JP2021106136A - Light-emitting module - Google Patents

Abstract

To provide a passive RFID light-emitting module that is increased in electric power which can be supplied to an organic EL by improving use efficiency of an electromagnetic wave.SOLUTION: A light-emitting module 1 comprises an organic EL light-emitting panel 20 and a radio power reception part (11) which is electrically connected to the organic EL light-emitting panel, and receives electric power to be supplied to the organic EL light-emitting panel from outside by radio. Between the organic EL light-emitting panel and the radio power reception part, a rectifier circuit 13 is connected, and an integrated circuit 14 for radio communication is further connected.SELECTED DRAWING: Figure 1

Description

The present invention relates to a light emitting module.

Conventionally, in a passive type RFID (radio frequency identifier), a communication radio wave transmitted from a reader / writer or the like is received by an antenna, and a part of the electromotive force obtained by this is used for organic EL (organic electro-luminescence). A technique for emitting light has been proposed. As a result, a passive RFID light emitting module that is not equipped with a battery is realized, and the module can be configured in the form of a card, a tag, a label, or the like, and self-luminous at the same time during radio wave communication.
In Patent Document 1, only when the organic EL element has a margin and becomes a predetermined value or more, which is a lower value than the voltage value at which the predetermined brightness is obtained, the current corresponding to the voltage is applied to the organic EL element. Supply to.

Japanese Unexamined Patent Publication No. 2010-182098

However, in the conventional RFID light emitting system of an organic EL using an electromagnetic wave applied from the outside, there is a problem that it is difficult to obtain sufficient electric power to make the organic EL emit light. In the first place, the energy source is for RFID communication, and the surplus power of the communication drive must be used for the light emission of the organic EL, but the RFID reader / writer is not designed for the output that assumes the light emission of the organic EL. Because.
Therefore, for example, since an organic EL having a large area may not emit light, it has been difficult to realize a passive RFID light emitting module having a light emitting surface having a large area. In addition, the passive RFID light emitting module often does not emit light unless it is brought into close contact with a reader / writer.

The present invention has been made in view of the above problems in the prior art, and when the organic EL is made to emit light by using the communication electromagnetic wave applied to the RFID from the outside without damaging the communication of the RFID, the electromagnetic wave of the electromagnetic wave is used. The object is to improve the utilization efficiency and increase the electric power that can be supplied to the organic EL.

The light emitting module of one aspect of the present invention comprises an organic EL light emitting panel and a wireless power receiving unit that is electrically connected to the organic EL light emitting panel and wirelessly receives power supplied to the organic EL light emitting panel from the outside. A light emitting module including a rectifying circuit is connected between the organic EL light emitting panel and the wireless power receiving unit, and an integrated circuit for wireless communication is further connected.

According to the present invention, when the organic EL is made to emit light without damaging the communication of the RFID by using the communication electromagnetic wave applied to the RFID from the outside, the utilization efficiency of the electromagnetic wave is improved and the electric power that can be supplied to the organic EL is supplied. Can be increased.

It is a plane schematic diagram which shows the structure of the light emitting module which concerns on one Embodiment of this invention. It is sectional drawing which shows the structure of the light emitting module which concerns on one Embodiment of this invention. It is a plane schematic diagram which shows the structure of the light emitting module which concerns on another Embodiment of this invention. It is a plane schematic diagram which shows the structure of the light emitting module which concerns on another Embodiment of this invention. It is a circuit diagram corresponding to FIGS. 1, 3 and 4. It is a plane schematic diagram which shows the structure of the light emitting module which concerns on another Embodiment of this invention. It is a plane schematic diagram which shows the structure of the light emitting module which concerns on another Embodiment of this invention. It is a circuit diagram corresponding to FIGS. 6 and 7. It is a plane schematic diagram which shows the structure of the light emitting module which concerns on another Embodiment of this invention. It is a circuit diagram corresponding to FIG. It is a plane schematic diagram which shows the structure of the light emitting module which concerns on another Embodiment of this invention. It is a plane schematic diagram which shows the structure of the light emitting module which concerns on another Embodiment of this invention.

