JP2024122015A - LIQUID EJECTION HEAD AND LIQUID EJECTION APPARATUS - Google Patents

Abstract

[Problem] To bond a communication plate and a sealing plate well to each other and to effectively prevent an adhesive from flowing into a flow path of the communication plate. [Solution] A liquid ejection head has a nozzle substrate, a pressure chamber substrate, a first surface bonded to the nozzle substrate, and a second surface bonded to the pressure chamber substrate, the communication plate having a first communication path, a second communication path, and an opening, and a sealing plate bonded to the first surface with an adhesive and constituting a part of a wall surface of a flow path formed by the opening, the adhesive being applied to the first surface over an adhesive region extending along the periphery of the opening, the first surface having a plurality of first recesses arranged around the opening, the relationship L≦0.5×W being satisfied, where L is the distance between two adjacent first recesses among the plurality of first recesses and W is the width of the adhesive region. [Selected Figure] Figure 4

Description

This disclosure relates to a liquid ejection head and a liquid ejection device.

Liquid ejection devices, such as inkjet printers, generally have a liquid ejection head that ejects liquid such as ink. For example, the liquid ejection head described in Patent Document 1 has a communication plate, a pressure chamber substrate laminated on one side of the communication plate, and a nozzle substrate and a sealing substrate (compliance substrate) laminated on the other side of the communication plate. A pressure chamber is formed in the pressure chamber substrate, in which pressure is applied to the liquid to eject the liquid. The communication plate is provided with a first communication passage that communicates with one end of the pressure chamber, and a second communication passage that communicates with the other end of the pressure chamber. The nozzle substrate is provided with a plurality of nozzles that communicate with the first communication passage and eject the liquid. The sealing substrate defines a flow path that communicates with the second communication passage. In addition, the communication plate is provided with an opening that constitutes a part of the liquid storage chamber that communicates with the second communication passage.

Here, the communication plate and the sealing substrate are joined together with an adhesive. In Patent Document 1, the communication plate has a recess where it abuts against the sealing substrate in order to prevent the adhesive from entering the flow path of the communication plate.

JP 2022-146190 A

To bond the communication plate and the sealing substrate to each other with an adhesive, the adhesive is applied to the sealing substrate, and then the communication plate and the sealing substrate are attached to each other with the adhesive.

In the liquid ejection head described in Patent Document 1, the planar area of the aforementioned recess can be increased to minimize the escape of adhesive. On the other hand, if the application position of the adhesive on the sealing plate varies due to manufacturing errors or the like, the excess adhesive that cannot escape into the recess flows into the liquid storage section and accumulates there. The amount of adhesive that accumulates in the liquid storage section affects the ejection characteristics of the liquid ejection head. Here, as described above, the larger the planar area of the recess is, the greater the overlapping area between the adhesive adhesion area and the aforementioned recess varies due to variations in the application position of the adhesive on the sealing plate, and therefore the amount of adhesive that accumulates in the liquid storage section also varies greatly. This results in a noticeable change in the ejection characteristics of the liquid ejection head.

In order to solve the above problems, one aspect of the liquid ejection head according to the present disclosure includes a nozzle substrate having a plurality of nozzles for ejecting liquid, a pressure chamber substrate having a pressure chamber for generating pressure for ejecting liquid from each of the plurality of nozzles, a first surface bonded to the nozzle substrate, and a second surface opposite to the first surface and bonded to the pressure chamber substrate, and a first communication passage communicating with each of the nozzles and one end of the pressure chamber, and a second communication passage communicating with the other end of the pressure chamber, for each of the plurality of nozzles. The device has a communication plate having a second communication passage and an opening communicating with the second communication passage, and a sealing plate bonded to the first surface with an adhesive and constituting a part of the wall surface of the flow path formed by the opening, the adhesive is applied to the first surface over an adhesive region extending along the periphery of the opening, the first surface has a plurality of first recesses arranged around the opening, and when the distance between two adjacent first recesses among the plurality of first recesses is L and the width of the adhesive region is W, the relationship L≦0.5×W is satisfied.

One aspect of the liquid ejection device according to the present disclosure includes a liquid ejection head according to the above aspect, and a control unit that controls the operation of the liquid ejection head.

1 is a configuration diagram that illustrates a liquid ejection device according to a first embodiment. FIG. 2 is an exploded perspective view of the liquid ejection head according to the first embodiment. 3 is a cross-sectional view taken along line AA in FIG. 2. 4 is an enlarged plan view showing a portion of a first surface of the communication plate in the first embodiment. FIG. FIG. 13 is a plan view for explaining the depth of a recess formed by anisotropic etching. 6 is a cross-sectional view taken along line BB in FIG. 5. FIG. 11 is an enlarged plan view showing a portion of a first surface of a communication plate in a second embodiment. FIG. 11 is an enlarged plan view showing a portion of a first surface of a communication plate in a third embodiment. FIG. 13 is an enlarged plan view showing a portion of a first surface of a communication plate in a fourth embodiment.

Below, preferred embodiments of the present disclosure will be described with reference to the attached drawings. Note that the dimensions and scale of each part in the drawings may differ from the actual dimensions and some parts are shown diagrammatically to facilitate understanding. Furthermore, the scope of the present disclosure is not limited to these forms unless otherwise specified in the following description to the effect that the present disclosure is limited.

