JP2020200503A - Electrical contact material, and manufacturing method of electrical contact material - Google Patents
Electrical contact material, and manufacturing method of electrical contact material Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 229910052709 silver Inorganic materials 0.000 claims abstract description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 29
- 239000000956 alloy Substances 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000010949 copper Substances 0.000 description 29
- 229910044991 metal oxide Inorganic materials 0.000 description 16
- 150000004706 metal oxides Chemical class 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001203 Alloy 20 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000000724 energy-dispersive X-ray spectrum Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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Abstract
Description
本発明は、電気接点材料、及び電気接点材料の製造方法に関する。 The present invention relates to an electrical contact material and a method for manufacturing the electrical contact material.
従来、スイッチ、電磁リレー及び遮断器などの電気製品では、電気回路に電流を断続させるための電気接点が用いられている。一般的に、電気接点材料としては、Ｃｕを含む合金が用いられている。Ｃｕを含む合金の表面には、電気抵抗率の高い酸化被膜が形成されやすいため、接触抵抗が上昇するという問題がある。Ｃｕを含む合金の表面に貴金属（Ａｇ及びＡｕなど）めっき層を形成することによって酸化皮膜が形成されることを抑制できるが、製造コストが増大してしまう。 Conventionally, in electric appliances such as switches, electromagnetic relays and circuit breakers, electric contacts for interrupting current in an electric circuit have been used. Generally, an alloy containing Cu is used as the electrical contact material. Since an oxide film having a high electrical resistivity is likely to be formed on the surface of the alloy containing Cu, there is a problem that the contact resistance increases. By forming a noble metal (Ag, Au, etc.) plating layer on the surface of the alloy containing Cu, it is possible to suppress the formation of an oxide film, but the production cost increases.
そこで、特許文献１では、電気接点材料の製造方法として、Ｓｎ、Ｚｎ、Ｎｉ、Ｃｕ、Ｉｎ、Ｆｅ、Ａｌ、Ａｇ、Ａｕ、Ｔｉ、Ｐｂ、Ｃｒ又はこれらの合金からなる複数の金属層を基材上に積層し、かつ、最も酸化されにくい金属層を最表層に配置した後に酸化雰囲気で加熱処理する手法が提案されている。この手法によれば、最表層の金属層より下に位置する金属層の金属が最表層の金属層に拡散して合金層が形成されるとともに、合金層の表面が酸化されて導電性酸化物層が形成される。この導電性酸化物層は、導電性を有し、かつ、剥離しにくいため、安定した接触抵抗を長期間維持することができる。 Therefore, in Patent Document 1, as a method for producing an electrical contact material, a plurality of metal layers made of Sn, Zn, Ni, Cu, In, Fe, Al, Ag, Au, Ti, Pb, Cr or alloys thereof are used as a base. A method has been proposed in which a metal layer that is laminated on a material and is most resistant to oxidation is placed on the outermost layer and then heat-treated in an oxidizing atmosphere. According to this method, the metal of the metal layer located below the metal layer of the outermost layer is diffused to the metal layer of the outermost layer to form an alloy layer, and the surface of the alloy layer is oxidized to carry a conductive oxide. Layers are formed. Since this conductive oxide layer has conductivity and is hard to peel off, stable contact resistance can be maintained for a long period of time.
しかしながら、特許文献１に記載の手法では、合金層の表面に導電性酸化物層が形成されるため、電気接点材料の電気的特性を向上させるにも限界がある。 However, in the method described in Patent Document 1, since the conductive oxide layer is formed on the surface of the alloy layer, there is a limit in improving the electrical characteristics of the electrical contact material.
そのため、良好な電気的特性と製造コスト低減とを両立可能なＡｇＣｕ系合金を電気接点材料として用いることが望まれるが、上述のとおり、ＡｇＣｕ系合金の表面には酸化皮膜が形成されやすく、またＡｇＣｕ系合金の表面に貴金属めっき層を形成すると製造コストが増大してしまう。 Therefore, it is desired to use an AgCu-based alloy as an electrical contact material that can achieve both good electrical characteristics and reduction in manufacturing cost. However, as described above, an oxide film is likely to be formed on the surface of the AgCu-based alloy, and Forming a noble metal plating layer on the surface of an AgCu-based alloy increases the manufacturing cost.
本発明は、電気的特性を維持可能な電気接点材料、及びその製造方法の提供を目的とする。 An object of the present invention is to provide an electrical contact material capable of maintaining electrical properties and a method for producing the same.
