JP2022140874A - Method for determining whether or not cleaning is necessary for a component mounting device and a component imaging device - Google Patents

Abstract

[Problem] To provide a component mounting device and a method for determining whether a component imaging device that images components needs cleaning, capable of appropriately determining whether a component imaging device that images components needs cleaning. [Solution] In a method for determining whether a component imaging device that images a component held by a nozzle needs cleaning, a board imaging device that moves together with a mounting head to image a board images a transparent cover of the component imaging device that is located at the depth of field of the board imaging device (ST11), and determines whether the component imaging device needs cleaning based on the image of the cover (ST12). [Selected Figure] Figure 9

Description

TECHNICAL FIELD The present invention relates to a component mounting apparatus having a component imaging device that captures an image of a component, and a cleaning necessity determination method for the component imaging device.

A component mounting apparatus that holds a component with a nozzle and mounts it on a board includes a component imaging device that captures an image of the component held by the nozzle from below (see, for example, Patent Document 1). By the way, if a component dropped from the nozzle or foreign matter such as dust adheres to the imaging area of a component imaging device whose optical axis is directed upward, problems such as obstructing the imaging field of view and blurring the captured image occur. Cleaning work is required to remove foreign matter that has been removed. A component mounting apparatus (electronic component mounting apparatus) described in Patent Document 1 includes a rotary head having a plurality of nozzles on concentric circles, and rotates the plurality of nozzles above a component imaging device (component recognition camera). If there is an imaging area in which the nozzle cannot be detected normally, it is determined that a recognition error has occurred due to a foreign object.

JP 2012-64781 A

However, although the component mounting apparatus described in Patent Literature 1 can automatically detect a foreign object adhering to the component imaging device, it overlooks a recognition abnormality depending on the size and position of the foreign object, and performs cleaning work appropriately. However, there is room for further improvement.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting apparatus and a cleaning necessity determination method for a component imaging apparatus that can appropriately determine whether or not cleaning work is necessary for a component imaging apparatus that captures an image of a component.

A component mounting apparatus according to the present invention includes a mounting head that holds a component with a mounted nozzle and mounts it on a board, a board imaging device that moves integrally with the mounting head to capture an image of the board, and the board imaging device. a component imaging device that has a transparent cover positioned at a depth of field of and captures an image of the component held by the nozzle; and a cleaning necessity determination unit that determines necessity of cleaning work.

A method for determining whether or not cleaning is necessary for a component imaging device according to the present invention determines whether or not a cleaning operation is necessary for a component imaging device that is mounted on a mounting head and captures an image of a component held by a nozzle that holds a component and mounts it on a substrate. A method for determining whether or not cleaning is necessary for a component imaging device, wherein the component imaging device has a transparent cover positioned at a depth of field of a substrate imaging device that moves integrally with the mounting head to image the substrate. The substrate imaging device images the cover, and based on the imaging result of the cover, it is determined whether or not the component imaging device needs to be cleaned.

ADVANTAGE OF THE INVENTION According to this invention, the necessity of the cleaning work of the components imaging device which images components can be judged appropriately.

1 is a plan view of a component mounting apparatus according to one embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram of the configuration of a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is an explanatory diagram of the configuration of a component recognition camera provided in a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is an explanatory diagram of the configuration of a board recognition camera provided in a component mounting apparatus according to an embodiment of the present invention; 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to one embodiment of the present invention; FIG. (a) Plan view (b) Side view explaining a state in which a foreign object adheres to a component recognition camera provided in a component mounting apparatus according to an embodiment of the present invention. FIG. 2 is an explanatory diagram of an example of a cleaning work recommendation screen displayed on a touch panel included in a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is a flowchart of a method for manufacturing a mounting board according to one embodiment of the present invention; Flow chart of a cleaning necessity determination method according to an embodiment of the present invention

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be changed as appropriate according to the specifications of the component mounting apparatus, the component recognition camera, and the board recognition camera. In the following, corresponding elements in all the drawings are given the same reference numerals, and overlapping descriptions are omitted. In FIG. 1 and a part described later, two axes orthogonal to each other in the horizontal plane are the X-axis (horizontal direction in FIG. 1) in the substrate transport direction and the Y-axis (vertical direction in FIG. 1) orthogonal to the substrate transport direction. shown. In FIG. 2 and a part to be described later, the Z-axis (vertical direction in FIG. 2) is shown as the height direction orthogonal to the horizontal plane.

