JP2022086030A - Component mounting device - Google Patents

Abstract

To provide a component mounting device capable of clearly recognizing a through hole provided through a substrate and mounting a component with high accuracy.SOLUTION: A component mounting device 1 that mounts a component BH on a substrate KB that has a substrate hole KH that is a through hole that penetrates in the thickness direction 1 includes a substrate transport unit 12 that supports and transports both ends of the substrate KB in the width direction by a pair of conveyors 12a, and positions the substrate at a predetermined working position, a lighting unit 19 that is placed above the substrate transfer unit 12 and illuminates the substrate KB positioned at the work position, and a substrate recognition camera 18 that is placed above the substrate transfer unit 12 and captures the substrate hole KH while the substrate KB is illuminated by the lighting unit 19. Further, below the substrate transport unit 12, a sticking sheet 31 is provided as light reflection suppressing means for suppressing the upward reflection of light due to the dark color of the surface that reflects light.SELECTED DRAWING: Figure 2

Description

The present invention relates to a component mounting device for mounting components on a substrate.

Conventionally, there is known a component mounting device that picks up components supplied by a component feeder by a mounting head and mounts them on a board. In such a component mounting device, the board transport section supports and transports both ends of the board in the width direction by a pair of conveyors, and positions the board at a predetermined work position. Then, the table member on which the lower receiving pin is erected is raised from below the positioned substrate, and the upper end of the lower receiving pin is brought into contact with the lower surface of the substrate to support (undertake) the substrate. After the substrate is supported by the underlay pin, the recognition mark provided on the substrate is imaged by a camera from above the substrate (for example, Patent Document 1 below).

Here, the camera is provided on the mounting head, and the recognition mark is imaged while irradiating the substrate with light from the lighting unit also provided on the mounting head. The recognition mark provided on the substrate may be a through hole (hereinafter referred to as a substrate hole) provided through the substrate in the thickness direction. In this case, the camera recognizes the contour of the inner edge of the substrate hole based on the contrast between the brightness of the surface of the substrate and the brightness of the inside of the substrate hole.

Japanese Unexamined Patent Publication No. 2015-38930

However, when the contour of the substrate hole is recognized based on the contrast between the brightness of the surface of the substrate and the brightness of the inside of the substrate hole as described above, if the color of the upper surface of the underlay table is light, Light (reflected light from the underlay table) easily enters the camera from below the substrate through the substrate hole. Then, the contrast between the brightness of the surface of the board and the brightness of the inside of the board hole becomes small, it becomes difficult to clearly recognize the outline of the board hole, and the mounting accuracy of the component by the component mounting device may decrease. Occurs.

Therefore, an object of the present invention is to provide a component mounting device capable of clearly recognizing a through hole provided through a substrate and mounting a component with high accuracy.

The component mounting device of the present invention is a component mounting device for mounting components on a substrate having a through hole penetrating in the thickness direction, and supports and conveys both ends of the substrate in the width direction by a pair of conveyors. A substrate transport unit positioned at a predetermined work position, a lighting unit arranged above the substrate transport unit and illuminating the substrate positioned at the work position, and an illumination unit arranged above the substrate transport unit and illuminating the substrate. An image pickup unit that captures an image of the through hole while the substrate is illuminated by the unit, and a light reflection suppressing means for suppressing upward reflection of light below the substrate transport unit are provided.

According to the present invention, it is possible to clearly recognize the through hole provided through the substrate and mount the component with high accuracy.