In the following description, the mutually intersecting X-axis, Y-axis, and Z-axis are used appropriately. The X-axis is an example of the "second axis." The Y-axis is an example of the "first axis." In addition, in the following, one direction along the X-axis is the X1 direction, and the direction opposite the X1 direction is the X2 direction. The X1 direction is an example of the "second direction." Similarly, the opposite directions along the Y-axis are the Y1 direction and the Y2 direction. The Y1 direction or the Y2 direction is an example of the "first direction." In addition, the opposite directions along the Z-axis are the Z1 direction and the Z2 direction. In addition, viewing in a direction along the Z-axis is sometimes called a "planar view."

Here, typically, the Z axis is the vertical axis, and the Z2 direction corresponds to the vertical downward direction. However, the Z axis does not have to be the vertical axis. Also, the X axis, Y axis, and Z axis are typically perpendicular to each other, but are not limited to this, and may intersect at an angle within the range of 80° to 100°, for example.

1. First embodiment 1-1. Overall configuration of liquid ejection device FIG. 1 is a schematic diagram showing a configuration of a liquid ejection device 100 according to a first embodiment. The liquid ejection device 100 is an inkjet printing device that ejects ink, which is an example of a liquid, as droplets onto a medium M. The medium M is typically printing paper. Note that the medium M is not limited to printing paper, and may be a printing target made of any material, such as a resin film or fabric.

As shown in FIG. 1, the liquid ejection device 100 has a liquid container 10, a control unit 20 which is an example of a "controller", a transport mechanism 30, a movement mechanism 40, and a liquid ejection head 50.

The liquid container 10 is a container that stores ink. Specific examples of the liquid container 10 include a cartridge that can be attached to and detached from the liquid ejection device 100, a bag-shaped ink pack made of a flexible film, and an ink tank that can be refilled with ink. The type of ink stored in the liquid container 10 is arbitrary.

The control unit 20 controls the operation of each element of the liquid ejection device 100. The control unit 20 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory.

The transport mechanism 30 transports the medium M in the Y2 direction under the control of the control unit 20. The movement mechanism 40 reciprocates the liquid ejection head 50 in the X1 and X2 directions under the control of the control unit 20. In the example shown in FIG. 1, the movement mechanism 40 has a roughly box-shaped carriage 41 that houses the liquid ejection head 50, and a transport belt 42 to which the carriage 41 is fixed. Note that the number of liquid ejection heads 50 mounted on the carriage 41 is not limited to one, and may be multiple. In addition to the liquid ejection head 50, the aforementioned liquid container 10 may also be mounted on the carriage 41.

Under the control of the control unit 20, the liquid ejection head 50 ejects ink supplied from the liquid container 10 from each of a number of nozzles onto the medium M in the Z2 direction. This ejection is performed in parallel with the transport of the medium M by the transport mechanism 30 and the reciprocating movement of the liquid ejection head 50 by the movement mechanism 40, so that an image is formed in ink on the surface of the medium M.

As described above, the liquid ejection device 100 includes a liquid ejection head 50 and a control unit 20, which is an example of a "control unit" that controls the operation of the liquid ejection head 50.

1-2. Overall configuration of liquid ejection head Fig. 2 is an exploded perspective view of a liquid ejection head 50 according to the first embodiment. Fig. 3 is a cross-sectional view taken along line A-A in Fig. 2. As shown in Figs. 2 and 3, the liquid ejection head 50 has a communication plate 51, a pressure chamber substrate 52, a nozzle substrate 53, a sealing plate 54, a vibration plate 55, a plurality of piezoelectric elements 56, a cover 57, a case 58, and a wiring substrate 59.

Here, a pressure chamber substrate 52, a vibration plate 55, a plurality of piezoelectric elements 56, a case 58, and a cover 57 are installed in an area located in the Z1 direction from the communication plate 51. On the other hand, a nozzle substrate 53 and a sealing plate 54 are installed in an area located in the Z2 direction from the communication plate 51. Each element of the liquid ejection head 50 is roughly a plate-shaped member that is elongated in the direction along the Y axis, and is joined to each other, for example, by an adhesive.

As shown in FIG. 2, the nozzle substrate 53 is a plate-shaped member on which a plurality of nozzles N are arranged in a direction along the Y axis. The nozzle substrate 53 is manufactured by processing a silicon single crystal substrate using a semiconductor manufacturing technique that uses a processing technique such as dry etching or wet etching. However, other known methods and materials may be used as appropriate to manufacture the nozzle substrate 53.

The communication plate 51 is a plate-like member for forming an ink flow path, and has a first surface F1 and a second surface F2 opposite to the first surface F1. In the example shown in Figures 2 and 3, the first surface F1 faces in the Z2 direction, and the second surface F2 faces in the Z1 direction. In addition to the nozzle substrate 53 described above, a sealing plate 54 is bonded to the first surface F1. Details of the first surface F1 will be explained later with reference to Figure 4. On the other hand, the pressure chamber substrate 52 and the case 58 are bonded to the second surface F2.

As shown in Figures 2 and 3, the communication plate 51 is provided with an opening R1 that opens to both the first surface F1 and the second surface F2, a plurality of second communication passages Ra, and a plurality of first communication passages Na.

The opening R1 is an elongated through hole extending in the direction along the Y axis in a plan view seen in the direction along the Z axis so as to be continuous across the multiple nozzles N. On the other hand, the second communication passage Ra and the first communication passage Na are through holes provided individually for each nozzle N. Each of the multiple second communication passages Ra communicates with the opening R1. The communication plate 51 is manufactured, for example, by processing a silicon single crystal substrate using semiconductor manufacturing technology, similar to the nozzle substrate 53 described above. However, other known methods and materials may be appropriately used to manufacture the communication plate 51. The communication plate 51 may be configured as a laminate of two or more layers. In addition, the second communication passage Ra is not limited to a through hole opening on both the first surface F1 and the second surface F2, and may be, for example, a groove provided on the second surface F2.

