JP2023183742A - Nozzle position adjustment method and substrate processing device - Google Patents

Abstract

To provide a nozzle position adjustment method and a substrate processing device that can adjust a liquid supply position with high precision.SOLUTION: The total value of a first distance by which a nozzle travels from the separated position until the engagement surface comes into contact with the end surface of a jig plate and a second distance required to move the nozzle in a posture in which the engagement surface is in contact with the end surface of the jig plate along the radial direction to the processing position is calculated as the nozzle movement distance. Then, when substrate processing is performed, the nozzle is positioned at the processing position by moving the nozzle from the separated position by the nozzle movement distance.SELECTED DRAWING: Figure 9

Description

The present invention relates to a nozzle position adjustment method for adjusting the position of a nozzle in the radial direction of a substrate, and a substrate processing technique for supplying a processing liquid to a substrate from a nozzle whose position has been adjusted by the nozzle position adjustment method.

2. Description of the Related Art A substrate processing apparatus is known that performs chemical processing, cleaning processing, etc. by supplying processing liquid from a nozzle to a substrate such as a semiconductor wafer while rotating the substrate (for example, Patent Document 1).

JP 2019-149423 Publication

When processing a substrate, the nozzle is positioned above the substrate, and then a processing liquid is ejected from an ejection port provided at the tip of the nozzle toward the upper surface of the substrate. For example, in the apparatus described in Patent Document 1, an etching liquid is supplied as a processing liquid to the peripheral edge of a rotating substrate held by a spin chuck. As a result, the thin film formed on the periphery of the upper surface of the substrate is etched away in a strip or donut shape. This is called bevel processing (or bevel etching processing), and corresponds to an example of the "substrate processing" of the present invention. In bevel processing, the dimensional accuracy of the width of the band-shaped region (hereinafter referred to as etching width) must be strictly controlled. For this purpose, it is necessary to adjust with high precision the position at which the processing liquid is supplied to the substrate (hereinafter referred to as "liquid supply position") in the radial direction of the substrate.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a nozzle position adjustment method and a substrate processing apparatus that can adjust the liquid supply position with high precision.

A first aspect of the present invention includes a rotation holding unit that holds and rotates a substrate around a rotation axis extending in the vertical direction, a nozzle that supplies a processing liquid for processing the substrate to the substrate, and a nozzle that rotates the substrate in a radial direction of the substrate. A nozzle position adjustment method for positioning a nozzle at a processing position in a radial direction in order to supply a processing liquid to a preset position from an end surface of a substrate in a substrate processing apparatus comprising a nozzle moving unit that moves the nozzle to a predetermined position from an end surface of the substrate. The first step is to hold a jig plate having the same shape as the rotary holder, and the second step is to position the nozzle at a separate position away from the rotary holder, and the engaging surface of the nozzle is held in the rotary holder. A third step in which the nozzle starts moving from the separated position to the jig plate in a posture facing the end surface of the jig plate, and a period from execution of the third step until the engagement surface comes into contact with the end surface of the jig plate. A fourth step is to measure the first distance that the nozzle has moved, and a second step is to measure the second distance required to move the nozzle in a posture where the engagement surface is in contact with the end surface of the jig plate along the radial direction to the processing position. a fifth step of calculating the nozzle movement distance by adding the nozzle movement distance to the first distance, and the first to fifth steps are executed before substrate processing, while the second step is executed when substrate processing is executed. After that, the nozzle is positioned at the processing position by moving the nozzle in the radial direction by the nozzle movement distance.

A second aspect of the present invention is a substrate processing apparatus, which includes a rotation holding unit that holds and rotates a substrate around a rotation axis extending in the vertical direction, and a rotation holding unit that supplies a processing liquid for substrate processing to the substrate. A nozzle, a nozzle moving unit that moves the nozzle in the radial direction of the substrate, and controlling the nozzle moving unit so that the nozzle is located at a processing position for supplying a processing liquid to a preset position from an end surface of the substrate. a control section, the control section is configured to move a nozzle located at a distance radially away from the rotation holding section to a processing position using a jig plate having the same shape as the substrate before processing the substrate. It has a calibration section that calculates the required nozzle movement distance, and a nozzle positioning section that positions the nozzle at the processing position by moving the nozzle from the separation position by the nozzle movement distance in the radial direction, and the calibration section After the nozzle starts moving from the separated position to the jig plate with the engagement surface facing the end face of the jig plate held by the rotating holding part, the engagement surface touches the end face of the jig plate. A measurement unit that measures a first distance that the nozzle has moved before contacting the nozzle, and a second distance that is required to move the nozzle in a posture where the engagement surface is in contact with the end surface of the jig plate along the radial direction to the processing position. and a movement distance calculation unit that calculates the nozzle movement distance by adding the nozzle movement distance to the first distance.

Conventionally, the nozzle travel distance required to move the nozzle from the remote position to the processing position has been determined by operator work. Therefore, the nozzle moving distance varies among operators, and this is one of the main causes of a decrease in the accuracy of the liquid supply position. On the other hand, in the inventions according to the first and second aspects, the nozzle movement distance is determined by the sum of the first distance and the second distance described above. In other words, the nozzle movement distance can be determined without intervening operator work. Therefore, by moving the nozzle by the nozzle movement distance (=first distance+second distance) from the separated position, the nozzle is positioned at the processing position with high precision.

Further, a third aspect of the present invention includes a rotation holding unit that holds and rotates the substrate around a rotation axis extending in the vertical direction, a nozzle that supplies a processing liquid for substrate processing to the substrate, and a nozzle that supplies the substrate with a processing liquid for processing the substrate. A nozzle position adjustment method for positioning a nozzle at a processing position in a radial direction in order to supply a processing liquid to a preset position from an end surface of a substrate in a substrate processing apparatus equipped with a nozzle moving unit that moves in a radial direction. , a seventh step in which a jig plate having the same shape as the substrate is held in a rotating holding section, an eighth step in which the nozzle is positioned at a separate position away from the rotating holding section, and before and after the eighth step, A ninth step of attaching the position adjustment jig to the nozzle so as to face the end surface of the held jig plate, and a ninth step of attaching the position adjustment jig to the nozzle so as to face the end surface of the jig plate from the separated position. a 10th step in which the nozzle starts moving; an 11th step in which the nozzle moves from execution of the 10th step until the position adjustment jig comes into contact with the end surface of the jig plate; and a 11th step in which the nozzle moves. a twelfth step of calculating the nozzle movement distance by adding a fourth distance required to move the nozzle in a posture in which the tool is in contact with the end surface of the jig plate along the radial direction to the processing position to the third distance; In preparation, the seventh to twelfth steps are executed before substrate processing, while when substrate processing is performed, the nozzle is moved in the radial direction by the nozzle movement distance after the eighth step is executed. , the nozzle is positioned at the processing position.

Further, a fourth aspect of the present invention is a substrate processing apparatus, which includes a rotation holding unit that holds and rotates a substrate around a rotation axis extending in the vertical direction, and a rotation holding unit that supplies a processing liquid for substrate processing to the substrate. A nozzle, a nozzle moving unit that moves the nozzle in the radial direction of the substrate, and controlling the nozzle moving unit so that the nozzle is located at a processing position for supplying a processing liquid to a preset position from an end surface of the substrate. a control section, the control section is configured to move a nozzle located at a distance radially away from the rotation holding section to a processing position using a jig plate having the same shape as the substrate before processing the substrate. It has a calibration section that calculates the required nozzle movement distance, and a nozzle positioning section that positions the nozzle at the processing position by moving the nozzle from the separation position by the nozzle movement distance in the radial direction, and the calibration section After the position adjustment jig attached to the rotary holder starts moving the nozzle from the separated position to the jig plate in a posture facing the end face of the jig plate held by the rotation holding part, the position adjustment jig A measurement unit that measures a third distance traveled by the nozzle until it comes into contact with the end surface of the plate, and a position adjustment jig that moves the nozzle in a position where it is in contact with the end surface of the jig plate along the radial direction to the processing position. and a moving distance calculating section that calculates a nozzle moving distance by adding a fourth distance required for the third distance to the third distance.

In the inventions according to the third and fourth aspects, the nozzle movement distance is determined by the sum of the third distance and the fourth distance described above. In other words, the nozzle movement distance can be determined without intervening operator work. Therefore, by moving the nozzle by the nozzle movement distance (=third distance + fourth distance) from the separated position, the nozzle is positioned at the processing position with high precision.

In the invention configured in this way, the nozzle movement distance is determined without intervening operator work, and the nozzle position is adjusted based on the nozzle movement distance, so the liquid supply position can be adjusted with high precision. Can be done.

1 is a plan view showing a schematic configuration of a substrate processing system equipped with a first embodiment of a substrate processing apparatus according to the present invention. 1 is a diagram showing the configuration of a first embodiment of a substrate processing apparatus according to the present invention. 3 is a plan view taken along the line AA in FIG. 2. FIG. FIG. 3 is a diagram showing the dimensional relationship between a substrate held by a spin chuck and a rotating cup portion. FIG. 3 is a perspective view showing a treatment liquid discharge nozzle on the upper surface side that is installed in the treatment mechanism in the first embodiment. FIG. 7 is a perspective view showing a processing liquid discharge nozzle on the upper surface side that is installed in the processing mechanism in the second embodiment. FIG. 3 is a block diagram showing functions executed by a calculation processing section of the substrate processing apparatus shown in FIG. 2. FIG. 3 is a flowchart showing bevel processing performed by the substrate processing apparatus shown in FIG. 2. FIG. 3 is a flowchart showing calibration processing included in bevel processing. FIG. 3 is a schematic diagram showing each part of the apparatus during calibration processing. FIG. 3 is a schematic diagram showing various parts of the apparatus during bevel processing. It is a flow chart which shows calibration processing in a 2nd embodiment. FIG. 7 is a schematic diagram showing each part of the apparatus during calibration processing in the second embodiment. 7 is a graph showing an example of eccentricity of a jig wafer after centering processing.

