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JP2023123191A - Conveyance device, polishing device, and conveyance method - Google Patents

Conveyance device, polishing device, and conveyance method Download PDF

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Publication number
JP2023123191A
JP2023123191A JP2022027113A JP2022027113A JP2023123191A JP 2023123191 A JP2023123191 A JP 2023123191A JP 2022027113 A JP2022027113 A JP 2022027113A JP 2022027113 A JP2022027113 A JP 2022027113A JP 2023123191 A JP2023123191 A JP 2023123191A
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JP
Japan
Prior art keywords
carrier
substrate
holding
holding portion
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2022027113A
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Japanese (ja)
Inventor
貢 齋藤
Mitsugi Saito
温光 古川
Onko Furukawa
孝平 蛭田
Kohei HIRUTA
雅史 三浦
Masafumi Miura
俊洋 廣嶋
Toshihiro Hiroshima
優 森田
Masaru Morita
圭佑 江▲崎▼
Keisuke Ezaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Corp
Mitsubishi Materials Techno Corp
Original Assignee
Sumco Corp
Mitsubishi Materials Techno Corp
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Application filed by Sumco Corp, Mitsubishi Materials Techno Corp filed Critical Sumco Corp
Priority to JP2022027113A priority Critical patent/JP2023123191A/en
Priority to CN202380023010.4A priority patent/CN118743009A/en
Priority to KR1020247027619A priority patent/KR20240137631A/en
Priority to PCT/JP2023/005963 priority patent/WO2023162922A1/en
Priority to TW112106477A priority patent/TW202403945A/en
Publication of JP2023123191A publication Critical patent/JP2023123191A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

To provide a conveyance device that prevents a substrate from falling during the conveyance of a carrier and a substrate.SOLUTION: A conveyance device 46 is used for conveying a carrier 205 that is formed in a flat plate shape and provided with a through-hole 206 and a substrate 200 that is accommodated within the through-hole. The conveyance device 46 includes a first holding portion 52 that holds the outer periphery of the carrier from the thickness direction of the carrier and a second holding portion 53 that holds the substrate within the through-hole from the thickness direction. At least one of the first and second holding portions can be made to extend or contract in the thickness direction so that the carrier held by the first holding portion and the substrate held by the second holding portion are separated from each other.SELECTED DRAWING: Figure 6

Description

本発明は、搬送装置、研磨装置、及び搬送方法に関する。 TECHNICAL FIELD The present invention relates to a conveying apparatus, a polishing apparatus, and a conveying method.

従来、互いに合体されたキャリア及びワーク（基板）を、研磨装置（研磨部）の回転定盤上に搬送する搬送装置が知られている（例えば、特許文献１参照）。この搬送装置では、キャリアが有する収容孔（貫通孔）内にワークが収容されることにより、キャリアにワークが合体する。
合体したキャリア及びワークは、吸着ヘッドにより搬送される。 2. Description of the Related Art Conventionally, there has been known a conveying device that conveys a carrier and a workpiece (substrate) that are combined with each other onto a rotating surface plate of a polishing device (polishing section) (see, for example, Japanese Unexamined Patent Application Publication No. 2002-100003). In this conveying device, the work is accommodated in the accommodation hole (through hole) of the carrier, whereby the work is united with the carrier.
The combined carrier and work are transported by the suction head.

特許第４２３５３１３号公報Japanese Patent No. 4235313

しかしながら、特許文献１の搬送装置では、キャリア及びワークを同じ高さで同時に搬送する。このため、搬送時のキャリアの撓み等により、ワークがキャリアに対して接触及び離間を繰り返したり、ワーク及びキャリアが厚さ方向に重なったりして、搬送装置からワークが落下する問題がある。 However, in the transport device of Patent Document 1, the carrier and the work are transported at the same height at the same time. Therefore, there is a problem that the workpiece repeatedly contacts and separates from the carrier due to bending of the carrier during transportation, or the workpiece and the carrier overlap in the thickness direction, and the workpiece drops from the transportation device.

本発明は、このような問題点に鑑みてなされたものであって、キャリア及び基板の搬送中に基板が落下するのを抑制した搬送装置、この搬送装置を備える研磨装置、及び搬送方法を提供することを目的とする。 SUMMARY OF THE INVENTION The present invention has been devised in view of such problems, and provides a transfer apparatus that prevents the substrate from falling during transfer of the carrier and the substrate, a polishing apparatus equipped with this transfer apparatus, and a transfer method. intended to

前記課題を解決するために、この発明は以下の手段を提案している。
（１）この発明の第１態様は、平板状に形成され貫通孔が設けられたキャリアと、前記貫通孔内に収容される基板と、を搬送する搬送装置であって、前記キャリアの外周部を、前記キャリアの厚さ方向から保持する第１保持部と、前記貫通孔内の前記基板を、前記厚さ方向から保持する第２保持部と、を備え、前記第１保持部に保持される前記キャリア及び前記第２保持部に保持される前記基板が互いに離間するように、前記第１保持部及び前記第２保持部の少なくとも一方が前記厚さ方向に伸びるか縮むことができる。 In order to solve the above problems, the present invention proposes the following means.
(1) A first aspect of the present invention is a transport device for transporting a carrier formed in a flat plate shape and provided with a through hole, and a substrate accommodated in the through hole, wherein the outer peripheral portion of the carrier and a second holding portion for holding the substrate in the through-hole from the thickness direction of the carrier, the substrate being held by the first holding portion. At least one of the first holding part and the second holding part can extend or contract in the thickness direction so that the carrier and the substrate held by the second holding part are spaced apart from each other.

この発明では、例えば、水平面に沿う支持面上で、貫通孔内に基板が収容されたキャリア及び基板を支持する。そして、搬送装置を用いて、第１保持部によりキャリアの外周部を厚さ方向となる上下方向から保持し、第２保持部により貫通孔内の基板を保持する。搬送装置により支持面上からキャリア及び基板を持ち上げ、キャリア及び基板を搬送すると、キャリアに作用する重力により、厚さ方向に見たときのキャリアの中央部が最も下方に撓み、キャリアが下方に向かって凸となるように湾曲する。この際に、第１保持部及び第２保持部の少なくとも一方を厚さ方向に伸ばすか縮ませることにより、第１保持部に保持されるキャリア及び第２保持部に保持される基板を互いに離間させる。すると、キャリア及び基板の搬送中に、基板がキャリアに接触したり、キャリア及び基板が厚さ方向に重なったりするのが抑制される。
従って、キャリア及び基板の搬送中に、搬送装置から基板が落下するのを抑制することができる。 In the present invention, for example, the substrate and the carrier containing the substrate in the through-hole are supported on a support surface along the horizontal plane. Then, using a transport device, the outer peripheral portion of the carrier is held by the first holding portion in the vertical direction, which is the thickness direction, and the substrate in the through hole is held by the second holding portion. When the carrier and the substrate are lifted from the support surface by the transport device and transported, the gravity acting on the carrier bends the center of the carrier downward most when viewed in the thickness direction, causing the carrier to move downward. It curves so that it becomes convex. At this time, by stretching or contracting at least one of the first holding portion and the second holding portion in the thickness direction, the carrier held by the first holding portion and the substrate held by the second holding portion are separated from each other. Let This prevents the substrate from contacting the carrier or overlapping the carrier and the substrate in the thickness direction during transport of the carrier and the substrate.
Therefore, it is possible to prevent the substrate from falling from the transport device while the carrier and the substrate are being transported.

（２）前記（１）に記載の搬送装置では、前記キャリアが前記第１保持部に保持され、前記貫通孔内に収容された前記基板が前記第２保持部に保持された状態から、前記第１保持部が前記厚さ方向の一方側に伸びる長さは、前記第２保持部が前記厚さ方向の前記一方側に伸びる長さよりも、前記キャリアの厚さを超えて長くてもよい。
この発明では、例えば、厚さ方向の一方側が下方となるように、搬送装置を配置する。このとき、キャリアが第１保持部に保持され、貫通孔内に収容された基板が第２保持部に保持された状態から、第１保持部が厚さ方向の一方側に伸びる長さは、第２保持部が厚さ方向の一方側に伸びる長さよりも、キャリアの厚さを超えて長い。このため、第１保持部に保持されるキャリア及び第２保持部に保持される基板がほぼ同じ高さに配置された状態から、基板よりもキャリアを、キャリアの厚さを超えて下方に配置することができる。キャリアの中央部は、キャリアに作用する重力により下方に向かって凸となるように湾曲するため、キャリア及び基板の搬送中に基板がキャリアに接触するのを、確実に抑制することができる。 (2) In the conveying apparatus described in (1) above, from a state in which the carrier is held by the first holding portion and the substrate accommodated in the through hole is held by the second holding portion, the The length in which the first holding portion extends to one side in the thickness direction may be longer than the length in which the second holding portion extends to the one side in the thickness direction, exceeding the thickness of the carrier. .
In the present invention, for example, the conveying device is arranged so that one side in the thickness direction faces downward. At this time, from the state in which the carrier is held by the first holding portion and the substrate accommodated in the through hole is held by the second holding portion, the length by which the first holding portion extends to one side in the thickness direction is The thickness of the carrier is longer than the length of the second holding portion extending to one side in the thickness direction. For this reason, the carrier held by the first holding part and the substrate held by the second holding part are arranged at substantially the same height, and the carrier is arranged below the substrate beyond the thickness of the carrier. can do. Since the central portion of the carrier curves downward due to the gravity acting on the carrier, it is possible to reliably prevent the substrate from coming into contact with the carrier while the carrier and the substrate are being transported.

（３）前記（１）又は（２）に記載の搬送装置では、前記第１保持部は、第１本体と、前記第１本体に対して前記厚さ方向に移動でき、前記キャリアの外周部を保持する第１移動部と、を有し、前記第２保持部は、第２本体と、前記第２本体に対して前記厚さ方向に移動でき、前記基板を保持する第２移動部と、を有し、前記第１本体及び前記第２本体を互いに連結する連結部材を備えてもよい。
この発明では、第１本体及び第２本体を互いに連結する連結部材により、第１移動部により保持されるキャリアの外周部、及び第２移動部により保持される基板の、厚さ方向における相対的な位置の精度を高めることができる。 (3) In the conveying device described in (1) or (2) above, the first holding portion can move in the thickness direction with respect to the first main body and the outer peripheral portion of the carrier. The second holding part is movable in the thickness direction with respect to the second main body and the second main body, and holds the substrate. and connecting the first body and the second body to each other.
In this invention, the connecting member that connects the first main body and the second main body to each other allows relative movement of the outer peripheral portion of the carrier held by the first moving portion and the substrate held by the second moving portion in the thickness direction. positional accuracy can be improved.