Side view of the main part of the component mounting device according to the first embodiment of the present invention. Enlarged perspective view of a part of the component mounting device according to the first embodiment of the present invention. Top view of the board on which the component mounting device according to the first embodiment of the present invention is to mount the component. Perspective view of the lower receiving portion included in the component mounting device according to the first embodiment of the present invention. Top view of the lower receiving portion provided in the component mounting device according to the first embodiment of the present invention. A cross-sectional view showing a sticking sheet which is a light reflection suppressing means provided in the component mounting apparatus according to the first embodiment of the present invention together with a part of an underlay table. A block diagram showing a control system of a component mounting device according to the first embodiment of the present invention. The figure which shows an example of the image obtained by image-taking the substrate hole by the substrate recognition camera provided in the component mounting apparatus in Embodiment 1 of this invention. A perspective view of a lower receiving portion included in the component mounting device according to the second embodiment of the present invention. (A) (b) A perspective view showing a pin hole insertion type sheet, which is a light reflection suppressing means included in the component mounting device according to the second embodiment of the present invention, together with a part of the underlay table. (A) (b) Cross-sectional view showing a pin hole insertion type sheet which is a light reflection suppressing means provided in the component mounting device according to the second embodiment of the present invention together with a part of the underlay table. (A) (b) Cross-sectional view showing a mountain-shaped sheet, which is a modification of the pin hole insertion type sheet which is a light reflection suppressing means provided in the component mounting device of the second embodiment of the present invention, together with a part of the underlay table. (A) (b) A perspective view showing a pin-mounted sheet, which is a light reflection suppressing means included in the component mounting device according to the second embodiment of the present invention, together with a lower receiving pin and a part of the lower receiving table. A pin-mounted sheet and a pin hole insertion type sheet, which are light reflection suppressing means included in the component mounting device according to the second embodiment of the present invention, are shown together with a part of the lower receiving pin and the lower receiving table (a) plan view (b). Cross section (A) (b) A perspective view showing a pin hole insertion type bottomed tubular member, which is a light reflection suppressing means included in the component mounting device according to the second embodiment of the present invention, together with a part of the underlay table. (A) (b) A perspective view showing a pin-mounted bottomed cylindrical member, which is a light reflection suppressing means included in the component mounting device according to the second embodiment of the present invention, together with a part of the underlay table. Perspective view of the lower receiving portion included in the component mounting device according to the third embodiment of the present invention. Perspective view of the lower receiving portion included in the component mounting device according to the fourth embodiment of the present invention. (A) (b) Cross-sectional view showing a magnet sheet, which is a light reflection suppressing means included in the component mounting device according to the fourth embodiment of the present invention, together with a part of the underlay table.

(Embodiment 1)
FIG. 1 shows a component mounting device 1 according to the first embodiment of the present invention. The component mounting device 1 is a device that repeatedly executes the component mounting work of mounting the component BH on the board KB, and is a base 11, a board transport section 12, a lower receiving section 13, a parts feeder 14, a head moving mechanism 15, and a mounting head. A component recognition camera 17, a board recognition camera 18, a lighting unit 19, and a control device 20 are provided. In the present embodiment, for convenience of explanation, the left-right direction of the base 11 is the X direction, and the front-back direction of the base 11 is the Y direction. Further, the vertical direction is the Z direction.

In FIG. 1, the substrate transport unit 12 is provided on the base 11. As shown in FIG. 2, the substrate transport portion 12 supports and transports both ends of the substrate KB supplied from the outside in the width direction from below by a pair of conveyors 12a extending in the X direction, and transports the substrate 11 to the base 11. The board KB is positioned at a predetermined working position defined near the central portion.

In the present embodiment, the substrate KB is a so-called multi-chamfered substrate, and as shown in FIG. 3, a plurality of (here, four) individual piece regions R are formed by slits SL provided so as to penetrate the substrate KB. (See also Figure 2). The component BH is mounted on each individual piece region R, and in the future, it will be treated as an individual mounting board by being separated from each other by the slit SL portion. A plurality of through holes (referred to as substrate holes KH) provided so as to penetrate the substrate KB in the thickness direction are provided in each individual piece region R as recognition marks of the individual piece region R.

In FIGS. 1 and 2, the lower receiving portion 13 is provided below the substrate transport portion 12. The lower receiving portion 13 is a mechanical portion that lifts and supports the substrate KB positioned at the working position by the substrate conveying portion 12 from below, and as shown in FIG. 2, the elevating cylinder 21, the lower receiving table 22, and a plurality of lower receiving portions. It has a pin 23.

In FIG. 4, the underlay table 22 is made of a horizontal flat plate-shaped table member. The underlay table 22 is made of a non-magnetic material (here, aluminum is used), and a large number of underlay pin insertion holes 22H penetrating in the thickness direction and opening upward are arranged in a matrix on the upper surface thereof. There is. The color of the surface of the underlay table 22 is the color of aluminum, which is light. The lower receiving table 22 is raised and lowered by the raising and lowering cylinder 21.

In FIG. 4, the lower receiving pin 23 is composed of a pin-shaped member extending in the Z direction. On the lower side, the insertion protrusion 23T projects downward from the bottom surface of the base 23B and extends. The lower receiving pin 23 can be attached (held) to the lower receiving table 22 by inserting the insertion protrusion 23T into the lower receiving pin insertion hole 22H provided in the lower receiving table 22 from above (FIG. 4). ..

In FIGS. 4 and 5, a sticking sheet 31 as a light reflection suppressing means is attached to the upper surface of the underlay table 22. The sticking sheet 31 is a sheet-like member, and the lower surface thereof is stuck to the upper surface of the lower support table 22. At least the upper surface (the surface that reflects light) of the sticking sheet 31 is dark (preferably black), and the reflection of light incident on the surface is suppressed.

