JP2526470Y2 - Surface emitting device - Google Patents
Surface emitting deviceInfo
- Publication number
- JP2526470Y2 JP2526470Y2 JP1988132988U JP13298888U JP2526470Y2 JP 2526470 Y2 JP2526470 Y2 JP 2526470Y2 JP 1988132988 U JP1988132988 U JP 1988132988U JP 13298888 U JP13298888 U JP 13298888U JP 2526470 Y2 JP2526470 Y2 JP 2526470Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- substrate
- emitting device
- light
- emitting diodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】 イ）産業上の利用分野 本考案は複数の発光ダイオードを用いた面発光素子に
関する。DETAILED DESCRIPTION OF THE INVENTION a) Industrial application field The present invention relates to a surface light emitting device using a plurality of light emitting diodes.
ロ）従来の技術 従来より液晶表示器や制御パネル案内表示において、
比較的広い面積の照明を行うに際し特開昭58−93088号
公報や特開昭63−182628号公報の如く複数の発光ダイオ
ードを用いた面発光素子が利用される。この様な面発光
素子においては、第２図の如く、照射面は500mm2以上で
あるのに発光ダイオード（13）（13）…は１辺0.2〜0.3
mmの略さいころ状と小さいので、基板（11）のプリント
配線（12）（12）の面積を広くし、さらに基板（11）の
表面に白色樹脂（図の斜線部（16））を基板の隅々まで
塗布し、それにより基板表面での光反射量を高め、反射
面積を広げることで照射面で高照度均一発光を得てい
た。B) Conventional technology Conventionally, in a liquid crystal display and a control panel guidance display,
For illuminating a relatively large area, a surface light emitting device using a plurality of light emitting diodes is used as disclosed in Japanese Patent Application Laid-Open Nos. 58-93088 and 63-182628. In such a surface light emitting device, as shown in FIG. 2 , the light emitting diodes (13) (13).
mm, the area of the printed wiring (12) (12) on the board (11) is increased, and the white resin (shaded area (16) in the figure) is added to the surface of the board (11). The coating was applied to every corner, thereby increasing the amount of light reflection on the substrate surface and widening the reflection area, thereby obtaining high illuminance uniform light emission on the irradiated surface.
ハ）考案が解決しようとする課題 ところが、面発光素子を薄くし、あるいは薄くした上
で発光ダイオード数を減少させようとすると、発光ダイ
オードの真上近傍とその周辺との照度差が大きくなり、
均一な照光が出来なくなった。C) Problems to be solved by the invention However, if the surface emitting element is made thinner or the number of light emitting diodes is reduced after the thinning, the illuminance difference between the area immediately above the light emitting diode and the surrounding area increases.
I couldn't evenly illuminate.
ニ）課題を解決するための手段 本考案は上述の点を考慮してなされたもので、上述し
た基板の発光ダイオード周辺部においてはは、白色樹脂
を設けないでかつ基板表面露出部を形成したものであ
る。D) Means for Solving the Problems The present invention has been made in consideration of the above-mentioned points. In the periphery of the light emitting diode of the above-mentioned substrate, a white resin was not provided and a substrate surface exposed portion was formed. Things.
ホ）作用 これにより発光ダイオード周辺部では光散乱効果のみ
又は光が吸収されかつ散乱されることになり、その外周
部で反射される。照射面が反射面に近いと反射面も１つ
の光源の如き作用をするので、多数の散在した光源をも
つ面発光素子となる。E) Action As a result, only the light scattering effect or light is absorbed and scattered at the periphery of the light emitting diode, and is reflected at the outer periphery. When the irradiation surface is close to the reflection surface, the reflection surface also functions as one light source, so that the surface light emitting element has a large number of scattered light sources.
ヘ）実施例 第１図は本考案実施例の面発光素子の断面図（ａ）と
その基板平面図（ｂ）である。図に於て、（１）は帯状
をなした３本のプリント配線（２）（２）（２）を有し
た基板で、厚さ0.8mmのフェノール樹脂基材等からな
り、プリント配線（２）（２）は発光ダイオードの周辺
において基板表面前記基材の表面（1a）（1a）が露出す
るように細い部分を有している。（３）（３）…はプリ
ント配線（２）（２）（２）に固着され、配線が施こさ
れた発光ダイオードである。（４）は基板（１）の周縁
部に設けられた枠体で、（５）は発光ダイオード（３）
（３）…の上方に保持された光拡散シートで、基板に平
行になるよう枠体（４）に貼付してある。そして上述の
基板（１）の表面には、発光ダイオード（３）（３）…
の周辺の基板表面（1a）（1a）を露出させるよう四角形
の窓部（6a）（6a）…を有した白色樹脂（図の斜線部
（６））が塗布されている。F) Embodiment FIG. 1 is a cross-sectional view (a) of a surface emitting device according to an embodiment of the present invention and a plan view (b) of a substrate thereof. In the figure, (1) is a substrate having three strip-shaped printed wirings (2), (2) and (2), which is made of a 0.8 mm thick phenol resin base material or the like, and has a printed wiring (2). (2) has a thin portion around the light emitting diode so that the surface (1a) of the substrate (1a) is exposed. (3) (3)... Are light-emitting diodes fixed to the printed wirings (2), (2) and (2) and provided with wirings. (4) is a frame provided on the periphery of the substrate (1), and (5) is a light emitting diode (3)
The light diffusion sheet held above (3) ... is attached to the frame (4) so as to be parallel to the substrate. Then, the light emitting diodes (3), (3),.
A white resin (hatched portion (6) in the figure) having rectangular windows (6a) (6a)... Is applied so as to expose the substrate surfaces (1a) (1a) around the substrate.
