JP2022162107A - Hot-melt adhesive resin composition and hot-melt adhesive resin laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hot-melt adhesive resin composition which is bonded by heating for a short time, can exhibit high adhesive force, and dispenses with a special storage condition.

SOLUTION: A hot-melt adhesive resin composition contains component (A), component (B) and component (C), in which a content of the component (A) is 10 pts.mass or more and 40 pts.mass or less in 100 pts.mass of the total content of the component (A) and the component (B), and in the component (A) and the component (C), a functional group contained in the component (C) exceeds 1.0 equivalent and 5.0 equivalent or less with respect to a functional group contained in the component (A) of 1.0 equivalent.

SELECTED DRAWING: None

COPYRIGHT: (C)2023,JPO&INPIT

Description

The present invention relates to a hot-melt adhesive resin composition and a hot-melt adhesive resin laminate.

2. Description of the Related Art Conventionally, hot-melt adhesives have been used as materials for adhering to adherends such as metals. Patent Document 1 describes a film-like adhesive for connecting circuit members containing a thermoplastic resin, an epoxy resin, a phenol resin, and an insulating spherical inorganic filler.

Japanese Patent No. 3991268

Conventional hot-melt adhesives sometimes require a long heating process or a light energy irradiation process in order to advance the cross-linking reaction. Moreover, in the case of cross-linking by bringing the hot-melt adhesive into contact with water, special cross-linking equipment may be required.

On the other hand, the hot-melt adhesive is designed to have high reactivity in order to allow the cross-linking reaction to proceed in a short period of time. In such cases, it has been necessary to set special storage conditions such as low-temperature storage, moisture-proof storage, and light-shielded storage in order to store the hot-melt adhesive.

Under these circumstances, there is a demand for a hot-melt adhesive that undergoes a crosslinking reaction in a short period of time and that is easy to store.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a hot-melt adhesive resin composition that adheres by heating for a short period of time, exhibits high adhesive strength, and is easy to store.

That is, the present invention employs the following configurations.
[1] Including the following components (A), (B) and (C), the content of component (A) is 10 parts in the total content of components (A) and (B) of 100 parts by mass. 1 part by mass or more and 40 parts by mass or less, and component (A) and component (C) contain 1 functional group per 1.0 equivalent of functional group contained in component (A). A hot-melt adhesive resin composition characterized by being blended in an amount exceeding 0.0 equivalent and not more than 5.0 equivalent.
Component (A): Modified polyolefin obtained by introducing functional groups into polyolefin.
(B) Component: Solid phenolic resin.
(C) component: cross-linking agent.
[2] The hot-melt adhesive resin composition according to [1], wherein the component (A) is a modified polyolefin modified with a carboxylic acid or a carboxylic anhydride.
[3] The hot-melt adhesive resin composition according to [1] or [2], wherein the component (B) is a hot-melt phenolic resin.
[4] The component (C) is at least one selected from the group consisting of epoxy resins, phenoxy resins, isocyanate resins, oxazoline group-containing resins, amino group-containing resins, polyamines, amide resins, melamine resins, and urea resins. The hot-melt adhesive resin composition according to any one of [1] to [3].
[5] A hot-melt adhesive resin laminate having a substrate layer made of a resin as a forming material and an adhesive layer, wherein at least one surface of the substrate layer is provided with an adhesive layer, the adhesive layer comprising [ 1] A hot-melt adhesive resin laminate comprising the hot-melt adhesive resin composition according to any one of [4].
[6] The substrate layer includes fluorine resin, polyimide resin, polyetheretherketone resin, polyphenylene sulfide resin, polyphenylene ether resin, liquid crystal polyester resin, polyester resin, polyamide resin, polyamideimide resin, epoxy resin, acrylic resin, polyketone. The hot-melt adhesive resin laminate according to [5], which is at least one selected from the group consisting of resins, cyclic olefin resins, polymethylpentene, polypropylene, and polyethylene.

According to the present invention, it is possible to provide a hot-melt adhesive resin composition that adheres by heating for a short period of time, exhibits high adhesive strength, and is easy to store.
Here, “short-time heating” means heating at a heating temperature of 100° C. to 200° C. for 5 minutes to 15 minutes.

