JP2660608B2 - Metal detector and pachinko game machine - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal detection device and a pachinko game machine, and more particularly to a device for detecting the position of a metal such as a pachinko ball.

[Background Art] As a metal detection device, for example, in a pachinko game machine, there is a device that detects the passage of a pachinko ball, which is a metal, in a passage route thereof. In pachinko game machines, it is necessary to accurately grasp the so-called incoming ball played by the player and the payout as a prize for the ball that entered the safe hole for each pachinko game machine. The most important information above.

Therefore, there is a conventional technique for detecting the passage of a pachinko ball in the path of a pachinko game machine disclosed in Japanese Patent Publication No. 64-3506.

That is, the publication discloses that an upper sheet having a contact pair and a lower sheet are provided, and when the pachinko ball is placed on the upper sheet, the pachinko ball is detected by conducting the contact pair with the weight of the pachinko ball. Have been.

[Problems to be Solved by the Invention] However, according to the above-mentioned conventional technology, a pachinko ball can be detected only in the flow path of the pachinko game machine, so that a pachinko machine is provided to a safe hole and an out hole on the board of the pachinko game machine. It cannot detect how the ball enters. For this reason, in the conventional technique, it is not possible to know the progress of the game, and there is a problem that the function is insufficient for accurate management of the pachinko game machine.

Further, the pachinko game machine generates noise of various frequencies, and there is a problem that the noise may cause erroneous detection when detecting a pachinko ball.

The present invention has been made in view of such conventional problems, and it is possible to detect safe balls and out balls on the surface of a pachinko game machine, and it is possible to perform detection without physical contact. It is an object of the present invention to provide a metal detection device which is not affected by noise and a pachinko game machine provided with such a metal detection device.

Means for Solving the Problems The gist of the present invention for achieving the object is as follows. 1. A plurality of parallel folded transmission lines are attached to one surface of a substrate, and electromagnetic characteristics change due to approach of metal. A plurality of parallel folded reception lines are electromagnetically coupled in a direction intersecting with the transmission lines, and are arranged on the opposite surface of the substrate to form a metal sensor having a planar detection matrix. A transmission circuit for sequentially transmitting a signal of a predetermined frequency, and a plurality of CT sensors corresponding to each reception line, a reception for sequentially receiving a signal from each reception line in synchronization with the transmission circuit via each CT sensor. A metal detection device, comprising: a circuit;

2. The metal detection device according to claim 1, wherein the receiving circuit includes the plurality of CT sensors, a multiplexer for sequentially receiving signals from each CT sensor, and an amplifier for a signal from the multiplexer.

31. A pachinko game machine comprising the metal detection device according to item 1 or 2 along a board surface, wherein the metal is a pachinko ball.

"Operation" When a signal of a predetermined frequency is sequentially transmitted from a transmission circuit to a plurality of folded transmission lines to generate a magnetic field, an electromotive force is generated in a reception line electromagnetically coupled to the transmission line due to a mutual induction effect. I do. At this time, when a metal such as a pachinko ball approaches the metal sensor, an eddy current is generated on the surface of the metal in a direction to cancel the magnetic flux by the metal sensor. The impedance of the transmission line changes due to the influence of the eddy current, thereby changing the current. In response, the reception line changes the magnitude of the electromotive force. The receiving circuit receives a signal from each receiving line via each CT sensor in synchronization with the transmitting circuit. The position of the metal in the detection matrix can be grasped as coordinates from the intersection of the reception line where the reception signal has changed and the transmission line transmitted at that time.

Each CT sensor insulates the metal sensor from the receiving circuit,
It prevents noise from entering the receiving circuit from the pachinko game machine and amplifies the received signal. The CT sensor is smaller than the OP amplifier, and the metal detector can be made smaller.

The metal detection device can track the movement of the pachinko ball as a change in coordinates on the board of the pachinko game machine. In the case of the pachinko game machine, the metal sensor corresponds to key points such as safe holes and out holes on the board. Monitoring the progress of
It is possible to know the situation of the ball coming out, to check the stoppage and check for abnormalities due to fraud, and to use the data as nail adjustment data.

Hereinafter, various embodiments of the present invention will be described with reference to the drawings.

1 to 15 show a first embodiment of the present invention.
In the first embodiment, a case is shown in which a metal detection device is configured using a metal sensor, and the metal detection device is provided in the pachinko game machine 10 and applied.

As shown in FIGS. 2 and 3, a pachinko game machine
A detection matrix 20 that forms a metal sensor is provided along the board surface 11 of the device 10.

On the board 11 of the pachinko game machine 10, the inside of the guide rail 12 forms a game area, into which a large number of nails 13,13 ... that play pachinko balls are driven, and safe holes 14a, 14a ...
Has been established, and an out hole 15 has been established at the lower end of the game area.

