JP2021146199A - Oral cavity sensing device and manufacturing method therefor - Google Patents

Abstract

To provide an oral cavity sensing device that is easy to manufacture and excellent in safety in use, and a manufacturing method therefor.SOLUTION: A sensing device to be installed in an oral cavity comprises an electronic device 2 in which electronic components are mounted on a circuit board, a first dental resin material 3 covering all the electronic device 2, a second dental resin material 4 covering all the first dental resin material 3, and an oral cavity tool 1 comprising a first depression in which the electronic device 2 covered by the first dental resin material 3 and the second dental resin material 4 is housed.SELECTED DRAWING: Figure 1

Description

The present invention relates to an intraoral sensing device and a method for manufacturing the same.

So far, an intraoral sensing device installed in the oral cavity to obtain biological information has been put into practical use.
Conventionally, when an electronic device such as a biological monitoring sensor is attached to an oral device, it is attached to the oral device using a resin having adhesive strength to both the oral device and the electronic device. If you try to remove the electronic device from the oral appliance by recharging the battery of the electronic device, the resin cannot be removed because it is in close contact with the electronic device, and if you try to remove it forcibly, the electronic device will be damaged. There was a problem that it would end up. As a means for solving this, a method of dissolving the resin adhering the oral device and the electronic device with a solvent and taking out the electronic device is also conceivable. However, since the electronic device is equipped with a battery, there is a possibility that the circuit terminals will be short-circuited and the electronic device will be destroyed by immersing the battery in a solvent.
To solve such a problem, it is possible to cover the entire electronic device with the material of the oral appliance. For example, Patent Document 1 describes a method of forming a protective film having moisture resistance and insulation at a portion of an electronic circuit board on which electronic components are mounted, which requires at least moisture resistance and insulation, and is a resin. The first step of applying the first coating agent containing the above to form the first film, and the second coating agent to which an additive for imparting thickening is added to the first coating agent is applied. Described is a method of coating a mounting structure with a protective coating, which comprises a second step of forming a second coating. In this case, since the electronic device and the oral device are not adhered to each other, the possibility of breakage when the electronic device is taken out is reduced. However, when this means is taken, it is necessary to increase the thickness of the material of the oral appliance in manufacturing, and in the case of an orthodontic appliance, for example, there is a problem that it becomes difficult to control the force applied to the dentition. Further, if the material of the oral appliance is cracked, the moisture comes into direct contact with the electronic device, so that there is a problem that the electronic device is destroyed. For safety reasons, it is necessary to provide a second means so that electric leakage does not occur even if one means (in this case, the material of the orthodontic appliance) is cracked. Since only one means is provided in the above-mentioned method, there is also a safety problem. In addition, since the dental resin material for fixing the oral appliance and the electronic device is a liquid and the liquid polymerized and cured, there is a problem that the viscosity of the liquid is low and the dental resin material runs down before being cured. there were.

To solve such a problem, as shown in FIG. 17, it is conceivable to sandwich the electronic device 42 between two sealing films made of a thermoplastic polymer compound to form the oral appliance 41. There is a need to further simplify the manufacturing process.

Japanese Unexamined Patent Publication No. 2011-66080

An object of the present invention is to provide an oral sensing device and a method for manufacturing the same, which are easy to manufacture and excellent in safety in use.

The intraoral sensing device of the present invention is a sensing device installed in the oral cavity, and includes an electronic device in which an electronic component is mounted on a circuit board, a first dental resin material that covers all of the electronic devices, and the like.
A first recess in which a second dental resin material covering the entire first dental resin material, the first dental resin material, and the electronic device covered with the second dental resin material are accommodated. It is an intraoral sensing device having an intraoral device and the above.

A first specific aspect of the intraoral sensing device of the present invention is that the second dental resin material covers the electronic device covered with the first dental resin material, and the inside of the first recess. It is characterized by being adhered to.

The second specific aspect of the intraoral sensing device of the present invention is that the second dental resin material has one of the wide surfaces of the first dental resin material as the bottom surface and faces the bottom surface. The thickness of at least two or more corners is thinner than the thickness of the other portion, and the thickness of the corner of the second dental resin material of the first recess is thinner than the thickness of the other portion. It is characterized in that a first protrusion is provided at a portion corresponding to the portion.

A third specific aspect of the intraoral sensing device of the present invention is that one of the wide surfaces of the first dental resin material of the second dental resin material is a bottom surface, and the side surface with respect to the bottom surface. A second recess is provided on at least two or more of the corresponding surfaces, and a first protrusion is provided at a portion of the first recess corresponding to the second recess on the side surface of the second dental resin material. Is provided.

A fourth specific aspect of the intraoral sensing device of the present invention is that one of the wide surfaces of the first dental resin material of the second dental resin material is a bottom surface, and the side surface with respect to the bottom surface. A second protrusion is provided on at least two or more of the corresponding surfaces, and a recess is provided in the first recess corresponding to the second protrusion on the side surface of the second dental resin material. It is characterized by being.

In the manufacturing method according to the first specific aspect of the oral sensing device of the present invention, an electronic device having an electronic component mounted on a circuit board is prepared, and all the electronic devices are covered with the first dental resin material. A tooth mold matching the teeth and gingiva of the user who will be equipped with the intraoral sensing device is prepared, the electronic device covered with the first dental resin material is placed on the tooth mold, and the tooth mold is placed. The oral device is pressed against the material for manufacturing the oral device to perform embossing, and the oral device having the first recess in which the electronic device covered with the first dental resin material is accommodated is molded to form the first dental device. With the electronic device covered with the resin material for use housed in the first recess, the oral appliance is removed from the tooth mold to cover the entire first dental resin material, and the oral cavity is covered. A method of manufacturing an oral sensing device in which the electronic device covered with the first dental resin material is covered with a second dental resin material so as to be adhered to the inside of the first recess of the device. ..