An embodiment of the present invention will be described below with reference to the drawings. The following is an embodiment of the present invention and does not limit the present invention.

[Overview of light emitting module]
1, FIG. 2 and FIG. 3 are schematic plan views showing the configuration of the light emitting module 1 in the present embodiment, and show different arrangement forms. FIG. 2 is a schematic cross-sectional view corresponding to FIGS. 1 and 3. The circuit is common to the arrangements of FIGS. 1, 3 and 4, as shown in FIG.
The light emitting module 1 includes a circuit board 10 and an organic EL (Electronic Luminescence) light emitting panel 20. The circuit board 10 is provided with an antenna coil 11, a rectifier circuit 13, and an integrated circuit 14 for wireless communication. The antenna coil 11 functions not only as the "wireless power receiving unit" of the present invention but also as an information transmission / reception antenna. The organic EL light emitting panel 20 has a light emitting area 21.

The circuit board 10 is an insulating substrate with a conductive circuit pattern. Further, the circuit board 10 preferably has flexibility. Specifically, the circuit board 10 is a flexible printed circuit board (FPC) made of a thin and soft base film (polyimide or the like) having an insulating property and a base material in which a conductive metal such as copper foil is bonded.

The antenna coil 11 is an induction coil that generates an electromotive force by electromagnetic induction, and is formed on the circuit board 10 by, for example, etching. The antenna coil 11 is electrically connected to the organic EL light emitting panel 20 (specifically, the anode and cathode of the organic EL light emitting element) via the wirings 12A and 12B. The wiring 12A is laid on the circuit board 10 and extends from one end of the antenna coil 11 to the end of the circuit board 10, and is connected to the cathode of the organic EL light emitting panel 20 by the anisotropic conductive film 30A. ing. The wiring 12B is laid on the circuit board 10 and extends from the other end of the antenna coil 11 to the end of the circuit board 10, and is connected to the anode of the organic EL light emitting panel 20 by the anisotropic conductive film 30B. Has been done.
It is preferable that at least one place between the organic EL light emitting panel 20 and the antenna coil 11 is connected by an anisotropic conductive film. In particular, it is preferable that the connecting portion of the organic EL light emitting panel 20 is made of an anisotropic conductive film as in the present embodiment. By using the anisotropic conductive films 30A and 30B, thermocompression bonding at a relatively low temperature is possible, the heat load on the organic EL light emitting panel 20 can be reduced, and the yield can be improved.

A rectifier circuit 13 is connected between the organic EL light emitting panel 20 and the antenna coil 11, and an integrated circuit 14 for wireless communication is further connected. In the embodiment shown in FIGS. 1 to 4, a half-wave rectifier circuit is applied as the rectifier circuit 13, and the rectifier circuit 13 is connected in series with the wiring 12B. The integrated circuit 14 for wireless communication is connected between the wiring 12A and the wiring 12B. As shown in FIG. 5, the organic EL light emitting panel 20 and the integrated circuit 14 for wireless communication are connected to the antenna coil 11 in parallel.
The integrated circuit 14 for wireless communication is an integrated circuit that transmits / receives information to / from a reader / writer via an antenna coil 11. It also has a memory in which information is stored.

The antenna coil 11 receives electric power (receives power) wirelessly from an external wireless power transmission device such as a smartphone, and supplies electric power to the organic EL light emitting panel 20. In the present embodiment, when an electromagnetic wave is transmitted from the wireless transmission device to the antenna coil 11, the magnetic field in the vicinity of the antenna coil 11 changes as compared with before the transmission, and an induced electromotive force is generated in the antenna coil 11. The antenna coil 11 receives power from the wireless power transmission device wirelessly by using the electromagnetic induction method. Then, the electromotive force generated by the antenna coil 11 is rectified by the rectifier circuit 13 and supplied to the organic EL light emitting panel 20 as driving power. By applying electromagnetic waves from the wireless power transmission device, the integrated circuit 14 for wireless communication responds via the antenna coil 11 to transmit information, and the organic EL light emitting panel 20 emits light.