First, the configuration of the component mounting apparatus 1 will be described with reference to FIGS. 1 and 2. FIG. 2 schematically shows part of the component mounting apparatus 1 in FIG. The component mounting apparatus 1 has a function of performing a component mounting operation of mounting a component supplied from a component supply section onto a board. A substrate transport mechanism 2 is arranged along the X-axis in the center of the base 1a. The substrate transport mechanism 2 carries the substrate 3 transported from the upstream side into the mounting work position, positions it, and holds it. Further, the board transfer mechanism 2 carries out the board 3 on which the component mounting work is completed to the downstream side.

Component supply units 4 are arranged on both sides of the board transfer mechanism 2 (in the front-rear direction of the Y-axis). A plurality of tape feeders 5 (component supply devices) are mounted in parallel along the X-axis in each component supply section 4 . The tape feeder 5 pitch-feeds the component tape having pockets for storing the components D in the direction (tape feeding direction) toward the substrate transport mechanism 2 from the outside of the component supply unit 4, thereby feeding the mounting head described below. The component D is supplied to the component supply position 5a from which the component D is taken out by .

In FIGS. 1 and 2, a Y-axis table 6 having a linear driving mechanism is arranged along the Y-axis at both ends of the X-axis on the upper surface of the base 1a. A beam 7, also provided with a linear drive mechanism, is coupled to the Y-axis table 6 so as to be movable along the Y-axis. Beam 7 is arranged along the X axis. A mounting head 8 is attached to the beam 7 so as to be movable along the X axis. The mounting head 8 has a suction unit 8a that sucks and holds the component D by means of a nozzle 9 attached to its lower end, and that can raise and lower the nozzle 9 that holds the component D. As shown in FIG. The nozzle 9 has a nozzle shaft 9a that holds the component D, and a reflector 9b provided on the upper part of the nozzle shaft 9a (on the side opposite to the tip surface of the nozzle shaft 9a) (see FIG. 3). .

In FIG. 1, the Y-axis table 6 and the beam 7 constitute a head moving mechanism 10 for horizontally moving the mounting head 8 along the X-axis and the Y-axis. The head moving mechanism 10 and the mounting head 8 take out the component D from the component supply position 5a of the tape feeder 5 arranged in the component supply unit 4 by sucking it onto the tip surface of the nozzle shaft 9a of the nozzle 9, and A mounting turn is performed to mount the substrate 3 on the mounting position positioned at the position of the substrate 3 . That is, the Y-axis table 6, the beam 7, and the mounting head 8 constitute component mounting means for holding the component D supplied to the component supply position 5a of the tape feeder 5 by the nozzle 9 and mounting it on the board 3. FIG. Then, the mounting head 8 holds the component D with the attached nozzle 9 and mounts it on the board 3 .

1 and 2, a component recognition camera 20 is arranged between the component supply section 4 and the board transfer mechanism 2. As shown in FIG. When the nozzle 9 of the mounting head 8 picking up the component D from the component supply unit 4 moves above the component recognition camera 20 (arrow a in FIG. 3), the component recognition camera 20 moves the component held by the nozzle 9. The holding posture of part D is recognized by imaging D.

A substrate recognition camera 30 is attached to the plate 7a to which the mounting head 8 is attached. The board recognition camera 30 moves integrally with the mounting head 8 . As the mounting head 8 moves, the board recognition camera 30 moves above the board 3 positioned on the board transfer mechanism 2, picks up an image of the board mark 3a provided on the board 3, and recognizes the position of the board 3. . In the component mounting operation on the board 3 by the mounting head 8, the mounting position is corrected in consideration of the recognition result of the holding posture of the component D by the component recognition camera 20 and the recognition result of the board position by the board recognition camera 30. will be

In FIG. 2, a carriage 11 having a plurality of tape feeders 5 preliminarily mounted on a feeder base 11a is set in the component supply section 4. As shown in FIG. The carriage 11 holds a tape reel 13 for storing the component tape 12 holding the component D in a wound state. The component tape 12 pulled out from the tape reel 13 is pitch-fed by the tape feeder 5 to the component supply position 5a.