より具体的に例示するならば、照射面積15×60mmに対
し、一辺0.25mmの略さいころ状のGaP発光ダイオード
（３）（３）…を6.0mm間隔で２列に配置した。白色樹
脂（６）はチタンホワイト15〜35重量％を混入したエポ
キシ樹脂系のものをセロソルブ系溶剤を用いて２度塗り
し、窓部（6a）（6a）…は一辺4.0mmとした。窓部（6
a）（6a）…におけるプリント配線（２）（２）（２）
の面積占有率は85％以下、より好ましくは50〜80％とし
た。この様な面発光素子は従来高さ（基板の裏面から拡
散シート表面までの高さ）6.5乃至8.0mmであったものが
5.5mmとしても均一照度での照明が行なえ、さらに発光
ダイオード間隔を２割広げても液晶表示器の背面に積層
して均一照明を行うことができた。More specifically, GaP light emitting diodes (3), (3),... Having a side of 0.25 mm are arranged in two rows at 6.0 mm intervals with respect to an irradiation area of 15 × 60 mm. The white resin (6) was twice coated with an epoxy resin-based resin mixed with 15 to 35% by weight of titanium white using a cellosolve-based solvent, and the windows (6a) (6a). Window (6
a) Printed wiring in (6a) ... (2) (2) (2)
Is 85% or less, more preferably 50 to 80%. Such a surface light emitting device had a height (the height from the back surface of the substrate to the surface of the diffusion sheet) of 6.5 to 8.0 mm.
Even at 5.5 mm, illumination with uniform illuminance could be performed, and even when the interval between the light emitting diodes was widened by 20%, uniform illumination could be performed by laminating on the back surface of the liquid crystal display.
ト）考案の効果 本考案は上述の様に、各々の発光ダイオードの周辺に
位置する基板の表面を露出させるので、発光ダイオード
からの高輝度光はこの露出部に於て吸収される。故に、
この露出部の上方に位置する光拡散シート上で輝度は弱
められる。そして露出部の周辺に位置する基板の表面に
平坦に白色樹脂を設けるので、この部分での反射効率は
高くなる。故に、露出部の周辺の上方に位置する光拡散
シート上で輝度は強められる。従って、全ての発光ダイ
オードを一体的に囲む枠体上の光拡散シートに於て、略
全面にわたって略均一な輝度が得られる。G) Effect of the present invention As described above, the present invention exposes the surface of the substrate located around each light emitting diode, so that the high brightness light from the light emitting diode is absorbed in this exposed portion. Therefore,
The brightness is reduced on the light diffusion sheet located above the exposed portion. Since the white resin is flatly provided on the surface of the substrate located around the exposed portion, the reflection efficiency at this portion is increased. Therefore, the brightness is enhanced on the light diffusion sheet located above the periphery of the exposed portion. Therefore, in the light diffusion sheet on the frame that integrally surrounds all the light emitting diodes, substantially uniform brightness can be obtained over substantially the entire surface.
第１図（ａ）は本考案実施例の面発光素子の断面図、同
図（ｂ）はその基板の表面図、第２図は従来の面発光素
子の基板平面図である。 （１）……基板、（３）（３）……発光ダイオード、
（５）……拡散シート、（６）……白色樹脂。1A is a cross-sectional view of a surface light emitting device according to an embodiment of the present invention, FIG. 1B is a front view of the substrate, and FIG. 2 is a plan view of a conventional surface light emitting device. (1) ... substrate, (3) (3) ... light emitting diode,
(5) ... diffusion sheet, (6) ... white resin.
Claims (1)
基板のプリント配線に固着配線された複数の発光ダイオ
ードと、発光ダイオードの上方に基板と略平行に保持さ
れた光拡散手段とを具備した面発光素子において、各々
の発光ダイオードの周辺に位置する前記基材の表面は露
出され、その露出部の周辺に位置する前記基板の表面に
白色樹脂が平坦に設けられ、全ての発光ダイオードを一
体的に囲む様に前記基板上に枠体が設けられた事を特徴
とする面発光素子。1. A substrate having printed wiring on a surface of a base material,
In a surface light emitting device comprising a plurality of light emitting diodes fixedly wired to a printed wiring of a substrate and light diffusion means held above the light emitting diodes substantially in parallel with the substrate, the light emitting device is located around each light emitting diode. The surface of the substrate was exposed, a white resin was flatly provided on the surface of the substrate located around the exposed portion, and a frame was provided on the substrate so as to integrally surround all the light emitting diodes. A surface emitting device characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988132988U JP2526470Y2 (en) | 1988-10-12 | 1988-10-12 | Surface emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988132988U JP2526470Y2 (en) | 1988-10-12 | 1988-10-12 | Surface emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0254252U JPH0254252U (en) | 1990-04-19 |
| JP2526470Y2 true JP2526470Y2 (en) | 1997-02-19 |
Family
ID=31390452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988132988U Expired - Lifetime JP2526470Y2 (en) | 1988-10-12 | 1988-10-12 | Surface emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2526470Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5265732B2 (en) * | 2011-05-12 | 2013-08-14 | 京楽産業．株式会社 | Game machine |
| JP6185114B2 (en) * | 2016-06-08 | 2017-08-23 | 新光電気工業株式会社 | Wiring board and light emitting device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6125269Y2 (en) * | 1980-03-28 | 1986-07-29 | ||
| JPS5877071U (en) * | 1981-11-17 | 1983-05-24 | 三洋電機株式会社 | light emitting diode display |
| JPS58174988A (en) * | 1982-04-07 | 1983-10-14 | 三洋電機株式会社 | Light emitting diode display unit and manufacture thereof |
-
1988
- 1988-10-12 JP JP1988132988U patent/JP2526470Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0254252U (en) | 1990-04-19 |
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