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JP2573723Y2 - LED display unit - Google Patents

LED display unit

Info

Publication number
JP2573723Y2
JP2573723Y2 JP1991082672U JP8267291U JP2573723Y2 JP 2573723 Y2 JP2573723 Y2 JP 2573723Y2 JP 1991082672 U JP1991082672 U JP 1991082672U JP 8267291 U JP8267291 U JP 8267291U JP 2573723 Y2 JP2573723 Y2 JP 2573723Y2
Authority
JP
Japan
Prior art keywords
wiring board
housing
drive circuit
matrix wiring
display unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1991082672U
Other languages
Japanese (ja)
Other versions
JPH0533181U (en
Inventor
純 宇佐美
達生 三木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiwa Electric Mfg Co Ltd
Original Assignee
Seiwa Electric Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiwa Electric Mfg Co Ltd filed Critical Seiwa Electric Mfg Co Ltd
Priority to JP1991082672U priority Critical patent/JP2573723Y2/en
Publication of JPH0533181U publication Critical patent/JPH0533181U/en
Application granted granted Critical
Publication of JP2573723Y2 publication Critical patent/JP2573723Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は、表示画素となるLED
チップがマトリックス状に配設され、例えば多数個を固
定枠体に取り付けて前面を面一に配置することにより大
型表示画面のLED表示装置を構成できるLED表示ユ
ニットに関するものである。
The present invention relates to an LED which is used as a display pixel.
The present invention relates to an LED display unit in which chips are arranged in a matrix and, for example, a large number of chips are mounted on a fixed frame body and the front surface is flush with each other to form an LED display device having a large display screen.

【0002】[0002]

【従来の技術】斯かるこの種のLED表示ユニットは、
それの破断右側面図を示した図4のような構成になって
いる。即ち、同図には、マトリックス配線板(2)の前
面にハウジング(1)が接合固着されてなる表示部が4
分割された構成のもの、換言すると4個の同一の矩形状
表示ブロックを正面正方形に並設した構成のものを例示
してあり、マトリックス配線板(2)には、これの前面
に形成された配線回路パターン(図示せず)に例えば6
4×64個のLEDチップ(図示せず)がマトリックス
状に配列してボンディング実装されており、この各LE
Dチップに給電するためのターミナルピン(3)は、図
2に示すように列状に配され、且つマトリックス配線板
(2)を貫通して配線回路パターンに電気的に導通して
いる。ハウジング(1)には、LEDによる1画素単位
毎に表示孔(図示せず)が対向配設され、マトリックス
配線板(2)の前面に融着等の手段で一体化されてい
る。
2. Description of the Related Art Such an LED display unit of this type is:
It has a configuration as shown in FIG. 4 showing a cutaway right side view thereof. That is, FIG. 1 shows a display section 4 having a housing (1) joined and fixed to the front surface of a matrix wiring board (2).
A divided configuration, in other words, a configuration in which four identical rectangular display blocks are arranged side by side in a square front is illustrated, and the matrix wiring board (2) is formed on the front surface thereof. For example, 6 in the wiring circuit pattern (not shown)
4 × 64 LED chips (not shown) are arranged in a matrix and bonded and mounted.
The terminal pins (3) for supplying power to the D chip are arranged in rows as shown in FIG. 2, and penetrate through the matrix wiring board (2) to be electrically connected to the wiring circuit pattern. The housing (1) is provided with a display hole (not shown) for each pixel unit of the LED, and is integrated with the front surface of the matrix wiring board (2) by means of fusion or the like.