In FIG. 1, a touch panel 14 operated by a worker is installed at a position where the worker works on the front surface of the component mounting apparatus 1 . The touch panel 14 displays various types of information on its display section, and the operator uses operation buttons displayed on the display section to input data and operate the component mounting apparatus 1 .

Next, the configuration of the component recognition camera 20 will be described with reference to FIG. The component recognition camera 20 includes an imaging unit 22 having an imaging element such as a one-dimensional CCD or a two-dimensional CMOS sensor inside a housing 21 . A cover 21a made of transparent plate glass or the like is installed on the upper surface of the housing 21 . The height position of the upper surface of the cover 21a is positioned at the mounting reference height H0, which is the same as the height of the upper surface of the substrate 3 positioned at the mounting work position of the substrate transport mechanism 2 (see also FIG. 2).

A lens 23 is arranged above the imaging unit 22 . The imaging unit 22 is installed with an optical axis 22a directed upward, and images the component D held by the nozzle 9 through the lens 23 and the cover 21a. That is, the depth of field, which is the range of the distance at which a clear image can be obtained when the component recognition camera 20 captures an image of the subject (the component D or the tip of the nozzle 9), is set higher than the cover 21a.

A coaxial illumination unit 24 and a transmission illumination unit 25 are installed inside the housing 21 and above the lens 23 . The coaxial illumination unit 24 is configured with illumination means 24a configured with a plurality of LED chips or the like and a half mirror 24b. The half mirror 24b is arranged in the middle of the optical axis 22a of the imaging section 22, and reflects the light emitted from the illumination means 24a upwardly of the half mirror 24b.

In FIG. 3, the transmissive illumination unit 25 is configured with a plurality of LED chips and the like, and illuminates the reflecting plate 9b of the nozzle 9 positioned above the component recognition camera 20 from an oblique downward direction. The light emitted from the transmission illumination unit 25 is mainly reflected by the reflector 9b of the nozzle 9 and illuminates the component D held by the nozzle 9 from above. The component recognition camera 20 switches between coaxial illumination by the coaxial illumination unit 24 and transmission illumination by the transmission illumination unit 25, or illuminates by combining them, depending on the object to be imaged.

Next, referring to FIG. 4, the configuration of the board recognition camera 30 will be described. The board recognition camera 30 has a camera unit 32 and a board lighting section 33 installed inside a housing 31 . The camera unit 32 includes an imaging element such as a two-dimensional CMOS sensor with an optical axis directed downward, a lens, and the like. A window member 34 such as glass that transmits light is installed in the lower part of the housing 31 by cutting out a part of the housing 31 . The board recognition camera 30 is set so that its depth of field includes the upper surface of the board 3 positioned at the mounting work position (mounting reference height H0).

The substrate illumination unit 33 reflects the light emitted from the side illumination substrate illumination unit 33a, the coaxial substrate illumination unit 33b, and the coaxial substrate illumination unit 33b, which illuminate the imaging target downward from the oblique direction toward the imaging target below. A half mirror 33c is provided. The substrate illumination unit 33 switches between side illumination by the side illumination substrate illumination unit 33a and coaxial illumination by the coaxial substrate illumination unit 33b, or illuminates by combining them, according to the material of the object to be imaged by the camera unit 32 and the like. When the board recognition camera 30 takes an image of the board mark 3a formed on the board 3 or the cover 21a of the component recognition camera 20, the board recognition camera 30 moves above the object to be imaged, and illuminates the object to be imaged by the board illumination unit 33. An image is taken by the unit 32 .

