JP2020140220A - Touch sensor - Google Patents

Abstract

To compactly and stably install a touch sensor to an external apparatus.SOLUTION: A touch sensor 1 includes a connection portion 10 that is disposed on a sensor substrate 2 and a connection substrate 4 such that the sensor substrate 2 and the connection substrate 4 are connected, and that includes a thin wall portion having a thickness smaller than a thickness of the sensor substrate 2. Wires 5, 5 and the like extend across the connection substrate 4 from a sensor unit 3 through a back surface of the connection portion 10. The connection substrate 4 is configured to be foldable to a back surface side of the sensor substrate 2 in a state where the wires 5, 5 and the like are along the back surface of the connection portion 10 by the connection portion 10.SELECTED DRAWING: Figure 5

Description

The present invention relates to a touch sensor.

Conventionally, as a touch sensor capable of performing a touch operation, for example, those shown in Patent Documents 1 and 2 are known.

In Patent Document 1, a substrate having a predetermined thickness, a sensor portion (first and second induction layers) formed on the substrate, and one end portion arranged on the substrate are electrically connected to the sensor portion. An electrostatic touch sensor with a plurality of wirings is disclosed. The other end of each wiring is arranged at the end of the substrate located outside the sensor.

Further, Patent Document 2 describes a substrate (base material sheet), a sensor unit composed of a plurality of electrodes formed on the substrate, and a plurality of sensors arranged on the substrate and one end of which is electrically connected to the sensor unit. A touch sensor comprising the above wiring and a flexible wiring board electrically connected to the other ends of the plurality of wirings is disclosed. The other end of each wiring is arranged at the end of the substrate (FPC connection) located outside the sensor. Further, the flexible wiring board is configured so that the tip portion thereof is connected to an external device in a state of being fixed to the end portion of the base material by an anisotropic conductive resin material.

Utility Model Registration No. 3168238 Japanese Unexamined Patent Publication No. 2015-18317

Here, when the touch sensor of Patent Document 1 is connected to an external device, the flexible wiring board is fixed to the end of the substrate with an anisotropic conductive resin material as in Patent Document 2, and is connected to the flexible wiring board. It was necessary to electrically connect the other end of each wiring. By forming a large area of the board end where the other end of each wiring is located, the area of the portion where the flexible wiring board and the board end are fixed increases, and as a result, the other end of each wiring and the flexible wiring The connection with the board was stable. However, if the area of the fixed portion is made too large, the projected area of the touch sensor in a plan view naturally becomes large, and it is difficult to install the touch sensor in a small external device such as a wristwatch. That is, in the conventional touch sensor, when trying to stabilize the connection state between each wiring and the flexible wiring board, it tends to be difficult to install the touch panel in a small external device.

The present invention has been made in view of these points, and an object of the present invention is to install a touch sensor compactly and stably with respect to an external device.

In order to achieve the above object, the touch sensor according to the embodiment of the present invention has a sensor substrate in which a sensor portion composed of a plurality of electrodes is formed on the back surface, a connection substrate continuous with the sensor substrate, and one end portion thereof. A plurality of wirings that are electrically connected to each electrode of the sensor unit on the back surface of the sensor board and whose other end is arranged on the back surface of the connection board, and the other end of each wiring that is attached to the back surface of the connection board. A connecting portion that is disposed between the sensor board and the connecting board so as to connect the electrically connected flexible wiring board and the sensor board and the connecting board, and includes a thin portion having a thickness smaller than the thickness of the sensor board. And have. The plurality of wires extend from the sensor portion through the back surface of the connecting portion to the connecting board, and the connecting board is bent toward the back surface side of the sensor board with the plurality of wirings along the back surface of the connecting portion by the connecting portion. It is characterized in that it is configured to be possible.

According to the present invention, the touch sensor can be installed compactly and stably with respect to an external device.