FIG. 1 is a plan view showing a schematic configuration of a substrate processing system equipped with a first embodiment of a substrate processing apparatus according to the present invention. This is a schematic diagram that does not show the external appearance of the substrate processing system 100, but clearly shows the internal structure of the substrate processing system 100 by excluding the outer wall panel and other parts of the structure. This substrate processing system 100 is installed in, for example, a clean room, and is a single-wafer type device that processes one substrate W on which a circuit pattern or the like (hereinafter referred to as a "pattern") is formed only on one main surface. Then, the nozzle position adjustment method according to the present invention is executed in the processing unit 1 installed in the substrate processing system 100. In this specification, the pattern-formed surface (one main surface) on which a pattern is formed among both main surfaces of the substrate is referred to as the "front surface", and the other main surface on the opposite side, on which no pattern is formed, is referred to as the "back surface". It is called. Further, the surface facing downward is referred to as the "lower surface", and the surface facing upward is referred to as the "upper surface". Furthermore, in this specification, the term "pattern-formed surface" refers to a surface on which a concavo-convex pattern is formed in an arbitrary region of the substrate.

Here, the "substrate" in this embodiment includes a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, a substrate for an FED (Field Emission Display), a substrate for an optical disk, and a substrate for a magnetic disk. Various substrates such as substrates and magneto-optical disk substrates can be applied. The following description will be made with reference to the drawings, taking as an example a substrate processing apparatus mainly used for processing semiconductor wafers, but the invention is similarly applicable to the processing of the various substrates exemplified above.

As shown in FIG. 1, the substrate processing system 100 includes a substrate processing section 110 that processes a substrate W, and an indexer section 120 coupled to the substrate processing section 110. The indexer unit 120 has a container C for accommodating the substrates W (FOUP (Front Opening Unified Pod), SMIF (Standard Mechanical Interface) pod, OC (Open Cassette), etc. that accommodates a plurality of substrates W in a sealed state). It has a container holding part 121 that can hold a plurality of containers. The indexer section 120 is also an indexer for accessing the container C held in the container holding section 121 and taking out an unprocessed substrate W from the container C or storing a processed substrate W in the container C. A robot 122 is provided. Each container C accommodates a plurality of substrates W in a substantially horizontal posture.

The indexer robot 122 includes a base portion 122a fixed to the device housing, a multi-joint arm 122b rotatable around a vertical axis with respect to the base portion 122a, and a hand attached to the tip of the multi-joint arm 122b. 122c. The hand 122c has a structure that allows the substrate W to be placed and held on its upper surface. An indexer robot having such a multi-joint arm and a hand for holding a substrate is well known, so a detailed description thereof will be omitted.

The substrate processing unit 110 includes a mounting table 112 on which an indexer robot 122 places a substrate W, a substrate transfer robot 111 arranged approximately at the center in a plan view, and a plurality of substrate transfer robots 111 arranged so as to surround the substrate transfer robot 111. A processing unit 1 is provided. Specifically, a plurality of processing units 1 are arranged facing the space where the substrate transfer robot 111 is arranged. For these processing units 1, the substrate transfer robot 111 randomly accesses the mounting table 112 and transfers the substrate W to and from the mounting table 112. On the other hand, each processing unit 1 executes a predetermined process on a substrate W, and corresponds to a substrate processing apparatus according to the present invention. In this embodiment, these processing units (substrate processing apparatuses) 1 have the same function. Therefore, parallel processing of multiple substrates W is possible. Note that if the substrate transfer robot 111 can directly transfer the substrate W from the indexer robot 122, the mounting table 112 is not necessarily required.

FIG. 2 is a diagram showing the configuration of the first embodiment of the substrate processing apparatus according to the present invention. 3 is a plan view taken along the line AA in FIG. 2. FIG. In FIGS. 2, 3, and the figures referred to below, the dimensions and numbers of each part may be exaggerated or simplified for ease of understanding. The substrate processing apparatus (processing unit) 1 includes a rotation mechanism 2, a scattering prevention mechanism 3, an upper surface protection heating mechanism 4, a processing mechanism 5, an atmosphere separation mechanism 6, an elevating mechanism 7, a centering mechanism 8, and a substrate observation mechanism 9. . Each of these parts 2 to 9 is housed in the internal space 12 of the chamber 11 and is electrically connected to a control unit 10 that controls the entire apparatus. Each section 2 to 9 operates according to instructions from the control unit 10.

As the control unit 10, for example, one similar to a general computer can be adopted. That is, in the control unit 10, each part of the substrate processing apparatus 1 is controlled by a CPU serving as a main control part performing arithmetic processing according to a procedure described in a program. Note that the detailed configuration and operation of the control unit 10 will be described in detail later. Further, in this embodiment, the control unit 10 is provided for each substrate processing apparatus 1, but a configuration may be adopted in which a plurality of substrate processing apparatuses 1 are controlled by one control unit. Further, the substrate processing apparatus 1 may be configured to be controlled by a control unit (not shown) that controls the entire substrate processing system 100.

As shown in FIG. 2, a fan filter unit (FFU) 13 is attached to the ceiling wall 11a of the chamber 11. This fan filter unit 13 further purifies the air in the clean room in which the substrate processing apparatus 1 is installed and supplies the purified air to the processing space in the chamber 11 . The fan filter unit 13 is equipped with a fan and a filter (for example, a HEPA (High Efficiency Particulate Air) filter) for taking in air in the clean room and sending it out into the chamber 11. to supply clean air. As a result, a downflow of clean air is formed in the processing space within the chamber 11 . Further, in order to uniformly disperse the clean air supplied from the fan filter unit 13, a punching plate 14 having a large number of blowing holes is provided directly below the ceiling wall 11a.

As shown in FIGS. 1 and 3, in the substrate processing apparatus 1, a shutter 15 is provided on the side surface of the chamber 11. A shutter opening/closing mechanism (not shown) is connected to the shutter 15, and opens and closes the shutter 15 in response to opening/closing commands from the control unit 10. More specifically, in the substrate processing apparatus 1, when carrying the unprocessed substrate W into the chamber 11, the shutter opening/closing mechanism opens the shutter 15, and the hand (not shown) of the substrate transfer robot 111 moves the unprocessed substrate W into the chamber 11. is carried into the spin chuck (corresponding to an example of the "rotation holding part" of the present invention) 21 of the rotation mechanism 2 in a face-up position. That is, the substrate W is placed on the spin chuck 21 with the upper surface Wf facing upward. Then, when the hand of the substrate transfer robot 111 retreats from the chamber 11 after carrying in the substrate, the shutter opening/closing mechanism closes the shutter 15. Then, bevel processing is performed on the peripheral edge portion Ws of the substrate W within the processing space of the chamber 11 (corresponding to a sealed space SPs to be described in detail later). Further, after the bevel processing is finished, the shutter opening/closing mechanism opens the shutter 15 again, and the hand of the substrate transfer robot 111 carries out the processed substrate W from the spin chuck 21. In this manner, in this embodiment, the internal space 12 of the chamber 11 is maintained at room temperature. In this specification, "normal temperature" means a temperature range of 5°C to 35°C.

The rotation mechanism 2 has a function of rotating the substrate W while holding it in a substantially horizontal position with its surface facing upward, and also synchronously rotating a part of the scattering prevention mechanism 3 in the same direction as the substrate W. have. The rotation mechanism 2 rotates the substrate W and the rotation cup portion 31 of the scattering prevention mechanism 3 around a vertical rotation axis AX passing through the center of the main surface. In order to clearly indicate the members and parts that are integrally rotated by the rotation mechanism 2, dots are attached to the parts to be rotated in FIG.

The rotation mechanism 2 includes a spin chuck 21 that is a disc-shaped member smaller than the substrate W. The spin chuck 21 is provided so that its upper surface is substantially horizontal and its center axis coincides with the rotation axis AX. A cylindrical rotating shaft portion 22 is connected to the lower surface of the spin chuck 21 . The rotating shaft portion 22 extends in the vertical direction with its axis aligned with the rotating shaft AX. Further, a rotation drive unit (for example, a motor) 23 is connected to the rotation shaft unit 22 . The rotation drive section 23 rotates the rotation shaft section 22 around its axis in response to a rotation command from the control unit 10. Therefore, the spin chuck 21 is rotatable around the rotation axis AX together with the rotation shaft portion 22. The rotation drive section 23 and the rotation shaft section 22 have a function of rotating the spin chuck 21 around the rotation axis AX, and the lower end of the rotation shaft section 22 and the rotation drive section 23 are housed in a cylindrical casing 24. has been done.

A through hole (not shown) is provided in the center of the spin chuck 21 and communicates with the internal space of the rotating shaft portion 22 . A pump 26 is connected to the internal space via a pipe 25 provided with a valve (not shown). The pump 26 and the valve are electrically connected to the control unit 10 and operate according to commands from the control unit 10. As a result, negative pressure and positive pressure are selectively applied to the spin chuck 21. For example, when the pump 26 applies negative pressure to the spin chuck 21 with the substrate W placed on the upper surface of the spin chuck 21 in a substantially horizontal position, the spin chuck 21 attracts and holds the substrate W from below. On the other hand, when the pump 26 applies positive pressure to the spin chuck 21, the substrate W can be removed from the top surface of the spin chuck 21. Further, when the suction of the pump 26 is stopped, the substrate W becomes horizontally movable on the upper surface of the spin chuck 21.

A nitrogen gas supply section 29 is connected to the spin chuck 21 via a pipe 28 provided at the center of the rotating shaft section 22 . The nitrogen gas supply unit 29 supplies room-temperature nitrogen gas supplied from a utility in the factory where the substrate processing system 100 is installed to the spin chuck 21 at a flow rate and timing according to a nitrogen gas supply command from the control unit 10. Then, on the lower surface Wb side of the substrate W, nitrogen gas is caused to flow from the center to the outside in the radial direction. Note that although nitrogen gas is used in this embodiment, other inert gases may be used. The same applies to the heated gas discharged from the central nozzle, which will be described later. Moreover, "flow rate" means the amount by which a fluid such as nitrogen gas moves per unit time.

