JP2021057227A - Self-luminous panel and manufacturing method of the same - Google Patents

Abstract

To provide a self-luminous panel whose luminescent layer is formed by a coating method, in which the film thickness irregularity of a functional layer is suppressed and unevenness in emission intensity is reduced even when forming a weir for defects in a barrier.SOLUTION: A self-luminous panel in which a non-display area is adjacent in a column direction to a display area in which light-emitting devices are arranged in a matrix shape as viewed in a plan view, the self-luminous panel including a plurality of pixel electrodes arranged above a substrate on the display area, a plurality of barriers that extend in the column direction in the display region and divide the pixel electrodes in the column direction, a first luminescent layer that is a coating film disposed in a first gap of gaps between tow barriers, a third luminescent layer that is disposed in a third gap separated from the first gap in the column direction and is a coating film made of the same material as the first luminescent layer, an outer barrier that defines a strip-shaped external gap in the non-display region, and a counter electrode that is disposed above the first and third luminescent layers, the first and third gaps being communicated with each other through the external gap.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to a display panel using a self-luminous element utilizing an electroluminescent phenomenon and a quantum dot effect, and a method for manufacturing the same.

In recent years, display devices using self-luminous elements such as organic EL elements utilizing the electroluminescent phenomenon of organic materials and QLEDs utilizing the quantum dot effect are becoming widespread.

The self-luminous element has a structure in which at least a light emitting layer is sandwiched between an anode and a cathode. Currently, as a method for efficiently forming a functional layer including a light emitting layer, an ink containing a functional material is applied by a wet process to form the functional layer. In the wet process, the manufacturing equipment can be miniaturized as compared with the vacuum vapor deposition equipment, and it is not necessary to use the shadow mask used when depositing the functional material. Therefore, there is no need to perform work such as positioning the shadow mask, and it is easy to manufacture a large substrate with a mixture of panel sizes in consideration of mass productivity and mass productivity, which is suitable for efficient panel generation. .. Further, unlike the thin-film deposition method, in the wet process, the efficiency of using functional materials such as expensive light-emitting materials is improved, so that the panel manufacturing cost can be reduced. Further, in the wet process, a plurality of self-luminous elements including the same functional layer are arranged in a row as an element row, and the functional layer is formed for each element row, thereby forming the functional layer more efficiently and between the elements. It is possible to suppress variations in the thickness of the functional layer of the above (see, for example, Patent Document 1).

JP-A-2010-192215 Japanese Unexamined Patent Publication No. 2016-7992

In the wet process, a partition wall formed for each subpixel called a bank is required to separately print the luminescent material for forming the functional layer and the ink in which the functional material is dissolved. On the other hand, in the manufacturing process of the display panel, defects such as partial breakage of the bank and adhesion of foreign matter may occur. If the functional layer is formed in the presence of such defects, the inks applied to the two regions to be partitioned by the defective partition wall may be mixed and cause serious display defects such as color mixing. Therefore, for example, as disclosed in Patent Document 2, there is a repair technique that suppresses the spread of color mixing by forming a weir so as to surround the defect of the partition wall.

However, when a weir is formed, the formation region of the functional layer partitioned by the partition wall is further subdivided by the weir. Therefore, in particular, when the area of the functional layer is not sufficiently large with respect to the area of the light emitting element, it is not possible to sufficiently suppress the variation in the film thickness of the functional layer between the elements, which is caused by the uneven film thickness of the functional layer. Variations in emission intensity may occur.

The present disclosure has been made in view of the above problems, and is a self-luminous panel in which the light emitting layer is formed by a coating method, and even if a weir is formed for defects in the partition wall, the film thickness of the functional layer is uneven. It is an object of the present invention to provide a self-luminous panel that suppresses and suppresses variations in light emission intensity, and a method for manufacturing the same.

The self-luminous panel according to one aspect of the present disclosure is a self-luminous panel in which a non-display area is adjacent in a column direction to a display area in which light emitting elements are arranged in a matrix when viewed in a plan view. In the row direction, a plurality of pixel electrodes arranged above the substrate, a plurality of partition walls arranged above the substrate in the display area, and extending in the column direction to partition the plurality of pixel electrodes in the row direction. The first light emitting layer, which is a coating film arranged in the first gap among the gaps between the two partition walls adjacent to the first space, and the second gap adjacent to the first gap in the row direction, are arranged in the first gap. A coating film made of the same material as the first light emitting layer, which is arranged in a second light emitting layer having a light emitting color different from that of the first light emitting layer and a third gap separated from the first gap in the row direction. A light emitting layer of 3, an external partition wall arranged above the substrate and partitioning a band-shaped outer gap in the non-display region, the first light emitting layer, the second light emitting layer, and the third light emitting layer. It is characterized in that the first gap and the third gap are communicated with each other via the outer gap.

According to the self-luminous panel of the above aspect, since the first gap in which the first light emitting layer is formed and the third gap in which the third light emitting layer is formed are communicated by an external gap, the first gap or the first gap or Even if a weir is formed in the third gap, the area where the light emitting layer is formed does not become small. Therefore, since the film thickness of the light emitting layer is highly uniform regardless of the presence or absence of the weir, it is possible to suppress variations in the light emission intensity between the light emitting elements that emit light of the same color.

It is a schematic block diagram which shows the circuit structure of the display device 1 which concerns on Embodiment 1. FIG. It is a schematic diagram which shows the circuit structure in each sub-pixel of the display panel 10 which concerns on Embodiment 1. FIG. It is a schematic plan view of the display panel 10 which concerns on Embodiment 1. FIG. It is an enlarged plan view of the part A0 in FIG. It is a perspective view of a part of a substrate at the stage of forming a column bank and a row bank. It is a schematic cross-sectional view of AA in FIG. It is a figure which shows typically the defective part of a column bank. (A) to (c) are diagrams schematically showing defective portions of column banks. It is a figure which shows typically the color mixing occurs in the defective part of a column bank. It is a figure which shows typically the weir formed by repairing a row bank. It is a figure which shows typically that the range of a mixed color region is limited by the formation of a weir. It is a figure which shows typically the influence which the relative position in the display area 10p of a weir has on a light emitting layer, (a) is a state which a weir is far from the boundary between a display area 10p and a non-display area 10q, (b) is a state. The weir shows a state close to the boundary between the display area 10p and the non-display area 10q. It is a figure which shows typically the influence on the light emitting layer by the distance between a weir and a boundary between a display area 10p and a non-display area 10q. It is a figure which shows typically the influence of the weir on the light emitting layer in the display panel 10 which concerns on Embodiment 1. FIG. (A) to (c) are schematic plan views of the display panel 10 according to the second embodiment. It is a flowchart which shows the manufacturing process of the display panel 10 which concerns on Embodiment 1. FIG. It is a partial cross-sectional view schematically showing a part of the manufacturing process of the display panel which concerns on Embodiment 1. FIG. (A) is a partial cross-sectional view showing a state in which a TFT layer is formed on a base material. (B) is a partial cross-sectional view showing a state in which an interlayer insulating layer is formed on the TFT layer. (C) is a partial cross-sectional view showing a state in which a pixel electrode material layer is formed on an interlayer insulating layer. (D) is a partial cross-sectional view showing a state in which a pixel electrode material layer is patterned to form a pixel electrode. It is a partial cross-sectional view schematically showing a part of the manufacturing process of the display panel which concerns on Embodiment 1. FIG. (A) is a partial cross-sectional view showing a state in which a row bank material layer is formed on a pixel electrode and an interlayer insulating layer. (B) is a partial cross-sectional view showing a state in which a row bank is formed. (C) is a partial cross-sectional view showing a state in which the material ink of the hole injection layer is applied into the opening of the row bank to form the hole injection layer. (D) is a partial cross-sectional view showing a state in which the material ink of the hole transport layer is applied in the opening of the row bank to form the hole transport layer. It is a partial cross-sectional view schematically showing a part of the manufacturing process of the display panel which concerns on Embodiment 1. FIG. (A) is a partial cross-sectional view showing a state in which the material ink of the light emitting layer is applied into the opening of the row bank to form the light emitting layer. (B) is a partial cross-sectional view showing a state in which an electron transport layer is formed on a row bank and a light emitting layer. (C) is a partial cross-sectional view showing a state in which an electron injection layer is formed on an electron transport layer. It is a partial cross-sectional view schematically showing a part of the manufacturing process of the display panel which concerns on Embodiment 1. FIG. (A) is a partial cross-sectional view showing a state in which a counter electrode is formed on the electron injection layer. (B) is a partial cross-sectional view showing a state in which a sealing layer is formed on the counter electrode.

<< Background to one aspect of this disclosure >>
When the functional layer is formed by the coating method, the ink in which the material is dissolved is applied to the partition gap. Hereinafter, the functional layer formed by the coating method in this way is referred to as a coating film. As described above, since the partition wall prevents the ink from getting over and defines the formation range of the coating film, if a defect occurs, it may cause a serious display defect such as color mixing due to the mixing of the ink. More specifically, if there is a defect 3 due to a foreign substance as shown in FIGS. 7, 8 (a) and 8 (b), and a defect 3 due to a partial breakage of the partition wall as shown in FIG. 8 (c), a defect is present. The partition wall (row bank) 14Y in which 3 is present cannot prevent the ink from getting over, and a color mixing region as shown in FIG. 9 is generated. Therefore, as shown in FIG. 10, by forming the weir 5 so as to surround the defect of the partition wall, the color mixing region SA is limited to a narrow region surrounded by the weir 5 and the partition wall 14Y as shown in FIG. There is a repair technique to do.