The front glass cover covering the panel surface 11 has a double structure including a front glass body 16 and an inner glass body 17.

On the front of the pachinko game machine 10, a launching handle 33 for performing a pachinko ball launching operation, and a ball tray for receiving a launching ball.
34 are provided.

As shown in FIG. 4, the plurality of transmission lines 22 are formed in a parallel folded shape (or loop shape) in which one transmission line 22 makes a U-turn at the folded portion 61, and these are arranged in parallel in one direction. Are arranged on the same plane. Also, the plurality of transmission lines 26
Similarly, one reception line 26 is formed in a parallel folded shape (or loop shape) by making a U-turn, and these are arranged on the same plane in parallel in one direction. The transmission terminal 23 and the reception terminal 27 are arranged at the lower end of the inner glass body (front glass) 17 in a vertical relationship when mounted on a pachinko game machine.

Each reception line 26 is electromagnetically coupled to each transmission line 22 and is arranged in a cross direction perpendicular to a plane parallel position to each transmission line 22 so that the electromagnetic characteristics change due to the approach of a metal such as a pachinko ball. The transmission line 22 and each reception line 26 constitute a detection matrix 20 in a planar shape.

In the front view of FIG. 4, each transmitting line 22 and each receiving line 26 intersect.
Are formed as detection units 20a, 20a,... For detecting a pachinko ball by an impedance change which is an electromagnetic characteristic value. Some of the detection units 20a, 20a ... correspond to the safe holes 14a, 14a ... as shown in FIG. The detection matrix 20 is provided on an inner glass body (front glass) 17 which is on the inner side and on the side of the board among two glass bodies covering the board 11 as shown in FIG.

FIG. 5 (A) is an enlarged sectional view of the inner glass body,
(B) shows an enlarged view of a portion circled by destruction in (A). The inner glass body 17 includes an inner protective glass plate 17a which is a protective sheet for the receiving line 26 (shown in FIG. 4), a receiving glass base substrate 17b, a transmitting glass base substrate 17c, and a transmitting line 22 (FIG. 4). Has a four-layered structure of an outer glass plate 17d which is a protective sheet for the above. The inner glass body (front glass) 17 typically has a vertical length a of 367 mm.
A glass substrate having a square shape with a size of ± 10 mm and a horizontal length b of 405 mm ± 10 mm, and having a thickness of 3.0 to 3.5 mm. The inner protective glass plate 17a and the outer glass plate 17d have a shorter vertical length than the receiving glass base substrate 17b and the transmitting glass base substrate 17c, and the inner glass body 17 is
The lower end 17p is exposed.

A plurality of parallel folded receiving lines 26 are sandwiched between the inner protective glass plate 17a and the receiving glass base substrate 17b, and between the transmitting glass base substrate 17c and the outer glass plate 17d, A plurality of parallel folded transmission lines 22 are sandwiched. Accordingly, the inner glass body 17 forms the transmission line 22 on one surface of the transmission-side glass base substrate 17c with the transparent adhesive layer 1.
8a, and the outer glass plate 17
d is adhered by the transparent adhesive layer 18b, and the receiving line 26 is formed on the other surface of the receiving-side glass base substrate 17b by the transparent adhesive layer 18c.
And placed on top of it, with an internal protective glass plate
17a is adhered by a transparent adhesive layer 18d, and the other surface of the transmission-side glass base substrate 17c and the reception-side glass base substrate 1
7b is bonded to the other surface by a transparent adhesive layer 18e.

A transparent conductive film for shielding is provided on the entire surface of the outer glass plate 17d, which is the front side of the transmission lines 22. The transparent conductive film is formed of an indium oxide (ITO) film, a tin oxide film, or the like.

As shown in FIG. 4, a rectangular transmission-side glass base substrate 17c is bonded to a transmission-side folded substrate 19a formed of an elongated flexible printed circuit board (FPC) along one side in the vertical direction, and the opposite side in the vertical direction. An L-shaped transmission-side routing board 19b, also made of a flexible board, is adhered along a part of the side of the lower end and the side of the lower end. As shown in FIG. 6, the transmission-side folded substrate 19a includes a plurality of conductive patterns made of copper foil.
Specifically, 32 arc-shaped folded portions 61 are formed in a line,
As shown in the drawing, one end 62a of a wire 62 is connected to one end 61a of each folded portion 61 by soldering using solder 63 or welding.

FIG. 8 is an enlarged view of a portion circled by a broken line in FIGS. 4 and 5. As shown in FIG. 8, the lower end of the transmission side routing board 19b on the opposite side has a plurality of conductors, specifically 64 conductors, on the edge thereof, along a part of the side, made of copper foil. A transmission terminal 23 for external connection extending in the vertical direction is formed.