The rotation mechanism 2 includes a power transmission section 27 in order to not only rotate the spin chuck 21 integrally with the substrate W but also rotate the rotary cup section 31 in synchronization with the rotation. The power transmission section 27 includes an annular member 27a made of a non-magnetic material or resin, a magnet 27b built into the annular member 27a, and a magnet built into a lower cup 32, which is a component of the rotating cup section 31. 27c. The annular member 27a is attached to the rotating shaft portion 22 and is rotatable together with the rotating shaft portion 22 around the rotating axis AX. On the outer peripheral edge of the annular member 27a, a plurality of magnets 27b (36 in this embodiment) are arranged radially around the rotation axis AX at equal angular intervals (10 degrees in this embodiment). In this embodiment, one of the two adjacent magnets 27b is arranged so that the outer and inner sides are N and S poles, respectively, and the other is arranged so that the outer and inner sides are S and N poles, respectively. It is located.

Similar to these magnets 27b, a plurality of magnets 27c (36 in this embodiment) are arranged radially around the rotation axis AX at equal angular intervals (10 degrees in this embodiment). These magnets 27c are built into the lower cup 32. The lower cup 32 is a component of the scattering prevention mechanism 3, which will be described next, and has an annular shape. That is, the lower cup 32 has an inner peripheral surface that can face the outer peripheral surface of the annular member 27a. The inner diameter of this inner peripheral surface is larger than the outer diameter of the annular member 27a. Then, the lower cup 32 is placed concentrically with the rotating shaft portion 22 and the annular member 27a, with the inner circumferential surface facing away from the outer circumferential surface of the annular member 27a by a predetermined distance (=(inner diameter - outer diameter)/2). It is arranged in a shape. An engaging pin and a connecting magnet are provided on the upper surface of the outer periphery of the lower cup 32, and the upper cup 33 is connected to the lower cup 32 by these, and this connecting body functions as the rotating cup portion 31.

The lower cup 32 is rotatably supported around the rotation axis AX in the above arrangement state by a bearing not shown in the drawings. At the inner peripheral edge of the lower cup 32, a plurality of magnets 27c (36 in this embodiment) are arranged radially around the rotation axis AX at equal angular intervals (10 degrees in this embodiment). Further, the arrangement of the two adjacent magnets 27c is also similar to that of the magnet 27b. That is, on the one hand, the outer side and the inner side are arranged as north and south poles, respectively, and on the other hand, the outer side and the inner side are arranged as south poles and north poles, respectively.

In the power transmission section 27 configured in this way, when the annular member 27a is rotated together with the rotating shaft section 22 by the rotary drive section 23, the lower cup 32 is moved into an air gap (circle) due to the magnetic force between the magnets 27b and 27c. It rotates in the same direction as the annular member 27a while maintaining the gap between the annular member 27a and the lower cup 32. As a result, the rotating cup portion 31 rotates around the rotation axis AX. That is, the rotating cup portion 31 rotates in the same direction as the substrate W and in synchronization with the substrate W.

The scattering prevention mechanism 3 includes a rotating cup part 31 that can rotate around the rotation axis AX while surrounding the outer periphery of the substrate W held by the spin chuck 21, and a fixed cup part that is fixedly provided so as to surround the rotating cup part 31. 34. The rotating cup portion 31 is provided so as to be rotatable around the rotation axis AX while surrounding the outer periphery of the rotating substrate W by connecting the upper cup 33 to the lower cup 32 .

FIG. 4 is a diagram showing the dimensional relationship between the substrate held by the spin chuck and the rotating cup portion. The lower cup 32 has an annular shape. The outer diameter of the lower cup 32 is larger than the outer diameter of the substrate W, and the lower cup 32 is arranged to be rotatable around the rotation axis AX in a state in which it protrudes in the radial direction from the substrate W held by the spin chuck 21 when viewed vertically from above. has been done. In the protruding area, that is, the upper peripheral edge 321 of the lower cup 32, engaging pins and flat lower magnets that stand vertically upward along the circumferential direction are attached alternately, and the total number of engaging pins is is three, and the total number of lower magnets is three. These engagement pins and lower magnets are arranged radially around the rotation axis AX at equal angular intervals (60 degrees in this embodiment).

On the other hand, the upper cup 33 has a lower annular part 331, an upper annular part 332, and an inclined part 333 connecting these parts, as shown in FIGS. 2, 3, and 4. The outer diameter D331 of the lower annular portion 331 is the same as the outer diameter D32 of the lower cup 32, and the lower annular portion 331 is located vertically above the peripheral edge 321 of the lower cup 32.

The upper cup 33 can be raised and lowered in the vertical direction by the raising and lowering mechanism 7. When the upper cup 33 is moved upward by the lifting mechanism 7, a transport space for loading and unloading the substrate W is formed between the upper cup 33 and the lower cup 32 in the vertical direction. On the other hand, when the upper cup 33 is moved downward by the lifting mechanism 7, the upper cup 33 is positioned horizontally with respect to the lower cup 32 by the action of the engagement pin and the coupling magnet, and the upper cup 33 and the lower cup 32 are coupled to each other. As a result, as shown in the partially enlarged view of FIG. 3, the upper cup 33 and the lower cup 32 are integrated in the vertical direction with a gap GPc extending in the horizontal direction being formed. The rotary cup portion 31 is rotatable around the rotation axis AX while forming the gap GPc.

In the rotary cup portion 31, as shown in FIG. 4, the outer diameter D332 of the upper annular portion 332 is slightly smaller than the outer diameter D331 of the lower annular portion 331. Also, when comparing the diameters d331 and d332 of the inner circumferential surfaces of the lower annular portion 331 and the upper annular portion 332, the lower annular portion 331 is larger than the upper annular portion 332, and when viewed in plan from vertically above, the lower annular portion 331 is larger than the upper annular portion 332. , the inner circumferential surface of the upper annular portion 332 is located inside the inner circumferential surface of the lower annular portion 331. The inner circumferential surface of the upper annular portion 332 and the inner circumferential surface of the lower annular portion 331 are connected by the inclined portion 333 over the entire circumference of the upper cup 33. Therefore, the inner circumferential surface of the inclined portion 333, that is, the surface surrounding the substrate W, forms an inclined surface 334. That is, as shown in FIG. 8, the inclined portion 333 can surround the outer periphery of the rotating substrate W to collect droplets scattered from the substrate W, and forms a space surrounded by the upper cup 33 and the lower cup 32. functions as a collection space SPc.

Furthermore, the inclined portion 333 facing the collection space SPc is inclined upward from the lower annular portion 331 to the peripheral edge of the substrate W. Therefore, the droplets collected on the inclined portion 333 flow along the inclined surface 334 to the lower end of the upper cup 33, that is, the lower annular portion 331, and further to the outside of the rotating cup portion 31 via the gap GPc. It can be discharged.

The fixed cup part 34 is provided so as to surround the rotating cup part 31, and forms a discharge space SPe. As shown in FIG. 2, the fixed cup part 34 has a liquid receiving part 341 and an exhaust part 342 provided inside the liquid receiving part 341. The liquid receiving portion 341 has a cup structure that opens so as to face the opening on the side opposite to the substrate of the gap GPc (the opening on the right side in the partially enlarged view in FIG. 3). That is, the internal space of the liquid receiving part 341 functions as a discharge space SPe, and is communicated with the collection space SPc via the gap GPc. Therefore, the droplets collected by the rotary cup portion 31 are guided to the discharge space SPe through the gap GPc together with the gas component. The droplets are then collected at the bottom of the liquid receiving portion 341 and drained from the fixed cup portion 34. Meanwhile, gaseous components are collected at exhaust site 342. This exhaust section 342 is connected to the exhaust mechanism 38. Therefore, by operating the exhaust mechanism 38 in response to a command from the control unit 10, the pressure in the fixed cup portion 34 is adjusted, and the gas component within the exhaust portion 342 is efficiently exhausted. Moreover, the pressure and flow rate of the exhaust space SPe are adjusted by precise control of the exhaust mechanism 38. For example, the pressure in the discharge space SPe is lower than the pressure in the collection space SPc. As a result, the droplets in the collection space SPc can be efficiently drawn into the discharge space SPe, and the movement of the droplets from the collection space SPc can be promoted.

The upper surface protection heating mechanism 4 has a blocking plate 41 arranged above the upper surface Wf of the substrate W held by the spin chuck 21, as shown in FIGS. 2 and 3. This blocking plate 41 has a disk portion 42 held in a horizontal position. The disk portion 42 has a built-in heater 421 that is driven and controlled by a heater drive portion 422 . This disk portion 42 has a slightly smaller diameter than the substrate W. The disk portion 42 is supported by the support member 43 so that the lower surface of the disk portion 42 covers the surface area of the upper surface Wf of the substrate W excluding the peripheral edge portion Ws from above. A notch 44 is provided at the peripheral edge of the disc portion 42 . The cutout portion 44 is open radially outward. This prevents the disk portion 42 from interfering with the processing liquid discharge nozzle included in the processing mechanism 5. That is, the treatment liquid discharge nozzle is capable of reciprocating in the radial direction X within the notch space formed by the notch portion 44 and extending radially outward.

The lower end portion of the support member 43 is attached to the center portion of the disc portion 42. A cylindrical through hole is formed to vertically penetrate the support member 43 and the disk portion 42 . Further, a central nozzle 45 is inserted vertically into the through hole. This central nozzle 45 is connected to a nitrogen gas supply section 47 via a pipe 46, as shown in FIG. The nitrogen gas supply unit 47 supplies room-temperature nitrogen gas, which is supplied from the utilities of the factory where the substrate processing system 100 is installed, to the central nozzle 45 at a flow rate and timing according to a nitrogen gas supply command from the control unit 10. . Further, in this embodiment, a ribbon heater 48 is attached to a part of the pipe 46. The ribbon heater 48 generates heat in response to a heating command from the control unit 10 and heats the nitrogen gas flowing inside the pipe 46 .

