JP2023165242A - Non-contact ic inlet with cover, booklet, manufacturing method of non-contact ic inlet with cover, and non-contact ic inlet - Google Patents

Abstract

To provide a non-contact IC inlet with a cover which is easily manufactured and can prevent displacement of an IC module, a booklet, a manufacturing method of the non-contact IC inlet with the cover, and a non-contact IC inlet.SOLUTION: A non-contact IC inlet with a cover has: an IC module 5; a sheet-like single-layer substrate 2 with a housing hole 23 capable of storing the IC module 5; a cover member 4 pasted with the substrate 2 by an elastic adhesive 3; and a coiled antenna 6 arranged on a side of the substrate 2 which is pasted with the cover member 4 and connected to the IC module 5. The substrate 2 is a foamed or porous plastic sheet. In the housing hole 23, a first region 25 and a second region 26 are provided, the first region 25 being located on the side of the substrate 2 which is pasted with the cover member 4 and opening toward the side, and the second region 26 being located on a side opposite to the first region 25 of the substrate 2 which is pasted with the cover member 4 and communicating with the first region 25. The second region 26 is smaller in outer shape than the first region 25.SELECTED DRAWING: Figure 1

Description

The present invention relates to a non-contact IC inlet with a cover, a booklet, a method for manufacturing the non-contact IC inlet with a cover, and a non-contact IC inlet.

Systems using non-contact IC cards and non-contact IC tags are becoming widespread. For example, a non-contact IC inlet with a cover is used in booklets such as passports and savings passbooks, which are equipped with an IC inlet that allows entry and printing of electronic data. In a non-contact IC inlet with a cover, an IC module and an antenna coil connected to the IC module are sandwiched between two sheet-like base materials bonded together with an adhesive.
Usually, at least one of the two base materials is provided with an accommodation hole for accommodating an IC module. The accommodation hole is a through hole that penetrates the front and back of the base material, or a recess that does not penetrate the base material. By housing the IC module in the accommodation hole, the IC module does not protrude from the surface of the two base materials bonded together, and the physical durability of the non-contact IC inlet is improved. In particular, passports are required to have severe physical durability because they have a long expiration date of 10 years, and visa stamps are stamped or written on with a ballpoint pen or the like at the time of entry/exit.

Patent Document 1 discloses a non-contact IC inlet with a cover in which accommodation holes are provided in both of two base materials and an IC module is accommodated so as to straddle both of these accommodation holes.
Patent Document 2 discloses a non-contact IC inlet with a cover in which an accommodation hole is provided in one of two base materials and an IC module is accommodated in the accommodation hole.

Patent No. 5130887 Patent No. 4471971

A non-contact IC inlet with a cover in which an IC module and an antenna as described above are sandwiched between two base materials can be manufactured by a process of applying an adhesive to the base materials and a lamination process of bonding the two base materials. In the adhesive application process, heating, cooling, and tension are applied to the base material, so depending on the type of base material, heat and residual tension may cause shrinkage, which may cause the IC module or antenna to become misaligned. .
Heat shrinkage after the lamination process may cause misalignment of the IC module or antenna.

In a non-contact IC inlet with a cover in which accommodation holes are provided in both of two base materials and IC modules are accommodated in both of these accommodation holes as in Patent Document 1, the two base materials are placed in the manufacturing process. It is necessary to provide accommodation holes concentrically in each, and the IC module is accommodated in both accommodation holes. For this reason, high precision is required for forming the accommodation hole and positioning the IC module with respect to the accommodation hole. Furthermore, depending on the type of adhesive, two base materials can be easily separated by immersion in an organic solvent or heat using an iron, and it has been pointed out that there is a risk of removing the IC chip or antenna. To avoid such constructional drawbacks, tamper-proof functionality may be required.

Even if the base material is provided with an accommodation hole for accommodating the IC module, the joint between the IC module and the antenna is not accommodated in the accommodation hole and therefore protrudes from the base material. As a result, the surface of the non-contact IC inlet with a cover may bulge and damage other products, or if the joint between the IC module and the antenna has a sharp shape, the base material may be damaged.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a non-contact IC inlet with a cover, a booklet, a method for manufacturing the non-contact IC inlet with a cover, and a non-contact IC inlet that is easy to manufacture and can prevent the positional shift of an IC module. shall be.
In particular, the antenna sandwiched between the cover material and the base material can be easily prevented from peeling off. Furthermore, the present invention relates to a configuration that prevents disconnection between the IC module and the antenna and damage to the IC module itself. As the base material becomes thinner, it becomes more susceptible to shrinkage during lamination, so it is required to process it under appropriate conditions. In addition, it becomes difficult to distinguish the shape of the antenna through the cover material, contributing to an improvement in aesthetic appearance.

