JP2022115105A - Bump formation device, bump formation method, solder ball repair device, and solder ball repair method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable soldering device and method in extremely fine solder bump formation.

SOLUTION: A bump forming device for supplying a solder ball onto an electrode pad formed on a substrate includes: a plasma generation device for irradiating the supplied solder ball with plasma to remove an oxide film of the solder ball; and a laser generation device for irradiating the solder ball with laser to melt the solder ball. By removing the oxide film of the solder ball by plasma irradiation means and at the same time melting the solder ball by laser irradiation means, a solder bump is formed on the electrode pad.

SELECTED DRAWING: Figure 14

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention provides a bump forming apparatus and bump forming method for mounting solder balls on a substrate in the electrode manufacturing process of a package substrate used in a semiconductor device, and inspects the formed electrodes to repair defective portions. ) to a solder ball repair device and a solder ball repair method.

2. Description of the Related Art In recent years, bump forming techniques using solder have been used for electrical connection of semiconductor devices. For example, there is a cream solder printing method that forms solder bump electrodes with a pitch of 150 to 180 μm and a diameter of 80 to 100 μm by using a high-precision screen printer to print cream solder on electrodes of a substrate and reflow the solder.

In addition, along with the miniaturization of electrodes due to the miniaturization and high performance of semiconductor devices, solder balls are placed in a jig with fine holes processed with high precision, aligned at a predetermined pitch, and mounted directly on the substrate before reflow. There is a ball feeding method for forming solder bump electrodes by

In such background art, Japanese Patent Application Laid-Open No. 2000-049183 (Patent Document 1) discloses that solder balls are supplied from an air nozzle onto a mask, and solder balls are filled into predetermined openings while the mask is rocked and vibrated. Also disclosed is a method of filling and then heating by translational movement of a brush or squeegee. However, it is not always the case that all the solder balls are correctly mounted at each bump formation position, and mounting failures may occur in some cases.

Therefore, in Japanese Patent Application Laid-Open No. 2003-309139 (Patent Document 2), a solder ball repair device is installed, and after sucking and removing defective solder balls with a pipe member, new good solder balls are adsorbed on the pipe member. A technique is disclosed in which the pipe member is transported and remounted on the defective portion, and the laser beam irradiation unit irradiates the pipe member with a laser beam from the inside to melt the solder ball and temporarily fix it.

In addition, in Japanese Patent Application Laid-Open Nos. 2008-288515 (Patent Document 3) and 2009-177015 (Patent Document 4), the state of a substrate on which solder balls are printed is inspected, and repair is performed according to the defective state. A solder ball printing apparatus is disclosed which consists of an inspection and repair section for performing.

In addition, in Japanese Patent Application Laid-Open No. 2010-010565 (Patent Document 5), there is disclosed a method for repairing by inspecting the state of solder balls mounted on electrode pads of a substrate and supplying solder balls to electrode pads in which defects have been detected. A solder ball inspection and repair device with a dispenser is disclosed.

In addition, as methods for heating solder balls, there are Japanese Patent No. 3173338 (Patent Document 6), Japanese Patent No. 3822834 (Patent Document 7), and Japanese Patent No. 5098648 (Patent Document 8), which use plasma to remove an oxide film. Japanese Patent Application Laid-Open No. 2015-103688 (Patent Document 9) is a method for doing so, and Japanese Patent Application Laid-Open No. 2003-309139 (Patent Document 10) is a method for performing heating and melting with a laser.

JP-A-2000-049183 Japanese Patent Application Laid-Open No. 2003-309139 JP 2008-288515 A JP 2009-177015 A JP 2010-010565 A Patent No. 3173338 Patent No. 3822834 Patent No. 5098648 JP 2015-103688 A Japanese Patent Application Laid-Open No. 2003-309139

Currently, 5G (fifth generation mobile communication system) compatible technology has started to be put into practical use. Also, the diameter of solder balls used for forming bump electrodes is being reduced from 70 to 80 μm to 30 to 50 μm or less. With the miniaturization of bump electrodes due to the miniaturization, high speed, and large capacity of semiconductor devices used in 5G, even if reflow is performed by the techniques and devices disclosed in the above patent documents, solder Due to problems such as wettability and intermetallic compound (IMC) layers, there are problems such as soldering defects and cracks, the deterioration of the reliability of solder joint interfaces, and the occurrence of defects in solder bump electrodes.

In the technique disclosed in Patent Document 2, there is a high probability that the amount of residual flux is small after repair, and if the solder wettability is poor during reflow, soldering to the electrode pad portion is difficult when the solder ball melts. Imperfect wetting failure may occur.

In addition, in the solder ball inspection and repair device in the solder ball printing apparatus disclosed in Patent Documents 3 to 5, and the technology disclosed in Patent Documents 6 to 10, re-inspection is performed after reflow, solder balls are mounted, When repairing is carried out, even if flux is applied to the newly supplied solder balls, the electrode pads are damaged (affected) by the oxidizing action of the preceding reflow process. There is a high probability that defects will occur. Also, compared to normal soldering, there is a possibility that problems may arise in soldering reliability.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an apparatus for inspecting bump defects occurring on electrode pads of a substrate, resupplying solder balls to defective electrode portions, repairing them, and soldering them. Another object of the present invention is to provide a highly reliable repair soldering apparatus and method for repairing and soldering defective portions of bump electrodes after reflow in ultra-fine solder bumps. Another object of the present invention is to provide a highly reliable soldering apparatus and method for forming ultrafine solder bumps.

In order to solve the above-described problems, the bump forming apparatus of the present invention is a bump forming apparatus that supplies solder balls onto electrode pads formed on a substrate, wherein the supplied solder balls are irradiated with plasma, A plasma generator (plasma irradiation means) for removing an oxide film of a solder ball, and a laser generator (laser irradiation means) for irradiating the solder ball with a laser to melt the solder ball, wherein the plasma is irradiated from the plasma irradiation means. At the same time, the solder ball is melted by the laser emitted from the laser irradiation means to form a solder bump on the electrode pad.

Further, the bump forming method of the present invention is a bump forming method for supplying solder balls onto electrode pads formed on a substrate, wherein after the solder balls are supplied to the electrode pads, the solder balls are irradiated with plasma and A laser is irradiated to remove the oxide film of the solder ball, and at the same time, the solder ball is melted and soldered to the electrode pad.

Further, the solder ball repair apparatus of the present invention includes a repair dispenser that inspects the state of the solder bumps formed on the electrode pads of the substrate and supplies the solder balls to the electrode pads for which defects have been detected. and a plasma generator for removing an oxide film of the solder ball by irradiating plasma onto the solder ball supplied by a plasma generator, and a laser generator for irradiating the solder ball with a laser and melting the solder ball, wherein the solder ball is oxidized. At the same time as removing the film, the solder balls are melted to form solder bumps on the electrode pads.

Also, in the solder ball repair method of the present invention, the state of the solder bumps formed on the electrode pads of the substrate is inspected by a solder ball inspection process, and the electrode pads detected to be defective by the solder ball inspection process are soldered with a repair dispenser. After supplying the ball and supplying the solder ball to the electrode pad whose defect was detected by the repair dispenser, the solder ball was irradiated with plasma and laser to remove the oxide film of the solder ball and at the same time remove the solder ball. It is characterized in that it is melted and soldered to the electrode pad.

According to the present invention, it is possible to provide an apparatus for inspecting bump defects occurring on electrode pads of a substrate, resupplying and repairing solder balls to defective electrode portions, and soldering them. Also, in ultra-fine solder bumps, it is possible to provide a highly reliable repair soldering apparatus and method for repairing and soldering defective portions of bump electrodes after reflow. Also, it is possible to provide a highly reliable soldering apparatus and method for forming ultra-fine solder bumps.

Problems, configurations, and effects other than those described above will be clarified by the description of the embodiments.

It is a schematic diagram showing a flux printing and a solder ball mounting/printing process. FIG. 4 is a schematic diagram illustrating steps from flux printing to solder ball inspection and repair; 4 is a flow chart showing a step of forming bumps; FIG. 4 is a side view showing the overall structure of the solder ball supply head; It is a schematic diagram explaining solder ball mounting and printing operation. FIG. 10 is a plan view showing an example of the state of the board after mounting and printing solder balls; It is a schematic diagram showing a typical defect example after solder ball mounting and printing. FIG. 4 is a schematic diagram for explaining a repair work after solder ball mounting and printing; It is a top view explaining schematic structure of an inspection repair apparatus. FIG. 4 is a side view showing the configuration of the repair dispenser; FIG. 10 is an enlarged view for explaining the suction and separation operation of the solder balls at the tip of the repair dispenser; 1 is an external view showing a plasma laser repair system that is an embodiment of the present invention; FIG. It is an explanatory view explaining a plasma laser repair device. FIG. 4 is an explanatory diagram for explaining a plasma laser repair head section; 4 is a flow chart showing a plasma laser repair operation; FIG. 10 is an explanatory diagram for explaining a plasma laser head portion of Example 2; FIG. 10 is an explanatory diagram for explaining the principle of the plasma laser head section of Example 2; FIG. 10 is an explanatory diagram for explaining the configuration of the plasma laser head section of Example 2; FIG. 11 is an explanatory diagram for explaining pulse irradiation in Example 2;

Preferred embodiments of the apparatus and method according to the embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 shows an overview of flux printing and solder ball mounting/printing processes.

As shown in FIG. 1(a), first, a predetermined amount of flux 23 is transferred onto the electrode pads 22 of the substrate 21 by screen printing. In this embodiment, a metal screen manufactured by an additive method is used for the screen 20 so as to ensure high pattern position accuracy. As the squeegee 3, any of a square squeegee, a sword squeegee, and a flat squeegee may be used. First, conditions such as screen gap, printing pressure, and squeegee speed are set according to the viscosity and thixotropy of the flux 23 . Then, flux printing is executed under the set conditions.

If the amount of printed flux 23 is small, the solder balls may not adhere to the electrode pads 22 when the solder balls are filled. In addition, it becomes a factor of poor wetting of solder during reflow, which makes it impossible to form bumps with a good shape, resulting in poor bump height and insufficient solder connection strength.

