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JP2024018046A - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
JP2024018046A
JP2024018046A JP2022121091A JP2022121091A JP2024018046A JP 2024018046 A JP2024018046 A JP 2024018046A JP 2022121091 A JP2022121091 A JP 2022121091A JP 2022121091 A JP2022121091 A JP 2022121091A JP 2024018046 A JP2024018046 A JP 2024018046A
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JP
Japan
Prior art keywords
circuit board
conductive connection
control device
electronic control
connection part
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JP2022121091A
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Japanese (ja)
Inventor
勲 方田
Isao Hoda
彩 大前
Aya Omae
博史 篠田
Hiroshi Shinoda
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Hitachi Astemo Ltd
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Hitachi Astemo Ltd
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Priority to JP2022121091A priority Critical patent/JP2024018046A/en
Priority to PCT/JP2023/015139 priority patent/WO2024024184A1/en
Publication of JP2024018046A publication Critical patent/JP2024018046A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Inverter Devices (AREA)

Abstract

To provide an electronic control device which can improve electromagnetic compatibility while preventing unnecessary expansion of a conductive connection part on the surface of a circuit board.SOLUTION: An electronic control device has a circuit board 110, a resin base part 120, a metallic cover, a conductive connection part 140, and a fluidization prevention part 150. The circuit board 110 has an object wiring 111 as an object of noise reduction, an electronic component 112 mounted on the vicinity of the object wiring 111, a signal ground 114 connected to the electronic component 112, and a housing ground 113 which is connected to the signal ground 114 through the electronic component 112 and is connected to the cover through the conductive connection part 140. The fluidization prevention part 150 has a communication passage 151 between the conductive connection part 140 and the electronic component 112. The housing ground 113 has a first connection part 113a connected to the conductive connection part 140, a second connection part 113b connected to the electronic component 112, and a communication part 113c which passes through the communication passage 151 and connects the first connection part 113a and the second connection part 113b.SELECTED DRAWING: Figure 2

Description

本開示は、電子制御装置に関する。 The present disclosure relates to an electronic control device.

従来から電子制御装置が知られている。たとえば、下記特許文献1に記載された電子制御装置は、樹脂製の基台と、電子部品が搭載された回路基板と、その回路基板を覆う金属カバーと、その金属カバーと回路基板の接地回路とを導電接続する導電性接続部と、を備えている。この電子制御装置は、上記回路基板は上記基台と上記金属カバーとの間に挟持され、上記導電性接続部と上記電子部品との間に凸状部材が配置され、上記導電性接続部と上記凸状部材とが当接されたことを特徴としている(特許文献1、第0011段落、請求項1)。 Electronic control devices have been known for a long time. For example, the electronic control device described in Patent Document 1 below includes a resin base, a circuit board on which electronic components are mounted, a metal cover that covers the circuit board, and a grounding circuit between the metal cover and the circuit board. and a conductive connection portion that conductively connects the. In this electronic control device, the circuit board is sandwiched between the base and the metal cover, a convex member is arranged between the conductive connection part and the electronic component, and the circuit board is sandwiched between the conductive connection part and the electronic component. It is characterized in that the convex member is in contact with the above-mentioned convex member (Patent Document 1, paragraph 0011, claim 1).

この従来の電子制御装置によれば、導電性材料を回路基板上の所定の位置に設置する際、その回路基板面での不要な広がりを防止できる。したがって、回路基板上の部品禁止帯を小さく設定した場合でも、導電性材料の回路基板上での電子部品や配線パターンとの接触を防止でき、回路の破損を防止することができる(特許文献1、第0012段落)。 According to this conventional electronic control device, when installing a conductive material at a predetermined position on a circuit board, it is possible to prevent unnecessary spreading of the conductive material on the circuit board surface. Therefore, even if the prohibited component zone on the circuit board is set small, it is possible to prevent the conductive material from coming into contact with electronic components or wiring patterns on the circuit board, and damage to the circuit can be prevented (Patent Document 1 , paragraph 0012).

国際公開第2022/059263号International Publication No. 2022/059263

上記のような電子制御装置においては、エミッション(EMI)の抑制とイミュニティ(EMS)の向上、すなわち、電磁両立性(EMC)のさらなる向上が求められている。しかしながら、上記従来の電子制御装置は、前述のように、導電性接続部と電子部品との間に凸状部材が配置されることで、導電性材料の回路基板面での不要な広がりを防止できる反面、凸状部材がEMC向上の障害となるおそれがある。 In electronic control devices such as those described above, suppression of emissions (EMI) and improvement of immunity (EMS), that is, further improvement of electromagnetic compatibility (EMC) are required. However, as mentioned above, in the conventional electronic control device, a convex member is placed between the conductive connection part and the electronic component to prevent unnecessary spread of the conductive material on the circuit board surface. However, the convex member may become an obstacle to improving EMC.

本開示は、導電性接続部が回路基板の表面で不要に広がることを防止しつつ、EMCを向上させることが可能な電子制御装置を提供する。 The present disclosure provides an electronic control device that can improve EMC while preventing conductive connections from spreading unnecessarily on the surface of a circuit board.

本開示の一態様は、回路基板と、該回路基板を支持する樹脂製のベース部と、該ベース部に支持された前記回路基板を覆う金属製のカバーと、該カバーを前記回路基板に接続する導電性接続部と、該導電性接続部の広がりを防止する流動防止部と、を有する電子制御装置であって、前記回路基板は、ノイズ低減の対象となる対象配線と、該対象配線の近傍に実装される電子部品と、該電子部品に接続される信号グランドと、前記電子部品を介して前記信号グランドに接続されるとともに前記導電性接続部を介して前記カバーに接続される筐体グランドと、を有し、前記流動防止部は、前記導電性接続部と前記電子部品との間に連絡通路を有し、前記筐体グランドは、前記導電性接続部に接続される第1接続部と、前記電子部品に接続される第2接続部と、前記流動防止部の前記連絡通路を通り前記第1接続部と前記第2接続部とを接続する連絡部と、を有することを特徴とする電子制御装置である。 One aspect of the present disclosure includes a circuit board, a resin base portion supporting the circuit board, a metal cover covering the circuit board supported by the base portion, and connecting the cover to the circuit board. An electronic control device having a conductive connecting portion that prevents the conductive connecting portion from spreading, and a flow prevention portion that prevents the conductive connecting portion from spreading, the circuit board comprising a target wiring that is a target for noise reduction, and a flow prevention unit that prevents the conductive connecting portion from spreading. An electronic component mounted nearby, a signal ground connected to the electronic component, and a casing connected to the signal ground via the electronic component and to the cover via the conductive connection part. a ground, the flow prevention part has a communication path between the conductive connection part and the electronic component, and the case ground has a first connection connected to the conductive connection part. a second connection part connected to the electronic component; and a communication part passing through the communication passage of the flow prevention part and connecting the first connection part and the second connection part. This is an electronic control device.