The nitrogen gas heated in this way (hereinafter referred to as "heated gas") is forced toward the central nozzle 45 and is discharged from the central nozzle 45. By supplying heating gas while the disk portion 42 is positioned at a processing position close to the substrate W held by the spin chuck 21, the heating gas is applied to the upper surface Wf of the substrate W and the disk portion 42 with a built-in heater. It flows from the center of the space between the two toward the periphery. This makes it possible to suppress the atmosphere around the substrate W from entering the upper surface Wf of the substrate W. As a result, droplets contained in the atmosphere can be effectively prevented from being drawn into the space sandwiched between the substrate W and the disk portion 42. Further, the entire upper surface Wf is heated by the heating by the heater 421 and the heating gas, and the in-plane temperature of the substrate W can be made uniform. Thereby, it is possible to suppress the substrate W from warping and to stabilize the position where the processing liquid lands.

As shown in FIG. 2, the upper end portion of the support member 43 is fixed to a beam member 49 extending in a horizontal direction perpendicular to the substrate conveyance direction (left-right direction in FIG. 3) in which the substrate W is carried in and out. This beam member 49 is connected to the lifting mechanism 7, and is raised and lowered by the lifting mechanism 7 in response to commands from the control unit 10. For example, in FIG. 2, the beam member 49 is positioned downward, so that the disk portion 42 connected to the beam member 49 via the support member 43 is located at the processing position. On the other hand, when the lifting mechanism 7 raises the beam member 49 in response to a lifting command from the control unit 10, the beam member 49, the support member 43, and the disc part 42 rise integrally, and the upper cup 33 also moves in conjunction. The cup 32 separates from the lower cup 32 and rises. This widens the space between the spin chuck 21, the upper cup 33, and the disk portion 42, and it becomes possible to carry the substrate W into and out of the spin chuck 21.

As shown in FIGS. 2 and 3, the processing mechanism 5 includes a processing liquid discharge nozzle 51F arranged on the upper surface side of the substrate W, a processing liquid discharge nozzle 51B arranged on the lower surface side of the substrate W, and a processing liquid discharge nozzle 51B arranged on the lower surface side of the substrate W. It has a processing liquid supply section 52 that supplies processing liquid to the nozzles 51F and 51B. Hereinafter, in order to distinguish the processing liquid discharge nozzle 51F on the upper surface side and the processing liquid discharge nozzle 51B on the lower surface side, they will be referred to as "upper surface nozzle 51F" and "lower surface nozzle 51B", respectively. Furthermore, although two processing liquid supply sections 52 are illustrated in FIG. 2, they are the same.

FIG. 5A is a perspective view showing a processing liquid discharge nozzle on the upper surface side that is installed in the processing mechanism. In this embodiment, three upper surface nozzles 51F are provided, and a processing liquid supply section 52 is connected to them. In addition, the processing liquid supply unit 52 is configured to be able to supply SC1, DHF, and functional water (CO2 water, etc.) as processing liquids, and SC1, DHF, and functional water are each independently discharged from the three upper nozzles 51F. It is possible.

In each upper surface nozzle 51F, a nozzle main body portion 51F1 and an engaging portion 51F2 integrated with the nozzle main body portion 51F1 are integrated. The engaging portion 51F2 can be made of a material having higher hardness than the nozzle body portion 51F1, such as PBI (POLYBENZIMIDAZOLE) or amorphous carbon. As shown in the enlarged view in FIG. 3, the surface of the engaging portion 51F2 exposed toward the center of the substrate W functions as the engaging surface 512 during the calibration process, as will be described later.

A discharge port 511 for discharging the processing liquid is provided on the lower surface of the tip of the nozzle body portion 51F1. As shown in the enlarged view in FIG. 3, the lower part of the plurality of (three in this embodiment) upper surface nozzles 51F is shaped like a disk, with each discharge port 511 facing toward the peripheral edge of the upper surface Wf of the substrate W. The upper nozzle 51F is disposed in the notch 44 of the portion 42, and the upper part of the upper nozzle 51F is movable integrally with the nozzle holder 53 in the radial direction X of the substrate W. This nozzle holder 53 is connected to a nozzle moving section 54. This nozzle moving section 54 has a function of moving the upper surface nozzles 51F in the radial direction X all at once. Therefore, the nozzle moving unit 54 collectively drives the three upper surface nozzles 51F in the direction X in response to a nozzle movement command from the control unit 10. This nozzle movement command includes information regarding the nozzle movement distance, which will be described in detail later. When the upper surface nozzle 51F is moved by the designated nozzle movement distance in the radial direction X based on this information, the upper surface nozzle 51F is positioned at the bevel processing position (see symbol Pt in FIGS. 9 and 10). As a result, the processing liquid is supplied from the upper surface nozzle 51F to a preset position from the end surface of the substrate W. In order to position the nozzle 51F at the bevel processing position with high precision in this manner, in this embodiment, a calibration process is executed prior to the bevel processing on the substrate W. This calibration process will be explained later along with the configuration and operation of the nozzle moving section 54.

The discharge port 511 of the upper surface nozzle 51F positioned at the bevel processing position is directed toward the peripheral edge of the upper surface Wf of the substrate W. Then, in response to a supply command from the control unit 10, the processing liquid supply section 52 supplies the processing liquid corresponding to the supply command among the three types of processing liquids to the upper nozzle 51F for the processing liquid. The processing liquid is discharged from the discharge port 511 onto the peripheral edge of the upper surface Wf of the substrate W.

Further, a lower sealing cup member 61 of the atmosphere separation mechanism 6 is detachably fixed to a part of the components of the nozzle moving section 54. That is, when performing bevel processing, the upper surface nozzle 51F and the nozzle holder 53 are integrated with the lower sealing cup member 61 via the nozzle moving part 54, and are vertically moved together with the lower sealing cup member 61 by the lifting mechanism 7. It is raised and lowered in direction Z. On the other hand, when performing the calibration process, the lower sealing cup member 61 is removed, the upper surface nozzle 51F and the nozzle holder 53 are reciprocated in the radial direction be raised and lowered.

In this embodiment, in order to discharge the processing liquid toward the peripheral edge of the lower surface Wb of the substrate W, the lower surface nozzle 51B and the nozzle support part 57 are provided below the substrate W held by the spin chuck 21. The nozzle support portion 57 has a thin cylindrical portion 571 extending in the vertical direction, and a flange portion 572 having an annular shape that is folded outward in the radial direction at the upper end of the cylindrical portion 571. The cylindrical portion 571 has a shape that can be freely inserted into the air gap formed between the annular member 27a and the lower cup 32. As shown in FIG. 2, the nozzle support portion 57 is arranged so that the cylindrical portion 571 is loosely inserted into the air gap and the flange portion 572 is located between the substrate W held by the spin chuck 21 and the lower cup 32. are fixedly placed. Three lower nozzles 51B are attached to the upper peripheral edge of the flange portion 572. Each lower surface nozzle 51B has a discharge port (not shown) that opens toward the peripheral edge of the lower surface Wb of the substrate W, and can discharge the processing liquid supplied from the processing liquid supply section 52 via the piping 58. It becomes.

The processing liquid discharged from the upper nozzle 51F and the lower nozzle 51B performs bevel processing on the peripheral edge of the substrate W. Further, on the lower surface side of the substrate W, a flange portion 572 is extended to the vicinity of the peripheral edge portion Ws. Therefore, the nitrogen gas supplied to the lower surface side via the pipe 28 flows into the collection space SPc along the flange portion 572. As a result, droplets are effectively prevented from flowing back to the substrate W from the collection space SPc.

The atmosphere separation mechanism 6 includes a lower sealed cup member 61 and an upper sealed cup member 62. Both the lower sealing cup member 61 and the upper sealing cup member 62 have a cylindrical shape that is open upward and downward. The inner diameters of these parts are larger than the outer diameter of the rotary cup part 31, and the atmosphere separation mechanism 6 supports the spin chuck 21, the substrate W held by the spin chuck 21, the rotary cup part 31, and the upper surface protection heating mechanism 4 from above. More specifically, as shown in FIG. 2, the upper sealing cup member 62 is arranged to completely surround the punching plate 14, so that the upper opening covers the opening 11b of the ceiling wall 11a from below. is placed in a fixed position. Therefore, the downflow of clean air introduced into the chamber 11 is divided into one that passes through the inside of the upper sealing cup member 62 and one that passes outside the upper sealing cup member 62 .

Further, the lower end portion of the upper sealing cup member 62 has a flange portion 621 having an annular shape that is folded inward. An O-ring 63 is attached to the upper surface of this flange portion 621. A lower hermetic cup member 61 is disposed inside the upper hermetic cup member 62 so as to be movable in the vertical direction.

The upper end portion of the lower sealing cup member 61 has a flange portion 611 having an annular shape that is folded outward. This flange portion 611 overlaps with the flange portion 621 in plan view from vertically above. Therefore, when the lower sealing cup member 61 is lowered, the flange portion 611 of the lower sealing cup member 61 is locked with the flange portion 621 of the upper sealing cup member 62 via the O-ring 63, as shown in FIGS. 3 and 14. be done. Thereby, the lower sealing cup member 61 is positioned at the lower limit position. At this lower limit position, the upper sealing cup member 62 and the lower sealing cup member 61 are connected in the vertical direction, and the downflow introduced into the inside of the upper sealing cup member 62 is guided toward the substrate W held by the spin chuck 21. be done.

The lower end portion of the lower sealing cup member 61 has a flange portion 612 that is folded outward and has an annular shape. This flange portion 612 overlaps with the upper end portion of the fixed cup portion 34 (the upper end portion of the liquid receiving portion 341) in a plan view from vertically above. Therefore, at the lower limit position, the flange portion 612 of the lower sealing cup member 61 is locked by the fixed cup portion 34 via the O-ring 64, as shown in the enlarged view in FIG. Thereby, the lower sealed cup member 61 and the fixed cup part 34 are connected in the vertical direction, and a sealed space SPs is formed by the upper sealed cup member 62, the lower sealed cup member 61, and the fixed cup part 34. Bevel processing on the substrate W can be performed within this sealed space SPs. That is, by positioning the lower sealed cup member 61 at the lower limit position, the sealed space SPs is separated from the outer space SPo of the sealed space SPs (atmosphere separation). Therefore, bevel processing can be stably performed without being affected by the outside atmosphere. Furthermore, although a processing liquid is used to perform the bevel processing, it is possible to reliably prevent the processing liquid from leaking from the closed space SPs to the outer space SPo. Therefore, the degree of freedom in selecting and designing components to be placed in the outer space SPo is increased.

