JP2666789B2 - Method of manufacturing resin-sealed TAB semiconductor device and TAB tape structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method of manufacturing a resin-sealed TAB semiconductor device and a TAB tape structure.

[0002]

2. Description of the Related Art A TAB tape is formed by arranging a plurality of device holes at predetermined intervals on a center line of a long insulating film, and a plurality of metal foil leads each having a protruding tip portion on each device hole. It is formed so as to adhere to the surface. Further, feed holes for transporting the TAB tape are formed on both sides of the insulating film. The semiconductor element is placed in each device hole, and the electrode of the semiconductor element and the tip of the metal foil lead are pressed.

In such a TAB tape, since a long insulating film is soft and easily deformed, a positioning hole of the insulating film cannot be inserted into a positioning pin of a resin-sealing mold, and individual semiconductor devices (ICs) cannot be used. Since the accuracy between the pitches of (1) and (2) is not obtained, continuous work including transport, storage, and manufacturing processing is hindered. On the other hand, Japanese Utility Model Application Laid-Open No. 63-136335 discloses a technique for attaching an insulating auxiliary tape to the front or back surface of the insulating film of TAB to protect the metal foil leads on the long insulating film. Have been. However, even if such a configuration is used, since it is a combination of a soft insulating film and a tape, the entire structure is deformed due to heat shrinkage or the like, and a problem occurs in the above-described operation and transport.

Therefore, in the case of a semiconductor device of a kind that causes the above problem, a metal foil lead group is formed around each device hole of a long insulating film, and then each device hole, that is, each semiconductor device is formed. A long insulating film was cut for each device, and transport and resin sealing were performed for each TAB tape alone. This is to avoid the above-mentioned problem caused by making the insulating film long.

FIGS. 7A and 7B are diagrams showing the TAB tape unit 10, in which FIG. 7A is a plan view, and FIG. 7B is a cross-sectional view taken along the line AA in FIG.

An insulating film piece 30 obtained by cutting a long insulating film of Kapton or the like having a thickness of 20 to 50 μm.
A rectangular device hole 35 is formed at the center of the device, a rectangular opening 34 is formed on each of four sides thereof, and an insulating film feed hole (sprocket hole) 32 is formed at both ends. A pair of insulating film positioning holes 31 are formed, and an insulating film type identification hole 32 is formed. A plurality of metal foil leads 20 are formed so as to protrude above the device holes 35 from each of the four sides. This metal foil lead 20 is the inner lead 2
2. An end portion 21 of the internal lead projecting above the device hole 35, an external lead 23, and a measuring terminal portion 24. The insulating film ring portion 30A between the device hole 35 and the opening 34 and the outside of the opening 34. Is bonded to the surface of the insulating film with an insulating adhesive 36.

FIG. 8 shows a state in which the TAB tape unit 10 shown in FIG.
The bump electrode 42 is gang-bonded to the tip 21 of the metal foil lead 20, an electrical measurement is performed at the measuring terminal 24, and the resin 43 is sealed. And insulating film support 3
By cutting the portion of 0B, the TAB tape alone 10
FIG. 4 is a cross-sectional view showing a state of the TAB type semiconductor device separated from the semiconductor device. The illustration of the solder resist for preventing the resin from flowing at the time of sealing is omitted.

[0008]

As described above, in the prior art, a predetermined feeding operation is applied to a long insulating film by using the perforation holes 33, so that the metal foil leads are provided on the periphery of each device hole of the insulating film. After the group is formed, a long insulating film is cut into individual device holes, that is, individual semiconductor device units, and the TAB tape unit 10 is formed. Therefore, the subsequent feeding to the bonding device or the resin sealing device and the set-up operation to these devices are performed by the operator holding the individual TAB tape unit 10 with tweezers. It could not cope with the automatic manufacturing equipment and the workability was reduced.

Accordingly, an object of the present invention is to enable simultaneous transfer of a plurality of intermediate semiconductor device products and accurate setup to a manufacturing apparatus without deforming the tape, thereby improving manufacturing workability. It is an object of the present invention to provide a method of manufacturing a resin-sealed TAB semiconductor device and a TAB tape structure.