In order to achieve the above object, a non-contact IC inlet with a cover according to the present invention includes an IC module, a sheet-like single layer base material in which a housing hole capable of housing the IC module is formed, and an elastic adhesive. The base material includes a cover material to be bonded to the base material, and a coil-shaped antenna arranged on a side of the base material to be bonded to the cover material and connected to the IC module, and the base material includes: It is a foamed or porous plastic sheet, and inside the accommodation hole, a first region is located on the side of the base material to be bonded to the cover material and is open to the side to be bonded to the cover material. , a second region located on the opposite side of the first region of the base material to the side to be bonded to the cover material and communicating with the first region, the second region is located on the side opposite to the side to be bonded to the cover material, and the second region is connected to the first region. 1 area, the cover material is a texture layer alone, or the texture layer and the resin layer are bonded together, and is in contact with the elastic adhesive, and the thickness of the elastic adhesive is , which is thicker than 10% of the cross-sectional diameter of the antenna, and the IC module and the antenna are opposed to the cover material via the elastic adhesive.

The booklet according to the present invention includes the above-mentioned non-contact IC inlet with a cover.

The method for manufacturing a non-contact IC inlet with a cover according to the present invention is the method for manufacturing the above-mentioned non-contact IC inlet with a cover, which includes the step of forming the accommodation hole in the base material, and the step of forming the accommodation hole in the accommodation hole. an IC module placement step of arranging an IC module; an antenna placement step of arranging the antenna on a side of the base material to be bonded to the cover material; and a step of bonding the base material and the cover material with an elastic adhesive. and a joining step.

In the present invention, the base material of the covered non-contact IC inlet is a single layer. This eliminates the need for a step of bonding a plurality of base materials together in the manufacturing process. This facilitates the manufacture of a non-contact IC inlet with a cover, and also prevents the IC module and antenna from shifting due to shrinkage of the base material due to heat or residual tension when bonding a plurality of base materials together.
Furthermore, the present invention eliminates the need for lamination equipment for bonding a plurality of base materials together, and also eliminates the need for maintenance of the control device necessary for temperature and pressure management in the lamination equipment, making it possible to reduce costs and labor.
Furthermore, in the present invention, since it is only necessary to provide a housing hole in a single layer base material and install an IC module in this housing hole, it is easy to form a housing hole in the base material and to align the IC module with respect to the base material. It is.
For example, in a non-contact IC inlet with a cover where two base materials are bonded together, if accommodation holes are provided in each of the two base materials and an IC module is placed so as to straddle these two accommodation holes, two Equipment that performs highly accurate position correction is required to prevent positional deviation from occurring in both housing holes. In the present invention, such equipment is not required, and costs can be reduced.
In the present invention, a first region and a second region having a smaller external shape than the first region are provided inside the accommodation hole. Therefore, a stepped portion is formed at the boundary between the first region and the second region on the inner circumferential surface of the accommodation hole. Thereby, by fitting the IC module along the stepped portion of the accommodation hole, the IC module can be placed in the correct position, and displacement of the IC module can be prevented.
In the present invention, since an elastic adhesive is filled between the cover material and the IC module and between the cover material and the antenna, the elastic adhesive seals the IC module, the antenna, and the joint between the IC module and the antenna. Can be protected. Furthermore, in the present invention, since the unevenness at the joint between the IC module and the antenna is covered with the elastic adhesive, it is possible to prevent unevenness from occurring on the surface of the cover material due to the unevenness at the joint between the IC module and the antenna.
The texture layer is paper, cloth, nonwoven fabric, resin sheet, etc.

Furthermore, in the non-contact IC inlet with a cover according to the present invention, the texture layer and the resin layer are bonded together in the cover material, and the resin layer is in contact with the elastic adhesive.

With such a configuration, the base material and the cover material can be bonded together favorably.

Further, in the non-contact IC inlet with a cover according to the present invention, the shore hardness of the elastic adhesive is A30 or more and A95 or less, and the amount of the elastic adhesive applied to the base material per unit area is: It may be 40 g/m ² or more and 100 g/m ² or less.

With such a configuration, the elastic adhesive has appropriate flexibility. Due to its moderate flexibility, when the covered non-contact IC inlet is bent, the elastic adhesive follows the cover material and base material, preventing the cover material from peeling off from the base material or cracks in either the cover material or the base material. can be prevented from occurring. Furthermore, by applying an appropriate amount of elastic adhesive, the IC module, the antenna, and the joint between the IC module and the antenna can be well protected.

Moreover, in the non-contact IC inlet with a cover according to the present invention, the second region may penetrate the base material.

With such a configuration, the accommodation hole can be easily formed.

Furthermore, in the non-contact IC inlet with a cover according to the present invention, the second region may have a depression-like structure having a bottom surface in the base material, or may partially penetrate the base material.

With such a configuration, the accommodation hole can be easily formed, the IC module can be placed in the correct position, and the positional shift of the IC module can be prevented.

Furthermore, in the covered non-contact IC inlet according to the present invention, the antenna may be partially buried within the base material.

With such a configuration, the portion of the antenna that is exposed from the base material is reduced, so that the antenna can be covered even with a small amount of elastic adhesive.

Further, in the method for manufacturing a non-contact IC inlet with a cover according to the present invention, in the accommodation hole forming step, a recess that does not penetrate the base material is provided at a position in the base material where the first region of the accommodation hole is provided. and a through hole forming step of providing a through hole having an outer diameter smaller than the outer diameter of the recess and penetrating through the bottom of the recess at a position in the base material where the second region of the accommodation hole is provided. You may do so.