（４）本発明の第２態様は、前記キャリアの外周縁には、複数の歯部が設けられ、定盤の支持面上で回転し、前記キャリアの前記複数の歯部に嵌め合う内歯車及び太陽歯車を有し、前記基板の厚さ方向を向く面を研磨する遊星歯車装置式の研磨部と、前記に記載の搬送装置と、を備え、前記搬送装置は、前記内歯車の複数の歯部及び前記太陽歯車の複数の歯部に前記キャリアの前記複数の歯部を嵌め合わせる研磨装置である。 (4) A second aspect of the present invention is an internal gear that is provided with a plurality of teeth on the outer peripheral edge of the carrier, rotates on the support surface of the surface plate, and is fitted to the plurality of teeth of the carrier. and a sun gear, and a polishing unit of a planetary gear system type that polishes the surface facing the thickness direction of the substrate; It is a polishing device in which the plurality of teeth of the carrier are fitted to the teeth of the sun gear and the plurality of teeth of the sun gear.

この発明では、搬送装置により、遊星歯車装置式の研磨部における、内歯車の複数の歯部及び太陽歯車の複数の歯部にキャリアの複数の歯部を嵌め合わせる。そして、内歯車及び太陽歯車の少なくとも一方を回転させることによりキャリアを回転させ、キャリアに収容される基板の厚さ方向を向く面を研磨することができる。 In this invention, the plurality of teeth of the carrier are fitted to the plurality of teeth of the internal gear and the plurality of teeth of the sun gear in the polishing section of the planetary gear system by the conveying device. By rotating at least one of the internal gear and the sun gear, the carrier can be rotated, and the surface facing the thickness direction of the substrate accommodated in the carrier can be polished.

（５）本発明の第３態様は、平板状に形成され貫通孔が設けられたキャリアと、前記貫通孔内に収容される基板と、を搬送する搬送方法であって、前記キャリアの外周部及び前記基板を、前記キャリア及び前記基板が互いに離間するようにそれぞれ保持する保持工程と、支持面上に前記キャリアを配置して前記キャリアを平坦にするとともに、前記キャリアを平坦にしたときに、前記基板を前記キャリアよりも上方に離間させる平坦化工程と、前記キャリアの前記貫通孔内に、上方から前記基板を収容させる収容工程と、を行う。 (5) A third aspect of the present invention is a transport method for transporting a carrier formed in a flat plate shape and provided with a through hole, and a substrate accommodated in the through hole, wherein the outer peripheral portion of the carrier and a holding step of holding the substrate so that the carrier and the substrate are separated from each other; placing the carrier on a support surface to flatten the carrier; and when flattening the carrier, A flattening step of separating the substrate above the carrier and an accommodating step of accommodating the substrate from above in the through hole of the carrier are performed.

この発明では、保持工程におけるキャリア及び基板の搬送中、及び平坦化工程における支持面上にキャリアを配置する際に、基板がキャリアに接触したり、キャリア及び基板が厚さ方向に重なったりするのがそれぞれ抑制される。保持工程及び平坦化工程の後で、収容工程において、キャリアの貫通孔内に、上方から基板を収容させる。
従って、キャリア及び基板の搬送中に、基板が落下するのを抑制することができる。 In the present invention, the substrate does not come into contact with the carrier or the carrier and the substrate overlap in the thickness direction during transport of the carrier and substrate in the holding process and when placing the carrier on the support surface in the planarizing process. are suppressed respectively. After the holding step and the flattening step, in the accommodating step, the substrate is accommodated in the through holes of the carrier from above.
Therefore, it is possible to prevent the substrate from falling during the transportation of the carrier and the substrate.

（６）前記（５）に記載の搬送方法において、前記保持工程では、前記キャリアよりも前記基板が上方に位置するように保持してもよい。
この発明では、平坦化工程において支持面上にキャリアを配置する際に基板が支障とならないため、平坦化工程を容易に行うことができる。 (6) In the carrying method described in (5) above, in the holding step, the substrate may be held above the carrier.
According to the present invention, the substrate does not interfere with placing the carrier on the support surface in the planarization process, so the planarization process can be easily performed.

本発明の搬送装置、研磨装置、及び搬送方法によれば、キャリア及び基板の搬送中に基板が落下するのを抑制することができる。 According to the transfer apparatus, the polishing apparatus, and the transfer method of the present invention, it is possible to prevent the substrate from falling during transfer of the carrier and the substrate.

本発明の一実施形態の研磨装置が用いられる研磨設備の概略構成を示す図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematic structure of the polishing equipment with which the polishing apparatus of one Embodiment of this invention is used. 同研磨設備の研磨装置の拡大図である。It is an enlarged view of the polishing device of the same polishing equipment. 同研磨装置における保持部の断面図である。It is sectional drawing of the holding|maintenance part in the same polishing apparatus. 吸着パッドが潰れる前後の状態を説明する図である。It is a figure explaining the state before and after a suction pad is crushed. セットテーブル上にキャリア及び基板が配置された状態を示す断面図である。FIG. 4 is a cross-sectional view showing a state in which carriers and substrates are arranged on a set table; 同研磨装置によりキャリア及び基板を保持した状態の断面図である。FIG. 2 is a cross-sectional view of the polishing apparatus holding a carrier and a substrate; 本発明の一実施形態における搬送方法を示すフローチャートである。It is a flowchart which shows the conveyance method in one Embodiment of this invention. 搬送されるキャリア及び基板の状態を示す断面図である。FIG. 4 is a cross-sectional view showing the state of the carrier and substrate being transported;

以下、本発明に係る研磨装置の一実施形態が用いられる研磨設備を、図１から図８を参照しながら説明する。
図１に示す研磨設備１は、基板２００の厚さ方向を向く面を研磨するための設備である。例えば、図１及び図２に示すように、基板２００は、基板２００の厚さ方向から見たときに円形状を呈する平板状に形成される。基板２００は、シリコン製である。なお、図２中に、基板２００、後述するキャリア２０５を保持する、第１保持部５２及び第２保持部５３を示す。
以下では、研磨設備１により研磨される前の基板２００を、基板２００Ａとも言う。研磨設備１により研磨された後の基板２００を、基板２００Ｂとも言う。例えば、基板２００Ａの厚さは、７８０μｍ（マイクロメートル）である。基板２００Ｂの厚さは、７７０μｍである。 A polishing facility in which an embodiment of the polishing apparatus according to the present invention is used will be described below with reference to FIGS. 1 to 8. FIG.
The polishing equipment 1 shown in FIG. 1 is equipment for polishing the surface of the substrate 200 facing the thickness direction. For example, as shown in FIGS. 1 and 2, the substrate 200 is formed in a flat plate shape that exhibits a circular shape when viewed from the thickness direction of the substrate 200 . The substrate 200 is made of silicon. Note that FIG. 2 shows a first holding portion 52 and a second holding portion 53 that hold the substrate 200 and a carrier 205 which will be described later.
Below, the substrate 200 before being polished by the polishing equipment 1 is also referred to as a substrate 200A. The substrate 200 after being polished by the polishing equipment 1 is also referred to as a substrate 200B. For example, the thickness of the substrate 200A is 780 μm (micrometers). The thickness of the substrate 200B is 770 μm.

キャリア２０５は、キャリア２０５の厚さ方向から見たときに円形状を呈する平板状に形成される。キャリア２０５には、複数（本実施形態では３つ）の貫通孔２０６が設けられる。複数の貫通孔２０６は、キャリア２０５の中心軸回りに等角度ごとに形成される。複数の貫通孔２０６は、キャリア２０５を厚さ方向に貫通する。貫通孔２０６の径及び基板２００の径は、互いに同等である。基板２００は、貫通孔２０６内に収容される。このとき、キャリア２０５の厚さ方向と、基板２００の厚さ方向とが一致する。
図２に示すように、キャリア２０５の外周縁には、複数の歯部２０７が設けられる。複数の歯部２０７は、外歯である。キャリア２０５の周方向に隣り合う歯部２０７の間には、半円状の窪み２０８が形成される。 The carrier 205 is formed in a flat plate shape having a circular shape when viewed from the thickness direction of the carrier 205 . The carrier 205 is provided with a plurality of (three in this embodiment) through holes 206 . A plurality of through holes 206 are formed at equal angles around the center axis of the carrier 205 . A plurality of through holes 206 penetrate through the carrier 205 in the thickness direction. The diameter of the through-hole 206 and the diameter of the substrate 200 are equal to each other. Substrate 200 is accommodated within through hole 206 . At this time, the thickness direction of the carrier 205 coincides with the thickness direction of the substrate 200 .
As shown in FIG. 2, a plurality of teeth 207 are provided on the outer peripheral edge of the carrier 205 . The plurality of teeth 207 are external teeth. A semicircular depression 208 is formed between the teeth 207 adjacent to each other in the circumferential direction of the carrier 205 .

例えば、キャリア２０５の外径は７２０ｍｍ、厚さは７７０μｍである。キャリア２０５は、ステンレス鋼等で形成される。
平坦な支持面等の上で、キャリア２０５の貫通孔２０６内に基板２００を収容するときには、キャリア２０５及び基板２００は撓んでいない。このとき、キャリア２０５の下面と基板２００の下面とはほぼ面一であり、キャリア２０５の上面と基板２００の上面とはほぼ面一である。
なお、キャリア２０５に設けられる貫通孔２０６の数に制限は無く、貫通孔２０６の数は１つでもよい。 For example, the carrier 205 has an outer diameter of 720 mm and a thickness of 770 μm. The carrier 205 is made of stainless steel or the like.
Carrier 205 and substrate 200 are not flexed when substrate 200 is accommodated within through hole 206 of carrier 205, such as on a flat support surface. At this time, the bottom surface of the carrier 205 and the bottom surface of the substrate 200 are substantially flush, and the top surface of the carrier 205 and the top surface of the substrate 200 are substantially flush.
The number of through-holes 206 provided in the carrier 205 is not limited, and the number of through-holes 206 may be one.