本発明に係る電気接点材料の一つの態様は、ＡｇとＣｕとを含有する第１領域と、第１領域上に配置され、Ａｇを含有する第２領域とを備える。第２領域におけるＣｕの含有率は、第１領域におけるＣｕの含有率より小さい。 One aspect of the electrical contact material according to the present invention includes a first region containing Ag and Cu, and a second region arranged on the first region and containing Ag. The Cu content in the second region is smaller than the Cu content in the first region.
本発明に係る電気接点材料の製造方法の一つの態様はＡｇＣｕ系合金に酸素含有雰囲気中で熱処理を施すことによって電気接点材料を形成する熱処理工程を備える。電気接点材料は、ＡｇとＣｕとを含有する第１領域と、第１領域上に配置され、Ａｇを含有する第２領域と、第２領域上に配置され、ＣｕＯを含有する第３領域とを有する。第２領域におけるＣｕの含有率は、第１領域におけるＣｕの含有率より小さい。 One aspect of the method for producing an electrical contact material according to the present invention includes a heat treatment step of forming an electrical contact material by heat-treating an AgCu-based alloy in an oxygen-containing atmosphere. The electrical contact material has a first region containing Ag and Cu, a second region containing Ag, a second region containing Ag, and a third region containing CuO, which are arranged on the second region. Has. The Cu content in the second region is smaller than the Cu content in the first region.
本発明の一つの態様によれば、電気的特性を維持可能な電気接点材料、及びその製造方法を提供することができる。 According to one aspect of the present invention, it is possible to provide an electrical contact material capable of maintaining electrical properties, and a method for producing the same.
図１は、第１電気接点材料２０及び第２電気接点材料３０の製造方法を説明するための模式図である。図１では、ＡｇＣｕ系合金１０、第１電気接点材料２０及び第２電気接点材料３０それぞれの表面付近の拡大断面が図示されている。 FIG. 1 is a schematic diagram for explaining a method of manufacturing the first electrical contact material 20 and the second electrical contact material 30. In FIG. 1, enlarged cross sections near the surfaces of each of the AgCu-based alloy 10, the first electric contact material 20, and the second electric contact material 30 are shown.
以下においては、図１を参照しながら、本実施形態に係る第１及び第２電気接点材料２０，３０の構成について、これらの製造方法にしたがって説明する。 In the following, the configurations of the first and second electrical contact materials 20 and 30 according to the present embodiment will be described with reference to FIG. 1 according to these manufacturing methods.
（ＡｇＣｕ系合金１０の準備）
まず、少なくともＡｇ（銀）及びＣｕ（銅）を含むＡｇＣｕ系合金１０を準備する。ＡｇＣｕ系合金１０は、少なくともＡｇとＣｕとを含むＡｇＣｕ系合金によって構成される。ＡｇＣｕ系合金１０において、ＣｕはＡｇ基材中に分散されている。ＡｇＣｕ系合金１０の表面には、酸化被膜が形成されていないことが好ましい。
(Preparation of AgCu alloy 10)
First, an AgCu-based alloy 10 containing at least Ag (silver) and Cu (copper) is prepared. The AgCu-based alloy 10 is composed of an AgCu-based alloy containing at least Ag and Cu. In the AgCu-based alloy 10, Cu is dispersed in the Ag base material. It is preferable that no oxide film is formed on the surface of the AgCu-based alloy 10.
ＡｇＣｕ系合金１０は、第１及び第２電気接点材料２０，３０の耐溶着性及び耐アーク消耗性の向上のために、金属酸化物を含んでいてもよい。金属酸化物としては、例えばＳｎＯ２、ＺｎＯ、Ｉｎ２Ｏ３、ＣｄＯ２から選択される少なくとも１種を用いることができるが、これらには限られない。第１及び第２電気接点材料２０，３０の耐溶着性を向上させるにはＳｎＯ２が金属酸化物として好適であり、入手性を考慮するとＺｎＯが金属酸化物として好適である。 The AgCu-based alloy 10 may contain a metal oxide in order to improve the welding resistance and arc wear resistance of the first and second electrical contact materials 20 and 30. As the metal oxide, for example, at least one selected from SnO 2 , ZnO, In 2 O 3 , and CdO 2 can be used, but the metal oxide is not limited thereto. SnO 2 is suitable as a metal oxide for improving the welding resistance of the first and second electrical contact materials 20 and 30, and ZnO is suitable as a metal oxide in consideration of availability.
