JP2021533535A - ポータブルライト - Google Patents
ポータブルライト Download PDFInfo
- Publication number
- JP2021533535A JP2021533535A JP2021505341A JP2021505341A JP2021533535A JP 2021533535 A JP2021533535 A JP 2021533535A JP 2021505341 A JP2021505341 A JP 2021505341A JP 2021505341 A JP2021505341 A JP 2021505341A JP 2021533535 A JP2021533535 A JP 2021533535A
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- JP
- Japan
- Prior art keywords
- cob
- assembly
- cob assembly
- portable light
- curved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- H—ELECTRICITY
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- B62J—CYCLE SADDLES OR SEATS; AUXILIARY DEVICES OR ACCESSORIES SPECIALLY ADAPTED TO CYCLES AND NOT OTHERWISE PROVIDED FOR, e.g. ARTICLE CARRIERS OR CYCLE PROTECTORS
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B62J—CYCLE SADDLES OR SEATS; AUXILIARY DEVICES OR ACCESSORIES SPECIALLY ADAPTED TO CYCLES AND NOT OTHERWISE PROVIDED FOR, e.g. ARTICLE CARRIERS OR CYCLE PROTECTORS
- B62J6/00—Arrangement of optical signalling or lighting devices on cycles; Mounting or supporting thereof; Circuits therefor
- B62J6/01—Electric circuits
- B62J6/015—Electric circuits using electrical power not supplied by the cycle motor generator, e.g. using batteries or piezo elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B62J—CYCLE SADDLES OR SEATS; AUXILIARY DEVICES OR ACCESSORIES SPECIALLY ADAPTED TO CYCLES AND NOT OTHERWISE PROVIDED FOR, e.g. ARTICLE CARRIERS OR CYCLE PROTECTORS
- B62J6/00—Arrangement of optical signalling or lighting devices on cycles; Mounting or supporting thereof; Circuits therefor
- B62J6/22—Warning or information lights
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
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- F21V15/01—Housings, e.g. material or assembling of housing parts
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- B62J—CYCLE SADDLES OR SEATS; AUXILIARY DEVICES OR ACCESSORIES SPECIALLY ADAPTED TO CYCLES AND NOT OTHERWISE PROVIDED FOR, e.g. ARTICLE CARRIERS OR CYCLE PROTECTORS
- B62J6/00—Arrangement of optical signalling or lighting devices on cycles; Mounting or supporting thereof; Circuits therefor
- B62J6/02—Headlights
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B62J—CYCLE SADDLES OR SEATS; AUXILIARY DEVICES OR ACCESSORIES SPECIALLY ADAPTED TO CYCLES AND NOT OTHERWISE PROVIDED FOR, e.g. ARTICLE CARRIERS OR CYCLE PROTECTORS
- B62J6/00—Arrangement of optical signalling or lighting devices on cycles; Mounting or supporting thereof; Circuits therefor