The organic EL light emitting panel 20 emits light by being supplied with electric power (induced electromotive force) generated by the antenna coil 11. The emission brightness of the organic EL light emitting panel 20 increases in proportion to the magnitude of the electric power generated by the antenna coil 11. As described above, the light emitting module 1 has an advantage that it is not necessary to prepare a power source for causing the organic EL light emitting panel 20 to emit light.
The method of supplying electric power wirelessly is not limited to the case of using the electromagnetic induction method, and a magnetic field resonance method, a radio wave reception method, an electric field coupling method, or the like may be used. Here, the magnetic field resonance method is a method in which a coil and a capacitor are embedded in the power transmission side and the power reception side, and the respective resonators are magnetically resonated to supply electric power. The radio wave reception method is a method in which electric power is supplied by converting an electric current into an electromagnetic wave on the power transmission side and sending it to the power reception side. In this radio wave receiving method, the power receiving side receives an electromagnetic wave from an antenna, converts it into a direct current through a rectifier circuit, and uses it as electric power. The electric field coupling method is a method in which electrodes are installed on the power transmission side and the power reception side, respectively, and power is supplied by using the electric field generated when the electrodes are close to each other.
The frequency band used is the band used by RFID, and is not particularly limited as long as power can be supplied to the organic EL panel.

For example, as shown in FIG. 1, the arrangement form in which the organic EL light emitting panel 20 is arranged outside the antenna coil 11 can be implemented. The distance between the organic EL light emitting panel 20 and the antenna coil 11 can be increased.
Further, the organic EL light emitting panel 20 can be arranged inside the loop of the antenna coil 11 as shown in FIG. 4, for example. By arranging the organic EL light emitting panel 20 in a space-efficient manner while keeping the total length of the antenna coil 11 long, the entire light emitting module 1 can be made small in area.

For example, as shown in FIG. 1, the rectifier circuit 13 and the integrated circuit 14 for wireless communication can be arranged outside the antenna coil 11. When the organic EL light emitting panel 20 is also arranged outside the antenna coil 11, the organic EL is arranged by arranging the rectifying circuit 13 and the integrated circuit 14 for wireless communication between the organic EL light emitting panel 20 and the antenna coil 11. The distance between the light emitting panel 20 and the antenna coil 11 can be increased, and the space between the organic EL light emitting panel 20 and the antenna coil 11 can be efficiently used.
Further, for example, as shown in FIG. 3 or 4, the rectifier circuit 13 and the integrated circuit 14 for wireless communication can be arranged inside the antenna coil 11. By arranging the rectifier circuit 13 and the integrated circuit 14 for wireless communication inside the antenna coil 11 while maintaining the overall length of the antenna coil 11 in a space-efficient manner, the entire light emitting module 1 can be made small in area.
Although not shown, the organic EL light emitting panel 20 may be arranged inside the loop of the antenna coil 11, and the rectifier circuit 13 and the integrated circuit 14 for wireless communication may be arranged outside the antenna coil 11.

The organic EL light emitting panel 20 forms an organic EL light emitting element on the base material 22 (FIG. 2), which is composed of one or both electrodes having translucency and facing each other and a thin film organic light emitting layer laminated between the electrodes. It was done. The organic EL light emitting panel 20 is formed via a sealing glass cap having a concave recess, an inorganic insulating film such as oxidized or silicon nitride formed on the organic EL light emitting element, an epoxy resin, an acrylic resin, or the like. 23 (FIG. 2) such as an aluminum foil or a barrier film may be adhered and sealed.

When power is supplied between the electrodes of the organic EL light emitting element, the electrically excited electrons and holes in the organic EL light emitting element are recombined, and the organic EL light emitting panel 20 emits light. The organic EL light emitting panel 20 is a self-luminous device suitable for ultra-thinness, weight reduction, and flexibility.