FIG. 1 is an overall perspective view showing a state before bending the connection substrate in the touch sensor according to the first embodiment of the present invention as viewed from above. FIG. 2 is an overall perspective view showing the touch sensor in a state where the connection board is bent as viewed from above. FIG. 3 is an overall perspective view showing the touch sensor in a state before the connection board is bent as viewed from below. FIG. 4 is an overall perspective view showing the touch sensor in a state where the connection board is bent as viewed from below. FIG. 5 is a partially enlarged perspective view showing the configuration of the touch sensor in a state where the connection board is bent. FIG. 6 is a partially enlarged view showing an enlarged portion A of FIG. FIG. 7 is a sectional view taken along line VII-VII of FIG. FIG. 8 is a view corresponding to FIG. 1 showing a state before bending the connection board in the touch sensor according to the second embodiment of the present invention as viewed from above. FIG. 9 is a partially enlarged cross-sectional view showing the configuration of the touch sensor in a state where the connection board is bent. FIG. 10 is a view corresponding to FIG. 1 showing a state before bending the connection board in the touch sensor according to the third embodiment of the present invention as viewed from above. FIG. 11 is a view corresponding to FIG. 2 showing a touch sensor in a state where the connection board is bent as viewed from above. FIG. 12 is a view corresponding to FIG. 4 showing a touch sensor in a state where the connection board is bent as viewed from below. FIG. 13 is a partially enlarged view schematically showing a broken portion of the touch sensor in a state where the connection board is bent.

Hereinafter, each embodiment of the present invention will be described in detail with reference to the drawings. The following description of each embodiment is merely an example and is not intended to limit the present invention, its application or its use.

[First Embodiment]
1 to 4 show the entire touch sensor 1 according to the first embodiment of the present invention. The touch sensor 1 is a sensor type input device capable of performing a touch operation. The touch sensor 1 includes various devices incorporating a display device such as a liquid crystal display or an organic EL display (for example, an in-vehicle device such as a car navigation system, a personal computer display device, a mobile phone, a personal digital assistant, a portable game machine, etc. It is used as an input device for copy machines, ticket vending machines, automatic cash deposit machines, watches, etc.). In particular, the touch sensor 1 is useful as an input device for incorporating into a relatively small device such as a wristwatch.

In the following description, the X-axis direction shown in each figure is the direction from the left side to the right side of the touch sensor 1 shown in FIG. 1, and the Y-axis direction is the front side of the touch sensor 1 shown in FIG. 1 (touch sensor 1). The direction from the rear side) to the back side (front side of the touch sensor 1) and the Z-axis direction are defined as the directions from the back surface of the sensor substrate 2 described later to the lower side of the touch sensor 1 shown in FIG. It should be noted that such a positional relationship is irrelevant to the actual direction of the touch sensor 1 or the device in which the touch sensor 1 is incorporated.

As shown in FIGS. 1 to 4, the touch sensor 1 includes a sensor substrate 2. The sensor substrate 2 is made of a light-transmitting resin material such as polyethylene terephthalate, polyether sulfone, polycarbonate, PMMA (acrylic), or a glass material. Further, the sensor substrate 2 is formed in a rectangular plate shape and has a thickness of, for example, about 1 to 3 mm. That is, the sensor substrate 2 is configured as a plate material having relatively high rigidity.

On the front surface side of the sensor substrate 2, a window frame portion 2a having a substantially frame shape in a dark color such as black is formed on the outer periphery thereof by printing or the like. Further, on the surface side of the sensor substrate 2, a light-transmitting operation surface 2b is formed in an internal rectangular region surrounded by the window frame portion 2a. The operation surface 2b is configured as a surface on the side where the user's fingers or the like come into contact with the touch operation of the touch sensor 1.

As shown in FIGS. 3 and 4, the sensor substrate 2 has a capacitance type sensor unit 3 capable of detecting a touch operation by a user's finger (detection target) in contact with the operation surface 2b. There is. The sensor unit 3 is composed of a plurality of electrodes (not shown). As the material of each electrode, for example, a transparent conductive film having light transmittance such as indium tin oxide or tin oxide, or a conductive layer having a mesh structure in which a conductive metal (conductor) such as copper is formed in a mesh shape is used. Are suitable.

As shown in FIGS. 1 to 4, a connection board 4 for attaching the flexible wiring board 8 described later is provided at the rear end of the sensor board 2. The connection board 4 is made of the same material as the sensor board 2 and is continuous with the sensor board 2. Specifically, the connection board 4 projects from the rear end portion of the sensor board 2 in the direction opposite to the Y-axis direction, and is integrally formed with the sensor board 2 via a connecting portion 10 described later. Further, the connection board 4 is formed shorter than the sensor board 2 in the X-axis direction. Further, the connecting substrate 4 is formed so that the thickness is larger than the thickness of the connecting portion 10 described later.