The means for attaching the attachment sheet 31 to the upper surface of the underlay table 22 is here the double-sided adhesive tape 32 (FIG. 6). The sticking sheet 31 can be attached to an arbitrary position on the underlay table 22, but here, each of the plurality of substrate holes KH of the substrate KB positioned at the working position on the upper surface of the underlay table 22. It is pasted at a position that covers the position directly below (or near).

In FIG. 1, a dolly 14D is connected to the base 11, and the parts feeder 14 is detachably attached to a feeder mounting portion 14F provided on the upper part of the dolly 14D. A plurality of parts feeders 14 are provided side by side in the width direction (X direction) of the feeder mounting portion 14F. Each part feeder 14 continuously supplies the part BH to the part supply port 14K (FIG. 1) provided at the end near the substrate transport portion 12.

In FIGS. 1 and 2, the head moving mechanism 15 is composed of, for example, an XY beam mechanism, and moves the mounting head 16 in a horizontal plane (in the XY plane). As shown in FIGS. 1 and 2, the mounting head 16 includes a plurality of nozzles 16N extending downward. The mounting head 16 can raise and lower each nozzle 16N individually, and can also rotate around the vertical axis. The mounting head 16 generates a suction force at the lower end of the nozzle 16N to attract the component BH supplied by the component feeder 14 and pick up the component BH.

In FIG. 1, the component recognition camera 17 is provided in the area between the substrate transfer section 12 and the component feeder 14 on the base 11. The component recognition camera 17 has the image pickup optical axis directed upward. The component recognition camera 17 captures the component BH picked up by the mounting head 16 attracted to the nozzle 16N from below.

In FIGS. 1 and 2, the substrate recognition camera 18 is attached to the mounting head 16 and moves inward in the XY plane together with the mounting head 16. The substrate recognition camera 18 has the image pickup optical axis directed downward, and images the substrate hole KH of the substrate KB positioned at the working position by the substrate transport unit 12 from above.

In FIGS. 1 and 2, the illumination unit 19 is attached to the mounting head 16. The lighting unit 19 illuminates the substrate KB by emitting light downward.

In FIG. 1, the control device 20 is provided in the base 11. As shown in FIG. 7, the control device 20 includes a storage unit 41, a mounting operation control unit 42, and a recognition determination unit 43. The storage unit 41 stores various data related to the component BH and the like, in addition to the component mounting operation program which is a program that defines the order in which the component BH is mounted on the board KB.

The mounting operation control unit 42 executes the component mounting operation for mounting the component BH on the board KB by operating each part of the component mounting device 1 according to the component mounting operation program stored in the storage unit 41. Specifically, the mounting operation control unit 42 controls the transfer operation of the substrate KB by the pair of conveyors 12a provided in the substrate transfer unit 12 and the elevating operation of the lower receiving table 22 by the elevating cylinder 21. The mounting operation control unit 42 also controls the supply operation of the component BH by each part feeder 14, the moving operation of the mounting head 16 by the head moving mechanism 15, the raising / lowering and rotation operation of the nozzle 16N by the mounting head 16, and the nozzle 16N. Controls the suction operation of the component BH.

The mounted motion control unit 42 also controls the imaging motion of the component BH by the component recognition camera 17. The image of the component BH obtained by the image pickup of the component recognition camera 17 is sent to the recognition determination unit 43 of the control device 20, and the component BH is recognized. Further, the mounting operation control unit 42 controls the lighting operation by the lighting unit 19 and the imaging operation of the component BH by the substrate recognition camera 18.

The image of the substrate hole KH obtained by the image pickup of the substrate recognition camera 18 is sent to the recognition determination unit 43 of the control device 20 to recognize the substrate hole KH, and the position of each piece region R is grasped. At this time, the recognition determination unit 43 is based on the contrast between the brightness of the surface of the substrate KB and the brightness of the inside of the substrate hole KH based on the image of the substrate hole KH imaged by the substrate recognition camera 18 which is the imaging unit. Recognize hole KH.

When performing component mounting work, the component mounting device 1 first receives and transports the board KB sent from the device on the upstream side of the component mounting device 1 by the board transport unit 12, and positions the board KB at the work position. After the board KB is positioned at the working position by the board transport unit 12, the component mounting device 1 operates the elevating cylinder 21 to raise the lower receiving table 22. As a result, the entire lower receiving portion 13 rises, and each tip portion of the plurality of lower receiving pins 23 provided on the lower receiving table 22 abuts on the lower surface of the substrate KB from below. When the tip of the lower support pin 23 comes into contact with the lower surface of the board KB and then the lower support table 22 is further pushed up by the elevating cylinder 21, the board KB moves upward away from the pair of conveyors 12a, and the board transfer section 12 It is pressed from below against a pair of substrate pressing members 12T (FIG. 2) installed above the above and clamped.