The pressure chamber substrate 52 is a plate-like member in which a number of pressure chambers C corresponding to a number of nozzles N are formed. Each pressure chamber C is a space called a cavity for generating pressure to eject ink from the corresponding nozzle N. The pressure chambers C are arranged in a direction along the Y axis. Each pressure chamber C is formed of a hole 52a that opens on both sides of the pressure chamber substrate 52, and is elongated extending in a direction along the X axis. The end of each pressure chamber C in the X2 direction communicates with the corresponding second communication passage Ra. On the other hand, the end of each pressure chamber C in the X1 direction communicates with the corresponding first communication passage Na. The pressure chamber substrate 52 is manufactured by processing a silicon single crystal substrate by semiconductor manufacturing technology, for example, in the same manner as the nozzle substrate 53 described above. However, other known methods and materials may be appropriately used for manufacturing each of the pressure chamber substrates 52.

A vibration plate 55 is disposed on the surface of the pressure chamber substrate 52 facing the Z1 direction. The vibration plate 55 is a plate-shaped member that can be elastically deformed. Although not shown, the vibration plate 55 has an elastic film and an insulating film, which are laminated in this order in the Z1 direction. The elastic film is made of, for example, silicon oxide (SiO ₂ ) and is formed by thermally oxidizing one surface of a silicon single crystal substrate. The insulating film is made of, for example, zirconium oxide (ZrO ₂ ) and is formed by forming a layer of zirconium by a sputtering method and thermally oxidizing the layer. Note that the vibration plate 55 is not limited to a configuration in which the elastic film and the insulating film are laminated, and may be made of, for example, a single layer or three or more layers.

On the surface of the vibration plate 55 facing the Z1 direction, multiple piezoelectric elements 56 corresponding to different nozzles N or pressure chambers C are arranged. Each piezoelectric element 56 is a passive element that deforms when a drive signal is supplied, and has an elongated shape extending in the direction along the X axis. The multiple piezoelectric elements 56 are arranged in the direction along the Y axis so as to correspond to the multiple pressure chambers C. When the vibration plate 55 vibrates in conjunction with the deformation of the piezoelectric elements 56, the pressure in the pressure chamber C fluctuates, causing ink to be ejected from the nozzle N.

Although not shown, each piezoelectric element 56 has a first electrode, a piezoelectric body, and a second electrode, which are stacked in this order in the Z1 direction. The first electrodes are individual electrodes arranged at a distance from each other for each piezoelectric element 56, and a drive signal is supplied to the first electrodes from the control unit 20. The second electrodes are strip-shaped common electrodes extending in the direction along the Y axis so as to be continuous across the plurality of piezoelectric elements 56, and a constant potential is supplied to the second electrodes, for example. Examples of metal materials for these electrodes include metal materials such as platinum (Pt), aluminum (Al), nickel (Ni), gold (Au), and copper (Cu), and among these, one type can be used alone, or two or more types can be used in combination in the form of an alloy or a laminate. The piezoelectric body is made of a piezoelectric material such as lead zirconate titanate (Pb(Zr,Ti)O ₃ ). The piezoelectric body may be provided integrally across the plurality of piezoelectric elements 56, or may be provided individually for each piezoelectric element 56.

2 and 3, the case 58 is a case for storing ink to be supplied to the multiple pressure chambers C, and is joined to the second surface F2 of the communication plate 51 with an adhesive or the like. The case 58 is made of, for example, a resin material, and is manufactured by injection molding. The case 58 is provided with a storage section R2 and an inlet IH. The storage section R2 is a recessed portion having an outer shape corresponding to the opening R1 of the communication plate 51. The inlet IH is a through hole that communicates with the storage section R2. The space formed by the opening R1 and the storage section R2 functions as a common flow path R, which is a reservoir that stores ink. Ink is supplied to the common flow path R from the liquid container 10 via the inlet IH.

The sealing plate 54 is an element for absorbing pressure fluctuations in the common flow path R. The sealing plate 54 is, for example, a compliance substrate that is an elastically deformable flexible sheet member that has the function of cushioning ink vibrations. Here, the sealing plate 54 is disposed on the first surface F1 of the communication plate 51 so as to form part of the wall surface of the common flow path R, which is a flow path formed by the opening R1 of the communication plate 51. Here, the sealing plate 54 is adhered to the first surface F1. Details of this adhesion will be explained later based on FIG. 4.

The cover 57 is a structure that protects the multiple piezoelectric elements 56 and reinforces the mechanical strength of the pressure chamber substrate 52 and the vibration plate 55. The cover 57 is bonded to the surface of the vibration plate 55, for example, with an adhesive. The cover 57 has a recess that accommodates the multiple piezoelectric elements 56.

A wiring board 59 is bonded to the surface of the pressure chamber substrate 52 or the vibration plate 55 facing the Z1 direction. The wiring board 59 is a mounting component on which multiple wiring lines are formed for electrically connecting the control unit 20 and the liquid ejection head 50. The wiring board 59 is a flexible wiring board such as an FPC (Flexible Printed Circuit) or an FFC (Flexible Flat Cable). A drive circuit 60 for driving the piezoelectric elements 56 is mounted on the wiring board 59. The drive circuit 60 selectively supplies drive signals for driving each piezoelectric element 56 to each piezoelectric element 56 via the wiring board 59.

