JP2023052355A - Vapor chamber, sheet for vapor chamber, and method for manufacturing vapor chamber - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vapor chamber that can improve heat transport efficiency.

SOLUTION: A vapor chamber comprises a sealed space filled with working fluid. The sealed space is provided with a plurality of vapor flow passages in which the working fluid in a gas state flows, and a wick material 103 provided between the plurality of vapor flow passages adjacent to each other, and in which the working fluid in a liquid state flows. At least a portion of an outer surface of the vapor chamber at a position overlapping with the vapor flow passages in a planar view is provided with at least one of a concave part and a convex part. The concave part and the convex part have a curved shape in a cross section orthogonal to a direction in which the vapor flow passages extend.

SELECTED DRAWING: Figure 24

COPYRIGHT: (C)2023,JPO&INPIT

Description

The present disclosure relates to a vapor chamber having a sealed space in which a working fluid is sealed, a vapor chamber sheet, and a vapor chamber manufacturing method.

Devices that generate heat such as central processing units (CPUs), light emitting diodes (LEDs), and power semiconductors used in mobile terminals such as mobile terminals and tablet terminals are cooled by heat dissipating members such as heat pipes ( For example, see Patent Document 1). In recent years, in order to reduce the thickness of mobile terminals and the like, there has been a demand for thinner heat dissipating members, and the development of vapor chambers that can be made thinner than heat pipes is underway. The vapor chamber has a structure in which two sheets are joined together, and a sealed space in which a working fluid is enclosed is formed between the two sheets. The working fluid cools the device by absorbing the heat of the device and releasing it to the outside.

More specifically, the working fluid in the vapor chamber receives heat from the device at the portion (evaporator) that is close to the device, evaporates from liquid to gas, and then the gas moves to a position away from the evaporator. , where it cools and condenses into a liquid. A liquid flow path as a capillary structure (wick) is provided in the vapor chamber, and the liquid working fluid passes through this liquid flow path and is transported toward the evaporator, where it returns to the evaporator. Evaporate under heat. In this way, the working fluid circulates in the vapor chamber while repeating phase changes, that is, evaporation and condensation, thereby transferring heat in the device and increasing heat transport efficiency.

JP 2015-121355 A

An object of the present disclosure is to provide a vapor chamber, a vapor chamber sheet, and a vapor chamber manufacturing method capable of improving heat transport efficiency.

The present application relates to a vapor chamber having a sealed space in which a working fluid is sealed, wherein the sealed space includes a plurality of vapor channels through which a gaseous working fluid flows and provided between a plurality of adjacent vapor channels, a wicking material through which a working fluid in a liquid state flows, and at least one of a concave portion and a convex portion is provided on at least a portion of an outer surface of the vapor chamber at a position overlapping the vapor flow path in a plan view, and the concave portion and the convex portion disclose a vapor chamber having a curved shape in a cross section orthogonal to the direction in which the vapor flow path extends.

Further, the present application relates to a vapor chamber having a sealed space in which a working fluid is enclosed, wherein the sealed space includes a plurality of vapor flow paths through which the gaseous working fluid flows, and a plurality of adjacent vapor flow paths provided between the vapor flow paths. a liquid channel or wick material through which the working fluid in a liquid state flows; 1, a vapor chamber is provided over the entire width of the steam channel in a cross section perpendicular to the direction in which the steam channel extends.

Further, the present application relates to a vapor chamber having a sealed space in which a working fluid is enclosed, wherein the sealed space includes a plurality of vapor flow paths through which the gaseous working fluid flows, and a plurality of adjacent vapor flow paths provided between the vapor flow paths. a liquid channel or wick material through which the working fluid in a liquid state flows; , discloses a vapor chamber that is not positioned to overlap the liquid flow path or wick material in plan view.

According to the embodiment of the present disclosure, heat transport efficiency can be improved.

FIG. 1 is a perspective view schematically showing an electronic device having a vapor chamber. 2 is a top view of a vapor chamber according to aspects of the present disclosure; FIG. 3 is a cross-sectional view taken along the line AA showing the vapor chamber of FIG. 2. FIG. 4 is a plan view of the lower sheet of FIG. 2; FIG. 5 is a bottom view of the upper sheet of FIG. 2; FIG. FIG. 6 is an enlarged cross-sectional view showing the steam flow path concave portion shown in FIG. 3 . 7 is an enlarged top view of a portion B showing the liquid flow path portion of FIG. 4. FIG. 8 is an enlarged cross-sectional view showing the liquid flow path portion of FIG. 6. FIG. FIG. 9 is a cross-sectional view showing an example in which the upper sheet is also provided with main grooves. 10 is a diagram for explaining the first preparation step of the lower material sheet in the method of manufacturing the vapor chamber of FIG. 2. FIG. FIG. 11 is a diagram for explaining a step of forming the lower flow channel grooves of the lower material sheet in the method of manufacturing the vapor chamber of FIG. 2. FIG. 12 is a diagram for explaining a second preparation step for the upper material sheet in the method of manufacturing the vapor chamber of FIG. 2. FIG. FIG. 13 is a diagram for explaining a step of forming upper flow passage grooves in the upper material sheet in the method of manufacturing the vapor chamber of FIG. 2; 14A and 14B are diagrams for explaining a temporary fixing step in the manufacturing method of the vapor chamber of FIG. 2. FIG. 15A and 15B are diagrams for explaining a bonding step in the vapor chamber manufacturing method of FIG. 2. FIG. FIG. 16 is a view showing the steam flow channel recess after bonding in the bonding step of FIG. 14 . FIG. 17 is a diagram for explaining a working fluid injection step in the vapor chamber manufacturing method of FIG. 2 . FIG. 18 is a partially enlarged cross-sectional view showing a state in which the lower sheet is pressed in the vapor chamber of the modification. FIG. 19 is a partially enlarged cross-sectional view showing a state in which the upper sheet is pressed in the vapor chamber of the modification. FIG. 20 is an enlarged cross-sectional view showing a vapor chamber in a modified example. 21 is an enlarged sectional view showing a modification of the vapor chamber shown in FIG. 20. FIG. 22 is an enlarged sectional view showing a modification of the vapor chamber shown in FIG. 20. FIG. FIG. 23 is an enlarged cross-sectional view showing a three-sheet vapor chamber. FIG. 24 is an enlarged cross-sectional view showing another example three-sheet vapor chamber. FIG. 25 is an enlarged cross-sectional view showing a vapor chamber consisting of four sheets. FIG. 26 is an enlarged cross-sectional view showing an example of a vapor chamber having projections.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In addition, in the drawings attached to this specification, for the convenience of illustration and easy understanding, the scale, the ratio of vertical and horizontal dimensions, etc. may be appropriately changed and exaggerated from those of the real thing.
In addition, in the vapor chamber, the working fluid moves in the sealed space while undergoing a phase change. It is sometimes described as "liquid".

First, an electronic device E on which the vapor chamber 1 according to the present embodiment is mounted will be described by taking a tablet terminal as an example. As shown in FIG. 1 , the electronic device E (tablet terminal) includes a housing H, a device D housed in the housing H, and a vapor chamber 1 . In the electronic device E shown in FIG. 1, a touch panel display TD is provided on the front surface of the housing H. As shown in FIG. The vapor chamber 1 is housed within the housing H and placed in thermal contact with the device D. As shown in FIG. This allows the vapor chamber 1 to receive the heat generated by the device D when the electronic equipment E is used. The heat received by the vapor chamber 1 is released to the outside of the vapor chamber 1 via a working fluid, which will be described later. In this way device D is cooled. If the electronic device E is a tablet terminal, the device D corresponds to a central processing unit or the like.

2 to 21, the vapor chamber, vapor chamber sheet, and vapor chamber manufacturing method according to the embodiment of the present disclosure will be described. The vapor chamber 1 in this embodiment has a sealed space 3 in which a working fluid 2 (see FIG. 6) is enclosed. It is a device for cooling devices D (devices to be cooled) that generate heat such as central processing units (CPUs), light emitting diodes (LEDs), and power semiconductors used in mobile terminals and the like. The vapor chamber 1 is generally formed in the shape of a thin flat plate.

As shown in FIGS. 2 and 3, the vapor chamber 1 of this embodiment includes a lower sheet 10 (first sheet, vapor chamber sheet) and an upper sheet 20 (second sheet) provided on the lower sheet 10. , sheet for vapor chamber). The lower sheet 10 has an upper surface 10a (first sheet surface) and a lower surface 10b (first opposite surface) opposite to the upper surface 10a. A device D, which is an object to be cooled, is attached to the lower surface 10b (in particular, the lower surface of the evaporator 11, which will be described later). The upper sheet 20 has a lower surface 20a (second sheet surface) and an upper surface 20b (second opposite surface) provided on the opposite side of the lower surface 20a. The lower surface 20a is overlaid on the upper surface 10a of the lower sheet 10, and the lower sheet 10 and the upper sheet 20 are joined by diffusion bonding, which will be described later.

A sealed space 3 containing a working fluid is formed between the lower sheet 10 and the upper sheet 20 . Examples of working fluids include pure water, ethanol, methanol, acetone, mixtures thereof, and the like.

2 and 3 show an example in which both the lower sheet 10 and the upper sheet 20 are formed in a rectangular shape in a plan view, but they are not limited to this. In addition to being rectangular like this form, when viewed from above, it is circular, elliptical, triangular, other polygonal, shapes with bent portions, such as L-shaped, T-shaped, crank-shaped, etc., and combinations thereof can be shaped.
Here, the planar view means that the vapor chamber 1 is seen from the normal direction of the surface receiving heat from the device D (the lower surface 10b of the lower sheet 10) and the surface emitting the received heat (the upper surface 20b of the upper sheet 20). This corresponds to, for example, a state in which the vapor chamber 1 is viewed from above (see FIG. 2) or a state viewed from below.

Here, the first sheet is referred to as the lower sheet and the second sheet as the upper sheet, but this does not necessarily limit the vertical relationship and is for the sake of convenience. Here, the sheet that receives heat from the device D is the first sheet, and the sheet that is arranged on the opposite side is the second sheet. The descriptions of "upper" and "lower" given to other parts are merely to match this description.

As shown in FIGS. 3 and 4, the lower sheet 10 includes an evaporating portion 11 that evaporates the working fluid 2 to generate steam, and a lower steam portion that is provided on the upper surface 10a and has a rectangular shape in plan view. and a channel recess 12 (first steam channel recess). Of these, the lower steam flow passage concave portion 12 constitutes a part of the sealed space 3 described above, and is mainly configured so that the steam generated in the evaporating portion 11 passes therethrough.