However, when the weir 5 is formed, the gap 14a, which is the formation range of the coating film, is divided into two partial regions SB. As shown in FIG. 12A, when the areas of the two partial regions SB1 and SB2 are sufficiently large with respect to the area of the light emitting element, the influence of the weir 5 is not large. However, as shown in FIG. 12B, when at least one of the areas of the two partial regions SB1 and SB2 cannot be said to be sufficiently large with respect to the area of the light emitting element, the partial region SB1 having a narrow area contains ink. Since the drying conditions such as the wet spread range and the flow range during drying are different from those of other parts in the self-luminous panel, the film thickness and film are different from the functional layer formed in the partial region SB2 and the gap 14a adjacent in the row direction. The shape may be different. Therefore, the closer the weir 5 is to the long end of the gap 14a, the greater the influence on the film thickness of the functional layer, especially in a narrow region sandwiched between the weir 5 and the long end of the gap 14a. The emission intensity varies due to the uneven film thickness of the functional layer, and a display abnormality may occur in which the partial region SB1 having different brightness is conspicuously visible.

In view of the above problems, the inventor has studied a configuration for suppressing uneven film thickness of the functional layer even if a weir is formed for defects in the partition wall, and has reached the present disclosure.

≪Aspect of disclosure≫
The self-luminous panel according to one aspect of the present disclosure is a self-luminous panel in which a non-display area is adjacent in a column direction to a display area in which light emitting elements are arranged in a matrix when viewed in a plan view. In the row direction, a plurality of pixel electrodes arranged above the substrate, a plurality of partition walls arranged above the substrate in the display area, and extending in the column direction to partition the plurality of pixel electrodes in the row direction. The first light emitting layer, which is a coating film arranged in the first gap among the gaps between the two partition walls adjacent to the first space, and the second gap adjacent to the first gap in the row direction, are arranged in the first gap. A coating film made of the same material as the first light emitting layer, which is arranged in a second light emitting layer having a light emitting color different from that of the first light emitting layer and a third gap separated from the first gap in the row direction. A light emitting layer of 3, an external partition wall arranged above the substrate and partitioning a band-shaped outer gap in the non-display region, the first light emitting layer, the second light emitting layer, and the third light emitting layer. It is characterized in that the first gap and the third gap are communicated with each other via the outer gap.

Further, the method for manufacturing a self-luminous panel according to one aspect of the present disclosure is to manufacture a self-luminous panel in which a non-display region is adjacent to a display region in which light emitting elements are arranged in a matrix when viewed in a plan view. In the method, pixel electrodes are formed in a matrix in the display area above the substrate, and a plurality of the pixel electrodes are extended in the column direction in the display area above the substrate to partition the plurality of pixel electrodes in the row direction. A plurality of partition walls are formed, and an outer gap communicating with both the first gap among the gaps defined by the two partition walls adjacent in the row direction and the third gap separated in the row direction from the first gap is partitioned. The outer partition wall is formed in the non-display region, and the material ink of the first light emitting layer is applied to the first gap and the third gap to form the first light emitting layer and the third light emitting layer. A second light emitting layer having a different emission color from the first light emitting layer is formed in the second gap adjacent to the first gap in the row direction, and the first light emitting layer and the second light emitting layer are formed. It is characterized in that a counter electrode is formed above the light emitting layer and the third light emitting layer.

According to the self-luminous panel of the above aspect or the method of manufacturing the self-luminous panel of the above aspect, the first gap in which the first light emitting layer is formed and the third gap in which the third light emitting layer is formed are external. Since the gaps communicate with each other, even if a weir is formed in the first gap or the third gap, the area where the light emitting layer is formed is not reduced. Therefore, since the film thickness of the light emitting layer is highly uniform regardless of the presence or absence of the weir, it is possible to suppress variations in the light emission intensity between the light emitting elements that emit light of the same color.

Further, in the self-luminous panel of the above aspect or the method of manufacturing the self-luminous panel of the above aspect, the following may be performed.

The partition wall defining the first gap and the partition wall defining the third gap may be continuous via the outer partition wall.

As a result, the first gap, the outer gap, and the third gap are seamlessly communicated with each other, so that the material ink of the light emitting layer can flow between the first gap and the third gap without stagnation. Uniformity can be improved.

Further, in the outer gap, a dummy light emitting layer made of the same material as both the first light emitting layer and the third light emitting layer and formed as a coating film is formed, and the first light emitting layer and the said third light emitting layer are formed. It may be assumed that the third light emitting layer is continuous with the dummy light emitting layer.

As a result, the film forming conditions of the first light emitting layer and the film forming conditions of the third light emitting layer can be brought close to each other, so that the uniformity of the film thickness of the light emitting layer can be improved.

Further, a fourth light emitting layer arranged above the pixel electrode in the fourth gap adjacent to the third gap in the row direction and made of the same material as the second light emitting layer and formed as a coating film. A second external partition wall is further provided above the substrate and which partitions a band-shaped second external gap in the non-display region, and the second light emitting layer is formed as a coating film to define the second gap. The partition wall and the partition wall defining the fourth gap are continuous via the second outer partition wall, so that the second gap and the fourth gap communicate with each other via the second outer gap. It may be.

Further, a second outer partition wall for partitioning the second outer gap communicating with both the second gap and the fourth gap adjacent to the third gap in the row direction is formed in the non-display region, and the second gap is formed. In the formation of the light emitting layer, the material ink of the second light emitting layer may be applied, and the material ink of the second light emitting layer may be applied to the fourth gap to form the fourth light emitting layer. ..

As a result, even when a weir is formed in the second gap where the second light emitting layer is formed or the fourth gap where the fourth light emitting layer is formed, the emission intensity between the light emitting elements that emit light in the same color is high. Variation can be suppressed.

Further, the first gap, the second gap, the fourth gap, and the third gap may be arranged in the row direction in this order.

As a result, it is possible to easily realize a configuration in which the first gap and the third gap are communicated with each other and the second gap and the fourth gap are communicated with each other.

Further, a fifth light emitting layer arranged above the pixel electrode in the fifth gap separated from the third gap in the row direction and made of the same material as the first light emitting layer and formed as a coating film. A partition wall that is arranged above the substrate and further includes a third external partition wall that partitions the band-shaped third external gap in the non-display region, and a partition wall that defines the third gap and a partition wall that defines the fifth gap. The third gap and the fifth gap may be communicated with each other through the third outer gap because the third gap is continuous through the third outer partition wall.

Further, a third outer partition wall for partitioning the third outer gap communicating with both the third gap and the fifth gap separated from the third gap in the row direction is formed in the non-display region, and the fifth gap is formed. The material ink of the first light emitting layer may be applied to the gap to form the fifth light emitting layer.

As a result, the material ink of the light emitting layer can flow between the first gap and the third gap, and between the third gap and the fifth gap, so that the variation in the film thickness of the light emitting layer is further suppressed. be able to.

Further, a fifth light emitting layer, which is arranged above the pixel electrode in the fifth gap separated from the third gap in the row direction and is made of the same material as the first light emitting layer and is formed as a coating film, is further provided. In addition, the first gap, the third gap, and the fifth gap may be continuous via the external gap.

Further, in the formation of the outer partition wall, the outer gap communicates with all of the first gap, the third gap, and the fifth gap separated from the third gap in the row direction. Is formed, and the material ink of the first light emitting layer is applied to the fifth gap to form the fifth light emitting layer.

As a result, the material ink of the light emitting layer can flow in all of the first gap, the third gap, and the fifth gap, so that the variation in the film thickness of the light emitting layer can be further suppressed.

Further, a weir extending in the row direction and dividing the first light emitting layer in the column direction may be provided in the first gap.

Further, the weir may be formed above one or more pixel electrodes, and the light emitting element may not exist in the region where the pixel electrodes exist when viewed in a plan view.

Further, the defect of the partition wall may be detected, and when the defect is detected, the weir may be formed so that the defect is surrounded by the partition wall and the weir.

As a result, even when a defect is present in the partition wall, color mixing and the like can be suppressed, and further, variation in the film thickness of the light emitting layer can be suppressed.

<< Embodiment 1 >>
1. 1. Configuration of Display Device Hereinafter, an embodiment of a display device (hereinafter, simply referred to as “display device”) using an organic EL display panel as the self-luminous display panel according to the present disclosure will be described.

(1) Circuit Configuration of Display Device 1 FIG. 1 is a block diagram showing a circuit configuration of the display device 1.

As shown in FIG. 1, the display device 1 includes an organic EL display panel 10 (hereinafter, referred to as “display panel 10”) and a drive control circuit unit 200 connected to the organic EL display panel 10.

The display panel 10 is an organic EL (Electro Luminescence) panel that utilizes the electroluminescence phenomenon of an organic material, and is configured such that a plurality of organic EL elements are arranged in a matrix (matrix), for example.

The drive control circuit unit 200 is composed of four drive circuits 210 to 240 and a control circuit 250.

(2) Circuit Configuration of Display Panel 10 In the display panel 10, a plurality of unit pixels 100e are arranged in a matrix to form a display area. Each unit pixel 100e is composed of three organic EL elements, that is, three sub-pixels 100se that emit light in three colors of R (red), G (green), and B (blue). The circuit configuration of each sub-pixel 100se will be described with reference to FIG.

FIG. 2 is a circuit diagram showing a circuit configuration of the organic EL element 100 corresponding to each sub-pixel 100se of the display panel 10 used in the display device 1.

