JP2019203508A - Cryopump system, cryopump controller, cryopump regeneration method and cryopump - Google Patents

Abstract

To shorten a regeneration time of a cryopump.SOLUTION: A cryopump system comprises a cryopump 10, and a regeneration control unit 102 that controls the cryopump 10 according to a regeneration sequence including a discharge process that discharges a condensate from the cryopump 10 and in which roughing of the cryopump 10 is performed. The regeneration control unit 102 comprises a pressure drop rate calculation unit 114 that calculates a pressure drop rate in the cryopump 10 during roughing of the cryopump 10, and a pressure drop rate monitoring unit 116 that detects a reduction in the pressure drop rate during the roughing.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a cryopump system, a cryopump control device, and a cryopump regeneration method.

  The cryopump is a vacuum pump that traps and exhausts gas molecules by condensation or adsorption onto a cryopanel cooled to a very low temperature. The cryopump is generally used to realize a clean vacuum environment required for a semiconductor circuit manufacturing process or the like. Since the cryopump is a so-called gas storage type vacuum pump, regeneration is required to periodically discharge the trapped gas to the outside.

JP 2008-223538 A

  One exemplary object of one aspect of the present invention is to reduce the regeneration time of the cryopump.

  According to an aspect of the present invention, the cryopump and a discharge process for discharging the condensate from the cryopump, wherein the cryopump is controlled according to a regeneration sequence including a discharge process in which roughing of the cryopump is executed. A cryopump system including a regeneration control unit is provided. The regeneration control unit includes a pressure drop rate calculation unit that calculates a pressure drop rate in the cryopump during the roughing of the cryopump, and a pressure drop rate monitor that detects a reduction in the pressure drop rate during the roughing A section.

  According to an aspect of the present invention, there is provided a regeneration control unit that controls the cryopump in accordance with a regeneration sequence that includes a discharge process for discharging the condensate from the cryopump and that performs roughing of the cryopump. A cryopump controller is provided. The regeneration control unit includes a pressure drop rate calculation unit that calculates a pressure drop rate in the cryopump during the roughing of the cryopump, and a pressure drop rate monitor that detects a reduction in the pressure drop rate during the roughing A section.

  According to an aspect of the present invention, a cryopump is a discharge process for discharging condensate from a cryopump, wherein the cryopump is controlled according to a regeneration sequence including a discharge process in which roughing of the cryopump is executed. A playback method is provided. The controlling comprises calculating a pressure drop rate in the cryopump during the roughing of the cryopump and detecting a reduction in the pressure drop rate during the roughing.

  It should be noted that any combination of the above-described constituent elements, or those obtained by replacing the constituent elements and expressions of the present invention with each other between apparatuses, methods, systems, computer programs, recording media storing computer programs, and the like are also included in the present invention. It is effective as an embodiment of

  According to the present invention, the regeneration time of the cryopump can be shortened.

It is a figure showing typically a cryopump system concerning an embodiment with the present invention. It is a figure which shows roughly the structure of the cryopump control part which concerns on one embodiment of this invention. It is a flowchart which shows the principal part of the cryopump regeneration method which concerns on one embodiment of this invention. It is a figure which illustrates roughly pressure change in a cryopump concerning an embodiment of the present invention.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. In the description, the same elements are denoted by the same reference numerals, and repeated descriptions are omitted as appropriate. Moreover, the structure described below is an illustration and does not limit the scope of the present invention at all.

  FIG. 1 is a diagram schematically showing a cryopump system according to an embodiment of the present invention. The cryopump system includes a cryopump 10 and a cryopump control unit 100 that controls the vacuum pumping operation and the regeneration operation of the cryopump 10. The cryopump 10 is attached to a vacuum chamber such as an ion implantation apparatus or a sputtering apparatus, and is used to increase the degree of vacuum inside the vacuum chamber to a level required for a desired process. The cryopump control unit 100 may be provided integrally with the cryopump 10 or may be configured as a separate control device from the cryopump 10.

  The cryopump 10 has an intake port 12 for receiving gas. The air inlet 12 is an inlet to the internal space 14 of the cryopump 10. The gas to be exhausted enters the internal space 14 of the cryopump 10 through the air inlet 12 from the vacuum chamber to which the cryopump 10 is attached.

  In the following description, the terms “axial direction” and “radial direction” are sometimes used to express the positional relationship of the components of the cryopump 10 in an easily understandable manner. The axial direction represents the direction passing through the air inlet 12, and the radial direction represents the direction along the air inlet 12. For convenience, the fact that it is relatively close to the inlet 12 in the axial direction may be referred to as “up”, and that it is relatively distant may be called “down”. In other words, the distance from the bottom of the cryopump 10 may be referred to as “up” and the distance from the bottom of the cryopump 10 as “lower”. With respect to the radial direction, the proximity to the center of the intake port 12 may be referred to as “inside” and the proximity to the periphery of the intake port 12 may be referred to as “outside”. Such an expression is not related to the arrangement when the cryopump 10 is attached to the vacuum chamber. For example, the cryopump 10 may be attached to the vacuum chamber with the inlet 12 facing downward in the vertical direction.

  The cryopump 10 includes a low-temperature cryopanel 18 and a high-temperature cryopanel 19. The cryopump 10 includes a cooling system that cools the high-temperature cryopanel 19 and the low-temperature cryopanel 18. This cooling system includes a refrigerator 16 and a compressor 36.

  The refrigerator 16 is a cryogenic refrigerator such as a Gifford-McMahon refrigerator (so-called GM refrigerator). The refrigerator 16 is a two-stage refrigerator including a first stage 20, a second stage 21, a first cylinder 22, a second cylinder 23, a first displacer 24, and a second displacer 25. Therefore, the high temperature stage of the refrigerator 16 includes the first stage 20, the first cylinder 22, and the first displacer 24. The low temperature stage of the refrigerator 16 includes a second stage 21, a second cylinder 23, and a second displacer 25.