FIG. 2 is a schematic cross-sectional view of a test laminate obtained by laminating the hot-melt adhesive resin laminate of the present embodiment on a metal plate. FIG. 3 is a schematic cross-sectional view of a test laminate obtained by laminating the hot-melt adhesive resin laminate of the present embodiment on a metal plate when the laminate is folded. FIG. 4 is a schematic cross-sectional view of a test laminate obtained by laminating a hot-melt adhesive resin laminate of a comparative example on a metal plate and bending the laminate. FIG. 4 is a schematic cross-sectional view of a test laminate obtained by laminating a hot-melt adhesive resin laminate of a comparative example on a metal plate and bending the laminate.

The present invention will be described below based on preferred embodiments.

<Hot melt adhesive resin composition>
The hot-melt adhesive resin composition of this embodiment contains the following components (A), (B) and (C).
Component (A): Modified polyolefin obtained by introducing functional groups into polyolefin.
(B) Component: Solid phenolic resin.
(C) component: cross-linking agent.

In the present embodiment, the content of component (A) is 10 parts by mass or more and 40 parts by mass or less in 100 parts by mass of the total content of components (A) and (B).
Further, the component (A) and the component (C) are such that the functional group contained in the component (C) exceeds 1.0 equivalents with respect to 1.0 equivalents of the functional groups contained in the component (A) and is 5.0 equivalents. It is blended so that it is equal to or less than the equivalent.
Each component contained in the hot-melt adhesive resin composition of the present embodiment will be described below.

<<(A) component>>
The component (A) is a modified polyolefin obtained by introducing a functional group into the polyolefin. Here, the "functional group" is a functional group that interacts with the surface of the adherend, and is preferably an acidic functional group such as a carboxyl group or a carboxylic anhydride group in the present embodiment. Component (A) is a component that contributes to adhesiveness. Here, "interacting with the surface of the adherend" means forming a chemical bond such as a hydrogen bond between the polar group on the surface of the adherend and the acidic functional group of the component (A). do.

In the present embodiment, the component (A) is preferably a polyolefin resin modified with a carboxylic acid or its anhydride, and having an acid functional group such as a carboxy group or a carboxylic anhydride group in the polyolefin resin.

Component (A) can be produced by introducing a functional group into polyolefin. Examples of the introduction method include a copolymerization method and an acid modification method.
Copolymerization methods include copolymerization of acid functional group-containing monomers and olefins.
Examples of the acid modification method include graft modification in which a polyolefin resin and an acid functional group-containing monomer are melt-kneaded in the presence of a radical polymerization initiator such as an organic peroxide or an aliphatic azo compound.
In the present embodiment, it is preferable to produce the component (A) by acid-modifying the polyolefin resin.

Examples of the polyolefin resins include polyethylene, polypropylene, poly-1-butene, polyisobutylene, copolymers of propylene and ethylene, and copolymers of propylene and olefin monomers.
Examples of the olefinic monomer to be copolymerized include 1-butene, isobutylene, and 1-hexene.

Among them, maleic anhydride-modified polypropylene is preferable as component (A) from the viewpoint of adhesiveness, durability, and the like.

- Weight average molecular weight In the present embodiment, the weight average molecular weight of component (A) is preferably 40,000 or more, more preferably 50,000 or more, and particularly preferably 60,000 or more. Moreover, it is more preferably 140,000 or less, more preferably 130,000 or less, and particularly preferably 120,000 or less. The above upper limit and lower limit can be combined arbitrarily.

Amount of acid addition Examples of carboxylic acids used for modification include acrylic acid, methacrylic acid, maleic acid, nadic acid, fumaric acid, itaconic acid, crotonic acid, citraconic acid, sorbic acid, mesaconic acid, and angelic acid. . Derivatives thereof include acid anhydrides, esters, amides, imides, metal salts, etc. Specific examples include maleic anhydride, itaconic anhydride, citraconic anhydride, nadic anhydride, methyl acrylate, Methyl methacrylate, ethyl acrylate, butyl acrylate, maleic acid monoethyl ester, acrylamide, maleic acid monoamide, maleimide, N-butylmaleimide, sodium acrylate, sodium methacrylate and the like. Among these, unsaturated dicarboxylic acids and derivatives thereof are preferred, and maleic anhydride and phthalic anhydride are particularly preferred.
In the present embodiment, the amount of carboxylic acid added to component (A) is preferably 0.5% by mass or more and 3.0% by mass or less.

- Melting point In the present embodiment, the melting point of the component (A) is preferably 50°C or higher, more preferably 55°C or higher. 60° C. or higher is particularly preferred. The upper limit of the melting point is preferably 110°C or lower, more preferably 105°C or lower, and particularly preferably 100°C or lower. The above upper limit and lower limit can be combined arbitrarily. In this embodiment, the temperature is more preferably 50° C. or higher and 100° C. or lower.