The wireless power receiving unit (transmission / reception antenna) connected to the integrated circuit 14 for wireless communication and the wireless power receiving unit for supplying current to the organic EL light emitting panel 20 can be separated or shared. A common wireless power receiving unit as in the present embodiment is preferable from the viewpoint of simplifying the circuit and manufacturing the light emitting module 1 at low cost.

As an integrated circuit for wireless communication, there is also an integrated circuit having a direct current output. Regardless of this embodiment, such an integrated circuit can also be used. When an integrated circuit for wireless communication having a DC current output is used, the organic EL light emitting panel 20 can be connected to the DC current output terminal of the integrated circuit. The integrated circuit for wireless communication to be used preferably consumes less current than the organic EL light emitting panel 20 in the range of 1 to 5 V.

[Explanation when providing capacity]
6 to 12 show a configuration in which a capacitance is added to the light emitting module 1 in addition to the above configuration.
As shown in the circuit diagrams of FIGS. 8 and 10, the capacitance 15 is connected in parallel with the antenna coil 11. At this time, a desired number of resonances can be realized by selecting the capacitance of the capacitance 15.
The capacitance 15 can also be provided by mounting a capacitor component on the circuit board 10 as shown in FIG. Further, the capacitance 15 includes two electrode films formed so as to face the front and back surfaces of the insulating substrate of the circuit board 10 supporting the antenna coil 11 as shown in FIGS. 7, 9, 11 and 12, and the two electrode films. It can be provided in a form composed of a part of the insulating substrate arranged between the two electrode films.

[Additional explanation about rectifier circuit]
As the rectifier circuit 13, any known rectifier circuit may be used. For example, a half-wave rectifier circuit 13 using one diode (FIGS. 1, 3 to 8) and a full-wave rectifier circuit 13 using four diodes (FIGS. 9, 10, 11, 12) Can be mentioned. As shown in FIG. 10, the organic EL light emitting panel 20, the rectifier circuit 13, and the integrated circuit 14 for wireless communication are connected to the antenna coil 11 in parallel.
Further, the smaller the capacity of the rectifier circuit 13, the better. This is because the loss in the rectifier circuit 13 is suppressed, the utilization efficiency of electromagnetic waves is improved, and the electric power that can be supplied to the organic EL light emitting panel 20 is increased. Specifically, 30 pF or less is preferable, 20 pF is preferable, and 10 pF or less is most preferable.
Further, since the organic EL light emitting panel itself has rectifying property, an organic EL light emitting panel having a small area and a small capacity may be provided and used in the rectifying circuit.

[Additional explanation about the antenna]
A magnetic sheet may be overlapped or provided on the antenna coil 11. When there is a conductive member around the antenna, energy can be transferred with little loss. The magnetic sheet preferably has a magnetic permeability of 100 or more.
The antenna coil 11 can be formed by attaching a conductor to an insulator substrate and patterning the conductor. Regardless of the present embodiment, the antenna coil may be configured by winding an insulatingly coated copper wire such as a vinyl coated copper wire.
As the insulating substrate of the circuit board 10, glass epoxy, glass composite or the like can be used when it is a rigid substrate, and PET, paper or the like can be used in addition to polyimide when it is a flexible substrate. can. A flexible substrate is preferable because of its thickness, weight, and the ability to be used even when bent. The pattern of the conductor such as the antenna coil 11 and the wirings 12A and 12B can also be produced by printing a metal foil such as copper foil or aluminum foil, or a silver paste on the insulating substrate. Further, a transparent conductive film such as ITO or a film sputtered with silver, molybdenum, aluminum, or the like can also be used.
The shape of the antenna coil 11, the number of turns, and the like can be appropriately designed.
The inductance of the antenna coil 11 is preferably 0.5 μH to 4 μH.
When the impedance of the antenna coil 11 is 30 Ω or more, the emission brightness of the organic EL light emitting panel 20 decreases, so it is preferable to design the antenna coil 11 to have an impedance of 10 Ω or less.