  The first cylinder 22 and the second cylinder 23 are connected in series. The first stage 20 is installed at a joint between the first cylinder 22 and the second cylinder 23. The second cylinder 23 connects the first stage 20 and the second stage 21. The second stage 21 is installed at the end of the second cylinder 23. A first displacer 24 and a second displacer 25 are arranged inside the first cylinder 22 and the second cylinder 23 so as to be movable in the longitudinal direction of the refrigerator 16 (left and right direction in FIG. 1). The first displacer 24 and the second displacer 25 are connected so as to be movable together. A first regenerator and a second regenerator (not shown) are incorporated in the first displacer 24 and the second displacer 25, respectively.

  The refrigerator 16 includes a drive mechanism 17 provided at the high temperature end of the first cylinder 22. The drive mechanism 17 is connected to the first displacer 24 and the second displacer 25 so that the first displacer 24 and the second displacer 25 can reciprocate inside the first cylinder 22 and the second cylinder 23, respectively. The drive mechanism 17 includes a flow path switching mechanism that switches the flow path of the working gas so that the supply and discharge of the working gas are periodically repeated. The flow path switching mechanism includes, for example, a valve unit and a drive unit that drives the valve unit. The valve unit includes a rotary valve, for example, and the drive unit includes a motor for rotating the rotary valve. The motor may be an AC motor or a DC motor, for example. The flow path switching mechanism may be a direct acting mechanism driven by a linear motor.

  The refrigerator 16 is connected to the compressor 36 through a high pressure conduit 34 and a low pressure conduit 35. The refrigerator 16 expands a high-pressure working gas (for example, helium) supplied from the compressor 36 to generate cold in the first stage 20 and the second stage 21. The compressor 36 collects the working gas expanded in the refrigerator 16, pressurizes it again, and supplies it to the refrigerator 16.

  Specifically, first, the drive mechanism 17 makes the high-pressure conduit 34 communicate with the internal space of the refrigerator 16. A high-pressure working gas is supplied from the compressor 36 to the refrigerator 16 through the high-pressure conduit 34. When the internal space of the refrigerator 16 is filled with high-pressure working gas, the drive mechanism 17 switches the flow path so that the internal space of the refrigerator 16 communicates with the low-pressure conduit 35. As a result, the working gas expands. The expanded working gas is recovered to the compressor 36. In synchronism with the supply and discharge of the working gas, the first displacer 24 and the second displacer 25 reciprocate inside the first cylinder 22 and the second cylinder 23, respectively. The refrigerator 16 generates cold in the first stage 20 and the second stage 21 by repeating such a heat cycle.

  The refrigerator 16 is configured to cool the first stage 20 to the first temperature level and cool the second stage 21 to the second temperature level. The second temperature level is lower than the first temperature level. For example, the first stage 20 is cooled to about 65K to 120K, preferably 80K to 100K, and the second stage 21 is cooled to about 10K to 20K.

  FIG. 1 shows a cross section including the central axis of the internal space 14 of the cryopump 10 and the central axis of the refrigerator 16. A cryopump 10 shown in FIG. 1 is a so-called horizontal cryopump. The horizontal cryopump is generally a cryopump in which the refrigerator 16 is disposed so as to intersect (usually orthogonal) the central axis of the internal space 14 of the cryopump 10. The present invention can be similarly applied to a so-called vertical cryopump. A vertical cryopump is a cryopump in which a refrigerator is disposed along the axial direction of the cryopump.

  The low-temperature cryopanel 18 is provided at the center of the internal space 14 of the cryopump 10. The low-temperature cryopanel 18 includes a plurality of panel members 26, for example. Each of the panel members 26 has, for example, a shape of a side surface of a truncated cone, that is, an umbrella shape. Each panel member 26 is usually provided with an adsorbent 27 such as activated carbon. The adsorbent 27 is bonded to the back surface of the panel member 26, for example. In this way, the low temperature cryopanel 18 includes an adsorption region for adsorbing gas molecules.

  The panel member 26 is attached to the panel attachment member 28. The panel attachment member 28 is attached to the second stage 21. In this way, the low temperature cryopanel 18 is thermally connected to the second stage 21. Therefore, the low-temperature cryopanel 18 is cooled to the second temperature level.

  The high temperature cryopanel 19 includes a radiation shield 30 and an entrance cryopanel 32. The high temperature cryopanel 19 is provided outside the low temperature cryopanel 18 so as to surround the low temperature cryopanel 18. The high temperature cryopanel 19 is thermally connected to the first stage 20, and the high temperature cryopanel 19 is cooled to the first temperature level.

  The radiation shield 30 is mainly provided to protect the low-temperature cryopanel 18 from radiant heat from the housing 38 of the cryopump 10. The radiation shield 30 is between the housing 38 and the low temperature cryopanel 18 and surrounds the low temperature cryopanel 18. The radiation shield 30 is opened at the upper end in the axial direction toward the air inlet 12. The radiation shield 30 has a cylindrical shape (for example, a cylinder) in which the lower end in the axial direction is closed, and is formed in a cup shape. There is a hole for mounting the refrigerator 16 on the side surface of the radiation shield 30, and the second stage 21 is inserted into the radiation shield 30 from there. The first stage 20 is fixed to the outer surface of the radiation shield 30 at the outer periphery of the mounting hole. Thus, the radiation shield 30 is thermally connected to the first stage 20.

  The inlet cryopanel 32 is disposed along the radial direction at the air inlet 12. The inlet cryopanel 32 is disposed at the shield opening end 31. The outer periphery of the inlet cryopanel 32 is fixed to the shield opening end 31 and is thermally connected to the radiation shield 30. The inlet cryopanel 32 is provided away from the low temperature cryopanel 18 in the axial direction. The inlet cryopanel 32 is formed, for example, in a louver structure or a chevron structure. The inlet cryopanel 32 may be formed concentrically around the central axis of the radiation shield 30, or may be formed in another shape such as a lattice shape.

  The inlet cryopanel 32 is provided to exhaust the gas that enters the air inlet 12. A gas (for example, moisture) condensing at the temperature of the inlet cryopanel 32 is trapped on the surface. The inlet cryopanel 32 is provided to protect the low-temperature cryopanel 18 from radiant heat from a heat source outside the cryopump 10 (for example, a heat source in a vacuum chamber to which the cryopump 10 is attached). In addition to radiant heat, the ingress of gas molecules is limited. The inlet cryopanel 32 occupies a part of the opening area of the air inlet 12 so as to limit the gas flow into the internal space 14 through the air inlet 12 to a desired amount.