In this embodiment, the lower steam channel recessed portion 12 includes a plurality of lower channel grooves (that is, a plurality of first lower channel grooves 12G1, a plurality of second lower channel grooves 12G2, and a plurality of second lower channel grooves 12G2). 3 lower channel grooves 12G3). Each of the first lower channel grooves 12G1 and the second lower channel grooves 12G2 extends in the first direction X so that the working fluid containing a large amount of steam passes therethrough, and is perpendicular to the first direction X. are arranged at different positions with intervals in the second direction Y.
On the other hand, the third lower flow groove 12G3 extends in the second direction Y and communicates with both ends of the first lower flow groove 12G1 and the second lower flow groove 12G2. In this embodiment, each of the lower channel grooves 12G1, 12G2, 12G3 has a curved portion in cross section. A bottom surface 12a, which will be described later, corresponds to a portion of the wall surface of the lower steam channel concave portion 12 on the side of the lower surface 10b of the lower sheet 10. As shown in FIG.

The evaporator 11 is arranged in the lower steam channel recess 12, and the first lower channel groove 12G1 overlaps the evaporator 11 in plan view. The steam in the lower steam passage concave portion 12 diffuses away from the evaporating portion 11, and most of the steam is transported toward the peripheral portion where the temperature is relatively low.

The evaporating portion 11 is a portion where the working fluid 2 in the sealed space 3 evaporates by receiving heat from the device D attached to the lower surface 10b of the lower sheet 10 . Therefore, the term evaporating section 11 is not limited to the portion overlapping the device D in plan view of the vapor chamber, but also includes the portion where the working liquid 2 can evaporate even if it does not overlap the device D. is used as Here, the evaporating section 11 can be provided at any position on the lower sheet 10, but FIGS. In this case, it is possible to prevent the attitude of the mobile terminal in which the vapor chamber 1 is installed from affecting the stabilization of the operation of the vapor chamber 1 .

In this embodiment, as shown in FIGS. 3, 4, and 6, the lower steam channel recess 12 protrudes above the bottom surface 12a of the lower steam channel recess 12 (in a direction perpendicular to the upper surface 10a). A plurality of lower channel wall portions 13 (first channel wall portions) are provided. The lower channel wall portion 13 includes an upper surface 13a (protruding end face) that contacts a lower surface 22a of an upper channel wall portion 22, which will be described later.

In this embodiment, the lower channel wall portion 13 elongates along the direction (X direction) in which the first lower channel groove 12G1 and the second lower channel groove 12G2 of the vapor chamber 1 extend. Examples are given. The respective lower flow path wall portions 13 are arranged in parallel with each other at regular intervals. The lower steam channel recessed portion 12 is partitioned by the lower channel wall portion 13 into the above-described first lower channel groove 12G1 and second lower channel groove 12G2. That is, the first lower channel grooves 12G1 are formed between the lower channel wall portions 13 adjacent to each other. Similarly, a second lower channel groove 12G2 is formed between a lower peripheral edge wall 14, which will be described later, and a lower channel wall portion 13 adjacent thereto in the second direction Y. As shown in FIG.
In this manner, the steam flows around each lower channel wall portion 13 and is transported away from the evaporating portion 11, thereby suppressing obstruction of the steam flow. ing. For example, in the first lower channel groove 12G1, steam is transported toward the third lower channel groove 12G3.

In addition, the lower channel wall portion 13 is arranged so as to overlap with a corresponding later-described upper channel wall portion 22 of the upper sheet 20 in a plan view, thereby improving the mechanical strength of the vapor chamber 1. .
The width w0 of the lower flow path wall portion 13 shown in FIGS. 6 and 7 is preferably 3000 μm or less, may be 1500 μm or less, or may be 1000 μm or less at the upper surface 10a. On the other hand, the width w0 at the upper surface 10a is preferably 100 μm or more, may be 200 μm or more, or may be 400 μm or more. Also, the range of width w0 may be determined by a combination of any one of the plurality of upper limit candidate values and one of the plurality of lower limit candidate values. Also, the range of width w0 may be determined by combining any two of the plurality of upper limit candidate values or by combining any two of the plurality of lower limit candidate values. Here, the width w0 means the dimension of the lower channel wall portion 13 in the direction (Y direction) orthogonal to the longitudinal direction (X direction) of the lower channel wall portion 13. For example, FIG. It corresponds to the vertical dimension in FIG. 7 or the horizontal dimension in FIG.
The width w1 of the first lower channel groove 12G1 (interval between the lower channel walls 13 adjacent to each other) is preferably 2000 μm or less, may be 1500 μm or less, or may be 1000 μm or less on the upper surface 10a. may be On the other hand, the width w1 at the upper surface 10a is preferably 100 μm or more, may be 200 μm or more, or may be 400 μm or more. Also, the range of the width w1 may be determined by a combination of any one of the plurality of upper limit candidate values and one of the plurality of lower limit candidate values. Also, the range of the width w1 may be determined by combining any two of the plurality of upper limit candidate values or by combining any two of the plurality of lower limit candidate values.
The width of the second lower flow groove 12G2 and the width of the third lower flow groove 12G3 may be equal to the width of the first lower flow groove 12G1.

In addition, the height h0 of the lower flow path wall portion 13 shown in FIG. It may be 100 μm or less. On the other hand, the height h0 is preferably 10 μm or more, may be 25 μm or more, or may be 50 μm or more. Also, the range of the height h0 may be determined by a combination of any one of the plurality of upper limit candidate values and one of the plurality of lower limit candidate values. Also, the range of the height h0 may be determined by combining any two of a plurality of upper limit candidate values or by combining any two of a plurality of lower limit candidate values.

As shown in FIGS. 3 and 4, a lower peripheral wall 14 is provided at the peripheral edge of the lower seat 10 . The lower peripheral wall 14 is formed so as to surround the sealed space 3 , particularly the lower steam channel recess 12 , and defines the sealed space 3 . Lower alignment holes 15 for positioning the lower sheet 10 and the upper sheet 20 are provided at the four corners of the lower peripheral wall 14 in plan view.

As shown in FIG. 6, the lower surface 10b of the lower seat 10 is provided with a lower seat recess 50 (first seat recess) recessed toward the lower steam flow channel recess 12. As shown in FIG. The lower seat recessed portion 50 is arranged at a position overlapping the lower steam flow path recessed portion 12 in plan view on the lower surface 10b. FIG. 6 shows an example in which the cross-sectional shape of the lower seat recessed portion 50 has a curved portion. good too.

In this embodiment, as described above, a plurality of lower flow channel wall portions 13 are provided in the lower steam flow channel recessed portion 12, and the first lower flow channel wall portion 13 defined by the lower flow channel wall portions 13 is provided. A channel groove 12G1, a second lower channel groove 12G2 and a third lower channel groove 12G3 are formed. As a result, the lower seat recessed portion 50 is arranged between a pair of lower flow path wall portions 13 adjacent to each other (at a position overlapping the first lower flow path groove 12G1). The lower seat recessed portion 50 that overlaps with the first lower flow groove 12G1 is elongated and continuously extends along the first direction X along the first lower flow groove 12G1 in plan view. In addition, the lower seat recessed portion 50 may also be formed between the lower peripheral edge wall 14 and the adjacent lower channel wall portion 13 (position overlapping the second lower channel groove 12G2). good. The lower seat recessed portion 50 that overlaps with the second lower flow groove 12G2 extends continuously in the first direction X along the second lower flow groove 12G2. Furthermore, a lower seat recess 50 may be formed at a position overlapping the third lower flow channel 12G3 in plan view, and the lower seat recess 50 may be formed along the third lower flow channel 12G3. In addition, it extends continuously along the second direction Y in an elongated shape.

In addition, as shown in FIG. 6 , a bottom surface 12a that protrudes inward of the lower steam flow path recessed portion 12 is provided at a position overlapping the lower seat recessed portion 50 in a plan view in the bottom surface 12a that defines the lower steam flow path recessed portion 12. A side bottom surface protrusion 51 (first bottom surface protrusion) is provided. FIG. 6 shows an example in which the cross-sectional shape of the lower bottom surface convex portion 51 is curved in the same shape as the lower seat concave portion 50, but is not limited thereto, and may be rectangular, V-shaped, And it may be a shape in which these are combined.

In a plan view, the lower bottom surface convex portion 51 is located between a pair of mutually adjacent lower flow channel wall portions 13 (at a position overlapping the first lower flow channel groove 12G1), similarly to the lower seat concave portion 50. are placed. The lower bottom surface convex portion 51 that overlaps the first lower flow groove 12G1 is elongated and continuously extends along the first direction X along the first lower flow groove 12G1. In addition, the lower bottom surface convex portion 51 is also formed between the lower peripheral edge wall 14 and the adjacent lower channel wall portion 13 (position overlapping the second lower channel groove 12G2). good too. The lower bottom surface convex portion 51 that overlaps the second lower flow groove 12G2 is elongated and continuously extends along the first direction X along the second lower flow groove 12G2. Furthermore, a lower bottom surface convex portion 51 may be formed at a position overlapping the third lower flow groove 12G3 in plan view, and the lower bottom surface convex portion 51 may be formed in the third lower flow groove 12G3. , elongated continuously along the second direction Y. That is, in this embodiment, the lower bottom surface convex portion 51 is formed along with the formation of the lower seat concave portion 50 as will be described later. It is formed in a planar shape. It should be noted that each of the lower bottom surface projections 51 is elongated and continuously extended as described above, thereby preventing the flow of steam in each of the lower flow grooves 12G1 to 12G3 from being obstructed.

As shown in FIG. 6, the thickness t3 of the portion between the lower surface 10b of the lower sheet 10 in which the lower recessed portion 50 is formed and the first lower channel groove 12G1 is smaller than the thickness t4 of the portion between That is, t3 is thinner than t4.

In this embodiment, the upper sheet 20 has substantially the same structure as the lower sheet 10, except that the liquid flow path section 30, which will be described later, is not provided. The configuration of the upper sheet 20 will be described in more detail below.

As shown in FIGS. 3 and 5, the upper sheet 20 has an upper steam channel recess 21 (second steam channel recess) provided in the lower surface 20a. The upper steam flow passage concave portion 21 constitutes a part of the sealed space 3 and is mainly configured so that the steam generated in the evaporating portion 11 passes through and cools the steam. The upper steam channel recess 21 is formed so as to overlap the lower steam channel recess 12 in plan view. The depth of the upper steam channel recess 21 may be the same as the depth h0 of the lower steam channel recess 12 .