1-3. First surface of the communication plate Fig. 4 is an enlarged plan view showing a part of the first surface F1 of the communication plate 51 in the first embodiment. In Fig. 4, the configuration near the end of the opening R1 in the Y1 direction is shown as a part of the communication plate 51 seen in the Z1 direction, and for convenience of explanation, the first surface F1 is shown with a cross-hatched adhesive region Rad, which is an area of the adhesive AD for bonding the sealing plate 54 described above.

As shown in FIG. 4, adhesive AD is applied to the first surface F1 over the adhesive region Rad. The adhesive region Rad extends along the periphery of the opening R1 and has a shape that surrounds the periphery of the opening R1. In the example shown in FIG. 4, the adhesive region Rad includes a pair of a first region Rad1, a second region Rad2, and a third region Rad3.

One of the pair of first regions Rad1 extends along the X-axis at a position further in the Y1 direction than the opening R1. On the other hand, although not shown in FIG. 4, the other of the pair of first regions Rad1 extends along the X-axis at a position further in the Y2 direction than the opening R1. Here, "extending along the X-axis" refers to extending in a direction having a directional component parallel to the X-axis, and includes extending in a direction parallel to the X-axis as well as extending in a direction inclined with respect to the X-axis.

In the example shown in FIG. 4, each first region Rad1 extends linearly in a direction parallel to the X-axis with a constant width. Note that each first region Rad1 may extend in a direction inclined with respect to the X-axis. Furthermore, the shape of the first region Rad1 is not limited to the example shown in FIG. 4, and may have, for example, a curved or bent portion, or may have two or more portions with different widths.

The second region Rad2 extends along the Y axis at a position in the X1 direction from the opening R1, and both longitudinal ends of the second region Rad2 are connected to the X1 direction ends of the pair of first regions Rad1 described above. Here, "extending along the Y axis" refers to extending in a direction having a directional component parallel to the Y axis, and includes extending in a direction inclined relative to the Y axis as well as extending in a direction parallel to the Y axis.

In the example shown in FIG. 4, the second region Rad2 extends linearly in a direction parallel to the Y axis with a constant width. The second region Rad2 may extend in a direction inclined with respect to the Y axis. The shape of the second region Rad2 is not limited to the example shown in FIG. 4, and may have, for example, a curved or bent portion, or may have two or more portions with different widths.

The third region Rad3 extends along the Y axis at a position in the X2 direction from the opening R1, and both ends of the third region Rad3 in the longitudinal direction are connected to the ends of the pair of first regions Rad1 in the X2 direction.

In the example shown in FIG. 4, the third region Rad3 has a shape that follows the outer edge of the opening R1 with a constant width. Note that the shape of the third region Rad3 is not limited to the example shown in FIG. 4, and may have, for example, two or more portions with different widths.

The width W of the above adhesive region Rad is approximately constant. The width W is not particularly limited, but is, for example, in the range of 50 μm to 100 μm, and preferably in the range of 60 μm to 80 μm. Note that the width W of the adhesive region Rad does not have to be constant, and for example, the widths of the first region Rad1, the second region Rad2, and the third region Rad3 may be different from each other. However, the width W is the width of the first region Rad1.

The first surface F1 has a plurality of first recesses 51a and a plurality of second recesses 51b.

The multiple first recesses 51a are arranged around the opening R1 so as to partially overlap the first region Rad1. Such multiple first recesses 51a function as an escape route for excess adhesive AD and increase the adhesive strength by the anchor effect of adhesive AD. In the example shown in FIG. 4, the multiple first recesses 51a are regularly arranged so as to line up in both the Y-axis direction and the X-axis direction.

More specifically, the multiple first recesses 51a are configured by lining up multiple rows of multiple first recesses 51a aligned in the direction along the X-axis in the direction along the Y-axis. Here, of the multiple rows, the first recesses 51a in two rows adjacent to each other in the direction along the Y-axis are shifted from each other in the direction along the X-axis. Therefore, even if the adhesive AD in the first region Rad1 spreads in the direction along the Y-axis, the multiple first recesses 51a function favorably as an escape route for the excess adhesive AD.

Here, when the distance between two adjacent first recesses 51a among the plurality of first recesses 51a is L and the width of the adhesive region Rad is W, the relationship L≦0.5×W is satisfied, and preferably the relationship 0.1×W≦L≦0.5×W is satisfied. As a result, even if the position of the first region Rad1 is shifted in the direction along the Y axis, the variation in the overlapping area between the first region Rad1 and the plurality of first recesses 51a can be reduced. Here, if the position of the adhesive region Rad varies due to an error or the like, even if the overlap between a certain first recess 51a and the adhesive region Rad becomes small, the overlap between another adjacent first recess 51a and the adhesive region Rad becomes large, so that the overlap between the entire plurality of first recesses 51a and the adhesive region Rad does not change much. Therefore, the first recess 51a can be suitably used as a place to escape excess adhesive AD. This prevents excess adhesive AD from flowing into the common flow path R even if the adhesive area Rad is misaligned.

On the other hand, if the distance L is too large, and the position of the adhesive area Rad varies due to an error or the like, the overlap between the adhesive area Rad and the first recesses 51a may become extremely small. As a result, the excess adhesive AD flows into the common flow path R, causing a deterioration in the ejection characteristics of the liquid ejection head 50.