本開示の上記一態様によれば、導電性接続部が回路基板の表面で不要に広がることを防止しつつ、EMCを向上させることが可能な電子制御装置を提供することができる。 According to the above aspect of the present disclosure, it is possible to provide an electronic control device that can improve EMC while preventing the conductive connection portion from spreading unnecessarily on the surface of the circuit board.

本開示に係る電子制御装置の一実施形態を示す分解斜視図。FIG. 1 is an exploded perspective view showing an embodiment of an electronic control device according to the present disclosure. 図1の電子制御装置のベース部と回路基板の周縁部の模式的な拡大平面図。FIG. 2 is a schematic enlarged plan view of a base portion and a peripheral portion of a circuit board of the electronic control device shown in FIG. 1; 図2のIII-III線に沿う電子制御装置の模式的な拡大断面図。FIG. 3 is a schematic enlarged sectional view of the electronic control device taken along line III-III in FIG. 2; 図2のIV-IV線に沿う電子制御装置の模式的な拡大断面図。FIG. 3 is a schematic enlarged cross-sectional view of the electronic control device taken along line IV-IV in FIG. 2; 図2の電子制御装置の変形例を示す模式的な拡大平面図。FIG. 3 is a schematic enlarged plan view showing a modification of the electronic control device shown in FIG. 2; 図2の電子制御装置の変形例を示す模式的な拡大平面図。FIG. 3 is a schematic enlarged plan view showing a modification of the electronic control device shown in FIG. 2;

以下、図面を参照して本開示に係る電子制御装置の実施形態を説明する。 Hereinafter, embodiments of an electronic control device according to the present disclosure will be described with reference to the drawings.

図1は、本開示に係る電子制御装置の一実施形態を示す分解斜視図である。図2は、図1の電子制御装置100のベース部120と回路基板110の周縁部の模式的な拡大平面図である。図3は、図2のIII-III線に沿う電子制御装置100の模式的な拡大断面図である。図4は、図2のIV-IV線に沿う電子制御装置100の模式的な拡大断面図である。 FIG. 1 is an exploded perspective view showing an embodiment of an electronic control device according to the present disclosure. FIG. 2 is a schematic enlarged plan view of the base portion 120 and the peripheral portion of the circuit board 110 of the electronic control device 100 of FIG. FIG. 3 is a schematic enlarged sectional view of the electronic control device 100 taken along line III-III in FIG. FIG. 4 is a schematic enlarged sectional view of the electronic control device 100 taken along line IV-IV in FIG.

本実施形態の電子制御装置100は、たとえば、車両に搭載され、車両のエンジンや、変速機などに用いられる各種のアクチュエータを制御する。電子制御装置100は、たとえば、車両全体の軽量化を目的として、部品の樹脂化を含む軽量化が進められるとともに、エンジン本体や変速機に直接的に固定され、接続ケーブルの短縮化が図られている。 The electronic control device 100 of this embodiment is mounted on a vehicle, for example, and controls various actuators used in the vehicle's engine, transmission, and the like. For example, the electronic control device 100 is being made lighter by using plastic parts for the purpose of reducing the weight of the entire vehicle, and is also being directly fixed to the engine body or the transmission to shorten the length of connection cables. ing.

電子制御装置100は、たとえば、回路基板110と、樹脂製のベース部120と、金属製のカバー130と、導電性接続部140と、流動防止部150と、を有している。また、電子制御装置100は、たとえば、シール部材160と、コネクタ170と、を有している。 The electronic control device 100 includes, for example, a circuit board 110, a base portion 120 made of resin, a cover 130 made of metal, a conductive connection portion 140, and a flow prevention portion 150. Further, the electronic control device 100 includes, for example, a seal member 160 and a connector 170.

回路基板110は、たとえば、図2に示すように、ノイズ低減の対象となる対象配線111と、その対象配線111の近傍に実装される電子部品112と、を有する多層基板である。また、回路基板110は、たとえば、図2および図3に示すように、回路基板110の周縁部に回路基板110の端縁に沿って設けられた筐体グランド113と、その筐体グランド113よりも回路基板110の内側に設けられた信号グランド114と、を有している。さらに、回路基板110は、たとえば、複数の開口部115と、複数の貫通ビア116と、を有している。 For example, as shown in FIG. 2, the circuit board 110 is a multilayer board that includes a target wiring 111 to be subjected to noise reduction and an electronic component 112 mounted near the target wiring 111. Further, as shown in FIGS. 2 and 3, for example, the circuit board 110 has a case ground 113 provided along the edge of the circuit board 110 at the periphery of the circuit board 110, and It also has a signal ground 114 provided inside the circuit board 110. Further, the circuit board 110 includes, for example, a plurality of openings 115 and a plurality of through vias 116.