  The cryopump 10 includes a housing 38. The housing 38 is a vacuum container for separating the inside and the outside of the cryopump 10. The housing 38 is configured to hold the internal space 14 of the cryopump 10 in an airtight manner. The housing 38 is provided outside the high temperature cryopanel 19 and surrounds the high temperature cryopanel 19. The housing 38 accommodates the refrigerator 16. That is, the housing 38 is a cryopump container that houses the high-temperature cryopanel 19 and the low-temperature cryopanel 18.

  The housing 38 is fixed to a part of the external environment temperature (for example, the high temperature part of the refrigerator 16) so as not to contact the high temperature cryopanel 19 and the low temperature part of the refrigerator 16. The outer surface of the housing 38 is exposed to the external environment, and has a higher temperature than the cooled high-temperature cryopanel 19 (for example, about room temperature).

  Further, the housing 38 includes an inlet flange 56 that extends radially outward from the open end thereof. The intake port flange 56 is a flange for attaching the cryopump 10 to the vacuum chamber. A gate valve (not shown) is provided at the opening of the vacuum chamber, and the inlet flange 56 is attached to the gate valve. In this manner, the gate valve is positioned above the inlet cryopanel 32 in the axial direction. For example, the gate valve is closed when the cryopump 10 is regenerated, and is opened when the cryopump 10 evacuates the vacuum chamber.

  A vent valve 70, a roughing valve 72, and a purge valve 74 are attached to the housing 38.

  The vent valve 70 is provided at, for example, the end of a discharge line 80 for discharging fluid from the inside of the cryopump 10 to the external environment. By opening the vent valve 70, the flow of the discharge line 80 is allowed, and by closing the vent valve 70, the flow of the discharge line 80 is blocked. The fluid to be discharged is basically a gas, but may be a liquid or a mixture of gas and liquid. For example, a liquefied gas condensed in the cryopump 10 may be mixed in the discharged fluid. By opening the vent valve 70, the positive pressure generated inside the housing 38 can be released to the outside.

  The roughing valve 72 is connected to the roughing pump 73. By opening / closing the roughing valve 72, the roughing pump 73 and the cryopump 10 are communicated or disconnected. By opening the roughing valve 72, the roughing pump 73 and the housing 38 are communicated, and by closing the roughing valve 72, the roughing pump 73 and the housing 38 are shut off. By opening the roughing valve 72 and operating the roughing pump 73, the inside of the cryopump 10 can be decompressed.

  The roughing pump 73 is a vacuum pump for evacuating the cryopump 10. The roughing pump 73 is a vacuum pump for providing the cryopump 10 with a base pressure level that is a low vacuum region of the operation pressure range of the cryopump 10, in other words, an operation start pressure of the cryopump 10. The roughing pump 73 can depressurize the housing 38 from atmospheric pressure to the base pressure level. The base pressure level corresponds to a high vacuum region of the roughing pump 73 and is included in an overlapping portion of the operating pressure range of the roughing pump 73 and the cryopump 10. The base pressure level is, for example, in the range of 1 Pa to 50 Pa (for example, about 10 Pa).

  The roughing pump 73 is typically provided as a vacuum device different from the cryopump 10 and forms, for example, a part of a vacuum system including a vacuum chamber to which the cryopump 10 is connected. The cryopump 10 is a main pump for the vacuum chamber, and the roughing pump 73 is an auxiliary pump.

  The purge valve 74 is connected to a purge gas supply device including a purge gas source 75. By opening and closing the purge valve 74, the purge gas source 75 and the cryopump 10 are communicated or shut off, and supply of the purge gas to the cryopump 10 is controlled. Opening the purge valve 74 allows a purge gas flow from the purge gas source 75 to the housing 38. By closing the purge valve 74, the purge gas flow from the purge gas source 75 to the housing 38 is blocked. By opening the purge valve 74 and introducing purge gas from the purge gas source 75 into the housing 38, the pressure inside the cryopump 10 can be increased. The supplied purge gas is discharged from the cryopump 10 through the vent valve 70 or the roughing valve 72.

  Although the temperature of the purge gas is adjusted to room temperature in this embodiment, in some embodiments, the purge gas may be a gas heated to a temperature higher than room temperature or a gas slightly lower than room temperature. In this document, room temperature is a temperature selected from the range of 10 ° C. to 30 ° C. or the range of 15 ° C. to 25 ° C., for example, about 20 ° C. The purge gas is, for example, nitrogen gas. The purge gas may be a dry gas.

  The cryopump 10 includes a first temperature sensor 90 for measuring the temperature of the first stage 20 and a second temperature sensor 92 for measuring the temperature of the second stage 21. The first temperature sensor 90 is attached to the first stage 20. The second temperature sensor 92 is attached to the second stage 21. The first temperature sensor 90 periodically measures the temperature of the first stage 20 and outputs a signal indicating the measured temperature to the cryopump control unit 100. The first temperature sensor 90 is connected to the cryopump control unit 100 so that its output can be communicated. The second temperature sensor 92 is similarly configured. The measured temperatures of the first temperature sensor 90 and the second temperature sensor 92 may be used in the cryopump control unit 100 as the temperatures of the high-temperature cryopanel 19 and the low-temperature cryopanel 18, respectively.

  A pressure sensor 94 is provided inside the housing 38. For example, the pressure sensor 94 is provided in the vicinity of the refrigerator 16 outside the high-temperature cryopanel 19. The pressure sensor 94 periodically measures the pressure of the housing 38 and outputs a signal indicating the measured pressure to the cryopump control unit 100. The pressure sensor 94 is connected to the cryopump control unit 100 so that its output can be communicated.

  The cryopump control unit 100 is configured to control the refrigerator 16 for the vacuum pumping operation and the regeneration operation of the cryopump 10. The cryopump control unit 100 is configured to receive measurement results of various sensors including a first temperature sensor 90, a second temperature sensor 92, and a pressure sensor 94. The cryopump control unit 100 calculates control commands to be given to the refrigerator 16 and various valves based on such measurement results.