As shown in FIG. 5 (A), the transmission terminal 23 is disposed at the lower end 17p of the inner glass body 17 and is exposed without being covered by the outer glass plate 17d. That is, the outer glass plate 17d is
It is bonded on the transmission line 22 excluding the transmission terminal 23 on the transmission-side glass base substrate 17c. The terminal side of each transmission line 22 is the transmission terminal 23 of each transmission line 22 and the routing part to each transmission terminal 23.
64. The routing portion 64 for each transmission terminal 23 is formed on the transmission side routing substrate 19b by a conductor pattern, and extends from each transmission terminal 23 along the transmission side routing substrate 19b.

The other end 62b of the wire 62 extending from one end 61a of each folded portion 61
Is the wire 62 with tension, and the corresponding terminal side
The starting point 64a of the 64 is connected by soldering or welding using the solder 63, and is connected to the transmitting terminal 23 via the routing portion 64. It should be noted that the routing unit 64 connects two straight portions by a circular arc portion 64R in order to remove high-frequency interference.

Similarly, the rectangular receiving-side glass base substrate 17a is
The receiving-side folded substrate 29a is bonded along one side of the upper end in the horizontal direction, and the elongated receiving-side routing substrate 29b is bonded along a part of the lower side in the horizontal direction. Similarly to the transmission-side folded substrate 19a, the reception-side folded substrate 29a forms a plurality of, specifically, 32 arc-shaped folded portions 61 by a conductor pattern made of copper foil, and a wire is attached to one end 61a of each folded portion. One end 62a of 62 is connected by soldering using solder 63 or welding.

At the lower end of the opposite receiving-side routing substrate 29b, on the edge thereof, along a part of the side, when the receiving-side glass base substrate 17b is bonded to the transmitting-side glass base substrate 17c, they do not overlap each other. A plurality of, specifically 64, receiving terminals 27 for external connection extending in the vertical direction are formed at the non-opposing positions by a conductor pattern made of copper foil.

The receiving terminal 27 is, as shown in FIG.
And is exposed at the lower end 17p without being covered by the inner protective glass plate 17a. That is, the inner protective glass plate 17a
The terminal side of the reception line 26 except the reception terminal 27 on the reception side glass base substrate 17b has the reception terminal 27 of each reception line 26 and the routing part 64 to each reception terminal 27. The routing part 64 to each reception terminal 27 is formed by a conductor pattern on the reception side routing board 29b.
And extends from each reception terminal 27 along the reception side routing board 29b.

The other end 62b of the wire 62 extending from one end 61a of each folded portion 61
Is the wire 62 with tension, and the corresponding terminal side
The starting point 64 a of the base plate 64 is connected to the receiving terminal 27 via the routing part 64 by being connected by soldering or welding using the solder 63.

As described above, the transmission line 22 and the reception line 26
a, 29a, the folded portions 61 formed on the routing boards 19b, 29b, the wires 62, the wires 62, the transmission terminal 23 forming the end of the transmission line 22, and the reception line. The receiving terminal 27 which is the end of 26
It is composed of Each wire 62 has a matte-treated black surface to prevent light reflection in order to make it inconspicuous to the player.

Detection matrix 20 suitable for normal pachinko game machine 10
Is a pattern in which the transmission line 22 has 32 rows, the reception line 26 has 32 columns, and the number of detection units 20a is 1024 in total. In FIG. 4, the patterns other than the outer patterns are omitted.

The thickness of the wires constituting the transmission line 22 and the reception line 26 is preferably set to a value of 25 μm to 30 μm. In the case of this embodiment,
As shown in FIG. 4, the entire widths c and d of the transmitting terminal 23 and the receiving terminal 27 are each 126 mm, and as shown in FIG. 19b
Each of the widths e and f of the portions extending in the vertical direction is formed to be 10 mm or less.

As shown in FIG. 8, the width g of each of the transmission terminal 23 and the reception terminal 27 is 1.5 mm. Routing section 64
By setting the widths e and f to 10 mm or less, the transmission side folded board 19a and the transmission side routing board 19b are hidden by the mounting frame for the inner glass body (front glass) 17 of the pachinko game machine, It is not visible from the front of the building.

As shown in FIG. 9, a transmission circuit board 66a and a reception circuit board 66b are installed in the lower portion inside the mounting frame, and the transmission circuit board 66a has a transmission circuit for transmitting to the plurality of transmission lines 22 of the detection matrix 20. The circuit 40 is provided, and the receiving circuit 50 for receiving from the plurality of receiving lines 26 is provided on the receiving circuit board 66b. On these boards 66a and 66b, a transmission connector 67a and a reception connector 67b are provided at positions corresponding to the transmission terminal 23 and the reception terminal 27.