<<(B) component>>
Component (B) is a solid phenolic resin. Component (B) is preferably a hot-melt phenolic resin. Specifically, novolac type phenol resin (hydroxyl equivalent: 100 g / eq to 110 g / eq, softening point: 75 ° C to 125 ° C), cresol type phenol resin (hydroxyl equivalent: 110 g / eq to 120 g / eq, softening point: 80° C. to 130° C.), or mixtures thereof. Examples of such component (B) include Bellpearl S type manufactured by Air Water Bellpearl Co., Ltd. By using such component (B), a rigid structure can be imparted to the adhesive layer after curing, and the adhesive force can be maintained even when placed in a high temperature environment of, for example, about 180°C.

The weight average molecular weight of component (B) is preferably 1,000 or more, more preferably 2,000 or more, and particularly preferably 3,000 or more. Moreover, 10000 or less are more preferable, 9000 or less are more preferable, and 8000 or less are especially preferable. The above upper limit and lower limit can be combined arbitrarily.
When the weight-average molecular weight of component (B) is within the above range, moisture resistance can be imparted to the hot-melt adhesive resin composition.

The softening point of component (B) is preferably 50°C or higher, more preferably 55°C or higher. 60° C. or higher is particularly preferred. The upper limit of the softening point is preferably 160°C or lower, more preferably 150°C or lower, and particularly preferably 140°C or lower. The above upper limit and lower limit can be combined arbitrarily.

When the softening point of the component (B) is within the above range, the reaction with the component (C) does not proceed excessively, resulting in good storability.
Here, "storability" means the property of being able to be stored for several months at a temperature of about 25°C to 40°C without requiring light-shielding equipment or moisture-proof equipment.

In the present embodiment, the content of component (A) is 10 parts by mass or more and 40 parts by mass or less, and 15 parts by mass or more and 35 parts by mass in the total content of 100 parts by mass of components (A) and (B). Part or less is more preferable.

(A) Adhesive force can be improved as content of a component is more than the said lower limit. When the content of the component (A) is equal to or less than the above upper limit, the adhesive strength can be maintained even when placed in a high temperature environment of, for example, about 180°C.

In the present embodiment, the content of component (B) is 60 parts by mass or more and 90 parts by mass or less, and 65 parts by mass or more and 85 parts by mass in the total content of 100 parts by mass of components (A) and (B). Part or less is preferred.

When the content of the component (B) is at least the above lower limit, the adhesive strength can be maintained even when placed in a high temperature environment of, for example, about 180°C. (B) Adhesive force can be improved as content of a component is below the said upper limit.

<<(C) component>>
Component (C) is a cross-linking agent. Component (C) is preferably one or more selected from the group consisting of epoxy resins, phenoxy resins, isocyanate resins, oxazoline group-containing resins, amino group-containing resins, polyamines, amide resins, melamine resins, and urea resins. . Among these, epoxy resins and isocyanate resins are preferred.

Examples of epoxy resins include bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, novolac-type epoxy resins, glycidylamine-type epoxy resins, and the like.

Examples of isocyanate resins include biret-modified and isocyanurate-modified diisocyanates such as hexamethylene diisocyanate, isophorone diisocyanate, diphenylmethane diisocyanate, tolylene diisocyanate, and xylylene diisocyanate, trimethylolpropane, and trivalent or higher polyols such as glycerin. and polyisocyanate compounds such as adducts of.

In the present embodiment, the component (A) and the component (C) have more than 1.0 equivalents of the functional group contained in the component (C) with respect to 1.0 equivalents of the functional group contained in the component (A). It is blended so as to be 5.0 equivalents or less.

Here, the functional group possessed by the component (A) is an acidic functional group such as a carboxyl group or a carboxylic anhydride group.
In the resin described above, the functional group of component (C) is an epoxy group in the case of an epoxy resin, a hydroxy group in the case of a phenoxy resin, and an isocyanate group in the case of an isocyanate resin. is an oxazoline group in the case of an oxazoline group-containing resin, an amino group in the case of an amino group-containing resin, an amine in the case of a polyamine, an amide group in the case of an amide resin, and an amide group in the case of an amide resin. In some cases it is an amide group, and in the case of urea resins it is an amino group.