As shown in FIG. 2, in the display panel 10 according to the present embodiment, each sub-pixel 100se includes two transistors Tr1 and Tr2, one capacitor C, and an organic EL element unit EL as a light emitting unit. Has been done. The transistor Tr1 is a driving transistor, and the transistor Tr2 is a switching transistor.

The gate G2 of the switching transistor Tr2 is connected to the scanning line Vscn, and the source S2 is connected to the data line Vdat. The drain D2 of the switching transistor Tr2 is connected to the gate G1 of the drive transistor Tr1.

The drain D1 of the drive transistor Tr1 is connected to the power supply line Va, and the source S1 is connected to the pixel electrode (anode) of the organic EL element unit EL. The common electrode (counter electrode: cathode) in the organic EL element part EL is connected to the ground line Vcat.

The first end of the capacitor C is connected to the drain D2 of the switching transistor Tr2 and the gate G1 of the drive transistor Tr1, and the second end of the capacitor C is connected to the power supply line Va.

In the display panel 10, a plurality of adjacent sub-pixels 100se (for example, three sub-pixels 100se of emission colors of red (R), green (G), and blue (B)) are combined to form one unit pixel 100e. However, each unit pixel 100e is arranged so as to be distributed to form a pixel region.

Then, a gate line is drawn out from the gate G2 of each sub-pixel 100se, and is connected to a scanning line Vscn connected from the outside of the display panel 10. Similarly, a source line is drawn from the source S2 of each sub-pixel 100se and connected to a data line Vdat connected from the outside of the display panel 10.

Further, the power supply line Va of each sub-pixel 100se and the grounding line Vcat of each sub-pixel 100se are integrated and connected to the power supply line and the grounding line of the display device 1.

The drive circuit of each organic EL element is not limited to the above, and other configurations may be used.

(3) Overall Configuration of Display Panel 10 (3-1) Outline of Display Panel 10 The display panel 10 according to the present embodiment will be described with reference to the drawings. The drawings are schematic views, and the scale may differ from the actual ones.

FIG. 3 is a schematic plan view of the display panel 10. The display panel 10 is an organic EL display panel that utilizes the electroluminescence phenomenon of an organic compound, and is a plurality of organic substances each constituting a pixel on a substrate 11 (TFT substrate) on which a thin film transistor (TFT) is formed. The EL elements 100 are arranged in a matrix and have a top emission type configuration that emits light from the upper surface. Here, in the present specification, the X direction, the Y direction, and the Z direction in FIG. 3 are the row direction, the column direction, and the thickness direction in the display panel 10, respectively.

As shown in FIG. 3, the display panel 10 is provided with a column bank 14Y (partition wall) and a row bank 14X (inter-pixel regulation layer) that partition the substrate 11 in a matrix and regulate the emission units of each RGB color. A distinction is made between the compartmentalized area 10a (10Xa and 10Ya in the X and Y directions, and 10a if no distinction is required) and the non-partitioned region 10b (10Xb and 10Yb in the X and Y directions, respectively) around the compartmentalized area 10a. If it is not necessary, it is set to 10b). The outer peripheral edge of the partition area 10a in the row direction corresponds to the end portion of the row bank 14Y in the row direction. A rectangular sealing member (not shown) surrounding the compartmentalized area 10a is formed in the non-partitioned region 10b. In the partition area 10a, of the areas partitioned by the column bank 14Y and the row bank 14X, the non-display area 10q including the outer peripheral portion does not contribute to the display, and the display area 10p provided inside the non-display area 10q is organic. The EL element 100 is formed.

(3-2) Outline of Organic EL Element 100 FIG. 4 is an enlarged plan view of part A0 in FIG.

In the display area 10p of the display panel 10, unit pixels (pixel areas) 100e composed of a plurality of organic EL elements 100 are arranged in a matrix without gaps. Each unit pixel 100e includes three types of self-luminous elements, a self-luminous element 100R that emits red light, a self-luminous element 100G that emits green light, and a self-luminous element 100B that emits blue light, as sub-pixels 100se. That is, the self-luminous elements 100R, 100G, and 100B arranged in the row direction form a set to form a unit pixel 100e in color display. The self-luminous elements 100R, 100G, and 100B each do not distinguish between a self-luminous region 100aR that emits red light, a self-luminous region 100aG that emits green light, and a self-luminous region 100aB that emits blue light (hereinafter, 100aR, 100aG, 100aB). Is abbreviated as "self-luminous region 100a") and non-self-luminous region 100b.

The self-luminous elements 100R, 100G, 100B have self-luminous elements 100R, 100G, 100B, 100B, 100G, 100R, 100R, 100G, 100B, 100B, 100G, 100R, ... The sub-pixels are arranged so as to be arranged in the opposite row direction between the unit pixels 100e adjacent to the unit pixel 100e.

On the display panel 10, a plurality of pixel electrodes 13 are arranged in a matrix on the substrate 11 in a state where they are separated by predetermined distances in the row and column directions, respectively. The three pixel electrodes 13 and the area up to the periphery thereof are included in the unit pixel (pixel area) 100e, and the boundary between the pixel unit 100e and the pixel unit 100e is the gap between the pixel electrodes 13 adjacent to each other in the column direction (Y direction). It is a straight line that divides in the direction and a straight line that divides the gap between the pixel electrodes 13 of the self-luminous elements 100B and 100R adjacent to the row direction (X direction) in the X direction.

The pixel electrode 13 and the pixel electrode 13 adjacent thereto are insulated from each other. An insulating layer extending in a line is provided between the adjacent pixel electrodes 13.

A column bank 14Y in which each row extends in the column direction (Y direction in FIG. 3) above the region on the substrate 11 located between one pixel electrode 13 and the pixel electrodes 13 adjacent to the pixel electrode 13 in the row direction. Are arranged side by side in multiple rows. Therefore, the row-direction outer edge of the self-luminous region 100a is defined by the row-direction outer edge of the column bank 14Y.

On the other hand, above the region on the substrate 11 located between one pixel electrode 13 and the pixel electrode 13 adjacent to the pixel electrode 13 in the column direction, each row extends in the row direction (X direction in FIG. 3). A plurality of banks 14X are arranged side by side. The region where the row bank 14X is formed is a non-self-luminous region 100b because organic electroluminescence does not occur in the light emitting layer 17 above the pixel electrode 13. Therefore, the outer edge of the self-luminous region 100a in the column direction is defined by the outer edge of the row bank 14X in the column direction.

Here, it is assumed that the pixel electrode 13 has the same shape for all the sub-pixels, and a part of the pixel electrode 13 is covered with the row bank 14X and the column bank 14Y. However, since the portion covered by the row bank 14X and the column bank 14Y does not function as an electrode, the pixel electrode 13 is not formed in the portion to be covered by the row bank 14X or the column bank 14Y. Good.

When the space between adjacent row banks 14Y is defined as the gap 14a, the gap 14a includes a red gap 14aR corresponding to the self-luminous region 100aR, a green gap 14aG corresponding to the self-luminous region 100aG, and a blue gap corresponding to the self-luminous region 100aB. There is 14aB (hereinafter, referred to as "gap 14a" when the gap 14aR, the gap 14aG, and the gap 14aB are not distinguished), and the display panel 10 adopts a configuration in which a large number of column banks 14Y and the gap 14a are alternately arranged. ..

In the display panel 10, a plurality of pixel regions 100e are arranged side by side in the column direction along the gap 14aR, the gap 14aG, and the gap 14aB so that the self-luminous region 100a and the non-self-luminous region 100b are alternately repeated. There is. The non-self-luminous region 100b has a connection recess (contact hole, not shown) that connects the pixel electrode 13 and the source S1 of the TFT, and is a contact region on the pixel electrode 13 for electrical connection to the pixel electrode 13. Is provided.

In one sub-pixel 100se, the column bank 14Y provided in the column direction and the row bank 14X provided in the row direction are orthogonal to each other, and the self-luminous region 100a is formed in the row bank 14X and the row bank 14X in the column direction. It is located between adjacent row banks 14X.

FIG. 5 is a perspective view of a part of the display panel 10 for explaining the formation state of the column bank 14Y and the row bank 14X. As shown in the figure, the height of the row bank 14X is sufficiently lower than the height of the column bank 14Y (line bank method).

With the above configuration, the liquid level of the ink discharged into each of the gaps 14aR, 14aG, and 14aB is higher than that of the row bank 14X, and the ink flows in the column direction (Y direction), so that the liquid level of the ink is flat. The film thickness fluctuates in the column direction.

(3-3) Configuration of Each Part of Display Panel 10 Hereinafter, the configuration of each part of the display panel 10 will be described. FIG. 6 is a schematic cross-sectional view corresponding to the AA cross section of FIG.

<Board>
The substrate 11 includes a base material 111 which is an insulating material and a TFT layer 112. A drive circuit is formed in the TFT layer 112 for each sub-pixel. As the base material 111, for example, a glass substrate, a quartz substrate, a plastic substrate, or the like can be adopted. As the plastic material, either a thermoplastic resin or a thermosetting resin may be used. For example, polyimide (PI), polyetherimide (PEI), polysulfone (PSu), polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate, styrene-based, polyolefin-based, polyurethane-based, Examples thereof include various thermoplastic elastomers such as, epoxy resin, unsaturated polyester, silicone resin, polyurethane, etc., or copolymers, blends, polymer alloys, etc. mainly containing these. From these, it is possible to select one type or a laminated body in which two or more types are laminated so as to have durability against the process temperature.