In the manufacturing method according to the second specific aspect of the oral sensing device of the present invention, an electronic device having an electronic device mounted on a circuit board is prepared, and all the electronic devices are covered with the first dental resin material. The thickness of at least two or more corners of the surface facing the bottom surface is the thickness of the other portion, with one of the wide surfaces of the first dental resin material as the bottom surface and covering the entire first dental resin material. The electronic device covered with the first dental resin material is covered with the second dental resin material so as to be thinner than the thickness, and is aligned with the teeth and gingiva of the user who will be equipped with the intraoral sensing device. The prepared tooth mold is prepared, the electronic device covered with the first dental resin material and the second dental resin material is placed on the tooth mold, and the tooth mold is used as a material for manufacturing an oral appliance. Pressing and embossing is performed to form an oral appliance having a first recess in which the electronic device covered with the first dental resin material and the second dental resin material fits, and the first Manufacture of an oral sensing device for removing the oral device from the tooth mold while the dental resin material and the electronic device covered with the second dental resin material are housed in the first recess. The method.

In the manufacturing method according to the third specific aspect of the oral sensing device of the present invention, an electronic device having an electronic device mounted on a circuit board is prepared, and all the electronic devices are covered with the first dental resin material. A second recess that covers the entire first dental resin material and has at least two or more surfaces corresponding to the side surface with respect to the bottom surface, with one of the wide surfaces of the first dental resin material as the bottom surface. The electronic device covered with the first dental resin material was covered with the second dental resin material so as to be provided so as to match the teeth and gingiva of the user who will be equipped with the intraoral sensing device. A tooth mold is prepared, the electronic device covered with the first dental resin material and the second dental resin material is placed on the tooth mold, and the tooth mold is pressed against the material for manufacturing an oral appliance. The first dental resin material and the second dental resin material-covered oral appliance having a first recess in which the electronic device is accommodated are formed by embossing. A method for manufacturing an oral sensing device, which removes the oral device from the tooth mold while the dental resin material and the electronic device covered with the second dental resin material are housed in the first recess. Is.

In the manufacturing method according to the fourth specific aspect of the oral sensing device of the present invention, an electronic device having an electronic device mounted on a circuit board is prepared, and all the electronic devices are covered with the first dental resin material. A second protrusion that covers the entire first dental resin material and has at least two or more surfaces corresponding to the side surface with respect to the bottom surface, with one of the wide surfaces of the first dental resin material as the bottom surface. The electronic device covered with the first dental resin material was covered with the second dental resin material so as to be provided so as to match the teeth and gingiva of the user who will be equipped with the intraoral sensing device. A tooth mold is prepared, the electronic device covered with the first dental resin material and the second dental resin material is placed on the tooth mold, and the tooth mold is pressed against the material for manufacturing an oral appliance. The first dental resin material and the second dental resin material-covered oral appliance having a first recess in which the electronic device is accommodated are formed by embossing. A method for manufacturing an oral sensing device, which removes the oral device from the tooth mold while the dental resin material and the electronic device covered with the second dental resin material are housed in the first recess. Is.

According to the present invention, it is possible to provide an oral sensing device and a method for manufacturing the same, which are easy to manufacture and excellent in safety in use.

FIG. 1 is a cross-sectional view of an intraoral sensing device when the electronic device 2 is attached to the intraoral device 1. FIG. 2 is a schematic view of an oral sensing device when the electronic device 2 is attached to the oral device 1. FIG. 3 is a schematic view of another oral sensing device when the electronic device 2 is attached to the oral device 1. FIG. 4 is a schematic view showing the shape of an electronic device covered with a second dental resin material 4 installed in the first recess of the oral appliance. FIG. 5 is a cross-sectional view of the first recessed portion when the electronic device 2 is installed in the first recess of the oral appliance 1. FIG. 6 is a cross-sectional view showing a state when the electronic device 2 installed in the first recess of the oral appliance 1 is removed. FIG. 7 is a schematic view showing another shape of the electronic device covered with the second dental resin material 4 placed in the first recess of the oral appliance. FIG. 8 is a cross-sectional view of another first recess when the electronic device 2 is installed in the first recess of the oral appliance 1. FIG. 9 is a schematic view showing another shape of the electronic device covered with the second dental resin material 4 placed in the first recess of the oral appliance. FIG. 10 is a cross-sectional view of another first recess when the electronic device 2 is installed in the first recess of the oral appliance 1. FIG. 11 is a schematic view showing another shape of the electronic device covered with the second dental resin material 4 placed in the first recess of the oral appliance. FIG. 12 is a schematic view showing another shape of the electronic device covered with the second dental resin material 4 placed in the first recess of the oral appliance. FIG. 13 is a cross-sectional view of another first recess when the electronic device 2 is installed in the first recess of the oral appliance 1. FIG. 14 is a cross-sectional view of another first recess when the electronic device 2 is installed in the first recess of the oral appliance 1. FIG. 15 is a cross-sectional view of an intraoral sensing device when the electronic device 2 is attached to the implant denture 32. FIG. 16 is a schematic block diagram showing a circuit configuration of the electronic device 2. FIG. 17 is a cross-sectional view of a conventional oral sensing device when the electronic device 42 is attached to the oral device 41. FIG. 18 is a process flow diagram showing a method of manufacturing an intraoral sensing device. FIG. 19 is a process flow diagram showing another manufacturing method of the intraoral sensing device.

The present invention has the following advantageous features.
Since the electronic device 2 is doubly covered with the first dental resin material 3 and the second dental resin material 4 when used in the oral cavity, even if one of them is cracked, On the other hand, it is protected, so it is highly safe for the human body. Further, particularly when the first dental resin material 3 is a silicone resin, the silicone resin does not adhere to the electronic device 2, so that the first dental resin material 3 can be easily peeled off from the electronic device 2 and the electronic device. 2 can be reused without being damaged. Further, the first dental resin material 3 can be peeled off from the electronic device 2 and mounted on the electronic device 2 to replace the battery, which is particularly useful when the battery is a primary battery.