  For example, in the evacuation operation, the cryopump control unit 100 controls the refrigerator 16 so that the stage temperature (for example, the first stage temperature) follows the target cooling temperature. The target temperature of the first stage 20 is normally set to a constant value. The target temperature of the first stage 20 is determined as a specification according to a process performed in a vacuum chamber to which the cryopump 10 is attached, for example. Further, the cryopump control unit 100 is configured to control exhaust from the housing 38 and supply of purge gas to the housing 38 for regeneration of the cryopump 10. The cryopump control unit 100 controls the opening / closing of the vent valve 70, the roughing valve 72, and the purge valve 74 during regeneration.

  The operation of the cryopump 10 having the above configuration will be described below. When the cryopump 10 is operated, first, before the operation, the inside of the cryopump 10 is roughly evacuated to the operation start pressure (for example, about 1 Pa to 10 Pa) through the rough evacuation valve 72. Thereafter, the cryopump 10 is operated. Under the control of the cryopump control unit 100, the first stage 20 and the second stage 21 are cooled by driving the refrigerator 16, and the high-temperature cryopanel 19 and the low-temperature cryopanel 18 that are thermally connected thereto are also included. To be cooled.

  The inlet cryopanel 32 cools gas molecules flying from the vacuum chamber toward the inside of the cryopump 10, and condenses and exhausts a gas (for example, moisture) whose vapor pressure is sufficiently low at the cooling temperature. A gas whose vapor pressure is not sufficiently low at the cooling temperature of the inlet cryopanel 32 passes through the inlet cryopanel 32 and enters the radiation shield 30. Of the gas molecules that have entered, the gas whose vapor pressure is sufficiently low at the cooling temperature of the low-temperature cryopanel 18 is condensed on the surface and exhausted. A gas whose vapor pressure does not become sufficiently low even at the cooling temperature (for example, hydrogen) is adsorbed by the adsorbent 27 that is bonded to the surface of the low-temperature cryopanel 18 and cooled, and then exhausted. In this way, the degree of vacuum of the vacuum chamber to which the cryopump 10 is attached can reach a desired level.

  By continuing the exhaust operation, gas is accumulated in the cryopump 10. In order to discharge the accumulated gas to the outside, the cryopump 10 is regenerated. The cryopump control unit 100 determines whether or not a predetermined regeneration start condition is satisfied, and starts regeneration when the condition is satisfied. If the condition is not satisfied, the cryopump control unit 100 does not start the regeneration and continues the evacuation operation. The regeneration start condition may include, for example, that a predetermined time has elapsed since the vacuum exhaust operation was started.

  FIG. 2 is a diagram schematically showing the configuration of the cryopump control unit 100 according to an embodiment of the present invention. Such a control device is realized by hardware, software, or a combination thereof. FIG. 2 schematically shows a configuration of a part of the related cryopump 10.

  The cryopump control unit 100 includes a regeneration control unit 102, a storage unit 104, an input unit 106, and an output unit 108.

  The regeneration control unit 102 is configured to control the cryopump 10 according to a regeneration sequence including a temperature raising process, a discharge process, and a cool-down process. The regeneration sequence provides, for example, full regeneration of the cryopump 10. In the full reproduction, all the cryopanels including the high temperature cryopanel 19 and the low temperature cryopanel 18 are reproduced. Note that the regeneration control unit 102 may control the cryopump 10 according to a regeneration sequence representing partial regeneration.

  The storage unit 104 is configured to store information related to the control of the cryopump 10. The input unit 106 is configured to receive an input from a user or another device. The input unit 106 includes, for example, an input unit such as a mouse and a keyboard for receiving an input from the user, and / or a communication unit for communicating with another device. The output unit 108 is configured to output information related to the control of the cryopump 10 and includes output means such as a display and a printer. The storage unit 104, the input unit 106, and the output unit 108 are connected to the playback control unit 102 so as to communicate with each other.

  The regeneration control unit 102 includes a valve control unit 110, a pressure monitoring unit 112, a pressure drop rate calculating unit 114, a pressure drop rate monitoring unit 116, and a phase transition estimation unit 118. The valve control unit 110 is configured to open and close the vent valve 70, the roughing valve 72, and / or the purge valve 74 according to the regeneration sequence. The valve control unit 110 determines the opening timing and closing timing of the vent valve 70, the roughing valve 72, and / or the purge valve 74 based on the input. The pressure monitoring unit 112, the pressure drop rate calculation unit 114, the pressure drop rate monitoring unit 116, and the phase transition estimation unit 118 will be described later.

  The temperature raising process is a first step of regeneration in which the low-temperature cryopanel 18 and / or the high-temperature cryopanel 19 of the cryopump 10 is heated from the extremely low temperature Tb to the regeneration temperature Ta. The extremely low temperature Tb is the standard operating temperature of the cryopump 10 and includes the operating temperature Tb1 of the high-temperature cryopanel 19 and the operating temperature Tb2 of the low-temperature cryopanel 18. As described above, the operating temperature Tb1 of the high-temperature cryopanel 19 is selected from a range of 65K to 120K, for example, and the operating temperature Tb2 of the low-temperature cryopanel 18 is selected from a range of 10K to 20K, for example.

  The regeneration temperature Ta is a cryopanel target temperature in the temperature raising process, and is a melting point of the condensate accumulated in the cryopump 10 or higher. The condensate contains, for example, water, in which case the regeneration temperature Ta is 273K or higher. The regeneration temperature Ta may be room temperature or higher. The regeneration temperature Ta may be the heat resistant temperature of the cryopump 10 or a temperature lower than that. The heat resistant temperature of the cryopump 10 may be, for example, about 320K to 340K (for example, about 330K).

  The regeneration control unit 102 is configured to control the cryopump 10 so as to adjust the temperature of the low-temperature cryopanel 18 and / or the high-temperature cryopanel 19 to the target temperature determined in the regeneration sequence. The regeneration control unit 102 uses the measured temperature of the first temperature sensor 90 and / or the second temperature sensor 92 as the temperature of the low temperature cryopanel 18 and / or the high temperature cryopanel 19.