On the other hand, if the amount of flux is too much, and excess flux adheres to the openings of the screen during mounting and printing of the solder balls, the solder balls will adhere to the openings of the screen, making it impossible to transfer the solder balls onto the board. . Thus, flux printing is a very important factor for maintaining the quality of solder ball mounting.

Next, as shown in FIG. 1B, solder balls 24 are mounted and printed on the electrode pads 22 of the board 21 on which the flux 23 is printed. In this embodiment, solder balls with a diameter of about 30 μm are used. The diameter of the solder ball has been reduced to 25 μm to 30 μm as the bump electrode has been miniaturized due to the miniaturization, high speed, and large capacity of the semiconductor device.
As the screen 20b used for mounting the solder balls 24, a metal screen manufactured by an additive method is used so as to ensure high pattern position accuracy.

A magnetic material such as nickel is used for the material of the screen 20b. Thereby, the screen 20b is magnetically attracted by the magnet 10s provided on the stage 10, and the gap between the substrate 21 and the screen 20b can be made zero. Therefore, it is possible to prevent the solder balls 24 from slipping between the substrate 21 and the screen 20b and generating surplus balls.

In addition, resin or metal micro-posts 20a are provided on the rear surface of the screen 20b. This constitutes an escape portion when the flux 23 is smudged. Therefore, when the substrate 21 on which the flux 23 is printed is brought into close contact with the screen 20b, it is possible to prevent the flux 23 from smearing and adhering to the inside of the opening of the screen.

Positioning marks (not shown) are provided at four corners of the substrate 21 . A positioning mark on the substrate 21 and a positioning mark (not shown) on the screen 20b side are visually recognized by the camera 15f (see FIG. 2) to align them with high precision. Thereby, it becomes possible to supply the solder balls 24 on the predetermined electrode pads 22 with high accuracy.

The slit-like body 63 shown on the screen 20b is one element constituting a filling unit (see FIG. 4) for supplying solder balls. By moving the filling unit in the direction of arrow 60V while swinging the slit-like body 63, the solder balls 24 are pushed and rolled, and the openings 20d of the screen 20b are filled one after another.

FIG. 2 is a schematic diagram showing an embodiment of processes from flux printing to solder ball inspection and repair.

The apparatus shown in FIG. 2 comprises a flux printing section 101, a solder ball loading/printing section 103, and an inspection/repair section 104 as an integral unit. Each part is connected by a belt conveyor 25, and the substrate is conveyed by the belt conveyor 25. FIG. The flux printing section 101 and the solder ball loading/printing section 103 are provided with tables 10f and 10b for work. The table 10f and the table 10b are vertically moved to transfer and receive substrates. The table 10f and the table 10b are also configured to be movable in horizontal directions (XY.theta. directions). Also, the screen 20 or screen 20b and the substrate can be aligned by taking images of alignment marks (not shown) of the screen 20 or screen 20b and the substrate with the cameras 15f and 15b. After passing through the inspection/repair section 104, the substrate is sent to the reflow section (not shown) in the next process, where the mounted solder balls are melted by heating and soldered onto the electrode pads to form bumps. It will be.

FIG. 3 shows a flow chart of the bump formation process in this embodiment.

First, the board is loaded into the flux printing unit (STEP 1). After that, a predetermined amount of flux is printed on the electrode pads (STEP 2). Next, the screen opening condition after flux printing is inspected (STEP 3). If the result of the inspection is NG (defective), the screen is automatically cleaned by the block cleaning device provided in the printing apparatus, and the flux is supplied and replenished as necessary. In addition, the NG board is put on standby on the conveyor for the post-process together with the NG signal so as not to carry out the process after the solder ball printing, and is discharged out of the line. By using an in-line NG substrate stocker or the like, the magazine may be discharged all at once. NG substrates can be used again for flux printing after cleaning in a process outside the line (STEP 4).

Solder balls are mounted and printed on non-defective boards (STEP 5). After the mounting and printing of the solder balls is completed, before releasing the plate, the state of filling of the solder balls in the opening of the screen is inspected from above the screen (STEP 6). As a result, if there is an insufficiently filled portion, the solder ball mounting/printing operation is executed again (STEP 7). Thereby, the filling rate of the solder balls can be improved.

If the inspection in STEP6 is OK, the stencil is removed (STEP8), and the mounting status of the solder balls is inspected by the inspection/repair device (STEP9). If the inspection of the solder ball mounting state is NG, flux is supplied and then solder balls are re-supplied to the defective electrode pad portion (STEP 10). If the inspection of the mounting state is OK, the solder balls are melted by a reflow device (not shown) arranged in the next step (STEP 11), and the solder bumps are completed.

FIG. 4 is a side view showing the overall structure of the solder ball supply head, showing the configuration of the solder ball supply head (filling unit) for mounting the solder balls on the substrate in the solder ball mounting/printing section. be.

The solder ball supply head 60 includes a ball case that stores the solder balls 24 in a space formed by the housing 61, the lid 64, and the sieve-like body 62, and a slit-like shape that is provided below the sieve-like body 62 with an interval therebetween. a body 63; The sieve-like body 62 is formed of an extremely thin metal plate having openings such as mesh-like openings or continuous rectangular slits so as to match the diameter of the solder balls 24 to be supplied. A slit-shaped body 63 is arranged below the sieve-shaped body 62 so that the slit-shaped body 63 is in surface contact with the screen 20b.

Further, the degree of contact and the gap between the slit-shaped body 63 and the screen 20b can be finely adjusted by the print head elevating mechanism 4 provided above the lid 64. FIG. The slit-shaped body 63 is made of an extremely thin metal plate made of a magnetic material. By using a magnetic material, the slit-shaped body 63 can be attracted to the screen 20b formed of the magnetic material by the magnetic force from the stage 10 provided with the magnet. The slit-like body 63 has, for example, mesh-like openings or continuous rectangular slits so as to match the diameter of the target solder balls 24 and the dimensions of the openings 20d of the screen 20b.

Further, the solder ball supply head 60 has a horizontal vibration mechanism for horizontally vibrating the sieve-like body 62 provided in the ball case. The horizontal vibration mechanism is constructed by attaching the vibrating means 65 to a member formed in a position parallel to the side surface of the ball case and providing a support member 70 to which the member is attached on the upper surface of the lid 64 . With this configuration, the sieve-shaped body 62 can be vibrated by vibrating the ball case from the side thereof by the vibrating means 65 . By vibrating the sieve-like body 62 , the slit-shaped opening provided in the sieve-like body 62 can be opened larger than the diameter of the solder ball 24 . As a result, the solder balls 24 housed in the ball case fall from the slit portion of the sieve-like body 62 onto the slit-like body 63 .
The number of solder balls 24 dropped onto the slit-like body 63 , that is, the supply amount of the solder balls 24 can be adjusted by controlling the vibration energy of the vibrating means 65 .

The vibrating means 65 uses an air rotary vibrator, and can control the vibration frequency by finely adjusting the compressed air pressure by digital control. Alternatively, the frequency may be varied by controlling the flow rate of compressed air. The vibrator 65 causes the sieve 62 and the ball case to vibrate the solder balls 24 housed in the ball case, thereby canceling out and dispersing the attractive force due to the Van des Waals force acting between the solder balls 24 . Due to the dispersion effect, it is possible to prevent the supply amount of solder balls from changing due to the influence of the material of the solder balls 24 and the temperature and humidity in the production environment. Therefore, it is possible to make adjustments in consideration of production efficiency.

Further, the solder ball supply head 60 is provided with a horizontal swing mechanism for horizontally swinging the ball case. The horizontal swing mechanism is constructed as follows. A linear guide 67 is provided above the support member 70, and a filling head support member 71 is provided with a linear rail so that the linear guide 67 can move. The filling head support member 71 is provided with a drive motor 68, and an eccentric cam 66 is attached to the shaft of the drive motor 68. As shown in FIG. When the eccentric cam 66 rotates, the support member 70 moves (swings) in the horizontal direction.
The filling head support member 71 is supported by the motor support member 2 and is constructed so as not to move laterally with respect to the motor support member 2 .

That is, the horizontal rocking mechanism rotates the eccentric cam 66 by the driving motor 68, thereby horizontally rocking the slit-shaped body 63 with an arbitrary stroke amount. Since the slit-shaped body 63 swings while being attracted to the screen 20b by magnetic force, there is no gap between the slit-shaped body 63 and the screen 20b, and the solder balls 24 can be reliably rolled. . Also, depending on the size of the opening of the slit-shaped body 63, the solder balls 24 can be reliably refilled into the opening of the slit-shaped body 63, and an efficient filling operation can be performed. The cycle speed of the screen 20b and the swing motion can be arbitrarily changed by controlling the speed of the drive motor 68, and the filling tact of the solder balls 24 can be set in consideration of the line balance. Also, the filling rate can be controlled by adjusting the type of material of the solder balls 24, the opening of the screen 20b, and the cycle speed suitable for the environmental conditions.

Further, the solder ball supply head 60 is provided with a spatula-like body 69 . When the screen 20b is separated from the surface of the substrate 21 after the solder balls 24 have been supplied onto the substrate 21 by the solder ball supply head 60, that is, when the solder balls are transferred onto the substrate by removing the plate, the plate surface of the screen 20b If the solder balls 24 are left on the screen 20b, the solder balls 24 will drop onto the substrate 21 through the openings 20d of the screen 20b, causing excessive solder balls to be supplied. For this reason, in this embodiment, the spatula-like body 69 is provided at substantially the same height as the slit-like body 63 with a gap from the ball case in the advancing direction of the solder ball supply head 60 . The tip of the spatula-like body 69 is extremely thin and polished to a high degree of flatness so that the solder balls 24 do not protrude outside the solder ball supply head 60 while being in close contact with the screen 20b.

Further, the spatula-shaped body 69 is made of a magnetic material and adheres to the screen 20b by magnetic force like the slit-shaped body 63, so that the solder balls 24 can be prevented from protruding outside the solder ball supply head 60. It should be noted that the spatula-like body 69 may be provided on the entire outer peripheral region of the ball case. The spatula-like body 69 can minimize the remaining balls on the plate surface of the screen 20b.

However, the impact of ball remnants due to minute displacements of the plate surface of the screen 20b is still conceivable. Therefore, in this embodiment, the solder ball supply head 60 is provided with an air blowing mechanism 75 for forming an air curtain in order to further reduce defects due to excess solder balls.