In the first specific aspect of the present invention, as shown in FIG. 1, the electronic device 2 completely covered with the first dental resin material 3 is housed in the first recess of the oral appliance 1. The second dental resin material 4 is filled in the gap between the electronic device 2 completely covered with the first dental resin material 3 and the first recess, and the second dental resin material 4 causes an electron. The device 2 and the intraoral device 1 are adhered to each other. 2 and 3 are perspective views of the oral appliance 1. When the intraoral device is attached to the teeth and gums, the electronic device 2 is arranged inside the oral cavity (lingual side) as shown in FIG. 2, or outside the oral cavity as shown in FIG. The electronic device 2 may be arranged (on the buccal side).
By adopting such a configuration, the safety of using the oral sensing device is more excellent, and the manufacturing of the oral sensing device becomes easier.

In the second specific aspect of the present invention, as shown in FIG. 4, the second dental resin material 4 covering the electronic device entirely covered with the first dental resin material is the first dentistry. With one of the wide surfaces of the resin material as the bottom surface, the surface is molded so that the thickness of at least two or more corners of the surface facing the bottom surface is thinner than the thickness of the other portion, and as shown in FIG. The first recess of the oral appliance 1 is a portion corresponding to a portion where the thickness of the corner on the side surface of the second dental resin material 4 is thinner than the thickness of the other portion, and the first protrusion 1c Is provided.
By adopting such a configuration, as shown in FIG. 6, the force applied to the oral device 1 when the oral device 1 is attached / detached is not directly applied to the electronic device 2, and the electronic device 2 is repeatedly attached / detached. The possibility that the electronic device 2 will be damaged by removal has been reduced. In particular, when the oral appliance 1 is molded by vacuum embossing, the first protrusion 1c can be formed at the same time as the formation of the first recess, and the electronic device 2 is automatically set. Efficiency is improved.

In a third specific aspect of the present invention, as shown in FIG. 7, the first dentistry of the second dental resin material 4 covering an electronic device entirely covered with the first dental resin material. With one of the wide surfaces of the resin material as the bottom surface, second recesses are provided on at least two or more surfaces corresponding to the side surfaces with respect to the bottom surface, and as shown in FIG. 8, the first surface is provided. The first protrusion 1c is provided at a portion of the recess corresponding to the second recess on the side surface of the dental resin material.
By adopting such a configuration, it has become easier to remove the electronic device 2 from the oral device 1 and to reattach the electronic device 2 to the oral device 1. In particular, when the oral appliance 1 is molded by vacuum embossing, the first protrusion 1c can be formed at the same time as the formation of the first recess, and the electronic device 2 is automatically set. Efficiency is improved.

In a third specific aspect of the present invention, as shown in FIG. 9, the first dentistry of the second dental resin material 4 covering an electronic device entirely covered with the first dental resin material. With one of the wide surfaces of the resin material as the bottom surface, second protrusions are provided on at least two or more surfaces corresponding to the side surfaces with respect to the bottom surface, and as shown in FIG. 10, the first surface is provided. A recess 1d is provided at a portion of the recess corresponding to the second protrusion on the side surface of the second dental resin material 4.
By adopting such a configuration, it has become easier to remove the electronic device 2 from the oral device 1 and to reattach the electronic device 2 to the oral device 1. In particular, when the oral appliance 1 is molded by vacuum embossing, the dent 1d can be formed at the same time as the formation of the first dent, and the electronic device 2 is automatically set, so that the work efficiency is improved. do.

In the second specific aspect and the third specific aspect of the present invention described above, as shown in FIG. 11 or 12, the shape is not limited to a substantially rectangular parallelepiped shape, and the corners may be rounded or the corners may be dropped. good. Further, as shown in FIG. 13 or 14, the corner of the first recess in contact with the bottom may be dropped or rounded.

[Intraoral sensing device]
The oral sensing device is composed of an electronic device 2, an oral device 1, a first dental resin material 3, and a second dental resin material 4.

<Electronics>
As shown in FIG. 16, the electronic device 2 is composed of a wireless module unit 23 including a wireless transmission / reception unit 26, a signal processing unit 24, and a memory 25, a sensor 22, and a battery 21, and is mounted on a circuit board. The whole is covered with the first dental resin material.
The electronic device 2 is composed of a wireless module unit 23 in which a wireless transmission / reception unit 26, a signal processing unit 24, and a memory 25 are combined, a sensor 22, and a battery 21, and is embedded in an orthodontic appliance, a denture, or an implant.
The wireless transmission / reception unit 26 has a role of transmitting digital data sensed in the oral cavity to the network connector 27 outside the oral cavity and receiving a command transmitted from the network connector 27 to the electronic device 2.
The signal processing unit 24 is composed of a microcomputer and an AD converter, has a role of converting sensing data sent from the sensor 22 into digital data and storing it in the memory 25, and data capable of transmitting the digital data stored in the memory 25. It controls the operation of the sensor 22 and the wireless transmission / reception unit 26 by interpreting the role of converting the data into data and the command sent from the network connector 27.
The sensor 22 uses a temperature sensor, an acceleration sensor, a gyro sensor, a pressure sensor, a strain sensor, a pulse wave sensor that measures pulse waves using light, a pulse oximeter that measures blood oxygen concentration using light, and light. It is composed of at least one selected from a group consisting of a heart rate sensor that measures heart rate and a laser sensor that measures blood flow using laser light, and acquires various physical information and biological information.
The battery 21 is composed of a primary battery or a secondary battery, and supplies electric power to the wireless transmission / reception unit 26, the signal processing unit 24, the memory 25, and the sensor 22.
In these circuit blocks, a battery 21, a sensor 22, a signal processing unit 24, a wireless transmission / reception unit 26, and a memory 25 are mounted on a thin circuit board or a flexible substrate. Generally, the wireless transmission / reception unit 26, the signal processing unit 24, and the memory 25 are often provided as a single chip. Further, in the electronic device 2, a battery 21, a sensor 22, a signal processing unit 24, a memory 25, and a wireless transmission / reception unit 26 are mounted on a thin circuit board or a flexible substrate.