The transmission connector 67a is an edge connector for detachably connecting the transmission terminal 23 to the transmission circuit 40 on the transmission circuit board 66a, and the reception connector 67b is configured to detach the reception terminal 27 from the reception circuit 50 on the reception circuit board 66b. It is an edge connector for making possible connections. That is, the transmission connector 67a and the reception connector 67b are connected to the transmission circuit board 66a and the reception circuit board 66a.
A groove 68a is formed along the length of the elongated insulator 68 along the length of the insulator 68, and each circuit board 66 is formed at the bottom of the groove 68a.
Each of the substrates 66 is insulated with a base rubber so that a large number of conductive wires connected to a and 66b do not contact each other.
a, 66b are buried in the vertical direction.

The transmission terminal 23 and the reception terminal 2 are provided in the groove 68a of each insulator 68.
The inner glass body (front glass) 17 on which the 7 is arranged can be inserted, the transmission connector 67a is connected to the transmission terminal 23 of the transmission line 22 with the inner glass body 17 sandwiched from both sides, and the reception connector 67b is In this state, it is connected to the receiving terminal 27 of the receiving line 26.

The connection between the transmission terminal 23 and the reception terminal 27 and the transmission circuit 40 and the reception circuit 50 is performed by positioning the transmission terminal 23 and the reception terminal 27 below the inner glass body 17 so as to be connectable to the transmission connector 67a and the reception connector 67b. 68a and its about
This is performed by mounting the inner glass body 17 in the mounting frame so that the transmitting terminal 23 and the receiving terminal 27 are securely connected to the transmitting connector 67a and the receiving connector 67b with the weight of 1.2 kg.

A signal processing system constituting a metal detection device for detecting pachinko balls is as shown in FIGS. 1 and 10 to 13.

As shown in FIG. 10, the detection matrix 20 is under the control of the CPU memory control board 172 via the matrix I / O transmission / reception board 171. The CPU memory control board 172 can communicate with the communication line 179, and can read and use the data of the RAM card 173. RAM card 173 has safe holes 14a, 14a
., The detection algorithm of the pachinko balls entering the safe holes 14a, 14a, and the like are recorded.

The option 174 connected to the CPU memory control board 172 is a device for recording a trajectory of a pachinko ball moving around between the board surface 11 of the pachinko game machine 10 and the inner glass body 617. The option 174 may be of a type that stores data in a semiconductor memory or the like.However, during a time period when the number of players increases, the operation rate of the pachinko game machine 10 increases, so a huge storage capacity is required, and Since a required semiconductor memory is generally expensive or requires a larger space, the movement of a pachinko ball is recorded using a hard disk.
The recorded data is applied to a computer incorporating software for analyzing the trajectory of a pachinko ball, and is subjected to arithmetic processing, whereby necessary data can be obtained at a pachinko game hall (hall).

The matrix I / O transmission / reception board 171 has a transmission circuit board 66a provided with the transmission circuit 40 and a transmission circuit board 66b provided with the reception circuit 50. The transmission circuit 40 is a circuit for sequentially transmitting a signal of a predetermined frequency to each transmission line 22, and the reception circuit 50 is a circuit for sequentially receiving a signal from each reception line 26 in synchronization with the transmission circuit 40.

The transmission circuit 40 includes a transmission connector 41 as shown in FIG.
The amplifier 42 and the channel switching logic 43 connected to the transmission connector 41, the analog multiplexer 44 connected to the amplifier 42 and the channel switching logic 43, and the analog multiplexer 44, and a plurality of, specifically, Is composed of 32 PNP + NPN totem pole drivers 45 connected to the transmission line 22 side of 32 circuits, respectively.

The channel switching logic 43, as shown in FIG.
The operation is performed by two control lines for clock and reset by effectively utilizing the counter IC 43a.

The receiving circuit 50 includes, as shown in FIG.
a plurality of CT sensors (current transformers) 51 connected to the receiving line 26 side of a plurality of circuits, specifically 32
It comprises an analog multiplexer 52 connected to 51, an amplifier 53 and channel switching logic 54 connected to the analog multiplexer 52, and a receiving connector 55 connected to the amplifier 53 and channel switching logic 54. Therefore, the receiving circuit 50 receives a signal from each receiving line 26 via each CT sensor 51.

The CT sensor 51 is connected to each reception line 26 and an analog multiplexer.
52, and amplifies the signal from each reception line 26 by 10 times. Analog multiplexer 52
A signal is sequentially received from the CT sensor 51, and an amplifier is provided.
53 amplifies the signal from the analog multiplexer 52. The channel switching logic 54 is a member similar to the channel switching logic 43 of the transmission circuit 40.