As described above, the board recognition camera 30 is a board imaging device that moves integrally with the mounting head 8 to take an image of the board 3 . Further, the component recognition camera 20 is a component imaging device that has a transparent cover 21a positioned at the depth of field (mounting reference height H0) of the substrate imaging device and that images the component D held by the nozzle 9. . It should be noted that the height position of the top surface of the cover 21a of the component imaging device need not strictly match the mounting reference height H0, and is outside the range of the depth of field of the component imaging device. It may be within the depth of field of the device. As a result, even if foreign matter adheres to the cover 21a, imaging of the component D held by the nozzle 9 by the component imaging device is not hindered, and imaging of the foreign matter on the cover 21a can be performed by the substrate imaging device. Become.

Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 includes a control device 40 , a substrate transport mechanism 2 , a tape feeder 5 , a mounting head 8 , a head moving mechanism 10 , a component recognition camera 20 , a substrate recognition camera 30 and a touch panel 14 . The control device 40 includes an image processing section 41 , a cleaning necessity determination section 42 , a notification processing section 43 , a mounting operation processing section 44 and a mounting storage section 45 . The mounting storage unit 45 is a storage device, and stores mounting data 46, captured image data 47, and the like.

The mounting data 46 stores information necessary for component mounting work, such as the size of the board 3, the type and mounting position (XY coordinates) of the component D to be mounted, for each type of board 3 (board type). . The image processing unit 41 controls the mounting head 8 , the head moving mechanism 10 , and the component recognition camera 20 so that the component D held by the nozzle 9 is illuminated by the coaxial illumination unit 24 or the transmissive illumination unit 25 and captured by the imaging unit 22 . Then, the captured image is image-processed to detect the position of the component D held by the nozzle 9 .

In FIG. 4, the image processing unit 41 controls the head moving mechanism 10 and the substrate recognition camera 30 to image the substrate mark 3a of the substrate 3 positioned by the substrate transport mechanism 2, processes the captured image, and performs the substrate Detect the position of 3. Further, the image processing unit 41 controls the head moving mechanism 10 and the substrate recognition camera 30 to capture an image of the cover 21a of the component recognition camera 20, and removes foreign substances such as components D, dust, dirt, etc. that have fallen onto the cover 21a. To detect. An image captured by the board recognition camera 30 is stored in the mounting storage unit 45 as captured image data 47 .

The mounting operation processing unit 44 performs the component mounting operation based on the mounting data 46, the position of the board 3 positioned on the board transport mechanism 2 detected by the image processing unit 41, and the position of the component D held by the nozzle 9. let it run. The cleaning necessity determination unit 42 determines the cleaning work of the board recognition camera 30 based on the result (captured image) of the board recognition camera 30 (board imaging device) imaging the cover 21a of the component recognition camera 20 (component imaging device). Cleaning necessity judgment processing for judging necessity is executed. Specifically, when the image processing unit 41 detects a foreign object on the cover 21a, the cleaning necessity determination unit 42 determines that cleaning work is necessary.

In FIG. 5, the cleaning necessity determination process is performed after the nozzle 9 attached to the mounting head 8 is replaced, or when the state of the nozzle 9 during component mounting work is confirmed. is executed when the image is captured. When it is time to perform the cleaning necessity determination process, the image processing unit 41 causes the board recognition camera 30 (board imaging device) to image the cover 21a, and the cleaning necessity determination unit 42 determines whether the cleaning work is necessary. When the component recognition camera 20 takes an image of the nozzle 9 that does not hold the component D, the board recognition camera 30 that moves integrally with the mounting head 8 also moves above the component recognition camera 20, so cleaning is not required. It is possible to shorten the time until the judgment process is started. Note that cleaning necessity determination processing may be executed before the image of the nozzle 9 is captured by the component recognition camera 20 .

When the cleaning necessity determination unit 42 determines that the cleaning work is necessary, the notification processing unit 43 causes the touch panel 14 to display a cleaning work recommendation screen including that the cleaning work is necessary, which will be described later. In other words, the touch panel 14 is a notification unit that notifies the user when the cleaning necessity determination unit 42 determines that the cleaning work is necessary.