The electronic device 2 is covered with the first dental resin material 3, and the outside thereof is covered with the second dental resin material 4 and installed in the oral appliance. Intrusion can be prevented. Even if the second dental resin material 4 is cracked, the electronic device 2 is covered with the soft first dental resin material 3, so that double safety is ensured.

The wireless module unit 23 mounted on the electronic device 2 does not necessarily have to wirelessly exchange data with the outside, and may be an electronic device that exchanges data by wire. However, in the case of an electronic device that exchanges data by wire, it is necessary to waterproof the connector portion that connects the electronic device 2 and the network connector 27. A mechanism like a lid is installed on the connector part, and a mechanism that opens when reading data and closes when installing in the oral cavity is adopted. Therefore, there is an advantage that the waterproof structure can be simplified by transmitting and receiving data wirelessly.

By using a temperature sensor for the sensor 22, not only can it be used for oral orthodontic treatment by measuring the time when the oral appliance is worn, but also daily changes in body temperature can be monitored.
By using an acceleration sensor / gyro sensor for the sensor 22, not only can the number of chews be counted, but also step count measurement, activity amount measurement, jaw movement measurement, and bruxism (bruxism) measurement can be performed.
By using a pressure sensor / strain sensor for the sensor 22, not only can the force applied to the teeth, dentures, and implants be measured, but also the force applied to the teeth by the oral appliance, the bruxism (grinding), and the chewing force can be measured. It is also possible to measure the number of times of chewing, the number of times of chewing, and the time when the oral device is worn.

<Intraoral device>
Orthodontic appliances 1 include, for example, orthodontic appliances, dentures or implants.

In the case of an orthodontic device, the intraoral device 1 is preferably formed of a thermoplastic polymer compound, and any one of the thermoplastics selected from the group consisting of polyethylene-based materials, polyurethane-based materials, and acrylic-based resins. It is more preferably formed of a polymer compound.
When the electronic device is attached to the oral device, as shown in FIGS. 1 to 3, the oral device matches the material for manufacturing the oral device with the teeth and gingiva of the user who will be wearing the oral sensing device. It is preferable to press it against the tooth mold to be embossed, or to mold it into a tooth mold / gingival shape with a 3D printer, and press it against the tooth and gingival-matched tooth mold of the user who is planning to install the oral sensing device. It is more preferable to emboss.
As the material for manufacturing the oral apparatus, the above-mentioned sheet or film of the thermoplastic polymer compound is preferable.
A recess is provided in a part of the oral appliance 1, and an electronic device 2 is installed in the recess. The place where the electronic device 2 is installed may be a place corresponding to the side wall of the crown or a place corresponding to the gingiva, but when considering the engagement of the upper and lower teeth, it is installed at the place corresponding to the gingiva shown in FIG. Is preferable. In addition, a pulse wave sensor that measures pulse waves using light, a pulse oximeter that measures blood oxygen concentration using light, a heart rate sensor that measures heartbeat using light, or laser light is used to measure blood flow. In the case of the laser sensor for measurement, since information is obtained from the blood vessels of the gingiva, it is preferable to install it in a place corresponding to the gingiva.
Further, when the sensor using the above-mentioned light or laser is mounted, the transmission of light is indispensable, so that the oral appliance 1 is a material capable of transmitting light of any wavelength in the wavelength range of 400 to 1000 nm. Consists of.

In the first specific embodiment, as shown in FIG. 1, the electronic device 2 is entirely covered with the first dental resin material 3, and further, the entire circumference of the first dental resin material 3 is covered with the second. While covering with the dental resin material 4, the recess of the oral instrument 1 is filled with the second dental resin material 4, and the oral instrument 1 and the electronic device 2 are adhered to each other.

In the second specific embodiment, as shown in FIG. 4, the thickness of the second dental resin material 4 is at least one of the surfaces facing the bottom surface, with one of the wide surfaces of the first dental resin material as the bottom surface. Adopt a structure in which the thickness of two or more corners is thinner than the thickness of other parts. Then, as shown in FIG. 5, the electronic device is fixed by the portion where the thickness of the corner of the second dental resin material 4 is thinner than the thickness of the other portion and the first protrusion 1c of the oral appliance 1. Even if a large force is applied to the intraoral device 1, the force is not directly applied to the electronic device 2. Therefore, it is possible to avoid the problem that the electronic device 2 is broken due to the force applied to the electronic device 2 when the oral device 1 is attached / detached. Further, when the corners of the second dental resin material 4 are formed with only one thin corner, the probability of falling off is very high, which is not preferable. By forming at least two corners, preferably four, the oral device 1 will not fall off even when it is attached or detached. FIG. 6 is a schematic view showing a state when the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 is removed from the oral appliance 1. When the electronic device 2 is taken out in the direction of the arrow, the first protrusion 1c of the oral appliance 1 is deformed, so that the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 Can be easily removed from the intraoral device 1.

In the third specific aspect, as shown in FIG. 7, the second dental resin material 4 has one of the wide surfaces of the first dental resin material as the bottom surface, and the surface corresponding to the side surface with respect to the bottom surface. A structure in which a second recess of 4 g is provided on at least two or more surfaces is adopted. Then, as shown in FIG. 8, in order to fix the electronic device 2 with the second recess 4g formed on the side surface of the second dental resin material 4 and the first protrusion 1c of the oral device, the oral device 1 is used. Even if a large force is applied to the electronic device 2, the force is not directly applied to the electronic device 2. Therefore, it is possible to avoid the problem that the electronic device 2 is broken due to the force applied to the electronic device 2 when the oral device 1 is attached / detached. Further, when the second recess 4g is formed on only one side surface, the probability of falling off is very high, which is not preferable. By forming a second recess 4g on at least two side surfaces, preferably four surfaces, the oral device 1 will not fall off even when it is attached or detached. The second recess 4g is preferably parallel to the bottom surface.