That is, the motor support member 2 that supports the print head elevating mechanism 4 is provided with an air blowing mechanism 75 to form an air curtain around the filling unit. Compressed air is supplied to the blower mechanism 75 from a compressed air supply source (not shown). When the blowing mechanism 75 is used, when the solder ball supply head 60 moves in the direction of the board end surface, the protruding solder balls are pushed and rolled in the moving direction of the solder ball supply head 60 by compressed air. Therefore, solder balls remaining on the printing plate can be prevented.

Next, the operation of mounting and printing solder balls on the board will be described.

FIG. 5 is a schematic diagram for explaining the solder ball mounting/printing operation. The solder ball supply head 60 and the sweeper 130 are mainly used for the solder ball mounting/printing operation.

First, as shown in (1), the solder ball supply head 60 vibrates the ball case by the horizontal vibration mechanism while moving in the longitudinal direction of the substrate 21 to fill the openings of the screen 20b with solder balls. In addition, as shown in (2), the solder ball supply head 60 also uses the horizontal swing mechanism to roll the solder balls to reliably fill the openings, while moving in the horizontal direction (arrow A direction). ).

After completing the operation of filling the screen openings with solder balls, the solder ball supply head 60 rises as indicated by arrow B in (3). After that, it moves longitudinally above the substrate 21 as shown by arrow C in (4), and when it returns to its original position, it descends as shown by arrow D to a position in contact with the screen 20b and stops there.

Next, the sweep operation of sweeper 130 will be described.

The sweeper 130 is for sweeping up any solder balls unintentionally left on the screen after the filling operation. A plurality of squeegees 131 are formed at the bottom of the sweeper 130, as shown in FIG. The squeegee 131 is attached at a certain angle in a direction opposite to the movement direction of the sweeper 130 (details are not shown). By moving the squeegee 131 over the screen and stroking its surface, the solder balls on the screen can be swept and collected like a broom.

When the solder ball supply head 60 completes the filling operation, the sweeper 130 moves in the horizontal direction indicated by the arrow E while being in contact with the screen 20b, as shown in (5). That is, a plurality of squeegees 131 attached to the bottom of the sweeper 130 advance horizontally along the upper surface of the screen 20b. At this time, the solder balls remaining on the screen 20b are collected and dropped into the empty openings of the screen 20b. As a result, it is possible to eliminate the no-ball defect shown in FIGS. 6 and 7 to be described later. Furthermore, all the solder balls on the screen 20b are removed, and finally no surplus solder balls remain on the screen 20b.

Once the sweeper 130 has moved to the vicinity of the edge of the screen 20b where the opening exists, the sweeper 130 once rises as indicated by an arrow F. After that, as shown by arrow G in (6), it returns in the longitudinal direction above the substrate 21, and as shown by arrow H, it descends again to a position in contact with the screen 20b. After that, the same sweep operation is repeated. This sweep operation is repeated several times until the solder balls on the screen 20b are completely swept away. In some cases, as indicated by arrow I in (7), the sweep operation limited to a portion of the screen 20b may be continuously performed while moving to other portions.

By the sweep operation described above, all the empty openings can be filled with solder balls, so that the no-ball defect can be eliminated. Moreover, since all the surplus solder balls on the screen 20b are finally removed, it is possible to prevent the surplus solder balls from entering the opening of the screen 20b when the screen 20b is separated from the substrate 21.例文帳に追加Therefore, it is possible to eliminate double ball defects as shown in FIGS.

FIG. 6 shows an example of how solder balls are filled on a board after solder balls are mounted and printed.

When the substrate 21 is photographed by a camera, the state shown in (a) can be observed when the solder balls are well filled in all the electrode portions. (b) shows a state in which the filling of a part of the solder balls is incomplete (no ball defect). (c) shows a double ball state in which solder balls are attracted to each other, and a state in which surplus solder balls protrude from the electrode portion.

FIG. 7 shows a typical defect example after solder ball mounting and printing. As shown in FIG. 7, as examples of solder ball filling failures, for example, a "no ball state" in which no solder ball is filled, a "double ball state" in which adjacent solder balls overlap each other, and a solder ball A "displaced ball state" that is displaced from the flux application position of the electrode portion can be mentioned.

If the board is sent to the post-process (reflow process) in these conditions, a rejected product will be produced. Therefore, by inspecting the filling condition on the board and retrying the mounting/printing operation by the filling unit (solder ball supply head), it becomes possible to correct the defective product to a good product. This detection can be determined by pattern matching that compares with a non-defective product model. After mounting and printing solder balls, batch recognition is performed for each area by a line sensor camera (not shown) attached to the filling unit. If NG, solder ball mounting and printing are executed again. If it passes, the plate separation operation is executed, and the substrate is discharged to the post-process.

FIG. 8 is a diagram for explaining the inspection/repair work after solder ball mounting/printing.

In the inspection/repair section, first, after solder ball mounting/printing is completed, the state of filling on the board is checked with a CCD (Charge Coupled Device) camera. Then, when a defect is detected, the position coordinates of the defect location are obtained. In the case of a defect such as a double ball, a misaligned ball, or an excessive ball, as shown in (1), the vacuum suction nozzle 86 for suction, which is a dispenser for removal, moves to the position of the defective solder ball 24x. Then, the defective solder balls 24x are vacuum-sucked and moved to a defective ball disposal station (not shown). At the defective ball disposal station, the ball is dropped and discarded in a disposal box 83 (see FIG. 9) by breaking the vacuum.

When an electrode pad portion to which no solder ball 24 is supplied is detected, or when a defective solder ball is removed by the vacuum suction nozzle 86, as shown in (2), normal solder balls stored in the solder ball storage portion 84 are detected. A repairing dispenser 87 is used to suck the solder ball 24 with a negative pressure. Then, as shown in (3), the repairing dispenser 87 sucking the normal solder balls 24 moves from the solder ball storage section 84 to the flux supply section 85 . As shown in (4), the repairing dispenser 87 sucking the solder balls 24 is moved to the flux 23 stored in the flux supply unit 85 to immerse the solder balls 24 in the flux 23 (or The flux 23 is added to the solder ball 24 by attaching the flux 23 to the solder ball 24 . After that, as shown in (5), the repairing dispenser 87 sucking the solder ball 24 is moved to the defective portion on the substrate. Finally, as shown in (6), solder balls 24 are supplied to the defective portion. The repair work is completed through the above steps (1) to (6).

In the above process, the removing dispenser can also be used as a flux supplying dispenser, and after the defective solder ball is removed, the flux can be supplied to the defective portion. In this case, it is not necessary to carry out the step of applying flux when supplying new solder balls.

If defective balls such as misaligned balls are removed in the above inspection, the defect can be repaired by replenishing normal solder balls to the correct positions in the repair work described above.

FIG. 9 is a diagram for explaining the schematic configuration of the inspection/repair apparatus, and is a plan view of the inspection/repair section as one independent apparatus viewed from above.

As shown in FIG. 9, when the board 21 to be inspected is carried in from the carry-in conveyor 81, it is transferred onto the inspection part conveyor 82 and conveyed in the arrow J direction. A portal frame 80 is provided above the inspection section conveyor 82 . A line sensor 79 is arranged in a direction perpendicular to the board transfer direction (arrow J direction) on the side of the entrance conveyor 81 of the portal frame 80 . The line sensor 79 detects the state of the solder balls 24 printed on the electrode pads 22 on the substrate 21 . In this embodiment, the line sensor 79 is provided as a solder ball state detector, but an imaging camera is provided to move in the longitudinal direction of the gate-shaped frame 80 to image the state of the solder ball and detect defects. may be configured to detect

A solder ball storage section 84 storing normal solder balls and a flux supply section 85 are provided on one leg side supporting the portal frame 80 . A disposal box 83 is provided on the other leg side. On the portal frame 80, a vacuum suction nozzle 86, which is a removal dispenser for sucking and removing defective solder balls, and a repair dispenser 87 for repairing defects on the board, are horizontally moved by a linear motor (arrow (K direction).

The inspection unit conveyor 82 is configured to be able to reciprocate in the direction of arrow J and its reverse direction, and according to the defect position of the substrate 21, the defect position can be aligned with the position of the repair dispenser 87 or the vacuum suction nozzle 86. It is configured so that The substrate 21 that has been inspected and repaired is carried out by the carry-out conveyor 88 and sent to the reflow device. With the above configuration, inspection and repair can be performed by the operation described with reference to FIG.

FIG. 10 is a side view showing the configuration of the repair dispenser, and FIG. 11 is an enlarged view for explaining the suction and separation operation of the solder ball at the tip of the repair dispenser.

As shown in FIG. 10, the repairing dispenser 87 is formed with a suction nozzle 90 made of, for example, plastic for holding and moving the solder balls (however, the material is not limited to plastic). . The suction nozzle 90 is tapered upward from the tip 98 . That is, the suction nozzle 90 has a shape in which the width increases from the distal end portion 98 toward the proximal end portion 99 . A through hole 92 is formed in the suction nozzle 90 .

As shown in FIG. 11, the through hole 92 is also tapered upward (although not so much as the suction nozzle 90). That is, the through hole 92 is formed to be thicker toward the top and thinner toward the bottom. More specifically, the through hole 92 is formed so that the inner diameter of the open end portion 92a provided at the lower end of the through hole 92 is approximately the same as the outer diameter of the mandrel 91 described later. Negative pressure is applied to the internal space of the through hole 92 by a negative pressure applying mechanism (not shown).

The suction nozzle 90 is fixed to a nozzle support frame 94 with bolts or the like. The nozzle support frame 94 is connected to the drive section 96 . Therefore, the suction nozzle 90 can move freely in the vertical direction together with the drive unit 96 .

A mandrel 91 is inserted and held in a through hole 92 in the suction nozzle 90 via a seal member (not shown). The mandrel 91 is, for example, a cylindrical metal rod having a diameter of about 10 μm, and is made of a material that is strong and resistant to electrification (however, the shape (diameter) and material of the mandrel 91 are not limited to the above, and the solder ball 24 preferably smaller than the diameter). The outer diameter of the mandrel 91 is smaller than the inner diameter of the through hole 92 except for the open end 92 a of the through hole 92 , so that the mandrel 91 can freely move up and down in the axial direction of the suction nozzle 90 . An upper end portion 91 a of the mandrel 91 is fixed to a support member 93 . The support member 93 is connected to a motor 95 so that it can move vertically together with the spindle 91 .