対象配線111は、たとえば、回路基板110の第1層目に配置されたクロック配線、電源配線、または信号配線であり、回路基板110の第2層目に配置された信号グランド114と対を成しており、クロック、電源、または信号を伝送する。電子部品112は、たとえば、コンデンサなどの回路素子であり、対象配線111に可能な限り近い位置に配置されている。また、電子部品112は、たとえば、対象配線111と導電性接続部140との間の位置に配置されている。 The target wiring 111 is, for example, a clock wiring, a power supply wiring, or a signal wiring placed on the first layer of the circuit board 110, and forms a pair with the signal ground 114 placed on the second layer of the circuit board 110. transmit clocks, power, or signals. The electronic component 112 is, for example, a circuit element such as a capacitor, and is placed as close as possible to the target wiring 111. Moreover, the electronic component 112 is arranged, for example, at a position between the target wiring 111 and the conductive connection part 140.

筐体グランド113は、たとえば、図3に示すように、多層基板である回路基板110の複数の層に設けられ、各層に設けられた筐体グランド113が複数の貫通ビア116によって互いに接続されている。同様に、信号グランド114は、たとえば、回路基板110の複数の層に設けられ、各層に設けられた信号グランド114が複数の貫通ビア116によって互いに接続されるとともに、回路基板110に設けられた図示を省略する個々の回路に接続されている。また、信号グランド114は、たとえば、電子部品112に接続され、筐体グランド113は、たとえば、電子部品112を介して信号グランド114に接続されるとともに、導電性接続部140を介してカバー130に接続されている。 For example, as shown in FIG. 3, the case ground 113 is provided in multiple layers of the circuit board 110, which is a multilayer board, and the case grounds 113 provided in each layer are connected to each other by a plurality of through vias 116. There is. Similarly, the signal ground 114 is provided, for example, in multiple layers of the circuit board 110, and the signal grounds 114 provided in each layer are connected to each other by a plurality of through vias 116. Connected to individual circuits to omit. Further, the signal ground 114 is connected to the electronic component 112, for example, and the housing ground 113 is connected to the signal ground 114 via the electronic component 112, and to the cover 130 via the conductive connection part 140. It is connected.

開口部115は、たとえば、回路基板110を貫通する貫通孔によって導電性接続部140と電子部品112との間に形成され、後述する流動防止部150を貫通させる。貫通ビア116は、たとえば、図2および図3に示すように、回路基板110の各々の層に設けられた筐体グランド113、信号グランド114などを電気的に接続している。このような貫通ビア116を設けることで、導電性接続部140から回路基板110の第2層目の信号グランド114に至る経路が短縮される。 The opening 115 is formed between the conductive connection part 140 and the electronic component 112 by, for example, a through hole penetrating the circuit board 110, and penetrates a flow prevention part 150, which will be described later. The through via 116 electrically connects the case ground 113, the signal ground 114, etc. provided in each layer of the circuit board 110, for example, as shown in FIGS. 2 and 3. By providing such a through via 116, the path from the conductive connection portion 140 to the signal ground 114 in the second layer of the circuit board 110 is shortened.

ベース部120は、たとえば、図1に示すように、樹脂の成形品であり、上部と前部が開放された凹形状を有し、回路基板110を収容する筐体の一部を構成する。ベース部120は、回路基板110の下面を覆うとともに、回路基板110の下面および周縁を支持する。また、ベース部120は、たとえば、幅方向の両側に複数の脚部121を有している。各々の脚部121は、たとえば、ボルトによってエンジン本体や変速機などに取り付けられる。 For example, as shown in FIG. 1, the base portion 120 is a resin molded product, has a concave shape with an open top and front, and constitutes a part of a casing that accommodates the circuit board 110. The base portion 120 covers the lower surface of the circuit board 110 and supports the lower surface and peripheral edge of the circuit board 110. Further, the base portion 120 has, for example, a plurality of leg portions 121 on both sides in the width direction. Each leg 121 is attached to the engine body, transmission, etc., for example, with bolts.

カバー130は、たとえば、図1に示すように、凹凸を有する金属製の矩形板状の部材であり、ベース部120とともに回路基板110を収容する筐体の一部を構成する。カバー130は、たとえば、ベース部120の角部に設けられた固定用のピン122をカバー130の角部に設けられた貫通孔131に挿通させ、ピン122の先端を加熱して拡径させることによってベース部120に固定され、回路基板110の上面を覆う。 For example, as shown in FIG. 1, the cover 130 is a metal rectangular plate-like member having unevenness, and forms part of a casing that houses the circuit board 110 together with the base portion 120. For example, the cover 130 can be made by inserting a fixing pin 122 provided at a corner of the base portion 120 into a through hole 131 provided at a corner of the cover 130, and heating the tip of the pin 122 to enlarge the diameter. It is fixed to the base part 120 by a screwdriver, and covers the upper surface of the circuit board 110.

導電性接続部140は、たとえば、回路基板110の筐体グランド113とカバー130とを接続する導電性を有する部材である。導電性接続部140は、たとえば、導電性接着剤または導電性グリスであり、少なくとも電子制御装置100の組み立て時に流動性を有している。より具体的には、ベース部120に支持された回路基板110の上に導電性接続部140を配置した状態でベース部120にカバー130を取り付けると、回路基板110とカバー130との間で圧縮された導電性接続部140が回路基板110の上で流動して広がる。 The conductive connection portion 140 is, for example, a conductive member that connects the case ground 113 of the circuit board 110 and the cover 130. The conductive connection portion 140 is, for example, a conductive adhesive or conductive grease, and has fluidity at least when the electronic control device 100 is assembled. More specifically, when the cover 130 is attached to the base part 120 with the conductive connection part 140 disposed on the circuit board 110 supported by the base part 120, compression occurs between the circuit board 110 and the cover 130. The conductive connection portion 140 flows and spreads on the circuit board 110.

流動防止部150は、上記のような導電性接続部140の広がりを防止する。より具体的には、流動防止部150は、対象配線111に対向する導電性接続部140の側面に隣接して設けられ、導電性接続部140の対象配線111へ向かう方向への流動を防止する。図1に示す例において、流動防止部150は、ベース部120に設けられた凸部であり、回路基板110は、流動防止部150を貫通させる開口部115を有している。なお、流動防止部150は、たとえば、カバー130に設けられた凸部であってもよく、回路基板110に設けられていてもよい。 The flow prevention part 150 prevents the conductive connection part 140 from spreading as described above. More specifically, the flow prevention part 150 is provided adjacent to the side surface of the conductive connection part 140 facing the target wiring 111 and prevents the conductive connection part 140 from flowing in the direction toward the target wiring 111. . In the example shown in FIG. 1, the flow prevention part 150 is a convex part provided on the base part 120, and the circuit board 110 has an opening 115 that allows the flow prevention part 150 to pass through. Note that the flow prevention portion 150 may be a convex portion provided on the cover 130 or may be provided on the circuit board 110, for example.