As shown in FIG. 13, the CPU memory control board 1
On the transmission side, a CPU connector 46 connected to the CPU unit 30, a sequence control circuit 47 for transmitting a transmission clock in accordance with a start signal from the CPU unit 30 via the CPU connector 46, and a transmission clock receiving the transmission clock It has a bandpass filter 48 for transmitting a signal, and an amplifier 49 for amplifying a transmission signal and transmitting the amplified signal to a transmission connector.

On the receiving side, the CPU memory control board 172 includes an amplifier 71 that amplifies a signal received from the receiving connector 55.
, A band-pass filter 72 that receives the amplified signal, a full-wave rectifier / amplifier 73 that receives the signal received from the band-pass filter 72, and a signal 2 that receives the received signal from the full-wave rectifier / amplifier 73.
Stage low-pass filters 74a, 74b and low-pass filter 74b
An A / D converter 75 that receives a reception signal from the controller and sends digital data to the bidirectional RAM 76 under the control of the sequence control circuit 47, and receives the digital data and writes the reception data under the control of the sequence control circuit 47, the CPU It has a bidirectional RAM 76 that sends received data to the CPU unit 30 via the CPU connector 46 in response to a read signal from the connector 46.

The bidirectional RAM 76 has a counter inside, and all the processing of the matrix data of pachinko balls is performed by the counter. Further, the CPU memory control board 172 has a power supply unit 77.

The voltage waveform 81 to the transmission line 22 has a frequency of 1 to 1.3 MHz.
Is preferably a continuous sine wave centered at 0V.

By the way, the pachinko game machine 10 generates noise of various frequencies depending on the model. If the frequency of this noise matches or approaches the transmission frequency to the detection matrix 20, the detection accuracy of pachinko balls will be significantly deteriorated. In order to remove the influence of this noise, for example, depending on the model of the pachinko game machine 10, several types of metal detectors having a transmission frequency that does not match or approach the frequency of the noise in the frequency band of 1 to 1.3 MHz are set in advance. It is sufficient to prepare a metal detection device having a transmission frequency suitable for the pachinko game machine 10 to be prepared and to mount it on the pachinko game machine 10. According to this method, the influence of noise can be removed at a low manufacturing cost, and the detection accuracy of pachinko balls can be increased.
By selecting a metal detection device of a model most suitable for the pachinko game machine 10 in advance, application to the pachinko game machine 10 becomes easy.

 Next, the operation will be described.

Address signals and control signals from the CPU unit 30 are passed through the CPU connector 46 to the pachinko game machine 10.
Is transmitted to

In the pachinko game machine 10, on the transmission side, the sequence control circuit 47 receives the start signal, divides the frequency of the 16 MHz original clock as necessary, and outputs the transmission clock. The transmission clock from the sequence control circuit 47 is subjected to waveform shaping from a digital signal to an analog signal by a band-pass filter 48, and then amplified by an amplifier 49.
Sent to.

Further, the transmission signal is amplified by the amplifier 42 in the transmission circuit 40. The analog multiplexer 44 sequentially operates the totem pole driver 45 on the channel switched by the channel switching logic 43, whereby the totem pole driver 45 sequentially transmits the signal amplified by the amplifier 42 to the transmission line 22 at a predetermined cycle. Output (No. 14
(See FIG. 91).

On the receiving side, as shown in FIG. 1, a current as an electromagnetic characteristic value appearing on the plurality of receiving lines 26 is detected by the CT sensor 51 for 10 times.
It is amplified twice. Because amplification is performed by the CT sensor 51,
As a result, it is not necessary to increase the degree of amplification of the amplifier on the receiving side. The CT sensor 51 insulates each reception line 26 of the detection matrix 20 constituting the metal sensor from the analog multiplexer 52 of the reception circuit 50, and prevents noise from entering the reception circuit 50 from the pachinko game machine 10, Amplify the received signal.

The CT sensor 51 can prevent the occurrence of noise and DC drift due to the OP amplifier itself, as compared with the case where an OP amplifier is used, and can improve the detection accuracy of the received signal. OP amplifiers are generally larger than CT sensors 51, and if they attempt to achieve the same level of accuracy as CT sensors 51, they will be expensive and the circuit will be more complicated. I will. On the other hand, the CT sensor 51 is smaller and simpler in configuration than the OP amplifier,
By using the CT sensor 51, the matrix I / O transmission / reception board 71 and the metal detection device can be reduced in size. The matrix I / O transmission / reception board 7
1 is a CT sensor 51, an analog multiplexer 52, and an amplifier 5
By adopting a simple structure mainly composed of 3 and 4, the size is reduced and the number of lead wires is reduced.

