JP2564645Y2 - Hybrid integrated circuit device having heat-generating components - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device on which heat-generating components having high power consumption are mounted.

[0002]

2. Description of the Related Art FIG. 3 is a view showing a heat radiating structure of a heat generating component in a conventional example. In FIG. 3, the circuit board 31 includes:
Land electrodes 32, 32 'and wiring patterns 33, 33' are formed. In addition, the land electrode 3 of the circuit board 31
External connection terminals 34, 34 'are attached to 2, 32'. For example, a bare chip 35 (hereinafter, an LSI or an IC that is not insulated and molded by a mold is simply referred to as a bare chip) that generates heat is attached to such a circuit board 31 by an adhesive (not shown). Thereafter, the terminal electrodes 36 of the bare chip 35,
36 'and the wiring patterns 33, 33' of the circuit board 31 are electrically connected by wires 37, 37 '. The connection by the wires 37 and 37 'is automatically performed by wire bonding.

[0003] As described above, the entire circuit board 31 on which circuit components such as the bare chip 35 are mounted is molded with a mold resin 38 having good thermal conductivity. This circuit board 3
In order to further improve the heat radiation property of the heat radiation fin 4, a heat conductive adhesive 39 is provided on the upper part of the mold resin 38.
A heat sink 40 with 0 'is attached.
With the above-described configuration, heat generated from the heat-generating component is transferred to the heat-conductive mold resin 38 and the heat sink 4.
Emanates from zero.

FIG. 4 is a view showing a heat dissipation structure of a heat-generating component in another conventional example. In FIG. 4, the heat radiation circuit board 4
Numeral 1 is made of, for example, a ceramic substrate, has an opening 42 formed therein, and has land electrodes 43, 4 on one surface.
3 'is formed. Further, a heat dissipating member 51 is attached to the opening 42 with a heat conductive adhesive 52. A heat generating member, for example, a bare chip 53 is attached to the upper surface of the heat radiating member 51. The height of the terminal electrodes 54 and 54 ′ formed on the bare chip 53 is the same as that of the land electrodes 4 formed on the heat radiation circuit board 41.
3, 43 '. Then, the terminal electrode 5
4, 54 'and land electrodes 43, 43'
Wire bonding is performed by 5, 55 '.

[0005]

[Problems to be solved by the invention] In recent years, bare chips
In order to meet the demand for miniaturization, the degree of integration has been increased. However, the power consumption of bare chips with a high degree of integration has also increased. Therefore, heat is radiated by the heat conductive mold resin and the heat sink shown in FIG. Such a heat dissipating means has a problem that the heat sink portion becomes large and it is impossible to respond to miniaturization. In FIG. 4, heat generated from the bare chip is radiated while passing through the heat radiating member, the heat conductive adhesive, and the heat radiating circuit board. Therefore, the heat radiation effect is better than that of FIG. However, since the connection between the land electrode of the heat radiation circuit board and the terminal electrode of the bare chip is performed by wire bonding, the height of the insulating member covering the slack portion of the wire increases, and the amount of the insulating member also increases. . That is, in the wire bonding for connecting the land electrode and the terminal electrode, since the wire is cut off by an electric torch, the wire is not linearly led out from the cut portion, but the wire is slackened. The coating with the insulating member also covers the slack portion of the wire, so that the entire thickness of the hybrid integrated circuit device cannot be reduced. Wire bonding can automatically connect the land electrode and the terminal electrode, but has the problem that it takes time to process each one.

The present invention is intended to solve the above problems, and is a hybrid integrated circuit which is small in size, has good heat radiation characteristics, and can easily connect a land electrode of a circuit board to a terminal electrode such as a heat-generating component. It is intended to provide a device.

[0007]

Means for Solving the Problems (First Invention) In order to achieve the above object, a hybrid integrated circuit device having a heat generating component according to the present invention has a through hole (2 in FIG. 1). A first heat dissipation circuit board (1 in FIG. 1) having a wiring pattern (5, 5 'in FIG. 1) formed on one surface;
Being attached inside the through hole (2) ,
Other than the first heat radiation circuit board (1), through a heat radiation member (22 in FIG. 1) provided inside the through hole (2).
A heat generating component to the heat radiating from the surface of the square (21 in FIG. 1), the first
1 of the heat radiation circuit board (1) (FIG. 1)
4) and the terminal electrodes (21 ', 21 " , 25, 25' in FIG. 1) of the heating component (21) and the circuit component (24 ) are electrically connected. Connect to
And a flexible circuit board (11 in FIG. 1) on which wiring patterns (12 and 12 'in FIG. 1) are formed.