図1に示す例において、流動防止部150は、半円筒状の形状を有している。なお、流動防止部150は、たとえば、回路基板110の端縁に沿って延びる平板状の部分と、その平板状の部分の端部において、平面視で円形の導電性接続部140の外周に沿って回路基板110の端縁へ向けて湾曲する円弧状の部分とを有してもよい。この場合、回路基板110の開口部115は、流動防止部150の形状に対応する円弧状の形状または直線状の部分と円弧状の部分とを有している。 In the example shown in FIG. 1, the flow prevention part 150 has a semi-cylindrical shape. Note that the flow prevention portion 150 includes, for example, a flat portion extending along the edge of the circuit board 110 and an edge portion of the flat portion along the outer periphery of the conductive connection portion 140, which is circular in plan view. It may also have an arcuate portion that curves toward the edge of the circuit board 110. In this case, the opening 115 of the circuit board 110 has an arcuate shape or a linear portion corresponding to the shape of the flow prevention portion 150 and an arcuate portion.

図2に示すように、流動防止部150は、導電性接続部140と電子部品112との間に連絡通路151を有している。図2に示す例において、流動防止部150は、平面視で円形の導電性接続部140の対象配線111に対向する半円筒状の側面に隣接して設けられ、導電性接続部140に外縁に沿う半円筒状の形状を有している。流動防止部150の連絡通路151は、たとえば、導電性接続部140と電子部品112との間の位置に設けられている。また、連絡通路151は、たとえば、対象配線111と導電性接続部140との距離が最短となる経路上に設けられている。 As shown in FIG. 2, the flow prevention section 150 has a communication passage 151 between the conductive connection section 140 and the electronic component 112. In the example shown in FIG. 2, the flow prevention part 150 is provided adjacent to the semicylindrical side surface of the conductive connection part 140, which is circular in plan view and faces the target wiring 111, and is attached to the outer edge of the conductive connection part 140. It has a semi-cylindrical shape. The communication passage 151 of the flow prevention part 150 is provided, for example, at a position between the conductive connection part 140 and the electronic component 112. Furthermore, the communication path 151 is provided, for example, on a route where the distance between the target wiring 111 and the conductive connection portion 140 is the shortest.

回路基板110の筐体グランド113は、たとえば、導電性接続部140に接続される第1接続部113aと、電子部品112に接続される第2接続部113bと、を有している。図2に示すように、第1接続部113aは、たとえば、回路基板110の外周縁に沿って設けられた枠状の筐体グランド113において、導電性接続部140の平面形状に対応する円形に拡張されたパッド状の部分である。また、第2接続部113bは、たとえば、枠状の筐体グランド113の内側で対象配線111に隣接して設けられた矩形のパッド状の部分である。 The case ground 113 of the circuit board 110 has, for example, a first connection part 113a connected to the conductive connection part 140 and a second connection part 113b connected to the electronic component 112. As shown in FIG. 2, the first connection portion 113a is formed into a circular shape corresponding to the planar shape of the conductive connection portion 140, for example, in the frame-shaped case ground 113 provided along the outer periphery of the circuit board 110. It is an expanded pad-like part. Further, the second connection portion 113b is, for example, a rectangular pad-shaped portion provided adjacent to the target wiring 111 inside the frame-shaped case ground 113.

また、筐体グランド113は、たとえば、流動防止部150の連絡通路151を通り、第1接続部113aと第2接続部113bとを接続する連絡部113cを有している。連絡部113cは、たとえば、第1接続部113aと第2接続部113bとを最短経路で結ぶ直線状に設けられている。連絡部113cの幅は、たとえば、対象配線111のノイズを低減可能な範囲で可能な限り狭くされる。 Furthermore, the housing ground 113 includes, for example, a communication portion 113c that passes through the communication passage 151 of the flow prevention portion 150 and connects the first connection portion 113a and the second connection portion 113b. The communication portion 113c is provided, for example, in a straight line that connects the first connection portion 113a and the second connection portion 113b via the shortest path. For example, the width of the communication portion 113c is made as narrow as possible within a range that can reduce the noise of the target wiring 111.

これにより、流動防止部150の連絡通路151の幅を可能な限り狭くすることができ、導電性接続部140の対象配線111へ向けた流動を防止することができる。なお、導電性接続部140の粘度を、連絡通路151の幅に応じて適切に設定することで、導電性接続部140の対象配線111へ向けた流動を防止してもよい。また、導電性接続部140の連絡通路151を通した流動をより確実に防止するために、流動防止部150は、たとえば、遮蔽部152を有してもよい。 Thereby, the width of the communication passage 151 of the flow prevention part 150 can be made as narrow as possible, and the flow of the conductive connection part 140 toward the target wiring 111 can be prevented. Note that the conductive connector 140 may be prevented from flowing toward the target wiring 111 by appropriately setting the viscosity of the conductive connector 140 depending on the width of the communication path 151. Further, in order to more reliably prevent the conductive connection portion 140 from flowing through the communication passage 151, the flow prevention portion 150 may include a shielding portion 152, for example.

遮蔽部152は、たとえば、図2および図3に二点鎖線で示すように、導電性接続部140と連絡通路151との間に配置され、導電性接続部140と連絡通路151との間の経路を遮蔽する壁状の部分である。遮蔽部152は、たとえば、カバー130の回路基板110に対向する面から回路基板110へ突出させて設けられている。なお。遮蔽部152は、たとえば、筐体グランド113の第1接続部113aまたは連絡部113cの上に連絡通路151を遮蔽するように固定されていてもよい。 For example, the shielding part 152 is disposed between the conductive connection part 140 and the communication passage 151, as shown by the two-dot chain line in FIGS. It is a wall-like part that blocks the route. The shielding portion 152 is provided, for example, so as to protrude toward the circuit board 110 from the surface of the cover 130 that faces the circuit board 110 . In addition. For example, the shielding part 152 may be fixed on the first connection part 113a or the communication part 113c of the housing ground 113 so as to shield the communication passage 151.