Here, the width W is the width of the first region Rad1. Furthermore, the distance L is the distance between two of the multiple first recesses 51a that are adjacent to each other in the direction along the Y axis. In other words, the distance L is the distance between two of the multiple first recesses 51a that are adjacent to each other in a direction intersecting the extension direction of the first region Rad1. Therefore, even if the position of the first region Rad1 is shifted in the direction along the Y axis, the variation in the overlapping area between the first region Rad1 and the multiple first recesses 51a is suitably reduced.

The distance between two adjacent first recesses 51a in the direction along the X-axis among the multiple first recesses 51a is not particularly limited, but from the viewpoint of allowing the first recesses 51a to function favorably as an escape route for excess adhesive AD, it is preferable that the distance be smaller than the width W1x of the first recesses 51a along the X-axis.

The planar shape of each of the multiple first recesses 51a is a hexagon. In the example shown in FIG. 4, the planar shape of each of the multiple first recesses 51a is a regular hexagon, and the multiple first recesses 51a are arranged so that a pair of sides are parallel to the X-axis. Therefore, the width W1y along the Y-axis of each of the multiple first recesses 51a is shorter than the width W1x along the X-axis of each of the multiple first recesses 51a. In addition, the width W1y along the Y-axis of each of the multiple first recesses 51a is smaller than the width W along the Y-axis of the first region Rad1. This allows the adhesive strength between the communication plate 51 and the sealing plate 54 to be increased by the anchor effect of the first recesses 51a.

The second recesses 51b are arranged so as to partially overlap the second region Rad2 around the opening R1. The second recesses 51b function as an escape route for excess adhesive AD, similar to the first recesses 51a described above, and increase the adhesive strength by the anchor effect of adhesive AD. In the example shown in FIG. 4, the second recesses 51b are arranged at equal intervals in the direction along the Y axis.

Here, the distance between two adjacent second recesses 51b among the multiple second recesses 51b is not particularly limited, but from the viewpoint of allowing the second recesses 51b to function favorably as an escape route for excess adhesive AD, it is preferable that the distance be smaller than the width W2y of the second recesses 51b along the Y axis.

The planar shape of each of the multiple second recesses 51b is a parallelogram. In the example shown in FIG. 4, each of the multiple second recesses 51b is arranged so that a pair of sides is parallel to the X-axis. Furthermore, the width W2y of each of the multiple second recesses 51b along the Y-axis is shorter than the width W2x of each of the multiple second recesses 51b along the X-axis. Furthermore, the width W2x of each of the multiple second recesses 51b along the X-axis is smaller than the width of the second region Rad2 along the X-axis. This makes it possible to suitably reduce the variation in the overlapping area between the second region Rad2 and the multiple second recesses 51b even if the position of the second region Rad2 is shifted in the direction along the X-axis.

The wall surfaces of the first recess 51a and the second recess 51b are preferably made of crystal planes of single crystal silicon. For example, when the communication plate 51 is formed using a silicon single crystal substrate of the (110) plane, the first recess 51a and the second recess 51b can be formed by anisotropic etching. In this case, the wall surfaces of the first recess 51a and the second recess 51b can be made of the (111) plane of single crystal silicon. By making the wall surfaces of the first recess 51a and the second recess 51b in this way, it is possible to form the first recess 51a and the second recess 51b with high dimensional accuracy. In addition, when these recesses are formed by anisotropic etching as described above, the depth of the recess can be made smaller than the width. Therefore, these recesses can function favorably as escape routes for the adhesive AD.

Here, the depth of the first recess 51a and the second recess 51b is preferably equal to or greater than the thickness T of the adhesive AD in order to prevent overflow of the adhesive AD as much as possible. FIG. 5 is a plan view for explaining the depth of the second recess 51b, which is a recess formed by anisotropic etching. FIG. 6 is a cross-sectional view of line B-B in FIG. 5. Here, the second recess 51b is explained, but the same applies to the first recess 51a. In this embodiment, a single crystal silicon substrate is used as the communication plate 51, and the first recess 51a and the second recess 51b are formed by anisotropic etching. Therefore, as described above, the wall surfaces of the first recess 51a and the second recess 51b are composed of the (111) plane. At this time, the crystal plane distance Wc is as shown in FIG. 5. On the other hand, the angle between the (111) plane, which is the wall surface of the first recess 51a and the second recess 51b, and the (110) plane, which is the XY plane, is 35.264° as shown in FIG. 6. Therefore, the depth of each of the first recess 51a and the second recess 51b is (Wc/2) × tan (35.264). Therefore, in order for the depth of each of the first recess 51a and the second recess 51b to be equal to or greater than the thickness T of the adhesive AD, (Wc/2) × tan (35.264) ≧ T must be satisfied.

The method of forming the first recess 51a and the second recess 51b is not limited to the method using anisotropic etching as described above, but may be any method. However, it is preferable that the depth of these recesses is smaller than the width of the recesses from the viewpoint of allowing them to function effectively as an escape route for excess adhesive AD.

As described above, the liquid ejection head 50 has a nozzle substrate 53, a pressure chamber substrate 52, a communication plate 51, and a sealing plate 54. The nozzle substrate 53 is provided with a plurality of nozzles N that eject ink, which is an example of a "liquid". The pressure chamber substrate 52 is provided with a pressure chamber C that generates pressure for ejecting ink from each of the nozzles N of the plurality of nozzles N. The communication plate 51 has a first surface F1 that is bonded to the nozzle substrate 53, and a second surface F2 that is the surface opposite to the first surface F1 and is bonded to the pressure chamber substrate 52. The communication plate 51 is provided with a first communication passage Na that communicates with each of the nozzles N and one end of the pressure chamber C, a second communication passage Ra that communicates with the other end of the pressure chamber C, and an opening R1 that communicates with the second communication passage Ra, for each of the nozzles N of the plurality of nozzles N. The sealing plate 54 is bonded to the first surface F1 with an adhesive AD, and forms a part of the wall surface of the flow path by the opening R1.