When the board KB is clamped, the component mounting device 1 moves the mounting head 16 above the board KB by the head moving mechanism 15. Then, the optical axis of the substrate recognition camera 18 is aligned with the center of the substrate hole KH, and the substrate recognition camera 18 is made to image the substrate hole KH. At the time of imaging by the substrate recognition camera 18, light is emitted from the illumination unit 19 toward the surface of the substrate KB.

In the image GZ (FIG. 8) of the substrate hole KH captured by the substrate recognition camera 18, the surface of the substrate KB is illuminated by illumination and appears bright, while the inside of the substrate hole KH appears dark. This is because the light from the lighting unit 19 that has passed through the substrate hole KH reaches the upper surface of the lower receiving table 22 directly underneath, but the adhesive sheet 31 is attached to the upper surface of the lower receiving table 22. This is because the reflection by the sticking sheet 31 is suppressed. Therefore, the recognition determination unit 43 of the control device 20 can clearly recognize the contour KHE of the inner edge of the substrate hole KH based on the contrast between the brightness of the surface of the substrate KB and the brightness in the substrate hole KH. As described above, in the first embodiment, the recognition determination unit 43 of the control device 20 determines the brightness of the surface of the substrate KB obtained from the image GZ of the substrate hole KH (through hole) imaged by the substrate recognition camera 18 which is an image pickup unit. It is a recognition unit that recognizes the contour KHE of the inner edge of the substrate hole KH based on the contrast between the brightness of the inside of the substrate hole KH and the brightness inside the substrate hole KH.

After the substrate recognition camera 18 recognizes the plurality of substrate holes KH provided in each individual piece region R as described above, the position of each individual piece region R is obtained based on the positions of the plurality of substrate holes KH. Then, the mounting head 16 is reciprocated between the parts feeder 14 and the board KB positioned at the working position by the head moving mechanism 15, so that the parts BH supplied by the parts feeder 14 are defined on each piece area R. It will be mounted at the target position (component mounting position).

The mounting head 16 attracts the component BH supplied by the component feeder 14 to the nozzle 16N, and then moves above the substrate KB by a path passing above the component recognition camera 17. As described above, when the mounting head 16 passes above the component recognition camera 17, the component recognition camera 17 captures the component BH adsorbed on the nozzle 16N from below. The image of the component BH thus obtained is sent to the control device 20, and the recognition determination unit 43 recognizes the component BH. Then, based on the information obtained by the recognition of the component BH, the operation parameters of the mounting head 16 when the component BH is mounted at the target mounting position are corrected.

When all the component BHs to be mounted on the board KB are mounted by repeating the movement operation of the mounting head 16, the board transport unit 12 operates to carry the board KB to the device on the downstream side. This completes the component mounting work per board KB.

As described above, in the component mounting device 1 according to the first embodiment, the light reflection suppressing means (sticking sheet) for suppressing the light from being reflected upward below the substrate hole KH of the substrate KB positioned at the working position. Since 31) is provided, the amount of light incident on the substrate recognition camera 18 through the substrate hole KH after being reflected below the substrate KB (upper surface of the underlay table 22) is greatly reduced. Therefore, in the image GZ of the substrate hole KH imaged by the substrate recognition camera 18, the contrast between the surface of the substrate KB and the inside of the substrate hole KH becomes extremely high, and the contour KHE of the inner edge of the substrate hole KH is clearly recognized. can do.

(Embodiment 2)
Next, Embodiment 2 of the present invention will be described. The component mounting device according to the second embodiment is different from the component mounting device 1 according to the first embodiment only in the light reflection suppressing means.

FIG. 9 shows the lower receiving portion 13 included in the component mounting device according to the second embodiment. In the second embodiment, as shown in FIG. 9, the light reflection suppressing means includes a pin hole insertion type sheet 51, a pin mounting type sheet 52, a pin hole insertion type bottomed tubular member 53, and a pin mounting type bottomed tubular member. It includes a member 54.

In FIGS. 10A and 10B, the pin hole insertion type sheet 51 is composed of a sheet-like member provided with a hole insertion portion 51T to be inserted into the pin insertion hole 22H of the lower receiving table 22. At least the upper surface (the surface that reflects light) of the pin hole insertion type sheet 51 is dark (preferably black), and the reflection of light incident on the surface is suppressed.