シール部材160は、たとえば、図1に示すように、ベース部120とカバー130との間に配置される枠状の部分と、ベース部120とコネクタ170との間に配置される枠状の部分とを有している。シール部材160は、ベース部120とカバー130との間をシールするとともに、ベース部120とコネクタ170との間をシールする。 For example, as shown in FIG. 1, the sealing member 160 includes a frame-shaped portion disposed between the base portion 120 and the cover 130 and a frame-shaped portion disposed between the base portion 120 and the connector 170. It has The seal member 160 seals between the base portion 120 and the cover 130 and also seals between the base portion 120 and the connector 170.

コネクタ170は、たとえば、図1に示すように、回路基板110に取り付けられた状態でベース部120の開放された前部に配置され、ベース部120およびカバー130によってシール部材160を介して上下左右から支持される。コネクタ170は、回路基板110の回路に接続された複数のコネクタピン171を有し、図示を省略する接続ケーブルに接続される。 For example, as shown in FIG. 1, the connector 170 is attached to the circuit board 110 and is disposed in the open front part of the base part 120, and is connected to the base part 120 and the cover 130 through the sealing member 160. Supported by The connector 170 has a plurality of connector pins 171 connected to circuits on the circuit board 110, and is connected to a connection cable (not shown).

以下、前述の特許文献1に記載された従来の電子制御装置との対比に基いて、本実施形態の電子制御装置100の作用を説明する。 Hereinafter, the operation of the electronic control device 100 of this embodiment will be explained based on comparison with the conventional electronic control device described in Patent Document 1 mentioned above.

上記従来の電子制御装置は、前述のように、導電性接続部と電子部品との間に凸状部材が配置され、導電性接続部と凸状部材とが当接されている。これにより、導電性材料を回路基板上の所定の位置に設置する際、その回路基板面での不要な広がりを防止できる。したがって、回路基板上の部品禁止帯を小さく設定した場合でも、導電性材料の回路基板上での電子部品や配線パターンとの接触を防止でき、回路の破損を防止することができる。 As described above, in the conventional electronic control device, the convex member is disposed between the conductive connection portion and the electronic component, and the conductive connection portion and the convex member are in contact with each other. Thereby, when installing the conductive material at a predetermined position on the circuit board, unnecessary spreading on the surface of the circuit board can be prevented. Therefore, even if the component prohibited zone on the circuit board is set small, it is possible to prevent the conductive material from coming into contact with electronic components or wiring patterns on the circuit board, and damage to the circuit can be prevented.

このような電子制御装置においては、エミッション(EMI)の抑制とイミュニティ(EMS)の向上、すなわち、電磁両立性(EMC)のさらなる向上が求められている。しかし、上記従来の電子制御装置は、凸状部材が障害となり、回路基板の実装領域に設けられたクロック配線等の対象配線の近傍の信号グランドを、金属カバーに接続された導電性接続部の近傍の筐体グランドに接続することが困難になる。すなわち、対象配線の近傍から導電性接続部の近傍の筐体グランドに至る信号グランドの経路は、凸状部材を迂回する経路となり、信号グランドのインピーダンスが増加して放射ノイズが増加する。 In such electronic control devices, suppression of emissions (EMI) and improvement of immunity (EMS), that is, further improvement of electromagnetic compatibility (EMC) are required. However, in the conventional electronic control device described above, the convex member becomes an obstacle, and the signal ground near the target wiring such as the clock wiring provided in the mounting area of the circuit board is connected to the conductive connection part connected to the metal cover. It becomes difficult to connect to the nearby chassis ground. That is, the path of the signal ground from the vicinity of the target wiring to the case ground near the conductive connection becomes a path that detours around the convex member, increasing the impedance of the signal ground and increasing radiation noise.

これに対し、本実施形態の電子制御装置100は、前述のように、回路基板110と、その回路基板110を支持する樹脂製のベース部120と、そのベース部120に支持されたベース部120を覆う金属製のカバー130と、を有している。また、電子制御装置100は、カバー130を回路基板110に接続する導電性接続部140と、その導電性接続部140の広がりを防止する流動防止部150と、を有している。回路基板110は、ノイズ低減の対象となる対象配線111と、その対象配線111の近傍に実装される電子部品112と、を有している。また、回路基板110は、電子部品112に接続される信号グランド114と、電子部品112を介して信号グランド114に接続されるとともに導電性接続部140を介してカバー130に接続される筐体グランド113と、を有している。そして、流動防止部150は、導電性接続部140と電子部品112との間に連絡通路151を有している。さらに、筐体グランド113は、導電性接続部140に接続される第1接続部113aと、電子部品112に接続される第2接続部113bと、流動防止部150の連絡通路151を通り第1接続部113aと第2接続部113bとを接続する連絡部113cと、を有している。 On the other hand, as described above, the electronic control device 100 of the present embodiment includes a circuit board 110, a resin base part 120 that supports the circuit board 110, and a base part 120 that is supported by the base part 120. It has a metal cover 130 that covers the. Further, the electronic control device 100 includes a conductive connection portion 140 that connects the cover 130 to the circuit board 110, and a flow prevention portion 150 that prevents the conductive connection portion 140 from spreading. The circuit board 110 includes a target wiring 111 to be subjected to noise reduction, and an electronic component 112 mounted near the target wiring 111. The circuit board 110 also includes a signal ground 114 connected to the electronic component 112 and a housing ground connected to the signal ground 114 via the electronic component 112 and to the cover 130 via a conductive connection part 140. 113. The flow prevention section 150 has a communication passage 151 between the conductive connection section 140 and the electronic component 112. Furthermore, the case ground 113 passes through a first connection part 113a connected to the conductive connection part 140, a second connection part 113b connected to the electronic component 112, and a communication passage 151 of the flow prevention part 150. It has a connecting part 113c that connects the connecting part 113a and the second connecting part 113b.