Since the supporting member 93 and the driving portion 96 are connected via the linear rail 97, the supporting member 93 and the driving portion 96 can move up and down independently. That is, the mandrel 91 attached to the support member 93 and the suction nozzle 90 connected to the driving portion 96 can move up and down independently of each other.

Thus, the support member 93, the nozzle support frame 94, the motor 95, the drive section 96, the linear rail 97, etc. constitute a drive mechanism.

When the support member 93 descends or the suction nozzle 90 rises, the lower end surface of the support member 93 and the upper end surface of the suction nozzle 90 come into contact as shown in FIG. 10(b). In this contact state, the lower end portion 91b of the mandrel 91 protrudes downward from the tip portion 98 of the suction nozzle 90 . In order to realize the above function, the total length A of the mandrel 91 is configured to be longer than the total length B of the suction nozzle 90 .

11, the tip portion 98 of the suction nozzle 90 is processed into a tapered groove so as to easily hold the solder ball 24. As shown in FIG. Since the tip portion 98 of the suction nozzle 90 is processed into a tapered groove shape, when the solder ball 24 is vacuum-sucked, the solder ball 24 fits perfectly and satisfactorily in the tapered groove, and the solder ball 24 is positioned at the tip. It becomes difficult to easily detach from the portion 98 . By making the shape of the groove portion of the tip portion 98 spherical, which is similar to the shape of the solder ball 24, even better adsorption becomes possible. However, the shape of the tip portion 98 is not limited to the above.

Next, the operation of repairing defective solder balls by the repair dispenser configured as described above will be described.

First, the suction nozzle 90 of the repair dispenser 87 sucks a new solder ball 24 (approximately 30 μm in diameter) for repair. At this time, since a negative pressure is supplied to the suction nozzle 90 through the through hole 92 , the solder ball 24 is vacuum-sucked to the tip portion 98 of the suction nozzle 90 . Although not shown, a structure is provided to prevent the negative pressure from leaking from the upper portion of the through hole 92 into which the mandrel 91 is inserted. At this time, as shown in FIG. 10(a), the mandrel 91 is retracted inward (upward) from the tip portion 98 of the suction nozzle 90. As shown in FIG.

In this suction state, the solder ball 24 is conveyed above the defective electrode pad 120, and the repairing dispenser 87 is lowered toward the electrode pad 120 to remove the flux on the electrode pad 120 as shown in FIG. 11(a). A solder ball 24 is placed within 121 .

Next, the motor 95 is driven to lower the mandrel 91 through the through hole 92 of the suction nozzle 90 until the lower end 91b of the mandrel 91 contacts the solder ball 24 . As a result, the mandrel 91 presses the solder ball 24 against the electrode pad 120, as shown in FIG. 11(b). Since the outer diameter of the mandrel 91 and the inner diameter of the open end 92a of the through hole 92 are substantially the same as described above, the mandrel 91 blocks the open end 92a of the through hole 92 during the movement of the mandrel 91 . As a result, the gap in the through hole 92 is narrowed, and even if negative pressure is applied, the resulting vacuum suction (negative pressure) force is reduced, and the solder ball 24 can be separated from the suction nozzle 90 . .

Therefore, according to the above configuration, there is no need to separately provide a vacuum pump valve for shutting off the negative pressure, which leads to cost reduction.

Next, as shown in FIG. 10B, while the solder balls 24 are pressed against the electrode pads 120 by the mandrels 91, the adsorption nozzles 90 are lifted to separate from the solder balls 24 as shown in FIG. 11B. do.

Finally, the motor 95 is driven to raise the mandrel 91 again and separate it from the solder ball 24 . At this time, the contact area between the mandrel 91 and the solder ball 24 is so small that even if static electricity is generated, it is so small that it can be ignored.

As described above, the solder ball inspection and repair apparatus according to the embodiment of the present invention (hereinafter sometimes referred to as a solder ball repair apparatus) is provided with the mandrel 91 that can move up and down in the repair dispenser 87, and the solder balls 24 is supplied to the defective portion, the solder ball 24 is physically pressed against the electrode pad 120 side by the mandrel 91, and the suction nozzle 91 is pulled up to separate from the solder ball 24, thereby removing the solder ball. It can be efficiently and reliably mounted on the electrode pad.

In addition, since the above functions are realized with a simple configuration without using an expensive device such as a laser beam irradiation device for mounting solder balls, the manufacturing cost of the device can be kept low.

Next, a plasma laser repair system that is an embodiment of the present invention will be described. FIG. 12 is an external view showing a plasma laser repair system that is an embodiment of the present invention.

With the miniaturization of bump electrodes due to miniaturization, high speed, and high capacity of semiconductor devices, for example, defects in solder bump electrodes are inspected and repaired by the inspection/repair unit 104 shown in FIG. , even after the reflow, solder ball filling failures such as those shown in FIG. , and a “displaced ball state” in which the solder ball is displaced from the flux application position of the electrode portion.

In these states, even if there is only one defective solder ball filling, the product is rejected. ) makes it possible to restore defective products to non-defective products by retrying the mounting operation. This detection can be determined by pattern matching that compares with a non-defective product model.

Therefore, the plasma laser repair system shown in this embodiment re-inspects the board that has passed through the reflow device, and re-supplies solder balls to the defective electrode portions where the bumps generated on the electrode pads of the board are defective and repairs them again. go and solder. In such ultra-fine solder bumps, the plasma laser repair system shown in this embodiment is a highly reliable repair-soldering apparatus for repairing and soldering defective portions of bump electrodes after reflow.

The plasma laser repair system shown in this embodiment is installed in the post-process of the inspection/repair unit 104 shown in FIG. 2 and the post-process of the reflow device (not shown). This plasma laser repair system is not limited to being installed in the post-process of the inspection/repair unit 104 shown in FIG. 2 or the post-process of the reflow apparatus, and may be installed as a single system. For the sake of convenience, the case where this plasma laser repair system is installed as a single system off-line or the like is called a bump forming apparatus, and the method of forming bumps using this apparatus is called the bump forming method for convenience. may be called. The bump forming apparatus forms bumps on the electrode pads by mounting solder balls on each of the plurality of electrode pads formed on the substrate and reflowing the solder balls.

In the present embodiment, it is assumed that the device is installed in a step subsequent to the reflow portion positioned after the inspection/repair portion 104 shown in FIG. At this time, the installation of the plasma laser repair system may be done online or offline. In other words, the substrate on which the bump electrode having the defective portion detected after the reflow exists may be distributed to this plasma laser repair system online, and the substrate having the bump electrode having the defective portion detected after the reflow may It may be stocked and distributed to this plasma laser repair system offline. In this embodiment, an off-line case will be described.

In addition, when the plasma laser repair system is in the process next to the reflow part located in the post-process of the inspection/repair part 104 shown in FIG. Each part may be controlled to simply pass through the system. In this case, a series of devices, a so-called production line configuration, can be simplified.

The plasma laser repair system carries out the loading stage (BF (LD)) for loading the substrate (the substrate on which the bump electrode where the defective part is detected after reflow exists), and the inspection and repair work for the substrate after reflow. An inspection/repair unit (IR), a laser repair unit (LR) that fixes (soldering or welding) the repaired solder ball to the electrode pad, and a carry-out stage (BF (ULD)) that carries out the repaired board. , has The control unit (control unit (hereinafter referred to as CON) or control means) controls the entire loading stage (BF (LD)), inspection/repair unit (IR), laser repair unit (LR), and unloading stage (BF (ULD)). is a control unit that controls to a predetermined state.

2, that is, the flux printing unit 101, the solder ball mounting/printing unit 103, and the inspection/repair unit 104 are similarly controlled by a series of control flow shown in FIG. The control flow and the CON may be linked by connecting individual control devices with dedicated communication means or the like, but may be configured as an integrated control device. (See Figure 12 for a series of system block diagrams). Of course, the flux printing unit 101, the solder ball mounting/printing unit 103, the inspection/repair unit 104, the reflow unit (not shown) arranged in the next step, and the loading stage (BF (LD )), inspection/repair unit (IR), laser repair unit (LR), and carry-out stage (BF (ULD)) as a series of systems, these are all controlled by a single controller. good too.

The inspection/repair unit (IR) also has the function of a solder ball inspection device for inspecting the state of the solder balls, such as the inspection/repair unit 104 shown in FIG. In the case of NG (when a defect is detected) by the inspection of the solder ball mounting state, flux is supplied to the solder ball, and then the electrode pad portion of the defective portion is applied, for example, with a repair dispenser as shown in FIG. and resupply the solder balls.

As a basic example, the repair work is carried out in steps (1) to (6) shown in FIG. Also, as a basic example of the device configuration, the device configurations shown in FIGS. 9 and 10 are applied. At this time, the position data where the solder ball is re-supplied is acquired, and this position data is transmitted to the inspection/repair unit (IR) or the laser repair unit (LR) by a dedicated communication means, etc. You can cooperate.

Next, a plasma laser repair device, which is a laser repair unit (LR), will be described with reference to FIG.

The plasma laser repair apparatus has a plasma laser repair head section 200, an alignment stage 216 on which a substrate 215 is placed, and a stage movement shaft 218 for moving the alignment stage 216 in horizontal directions (XYθ directions). The plasma laser repair head unit 200 may be movable in horizontal directions (XYθ directions). As a result, the repaired solder ball (solder ball position) can be pinpointed (locally) irradiated with plasma and laser. Plasma can also be expressed as emission and radiation, but in this embodiment, both of these are called irradiation.

Then, the plasma laser repair apparatus moves the alignment stage 216 in the horizontal direction (XYθ directions) based on the position data transmitted from the inspection/repair unit (IR). Also, the plasma laser repair head section 200 may be moved based on this position data.

In this embodiment, the case where the alignment stage 216 is moved in the horizontal direction (XYθ direction) will be described, but the plasma laser repair head unit 200 is configured to be movable in the X direction and the Y direction, and the alignment stage 216 is moved in the θ direction. may be configured to be movable to Alternatively, the repair head may be configured to move in the X direction, Y direction, and θ direction relative to the stage on which the substrate 215 is placed.