In this embodiment, the upper steam channel recessed portion 21 includes a plurality of upper channel grooves (that is, a plurality of first upper channel grooves 21G1, a plurality of second upper channel grooves 21G2, and a plurality of third upper channel grooves). groove 21G3). Each of the first upper channel grooves 21G1 and the second upper channel grooves 21G2 extends in the first direction X so that the steam passes therethrough, and differs from each other in the second direction Y orthogonal to the first direction X. They are arranged at positions with intervals. The third upper flow groove 21G3 extends in the second direction Y and communicates with both ends of the first upper flow groove 21G1 and the second upper flow groove 21G2. In this embodiment, each upper flow channel groove 21G1, 21G2, 21G3 is formed to have a curved portion in the cross section. A bottom surface 21a, which will be described later, corresponds to a portion of the wall surface of the upper steam channel recess 21 on the side of the upper surface 20b of the upper sheet 20. As shown in FIG.

The steam in the upper steam passage concave portion 21 diffuses away from the evaporating portion 11, and most of it is transported toward the relatively low-temperature peripheral portion.

Further, as shown in FIG. 3, on the upper surface 20b of the upper sheet 20 is arranged a housing member H that constitutes a part of the housing of a mobile terminal or the like. As a result, the steam in the upper steam passage recess 21 is cooled by the outside through the upper sheet 20 and the housing member H.

In this embodiment, as shown in FIGS. 2, 5, and 6, in the upper steam channel recess 21 of the upper sheet 20, from the bottom surface 21a of the upper steam channel recess 21 downward (perpendicular to the lower surface 20a) A plurality of projecting upper channel wall portions 22 (second channel wall portions) are provided. The upper channel wall portion 22 includes a lower surface 22a (protruding end surface) that contacts the upper surface 13a of the lower channel wall portion 13 described above. Here, the bottom surface 21a of the upper steam channel recess 21 can be called a ceiling surface in the vertical arrangement relationship between the lower sheet 10 and the upper sheet 20 as shown in FIG. Since it corresponds to the back surface of 21, it is referred to as bottom surface 21a in this specification.

In this embodiment, an example is shown in which the upper flow path wall portion 22 extends long and narrow along the first upper flow groove 21G1 and the second upper flow groove 21G2 (horizontal direction in FIG. 5). And each upper flow-path wall part 22 is spaced apart by equal intervals, and is mutually arrange|positioned in parallel. The upper steam channel recessed portion 21 is partitioned into the above-described first upper channel groove 21G1 and second upper channel groove 21G2 by the upper channel wall portion 22 . That is, a first upper flow channel groove 21G1 is formed between a pair of upper flow channel wall portions 22 adjacent to each other. Similarly, a second upper channel groove 21G2 is formed between an upper peripheral wall 23, which will be described later, and an upper channel wall portion 22 adjacent thereto. In this manner, the steam flows around each upper flow channel wall portion 22 and is transported toward the peripheral edge portion of the upper steam flow channel concave portion 21, so that the flow of steam is prevented. is suppressed. For example, in the first upper channel groove 21G1, steam is transported toward the third upper channel groove 21G3.

Further, the upper flow path wall portion 22 is arranged so as to overlap the corresponding lower flow path wall portion 13 of the lower sheet 10 in plan view, thereby improving the mechanical strength of the vapor chamber 1 . 2, 3, and 6 show an example in which the width and height of the upper channel wall portion 22 are the same as the width w0 and height h0 of the lower channel wall portion 13 described above. Yes, but they do not have to be the same. Moreover, the width of the first upper flow groove 21G1 may be equal to the width of the first lower flow groove 12G1, or may be larger or smaller. The width of the third upper channel groove 21G3 may be equal to, greater than or smaller than the width of the third lower channel groove 12G3. good too.

As shown in FIGS. 3 and 5, an upper peripheral wall 23 is provided at the peripheral edge of the upper sheet 20 . The upper peripheral wall 23 is formed so as to surround the sealed space 3 , particularly the upper steam channel recess 21 , and defines the sealed space 3 . Further, upper alignment holes 24 for positioning the lower sheet 10 and the upper sheet 20 are provided at the four corners of the upper peripheral wall 23 in plan view. That is, each upper alignment hole 24 is arranged so as to overlap with each lower alignment hole 15 described above at the time of temporary fixing, which will be described later, so that the lower sheet 10 and the upper sheet 20 can be positioned.

As shown in FIG. 6, the upper surface 20b of the upper sheet 20 is provided with an upper sheet recess 60 (second sheet recess) that is recessed toward the upper steam flow path recess 21. As shown in FIG. The upper seat recessed portion 60 is arranged at a position overlapping the upper steam flow path recessed portion 21 in plan view on the upper surface 20b. FIG. 6 shows an example in which the cross-sectional shape of the upper seat recessed portion 60 has a curved portion. may

In this embodiment, as described above, a plurality of upper flow channel wall portions 22 are provided in the upper steam flow channel concave portion 21, and the first upper flow channel grooves 21G1 defined by the upper flow channel wall portions 22, A second upper flow groove 21G2 and a third upper flow groove 21G3 are formed. As a result, the upper seat concave portion 60 is arranged between a pair of upper flow path wall portions 22 adjacent to each other (at a position overlapping the first upper flow path groove 21G1). The upper seat recessed portion 60 that overlaps with the first upper flow groove 21G1 is elongated and continuously extends along the first direction X along the first upper flow groove 21G1 in plan view. Further, the upper seat recess 60 may also be formed between the upper peripheral wall 23 and the adjacent upper channel wall 22 (at a position overlapping the second upper channel groove 21G2). The upper seat concave portion 60 that overlaps with the second upper flow groove 21G2 is elongated and continuously extends along the first direction X along the second upper flow groove 21G2. Furthermore, an upper seat recess 60 may be formed at a position that overlaps the third upper flow channel 21G3 in plan view, and the upper seat recess 60 may extend along the third upper flow channel 21G3 so as to extend along the second upper flow channel 21G3. It extends continuously along the direction Y in an elongated fashion.

Further, as shown in FIG. 6 , an upper bottom surface convex portion protruding inward of the upper steam channel recessed portion 21 is provided at a position overlapping the upper sheet recessed portion 60 in plan view in the bottom surface 21 a defining the upper steam channel recessed portion 21 . 61 (second bottom projection) is provided. FIG. 6 shows an example in which the cross-sectional shape of the upper bottom surface convex portion 61 has a curved portion in the same shape as the upper sheet concave portion 60, but is not limited to this, and may be rectangular, It may be V-shaped or a combination thereof.

The upper bottom surface convex portion 61 is arranged between a pair of mutually adjacent upper flow channel wall portions 22 (at a position overlapping the first upper flow channel groove 21G1) in plan view, similarly to the upper seat concave portion 60. . The upper bottom surface convex portion 61 that overlaps with the first upper flow groove 21G1 is elongated and continuously extends along the first direction X along the first upper flow groove 21G1. The upper bottom surface convex portion 61 may also be formed between the upper peripheral edge wall 23 and the adjacent upper flow channel wall portion 22 (position overlapping the second upper flow channel groove 21G2). The upper bottom surface convex portion 61 that overlaps with the second upper flow groove 21G2 is elongated and continuously extends along the first direction X along the second upper flow groove 21G2. Furthermore, an upper bottom surface protrusion 61 may be formed at a position overlapping the third upper flow groove 21G3 in a plan view, and the upper bottom surface protrusion 61 is formed along the third upper flow groove 21G3. It extends continuously in the second direction Y and is elongated. That is, in this embodiment, the upper bottom surface convex portion 61 is formed along with the formation of the upper seat concave portion 60 as will be described later. It is It should be noted that the upper bottom surface protrusions 61 are elongated and continuously extended as described above, so that the flow of steam in the upper flow grooves 21G1 to 21G3 is prevented from being obstructed.

In FIG. 6, the thickness t5 of the portion between the upper surface 20b of the upper sheet 20 and the upper steam channel recess 21 is equal to the thickness t3 of the lower sheet 10 described above. However, this thickness t5 may be different from the thickness t3.

Such lower sheet 10 and upper sheet 20 are permanently bonded together, preferably by diffusion bonding. More specifically, as shown in FIG. 3, the upper surface 14a of the lower peripheral wall 14 of the lower sheet 10 and the lower surface 23a of the upper peripheral wall 23 of the upper sheet 20 are in contact with each other, The upper peripheral wall 23 is joined together. As a result, a sealed space 3 is formed between the lower sheet 10 and the upper sheet 20 to seal the working fluid. In addition, the upper surface 13a of the lower flow path wall portion 13 of the lower sheet 10 and the lower surface 22a of the upper flow path wall portion 22 of the upper sheet 20 are in contact with each other, and the upper flow path corresponding to each lower flow path wall portion 13 is formed. The road wall portion 22 is joined to each other. This improves the mechanical strength of the vapor chamber 1 . When the lower channel wall portion 13 and the upper channel wall portion 22 according to the present embodiment are arranged at regular intervals, the mechanical strength at each position of the vapor chamber 1 can be made nearly equal. The lower sheet 10 and the upper sheet 20 may be joined by other methods such as brazing instead of diffusion joining as long as they can be joined permanently. Here, the term "permanently joined" is not limited to a strict meaning. It means that the upper sheet 20 is bonded to the lower surface 20a of the upper sheet 20 to such an extent that the bonding can be maintained.

In addition, as shown in FIG. 2, the vapor chamber 1 further includes an injection part 4 for injecting the working fluid into the sealed space 3 at one of the pair of ends in the longitudinal direction. As shown in FIGS. 4 and 5, the injection part 4 has a lower injection projection 16 projecting from the end surface of the lower sheet 10 and an upper injection projection 25 projecting from the end surface of the upper sheet 20. are doing. A lower injection channel recess 17 is formed on the upper surface of the lower injection projection 16 , and an upper injection channel recess 26 is formed on the lower surface of the upper injection projection 25 . The lower injection channel recess 17 communicates with the lower steam channel recess 12 (more specifically, one third lower channel groove 12G3), and the upper injection channel recess 26 communicates with the upper steam flow channel. It communicates with the passage recess 21 (more specifically, one third upper passage groove 21G3). The lower injection channel recess 17 and the upper injection channel recess 26 form injection channels for the hydraulic fluid when the lower sheet 10 and the upper sheet 20 are joined together. The working fluid is injected into the sealed space 3 through the injection channel. In addition, in this embodiment, an example in which the injection part 4 is provided at one end of a pair of ends in the longitudinal direction of the vapor chamber 1 is shown, but it is not limited to this. It may be arranged at any other end, or a plurality thereof may be arranged. When a plurality of them are arranged, for example, they may be arranged at each of a pair of ends in the longitudinal direction of the vapor chamber 1, or may be arranged at one end of the other pair of ends.