(Second Invention) A hybrid integrated circuit device having a heat generating component according to the present invention has a through hole.
(2) is drilled, and a wiring pattern is formed on one surface.
First heat dissipation circuit board on which (5, 5 ') is formed
(1) mounted inside the through hole (2)
And a radiator provided inside the through hole (2).
A first heat-dissipating circuit board (1) via a material (22);
A heat-generating component (21) for radiating heat from the other surface of the first member;
Embedded in the recess provided in the heat radiation circuit board (1)
Circuit component (24), said heat-generating component (21) and circuit component
(24), terminal electrodes (21 ', 21 ", 25, 2
5 ') to electrically connect the wiring patterns (12,
12 ′) is formed on the second heat dissipation circuit board (1).
1 ').

[0009]

[0010]

[Operation] (First device) It is assumed that the first heat dissipation circuit board has a through hole .
In both cases, a wiring pattern is formed on one surface. the above
Heating components and heat dissipating members are attached inside the through hole .
That has been. Also, a recess is provided on the first heat dissipation circuit board.
The circuit component is embedded in the recess. First a heat generating component Contact heat dissipation circuit board formed a wiring pattern
And the terminal electrodes of the circuit components are electrically connected by the wiring pattern of the flexible circuit board. Therefore, the heat generated from the heat-generating component dissipates while being transmitted from the heat dissipating member to the first heat dissipating circuit board. Then, the wiring of the heat-generating components is soldered at a plurality of locations at once by simply placing a solder paste at a soldering position of a flexible circuit board formed in advance as a wiring pattern and then passing it through a reflow furnace. You.

[0011] (Second invention) first heat dissipation circuit board, the recess for inserting the through <br/> port and circuit components for attaching the heat generating component is formed. Circuit components are attached to the recesses by, for example, an adhesive. The second heat radiating circuit board includes the heat generating component and
Wiring patterns are formed for electrically connecting the fine circuit parts
You. The terminal electrodes of the heat-generating component and the terminal electrodes of other circuit components are connected to the wiring pattern of the second heat-radiating circuit board.
Ru are electrically connected by a turn. Therefore, the heat-generating component and other circuit components are separated by the second heat-radiating circuit board.
It can be connected at the same time Te. In addition, heat radiation of heat-generating components
Are a heat dissipation member, a first heat dissipation circuit board, and a second heat dissipation circuit board.
Dissipates while transmitting to the thermal circuit board.

[0012]

[0013]

[Embodiment] FIG. 1 is a view for explaining heat radiation of a heat-generating component and a wiring structure according to an embodiment of the present invention. The first heat-dissipating circuit board 1 is made of a ceramic substrate or the like having a good heat-dissipating property. In addition, wiring patterns 5, 5 'are formed on one surface of the first heat radiation circuit board 1. An opening 2 formed in the first heat dissipation circuit board 1
, A heat radiating member 22 is attached by, for example, a heat-resistant adhesive 23 or a high-temperature solder. Further, the heat generating component 21 is similarly attached to the heat radiating member 22. Similarly, a circuit component 24 is attached to the concave portion 4 formed in the first heat dissipation circuit board 1 by using a heat-resistant adhesive 23 or a high-temperature solder.

On the other hand, the flexible circuit board 11 has the terminal electrodes 21 ′ and 21 ″ of the heat generating component 21 and the circuit component 2.
Wiring patterns 12, 12 'are formed at positions corresponding to the four terminal electrodes 25, 25'. Therefore, the first
Heat generating component 21 and circuit component 24
After the solder paste is placed on these terminal electrodes and the flexible circuit board 11 is attached, the heat generating component 21 and the circuit component 24 are electrically connected to desired places. With such a configuration, heat generated in the heat-generating component 21 is transmitted to the heat-radiating member 22 and the first
From the heat radiation circuit board 1. Heating component 2
The wiring between the circuit component 1 and the circuit component 24 is connected at a time by the flexible circuit board 11 on which a predetermined wiring pattern is formed, instead of connecting each one by wire bonding.