Next, using FIG. 14, the plasma laser repair head section 200 will be described.

The plasma laser repair head unit (which also has a meaning as a bump forming device) 200 moves to the repaired solder ball position, applies pinpoint spot preheating to the solder ball, and applies plasma to the solder ball. is irradiated to remove (oxidation-reduction) the oxide film (for example, thickness of several nm to several μm) of the solder ball, and after removing the oxide film (oxide film), a laser (laser beam) is irradiated. , locally reflow.

The plasma laser repair head unit 200 is sometimes referred to as a laser unit (laser head or laser generator (laser irradiation means)) that irradiates the solder ball with a spot laser to heat and melt the solder ball. ) 205, a plasma unit (also referred to as a micro-plasma head or a plasma generator (meaning plasma irradiation means)) that irradiates the solder balls with plasma in a spot manner, and solder balls (in which the solder balls are arranged). and a spot heater 210 for spotly preheating the substrate and electrode pads (eg, copper pads). It also has a unit fixing plate 219 for fixing at least the laser unit 205 and the plasma unit.

In this embodiment, for example, a spot heater 210 that uses infrared rays or the like is used to perform spot preheating. A hot plate may be used.

Also, instead of the spot heater 210, a defocus laser may be used to preheat the periphery of the solder ball. A defocus laser heats the periphery of the solder ball, and an infrared laser, for example, can be used as the defocus laser. Note that the focal point of the defocused laser is preferably larger than the focal point of the laser emitted from the laser unit 205 .

Also, the laser emitted from the laser unit 205 is preferably applied in a pulsed manner (15 to 25 KHz, eg, microwave). By irradiating the solder ball with laser pulses, the oxide film on the solder ball can be efficiently removed. This is because the laser can be pulsed and the thermoacoustic effect can be used to effectively crack the oxide film that forms on the surface of the solder ball due to the impact.

The plasma laser repair head section 200 also has an actuator 202 for moving the unit fixing plate 219 in the vertical direction (Z-axis direction) and a motor 201 for driving the actuator 202 . As a result, at least the laser unit 205 and the plasma unit can be vertically moved to match the laser irradiation direction and the plasma irradiation direction with the mounted solder balls. And the actuator 202 is fixed to the head frame 203 .

The plasma unit includes a plasma electrode 213 that applies a high frequency voltage to generate plasma, a plasma antenna 211 that generates an electric field by applying the high frequency voltage, and a plasma capillary 212 that is a plasma discharge tube into which gas is introduced to generate plasma. and a plasma nozzle 214 for injecting plasma. As a result, the solder balls can be spot-irradiated with plasma. In this embodiment, the plasma electrode 213, plasma antenna 211, plasma capillary 212, and plasma nozzle 214 are arranged linearly. The arrangement of these elements is arbitrary, and there is no limitation as long as the arrangement is such that the solder balls can be spot-irradiated with plasma.

Plasma is generated using the medium gas, and as the plasma gas in this embodiment, a mixed gas of 97 to 97.5% by weight argon and 3 to 2.5% hydrogen is used. be done. The types and mixing ratios of these gases are arbitrary, and the types of gases and their mixing ratios may be appropriately selected according to the apparatus configuration, or the electrode pads or solder balls to be irradiated. This gas is introduced into the plasma capillary 212 from the plasma electrode 213 side. The plasma unit preferably irradiates the electrode pads and/or solder balls with plasma containing argon gas. Also, the medium gas is preferably argon gas containing 1 to 4% by weight of hydrogen.

In this case, the hydrogen is radicalized and activated to remove the oxide film formed on the surface of the solder ball. The principle is that the oxygen in the oxide film and this hydrogen combine to form water vapor to remove the oxide film.

The laser unit 205 includes an observation camera 206 for observing the state of the solder balls, a laser light guide port 207 for introducing laser light, a collimator lens 208 for correcting aberrations to obtain parallel light of the laser light, and a parallel light beam. and a condenser lens 209 for condensing the laser light. In this embodiment, the observation camera 206 and the condenser lens 209 are arranged in a straight line, and the linear axes of the laser light guide port 207 and the collimating lens 208 and the observation camera 206 and the condenser lens 209 are aligned. placed perpendicular to the

That is, the observation camera 206 observes the state of the solder ball linearly, and the laser beam is refracted by 90° and irradiated onto the solder ball. As a result, the solder ball can be spot-irradiated with the laser. It should be noted that this device configuration is an example, and there is no limitation to these arrangement configurations. In addition, the observation camera 206 is not necessarily essential as an apparatus configuration.

The linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 preferably converge toward one solder ball. That is, the intersection (focus) of the plasma irradiation axis of the plasma unit (linear axis of the plasma unit) and the laser irradiation axis of the laser unit 205 (linear axis of the laser unit 205) is approximately the center of the solder ball. The plasma unit and the laser unit 205 are arranged so that they are aligned with each other, and the arrangement position of the substrate is controlled so that the solder ball to be repaired is arranged at this intersection. Of course, the control of the substrate arrangement position is relative, and the movement of the plasma laser head may be controlled so as to be at a predetermined position.

The angle between the laser irradiation axis of the laser unit 205 and the plasma irradiation axis of the plasma unit is not particularly limited. Although it depends on the state of , it is preferable that the angle be adjusted approximately from 0 to 180 degrees. In other words, when this angle is 0 degrees, the laser irradiation axis and the plasma irradiation axis are in the same direction. In the case of , it means that the laser irradiation axis and the plasma irradiation axis are opposed to each other, and for example, the solder ball is irradiated with the laser and the plasma from the left and right directions.

In this embodiment, the linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 are each arranged at a predetermined angle with respect to the Z axis. , each positioned at an angle of 90°. In other words, the plasma unit/laser unit 205 irradiates the plasma or the laser approximately in the center of the solder ball supplied to the electrode pad.

Also, the plasma unit/laser unit 205 preferably irradiates plasma or laser onto substantially the upper half portion of the solder ball supplied to the electrode pad. That is, it is preferable to irradiate the solder ball with plasma or laser from above.

The linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 do not necessarily have to be arranged at a predetermined angle with respect to the Z axis. For example, the linear axis of the laser unit 205 is parallel to the Z-axis (coaxial with the Z-axis), and the linear axis of the plasma unit and the axis of the spot heater 210 are at a predetermined angle. may be placed. Also, the linear axis of the plasma unit and the axis of the spot heater 210 may be parallel to the Z-axis. Also, the axis of the laser unit 205 and the axis of the plasma unit may be parallel, or they may be coaxial.

Further, the plasma laser repair head unit 200 includes a board height displacement meter 204 for measuring the height (GAP height) from the tip (board side) of the laser unit 205 to the board, and an alignment sensor for observing solder ball filling defects on the board. A camera 217 may be installed. The substrate height displacement meter 204 and the alignment camera 217 may be fixed to the unit fixing plate 219, and the spot heater 210 may also be fixed to the unit fixing plate 219.

As a result, the substrate 215 placed on the alignment stage 216 and the solder balls placed on the substrate 215 can be spotwise irradiated with laser, spotwise irradiated with plasma, and spotwise preheated. can.

Further, by using the spot heater 210 to perform spot preheating, it is not necessary to preheat the entire substrate, and thermal damage to the substrate can be suppressed. Further, by using the laser unit 205 to irradiate the laser spotwise, there is no need to reflow the entire substrate, and thermal damage to the substrate and healthy solder balls can be suppressed.

In other words, this embodiment is a solder ball repair apparatus or bump forming apparatus comprising a laser unit 205 for irradiating a solder ball with a laser and a plasma unit for irradiating a plasma on the solder ball. together or simultaneously. Here, irradiation “together” or “simultaneously” includes irradiation with plasma prior to laser irradiation in terms of time, and means that the irradiation times overlap each other.

In other words, if the plasma is irradiated to remove the oxide film of the solder ball and then the laser is irradiated, the solder ball is activated by the plasma. Although an oxide film is formed on the ball, by irradiating these together or simultaneously, the occurrence of such an oxide film on the solder ball can be suppressed. Therefore, it is not always necessary to fill the processing chamber with an inert gas such as nitrogen gas and perform the removal processing of the oxide film of the solder ball in an inert gas atmosphere. In this embodiment, the environment in which the plasma laser repair apparatus is installed is an atmospheric environment. It should be noted that this embodiment does not prevent the plasma laser repair apparatus from being covered and the covered interior to be in a nitrogen environment.

The plasma laser repair system is controlled by a control unit (CON) so that the plasma from the plasma unit that irradiates the solder balls and the laser from the laser unit that irradiates the solder balls are simultaneously irradiated. The CON also controls the exposure of the solder balls to the plasma prior to the laser exposure of the solder balls supplied by the repair dispenser. Also, this CON controls the spot heater 210 for preheating the solder balls to preheat the solder balls prior to plasma irradiation and laser irradiation.

CON is also a control unit for controlling the plasma irradiation by the plasma unit and the laser irradiation by the laser unit in bump formation, and the plasma irradiation by the plasma unit and the laser irradiation by the laser unit are simultaneously irradiated. control to secure a time slot (there is a time slot). In addition, CON controls so that plasma irradiation by the plasma unit is performed prior to laser irradiation by the laser unit also in bump formation. Furthermore, CON also controls preheating of the solder ball and the periphery of the solder ball prior to plasma irradiation and laser irradiation in bump formation as well.

FIG. 15 shows a flow chart of the plasma laser repair operation. CON properly controls each part according to this operation flow chart.

First, the substrate 215 is loaded onto the loading stage of the plasma laser repair apparatus (STEP 1).
After that, position data is received from the inspection/repair unit (IR) (STEP 2). Then, the substrate 215 is placed on the alignment stage 216 (STEP 3). Based on the received position data, for example, the alignment stage 216 is moved to place the substrate 215 at a predetermined position (STEP 4).

After that, when the arrangement is completed, the motor 201 is driven to move the actuator 202 downward (in the Z-axis direction) so that the tip of the laser unit 205 reaches the set GAP height (gap height). Move (STEP5). This GAP height is confirmed by the substrate height displacement meter 204 (STEP 6). If there is no problem with this gap height (in the case of OK), proceed to the next STEP. If there is a problem with this gap height, the actuator 202 is moved downward so that the tip of the laser unit 205 reaches the set gap height (gap height), and this gap height is adjusted again. The height is confirmed by the board height displacement meter 204 .