図１に示すように、この研磨設備１は、搬入バスケット１０と、搬出バスケット１５と、セットテーブル２０と、第１搬送装置２５と、本実施形態の研磨装置３０と、制御部８０と、を備える。
搬入バスケット１０は、基板２００Ａを収容した状態で、図示しない搬入装置により研磨設備１に搬入される。搬出バスケット１５は、基板２００Ｂを収容した状態で、図示しない搬出装置により研磨設備１から搬出される。 As shown in FIG. 1, this polishing equipment 1 includes a carry-in basket 10, a carry-out basket 15, a set table 20, a first conveying device 25, a polishing device 30 of the present embodiment, and a control unit 80. Prepare.
The carry-in basket 10 containing the substrates 200A is carried into the polishing facility 1 by a carry-in device (not shown). The carry-out basket 15 containing the substrate 200B is carried out from the polishing facility 1 by a carry-out device (not shown).

セットテーブル２０は、基板２００及びキャリア２０５を置くための台である。図５に示すように、セットテーブル２０の上面２１は水平面に沿う。上面２１は、平坦である。
図１に示すように、例えば、第１搬送装置２５は、マニピュレータである。第１搬送装置２５は、バスケット１０，１５とセットテーブル２０との間で基板２００を搬送する。 The set table 20 is a table on which the substrate 200 and the carrier 205 are placed. As shown in FIG. 5, the upper surface 21 of the set table 20 extends along the horizontal plane. The upper surface 21 is flat.
As shown in FIG. 1, for example, the first transport device 25 is a manipulator. The first transport device 25 transports the substrate 200 between the baskets 10 and 15 and the set table 20 .

研磨装置３０は、研磨部３１と、本実施形態の第２搬送装置（搬送装置）４６と、を有する。
本実施形態の研磨部３１は、遊星歯車装置式である。図１及び図２に示すように、研磨部３１は、第１定盤（定盤）３２と、太陽歯車３３と、内歯車３４と、第２定盤（不図示）と、を有する。
例えば、第１定盤３２の支持面３２ａは、水平面に沿うように配置される。支持面３２ａは、平坦である。第１定盤３２は、上下方向に沿う軸線Ｏ１周りの第１の向きに回転する。 The polishing device 30 has a polishing section 31 and a second transfer device (transfer device) 46 of the present embodiment.
The polishing unit 31 of this embodiment is of a planetary gear system type. As shown in FIGS. 1 and 2, the polishing section 31 has a first surface plate (surface plate) 32, a sun gear 33, an internal gear 34, and a second surface plate (not shown).
For example, the support surface 32a of the first platen 32 is arranged along the horizontal plane. The support surface 32a is flat. The first platen 32 rotates in a first direction about an axis O1 along the vertical direction.

太陽歯車３３は、支持面３２ａ上に軸線Ｏ１と同軸に配置される。図２に示すように、太陽歯車３３の外周縁には、複数の歯部３７が設けられる。例えば、複数の歯部３７は、円柱状の外歯である。複数の歯部３７は、太陽歯車３３の周方向に互いに間隔を空けて配置される。太陽歯車３３は、支持面３２ａ上で回転する。複数の歯部３７は、キャリア２０５の複数の歯部２０７に嵌め合う。太陽歯車３３は、キャリア２０５に内接する。
内歯車３４の内周縁には、複数の歯部３９が設けられる。複数の歯部３９は、円柱状の内歯である。複数の歯部３９は、内歯車３４の周方向に互いに間隔を空けて配置される。内歯車３４は、支持面３２ａ上で回転する。複数の歯部３９は、キャリア２０５の複数の歯部２０７に嵌め合う。内歯車３４は、キャリア２０５に外接する。 The sun gear 33 is arranged coaxially with the axis O1 on the support surface 32a. As shown in FIG. 2 , a plurality of teeth 37 are provided on the outer peripheral edge of the sun gear 33 . For example, the plurality of teeth 37 are cylindrical external teeth. The plurality of tooth portions 37 are arranged at intervals in the circumferential direction of the sun gear 33 . The sun gear 33 rotates on the support surface 32a. A plurality of teeth 37 fit into a plurality of teeth 207 of carrier 205 . Sun gear 33 is inscribed in carrier 205 .
A plurality of teeth 39 are provided on the inner peripheral edge of the internal gear 34 . The plurality of teeth 39 are cylindrical internal teeth. The plurality of tooth portions 39 are spaced apart from each other in the circumferential direction of the internal gear 34 . The internal gear 34 rotates on the support surface 32a. A plurality of teeth 39 fit into a plurality of teeth 207 of carrier 205 . The internal gear 34 circumscribes the carrier 205 .

第２定盤は、第１定盤３２とともに太陽歯車３３及び内歯車３４を挟む挟み状態と、太陽歯車３３及び内歯車３４から離間した退避状態と、の間で切り替えできる。
挟み状態の第２定盤は、軸線Ｏ１と同軸に配置され、軸線Ｏ１周りの前記第１の向きとは反対の第２の向きに回転する。 The second surface plate can be switched between a sandwiching state in which the sun gear 33 and the internal gear 34 are sandwiched together with the first surface plate 32 and a retracted state in which the sun gear 33 and the internal gear 34 are separated.
The sandwiched second platen is arranged coaxially with the axis O1 and rotates about the axis O1 in a second direction opposite to the first direction.

第２搬送装置４６は、キャリア２０５と、複数の基板２００とを、一体に搬送する。第２搬送装置４６は、内歯車３４の複数の歯部３９及び太陽歯車３３の複数の歯部３７に、キャリア２０５の複数の歯部２０７を嵌め合わせる。図１に示すように、第２搬送装置４６は、マニピュレータ４７と、保持部５０と、を有する。
例えば、マニピュレータ４７は、図示しない複数のリンク及び関節を有する。複数のリンクは、連結軸Ｏ３に沿って並べて配置される。関節は、連結軸Ｏ３に沿って隣り合う複数のリンクの端部同士を回転可能に連結する。
複数のリンクにおける連結軸Ｏ３に沿った最も第１側のリンクには、前記保持部５０が設けられる。複数のリンクにおける連結軸Ｏ３に沿った最も第１側とは反対側の第２側のリンクは、設置面Ｆに支持される。 The second transport device 46 transports the carrier 205 and the plurality of substrates 200 integrally. The second conveying device 46 engages the teeth 207 of the carrier 205 with the teeth 39 of the internal gear 34 and the teeth 37 of the sun gear 33 . As shown in FIG. 1 , the second conveying device 46 has a manipulator 47 and a holding section 50 .
For example, the manipulator 47 has multiple links and joints (not shown). The multiple links are arranged side by side along the connecting axis O3. The joint rotatably connects end portions of a plurality of links adjacent to each other along the connecting axis O3.
The holding portion 50 is provided on the first link of the plurality of links along the connecting axis O3. Among the plurality of links, the link on the second side opposite to the first side along the connecting axis O3 is supported on the installation surface F. As shown in FIG.

図１に示すように、保持部５０は、軸線Ｏ５に対して複数回の回転対称（本実施形態では３回対称）に形成される。なお、後述する第１保持部５２及び複数の第２保持部５３は、保持部５０の径方向に沿う同一直線上には配置されていないが、図３では、第１保持部５２及び複数の第２保持部５３の保持部５０の周方向における位置を変えて示している。
保持部５０は、保持部５０が保持するキャリア２０５及び基板２００における厚さ方向が上下方向に平行になり、厚さ方向の一方側が下方となるように配置される。
図３に示すように、保持部５０は、フレーム（連結部材）５１と、第１保持部５２と、第２保持部５３と、撮像部５４と、吸引部（不図示）と、を有する。
フレーム５１は、天板５７と、第１周壁５８と、第２周壁５９と、第１底板６０と、第２底板６１と、を有する。
天板５７は、円板状に形成される。天板５７は、マニピュレータ４７により、水平面に沿うように支持される。 As shown in FIG. 1, the holding portion 50 is formed with a plurality of rotational symmetry (three-fold symmetry in this embodiment) with respect to the axis O5. Note that the first holding portion 52 and the plurality of second holding portions 53, which will be described later, are not arranged on the same straight line along the radial direction of the holding portion 50, but in FIG. The position of the second holding portion 53 in the circumferential direction of the holding portion 50 is changed.
The holding part 50 is arranged so that the thickness directions of the carrier 205 and the substrate 200 held by the holding part 50 are parallel to the vertical direction, and one side in the thickness direction faces downward.
As shown in FIG. 3, the holding section 50 has a frame (connecting member) 51, a first holding section 52, a second holding section 53, an imaging section 54, and a suction section (not shown).
The frame 51 has a top plate 57 , a first peripheral wall 58 , a second peripheral wall 59 , a first bottom plate 60 and a second bottom plate 61 .
The top plate 57 is formed in a disc shape. The top plate 57 is supported along the horizontal plane by the manipulator 47 .

第１周壁５８は、筒状に形成され、軸線Ｏ５と同軸に配置される。第１周壁５８は、天板５７の下面に固定される。
第２周壁５９は、筒状に形成され、軸線Ｏ５と同軸に配置される。第２周壁５９は、第１周壁５８を外側から囲い、天板５７の外周縁の下面に固定される。前記第１周壁５８の下端は、第２周壁５９の下端よりも下方に突出している。
第１底板６０は、円板状に形成され、第１周壁５８内に配置される。第１底板６０は、第１周壁５８における上下方向の中間部に固定される。
第２底板６１は、環状に形成され、第１周壁５８と第２周壁５９との間に配置される。第２底板６１は、第１周壁５８の下端部及び第２周壁５９の下端にそれぞれ固定される。第２底板６１には、複数の連通孔６１ａが形成される。 The first peripheral wall 58 is formed in a tubular shape and arranged coaxially with the axis O5. The first peripheral wall 58 is fixed to the bottom surface of the top plate 57 .
The second peripheral wall 59 is formed in a tubular shape and arranged coaxially with the axis O5. The second peripheral wall 59 surrounds the first peripheral wall 58 from the outside and is fixed to the lower surface of the outer peripheral edge of the top plate 57 . The lower end of the first peripheral wall 58 protrudes below the lower end of the second peripheral wall 59 .
The first bottom plate 60 is disc-shaped and arranged within the first peripheral wall 58 . The first bottom plate 60 is fixed to a vertically intermediate portion of the first peripheral wall 58 .
The second bottom plate 61 is annularly formed and arranged between the first peripheral wall 58 and the second peripheral wall 59 . The second bottom plate 61 is fixed to the lower end of the first peripheral wall 58 and the lower end of the second peripheral wall 59, respectively. A plurality of communication holes 61 a are formed in the second bottom plate 61 .