[Flexible wiring]
It is preferable that the organic EL light emitting panel 20 and the antenna coil 11 are connected to each other by flexible wiring. The flexible wiring may be required to be bent at 90 degrees or more. This is because the organic EL light emitting panel 20 and the antenna coil 11 are separately arranged on the side surface and the bottom surface of the article. Further, by bending the space between the organic EL light emitting panel 20 and the antenna coil 11 at 180 degrees, the organic EL light emitting panel 20 and the antenna coil 11 can be overlapped with each other, and can be incorporated into a card or the like to increase the area of each. can.
The flexible wiring may be by a flexible printed circuit board (FPC) which is a circuit board 10. In the form in which the organic EL light emitting panel 20 is arranged outside the antenna coil 11, the degree of freedom in the angle between the arrangement surface of the organic EL light emitting panel 20 and the arrangement surface of the antenna coil 11 can be improved.
In the form in which the organic EL light emitting panel 20 is arranged outside the antenna coil 11, the distance between the organic EL light emitting panel 20 and the antenna coil 11 can be arbitrarily selected by selecting the length of the flexible wiring portion. If it is desired to increase the distance, in the form in which the organic EL light emitting panel 20 is arranged outside the antenna coil 11, the flexible wiring portion 16 including the wirings 12A and 12B is the organic EL light emitting panel 20 and the antenna as shown in FIG. A form that is long in the direction of connecting to the coil 11 can be implemented.
Further, as shown in FIG. 11, it is preferable that the flexible wiring portion 16 is narrower than the arrangement portion of the antenna coil 11. The insulating material can be saved while securing a large area of the antenna coil 11.

Further, the flexible wiring can be carried out by the electric cables 12A3 and 12B3 as shown in FIG. In this case, not only the angle between the arrangement surface of the organic EL light emitting panel 20 and the arrangement surface of the antenna coil 11 but also the degree of freedom of the distance between the organic EL light emitting panel 20 and the antenna coil 11 is improved. As the electric cables 12A3 and 12B3, a general coated copper wire can be applied. It is easy to select the length of the electric cables 12A3 and 12B3.
As a connection structure, as shown in FIG. 12, a flexible substrate can be separated into a circuit board 10 including an antenna coil 11 and a relay board 25, and further can be as follows.
One end of the wiring 12A1 and 12B1 of the relay board 25 is connected to the organic EL light emitting panel 20 by the anisotropic conductive films 30A and 30B. The other ends of the wirings 12A1 and 12B1 of the relay board 25 are connected to one ends of the electric cables 12A3 and 12B3 by solders 12A2 and 12B2. The other ends of the electric cables 12A3 and 12B3 are connected to the ends of the wirings 12A5 and 12B5 on the circuit board 10 by solders 12A4 and 12B4.
It is preferable that at least one place of the wiring between the organic EL light emitting panel 20 and the antenna coil 11 is connected by solder. Easy to assemble and disassemble. Further, it is preferable to connect both ends of the electric cables 12A3 and 12B3 with solder. The electric cables 12A3 and 12B3 can be easily connected, and can be easily replaced with cables having different lengths.

[Resonance characteristics, etc.]
By selecting the inductance of the antenna coil 11 and the capacitance of the capacitance 15, it is possible to adjust the resonance with the electromagnetic field transmitted by the wireless power transmission device and improve the utilization efficiency of the electromagnetic wave. In order to increase the electric power supplied to the organic EL, it is preferable to adjust so that the current value flowing through the organic EL light emitting panel 20 becomes large.
Further, by adjusting the resonance, the distance between the antenna coil 11 capable of emitting light from the organic EL light emitting panel 20 and the wireless power transmission device can be selected.