Here, the adhesive AD is applied to the first surface F1 over an adhesive region Rad that extends along the periphery of the opening R1. The first surface F1 has a plurality of first recesses 51a arranged around the periphery of the opening R1. When the distance between two adjacent first recesses 51a among the plurality of first recesses 51a is L and the width of the adhesive region Rad is W, the relationship L≦0.5×W is satisfied.

In the above liquid ejection head 50, the distance L and width W satisfy the relationship L≦0.5×W, so even if the positional relationship between the adhesive region Rad and the communicating plate 51 varies due to manufacturing errors, etc., the variation in the overlapping area between the adhesive region Rad and the multiple first recesses 51a can be reduced. Therefore, the first recesses 51a can function favorably as an escape route for excess adhesive AD. As a result, the communicating plate 51 and the sealing plate 54 can be favorably bonded to each other, and the flow of adhesive AD into the flow path of the communicating plate 51 can be favorably suppressed. As a result, the deterioration of the ejection characteristics of the liquid ejection head 50 due to the flow of adhesive AD into the flow path of the communicating plate 51 can be suppressed.

In this embodiment, as described above, the nozzles N are arranged along the Y axis, which is an example of a "first axis." The pressure chamber C extends along the X axis, which is an example of a "second axis" intersecting the Y axis. The adhesive region Rad includes a first region Rad1 and a second region Rad2. The first region Rad1 extends along the X axis at a position in the Y1 direction or Y2 direction, which is an example of a "first direction" along the Y axis, further from the opening R1. The second region Rad2 extends along the Y axis at a position in the X1 direction, which is an example of a "second direction" along the X axis, further from the opening R1. The first recesses 51a partially overlap the first region Rad1. In addition to the first recesses 51a, the first surface F1 has a plurality of second recesses 51b that partially overlap the second region Rad2.

Here, the first recess 51a functions as an escape route for excess adhesive AD in the first region Rad1. This makes it possible to prevent adhesive AD from flowing into the flow paths corresponding to the nozzles N at both ends in the arrangement direction among the multiple nozzles N. On the other hand, the second recess 51b functions as an escape route for excess adhesive AD in the second region Rad2. This makes it possible to prevent adhesive AD from flowing into the flow paths corresponding to each of the multiple nozzles N.

As described above, each of the first recesses 51a has a hexagonal shape in plan view. Therefore, the first recesses 51a can be formed with a desired width and depth with high precision by anisotropic etching of the silicon single crystal substrate.

Furthermore, as described above, the multiple first recesses 51a are arranged so as to be aligned in both the direction along the Y axis and the direction along the X axis. Therefore, by lining up the multiple first recesses 51a in the direction along the Y axis, even if the position of the first region Rad1 shifts in the direction along the Y axis, the first recesses 51a can function favorably as an escape route for the excess adhesive AD in the first region Rad1. Furthermore, by lining up the multiple first recesses 51a in the direction along the X axis, the first recesses 51a can function favorably as an escape route for the excess adhesive AD over a wide range of the first region Rad1.

As described above, the width W1y along the Y axis of each of the multiple first recesses 51a is smaller than the width W of the first region Rad1 along the Y axis. Therefore, compared to a configuration in which the width W1y of the first recesses 51a is larger than the width W of the first region Rad1, the adhesive strength between the communication plate 51 and the sealing plate 54 can be increased due to the anchor effect of the first recesses 51a.

Furthermore, as mentioned above, the sealing plate 54 has the function of cushioning the vibration of the ink. Since such a sealing plate 54 is extremely thin compared to the communication plate 51, it is difficult to provide a recess that can function as an escape route for the adhesive AD. For this reason, it is necessary to provide multiple recesses on the first surface F1 of the communication plate 51.

2. Second embodiment Hereinafter, a second embodiment of the present disclosure will be described. In the following exemplary embodiments, for elements whose actions or functions are similar to those of the first embodiment, the reference numerals used in the description of the first embodiment will be used, and detailed descriptions of each will be omitted as appropriate.

Figure 7 is an enlarged plan view showing a portion of the first surface F1 of the communication plate 51A in the second embodiment. The second embodiment is similar to the first embodiment described above, except that the communication plate 51A is used instead of the communication plate 51. The communication plate 51A is configured similarly to the communication plate 51 in the first embodiment, except that it has a plurality of first recesses 51c instead of the plurality of first recesses 51a, and a plurality of third recesses 51d is added. That is, the first surface F1 in this embodiment has a plurality of first recesses 51c, a plurality of second recesses 51b, and a plurality of third recesses 51d.

As shown in FIG. 7, the multiple first recesses 51c are similar to the multiple first recesses 51a in the first embodiment, except for their different arrangement. The multiple first recesses 51c are configured by lining up multiple rows of multiple first recesses 51c aligned in the direction along the Y axis in the direction along the X axis. Here, among the multiple rows, the first recesses 51c in two rows adjacent to each other in the direction along the X axis are shifted from each other in the direction along the Y axis. This makes it possible to suitably reduce the variation in the overlapping area between the first region Rad1 and the multiple first recesses 51c.