第１保持部５２は、キャリア２０５の外周部を厚さ方向から保持する。ここで言う外周部とは、円形状の保持対象の半径をｒとしたときに、保持対象の外周縁から中心に向かって（０．４ｒ）の範囲のことを意味する。
保持部５０は、第１保持部５２を複数有する。複数の第１保持部５２は、軸線Ｏ５回りに互いに間隔を空けて配置される。図３に示すように、各第１保持部５２は、第１本体６４と、第１移動部６５と、を有する。第１移動部６５は、吸着パッド６７と、可動管６８と、を有する。
吸着パッド６７は、合成ゴム等の弾性を有する材料でコーン状（円錐面状）に形成される。吸着パッド６７は、下方に向かうに従い漸次、外径が大きくなるように配置される。
可動管６８は、吸着パッド６７から上方（厚さ方向の他方側）に向かって延びる。可動管６８内の空間は、吸着パッド６７の凹部に連なる。
例えば、可動管６８の上端部における外周面には、第１係合部６８ａが固定される。可動管６８における第１係合部６８ａよりも下方の部分は、第２底板６１の連通孔６１ａ内に配置される。 The first holding portion 52 holds the outer peripheral portion of the carrier 205 from the thickness direction. The outer peripheral portion referred to here means a range (0.4r) from the outer peripheral edge of the object to be held toward the center, where r is the radius of the object to be held.
The holding portion 50 has a plurality of first holding portions 52 . The plurality of first holding portions 52 are spaced apart from each other around the axis O5. As shown in FIG. 3 , each first holding portion 52 has a first main body 64 and a first moving portion 65 . The first moving part 65 has a suction pad 67 and a movable tube 68 .
The suction pad 67 is formed in a cone shape (conical surface shape) from an elastic material such as synthetic rubber. The suction pads 67 are arranged such that their outer diameters gradually increase toward the bottom.
The movable tube 68 extends upward (the other side in the thickness direction) from the suction pad 67 . The space inside the movable tube 68 continues to the concave portion of the suction pad 67 .
For example, a first engaging portion 68 a is fixed to the outer peripheral surface of the upper end portion of the movable tube 68 . A portion of the movable tube 68 below the first engagement portion 68 a is disposed within the communication hole 61 a of the second bottom plate 61 .

第１本体６４は、内径が可動管６８の外径よりも大きい管状である。第１本体６４は、Ｌ字状に折れている。第１本体６４の第１端部６４ａは上下方向に沿って延びている。例えば、第１端部６４ａの下端の内周面には、第２係合部６４ｂが固定される。第２係合部６４ｂは、第１本体６４の第１端部６４ａの全周にわたって形成される。第２係合部６４ｂは、第１係合部６８ａを、第１係合部６８ａの下方から支持する。第２係合部６４ｂと可動管６８との間は、気密に封止される。可動管６８は、第２係合部６４ｂ（第１本体６４の第１端部６４ａ）に対して上下方向に移動できる。
第１本体６４は、フレーム５１の第２底板６１等に固定される。図２に示す状態から、第１本体６４に対して可動管６８が下方に移動することはできない。一方で、図２に示す状態から、第１本体６４に対して可動管６８が上方に移動できる。 The first body 64 is tubular with an inner diameter larger than the outer diameter of the movable tube 68 . The first main body 64 is bent in an L shape. A first end portion 64a of the first main body 64 extends in the vertical direction. For example, the second engaging portion 64b is fixed to the inner peripheral surface of the lower end of the first end portion 64a. The second engaging portion 64b is formed along the entire circumference of the first end portion 64a of the first main body 64 . The second engaging portion 64b supports the first engaging portion 68a from below the first engaging portion 68a. The space between the second engaging portion 64b and the movable tube 68 is airtightly sealed. The movable tube 68 can move vertically with respect to the second engaging portion 64b (the first end portion 64a of the first main body 64).
The first main body 64 is fixed to the second bottom plate 61 of the frame 51 or the like. The movable tube 68 cannot move downward with respect to the first main body 64 from the state shown in FIG. On the other hand, the movable tube 68 can move upward with respect to the first main body 64 from the state shown in FIG.

図４に示すように、第１保持部５２の吸着パッド６７の下端をキャリア２０５の外周部の上面に接触させる。
吸着パッド６７の凹部内の空気を吸引すると、二点鎖線Ｌ１で示すように吸着パッド６７が潰れるように変形し、吸着パッド６７に接触していたキャリア２０５が吸着パッド６７に保持される。 As shown in FIG. 4 , the lower end of the suction pad 67 of the first holding portion 52 is brought into contact with the upper surface of the outer peripheral portion of the carrier 205 .
When the air in the concave portion of the suction pad 67 is sucked, the suction pad 67 is deformed so as to be crushed as indicated by the two-dot chain line L1, and the carrier 205 in contact with the suction pad 67 is held by the suction pad 67.

図５に、セットテーブル２０の上面２１上に、キャリア２０５及び基板２００が配置された状態を示す。基板２００は、キャリア２０５の貫通孔２０６内に収容される。
この状態のキャリア２０５及び基板２００に対して、上方から保持部５０を近づけ、第１保持部５２の吸着パッド６７をキャリア２０５の外周部の上面に接触させる。
吸着パッド６７の凹部内の空気を吸引すると、第１保持部５２の潰れた吸着パッド６７が、キャリア２０５の外周部を保持する。このとき、可動管６８の第１係合部６８ａは、第１本体６４の第２係合部６４ｂから上方に離間する。
このときの、フレーム５１に対する潰れた吸着パッド６７の下端の位置を、基準位置Ｐ５２１と言う。基準位置Ｐ５２１は、フレーム５１に対する、潰れた吸着パッド６７の下端における、吸着パッド６７の周方向の平均位置であることが好ましい。 FIG. 5 shows a state in which the carrier 205 and the substrate 200 are arranged on the upper surface 21 of the set table 20. As shown in FIG. Substrate 200 is received within through-hole 206 of carrier 205 .
The holding unit 50 is brought close to the carrier 205 and the substrate 200 in this state from above, and the suction pads 67 of the first holding unit 52 are brought into contact with the upper surface of the outer periphery of the carrier 205 .
When the air inside the concave portion of the suction pad 67 is sucked, the crushed suction pad 67 of the first holding portion 52 holds the outer peripheral portion of the carrier 205 . At this time, the first engaging portion 68 a of the movable tube 68 is separated upward from the second engaging portion 64 b of the first main body 64 .
The position of the lower end of the crushed suction pad 67 with respect to the frame 51 at this time is called a reference position P521 . The reference position P 521 is preferably the average circumferential position of the suction pad 67 at the lower end of the collapsed suction pad 67 with respect to the frame 51 .

この状態から、マニピュレータ４７により保持部５０を上方に移動させると、図６に示すように、第１保持部５２に保持されたキャリア２０５が、セットテーブル２０の上面２１から上方に離間する。キャリア２０５、吸着パッド６７等に作用する重力により、第１保持部５２の第１本体６４に対してキャリア２０５、吸着パッド６７等が下方に移動する。可動管６８の第１係合部６８ａが第１本体６４の第２係合部６４ｂに、第２係合部６４ｂの上方から係止すると、第１本体６４（フレーム５１）に対してキャリア２０５、吸着パッド６７等が、これ以上下方に移動できなくなる。
キャリア２０５を保持して潰れ、フレーム５１に対して下方に移動できなくなったときの、フレーム５１に対する吸着パッド６７の下端の位置を、下端位置Ｐ５２２と言う。下端位置Ｐ５２２は、第１保持部５２の吸着パッド６７の移動範囲における下方の端の位置である。
図６中に、吸着パッド６７の基準位置Ｐ５２１を、二点鎖線Ｌ４で示す。以下では、潰れた吸着パッド６７における、基準位置Ｐ５２１と下端位置Ｐ５２２との上下方向の距離を、伸長距離Ｍ５２と言う。伸長距離Ｍ５２は、第１保持部５２がキャリア２０５を保持した状態から、第１保持部５２が下方（厚さ方向の一方側）に伸びる長さである。
このように、第１保持部５２は、キャリア２０５を保持した状態から下方に向かって伸びることができる。 From this state, when the holding portion 50 is moved upward by the manipulator 47, the carrier 205 held by the first holding portion 52 is separated upward from the upper surface 21 of the set table 20, as shown in FIG. The gravity acting on the carrier 205 , the suction pads 67 , etc. causes the carrier 205 , the suction pads 67 , etc. to move downward with respect to the first main body 64 of the first holding portion 52 . When the first engaging portion 68a of the movable tube 68 engages the second engaging portion 64b of the first main body 64 from above the second engaging portion 64b, the carrier 205 is moved to the first main body 64 (frame 51). , the suction pad 67 and the like cannot move further downward.
The position of the lower end of the suction pad 67 with respect to the frame 51 when the carrier 205 is crushed and cannot move downward with respect to the frame 51 is referred to as a lower end position P522 . The lower end position P 522 is the lower end position of the movement range of the suction pad 67 of the first holding portion 52 .
In FIG. 6, the reference position P521 of the suction pad 67 is indicated by a chain double-dashed line L4. Hereinafter, the vertical distance between the reference position P 521 and the lower end position P 522 of the collapsed suction pad 67 is referred to as an extension distance M 52 . The extension distance M52 is the length by which the first holding portion 52 extends downward (one side in the thickness direction) from the state in which the first holding portion 52 holds the carrier 205 .
Thus, the first holding portion 52 can extend downward from the state where the carrier 205 is held.