Further, as shown in FIGS. 4, 7 and 8, the upper surface 13a of each lower flow path wall 13 is provided with a lower liquid flow path 30 through which the working fluid 2 passes. The lower liquid flow path portion 30 constitutes a part of the sealed space 3 described above, and communicates with the lower steam flow path recessed portion 12 and the upper steam flow path recessed portion 21 described above.

The lower liquid flow path section 30 has a plurality of mainstream grooves 31 . Each mainstream groove 31 extends in the first direction X along the direction in which the lower flow path wall portion 13 extends, and the hydraulic fluid 2 passes through it. are arranged at intervals in different positions. The main groove 31 is mainly configured to transport the working fluid 2 condensed from the vapor generated in the evaporator 11 toward the evaporator 11 .

In this embodiment, the mainstream groove 31 is elongated along the longitudinal direction (the first direction X) of the lower channel wall portion 13 , and the longitudinal direction of the lower channel wall portion 13 is shown. extends from one end to the other in the Each mainstream groove 31 communicates with the third lower flow channel groove 12G3 of the lower steam flow channel concave portion 12. As shown in FIG. In this manner, the working fluid 2 condensed at the peripheral edge of the lower steam channel recess 12 and the peripheral edge of the upper steam channel recess 21 is transported toward the evaporator 11 by capillary action. A plurality of mainstream grooves 31 are formed in the upper surface 13a of one lower flow path wall portion 13, and the respective mainstream grooves 31 are arranged in parallel with each other at regular intervals. In this embodiment, an example in which the cross section of the main groove 31 has a curved shape as a whole is shown, but the cross section of the main groove 31 may have any shape as long as it can exert a capillary action. Therefore, the cross-sectional shape of the groove may be a shape having an internal corner portion, an external corner portion, or a shape in which these are combined.
In this embodiment, the main flow grooves 31 are arranged parallel to each other at equal intervals, but the present invention is not limited to this arrangement. Also good. Furthermore, the number of main grooves 31 may vary in each lower flow path wall portion 13 , and the lower flow path wall portion 13 may have a portion without main flow grooves 31 .

Although not shown, a plurality of communication grooves (not shown) extending in a direction (for example, the second direction Y) crossing the main grooves 31 are provided, and these communication grooves communicate the main grooves 31 with each other. The main groove 31 and the lower steam flow channel concave portion 12 may be communicated with each other.
Alternatively, in the evaporating section 11, the lower surface 22a of the upper channel wall portion 22 may be separated from the upper surface 13a of the lower channel wall portion 13 so that there is a gap. In this case, since the space between the upper surface 13 a and the lower surface 22 a communicates with the lower steam flow channel recess 12 and the upper steam flow channel recess 21 , the main grooves 31 are connected to the steam flow channel recesses 12 and 21 . can be communicated.

On the upper surface 10a of the lower sheet 10, the width w2 of the main groove 31 shown in FIG. 8 is smaller than the width w0 of the lower flow path wall portion 13 shown in FIG. As a result, the main groove 31 is filled with the working fluid 2 condensed from the vapor, and the filled liquid working fluid 2 is transported toward the evaporator 11 by capillary action. On the other hand, each of the lower channel grooves 12G1, 12G2, 12G3 and each of the upper channel grooves 21G1, 21G2, 21G3 has a larger channel cross-sectional area than the main channel 31, Vapor generated in will pass through.
More specifically, the first flow path is formed by the lower flow grooves 12G1, 12G2, 12G3 and the upper flow grooves 21G1, 21G2, 21G3 and through which steam mainly passes, and is formed by the main flow groove 31. When the channel through which the working fluid mainly passes is the second channel, the channel cross-sectional area of the second channel is made smaller than the channel cross-sectional area of the first channel. More specifically, the average flow channel cross-sectional area of two adjacent first flow channels is Ag, and the average flow of a plurality of second flow channels arranged between the two adjacent first flow channels is When the cross-sectional area of the passage is Al, the second channel and the first channel have a relationship in which Al is 0.5 times or less, preferably 0.25 times or less, that of Ag. This relationship may be satisfied in at least a portion of the entire vapor chamber, and more preferably in the entire vapor chamber.

The width w2 of the main groove 31 means the dimension of the main groove 31 in the direction orthogonal to the longitudinal direction of the main groove 31, and corresponds to, for example, the vertical dimension in FIG. 7 or the horizontal dimension in FIG. do.
The width w2 is preferably 1000 μm or less, may be 500 μm or less, or may be 200 μm or less. On the other hand, the width w2 is preferably 30 μm or more, may be 45 μm or more, or may be 60 μm or more. Also, the range of the width w2 may be determined by a combination of any one of the plurality of upper limit candidate values and one of the plurality of lower limit candidate values. Also, the range of width w2 may be determined by combining any two of a plurality of upper limit candidate values or by combining any two of a plurality of lower limit candidate values.
Also, the depth h1 of the main groove 31 is preferably smaller than the depth h0 of the lower steam flow channel concave portion 12, although it depends on the size of the width w2. The depth h1 is preferably 200 μm or less, may be 150 μm or less, or may be 100 μm or less. On the other hand, the depth h1 is preferably 5 μm or more, may be 10 μm or more, or may be 20 μm or more. Also, the range of depth h1 may be defined by a combination of any one of the plurality of upper limit candidate values and one of the plurality of lower limit candidate values. Also, the range of depth h1 may be determined by combining any two of a plurality of upper limit candidate values or by combining any two of a plurality of lower limit candidate values. The same applies to the depth of the communication groove described above.

Such a mainstream groove 31 is formed in the upper surface 13 a of the lower flow path wall portion 13 of the lower sheet 10 . On the other hand, in this embodiment, the main flow groove is not formed in the lower surface 22a of the upper flow path wall portion 22 of the upper sheet 20. As shown in FIG. That is, the lower surface 22 a is flat and exposed to the main groove 31 . In this manner, in the cross section of the main groove 31 , the entire main groove 31 is covered with the flat lower surface 22 a of the upper flow path wall portion 22 .

However, the present invention is not limited to this, and the upper sheet 20 may also be provided with the mainstream groove 32 as shown in FIG. In that case, it can be considered in the same way as the mainstream groove 31 of the lower seat 10 described above. Therefore, in the example shown in FIG. 9, the main groove 31 and the main groove 32 are overlapped to form the second flow path.
Alternatively, the main groove 32 of the upper sheet 20 and the main groove 31 of the lower sheet 10 may be separate second flow paths without overlapping.

Materials used for the lower sheet 10 and the upper sheet 20 are not particularly limited as long as they have good thermal conductivity. For example, the lower sheet 10 and the upper sheet 20 are made of copper or a copper alloy. It is preferred that Thereby, the thermal conductivity of the lower sheet 10 and the upper sheet 20 can be increased. Therefore, the heat transport efficiency of the vapor chamber 1 can be enhanced. Alternatively, other metal materials such as aluminum or other metal alloy materials such as stainless steel can be used for the lower sheet 10 and the upper sheet 20 as long as the desired heat radiation efficiency can be obtained.
However, it does not necessarily have to be a metal material or a metal alloy material, and ceramics such as AlN, Si ₃ N ₄ or Al ₂ O ₃ and resins such as polyimide and epoxy are also possible.
In addition, one of the lower sheet 10 and the upper sheet 20 may be made of different materials, one sheet may be formed by laminating two or more kinds of materials, or the materials may be different depending on the part. good.

Further, as shown in FIG. 6, the thickness T0 of the vapor chamber 1 is preferably 1.0 mm or less, may be 0.75 mm or less, or may be 0.5 mm or less. On the other hand, the thickness T0 is preferably 0.1 mm or more, may be 0.15 mm or more, or may be 0.2 mm or more. Also, the range of the thickness T0 may be determined by a combination of any one of the plurality of upper limit candidate values and one of the plurality of lower limit candidate values. Also, the range of the thickness T0 may be determined by combining any two of a plurality of upper limit candidate values or by combining any two of a plurality of lower limit candidate values.
In this embodiment, the thickness T1 of the lower sheet 10 and the thickness T2 of the upper sheet 20 are equal, but the thickness T1 of the lower sheet 10 and the thickness T2 of the upper sheet 20 are not limited to this. The heights T2 need not be equal.

Next, the operation of the form of the vapor chamber 1 having such a configuration will be described. Here, first, the manufacturing method of the vapor chamber 1 will be described with reference to FIGS. 10 to 17, but the description of the half-etching process for the upper sheet 20 will be simplified. 10 to 17 show cross sections similar to the cross sectional view of FIG.

First, as shown in FIG. 10, as a first preparation step, a plate-shaped lower surface having an upper surface M1a (first sheet side surface) and a lower surface M1b (first opposite side surface) provided on the opposite side of the upper surface M1a A side material sheet M1 is prepared.

After the first preparatory step, as a lower channel groove forming step, as shown in FIG. and a lower liquid flow path portion 30 are formed.

In this case, first, a resist film (not shown) is formed on the upper surface M1a of the lower material sheet M1. For the resist film, an electrodeposition resist material that can be adhered by an electric field can be preferably used. good too.

Subsequently, the resist film is patterned using a photolithographic technique to form resist openings (not shown).

Next, the upper surface M1a of the lower material sheet M1 is half-etched. As a result, portions of the upper surface M1a corresponding to the resist openings of the resist film are half-etched to form the first lower channel groove 12G1, the second lower channel groove 12G2, and the third lower channel groove 12G3. a lower steam channel recess 12, a lower channel wall portion 13, and a lower peripheral wall 14 (see FIG. 3) are formed. At this time, the lower liquid channel portion 30 having the main groove 31 is formed on the upper surface 13 a of the lower channel wall portion 13 . Further, the lower material sheet M1 is etched from the upper surface M1a and the lower surface M1b so as to have the contour shape as shown in FIG. 4 to obtain the predetermined contour shape. Note that half-etching means etching for forming recesses that do not penetrate the material. Therefore, the depth of the recess formed by half-etching is not limited to half the thickness of the lower sheet 10 . As the etchant, for example, an iron chloride-based etchant such as an aqueous ferric chloride solution or a copper chloride-based etchant such as an aqueous copper chloride solution can be used.