Next, an example of cleaning necessity determination processing will be described with reference to FIG. 6 . When it comes time to perform the cleaning necessity determination process, the image processing unit 41 moves the board recognition camera 30 above the component recognition camera 20 to capture an image of the cover 21a of the component recognition camera 20 . Since the depth of field of the board recognition camera 30 is set at the height position (mounting reference height H0) above the cover 21a, the board recognition camera 30 can clearly image foreign substances on the cover 21a. In the example of FIG. 6, a component (foreign matter C1) and dirt such as paste (foreign matter C2) are dropped on the cover 21a. Therefore, the foreign substances C1 and C2 on the cover 21a are detected by image processing by the image processing unit 41, and the cleaning necessity determination unit 42 determines that cleaning work is necessary. The captured image at this time is stored in the captured image data 47 .

Next, an example of a cleaning work recommendation screen 51 displayed on the touch panel 14 will be described with reference to FIG. FIG. 7 is an example of a cleaning work recommendation screen 51 for the component recognition camera 20 in which foreign objects C1 and C2 shown in FIG. 6 have been detected. A warning display field 52 , a captured image display field 53 , a mounting interruption button 54 , and a cleaning end button 55 are displayed on the cleaning work recommendation screen 51 . In the warning display column 52, texts indicating that foreign substances C1 and C2 have been found on the upper surface of the component recognition camera 20 and that cleaning of the component recognition camera 20 is recommended are displayed. In the captured image display column 53, the captured image on the cover 21a of the component recognition camera 20 captured by the board recognition camera 30 stored in the captured image data 47 is displayed.

In this example, foreign object display circles E1 and E2 larger than the foreign objects C1 and C2 centered on the foreign objects C1 and C2 detected by the image processing unit 41 are superimposed and displayed in the captured image display field 53 . By displaying the foreign object display circles E1 and E2, even if the detected foreign objects C1 and C2 are too small to be recognized by the naked eye, the operator who cleans the component recognition camera 20 should remove the foreign objects C1 and C2. You can easily find the location. In this manner, the touch panel 14 (notification unit) displays the imaging result of the cover 21a including the portion determined to require cleaning work.

In FIG. 7, when the mounting suspension button 54 is operated, the component mounting operation in the component mounting apparatus 1 is suspended, and the cleaning operation of the component recognition camera 20 by the operator becomes possible. When the cleaning end button 55 is operated, the display of the cleaning work recommendation screen 51 ends, and the interrupted component mounting work is resumed. When the cleaning end button 55 is operated, the cleaning necessity determination process is executed to determine again whether or not the foreign substances C1 and C2 have been removed by the cleaning work (whether additional cleaning work is necessary). can be

Next, with reference to FIG. 8, a method of manufacturing a mounting board by the component mounting apparatus 1 will be described. In the flow described below, the process of determining the necessity of cleaning work for the component recognition camera 20 and the process of mounting the component D on the board 3 will mainly be described. Each step of is omitted.

First, the image processing unit 41 determines whether or not it is time to perform cleaning necessity determination processing (ST1: timing determination step). When it is time to determine whether or not cleaning is necessary, such as when the component recognition camera 20 takes an image of the nozzle 9 (Yes in ST1), a step of determining whether or not cleaning is necessary (ST2) is performed. If it is not the timing for determining the necessity of cleaning (No in ST1), the step of determining the necessity of cleaning (ST2) is skipped, and the component mounting step (ST3) of mounting the component D on the board 3 is executed. While there are still mounting boards to be manufactured (No in ST4), the process returns to the timing determination step (ST1) and the component mounting step (ST3) is continued. A step (ST2) is executed.

Next, with reference to FIG. 9, a cleaning necessity determination step (ST2) (method for determining necessity of cleaning of the component imaging device) for determining necessity of cleaning work of the component recognition camera 20 (component imaging device) will be described. In the cleaning necessity determination step (ST2), first, the board recognition camera 30 (board imaging device) captures an image of the cover 21a of the component recognition camera 20 (ST11: cover imaging step). Next, the cleaning necessity judgment unit 42 judges necessity of cleaning operation of the component recognition camera 20 based on the imaging result of the cover 21a (ST12: judgment step). That is, it is determined whether or not there are foreign substances C1 and C2 on the cover 21a.