When the pin hole insertion type sheet 51 is attached to the lower receiving table 22, the hole insertion portion 51T is inserted into the pin insertion hole 22H of the lower receiving table 22 from above (FIGS. 10 (a) → 10 (b) and 11 (FIG. 11). a) → FIG. 11 (b)). The pin hole insertion type sheet 51 can be attached to any position on the lower support table 22 where the pin insertion hole 22H is provided, but here, the pin hole insertion type sheet 51 is positioned at the working position on the upper surface of the lower support table 22. It is attached to a position that covers a position directly below (or near) each of the plurality of substrate holes KH possessed by the substrate KB. When a plurality of pin hole insertion type sheets 51 inserted into adjacent pin insertion holes 22H interfere with each other, these pin hole insertion type sheets 51 are overlapped with each other vertically (FIG. 11B). ..

12 (a) and 12 (b) show a mountain-shaped sheet 51A and an inverted mountain-shaped sheet 51B as modified examples of the pin hole insertion type sheet 51. The mountain-shaped sheet 51A and the inverted mountain-shaped sheet 51B are not flat and have a mountain-shaped (upper constriction) or inverted mountain-shaped (lower constriction) shape when viewed from the side. The mountain-shaped sheet 51A is a pin-hole insertion type sheet 51 having a mountain shape, and the inverted mountain-shaped sheet 51B is a pin-hole insertion type sheet 51 having an inverted mountain shape (FIG. 12A). When the mountain-shaped sheet 51A and the inverted mountain-shaped sheet 51B are installed on the lower receiving table 22, the slope portion of the mountain-shaped sheet 51A and the slope portion of the inverted mountain-shaped sheet 51B are brought into contact with each other. As a result, the height of the region covering the surface of the underlay table 22 can be made substantially uniform in the entire mountain-shaped sheet 51A and the inverted mountain-shaped sheet 51B (FIG. 12 (b)).

In FIGS. 13 (a) and 13 (b), in the pin-mounted sheet 52, the bottom support table in which the insertion protrusion 23T is inserted into the pin insertion hole 22H of the bottom support table 22 (that is, held by the bottom support table 22). It is composed of a sheet-like member having a pin insertion hole 52H which is inserted and attached to the lower receiving pin 23 held in the 22. At least the upper surface (the surface that reflects light) of the pin-mounted sheet 52 is dark (preferably black), and the reflection of light incident on the surface is suppressed.

When the pin-mounted sheet 52 is attached to the lower receiving table 22, the lower receiving pin 23 in a state in which the insertion protrusion 23T is inserted into the pin insertion hole 22H of the lower receiving table 22 (in a state of being held by the lower receiving table 22). The pin-mounted sheet 52 is positioned above, and the lower receiving pin 23 is lowered so as to be inserted into the pin insertion hole 52H (FIG. 13 (a) → FIG. 13 (b)). Then, the pin mounting type sheet 52 is mounted on the bottom receiving pin 23 so that the base portion 23B of the bottom receiving pin 23 is fitted into the pin insertion hole 52H (FIG. 13 (b)). The pin-mounted sheet 52 can be attached to any position on the lower receiving table 22 to which the lower receiving pin 23 is attached, but here, the pin-mounted sheet 52 is positioned at the working position on the upper surface of the lower receiving table 22. It is attached to a position that covers a position directly below (or near) each of the plurality of substrate holes KH of the substrate KB.

By further attaching the pin hole insertion type sheet 51 around the pin mounting type sheet 52 mounted on the lower receiving pin 23, the area covering the upper surface of the lower receiving table 22 covered by the pin mounting type sheet 52 can be expanded. .. In this case, as shown in FIGS. 14 (a) and 14 (b) (FIG. 14 (b) is a cross-sectional view taken along the line VV in FIG. 14 (a)), the pin hole insertion type sheet 51 is a pin-mounted type. By overlapping the sheet 52 vertically, a relatively wide dark color region can be formed in the vicinity of the lower receiving pin 23.

In FIGS. 15A and 15B, the pin hole insertion type bottomed tubular member 53 has a bottom portion 53a having a hole insertion portion 53T inserted into the pin insertion hole 22H and a cylinder extending upward from the bottom portion 53a. It is provided with a side wall 53b having a shape. In the pin hole insertion type bottomed tubular member 53, at least the upper surface of the bottom portion 53a and the surface of the side wall 53b (that is, the surface that reflects light) are dark (preferably black), and the reflection of light incident on the surface is suppressed. It has become so. When the pin hole insertion type bottomed tubular member 53 is attached to the lower receiving table 22, the hole insertion portion 53T is inserted into the pin insertion hole 22H of the lower receiving table 22 from above (FIG. 15 (a) → FIG. 15 (b). )). The pin hole insertion type bottomed tubular member 53 can be attached to any position on the lower receiving table 22 where the pin insertion hole 22H is provided, but here, the work is performed on the upper surface of the lower receiving table 22. It is attached to a position that covers a position immediately below (or near) each of the plurality of board holes KH of the board KB positioned at the position.