The GAP height is confirmed by the board height displacement gauge 204, and if there is no problem, the spot heater 210 is used to spot the solder ball (the board 215 or the electrode pad on which the solder ball is arranged), for example, 150 degrees. Preheat to ~180°C (STEP7). For example, a thermometer (not shown) can be used to check whether the temperature of the solder balls (the substrate 215 and the electrode pads on which the solder balls are arranged), especially the temperature of the substrate 215, has reached a set temperature. (STEP8). If this temperature has reached the set temperature, proceed to the next STEP. If the temperature has not reached the set temperature, the spot heater 210 continues to preheat. Alternatively, the output of the spot heater 210 is increased to accelerate the temperature rise. Then, it is confirmed again whether or not this temperature has reached the set temperature.

Further, the GAP height is confirmed by the substrate height displacement meter 204, and if there is no problem, the plasma unit irradiates the solder ball with plasma in a spot (STEP 9). Then, the observation camera 206, for example, confirms whether or not the solder balls and/or electrode pads are oxidized and reduced (the oxide film formed on the surface of the solder balls is removed) (STEP 10).
In this case, when the oxide film formed on the surface of the solder ball is removed, the solder ball looks purple. From this, it can also be confirmed that the oxide film has been removed. In addition, when oxidation-reduction is completed, it progresses to the following STEP. If the oxidation-reduction is not completed, plasma irradiation is continued. Then, it is confirmed again whether or not the oxidation-reduction is completed. Here, the case where the oxide film on the electrode pad is removed and then the oxide film on the solder ball is removed is also included. In addition, when the observation camera 206 is not installed, the time for completion of oxidation-reduction may be set in advance, and the next step may be performed based on the set time.

After confirming that the temperature of the substrate 215 has reached the set temperature and that the solder balls have been oxidized and reduced, the laser unit 205 irradiates the solder balls with a laser to reduce the temperature of the solder balls. For example, the temperature is raised to about 250° C. in about 2 seconds to melt the solder ball and fix (solder or weld) it to the electrode pad (STEP 11). As a result, solder ball filling failure can be eliminated.

After that, the substrate 215, which has been repaired and no defective solder balls are filled, is unloaded from the unloading stage (STEP 12).

In this way, the plasma irradiation timing at which the plasma unit irradiates the solder ball with plasma is earlier than the laser irradiation timing at which the laser unit 205 irradiates the solder ball with the laser. It is preferable that the irradiation is continued while the irradiation is being performed. In other words, it is preferable that there is a time period during which the plasma and the laser are irradiated together or simultaneously. Also, the preheating timing at which the spot heater 210 preheats the solder ball is earlier than the laser irradiation timing at which the laser unit 205 irradiates the solder ball with the laser. It is preferable that the interval is continued.

That is, simultaneously or simultaneously, the solder balls are irradiated with plasma, the solder balls are irradiated with laser, the oxide film of the solder balls is removed, the solder balls are melted, and the solder balls are soldered to the electrode pads. At the same time or together, the solder ball is preheated, the solder ball is irradiated with plasma, the solder ball is irradiated with laser, the oxide film of the solder ball is removed, the solder ball is melted, and the solder ball is soldered to the electrode pad. may be attached. That is, together or simultaneously means having overlapping time periods.

Before placing the solder ball, the electrode pad is irradiated with plasma to remove the oxide film of the electrode pad, then the solder ball is placed, the solder ball is irradiated with plasma, and the oxide film of the solder ball is removed. At the same time as the removal, the solder balls may be melted by irradiating the solder balls with a laser and soldered to the electrode pads.

As described above, the solder ball repair method or bump formation method described in this embodiment inspects the state of the solder bumps formed on the electrode pads of the substrate 215 by the solder ball inspection process, and detects defects by the solder ball inspection process. This is a method of supplying solder balls to the electrode pads that have been repaired using a repair dispenser.

In the solder ball repair method or bump formation method, after the solder ball is supplied to the electrode pad whose defect has been detected by the repair dispenser, the solder ball is irradiated with plasma and laser to remove the oxide film of the solder ball. Upon removal, the solder balls are melted and soldered to the electrode pads. Further, in the solder ball repair method or bump formation method, plasma is irradiated to the electrode pad whose defect is detected by the repair dispenser to remove the oxide film of the electrode pad, and then solder balls are supplied to the electrode pad, The solder ball is irradiated with plasma and laser to melt the solder ball while removing the oxide film of the solder ball, thereby fixing (soldering or welding) the solder ball to the electrode pad.

The bump forming apparatus or bump forming method can also be considered to supply solder balls 24 onto the electrode pads 22 formed on the substrate 21 .

As a result, it is possible to inspect the bump defect generated on the electrode pad of the substrate, re-supply the solder ball to the defective electrode portion, repair the defective electrode portion, and perform soldering. Moreover, in ultra-fine solder bumps, highly reliable repair soldering can be performed as repair/soldering to defective portions of bump electrodes after reflow.

Thus, the solder ball repair apparatus or bump forming apparatus described in this embodiment targets the solder balls on the electrode pads 22 of the substrate 215, and the solder bumps formed on the electrode pads 22 of the substrate 215 are used as targets. and a repair dispenser for supplying solder balls to electrode pads where defects have been detected.

Then, the solder ball repair device or bump forming device includes a plasma unit (plasma generator) that irradiates plasma onto the solder balls supplied by the repair dispenser to remove the oxide film of the solder balls, and a laser that irradiates the solder balls. and a laser unit (laser generator) 205 that melts the solder ball, and removes the oxide film of the solder ball or at the same time melts the solder ball to form a solder bump on the electrode pad (the solder ball is turned into an electrode). solder to the pad).

In addition, the solder ball repair apparatus or bump forming apparatus irradiates the electrode pad in which the defect has been detected with plasma to remove the oxide film, and irradiates the solder ball supplied by the dispenser for repair with the plasma to remove the solder ball. Equipped with a plasma unit (plasma generator) for removing an oxide film and a laser unit (laser generator) 205 for irradiating a solder ball with a laser to melt the solder ball, the oxide film of the electrode pad where the defect is detected. are removed, the oxide film of the solder ball is removed, or at the same time, the solder ball is melted and soldered to the electrode pad (solder bump is formed on the electrode pad).

Also, the laser unit 205 preferably irradiates the upper part of the solder ball supplied to the electrode pad with a laser. Also, the laser unit 205 preferably irradiates the surface of the solder ball supplied to the electrode pad with a laser substantially perpendicularly. Also, the laser unit 205 preferably irradiates a laser with a spot diameter suitable for the solder ball diameter, and this spot diameter is preferably substantially the same as or smaller than the solder ball diameter.

Also, the plasma unit preferably irradiates the electrode pad with plasma in a range wider than the diameter of the solder ball or the electrode pad. Thereby, the oxide film can be removed efficiently.

In the above description, removing the oxide film of the solder ball by plasma irradiation or melting the solder ball by laser irradiation at the same time means that plasma irradiation and laser irradiation are performed at the same time over the same period of time. , means to have at least a simultaneous irradiation period or at least a simultaneous irradiation time period. Therefore, the plasma irradiation may precede the laser irradiation, the plasma irradiation may be stopped during the laser irradiation, or vice versa.

Even if the plasma irradiation and the laser irradiation are switched instantaneously or in a short time, if the removal of the oxide film by the plasma irradiation is a short time difference that causes no problem with the melting by the laser irradiation. , means to have at least a simultaneous irradiation period or at least a simultaneous irradiation time period.

In addition, the plasma irradiation timing at which the plasma unit irradiates the electrode pad and/or the solder ball with plasma is earlier than the laser irradiation timing at which the laser unit 205 irradiates the solder ball with the laser. It is preferable that the irradiation be continued while the laser is being irradiated. In other words, it is preferable that there is a period of time during which the plasma and the laser are irradiated at the same time.

In particular, since the surface of a solder ball irradiated with plasma is activated, it is easily oxidized, and is oxidized as soon as the plasma irradiation is stopped. Therefore, it is important to irradiate the laser while irradiating the plasma.

Thus, in the solder ball repair apparatus described in this embodiment, the solder balls and/or electrode pads supplied onto the electrode pads of the substrate 215 are irradiated with plasma while the solder balls are irradiated with laser. .

In addition, although the solder ball repair apparatus described in this embodiment has been described as having the spot heater 210, this is not necessarily required depending on the product type and material, and will be omitted. However, if this spot heater 210 is provided and controlled as in the embodiment, the output of the laser can be made smaller.

According to the present embodiment, soldering the solder balls onto the electrode pads causes little damage, and can be repaired and soldered efficiently and reliably.

In addition, according to the present embodiment, only the portion where the defect is generated is irradiated with the laser and the plasma, so the time required for soldering is short, and the repair can be performed with a simple line configuration without using a batch reflow process. can be completed, the manufacturing cost of the device can be kept low.

Moreover, according to this embodiment, only the defective electrode pad portion can be repaired by laser and plasma, and soldering can be performed. Therefore, less energy is required for re-soldering, and a large amount of heat is not generated. Therefore, it is possible to provide an energy-saving and environment-friendly system.

In addition, according to the present embodiment, only the portion where the defect has occurred can be repaired by laser and plasma, and soldering is possible. No additions allow for reliable repair and soldering.

Next, using FIG. 16, the plasma laser head section 300 of Example 2 will be described. In addition, in explaining Example 2, a different part from Example 1 is demonstrated.

The plasma laser repair head unit 300 moves to the solder ball position, applies pinpoint spot preheating to the solder ball 24, and irradiates the solder ball 24 with plasma to form an oxide film on the solder ball 24. is removed, the oxide film is removed, and then a laser is applied to locally reflow or form bumps.

The plasma laser repair head unit 300 irradiates the solder balls 24 with a spot laser to heat and melt the solder balls (laser generator (meaning laser irradiation means)) 305, and the solder balls 24. It has a plasma unit (plasma generator (meaning plasma irradiation means)) 306 that irradiates plasma in a spot manner, and a spot heater 210 that preheats the solder balls 34 in a spot manner. A unit fixing plate 219 for fixing at least the laser unit 305 and the plasma unit 306 is provided.