With such a configuration, a housing hole having a stepped portion on the inner peripheral surface can be easily provided in the base material.

In order to achieve the above object, a non-contact IC inlet according to the present invention includes an IC module, a sheet-like single-layer base material in which an accommodation hole capable of accommodating the IC module is formed, and one layer of the base material. a coil-shaped antenna arranged on a surface and connected to the IC module, and inside the accommodation hole is located on the one surface side of the base material and has an opening on the one surface side. A first region and a second region located on the other side of the base material than the first region and communicating with the first region are provided, and the second region is closer to the first region than the first region. The antenna has a small external shape, the base material is a foamed or porous plastic sheet, and the bulk density of the base material is 0.5 g/cm ³ or more and 1.5 g/cm ³ or less, and the antenna The wire is a resin-coated metal conductor in which a metal conductor is coated with a resin, the conductor of the wire is a single wire, and the cross section of the wire conductor is circular, and the cross-sectional area is 1800 μm ² or more. 72000 μm ² or less, and the ratio w/( d+w) is 0.04 or more and 0.5 or less.

When the width of the antenna wire is the diameter wmm, the width d of the blank portion can be set to a minimum of about wmm to 2.0 mm. Within this range, the cover material can be sufficiently bonded and the magnetic field strength for communication can be ensured.

According to the present invention, manufacturing is easy and the positional shift of the IC module can be prevented.

FIG. 2 is a sectional view showing an example of a non-contact IC inlet with a cover according to an embodiment of the present invention. FIG. 2 is an exploded cross-sectional view of FIG. 1; FIG. 3 is a schematic diagram showing the width dimension w of the wires of the antenna and the width dimension d of the blank portion between the arranged wires. FIG. 3 is a cross-sectional view showing a recess forming step. FIG. 3 is a cross-sectional view showing a step of forming an accommodation hole. FIG. 3 is a cross-sectional view showing an IC module placement process, an antenna placement process, and a bonding process.

EMBODIMENT OF THE INVENTION Hereinafter, the non-contact IC inlet with a cover, the booklet, the manufacturing method of the non-contact IC inlet with a cover, and the non-contact IC inlet according to embodiments of the present invention will be described based on FIGS. 1 to 6.
As shown in FIGS. 1 and 2, the covered non-contact IC inlet 1 according to the present embodiment includes a sheet-like single-layer base material 2, and a sheet-like cover that is bonded to the base material 2 with an elastic adhesive 3. 4, an IC module 5 disposed on the base material 2, and a coil-shaped antenna 6 disposed on the base material 2 and connected to the IC module 5.

The base material 2 and the cover material 4 are bonded together one by one. The direction in which the base material 2 and the cover material 4 are bonded and laminated (the direction of arrow A in the figure) is referred to as the thickness direction. In the thickness direction, the side on which the cover material 4 is provided relative to the base material 2 is referred to as one side, and the side on which the base material 2 is provided relative to the cover material 4 is referred to as the other side. Among the surfaces of the base material 2, the surface on one side in the thickness direction that is bonded to the cover material 4 is referred to as the first surface 21, and the surface on the other side in the thickness direction is referred to as the second surface 22. .

The specific structure of the cover material 4 can be, for example, a texture layer of paper, cloth, nonwoven fabric, resin sheet, etc., or a paper cloth in which a texture layer and a resin layer are bonded together. The cover material 4 shown in FIG. 1 is an example of paper cloth in which a texture layer 43 and a resin layer 44 are bonded together. The cover material 4 is provided with a texture layer 43 on one side in the thickness direction, and a resin layer 44 on the other side in the thickness direction. The other surface 42 of the cover material 4 in the thickness direction is bonded to the base material 2 using the elastic adhesive 3. The surface 42 on the other side in the thickness direction of the cover material 4 is the surface on the other side of the resin layer 44 in the thickness direction.
It is formed by coating a thermoplastic resin (nitrocellulose, acrylic, polyurethane, PVC, or other resin, polyolefin) or bonding sheet-like thermoplastic resins. Specific examples of polyolefins are polypropylene, polyethylene, and polyethylene terephthalate. The basis weight of the texture layer 43 can be 50 g/m ² or more and 500 g/m ² or less, and this range is suitable for lamination processing. Moreover, if the basis weight of the texture layer 43 is 100 g/m ² or more and 500 g/m ² or less, appropriate rigidity can be obtained. The resin layer 44 includes a colored layer, a surface protection layer, a decoration layer, and the like.
The IC module 5 is accommodated in the accommodation hole 23 provided in the base material 2 . Antenna 6 is arranged on one side of base material 2 .

The booklet according to this embodiment is, for example, a passport. The booklet includes a non-contact IC inlet 1 with a cover. The cover-equipped non-contact IC inlet 1 of the booklet is used as a cover by pasting endpaper on the surface on the base material 2 side. One surface 41 of the cover material 4 in the thickness direction becomes the cover surface of the booklet.