When it is determined that the cleaning work of the component recognition camera 20 is necessary (Yes in ST12), the notification processing unit 43 notifies that the cleaning work is necessary and the locations (foreign substances C1 and C2) determined to require the cleaning work. The imaging result of the cover 21a (cleaning work recommendation screen 51) is displayed on the touch panel 14 (ST13: notification step). If it is determined that the cleaning work of the component recognition camera 20 is not necessary (No in ST12), the notification step (ST13) is skipped and the cleaning necessity determination step (ST2) ends.

Even if it is determined that cleaning work is necessary and the cleaning work recommendation screen 51 is displayed on the touch panel 14 (ST13), the component mounting work is continued because there is no problem with the component mounting work (ST3). As a result, the operator can perform the cleaning work of the component recognition camera 20 at an appropriate timing, such as waiting for the board, without stopping the component mounting work for a long time.

As described above, the component mounting apparatus of the present embodiment includes the mounting head 8 that holds the component D with the attached nozzle 9 and mounts it on the substrate 3, and the mounting head 8 that moves together with the mounting head 8 to mount the component D on the substrate 3. and a transparent cover 21a positioned at the depth of field (mounting reference height H0) of the board imaging device (board recognition camera 30) for imaging the component D held by the nozzle 9. a component imaging device (component recognition camera 20), and a cleaning necessity determination unit 42 that determines whether or not cleaning of the component imaging device is necessary based on the result of imaging the cover 21a by the substrate imaging device. . Accordingly, it is possible to appropriately determine whether or not the cleaning work of the component imaging device that images the component D is necessary.

The component mounting apparatus and the method for determining whether or not cleaning is necessary for a component imaging apparatus according to the present invention have the effect of making it possible to appropriately determine whether cleaning work is necessary for a component imaging apparatus that images a component, and mount a component on a board. It is useful in the field of

REFERENCE SIGNS LIST 1 component mounting device 3 substrate 8 mounting head 9 nozzle 14 touch panel (informing unit)
20 component recognition camera (component imaging device)
21a cover 30 board recognition camera (board imaging device)
D Component H0 Mounting standard height (depth of field)

Claims (8)

a mounting head that holds the component with the attached nozzle and mounts it on the substrate;
a substrate imaging device that moves integrally with the mounting head to image the substrate;
a component imaging device that has a transparent cover positioned at the depth of field of the substrate imaging device and that captures an image of the component held by the nozzle;
A component mounting apparatus, comprising: a cleaning necessity determination unit that determines necessity of cleaning work of the component imaging device based on a result of imaging of the cover by the board imaging device. 2. The component mounting apparatus according to claim 1, further comprising a notification unit for notifying that, when said cleaning necessity determination unit determines that cleaning work is necessary. 3. The component mounting apparatus according to claim 2, wherein said notification unit displays an imaging result of said cover including a portion determined to require cleaning work. after the nozzle attached to the mounting head is replaced or when the component imaging device images the nozzle when checking the state of the nozzle, the substrate imaging device images the cover;
4. The component mounting apparatus according to any one of claims 1 to 3, wherein said cleaning necessity determination unit determines necessity of cleaning work. A cleaning necessity determination method for a component imaging device for determining whether or not cleaning work is necessary for a component imaging device that is mounted on a mounting head, holds a component, and images a component held by a nozzle that mounts the component on a substrate, the method comprising:
The component imaging device has a transparent cover positioned at a depth of field of a substrate imaging device that moves integrally with the mounting head to image the substrate,
The board imaging device images the cover,
A cleaning necessity determination method for a component imaging device, for determining necessity of cleaning work of the component imaging device based on an imaging result of the cover. 6. The method for determining whether or not cleaning is necessary for a component imaging device according to claim 5, wherein when it is determined that cleaning work for the component imaging device is necessary, that effect is notified. 7. The parts imaging device according to claim 5, wherein when it is determined that cleaning work of the parts imaging device is necessary, an imaging result of the cover including a portion determined to require cleaning work is displayed. judgment method. after the nozzle attached to the mounting head is replaced or when the component imaging device images the nozzle when checking the state of the nozzle, the substrate imaging device images the cover;
8. The method for determining whether or not cleaning of the component imaging device is necessary according to claim 5, wherein the cleaning operation of the component imaging device is determined.

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