[0010]

A feature of the present invention is a step of preparing a metal frame plate in which a positioning hole and a plurality of openings arranged in one direction are formed, and a step of forming a device hole in the center of an insulating film piece. Forming and preparing a plurality of TAB tapes each provided with a plurality of metal foil leads having a tip portion protruding above the device hole on the main surface of the insulating film piece; A step of exposing the TAB tape alone in the opening by bonding a peripheral part of the insulating film piece to the outside of the periphery of the opening, and mounting a semiconductor element in each of the device holes, Connecting each of the plurality of electrodes of the semiconductor element to the tip of the metal foil lead, and cutting the external lead portion of the metal foil lead after sealing the semiconductor element with resin. The Rukoto, a plurality of resin-sealed T
And a step of separating the AB semiconductor device from one metal frame plate.

Another feature of the present invention is that a device hole is formed in the center of a metal frame plate having a positioning hole and a plurality of openings arranged in one direction and an insulating film piece, and the device hole is formed on the device hole. A plurality of TAB tapes each provided with a plurality of metal foil leads having protruding tips on the main surface of the insulating film piece, and the insulating film pieces are provided outside the periphery of each of the openings. In a TAB tape structure in which the TAB tape alone is exposed in the opening by bonding a peripheral portion of the TAB tape.

In the above-described method for manufacturing a resin-sealed TAB semiconductor device or a TAB tape structure, an island exposed in a device hole and a suspension lead for supporting the island are formed on a metal frame plate, and a semiconductor element is formed on the island. It can be configured to be mounted, and a feed hole for conveyance can be formed in the metal frame plate.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

An embodiment of the present invention will be described with reference to FIGS. First, FIG. 2 shows a thickness of 0.1 mm to 0.3 m.
metal frame plate 50 made of Cu alloy plate or Fe alloy plate
Is shown. A plurality of (five in the figure) openings 55 are arranged and formed in the metal frame plate, and an island 57 is provided at the center of each opening 55 and supported by four suspension leads 58. The island 57 and the suspension lead 58 are formed continuously and integrally with the surrounding metal plate. Further, a pair of TAB tape single-piece adhesive positioning holes 51 are formed in the vicinity of each opening 55.

A pair of metal frame plate positioning holes 56 and metal frame plate type identification holes 52 are formed on the entire metal frame plate 50, and metal frame plate feed holes 53 are arranged on both sides.

FIG. 1 shows the TAB tape unit 1 of FIG. 7 so as to close the respective openings 55 of the metal frame plate 50 of FIG.
FIG. 2 is an enlarged view showing a part of the TAB tape structure according to the embodiment of the present invention obtained by adhering No. 0, (A) is a plan view, and (B) is an AA part of (A). FIG.

The positioning hole 31 of the insulating film of the TAB tape unit 10 and the positioning hole 51 of the TAB tape unit adhesion of the metal frame plate 50 are aligned by image recognition. And an adhesive 37 such as an insulating paste.

Thus, in the opening 55 of the metal frame plate 50, the device lead 35 of the TAB tape 10 alone, the internal lead 22 including the tip 21 protruding above the device hole 35, the external lead 23 and the measuring terminal 24 are connected. Insulating film 30 including metal foil leads 20, four rectangular openings 34, insulating film type identification holes 32, and a ring portion 30A between device holes 35 and openings 34.
Are exposed, and an island 57 of the metal frame plate supported by the suspension lead 58 is located at the center of the device hole 35. In addition, the insulating tape feed hole 33 closed by the metal frame plate 50 is formed by processing metal foil leads and device holes on a long insulating film, cutting the long insulating film to obtain the TAB tape unit 10. After the TAB tape unit 10 is bonded to the metal frame plate 50, it is unnecessary.

The TAB tape structure shown in FIG. 1 is automatically conveyed by using a metal frame plate feed hole 53, and a metal frame plate positioning hole 5 is provided.
6 and the bonding device is automatically aligned by image recognition, and as shown in FIG. 3A, one main surface of the island 57 is adhered to the surface of the semiconductor element 41 with an adhesive 38 such as an insulating paste. The central portion is fixed, and the bump electrode 42 at the peripheral portion of the semiconductor element 41 and the tip portion 21 of the metal foil lead 20 are connected by an automatic gang bonding facility. As described above, since the surface of the semiconductor element is fixed to the island constituting a part of the metal frame plate, heat from the semiconductor element can be efficiently dissipated.