The base material 2 may be, for example, a plastic sheet, paper, or synthetic paper made by combining plastic and paper. The plastic sheet can be a foamed or porous plastic sheet. The material of the plastic sheet can be thermoplastic. Foamed plastic sheets and porous plastic sheets are highly flexible and easy to hold antennas. Examples of plastic sheets used include polyethylene terephthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC), polypropylene (PP), and TESLIN (registered trademark). The base material 2 has flexibility due to the use of the above materials.

The plastic sheet can have a bulk density of 0.5 or more and 1.5 or less. With this bulk density, the IC module 5 can be protected even with a single layer. It is possible to protect electronic components while maintaining flexibility. In particular, when durability is required, plastic sheets with a bulk density of 1.5 or more and 2.5 or less include engineering plastics, fiber reinforcement, fillers, and the like.
For example, if flexibility is important, Tezrin (bulk density: 0.6 to 0.7) can be used as the material of the plastic sheet of the base material 2. If durability is important, PET (bulk density 1.4), PC (bulk density 1.2), fluororesin (bulk density approximately 1.7 to 2.0), etc., may be used as the base material 2 plastic sheet. It can be used as a material.
As described above, the base material 2 is one sheet (single layer). The thickness of the base material 2 is set to be greater than or equal to the thickness of the antenna 6 and the thickness of the IC module 5. By making the base material 2 a single layer, it is possible to achieve a thinner structure and reduce the number of processing steps.

The accommodation hole 23 penetrates the base material 2 in the thickness direction. When viewed from the thickness direction, the accommodation hole 23 has a shape that is smaller on one side in the thickness direction than on the other side. The inner circumferential surface of the accommodation hole 23 has a stepped portion 24 at an intermediate portion in the thickness direction.
The outer shape of a portion of the accommodation hole 23 on one side in the thickness direction than the stepped portion 24 is approximately the same as the outer shape of the lead frame 51 of the IC module 5 . A portion of the accommodation hole 23 on the other side of the thickness direction than the stepped portion 24 has approximately the same external shape as the IC chip 52 .

Among the internal regions of the accommodation hole 23, the region on one side in the thickness direction of the step portion 24 is referred to as a first region 25, and the region on the other side of the thickness direction than the step portion 24 is referred to as a second region 26. write. An end 252 on the other side in the thickness direction of the side surface 251 of the first region 25 and one side in the thickness direction of the side surface 261 of the second region 26 on the inner circumferential surface of the accommodation hole 23 . The surface connecting the end portion 262 and the end portion 262 will be referred to as the connection surface 27. The connection surface 27 is a plane facing one side in the thickness direction. The side surface 251 of the first region 25, the connection surface 27, and the side surface 261 of the second region 26 form the step portion 24. The connecting portion 28 between the side surface 251 of the first region 25 and the connecting surface 27 may have an R shape with rounded corners. The area of the plane surrounded by the outline of the accommodation hole 23 may be 25 mm ² or more and 70 mm ² or less. Within this range, it is easy to accommodate the IC module 5 in the accommodation hole 23, and it is easy to prevent the elastic adhesive 3 from excessively entering the accommodation hole 23 and creating a depression in the cover material 4.

The IC module 5 includes a lead frame 51, an IC chip 52 mounted on the lead frame 51, and a protective tape 53 that protects the IC chip 52 as an option. The IC module 5 is arranged in the accommodation hole 23 of the base material 2 with the lead frame 51 on one side in the thickness direction and the IC chip 52 on the other side in the thickness direction.
The IC chip 52 is, for example, a bare chip diced from a wafer, a package, or the like. The lead frame 51 and the IC chip 52 overlap in the thickness direction. The IC chip 52 is bonded to the other side of the lead frame 51 in the thickness direction. The IC chip 52 has a smaller shape than the lead frame 51 when viewed from the thickness direction.
The protective tape 53 covers the joined lead frame 51 and IC chip 52 from the other side in the thickness direction. The other side of the IC module 5 in the thickness direction has a stepped portion 54 formed by the other surface 512 of the lead frame 51 in the thickness direction and the outer peripheral surface 521 of the IC chip 52 .
The thickness of the IC module 5 can be 1,000 μm or less and 150 μm or more due to the processing of the IC module. By setting it to 400 μm or less, it becomes easier to encapsulate it in the base material. By setting the thickness to 200 μm or more, cracking of the chip can be prevented. Easily meets the thickness requirements for IC cards and passports.

When the IC module 5 is placed in the accommodation hole 23, the lead frame 51 is placed in the first area 25, and the IC chip 52 is placed in the second area 26. When the protective tape 53 is present, a portion 513 of the other surface 512 in the thickness direction of the lead frame 51 that is not bonded to the IC chip 52 faces the connection surface 27 of the base material 2 via the protective tape 53. ing.
The thickness of the base material 2 is greater than the thickness of the IC module 5. The IC module 5 accommodated in the accommodation hole 23 of the base material 2 is arranged so as not to protrude from the base material 2 in the thickness direction. Specifically, the thickness of the base material can be set to 103% or more and 130% or less of the thickness of the IC module 5, taking into consideration the thickness of the protective tape 53 and the thickness of the antenna 6 that is not embedded in the base material. Specifically, the thickness of the base material 2 can be 257 μm or more and 325 μm or less if the IC module 5 has a thickness of 250 μm, and 350 μm or more and 442 μm or less if the IC module 5 has a thickness of 340 μm. The thickness of the base material 2 depends on the IC module, but is not limited to the above IC module thickness.