The analog multiplexer 52 switches signals from the respective receiving lines 26 that have passed through the CT sensor 51 by the channel switching logic 54, and sequentially outputs the signals at a predetermined cycle. The signal from the analog multiplexer 52 is output by the amplifier 53 to 100
It is amplified twice (see step 92 in FIG. 14).

The reception signal is amplified and detected through a reception connector 55, an amplifier 71, and a band-pass filter 72. The received signal from the band-pass filter 72 is an analog signal in which several cycles constitute one scan, as shown in FIG. This analog signal is subjected to waveform shaping by a full-wave rectifier / amplifier 73 as shown in FIG. 15 (B).

The signal from the full-wave rectifier / amplifier 73 is averaged by an integration process as shown in FIG. 15 (C) by a low-pass filter 74a, and furthermore, the low-pass filter 74b
Then, as shown in FIG. 15D, averaging is performed. As a result, the noise is also averaged with the received signal,
The amount of noise is very small compared to the signal, and errors due to noise can be ignored. Low-pass filter 74a,
When averaging is performed by 74b, since the noise has already passed through the band-pass filter 72, there is no noise enough to cause an error. For this reason, the transmission frequency is selected to be a frequency that is not affected by the noise of the pachinko game machine 10, but the bandpass filter 72 includes:
The one suitable for the transmission frequency is used.

Next, the received signal is sent to A / D converter 75. A / D
The converter 75 converts a signal from the detection matrix 20 into a digital signal in a predetermined bit unit, for example, 12 bits,
The received data is recorded in the bidirectional RAM 76 under the control of the sequence control circuit 63 (see step 93 in FIG. 14). This processing speed is as high as 25,000 times per second.
The bidirectional RAM 76 records received data irrespective of the operation of the CPU unit 30 by a write signal from the sequence control circuit 63, and then inputs one clock to increase the address by +1 (see step 94 in FIG. 14). ). Two-way RA
The capacity of M76 is, for example, 2048 bytes.

Thus, the analog multiplexer 52 of the receiving circuit 50
Switches the signal from each reception line 26 (step 95 in FIG. 14).
The above steps are repeated 32 times according to the 32 reception lines 26 (see step 96 in FIG. 14). After 32 repetitions, the analog multiplexer 44 of the transmitting circuit 40
(See step 97 in FIG. 14), and the signal processing is repeated again.

The CPU unit 30 reads data relating to the position of the pachinko ball recorded in the bidirectional RAM 76 by a read start signal as necessary, and performs an arithmetic process. Then, CPU unit 30 repeats this process. Each circuit of the CPU memory control board 72 and the CPU unit 30 perform processing while ignoring each other's waiting time, so that the load on the CPU unit 30 is reduced and the processing speed of the CPU unit 30 can be increased.

If the algorithm of ball detection is a simple one, it is sufficient to use an inexpensive 8-bit CPU. If a complicated algorithm is required, the CPU unit 30 performs high-speed processing. It is better to select one that uses a 16-bit CPU. In any case, the scanning speed of the pachinko ball is not affected by the CPU because the scanning is not performed via the CPU.

As described above, when a signal of a predetermined frequency is sequentially transmitted from the transmission circuit 40 to the plurality of folded transmission lines 22 to generate a magnetic field, the reception line 26 electromagnetically coupled to the transmission line 22 includes:
An electromotive force is generated by the mutual induction action. At this time, when the pachinko ball, which is a metal, approaches the detection unit 20a of the detection matrix 20, an eddy current is generated on the surface of the pachinko ball in a direction to cancel the magnetic flux by the detection matrix 20. Transmission line 22
The impedance changes due to the influence of the eddy current to change the current, and accordingly, the reception line 26 changes the magnitude of the electromotive force.

The reception circuit 50 is a transmission circuit by the sequence control circuit 47.
In synchronization with 40, a signal is received from each reception line 26 via each CT sensor 51. .. Can be detected by scanning, and the position of the pachinko ball in the detection matrix 20 can be grasped as coordinates from the intersection position. Detection unit 20
The number of a is 32 lines for the transmission line 22 and 32 columns for the reception line 26, for a total of 1024
Since the pachinko balls are individual pieces,
And can also be detected through the out hole 15.

Since the voltage waveform to the transmission line 22 is a continuous sine wave centered on the OV, there is no generation of noise such as a rectangular wave, and the influence on other devices such as the CPU unit 30 is prevented. Can be.

In addition, since the voltage waveform has a transmission frequency band of 1 to 1.3 MHz, noise from peripheral devices of the pachinko game machine 10 is not easily received, and the response sensitivity can be increased. Note that components that can process signals in the frequency band of 1 to 1.3 MHz are less expensive than components that process signals in the higher frequency band.