ＡｇＣｕ系合金１０におけるＡｇの含有率は特に制限されないが、例えば、８．５質量％以上８０質量％以下とすることができる。また、第１及び第２電気接点材料２０，３０の製造コストを低減させる観点から、Ａｇの含有率は、１５質量％以下が好ましく、３０質量％以下がより好ましい。 The content of Ag in the AgCu-based alloy 10 is not particularly limited, but may be, for example, 8.5% by mass or more and 80% by mass or less. Further, from the viewpoint of reducing the manufacturing cost of the first and second electrical contact materials 20 and 30, the Ag content is preferably 15% by mass or less, more preferably 30% by mass or less.
ＡｇＣｕ系合金１０におけるＣｕの含有率は特に制限されないが、例えば、１５質量％以上９０質量％以下とすることができる。また、第１及び第２電気接点材料２０，３０の耐酸化性、耐熱性及び耐衝撃性を維持する観点から、Ｃｕの含有率は、７０質量％以下が好ましい。 The content of Cu in the AgCu-based alloy 10 is not particularly limited, but can be, for example, 15% by mass or more and 90% by mass or less. Further, from the viewpoint of maintaining the oxidation resistance, heat resistance and impact resistance of the first and second electrical contact materials 20 and 30, the Cu content is preferably 70% by mass or less.
ＡｇＣｕ系合金１０が金属酸化物を含む場合、ＡｇＣｕ系合金１０における金属酸化物の含有率は特に制限されないが、例えば、０．５質量％以上１５質量％以下とすることができる。第１及び第２電気接点材料２０，３０の耐溶着性及び耐アーク消耗性を向上させる観点から、金属酸化物の割合は、０．５質量％以上が好ましい。また、第１及び第２電気接点材料２０，３０の電気伝導度を維持する観点から、金属酸化物の割合は、１５質量％以下が好ましい。 When the AgCu-based alloy 10 contains a metal oxide, the content of the metal oxide in the AgCu-based alloy 10 is not particularly limited, but can be, for example, 0.5% by mass or more and 15% by mass or less. From the viewpoint of improving the welding resistance and arc wear resistance of the first and second electrical contact materials 20 and 30, the ratio of the metal oxide is preferably 0.5% by mass or more. Further, from the viewpoint of maintaining the electric conductivity of the first and second electric contact materials 20 and 30, the ratio of the metal oxide is preferably 15% by mass or less.
ＡｇＣｕ系合金１０におけるＡｇＣｕ及び金属酸化物それぞれの含有率は、ＡｇＣｕ系合金１０の断面をエネルギー分散型Ｘ線分光装置（ＥＤＳ：Ｅｎｅｒｇｙ Ｄｉｓｐｅｒｓｉｖｅ Ｘ−ｒａｙ Ｓｐｅｃｔｒｏｍｅｔｅｒ)を用いて分析することによって測定される。ＥＤＳには、ＪＥＯＬ社製、型式ＪＥＤ−２３００が用いられる。 The content of each of AgCu and metal oxide in AgCu-based alloy 10 is measured by analyzing the cross section of AgCu-based alloy 10 using an energy dispersive X-ray spectrum device (EDS). .. For EDS, model JED-2300 manufactured by JEOL Ltd. is used.
（熱処理工程）
次に、ＡｇＣｕ系合金１０に酸素含有雰囲気中で熱処理を施すことによって、第１電気接点材料２０を形成する。第１電気接点材料２０は、本発明に係る電気接点材料の一例である。
(Heat treatment process)
Next, the AgCu-based alloy 10 is heat-treated in an oxygen-containing atmosphere to form the first electrical contact material 20. The first electrical contact material 20 is an example of the electrical contact material according to the present invention.
熱処理工程の条件は、以下の通りである。 The conditions of the heat treatment process are as follows.
・酸素含有雰囲気（例えば、大気雰囲気）
・熱処理温度：２２５℃以上３５０℃以下
・熱処理時間：１時間以上
・ Oxygen-containing atmosphere (for example, atmospheric atmosphere)
・ Heat treatment temperature: 225 ° C or higher and 350 ° C or lower ・ Heat treatment time: 1 hour or longer
図１に示すように、第１電気接点材料２０は、第１領域２１と、第２領域２２と、第３領域２３とを有する。 As shown in FIG. 1, the first electrical contact material 20 has a first region 21, a second region 22, and a third region 23.