Here, as in the first embodiment, when the distance between two adjacent first recesses 51c among the multiple first recesses 51c is L and the width of the adhesive region Rad is W, the relationship L≦0.5×W is satisfied. As a result, even if the position of the first region Rad1 is shifted in the direction along the Y axis, the variation in the overlapping area between the first region Rad1 and the multiple first recesses 51c can be reduced. Therefore, the first recesses 51c can function favorably as an escape route for excess adhesive AD.

The multiple third recesses 51d are arranged so as to partially overlap the third region Rad3 around the opening R1. Similar to the multiple first recesses 51c described above, the multiple third recesses 51d function as an escape route for excess adhesive AD and increase the adhesive strength by the anchor effect of adhesive AD. In the example shown in FIG. 7, the multiple third recesses 51d are arranged at equal intervals along the longitudinal direction of the third region Rad3 and in the width direction of the third region Rad3.

Here, the distance between two adjacent third recesses 51d among the multiple third recesses 51d is not particularly limited, but from the viewpoint of allowing the third recesses 51d to function favorably as an escape route for excess adhesive AD, it is preferable that the distance be smaller than the width of the third recesses 51d along the Y axis.

The planar shape of each of the multiple third recesses 51d is a parallelogram. In the example shown in FIG. 7, each of the multiple third recesses 51d is arranged so that a pair of sides is parallel to the X-axis. Furthermore, the width of each of the multiple third recesses 51d along the Y-axis is shorter than the width of each of the multiple third recesses 51d along the X-axis. In other words, the width of each of the multiple third recesses 51d along the X-axis is smaller than the width of the third region Rad3 along the X-axis. This makes it possible to suitably reduce the variation in the overlapping area between the third region Rad3 and the multiple third recesses 51d even if the position of the third region Rad3 shifts in the direction along the X-axis.

As with the first embodiment described above, the second embodiment also effectively bonds the communication plate 51A and the sealing plate 54 to each other and effectively prevents the adhesive AD from flowing into the flow path of the communication plate 51A.

3. Third embodiment Hereinafter, a third embodiment of the present disclosure will be described. In the following exemplary embodiments, for elements whose actions or functions are similar to those of the first embodiment, the reference numerals used in the description of the first embodiment will be used, and detailed descriptions of each will be omitted as appropriate.

Figure 8 is an enlarged plan view showing a portion of the first surface F1 of the communication plate 51B in the third embodiment. The third embodiment is similar to the first embodiment described above, except that the communication plate 51B is used instead of the communication plate 51. The communication plate 51B is configured similarly to the communication plate 51 in the first embodiment, except that it has a plurality of first recesses 51e instead of the plurality of first recesses 51a, and a plurality of third recesses 51d is added. That is, the first surface F1 in this embodiment has a plurality of first recesses 51e, a plurality of second recesses 51b, and a plurality of third recesses 51d.

As shown in FIG. 8, the first recesses 51e are similar to the first recesses 51a of the first embodiment, except that the planar shapes are different. The planar shapes of the first recesses 51e are parallelograms. In the example shown in FIG. 8, the planar shapes of the first recesses 51e are parallelograms, and the first recesses 51e are arranged so that a pair of sides are parallel to the X-axis. Here, the width W1y of each of the first recesses 51e along the Y-axis is shorter than the width W1x of each of the first recesses 51e along the X-axis. Also, the width W1y of each of the first recesses 51e along the Y-axis is greater than the width W of the first region Rad1 along the Y-axis. This makes it possible to suitably reduce the variation in the overlapping area between the first region Rad1 and the first recesses 51a, even if the position of the first region Rad1 is shifted in the direction along the Y-axis.

As with the first embodiment described above, the third embodiment also effectively bonds the communication plate 51B and the sealing plate 54 to each other and effectively prevents the adhesive AD from flowing into the flow path of the communication plate 51B.

In this embodiment, as described above, the planar shape of each of the multiple first recesses 51e is a parallelogram. Therefore, the first recesses 51e of the desired width and depth can be formed with high precision by anisotropic etching of the silicon single crystal substrate.

As described above, the width W1y along the Y axis of each of the multiple first recesses 51e is greater than the width W along the Y axis of the first region Rad1. Therefore, the variation in the overlapping area between the first region Rad1 and the first recesses 51e can be reduced compared to a configuration in which the width W1y of the first recesses 51e is smaller than the width W of the first region Rad1.

4. Fourth embodiment Hereinafter, a fourth embodiment of the present disclosure will be described. In the following exemplary embodiments, for elements whose actions or functions are similar to those of the first embodiment, the reference numerals used in the description of the first embodiment will be used, and detailed descriptions of each will be omitted as appropriate.

Figure 9 is an enlarged plan view showing a portion of the first surface of the communication plate 51C in the fourth embodiment. The fourth embodiment is similar to the first embodiment described above, except that the communication plate 51C is used instead of the communication plate 51. The communication plate 51C is configured similarly to the communication plate 51 in the first embodiment, except that it has a plurality of first recesses 51f instead of the plurality of first recesses 51a, and a plurality of third recesses 51d is added. That is, the first surface F1 in this embodiment has a plurality of first recesses 51f, a plurality of second recesses 51b, and a plurality of third recesses 51d.

