JP2020091216A - Component state detection device - Google Patents

Abstract

To provide a component state detection device capable of efficiently detecting a state of an electronic component.SOLUTION: A component state detection device 10 for detecting a state of an electronic component W includes: parallel light generation means 11 having a light source 14, an optical member 16 in which a predetermined pattern is formed and light emitted from the light source 14 passes to be pattern light corresponding to the pattern, and a first telecentric lens 17 for emitting incident pattern light to parallel light P of which principal ray is parallel to an optical axis; imaging means 12 having a second telecentric lens 19 through which reflected light Q generated by reflecting the parallel light P to an electronic component W transmits; and image analysis means 13 for detecting the state of the electronic component W on the basis of a captured image of the imaging means 12.SELECTED DRAWING: Figure 1

Description

The present invention relates to a component state detection device that detects a state of an electronic component.

Conventionally, when electronic parts such as diodes, transistors, capacitors, inductors, ICs (Integrated Circuits) are stored in a pocket of a tray or a carrier tape, it is a non-contact type whether or not the electronic parts are arranged at predetermined positions in the pocket. It was judged by the sensor. For example, if an object is detected outside the pocket of the carrier tape by the non-contact type sensor, it is determined that the electronic component is not placed at the predetermined position, and if the object is not detected by the sensor, the electronic component is placed at the predetermined position. It is determined that it is distributed to.

However, the method described above cannot stably detect the arrangement of thin electronic components (for example, electronic components having a thickness of 0.1 mm). In this respect, it is conceivable that the arrangement of thin electronic components can be stably detected by adopting a method of deriving three-dimensional information using the phase shift method (see Patent Document 1). In addition, it is expected that the phase shift method can detect the shape of the electronic component in addition to the arrangement of the electronic component.

JP, 2007-240465, A

However, in order to detect the state (arrangement, shape, etc.) of electronic components using the phase shift method, it is necessary to perform imaging for one electronic component multiple times, and the state of many electronic components can be detected per unit time. There is a problem that this method cannot be adopted in a device that needs to do so.
The present invention has been made in view of such circumstances, and an object thereof is to provide a component state detection device capable of efficiently detecting the state of an electronic component.

The component state detecting device according to the present invention in accordance with the above-mentioned object, in the component state detecting device for detecting the state of an electronic component, a light source, a predetermined pattern is formed, the light emitted from the light source passes through the pattern. An optical member which becomes a corresponding pattern light; a parallel light generating means having a first telecentric lens for emitting the incident pattern light into a parallel light whose principal ray is parallel to the optical axis; and the parallel light. Is provided with an image pickup means having a second telecentric lens through which reflected light generated by being reflected by the electronic component is transmitted, and an image analysis means for detecting the state of the electronic component based on an image picked up by the image pickup means.

The component state detecting device according to the present invention includes a parallel light generation unit having a first telecentric lens that emits incident pattern light into parallel light whose principal ray is parallel to the optical axis, and parallel light to an electronic component. Since the image pickup means having the second telecentric lens through which the reflected light generated by the reflection is transmitted and the image analysis means for detecting the state of the electronic component based on the picked-up image of the image pickup means are provided, based on one picked-up image The state of the electronic component can be detected from the reflected light captured in the captured image, and the state of the electronic component can be detected by efficient processing in which one image of the electronic component is captured only once.

It is explanatory drawing of the component state detection apparatus which concerns on the 1st Embodiment of this invention. (A), (B), (C) is an explanatory view showing the relationship between the arrangement of electronic components and the bright part in the captured image. (A) And (B) is explanatory drawing which shows the difference of the parallel light and non-parallel light regarding the relationship between the position of an electronic component, and light. (A) And (B) is explanatory drawing which shows the relationship of arrangement|positioning of an optical member, a 1st telecentric lens, and an electronic component, and the focus of parallel light, respectively. (A) And (B) is explanatory drawing of the component state detection apparatus which concerns on the 2nd Embodiment of this invention, respectively. It is explanatory drawing which shows the modification which detects the arrangement|positioning of the electronic component adsorbed by the adsorption member. It is explanatory drawing which shows the relationship between the deformation|transformation of an electronic component, and the bright part in a captured image. (A) And (B) is explanatory drawing which shows the modification which determines whether the shape of the lead of an electronic component is normal.