As shown in FIGS. 3 and 4, the sensor unit 3 (plurality of electrodes) is provided with a plurality of wirings 5, 5, ... For electrically connecting to an external circuit (not shown). Wiring 5, 5, ... Are arranged on the back surfaces of the sensor substrate 2, the connecting substrate 4, and the connecting portion 10 described later (see FIG. 5). Specifically, one end portion 5a of each wiring 5 is arranged on the back surface of the sensor substrate 2 and is electrically connected to the sensor portion 3. Further, the other end 5b of each wiring 5 is arranged on the back surface of the connection board 4 and is electrically connected to the flexible wiring board 8 described later. In this way, the plurality of wirings 5, 5, ... Extend from the sensor unit 3 through the back surface of the connecting unit 10 to the connecting substrate 4.

As shown in FIG. 6, each wiring 5 has a mesh structure in which conductors 7 are formed in a mesh shape. Specifically, this mesh structure is made of a conductive metal such as copper in the grooves 6, 6, ... (See FIG. 7) formed on the back surfaces of the sensor substrate 2, the connecting substrate 4, and the connecting portion 10 described later. The conductor 7 is configured as an embedded conductive layer. In FIGS. 6 and 7, in order to emphasize each conductor 7, each conductor 7 is hatched with dots.

As shown in FIGS. 1 to 5, the touch sensor 1 includes a flexible wiring board 8. The flexible wiring board 8 is configured to be flexible and its electrical characteristics do not change even in a deformed state. The tip of the flexible wiring board 8 is fixed to the back surface of the connection board 4 by, for example, an anisotropic conductive resin material (not shown).

Here, since the connection board 4 is made of a plate material having a thickness larger than the thickness of the connecting portion 10 described later and having a relatively high rigidity like the sensor board 2, when the flexible wiring board 8 is crimped. It is possible to suppress deformation of the connection substrate 4 during heating and pressurization. That is, the connection stability between the flexible wiring board 8 and the connection board 4 is improved, and the flexible wiring board 8 can be mounted on the connection board 4 in a stable state. Further, since the connection board 4 functions as a reinforcing plate after the flexible wiring board 8 is mounted, the load applied to the mounting portion between the connection board 4 and the flexible wiring board 8 is reduced, and as a result, the touch sensor It is also possible to improve the handleability of 1.

As shown in FIGS. 1 to 4, a connecting portion 10 for connecting the sensor board 2 and the connecting board 4 is arranged between the sensor board 2 and the connecting board 4. Specifically, the connecting portion 10 connects the sensor board 2 and the connecting board 4 on the rear side of the sensor board 2.

The connecting portion 10 is made of the same material as the sensor substrate 2 and the connecting substrate 4. Further, as shown in FIG. 5, the connecting portion 10 includes a thin portion having a thickness smaller than the thickness of the sensor substrate 2. Specifically, in this embodiment, the connecting portion 10 is configured to be entirely composed of the thin-walled portion, and the upper surface thereof is located at a position lower than the operation surface 2b of the sensor substrate 2 in the Z-axis direction. .. Further, the connecting portion 10 is formed to be shorter than the sensor substrate 2 and substantially the same length as the connecting substrate 4 in the X-axis direction. When the sensor substrate 2, the connecting portion 10, and the connecting substrate 4 are integrally formed of a single resin material, they are formed by, for example, molding. When the sensor substrate 2, the connecting portion 10, and the connecting substrate 4 are made of two or more types of resin materials, they may be formed by so-called two-color molding.

Next, as a feature of the present invention, the connecting substrate 4 is configured to be bendable toward the back surface side of the sensor substrate 2 by the connecting portion 10. For example, the connection substrate 4 can be bent toward the back surface side of the sensor substrate 2 by bending the connecting portion 10 while heating with a heater. The thickness and material of the connecting portion 10 may be appropriately set so that the connecting substrate 4 can be bent toward the back surface side of the sensor substrate 2 at room temperature without heating.

As shown in FIGS. 2 and 4, the connection substrate 4 is bent toward the back surface side of the sensor substrate 2 so that the angle formed by the back surface thereof and the back surface of the sensor substrate 2 is approximately 90 °. That is, the connection board 4 is configured to extend along the Z-axis direction in a state of being bent with respect to the sensor board 2 (hereinafter referred to as “bent state”).