  The regeneration control unit 102 controls at least one heat source provided in the cryopump 10 so as to control the temperature of the low-temperature cryopanel 18 and / or the high-temperature cryopanel 19 to a target temperature. For example, the regeneration control unit 102 may open the purge valve 74 so as to supply the purge gas to the housing 38 in the temperature raising process. Further, the regeneration control unit 102 may close the purge valve 74 so as to stop the supply of the purge gas to the housing 38. Thus, the purge gas may be used as a first heat source for heating the low-temperature cryopanel 18 and / or the high-temperature cryopanel 19 in the temperature raising process.

  In order to heat the low-temperature cryopanel 18 and / or the high-temperature cryopanel 19, a second heat source different from the purge gas may be used. For example, the regeneration control unit 102 may control the temperature increasing operation of the refrigerator 16. The refrigerator 16 is configured such that adiabatic compression occurs in the working gas when the drive mechanism 17 operates in the direction opposite to the cooling operation. The refrigerator 16 heats the first stage 20 and the second stage 21 with the compression heat thus obtained. Such heating is also referred to as reverse heating of the refrigerator 16. The high-temperature cryopanel 19 and the low-temperature cryopanel 18 are heated using the first stage 20 and the second stage 21 as heat sources, respectively. Or the heater installed in the refrigerator 16 may be used as a heat source. In this case, the regeneration control unit 102 can control the heater independently of the operation of the refrigerator 16.

  In the temperature raising process, one of the first and second heat sources may be used alone, or both may be used simultaneously. Similarly, in the discharge process, one of the first and second heat sources may be used alone, or both may be used simultaneously. The regeneration control unit 102 switches the temperature of the low-temperature cryopanel 18 and / or the high-temperature cryopanel 19 by switching between the first heat source and the second heat source or using both the first heat source and the second heat source. May be controlled to a target temperature.

  The regeneration control unit 102 determines whether or not the measured value of the cryopanel temperature has reached the target temperature. The regeneration control unit 102 continues the temperature increase until the target temperature is reached, and ends the temperature increase process when the target temperature is reached. The regeneration control unit 102 may continue the temperature raising process for a predetermined period after reaching the target temperature. At this time, the supply of the purge gas may be continued. When the temperature raising process ends, the regeneration control unit 102 starts the discharge process.

  In the temperature raising process, condensate and / or adsorbate on the low-temperature cryopanel 18 and / or the high-temperature cryopanel 19 may be discharged from the cryopump 10. The valve controller 110 may open the vent valve 70 and / or the roughing valve 72 and then close it in time to discharge condensate and / or adsorbate from the housing 38.

  The discharge process is a second step of regeneration in which condensate and / or adsorbate is discharged from the cryopump 10. Condensate and / or adsorbate is present on the low-temperature cryopanel 18 and / or the high-temperature cryopanel 19 at the extremely low temperature Tb. In the process of heating from the extremely low temperature Tb to the regeneration temperature Ta, the condensate and / or adsorbate is dissolved and finally vaporized. The regeneration control unit 102 continues the temperature adjustment of the low temperature cryopanel 18 and / or the high temperature cryopanel 19 to the regeneration temperature Ta or another target temperature in the discharge process.

  The gas re-vaporized from the surface of the cryopanel is discharged to the outside of the cryopump 10. The re-vaporized gas is discharged to the outside through the discharge line 80 or using the roughing pump 73, for example. The re-vaporized gas is discharged from the cryopump 10 together with a purge gas introduced as necessary.

  The discharge process may include rough and purge. Rough and purge is a process in which roughing of the housing 38 and supply of purge gas are alternately performed. In rough and purge, a combination of roughing and purging is executed once or a plurality of times. Typically, in rough and purge, the regeneration control unit 102 selectively performs roughing and purging. That is, when roughing (or purging) is being performed, purging (or roughing) is stopped. As an alternative, in rough and purge, one of roughing and purging may be intermittently performed while one of roughing and purging is performed continuously. This is also considered that roughing and supply of purge gas are performed alternately. The start and end of roughing and purging may be performed based on the pressure and / or pressure drop rate of the housing 38, or may be based on elapsed time.

  The regeneration control unit 102 continues the discharge process until the discharge completion condition is satisfied. The discharge completion condition is based on the pressure in the cryopump 10, for example, the pressure measured by the pressure sensor 94. For example, the regeneration control unit 102 determines that the condensate remains in the cryopump 10 while the measured pressure in the housing 38 exceeds a predetermined threshold value. Therefore, the cryopump 10 continues the discharge process. The regeneration control unit 102 determines that the condensate has been discharged when the measured pressure in the housing 38 is lower than the threshold value. In this case, the regeneration control unit 102 ends the discharge process and starts the cool-down process.

  The playback control unit 102 may execute a so-called build-up test. The build-up test in the cryopump regeneration is a process for determining that the condensate is discharged from the cryopump 10 when the pressure increase gradient from the pressure at the determination start time does not exceed the threshold value. This is also called a RoR (Rate-of-Rise) method. Therefore, the regeneration control unit 102 may end the discharge process when the amount of pressure increase per unit time at the base pressure level is below the threshold value.

  The pressure monitoring unit 112 is configured to monitor the pressure in the cryopump 10 (that is, in the housing 38) using the pressure measured by the pressure sensor 94. The pressure monitoring unit 112 may determine whether or not the pressure in the cryopump 10 is in a certain pressure region. This pressure region may be a pressure region higher than the operation start pressure of the cryopump. The pressure monitoring unit 112 may compare the pressure in the cryopump 10 with a pressure threshold value and determine whether the pressure is higher than the threshold value. This pressure threshold value may be an operation start pressure of the cryopump or higher pressure. The pressure threshold is higher than the base pressure level, and may be selected from the range of, for example, 50 Pa to 500 Pa, preferably 100 Pa to 200 Pa. This pressure region can also be called a quasi-base pressure level. Therefore, the pressure monitoring unit 112 determines whether or not the pressure in the cryopump 10 is at the base pressure level, or determines whether or not the pressure in the cryopump 10 is at the quasi-base pressure level. Good. The pressure monitoring unit 112 may store the pressure in the cryopump 10 and / or the determination result in the storage unit 104 and / or output it to the output unit 108.