The lower sealing cup member 61 is configured to be movable vertically upward as well. Further, as described above, the nozzle head 56 (=upper surface nozzle 51F+nozzle holder 53) is fixed to the intermediate portion of the lower sealing cup member 61 in the vertical direction via a part of the nozzle moving section 54. In addition to this, as shown in FIGS. 2 and 3, the upper surface protection heating mechanism 4 is fixed to the intermediate portion of the lower sealing cup member 61 via a beam member 49. That is, as shown in FIG. 3, the lower sealing cup member 61 is connected to one end of the beam member 49, the other end of the beam member 49, and the nozzle moving part 54 at three different locations in the circumferential direction. . Then, as the elevating mechanism 7 moves up and down one end of the beam member 49, the other end of the beam member 49, and the nozzle moving section 54, the lower sealing cup member 61 also moves up and down accordingly.

On the inner circumferential surface of the lower sealing cup member 61, as shown in FIGS. 2, 3, and 14, a plurality of protrusions 613 (four protrusions) are provided inwardly as engagement portions capable of engaging with the upper cup 33. ) is installed protrudingly. Each protrusion 613 extends to the space below the upper annular portion 332 of the upper cup 33. Further, each protrusion 613 is attached so as to be spaced downward from the upper annular portion 332 of the upper cup 33 with the lower sealing cup member 61 positioned at the lower limit position. As the lower sealing cup member 61 rises, each protrusion 613 can engage with the upper annular portion 332 from below. Even after this engagement, the upper cup 33 can be separated from the lower cup 32 by further raising the lower sealing cup member 61.

In this embodiment, after the lower sealing cup member 61 begins to rise together with the upper surface protection heating mechanism 4 and the nozzle head 56 by the lifting mechanism 7, the upper cup 33 also rises together. As a result, the upper cup 33, the upper surface protection heating mechanism 4, and the nozzle head 56 are separated upward from the spin chuck 21. By moving the lower sealed cup member 61 to the retracted position, a transfer space is created for the hand of the substrate transfer robot 111 to access the spin chuck 21 . The loading of the substrate W onto the spin chuck 21 and the unloading of the substrate W from the spin chuck 21 can be performed through the transfer space. In this manner, in this embodiment, the substrate W can be accessed to the spin chuck 21 by raising the lower sealing cup member 61 with the minimum amount by the lifting mechanism 7.

The elevating mechanism 7 has two elevating drive parts 71 and 72. As shown in FIG. 3, the elevating drive unit 71 is provided with a first elevating motor 711. The first lifting motor 711 operates in response to a drive command from the control unit 10 to generate rotational force. Two lifting parts 712 and 713 are connected to this first lifting motor 711. The elevating parts 712 and 713 simultaneously receive the rotational force from the first elevating motor 711. Then, the elevating section 712 moves the support member 491 that supports one end of the beam member 49 up and down in the vertical direction Z according to the amount of rotation of the first elevating motor 711. Further, the elevating section 713 moves the nozzle moving section 54, which supports the nozzle head 56 and moves it in the radial direction X, up and down in the vertical direction Z according to the amount of rotation of the first elevating motor 711.

As shown in FIG. 3, the elevating drive section 72 includes a second elevating motor 721 and an elevating section 722. The second elevating motor 721 operates in response to a drive command from the control unit 10 to generate rotational force and applies it to the elevating section 722 . The elevating section 722 vertically moves the support member 492 that supports the other end of the beam member 49 according to the amount of rotation of the second elevating motor 721 .

The elevating and lowering drive units 71 and 72 synchronously move support members 491, 492, and 54, which are respectively fixed at three different locations in the circumferential direction of the lower sealing cup member 61, in the vertical direction. Therefore, the upper surface protection heating mechanism 4, the nozzle head 56, and the lower sealing cup member 61 can be moved up and down stably. Further, as the lower sealing cup member 61 is raised and lowered, the upper cup 33 can also be raised and lowered stably.

The centering mechanism 8 includes an abutting member 81 that can approach and move away from the end surface of the substrate W loaded onto the spin chuck 21, and a centering drive unit 82 that moves the abutting member 81 in the horizontal direction. ing. In this embodiment, three radial contact members 81 are arranged at equal angular intervals around the rotation axis AX, and only one of them is illustrated in FIG. 2 . This centering mechanism 8 performs centering in response to a centering command from the control unit 10 while the pump 26 stops suction (that is, while the substrate W is horizontally movable on the upper surface of the spin chuck 21). The drive unit 82 brings the contact member 81 close to the substrate W (centering process). This centering process eliminates the eccentricity of the substrate W with respect to the spin chuck 21, and the center of the substrate W coincides with the center of the spin chuck 21.

The substrate observation mechanism 9 has an observation head 91 for observing the peripheral edge of the substrate W. This observation head 91 is configured to be able to approach and move away from the peripheral edge of the substrate W. An observation head drive unit 92 is connected to the observation head 91 . When observing the peripheral edge of the substrate W using the observation head 91, the observation head driving section 92 moves the observation head 91 close to the substrate W in response to an observation command from the control unit 10 (observation processing). Then, the peripheral edge of the substrate W is imaged using the observation head 91. The captured image is sent to the control unit 10. Based on this image, the control unit 10 checks whether the bevel processing has been performed satisfactorily.

The control unit 10 includes an arithmetic processing section 10A, a storage section 10B, a reading section 10C, an image processing section 10D, a drive control section 10E, a communication section 10F, and an exhaust control section 10G. The storage unit 10B is composed of a hard disk drive and the like, and stores programs for executing calibration processing and bevel processing by the substrate processing apparatus 1. The program is stored, for example, in a computer-readable recording medium RM (for example, an optical disk, a magnetic disk, a magneto-optical disk, etc.), is read from the recording medium RM by the reading section 10C, and is stored in the storage section 10B. . Further, provision of the program is not limited to the recording medium RM, and the program may be provided via a telecommunications line, for example. The image processing unit 10D performs various processes on the image captured by the board observation mechanism 9. The drive control section 10E controls each drive section of the substrate processing apparatus 1. The communication unit 10F communicates with a control unit that integrates and controls each unit of the substrate processing system 100. The exhaust control section 10G controls the exhaust mechanism 38.

Further, the control unit 10 is connected to a display section 10H (for example, a display) that displays various information and an input section 10J (for example, a keyboard, a mouse, etc.) that receives input from an operator.

The arithmetic processing unit 10A is composed of a computer having a CPU (=Central Processing Unit), a RAM (=Random Access Memory), etc., and processes each part of the substrate processing apparatus 1 as follows according to a program stored in the storage unit 10B. Control as follows to execute calibration processing and bevel processing. In order to execute these processes, the arithmetic processing unit 10A performs the functions shown in FIG. 6 by executing the above program.

FIG. 6 is a block diagram showing functions executed by the arithmetic processing section of the substrate processing apparatus shown in FIG. 2. The calculation processing section 10A includes a calibration section 10K and a nozzle positioning section 10L. The calibration unit 10K uses a jig wafer having the same shape as the substrate W (corresponding to an example of the "jig plate" of the present invention) to move to a home position (reference numeral in FIG. 9) away from the spin chuck 21 in the radial direction The nozzle movement distance required to move the upper surface nozzle 51F located at the bevel processing position Pt (see Ph) is determined. In order to perform this function, the calibration section 10K includes a measurement section 10K1 and a movement distance calculation section 10K2. The measurement unit 10K1 moves the top nozzle 51F from the home position to the jig wafer in a posture such that the engagement surface 512 of the top nozzle 51F faces the end surface of the jig wafer (symbol JW in FIG. 9) held by the spin chuck 21. After starting to move, the first distance that the upper surface nozzle 51F has moved until the engagement surface 512 comes into contact with the end surface of the jig wafer is measured. Furthermore, the movement distance calculation unit 10K2 stores a second distance M2 required to move the upper surface nozzle 51F in a posture in which the engagement surface 512 is in contact with the end surface of the jig wafer to the bevel processing position along the radial direction X. The nozzle movement distance is calculated by reading the distance from the unit 10B and adding it to the first distance.

On the other hand, the nozzle positioning section 10L positions the upper surface nozzle 51F based on the nozzle movement distance calculated by the calibration section 10K. More specifically, the nozzle positioning unit 10L positions the upper nozzle 51F at the bevel processing position by moving the upper nozzle 51F from the separated position in the radial direction X by the nozzle movement distance.

FIG. 7 is a flowchart showing bevel processing performed by the substrate processing apparatus shown in FIG. FIG. 8 is a flowchart showing the calibration process included in the bevel process. FIG. 9 is a schematic diagram showing each part of the apparatus during calibration processing. FIG. 10 is a schematic diagram showing each part of the apparatus during bevel processing. Here, after explaining the configuration of the nozzle moving unit 54, the nozzle position adjustment executed in the calibration process and the bevel process will be explained in detail.

As shown in FIGS. 9 and 10, the nozzle moving section 54 is attached to the upper end of the lifter 713a of the elevating section 713 while holding the nozzle head 56 (=top nozzle 51F+nozzle holder 53). Therefore, when the lifter 713a expands and contracts in the vertical direction in response to a lift command from the control unit 10, the nozzle moving section 54 and the nozzle head 56 move in the vertical direction Z accordingly.

Further, in the nozzle moving section 54, a base member 541 is fixed to the upper end of the lifter 713a. A linear actuator 542 is attached to this base member 541. The linear actuator 542 includes a motor (hereinafter referred to as "nozzle drive motor") 543 that functions as a drive source for nozzle movement in the radial direction It has a motion conversion mechanism 545 that converts the motion into linear motion and reciprocates the slider 544 in the radial direction X. Furthermore, in the motion conversion mechanism 545, a guide such as an LM guide (registered trademark) is used to stabilize the movement of the slider 544 in the radial direction X.