Subsequently, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
As shown in FIGS. 1 and 2A, a component state detection device 10 according to the first exemplary embodiment of the present invention is a device for detecting the state of an electronic component W, and is configured to detect parallel light P as an electronic component. The parallel light generation means 11 for irradiating W, the image pickup means 12 provided at a position for capturing the reflected light Q generated by the reflection of the parallel light P by the electronic component W, and the image pickup means 12 for image pickup. An image analysis unit 13 for detecting the state of the electronic component W based on the image R is provided. The details will be described below.

As shown in FIG. 1, the parallel light generating means 11 has a light source 14, an optical member 16 having a predetermined pattern (slit 15 in this embodiment), and a telecentric lens 17 (first telecentric lens). ing. In the present embodiment, the light source 14 is an LED illumination and the optical member 16 is a plate-shaped stripe reticle (a photomask in which a plurality of slits are formed at equal intervals), but the invention is not limited thereto. The light emitted from the light source 14 passes through the optical member 16 and becomes pattern light corresponding to the slit 15 (that is, the pattern formed on the optical member 16).

The telecentric lens 17 is fixed in the hollow member 18, and the pattern light incident on the telecentric lens 17 has a plurality of (the same number as the slit 15) parallel rays whose principal rays are parallel to the optical axis (the optical axis of the telecentric lens 17). Light P is emitted. The parallel light P is reflected by the surface S of the electronic component W housed in the pocket T1 of the carrier tape T and arranged at a predetermined position as shown in FIGS. In S, a straight bright portion K that is brighter than other areas appears in each reflection area of the parallel light P. Each bright part K is parallel.
Hereinafter, in the present embodiment, it is assumed that the electronic component W is arranged at a position where an image is picked up by the image pickup means 12.

Here, since the parallel light P is irradiated on the surface S of the electronic component W, the position of the electronic component W is different and the parallel light P is generated on the surface S of the electronic component W, as shown in FIG. 3A. Even if the distance from the means 11 changes, the distance between the position at which one of the adjacent parallel light beams P reaches the surface S of the electronic component W and the position at which the other parallel light beam P reaches the surface S of the electronic component W do not change and are adjacent to each other. The distance between the bright parts K does not change. Therefore, in the present embodiment, even if the distance between the surface S of the electronic component W and the parallel light generating means 11 changes, the distance between the bright portions K appearing on the surface S of the electronic component W has a constant value. In addition to the case where the position of the electronic component W is different and the case where an electronic component having a different thickness from the electronic component W is adopted, the distance between the surface of the electronic component and the parallel light generating means 11 is changed.

On the other hand, as shown in FIG. 3(B), when two lights U that are not parallel to the surface S of the electronic component W are irradiated, a surface S of the electronic component W and a mechanism for irradiating the light U are provided. When the distance is changed, the distance between the position where one light U reaches the surface S of the electronic component W and the position where the other light U reaches the surface S of the electronic component W is changed.
Further, in the present embodiment, the direction in which the parallel light P (the chief ray of the parallel light P) is perpendicular to the optical member 16 and oblique to the surface of the electronic component W (non-parallel and non-perpendicular). The light source 14, the optical member 16, and the telecentric lens 17 are arranged so as to proceed to the.

As shown in FIG. 1, the image pickup unit 12 transmits the telecentric lens 19 (second telecentric lens) through which the reflected light Q generated by the reflection of the parallel light P on the surface of the electronic component W is transmitted, and the telecentric lens 19. An image sensor 20 for converting the reflected light Q into an electric signal is provided, and imaged images of the electronic component W (for example, imaged images R and R1 shown in FIGS. 2A, 2B, and 2C, respectively). , R2). An image analysis unit 13 that can be configured by a microcomputer or the like is connected to the image pickup unit 12, and the image analysis unit 13 can receive a picked-up image from the image pickup unit 12.