In the fourth specific aspect, as shown in FIG. 9, the second dental resin material 4 has one of the wide surfaces of the first dental resin material as the bottom surface, and the surface corresponding to the side surface with respect to the bottom surface. A structure in which the second protrusion 4h is provided on at least two or more surfaces is adopted. Then, as shown in FIG. 10, since the electronic device 2 is fixed by the second protrusion 4h formed on the side surface of the second dental resin material 4 and the recess 1d of the oral device, a large force is applied to the oral device 1. No force is directly applied to the electronic device 2 even if the force is applied. Therefore, it is possible to avoid the problem that the electronic device 2 is broken due to the force applied to the electronic device 2 when the oral device 1 is attached / detached. Further, when the second protrusion 4h is formed on only one side surface, the probability of falling off is very high, which is not preferable. By forming the second protrusion 4h on at least two side surfaces, preferably four surfaces, the oral device 1 will not fall off even when it is attached or detached. The second protrusion 4h is preferably parallel to the bottom surface.

In the case of the second specific aspect (FIG. 4), the third specific aspect (FIG. 7), or the fourth specific aspect (FIG. 9), the oral device 1 is made of a polyethylene-based material, a polyurethane-based material, or an acrylic material. A method of embossing on a tooth mold formed of plaster or a 3D printer, which is composed of a thermoplastic polymer compound such as a based resin, is suitable. Place the electronic device 2 covered with the second dental resin material 4 shown in FIG. 4, FIG. 7 or FIG. 9 at the place where the electronic device 2 is to be installed on the tooth mold, and vacuum-emboss the thermoplastic polymer compound. When the sheet or film of No. 1 is molded, the thermoplastic polymer compound enters the portion where the thickness of the corner is thin or the first recess, and the first protrusion 1c of the oral apparatus 1 as shown in FIG. 5 or FIG. Alternatively, the recess 1d of the intraoral device 1 as shown in FIG. 10 can be automatically formed.
When the oral device 1 is manufactured by a 3D printer, it is necessary to set the electronic device 2 in the first recess of the oral device 1 after that, but the electronic device having the shape shown in FIG. 4, FIG. 7 or FIG. 9 When vacuum embossing is performed in step 2, the labor of setting can be saved and the work efficiency can be improved.

The position where the electronic device 2 is attached to the intraoral device 1 may be either the upper jaw or the lower jaw, and may be either the inside (lingual side) or the outside (buccal side) of the oral cavity.

When the electronic device 2 is attached to the denture or the implant, it is preferable to install the electronic device 2 in the denture (implant denture 32) as shown in FIG. FIG. 15 shows an example of an implant implanted in the alveolar bone 34, but the same applies to a denture. It is preferable that the electronic device 2 is doubly covered with the first dental resin material 3 and the second dental resin material 4 and installed inside the denture or the implant denture 32.
A pulse wave sensor that uses light to measure pulse waves, a pulse oximeter that uses light to measure blood oxygen concentration, a heart rate sensor that uses light to measure heart rate, or a laser beam to measure blood flow. In the case of the laser sensor, since information is obtained from the blood vessels of the gingiva, it is preferable to install the laser sensor at a location corresponding to the gingiva 33. Further, when the above-mentioned sensor using light or laser is mounted, a part of the denture or the implant denture is made of a material capable of transmitting light having a wavelength of 400 to 1000 nm because of light transmission. It is composed.

<First dental resin material>
The first dental resin material 3 is, for example, a silicone resin or methacrylate containing polydimethylsiloxane as a main component, to which butyl phthalate is added as a plasticizer and cured by polymerization. Examples of the silicone resin include condensation type silicone rubber and addition type silicone rubber. The first dental resin material 3 is not limited to the above-mentioned one, and other plastics and the like can also be used. As the first dental resin material 3, a silicone resin is preferable.

Since the silicone resin has a weak adhesion to the electronic device 2, it can be easily removed. Therefore, when the electronic device 2 is reused, the cleanliness is always maintained by replacing the silicone resin with a new one. Further, since the adhesion between the second dental resin material 4 and the silicone resin, which will be described later, is weak, the electronic device 2 can be easily peeled off from the oral appliance 1 when the electronic device 2 is reused.

<Second dental resin material>
The second dental resin material 4 is, for example, obtained by polymerizing and curing methyl methacrylate and polymethyl methacrylate, 2,2-bis (4- (3-methaxoloxy-2-hydroxypropoxy) phenyl) propane, and urethane dimethacrylate. , Triethylene glycol dimethacrylate as a main component, polymethyl methacrylate, 4-methacryloyloxyethyl trimerite anhydride, polymerized and cured tri-n-butylborane, polyethylene resin, polyurethane resin, or acrylic It is a system resin. The second dental resin material 4 is not limited to the above-mentioned one, and other plastics and the like can also be used. As the second dental resin material 4, it is preferable to polymerize and cure methyl methacrylate and polymethyl methacrylate because it has good coverage to cover the electronic device 2 and can prevent moisture from entering the device. ..

Dental resin materials obtained by polymerizing and curing methyl methacrylate and polymethyl methacrylate, polymethyl methacrylate, 4-methacryloyloxyethyl trimerite anhydride, and tri-n-butylborane by polymerizing and curing liquid and powder are polymerized and cured. Since it is a type that allows the dental resin material to flow down, the gap between the electronic device 2 and the oral device can be filled. The polymerization procedure is to first apply liquid to the brush or hand, and then apply powder to the brush or hand. As a result, the viscosity of the dental resin material is increased, and the dental resin material can be placed in the gap between the electronic device 2 and the oral appliance.

Since the second dental resin material 4 is softer than the first dental resin material 3 and has a high adhesion to the oral instrument 1, the electronic device 2 is fixed to the oral instrument 1 with a high holding force. be able to. Further, the first dental resin material 3 is harder than the second dental resin material 4, and is suitable for protecting the electronic device 2 from an external force.