<Interlayer insulation layer>
The interlayer insulating layer 12 is formed on the substrate 11. The interlayer insulating layer 12 is made of a resin material and is for flattening a step on the upper surface of the TFT layer 112. Examples of the resin material include a positive type photosensitive material. Moreover, as such a photosensitive material, an acrylic resin, a polyimide resin, a siloxane resin, a phenol resin and the like can be mentioned. Further, although not shown, contact holes are formed in the interlayer insulating layer 12 for each sub-pixel.

<Pixel electrode>
The pixel electrode 13 is formed on the interlayer insulating layer 12. The pixel electrode 13 is provided for each sub-pixel and is electrically connected to the TFT layer 112 through a contact hole provided in the interlayer insulating layer 12.

In this embodiment, the pixel electrode 13 functions as a light-reflecting anode.

Specific examples of the metal material having light reflectivity include Ag (silver), Al (aluminum), aluminum alloy, Mo (molybdenum), APC (alloy of silver, palladium and copper), ARA (silver, rubidium, gold). , MoCr (alloy of molybdenum and chromium), MoW (alloy of molybdenum and tungsten), NiCr (alloy of nickel and chromium) and the like.

The pixel electrode 13 may be composed of a metal layer alone, but as a laminated structure in which a layer made of a metal oxide such as ITO (indium tin oxide) or IZO (zinc oxide) is laminated on the metal layer. May be good.

The pixel electrode 13 may function as a light-transmitting anode. At this time, the pixel electrode 13 includes at least one of a metal layer formed of a metal material and a metal oxide layer formed of a metal oxide. Examples of the material of the metal layer include a silver alloy containing Ag and Ag as main components, and an Al alloy containing Al and Al as main components. Examples of the Ag alloy include a magnesium-silver alloy (MgAg) and an indium-silver alloy. Ag basically has a low resistivity, and Ag alloy is preferable in that it is excellent in heat resistance and corrosion resistance and can maintain good electrical conductivity for a long period of time. Examples of the Al alloy include a magnesium-aluminum alloy (MgAl) and a lithium-aluminum alloy (LiAl). Examples of other alloys include lithium-magnesium alloys and lithium-indium alloys. The film thickness of the metal layer is about 1 nm to 50 nm in order to ensure the translucency. Examples of the material of the metal oxide layer include ITO and IZO. In this case as well, the metal layer alone or the metal oxide layer alone may be formed, but the laminated structure in which the metal oxide layer is laminated on the metal layer, or the metal layer is laminated on the metal oxide layer. It may be a laminated structure. Further, in the case of this configuration, at least a portion of the substrate 11 located below the pixel electrode 13 needs to have translucency.

As described above, the pixel electrode 13 may not have a portion corresponding to a part or all of the region covered by the column bank 14Y or the row bank 14X. However, in order to function as a pixel electrode, the portion that functions as a pixel electrode and the TFT need to be electrically connected.

<Column bank 14Y>
The row bank 14Y is formed on the pixel electrode 13 in a state where a part of the upper surface of the pixel electrode 13 is exposed and the peripheral region is covered. The region on the upper surface of the pixel electrode 13 that is not covered with the row bank 14Y (hereinafter, referred to as “opening”) corresponds to the subpixel. That is, the column bank 14Y has a gap 14a provided for each subpixel.

The row bank 14Y is formed on the interlayer insulating layer 12 in the portion where the pixel electrode 13 is not formed. That is, in the portion where the pixel electrode 13 is not formed, the bottom surface of the row bank 14Y is in contact with the upper surface of the interlayer insulating layer 12.

The row bank 14Y is a structure for preventing the applied ink from coming into contact with the ink of the adjacent subpixel when the hole injection layer 15, the hole transport layer 16, and the light emitting layer 17 are formed by the coating method. Function. In the row bank 14Y, the top portion and the upper portion of the side wall portion following the top portion are the liquid-repellent portion, and the portion of the side wall portion excluding the liquid-repellent portion is the parent liquid portion. The row bank 14Y is formed by adding a liquid-repellent surfactant such as a fluorine-based compound or a silicone-based compound to a base material made of an insulating resin material. As the base material which is an insulating resin material, for example, a positive photosensitive material can be used, and specific examples thereof include an acrylic resin, a polyimide resin, a siloxane resin, and a phenol resin. .. The base material is not limited to the positive type photosensitive material, and for example, a negative type photosensitive material may be used, or a non-photosensitive material may be used.

Each of the row banks 14Y has a quadrangular pyramid trapezoidal shape or a shape similar thereto, and the cross section is a forward-tapered trapezoidal shape having a taper upward or a bowl shape convex upward.

<Line bank 14X>
The row bank 14X is formed on the pixel electrode 13 in a state where a part of the upper surface of the pixel electrode 13 is exposed and the peripheral region is covered. The extending direction of the row bank 14X is orthogonal to the extending direction of the column bank 14Y. Each of the row banks 14X is formed over a plurality of gaps 14a, and in the gaps 14a, the adjacent pixel electrodes 13 are partitioned.

In the present embodiment, the row bank 14X is formed on the interlayer insulating layer 12 in the portion where the pixel electrode 13 is not formed. That is, in the portion where the pixel electrode 13 is not formed, the bottom surface of the row bank 14X is in contact with the upper surface of the interlayer insulating layer 12.

The row bank 14X electrically insulates between the pixel electrodes 13 adjacent to each other in the Y direction, and when the hole injection layer 15, the hole transport layer 16, and the light emitting layer 17 are formed by the coating method, the ink applied. This is for controlling the flow in the column direction (Y direction). The shape of the row bank 14X is a quadrangular pyramid trapezoidal shape or a shape similar thereto, and the cross section is a forward-tapered trapezoidal shape having a taper upward or a bowl shape convex upward. Further, the height of the row bank 14X from the interlayer insulating layer 12 is lower than the height of the column bank 14Y from the interlayer insulating layer 12. The row bank 14X is made of a resin material, and for example, a positive photosensitive material can be used. Specific examples of such a photosensitive material include an acrylic resin, a polyimide resin, a siloxane resin, and a phenol resin. The resin material is not limited to the positive type photosensitive material, and for example, a negative type photosensitive material may be used, or a non-photosensitive material may be used.

<Hole injection layer>
The hole injection layer 15 is provided on the pixel electrode 13 for the purpose of promoting the injection of holes (holes) from the pixel electrode 13 into the light emitting layer 17. Specific examples of the material of the hole injection layer 15 include a conductive polymer material such as PEDOT / PSS (mixture of polythiophene and polystyrene sulfonic acid). When the hole injection layer 15 is formed of a conductive polymer material, the hole injection layer 15 can be formed as a coating film by a wet process such as a coating method.

The hole injection layer 15 may be formed of an oxide of a transition metal. Specific examples of the transition metal include Ag (silver), Mo (molybdenum), Cr (chromium), V (vanadium), W (tungsten), Ni (nickel), Ir (iridium) and the like. This is because the transition metal has a plurality of oxidation numbers, so that a plurality of levels can be taken, and as a result, hole injection becomes easy and contributes to a reduction in the driving voltage. In this case, the hole injection layer 15 preferably has a large work function. When the hole injection layer 15 is formed of an oxide of a transition metal, the hole injection layer 15 can be formed by a vacuum deposition method, sputtering, or the like.

The hole injection layer 15 may have a laminated structure in which a conductive polymer material is laminated on an oxide of a transition metal. In this case, the hole injection layer 15 can be formed by forming an oxide of a transition metal by a vacuum vapor deposition method, sputtering, or the like, molding by etching, or the like, and then forming a film of a conductive polymer material by a coating method. The portion formed of the conductive polymer material becomes the coating film.

<Hole transport layer>
The hole transport layer 16 has a function of transporting the holes injected from the hole injection layer 15 to the light emitting layer 17, and efficiently transports the holes from the hole injection layer 15 to the light emitting layer 17. It is made of an organic material with high hole mobility. The hole transport layer 16 is formed by applying and drying an organic material solution. As the organic material forming the hole transport layer 16, polyfluorene or a derivative thereof, or a polymer compound such as polyarylamine or a derivative thereof can be used.

<Light emitting layer>
The light emitting layer 17 is formed in the gap 14a. The light emitting layer 17 has a function of emitting light of each color of R, G, and B by recombination of holes and electrons. As the material of the light emitting layer 17, a known material can be used.

When the light emitting element 100 is an organic EL element, examples of the organic light emitting material contained in the light emitting layer 17 include an oxinoid compound, a perylene compound, a coumarin compound, an azacmarin compound, an oxazole compound, an oxaziazole compound, a perinone compound, and pyrolopyrrole. Compounds, naphthalene compounds, anthracene compounds, fluorene compounds, fluoranthene compounds, tetracene compounds, pyrene compounds, coronen compounds, quinolone compounds and azaquinolone compounds, pyrazoline derivatives and pyrazolone derivatives, rhodamine compounds, chrysene compounds, phenanthrene compounds, cyclopentadiene compounds, stillben compounds , Diphenylquinone compound, styryl compound, butadiene compound, dicyanomethylenepyran compound, dicyanomethylenethiopyran compound, fluorescein compound, pyririum compound, thiapyrrium compound, selenapyrium compound, tellropyrylium compound, aromatic aldaziene compound, oligophenylene compound, thioxanthene Fluorescent substances such as compounds, cyanine compounds, acrydin compounds, metal complexes of 8-hydroxyquinolin compounds, metal complexes of 2-bipyridine compounds, complexes of shift salts and Group III metals, oxine metal complexes, and rare earth complexes can be used. .. Further, a known phosphorescent substance such as a metal complex that emits phosphorescence such as tris (2-phenylpyridine) iridium can be used. Further, the light emitting layer 17 is formed by using polyfluorene or a derivative thereof, polyphenylene or a derivative thereof, a polymer compound such as polyarylamine or a derivative thereof, or a mixture of the low molecular weight compound and the high molecular weight compound. May be good. The light emitting element 100 may be a quantum dot light emitting device (QLED; Quantum-dot Light Emitting Diode), and a material having a quantum dot effect can be used as the material of the light emitting layer 17.