第１領域２１は、ＡｇＣｕ系合金１０の本体部である。第１領域２１は、ＡｇＣｕ系合金１０の大部分を占める。第１領域２１は、少なくともＡｇとＣｕとを含有する。第１領域２１は、実質的にＡｇ及びＣｕのみによって構成されていてもよい。第１領域２１において、ＣｕはＡｇ基材中に分散されている。第１領域２１は、金属酸化物を含有していてもよいが、金属酸化物を実質的に含有していなくてもよい。 The first region 21 is the main body of the AgCu-based alloy 10. The first region 21 occupies most of the AgCu-based alloy 10. The first region 21 contains at least Ag and Cu. The first region 21 may be substantially composed of only Ag and Cu. In the first region 21, Cu is dispersed in the Ag substrate. The first region 21 may contain a metal oxide, but may not substantially contain a metal oxide.
なお、本明細書において、「組成Ｘを実質的に含有しない」とは、電気接点材料の断面をＥＤＳで分析した場合に、組成Ｘの含有率が５質量％以下であることを意味する。 In the present specification, "substantially free of composition X" means that the content of composition X is 5% by mass or less when the cross section of the electrical contact material is analyzed by EDS.
第１領域２１の厚みは特に制限されず、製品形状に応じて適宜設定可能である。 The thickness of the first region 21 is not particularly limited and can be appropriately set according to the product shape.
第２領域２２は、第１領域２１上に配置される。第２領域２２は、第１領域２１と第３領域２３との間に配置される。第２領域２２は、層状あるいは膜状に形成される。第２領域２２は、第１領域２１の表面全面を覆っていてもよいし、第１領域２１の表面を部分的に覆っていてもよい。第２領域２２は、少なくともＡｇを含有する。第２領域２２は、実質的にＡｇのみによって構成されていてもよい。第２領域２２は、Ｃｕを含有していてもよいが、Ｃｕを実質的に含有していなくてもよい。第２領域２２は、金属酸化物を含有していてもよいが、金属酸化物を実質的に含有していなくてもよい。 The second region 22 is arranged on the first region 21. The second region 22 is arranged between the first region 21 and the third region 23. The second region 22 is formed in a layered or membranous form. The second region 22 may cover the entire surface of the first region 21 or may partially cover the surface of the first region 21. The second region 22 contains at least Ag. The second region 22 may be composed substantially only of Ag. The second region 22 may contain Cu, but may not substantially contain Cu. The second region 22 may contain a metal oxide, but may not substantially contain a metal oxide.
第２領域２２の厚みは特に制限されず、第１領域２１の厚みよりも薄ければよい。第２領域２２の厚みは、例えば３μｍ以下とすることができる。第２領域２２の厚みは、熱処理の時間を長くするほど、或いは、熱処理の温度を高くほど、厚くすることができる。なお、第２領域２２の厚みは、第１電気接点材料２０の表面に垂直な断面における第２領域２２の表面（すなわち、第２領域２２と第３領域２３との界面）のうち１０μｍの範囲を最小二乗法で直線化し、当該直線に垂直な方向における当該直線からの距離を測定することで得られる。 The thickness of the second region 22 is not particularly limited and may be thinner than the thickness of the first region 21. The thickness of the second region 22 can be, for example, 3 μm or less. The thickness of the second region 22 can be increased as the heat treatment time is lengthened or the heat treatment temperature is raised. The thickness of the second region 22 is in the range of 10 μm of the surface of the second region 22 (that is, the interface between the second region 22 and the third region 23) in the cross section perpendicular to the surface of the first electrical contact material 20. Is straightened by the method of least squares, and the distance from the straight line is measured in the direction perpendicular to the straight line.
第３領域２３は、第２領域２２上に配置される。第３領域２３は、第１電気接点材料２０の最表層である。第３領域２３は、層状あるいは膜状に形成される。第３領域２３は、第２領域２２の表面全面を覆っていてもよいし、第２領域２２の表面を部分的に覆っていてもよい。第３領域２３は、少なくともＣｕＯを含有する。第３領域２３は、実質的にＣｕＯのみによって構成されていてもよい。第３領域２３は、Ａｇを含有していてもよいが、Ａｇを実質的に含有していなくてもよい。第３領域２３は、金属酸化物を含有していてもよいが、金属酸化物を実質的に含有していなくてもよい。 The third region 23 is arranged on the second region 22. The third region 23 is the outermost layer of the first electrical contact material 20. The third region 23 is formed in a layered or membranous form. The third region 23 may cover the entire surface of the second region 22, or may partially cover the surface of the second region 22. The third region 23 contains at least CuO. The third region 23 may be substantially composed of only CuO. The third region 23 may contain Ag, but may not substantially contain Ag. The third region 23 may contain a metal oxide, but may not substantially contain a metal oxide.