このような構成により、本実施形態の電子制御装置100は、流動防止部150を迂回することなく、対象配線111の近傍の信号グランド114を、導電性接続部140を介してカバー130に接続された筐体グランド113に接続することができる。より詳細には、導電性接続部140に接続された筐体グランド113の第1接続部113aと、対象配線111の近傍で電子部品112を介して信号グランド114に接続された筐体グランド113の第2接続部113bとを、筐体グランド113の連絡部113cによって接続している。この連絡部113cは、導電性接続部140と電子部品112との間に設けられた流動防止部150の連絡通路151を通過している。 With such a configuration, the electronic control device 100 of the present embodiment connects the signal ground 114 near the target wiring 111 to the cover 130 via the conductive connection part 140 without bypassing the flow prevention part 150. It can be connected to the housing ground 113. More specifically, the first connection portion 113a of the case ground 113 is connected to the conductive connection portion 140, and the first connection portion 113a of the case ground 113 is connected to the signal ground 114 via the electronic component 112 near the target wiring 111. The second connecting portion 113b is connected to the connecting portion 113c of the housing ground 113. This communication portion 113c passes through a communication passage 151 of a flow prevention portion 150 provided between the conductive connection portion 140 and the electronic component 112.

そのため、導電性接続部140に接続された筐体グランド113の第1接続部113aから、電子部品112を介して対象配線111の近傍の信号グランド114に接続された筐体グランド113の第2接続部113bに至る経路が短縮される。これにより、電子制御装置100は、流動防止部150によって導電性接続部140の不要な広がりを防止しつつ、金属製のカバー130と対象配線111の近傍の信号グランド114との間の経路のインピーダンスを低下させることができる。より具体的には、本実施形態の電子制御装置100は、たとえば、上記従来の電子制御装置と比較して、寄生インダクタンスが支配的となる100MHz以上の周波数において、上記経路のインピーダンスを約75%程度、低減することが可能になる。 Therefore, a second connection of the casing ground 113 is connected from the first connection part 113a of the casing ground 113 connected to the conductive connection part 140 to the signal ground 114 near the target wiring 111 via the electronic component 112. The route to the portion 113b is shortened. As a result, the electronic control device 100 prevents unnecessary expansion of the conductive connection portion 140 by the flow prevention portion 150, and reduces the impedance of the path between the metal cover 130 and the signal ground 114 near the target wiring 111. can be lowered. More specifically, the electronic control device 100 of the present embodiment reduces the impedance of the path by about 75% at a frequency of 100 MHz or higher where parasitic inductance is dominant, for example, compared to the conventional electronic control device described above. It becomes possible to reduce the amount.

このように、ノイズ源となる対象配線111のリターン経路である信号グランド114が、キャパシタまたはコンデンサなどの電子部品112、筐体グランド113、貫通ビア116、および導電性接続部140を介してカバー130に低インピーダンスで接続される。その結果、信号グランド114を安定化させ、対象配線111におけるコモンモードノイズの発生を抑制することができる。したがって、本実施形態の電子制御装置100によれば、導電性接続部140が回路基板110の表面で不要に広がることを防止しつつ、放射ノイズを抑制して、EMCを向上させることができる。 In this way, the signal ground 114, which is the return path of the target wiring 111, which is a noise source, is connected to the cover 130 via the capacitor or the electronic component 112 such as the capacitor, the case ground 113, the through via 116, and the conductive connection part 140. connected with low impedance. As a result, the signal ground 114 can be stabilized, and the occurrence of common mode noise in the target wiring 111 can be suppressed. Therefore, according to the electronic control device 100 of this embodiment, it is possible to prevent the conductive connection portion 140 from spreading unnecessarily on the surface of the circuit board 110, suppress radiation noise, and improve EMC.

また、本実施形態の電子制御装置100において、流動防止部150の連絡通路151は、対象配線111と導電性接続部140との距離が最短となる経路上に設けられている。このような構成により、連絡通路151を通り、導電性接続部140に接続された第1接続部113aと、電子部品112に接続された第2接続部113bとを接続する連絡部113cの長さを最短にすることができる。したがって、本実施形態の電子制御装置100によれば、金属製のカバー130と対象配線111の近傍の信号グランド114との間の経路のインピーダンスをより低下させ、EMCをより向上させることができる。 Furthermore, in the electronic control device 100 of this embodiment, the communication passage 151 of the flow prevention section 150 is provided on the path where the distance between the target wiring 111 and the conductive connection section 140 is the shortest. With such a configuration, the length of the communication part 113c that passes through the communication passage 151 and connects the first connection part 113a connected to the conductive connection part 140 and the second connection part 113b connected to the electronic component 112 is reduced. can be made as short as possible. Therefore, according to the electronic control device 100 of this embodiment, the impedance of the path between the metal cover 130 and the signal ground 114 near the target wiring 111 can be further reduced, and EMC can be further improved.

また、本実施形態の電子制御装置100において、流動防止部150は、ベース部120に設けられた凸部であり、回路基板110は、流動防止部150を貫通させる開口部115を有している。このような構成により、樹脂製のベース部120と流動防止部150とを一体に成形することが可能になり、電気絶縁性を有する流動防止部150を容易に形成することができる。また、ベース部120に回路基板110を配置するときに、回路基板110の開口部115に流動防止部150を挿通させ、ベース部120に対して回路基板110を位置決めすることができ、電子制御装置100の組立性が向上する。 Furthermore, in the electronic control device 100 of the present embodiment, the flow prevention part 150 is a convex part provided on the base part 120, and the circuit board 110 has an opening 115 that allows the flow prevention part 150 to pass through. . With such a configuration, the base portion 120 made of resin and the flow prevention portion 150 can be integrally molded, and the flow prevention portion 150 having electrical insulation properties can be easily formed. Further, when placing the circuit board 110 on the base part 120, the flow prevention part 150 can be inserted into the opening 115 of the circuit board 110, and the circuit board 110 can be positioned with respect to the base part 120. 100, the ease of assembly is improved.