第２保持部５３は、キャリア２０５の貫通孔２０６内の基板２００を、上下方向から保持する。図３に示すように、第２搬送装置４６は、第２保持部５３として、第２保持部５３Ａ、第２保持部５３Ｂ、第２保持部５３Ｃを有する。
第２保持部５３Ａ，５３Ｂは、伸長距離Ｍ５２の設定以外は第１保持部５２と同一の構成である。
第２保持部５３Ａは、第１保持部５２の第１本体６４、第１移動部６５、吸着パッド６７、可動管６８と略同一の構成の、第２本体７１Ａ、第２移動部７２Ａ、吸着パッド７４Ａ、可動管７５Ａを有する。
第２移動部７２Ａは、第２本体７１Ａに対して上下方向に移動できる。第２移動部７２Ａの吸着パッド７４Ａは、基板２００を保持する。
第２保持部５３Ａの吸着パッド７４Ａに対しても、第１保持部５２の吸着パッド６７に対する基準位置Ｐ５２１、下端位置Ｐ５２２、伸長距離Ｍ５２と同様に、基準位置Ｐ５３Ａ１、下端位置Ｐ５３Ａ２、伸長距離Ｍ５３Ａがそれぞれ規定される（図５及び図６参照）。
伸長距離Ｍ５３Ａは、第２保持部５３Ａが基板２００を保持した状態から、第２保持部５３Ａが下方に伸びる長さである。 The second holding part 53 holds the substrate 200 in the through hole 206 of the carrier 205 from above and below. As shown in FIG. 3, the second conveying device 46 has a second holding portion 53A, a second holding portion 53B, and a second holding portion 53C as the second holding portion 53. As shown in FIG.
The second holding portions 53A and 53B have the same configuration as the first holding portion 52 except for the setting of the extension distance M52 .
The second holding portion 53A includes a second main body 71A, a second moving portion 72A, and a suction unit having substantially the same configuration as the first main body 64, the first moving portion 65, the suction pad 67, and the movable tube 68 of the first holding portion 52. It has a pad 74A and a movable tube 75A.
The second moving portion 72A can move vertically with respect to the second main body 71A. The suction pad 74A of the second moving portion 72A holds the substrate 200. As shown in FIG.
Similarly to the reference position P 521 , the lower end position P 522 , and the extended distance M 52 for the suction pad 67 of the first holding portion 52, the suction pad 74A of the second holding portion 53A also has a reference position P 53A1 and a lower end position P 53A2 and an extension distance M 53A are defined respectively (see FIGS. 5 and 6).
The extension distance M 53A is the length by which the second holding portion 53A extends downward from the state in which the second holding portion 53A holds the substrate 200 .

第２保持部５３Ｂは、第１保持部５２の第１本体６４、第１移動部６５、吸着パッド６７、可動管６８と略同一の構成の、第２本体７１Ｂ、第２移動部７２Ｂ、吸着パッド７４Ｂ、可動管７５Ｂを有する。
第２移動部７２Ｂは、第２本体７１Ｂに対して上下方向に移動できる。第２移動部７２Ｂの吸着パッド７４Ｂは、基板２００を保持する。
第２保持部５３Ｂの吸着パッド７４Ｂに対しても、第１保持部５２の吸着パッド６７に対する基準位置Ｐ５２１、下端位置Ｐ５２２、伸長距離Ｍ５２と同様に、基準位置Ｐ５３Ｂ１、下端位置Ｐ５３Ｂ２、伸長距離Ｍ５３Ｂがそれぞれ規定される（図５及び図６参照）。
伸長距離Ｍ５３Ｂは、第２保持部５３Ｂが基板２００を保持した状態から、第２保持部５３Ｂが下方に伸びる長さである。 The second holding portion 53B includes a second main body 71B, a second moving portion 72B, and a suction unit having substantially the same configuration as the first main body 64, the first moving portion 65, the suction pad 67, and the movable tube 68 of the first holding portion 52. It has a pad 74B and a movable tube 75B.
The second moving portion 72B can move vertically with respect to the second main body 71B. The suction pad 74B of the second moving part 72B holds the substrate 200 .
Similarly to the reference position P 521 , the lower end position P 522 , and the extended distance M 52 for the suction pad 67 of the first holding portion 52, the suction pad 74B of the second holding portion 53B also has a reference position P 53B1 and a lower end position P 53B2 and an extension distance M 53B are defined respectively (see FIGS. 5 and 6).
The extension distance M 53B is the length by which the second holding portion 53B extends downward from the state in which the second holding portion 53B holds the substrate 200 .

第２保持部５３Ｃは、第１本体６４の形状、伸長距離Ｍ５２の設定以外は第１保持部５２と同一の構成である。
第２保持部５３Ｃは、第１保持部５２の第１移動部６５、吸着パッド６７、可動管６８と略同一の構成の、第２移動部７２Ｃ、吸着パッド７４Ｃ、可動管７５Ｃを有する。
第２保持部５３Ｃが有する第２本体７８Ｃは、真っすぐな管状である。第２本体７８Ｃは、上下方向に沿って延び、フレーム５１の第１底板６０に固定される。
以上のように、フレーム５１は、第１本体６４及び第２本体７１Ａ，７１Ｂ，７８Ｃを互いに連結する。
第２保持部５３Ｃの吸着パッド７４Ｃに対しても、第１保持部５２の吸着パッド６７に対する基準位置Ｐ５２１、下端位置Ｐ５２２、伸長距離Ｍ５２と同様に、基準位置Ｐ５３Ｃ１、下端位置Ｐ５３Ｃ２、伸長距離Ｍ５３Ｃがそれぞれ規定される（図５及び図６参照）。
伸長距離Ｍ５３Ｃは、第２保持部５３Ｃが基板２００を保持した状態から、第２保持部５３Ｃが下方に伸びる長さである。 The second holding portion 53C has the same configuration as the first holding portion 52 except for the shape of the first main body 64 and setting of the extension distance M52 .
The second holding portion 53C has a second moving portion 72C, a suction pad 74C, and a movable pipe 75C, which have substantially the same configurations as the first moving portion 65, the suction pad 67, and the movable pipe 68 of the first holding portion 52, respectively.
A second main body 78C of the second holding portion 53C has a straight tubular shape. The second main body 78</b>C extends in the vertical direction and is fixed to the first bottom plate 60 of the frame 51 .
As described above, the frame 51 connects the first main body 64 and the second main bodies 71A, 71B, 78C to each other.
Similarly to the reference position P 521 , the lower end position P 522 , and the extended distance M 52 for the suction pad 67 of the first holding portion 52, the suction pad 74C of the second holding portion 53C also has a reference position P 53C1 and a lower end position P 53C2 and extension distance M 53C are defined respectively (see FIGS. 5 and 6).
The extension distance M 53C is the length by which the second holding portion 53C extends downward from the state in which the second holding portion 53C holds the substrate 200 .

このように、第２保持部５３Ａ，５３Ｂ，５３Ｃは、基板２００を保持した状態からそれぞれ下方に向かって伸びることができる。
図６に示す二点鎖線Ｌ４上に、基準位置Ｐ５３Ａ１，Ｐ５３Ｂ１，Ｐ５３Ｃ１が配置される。
図２に示すように、第２保持部５３Ａ，５３Ｂ，５３Ｃは、各基板２００に対して、基板２００の軸線回りに等角度ごとに配置される。
本実施形態では、伸長距離Ｍ５３Ａ，Ｍ５３Ｂ，Ｍ５３Ｃは、互いに同等である。伸長距離Ｍ５２は、伸長距離Ｍ５３Ａ，Ｍ５３Ｂ，Ｍ５３Ｃよりも、キャリア２０５の厚さ（厚さ方向の長さ）を超えて長い。伸長距離Ｍ５２は、伸長距離Ｍ５３Ａ，Ｍ５３Ｂ，Ｍ５３Ｃよりも、キャリア２０５の厚さの２倍を超えて長いことが好ましい。 In this way, the second holding parts 53A, 53B, 53C can each extend downward from the state where the substrate 200 is held.
Reference positions P 53A1 , P 53B1 , and P 53C1 are arranged on the two-dot chain line L4 shown in FIG.
As shown in FIG. 2, the second holding portions 53A, 53B, and 53C are arranged with respect to each substrate 200 around the axis of the substrate 200 at equal angles.
In this embodiment, extension distances M 53A , M 53B , and M 53C are equivalent to each other. Extension distance M 52 is longer than extension distances M 53A , M 53B , and M 53C by exceeding the thickness (length in the thickness direction) of carrier 205 . Preferably, extension distance M 52 is more than twice the thickness of carrier 205 greater than extension distances M 53A , M 53B , M 53C .

図３に示すように、撮像部５４は、フレーム５１の第２周壁５９に固定される。撮像部５４は、撮像部５４に対して下方に配置された物の像を取得する。撮像部５４は、取得した像を制御部８０に送る。
吸引部は、図示はしないが、吸引ポンプと、複数の開閉弁と、を有する。
吸引ポンプは、図示しないチューブにより第１本体６４、第２本体７１Ａ，７１Ｂ，７１Ｃにそれぞれ接続される。吸引ポンプは、チューブ、第１本体６４、第２本体７１Ａ，７１Ｂ，７１Ｃ、可動管６８，７５Ａ，７５Ｂ，７５Ｃを通して吸着パッド６７，７４Ａ，７４Ｂ，７４Ｃの凹部内の空気を吸引できる。
複数の開閉弁は、複数のチューブを独立して開閉できる。 As shown in FIG. 3 , the imaging section 54 is fixed to the second peripheral wall 59 of the frame 51 . The imaging section 54 acquires an image of an object placed below the imaging section 54 . The imaging unit 54 sends the acquired image to the control unit 80 .
The suction unit has a suction pump and a plurality of on-off valves (not shown).
The suction pumps are connected to the first main body 64 and the second main bodies 71A, 71B, 71C by tubes (not shown). The suction pump can suck the air in the concave portions of the suction pads 67, 74A, 74B, 74C through the tubes, the first main body 64, the second main bodies 71A, 71B, 71C, and the movable tubes 68, 75A, 75B, 75C.
A plurality of on-off valves can independently open and close a plurality of tubes.

図１に示すように、第２搬送装置４６及びセットテーブル２０のそれぞれから近い位置には、複数のキャリア２０５が積み重ねられたストッカ８５がある。ストッカ８５にあるキャリア２０５には、基板２００が収容されていない。
制御部８０は、図示はしないが、ＣＰＵ（Central Processing Unit）、メモリ等を有する。メモリには、ＣＰＵを動作させるための制御プログラム等が記憶される。
制御部８０は、第１搬送装置２５及び研磨装置３０に接続され、第１搬送装置２５及び研磨装置３０を制御する。 As shown in FIG. 1, a stocker 85 in which a plurality of carriers 205 are stacked is located near each of the second conveying device 46 and the set table 20 . The carrier 205 in the stocker 85 does not contain the substrate 200 .
The control unit 80 has a CPU (Central Processing Unit), a memory, etc., although not shown. The memory stores control programs and the like for operating the CPU.
The controller 80 is connected to the first transport device 25 and the polishing device 30 and controls the first transport device 25 and the polishing device 30 .