It is preferable that a coating film made of the same material as the light emitting layer 17 is formed on the row bank 14X, and the light emitting layer 17 is continuous between two sub-pixels adjacent to each other in the column direction across the row bank 14X. ..

<Electron transport layer>
The electron transport layer 18 is formed on the light emitting layer 17 and the row bank 14Y in common with the plurality of pixels, and has a function of transporting the electrons injected from the counter electrode 20 to the light emitting layer 17. The electron transport layer 18 is formed by using, for example, an oxadiazole derivative (OXD), a triazole derivative (TAZ), a phenanthroline derivative (BCP, Bphen), or the like.

The electron transport layer 18 is formed, for example, by forming a material such as an oxadiazole derivative, a triazole derivative, or a phenanthroline derivative in common to a plurality of pixels by a thin-film deposition method. The electron transport layer 18 may be formed by a coating method. In this case, the electron transport layer 18 may be formed for each pixel as in the light emitting layer 17 and the like.

<Electron injection layer>
The electron injection layer 19 is provided on the electron transport layer 18 in common with a plurality of pixels, and has a function of promoting the injection of electrons from the counter electrode 20 into the light emitting layer 17.

The electron injection layer 19 is formed by, for example, doping an organic material having electron transportability with a metal material for improving electron injection property. Here, the dope means to disperse the metal atoms or metal ions of the metal material substantially evenly in the organic material, and specifically, to form a single phase containing the organic material and a trace amount of the metal material. Point to that. It is preferable that no other phase, particularly a phase composed of only a metal material such as a metal piece or a metal film, or a phase containing a metal material as a main component exists. Further, in a single phase containing an organic material and a trace amount of metal material, the concentration of metal atoms or metal ions is preferably uniform, and the metal atoms or metal ions are preferably not aggregated. The metal material is preferably selected from alkali metals, alkaline earth metals, and rare earths, and Ba or Li is more preferable. In this embodiment, Ba is selected. The doping amount of the metal material in the electron injection layer 19 is preferably 5 to 40 wt%. In this embodiment, it is 20 wt%. Examples of the organic material having electron transporting property include π-electron low molecular weight organic materials such as an oxadiazole derivative (OXD), a triazole derivative (TAZ), and a phenanthroline derivative (BCP, Bphen).

The electron injection layer 19 has a layer containing a metal fluoride selected from an alkali metal or an alkaline earth metal or a quinolinium complex of a metal selected from an alkali metal or an alkaline earth metal on the light emitting layer 17 side. You may have.

The electron injection layer 19 is formed by, for example, forming a film of a material such as an oxadiazole derivative, a triazole derivative, or a phenanthroline derivative and a metal material in common to a plurality of pixels by a co-evaporation method. The electron injection layer 19 may be formed by a coating method. In this case, the electron injection layer 19 may be formed for each pixel as in the light emitting layer 17 and the like.

<Counter electrode>
The counter electrode 20 is formed on the electron injection layer 19 in common with a plurality of pixels, and functions as a cathode.

In the present embodiment, the counter electrode 20 has both translucency and conductivity, and includes at least one of a metal layer formed of a metal material and a metal oxide layer formed of a metal oxide. There is. The film thickness of the metal layer is about 1 nm to 50 nm in order to ensure the translucency. Examples of the material of the metal layer include a silver alloy containing Ag and Ag as main components, and an Al alloy containing Al and Al as main components. Examples of the Ag alloy include a magnesium-silver alloy (MgAg) and an indium-silver alloy. Ag basically has a low resistivity, and Ag alloy is preferable in that it is excellent in heat resistance and corrosion resistance and can maintain good electrical conductivity for a long period of time. Examples of the Al alloy include a magnesium-aluminum alloy (MgAl) and a lithium-aluminum alloy (LiAl). Examples of other alloys include lithium-magnesium alloys and lithium-indium alloys. Examples of the material of the metal oxide layer include ITO and IZO.

The cathode may be composed of a metal layer alone or a metal oxide layer alone, but has a laminated structure in which a metal oxide layer is laminated on a metal layer, or a metal layer is laminated on a metal oxide layer. It may be a laminated structure.

When the pixel electrode 13, the interlayer insulating layer 12 under the pixel electrode 13, and the substrate 11 are translucent, the counter electrode 20 may be a light-reflecting electrode. In this case, Ag, Al, Al alloy, Mo, APC, ARA, MoCr, MoW, and NiCr can be used as the material of the counter electrode 20.

<Encapsulation layer>
A sealing layer 21 is provided on the counter electrode 20. The sealing layer 21 prevents impurities (water, oxygen) from invading the counter electrode 20, the electron injection layer 19, the electron transport layer 18, the light emitting layer 17, etc. from the opposite side of the substrate 11, and these layers due to impurities. Has a function of suppressing deterioration of. The sealing layer 21 is formed by using a translucent material such as silicon nitride (SiN) or silicon oxynitride (SiON). Further, a sealing resin layer made of a resin material such as an acrylic resin or an epoxy resin may be provided on a layer formed by using a material such as silicon nitride (SiN) or silicon oxynitride (SiON).

In the present embodiment, since the organic EL display panel 10 is a top emission type, the sealing layer 21 needs to be formed of a light-transmitting material.

(3-4) Outline of Non-Display Area 10q As shown in FIG. 4, external partition walls 14L1 to 14L4 (referred to as external partition walls 14L unless otherwise specified) are arranged in the non-display area 10q of the display panel 10. The outer gaps 14DR, 14DG, and 14DB (referred to as the outer gap 14D unless otherwise specified) are present, which are partitioned by the outer partition walls 14L1 to 14L4. Each of the outer partition walls 14L1 to 14L4 is made of the same material as the row bank 14Y, and has the same cross-sectional shape in the direction orthogonal to the stretching direction. More specifically, the outer partition walls 14L1 to 14L4 are formed continuously with the row bank 14Y. The outer bulkhead 14L1 and the outer bulkhead 14L2 are continuously formed with three bulkheads 14Y defining two gaps 14aR adjacent in the row direction, and a U-shaped outer gap defined by the outer bulkhead 14L1 and the outer bulkhead 14L2. The 14DR communicates with the two gaps 14aR. Similarly, the outer bulkhead 14L3 is continuously formed with the two bulkheads 14Y defining the two gaps 14aG, and the U-shaped outer gap 14DG defined by the outer bulkhead 14L2 and the outer bulkhead 14L3 has two gaps. It communicates with 14aG. Similarly, the outer partition wall 14L4 is continuously formed with the two partition walls 14Y defining the two gaps 14aB, and the U-shaped outer gap 14DB defined by the outer partition wall 14L3 and the outer partition wall 14L4 has two gaps. It communicates with 14aB.

As a result, the two gaps 14aR adjacent to each other in the row direction form a loop via the two outer gaps 14DR, and the material ink of the functional layer applied to the two gaps 14aR forms the outer gap 14DR. It is possible to flow with each other through. Similarly, the two gaps 14aG adjacent to each other in the row direction form a loop via the two outer gaps 14DG, and the material ink of the functional layer applied to the two gaps 14aG forms the outer gap 14DG. It is possible to flow with each other through. Similarly, the two gaps 14aB adjacent to each other in the row direction form a loop via the two outer gaps 14DB, and the material ink of the functional layer applied to the two gaps 14aB forms the outer gap 14DB. It is possible to flow with each other through.

Since the material ink of the same functional layer as the gap 14aR is directly applied to the outer gap 14DR or indirectly applied through the gap 14aR, the outer gap 14DR is at least with the functional layer as a coating film formed in the gap 14aR. A coating film made of the same material is formed with the same film thickness and the same stacking order as the gap 14aR. More specifically, in the outer gap 14DR, a dummy hole injection layer 15D made of the same material as the hole injection layer 15, a dummy hole transport layer 16D made of the same material as the hole transport layer 16, and a red light emitting layer 17R Dummy red light emitting layers 17DR made of the same material as above are laminated in this order. Similarly, the outer gap 14DG has a dummy hole injection layer 15D made of the same material as the hole injection layer 15, a dummy hole transport layer 16D made of the same material as the hole transport layer 16, and the same material as the green light emitting layer 17G. Dummy green light emitting layers 17DG made of the above are laminated in this order. In the outer gap 14DB, a dummy hole injection layer 15D made of the same material as the hole injection layer 15, a dummy hole transport layer 16D made of the same material as the hole transport layer 16, and a dummy made of the same material as the blue light emitting layer 17B. The blue light emitting layers 17DB are laminated in this order.

A dummy pixel electrode 13D and a dummy electron transport layer 18D may be further formed in the outer gaps 14DR, 14DG, and 14DB. Further, the electron injection layer 19 and the counter electrode 20 may be formed on the dummy red light emitting layer 17DR, the dummy green light emitting layer 17DG, and the dummy blue light emitting layer 17DB.

2. Effects of External Gap 14DR, 14DG, 14DB According to the Embodiment Hereinafter, the effects of the external gaps 14DR, 14DG, 14DB according to the embodiment will be described with reference to a schematic diagram. First, the defect of the column bank 14Y, which is a prerequisite, and its repair (repair) will be described, and then the relationship between the weir 5 formed by the repair and the external gaps 14DR, 14DG, and 14DB will be described.