In Example 2, the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 are coaxial in the vicinity of the solder ball 24, and the plasma or laser is directed upward (directly above) the solder ball 24. Irradiate from The axis of the spot heater 210 is set so as to face one solder ball 24 irradiated with plasma or laser. As a result, the laser irradiation axis of the laser unit 305 , the plasma irradiation axis of the plasma unit 306 , and the spot heater 210 axis are concentrated on one solder ball 24 .

Next, using FIG. 17, the principle of the plasma laser head section 300 of Example 2 will be described.

In the second embodiment, the laser emitted from the laser unit 305 is introduced in the horizontal direction, reflected vertically by the half mirror 309, and applied to the solder ball 24 from above.

Further, in the second embodiment, the solder balls 24 are also irradiated with plasma from the plasma unit 306 from above the solder balls 24 .

The plasma unit 306 uses hollow cathode discharge to generate high-density plasma, and has a plasma electrode 313 for applying a high-frequency voltage for generating plasma. A high-frequency voltage for generating plasma is supplied from an electrode power supply 314 that supplies a high-frequency voltage to a plasma electrode 313, and a plasma gas is supplied from a gas supply unit 315 to generate plasma in a plasma generation region. Particularly, in Example 2, the gas is supplied horizontally so as to be the same as the laser introduction direction. That is, the laser introduction direction and the gas supply direction are the same. Thereby, the plasma laser head section 300 can be made compact.

Thus, in Example 2, the laser penetrates the plasma generation region, and the solder ball 24 is simultaneously irradiated with the plasma and the laser. As a result, the solder balls 24 can be efficiently and simultaneously irradiated with plasma and laser.

Further, by making the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 coaxial, it is not necessary to align the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306. The solder balls 24 can be efficiently irradiated with plasma and laser.

Also in the second embodiment, for example, an observation camera 206 such as a microscope is installed. Observation camera 206 observes the state of solder ball 24 from above (directly above) through half mirror 309 . However, the observation camera 206 is not necessarily essential as an apparatus configuration.

If the observation camera 206 is not installed, the half mirror 309 is not installed, and the laser unit 305 is installed above (directly above) the solder ball 24 to irradiate the solder ball 24 directly with the laser. can.

Also in the second embodiment, the spot heater 210 for spot-wise preheating the solder ball 34 is used, but instead of the spot heater 210, a defocus laser is used to preheat the periphery of the solder ball. You can put it on.

In particular, when the observation camera 206 is not installed, the solder ball 24 can be irradiated with the defocus laser from above (directly above) the solder ball 24 through the half mirror 309 . That is, the irradiation axis of the defocus laser is made coaxial with the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 in the vicinity of the solder ball 24 . Thereby, the periphery of the solder ball 24 can be efficiently preheated.

Next, using FIG. 18, the configuration of the plasma laser head section 300 of Example 2, particularly the configuration of the plasma unit 306 will be described.

The plasma unit 306 for spotwise irradiating plasma onto the solder balls 24 uses hollow cathode discharge to generate high-density plasma.

In FIG. 18, a member 330 is a guide path forming member that configures a gas guide path and is formed in a substantially cylindrical shape. A gas guide passage 331 is axially bored in the member 330 in a straight line by drilling or the like.

The gas guide path 331 has a wide opening at the top and a narrow, open nozzle shape at the bottom. A gas supply port 332 is formed on the side of the gas guide path 331 , and gas to be plasma is supplied from the gas supply section 315 to the gas guide path 331 .

A member 320 is installed at one open end of the gas guide path 331 so as to close the opening.
The member 320 is not particularly limited as long as it is a member that seals one end of the gas guide path 331 and transmits laser light, which will be described later. called.).

An O-ring 321 is sandwiched between the quartz glass plate 320 and the member 330 , and a lid body 316 having an opening at the center is screwed onto the member 330 above the quartz glass plate 320 . As a result, the quartz glass plate 320 is pressed against the O-ring 321 side, and one end of the gas guide path 331 is sealed. (The method is not particularly limited to the screwing method as long as the quartz glass plate 320 is hermetically sealed.)
With this configuration, the gas guided from the gas supply section 315 through the gas introduction section 317 and the gas supply port 332 is guided by the gas guide path 331 and emitted downward from the nozzle formed at the lower end of the gas guide path 331 .

A quartz glass plate 322 is also installed at the open lower end of the gas guide path 331 in the form of a nozzle. With the same structure as above, the quartz glass plate 322 arranged at the lower end is pressed against the O-ring 323 side by the O-ring 323 and the lid 324, and one end of the gas guide path 331 is (hereinafter referred to as (except for the first hole described) will be sealed.

Plasma electrodes 313 made of tungsten for applying a high-frequency voltage for generating plasma by exciting gas are installed on the upper and lower surfaces of the quartz glass plate 322 placed below.
The plasma electrode 313 is connected to an electrode power supply line for supplying high voltage and high frequency voltage from an electrode power supply 314 .

The lower quartz glass plate 322 is formed with a first hole having a diameter of about 0.5 to 0.8 mm, which is the same as the tip of the open nozzle formed at the lower end of the gas guide path 331 .
Further, second holes are also formed in the plasma electrodes 313 installed on the upper and lower surfaces of the lower quartz glass plate 322 . The diameter of the second hole is greater than or approximately equal to the diameter of the first hole.

Plasma is generated around the plasma electrode 313 (in the vicinity of the second hole) by supplying a high-frequency high-frequency voltage from the electrode power supply 314 to the plasma electrode 313 , and this becomes a plasma generation region 318 . The generated plasma is then irradiated from the lower opening formed in the lid 324 toward the solder balls 24 positioned below.

This irradiation can be adjusted by the gas supply pressure from the gas supply unit 315 .
The gas supply pressure from the gas supply unit 315 is set to an appropriate pressure so that the solder balls 24 mounted on the substrate do not scatter or move (displace) from the predetermined electrodes due to the gas pressure.

It is desirable that the diameter of the opening in the lower portion of the lid 324 is approximately the same as the diameter of the first hole, or larger than the diameter of the first hole.

The laser emitted from the laser unit 305 is introduced in the horizontal direction, reflected in the vertical direction by the half mirror 309, passes through the upper opening of the lid 316, and reaches the upper quartz glass plate installed on the member 330. 320 , passes through the gas guide path 331 , the first hole, the second hole, and the lower opening of the lid 324 , and irradiates the solder balls 24 from above the solder balls 24 .

Further, as in Example 1, the gas (medium gas) is preferably argon gas containing 1 to 4% by weight of hydrogen. Also in this case, the gas is excited by the plasma electrode 313, which is a high-frequency power supply (for example, 5 kV, 50 Hz), the gas is radicalized, and the gas is turned into plasma.

As a result, the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 become coaxial in the vicinity of the solder ball 24, and the laser penetrates the plasma generation region 318, so that the plasma and the laser simultaneously generate the solder. The ball 24 is irradiated. As a result, the solder balls 24 can be efficiently and simultaneously irradiated with plasma and laser.

In Example 2, hollow cathode discharge is used to generate high-density plasma, but the plasma generation method is not limited to this. may be configured to be excited by

In Example 2, a hollow cathode discharge was used, and a plasma electrode was provided on the gas outlet side of the gas guide path 331 to generate plasma. Instead, it may be provided in an arbitrary part of the gas flow path.

As described above, according to the second embodiment, one end of which is sealed with a light transmitting member (for example, a quartz glass plate 320) that transmits laser light has a gas supply port 332 that supplies a gas for generating plasma on the side. A linearly formed gas guide path 331 for guiding the gas supplied from the gas supply port 332 to the solder balls mounted on the substrate, and one of the distribution paths from the gas guide path 331 to the solder balls. A plasma generation means (for example, plasma electrode 313) that surrounds the part and applies a high voltage/high frequency power supply to the gas to turn the gas into plasma (for example, a plasma electrode 313), and the generated laser light is transmitted through the light transmission member, and the gas distribution path and A laser generating means (for example, a laser unit 305) that irradiates the solder balls through the central portion of the plasma generation region, removes the oxide film of the solder balls with plasma, melts the solder balls with laser light, and forms bumps. A bump forming apparatus for forming can be obtained.

Next, laser pulse irradiation to which the second embodiment is applied will be described with reference to FIG.

The laser emitted from the laser unit 305 is preferably applied in a pulsed manner (15 to 25 kHz). By irradiating the solder ball 24 with laser pulses, the oxide film of the solder ball can be removed efficiently. This is because the laser can be pulsed and the thermoacoustic effect can be used to effectively crack the oxide film that forms on the surface of the solder ball due to the impact.

As described above, according to the second embodiment, since soldering can be performed by laser and plasma, the range of soldering is narrow, and highly reliable soldering is possible in forming ultra-fine solder bumps.

As described above, the bump forming apparatus, the bump forming method, the solder ball repair apparatus, and the solder ball repair method have been described based on the preferred embodiments, but the present invention is limited to the above embodiments. not to be interpreted. That is, the present invention can be embodied in various modifications and forms without departing from its spirit and main characteristics.

Reference Signs List 1 printing device 2 printing head 3 squeegee 4 motor 10 printing table 15 camera 20, 20b screen 20d opening 21 substrate 22 electrode pad 23 flux , 24... Solder ball, 60... Solder ball supply head, 87... Repair dispenser, 90... Suction nozzle, 91... Mandrel, 91a... Upper end, 91b... Lower end, 92... Through hole, 92a... Opening end, 93 Support member 94 Nozzle support frame 95 Motor 96 Drive unit 97 Linear rail 98 Tip part 99 Base end 120 Electrode pad 121 Flux 130 Sweeper 131 Squeegee 200 Plasma laser repair head 201 Motor 202 Actuator 203 Head frame 204 Substrate height displacement gauge 205 Laser unit 206 Observation camera 207 Laser light guide port 208 Collimating lens 209 Condensing lens 210 Spot heater 211 Plasma antenna 212 Plasma capillary 213 Plasma electrode 214 Plasma nozzle 215 Substrate 216 Alignment stage 217 Alignment camera 218 Stage movement axis 219 Unit fixing plate 300 Plasma laser head 305 Laser unit 306 Plasma unit 309 Half mirror 313 Plasma electrode 314 Electrode power source 315 Gas supply unit 316 Lid 317 Gas introduction portion 318 Plasma generation region 320 Member Quartz glass plate 321 O-ring 322 Quartz glass plate 323 O-ring 324 Lid 330 Member 331 Gas guide path, 332... Gas supply port.