次に、以上のように構成された研磨設備１を用いた研磨方法について説明する。この研磨方法では、本実施形態の搬送方法を使用する。
予め、搬入装置により、基板２００Ａを収容した搬入バスケット１０を搬送しておく。制御部８０は、第２搬送装置４６により、ストッカ８５内のキャリア２０５を、セットテーブル２０の上面２１上に配置する。研磨部３１の第２定盤は、退避状態になっている。
第２搬送装置４６の吸引部を駆動し、複数の開閉弁を閉じた状態にする。 Next, a polishing method using the polishing equipment 1 configured as described above will be described. This polishing method uses the transport method of the present embodiment.
In advance, the carry-in basket 10 containing the substrates 200A is transported by the carry-in device. The control unit 80 arranges the carrier 205 in the stocker 85 on the upper surface 21 of the set table 20 by the second transport device 46 . The second platen of the polishing section 31 is in a retracted state.
The suction part of the second conveying device 46 is driven to close the plurality of on-off valves.

次に、前記搬送方法を行う。搬送方法では、キャリア２０５と、キャリア２０５の貫通孔２０６内に収容される基板２００Ａとを、セットテーブル２０から研磨装置３０に搬送する。図７は、搬送方法Ｓを示すフローチャートである。
まず、第１収容工程（図７に示すステップＳ１）において、制御部８０は、第１搬送装置２５により、搬入バスケット１０内の基板２００Ａを、セットテーブル２０上のキャリア２０５の貫通孔２０６に収容する。
第１収容工程Ｓ１が終了すると、ステップＳ３に移行する。 Next, the transportation method is performed. In the transfer method, the carrier 205 and the substrate 200A accommodated in the through hole 206 of the carrier 205 are transferred from the set table 20 to the polishing apparatus 30. FIG. FIG. 7 is a flow chart showing the transport method S. As shown in FIG.
First, in the first accommodation step (step S1 shown in FIG. 7), the control unit 80 causes the first transfer device 25 to accommodate the substrates 200A in the carry-in basket 10 in the through holes 206 of the carrier 205 on the set table 20. do.
After the first accommodation step S1 is completed, the process proceeds to step S3.

次に、保持工程（ステップＳ３）において、第２搬送装置４６により、キャリア２０５の外周部及び基板２００Ａを、キャリア２０５及び基板２００Ａが互いに離間するようにそれぞれ保持する。
具体的には、制御部８０はマニピュレータ４７により、図５に示すように、セットテーブル２０上のキャリア２０５及び基板２００に対して、上方から保持部５０を近づけ、第１保持部５２の吸着パッド６７を、キャリア２０５の外周部の上面に接触させる。第２保持部５３Ａ，５３Ｂ，５３Ｃの吸着パッド７４Ａ，７４Ｂ，７４Ｃを、基板２００Ａの上面に接触させる。
複数の開閉弁を開いた状態にすると、吸着パッド６７，７４Ａ，７４Ｂ，７４Ｃの凹部内の空気がそれぞれ吸引され、吸着パッド６７，７４Ａ，７４Ｂ，７４Ｃが潰れるように変形する。第１保持部５２の潰れた吸着パッド６７により、キャリア２０５の外周部が上方から保持され、第２保持部５３Ａ，５３Ｂ，５３Ｃの潰れた吸着パッド７４Ａ，７４Ｂ，７４Ｃにより、基板２００Ａの外周部が上方から保持される。 Next, in the holding step (step S3), the outer peripheral portion of the carrier 205 and the substrate 200A are held by the second transfer device 46 so that the carrier 205 and the substrate 200A are separated from each other.
Specifically, the controller 80 causes the manipulator 47 to bring the holder 50 closer to the carrier 205 and the substrate 200 on the set table 20 from above, as shown in FIG. 67 is brought into contact with the upper surface of the outer periphery of carrier 205 . The suction pads 74A, 74B, 74C of the second holding portions 53A, 53B, 53C are brought into contact with the upper surface of the substrate 200A.
When the plurality of on-off valves are opened, the air in the concave portions of the suction pads 67, 74A, 74B, 74C is respectively sucked, and the suction pads 67, 74A, 74B, 74C are deformed so as to be crushed. The outer peripheral portion of the carrier 205 is held from above by the crushed suction pads 67 of the first holding portion 52, and the outer peripheral portion of the substrate 200A is held by the crushed suction pads 74A, 74B, 74C of the second holding portions 53A, 53B, 53C. is held from above.

そして、マニピュレータ４７により保持部５０を上方に移動させると、図６に示すように、保持部５２，５３Ａ，５３Ｂ，５３Ｃに保持されたキャリア２０５、基板２００Ａが、セットテーブル２０の上面２１から上方に離間する。
このとき、伸長距離Ｍ５２は、伸長距離Ｍ５３Ａ，Ｍ５３Ｂ，Ｍ５３Ｃよりもキャリア２０５の厚さを超えて長い。このため、第１保持部５２により保持されたキャリア２０５が湾曲しない場合であっても、キャリア２０５は、基板２００Ａよりもキャリア２０５の厚さを超えて下方に移動し、キャリア２０５の上面が二点鎖線Ｌ５で示す位置に配置される。第１保持部５２に保持されるキャリア２０５及び第２保持部５３Ａ，５３Ｂ，５３Ｃに保持される基板２００Ａが、互いに離間する When the holder 50 is moved upward by the manipulator 47, the carrier 205 and the substrate 200A held by the holders 52, 53A, 53B, and 53C move upward from the upper surface 21 of the set table 20, as shown in FIG. to separate.
At this time, extension distance M 52 is longer than extension distances M 53A , M 53B , and M 53C beyond the thickness of carrier 205 . Therefore, even if the carrier 205 held by the first holding portion 52 does not bend, the carrier 205 moves below the substrate 200A beyond the thickness of the carrier 205, and the upper surface of the carrier 205 is doubled. It is arranged at the position indicated by the dotted chain line L5. The carrier 205 held by the first holding part 52 and the substrate 200A held by the second holding parts 53A, 53B, 53C are separated from each other.

さらに、キャリア２０５の中央部（キャリア２０５における厚さ方向に見たときの中央部）は、キャリア２０５に作用する重力により下方に向かって凸となるように湾曲する。
この場合、湾曲するキャリア２０５の変位の最大値（図６中に示す最大撓み量Ｍ１）は、シミュレーションにより２ｍｍ程度であることが分かっている。
キャリア２０５が下方に向かって凸となるように湾曲することにより、第１保持部５２に保持されるキャリア２０５及び第２保持部５３Ａ，５３Ｂ，５３Ｃに保持される基板２００Ａが、互いにさらに離間する。
このように、本実施形態では、保持工程Ｓ３では、キャリア２０５よりも基板２００Ａが上方に位置するように保持する。 Further, the central portion of the carrier 205 (the central portion of the carrier 205 when viewed in the thickness direction) is curved downward due to the gravity acting on the carrier 205 .
In this case, the maximum value of displacement of the curved carrier 205 (maximum amount of deflection M 1 shown in FIG. 6) is found to be about 2 mm by simulation.
The carrier 205 held by the first holding portion 52 and the substrate 200A held by the second holding portions 53A, 53B, 53C are further separated from each other by curving the carrier 205 so as to protrude downward. .
Thus, in this embodiment, the substrate 200A is held above the carrier 205 in the holding step S3.

第２搬送装置４６によりキャリア２０５及び基板２００Ａを搬送する間に、図８に示すように、キャリア２０５の中央部が上下方向に振動することがある。図８中に、上方に向かって凸となるように湾曲したキャリア２０５を、二点鎖線Ｌ７で示す。
このため、前記伸長距離Ｍ５２は、伸長距離Ｍ５３Ａ，Ｍ５３Ｂ，Ｍ５３Ｃよりも、最大撓み量Ｍ１の２倍を超えて長いことがより好ましい。
保持工程Ｓ３が終了すると、ステップＳ５に移行する。 While the carrier 205 and the substrate 200A are being transported by the second transporting device 46, the central portion of the carrier 205 may vibrate vertically as shown in FIG. In FIG. 8, the carrier 205 curved upward is indicated by a chain double-dashed line L7.
Therefore, it is more preferable that the extension distance M52 is longer than the extension distances M53A , M53B , and M53C by more than twice the maximum bending amount M1 .
After the holding step S3 ends, the process proceeds to step S5.

次に、平坦化工程（ステップＳ５）において、第１定盤３２の支持面３２ａ上にキャリア２０５を配置してキャリア２０５を平坦にする。そして、キャリア２０５を平坦にしたときに、基板２００Ａをキャリア２０５よりも上方に離間させる。具体的には、制御部８０はマニピュレータ４７により、支持面３２ａの上方に保持部５０を移動させる。そして、保持部５０を下方に移動させることにより、支持面３２ａ上に保持部５０の保持部５２，５３Ａ，５３Ｂ，５３Ｃが保持するキャリア２０５及び基板２００Ａを降ろしていく。
支持面３２ａ上にキャリア２０５を配置したときには、図６中に二点鎖線Ｌ５で示すようにキャリア２０５が平坦になるため、基板２００Ａはキャリア２０５よりも上方に離間している。 Next, in the flattening step (step S5), the carrier 205 is placed on the support surface 32a of the first platen 32 and flattened. Then, the substrate 200A is spaced above the carrier 205 when the carrier 205 is flattened. Specifically, the controller 80 causes the manipulator 47 to move the holder 50 above the support surface 32a. By moving the holder 50 downward, the carrier 205 and the substrate 200A held by the holders 52, 53A, 53B, and 53C of the holder 50 are lowered onto the support surface 32a.
When the carrier 205 is placed on the supporting surface 32a, the carrier 205 is flattened as indicated by the two-dot chain line L5 in FIG.

支持面３２ａ上にキャリア２０５を配置する際に、制御部８０は、撮像部５４が取得した、研磨部３１における、内歯車３４の歯部３９及び太陽歯車３３の歯部３７の像を用いて、内歯車３４の複数の歯部３９及び太陽歯車３３の複数の歯部３７にキャリア２０５の複数の歯部２０７を嵌め合わせることが好ましい。
平坦化工程Ｓ５が終了すると、ステップＳ７に移行する。 When arranging the carrier 205 on the support surface 32a, the control unit 80 uses the images of the teeth 39 of the internal gear 34 and the teeth 37 of the sun gear 33 in the polishing unit 31 acquired by the imaging unit 54. , the teeth 39 of the internal gear 34 and the teeth 37 of the sun gear 33 are preferably fitted with the teeth 207 of the carrier 205 .
After the planarization step S5 is completed, the process proceeds to step S7.