(1) Outline of Defects in Column Bank 14Y The defect portion 3 of the column bank 14Y will be described with reference to the schematic views of FIGS. 7 and 8. 7 and 8 are schematic perspective views of a display panel in which one row bank 14Y has a defective portion 3.

In the example shown in FIG. 7, foreign matter adheres to one row bank 14Y to form a defective portion 3. When foreign matter is present on the column bank 14Y in this way, when ink is applied to the gaps 14a adjacent to each other in the row direction across the column bank 14Y, the ink comes into contact with the foreign matter, and different types of ink come into contact with the foreign matter. There is a risk that the ink (for example, the material ink of the red light emitting layer and the material ink of the green light emitting layer) will be mixed.

In the example shown in FIG. 8A, a foreign substance enters one row bank 14Y, and the foreign substance penetrates the wall surface of the row bank 14Y to the adjacent gap 14a to form a defective portion 3. In the example shown in FIG. 8B, foreign matter enters under one row bank 14Y, and the foreign matter penetrates the wall surface of the row bank 14Y to the adjacent gap 14a to form a defective portion 3. In this way, even when the foreign matter exists in or under the row bank 14Y, an ink flow path is formed in the gap between the foreign matter and the row bank 14Y due to the poor adhesion between the foreign matter and the row bank 14Y. In addition, since the foreign matter is a material that absorbs ink such as a fiber piece, the foreign matter itself becomes an ink flow path, and the ink exchange cannot be suppressed between the gaps 14a adjacent to each other with the foreign matter in between, and there is a defect. Become.

In the example shown in FIG. 8C, a part of the column bank 14Y is broken to form a defective portion 3. Such a collapse of the row bank 14Y is caused by, for example, in the exposure process in the film forming process of the row bank 14Y, the exposure to the positive photoresist which is the material of the row bank 14Y is locally excessive, or the row bank 14Y is broken. It occurs due to local inadequate exposure to the negative type photoresist, which is the material of 14Y. Even in such a case, the ink exchange cannot be suppressed between the adjacent gaps 14a via the fractured portion, and a defect exists.

FIG. 9 is a planar schematic showing a state in which the material ink of the red light emitting layer 17R is applied to one gap 14aR adjacent to the row bank 14Y having the defect portion 3 and the material ink of the green light emitting layer 17G is applied to the other gap 14aG. It is a figure. As shown in FIG. 9, the color mixing region generated by mixing the material ink of the red light emitting layer 17R and the material ink of the green light emitting layer 17G around the defect portion 3 is the gap 14aR and the gap 14aG adjacent to the defect portion 3. Spread in each. This color mixing region may extend long in the row direction and may reach about 1 cm.

In order to reduce the quality deterioration of the self-luminous panel due to such color mixing, the defective portion 3 is repaired.

(2) Outline of Repair for Defective Part 3 The outline of repair for defective part 3 will be described below with reference to the drawings. FIG. 10 is a perspective view showing a state in which the defective portion 3 is repaired using the weir 5.

The weir 5 functions as a structure for preventing the material ink of the applied functional layer from exceeding the weir 5. At least the surface of the weir 5 is liquid repellent. In the embodiment, the weir 5 has a quadrangular pyramid-shaped or similar shape like the row bank 14Y, and the cross section has a forward-tapered trapezoidal shape with an upward taper or an upwardly convex bowl shape.

The dam 5 is made of an insulating organic material, and is irradiated with UV light, for example, a thermosetting resin having an ethylenic double bond such as a (meth) acroyl group, an allyl group, a vinyl group, and a vinyloxy group. This comprises a photopolymerization initiator that initiates polymerization. Further, for example, a cross-linking agent for cross-linking these resins, for example, an epoxy compound or a polyisocyanate compound may be added. Further, a fluorinated polymer containing fluorine may be introduced into this resin structure. Examples of the fluoropolymer include a photosensitive resist containing a fluororesin such as a fluorinated polyolefin resin, a fluorinated polyimide resin, and a fluorinated polyacrylic resin.

In the weir 5, the defective portion 3 is surrounded by the weir 5 and the row bank 14Y other than the defective portion 3, so that the first space SA including the defective portion 3 and the two second space SBs not including the defective portion 3 are formed. It is formed so as to be partitioned by a weir 5. In the embodiment, weirs 5 are installed at two locations each of the two gaps 14a adjacent to the defective portion 3 at a predetermined distance in the row direction (Y direction) from the defective portion 3.

The weir 5 may be formed in advance, and at this time, the weir 5 is fixed to the bottom surface and the side surface of the gap 14a without any gap by the adhesive paste applied by using the dispenser device. As a result, as shown in the schematic view of FIG. 11, when the ink for forming the functional layer is applied, the color mixing region can be limited to only the first space SA surrounded by the weir 5, and the second space SB can be used. Can form a light emitting element. It is not necessary to form a light emitting element in the first space SA, and by doing so, it is possible to prevent light emission abnormality.

Although the weir 5 is formed in advance here, the weir 5 may be formed directly in the gap 14a by applying the resin paste using a dispenser device. Further, the form of the weir 5 is not limited to that shown in the schematic views of FIGS. 10 and 11, and as described above, the defective portion 3 is surrounded by the weir 5 and the row bank 14Y other than the defective portion 3, resulting in defects. The first space SA including the portion 3 and the second space SB not including the defective portion 3 may be partitioned by the weir 5. For example, one weir such as a dogleg, a U, or a semicircle may be arranged in each of the gaps 14a so that the second space SB is one for each of the gaps 14a.

(3) Relationship between the positions of the defective portion 3 and the weir 5 and the film thickness As described above, by repairing the defective portion 3 of the row bank 14Y using the weir 5, seriousness such as color mixing due to the defective portion 3 is serious. It is possible to minimize the area where such display defects occur to about several sub-pixels.

However, the inventor has found that when the defective portion 3 is close to the end portion of the display region 10p, a display defect may occur in the second space SB which should have escaped the influence of the defective portion 3.

When repairing using the weir 5, the gap 14a adjacent to the row bank 14Y having the defective portion 3 is divided into a first space SA including the defective portion 3 and a second space SB not including the defective portion 3. To. In particular, when the weir 5 partitions the gap 14a in the row direction, the gap 14a is divided into a first space SA including the defect portion 3 and two second space SBs not including the defect portion 3. In this case, since the two weirs 5 and the first space SA exist between the two second space SBs, the material ink of the functional layer cannot be exchanged between the two second space SBs. Each range of the second space SB is the flow range of the material ink of the functional layer. When these two second spaces SB are the second spaces SB1 and SB2, respectively, the areas of the second spaces SB1 and SB2 are sufficient with respect to the area of the sub-pixels, as shown in the schematic diagram of FIG. 12A. If it is wide, the influence of the weir 5 is small. On the other hand, as shown in the schematic diagram of FIG. 12B, the position of the weir 5 is close to the boundary between the display area 10p and the non-display area 10q, and the area of the second space SB1 becomes the area of the sub-pixel. On the other hand, if it cannot be said to be wide, an influence on the film thickness of the functional layer of the second space SB1 occurs. More specifically, when the length of the second space SB1 in the row direction (length in the Y direction) is short, the film thickness of the functional layer is different from that of the other gaps 14a. The reason for this is that the drying conditions are different because the range in which the material ink of the functional layer can flow is narrow, and the material ink that should flow out to the second space SB2 or flow in from the second space SB2 does not flow out, so the ink per unit area The reason may be that the amount is different from the other gaps 14a.

FIG. 13 shows the length d in the column direction of the second space SB1 when a partition wall is provided between the display area 10p and the non-display area 10q to prevent ink from getting over and the functional layer is not formed in the non-display area 10q. , Is a schematic view showing the relationship with the film thickness of the functional layer. As shown in FIG. 13, the smaller the length d of the second space SB1 in the row direction, the larger the film thickness difference. Therefore, the smaller the length d of the second space SB1 in the column direction, the larger the difference in brightness between the second space SB1 and the other gap 14a.

(4) Effects of External Gap 14DR, 14DG, and 14DB In the configuration according to the embodiment, the two gaps 14aR on which the red light emitting element is formed communicate with each other via the external gap 14DR. Similarly, the two gaps 14aG on which the green light emitting element is formed communicate with each other via the external gap 14DG. Similarly, the two gaps 14aB on which the blue light emitting element is formed communicate with each other via the external gap 14DB. Therefore, as shown in the schematic diagram of FIG. 14, even when the weir 5 is formed near the boundary between the display region 10p and the non-display region 10q and the gap 14a is divided into two second spaces SB1 and SB2. , The second space SB1 communicates with the outer gap 14D and the gap 14a communicating with the outer gap 14D. Therefore, the material ink of the functional layer applied to the second space SB1 can flow in and out not only to the second space SB1 but also to the outer gap 14D and the gap 14a communicating with the outer gap 14D. That is, since the material ink of the functional layer applied to the second space SB1 can flow in a wide range including the outer gap 14D and the gap 14a communicating with the outer gap 14D, it can flow with the other gap 14a in which the weir 5 is not formed. The film formation conditions do not change. Therefore, regardless of the position of the weir 5, it is possible to suppress the occurrence of uneven film thickness of the functional layer between the gap 14a having no weir 5 and the second space SB, and the brightness abnormality caused by the uneven film thickness can be prevented. It can be deterred.