FIG. 2 is a view for explaining the heat radiation and the wiring structure of the heat-generating component according to another embodiment of the present invention. The difference between the embodiment shown in FIG. 2 and the embodiment shown in FIG. 1 is that a second heat dissipation circuit board 11 'is used instead of the flexible circuit board 11 shown in FIG.
That is, was used. That is, the second heat radiating circuit board 11 ′ is located at a position corresponding to the terminal electrodes 21 ′ and 21 ″ of the heat generating component 21 and the terminal electrodes 25 and 25 ′ of the circuit component 24, similarly to the flexible circuit board 11. It has wiring patterns 12, 12 ', 12 "formed. The second heat radiating circuit board 11 'is made of a heat conductive member having a certain degree of flexibility, such as a thin plate or foil of aluminum, and the wiring pattern 1 is provided via an insulating member 11 ".
2, 12 'and 12 ". Therefore, after the heat-generating component 21 and the circuit component 24 are mounted on the first heat-radiating circuit board 1, the wiring pattern of the second heat-radiating circuit board 11' is formed. 12, 12 ', 12 "are connected to each terminal electrode 21',
21 ", 25, and 25 ', a desired electrical connection can be obtained.
1 'is an insulating member 11 "at a position corresponding to the heat generating component 21.
, An opening 27 is formed.

Further, the second heat radiation circuit board 11 'and the heat generating component 21 are connected by the heat conductive member 26 through the opening 27. The heat generated from the heat-generating component 21 dissipates heat while transmitting the heat dissipating member 22 and the first heat dissipating circuit board 1, and dissipates heat while transferring it from the heat conductive member 26 to the second heat dissipating circuit board 11 '. . In the present embodiment, as described above, not only the heat radiation from the heat-generating component is excellent, but also the wiring can be achieved at once only by soldering.

Although the embodiment of the present invention has been described in detail, the present invention is not limited to the embodiment. And
Various design changes can be made without departing from the present invention described in the utility model registration claims. In this embodiment, one heat-generating component and one circuit component have been described as examples, but the number is not limited to these. Similarly, it goes without saying that the number of terminal electrodes of the heat-generating component and the circuit component is not limited. Further, the wiring pattern of the heat radiation circuit board can be arbitrarily provided or omitted.

[0018]

According to the present invention, heat generated by the heat-generating component is radiated from the heat radiating member and the first circuit board, so that the heat radiating characteristics are excellent. According to the present invention, a plurality of terminal electrodes can be connected at a time by a flexible circuit board for connection between the heat-generating component and the circuit component. According to the present invention, when the second heat-dissipating circuit board is used for connection between the heat-generating component and the circuit component, the heat generated by the heat-generating component is generated by the heat-radiating member and the first circuit.
Substrate, and can be emitted from the second heat dissipation circuit board
Thus, a highly reliable hybrid integrated circuit device is obtained.

[Brief description of the drawings]

FIG. 1 is a view for explaining heat radiation of a heat-generating component and a wiring structure according to an embodiment of the present invention;

FIG. 2 is a view for explaining heat radiation of a heat-generating component and a wiring structure according to another embodiment of the present invention.

FIG. 3 is a view showing a heat dissipation structure of a heat generating component in a conventional example.

FIG. 4 is a diagram showing a heat dissipation structure of a heat-generating component in another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... 1st heat dissipation circuit board 2 ... opening part 3 ... step part 4 ... recessed part 5, 5 '... wiring pattern 11 ... flexible circuit board 11' ... 2nd heat dissipation circuit board 12, 12 ', 12 "... wiring pattern 21 ... heating component 21', 21" ... terminal electrode of heating component 22 ... heat dissipation member 23 ... heat resistance Adhesive 24 ... Circuit components 25, 25 '... Terminal electrode 26 ... Heat conductive member 27 ... Opening

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification number Agency reference number FI Technical indication H05K 7/20 H01L 23/12 E

Claims (2)

(57) [Scope of request for utility model registration] With 1. A through-hole is drilled, a first heat dissipation circuit board having a wiring pattern on one surface is formed, along with the mounted inside the through-hole, the transmural
Through the heat dissipating member provided inside the through hole, the first
A heat- generating component that radiates heat from the other surface of the heat- dissipating circuit board; and a heat-dissipating component embedded in a recess provided in the first heat-dissipating circuit board.
And the circuit components have, to electrically connect the terminal electrodes and the heat generating component and the circuit component
And a flexible circuit board on which a wiring pattern is formed. 2. A through hole is formed, and one surface is formed.
First heat dissipation circuit board on which a wiring pattern is formed
And being mounted inside the through hole,
Through the heat dissipating member provided inside the through hole, the first
A heat-generating component that radiates heat from the other surface of the heat- dissipating circuit board; and a heat-dissipating component embedded in a recess provided in the first heat-dissipating circuit board.
And the circuit components have, to electrically connect the terminal electrodes and the heat generating component and the circuit component
Second heat dissipation circuit on which a wiring pattern is formed
Hybrid integrated circuit device comprising a road-substrate, a heat generating component, characterized in that composed.