また、本実施形態の電子制御装置100は、前述のように、導電性接続部140と流動防止部150の連絡通路151との間に配置され、導電性接続部140と連絡通路151との間の経路を遮蔽する遮蔽部152を有することができる。このような構成により、遮蔽部152によって、導電性接続部140が連絡通路151に浸入または通過することを防止して、導電性接続部140が不要に広がることを、より確実に防止することが可能になる。 Further, as described above, the electronic control device 100 of the present embodiment is arranged between the conductive connection part 140 and the communication passage 151 of the flow prevention part 150, and is arranged between the conductive connection part 140 and the communication passage 151 of the flow prevention part 150. It is possible to have a shielding part 152 that shields the path. With this configuration, the shielding part 152 can prevent the conductive connection part 140 from entering or passing through the communication passage 151, thereby more reliably preventing the conductive connection part 140 from spreading unnecessarily. It becomes possible.

以上説明したように、本実施形態によれば、導電性接続部140が回路基板110の表面で不要に広がることを防止しつつ、EMCを向上させることが可能な電子制御装置100を提供することができる。なお、本開示に係る電子制御装置は、前述の実施形態に係る電子制御装置100の構成に限定されない。以下、図5および図6を参照して、前述の実施形態に係る電子制御装置100の変形例を説明する。 As described above, according to the present embodiment, it is possible to provide the electronic control device 100 that can improve EMC while preventing the conductive connection portion 140 from spreading unnecessarily on the surface of the circuit board 110. I can do it. Note that the electronic control device according to the present disclosure is not limited to the configuration of the electronic control device 100 according to the above-described embodiment. Hereinafter, a modification of the electronic control device 100 according to the above-described embodiment will be described with reference to FIGS. 5 and 6.

図5は、図2の電子制御装置100の変形例1を示す模式的な拡大図である。本変形例に係る電子制御装置100において、導電性接続部140は、回路基板110の端縁に沿う方向の寸法が、回路基板110の端縁に交差する方向の寸法よりも大きい。より具体的には、導電性接続部140は、回路基板110の端縁に沿って延びる直線部と、その直線部の両端の半円状の端部とを有する長円形の平面形状を有している。このような構成により、導電性接続部140と、筐体グランド113およびカバー130との接触面積を増加させ、筐体グランド113とカバー130との間のインピーダンスをさらに低下させることが可能になる。 FIG. 5 is a schematic enlarged view showing a first modification of the electronic control device 100 of FIG. In the electronic control device 100 according to this modification, the dimension of the conductive connection portion 140 in the direction along the edge of the circuit board 110 is larger than the dimension in the direction intersecting the edge of the circuit board 110. More specifically, the conductive connection portion 140 has an oval planar shape having a straight line portion extending along the edge of the circuit board 110 and semicircular end portions at both ends of the straight line portion. ing. Such a configuration makes it possible to increase the contact area between the conductive connection portion 140, the case ground 113, and the cover 130, and further reduce the impedance between the case ground 113 and the cover 130.

また、本変形例に係る電子制御装置100において、流動防止部150は、回路基板110の端縁に沿う方向において、導電性接続部140の両端よりも外側まで延びる長さを有している。また、回路基板110の開口部115は、それぞれ、導電性接続部140に沿う長さが15mm以下になっている。このような構成により、回路基板110の開口部115の長さに応じて発生するスリット放射の周波数を、EMI規格が設定されていない6GHz以上の周波数へシフトさせることができる。 Furthermore, in the electronic control device 100 according to the present modification, the flow prevention section 150 has a length extending to the outside of both ends of the conductive connection section 140 in the direction along the edge of the circuit board 110. Further, each of the openings 115 of the circuit board 110 has a length along the conductive connection portion 140 of 15 mm or less. With such a configuration, it is possible to shift the frequency of slit radiation generated depending on the length of the opening 115 of the circuit board 110 to a frequency of 6 GHz or higher for which no EMI standard is set.

図6は、図2の電子制御装置100の変形例2を示す模式的な拡大図である。本変形例に係る電子制御装置100は、回路基板110の一つの端縁に沿って二つの導電性接続部140が隣接して配置されている。また、流動防止部150は、二つの導電性接続部140と電子部品112との間に配置され、二つの導電性接続部140の間に連絡通路151を有している。筐体グランド113は、二つの導電性接続部140に接続される二つの第1接続部113aと、連絡通路151を通り二つの第1接続部113aの間の部分と第2接続部113bとを接続する連絡部113cと、を有している。このような構成によっても、前述の実施形態に係る電子制御装置100と同様の効果を奏することができる。 FIG. 6 is a schematic enlarged view showing a second modification of the electronic control device 100 of FIG. In the electronic control device 100 according to this modification, two conductive connection parts 140 are arranged adjacent to each other along one edge of the circuit board 110. Further, the flow prevention section 150 is arranged between the two conductive connection sections 140 and the electronic component 112, and has a communication passage 151 between the two conductive connection sections 140. The housing ground 113 connects the two first connection parts 113a connected to the two conductive connection parts 140, and the part between the two first connection parts 113a through the communication passage 151 and the second connection part 113b. It has a connecting portion 113c for connection. Such a configuration can also provide the same effects as the electronic control device 100 according to the above-described embodiment.

以上、図面を用いて本開示に係る電子制御装置の実施形態を詳述してきたが、具体的な構成はこの実施形態に限定されるものではなく、本開示の要旨を逸脱しない範囲における設計変更等があっても、それらは本開示に含まれるものである。 Although the embodiment of the electronic control device according to the present disclosure has been described above in detail using the drawings, the specific configuration is not limited to this embodiment, and design changes may be made within the scope of the gist of the present disclosure. etc., they are included in the present disclosure.