<Summary>
As described above, in the configuration according to the embodiment, in the self-luminous panel in which the light emitting layer is formed by the coating method, the film thickness of the functional layer including the light emitting layer is made uniform regardless of whether or not the defective portion is repaired. It is suitable as a configuration for suppressing abnormal brightness.

3. 3. Manufacturing Method of Organic EL Display Panel 10 Next, a manufacturing method of the organic EL display panel 10 as a self-luminous panel will be described with reference to the drawings.

FIG. 16 is a flowchart showing a manufacturing method of the organic EL display panel 10. 17 to 20 are schematic cross-sectional views showing a state in each step in the manufacture of the organic EL display panel 10, and correspond to the AA cross section of FIG.

(1) Preparation of Substrate 11 First, the base material 111 is prepared (step S10), and the TFT layer 112 is formed on the base material 111 to prepare the substrate 11 (TFT substrate) (step S11, FIG. 17 (a). )). The TFT layer 112 can be formed by a known method for manufacturing a TFT.

Next, the interlayer insulating layer 12 is formed on the substrate 11 (step S20). The interlayer insulating layer 12 is formed by using, for example, a spin coating method or the like to uniformly prepare a solution of an acrylic resin, a polyimide resin, a siloxane resin, or a phenol resin, which are positive photosensitive materials, in a solvent. It is formed by coating, exposing, and developing (FIG. 17 (b)).

Although not shown in FIG. 17B, a contact hole is opened at the time of exposure, and then a connection electrode is formed in the contact hole.

(3) Formation of Pixel Electrode 13 Next, as shown in FIG. 17 (c), the pixel electrode material layer 130 is formed on the interlayer insulating layer 12. The pixel electrode material layer 130 can be formed by, for example, a vacuum vapor deposition method, a sputtering method, or the like.

Then, as shown in FIG. 17D, the pixel electrode material layer 130 is patterned by etching to form a plurality of pixel electrodes 13 partitioned by subpixels (step S30).

(4) Formation of Row Bank 14X Next, a row bank resin, which is a material of row bank 14X, is applied onto the pixel electrode 13 and the interlayer insulating layer 12 to form a row bank material layer (step S40). As the row bank resin, for example, a phenol-based resin, an acrylic-based resin, a polyimide-based resin, and a siloxane-based resin, which are positive photosensitive materials, are used. The row bank material layer 140X is formed by, for example, uniformly applying a solution of a row bank resin such as phenol resin in a solvent onto the pixel electrode 13 and the interlayer insulating layer 12 by a spin coating method or the like. Will be done.

Next, the row bank 14X is pattern-exposed using a photomask, and the exposed portion is removed by development and fired. As a result, the row bank 14X is formed.

(5) Formation of Column Bank 14Y and External Bulkhead 14L Next, as shown in FIG. 18A, the column bank 14Y and the external bulkhead 14L are formed on the pixel electrode 13, the interlayer insulating layer 12, and the row bank 14X. A row bank resin, which is a material, is applied to form a row bank material layer 140Y (step S50). To the column bank resin, for example, a fluorine compound which is a liquid-repellent surfactant is added to an acrylic resin, a polyimide resin, a siloxane resin, and a phenol resin which are positive photosensitive materials. Used.

Next, the row bank material layer 140Y is pattern-exposed using a photomask, and the exposed portion is removed by development and fired to form the row bank 14Y as shown in FIG. 18 (b). Although not shown in FIG. 18B, an outer partition wall 14L is formed in the non-display area 10q in succession with the column bank 14Y.

Although the row bank 14Y and the outer partition wall 14L are formed at once using the same material here, they may be formed by individual film formation treatments.

Further, after the row bank 14Y is formed, a step of detecting a defective portion of the row bank 14Y and a step of repairing the defective portion when the defective portion is detected may be performed.

(6) Formation of Hole Injection Layer Next, as shown in FIG. 18C, the constituent materials of the hole injection layer 15 are included in each of the gaps 14aR, 14aG, and 14aB defined by the row bank 14Y. The ink is ejected from the nozzle 4010 of the coating device and applied onto the pixel electrodes 13 in the gaps 14aR, 14aG, and 14aB. Then, firing (drying) is performed to form the hole injection layer 15 (step S60).

In addition, in order to adjust the film thickness of the hole injection layer 15 in the gaps 14aR, 14aG, and 14aB, even if ink containing the constituent material of the hole injection layer 15 is applied to each of the external gaps 14DR, 14DG, and 14DB. Good.

(7) Film formation of hole transport layer Next, as shown in FIG. 18 (d), the constituent materials of the hole transport layer 16 are included in each of the gaps 14aR, 14aG, and 14aB defined by the row bank 14Y. The ink is ejected from the nozzle 4020 of the coating device and applied onto the hole transport layer 16 in the gaps 14aR, 14aG, 14aB. Then, firing (drying) is performed to form the hole transport layer 16 (step S70).

In addition, in order to adjust the film thickness of the hole transport layer 16 in the gaps 14aR, 14aG, and 14aB, even if ink containing the constituent material of the hole transport layer 16 is applied to each of the external gaps 14DR, 14DG, and 14DB. Good.

(8) Film formation of light emitting layer Next, as shown in FIG. 19A, ink containing the constituent materials of the light emitting layer 17R / G / B is ejected from the nozzles 4030R / 4030G / 4030B of the coating apparatus, respectively. , The gaps 14aR, 14aG, and 14aB are each applied on the hole transport layer 16. Then, firing (drying) is performed to form light emitting layers 17R, 17G, and 17B (step S80). At this time, the ink containing the constituent material of the light emitting layer 17R / G / B also wets and spreads to the outer gaps 14DR, 14DG, and 14DB, respectively.

Ink containing the constituent material of the light emitting layer 17R / G / B may be applied to each of the outer gaps 14DR, 14DG, and 14DB. By applying the ink to the outer gaps 14DR, 14DG, and 14DB, the film thickness of the light emitting layer 17R / G / B can be made uniform.

(9) Film formation of electron transport layer Next, as shown in FIG. 19 (b), the material constituting the electron transport layer 18 is vapor-deposited on the light emitting layers 17R, 17G, 17B and the row bank 14Y. A film is formed in common to each subpixel by a sputtering method to form an electron transport layer 18 (step S90).

(10) Film formation of electron injection layer Next, as shown in FIG. 19 (c), the material constituting the electron injection layer 19 is common to each subpixel by a vacuum deposition method or a sputtering method on the electron transport layer 18. To form a film, and the electron injection layer 19 is formed (step S100).

(11) Film formation of counter electrode Next, as shown in FIG. 20 (a), the material constituting the counter electrode 20 is commonly applied to each subpixel on the electron injection layer 19 by a vacuum deposition method or a sputtering method. A film is formed to form the counter electrode 20 (step S110).

(12) Film formation of sealing layer Finally, as shown in FIG. 20B, a material for forming a sealing layer is formed on the counter electrode 20 in common for each subpixel by a CVD method or a sputtering method. The film is formed to form the sealing layer 21 (step S120).

<< Embodiment 2 >>
In the organic EL display panel 100 according to the first embodiment, all of the gaps 14aR, 14aG, and 14aB are configured to communicate with the other gaps 14aR, 14aG, and 14aB via the external gaps 14DR, 14DG, and 14DB, respectively.

However, for all emission colors, it is not necessary to communicate the two gaps 14a via the external gap 14D, and the following configuration may be used.

In the green light emitting element, the brightness unevenness becomes conspicuous even if the length d becomes long, but in the blue light emitting element and the red light emitting element, the brightness unevenness becomes inconspicuous when the length d becomes long. Therefore, when the length d in the column direction of the second space SB1 is equal to or longer than a predetermined length, the brightness unevenness occurs only in the green light emitting element. The reason for this is thought to be that the human eye is sensitive to green light.

In view of the above points, only the gap 14aG on which the green light emitting element is formed communicates with the other gap 14aG via the external gap 14DG, and the gap 14aR and the gap 14aB are repaired even if the conventional configuration is used. Brightness abnormality can be suppressed regardless of the presence or absence of.

FIG. 15A is a schematic view showing the shapes of the row bank 14Y and the outer partition wall 14L according to one of the second embodiments. As shown in FIG. 15A, the gap 14aR and the gap 14aB are configured to be closed by the outer partition wall 14L in the non-display region 10q. On the other hand, the gap 14aG has a structure in which the two gaps 14aG are communicated in a loop by the external gaps 14DG provided in each of the two non-display regions 10q.

FIG. 15B is a schematic view showing the shapes of the row bank 14Y and the outer partition wall 14L according to the other one of the second embodiment. As shown in FIG. 15B, the gap 14aR and the gap 14aB are configured to be closed by the outer partition wall 14L in the non-display region 10q. On the other hand, regarding the gap 14aG, two gaps 14aG closest to each other in the row direction (X direction) are communicated with each other by an external gap 14DG provided in one non-display region 10q, and the external gap 14DG is two non-display regions 10q. By arranging them in a staggered pattern, the gap 14aG and the outer gap 14DG are connected in a long shape.

FIG. 15C is a schematic view showing the shapes of the row bank 14Y and the outer partition wall 14L according to the other one of the second embodiment. As shown in FIG. 15C, the gap 14aR and the gap 14aB are configured to be closed by the outer partition wall 14L in the non-display region 10q. On the other hand, with respect to the gap 14aG, the plurality of gaps 14aG are communicated with each other by the external gap 14DG provided in the two non-display regions 10q, so that the plurality of gaps 14aG are connected via the external gap 14DG. There is.