Next, the TAB tape structure is automatically conveyed using the metal frame plate feed holes 53, and is automatically aligned with the test apparatus by image recognition using the metal frame plate positioning holes 56. Then, an automatic electrical test of each semiconductor element and its metal foil lead is performed by bringing a measurement probe into contact therewith.

Next, the TAB tape structure is automatically conveyed by using the metal frame plate feed holes 53, and is automatically aligned with the enclosing device by image recognition using the metal frame plate positioning holes 56, and the encapsulating resin 43 is used. Automatic encapsulation is simultaneously performed on a plurality (five in the figure) of semiconductor elements provided in one TAB tape structure, and the state shown in FIG.
The illustration of the solder resist for preventing the resin from flowing at the time of sealing is omitted.

As described above, according to the present invention, since a plurality of semiconductor elements are simultaneously sealed in a long shape using a metal frame plate which is less deformed by heat shrinkage or the like, for example, the same number of semiconductor elements are simultaneously sealed. Using a long insulating film, the shift amount of the semiconductor element is 200 μm, and the encapsulation failure rate is 23 /
Under the same manufacturing conditions as the prior art of 1000 (2.3%), in the present invention, the shift amount of the semiconductor element is suppressed to 50 μm, and the encapsulation failure rate can be reduced to 0/1000 (0%). On the other hand, according to the present invention, since a plurality of TAB tapes are bonded to a long metal frame plate without performing the processing for each TAB tape alone, the productivity (index) for processing each TAB tape alone is improved. If it is 1, in the case of the present invention, for example, the productivity (index) is improved to 10.

FIG. 4 is a diagram schematically showing this resin sealing state. That is, a metal plate frame positioning hole 5 of a metal frame plate 50 in which a plurality of semiconductor elements are joined by a single TAB tape.
6 and the plane positions of the mold positioning pins 63 on the mold side are aligned by image recognition, and then the mold positioning pins 63 are inserted and fixed in the metal plate frame positioning holes 56 to fix the lower mold 61 and the upper mold 6.
By injecting and solidifying the resin 43 into the cavities provided in 2 and 3, resin sealing of a plurality of semiconductor devices is performed simultaneously.

Next, the TAB tape structure is automatically conveyed using the metal frame plate feed holes 53 and the metal frame plate positioning holes 56 are provided.
The TAB tape 10 exposed in the opening 55 of the metal frame plate 50
Cut portion 23A of external lead 23 on opening 34 of (insulating film piece 30) and supporting portion 3 of insulating film
The portion of 0B is cut to obtain each TAB type semiconductor device separated from the metal frame plate 50 as shown in FIG.

FIG. 5 is a sectional view showing a TAB tape structure according to an embodiment in which a part of the TAB tape structure shown in FIG. 1 is modified, and FIG. 6 is obtained by using the TAB tape structure shown in FIG. It is sectional drawing which shows the resin-sealed TAB semiconductor device.
In FIGS. 5 and 6, the same or similar parts as those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof will not be repeated. In this embodiment, an island 57G larger than the device hole 35 is formed by the metal frame plate 50, and T
The hanging lead 58 is bent in the direction opposite to the side where the AB tape unit 10 is bonded. Therefore, as shown in FIG. 6, the entire back surface of the semiconductor element 41 is mounted on the island 57G larger than the adhesive 38 such as a conductive paste. In this embodiment, since a large island is used, the thermal resistance is further reduced, and it is advantageous to use the semiconductor device in a semiconductor device having a large heat radiation amount.

[0026]

As described above, according to the present invention, a TAB tape structure in which a TAB tape alone is adhered so as to close each of a plurality of openings arranged in one direction of a metal frame plate having a positioning hole is constituted. Then, a resin-sealed TAB semiconductor device is manufactured. Since the metal frame plate is higher in rigidity than the insulating film, even if the metal frame plate is long for simultaneous processing of a plurality of semiconductor devices, the deformation is small and the manufacturing process can be performed at an accurate position with the positioning hole. In addition, each TAB tape is transported individually,
Instead of performing the manufacturing process, multiple TABs
The work efficiency in which the single tape is adhered and simultaneously conveyed and manufactured is improved. Further transport by the above configuration,
Fully automatic manufacturing including storage and manufacturing processing becomes possible, and productivity is further improved.