Since the imaging unit 12 has the telecentric lens 19, the size of the image (for example, the image of the electronic component W) does not change within the depth of field even if the distance between the imaging unit 12 and the subject is different. Then, of the reflected light generated by the reflection of the parallel light P on the surface of the electronic component W, only the reflected light Q whose principal ray is parallel to the optical axis of the image pickup means 12 (telecentric lens 19) (substantially reflected (Meaning only light Q) reaches the image sensor 20.
Note that FIGS. 1, 2A, 2B, and 2C do not describe reflected light in which the chief ray is not parallel to the optical axis of the imaging unit 12.

Next, the image of the electronic component W, the image of the surface S, and the image of the bright portion K in the captured image are referred to as the electronic component W′, the surface S′, and the bright portion K′ (that is, the bright portion K′ is The relationship between the reflected light Q) captured in the captured image, the arrangement of the electronic component W, and the distance between the bright portions K′ in the captured image will be described.
When the angle of the surface S of the electronic component W with respect to the parallel light P is different, the position where the parallel light P reaches on the surface S of the electronic component W is different as shown in FIGS. 2(A), (B), and (C). However, the distances between the reflected lights Q corresponding to the parallel lights P are different. Therefore, the captured image R (see FIG. 2A) obtained by capturing an image of the electronic component W in which the surface S is perpendicular to the optical axis of the image pickup means 12 and the surface S with respect to the optical axis of the image pickup means 12. The distances between the lightness values K′ are different from the captured images R1 and R2 (see FIGS. 2B and 2C) obtained by capturing the non-vertical electronic component W. In the example of FIG. 2B in which the angle formed by the parallel light P and the surface S is larger than the example of FIG. 2A, the interval of the lightness K′ is narrower than in the example of FIG. In the example of FIG. 2(C), which is smaller than the example of (A), the interval of the lightness K′ is wider than in the example of FIG. 2(A).

In the image analysis means 13, a range (hereinafter referred to as “normal range”) when the arrangement of the electronic components W is normal in the pocket T1 is preset as the distance between the bright portions K′ in the captured image. Has been done. The image analysis unit 13 analyzes the picked-up image acquired from the image pickup unit 12, detects a bright portion K′ on the surface S′ of the electronic component W′ in the picked-up image, and detects a bright portion K′ in the picked-up image. Is within the normal range, it is determined that the electronic component W is properly placed in the pocket T1. If the distance between the bright portions K′ in the captured image is outside the normal range, the electronic component W is detected. It is determined that the arrangement of the inside of the pocket T1 is not normal. In the present embodiment, a state in which the surface S of the electronic component W is arranged perpendicular to the optical axis of the image pickup means 12 is a state in which the electronic component W is normally arranged.

Here, the image pickup means 12 does not change the size of the image within the depth of field even if the distance to the subject changes. Therefore, even if the distance from the image pickup means 12 to the surface S of the electronic component W is different, the image pickup means As long as the angle of the surface S of the electronic component W with respect to 12 does not change, the distance between the bright portions K of the surface S of the electronic component W in the captured image and the width of each bright portion K do not change.
Therefore, the image analysis unit 13 can determine whether or not the arrangement of the electronic components having different thicknesses is normal, based on the one set normal range.

Further, in the component state detecting device 10, as shown in FIG. 4A, the main surface (the surface perpendicular to the parallel light P) of the optical member 16 and the telecentric lens 17 is parallel, and the normally arranged electrons are arranged. The surface S of the component W is not parallel to the main surfaces of the optical member 16 and the telecentric lens 17. Therefore, the virtual plane J on which all the parallel lights P are focused is not parallel to the surface S of the electronic component W normally arranged.

In this regard, as shown in FIG. 4B, the optical member 16 is arranged non-parallel to the main surface of the telecentric lens 17 (that is, inclined with respect to the parallel light P), and the optical member 16 is arranged. The virtual surface on which the main surface of the telecentric lens 17 is arranged and the virtual surface on which the surface S of the electronic component W that is normally arranged are arranged on the same straight line (a straight line orthogonal to the paper surface). By doing so, all the parallel lights P are focused on the surface S of the electronic component W normally arranged. Therefore, in order to focus all the parallel light P on the surface S of the electronic component W which is normally arranged (or to bring all the parallel light P to the surface S), the optical member 16 is moved to the telecentric lens 17. It may be arranged non-parallel to the main surface.