[Manufacturing method of intraoral sensing device]
In the intraoral sensing device according to the first specific aspect of the present invention, for example, as shown in FIG. 18, an electronic device 2 having an electronic component mounted on a circuit board is prepared, and all the electronic devices 2 are used as the first dental dental device. A tooth mold matching the teeth and gingiva of the user who is to be covered with the oral resin material 3 and to which the oral sensing device is to be attached is prepared, and the electronic device 2 covered with the first dental resin material 3 is covered with the tooth. An oral device 1 having a first recess in which an electronic device 2 covered with a first dental resin material 3 is accommodated by placing the tooth mold on a mold and pressing the tooth mold against a material for manufacturing an oral device to perform embossing molding. The oral appliance 1 is removed from the tooth mold while the electronic device 2 covered with the first dental resin material 3 is housed in the first recess, and the first dental resin material 3 is formed. The electronic device 2 covered with the first dental resin material 3 is covered with the second dental resin material 4 so as to cover the whole and adhere to the inside of the first recess of the oral appliance 1. Can be manufactured by.

In the oral sensing device according to the second specific aspect of the present invention, for example, as shown in FIG. 19, an electronic device 2 in which an electronic device is mounted on a circuit board is prepared, and all the electronic devices 2 are used as the first dental dental device. At least two or more surfaces facing the bottom surface, with one of the wide surfaces of the first dental resin material 3 as the bottom surface, and covering the entire first dental resin material 3 with the resin material 3 for use. The electronic device 2 covered with the first dental resin material 3 is covered with the second dental resin material 4 so that the thickness of the corner is thinner than the thickness of the other portion, and the oral sensing device is attached. A tooth mold matching the teeth and gingiva of the planned user is prepared, and the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 is placed on the tooth mold, and the tooth is placed. An oral cavity having a first recess in which an electronic device 2 covered with a first dental resin material 3 and a second dental resin material 4 is accommodated by pressing a mold against a material for manufacturing an intraoral instrument to perform embossing molding. The oral instrument 1 is placed on the tooth in a state where the internal device 1 is molded and the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 is housed in the first recess. It can be manufactured by removing it from the mold.

In the oral sensing device according to the third specific aspect of the present invention, for example, as shown in FIG. 19, an electronic device 2 in which an electronic device is mounted on a circuit board is prepared, and all the electronic devices 2 are used as the first dental dental device. Cover with the resin material 3 for use, cover the entire first dental resin material 3, and use one of the wide surfaces of the first dental resin material 3 as the bottom surface, and at least the surface corresponding to the side surface with respect to the bottom surface. The electronic device 2 covered with the first dental resin material 3 is covered with the second dental resin material 4 so that the second recess is provided on two or more surfaces, and the oral sensing device is to be attached. A tooth mold matching the user's teeth and gingiva is prepared, and an electronic device 2 covered with a first dental resin material 3 and a second dental resin material 4 is placed on the tooth mold, and the tooth mold is placed. Is pressed against the material for manufacturing oral instruments to perform embossing, and the oral cavity has a first recess in which the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 fits. With the electronic device 2 formed by molding the device 1 and covered with the first dental resin material 3 and the second dental resin material 4, the oral device 1 is placed in the tooth mold while being housed in the first recess. Can be manufactured by removing from. The second recess is preferably provided parallel to the bottom surface.

In the oral sensing device according to the fourth specific aspect of the present invention, for example, as shown in FIG. 19, an electronic device 2 in which an electronic device is mounted on a circuit board is prepared, and all the electronic devices 2 are used as the first dental dental device. Cover with the resin material 3 for use, cover the entire first dental resin material 3, and use one of the wide surfaces of the first dental resin material 3 as the bottom surface, and at least the surface corresponding to the side surface with respect to the bottom surface. The electronic device 2 covered with the first dental resin material 3 is covered with the second dental resin material 4 so that the second protrusions are provided on two or more surfaces, and the oral sensing device is to be attached. A tooth mold matching the user's teeth and gingiva is prepared, and an electronic device 2 covered with a first dental resin material 3 and a second dental resin material 4 is placed on the tooth mold, and the tooth mold is placed. Is pressed against the material for manufacturing oral instruments to perform embossing, and the oral cavity has a first recess in which the electronic device 2 covered with the first dental resin material 3 and the second dental resin material 4 fits. With the electronic device 2 formed by molding the device 1 and covered with the first dental resin material 3 and the second dental resin material 4, the oral device 1 is placed in the tooth mold while being housed in the first recess. Can be manufactured by removing from. The second protrusion is preferably provided parallel to the bottom surface.

The oral apparatus 1, the electronic device 2, the first dental resin material 3 and the second dental resin material 4 are the same as those described for the oral sensing device of the present invention, and the preferred ones are also the same. ..

[Action effect]
In the oral sensing device of the present invention, since the first dental resin material 3 covers the entire electronic device 2, it can be used even if the adhesion between the first dental resin material 3 and the electronic device 2 is very weak. Sometimes it doesn't come off.
By using the silicone resin as the first dental resin material 3, even when the electronic device 2 is reused for charging or the like, the electronic device 2 can be easily peeled off from the oral device 1 and the silicone resin can be peeled off cleanly. It is not destroyed and is easy to reuse.
Sufficient sterilization work is required when reusing what is put in the oral cavity, but in the oral sensing device of the present invention, since the silicone resin is disposable once, the electronic device 2 can be easily washed. be.
When the electronic device 2 is used in the oral cavity, the electronic device 2 is covered with the first dental resin material 3 and the second dental resin material 4, so that the waterproof property of the electronic device 2 is improved.
When the electronic device 2 is used in the oral cavity, it is covered with the first dental resin material 3 and the second dental resin material 4, so even if one of them has a crack, the other material can be used. Because it is protected, safety to the human body is ensured.

In the oral sensing device of the present invention, a part of the oral device 1 is recessed and the electronic device 2 is mounted therein, so that the manufacturing process is simple.
Since a part of the oral appliance 1 is recessed and the electronic device 2 is mounted therein, the thickness of the material of the oral appliance 1 can be reduced. For example, when the oral appliance 1 is an orthodontic appliance, the thickness of the material can be reduced. It is also possible to delicately control the force applied to the dentition.
Since the second dental resin material 4 for attaching the electronic device 2 to the oral appliance 1 polymerizes and cures the liquid and the powder, the second dental resin material 4 does not flow down. Therefore, when covering the first dental resin material 3 with the second dental resin material 4, the liquid material is first impregnated into the brush, and then the brush is dusted with the first dental resin. A brush stacking method of applying around the material 3 or a sprinkling method of alternately sprinkling a liquid material and powder can also be used.
In the second specific aspect, the electronic device 2 has a portion where the thickness of the corner is thinner than the thickness of the other portion and the first protrusion 1c of the oral appliance 1 via the second dental resin material 4. Since it is fixed with, even if a large force is applied to the oral device, the force is not directly applied to the electronic device 2. Therefore, it is possible to avoid the problem that the electronic device 2 is broken due to the force applied to the electronic device 2 when the oral device 1 is attached / detached.