  The pressure drop rate calculation unit 114 is configured to calculate the pressure drop rate in the cryopump 10 during roughing of the cryopump 10. The pressure drop rate calculation unit 114 periodically calculates the pressure drop rate from the pressure measured by the pressure sensor 94 while the roughing valve 72 is open. The pressure drop rate is the amount of pressure drop per unit time due to roughing. The pressure drop rate calculation unit 114 may calculate a logarithm (for example, a common logarithm) of the pressure drop rate from the measured pressure of the pressure sensor 94. The pressure drop rate calculation unit 114 outputs the calculated pressure drop rate to the pressure drop rate monitoring unit 116. The pressure drop rate calculation unit 114 may store the pressure drop rate in the storage unit 104 and / or output the pressure drop rate to the output unit 108.

  The pressure drop rate monitoring unit 116 is configured to monitor the pressure drop rate during roughing of the cryopump 10. The pressure drop rate monitoring unit 116 detects a reduction in the pressure drop rate during a single roughing. The pressure drop rate monitoring unit 116 may compare the pressure drop rate with a pressure drop rate threshold value and determine whether the pressure drop rate is higher than the threshold value. The pressure drop rate threshold may be a pressure drop rate at the start of the one roughing or a value somewhat smaller than that.

  The pressure drop rate monitoring unit 116 detects reduction of the pressure drop rate when the pressure drop rate falls below the pressure drop rate threshold. For example, the pressure drop rate monitoring unit 116 may detect a reduction in the pressure drop rate when the pressure drop rate falls below a pressure drop rate threshold value for the first time during one roughing. Alternatively, the pressure drop rate monitoring unit 116 may detect a reduction in the pressure drop rate when the pressure drop rate falls below the pressure drop rate threshold value for a predetermined time. The pressure drop rate monitoring unit 116 outputs the detection result to the phase transition estimation unit 118. The pressure drop rate monitoring unit 116 may store the detection result in the storage unit 104 and / or output the detection result to the output unit 108. The pressure drop rate monitoring unit 116 may detect a reduction in the pressure drop rate during roughing only when the pressure monitoring unit 112 determines that the measured pressure of the pressure sensor 94 is in a predetermined pressure region.

  The pressure drop rate monitoring unit 116 may detect the transition of the pressure drop rate from the first pressure drop rate region to the second pressure drop rate region during a single roughing. . The first pressure drop rate region may be a range of the pressure drop rate including the pressure drop rate at the start of the one roughing. The second pressure drop rate region may be a pressure drop rate range smaller than the first pressure drop rate region. The pressure drop rate monitoring unit 116 may detect the transition of the pressure drop rate as a reduction in the pressure drop rate.

  The phase transition estimation unit 118 is configured to estimate the phase transition of the condensate to be discharged from the cryopump 10. The phase transition estimation unit 118 estimates a change of the condensate from the liquid phase to the solid phase (that is, freezing of the condensate) when a decrease in the pressure drop rate during the roughing of the cryopump 10 is detected. The phase transition estimation unit 118 may store the estimation result in the storage unit 104 and / or output the estimation result to the output unit 108.

  The valve control unit 110 temporarily closes the roughing valve 72 and / or temporarily opens the purge valve 74 in response to the reduction in the detected pressure drop rate. The valve control unit 110 may temporarily close the roughing valve 72 and open the purge valve 74 temporarily. When the pressure monitoring unit 112 determines that the measured pressure of the pressure sensor 94 is within a predetermined pressure range, the valve control unit 110 temporarily opens the roughing valve 72 in response to the reduction in the detected pressure drop rate. May be closed and / or the purge valve 74 may be temporarily opened.

  The storage unit 104 stores playback parameters for defining a playback sequence. The reproduction parameter is predetermined experimentally or empirically and input from the input unit 106. The regeneration parameters include a cryopanel target temperature, a discharge completion condition, a pressure threshold value, and a pressure change rate threshold value. The cryopanel target temperature includes a regeneration temperature Ta and an extremely low temperature Tb. Each of the regeneration temperature Ta and the extremely low temperature Tb may be set as a single temperature, or may be set as a certain temperature range.

  The cool-down process is a final process of regeneration in which the cryopump 10 is re-cooled to the extremely low temperature Tb. The extremely low temperature Tb is a cryopanel target temperature in the cool-down process. When the discharge completion condition is satisfied, the discharge process is completed and the cool-down process is started. The cooling operation of the refrigerator 16 is started. The regeneration control unit 102 continues the cool-down process until the target temperature is reached, and ends the cool-down process when the target temperature is reached. Thus, the reproduction process is completed. The vacuum pumping operation of the cryopump 10 is resumed. The regeneration control unit 102 may be configured to perform a temperature adjustment operation of the refrigerator 16 that maintains the temperature of the low-temperature cryopanel 18 or the high-temperature cryopanel 19 at the target temperature in the vacuum exhaust operation.

  FIG. 3 is a flowchart showing a main part of a cryopump regeneration method according to an embodiment of the present invention. FIG. 4 is a diagram schematically illustrating a pressure change in the cryopump 10 according to an embodiment of the present invention. 3 and 4 show the discharge process in full regeneration. The vertical axis in FIG. 4 indicates pressure, and the horizontal axis indicates time.

  As described above, the regeneration control unit 102 executes the discharge process following the temperature raising process. The valve control unit 110 detects the completion of the temperature raising process, closes the purge valve 74 and opens the roughing valve 72 (S10). Thus, the roughing of the housing 38 is started (time ta in FIG. 4). The vent valve 70 is closed in the subsequent processing.

  The pressure monitoring unit 112 acquires the measured pressure P of the pressure sensor 94 during roughing (S12). The pressure monitoring unit 112 determines whether or not the measured pressure P is equal to or greater than the pressure threshold value Pt (S14). The pressure threshold value Pt is selected from a base pressure level or a quasi-base pressure level.