The antenna 6 is arranged along the first surface 21 of the base material 2. The antenna 6 is connected to one surface 511 of the lead frame 51 in the thickness direction. In the antenna 6 disposed along the first surface 21 of the base material 2, a part of the antenna 6 on the base material 2 side is buried in the base material 2. The antenna 6 can be a coil antenna. Preferably, the antenna 6 can be a coiled antenna, made of wire. In other words, the antenna 6 can be coiled. The wire can be a resin coated metal conductor. A resin-coated metal conductor is a metal conductor coated with resin.
The antenna 6 is, for example, an etching antenna in which a pattern is obtained by etching a metal foil adhered to the base material 2, an embedded coil antenna in which a resin-coated metal conductor is embedded in the base material 2 using ultrasonic waves, or a self-fusion antenna in which a resin-coated metal conductor is embedded in the base material 2 using ultrasonic waves. hollow coil antennas obtained by attaching The coating of the resin-coated metal conductor of the wire of the antenna 6 may consist of two layers: an insulating coating near the conductor and a self-bonding layer outside the insulating coating. The material of the insulating coating can be a polyurethane-based or polyester-based resin layer. The material of the self-bonding layer can be polyamide, polyamideimide, epoxy, or polyvinyl resin. The materials of the insulating coating and the self-bonding layer are not limited to these.
The joint 61 between the antenna 6 and the lead frame 51 is preferably a metal-to-metal joint. The bonding methods include thermal compression, soldering, and ultrasonic bonding.

The conductor of the resin-coated metal conductor wire forming the antenna 6 can be a single wire. Solid wire can carry more current per unit cross-sectional area, so thinner wires can carry more current. Therefore, the antenna 6 can be formed using a thin wire while passing a sufficient current, and the shape of the antenna 6 is unlikely to stand out on the cover. Also, if it is a single wire, it is easy to prevent wire breakage even if the wire is thin. The cross section of the conductor of the antenna 6 can be selected to be circular or flat. Further, the cross-sectional area range of the conductor is about 1800 μm ² to 72000 μm ² based on the diameter of the copper wire. The specific electrical resistance (Ω·m) of the conductor is preferably in the range of about 1.6×10 ⁻⁸ for pure copper to 10×10 ⁻⁸ for alloy. Within this range, it is possible to ensure a current value for communication, and it is also possible to prevent the shape (trace) of the antenna 6 from standing out on the cover material 4 . The conductor of the wire of the antenna 6 can be pure copper or a copper alloy. The copper alloy of the conductor material can be phosphor bronze, brass, titanium copper, or beryllium copper. Alternatively, it may be a copper-clad aluminum wire having a configuration of a combination of copper and aluminum.

As shown in FIG. 3, the ratio w/(d+w ) can be 0.04 or more and 0.5 or less. When the line width is defined as the diameter wmm, the blank width d can be set to a minimum of about wmm to 2.0 mm. Within this range, the cover material 4 can be bonded sufficiently and the magnetic field strength for communication can be ensured. The diameter of the wire for the antenna 6 can be selected from 50 to 200 μm depending on the durability of the copper wire, ease of processing, and the amount of copper wire embedded in the base material. The antenna 6 can be coiled by selecting a pitch between wires of 0.1 to 2.0 mm. If this pitch is narrow, waviness of the base material is likely to occur. It is difficult to secure the required inductance for wide pitch antenna coils. Because of this, there is a risk that the antenna 6 may deviate from the requirements of the international standard, so it is preferable to select the above range.

When the cover material 4 and the base material 2 are bonded together, the joint 61 between the antenna 6 and the lead frame 51 is covered and protected by the elastic adhesive 3. When the joint 61 between the antenna 6 and the lead frame 51 is covered with the elastic adhesive 3, its state and shape cannot be visually recognized from outside the base material 2 or the cover.

The elastic adhesive 3 may be a curable adhesive. The elastic adhesive may be an elastomer. The elastic adhesive 3 has a single layer or multiple layers. Multilayer elastic adhesives can be multiple layers of the same or different adhesives.
The elastic adhesive 3 can be a non-foam curable polyurethane. The elastic adhesive 3 is, for example, a polyurethane moisture-curing adhesive, a silicone UV-curing adhesive, an acrylic adhesive, an epoxy adhesive, a foam adhesive, an EVA adhesive, a PVA adhesive, or the like. . The Shore hardness of the elastic adhesive 3 is preferably A30 or more and A95 or less. If the Shore hardness of the elastic adhesive 3 is A30 or more and A95 or less, it will sufficiently follow the shape of the antenna 6, making it difficult to distinguish the shape of the antenna 6 through the cover material 4, resulting in an excellent appearance. For example, the hardness range for durability may be A65 or more and A95 or less, and the range of flexibility for a booklet cover may be A30 or more and A85 or less. In addition, when considering processability, the Shore hardness of the elastic adhesive 3 can be set to A65 or more and A95 or less. Within this range, it is easy to shorten the machining takt time. The coating amount of the elastic adhesive 3 is preferably 40 g/m ² or more and 100 g/m ² or less.