Next, referring to FIGS. 5A and 5B, a component according to a second embodiment of the present invention, which includes a plurality (two in the present embodiment) of parallel light generating means 31 and 32. The state detection device 30 will be described. In the component state detecting device 30, the same components as those of the component state detecting device 10 are designated by the same reference numerals and detailed description thereof will be omitted, and the electronic component W is stored in the pocket T1 of the carrier tape T. Then, it is assumed that it is arranged at a position where an image is taken by the imaging means 12.

The parallel light generating means 31 includes a light source 33, an optical member 34 having a plurality of slits formed therein, and a telecentric lens 36 (first telecentric lens) provided in a hollow member 35, and a chief ray of the telecentric lens 36. The parallel light P1 parallel to the optical axis is applied to the surface S of the electronic component W. When the parallel light P1 is reflected by the surface S of the electronic component W, a plurality of straight bright portions K1 appear on the surface S of the electronic component W in parallel.

The parallel light generating means 32 has a light source 37, an optical member 38 having a plurality of slits formed therein, and a telecentric lens 40 (first telecentric lens) provided in the hollow member 39, and the chief ray is the telecentric lens 40. The parallel light P2, which is parallel to the optical axis of, is applied to the surface S of the electronic component W at an angle different from that of the parallel light generating means 31. On the surface S of the electronic component W, a plurality of linear bright portions K2 appear due to the reflection of the parallel light P2 on the surface S of the electronic component W.

The bright portion K1 and the bright portion K2 are non-parallel. In the present embodiment, the parallel light generation means 31, 32 are arranged so that the bright portions K1, K2 substantially intersect.
The color (wavelength) of the light emitted from the light source 37 is different from the color (wavelength) of the light emitted from the light source 33, and the colors of the bright portion K1 and the bright portion K2 on the surface S of the electronic component W are different. The light sources 33 and 37 may emit light of the same color.

An image analysis unit (not shown) that acquires a captured image from the image capturing unit 12 is connected to the image capturing unit 12. In the image analysis means, pockets are respectively provided as intervals between bright portions K1′ (images of bright portions K1) and surfaces of bright portions K2′ (images of bright portions K2) on the surface S′ of the electronic component W′ in the captured image. A range (hereinafter, referred to as a “normal range”) when the arrangement of the electronic components W is normal in T1 is set in advance.
The image analysis means detects the bright portions K1′ and K2′ from the acquired captured image, and based on the spacing between the bright portions K1′ and the bright portions K2′ on the surface S′ of the electronic component W′ in the captured image. , The placement of the electronic component W is detected. Since the bright portions K1 and K2 have different colors, the image analysis unit can clearly distinguish and detect the bright portions K1′ and K2′ in the captured image.

Since the bright parts K1 and K2 are not parallel to each other, the component state detection device 30 can detect that the electronic component W is tilted regardless of the direction in which the surface S of the electronic component W is tilted from the normal position. is there.
Needless to say, the electronic parts to be detected are not limited to those housed in the pockets of the carrier tape. For example, the electronic parts housed in the tray or the electronic parts that are not in the housed state as shown in FIG. Parts can also be detected.

In the example shown in FIG. 6, the electronic component W is adsorbed by the adsorbing member 51 attached to the rotating body 50 so as to be able to move up and down (an example of advancing and retreating), and the surface S of the electronic component W is irradiated with the parallel light P3. The parallel light generating means 52 and the image pickup means 53 for imaging the surface S of the electronic component W in which the bright portion is exposed by the irradiation of the parallel light P3 are provided, and the electronic component W is horizontally arranged (normally arranged). It is detected whether or not it is adsorbed to the adsorbing member 51 in the state of ().