Claims (37)

A bump forming apparatus for supplying solder balls to electrode pads formed on a substrate, comprising: a plasma generating apparatus for irradiating the supplied solder balls with plasma to remove an oxide film of the solder balls; and a laser for the solder balls. and a laser generator that irradiates and melts the solder ball,
The plasma generator irradiates the solder ball with the plasma to remove the oxide film of the solder ball, and the laser generator irradiates the solder ball with the laser to melt the solder ball, A bump forming apparatus for forming a solder bump on the electrode pad. In the bump forming apparatus according to claim 1,
A controller for controlling plasma irradiation by the plasma generator and laser irradiation by the laser generator, wherein the controller controls the plasma irradiation by the plasma generator and the laser irradiation by the laser generator. A bump forming apparatus characterized in that control is performed so that there is a time zone for simultaneous irradiation. In the bump forming apparatus according to claim 2,
The bump forming apparatus according to claim 1, wherein the controller performs control such that the plasma generator irradiates the plasma prior to the laser irradiation by the laser generator. In the bump forming apparatus according to claim 1,
A bump forming apparatus, wherein a plasma irradiation axis of the plasma generator and a laser irradiation axis of the laser generator are coaxial. In the bump forming apparatus according to claim 1,
A bump forming apparatus, wherein the solder ball and the periphery of the solder ball are preheated prior to plasma irradiation and laser irradiation of the solder ball. In the bump forming apparatus according to claim 5,
A bump forming apparatus, wherein the preheating is performed by a spot heater for spot-preheating the solder ball. In the bump forming apparatus according to claim 5,
A bump forming apparatus, wherein the preheating is performed by a defocus laser that preheats the periphery of the solder ball. In the bump forming apparatus according to claim 1,
A bump forming apparatus, wherein the laser emitted from the laser generator is applied to the solder ball in a pulsed manner. In the bump forming apparatus according to claim 1,
A bump forming apparatus, wherein the plasma generator uses hollow cathode discharge to generate plasma. A bump forming apparatus for supplying solder balls to electrode pads formed on a substrate, comprising: a plasma generating apparatus for irradiating the electrode pads with plasma to remove an oxide film of the electrode pads; The plasma generator for supplying balls and irradiating the supplied solder balls with the plasma to remove the oxide film of the solder balls, and the laser generator for irradiating the solder balls with a laser and melting the solder balls. and
A bump forming apparatus for forming a solder bump on the electrode pad by melting the solder ball at the same time as removing the oxide film of the solder ball. In a bump forming method for supplying a solder ball to an electrode pad formed on a substrate, after supplying the solder ball to the electrode pad, the solder ball is irradiated with plasma and laser to oxidize the solder ball. A method of forming a bump, wherein the solder ball is melted and soldered to the electrode pad at the same time as the film is removed. In a bump forming method for supplying a solder ball to an electrode pad formed on a substrate, the electrode pad is irradiated with plasma to remove an oxide film of the electrode pad, and after supplying the solder ball to the electrode pad, the A method of forming a bump, comprising: irradiating a solder ball with plasma and irradiating a laser to remove an oxide film of the solder ball, melt the solder ball, and solder the solder ball to the electrode pad. A solder ball repairing apparatus having a repair dispenser that inspects the state of solder bumps formed on electrode pads of a substrate and supplies solder balls to electrode pads for which defects have been detected,
A plasma generator for irradiating plasma onto the solder ball supplied by the repair dispenser to remove the oxide film of the solder ball, and a laser generator for irradiating the solder ball with laser and melting the solder ball, with
A solder ball repairing device, wherein an oxide film of the solder ball is removed and at the same time, the solder ball is melted to form a solder bump on the electrode pad. In the solder ball repair device according to claim 13,
A solder ball repair apparatus comprising a control unit, wherein the control unit performs control so that there is a time zone in which the plasma irradiation by the plasma generator and the laser irradiation by the laser generator are simultaneously irradiated. In the solder ball repair device according to claim 13 or 14,
A solder ball repair apparatus characterized in that plasma irradiation is performed prior to laser irradiation. In the solder ball repair device according to claim 13, 14 or 15,
A solder ball repairing apparatus, wherein an oxide film of the electrode pad is removed by the plasma generator prior to supplying the solder ball to the electrode pad, the defect of which has been detected by the repairing dispenser. A solder ball repairing apparatus having a repair dispenser that inspects the state of solder bumps formed on electrode pads of a substrate and supplies solder balls to electrode pads for which defects have been detected,
a plasma generator that irradiates the electrode pad with the defect detected with plasma to remove the oxide film, and irradiates the solder ball supplied by the repair dispenser with plasma to remove the oxide film of the solder ball; , a laser generator that irradiates the solder ball with a laser and melts the solder ball,
Solder characterized by removing the oxide film of the electrode pad where the defect is detected, removing the oxide film of the solder ball, melting the solder ball, and soldering the solder ball to the electrode pad. ball repair equipment. In the solder ball repair device according to claim 13 or 14,
The solder ball repairing apparatus, wherein the laser generator irradiates the solder ball with a laser beam having a spot diameter substantially equal to the diameter of the solder ball. In the solder ball repair device according to claim 13 or 14,
The solder ball repair apparatus, wherein the plasma generator irradiates the solder ball supplied to the electrode pad with plasma substantially at the center thereof. In the solder ball repair device according to claim 13 or 14,
The solder ball repair apparatus, wherein the plasma generator irradiates substantially upper half portions of the solder balls supplied to the electrode pads with plasma. In the solder ball repair device according to claim 13 or 14,
The solder ball repairing apparatus, wherein the laser generator irradiates the solder ball supplied to the electrode pad with a laser substantially at the center thereof. In the solder ball repair device according to claim 13 or 14,
A solder ball repairing apparatus, wherein the laser generator irradiates a substantially upper half portion of the solder ball supplied to the electrode pad with a laser. In the solder ball repair device according to claim 13 or 14,
The solder ball repair apparatus, wherein the plasma generator irradiates the electrode pad with plasma over a diameter of the solder ball or a range wider than the diameter of the electrode pad. In the solder ball repair device according to claim 13 or 14,
The solder ball repair apparatus, wherein the plasma generator uses a medium gas to generate plasma. The solder ball repair device according to claim 24,
The solder ball repair apparatus, wherein the medium gas is argon gas containing 1 to 4% by weight of hydrogen. In the solder ball repair device according to claim 13 or 14,
A solder ball repairing apparatus, wherein an angle between an irradiation axis of the laser generator and an irradiation axis of the plasma generator is adjusted within a range of 0 to 180 degrees. A solder ball repairing apparatus having a repair dispenser that inspects the state of solder bumps formed on electrode pads of a substrate and supplies solder balls to electrode pads for which defects have been detected,
A plasma generator for irradiating plasma onto the solder ball supplied by the repair dispenser to remove the oxide film of the solder ball, and a laser generator for irradiating the solder ball with laser and melting the solder ball, A solder ball repair device comprising: In a solder ball repair method, the state of solder bumps formed on electrode pads of a substrate is inspected by a solder ball inspection process, and solder balls are supplied from a repair dispenser to the electrode pads for which defects are detected by the solder ball inspection process,
After the solder ball is supplied to the electrode pad in which the defect is detected by the repair dispenser, the solder ball is irradiated with plasma and laser to remove the oxide film of the solder ball and remove the solder ball. A method of repairing a solder ball, characterized in that the solder ball is melted and soldered to the electrode pad. In a solder ball repair method, the state of solder bumps formed on electrode pads of a substrate is inspected by a solder ball inspection process, and solder balls are supplied from a repair dispenser to the electrode pads for which defects are detected by the solder ball inspection process,
The repair dispenser irradiates the electrode pad with the defect detected with plasma to remove the oxide film of the electrode pad, supplies a solder ball to the electrode pad, and applies the plasma and the laser to the solder ball. A method for repairing solder balls, wherein the solder balls are fixed to the electrode pads by irradiation. In the solder ball repair device according to claim 13,
A solder ball repairing apparatus, wherein a plasma irradiation axis of the plasma generator and a laser irradiation axis of the laser generator are coaxial. In the solder ball repair device according to claim 13,
A solder ball repairing apparatus, wherein the solder ball and the periphery of the solder ball are preheated prior to plasma irradiation and laser irradiation of the solder ball. 32. A solder ball repair apparatus according to claim 31, wherein
A solder ball repairing apparatus, wherein the preheating is performed by a spot heater for spot-preheating the solder ball. 32. A solder ball repair apparatus according to claim 31, wherein
A solder ball repairing apparatus, wherein the preheating is performed by a defocus laser that preheats the periphery of the solder ball. 32. A solder ball repair apparatus according to claim 31, wherein
A solder ball repairing device, wherein the laser emitted from the laser generating device is applied to the solder ball in a pulsed manner. 32. A solder ball repair apparatus according to claim 31, wherein
A solder ball repair apparatus, wherein the plasma generator uses hollow cathode discharge to generate plasma. A solder ball whose one end is sealed with a light transmitting member that transmits laser light, has a gas supply port for supplying a gas for generating plasma on the side, and the gas supplied from the gas supply port is mounted on a substrate. A gas guide path formed in a straight line that guides irradiation to
plasma generation means for surrounding part of the gas flow path from the gas guide path to the solder ball and applying a high-pressure/high-frequency power supply to the gas to turn the gas into plasma;
a laser generating means for irradiating the solder ball with the generated laser light through the light transmitting member and through the gas flow path and the central portion of the plasma generation region, wherein the oxide film of the solder ball is formed by the plasma. A bump forming apparatus for removing and melting the solder ball with the laser beam to form a bump. In a bump forming apparatus that supplies solder balls onto electrode pads formed on a substrate and melts the solder balls to form bumps,
A plasma unit that irradiates a specific solder ball supplied to an electrode pad with plasma to remove the oxide film of the solder ball, and a laser unit that irradiates the specific solder ball with a laser and melts the solder ball. , a unit fixing plate fixed so that the irradiation direction of each unit irradiates the specific solder ball;
driving means for positioning the unit fixed plate so that the irradiation direction of each unit irradiates the specific solder balls;
A bump forming apparatus comprising:

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