In order to determine the blending amount of component (C) relative to component (A), first, the concentrations of functional groups of components (A) and (C) are determined by potentiometric titration or indicator titration. An example of calculating the functional group concentration (acid value (--COOH) or hydroxyl value (--OH)) of component (A) by the indicator titration method is described below.

[Method for measuring acid value]
1) About 3 g of the sample is weighed and put into a 200 mL tall beaker.
2) Add 20 mL of titration solvent.
3) Heat the liquid temperature to 20° C. with a beaker heating device to dissolve the sample.
4) After the liquid temperature becomes constant at 20°C, titration is performed using a 0.1 mol/L potassium hydroxide/ethanol solution to obtain the acid value.

[Calculation of acid value]
Acid value (mg/g) = (EP1-BL1) x FA1 x C1 x K1/SIZE
In the above formula, each symbol means the following numerical value.
EP1: titration volume (mL)
BL1: blank value (0.0 mL)
FA1: titrant factor (1.00)
C1: Concentration conversion value (5.611 mg/mL)
(Equivalent to 0.1 mol/L KOH 1 mL of potassium hydroxide)
K1: Coefficient (1)
SIZE: Sample collection amount (g)

The concentration of the functional group obtained by the above method is 1.0 equivalents of the functional group contained in the component (A), and the functional group contained in the component (C) exceeds 1.0 equivalents and is 5.0 equivalents. Mix as follows.

From the acid value of component (A), the specific blending amount (parts by mass) of component (C) is calculated by the following method. First, the functional group equivalent of component (A) is determined by the following formula.
Functional group equivalent of component (A) = molecular weight of KOH x 1000/acid value

For the functional group equivalent of component (C), for example, in the case of epoxy, the method specified in JIS K 7236 can be used.

For isocyanate, the method specified in JIS K 7301 can be used.
[Method for measuring isocyanate equivalent]
1) Take 3 g of sample in a 200 mL Erlenmeyer flask.
2) Add 20 mL of dehydrated toluene to dissolve the sample.
3) Add 20.0 mL of a 2 mol/L di-n-butylamine solution.
4) Shake to mix evenly, then leave for at least 20 minutes.
5) Add 100 mL of isopropyl alcohol.
6) Titrate with a 1 mol/L hydrochloric acid solution to obtain the isocyanate equivalent.

[Calculation of isocyanate equivalent]
Isocyanate equivalent = (SIZE / ((BL1-EP1) × FA1)) × K2
EP1: titration volume (mL)
BL1: blank value (39.888 mL)
FA1: titrant factor (1.00)
K2: Coefficient (1000)
SIZE: Sample collection amount (g)

Assuming that the blending amount of component (A) is X, the blending amount of component (C) Y can be expressed by the following formula.
Y = functional group equivalent of component (C) x X/functional group equivalent of component (A)

When the component (C) is blended so as to exceed the above lower limit, the adhesive strength can be maintained even when placed in a high temperature environment of, for example, about 180°C.
When the component (C) is blended so as to be equal to or less than the above upper limit, the component (A) and the component (C) do not excessively react with each other, resulting in good storability.

The hot-melt adhesive resin composition of the present embodiment can achieve both high reactivity in which adhesion can be achieved by heating for a short period of time and storability due to the configuration described above. In addition, the hot-melt adhesive resin composition of the present embodiment has particularly high adhesive strength to metals, and can maintain adhesive strength even when placed in a high-temperature environment.

<<Optional component>>
In the present embodiment, known additives such as antioxidants, surfactants, curing accelerators, plasticizers, fillers, cross-linking catalysts, processing aids, anti-aging agents, etc. may be appropriately blended as optional components. can be done. These may be used alone or in combination of two or more.

<Method for producing hot-melt adhesive resin composition>
The hot-melt adhesive resin composition can be produced by mixing the components (A), (B), (C) and optional components all at once or in an appropriate order.

<Hot melt adhesive resin laminate>
The hot-melt adhesive resin laminate of the present embodiment has a base material layer made of resin and an adhesive layer. The hot-melt adhesive resin laminate of this embodiment comprises an adhesive layer on at least one surface of the base material layer. The adhesive layer is composed of the hot-melt adhesive resin composition of the present embodiment described above.

The base material layer includes fluorine resin, polyimide resin, polyether ether ketone resin, polyphenylene sulfide resin, polyphenylene ether resin, liquid crystal polyester resin, polyester resin, polyamide resin, polyamideimide resin, epoxy resin, acrylic resin, polyketone resin, cyclic It is preferably one or more selected from the group consisting of olefin resin, polymethylpentene, polypropylene and polyethylene.