たとえば、前述の電子制御装置の実施形態において、流動防止部の形状は、直線状の部分の両端に円弧状の部分を有する形状や、半円筒状の形状であった。しかし、流動防止部の形状は、たとえば、一端が開放されたチャネル形状または角型のU字形状、直線状の形状、複数のピンが直線状に並んだ形状など、任意の形状を採用することができる。また、流動防止部は、成形性向上のためのリブを有してもよい。 For example, in the embodiments of the electronic control device described above, the shape of the flow prevention part is a shape in which a linear part has arcuate parts at both ends, or a semi-cylindrical shape. However, the shape of the flow prevention part may be any shape, such as a channel shape with one end open, a square U-shape, a linear shape, or a shape in which a plurality of pins are arranged in a straight line. I can do it. Moreover, the flow prevention part may have ribs for improving moldability.

100 電子制御装置
110 回路基板
111 対象配線
112 電子部品
113 筐体グランド
113a 第1接続部
113b 第2接続部
113c 連絡部
114 信号グランド
115 開口部
120 ベース部
130 カバー
140 導電性接続部
150 流動防止部
151 連絡通路
152 遮蔽部
100 Electronic control device 110 Circuit board 111 Target wiring 112 Electronic component 113 Housing ground 113a First connection part 113b Second connection part 113c Communication part 114 Signal ground 115 Opening part 120 Base part 130 Cover 140 Conductive connection part 150 Flow prevention part 151 Communication passage 152 Shielding part

Claims (7)

回路基板と、該回路基板を支持する樹脂製のベース部と、該ベース部に支持された前記回路基板を覆う金属製のカバーと、該カバーを前記回路基板に接続する導電性接続部と、該導電性接続部の広がりを防止する流動防止部と、を有する電子制御装置であって、
前記回路基板は、ノイズ低減の対象となる対象配線と、該対象配線の近傍に実装される電子部品と、該電子部品に接続される信号グランドと、前記電子部品を介して前記信号グランドに接続されるとともに前記導電性接続部を介して前記カバーに接続される筐体グランドと、を有し、
前記流動防止部は、前記導電性接続部と前記電子部品との間に連絡通路を有し、
前記筐体グランドは、前記導電性接続部に接続される第1接続部と、前記電子部品に接続される第2接続部と、前記流動防止部の前記連絡通路を通り前記第1接続部と前記第2接続部とを接続する連絡部と、を有することを特徴とする電子制御装置。
a circuit board, a resin base part that supports the circuit board, a metal cover that covers the circuit board supported by the base part, and a conductive connection part that connects the cover to the circuit board; An electronic control device comprising a flow prevention part that prevents the conductive connection part from spreading,
The circuit board includes a target wiring to be subjected to noise reduction, an electronic component mounted near the target wiring, a signal ground connected to the electronic component, and a connection to the signal ground via the electronic component. and a housing ground connected to the cover via the conductive connection part,
The flow prevention part has a communication passage between the conductive connection part and the electronic component,
The case ground passes through a first connection part connected to the conductive connection part, a second connection part connected to the electronic component, and the communication passage of the flow prevention part and connects to the first connection part. An electronic control device comprising: a communication section that connects the second connection section.
前記連絡通路は、前記対象配線と前記導電性接続部との距離が最短となる経路上に設けられていることを特徴とする請求項1に記載の電子制御装置。 2. The electronic control device according to claim 1, wherein the communication path is provided on a path where the distance between the target wiring and the conductive connection portion is the shortest. 前記流動防止部は、前記ベース部に設けられた凸部であり、
前記回路基板は、前記流動防止部を貫通させる開口部を有することを特徴とする請求項2に記載の電子制御装置。
The flow prevention part is a convex part provided on the base part,
The electronic control device according to claim 2, wherein the circuit board has an opening that penetrates the flow prevention part.
前記導電性接続部は、前記回路基板の端縁に沿う方向の寸法が、前記回路基板の前記端縁に交差する方向の寸法よりも大きいことを特徴とする請求項3に記載の電子制御装置。 4. The electronic control device according to claim 3, wherein a dimension of the conductive connection portion in a direction along an edge of the circuit board is larger than a dimension in a direction intersecting the edge of the circuit board. . 前記流動防止部は、前記回路基板の前記端縁に沿う方向において、前記導電性接続部の両端よりも外側まで延びる長さを有し、
前記回路基板の前記開口部は、前記流動防止部に沿う長さが15mm以下であることを特徴とする請求項4に記載の電子制御装置。
The flow prevention part has a length extending to the outside of both ends of the conductive connection part in a direction along the edge of the circuit board,
5. The electronic control device according to claim 4, wherein the opening of the circuit board has a length along the flow prevention part of 15 mm or less.
前記導電性接続部と前記流動防止部の前記連絡通路との間に配置され、前記導電性接続部と前記連絡通路との間の経路を遮蔽する遮蔽部を有することを特徴とする請求項2に記載の電子制御装置。 Claim 2, further comprising a shielding part that is disposed between the conductive connection part and the communication passage of the flow prevention part and blocks a path between the conductive connection part and the communication passage. The electronic control device described in . 前記回路基板の一つの端縁に沿って二つの前記導電性接続部が隣接して配置され、
前記流動防止部は、前記二つの前記導電性接続部と前記電子部品との間に配置され、前記二つの前記導電性接続部の間に前記連絡通路を有し、
前記筐体グランドは、前記二つの前記導電性接続部に接続される二つの前記第1接続部と、前記連絡通路を通り前記二つの前記第1接続部の間の部分と前記第2接続部とを接続する前記連絡部と、を有することを特徴とする請求項1に記載の電子制御装置。
two of the conductive connections are arranged adjacently along one edge of the circuit board;
The flow prevention part is disposed between the two conductive connection parts and the electronic component, and has the communication passage between the two conductive connection parts,
The case ground includes the two first connection portions connected to the two conductive connection portions, a portion passing through the communication passage between the two first connection portions, and the second connection portion. 2. The electronic control device according to claim 1, further comprising: the communication section that connects the electronic control device.
JP2022121091A 2022-07-29 2022-07-29 Electronic control device Pending JP2024018046A (en)

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