In FIGS. 16A and 16B, the pin-mounted bottomed tubular member 54 has an insertion protrusion 23T inserted into the pin insertion hole 22H of the lower receiving table 22 (that is, held by the lower receiving table 22). ) A bottom portion 54a having a pin insertion hole 54H to be inserted and attached to a bottom receiving pin 23 held by the bottom receiving table 22 and a cylindrical side wall 54b extending upward from the bottom portion 54a are provided. The pin-mounted bottomed tubular member 54 has at least a dark color (preferably black) on the upper surface of the bottom portion 54a and the surface of the side wall 54b (that is, the surface that reflects light), and the reflection of light incident on the surface is suppressed. It has become like.

When the pin-mounted bottomed tubular member 54 is attached to the lower receiving table 22, the insertion protrusion 23T is inserted into the pin insertion hole 22H of the lower receiving table 22 (held by the lower receiving table 22). A pin-mounted bottomed tubular member 54 is positioned above the receiving pin 23, and is lowered so that the lower receiving pin 23 is inserted into the pin insertion hole 54H (FIG. 16 (a) → FIG. 16 (b)). .. Then, the pin-mounted bottomed cylindrical member 54 is mounted on the bottom-supporting pin 23 so that the base portion 23B of the bottom-supporting pin 23 is fitted into the pin insertion hole 54H (FIG. 16B). The pin-mounted bottomed tubular member 54 can be attached to any position on the lower receiving table 22 to which the lower receiving pin 23 is attached, but here, the working position on the upper surface of the lower receiving table 22. It is attached to a position that covers a position directly below (or near) each of the plurality of substrate holes KH possessed by the substrate KB positioned in the above position.

By attaching the pin hole insertion type bottomed cylindrical member 53 and the pin mounting type bottomed tubular member 54 to the upper surface of the lower receiving table 22, the attached area can be darkened. Both the pin hole insertion type bottomed tubular member 53 and the pin-mounted type bottomed tubular member 54 are provided with a cylindrical side wall (side wall 53b or side wall 54b), and easily block light incident from an oblique outside. .. Therefore, by arranging the pin hole insertion type bottomed cylindrical member 53 or the pin mounting type bottomed tubular member 54 below the substrate hole KH, the inside of the substrate hole KH can be further seen in the image GZ of the substrate hole KH. It can be darkened.

The effect of blocking light by the side walls 53b and 54b of the pin hole insertion type bottomed tubular member 53 and the pin mounting type bottomed tubular member 54, respectively, is that the light from the lighting unit 19 is not limited to the substrate hole KH. From the slit SL (FIG. 3) formed in the substrate KB (that is, not only from directly above the position directly below the substrate hole KH on the underlay table 22 but also from diagonally upward) to the lower surface side of the substrate KB. It is more effective when it reaches. The side wall 53b of the pin hole insertion type bottomed cylindrical member 53 may be separable with respect to the bottom portion 53a. Similarly, the side wall 54b of the pin-mounted bottomed tubular member 54 may be separable with respect to its bottom 54a.

As described above, in the component mounting device according to the second embodiment, the light reflection suppressing means (pin hole insertion type) for suppressing the light from being reflected upward below the substrate hole KH of the substrate KB positioned at the working position. Since the sheet 51, the pin-mounted sheet 52, the pin hole insertion type bottomed tubular member 53, and the pin-mounted type bottomed tubular member 54) are provided, it is located below the substrate KB (upper surface of the lower receiving table 22). After reflection, the amount of light incident on the substrate recognition camera 18 through the substrate hole KH is greatly reduced. Therefore, in the image GZ of the substrate hole KH imaged by the substrate recognition camera 18, the contrast between the surface of the substrate KB and the inside of the substrate hole KH becomes extremely high, and the substrate hole KH is as in the case of the first embodiment. The contour KHE of the inner edge of the can be clearly recognized.

(Embodiment 3)
Next, Embodiment 3 of the present invention will be described. The component mounting device according to the third embodiment is different from the component mounting device 1 according to the first embodiment only in the light reflection suppressing means.

FIG. 17 shows a lower receiving portion 13 included in the component mounting device 1 according to the third embodiment. In the third embodiment, at least the upper surface of the underlay table 22 is painted with a dark-colored (preferably black) paint, and at least the upper surface (the surface reflecting light) of the under-receiver table 22 is covered with a dark-colored coating film 22M. It is in a formed state. Since the dark-colored coating film 22M suppresses the reflection of the light incident on the underlay table 22, it functions as a light reflection suppressing means.