Lamination examples of the hot-melt adhesive resin laminate of the present embodiment are described below.
・Lamination example 1
A laminate obtained by laminating an adhesive layer and a base material layer.
・Lamination example 2
A laminate obtained by laminating a first adhesive layer/base material layer/second adhesive layer in this order. However, both the first adhesive layer and the second adhesive layer are composed of the hot-melt adhesive resin composition of the present embodiment.

Various adherends such as metal, glass, and plastic can be used as the adherend to be adhered using the hot-melt adhesive resin laminate of the present embodiment. Since the hot-melt adhesive resin laminate of the present embodiment can exhibit high adhesiveness to metals, metals can be suitably used as the adherend.

A generally known metal plate, flat metal plate or metal foil can be used as the metal. Examples of metals used for these include iron, copper, aluminum, lead, zinc, titanium, chromium, and alloys such as stainless steel. Alternatively, a metal or non-metal that has undergone a surface treatment treatment by plating with a metal or coating with a paint containing a metal may be used as the adherend. Particularly preferably, a flat metal plate or metal foil made of iron, aluminum, titanium, stainless steel, or a surface-treated metal is used as an adherend, whereby the hot-melt adhesive resin laminate of the present embodiment is obtained. exhibits particularly strong adhesion.

<Method for producing hot-melt adhesive resin laminate>
A hot-melt adhesive resin laminate can be produced by coating a substrate with a hot-melt adhesive resin composition dispersed or dissolved in water or a solvent and drying the composition.

EXAMPLES The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

<Production of hot-melt adhesive resin composition>
Aqueous dispersions of hot-melt adhesive resin compositions 1 to 9 having a solid content of 50% by mass and containing the A component, B component and C component shown in Table 1 below at the compounding ratio shown in Table 1 were obtained. The “equivalent weight” of component C in Table 1 below is the equivalent weight of functional groups contained in component C with respect to 1.0 equivalent weight of functional groups contained in component A. The amount of functional groups (acid value) of component A was calculated by the following method.

[Method for measuring acid value]
1) About 3 g of the sample is weighed and put into a 200 mL tall beaker.
2) Add 20 mL of titration solvent.
3) Heat the liquid temperature to 20° C. with a beaker heating device to dissolve the sample.
4) After the liquid temperature becomes constant at 20°C, titration is performed using a 0.1 mol/L potassium hydroxide/ethanol solution to obtain the acid value.

[Calculation of acid value]
Acid value (mg/g) = (EP1-BL1) x FA1 x C1 x K1/SIZE
In the above formula, each symbol means the following numerical value.
EP1: titration volume (mL)
BL1: blank value (0.0 mL)
FA1: titrant factor (1.00)
C1: Concentration conversion value (5.611 mg/mL)
(Equivalent to 0.1 mol/L KOH 1 mL of potassium hydroxide)
K1: Coefficient (1)
SIZE: Sample collection amount (g)

In Table 1, each symbol means the following materials.

<Production of hot-melt adhesive resin laminate>
The resulting aqueous dispersions of hot-melt adhesive resin compositions 1 to 9 were applied onto a substrate by hand coating and dried at 110° C. for 1 minute to form a two-layer hot-melt adhesive resin of substrate layer/adhesive layer. Laminates (Examples 1-9, Comparative Examples 1-4) were produced. Materials shown in Table 3 were used for the base layer. Hereinafter, a two-layer hot-melt adhesive resin laminate consisting of a substrate layer and an adhesive layer may be referred to as a film.

In Table 3, the abbreviations of the base material layer mean the following materials.
・PI: polyimide ・PEN: polyethylene naphthalate ・SPS: polyphenylene sulfide ・COC: cycloolefin copolymer ・PP: polypropylene

<Evaluation>
<<Measurement of peel strength>>
- Production of test laminate The test laminate will be described with reference to FIG.
The test laminate 1 shown in FIG. 1 was obtained by laminating an aluminum plate 12 having a thickness of 100 μm on the laminate 11 side of the film including the substrate layer 10 and the adhesive layer 11, followed by thermocompression bonding.
The conditions for thermocompression bonding were a temperature of 170° C., a pressure of 0.4 MPa, and a bonding time of 10 minutes. As for the dimensions of the test laminate 1, the width l1 shown in FIG. 4 was 20 mm and the length was 50 mm.