After that, the resist film is removed. In this way, by forming the lower vapor channel concave portion 12 and the lower liquid channel portion 30 in one half-etching process, the number of half-etching processes can be reduced, and the vapor chamber 1 can be manufactured. Cost can be reduced. However, the present invention is not limited to this, and the lower vapor channel concave portion 12 is formed in the first half-etching step, and the lower liquid channel portion 30 is formed in the subsequent second half-etching step. You may do so. In this case, the depth h0 of the lower steam channel recessed portion 12 and the depth h1 of the lower liquid channel portion 30 (that is, the main groove 31 and the communication groove) can be easily made different.

Thus, the lower sheet 10 of this embodiment is manufactured.

On the other hand, the upper sheet 20 is produced in the same manner as the lower sheet 10 .

First, as shown in FIG. 12, as a second preparation step, a flat upper side having a lower surface M2a (second sheet side surface) and an upper surface M2b (second opposite side surface) provided on the opposite side of the lower surface M2a Prepare material sheet M2.

After the second preparation step, as an upper flow path groove forming step, as shown in FIG. 13, the upper material sheet M2 is half-etched to form the upper steam flow path concave portion 21 forming part of the sealed space 3. be. In this case, the lower surface M2a of the upper material sheet M2 is half-etched in the same manner as in the lower flow groove forming step, so that the lower surface M2a is formed with the first upper flow groove 21G1, the second upper flow groove 21G2, and the lower surface M2a. An upper steam channel recess 21 having a third upper channel groove 21G3, an upper channel wall portion 22, and an upper peripheral edge wall 23 (see FIG. 3) are formed. Also, the upper material sheet M2 is etched from the lower surface M2a and the upper surface M2b so as to have the contour shape as shown in FIG. 5 to obtain the predetermined contour shape.

Thus, the upper sheet 20 of this embodiment is produced.

After the lower flow path groove forming process and the upper flow path groove forming process, as shown in FIG. and the upper sheet 20 having are temporarily fixed. In this case, the lower sheet 10 is first aligned using the lower alignment hole 15 (see FIGS. 2 and 4) of the lower sheet 10 and the upper alignment hole 24 (see FIGS. 2 and 5) of the upper sheet 20. and the upper sheet 20 are positioned. Subsequently, the lower sheet 10 and the upper sheet 20 are fixed. The fixing method is not particularly limited, but for example, the lower sheet 10 and the upper sheet 20 may be fixed by performing resistance welding on the lower sheet 10 and the upper sheet 20 . In this case, as shown in FIG. 14, it is preferable to perform spot resistance welding of the lower peripheral edge wall 14 and the upper peripheral edge wall 23 using an electrode rod 40 . Laser welding may be performed instead of resistance welding. Alternatively, the lower sheet 10 and the upper sheet 20 may be ultrasonically bonded and fixed by irradiating ultrasonic waves. Furthermore, although an adhesive may be used, it is preferable to use an adhesive that does not have an organic component or has a small amount of an organic component. Thus, the lower sheet 10 and the upper sheet 20 are fixed in a positioned state.

After the temporary fixing process, as a bonding process, the lower sheet 10 and the upper sheet 20 are permanently bonded by diffusion bonding, as shown in FIG. In the diffusion bonding, the lower sheet 10 and the upper sheet 20 to be bonded are brought into close contact with each other, and in a controlled atmosphere such as a vacuum or an inert gas, pressure is applied in a direction to bring the sheets 10 and 20 into close contact with each other, and heat is applied. It is a method of joining by utilizing the diffusion of atoms occurring on the joint surface. Diffusion bonding heats the materials of the lower sheet 10 and upper sheet 20 to a temperature close to, but below the melting point, thus avoiding melting of each sheet 10,20. More specifically, the upper surface 14a of the lower peripheral wall 14 of the lower sheet 10 and the lower surface 23a of the upper peripheral wall 23 of the upper sheet 20 are diffusion-bonded as bonding surfaces. Thereby, the sealed space 3 is formed between the lower sheet 10 and the upper sheet 20 by the lower peripheral wall 14 and the upper peripheral wall 23 . In addition, the upper surface 13a of the lower flow path wall portion 13 of the lower sheet 10 and the lower surface 22a of the upper flow path wall portion 22 of the upper sheet 20 are diffusion-bonded as bonding surfaces, and the vapor chamber 1 is mechanically bonded. Improves strength. The lower liquid flow path portion 30 formed on the upper surface 13 a of the lower flow path wall portion 13 remains as a second flow path for the working liquid 2 .

In the joining process, the lower sheet 10 and the upper sheet 20 are heated to a predetermined temperature and a predetermined pressure is applied. For example, the lower sheet 10 and the upper sheet 20 are made of copper, the thickness T1 of the lower sheet 10 is 0.2 mm, the thickness T2 of the upper sheet 20 is 0.2 mm, and each of the lower flow channels 12G1, When the width w1 of 12G2, 12G3 and the upper flow channel grooves 21G1, 21G2, 21G3 is 1000 μm and the depth h0 is 150 μm, the lower sheet 10 and the upper sheet 20 are heated to 810° C. and subjected to a pressure of 2 MPa. may be added.

As a result, as shown in FIG. 16, the lower steam flow path bottom 10c thermally expands. Since a flat spacer (not shown) is in contact with the lower surface 10b of the lower sheet 10 in order to evenly pressurize the lower sheet 10, the lower steam channel bottom 10c is bent toward the upper surface 10a. nothing. For this reason, a lower seat recess 50 is formed on the lower surface 10 b of the lower seat 10 , and a lower bottom surface protrusion 51 is formed on the bottom surface 12 a of the lower steam channel recess 12 . In addition, due to the bending of the thermally expanded portion, the thickness t3′ (see FIG. 15) of the lower steam flow path bottom 10c before thermal expansion is greater than the thickness t3′ (see FIG. 15) of the lower steam flow path bottom 10c after thermal expansion. t3 (see FIG. 16) becomes smaller. The lower seat concave portion 50 and the lower bottom surface convex portion 51 are formed at positions overlapping the first lower flow groove 12G1, the second lower flow groove 12G2, and the third lower flow groove 12G3 in plan view. be.

Similarly, the upper steam channel bottom 20c thermally expands. Since a flat spacer (not shown) is in contact with the upper surface 20b of the upper sheet 20 to evenly pressurize the upper sheet 20, the upper steam flow path bottom 20c bends toward the lower surface 20a. Therefore, an upper sheet recess 60 is formed on the upper surface 20 b of the upper sheet 20 , and an upper bottom surface protrusion 61 is formed on the bottom surface 21 a of the upper steam flow path recess 21 . In addition, due to the bending of the thermally expanded portion, the thickness t5 (see FIG. 15) of the upper steam flow path bottom 20c after thermal expansion is greater than the thickness t5' (see FIG. 15) of the upper steam flow path bottom 20c before thermal expansion. 16) becomes smaller. The upper seat concave portion 60 and the upper bottom surface convex portion 61 are formed at positions overlapping the first upper flow groove 21G1, the second upper flow groove 21G2 and the third upper flow groove 21G3 in plan view.

After the joining step, as an injection step, as shown in FIG. 17, the working fluid 2 is injected into the sealed space 3 from the injection portion 4 (see FIG. 2). At this time, first, the sealed space 3 is evacuated to reduce the pressure, and then the working fluid 2 is injected into the sealed space 3 . During injection, the working liquid 2 passes through the injection channel formed by the lower injection channel recess 17 and the upper injection channel recess 26 .

After the injection of the working liquid 2, the injection channel mentioned above is sealed. For example, the injection section 4 may be irradiated with a laser to partially melt the injection section 4 to seal the injection channel. As a result, communication between the sealed space 3 and the outside is cut off, and the hydraulic fluid 2 is enclosed in the sealed space 3 . Thus, the hydraulic fluid 2 in the sealed space 3 is prevented from leaking to the outside. For sealing, the injection part 4 may be crimped or brazed.

As described above, the vapor chamber 1 of this embodiment is obtained.

Next, a method of operating the vapor chamber 1, that is, a method of cooling the device D will be described.

The vapor chamber 1 obtained as described above is installed in a housing of a mobile terminal or the like, and a device D such as a CPU, which is an object to be cooled, is attached to the lower surface 10b of the lower sheet 10 . At this time, the vapor chamber may be attached to the device D via a thermal interface material such as a tape containing grease or heat conductive filler placed on the lower surface 10b of the vapor chamber 1, or via an adhesive sheet.
Since the amount of the working fluid injected into the sealed space 3 is small, the working fluid 2 in the sealed space 3 moves against the wall surface of the sealed space 3, that is, the bottom surface 12a of the lower steam flow channel recess 12 due to its surface tension. ) wall surface (including the bottom surface 21 a ) of the upper steam channel recess 21 .

When the device D heats up in this state, the working fluid 2 existing in the evaporating portion 11 of the lower steam flow channel concave portion 12 receives heat from the device D. As shown in FIG. At this time, part of the heat from the device D is transferred to the working fluid 2 via the lower sheet concave portion 50 of the lower sheet 10 and the lower bottom surface convex portion 51 of the lower steam channel concave portion 12 . The received heat is absorbed as latent heat, and the working fluid 2 evaporates (vaporizes) to generate steam. Most of the generated steam passes through the first flow path (the first lower flow groove 12G1 and the first upper flow groove 21G1, the second lower flow groove 12G2 and the first upper flow groove 21G1) that constitute the sealed space 3. 2 upper channel grooves 21G2) and diffuses away from the device D (see solid line arrows in FIGS. 4 and 5). As a result, the steam leaves the evaporating section 11 and most of the steam is transported toward the relatively low-temperature periphery. The vapor diffused to the peripheral portion is cooled by radiating heat at the peripheral portion. The heat received by the lower sheet 10 and the upper sheet 20 from the steam at the periphery is transmitted to the outside through the housing member H (see FIG. 3). At this time, part of the heat from the steam is transmitted to the outside through the upper bottom surface convex portion 61 of the upper steam flow channel concave portion 21 and the upper sheet concave portion 60 of the upper sheet 20, and It is also transmitted to the outside via the side seat concave portion 50 and the lower bottom surface convex portion 51 of the lower steam flow channel concave portion 12 .