Even with the above configuration, the thickness of the green light emitting layer can be made uniform and the luminance abnormality can be suppressed regardless of whether or not the defective portion is repaired. As described above, the visibility of the luminance abnormality is not high for the uneven film thickness of the red light emitting layer and the uneven film thickness of the blue light emitting layer. It can be deterred.

<< Other modifications according to the embodiment >>
(1) In the first embodiment, two gaps 14aR, two gaps 14aG, and two gaps are used for the gaps 14aB, 14aG, 14aR, 14aR, 14aG, and 14aB arranged in the row direction using the external gaps 14DR, 14DG, and 14DB. A case where each of 14aB is communicated in a loop shape has been described. However, the arrangement order of the gaps may be arbitrary, and the two gaps 14a on which the light emitting elements emitting the same color are formed may be communicated with each other by the external gap 14D. Further, the types of light emitting elements are not limited to three types, and may be two types or four or more types. Here, the type of the light emitting element refers to a variation in the film thickness of the light emitting layer or the functional layer, and even if the light emitting color is the same, if the film thickness of the light emitting layer or the functional layer is different, different types of light emission are emitted. Think of it as an element. Further, an auxiliary electrode layer or other non-self-luminous region may be provided between two different types of gaps 14a.

Further, the two gaps 14a do not have to be in a loop shape as long as they are communicated by the outer gap 14D, and may be communicated in a U shape through one outer gap 14D. As in one aspect of the second embodiment shown, three or more gaps 14a may be communicated with each other in a long shape by a plurality of external gaps 14D.

Similarly, in the second embodiment, the shape is not limited to the shapes shown in FIGS. 15A to 15C, and the two gaps 14aG may be communicated with each other by the external gap 14DG, and the two gaps 14aG may be communicated with each other through the one external gap 14D. It may communicate in a U shape, or in the embodiment shown in FIG. 15C, the external gap 14DG may be formed in one hidden region 10q.

Further, for two or more of the emitted colors, the two gaps 14a may be communicated with each other by the external gap 14D as in the first embodiment, and the gaps 14a for one or more colors may be independent of each other.

(2) In the above embodiment, the hole injection layer 15, the hole transport layer 16, and the light emitting layer 17 are all formed by the coating method in the organic EL element 100, but at least the light emitting layer 17 is formed by the coating method. It may be formed, and the other layers may be formed by other methods such as a vapor deposition method and a sputtering method.

Further, the hole injection layer 15, the hole transport layer 16, the electron transport layer 18, and the electron injection layer 19 do not necessarily have to have the configuration of the above embodiment. It may not be provided with any one or more, or may be further provided with another functional layer. Further, for example, a single electron injection transport layer may be provided instead of the electron transport layer 18 and the electron injection layer 19.

(3) In the above-described embodiment, the case where the pixel electrode has light reflectivity and the counter electrode has light transmissivity has been described, assuming that the organic EL display panel is a top emission type. However, the organic EL display panel according to the present disclosure may be a so-called bottom emission type.

(4) The self-luminous panel and the self-luminous display device according to the present disclosure have been described above based on the embodiments and modifications, but the present invention is limited to the above embodiments and modifications. is not it. By arbitrarily combining the components and functions in the embodiment and the modified example, the form obtained by applying various modifications that can be thought of by those skilled in the art to the above-described embodiment and the modified example, and within the range that does not deviate from the gist of the present invention. The realized form is also included in the present invention.

In the present invention, in a self-luminous panel in which a light emitting layer is formed by a coating method, a self-luminous panel having excellent display quality can be manufactured by easily equalizing the film thickness of the light emitting layer regardless of whether or not the partition wall is repaired. Useful to do.

1 Display device 10 Display panel (organic EL display panel)
100 light emitting element (organic EL element)
10p display area 10q non-display area 3 Defects (defects)
5 Weir 11 Substrate 12 Interlayer insulation layer 13 Pixel electrode 14Y row bank (bulkhead)
14a Gap 14L External bulkhead 14D External gap 14X row bank 15 Hole injection layer 16 Hole transport layer 17 Light emitting layer 17D Dummy light emitting layer 18 Electron transport layer 19 Electron injection layer 20 Opposite electrode 21 Sealing layer

Claims (14)

A self-luminous panel in which the non-display area is adjacent to the display area in which the light emitting elements are arranged in a matrix when viewed in a plan view in the column direction.
A plurality of pixel electrodes arranged above the substrate in the display area,
A plurality of partition walls arranged above the substrate in the display region and extending in the column direction to partition the plurality of pixel electrodes in the row direction.
A first light emitting layer, which is a coating film arranged in the first gap among the gaps between two partition walls adjacent to each other in the row direction,
A second light emitting layer arranged in the second gap adjacent to the first gap in the row direction and having a different light emitting color from the first light emitting layer,
A third light emitting layer, which is a coating film made of the same material as the first light emitting layer, arranged in a third gap separated from the first gap in the row direction.
An external partition wall arranged above the substrate and partitioning a band-shaped external gap in the non-display area,
The first light emitting layer, the second light emitting layer, and a counter electrode arranged above the third light emitting layer are provided.
A self-luminous panel characterized in that the first gap and the third gap communicate with each other via the external gap. The self-luminous panel according to claim 1, wherein the partition wall defining the first gap and the partition wall defining the third gap are continuous via the outer partition wall. A dummy light emitting layer made of the same material as both the first light emitting layer and the third light emitting layer and formed as a coating film is formed in the outer gap, and the first light emitting layer and the third light emitting layer are formed. The self-luminous panel according to claim 1 or 2, wherein the light emitting layer is continuous with the dummy light emitting layer. A fourth light emitting layer arranged above the pixel electrode in the fourth gap adjacent to the third gap in the row direction and made of the same material as the second light emitting layer and formed as a coating film.
Further provided with a second external partition wall arranged above the substrate and partitioning a strip-shaped second external gap in the non-display area.
The second light emitting layer is formed as a coating film, and is formed.
Since the partition wall defining the second gap and the partition wall defining the fourth gap are continuous via the second outer partition wall, the second gap and the fourth gap are connected to the second outer gap. The self-luminous panel according to any one of claims 1 to 3, wherein the self-luminous panel communicates with each other. The self-luminous panel according to claim 4, wherein the first gap, the second gap, the fourth gap, and the third gap are arranged in the row direction in this order. A fifth light emitting layer arranged above the pixel electrode in the fifth gap separated from the third gap in the row direction and made of the same material as the first light emitting layer and formed as a coating film.
Further provided with a third external partition wall arranged above the substrate and partitioning a strip-shaped third external gap in the non-display area.
Since the partition wall defining the third gap and the partition wall defining the fifth gap are continuous via the third outer partition wall, the third gap and the fifth gap are connected to the third outer gap. The self-luminous panel according to any one of claims 1 to 3, wherein the self-luminous panel communicates with each other. A fifth light emitting layer arranged above the pixel electrode in the fifth gap separated from the third gap in the row direction and made of the same material as the first light emitting layer and formed as a coating film is further provided.
The self-luminous panel according to claim 1 or 3, wherein the first gap, the third gap, and the fifth gap are continuous via the external gap. The self-luminous light according to any one of claims 1 to 7, wherein a weir extending in the row direction and dividing the first light emitting layer in the column direction is provided in the first gap. panel. The weir is formed above one or more pixel electrodes.
The self-luminous panel according to claim 8, wherein the light emitting element does not exist in the region where the pixel electrode exists when viewed in a plan view. A method for manufacturing a self-luminous panel in which a non-display area is adjacent in a column direction to a display area in which light emitting elements are arranged in a matrix when viewed in a plan view.
Pixel electrodes are formed in a matrix in the display area above the substrate.
A plurality of partition walls extending in the column direction to partition the plurality of pixel electrodes in the row direction are formed in the display area above the substrate.
The outer partition wall that partitions the outer gap communicating with both the first gap and the third gap separated from the first gap in the row direction among the gaps defined by the two partition walls adjacent to each other in the row direction is hidden. Formed in the area,
The material ink of the first light emitting layer is applied to the first gap and the third gap to form the first light emitting layer and the third light emitting layer, respectively.
A second light emitting layer having a different emission color from the first light emitting layer is formed in the second gap adjacent to the first gap in the row direction.
A method for manufacturing a self-luminous panel, characterized in that a counter electrode is formed above the first light emitting layer, the second light emitting layer, and the third light emitting layer. A second external partition wall for partitioning the second external gap communicating with both the second gap and the fourth gap adjacent to the third gap in the row direction is formed in the non-display region.
In the formation of the second light emitting layer, the material ink of the second light emitting layer is applied.
The method for manufacturing a self-luminous panel according to claim 10, wherein the material ink of the second light emitting layer is applied to the fourth gap to form the fourth light emitting layer. A third outer partition wall for partitioning the third outer gap communicating with both the third gap and the fifth gap separated from the third gap in the row direction is formed in the non-display region.
The method for manufacturing a self-luminous panel according to claim 10, wherein the material ink of the first light emitting layer is applied to the fifth gap to form a fifth light emitting layer. In the formation of the outer partition wall, the outer gap is formed so that the outer gap communicates with all of the first gap, the third gap, and the fifth gap separated from the third gap in the row direction. And
The method for manufacturing a self-luminous panel according to claim 10, wherein the material ink of the first light emitting layer is applied to the fifth gap to form a fifth light emitting layer. The invention according to any one of claims 10 to 13, wherein a defect is detected in the partition wall, and when the defect is detected, a weir is formed so that the defect is surrounded by the partition wall and the weir. Manufacturing method of self-luminous panel.

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