Shore hardness can be measured according to the JIS: Z 2246 standard. A type indenter is used. This Shore hardness is measured in an environment of 23 degrees. In addition, when measuring the Shore hardness, five measurement points are measured, including the center and the four corners, and the average value is determined as the Shore hardness. Each point can be measured three times. The applied amount of the elastic adhesive 3 can be measured using an electronic scale or the like. In the case of multiple layers, the Shore hardness may be measured for all layers of the elastic adhesive 3. Further, the Shore hardness of the elastic adhesive 3 at 50° C., which is the upper limit of use of the passport, can be set to A50 or more and A90 or less. Within this range, the elastic adhesive appropriately fills the gap between the IC module and the accommodation hole of the base material, and it is easy to stabilize the holding of the IC module. Further, the thickness of the elastic adhesive relative to the diameter of the antenna can be greater than 10% of the cross-sectional diameter of the antenna. Further, the thickness of the elastic adhesive can be 10 μm or more and 100 μm or less.

A non-contact IC inlet with a cover 1, in which a base material 2 on which an antenna 6 and an IC module 5 are disposed, and a cover material 4 are bonded together using an elastic adhesive 3 as described above, has flexibility and can be bent. Even at times, it follows without peeling or cracking.

A method of manufacturing the covered non-contact IC inlet 1 according to this embodiment will be described.
An accommodation hole 23 is provided in the base material 2 (accommodation hole formation step).
In the accommodation hole forming step, first, as shown in FIG. 4, a recess 71 that does not penetrate the base material 2 is provided at a position in the base material 2 where the first region 25 is provided (recess formation step).
The recess 71 opens on one side of the base material 2 in the thickness direction. The outer shape of the recessed portion 71 is the same as the outer shape of the first region 25 . The depth dimension (thickness dimension) of the recessed portion 71 is the same as the depth dimension of the first region 25. A bottom surface 711 of the recess 71 is formed at the position of the connection surface 27 .
In the recess forming step, the recess 71 can be formed in the base material 2 by any of the following methods. For example, the base material 2 is milled using a milling device, and the recess 71 is formed by milling. For example, a heated punching tool or the like is pressed against the base material 2, and the base material 2 is depressed by heat and pressure to form the concave portion 71 by press working. For example, the head of an ultrasonic device is applied to the base material 2 to dent the base material 2, and the recess 71 is formed by ultrasonic processing. The method for forming the recess 71 is selected depending on the material of the base material 2 and the shape of the recess 71.

Subsequently, as shown in FIG. 5, a through hole 72 passing through the base material 2 is provided at a position in the base material 2 where the second region 26 is to be provided (through hole forming step). The outer shape of the through hole 72 is smaller than the outer shape of the recess 71 and is the same as the outer shape of the second region 26 . The through hole 72 penetrates the bottom 712 of the recess 71 in the base material 2 . By forming the recess 71 and the through hole 72 in the base material 2, the accommodation hole 23 is provided in the base material 2. The inside of the recess 71 corresponds to the first region 25 , the inside of the through hole 72 corresponds to the second region 26 , and the bottom surface 711 of the recess 71 corresponds to the connection surface 27 .
In the through-hole forming step, for example, the through-hole 72 is formed in the bottom 712 of the recess 71 of the base material 2 using a milling device, a punching tool, or a laser cutter.
Note that the through hole forming step may be performed before the recess forming step.

Next, as shown in FIG. 6, the IC module 5 is placed in the accommodation hole 23 provided in the base material 2 (IC module placement step). Further, the IC chip 52 of the IC module 5 is placed in the second area 26, and the lead frame 51 is placed in the first area 25.
The antenna 6 is arranged on the first surface 21 of the base material 2, and the antenna 6 is connected to the lead frame 51 (antenna arrangement step). The antenna 6 disposed on the first surface 21 of the base material 2 is partially embedded in the base material 2. The antenna 6 can be embedded using ultrasonic waves and a metal head (oscillator). Ultrasonic waves have a frequency of about 10 kHz to 50 kHz.
The order in which the IC module placement step, the step of placing the antenna 6 on the base material 2 in the antenna placement step, and the step of connecting the antenna 6 to the IC module 5 may be performed in any order other than the above order. A substrate distorted by ultrasonic application can also be flattened by (short-term) heat pressing.
The heat pressing process is carried out in the form of rollers or plates. In the case of rollers, the speed can be about 0.1 m/min to 10 m/min. The temperature is 120°C to 190°C, and the time is 5 seconds or more and 20 minutes or less. Further, after heat pressing, aging may be added at a temperature of 40 degrees or more and 90 degrees or less for 1 hour or more and 3 days or less.