A head support member 547 is connected to the slider 544, which is thus reciprocated in the radial direction X, via a connection member 546. This head support member 547 has a rod shape extending in the radial direction X. The (+X) direction end of the head support member 547 is fixed to the slider 544. On the other hand, the end of the head support member 547 in the (-X) direction extends horizontally toward the spin chuck 21, and the nozzle head 56 is attached to the tip thereof. Therefore, when the nozzle drive motor 543 rotates in response to a nozzle movement command from the control unit 10, the nozzle drive motor 543 rotates in the (+X) direction or (-X) direction corresponding to the direction of rotation, and by a distance corresponding to the amount of rotation. Slider 544, head support member 547, and nozzle head 56 move integrally. As a result, the upper surface nozzle 51F mounted on the nozzle head 56 is positioned in the radial direction X. For example, as shown in column (a) in FIG. A provided spring member 548 is compressed by the slider 544 and applies a biasing force to the slider 544 in the (-X) direction. Thereby, backlash included in the motion conversion mechanism 545 can be controlled. In other words, since the motion conversion mechanism 545 has mechanical parts such as guides, it is practically difficult to make the backlash along the radial direction X zero, and unless sufficient consideration is given to this, The positioning accuracy of the upper surface nozzle 51F at X is reduced. Therefore, in this embodiment, by providing the spring member 548, the backlash is always biased in the (-X) direction when the upper surface nozzle 51F is stationary at the home position Ph. Thereby, by executing bevel processing including calibration processing, which will be described next with reference to FIGS. 7 to 10, the influence of backlash can be suppressed, and highly accurate nozzle positioning becomes possible.

In this embodiment, when performing bevel processing, the arithmetic processing unit 10A has already calculated the nozzle movement distance (symbol M in FIGS. 9 and 10) required to move and position the upper surface nozzle 51F to the bevel processing position. It is determined whether the information is acquired and stored in the storage unit 10B (step S1). Here, only when the nozzle movement distance M has not been acquired ("NO" in step S1), the calculation processing unit 10A executes the calibration process (step S2). On the other hand, if the nozzle movement distance M has been acquired ("YES" in step S1), the calibration process is skipped and the process proceeds to step S3.

When performing the calibration process, the operator removes the atmosphere separation mechanism 6, and after the arithmetic processing unit 10A executes the steps shown in FIGS. 8 and 9, the atmosphere separation mechanism 6 is returned to its original position and the process proceeds to step S3. In this calibration process, the arithmetic processing unit 10A controls the nozzle drive motor 543 so that the upper surface nozzle 51F is located at the home position Ph separated from the spin chuck 21 in the radial direction X (step S201). During this positioning, as the upper surface nozzle 51F moves to the home position Ph, the slider 544 compresses the spring member 548, as shown in column (a) in FIG. 9, and a biasing force accompanying the compression is applied to the slider 544. . As a result, the backlash generated in the motion conversion mechanism 545 is biased in the (-X) direction. In addition, in this embodiment, in consideration of later steps, a height position Zh lower than a height position Zt (hereinafter referred to as "processing height position") when the upper nozzle 51F performs bevel processing in the vertical direction Z is set. is positioned. This height position Zh corresponds to the height of the jig wafer JW to be placed on the spin chuck 21 in the next step S202.

In step S202, the jig wafer JW is placed on the spin chuck 21. This placement work, so-called loading work, may be performed by an operator or by the substrate transfer robot 111. During this loading operation, application of negative pressure to the spin chuck 21 is stopped.

The arithmetic processing unit 10A gives a centering command to the centering drive unit 82 while maintaining the stoppage of negative pressure application. Correspondingly, the centering drive section 82 moves the contact member 81 close to the jig wafer JW to align the center of the jig wafer JW with the center of the spin chuck 21 (centering process). Following this, the arithmetic processing unit 10A gives a negative pressure application command to the pump 26. As a result, the jig wafer JW is attracted and held on the spin chuck 21 (step S203). As shown in column (a) of FIG. 9, the end surface of this jig wafer JW is located at the same height as the engagement surface 512 of the upper surface nozzle 51F and faces it.

In the next step S204, the arithmetic processing unit 10A gives a drive command to the nozzle drive motor 543 to start moving the upper surface nozzle 51F toward the jig wafer JW. Simultaneously with the start of this movement, the calculation processing unit 10A starts counting the moving distance of the jig wafer JW, and continues counting until the engagement surface 512 of the upper surface nozzle 51F comes into contact with the end surface of the jig wafer JW ( Step S205). In this embodiment, when the engagement surface 512 comes into contact with the end surface of the jig wafer JW, the value of the drive current of the nozzle drive motor 543 (hereinafter referred to as "current value") changes rapidly, and the value is set to a preset value. The determination is made based on whether or not it exceeds (step S206). This makes it possible to accurately detect the contact of the engagement surface 512 with the end surface of the jig wafer JW. Note that in this embodiment, the contact determination is performed based on the current value, but the determination method is not limited to this. For example, an optical component such as a camera or an optical sensor may be attached to the nozzle head 56, and the above contact determination may be performed by optical detection by the optical component. Further, the arithmetic processing unit 10A may control the nozzle drive motor 543 so as to reduce the moving speed of the jig wafer JW as the upper surface nozzle 51F approaches the jig wafer JW. Thereby, it is possible to reduce the impact when the upper surface nozzle 51F contacts the jig wafer JW.

Simultaneously with the engagement surface 512 coming into contact with the end surface of the jig wafer JW, the arithmetic processing unit 10A gives a movement stop command to the nozzle drive motor 543 to stop the movement of the upper surface nozzle 51F along the radial direction X. As a result, as shown in column (b) of FIG. 9, the upper nozzle 51F is located at the contact position Pe with the engagement surface 512 of the upper nozzle 51F in contact with the end surface of the jig wafer JW. Further, in parallel with this, the arithmetic processing unit 10A stores the moving distance counted in step S205 in the storage unit 10B (step S207). This moving distance means the distance that the upper surface nozzle 51F has moved from the home position Ph to the contact position Pe, and corresponds to an example of the "first distance" of the present invention. Therefore, hereinafter, the moving distance will be referred to as a first distance M1.

Next, the arithmetic processing unit 10A gives an ascending command to the elevating mechanism 7 while keeping the upper nozzle 51F at the contact position Pe. As a result, as shown in column (c) of FIG. 9, the upper surface nozzle 51F rises to the processing height position Zt (step S208). Following this, the arithmetic processing unit 10A reads the second distance M2 from the storage unit 10B, gives a drive command to the nozzle drive motor 543, and as shown in column (d) of FIG. That is, the upper surface nozzle 51F is further moved by the second distance M2 in the (-X) direction (step S209). If the upper surface nozzle 51F after this movement is as designed, it should be located at the bevel processing position Pt. Therefore, in the present embodiment, the arithmetic processing unit 10A determines the nozzle movement distance M after the operator confirms the positioning of the upper surface nozzle 51F at the bevel processing position Pt. Here, if the positioning of the upper surface nozzle 51F to the bevel processing position Pt is not confirmed ("NO" in step S210), the calibration process is interrupted and the process proceeds to error processing.

When positioning to the bevel processing position Pt is confirmed in step S210, the arithmetic processing unit 10A calculates the nozzle movement distance M by adding the second distance M2 to the first distance M1 obtained in step S207 ( Step S211). This nozzle movement distance M is stored in the storage section 10B. Further, the calculation processing unit 10A gives a home return command to the nozzle drive motor 543 to return the top nozzle 51F to the home position Ph (step S212). More specifically, the upper surface nozzle 51F is moved by a nozzle movement distance M in the (+X) direction and separated from the jig wafer JW. Furthermore, the arithmetic processing unit 10A gives a negative pressure stop command to the pump 26 to stop applying negative pressure to the spin chuck 21.

In step S213, the jig wafer JW is carried out from the spin chuck 21. When the calibration process is thus completed, the atmosphere separation mechanism 6 is returned to its original position by the operator. The above-mentioned unloading operation, so-called unloading operation, may be performed by an operator or by the substrate transfer robot 111.

Returning to FIG. 7, the description of the bevel process will be continued. In step S3, as shown in column (a) of FIG. 10, the substrate W before being beveled is placed on the spin chuck 21. During this loading operation, the upper surface nozzle 51F is located at the home position Ph and the processing height position Zt. Further, application of negative pressure to the spin chuck 21 is stopped. Then, in such a standby state, a loading operation is performed by the substrate transfer robot 111.

Subsequently, in the same manner as in step S203 above, centering processing for the substrate W and suction and holding of the substrate W are performed (step S4).

Next, the arithmetic processing unit 10A reads the nozzle movement distance M from the storage unit 10B. Then, the arithmetic processing unit 10A gives a nozzle movement command to the nozzle drive motor 543, and as shown in column (b) of FIG. The upper surface nozzle 51F is moved by M (step S5).

When preparations for supplying the processing liquid to the peripheral edge of the substrate W are thus completed, the processing unit 10A gives a rotation command to the rotation drive unit 23 to rotate the substrate W around the rotation axis AX, and the processing liquid supply unit 52 to supply the processing liquid to the upper nozzle 51F. As a result, bevel processing is performed on the peripheral edge of the substrate W (step S6).

In this embodiment, after the bevel process is completed, the arithmetic processing unit 10A gives an observation command to the observation head drive unit 92 to bring the observation head 91 close to the substrate W (observation process). Then, based on the image of the peripheral edge of the substrate W taken using the observation head 91, the arithmetic processing unit 10A inspects whether the bevel processing has been performed satisfactorily. If the desired etching width is not obtained ("NO" in step S7), the bevel process is interrupted and error processing is executed.