In addition, the transparent conductive film on the surface of the outer glass plate 17d has a function of shielding the electrical influence of a metal or a derivative from the outside and increasing the reaction sensitivity to pachinko balls.

The CPU unit 30 reads the data of the positions of the detection units 20a, 20a... Corresponding to the key points such as the safe holes 14a, 14a. The progress of the game is monitored by tracking the movement of the pachinko ball on the board 11 as a change in coordinates. By knowing the situation of incoming balls, outgoing balls, and the like, it is possible to check for abnormalities due to hitting management and fraud, and to use the data as nail adjustment data. RAM card 73
In the case of monitoring the state of the insertion of pachinko balls with the new pachinko game machine 10, the RAM card may be replaced accordingly. The RAM card 73 can be manufactured by copying one card as long as it is used for the same type of pachinko game machine 10.

Note that the connection is made by using the weight of the inner glass body (front glass) 17 so that the transmission terminal 23 and the reception terminal 27 are placed on the lower side and connected to the transmission connector 67a and the reception connector 67b inside the lower part of the mounting frame. The connection can be performed simultaneously when the inner glass body 17 is mounted on the mounting frame.

For the replacement or attachment of the inner glass body 17 provided with the detection matrix 20, the transmitting connector 67a and the receiving connector 67b are detachable, and the inner glass body 17 can be easily removed from the transmitting circuit 40 and the receiving circuit 50 of the mounting frame. Therefore, the failed detection matrix 20 can be easily replaced, and the detection matrix 20 can be easily attached to a pachinko game machine without the detection matrix 20.

Further, since the folded portion 61 of the transmission line 22 and the reception line 26 is formed by a conductor pattern, the transmission line 22 and the reception line
The manufacture of the transmission line 22 and the reception line 26 is further facilitated since the manufacturing of the transmission line 22 and the reception line 26 is facilitated and the routing portion 64 of the transmission line 22 and the reception line 26 is formed by a conductor pattern.

 Next, a second embodiment of the present invention will be described.

This embodiment is the same as the first embodiment except that the inner glass body has a three-layer structure of an inner protective glass plate, a glass base substrate, and an outer glass plate, and is the same as the member of the first embodiment. The same reference numerals are given to the members, and the overlapping description will be omitted.

FIG. 16 shows the structure of the inner glass body having the detection matrix of the second embodiment. That is, the inner glass body
17 has a three-layered configuration of an inner protective glass plate 17a, a glass base substrate 87, and an outer glass plate 17c, and a plurality of parallel folded reception lines 26 are formed on one surface of the glass base substrate 87. An inner protective glass plate 17a is bonded thereon, and a plurality of parallel folded transmission lines 22 are formed on the opposite surface of the glass base substrate 87, and an outer glass plate 17c is bonded thereon.

Instead of performing the pattern processing of the transmission lines 22 and the reception lines 26 on both surfaces of the glass base substrate 87, they may be formed on the inner protective glass plate 17a and the outer glass plate 17c.

Further, the glass base substrate 87 may be made of a plastic film in addition to glass.

 Next, a third embodiment of the present invention will be described.

This embodiment is the same as the first embodiment except that the routing board forms the routing portions on both surfaces thereof, and the same members as those of the first embodiment are denoted by the same reference numerals. , Overlapping description will be omitted.

As shown in FIG. 17, a rectangular transmission-side glass base substrate 17c is bonded to a transmission-side folded substrate 19a formed of an elongated flexible printed circuit board (FPC) along one side in the vertical direction, and the opposite side in the vertical direction. An L-shaped transmitting-side routing board 119 is adhered along a part of the side of the lower end and the side of the lower end. At the lower end of the transmission-side routing board 119, as shown in FIG.
A plurality of, specifically, 64 transmission terminals 23 for external connection extending in the vertical direction are formed.

The routing section 64 to each transmission terminal 23 extends alternately from each transmission terminal 23 to both sides of the transmission side routing board 119 one by one.
The routing portion 6 on the back side of the transmission-side routing substrate 119, that is, on the side facing the transmission-side glass base substrate 17c, of each routing portion 64.
The starting point 64a at the end of 4 is connected to the front side by a through hole 120 formed at a corresponding position on the transmission side routing board 119. The starting point 64a of each routing section 64 is located at one end 6 of each corresponding folded section.
The other end 62b of the wire 62 extending from 1a is connected to the wire 62 by soldering or welding using a solder 63 with the wire 62 having tension.

In the present embodiment, since the routing portions 64 are formed on both surfaces of the routing substrate 119, the width of the routing portion 64 extending in the vertical direction of the glass base substrate 17c is easily reduced to, for example, about 10 mm or less. be able to.