第３領域２３の厚みは特に制限されない。第３領域２３の厚みは、熱処理の時間を長くするほど、或いは、熱処理の温度を高くほど、厚くすることができる。 The thickness of the third region 23 is not particularly limited. The thickness of the third region 23 can be increased as the heat treatment time is lengthened or the heat treatment temperature is raised.
なお、第３領域２３は、電気伝導性の低いＣｕＯを含有しているが、第２領域２２から容易に剥離しやすく、電気接点として実際に使用されれば初期段階で自然に除去されうる。そのため、第１電気接点材料２０は、電気接点材料として十分に実用可能である。 Although the third region 23 contains CuO having low electrical conductivity, it is easily peeled off from the second region 22, and can be naturally removed at an initial stage if it is actually used as an electrical contact. Therefore, the first electrical contact material 20 is sufficiently practical as an electrical contact material.
ここで、第２領域２２におけるＣｕの含有率は、第１領域２１におけるＣｕの含有率より小さい。そのため、第２領域２２は、第１領域２１に比べて化学的に安定している。このように、化学的に安定した第２領域２２によって第１領域２１が覆われているため、第１電気接点材料２０が空気と接触したとしても、第２領域２２に含まれるＣｕが酸化してしまうことを抑制できる。よって、第１電気接点材料２０の電気的特性を長期間にわたって維持することができる。 Here, the Cu content in the second region 22 is smaller than the Cu content in the first region 21. Therefore, the second region 22 is chemically more stable than the first region 21. In this way, since the first region 21 is covered with the chemically stable second region 22, even if the first electrical contact material 20 comes into contact with air, the Cu contained in the second region 22 is oxidized. It can be suppressed. Therefore, the electrical characteristics of the first electrical contact material 20 can be maintained for a long period of time.
第１領域２１及び第２領域２２それぞれにおけるＣｕの含有率は、第１電気接点材料２０の表面に垂直な断面において、ＥＤＳを用いて分析することによって測定される。ＥＤＳには、ＪＥＯＬ社製、型式ＪＥＤ−２３００が用いられる。 The Cu content in each of the first region 21 and the second region 22 is measured by analysis using EDS in a cross section perpendicular to the surface of the first electrical contact material 20. For EDS, model JED-2300 manufactured by JEOL Ltd. is used.
第１領域２１におけるＣｕの含有率は特に制限されないが、例えば、15質量％以上90質量％以下とすることができる。また、第１及び第２電気接点材料２０，３０の耐酸化性、耐熱性及び耐衝撃性を維持する観点から、第１領域２１におけるＣｕの含有率は、70質量％以下が好ましい。 The content of Cu in the first region 21 is not particularly limited, but can be, for example, 15% by mass or more and 90% by mass or less. Further, from the viewpoint of maintaining the oxidation resistance, heat resistance and impact resistance of the first and second electrical contact materials 20 and 30, the Cu content in the first region 21 is preferably 70% by mass or less.
第２領域２２におけるＣｕの含有率は特に制限されないが、例えば、15質量％以下とすることができる。第２領域２２の化学的安定性を向上させる観点から、第２領域２２におけるＣｕの含有率は、5質量％以下が好ましい。 The content of Cu in the second region 22 is not particularly limited, but can be, for example, 15% by mass or less. From the viewpoint of improving the chemical stability of the second region 22, the Cu content in the second region 22 is preferably 5% by mass or less.
第１領域２１及び第２領域２２それぞれにおける酸素の含有率は、第１電気接点材料２０の表面に垂直な断面において、ＥＤＳを用いて分析することによって測定される。ＥＤＳには、ＪＥＯＬ社製、型式ＪＥＤ−２３００が用いられる。 The oxygen content in each of the first region 21 and the second region 22 is measured by analysis using EDS in a cross section perpendicular to the surface of the first electrical contact material 20. For EDS, model JED-2300 manufactured by JEOL Ltd. is used.