By radiating heat to the peripheral portion, the steam loses the latent heat absorbed in the evaporating portion 11 and condenses into the working fluid 2 . Most of the working liquid 2 adheres to the wall surface of the lower steam flow channel recess 12 or the wall surface of the upper steam flow channel recess 21 and reaches the lower liquid flow channel portion 30 . Here, since the working fluid 2 continues to evaporate in the evaporating portion 11, the working fluid 2 in the portion other than the evaporating portion 11 of the lower liquid flow path portion 30 is transported toward the evaporating portion 11 by capillary action. (see dashed arrow in FIG. 4). As a result, the working fluid 2 adhering to the wall surface of the lower steam flow channel recess 12 and the wall surface of the upper steam flow channel recess 21 moves toward the lower liquid flow channel portion 30, get inside. That is, the working fluid 2 passes through the communication grooves (not shown) and enters the second flow paths formed by the main grooves 31, and the main grooves 31 and the communication grooves are filled with the hydraulic fluid 2. As shown in FIG. Therefore, the working fluid 2 filled therein obtains a driving force toward the evaporating portion 11 due to the capillary action of each main groove 31 and is smoothly transported toward the evaporating portion 11 through the second flow path.

The working fluid 2 that has reached the evaporator 11 receives heat from the device D again and evaporates. In this way, the working fluid 2 circulates in the vapor chamber 1 while repeating phase changes, that is, evaporation and condensation, thereby transferring heat from the device D and releasing it. As a result, the device D is cooled.

According to the vapor chamber 1 of this embodiment, the lower seat recessed portion 50 recessed toward the lower steam flow channel recessed portion 12 is located on the lower surface 10b of the lower seat 10 at a position overlapping the lower steam flow channel recessed portion 12 in plan view. is provided. As a result, the surface area of the lower surface 10b acting as a heat receiving surface that receives heat from the device D can be increased. Therefore, the thermal resistance between the device D and the lower surface 10b can be reduced, and heat can be transferred from the device D to the working fluid 2 efficiently. As a result, heat transport efficiency can be improved. Furthermore, since the bonding area of the thermal interface material and the adhesive sheet can be increased by the lower sheet concave portion 50, the adhesion with the device D can be improved.
The positions of the device D and the housing H with respect to the vapor chamber 1 are not limited to the present embodiment, and the positions of the device D and the housing H may be exchanged, or the housing H may be provided between the device D and the vapor chamber 1 .

Further, according to the vapor chamber 1 of the present embodiment, the bottom surface 12a of the lower steam flow path recess 12 projects inwardly from the bottom surface 12a of the lower steam flow path recess 12 at a position overlapping the lower seat recess 50 in a plan view. A side bottom convex portion 51 is provided. As a result, the surface area of the bottom surface 12a of the lower steam channel recess 12 can be increased. Therefore, the thermal resistance between the lower sheet 10 and the working fluid 2 can be reduced, and heat can be transferred from the device D to the working fluid 2 more efficiently. That is, when the device D is activated, the working liquid 2 adhering to the wall surface of the lower steam flow path concave portion 12 can be quickly evaporated. Therefore, the diffusion of the vapor generated in the lower liquid flow path portion 30 can be prevented from being hindered by the working fluid 2 adhering to the wall surface of the lower vapor flow path concave portion 12, and the vapor can be diffused smoothly. be able to. As a result, heat transport efficiency can be further improved. Furthermore, since the lower sheet concave portion 50 and the lower bottom surface convex portion 51 are formed by thermal expansion during diffusion bonding, the thickness t3 (see FIG. 16) of the lower steam channel bottom portion 10c is reduced. be able to. Also in this respect, the thermal resistance between the device D and the working fluid 2 can be reduced.

Further, according to this embodiment, the upper sheet recessed portion 60 recessed toward the upper steam flow path recessed portion 21 is provided at a position overlapping the upper steam flow path recessed portion 21 in plan view on the upper surface 20b of the upper sheet 20 . As a result, the surface area of the upper surface 20b acting as a heat radiation surface for releasing heat to the outside can be increased. Therefore, thermal resistance between the upper surface 20b and the outside can be reduced, and heat can be efficiently transferred from the vapor of the working fluid 2 to the outside. As a result, heat transport efficiency can be improved.

Further, according to the present embodiment, the upper bottom surface convex portion 61 projecting inwardly of the upper steam channel recessed portion 21 is provided at a position of the bottom surface 21a of the upper steam channel recessed portion 21 that overlaps the upper seat recessed portion 60 in plan view. ing. As a result, the surface area of the bottom surface 21a of the upper steam passage recess 21 can be increased. Therefore, the thermal resistance between the upper sheet 20 and the working fluid 2 can be reduced, and heat can be transferred from the device D to the working fluid 2 more efficiently. That is, when the device D is activated, the liquid working fluid 2 adhering to the wall surface of the upper steam flow channel concave portion 21 can be quickly evaporated. Therefore, it is possible to prevent the diffusion of the vapor of the working fluid 2 evaporated in the lower liquid flow path portion 30 from being hindered by the working fluid 2 adhering to the wall surface of the upper vapor flow path concave portion 21, so that the vapor can flow smoothly. can be diffused into As a result, heat transport efficiency can be further improved. Furthermore, since the upper sheet concave portion 60 and the upper bottom surface convex portion 61 are formed by thermal expansion during diffusion bonding, the thickness t5 (see FIG. 16) can be reduced. Also in this respect, the thermal resistance between the working fluid 2 and the outside can be reduced.

Further, according to this embodiment, the lower sheet recessed portion 50 is provided in the lower surface 10b of the lower sheet 10 as described above. As a result, since the surface area of the lower surface 10b is increased even at the periphery of the lower steam flow passage concave portion 12 (the portion away from the device D) that emits heat to the outside, the space between the lower surface 10b and the outside Thermal resistance can be reduced. Therefore, heat can be efficiently transferred from the steam to the outside, and heat transport efficiency can be improved.

Further, according to this embodiment, as described above, the bottom surface 12 a of the lower steam flow path recess 12 is provided with the lower bottom surface protrusion 51 . As a result, the surface area of the bottom surface 12a of the lower steam channel recess 12 is increased even at the periphery of the lower steam channel recess 12 that releases heat to the outside. can reduce the thermal resistance between Therefore, heat can be transferred from the steam to the outside more efficiently, and the heat transport efficiency can be further improved.

Further, according to this embodiment, the lower seat recessed portion 50 is arranged between a pair of lower flow path wall portions 13 adjacent to each other. Thereby, the lower sheet concave portion 50 can be easily formed by adjusting the temperature of the lower sheet 10 and the upper sheet 20 heated during diffusion bonding and/or the pressure applied to each sheet 10, 20. be able to. It is possible to prevent the manufacturing process of the vapor chamber 1 from becoming complicated, and to suppress an increase in the manufacturing cost.

Further, according to this embodiment, the upper seat recessed portion 60 is arranged between a pair of upper flow path wall portions 22 adjacent to each other. As a result, the upper sheet concave portion 60 can be easily formed by adjusting the temperature of the lower sheet 10 and the upper sheet 20 heated during diffusion bonding and/or the pressure applied to each sheet 10, 20. can be done. It is possible to prevent the manufacturing process of the vapor chamber 1 from becoming complicated, and to suppress an increase in the manufacturing cost.

Further, according to this embodiment, the lower sheet recess 50 and the upper sheet recess 60 can be formed during the joining process. For this reason, the manufacturing process of the vapor chamber 1 can be prevented from becoming complicated, and an increase in manufacturing cost can be suppressed.

In addition, in this embodiment, the vapor chamber 1 is thin at this portion due to the lower sheet recessed portion 50 of the lower surface 10b of the lower sheet 10 and the upper sheet recessed portion 60 of the upper surface 20b of the upper sheet 20 . Therefore, there are situations in which the internal pressure rises due to the operation of the vapor chamber 1 and causes swelling, and cases in which the working fluid expands and causes swelling due to freezing of the working fluid when the vapor chamber 1 is not in operation. However, the vapor chamber 1 does not swell until the lower seat recess 50 and the upper seat recess 60 become flush with other portions of the lower surface 10b and the upper surface 20b and further swell. Therefore, the occurrence of problems due to swelling of the vapor chamber 1 can be alleviated. Further, in the case where the lower seat recessed portion 50 and the lower bottom surface protruding portion 51 are provided at positions overlapping each other in a plan view as in this embodiment, the lower seat recessed portion 50 has a curved shape, so that the height is increased. effect can be obtained.

Also, the thickness t3 of the lower steam channel bottom portion 10c provided between the lower surface 10b of the lower sheet 10 and the lower steam channel concave portion 12 is set to the thickness t3 between the lower surface 10b and the lower liquid channel portion 30. When the thickness t4 of the lower liquid flow path bottom portion 10d provided in the device D is smaller than the thickness t4 (see FIG. 6), the vapor flow path recessed portion 12 below the lower liquid flow path portion 30 is the lower surface that receives the heat of the device D. 10b can be approached. According to this, the heat from the device D can reach the lower vapor passage concave portion 12 earlier than the lower liquid passage portion 30 , and the working liquid 2 can be evaporated in the lower vapor passage concave portion 12 . It is possible to promote That is, when the device D is activated, the working liquid 2 adhering to the wall surface of the vapor channel concave portion 12 can be quickly evaporated. Therefore, it is possible to prevent the diffusion of the vapor generated in the lower liquid flow path portion 30 from being hindered by the working fluid 2 adhering to the wall surface of the lower vapor flow path concave portion 12, thereby smoothly diffusing the vapor. be able to. On the other hand, the lower liquid flow path portion 30 can be further away from the lower surface 10b than the lower steam flow path recessed portion 12, thereby suppressing evaporation of the working liquid. For this reason, it is possible to prevent flow channel clogging, such as obstruction of the flow of the working fluid 2, caused by the generation of bubbles due to the vapor of the working fluid 2 in the lower liquid flow channel portion 30 .

In the vapor chamber 1 of the present embodiment described above, an example in which the lower sheet recess 50 is provided on the lower surface 10b of the lower sheet 10 and the upper sheet recess 60 is provided on the upper surface 20b of the upper sheet 20 will be described. bottom. However, the present invention is not limited to this, and one of the lower seat recess 50 and the upper seat recess 60 may not be provided. Also in this case, heat transport efficiency can be improved. If the lower sheet recess 50 is not provided, the upper sheet 20 becomes the first sheet and the upper sheet recess 60 becomes the first sheet recess.