Peel strength test The aluminum plate of the test laminate 1 and the film are fixed, and the film is peeled off at a peeling angle of 180 ° at a tensile speed of 300 mm / min, and the adhesive strength of the film to the aluminum plate (unit : N/15 mm) was measured. The measurement was carried out in an atmosphere with a temperature of 23° C. and a humidity of 50% RH. The measured adhesive strength was evaluated according to the following criteria.
○: 10 N / 15 mm or more △: 7 N / 15 mm or more ×: less than 7 N / 15 mm

<<Floating evaluation at 180°C>>
The test laminate 1 shown in FIG. The substrate layer 10 was bent at the position of reference numeral l so that the surface of the base material layer 10 faced inside. The bending angle was 90°. It was heated at a temperature of 180° C. for 10 minutes while being folded. After heating, the adhesiveness of the film at the bent portion in the bent state was evaluated according to the following criteria.
○: As shown in the cross section of FIG.
Δ: As shown in the perspective view of FIG. 3 , the film at the bent portion was partially peeled off at the location indicated by reference numeral 4 , and the adhesive layer 11 was partially peeled off from the aluminum plate 12 .
x: As shown in the perspective view of FIG. 4, the entire bent portion is peeled off and a float is observed, and the adhesive layer 11 is completely peeled from the aluminum plate 12 in the entire bent portion.

≪Storage stability evaluation≫
The film described above was left at a temperature of 40° C. for 5 days. Before and after storage, the adhesive force (unit: N/15 mm) of the film to the aluminum plate was measured by the same method as described above for <<measurement of peel strength>>. The ratio (%) of the adhesive strength after storage to the adhesive strength before storage was measured and evaluated according to the following criteria.
○: 70% or more △: 50% or more ×: less than 50%

As shown in the above results, the hot-melt adhesive resin laminate to which the present invention was applied was bonded by heating for a short period of 10 minutes, and was able to exhibit high adhesive strength. Furthermore, even without special storage conditions such as low-temperature storage, light-shielding equipment, or moisture-proof equipment, deterioration in adhesive strength was not observed before and after storage.

1: Laminate, 10: Base layer, 11: Adhesive layer, 12: Aluminum plate

Claims (6)

A hot-melt adhesive resin composition containing the following components (A), (B) and (C),
An aluminum plate with a thickness of 100 μm was laminated on a film obtained by applying the hot-melt adhesive resin composition to a base layer with a thickness of 75 μm to a dry film thickness of 20 μm, and the temperature was 170 ° C., the pressure was 0.4 MPa, and the crimping time was 10 minutes. In the laminate obtained by thermocompression bonding,
When the aluminum plate and the film are fixed and the film is peeled off at a peeling angle of 180° at a pulling speed of 300 mm/min, the adhesive strength of the film to the aluminum plate (unit: N/15 mm ) is 10 N/15 mm or more.
Component (A): Modified polyolefin obtained by introducing functional groups into polyolefin.
(B) Component: Solid phenolic resin.
(C) component: cross-linking agent. 2. The hot-melt adhesive resin composition according to claim 1, wherein the component (A) is a modified polyolefin modified with a carboxylic acid or a carboxylic anhydride. 3. The hot-melt adhesive resin composition according to claim 1, wherein the component (B) is a hot-melt phenolic resin. The component (C) is one or more selected from the group consisting of epoxy resins, phenoxy resins, isocyanate resins, oxazoline group-containing resins, amino group-containing resins, polyamines, amide resins, melamine resins, and urea resins. The hot-melt adhesive resin composition according to any one of items 1 to 3. A hot-melt adhesive resin laminate having a substrate layer made of a resin as a forming material and an adhesive layer, wherein the adhesive layer is provided on at least one surface of the substrate layer,
A hot-melt adhesive resin laminate, wherein the adhesive layer is composed of the hot-melt adhesive resin composition according to any one of claims 1 to 4. The base material layer includes fluorine resin, polyimide resin, polyether ether ketone resin, polyphenylene sulfide resin, polyphenylene ether resin, liquid crystal polyester resin, polyester resin, polyamide resin, polyamideimide resin, epoxy resin, acrylic resin, polyketone resin, cyclic 6. The hot-melt adhesive resin laminate according to claim 5, which is one or more selected from the group consisting of olefin resin, polymethylpentene, polypropylene, and polyethylene.

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