The base material 2 and the cover material 4 are bonded together using the elastic adhesive 3 (bonding step).
The elastic adhesive 3 is applied entirely or partially to the other surface of the cover material 4 in the thickness direction, and the base material 2 and the cover material 4 are bonded together. The elastic adhesive 3 is disposed between the first surface 21 of the base material 2 and the cover material 4, and also between the antenna 6 and the cover material 4, between the lead frame 51 and the cover material 4, and between the antenna 6 and the cover material 4. The cover material 4 is disposed between the joint portion 61 between the lead frame 51 and the cover material 4 . The first surface 21 of the base material 2 , the antenna 6 , the lead frame 51 , and the joint 61 between the antenna 6 and the lead frame 51 face the cover material 4 via the elastic adhesive 3 .
In this way, the covered non-contact IC inlet 1 can be manufactured.

Next, a description will be given of the covered non-contact IC inlet 1, the booklet, the method of manufacturing the covered non-contact IC inlet, and the functions and effects of the non-contact IC inlet according to the embodiment of the present invention described above.
The base material 2 of the covered non-contact IC inlet 1 is a single piece. Therefore, the step of bonding the plurality of base materials 2 together in the manufacturing process becomes unnecessary. This makes it easier to manufacture the non-contact IC inlet 1 with a cover, and also prevents positional displacement of the IC module 5 and antenna 6 due to shrinkage of the base material 2 due to heat and residual tension when bonding a plurality of base materials 2 together. can be prevented.
Furthermore, the non-contact IC inlet 1 with a cover according to the present embodiment does not require lamination equipment for bonding multiple base materials together, and also eliminates the need for maintenance of the control device necessary for temperature and pressure management in the lamination equipment, thereby reducing costs and It is possible to reduce labor.

Furthermore, in the non-contact IC inlet 1 with a cover according to the present embodiment, the accommodation hole 23 is provided in the single base material 2 and the IC module 5 is installed in the accommodation hole 23. It is easy to form and align the IC module 5 with respect to the base material 2.
For example, in a non-contact IC inlet with a cover where two base materials are bonded together, if accommodation holes are provided in each of the two base materials and an IC module is placed so as to straddle these two accommodation holes, two High-performance position correction equipment is required to prevent positional deviation from occurring in both accommodation holes. In the non-contact IC inlet 1 with a cover according to the present embodiment, such equipment is not required, and costs can be reduced.

In the non-contact IC inlet 1 with a cover according to the present embodiment, a first region 25 and a second region 26 having an outer diameter smaller than the first region 25 are provided inside the accommodation hole 23 . Therefore, a stepped portion 24 is formed on the inner circumferential surface of the accommodation hole 23 at the boundary between the first region 25 and the second region 26 . Thereby, by fitting the IC module 5 along the stepped portion 24 of the accommodation hole 23, the IC module 5 can be placed in the correct position, and the positional shift of the IC module 5 can be prevented.

In the covered non-contact IC inlet 1 according to the present embodiment, since the elastic adhesive 3 is filled between the cover material 4 and the lead frame 51 of the IC module 5 and between the cover material 4 and the antenna 6, this elastic The adhesive 3 can protect the IC module 5, the antenna 6, and the joint 61 between the antenna 6 and the lead frame 51. Furthermore, in the present invention, since the unevenness of the joint 61 between the antenna 6 and the lead frame 51 is covered with the elastic adhesive 3, the unevenness of the joint 61 between the antenna 6 and the lead frame 51 causes the unevenness on the surface of the cover material 4. can be prevented from occurring.

In the present embodiment, the elastic adhesive 3 has a Shore hardness of A30 or more and A95 or less, and the density of the elastic adhesive 3 applied to the base material 2 is 40 g/m ² or more and 100 g/m ² .
With such a configuration, the elastic adhesive 3 has appropriate flexibility. Due to its moderate flexibility, when the covered non-contact IC inlet 1 is bent, the elastic adhesive 3 follows the cover material 4 and the base material 2, so that the cover material 4 does not peel off from the base material 2 or the cover material 4 and It is possible to prevent cracks from forming in any of the base materials 2. Furthermore, by applying an appropriate amount of the elastic adhesive 3, the IC module 5, the antenna 6, and the joint 61 between the antenna 6 and the lead frame 51 can be well protected.

Further, in this embodiment, the second region 26 of the accommodation hole 23 may penetrate the base material 2.
With such a configuration, the accommodation hole 23 can be easily formed.

Moreover, in this embodiment, the antenna 6 is arranged on one surface of the base material 2, and a part of the antenna 6 is buried in the base material 2 with respect to the cross section of the antenna 6. Specifically, it may be buried above 1/4 and below 3/4 of the diameter of the antenna.
With such a configuration, the height at which the antenna 6 is exposed from the base material 2 is reduced, so that the antenna 6 can be covered even with a small amount of the elastic adhesive 3.

In addition, in the accommodation hole forming step of the method for manufacturing the covered non-contact IC inlet 1 according to the present embodiment, a recess 71 that does not penetrate the base material 2 is provided at a position where the first region 25 of the accommodation hole 23 in the base material 2 is provided. A recess forming step and a through hole forming step of providing a through hole 72 having an outer diameter smaller than the outer diameter of the recess 71 and penetrating the bottom 712 of the recess 71 at a position in the base material 2 where the second region 26 of the accommodation hole 23 is provided. and do.
With such a configuration, the accommodation hole 23 having the stepped portion 24 on the inner circumferential surface can be easily provided in the base material 2.