【0003】各LEDチップの発光駆動時の発熱を逃が
すための金属製の放熱部材(4)には、ターミナルピン
(3)の各列をそれぞれ挿通させるための長孔状の複数
個の挿通孔(5)が所要箇所に形成されており、ハウジ
ング(1)とマトリックス配線板(2)とが一体化され
てなる表示部の背面全体が、熱伝導シリコンゴム(6)
を介在し、且つ表示部の背面から突出した各ターミナル
ピン(3)を挿通孔(5)に挿通させて放熱部材(4)
の前面に接合されている。また、所要の電子部品が実装
されて前記各LEDチップの点灯制御回路が形成された
駆動回路基板(7)は、放熱部材(4)の後面から突設
されたねじ孔を有する取付部(8)に固定ねじ(9)に
より固定されてているとともに、各ターミナルピン
(3)が半田付けにより接続されている。このターミナ
ルピン(3)により放熱部材(4)が熱伝導ゴム(6)
を介し表示部に押し付けられて固定されている。尚、同
図では固定枠体に取り付けるための構成等を省略してあ
る。
[0003] A plurality of elongated insertion holes through which each row of terminal pins (3) are inserted are inserted into a metal heat dissipation member (4) for releasing heat generated during emission driving of each LED chip. (5) is formed at a required location, and the entire back surface of the display unit in which the housing (1) and the matrix wiring board (2) are integrated is made of heat conductive silicone rubber (6).
The terminal pins (3) protruding from the rear surface of the display unit are inserted through the insertion holes (5) so that the heat radiation member (4)
It is joined to the front of. The drive circuit board (7) on which required electronic components are mounted and the lighting control circuit of each of the LED chips is formed has a mounting portion (8) having a screw hole protruding from the rear surface of the heat radiating member (4). ) Are fixed by fixing screws (9), and the respective terminal pins (3) are connected by soldering. The terminal pin (3) allows the heat dissipating member (4) to be thermally conductive rubber (6).
And is pressed against the display unit and fixed. It should be noted that components and the like for attachment to the fixed frame are omitted in FIG.

【0004】[0004]

【考案が解決しようとする課題】前記LED表示ユニッ
トは、駆動回路基板(7)が固定ねじ(9)により放熱
部材(4)に固定され、その放熱部材(4)が各ターミ
ナルピン(3)により熱伝導ゴム(6)を介在して表示
部に押し付け固定されているので、比較的堅固に組み立
てられる利点がある。然し乍ら、比較的小さい面積のマ
トリックス配線板(2)に前述のように64×64個と
いった多数個のLEDチップが実装され、この多数個の
LEDチップを点灯制御するための駆動回路基板(7)
は、、電子部品の実装密度が年々高くなっているため
に、放熱部材(4)にねじ止めするためのスペースを確
保するのが困難な状況になっている。
In the LED display unit, a drive circuit board (7) is fixed to a heat radiating member (4) by a fixing screw (9), and the heat radiating member (4) is connected to each terminal pin (3). As a result, it is pressed and fixed to the display unit with the heat conductive rubber (6) interposed therebetween. However, a large number of 64.times.64 LED chips are mounted on the matrix wiring board (2) having a relatively small area as described above, and a drive circuit board (7) for controlling the lighting of the large number of LED chips.
However, since the mounting density of electronic components is increasing year by year, it is difficult to secure a space for screwing to the heat radiating member (4).

【0005】そこで、ねじ止めを廃止し、放熱部材
(4)には駆動回路基板(7)の例えば四隅部分に単に
当接してこれを支持するだけのピン状支持部のみを形成
し、放熱部材(4)を、各ターミナルピン(3)を通じ
表示部と駆動回路基板(7)とで挟持固定する構成とす
ることが考えられる。ところが、放熱部材(4)は表示
部と駆動回路基板(7)とで単に挟持固定されているだ
けであり、また、放熱部材(4)の挿通孔(5)は、タ
ーミナルピン(3)に接触しないようにターミナルピン
(3)の各列に対し大きめの形状に穿設されている。そ
のため、LEDチップの発熱による駆動回路基板(7)
やターミナルピン(3)の伸長変形により発生する表示
部に対する押圧力の減少や振動等によって放熱部材
(4)が横方向、つまり各部材(1),(2),
(6),(4),(7)の重ね方向である前後方向に対
し上下左右を含む直交面方向に変位し、ターミナルピン
(3)が放熱部材(4)に接触する不都合が生じる問題
がある。
Therefore, the screwing is eliminated, and only the pin-shaped support portion for simply contacting and supporting the four corner portions of the drive circuit board (7) is formed on the heat radiating member (4). It is conceivable to adopt a configuration in which (4) is sandwiched and fixed between the display unit and the drive circuit board (7) through each terminal pin (3). However, the heat dissipating member (4) is merely sandwiched and fixed between the display unit and the drive circuit board (7), and the insertion hole (5) of the heat dissipating member (4) is connected to the terminal pin (3). Each row of terminal pins (3) is drilled in a larger shape so as not to contact. Therefore, the drive circuit board (7) caused by the heat generated by the LED chip
The heat radiating member (4) is moved laterally, that is, each member (1), (2),
(6), (4), and (7) are displaced in an orthogonal plane direction including up, down, left, and right with respect to the front-rear direction, which is the direction in which the terminal pins (3) are in contact with the heat radiating member (4). is there.