Further, in the vapor chamber 1 of the present embodiment described above, an example in which the lower bottom surface convex portion 51 provided on the bottom surface 12a of the lower steam flow passage concave portion 12 extends continuously and slenderly has been described. However, it is not limited to this. For example, the lower bottom surface convex portion 51 may be intermittently formed in the corresponding direction of the first direction X and the second direction Y. As shown in FIG. In this case, the surface area of the bottom surface 12a of the lower steam channel recess 12 can be increased, and the thermal resistance between the lower sheet 10 and the working fluid 2 can be further reduced. That is, when the device D is activated, the working liquid 2 adhering to the wall surface of the lower steam flow path concave portion 12 can be quickly evaporated.

Further, in the vapor chamber 1 of the present embodiment described above, an example in which the upper bottom surface convex portion 61 provided on the bottom surface 21a of the upper steam flow passage concave portion 21 extends continuously and slenderly has been described. However, the present invention is not limited to this, and the upper bottom surface convex portion 61 may be intermittently formed in the corresponding one of the first direction X and the second direction Y. As shown in FIG. In this case, the surface area of the bottom surface 21a of the upper steam channel recess 21 can be increased, and the thermal resistance between the upper sheet 20 and the working fluid 2 can be further reduced. That is, when the device D is activated, the working liquid 2 adhering to the wall surface of the upper steam flow channel concave portion 21 can be quickly evaporated.

Also, in the vapor chamber 1 of the present embodiment described above, an example in which the upper flow path wall portion 22 of the upper sheet 20 elongates along the longitudinal direction of the vapor chamber 1 has been described. However, it is not limited to this, and the shape of the upper flow path wall portion 22 is arbitrary. For example, the upper flow path wall portion 22 may be formed as a cylindrical boss. Also in this case, the upper sheet recessed portion 60 can be formed between a pair of upper flow path wall portions 22 adjacent to each other. Further, in this case, the upper flow path wall portion 22 is arranged so as to overlap the lower flow path wall portion 13 in a plan view, and the lower surface 22a of the upper flow path wall portion 22 is positioned on the lower flow path wall portion. 13 is preferably in contact with the upper surface 13a.

Further, in the vapor chamber 1 of the present embodiment described above, an example in which the lower sheet recess 50, the lower bottom surface protrusion 51, the upper sheet recess 60, and the upper bottom surface protrusion 61 are formed during the bonding process has been described. However, it is not limited to this. For example, the lower sheet concave portion 50 and the lower bottom surface convex portion 51 may be formed during the lower flow channel forming step shown in FIG. In this case, as shown in FIG. 18 , the lower seat recess 50 and the lower bottom surface protrusion 51 may be formed by pressing together with the lower steam channel recess 12 and the lower liquid channel 30 .

More specifically, after the lower material sheet M1 is prepared in the first preparation step shown in FIG. 10, the lower material sheet M1 is pressed in the lower flow channel forming step. In this case, the upper surface 10a of the lower sheet 10 is pressed via the first lower mold 70, and the lower surface 10b is pressed via the second lower mold 71. As shown in FIG.

The first lower mold 70 corresponds to the mold protrusion 70a having a shape corresponding to each of the lower flow channel grooves 12G1, 12G2, and 12G3 of the lower steam flow channel recess 12 and the lower liquid flow channel 30. and a mold protrusion 70b having a shape that By pressing the flat plate-shaped lower material sheet M1 using the first lower mold 70, as shown in FIG. A lower liquid flow path portion 30 can be formed. The second lower mold 71 also includes a mold projection 71 a having a shape corresponding to the lower seat recess 50 . As a result, the lower sheet concave portion 50 can be formed in the lower surface M1b of the lower material sheet M1.

Similarly, the upper sheet concave portion 60 and the upper bottom surface convex portion 61 may also be formed during the upper flow channel groove forming step for forming the upper steam flow channel concave portion 21 . In this case, as shown in FIG. 19, the upper seat recess 60 and the upper bottom surface protrusion 61 may be formed by press working together with the upper steam flow channel recess 21 .

More specifically, after the upper material sheet M2 is prepared in the second preparation process shown in FIG. 12, the upper material sheet M2 is pressed in the upper flow channel forming process. In this case, the lower surface 20 a of the upper sheet 20 is pressed through the first upper mold 80 and the upper surface 20 b is pressed through the second upper mold 81 .

The first upper mold 80 includes a mold projection 80a having a shape corresponding to each of the upper flow channel grooves 21G1, 21G2, 21G3 of the upper steam flow channel recess 21. As shown in FIG. By pressing the flat upper material sheet M2 using the first upper mold 80, as shown in FIG. . The second upper mold 81 also includes a mold projection 81 a having a shape corresponding to the upper sheet recess 60 . As a result, the upper sheet recess 60 can be formed in the upper surface M2b of the upper material sheet M2.

When the lower sheet recessed portion 50 is formed by pressing in the lower flow channel forming step and the upper sheet recessed portion 60 is formed by pressing in the upper flow channel forming step, the temperature of the lower sheet 10 and the upper sheet 20 is And the pressure applied to each sheet 10, 20 can be arbitrary as long as each sheet 10, 20 can be permanently bonded, and diffusion bonding can be facilitated.

In addition, since the lower sheet concave portion 50 and the lower bottom surface convex portion 51 are formed by press working, the thickness t3 after press working (see FIG. 16) is greater than the thickness t3′ before press working (see FIG. 15). ) can be reduced. Therefore, thermal resistance between the device D and the working fluid 2 can be reduced. Similarly, since the upper sheet concave portion 60 and the upper bottom surface convex portion 61 are formed, the thickness t5 after pressing (see FIG. 16) is made smaller than the thickness t5′ before pressing (see FIG. 15). be able to. Therefore, thermal resistance between the device D and the working fluid 2 can be reduced.

In the above, manufacturing of the vapor chamber by etching and manufacturing of the vapor chamber by pressing are explained, but the manufacturing method is not limited to this, and the vapor chamber can also be manufactured by cutting, laser processing, and processing with a 3D printer. can.
For example, when a vapor chamber is manufactured by a 3D printer, it is not necessary to manufacture the vapor chamber by bonding a plurality of sheets, and it is possible to create a vapor chamber without a bonded portion.

In the vapor chamber 1 of the present embodiment described above, an example in which the upper vapor flow path concave portion 21 is provided on the lower surface 20a of the upper sheet 20 has been described. However, the upper steam channel recess 21 may not be provided. In this case, the lower surface 20a of the upper sheet 20 is formed flat as a whole, and the first lower channel groove 12G1, the second lower channel groove 12G2 and the third lower channel groove 12G2 of the lower steam channel concave portion 12 are formed. The side channel groove 12G3 is covered and exposed. Thereby, the mechanical strength of the vapor chamber 1 can be improved.

Furthermore, in the vapor chamber 1 of the present embodiment described above, an example in which the upper surface 10a of the lower sheet 10 is provided with the lower steam flow path concave portion 12 has been described. Not limited to this, as shown in FIGS. 20 to 22, the lower steam flow passage concave portion 12 may not be provided.

In the modification shown in FIG. 20, the upper surface 10a of the lower sheet 10 is formed flat except for the main grooves 31 and the connecting grooves of the lower liquid flow path portion 30. In the modification shown in FIG. It covers and exposes each of the first upper channel groove 21G1, the second upper channel groove 21G2 and the third upper channel groove 21G3 of the upper steam channel concave portion 21. As shown in FIG. Thereby, the mechanical strength of the vapor chamber 1 can be improved.
Further, in the modification shown in FIG. 20, the portion of the upper surface 10a and the lower surface 10b of the lower sheet 10 that overlap with the upper steam flow passage concave portion 21 in plan view is formed flat.

In the modification shown in FIG. 21, a lower seat recess 50 is formed in a portion of the lower surface 10b of the lower seat 10 that overlaps with the upper steam flow channel recess 21. As shown in FIG. Further, an upper surface convex portion 90 is provided on the upper surface 10a of the lower seat 10 so as to project into the upper steam flow channel concave portion 21 at a position overlapping the lower seat concave portion 50 in a plan view. The upper surface protrusion 90 can have the same shape as the lower bottom surface protrusion 51 shown in FIG. 6 and the like, and can be formed in the same manner. These modifications show examples in which the thickness T2 of the upper sheet 20 is greater than the thickness T1 of the lower sheet 10 . However, the present invention is not limited to this, and the thickness T2 of the upper sheet 20 is less than that of the lower sheet 10 if a gap is formed between the upper bottom surface convex portion 61 and the upper surface 10a through which steam can flow. It does not have to be larger than the thickness T1.

In the modification shown in FIGS. 20 and 21, the lower sheet 10 is provided with a lower liquid flow path portion 30 as the second flow path through which the hydraulic fluid 2 passes, and the upper sheet 10 is provided as the first flow path through which the vapor passes. 20 is provided with a first upper channel groove 21G1. As a result, the second flow path, which is the liquid flow path portion, and the first flow path, which is the vapor flow path portion, can be formed on different sheets. Therefore, the depth of the liquid flow path and the depth of the vapor flow path can be easily made different.

In the modification shown in FIG. 22, both the upper surface 10a and the lower surface 10b of the lower sheet 10 are flat. On the other hand, in the upper flow path wall portion 22 on the side of the lower surface 20a of the upper sheet 20, a main flow groove 32 and a communication groove that serve as a second flow path are arranged.
A portion of the upper surface 10a of the lower sheet 10 is exposed while covering the first upper flow groove 21G1, the second upper flow groove 21G2, and the third upper flow groove 21G3, which serve as the first flow paths. Thereby, the mechanical strength of the vapor chamber 1 can be improved.

20 to 22, the accuracy of positioning the lower sheet 10 and the upper sheet 20 can be relaxed. That is, when the lower sheet 10 is provided with the lower steam channel recess 12, the wall surface of the lower steam channel recess 12 and the wall surface of the upper steam channel recess 21 are aligned with each other. It is preferable to position the lower sheet 10 and the upper sheet 20 with high accuracy. On the other hand, in the modifications shown in FIGS. 20 to 22, the lower sheet 10 is not provided with the lower steam flow path concave portion 12, so that the positioning accuracy between the lower sheet 10 and the upper sheet 20 is relaxed. can do.