The embodiments of the covered non-contact IC inlet 1, the booklet, and the method for manufacturing the covered non-contact IC inlet 1 according to the present invention have been described above, but the present invention is not limited to the above embodiments. Changes may be made as appropriate without departing from the spirit.
For example, in the above embodiment, the accommodation hole 23 penetrates the base material 2, but it does not need to penetrate the base material 2 as long as it is opened on one side in the thickness direction. That is, the second region 26 may not penetrate the base material 2 but may have a recessed shape.

In the embodiment described above, a portion of the antenna 6 on the base material 2 side is buried within the base material 2, but the antenna 6 does not need to be buried in the base material 2. Moreover, a portion of the antenna 6 in the length direction may be buried in the base material 2.

The Shore hardness of the elastic adhesive 3 may be outside the range of A30 or more and A95 or less. The amount of the elastic adhesive 3 applied to the base material 2 per unit area may be outside the range of 40 g/m ² or more and 100 g/m ² .

In the above embodiment, the accommodation hole 23 is formed by forming the recess 71 in the base material 2 and then forming the through hole 72, but the accommodation hole 23 may be formed by a method other than the above.

1 Non-contact IC inlet 2 Base material 3 Elastic adhesive 4 Cover material 5 IC module 6 Antenna 23 Accommodation hole 24 Step portion 25 First region 26 Second region 71 Recess 72 Through hole

Claims (10)

IC module and
a sheet-like single-layer base material in which a housing hole capable of housing the IC module is formed;
a cover material bonded to the base material using an elastic adhesive;
a coil-shaped antenna arranged on a side of the base material to be bonded to the cover material and connected to the IC module;
The base material is a foamed or porous plastic sheet,
Inside the accommodation hole,
a first region located on the side of the base material to be bonded to the cover material and open to the side to be bonded to the cover material;
a second region located on the opposite side of the first region of the base material to the side to be bonded to the cover material and communicating with the first region,
The second region has a smaller outer shape than the first region,
The cover material is
The texture layer is a single substance, or the texture layer and the resin layer are bonded together,
in contact with the elastic adhesive;
the thickness of the elastic adhesive is greater than 10% of the cross-sectional diameter of the antenna;
A non-contact IC inlet with a cover, in which the IC module and the antenna face the cover material via the elastic adhesive. The cover material has the texture layer and the resin layer bonded together,
The covered non-contact IC inlet according to claim 1, wherein the resin layer is in contact with the elastic adhesive. The shore hardness of the elastic adhesive is A30 or more and A95 or less,
2. The non-contact IC inlet with a cover according to claim 1, wherein the amount of the elastic adhesive applied to the base material per unit area is 40 g/ ^m2 or more and 100 g/ ^m2 or less. The covered non-contact IC inlet according to claim 1, wherein the second region penetrates the base material. 2. The covered non-contact IC inlet according to claim 1, wherein the second region has a depression-like configuration having a bottom surface in the base material or partially penetrates the base material. 2. The covered non-contact IC inlet according to claim 1, wherein the antenna is partially buried within the base material. A booklet comprising the covered non-contact IC inlet according to any one of claims 1 to 6. A method for manufacturing a covered non-contact IC inlet according to any one of claims 1 to 6, comprising:
an accommodation hole forming step of providing the accommodation hole in the base material;
an IC module placement step of placing the IC module in the accommodation hole;
an antenna placement step of placing the antenna on a side of the base material that is bonded to the cover material;
A method for manufacturing a non-contact IC inlet with a cover, the method comprising: bonding the base material and the cover material together using the elastic adhesive. In the accommodation hole forming step,
a recess forming step of providing a recess that does not penetrate the base material at a position in the base material where the first region of the accommodation hole is provided;
9. A through-hole forming step of providing a through-hole having an outer diameter smaller than the outer diameter of the recess and penetrating through the bottom of the recess at a position in the base material where the second region of the accommodation hole is provided. A method for manufacturing a non-contact IC inlet with a cover as described in . IC module and
a sheet-like single-layer base material in which a housing hole capable of housing the IC module is formed;
a coil-shaped antenna arranged on one surface of the base material and connected to the IC module;
Inside the accommodation hole,
a first region located on the one surface side of the base material and open to the one surface side;
a second region located on the other surface side of the base material, which is a surface opposite to the one surface, than the first region, and communicating with the first region;
The second region has a smaller outer shape than the first region,
The base material is a foamed or porous plastic sheet,
The bulk density of the base material is 0.5 g/cm ³ or more and 1.5 g/cm ³ or less,
The wire of the antenna is a resin-coated metal conductor in which a metal conductor is coated with resin,
The conductor of the wire is a single wire,
The cross section of the conductor of the wire is circular, and the cross-sectional area is 1800 μm ² or more and 72000 μm ² or less,
The ratio w/(d+w) between the width w of the wire and the sum d+w of the width d of a blank portion between the arranged wires and the width w of the wire is 0.04 or more. A non-contact IC inlet with a temperature of 0.5 or less.

Images