Further, as shown in FIG. 5, it is preferable that the back surface of the connecting portion 10 is formed into a curved surface in the bent state. The wirings 5, 5, ... Are in a state along the back surface of the connecting portion 10. Specifically, each wiring 5 is curved along the back surface of the connecting portion 10 with the conductor 7 embedded in each groove portion 6 (see FIG. 6).

(Action and effect of the first embodiment)
As described above, in the touch sensor 1 according to the first embodiment of the present invention, since the connecting portion 10 includes a thin portion smaller than the thickness of the sensor substrate 2, the bending rigidity of the connecting portion 10 is compared with that of the sensor substrate 2. Is low, and the connecting portion 10 is easily deformed. As a result, the connection board 4 can be bent toward the back surface side of the sensor board 2 at the position of the connection portion 10. Then, in the touch sensor 1 in the bent state, the projected area in a plan view is smaller than the projected area of the touch sensor 1 before the bent state. As a result, the bent touch sensor 1 can be compactly installed in a small external device such as a wristwatch. Further, since the bending rigidity of the connecting portion 10 is relatively low due to the thin portion, the deformed state of the connecting portion 10 can be easily maintained. Therefore, the mounting state of the flexible wiring board 8 with respect to the connection board 4 can be sufficiently stabilized even in the bent state. Further, the wirings 5, 5, ... Are along the back surface of the connecting portion 10 in a bent state. That is, in the bent state, each wiring 5 is compressed on the back surface side of the connecting portion 10. Therefore, each wiring 5 is less likely to be broken on the back surface of the connecting portion 10, and the energized state of the touch sensor 1 can be stabilized even when the projected area is reduced. Therefore, in the first embodiment of the present invention, the touch sensor 1 can be compactly and stably installed in a small external device.

Further, the connecting portion 10 is formed to be shorter than the sensor board 2 and substantially the same length as the connecting board 4 in the X direction (that is, a direction orthogonal to the connecting direction in which the sensor board 2 and the connecting board 4 are connected). ing. Therefore, the connection board 4 can be easily bent with respect to the sensor board 2, and the load generated on the connecting portion 10 in the bent state can be reduced.

Further, since the thickness of the connecting substrate 4 is larger than the thickness of the connecting portion 10, only the connecting portion 10 can be appropriately deformed.

Further, the back surface of the connecting portion 10 is formed on a curved surface in a state where the connecting substrate 4 is bent, and the wirings 5, 5, ... Are curved along the back surface of the connecting portion 10. Therefore, local stress concentration on each wiring 5 is suppressed on the back surface of the connecting portion 10, and breakage of each wiring 5 can be suppressed.

Further, a plurality of groove portions 6, 6, ... Are formed on the back surface of the connecting portion 10, and each wiring 5 is curved along the back surface of the connecting portion 10 with the conductor 7 embedded in each groove portion 6. are doing. As a result, each groove portion 6 is greatly curved together with the connecting portion 10 to reduce local stress concentration on the conductor 7 embedded in each groove portion 6, and as a result, breakage of each wiring 5 can be further suppressed. ..

Further, since the angle formed by the back surface of the sensor substrate 2 and the back surface of the connection substrate 4 is approximately 90 °, the projected area of the touch sensor 1 in a plan view can be sufficiently reduced. Even if the angle formed by the back surface of the sensor substrate 2 and the back surface of the connection substrate 4 is smaller than approximately 90 ° (acute angle), the projected area of the touch sensor 1 in a plan view can be sufficiently reduced. ..

Further, each wiring 5 has a mesh structure in which the conductor 7 is formed in a mesh shape. As a result of securing a plurality of conduction paths in each wiring 5 by this mesh structure, it is possible to stabilize the energized state of each wiring 5 arranged on the back surface of the connecting portion 10 in the bent state.

[Second Embodiment]
8 and 9 show the touch sensor 1 according to the second embodiment of the present invention. In this embodiment, the configuration of the connecting portion 10 and the bent state of the connecting substrate 4 are different from those of the touch sensor 1 according to the first embodiment. The other configuration of the touch sensor 1 according to this embodiment is the same as the configuration of the touch sensor 1 according to the first embodiment. Therefore, in the following description, the same parts as those in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 8 and 9, the connecting portion 10 has first and second thin-walled portions 21 and 22 whose thickness is smaller than the thickness of the sensor substrate 2. The first and second thin-walled portions 21 and 22 are formed in a concave shape so that the upper surfaces thereof are located below the operation surface 2b of the sensor substrate 2. An intermediate portion 23 having a thickness larger than that of the first and second thin-walled portions 21 and 22 is formed between the first thin-walled portion 21 and the second thin-walled portion 22.