【0006】そこで本考案は、駆動回路基板の一部を放
熱部材に単に当接させるのみの構成として電子部品の実
装密度を高くしながらも、簡単な構成で放熱部材の横方
向への変位を確実に防止できるようなLED表示ユニッ
トを提供することを技術的課題とするものである。
Therefore, the present invention provides a structure in which a part of the drive circuit board is merely brought into contact with the heat radiating member, thereby increasing the mounting density of the electronic components, and reducing the lateral displacement of the heat radiating member with a simple structure. It is an object of the present invention to provide an LED display unit that can surely prevent the display.

【0007】[0007]

【課題を解決するための手段】本考案は、上記した課題
を達成するための技術的手段として、LED表示ユニッ
トを次のように構成した。即ち、多数個のLEDがマト
リックス状に配置して前面の配線パターンに取り付けら
れ、且つ背面からLED給電用ターミナルピンが配列状
態に突設されたマトリックス配線板と、前記LEDによ
る1画素単位毎に表示孔が対向配設されて前記マトリッ
クス配線板の前面に接合状態に取着された合成樹脂製ハ
ウジングと、前記各ターミナルピンを挿通させて前記マ
トリックス配線板の背面全体に密接された放熱部材と、
この放熱部材の後側に配置されて前記各ターミナルピン
の端部が接続固着された駆動回路基板とを具備してなる
LED表示ユニットにおいて、前記ハウジングの背面に
複数本のピン状突起を一体に突設し、前記マトリックス
配線板に前記各突起の挿通孔を形成するとともに、前記
突起のうちの所定数の端部を前記マトリックス配線板の
背面に融着して前記ハウジングと前記マトリックス配線
板とを一体化し、前記放熱板に、これの前面に未融着の
前記各突起の端部が各々嵌入する複数個の位置決め用凹
部を、且つ背面に前記駆動回路基板を当接させる支持部
をそれぞれ形成したことを特徴として構成されている。
According to the present invention, as a technical means for achieving the above-mentioned object, an LED display unit is constituted as follows. That is, a matrix wiring board in which a large number of LEDs are arranged in a matrix and attached to a wiring pattern on the front surface, and LED power supply terminal pins are projected from the rear surface in an array state. A synthetic resin housing in which a display hole is provided to be opposed to the front surface of the matrix wiring board and is attached to the front surface of the matrix wiring board, and a heat radiating member closely inserted over the entire rear surface of the matrix wiring board through the terminal pins. ,
And a drive circuit board disposed on the rear side of the heat dissipating member and having the ends of the terminal pins connected and fixed, wherein a plurality of pin-shaped projections are integrally formed on the rear surface of the housing. Projecting, forming an insertion hole for each of the projections in the matrix wiring board, and fusing a predetermined number of the ends of the projections to the back surface of the matrix wiring board to form the housing and the matrix wiring board. A plurality of positioning recesses into which the ends of the unfused projections are fitted, respectively, on the front surface of the heat radiating plate, and a supporting portion for abutting the drive circuit board on the back surface. It is characterized by being formed.

【0008】[0008]

【作用】駆動回路基板は、電子部品の実装密度を高める
ために一部が放熱部材の支持部に当接されているだけで
あるが、半田付けされている多数本のターミナルピンに
より固定される。放熱部材は、ターミナルピンを通じ表
示部と駆動回路基板とで挟持されて前後方向の位置決め
がなされ、凹部に嵌入する複数本の突起により前後左右
を含む横方向への変位が阻止されるので、放熱部材は振
動等により変位することかない。また、LEDの発熱に
よるターミナルピンや駆動回路基板の伸長変形に対して
は、合成樹脂製のハウジングに一体形成された突起が、
自体の弾性力により前後方向の寸法変化に対し追従して
凹部から抜脱することがない。従って、各ターミナルピ
ンのみにより放熱部材および駆動回路基板を固定する構
成としながらも放熱部材の横方向への変位を確実に防止
できる。
The drive circuit board is only partially contacted with the supporting portion of the heat dissipating member in order to increase the mounting density of electronic components, but is fixed by a large number of soldered terminal pins. . The heat dissipating member is sandwiched between the display unit and the drive circuit board through the terminal pins, and is positioned in the front-rear direction. The member is not displaced by vibration or the like. Also, when the terminal pins and the drive circuit board are stretched and deformed due to the heat generated by the LEDs, the protrusions formed integrally with the housing made of synthetic resin,
Due to its own elastic force, it does not come out of the recess following the dimensional change in the front-rear direction. Therefore, the displacement of the heat radiating member in the horizontal direction can be reliably prevented while the heat radiating member and the drive circuit board are fixed only by each terminal pin.