As described above, in the component mounting device according to the third embodiment, the light reflection suppressing means (dark coating film) for suppressing the upward reflection of light below the substrate hole KH of the substrate KB positioned at the working position. Since 22M) is provided, the amount of light incident on the substrate recognition camera 18 through the substrate hole KH after being reflected below the substrate KB (upper surface of the underlay table 22) is greatly reduced. Therefore, in the image GZ of the substrate hole KH imaged by the substrate recognition camera 18, the contrast between the surface of the substrate KB and the inside of the substrate hole KH becomes extremely high, and as in the case of the first embodiment, the substrate KB The contour KHE of the inner edge of the can be clearly recognized. Instead of the dark-colored coating film 22M, the upper surface of the underlay table 22 may be darkened by surface-treating the upper surface of the underlay table 22. For example, the upper surface of the underlay table 22 is anodized to darken the upper surface of the underlay table 22 by adsorbing a dark dye inside the pores of the porous layer formed on the upper surface of the underlay table 22. May be good.

(Embodiment 4)
Next, Embodiment 4 of the present invention will be described. The component mounting device according to the fourth embodiment is different from the component mounting device 1 according to the first embodiment only in the light reflection suppressing means.

FIG. 18 shows a lower receiving portion 13 included in the component mounting device 1 according to the fourth embodiment. In the fourth embodiment, a plate member 22P whose upper surface is at least made of a magnetic material is attached to the upper surface of the lower receiving table 22 by a plurality of screws 22S. Then, on the upper surface of the plate member 22P, the lower receiving pin 23G configured by replacing the insertion projection 23T of the lower receiving pin 23 in the first embodiment with the magnet 23M embedded in the base 23B is formed by replacing the magnet 23M and the plate member 22P. It is attached by being attracted by the magnetic force between the two (see also FIGS. 19 (a) and 19 (b)).

The light reflection suppressing means in the component mounting device 1 according to the fourth embodiment comprises a magnet sheet 61 that is attracted and attached to the upper surface of the plate member 22P by magnetic force (FIGS. 18 and 19 (a) and 19 (b)). At least the upper surface (the surface that reflects light) of the magnet sheet 61 is dark (preferably black), and the reflection of light incident on the surface is suppressed. The magnet sheet 61 can be attached to an arbitrary position on the lower support table 22, but here, on the upper surface of the lower support table 22, directly below each of the plurality of board holes KH of the board KB positioned at the work position. It is installed in a position that covers the position of (or its vicinity).

The magnet sheet 61 may be made of a magnet itself (FIG. 19 (a)), or the magnet sheet 61 is entirely magnetized by providing the magnet 61b on the lower surface of the sheet member 61a whose upper surface is dark (preferably black). It may be configured as a sheet 61 (FIG. 19 (b)). Here, when the surface (head) of the screw 22S is not painted in a dark color, the surface thereof is painted in a dark color (preferably black).

As described above, in the component mounting device according to the fourth embodiment, the light reflection suppressing means (magnet sheet 61) for suppressing the light from being reflected upward below the substrate hole KH of the substrate KB positioned at the working position. Is provided, so that the amount of light incident on the substrate recognition camera 18 through the substrate hole KH after being reflected below the substrate KB (upper surface of the underlay table 22) is greatly reduced. Therefore, in the image GZ of the substrate hole KH imaged by the substrate recognition camera 18, the contrast between the surface of the substrate KB and the inside of the substrate hole KH becomes extremely high, and the substrate hole is similar to the case of the first embodiment. The contour KHE of the inner edge of KH can be clearly recognized. In the fourth embodiment, as in the case of the third embodiment, when a dark-colored (preferably black) coating film is formed on at least the upper surface (the surface that reflects light) of the plate member 22P, the coating film is applied. The film can be used as a light reflection suppressing means.

As described above, the component mounting device 1 according to the first to fourth embodiments is a light reflection suppressing means for suppressing upward reflection of light below the substrate hole KH of the substrate KB positioned at the working position. Is provided, so that the amount of light incident on the substrate recognition camera 18 through the substrate hole KH after being reflected below the substrate KB (upper surface of the underlay table 22) is greatly reduced. Therefore, in the image GZ of the substrate hole KH imaged by the substrate recognition camera 18, the contrast between the surface of the substrate KB and the inside of the substrate hole KH becomes extremely high, and the contour KHE of the inner edge of the substrate hole KH is clearly defined. Can be recognized. Further, this makes it possible to mount the component BH on the substrate KB with high accuracy.