The first thin-walled portion 21 is adjacent to the sensor substrate 2. Specifically, the first thin-walled portion 21 is formed so that the front end portion is continuous with the rear end portion of the sensor substrate 2 and the rear end portion is continuous with the front end portion of the intermediate portion 23. On the other hand, the second thin-walled portion 22 is adjacent to the connection substrate 4. Specifically, the second thin-walled portion 22 is formed so that the front end portion is continuous with the rear end portion of the intermediate portion 23 and the rear end portion is continuous with the front end portion of the connection substrate 4.

Then, in the connection board 4, the back surface of the connection board 4 faces the back surface of the sensor board 2 with the wirings 5, 5, ... By the first and second thin-walled portions 21 and 22 along the back surface of the connection portion 10. It is configured to be foldable. As a result, the flexible wiring board 8 attached to the connection board 4 is positioned below the liquid crystal display L so as to involve the liquid crystal display L (see the virtual line in FIG. 9) arranged under the touch sensor 1. It becomes possible. Therefore, even in this embodiment, the touch sensor 1 can be compactly installed in the external device.

[Third Embodiment]
10 to 13 show a touch sensor 1 according to a third embodiment of the present invention. In this embodiment, a holding member 30 for holding the bent state is added. Further, the configurations of the sensor substrate 2 and the connection substrate 4 are partially different from those of the first embodiment. The other configuration of the touch sensor 1 according to this embodiment is the same as the configuration of the touch sensor 1 according to the first embodiment. Therefore, in the following description, the same parts as those in FIGS. 1 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIGS. 10 to 13, in this embodiment, a recess 2c recessed in the Y-axis direction is formed at the rear end portion of the sensor substrate 2, and the connecting portion 10 is arranged in the recess 2c. ing. Further, a predetermined gap is formed between the inner portion of the recess 2c and the side portion of the connecting portion 10. Further, notch recesses 4a having a central portion cut out are formed on both side portions of the connection substrate 4.

A holding member 30 is arranged in the recess 2c of the sensor substrate 2. The holding member 30 is for holding the connection board 4 in a bent state toward the back surface side of the sensor board 2.

Outer frame portions 31, 31 extending in the Z-axis direction are provided on the side portions of the holding member 30, and the upper end portions of the outer frame portions 31 are arranged so as to fit within the respective gaps. Further, a protrusion 32 and a locking portion 35 are provided inside each outer frame portion 31, and the protrusion 32 is inserted into the notched recess 4a of the connecting substrate 4 to lock the surface side of the connecting substrate 4. It is designed to be locked by 35. This makes it possible to hold the connection board 4 in the bent state.

Further, as shown in FIG. 13, the holding member 30 has a support portion 33 for supporting the back surface of the connecting portion 10. The support portion 33 is located between the outer frame portions 31, 31 and is located on the back surface side of the connecting portion 10 and the connecting substrate 4. Further, a substantially semicircular projecting portion 34 projecting in the direction opposite to the Y-axis direction is formed at the tip end portion of the support portion 33. The protruding portion 34 is in contact with the back surface of the connecting portion 10 in the bent state. As a result, the back surface of the connecting portion 10 is maintained on a curved surface along the outer surface of the supporting portion 33.

As described above, in this embodiment, the holding member 30 for holding the connection board 4 in the bent state on the back surface side of the sensor board 2 is provided. Therefore, the bent state of the touch sensor 1 installed in the external device can be stably maintained for a long period of time.

Further, the holding member 30 is provided with a protruding portion 34 of a supporting portion 33 that supports the connecting portion 10 so that the back surface of the connecting portion 10 has a curved surface in a state where the connecting substrate 4 is bent. Therefore, the state in which the wiring 5 arranged on the back surface of the connecting portion 10 is unlikely to be broken can be stably maintained for a long period of time.

[Other Embodiments]
In the touch sensor 1 according to each of the above embodiments, the connecting portion 10 is formed to be shorter than the sensor substrate 2 and substantially the same length as the connecting substrate 4 in the X-axis direction, but the present invention is not limited to this embodiment. .. That is, the connecting board 4 and the connecting portion 10 may be formed to have the same length as the sensor board 2. Even in such a form, since the connection board 4 is configured to be bendable on the back surface side of the sensor board 2 by the connecting portion 10, the touch sensor 1 is compactly and stably installed with respect to the external device. be able to.