【0009】[0009]

【実施例】以下、本考案の好適な一実施例について図面
を参照しながら詳述する。図1は本考案の一実施例の一
部破断右側面図、図2は同上の表示部の構成要素である
表示ブロックの斜視図、図3は同上の放熱部材の一部斜
視図をそれぞれ示し、これらの図において図4と同等の
ものには同一の符号を付してあり、また、これらの図に
は、理解を容易にするために、固定枠体に取り付けるた
めの構成等の本考案の要旨と直接関係のない部分を省略
してある。そして、表示部は図2に示すような正面正方
形の4個の同一の表示ブロックが正方形に組み合わせて
構成されており、この表示ブロックは、多数個のLED
チップがマトリックス状に配置して実装されたマトリッ
クス配線板(12)の前面に、LEDによる1画素単位
毎に表示孔が対向配設された合成樹脂製のハウジング
(11)が接合固定され、マトリックス配線板(12)
の背面からターミナルピン(13)が突設されている構
成において既存のものと同様であるが、相違する点は、
ハウジング(11)にこれの背面適所から突出する複数
本(実施例では表示ブロックに7本で表示部全体で28
本の場合を図示)のピン状突起(18)が一体成形され
ているとともに、マトリックス配線板(12)に、各突
起(18)の挿通孔(19)が形成され、各突起(1
8)のうちの所定のものの端部がマトリックス配線板
(12)の背面に融着(A)されてハウジング(11)
とマトリックス配線板(12)とが一体化された構成に
ある。この実施例では、図2に示すように、各表示ブロ
ックの四隅と中央部とにそれぞれ配設された計5本の突
起(18)を融着(A)してハウジング(11)とマト
リックス配線板(12)との固着用とし、且つ中央部上
下の計2本の未融着の突起(18)を後述の放熱部材
(14)の位置決め用とした場合を示してある。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a partially cutaway right side view of an embodiment of the present invention, FIG. 2 is a perspective view of a display block as a component of a display unit of the above, and FIG. 3 is a partial perspective view of a heat dissipation member of the same. In these figures, the same parts as those in FIG. 4 are denoted by the same reference numerals, and in order to facilitate understanding, the present invention has a structure for mounting on a fixed frame. The parts not directly related to the gist of the above are omitted. The display unit is configured by combining four identical display blocks each having a square frontal shape as shown in FIG. 2 in a square shape.
On the front surface of a matrix wiring board (12) on which chips are arranged in a matrix and mounted, a synthetic resin housing (11) in which display holes are opposed to each other for each pixel by LED is fixedly joined. Wiring board (12)
The configuration in which the terminal pin (13) protrudes from the back of the device is the same as the existing one, but the difference is that
A plurality of housings (11) projecting from appropriate positions on the back of the housing (in the embodiment, seven display blocks and 28 display units in total)
The pin-shaped projection (18) is integrally formed, and an insertion hole (19) for each projection (18) is formed in the matrix wiring board (12).
8) An end of a predetermined one is fused (A) to the back surface of the matrix wiring board (12) to form a housing (11).
And the matrix wiring board (12) are integrated. In this embodiment, as shown in FIG. 2, a total of five projections (18) arranged at the four corners and the center of each display block are fused (A) to form a housing (11) and matrix wiring. A case is shown in which two unfused projections (18) above and below the central portion are used for positioning the heat dissipating member (14), which is for fixing to the plate (12).

【0010】各LEDチップの発光駆動時の発熱を逃が
すための金属製の放熱部材(14)には、図3に示すよ
うに、各ターミナルピン(13)群をそれぞれ挿通させ
るための長孔状の複数個の挿通孔(15)が所要箇所に
形成されている構成においてのみ既存のものと同様であ
るが、隣接する各2個の挿通孔(15)間の上下箇所
に、前述の未融着の位置決め用突起(18)が嵌入する
位置決め用凹部(20)が形成されているとともに、背
面の四隅部分から支持部(21)が一体に突設されてい
る。
As shown in FIG. 3, an elongated hole for allowing each terminal pin (13) group to pass through a metal heat radiating member (14) for releasing heat generated when each LED chip emits light. Is the same as the existing one only in a configuration in which a plurality of insertion holes (15) are formed at required positions, but the above-mentioned unfused portions are provided at upper and lower positions between each two adjacent insertion holes (15). A positioning recess (20) into which the positioning projection (18) for fitting is fitted is formed, and a support portion (21) is integrally provided from four corner portions on the back surface.