[Base material for organic EL light emitting panel]
As the base material of the organic EL light emitting panel 20, glass, metal, resin or the like can be used. When light is extracted from the base material side, there is no particular limitation as long as it has high light transmission. For example, a resin substrate, a resin film, or the like is preferably used from the viewpoint of thickness, weight, and degree of freedom in shape, but it is preferable to use a transparent resin film from the viewpoint of productivity and performance such as light weight and flexibility.
The resin that can be used as a flexible base material is not particularly limited, and for example, polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and modified polyester, polyethylene (PE) resin, and polypropylene (PP) resin, Polypropylene resins, polyolefin resins such as cyclic olefin resins, vinyl resins such as polyvinyl chloride and polyvinylidene chloride, polyether ether ketone (PEEK) resins, polysalphon (PSF) resins, polyether salphon (PES) resins, Examples thereof include polycarbonate (PC) resin, polyamide resin, polyimide resin, acrylic resin, and triacetyl cellulose (TAC) resin. These resins may be used alone or in combination of two or more. Further, the flexible base material may be an unstretched film or a stretched film.
It is preferable that the flexible base material has high transparency because the transparent electrode can be used as the transparent electrode of the electronic device. High transparency means that the total light transmittance in the visible light wavelength region measured by a method based on JIS K 7361-1: 1997 (test method for total light transmittance of plastic-transparent material) is 50% or more. That is, 80% or more is more preferable.
Further, the flexible base material is preferably a gas barrier film provided with a gas barrier layer. As the flexible substrate, the water vapor transmission rate (25 ± 0.5 ° C., relative humidity 90 ± 2% RH) measured by a method according to JIS K 7129-1992 is 0.01 g / (m2 ・ 24h). ) The following gas barrier film (also referred to as gas barrier film or the like) is preferable. Furthermore, the oxygen permeability measured by a method according to JIS K 7126-1987 is 1 × 10-3 ml / (m2 ・ 24h ・ atm) or less, and the water vapor transmission rate is 1 × 10-5 g /. It is preferably (m2 ・ 24h) or less. The gas barrier layer constituting the flexible base material is not particularly limited, and a known gas barrier layer can be applied as long as the above gas barrier properties can be realized. When the flexible base material is not a gas barrier film, it is preferable to provide a gas barrier layer capable of realizing the gas barrier property on any surface of the flexible base material.

[Conductive connecting material]
A conductive adhesive such as a conductive paste, a conductive tape, an anisotropic conductive film, or the like can be used to connect the organic EL light emitting panel 20. In particular, when the base material of the organic EL light emitting panel 20 is a resin substrate, it is preferable to use an anisotropic conductive film. Thermocompression bonding at a relatively low temperature is possible, the heat load on the organic EL light emitting panel 20 can be reduced, and the yield can be improved.
[Animolic conductive film]
As the anisotropic conductive film used for connecting the organic EL light emitting panel 20, conductive particles such as metal nuclei themselves, for example, gold, nickel, and silver (and resin nuclei plated with gold, for example) are dispersed in a binder. As the binder, a thermoplastic resin or a thermosetting resin is used, and among them, a thermosetting resin, particularly an epoxy resin is preferable. Further, a conductive paste having the same structure may be used. An anisotropic conductive film or the like in which nickel fibers (fibrous) are oriented can also be used as the filler.
When the anisotropic conductive film is thermocompression bonded to the resin substrate, the conductive particles make an electrical connection in the thickness direction, and at the same time, the binder resin makes a mechanical bond. Examples of the binder resin include a thermosetting resin such as an epoxy resin and a phenol resin, and a thermoplastic resin such as polyamideimide. From the viewpoints of resin fluidity, connection reliability, cost, pot life, etc., film-like epoxy Resin is suitable. Examples of the conductive particles include composite particles in which the surface of metal particles such as nickel, copper and silver, and plastic particles such as acrylic resin and styrene resin is coated with a metal plating film such as nickel and gold. In particular, from the viewpoint of connection reliability, composite particles in which the surface of plastic particles whose particles themselves are flexible and recoverable is coated with a metal plating film such as nickel or gold is preferable. The conductive particle size is usually 3 to 5 μm.