- B62J6/04—Rear lights
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/08—Devices for easy attachment to any desired place, e.g. clip, clamp, magnet
- F21V21/088—Clips; Clamps
- F21V21/0885—Clips; Clamps for portable lighting devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
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- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/057—Shape retainable
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
本発明は、ポータブルライトおよび製造方法に関する。
少なくともオーストラリアでは、夜間に乗るときに自転車にライトを使用することを要求する法律が義務付けられている。前面に白色ライトを使用し、背面に赤色ライトを使用する必要がある。これらのライトは、それぞれ、前後200メートルから見える必要がある。自転車用ライトの主な機能は、ライダーが他のサイクリスト、車、歩行者などの他の道路利用者に見えるようにすることである。特定の乗り物の場合、フロントライトの機能は、サイクリストが障害物を前方に見ることができるようにすることでもある。
前面、後面、および電子部品ならびにバッテリを受け入れるための内部空間を有するハウジングと、
基板、基板に取り付けられた個々の発光ダイオード(LED)チップのマトリクス、およびLEDチップのマトリクスを覆う外側被膜を含むチップオンボード(COB)アセンブリと、
COBアセンブリを保護するためのフロントレンズカバーと、を含み、
前面は、一方向に湾曲し、COBアセンブリは、対応して湾曲し、前面に取り付けられ、個々のLEDチップは、220度よりも大きい集合ビーム角を提供するように、湾曲の周りに配置され、湾曲の周りに光を外向きに向けるように配向される。
電子部品およびバッテリを受け入れる空間を定義するハウジングと、
基板、基板に取り付けられた複数の個々の発光ダイオード(LED)、および複数のLEDを覆う外側被膜を含むチップオンボード(COB)アセンブリと、
COBアセンブリを保護するためのフロントレンズカバーと、を含み、
COBアセンブリは、湾曲し、ハウジング内に配置され、個々のLEDは、220度よりも大きい集合ビーム角を提供するように、湾曲の周りに配置され、湾曲の周りに光を外向きに向けるように配向される。
平坦なCOBアセンブリの第1の側がガイドの表面に対して外向きに配置された状態で、COBアセンブリを保持するための第1の面を有するガイドと、
互いに内向きに移動可能な2つの対向するアクチュエータと、
2つの対向するクランプ装置であって、それぞれのアクチュエータの内端部にそれぞれ枢着され、ガイド内に配置されたCOBアセンブリの対向する周縁部をクランプするように構成されたクランプ装置と、
成形ダイであって、COBアセンブリが成形ダイの上または前に配置されるように、ガイドの下または後ろに配置され、湾曲した係合面を有する成形ダイと、を含み、
成形ダイは、COBアセンブリの第2の側に対して押し付けて、COBアセンブリを第1の方向において中央に曲げるように作動させることができ、それによって、アクチュエータは、COBアセンブリが曲がるにつれて、COBアセンブリのクランプされた縁部と共に内側に移動し、クランプ装置は、縁部が移動するにつれて回転する。
第1の面が第1の方向において外側に向くように配置された状態で、ガイド内に少なくとも1つのCOBアセンブリを配置する工程と、
それぞれのクランプ装置において、2つの対向する周縁部をクランプする工程と、
湾曲した係合面を有する成形ダイを作動させる工程であって、成形ダイは、COBアセンブリが係合面の形状をとるように、COBアセンブリを曲げるために、第1の方向においてCOBアセンブリの第2の面に向かって係合面を移動させる工程と、を含み、
成形ダイが第2の面に押し付けられるにつれて、クランプ装置は、互いに向かって内側に移動し、COBアセンブリが曲がるにつれて、COBアセンブリの縁部に追従するように第1の方向に向かって枢動する。
図1および図2は、直立の向きで使用される場合の、前部12と、後部14と、上部14と、底部16とを有するポータブルライト10を示す。ライトは、ハウジング18と、左右に走る曲面であって、上下に真っすぐになっている曲面を有するレンズカバー20とを有する。
Claims (21)
- 前面、後面、および電子部品ならびにバッテリを受け入れるための内部空間を有するハウジングと、
基板、前記基板に取り付けられた個々の発光ダイオード(LED)チップのマトリクス、およびLEDチップの前記マトリクスを覆う外側被膜を含むチップオンボード(COB)アセンブリと、
前記COBアセンブリを保護するためのフロントレンズカバーと、を含み、
前記前面は、一方向に湾曲し、前記COBアセンブリは、対応して湾曲し、前記前面に取り付けられ、個々のLEDチップは、220度よりも大きい集合ビーム角を提供するように、前記湾曲の周りに配置され、前記湾曲の周りに光を外向きに向けるように配向される、ポータブルライト。 - 前記集合ビーム角は、270度より大きい、請求項1に記載のポータブルライト。