As described above, according to the first embodiment, the movement distance of the upper surface nozzle 51F until the engagement surface 512 of the upper surface nozzle 51F comes into contact with the end surface of the jig wafer JW (the distance 1 distance M1), and the distance (second distance) required to move the upper surface nozzle 51F in a posture where the engagement surface 512 is in contact with the end surface of the jig wafer JW to the bevel processing position Pt along the radial direction X. is obtained. Then, the total value of these values is determined as the nozzle moving distance M. Therefore, according to the first embodiment, the conventional problem that the nozzle moving distance M is different for each operator can be solved, and the liquid supply position can be adjusted with high precision. Further, since the operator's work is reduced, the total cost required for substrate processing is reduced, and errors in positioning accuracy between substrate processing apparatuses 1 and between chambers 11 are also reduced. As a result, bevel processing can be stably executed.

Furthermore, since the second distance M2 is a value determined by design based on the bevel processing position Pt and the radial size of the substrate W, the nozzle movement distance M is calculated immediately after measuring the first distance M1. is also possible. That is, steps S207 to S209 in FIG. 8 may be omitted and the process may immediately proceed to step S211. Thereby, the time required for the calibration process can be shortened. However, in the first embodiment, as shown in columns (d) of FIGS. 8 and 9, after moving the top nozzle 51F to the bevel processing position Pt and checking the relative position of the top nozzle 51F with respect to the jig wafer JW. The nozzle moving distance M is determined. Therefore, the nozzle position can be adjusted with higher precision.

Further, at the home position Ph, the biasing force generated by the spring member 548 is always applied to the slider 544, and the backlash generated in the motion conversion mechanism 545 is biased in the (-X) direction. Thereby, it is possible to reliably suppress variations in the measurement results of the first distance M1 due to backlash, and to accurately obtain the nozzle movement distance M. As a result, the upper surface nozzle 51F can be positioned at the bevel processing position Pt with high precision without being affected by backlash. The spring member 548 may be attached optionally, and the spring member 548 may be attached in the second embodiment described below.

Moreover, since the centering process is performed on the jig wafer JW prior to measuring the first distance M1, the first distance M1 can be stably determined.

Furthermore, in the first embodiment, two types of components having different hardnesses are integrated in the upper surface nozzle 51F. Of course, the upper surface nozzle 51F may be formed of a single material, but wear due to contact of the engagement surface 512 with the jig wafer JW may become a problem. On the other hand, in the first embodiment, since the hardness of the engaging portion 51F2 is higher than that of the nozzle body portion 51F1, the above-mentioned wear can be effectively suppressed. In other words, deterioration in device operation due to wear on the engagement surface 512 can be suppressed.

As described above, in the first embodiment, a part of the upper surface nozzle 51F (the engagement surface 512) is brought into contact with the jig wafer JW, but a position adjustment jig is used exclusively for determining the nozzle movement distance M. may also be used (second embodiment). A second embodiment of the present invention will be described below with reference to FIGS. 5B, 11, and 12.

FIG. 5B is a perspective view showing a processing liquid discharge nozzle on the upper surface side that is installed in the processing mechanism in the second embodiment. FIG. 11 is a flowchart showing the calibration process in the second embodiment. FIG. 12 is a schematic diagram showing each part of the apparatus during calibration processing in the second embodiment. The second embodiment differs greatly from the first embodiment in that the nozzle movement distance M is determined while attaching and detaching a position adjustment jig PJ to and from the upper nozzle 51F instead of the engagement surface 512, and a spring member 548 is provided. This is because it is not. Other points are the same as the first embodiment. Therefore, in the following, the differences will be mainly explained, and the same components will be given the same reference numerals and the explanation will be omitted.

In the calibration process in the second embodiment, as shown in column (a) of FIG. The nozzle drive motor 543 is controlled (step S221). Further, at the home position Ph, the upper surface nozzle 51F is positioned at the same height position Zt as the bevel processing position Pt in the vertical direction Z.

Next, similarly to the first embodiment, loading of the jig wafer JW (step S222) and centering and suction holding of the jig wafer JW (step S23) are performed. Thereafter, the upper end of the positioning jig PJ was removably attached to the side surface of the upper nozzle 51F by the operator while the lower end of the strip-shaped positioning jig PJ faced the end surface of the jig wafer JW (step S224 ), the arithmetic processing unit 10A gives a drive command to the nozzle drive motor 543 to start moving the position adjustment jig PJ and the upper surface nozzle 51F to the jig wafer JW. Simultaneously with the start of this movement, the arithmetic processing unit 10A starts counting the moving distance of the jig wafer JW, and continues counting until the lower end of the position adjustment jig PJ comes into contact with the end surface of the jig wafer JW ( Step S226). Then, as in the first embodiment, the arithmetic processing unit 10A detects the contact of the position adjustment jig PJ with the jig wafer JW based on the fluctuation of the current value of the nozzle drive motor 543 (step S227). Of course, the above optical detection may be used to detect the contact of the position adjustment jig PJ with the jig wafer JW.

Simultaneously with the contact of the position adjustment jig PJ to the end surface of the jig wafer JW, the arithmetic processing unit 10A gives a movement stop command to the nozzle drive motor 543 to stop the movement of the upper surface nozzle 51F along the radial direction X. . As a result, as shown in column (b) of FIG. 12, the upper surface nozzle 51F is located at the contact position Pe with the position adjustment jig PJ in contact with the end surface of the jig wafer JW. In parallel with this, the arithmetic processing unit 10A stores the moving distance counted in step S205 in the storage unit 10B (step S228). This moving distance means the distance that the upper surface nozzle 51F has moved from the home position Ph to the contact position Pe, and corresponds to an example of the "third distance" of the present invention. Therefore, hereinafter, the moving distance will be referred to as a third distance M3.

Next, as shown in column (c) of FIG. 12, after the position adjustment jig PJ is removed by the operator (step S229), the arithmetic processing unit 10A reads the fourth distance M4 from the storage unit 10B, A drive command is given to the nozzle drive motor 543 to further move the upper surface nozzle 51F by a fourth distance M4 in the direction toward the rotation axis AX, that is, in the (-X) direction, as shown in column (d) of FIG. S230). If the upper surface nozzle 51F after this movement is as designed, it should be located at the bevel processing position Pt. After waiting for the operator to confirm the positioning of the upper surface nozzle 51F at the bevel processing position Pt, the arithmetic processing unit 10A determines the nozzle movement distance M. Here, if the positioning of the upper surface nozzle 51F to the bevel processing position Pt is not confirmed ("NO" in step S231), the calibration process is interrupted and the process proceeds to error processing.

When positioning to the bevel processing position Pt is confirmed in step S231, the arithmetic processing unit 10A calculates the nozzle movement distance M by adding the fourth distance M4 to the third distance M3 obtained in step S228 ( Step S232). This nozzle movement distance M is stored in the storage section 10B. The arithmetic processing unit 10A also gives a home return command to the nozzle drive motor 543 to return the top nozzle 51F to the home position Ph (step S233). More specifically, the upper surface nozzle 51F is moved by a nozzle movement distance M in the (+X) direction and separated from the jig wafer JW. Furthermore, the arithmetic processing unit 10A gives a negative pressure stop command to the pump 26 to stop applying negative pressure to the spin chuck 21.

In step S234, the jig wafer JW is carried out from the spin chuck 21. When the calibration process is thus completed, the atmosphere separation mechanism 6 is returned to its original position by the operator. The above-mentioned unloading operation, so-called unloading operation, may be performed by an operator or by the substrate transfer robot 111. Note that, following the calibration process, bevel processing similar to that in the first embodiment is executed.

As described above, in the second embodiment as well, the upper surface nozzle 51F can be moved until the position adjustment jig PJ attached to the upper surface nozzle 51F comes into contact with the end surface of the jig wafer JW with less operator work than in the conventional technology. The distance (third distance M3) and the distance (third distance M3) required to move the upper surface nozzle 51F in the position where the position adjustment jig PJ is in contact with the end surface of the jig wafer JW along the radial direction X to the bevel processing position Pt. 4 distance) is obtained. Then, the total value of these values is determined as the nozzle moving distance M. Therefore, in the second embodiment, as in the first embodiment, the conventional problem of the nozzle moving distance M being different for each operator can be solved, and the liquid supply position can be adjusted with high precision. There is. Further, since the operator's work is reduced, the total cost required for substrate processing is reduced, and errors in positioning accuracy between substrate processing apparatuses 1 and between chambers 11 are also reduced. As a result, bevel processing can be stably executed.

In addition, since the fourth distance M4 is a value determined by design based on the bevel processing position Pt and the radial size of the position adjustment jig PJ and the substrate W, the nozzle It is also possible to calculate the moving distance M. That is, steps S230 to S232 in FIG. 11 may be omitted and the process may immediately proceed to step S233. Thereby, the time required for the calibration process can be shortened. However, similarly to the first embodiment, the nozzle movement distance M is determined after the upper surface nozzle 51F is moved to the bevel processing position Pt and the relative position of the upper surface nozzle 51F with respect to the jig wafer JW is confirmed. Therefore, the nozzle position can be adjusted with higher precision.

Moreover, since the centering process for the jig wafer JW is performed prior to measuring the third distance M3, the third distance M3 can be stably determined.

Furthermore, in the second embodiment, the position adjustment jig PJ is attached to and removed from the top nozzle 51F before and after measuring the third distance M3, and the height position of the top nozzle 51F is always set at the same height as the bevel processing position Pt. The calibration process and bevel process can be performed stably.

Note that the present invention is not limited to the embodiments described above, and various changes other than those described above can be made without departing from the spirit thereof. For example, in the embodiment described above, by centering the jig wafer JW, the center of the jig wafer JW substantially coincides with the rotation axis AX. However, it is difficult to make the amount of deviation of the center of the jig wafer JW with respect to the rotation axis AX, that is, the amount of eccentricity, zero. For example, as shown in FIG. 13, the end face position of the jig wafer JW in the radial direction The eccentricity Md becomes larger than zero. Therefore, in the first embodiment, in step S203, the jig wafer JW is suctioned and held at the rotation angle at which the end surface of the jig wafer JW is located most in the (+X) direction, and in step S211, the arithmetic processing unit 10A formula,
Nozzle movement distance M=M1+M2+Md
The nozzle movement distance M may be calculated according to (third embodiment). In addition, in the second embodiment, in step S223, the jig wafer JW is suctioned and held at the rotation angle when the end surface of the jig wafer JW is located most in the (+X) direction, and in step S232, the arithmetic processing unit 10A formula,
Nozzle movement distance M=M3+M4+Md
The nozzle movement distance M may be calculated according to (fourth embodiment). According to these embodiments, the influence of eccentricity can be suppressed. Note that when performing the calibration process by suctioning and holding the jig wafer JW at the rotation angle when the end surface of the jig wafer JW is located most in the (-X) direction, conversely, only Md may be subtracted. By correcting the nozzle moving distance M by the amount of eccentricity Md in this manner, the influence of eccentricity can be minimized, and the nozzle position can be adjusted with high precision.