次に、第２収容工程（収容工程）（ステップＳ７）において、支持面３２ａ上において、キャリア２０５の貫通孔２０６内に、上方から基板２００Ａを収容させる。具体的には、制御部８０はマニピュレータ４７により保持部５０を下方に移動させて、キャリア２０５の貫通孔２０６内に基板２００Ａを収容させる。
第２搬送装置４６の複数の開閉弁を閉じ、保持部５２，５３Ａ，５３Ｂ，５３Ｃによるキャリア２０５及び基板２００Ａの保持を解除する。マニピュレータ４７により、保持部５０を支持面３２ａ上から退避させる。
第２収容工程Ｓ７が終了すると、搬送方法Ｓの全工程が終了し、キャリア２０５及び基板２００Ａが、セットテーブル２０から研磨装置３０に搬送される。 Next, in a second accommodation step (accommodation step) (step S7), the substrate 200A is accommodated from above in the through holes 206 of the carrier 205 on the support surface 32a. Specifically, the controller 80 causes the manipulator 47 to move the holder 50 downward to accommodate the substrate 200A in the through hole 206 of the carrier 205 .
A plurality of on-off valves of the second transfer device 46 are closed to release the carrier 205 and the substrate 200A from being held by the holding portions 52, 53A, 53B, and 53C. The manipulator 47 retracts the holding portion 50 from the support surface 32a.
When the second housing step S7 is finished, all steps of the transfer method S are finished, and the carrier 205 and the substrate 200A are transferred from the set table 20 to the polishing apparatus 30. FIG.

制御部８０は、研磨部３１の第２定盤を挟み状態にし、第１定盤３２及び第２定盤を軸線Ｏ１周りの所定の向きに回転させるとともに、太陽歯車３３及び内歯車３４の少なくとも一方を軸線Ｏ１周りに回転させる。
第１定盤３２、第２定盤等を所定の時間回転させると、第１定盤３２及び第２定盤により、基板２００Ａの厚さ方向を向く面が研磨され、基板２００Ａが、研磨された後の基板２００Ｂとなる。
制御部８０は、研磨部３１の第２定盤を退避状態にする。
制御部８０は、前記搬送方法と同様の方法により、キャリア２０５と、キャリア２０５の貫通孔２０６内に収容される基板２００Ｂとを、研磨装置３０からセットテーブル２０の上面２１上に搬送する。
制御部８０は、第１搬送装置２５により、セットテーブル２０上の基板２００Ｂを、搬出バスケット１５内に収容する。基板２００Ｂが収容された搬出バスケット１５は、適宜搬出装置により研磨設備１から搬出される。 The control unit 80 puts the second surface plate of the polishing unit 31 in a sandwiched state, rotates the first surface plate 32 and the second surface plate in a predetermined direction around the axis O1, and rotates the sun gear 33 and the internal gear 34 at least. One side is rotated around the axis O1.
When the first surface plate 32, the second surface plate, etc. are rotated for a predetermined time, the surface facing the thickness direction of the substrate 200A is polished by the first surface plate 32 and the second surface plate, and the substrate 200A is polished. It becomes the substrate 200B after being processed.
The control unit 80 puts the second surface plate of the polishing unit 31 in a retracted state.
The control unit 80 transfers the carrier 205 and the substrate 200B accommodated in the through hole 206 of the carrier 205 from the polishing apparatus 30 onto the upper surface 21 of the set table 20 by the same transfer method.
The control unit 80 causes the substrate 200B on the set table 20 to be accommodated in the unloading basket 15 by the first transport device 25 . The unloading basket 15 containing the substrate 200B is unloaded from the polishing facility 1 by a suitable unloading device.

以上の工程を繰り返すことにより、研磨設備１により基板２００Ａが連続的に研磨される。 By repeating the above steps, the polishing equipment 1 continuously polishes the substrate 200A.

以上説明したように、本実施形態の第２搬送装置４６では、セットテーブル２０の上面２１上で、貫通孔２０６内に基板２００Ａが収容されたキャリア２０５及び基板２００Ａを支持する。そして、第２搬送装置４６を用いて、第１保持部５２によりキャリア２０５の外周部を上方から保持し、第２保持部５３により貫通孔２０６内の基板２００Ａを保持する。第２搬送装置４６により上面２１上からキャリア２０５及び基板２００Ａを持ち上げ、キャリア２０５及び基板２００Ａを搬送すると、キャリア２０５に作用する重力により、キャリア２０５の中央部が最も下方に撓み、キャリア２０５が下方に向かって凸となるように湾曲する。この際に、第１保持部５２及び第２保持部５３の両方を下方に向かって伸ばすことにより、第１保持部５２に保持されるキャリア２０５及び第２保持部５３に保持される基板２００Ａを互いに離間させる。すると、キャリア２０５及び基板２００Ａの搬送中に、基板２００Ａがキャリア２０５に接触したり、キャリア２０５及び基板２００Ａが上下方向に重なったりするのが抑制される。
従って、キャリア２０５及び基板２００Ａの搬送中に、第２搬送装置４６から基板２００Ａが落下するのを抑制することができる。 As described above, the second transport device 46 of the present embodiment supports the substrate 200A and the carrier 205 containing the substrate 200A in the through hole 206 on the upper surface 21 of the set table 20 . Then, using the second transport device 46 , the first holding portion 52 holds the outer peripheral portion of the carrier 205 from above, and the second holding portion 53 holds the substrate 200</b>A in the through hole 206 . When the carrier 205 and the substrate 200A are lifted from the upper surface 21 by the second transport device 46 and transported, the center of the carrier 205 bends most downward due to the gravity acting on the carrier 205, and the carrier 205 moves downward. It curves so that it becomes convex toward. At this time, by extending both the first holding portion 52 and the second holding portion 53 downward, the carrier 205 held by the first holding portion 52 and the substrate 200A held by the second holding portion 53 are moved. keep them apart from each other. This prevents the substrate 200A from contacting the carrier 205 and the carrier 205 and the substrate 200A from overlapping each other in the vertical direction during transportation of the carrier 205 and the substrate 200A.
Therefore, it is possible to prevent the substrate 200A from falling from the second transport device 46 while the carrier 205 and the substrate 200A are being transported.

キャリア２０５が第１保持部５２に保持され、貫通孔２０６内に収容された基板２００Ａが第２保持部５３に保持された状態から、第１保持部５２が下方に伸びる長さである伸長距離Ｍ５２は、第２保持部５３が下方に伸びる長さである伸長距離Ｍ５３Ａ，Ｍ５３Ｂ，Ｍ５３Ｃよりも、キャリア２０５の厚さを超えて長い。このため、第１保持部５２に保持されるキャリア２０５及び第２保持部５３に保持される基板２００Ａがほぼ同じ高さに配置された状態から、基板２００Ａよりもキャリア２０５を、キャリア２０５の厚さを超えて下方に配置することができる。キャリア２０５の中央部は、キャリア２０５に作用する重力により下方に向かって凸となるように湾曲するため、キャリア２０５及び基板２００Ａの搬送中に基板２００Ａがキャリア２０５に接触するのを、確実に抑制することができる。 An extension distance that is the length by which the first holding portion 52 extends downward from a state in which the carrier 205 is held by the first holding portion 52 and the substrate 200A accommodated in the through hole 206 is held by the second holding portion 53 M52 is longer than the thickness of the carrier 205 than extension distances M53A , M53B , and M53C , which are the lengths of the downward extension of the second holding portion 53. As shown in FIG. Therefore, from a state in which the carrier 205 held by the first holding portion 52 and the substrate 200A held by the second holding portion 53 are arranged at approximately the same height, the carrier 205 is positioned higher than the substrate 200A and the thickness of the carrier 205 is increased. can be placed downward beyond the height. Since the central portion of the carrier 205 is curved downward due to the gravity acting on the carrier 205, it is possible to reliably prevent the substrate 200A from contacting the carrier 205 while the carrier 205 and the substrate 200A are being transported. can do.

第２搬送装置４６は、フレーム５１を有する。第１保持部５２の第１本体６４及び第２保持部５３の第２本体７１Ａ，７１Ｂ，７１Ｃを互いに連結するフレーム５１により、第１移動部６５により保持されるキャリア２０５の外周部、及び第２移動部７２Ａ，７２Ｂ，７２Ｃにより保持される基板２００Ａの、上下方向における相対的な位置の精度を高めることができる。
また、本実施形態の研磨装置３０では、第２搬送装置４６により、遊星歯車装置式の研磨部３１における、内歯車３４の複数の歯部３９及び太陽歯車３３の複数の歯部３７にキャリア２０５の複数の歯部２０７を嵌め合わせる。そして、内歯車３４及び太陽歯車３３の少なくとも一方を回転させることによりキャリア２０５を回転させ、キャリア２０５に収容される基板２００Ａの上下方向を向く面を研磨することができる。 The second transport device 46 has a frame 51 . The frame 51 connecting the first main body 64 of the first holding part 52 and the second main bodies 71A, 71B, 71C of the second holding part 53 to each other allows the outer peripheral part of the carrier 205 held by the first moving part 65 and the It is possible to increase the accuracy of the relative position in the vertical direction of the substrate 200A held by the two moving parts 72A, 72B, and 72C.
In addition, in the polishing apparatus 30 of the present embodiment, the carrier 205 is transferred to the plurality of teeth 39 of the internal gear 34 and the plurality of teeth 37 of the sun gear 33 in the planetary gear type polishing section 31 by the second conveying device 46 . The plurality of teeth 207 are fitted together. By rotating at least one of the internal gear 34 and the sun gear 33, the carrier 205 is rotated, and the up-down surface of the substrate 200A accommodated in the carrier 205 can be polished.

また、本実施形態の搬送方法Ｓでは、保持工程Ｓ３におけるキャリア２０５及び基板２００Ａの搬送中、及び平坦化工程Ｓ５における第１定盤３２の支持面３２ａ上にキャリア２０５を配置する際に、基板２００Ａがキャリア２０５に接触したり、キャリア２０５及び基板２００Ａが厚さ方向に重なったりするのがそれぞれ抑制される。保持工程Ｓ３及び平坦化工程Ｓ５の後で、第２収容工程Ｓ７において、キャリア２０５の貫通孔２０６内に、上方から基板２００Ａを収容させる。
従って、キャリア２０５及び基板２００Ａの搬送中に、基板２００Ａが落下するのを抑制することができる。
保持工程Ｓ３では、キャリア２０５よりも基板２００Ａが上方に位置するように保持する。従って、平坦化工程Ｓ５において支持面３２ａ上にキャリア２０５を配置する際に基板２００Ａが支障とならないため、平坦化工程Ｓ５を容易に行うことができる。 Further, in the transport method S of the present embodiment, during the transport of the carrier 205 and the substrate 200A in the holding step S3 and when the carrier 205 is placed on the support surface 32a of the first platen 32 in the flattening step S5, the substrate The contact of the carrier 200A with the carrier 205 and the overlapping of the carrier 205 and the substrate 200A in the thickness direction are suppressed. After the holding step S3 and the flattening step S5, the substrate 200A is accommodated in the through holes 206 of the carrier 205 from above in the second accommodating step S7.
Therefore, it is possible to prevent the substrate 200A from falling while the carrier 205 and the substrate 200A are being transported.
In the holding step S3, the substrate 200A is held above the carrier 205. As shown in FIG. Therefore, since the substrate 200A does not interfere with placing the carrier 205 on the support surface 32a in the planarization step S5, the planarization step S5 can be easily performed.