[Brief description of the drawings]

FIG. 1 is a view showing a part of a TAB tape structure according to an embodiment of the present invention, wherein (A) is a plan view and (B) is a cross-sectional view of AA section of (A).

FIG. 2 is a plan view showing the entire metal frame plate used for the TAB tape structure of FIG.

FIG. 3 is a cross-sectional view showing a method for manufacturing a resin-sealed TAB semiconductor device according to an embodiment of the present invention using the TAB tape structure of FIG. 1;

FIG. 4 is a view schematically showing a resin sealing step using the TAB tape structure of FIG. 1;

FIG. 5 is a sectional view showing a TAB tape structure according to an embodiment in which a part of the TAB tape structure shown in FIG. 1 is modified;

6 is a cross-sectional view showing a resin-sealed TAB semiconductor device obtained by using the TAB tape structure of FIG.

FIGS. 7A and 7B are diagrams showing a TAB tape alone, wherein FIG. 7A is a plan view and FIG.

FIG. 8 is a cross-sectional view showing a resin-sealed TAB semiconductor device obtained by a conventional manufacturing method.

[Explanation of symbols]

 Reference Signs List 10 TAB tape alone 20 Metal foil lead 21 Tip of internal lead 22 Internal lead 23 External lead 23A Cut part of external lead 24 Measurement terminal part 30 Piece of insulating film 30A Ring part of insulating film 30B Support part of insulating film REFERENCE SIGNS LIST 31 insulating film positioning hole 32 insulating film type identification hole 33 insulating film feed hole 34 opening 35 device hole 36, 37, 38 adhesive 41 semiconductor element 42 bump electrode 43 resin 50 metal frame plate 51 TAB tape unit adhesive positioning Hole 52 Metal frame plate type identification hole 53 Metal frame plate feed hole 55 Opening 56 Metal frame plate positioning hole 57, 57G Island 58 Suspension lead 61 Lower die 62 Upper die 63 Mold positioning pin

Claims (6)

(57) [Claims] 1. A step of preparing a metal frame plate having a positioning hole and a plurality of openings arranged in one direction, forming a device hole in the center of an insulating film piece, and forming a tip portion on the device hole. Providing a plurality of single TAB tapes each having a plurality of metal foil leads projecting from the main surface of the insulating film piece; and providing the insulating film outside the periphery of each opening of the metal frame plate. A step of exposing the TAB tape alone in the opening by bonding a peripheral portion of a film piece, and mounting a semiconductor element in each of the device holes, a plurality of electrodes of the semiconductor element and the metal Connecting the tip of the foil lead with each other, and sealing the semiconductor element with a resin, and then cutting the external lead portion of the metal foil lead to form a plurality of resin-sealed molds. Separating the TAB semiconductor device from one of the metal frame plates. 2. The semiconductor device according to claim 1, wherein an island exposed in the device hole and a suspension lead supporting the island are formed on the metal frame plate, and the semiconductor element is mounted on the island. A method for manufacturing a resin-sealed TAB semiconductor device. 3. The method of manufacturing a resin-sealed type TAB semiconductor device according to claim 1, wherein a feed hole for conveying the metal frame plate is formed in the metal frame plate. 4. A metal frame plate having a positioning hole and a plurality of openings arranged in one direction, a plurality of device holes formed at the center of an insulating film piece, and a tip protruding above the device hole. A plurality of TAB tapes each having the metal foil lead provided on the main surface of the insulating film piece, and bonding the peripheral part of the insulating film piece to the outside of the periphery of each of the openings. The T
A TAB tape structure, wherein a single AB tape is exposed. 5. The TAB tape structure according to claim 4, wherein an island exposed in the device hole and a suspension lead for supporting the island are formed on the metal frame plate. 6. The TAB tape structure according to claim 4, wherein a feed hole for conveying the metal frame plate is formed in the metal frame plate.