As shown in FIG. 9, the multiple first recesses 51f are similar to the multiple first recesses 51a of the first embodiment, except that the planar shape is different. The planar shape of each of the multiple first recesses 51f is a parallelogram, similar to the first recess 51e of the third embodiment. However, the width W1y along the Y axis of each of the multiple first recesses 51f is smaller than the width W along the Y axis of the first region Rad1. As a result, the adhesive strength between the communication plate 51C and the sealing plate 54 can be increased due to the anchor effect of the first recesses 51f, compared to the third embodiment.

As with the first embodiment described above, the fourth embodiment also makes it possible to effectively bond the communication plate 51C and the sealing plate 54 to each other and effectively prevent the adhesive AD from flowing into the flow path of the communication plate 51C.

5. Modifications Each of the above examples may be modified in various ways. Specific modifications that may be applied to each of the above examples are illustrated below. Note that two or more of the following examples may be combined as appropriate within the scope of not being inconsistent with each other.

5-1. Modification 1
In each of the above-mentioned embodiments, the arrangement of the first recesses 51a, the first recesses 51c, the first recesses 51e, and the first recesses 51f is regular, but the arrangement of the recesses may be random. The planar areas of the first recesses are not limited to the same planar areas, and the planar areas of the first recesses may be different from each other. The planar shapes of the recesses are not limited to hexagons and parallelograms, and may be arbitrary. The number of the first recesses is also not limited to the above-mentioned embodiments, and may be arbitrary.

5-2. Modification 2
In each of the above-mentioned embodiments, a serial type liquid ejection device 100 is exemplified in which a carriage 41 carrying a liquid ejection head 50 is moved back and forth, but the present disclosure can also be applied to a line type liquid ejection device in which multiple nozzles N are distributed across the entire width of the medium M.

5-3. Modification 3
The liquid ejection device 100 exemplified in each of the above-mentioned embodiments can be adopted in various devices such as facsimile machines and copy machines, in addition to devices dedicated to printing. However, the use of the liquid ejection device of the present disclosure is not limited to printing. For example, a liquid ejection device that ejects a solution of a coloring material is used as a manufacturing device that forms a color filter of a liquid crystal display device. Also, a liquid ejection device that ejects a solution of a conductive material is used as a manufacturing device that forms wiring and electrodes of a wiring board.

10...liquid container, 20...control unit (control section), 30...transport mechanism, 40...movement mechanism, 41...carriage, 42...transport belt, 50...liquid ejection head, 51...communicating plate, 51A...communicating plate, 51B...communicating plate, 51C...communicating plate, 51a...first recess, 51b...second recess, 51c...first recess, 51d...third recess, 51e...first recess, 51f...first recess, 52...pressure chamber substrate, 52a...hole, 53...nozzle substrate, 54...sealing plate, 55...vibration plate, 56...piezoelectric element , 57...cover, 58...case, 59...wiring board, 60...drive circuit, 100...liquid ejection device, AD...adhesive, C...pressure chamber, F1...first surface, F2...second surface, IH...inlet, L...distance, M...medium, N...nozzle, Na...first communication passage, R...common flow path, R1...opening, R2...container, Ra...second communication passage, Rad...adhesive region, Rad1...first region, Rad2...second region, Rad3...third region, W...width, W1x...width, W1y...width, W2x...width, W2y...width.

Claims (9)

a nozzle substrate provided with a plurality of nozzles for ejecting liquid;
a pressure chamber substrate in which a pressure chamber is provided for each of the plurality of nozzles, the pressure chamber generating a pressure for ejecting liquid from the nozzle;
a communication plate having a first surface bonded to the nozzle substrate and a second surface opposite to the first surface bonded to the pressure chamber substrate, the communication plate being provided with a first communication passage communicating with each of the nozzles and one end of the pressure chamber, a second communication passage communicating with the other end of the pressure chamber, and an opening communicating with the second communication passage, for each of the plurality of nozzles;
a sealing plate that is bonded to the first surface by an adhesive and that constitutes a part of a wall surface of the flow path defined by the opening,
The adhesive is applied to the first surface over a bonding area extending along a perimeter of the opening;
the first surface has a plurality of first recesses disposed around the opening;
A distance between two adjacent first recesses among the plurality of first recesses is L,
When the width of the adhesive region is W,
The relationship L≦0.5×W is satisfied.
A liquid ejection head comprising: The plurality of nozzles are arranged along a first axis;
The pressure chamber extends along a second axis that intersects with the first axis,
The adhesive region is
a first region extending along the second axis at a position in a first direction along the first axis relative to the opening;
a second region extending along the first axis at a position in a second direction along the second axis relative to the opening,
the first recesses partially overlap the first region;
the first surface has a plurality of second recesses partially overlapping the second region;
2. The liquid ejection head according to claim 1, The planar shape of each of the plurality of first recesses is a parallelogram.
3. The liquid ejection head according to claim 2. The planar shape of each of the plurality of first recesses is a hexagon.
3. The liquid ejection head according to claim 2. The plurality of first recesses are arranged to be aligned in a direction along the first axis and in a direction along the second axis.
3. The liquid ejection head according to claim 2. a width of each of the plurality of first recesses along the first axis is smaller than a width of the first region along the first axis;
3. The liquid ejection head according to claim 2. a width of each of the plurality of first recesses along the first axis is greater than a width of the first region along the first axis;
3. The liquid ejection head according to claim 2. The sealing plate has a function of cushioning vibration of the liquid.
2. The liquid ejection head according to claim 1. A liquid ejection head according to any one of claims 1 to 8,
A control unit for controlling the operation of the liquid ejection head.
A liquid ejection device comprising:

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