以上、本発明の一実施形態について図面を参照して詳述したが、具体的な構成はこの実施形態に限られるものではなく、本発明の要旨を逸脱しない範囲の構成の変更、組み合わせ、削除等も含まれる。
例えば、前記実施形態の搬送方法では、保持工程において、第１保持部５２のみを、キャリア２０５を保持した状態から下方に向かって伸ばし、第２保持部５３Ａ，５３Ｂ，５３Ｃは、基板２００Ａを保持した状態から伸ばさなくてもよい。このように構成しても、伸長距離Ｍ５２が、キャリア２０５の厚さを超えて長ければ、キャリア２０５よりも基板２００Ａを上方に位置させることができる。 As described above, one embodiment of the present invention has been described in detail with reference to the drawings, but the specific configuration is not limited to this embodiment, and the configuration can be changed, combined, or deleted without departing from the scope of the present invention. etc. are also included.
For example, in the carrying method of the above embodiment, in the holding step, only the first holding part 52 extends downward from the carrier 205 holding state, and the second holding parts 53A, 53B, 53C hold the substrate 200A. You don't have to stretch it out. Even with this configuration, the substrate 200A can be positioned above the carrier 205 if the extension distance M52 exceeds the thickness of the carrier 205. FIG.

同様に、保持工程において、保持部５０を上方に移動させつつ、第２保持部のみを上方に向かって縮ませてもよい。保持工程において、保持部５０を上方に移動させつつ、第１保持部及び第２保持部を上方に向かって縮ませてもよい。これらの方法によっても、キャリア２０５よりも基板２００Ａを上方に位置させることができる。 Similarly, in the holding step, only the second holding portion may be contracted upward while moving the holding portion 50 upward. In the holding step, the first holding portion and the second holding portion may be contracted upward while moving the holding portion 50 upward. The substrate 200A can be positioned above the carrier 205 also by these methods.

保持工程では、キャリア２０５よりも基板２００Ａが下方に位置するように保持したり、キャリア２０５及び基板２００Ａを水平面に沿って位置をずらして保持してもよい。
第１定盤３２の支持面３２ａ及びセットテーブル２０の上面２１は、それぞれ水平面に対して傾斜していてもよい。
第２搬送装置４６が備える第１保持部５２の数及び第２保持部５３の数は、限定されない。 In the holding step, the substrate 200A may be held below the carrier 205, or the carrier 205 and the substrate 200A may be held with their positions shifted along the horizontal plane.
The support surface 32a of the first platen 32 and the upper surface 21 of the set table 20 may each be inclined with respect to the horizontal plane.
The number of the first holding portions 52 and the number of the second holding portions 53 included in the second conveying device 46 are not limited.

３０ 研磨装置
３１ 研磨部
３２ 第１定盤（定盤）
３２ａ 支持面
３３ 太陽歯車
３４ 内歯車
３７，３９，２０７ 歯部
４６ 第２搬送装置（搬送装置）
５１ フレーム（連結部材）
５２ 第１保持部
５３，５３Ａ，５３Ｂ，５３Ｃ 第２保持部
６４ 第１本体
６５ 第１移動部
７１Ａ，７１Ｂ，７８Ｃ 第２本体
７２Ａ，７２Ｂ，７２Ｃ 第２移動部
２００ 基板
２０５ キャリア
２０６ 貫通孔
Ｓ 搬送方法
Ｓ３ 保持工程
Ｓ５ 平坦化工程
Ｓ７ 第２収容工程（収容工程） 30 polishing device 31 polishing section 32 first surface plate (surface plate)
32a support surface 33 sun gear 34 internal gear 37, 39, 207 teeth 46 second transfer device (transfer device)
51 frame (connecting member)
52 first holding portion 53, 53A, 53B, 53C second holding portion 64 first main body 65 first moving portion 71A, 71B, 78C second main body 72A, 72B, 72C second moving portion 200 substrate 205 carrier 206 through hole S Conveying method S3 Holding process S5 Flattening process S7 Second accommodation process (accommodation process)

Claims (6)

平板状に形成され貫通孔が設けられたキャリアと、前記貫通孔内に収容される基板と、を搬送する搬送装置であって、
前記キャリアの外周部を、前記キャリアの厚さ方向から保持する第１保持部と、
前記貫通孔内の前記基板を、前記厚さ方向から保持する第２保持部と、
を備え、
前記第１保持部に保持される前記キャリア及び前記第２保持部に保持される前記基板が互いに離間するように、前記第１保持部及び前記第２保持部の少なくとも一方が、前記厚さ方向に伸びるか縮むことができる、搬送装置。 A transport device for transporting a carrier formed in a flat plate shape and provided with a through hole, and a substrate accommodated in the through hole,
a first holding portion that holds the outer peripheral portion of the carrier from the thickness direction of the carrier;
a second holding part that holds the substrate in the through hole from the thickness direction;
with
At least one of the first holding part and the second holding part is arranged in the thickness direction so that the carrier held by the first holding part and the substrate held by the second holding part are separated from each other. A conveying device that can expand or contract. 前記キャリアが前記第１保持部に保持され、前記貫通孔内に収容された前記基板が前記第２保持部に保持された状態から、
前記第１保持部が前記厚さ方向の一方側に伸びる長さは、前記第２保持部が前記厚さ方向の前記一方側に伸びる長さよりも、前記キャリアの厚さを超えて長い、請求項１に記載の搬送装置。 From a state in which the carrier is held by the first holding portion and the substrate accommodated in the through hole is held by the second holding portion,
The length in which the first holding portion extends to one side in the thickness direction is longer than the length in which the second holding portion extends to the one side in the thickness direction, exceeding the thickness of the carrier. Item 1. The conveying device according to Item 1. 前記第１保持部は、
第１本体と、
前記第１本体に対して前記厚さ方向に移動でき、前記キャリアの外周部を保持する第１移動部と、を有し、
前記第２保持部は、
第２本体と、
前記第２本体に対して前記厚さ方向に移動でき、前記基板を保持する第２移動部と、を有し、
前記第１本体及び前記第２本体を互いに連結する連結部材を備える、請求項１又は２に記載の搬送装置。 The first holding part is
a first body;
a first moving part capable of moving in the thickness direction with respect to the first main body and holding an outer peripheral part of the carrier;
The second holding part is
a second body;
a second moving part capable of moving in the thickness direction with respect to the second body and holding the substrate;
3. The conveying device according to claim 1, comprising a connecting member that connects the first body and the second body to each other. 前記キャリアの外周縁には、複数の歯部が設けられ、
定盤の支持面上で回転し、前記キャリアの前記複数の歯部に嵌め合う内歯車及び太陽歯車を有し、前記基板の厚さ方向を向く面を研磨する遊星歯車装置式の研磨部と、
請求項１から３のいずれか一項に記載の搬送装置と、
を備え、
前記搬送装置は、前記内歯車の複数の歯部及び前記太陽歯車の複数の歯部に前記キャリアの前記複数の歯部を嵌め合わせる、研磨装置。 A plurality of teeth are provided on the outer peripheral edge of the carrier,
a polishing unit of a planetary gear system that rotates on the support surface of the platen, has an internal gear and a sun gear that are fitted to the plurality of teeth of the carrier, and polishes the surface of the substrate facing the thickness direction; ,
A conveying device according to any one of claims 1 to 3;
with
The conveying device is a polishing device, wherein the plurality of teeth of the carrier are fitted to the plurality of teeth of the internal gear and the plurality of teeth of the sun gear. 平板状に形成され貫通孔が設けられたキャリアと、前記貫通孔内に収容される基板と、を搬送する搬送方法であって、
前記キャリアの外周部及び前記基板を、前記キャリア及び前記基板が互いに離間するようにそれぞれ保持する保持工程と、
支持面上に前記キャリアを配置して前記キャリアを平坦にするとともに、前記キャリアを平坦にしたときに、前記基板を前記キャリアよりも上方に離間させる平坦化工程と、
前記キャリアの前記貫通孔内に、上方から前記基板を収容させる収容工程と、
を行う、搬送方法。 A transport method for transporting a carrier formed in a flat plate shape and provided with a through hole, and a substrate accommodated in the through hole,
a holding step of respectively holding the outer peripheral portion of the carrier and the substrate so that the carrier and the substrate are separated from each other;
a flattening step of placing the carrier on a support surface to flatten the carrier, and spacing the substrate above the carrier when the carrier is flattened;
an accommodating step of accommodating the substrate from above in the through hole of the carrier;
method of transportation. 前記保持工程では、前記キャリアよりも前記基板が上方に位置するように保持する、請求項５に記載の搬送方法。 6. The transfer method according to claim 5, wherein in said holding step, said substrate is held so as to be positioned above said carrier.
JP2022027113A 2022-02-24 2022-02-24 Conveyance device, polishing device, and conveyance method Pending JP2023123191A (en)

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JP2022027113A JP2023123191A (en) 2022-02-24 2022-02-24 Conveyance device, polishing device, and conveyance method
CN202380023010.4A CN118743009A (en) 2022-02-24 2023-02-20 Conveying device, polishing device, and conveying method
KR1020247027619A KR20240137631A (en) 2022-02-24 2023-02-20 Return device, polishing device, and return method
PCT/JP2023/005963 WO2023162922A1 (en) 2022-02-24 2023-02-20 Conveyor, polishing device, and conveying method
TW112106477A TW202403945A (en) 2022-02-24 2023-02-22 Conveyor, polishing device, and conveying method

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JP6101175B2 (en) * 2013-08-28 2017-03-22 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Semiconductor wafer polishing method
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