  When the measured pressure P is equal to or higher than the pressure threshold value Pt (Y in S14), the pressure drop rate calculation unit 114 calculates the pressure drop rate R from the measured pressure P of the pressure sensor 94 (S16). The pressure drop rate monitoring unit 116 may determine a pressure drop rate threshold value Rt for each roughing. For example, the pressure drop rate monitoring unit 116 may calculate the pressure drop rate threshold value Rt based on the initial pressure drop rate Ra calculated immediately after the start of roughing. The initial pressure drop rate Ra is illustrated in FIG. Alternatively, the pressure drop rate monitoring unit 116 may use a predetermined pressure drop rate threshold value Rt.

  The pressure drop rate monitoring unit 116 determines whether or not the pressure drop rate R is below the pressure drop rate threshold value Rt (S18). When the pressure drop rate R is equal to or greater than the pressure drop rate threshold value Rt (N in S18), the valve controller 110 continues roughing of the housing 38 (S10). Monitoring of the measurement pressure P and the pressure drop rate R is repeated. As shown in FIG. 4, the measured pressure P and the pressure drop rate R are periodically monitored at times ta + Δt, ta + 2Δt, ta + 3Δt,.

  On the other hand, when the pressure drop rate R is lower than the pressure drop rate threshold value Rt (Y in S18), the valve control unit 110 closes the roughing valve 72 and opens the purge valve 74 (S20). At time tb shown in FIG. 4, the pressure drop rate R becomes smaller than the pressure drop rate threshold value Rt. Thus, the roughing is finished and the purge is started.

  The valve control unit 110 ends the purge when the measured pressure P is increased to a predetermined pressure (for example, atmospheric pressure) or after a predetermined time from the start of the purge (time tc in FIG. 4). That is, the valve control unit 110 closes the purge valve 74 again and opens the roughing valve 72 again (S10). Thus, monitoring of the measured pressure P and the pressure drop rate R is repeated again. In this way, the regeneration control unit 102 performs rough and purge while monitoring the measured pressure P and the pressure drop rate R.

  When the measured pressure P is lower than the pressure threshold value Pt (N in S14), the regeneration control unit 102 ends the rough and purge (time td in FIG. 4). In this case, the regeneration control unit 102 may determine whether or not the discharge completion condition is satisfied following the end of the rough and purge. Alternatively, the regeneration control unit 102 may immediately end the discharge process and start the cool-down process.

  Roughing in rough and purge has the advantage of promoting water vaporization. This is because a large amount of water evaporates in a reduced pressure environment. However, since the heat of evaporation cools the water, at least a portion of it freezes again to become ice. Then, the amount of evaporation decreases. Therefore, purge gas is introduced. The ice is heated by the purge gas and returned to the water again. In this way, water is discharged from the cryopump 10 by repeating roughing and purging.

  Therefore, it is desirable to prevent refreezing in order to drain water efficiently. For this purpose, for example, it is desirable to start the purge at the timing when the water changes to ice. However, it is difficult in a typical playback sequence. This is because there is no way to know the timing of refreezing. It is not possible to specify the timing of refreezing simply by monitoring the pressure. This is because the pressure value at which refreezing occurs varies significantly depending on various factors such as the amount of water accumulated in the cryopump 10 and the exhaust capacity of the roughing pump 73.

  On the other hand, according to the present embodiment, the pressure drop rate R is monitored. The inventor has found that freezing of the condensate by the heat of evaporation results in a reduction in the pressure drop rate R. As shown in FIG. 4, the pressure drop rate R during the roughing gradually decreases compared to the initial pressure drop rate Ra at the start of the roughing. In particular, when the pressure is plotted on a logarithmic graph, a break point clearly appears in the pressure profile. By detecting such a transition of the pressure drop rate R, the refreezing timing of the condensate can be captured.

  Therefore, according to the present embodiment, it is possible to estimate the occurrence of a phase transition from the liquid phase to the solid phase of the condensate. It is possible to provide a method for estimating the phase transition timing that is more robust than simple pressure monitoring.

  Further, the reproduction control unit 102 can use the estimated phase transition timing as a trigger for executing the next event in the reproduction sequence. For example, as described above, the regeneration control unit 102 interrupts roughing with the detected refreezing timing as a trigger. Further, the regeneration control unit 102 starts purging with the detected refreezing timing as a trigger. By shifting from roughing to purging without refreezing, the condensate can be efficiently vaporized. Therefore, the reproduction time can be shortened.

  In the above, this invention was demonstrated based on the Example. It will be understood by those skilled in the art that the present invention is not limited to the above-described embodiment, and various design changes are possible, various modifications are possible, and such modifications are within the scope of the present invention. By the way.

  The regeneration control unit 102 may temporarily close the roughing valve 72 and continue to close the purge valve 74 in response to the reduction in the detected pressure drop rate. In this case, the regeneration control unit 102 temporarily closes the roughing valve 72 and turns off the heat source so as to increase heat input to the cryopanel from another heat source (for example, the refrigerator 16 and / or the heater). You may control. Alternatively, the regeneration control unit 102 may simply close the roughing valve 72 temporarily. Thereby, a cryopanel may be heated naturally. Therefore, the cryopump 10 may not be provided with the purge valve 74 and the purge gas source.

  The regeneration control unit 102 may temporarily open the purge valve 74 and control other heat sources (for example, the refrigerator 16 and / or the heater) in response to the reduction in the detected pressure drop rate. . In this way, the cryopanel may be heated by a plurality of heat sources.

  If the gas inflow amount through the purge valve 74 is larger than the gas outflow amount through the roughing valve 72, the regeneration control unit 102 temporarily opens the purge valve 74 in response to the reduction in the detected pressure drop rate, The opening of the roughing valve 72 may be continued.

  10 cryopump, 18 low temperature cryopanel, 19 high temperature cryopanel, 38 housing, 72 roughing valve, 74 purge valve, 94 pressure sensor, 100 cryopump control unit, 102 regeneration control unit, 110 valve control unit, 112 pressure monitoring unit, 114 pressure drop rate calculation unit, 116 pressure drop rate monitoring unit, 118 phase transition estimation unit.