【0011】図2に示した表示ブロックが熱伝導ゴム
(6)を介在して図3に1点鎖線で示した箇所にそれぞ
れ接合される。このとき、各ターミナルピン(13)群
が各挿通孔(15)に挿通され、且つ未融着の位置決め
用突起(18)が位置決め用凹部(20)に嵌入する。
この位置決め用突起(18)と位置決め用凹部(20)
とにより、後述の放熱部材(14)の横方向への変位防
止の他に、4個の表示ブロックを放熱部材(14)に取
り付ける際の相互の位置決め用にも利用できる利点があ
る。駆動回路基板(7)は四隅部分を放熱部材(14)
の支持部(21)にそれぞれ当接して各ターミナルピン
(13)が半田付けされている。従って、駆動回路基板
(7)における電子部品の実装密度をねじ止めする場合
に比較して格段に高めることができる。
The display block shown in FIG. 2 is joined to the portion shown by the one-dot chain line in FIG. 3 via the heat conductive rubber (6). At this time, each terminal pin (13) group is inserted into each insertion hole (15), and the unfused positioning projection (18) fits into the positioning recess (20).
The positioning projection (18) and the positioning recess (20)
Accordingly, there is an advantage that, in addition to preventing the heat dissipating member (14) to be described later from being displaced in the lateral direction, the four display blocks can be used for mutual positioning when the four display blocks are attached to the heat dissipating member (14). The drive circuit board (7) has heat dissipation members (14) at the four corners.
The terminal pins (13) are soldered in contact with the support portions (21). Therefore, the mounting density of the electronic components on the drive circuit board (7) can be significantly increased as compared with the case of screwing.

【0012】駆動回路基板(7)は半田付けされている
多数本のターミナルピン(7)により支持部(21)に
当接状態で固定される。放熱部材(14)は、ターミナ
ルピン(13)を通じ表示部と駆動回路基板(7)とで
挟持されて前後方向の位置決めがなされ、位置決め用凹
部(20)に嵌入する2個4組の計8本の位置決め用突
起(18)により前後左右の横方向への変位が阻止され
ているので、振動等によりずれることがない。また、合
成樹脂製のハウジング(12)に一体形成された突起
(18)が、LEDの発熱によるターミナルピン(1
3)や駆動回路基板(7)の伸長変形に対し自体の弾性
力により前後方向の寸法変化に追従するので、凹部(2
0)から抜脱することがない。従って、各ターミナルピ
ン(13)のみにより放熱部材(14)および駆動回路
基板(7)を固定する構成としながらも放熱部材(1
4)の横方向の変位を確実に防止できる。
The drive circuit board (7) is fixed in contact with the support (21) by a large number of soldered terminal pins (7). The heat dissipating member (14) is sandwiched between the display unit and the drive circuit board (7) through the terminal pins (13), is positioned in the front-rear direction, and is fitted in the positioning recess (20). Since the positioning projections (18) prevent displacement in the front-rear, left-right and lateral directions, they do not shift due to vibration or the like. Further, the projection (18) integrally formed with the housing (12) made of synthetic resin is provided with a terminal pin (1) caused by heat generated by the LED.
3) and the extension and deformation of the drive circuit board (7) follow the dimensional change in the front-rear direction by its own elastic force.
No escape from 0). Therefore, while the heat radiating member (14) and the drive circuit board (7) are fixed only by each terminal pin (13), the heat radiating member (1) is fixed.
4) The displacement in the lateral direction can be reliably prevented.

【0013】[0013]

【考案の効果】以上のように本考案のLED表示ユニッ
トによると、駆動回路基板の一部を放熱部材の支持部に
単に当接させるのみにして駆動回路基板の電子部品の実
装密度を高め、ターミナルピンにより放熱部材と駆動回
路基板とを前後方向の位置決めを行って固定する構成と
しながらも、合成樹脂製ハウジングの背面から一体に突
設させたピン状突起を、マトリックス配線板を挿通させ
て放熱板の位置決め用凹部に嵌入させた構成としたの
で、LEDの発熱による駆動回路基板やターミナルピン
の伸長変形や振動等に対し、放熱部材の横方向への変位
を確実に防止することができる。
As described above, according to the LED display unit of the present invention, the mounting density of the electronic components of the drive circuit board is increased by simply bringing a part of the drive circuit board into contact with the supporting portion of the heat radiating member. While the heat dissipation member and the drive circuit board are positioned and fixed in the front-rear direction by the terminal pins, the matrix wiring board is inserted through the pin-shaped projections that are integrally protruded from the back of the synthetic resin housing. The configuration in which the heat sink is fitted into the positioning recess of the heat sink makes it possible to reliably prevent the heat dissipating member from being displaced in the horizontal direction against elongation deformation, vibration, and the like of the drive circuit board and terminal pins due to heat generated by the LEDs. .