In addition, the receiving side routing board of the receiving side glass base board also
Form a through hole in the same way as the transmission side routing board 119,
The routing part can be formed alternately on each of the two surfaces.

Further, in order to reduce the width of the routing part, the routing part may be provided on both sides of the routing substrate, or a plurality of routing substrates may be laminated.

In each embodiment, one or both of the folded substrate and the routing substrate may be made of a thin glass epoxy substrate instead of the flexible printed circuit (FPC). Since the glass epoxy substrate is milky white, it is inconspicuous when used, and is resistant to heat, so that it is prevented from being broken by heat when soldering the wires of the transmission line and the reception line.

[Effects of the Invention] According to the metal detection device and the pachinko game machine according to the present invention, metal can be detected without physical contact,
It has durability.

In particular, with pachinko game machines, it is possible to easily and quickly obtain data such as the track of pachinko balls on the board, the number of pachinko balls hit by the player, and the ball entry rate into the safe hole, and the details of the game can be obtained. Because you can know it remotely
The level of counting management of the pachinko game machine can be raised, and anyone can easily adjust the nails of the pachinko game machine.

In addition, the metal detection device amplifies the received signal by insulating the metal sensor and the receiving circuit by the CT sensor,
Compared to the case where an OP amplifier is used, it is smaller and is not affected by noise generated in a pachinko game machine or the like, and erroneous detection due to noise can be prevented.

[Brief description of the drawings]

1 to 15 show a first embodiment of the present invention. FIG. 1 is a block diagram of a reception circuit of a matrix I / O transmission / reception board, and FIG. 2 is a diagram showing a pachinko game machine and a detection matrix. 3 is a partial longitudinal sectional view of a pachinko game machine, FIG. 4 is a front view of a detection matrix, and FIG. 5 is an enlarged sectional view of an inner glass body having a detection matrix. 6, FIG. 6 is a detailed front view of the transmission line, FIG. 7 is an enlarged sectional view of the transmission line showing a connection state of the wire, FIG. 8 is an enlarged front view of the transmission terminal, and FIG. FIG. 10 is a schematic configuration diagram of a metal detection device, FIG. 11 is a block diagram of a transmission circuit of a matrix I / O transmission / reception board,
FIG. 12 is a block diagram showing a main part of the channel switching logic, FIG. 13 is a block diagram of a reception and transmission circuit of a CPU memory control board, FIG. 14 is a flowchart of scanning of a detection matrix, and FIG. 15 is a reception signal. FIG. 16 is an enlarged sectional view of the inner glass body having the detection matrix of the second embodiment, and FIG. 17 is a schematic front view of the routing board of the third embodiment. B: Pachinko ball, 10: Pachinko game machine 11: Board surface, 13: Nail 14a: Safe hole, 15: Out hole 17 ... Inner glass body 19a, 29a: Turned-back board 19b, 29b ... Routing board 20: Detection matrix, 20a ... Detection unit 22 ... Transmission line, 23 ... Transmission terminal 26 ... Reception line, 27 ... Reception terminal 30 ... CPU unit, 40 ... Transmission circuit 44,52 ... Analog multiplexer 47 ... Sequence control circuit 50 ... Reception circuit, 51 ... CT sensor 53 ... Amplifier, 61 ... Folding section 62 ... Wire, 64 ... Wrapping section 67a ... Transmission connector, 67b ... Reception connector 75 ... A / D converter 171 ... Matrix I / O transmission / reception board 172 ... CPU memory control board 173 ... RAM card 174… Option 175… Personal computer 179… Communication line

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-64-58286 (JP, A) JP-A-60-231231 (JP, A) Jikai Sho 64-56288 (JP, U) 3506 (JP, B2) JP-B-51-46714 (JP, B2)

Claims (3)

(57) [Claims] A plurality of parallel folded transmission lines are attached to one surface of a substrate, and a plurality of parallel folded reception lines, whose electromagnetic characteristics change due to the approach of a metal, are arranged in a direction intersecting the transmission lines. A metal sensor that is arranged on the opposite surface of the substrate to form a detection matrix in a planar shape, a transmission circuit that sequentially transmits a signal of a predetermined frequency to each transmission line, and a plurality of transmission lines corresponding to each reception line. A metal detection device, comprising: a CT sensor; and a reception circuit that sequentially receives a signal from each reception line via each CT sensor in synchronization with the transmission circuit. 2. The method according to claim 1, wherein the receiving circuit includes: a plurality of the CT sensors;
2. The metal detecting device according to claim 1, further comprising: a multiplexer for sequentially receiving a signal from each CT sensor; and an amplifier for a signal from the multiplexer. 3. A pachinko game machine comprising the metal detection device according to claim 1 along a board surface, wherein the metal is a pachinko ball.