Further, in the above embodiment, the present invention is applied to the substrate processing apparatus 1 having the atmosphere separation mechanism 6, but the present invention can also be applied to a substrate processing apparatus not having the atmosphere separation mechanism 6. . Further, although the present invention is applied to a substrate processing apparatus having the rotating cup section 31, the present invention is also applicable to a substrate processing apparatus in which droplets scattered from the substrate W are always collected by a stationary cup section. can do.

This invention relates to a nozzle position adjustment method for adjusting the position of a nozzle in the radial direction can be applied.

1...Substrate processing equipment (processing unit)
10... Control unit 10A... Arithmetic processing section 10B... Storage section 10K... Calibration section 10L... Nozzle positioning section 10K1... Measurement section 10K2... Movement distance calculation section 512... Engagement surface (of the upper nozzle) 51B... Processing liquid discharge nozzle ( top nozzle)
543...(nozzle drive) motor 545...motion conversion mechanism 548...spring member AX...rotation axis JW...jig wafer M...nozzle movement distance M1...first distance M2...second distance M3...third distance M4...fourth distance Md... Eccentricity Pe... Contact position Ph... Home position (separated position)
PJ…position adjustment jig Pt…(bevel) processing position Z…vertical direction

Claims (16)

A rotation holding unit that holds and rotates a substrate around a rotation axis extending in the vertical direction, a nozzle that supplies a processing liquid for substrate processing to the substrate, and a nozzle moving unit that moves the nozzle in the radial direction of the substrate. A nozzle position adjustment method for positioning the nozzle at a processing position in the radial direction in order to supply the processing liquid to a preset position from an end surface of the substrate in a substrate processing apparatus comprising:
a first step of holding a jig plate having the same shape as the substrate in the rotation holding section;
a second step of locating the nozzle at a separate position away from the rotation holding part;
a third step of starting the movement of the nozzle from the separated position to the jig plate in a posture in which the engagement surface of the nozzle faces the end face of the jig plate held by the rotation holding part;
a fourth step of measuring a first distance traveled by the nozzle from execution of the third step until the engagement surface abuts the end surface of the jig plate;
A nozzle movement distance is determined by adding a second distance required to move the nozzle in a posture in which the engagement surface is in contact with the end surface of the jig plate along the radial direction to the processing position to the first distance. A fifth step of determining
While performing the first step to the fifth step before the substrate processing,
When performing the substrate processing, after performing the second step, the nozzle is positioned at the processing position by moving the nozzle by the nozzle movement distance in the radial direction. How to adjust the nozzle position. The nozzle position adjustment method according to claim 1,
The fifth step is a nozzle position adjustment method executed by reading out the second distance stored in advance in a storage unit of the substrate processing apparatus from the storage unit. The nozzle position adjustment method according to claim 1,
A sixth step of moving the nozzle in the radial direction to the second distance after moving the nozzle with the engagement surface in contact with the end surface of the jig plate above the jig plate. Furthermore,
A nozzle position adjustment method in which the sixth step is performed before the substrate processing. A rotation holding unit that holds and rotates a substrate around a rotation axis extending in the vertical direction, a nozzle that supplies a processing liquid for substrate processing to the substrate, and a nozzle moving unit that moves the nozzle in the radial direction of the substrate. A nozzle position adjustment method for positioning the nozzle at a processing position in the radial direction in order to supply the processing liquid to a preset position from an end surface of the substrate in a substrate processing apparatus comprising:
a seventh step of holding a jig plate having the same shape as the substrate in the rotation holding section;
an eighth step of locating the nozzle at a separate position away from the rotation holding part;
Before and after the eighth step, a ninth step of attaching a position adjustment jig to the nozzle so as to face an end surface of the jig plate held by the rotation holding part;
a tenth step of starting movement of the nozzle from the separated position to the jig plate with the position adjustment jig facing an end surface of the jig plate;
an eleventh step of measuring a third distance traveled by the nozzle from execution of the tenth step until the position adjustment jig comes into contact with the end surface of the jig plate;
moving the nozzle by adding a fourth distance required for moving the nozzle in a posture in which the position adjustment jig is in contact with the end surface of the jig plate along the radial direction to the processing position to the third distance; A twelfth step of calculating the distance,
While performing the seventh step to the twelfth step before the substrate processing,
When performing the substrate processing, after performing the eighth step, the nozzle is positioned at the processing position by moving the nozzle by the nozzle movement distance in the radial direction. How to adjust the nozzle position. The nozzle position adjustment method according to claim 4,
The twelfth step is a nozzle position adjustment method that is executed by reading out the fourth distance previously stored in a storage unit of the substrate processing apparatus from the storage unit. The nozzle position adjustment method according to claim 4,
further comprising a thirteenth step of moving the nozzle to the fourth distance in the radial direction after removing the position adjustment jig that is in contact with the end surface of the jig plate from the nozzle,
The attitude in the tenth step is such that the nozzle is located above the jig plate, while the lower end of the position adjustment jig is located at the same height as the jig plate in the vertical direction. and
The thirteenth step is a nozzle position adjustment method performed before the substrate processing. The nozzle position adjustment method according to any one of claims 1 to 6,
Before performing the substrate processing, a nozzle position adjustment method that measures an amount of eccentricity of the center of the substrate held by the rotation holding unit with respect to the rotation axis, and corrects the nozzle movement distance based on the amount of eccentricity. The nozzle position adjustment method according to claim 7,
Before holding the jig plate by the rotation holding unit, performing a centering process to align the center of the jig plate with the rotation axis,
The nozzle position adjustment method wherein the correction is performed by adding the eccentricity amount to the nozzle movement distance before correction. The nozzle position adjustment method according to any one of claims 1 to 6,
When the nozzle moving unit has a motor as a drive source for moving the nozzle,
A nozzle position adjustment method in which contact with an end surface of the jig plate is detected based on fluctuations in current applied to the motor or fluctuations in load applied to the motor. The nozzle position adjustment method according to any one of claims 1 to 6,
A nozzle position adjustment method in which contact with an end surface of the jig plate is detected by an optical component attached to the nozzle. The nozzle position adjustment method according to any one of claims 1 to 6,
When the nozzle moving unit includes a motor and a linear actuator having a motion conversion mechanism that converts rotational motion of the motor into linear motion,
When the nozzle is located at the separated position, the nozzle is positioned so that backlash included in the motion conversion mechanism is biased toward one side in the radial direction. The nozzle position adjustment method according to claim 11,
A nozzle position adjustment method for biasing the backlash in a direction toward the rotation axis in the radial direction by applying a biasing force toward the rotation axis to the nozzle located at the separated position. a rotation holding unit that holds and rotates the substrate around a rotation axis extending in the vertical direction;
a nozzle that supplies a processing liquid for substrate processing to the substrate;
a nozzle moving unit that moves the nozzle in a radial direction of the substrate;
a control unit that controls the nozzle moving unit so that the nozzle is located at a processing position for supplying the processing liquid to a preset position from an end surface of the substrate;
The control unit includes:
Before the substrate processing, a nozzle movement distance required to move the nozzle located at a radially distant position from the rotation holding part to the processing position using a jig plate having the same shape as the substrate is determined. The desired calibration part and
a nozzle positioning unit that positions the nozzle at the processing position by moving the nozzle from the separated position by the nozzle movement distance in the radial direction;
The calibration section
After the nozzle starts moving from the separated position to the jig plate in a posture in which the engagement surface of the nozzle faces the end surface of the jig plate held by the rotation holding part, the engagement surface a measuring unit that measures a first distance traveled by the nozzle until it comes into contact with an end surface of the jig plate;
moving the nozzle by adding a second distance required to move the nozzle in a posture in which the engagement surface is in contact with the end surface of the jig plate along the radial direction to the processing position to the first distance; a moving distance calculation unit that calculates the distance;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 13,
The nozzle includes a nozzle body having a discharge port for discharging the processing liquid, and an engagement portion having the engagement surface and being integrated with the nozzle body,
The hardness of the engaging portion is higher than the hardness of the nozzle body. a rotation holding unit that holds and rotates the substrate around a rotation axis extending in the vertical direction;
a nozzle that supplies a processing liquid for substrate processing to the substrate;
a nozzle moving unit that moves the nozzle in a radial direction of the substrate;
a control unit that controls the nozzle moving unit so that the nozzle is located at a processing position for supplying the processing liquid to a preset position from an end surface of the substrate;
The control unit includes:
Before the substrate processing, a nozzle movement distance required to move the nozzle located at a radially distant position from the rotation holding part to the processing position using a jig plate having the same shape as the substrate is determined. The desired calibration part and
a nozzle positioning unit that positions the nozzle at the processing position by moving the nozzle from the separated position by the nozzle movement distance in the radial direction;
The calibration section
After the position adjustment jig attached to the nozzle starts moving the nozzle from the separated position to the jig plate in a posture facing the end surface of the jig plate held by the rotation holding part, a measurement unit that measures a third distance that the nozzle has moved until the position adjustment jig comes into contact with an end surface of the jig plate;
A fourth distance required for moving the nozzle in a posture in which the position adjustment jig is in contact with the end surface of the jig plate along the radial direction to the processing position is added to the third distance, and the nozzle is adjusted. a moving distance calculation unit that calculates a moving distance;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 15,
In the substrate processing apparatus, the hardness of the position adjustment jig is higher than the height of the nozzle.

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