- さらに、前記ポータブルライトを素子に取り付けるためのマウントを含む、請求項1または2に記載のポータブルライト。
- さらに、前記バッテリの充電を可能にするように構成されたUSBコネクタを含む、請求項1〜3のいずれか1項に記載のポータブルライト。
- 前記フロントレンズカバーは、前記前面およびCOBアセンブリの前記湾曲に対応するように湾曲している、請求項1〜4のいずれか1項に記載のポータブルライト。
- 前記フロントレンズカバーは、前記COBアセンブリを、水による破損または誤動作から保護するように構成される、請求項1〜5のいずれか1項に記載のポータブルライト。
- 前記COBアセンブリは、半導体性材料または熱伝導性材料を含み、前記基板は、ヒートシンクとして作用するように構成される、請求項1〜6のいずれか1項に記載のポータブルライト。
- 前記基板は、前記COBアセンブリの湾曲した形を形成し維持するように弾性的に曲げることができる、請求項1〜7のいずれか1項に記載のポータブルライト。
- 前記基板は、前記COBアセンブリの湾曲した形を形成するように構成されるように可撓性である、請求項1〜7のいずれか1項に記載のポータブルライト。
- 前記基板は、熱伝導性誘電体層を含む第1の面を含み、銅回路層は、前記誘電体層上に位置し、絶縁被膜は、前記銅回路層の銅パッドのマトリクスが露出するように、前記第1の面上に塗布される、請求項1〜9のいずれか1項に記載のポータブルライト。
- 前記LEDチップの各々は、導電性接着剤でそれぞれの銅パッドに接続されたダイを含み、ワイヤボンドは、前記ダイを隣接する銅パッドに接続する、請求項10に記載のポータブルライト。
- 前記COBアセンブリの前記湾曲は、前記ワイヤボンドが曲がらないように、前記ワイヤボンドの方向に対して略垂直である、請求項11に記載のポータブルライト。
- 前記LEDチップの各々は、はんだを介してそれぞれの銅パッドに直接的に接続するように構成された前記LEDチップの基部上の1つまたは複数の電気コンタクトを含む、請求項10に記載のポータブルライト。
- 前記前面および前記COBアセンブリの前記湾曲は、90°と360°との間の角度で延びるようなものである、請求項1〜13のいずれか1項に記載のポータブルライト。
- 前記前面および前記COBアセンブリの前記湾曲は、120°〜220°の間の角度で延びるようなものである、請求項14に記載のポータブルライト。
- 前記前面および前記COBアセンブリの前記湾曲は、約180°の角度で延びる、請求項1〜15のいずれか1項に記載のポータブルライト。
- 前記後面は、自転車の管状フレーム部材に着座するように構成されるように概ね湾曲している、請求項1〜16のいずれか1項に記載のポータブルライト。
- 前記後面は、実質的に平坦である、請求項1〜16のいずれか1項に記載のポータブルライト。
- 電子部品およびバッテリを受け入れる空間を定義するハウジングと、
基板、前記基板に取り付けられた複数の個々の発光ダイオード(LED)、および前記複数のLEDを覆う外側被膜を含むチップオンボード(COB)アセンブリと、
前記COBアセンブリを保護するためのフロントレンズカバーと、を含み、
前記COBアセンブリは、湾曲し、ハウジング内に配置され、個々のLEDは、220度よりも大きい集合ビーム角を提供するように、前記湾曲の周りに配置され、前記湾曲の周りに光を外向きに向けるように配向される、ポータブルライト。 - チップオンボード(COB)アセンブリを曲げるための装置であって、
平坦なCOBアセンブリの第1の側がガイドの面に対して外向きに配置された状態で、前記COBアセンブリを保持するための第1の面を有するガイドと、
互いに内向きに移動可能な2つの対向するアクチュエータと、
2つの対向するクランプ装置であって、それぞれのアクチュエータの内端部にそれぞれ枢着され、前記ガイド内に配置されたCOBアセンブリの対向する周縁部をクランプするように構成されたクランプ装置と、
成形ダイであって、前記COBアセンブリが前記成形ダイの上または前に配置されるように、前記ガイドの下または後ろに配置され、湾曲した係合面を有する成形ダイと、を含み、
前記成形ダイは、前記COBアセンブリの第2の側に対して押し付けて、前記COBアセンブリを第1の方向において中央に曲げるように作動させることができ、それによって、前記アクチュエータは、前記COBアセンブリが曲がるにつれて、前記COBアセンブリのクランプされた縁部と共に内側に移動し、前記クランプ装置は、縁部が移動するにつれて回転する、装置。 - 第1の面に取り付けられた個々の発光ダイオード(LED)チップのマトリクスを有する基板を有するチップオンボード(COB)アセンブリを曲げる方法であって、前記方法は、
前記第1の面が第1の方向において外側に向くように配置された状態で、ガイド内に少なくとも1つのCOBアセンブリを配置する工程と、
それぞれのクランプ装置において、2つの対向する周縁部をクランプする工程と、
湾曲した係合面を有する成形ダイを作動させる工程であって、前記成形ダイは、前記COBアセンブリが係合面の形状をとるように、前記COBアセンブリを曲げるために、前記第1の方向において前記COBアセンブリの第2の面に向かって係合面を移動させる工程と、を含み、
前記成形ダイが前記第2の面に押し付けられるにつれて、前記クランプ装置は、互いに向かって内側に移動し、前記COBアセンブリが曲がるにつれて、前記COBアセンブリの前記縁部に追従するように前記第1の方向に向かって枢動する、方法。
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