Claims (7)

A cryopump system,
With a cryopump,
A discharge process for discharging condensate from the cryopump, wherein the cryopump is controlled in accordance with a regeneration sequence including a discharge process in which roughing of the cryopump is executed and a cool-down process for recooling the cryopump. A playback control unit,
The cryopump is
With cryopanels,
A cryopump container for accommodating the cryopanel;
A pressure sensor for measuring the pressure in the cryopump container during rough and purge in which roughing of the cryopump container and supply of purge gas to the cryopump container are alternately performed;
A roughing valve provided in the cryopump container,
The reproduction control unit
A pressure monitoring unit for determining whether or not a measured pressure of the pressure sensor during roughing of the cryopump is higher than a quasi-base pressure higher than a base pressure of the cryopump;
A pressure drop rate calculating unit for calculating a pressure drop rate in the cryopump during roughing of the cryopump;
A pressure drop rate monitoring unit that detects a reduction in the pressure drop rate during the roughing, and
The regeneration control unit, in the rough and purge,
When the measured pressure of the pressure sensor reaches the quasi-base pressure, the roughing is terminated,
When the pressure drop rate during the roughing is below the pressure drop rate threshold, the roughing is finished so that the roughing is finished even if the pressure sensor's measured pressure is higher than the quasi-base pressure. Control the valve,
The regeneration control unit determines whether or not a discharge completion condition is satisfied following the rough and purge, completes the discharge process and starts the cool-down process when the discharge completion condition is satisfied,
The cryopump system, wherein the regeneration control unit determines that the discharge completion condition is satisfied when a pressure increase amount per unit time at the base pressure falls below a threshold value. The regeneration sequence includes a heating process for heating the cryopump from a very low temperature to a melting point of the condensate or higher.
The cryoregenerative unit according to claim 1, wherein the regeneration control unit includes a phase transition estimation unit that estimates refreezing of the condensate when a reduction in the pressure drop rate during the roughing is detected. Pump system. The cryopump further includes a purge valve provided in the cryopump container,
The reproduction control unit
When the measured pressure of the pressure sensor reaches the quasi-base pressure, the supply of the purge gas is started,
When the pressure drop rate during the roughing is below a pressure drop rate threshold, the purge valve is configured to start the supply of the purge gas even when the measured pressure of the pressure sensor is higher than the quasi-base pressure. The cryopump system according to claim 1, wherein the cryopump system is controlled.   The cryopump system according to any one of claims 1 to 3, wherein the quasi-base pressure is in a range of 50 Pa to 500 Pa, and the base pressure is in a range of 1 Pa to 50 Pa. A cryopump control device,
Discharging process for discharging condensate from the cryopump, including a roughing and purging process in which roughing of the cryopump and supply of purge gas to the cryopump are alternately performed, and recooling the cryopump A regeneration control unit that controls the cryopump in accordance with a regeneration sequence including a cool-down process.
The reproduction control unit
A pressure monitoring unit that determines whether a measured pressure in the cryopump during roughing of the cryopump is higher than a quasi-base pressure higher than a base pressure of the cryopump;
A pressure drop rate calculating unit for calculating a pressure drop rate in the cryopump during roughing of the cryopump;
A pressure drop rate monitoring unit that detects a reduction in the pressure drop rate during the roughing, and
The regeneration control unit, in the rough and purge,
When the measured pressure in the cryopump reaches the quasi-base pressure, the roughing is terminated,
When the pressure drop rate during the roughing is below the pressure drop rate threshold, even if the measured pressure in the cryopump is higher than the quasi-base pressure, the roughing is terminated,
The regeneration control unit determines whether or not a discharge completion condition is satisfied following the rough and purge, completes the discharge process and starts the cool-down process when the discharge completion condition is satisfied,
The regeneration control unit determines that the discharge completion condition is satisfied when a pressure increase amount per unit time at the base pressure is lower than a threshold value. A cryopump regeneration method,
Discharging process for discharging condensate from the cryopump, including a roughing and purging process in which roughing of the cryopump and supply of purge gas to the cryopump are alternately performed, and recooling the cryopump And controlling the cryopump according to a regeneration sequence including a cool-down process
The controlling is performed in the rough and purge.
Determining whether the measured pressure in the cryopump during roughing of the cryopump is higher than a quasi-base pressure higher than the base pressure of the cryopump;
Calculating a pressure drop rate in the cryopump during roughing of the cryopump;
Detecting a reduction in the pressure drop rate during the roughing;
Ending the roughing when the measured pressure in the cryopump reaches the quasi-base pressure;
When the pressure drop rate during the roughing is below a pressure drop rate threshold value, the roughing is terminated even if the measured pressure in the cryopump is higher than the quasi-base pressure; Prepared,
The controlling determines whether or not a discharge completion condition is satisfied following the rough-and-purge, and completes the discharge process and starts the cool-down process when the discharge completion condition is satisfied. With
The method according to claim 1, wherein the discharge completion condition is determined to be satisfied when a pressure increase amount per unit time at the base pressure is below a threshold value. A cryopump,
With cryopanels,
A cryopump container for accommodating the cryopanel;
A pressure sensor for measuring the pressure in the cryopump container during rough and purge in which roughing of the cryopump container and supply of purge gas to the cryopump container are alternately performed;
A roughing valve provided in the cryopump container,
The roughing valve is in the rough and purge,
When the measured pressure of the pressure sensor reaches a quasi-base pressure higher than the base pressure of the cryopump, the roughing is terminated,
When the pressure drop rate during the roughing is below a pressure drop rate threshold, the roughing is terminated even if the measured pressure of the pressure sensor is higher than the quasi-base pressure,
The cryopump determines whether or not a discharge completion condition is satisfied following the rough-and-purge, and completes a discharge process of the regeneration sequence of the cryopump when the discharge completion condition is satisfied and performs a cool-down process. Configured to start
The cryopump according to claim 1, wherein the discharge completion condition is determined to be satisfied when a pressure increase amount per unit time at the base pressure falls below a threshold value.

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