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案の一実施例の一部破断右側面図である。FIG. 1 is a partially cutaway right side view of an embodiment of the present invention.

【図2】同上、表示部の一部の斜視図である。FIG. 2 is a perspective view of a part of the display unit according to the first embodiment.

【図3】同上、放熱部材の一部の斜視図である。FIG. 3 is a perspective view of a part of the heat dissipation member.

【図4】従来ユニットの一部破断右側面図である。FIG. 4 is a partially cutaway right side view of a conventional unit.

【符号の説明】[Explanation of symbols]

7 駆動回路基板 11 ハウジング 12 マトリックス配線板 13 ターミナルピン 14 放熱部材 18 ピン状突起 19 挿通孔 20 位置決め用凹部 Reference Signs List 7 drive circuit board 11 housing 12 matrix wiring board 13 terminal pin 14 heat dissipation member 18 pin-shaped protrusion 19 insertion hole 20 positioning recess

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 多数個のLEDがマトリックス状に配置
して前面の配線パターンに取り付けられ、且つ背面から
LED給電用ターミナルピンが配列状態に突設されたマ
トリックス配線板と、前記LEDによる1画素単位毎に
表示孔が対向配設されて前記マトリックス配線板の前面
に接合状態に取着された合成樹脂製ハウジングと、前記
各ターミナルピンを挿通させて前記マトリックス配線板
の背面全体に密接された放熱部材と、この放熱部材の後
側に配置されて前記各ターミナルピンの端部が接続固着
された駆動回路基板とを具備してなるLED表示ユニッ
トにおいて、前記ハウジングの背面に複数本のピン状突
起を一体に突設し、前記マトリックス配線板に前記各突
起の挿通孔を形成するとともに、前記突起のうちの所定
数の端部を前記マトリックス配線板の背面に融着して前
記ハウジングと前記マトリックス配線板とを一体化し、
前記放熱板に、これの前面に未融着の前記各突起の端部
が各々嵌入する複数個の位置決め用凹部を、且つ背面に
前記駆動回路基板を当接させる支持部をそれぞれ形成し
たことを特徴とするLED表示ユニット。
1. A matrix wiring board in which a large number of LEDs are arranged in a matrix and attached to a wiring pattern on a front surface, and a terminal pin for LED power supply is projected from a rear surface in an array state, and one pixel by the LEDs A display housing is provided for each unit, and a synthetic resin housing is attached to the front surface of the matrix wiring board in a bonded state, and the terminal pins are inserted through the housing to closely contact the entire back surface of the matrix wiring board. In an LED display unit comprising a heat dissipating member, and a drive circuit board disposed on the rear side of the heat dissipating member and having an end of each of the terminal pins connected and fixed, a plurality of pins are provided on the rear surface of the housing. Projections are integrally formed, and insertion holes for the respective projections are formed in the matrix wiring board, and a predetermined number of ends of the projections are connected to the mat. The housing and the matrix wiring board are integrated by fusing to the back of the Rix wiring board,
A plurality of positioning recesses into which the ends of the unfused protrusions are respectively fitted are formed on the front surface of the heat radiating plate, and a supporting portion for contacting the drive circuit board is formed on the back surface. Characterized LED display unit.
JP1991082672U 1991-10-11 1991-10-11 LED display unit Expired - Lifetime JP2573723Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991082672U JP2573723Y2 (en) 1991-10-11 1991-10-11 LED display unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991082672U JP2573723Y2 (en) 1991-10-11 1991-10-11 LED display unit

Publications (2)

Publication Number Publication Date
JPH0533181U JPH0533181U (en) 1993-04-30
JP2573723Y2 true JP2573723Y2 (en) 1998-06-04

Family

ID=13780919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991082672U Expired - Lifetime JP2573723Y2 (en) 1991-10-11 1991-10-11 LED display unit

Country Status (1)

Country Link
JP (1) JP2573723Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source
US9195281B2 (en) 2013-12-31 2015-11-24 Ultravision Technologies, Llc System and method for a modular multi-panel display

Also Published As

Publication number Publication date
JPH0533181U (en) 1993-04-30

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