In the third specific aspect, the electronic device 2 is fixed via the second dental resin material 4 with the second recess of the second dental resin material 4 and the first protrusion 1c of the oral instrument 1. Therefore, even if a large force is applied to the oral appliance 1, the force is not directly applied to the electronic device 2. Therefore, it is possible to avoid the problem that the electronic device 2 is broken due to the force applied to the electronic device 2 when the oral device 1 is attached / detached. When the oral device 1 is molded by vacuum embossing, a part of the oral device 1 is recessed, and the electronic device 2 is attached with a structure in which the first protrusion 1c is provided. Since the protrusion 1c of the above can be formed and the electronic device 2 is automatically set, the work efficiency is improved.

In the fourth specific aspect, the electronic device 2 is fixed to the second protrusion of the second dental resin material 4 and the recess 1d of the oral appliance 1 via the second dental resin material 4. Therefore, even if a large force is applied to the intraoral device 1, the force is not directly applied to the electronic device 2. Therefore, it is possible to avoid the problem that the electronic device 2 is broken due to the force applied to the electronic device 2 when the oral device 1 is attached / detached. When the oral device 1 is molded by vacuum embossing, a part of the oral device 1 is dented, and the electronic device 2 is attached with a structure in which the dent 1d is provided, the dent 1d is automatically formed. At the same time, the electronic device 2 is automatically set, so that the work efficiency is improved.

Since the electronic device 2 is provided with the wireless transmission / reception unit 26, it is easy to take out the sensed information to the outside.
By using a temperature sensor for the sensor 22, not only can it be used for oral orthodontic treatment by measuring the time when the oral appliance 1 is worn, but also daily changes in body temperature can be monitored.
By using an acceleration sensor / gyro sensor for the sensor 22, not only can the number of chews be counted, but also one or more types selected from the group consisting of step count measurement, activity measurement, jaw movement measurement, and bruxism (grinding teeth). Can be measured.
By using a pressure sensor / strain sensor for the sensor 22, it is possible not only to measure the force applied to the tooth or denture or the implant, but also to measure the force applied to the tooth by the oral appliance 1 and to measure Bruxism. It is possible to measure one or more types selected from the group consisting of the measurement of the chewing force, the number of times of chewing, and the time when the oral device is worn.

The present application claims priority based on Japanese Patent Application No. 2020-0444440 filed in Japan on March 13, 2020, the contents of which are incorporated herein by reference. The "silicon resin" in the specification of Japanese Patent Application No. 2020-0444440 means the "silicon resin" in the specification of the present application.

1 ... Oral implant, 1c ... First protrusion, 1d ... Depression, 2 ... Electronic device, 3 ... First dental resin material, 4 ... Second dental resin material, 4g ... Second depression, 4h ... second protrusion, 5 ... tooth, 21 ... battery, 22 ... sensor, 23 ... wireless module unit, 24 ... signal processing unit, 25 ... memory, 26 ... wireless transmitter / receiver, 27 ... network connector, 31 ... implant, 32 ... Implant denture, 33 ... Gingiva, 34 ... Alveolar bone, 41 ... Oral device, 42 ... Electronic device

Claims (24)