The detection of the electronic component is not limited to the arrangement of the electronic component, and for example, the shape of the electronic component can also be detected.
When the electronic component W is deformed in the example shown in FIG. 6, as shown in FIG. 7, a plurality of bright portions K3′ on the surface S′ of the electronic component W′ in the captured image R3 captured by the image capturing unit 53 are displayed. Some or all may not be evenly spaced or may not be straight. The image analysis means, when the distance between the adjacent bright portions K3′ on the surface S′ of the electronic component W′ in the captured image R3 is different from the others, or when there is a non-linear bright portion K3′, It is determined that the electronic component W is deformed. Therefore, the image analysis means can detect the state of the electronic component W (either the arrangement and/or the shape) based on the arrangement of the bright portion K3′ (the reflected light Q3 captured in the captured image) in the captured image R3. ..

Further, instead of the electronic component W in the example shown in FIG. 6, when the electronic component W1 in which the lead M is connected to the body portion L is applied as shown in FIGS. By irradiating the parallel light P3, it is possible to determine whether or not the lead M has a normal shape based on the image of the bright portion K4 appearing in the image of the lead M in the captured image.
In this example, as compared with the interval of the bright portion K4 on the lead M having a normal shape (see FIG. 8A), the interval of the bright portion K4 on the lead M with the tip side floating (FIG. 8(B)). (See) becomes narrower. It goes without saying that the part of the electronic component capable of detecting the shape is not limited to the lead, and the detection target for the specific part of the electronic component may be not only the shape but also the arrangement.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and changes in conditions and the like without departing from the gist are all within the scope of application of the present invention.
For example, in the optical member, the portion that transmits the light emitted from the light source does not need to be a through hole, and may be formed of a light transmissive material.
Further, the image analysis means may detect the state of the electronic component based on the change in the width or size of the reflected light instead of the interval of the reflected light (bright portion) in the captured image. The frequency component of the reflected light may be acquired by the conversion, and the state of the electronic component may be detected from the change in the frequency component.
Further, three or more parallel light generating means may be provided.
Further, the optical member is not limited to one having slits formed therein, and for example, an optical member in which dot-shaped bright portions appear at equal intervals (planar intervals) in the front-rear direction and the left-right direction on the surface of the electronic component. May be adopted.

10: Component state detection device, 11: Parallel light generation means, 12: Imaging means, 13: Image analysis means, 14: Light source, 15: Slit, 16: Optical member, 17: Telecentric lens, 18: Hollow member, 19: Telecentric lens, 20: Image sensor, 30: Component state detection device, 31, 32: Parallel light generating means, 33: Light source, 34: Optical member, 35: Hollow member, 36: Telecentric lens, 37: Light source, 38: Optical Member, 39: Hollow member, 40: Telecentric lens, 50: Rotating body, 51: Adsorption member, 52: Parallel light generating means, 53: Imaging means, J: Virtual surface, K, K′, K1, K1′, K2 , K2′, K3′, K4: bright part, L: body part, M: lead, P, P1, P2, P3: parallel light, Q, Q3: reflected light, R, R1, R2, R3: captured image, S, S': surface, T: carrier tape, T1: pocket, U: light, W, W', W1: electronic component

Claims (5)

In a component state detection device that detects the state of electronic components,
A light source, an optical member in which a predetermined pattern is formed, and light emitted from the light source passes through to become pattern light corresponding to the pattern, and the incident pattern light, the chief ray is parallel to the optical axis. Parallel light generating means having a first telecentric lens for emitting parallel light and emitting the parallel light;
An image pickup unit having a second telecentric lens, through which reflected light generated when the parallel light is reflected by the electronic component is transmitted;
An image analysis unit for detecting the state of the electronic component based on an image captured by the image capturing unit. 2. The component state detecting device according to claim 1, wherein there are a plurality of the parallel light generating means, and the plurality of the parallel light generating means respectively irradiate the electronic component with the parallel light at different angles. State detection device. The component state detection device according to claim 2, wherein the plurality of parallel light generation units emit the parallel light beams of different colors. The component state detection device according to any one of claims 1 to 3, wherein the optical member is a plate-shaped object and is arranged to be inclined with respect to the parallel light. apparatus. The component state detection device according to any one of claims 1 to 4, wherein the image analysis unit detects a state of the electronic component based on an arrangement of the reflected light captured in the captured image. A component state detection device characterized by:

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