（除去工程）
次に、第１電気接点材料２０の最表層である第３領域２３を除去することによって、第２電気接点材料３０を形成する。
(Removal process)
Next, the second electrical contact material 30 is formed by removing the third region 23, which is the outermost layer of the first electrical contact material 20.
第３領域２３は、例えば、バレル研磨、ショットブラストなどによって除去することができる。効率的かつ簡便な除去という観点から、バレル研磨によって第３領域２３を除去することが好ましい。 The third region 23 can be removed by, for example, barrel polishing, shot blasting, or the like. From the viewpoint of efficient and easy removal, it is preferable to remove the third region 23 by barrel polishing.
第２電気接点材料３０は、本発明に係る電気接点材料の一例である。第２電気接点材料３０は、第１領域２１と、第２領域２２とを有する。第１領域２１及び第２領域２２の構成は、上述のとおりである。 The second electrical contact material 30 is an example of the electrical contact material according to the present invention. The second electrical contact material 30 has a first region 21 and a second region 22. The configurations of the first region 21 and the second region 22 are as described above.
第２電気接点材料３０は、電気伝導性の低いＣｕＯを含有する第３領域２３を備えていないので、より電気的特性の良好な電気接点材料であるといえる。 Since the second electrical contact material 30 does not include the third region 23 containing CuO having low electrical conductivity, it can be said that the second electrical contact material 30 is an electrical contact material having better electrical characteristics.
第２電気接点材料３０には、周知の伸線加工及び線材加工（又はリベット加工）が施されて電気接点として製品化される。 The second electrical contact material 30 is subjected to well-known wire drawing and wire rod processing (or rivet processing) to be commercialized as an electrical contact.
１０ ＡｇＣｕ系合金
２０ 第１電気接点材料
２１ 第１領域
２２ 第２領域
２３ 第３領域
３０ 第２電気接点材料
10 AgCu-based alloy 20 1st electrical contact material 21 1st region 22 2nd region 23 3rd region 30 2nd electrical contact material
Claims (7)
前記第１領域上に配置され、Ａｇを含有する第２領域と、
を備え、
前記第２領域におけるＣｕの含有率は、前記第１領域におけるＣｕの含有率より小さい、
電気接点材料。 The first region containing Ag and Cu,
A second region arranged on the first region and containing Ag,
With
The Cu content in the second region is smaller than the Cu content in the first region.
Electrical contact material.
請求項１に記載の電気接点材料。 A third region arranged on the second region and containing CuO is provided.
The electrical contact material according to claim 1.
請求項１又は２に記載の電気接点材料。 The thickness of the second region is 3 μm or less.
The electrical contact material according to claim 1 or 2.
前記電気接点材料は、
ＡｇとＣｕとを含有する第１領域と、
前記第１領域上に配置され、Ａｇを含有する第２領域と、
前記第２領域上に配置され、ＣｕＯを含有する第３領域と、
を有し、
前記第２領域におけるＣｕの含有率は、前記第１領域におけるＣｕの含有率より小さい、
電気接点材料の製造方法。 It is provided with a heat treatment step of forming an electrical contact material by heat-treating an AgCu-based alloy in an oxygen-containing atmosphere.
The electrical contact material is
The first region containing Ag and Cu,
A second region arranged on the first region and containing Ag,
A third region arranged on the second region and containing CuO,
Have,
The Cu content in the second region is smaller than the Cu content in the first region.
Manufacturing method of electrical contact material.
請求項４に記載の電気接点材料の製造方法。 A removal step for removing the third region is provided.
The method for manufacturing an electrical contact material according to claim 4.
請求項５に記載の電気接点材料の製造方法。 In the removal step, the third region is removed by barrel polishing.
The method for manufacturing an electrical contact material according to claim 5.
請求項５又は６に記載の電気接点材料の製造方法。 The thickness of the second region is 3 μm or less.
The method for producing an electrical contact material according to claim 5 or 6.
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| JPS5298626A (en) * | 1976-02-16 | 1977-08-18 | Mitsubishi Marorii Yakin Kougi | Material for silver oxide electric contact |
| JPH0410381A (en) * | 1990-04-26 | 1992-01-14 | Mitsubishi Heavy Ind Ltd | Induction heating control device |
| JPH04206122A (en) * | 1990-11-28 | 1992-07-28 | Toshiba Corp | Vacuum value |
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