Up to this point, the vapor chamber 1 has been described as an example comprising two sheets, the first sheet being the lower sheet 10 and the second sheet being the upper sheet 20 . However, the present invention is not limited to this, and may be a vapor chamber with three or more sheets as shown in FIGS. 23-25. 23 and 24 are examples of a vapor chamber consisting of three sheets, and FIG. 25 is an example of a vapor chamber consisting of four sheets.

The vapor chamber shown in FIG. 23 consists of a laminate of a lower sheet 10 (first sheet), an upper sheet 20 (second sheet) and an intermediate sheet 100 (third sheet).
An intermediate sheet 100 is arranged so as to be sandwiched between the lower sheet 10 and the upper sheet 20, the upper surface 10a of the lower sheet 10 contacts the lower surface 100b of the intermediate sheet 100, and the lower surface 20a of the upper sheet 20 contacts the intermediate sheet. 100 are in contact with the upper surface 100a and are respectively bonded. The mode of bonding is as described above.

Here, the lower sheet 10 has a lower sheet concave portion 50 and a lower bottom surface convex portion 51, and other portions are flat on both the upper surface 10a and the lower surface 10b.
Similarly, the upper sheet 20 has an upper sheet concave portion 60 and an upper bottom surface convex portion 61, and other portions are flat on both the upper surface 20a and the lower surface 10b.

The intermediate sheet 100 is provided with channel grooves 101 , channel walls 102 , and mainstream grooves 32 .
The flow channel 101 is a groove penetrating the intermediate sheet 100 in the thickness direction, and the first lower flow channel 12G1 and the first upper flow channel 21G1 are overlapped to form the first flow channel. and arranged in a form and position corresponding to this. The intermediate sheet 100 has a groove that overlaps the second lower flow groove 12G2 and the second upper flow groove 21G2 to form the first flow path, and a third lower flow groove 12G3 and a third upper flow groove 12G3. It has a groove corresponding to a flow path that overlaps with the flow path groove 21G3.
The channel wall 102 is a wall portion arranged in a form and position corresponding to a wall portion in which the lower channel wall portion 13 and the lower channel wall portion 22 are overlapped.
The main groove 32 is a groove having a shape and arrangement that form a second flow path, like the main groove 32 described above, and is provided on the lower surface 100 b of the intermediate sheet 100 .

The lower seat recess 50, the lower bottom surface protrusion 51, the upper seat recess 60, and the upper bottom surface protrusion 61 are arranged at positions overlapping the flow channel 101 in plan view of the vapor chamber.

The vapor chamber shown in FIG. 24 is also a laminate of a lower sheet 10 (first sheet), an upper sheet 20 (second sheet) and an intermediate sheet 100 (third sheet).
In the vapor chamber shown in FIG. 24, the cross-sectional area of the main groove 32 is made wider than in the vapor chamber shown in FIG. 23, and the wick material 103 is arranged here. The wick material 103 is a material having such a fine structure as to generate capillary force, and examples thereof include sintered particles, twisted wire, non-woven fabric, and mesh material. Although the main groove 32 of this embodiment is formed larger than the main groove 32 of the above-described embodiment, the relationship between the first flow path and the second flow path can be considered in the same manner as described above.
According to this, since capillary force can be generated by the wick material 103, there is no need to finely fabricate the main groove 32, so control of shape accuracy can be relaxed.

The vapor chamber shown in FIG. 25 is a stack of a lower sheet 10 (first sheet), an upper sheet 20 (second sheet) and two intermediate sheets 100 (third sheet) and 110 (fourth sheet). consists of
Intermediate sheets 100 and 110 are arranged so as to be sandwiched between the lower sheet 10 and the upper sheet 20, the upper surface 10a of the lower sheet 10 contacts the lower surface 100b of the intermediate sheet 100, and the upper surface 100a of the intermediate sheet 100 contacts the lower surface 100b of the intermediate sheet 100. The bottom surface 110b of the intermediate sheet 110 is in contact, and the bottom surface 20a of the upper sheet 20 is in contact with the top surface 110a of the intermediate sheet 110 and joined together. The mode of bonding is as described above.

Here, the lower sheet 10 has a lower sheet concave portion 50 and a lower bottom surface convex portion 51, and other portions are flat on both the upper surface 10a and the lower surface 10b.
Similarly, the upper sheet 20 has an upper sheet concave portion 60 and an upper bottom surface convex portion 61, and other portions are flat on both the upper surface 20a and the lower surface 10b.

The intermediate sheet 100 is provided with a first lower channel groove 12</b>G<b>1 , a lower channel wall portion 13 and a mainstream groove 31 .
The first lower flow groove 12G1 in this embodiment is a groove that penetrates the intermediate sheet 100 in the thickness direction, but is otherwise arranged in the same form and position as the above-described first lower flow groove 12G1. can do. Similarly, the intermediate sheet 100 also has a channel groove corresponding to the second lower channel groove 12G2 and a channel groove corresponding to the third lower channel groove 12G3.
The lower channel wall portion 13 can be arranged in the same form and position as the lower channel wall portion 13 described above.
The main groove 31 in this embodiment is a groove penetrating the intermediate sheet 100 in the thickness direction, but has the same form and arrangement as the main groove 32 described above, and is provided in the lower flow path wall portion 13 of the intermediate sheet 100. It is

The intermediate sheet 110 is provided with the first upper channel groove 21G1 and the upper channel wall portion 22 .
The second upper flow groove 21G1 in the present embodiment is a groove that penetrates the intermediate sheet 110 in the thickness direction, but is otherwise arranged in the same form and position as the above-described second upper flow groove 21G1. can be done. Similarly, the intermediate sheet 110 also has a channel groove corresponding to the second upper channel groove 21G2 and a channel groove corresponding to the third upper channel groove 21G3.
The upper channel wall 22 can be arranged in the same configuration and position as the upper channel wall 22 described above.

The first lower channel groove 12G1 and the first upper channel groove 21G1 are arranged so as to overlap each other in a plan view of the vapor chamber to form a first channel. On the other hand, the lower channel wall portion 13 and the upper channel wall portion 22 are arranged so as to overlap each other in a plan view of the vapor chamber, and are formed into a second channel by the main groove 31 .
Furthermore, the lower seat recess 50, the lower bottom surface protrusion 51, the upper seat recess 60, and the upper bottom surface protrusion 61 are arranged in the same manner as the first lower flow groove 12G1 and the first upper flow groove 21G1 in plan view of the vapor chamber. are placed in overlapping positions.

In FIG. 26, instead of the lower seat recess 50, the lower bottom surface protrusion 51, the upper seat recess 60, and the upper bottom surface protrusion 61 provided in the vapor chamber described so far, the uneven relationship is reversed. 5 shows a cross-sectional view illustrating a vapor chamber provided with a lower seat protrusion 50', a lower bottom surface recess 51', an upper seat protrusion 60', and an upper bottom surface recess 61'.
In this vapor chamber, a lower sheet convex portion 50' and an upper sheet convex portion 50' are provided on the lower surface 10b of the lower sheet 10 at positions overlapping the first lower flow channel groove 12G1 and the first upper flow channel groove 21G1 in plan view of the vapor chamber. 20, an upper sheet convex portion 60' is arranged on the upper surface 20b thereof. On the other hand, on the upper surface 10a side of the lower sheet 10, a lower bottom surface recessed portion 51' is arranged, and on the lower surface 20a of the upper sheet 20, an upper bottom surface recessed portion 61' is arranged.
The lower sheet convex portion 50', the lower bottom surface concave portion 51', the upper sheet convex portion 60', and the upper bottom surface concave portion 61' are the lower sheet concave portion 50 and the lower bottom surface convex portion provided in the form described above. 51, the upper sheet concave portion 60, and the upper bottom surface convex portion 61, except that the concave/convex relationship is reversed.

According to the vapor chamber having such a configuration, in addition to the effects described above, the flow resistance of the first flow path (vapor flow path) can be reduced, and the possibility of clogging the vapor flow path with condensate can be reduced. can be reduced.

The above-described forms and modifications of the present disclosure are not limited as they are, and can be embodied by modifying the constituent elements without departing from the gist thereof. Further, various forms can be made by appropriately combining the plurality of constituent elements disclosed in the above forms and modifications. Some components may be deleted from all the components shown in each form and modification.

1 vapor chamber 2 working fluid 3 sealed space 4 injection part 10 lower sheet 11 evaporating part 12 lower steam channel recess 12a bottom surface 13 lower channel wall part 13a upper surface 20 upper sheet 21 upper steam channel recess 21a bottom surface 22 upper side Flow path wall portion 22a Lower surface 50 Lower sheet concave portion 51 Lower bottom surface convex portion 60 Upper sheet concave portion 61 Upper bottom surface convex portion 70 First lower molds 70a, 70b Mold convex portion 71 Second lower mold 71a Mold Projection 80 First upper mold 80a Mold projection 81 Second upper mold 81a Mold projection 90 Upper surface projection M1 Lower material sheet M1a Upper surface M1b Lower surface M2 Upper material sheet M2a Lower surface M2b Upper surface

Claims (3)

A vapor chamber having a sealed space in which a working fluid is enclosed,
In the sealed space,
a plurality of vapor flow paths through which the gaseous working fluid flows;
a wick material provided between the plurality of adjacent vapor flow paths and through which the working fluid in a liquid state flows;
is provided,
At least a portion of the outer surface of the vapor chamber at a position overlapping the steam flow path in plan view is provided with at least one of a concave portion and a convex portion,
The concave portion and the convex portion each have a curved shape in a cross section orthogonal to the direction in which the steam flow path extends.
vapor chamber. A vapor chamber having a sealed space in which a working fluid is enclosed,
In the sealed space,
a plurality of vapor flow paths through which the gaseous working fluid flows;
a liquid channel or wick material provided between the plurality of adjacent vapor channels and through which the working fluid in a liquid state flows;
is provided,
a recess is provided in at least a portion of the outer surface of the vapor chamber at a position overlapping the steam flow path in a plan view,
The recess is provided over the entire width direction of the steam channel in a cross section perpendicular to the direction in which the steam channel extends,
vapor chamber. A vapor chamber having a sealed space in which a working fluid is enclosed,
In the sealed space,
a plurality of vapor flow paths through which the gaseous working fluid flows;
a liquid channel or wick material provided between the plurality of adjacent vapor channels and through which the working fluid in a liquid state flows;
is provided,
a recess is provided in at least a portion of the outer surface of the vapor chamber at a position overlapping the steam flow path in a plan view,
The vapor chamber, wherein the concave portion is not provided at a position overlapping the liquid flow path or the wick material in plan view.

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