Further, as the touch sensor 1 according to each of the above embodiments, the touch sensor 1 is bent toward the back surface side of the sensor substrate 2 so that the angle formed by the back surface of the connection substrate 4 and the back surface of the sensor substrate 2 is approximately 90 °. However, it is not limited to this form. That is, the angle formed by the back surface of the connection board 4 and the back surface of the sensor board 2 may be set to an angle (acute angle) smaller than 90 °. Even in such a form, the projected area of the touch sensor 1 in the bent state in a plan view can be made smaller than the projected area before the bent state. Alternatively, the angle formed by the back surface of the connection substrate 4 and the back surface of the sensor substrate 2 is set to an angle larger than approximately 90 ° (obtuse angle), and the projected area of the touch sensor 1 in a plan view is made smaller than the projected area before bending. May be good. For example, if the touch sensor 1 has an angle formed by the back surface of the connection board 4 and the back surface of the sensor board 2 of about 80 ° to about 135 °, the projected area can be suppressed and the flexible wiring board 8 can be connected to an external device. Can also be easily done.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the invention.

The present invention can be industrially used as a touch sensor type input device for incorporating into a small external device such as a wristwatch or the like.

1: Touch sensor 2: Sensor board 3: Sensor part 4: Connection board 5: Wiring 6: Groove 7: Conductor 8: Flexible wiring board 10: Connecting part 21: First thin-walled part 22: Second thin-walled part 23: Intermediate part 30: Holding member 33: Support portion

Claims (10)

A sensor board with a sensor unit consisting of multiple electrodes formed on the back surface,
A connection board continuous with the sensor board and
A plurality of wirings in which one end is electrically connected to each of the electrodes of the sensor on the back surface of the sensor substrate and the other end is arranged on the back surface of the connection substrate.
A flexible wiring board attached to the back surface of the connection board and electrically connected to the other end of each wiring.
A connecting portion is provided between the sensor substrate and the connecting substrate so as to connect the sensor substrate and the connecting substrate, and includes a thin portion having a thickness smaller than the thickness of the sensor substrate.
The plurality of wirings extend from the sensor portion to the connection board via the back surface of the connecting portion.
The connection board is a touch sensor configured by the connecting portion so that the plurality of wirings can be bent toward the back surface side of the sensor board in a state of being along the back surface of the connecting portion. In the touch sensor according to claim 1,
The connecting portion is a touch sensor formed to be shorter than the sensor board and substantially the same length as the connecting board in a direction orthogonal to the connecting direction in which the sensor board and the connecting board are connected. In the touch sensor according to claim 1,
A touch sensor in which the thickness of the connection board is larger than the thickness of the connection portion. In the touch sensor according to claim 1,
The back surface of the connecting portion is formed into a curved surface in a state where the connecting substrate is bent.
A touch sensor in which the plurality of wires are curved along the back surface of the connecting portion. In the touch sensor according to claim 4,
A plurality of grooves are formed on the back surface of the connecting portion.
Each of the wirings is a touch sensor in which a conductor is embedded in each of the grooves and is curved along the back surface of the connecting portion. In the touch sensor according to claim 1,
A touch sensor in which the angle formed by the back surface of the connection board and the back surface of the sensor board is approximately 80 ° to approximately 135 °. In the touch sensor according to any one of claims 1 to 6.
Each of the wirings is a touch sensor having a mesh structure in which conductors are formed in a mesh shape. In the touch sensor according to any one of claims 1 to 7.
The connecting part
The first thin-walled portion adjacent to the sensor substrate and
It has a second thin-walled portion adjacent to the connection board, and has.
The connection board is configured to be bendable so that the back surface of the connection board faces the back surface of the sensor board while the plurality of wirings are along the back surface of the connection portion by the first and second thin-walled portions. The touch sensor. In the touch sensor according to claim 1,
A touch sensor further provided with a holding member for holding the connection board in a bent state on the back surface side of the sensor board. In the touch sensor according to claim 9,
The holding member is provided with a support portion that supports the connecting portion so that the back surface of the connecting portion has a curved surface in a state where the connecting substrate is bent.

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