[summary]
Since the rectifying circuit 13 is connected between the organic EL light emitting panel 20 and the wireless power receiving unit (11) as in the above embodiment, and the integrated circuit 14 for wireless communication is further connected, the RFID The DC power of the organic EL light emitting panel can be generated by the rectifying circuit 13 without damaging the communication, the utilization efficiency of the electromagnetic waves transmitted by the wireless power transmission device can be improved, and the power that can be supplied to the organic EL can be increased. ..
Since the capacitance is connected in parallel with the wireless power receiving unit (11), good resonance can be selected, so that the utilization efficiency of the electromagnetic waves transmitted by the wireless power transmission device is improved and the power that can be supplied to the organic EL is increased. be able to.
Since the organic EL light emitting panel 20, the rectifying circuit 13, and the integrated circuit 14 for wireless communication are connected to the wireless power receiving unit (11) in parallel, the electromotive force of the wireless power receiving unit (11) is distributed to each unit. It is possible to improve the utilization efficiency of electromagnetic waves transmitted by the wireless power transmission device and increase the electric power that can be supplied to the organic EL without impairing the communication of RFID.
Since at least one of the wirings between the organic EL light emitting panel 20 and the wireless power receiving unit (11) is connected by an anisotropic conductive film, a low resistance wiring connection is realized and the connection resistance is reduced. Therefore, it is possible to improve the utilization efficiency of the electromagnetic waves transmitted by the wireless power transmission device and increase the power that can be supplied to the organic EL without impairing the RFID communication.
In the above embodiments, all of them are merely examples of embodiment of the present invention, and the technical scope of the present invention should not be construed in a limited manner by these. That is, the present invention can be implemented in various forms without departing from its gist or its main features.

1 Light emitting module 10 Circuit board 11 Antenna coil 12A, 12B Wiring 12A1, 12B1 Wiring 12A2, 12B2 Solder 12A3, 12B3 Electric cable 12A4, 12B4 Solder 12A5, 12B5 Wiring 13 Rectifier circuit 14 Integrated circuit for wireless communication 15 Capacity 16 Flexible wiring part 20 Organic EL light emitting panel 25 Relay substrate 30A, 30B Anisotropic conductive film

Claims (13)

A light emitting module including an organic EL light emitting panel and a wireless power receiving unit that is electrically connected to the organic EL light emitting panel and wirelessly receives electric power supplied to the organic EL light emitting panel from the outside.
A light emitting module in which a rectifier circuit is connected between the organic EL light emitting panel and the wireless power receiving unit, and an integrated circuit for wireless communication is further connected. The light emitting module according to claim 1, wherein the organic EL light emitting panel is arranged outside the wireless power receiving unit. The light emitting module according to claim 1, wherein the organic EL light emitting panel is arranged inside the wireless power receiving unit. The light emitting module according to claim 2 or 3, wherein the rectifier circuit and the integrated circuit for wireless communication are arranged outside the wireless power receiving unit. The light emitting module according to claim 2 or 3, wherein the rectifier circuit and the integrated circuit for wireless communication are arranged inside the wireless power receiving unit. The light emitting module according to any one of claims 1 to 5, wherein the capacitance is connected in parallel with the wireless power receiving unit. The capacity is composed of two electrode films formed so as to face each other on the front and back surfaces of an insulating substrate that supports the wireless power receiving unit, and a part of the insulating substrate arranged between the two electrode films. The light emitting module according to claim 6. The light emitting module according to any one of claims 1 to 7, wherein the organic EL light emitting panel, the rectifier circuit, and the integrated circuit for wireless communication are connected in parallel to the wireless power receiving unit. The light emitting module according to claim 2, wherein the organic EL light emitting panel and the wireless power receiving unit are connected to each other by flexible wiring. The light emitting module according to claim 9, wherein the flexible wiring is long in a direction connecting the organic EL light emitting panel and the wireless power receiving unit. The light emitting module according to claim 9 or 10, wherein the flexible wiring is an electric cable. The light emitting module according to any one of claims 1 to 11, wherein at least one of the wirings between the organic EL light emitting panel and the wireless power receiving unit is connected by an anisotropic conductive film. .. The light emitting module according to any one of claims 1 to 12, wherein at least one place of the wiring between the organic EL light emitting panel and the wireless power receiving unit is connected by solder.

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