A sensing device installed in the oral cavity
Electronic devices with electronic components mounted on circuit boards and
The first dental resin material that covers all of the electronic devices,
A second dental resin material that covers the entire first dental resin material,
An oral appliance with a first recess in which the electronic device covered with the first dental resin material and the second dental resin material fits.
Oral sensing device with. The intraoral sensing device according to claim 1, wherein the second dental resin material adheres the electronic device covered with the first dental resin material to the inside of the first recess. In the second dental resin material, the thickness of at least two or more corners of the surface facing the bottom surface is thinner than the thickness of the other portion, with one of the wide surfaces of the first dental resin material as the bottom surface. The first protrusion is provided at a portion of the first recess corresponding to a portion where the thickness of the corner of the second dental resin material is thinner than the thickness of the other portion. , The intraoral sensing device according to claim 1. A second recess is provided on at least two or more surfaces of the second dental resin material corresponding to the side surface with respect to the bottom surface, with one of the wide surfaces of the first dental resin material as the bottom surface. The oral sensing device according to claim 1, wherein a first protrusion is provided at a portion of the first recess corresponding to the second recess on the side surface of the second dental resin material. .. The intraoral sensing device according to claim 4, wherein the second recess is parallel to the bottom surface. A second protrusion is provided on at least two or more surfaces of the second dental resin material corresponding to the side surface with respect to one of the wide surfaces of the first dental resin material as the bottom surface. The intraoral sensing device according to claim 1, wherein a recess is provided in a portion of the first recess corresponding to a second protrusion on the side surface of the second dental resin material. The intraoral sensing device according to claim 6, wherein the second protrusion is parallel to the bottom surface. The oral sensing device according to any one of claims 1 to 7, wherein the oral device is made of a thermoplastic polymer compound. The oral sensing device according to any one of claims 1 to 7, wherein the first dental resin material contains polydimethylsiloxane as a main component. The oral sensing device according to any one of claims 1 to 7, wherein the first dental resin material is obtained by adding butyl phthalate as a plasticizer to methacrylate and polymerizing and curing the resin material. The oral sensing device according to any one of claims 1 to 7, wherein the second dental resin material is obtained by polymerizing and curing methyl methacrylate and polymethyl methacrylate. The second dental resin material is at least one selected from the group consisting of 2,2-bis (4- (3-methaxoloxy-2-hydroxypropoxy) phenyl) propane, urethane dimethacrylate and triethylene glycol dimethacrylate. The intraoral sensing device according to any one of claims 1 to 7, wherein the seed is the main component. The second dental resin material is obtained by polymerizing and curing polymethylmethacrylate, 4-methacryloyloxyethyl trimeritate anhydride and tri-n-butylborane, according to any one of claims 1 to 3. The above-mentioned intraoral sensing device. The second dental resin material is characterized by being capable of a brush stacking method in which a liquid material is first impregnated into a brush and then powder is applied to the brush and applied around the first dental resin material. The intraoral sensing device according to any one of claims 11 to 13. The oral sensing device according to any one of claims 11 to 13, wherein the second dental resin material can be sprinkled with a liquid material and a powder alternately. The oral cavity according to any one of claims 1 to 7, wherein the second dental resin material is any one selected from the group consisting of polyethylene-based resin, polyurethane-based resin, and acrylic-based resin. Sensing device. The electronic device is
Sensors that sense biological information and
A battery that supplies power to the sensor and
A signal processing unit that receives power from the battery and generates digital data based on the output signal from the sensor.
A memory for storing the digital data and
A wireless transmitter / receiver that receives power from the battery and transmits the digital data stored in the memory to the network connector in response to a signal sent from the network connector.
The intraoral sensing device according to any one of claims 1 to 16. The sensors include a temperature sensor, an acceleration sensor, a gyro sensor, a pressure sensor, a strain sensor, a pulse wave sensor that measures pulse waves using light, a pulse oximeter that measures blood oxygen concentration using light, and light. The intraoral sensing device according to claim 17, which comprises at least one selected from the group consisting of a heart rate sensor for measuring heart rate and a laser sensor for measuring blood flow using laser light. The oral sensing device according to any one of claims 1 to 18, wherein the oral device is an orthodontic device, a denture, or an implant. The oral sensing device according to any one of claims 1 to 19, wherein the oral device is made of a material capable of transmitting light having a wavelength in the range of 400 to 1000 nm. .. The method for manufacturing an intraoral sensing device according to claim 2.
Prepare electronic devices with electronic components mounted on the circuit board,
Cover all the electronic devices with the first dental resin material and
Prepare a tooth mold that matches the teeth and gingiva of the user who will be wearing the intraoral sensing device.
The electronic device covered with the first dental resin material is placed on the tooth mold and placed on the tooth mold.
The tooth mold is pressed against a material for manufacturing an oral instrument to perform embossing molding, and an oral instrument having a first recess in which the electronic device covered with the first dental resin material is accommodated is formed.
With the electronic device covered with the first dental resin material housed in the first recess, the oral appliance is removed from the tooth mold.
The electronic device covered with the first dental resin material so as to cover the entire first dental resin material and adhere to the inside of the first recess of the oral appliance. Cover with a second dental resin material,
A method for manufacturing an intraoral sensing device. The method for manufacturing an intraoral sensing device according to claim 3.
Prepare an electronic device with an electronic device mounted on the circuit board,
Cover all the electronic devices with the first dental resin material and
The thickness of at least two or more corners of the surface facing the bottom surface is the other, with one of the wide surfaces of the first dental resin material as the bottom surface and covering the entire surface of the first dental resin material. The electronic device covered with the first dental resin material is covered with the second dental resin material so as to be thinner than the thickness of the portion.
Prepare a tooth mold that matches the teeth and gingiva of the user who will be wearing the intraoral sensing device.
The electronic device covered with the first dental resin material and the second dental resin material is placed on the tooth mold.
The tooth mold is pressed against a material for manufacturing an oral appliance to perform embossing molding, and a first recess in which the electronic device covered with the first dental resin material and the second dental resin material is accommodated is formed. Mold the oral device to have
With the electronic device covered with the first dental resin material and the second dental resin material housed in the first recess, the oral appliance is removed from the tooth mold.
A method for manufacturing an intraoral sensing device. The method for manufacturing an intraoral sensing device according to claim 4.
Prepare an electronic device with an electronic device mounted on the circuit board,
Cover all the electronic devices with the first dental resin material and
It covers the entire surface of the first dental resin material, and has one of the wide surfaces of the first dental resin material as the bottom surface, and at least two or more surfaces corresponding to the side surfaces with respect to the bottom surface. The electronic device covered with the first dental resin material is covered with the second dental resin material so that the second recess is provided.
Prepare a tooth mold that matches the teeth and gingiva of the user who will be wearing the intraoral sensing device.
The electronic device covered with the first dental resin material and the second dental resin material is placed on the tooth mold.
The tooth mold is pressed against a material for manufacturing an oral appliance to perform embossing molding, and a first recess in which the electronic device covered with the first dental resin material and the second dental resin material is accommodated is formed. Mold the oral device to have
With the electronic device covered with the first dental resin material and the second dental resin material housed in the first recess, the oral appliance is removed from the tooth mold.
A method for manufacturing an intraoral sensing device. The method for manufacturing an intraoral sensing device according to claim 6.
Prepare an electronic device with an electronic device mounted on the circuit board,
Cover all the electronic devices with the first dental resin material and
The first dental resin material is entirely covered, and one of the wide surfaces of the first dental resin material is used as the bottom surface, and at least two or more surfaces corresponding to the side surfaces with respect to the bottom surface are second or more. The electronic device covered with the first dental resin material is covered with the second dental resin material so that the protrusions of the above are provided.
Prepare a tooth mold that matches the teeth and gingiva of the user who will be wearing the intraoral sensing device.
The electronic device covered with the first dental resin material and the second dental resin material is placed on the tooth mold.
The tooth mold is pressed against a material for manufacturing an oral appliance to perform embossing molding, and a first recess in which the electronic device covered with the first dental resin material and the second dental resin material is accommodated is formed. Mold the oral device to have
With the electronic device covered with the first dental resin material and the second dental resin material housed in the first recess, the oral appliance is removed from the tooth mold.
A method for manufacturing an intraoral sensing device.

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