Although the embodiments of the present invention have been described so far, the present invention is not limited to the above-mentioned ones, and various modifications and the like are possible. For example, in the above-described embodiment, as the light reflection suppressing means, the coating film 22M, the sticking sheet 31, the pin hole insertion type sheet 51 (including the chevron sheet 51A and the inverted chevron sheet 51B), and the pin mounting type sheet 52. , The pin hole insertion type bottomed tubular member 53, the pin-mounted type bottomed tubular member 54, and the magnet sheet 61 are shown, but the light reflection suppressing means reflects light upward below the substrate transport portion 12. It is not limited to the one shown in the embodiment as long as it suppresses the above. Further, the light reflection suppressing means does not necessarily have to be attached to the lower receiving table 22, and may be provided below the substrate conveying portion 12.

Provided is a component mounting device capable of clearly recognizing a through hole provided through a substrate and mounting a component with high accuracy.

1 Parts mounting device 12 Board transfer unit 12a Conveyor 18 Board recognition camera (imaging unit)
19 Lighting unit 22 Underlay table (table member)
22H pin insertion hole 22M coating film (light reflection suppressing means)
23,23G Underlay pin 31 Adhesive sheet (light reflection suppressing means) (sheet-like member)
43 Recognition judgment unit (recognition unit)
51 Pin hole insertion type sheet (light reflection suppressing means) (sheet-like member)
51T hole insertion part 51A mountain-shaped sheet (light reflection suppressing means)
51B inverted mountain type sheet (light reflection suppressing means)
52-pin mountable sheet (light reflection suppressing means) (sheet-like member)
52H Pin insertion hole 53 Pin hole insertion type bottomed tubular member (light reflection suppression means)
53a Bottom 53b Side wall 53T Hole insertion part 54 Pin-mounted bottomed tubular member (light reflection suppressing means)
54a Bottom 54b Side wall 54H Pin insertion hole 61 Magnet sheet (light reflection suppression means)
BH parts KB board KH board hole (through hole)
Outline of KHE inner edge GZ image

Claims (12)

A component mounting device that mounts components on a board that has through holes that penetrate in the thickness direction.
A board transport section that supports and transports both ends of the board in the width direction by a pair of conveyors and positions them at a predetermined work position.
A lighting unit arranged above the substrate transport unit and illuminating the substrate positioned at the work position, and a lighting unit.
An image pickup unit which is arranged above the substrate transport unit and images the through hole while the substrate is illuminated by the illumination unit.
A light reflection suppressing means for suppressing the upward reflection of light below the substrate transport portion.
Parts mounting device equipped with. A recognition unit for recognizing the contour of the inner edge of the through hole based on the contrast between the brightness of the surface of the substrate obtained from the image of the through hole captured by the image pickup unit and the brightness of the inside of the through hole is provided. , The component mounting device according to claim 1. The component mounting device according to claim 1 or 2, wherein the light reflection suppressing means suppresses the reflection of light because the surface reflecting the light has a dark color. The component mounting device according to any one of claims 1 to 3, wherein the lighting unit is integrated with the image pickup unit and is movable above the substrate. The component according to any one of claims 1 to 4, further comprising a table member holding a lower receiving pin that supports the substrate positioned at the working position, and the light reflection suppressing means provided on the table member. On-board device. The component mounting device according to claim 5, wherein the light reflection suppressing means comprises a sheet-like member attached to the upper surface of the table member. The table member has a pin insertion hole into which the lower receiving pin is inserted from above, and the light reflection suppressing means comprises a sheet-like member having a hole insertion portion to be inserted into the pin insertion hole. 5. The component mounting device according to 5. The component mounting device according to claim 5, wherein the light reflection suppressing means comprises a sheet-like member having a pin insertion hole to be inserted and attached to the lower receiving pin held by the table member. The table member has a pin insertion hole into which the lower receiving pin is inserted from above, and the light reflection suppressing means extends upward from a bottom portion having a hole insertion portion inserted into the pin insertion hole and the bottom portion. The component mounting device according to claim 5, which has a tubular side wall. The fifth aspect of the present invention, wherein the light reflection suppressing means has a bottom having a pin insertion hole to be inserted and attached to the lower receiving pin held by the table member, and a cylindrical side wall extending upward from the bottom. Parts mounting device. The component mounting device according to claim 5, wherein the light reflection suppressing means comprises a dark-colored coating film formed on at least the upper surface of the table member. The component mounting according to claim 5, wherein the table member includes a plate member whose upper surface is at least made of a magnetic material, and the light reflection suppressing means is made of a magnet sheet which is attracted and attached to the upper surface of the plate member by magnetic force. Device.

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