JP2019201103A - Processing device - Google Patents

Abstract

To improve processing efficiency by increasing the speed at which a work piece is fed to be processed.SOLUTION: A processing device for processing a plate-like work piece comprises: a holding table having a holding surface on which the work piece is placed, having a function for holding the work piece on the holding surface, and rotatable around an axis perpendicular to the holding surface; an X-axis direction movement mechanism that moves the holding table in the X-axis direction; a Y-axis direction movement mechanism that moves the holding table in a Y-axis direction orthogonal to the X-axis direction; a control unit that simultaneously actuates the X-axis direction movement mechanism and the Y-axis direction movement mechanism, thereby process feeding the work piece, held on the holding table, in a process feeding direction on an XY plane different from the X-axis direction and Y-axis direction; and a processing unit that processes the work piece held on the holding table.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a processing apparatus for processing a workpiece such as a wafer having a device formed on a surface thereof.

  When manufacturing a device chip such as an IC (Integrated Circuit) chip on which a semiconductor device is mounted, first, a plurality of intersecting processing lines are set on the surface of the disk-shaped semiconductor wafer, and the section is defined by the processing lines. A device is formed in each region. Thereafter, the wafer is divided along the planned processing line.

  When the wafer is divided, for example, a laser processing apparatus that can irradiate the wafer with a laser beam having a wavelength that is transparent to the wafer is used. The wafer is irradiated with the laser beam along the planned processing line to be condensed inside the wafer, and a modified layer is formed by a multiphoton absorption process. When the crack is extended in the wafer thickness direction starting from the modified layer, the wafer is divided along the planned processing line to form individual device chips.

  Further, a cutting device having an annular cutting blade is used for dividing the wafer. The cutting blade includes a through hole in the center and a grindstone portion on the outer peripheral portion. When the rotating shaft is passed through the through hole, the cutting blade is rotated around the rotating shaft, and the grindstone is brought into contact with the wafer, the wafer is cut. When the wafer is cut along a planned processing line and divided, individual device chips can be formed.

  These processing apparatuses include a holding table that holds a workpiece, and a processing unit that processes the workpiece held on the holding table. The machining apparatus further includes a machining feed unit that moves the holding table in the machining feed direction, and an index feed unit that moves the holding table in an index feeding direction orthogonal to the machining feed direction (see Patent Document 1). ).

  In the processing apparatus, first, while processing the workpiece, the processing feed unit moves the holding table on which the workpiece is placed in the processing feed direction, and performs processing from one end of the workpiece to the other end along the planned processing line. carry out. Thereafter, the indexing feed unit is operated to move the holding table in the indexing feed direction, and then the machining feed unit is actuated to reverse the movement direction so that the one end from the other end side along the other scheduled machining line. Process to the side in the same way.

JP 2003-320466 A

  In recent years, wafers have been increased in size in order to improve device chip productivity. When a large wafer is used, the number of devices that can be formed on a single wafer increases, and the number of device chips that are formed increases, so that the production efficiency of device chips increases. However, since the number of lines to be processed increases correspondingly and the length of the line to be processed increases, the time required for processing per wafer also increases.

  Therefore, an improvement in the moving speed of the holding table that holds the workpiece is required. However, since the machining feed unit having a high-output drive source is large and expensive, a technique for improving the moving speed of the holding table by another method is particularly required.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a processing apparatus in which a moving speed of a holding table for holding a workpiece is large and processing efficiency is high.

  According to one aspect of the present invention, there is provided a processing apparatus for processing a plate-shaped workpiece, which includes a holding surface on which the workpiece is placed, and a function of holding the workpiece on the holding surface. A holding table having X, an X-axis direction moving mechanism that moves the holding table along the X-axis direction, and a Y-axis direction moving mechanism that moves the holding table along the Y-axis direction orthogonal to the X-axis direction. The X-axis direction and the Y-axis direction are different from each other on the workpiece held on the holding table by simultaneously operating the X-axis direction moving mechanism and the Y-axis direction moving mechanism. There is provided a processing apparatus comprising: a control unit capable of processing feed in an upper processing feed direction; and a processing unit for processing a workpiece held on the holding table.

  Preferably, an angle formed by the machining feed direction and the X-axis direction is 45 degrees, and an angle formed by the machining feed direction and the Y-axis direction is 45 degrees.

  Preferably, the control unit can change the processing feed direction while the processing by the processing unit is performed on the workpiece held on the holding table.

  Preferably, the processing unit is a laser processing unit capable of laser processing the workpiece by irradiating the workpiece with a laser beam.

  The processing apparatus includes an X-axis direction moving mechanism that moves the holding table in the X-axis direction, and a Y-axis direction moving mechanism that moves the holding table in the Y-axis direction orthogonal to the X-axis direction. For example, conventionally, one of the two moving mechanisms has been used as a machining feed unit, and the other has been used as an index feed unit. That is, one of the X-axis direction and the Y-axis direction is the machining feed direction, and the other is the index feed direction.

  On the other hand, in the processing apparatus according to one aspect of the present invention, when the holding table that holds the workpiece is processed and fed, both moving mechanisms are operated simultaneously. Then, the holding table moves along a machining feed direction different from the X-axis direction and the Y-axis direction. The speed of the holding table at this time is as follows: the X-axis direction moving mechanism attempts to move the holding table along the X-axis direction, and the Y-axis direction moving mechanism moves the holding table along the Y-axis direction. It is calculated by using the Pythagorean theorem from the Y-axis direction speed to be moved.

  For example, when the holding table is processed and fed by both moving mechanisms, the speed when the output of the moving mechanism is maximized is faster than when one moving mechanism is used as a machining feed unit. Therefore, in the processing apparatus according to one embodiment of the present invention, faster processing feed is possible, and the processing efficiency of the workpiece can be improved.

  Further, in the processing apparatus according to the present embodiment, the load of each moving mechanism when moving the holding table at a predetermined speed is smaller than when one moving mechanism is used as a processing feeding unit. Therefore, the wear of each moving mechanism is suppressed, the frequency of inspection and replacement can be reduced, and the operating time of the processing apparatus can be increased, so that the processing efficiency of the workpiece can be improved.

  Therefore, according to one embodiment of the present invention, there is provided a processing apparatus that has a large moving speed of a holding table that holds a workpiece and high processing efficiency.

It is a perspective view which shows typically the frame unit containing a to-be-processed object. It is a perspective view which shows a processing apparatus typically. It is a perspective view which shows typically an X-axis direction moving mechanism and a Y-axis direction moving mechanism. It is a perspective view which shows a processing apparatus typically.

  Embodiments of the present invention will be described with reference to the accompanying drawings. First, as an example of a plate-like workpiece processed by the processing apparatus according to the present embodiment, a wafer having a plurality of devices formed on the surface will be described with reference to FIG. FIG. 1 is a perspective view schematically showing a frame unit 11 including a wafer 1 which is a workpiece. The wafer 1 is, for example, a plate-like substrate made of a material such as silicon, SiC (silicon carbide), or another semiconductor, or a material such as sapphire, glass, or quartz.

  On the surface 1a of the wafer 1, for example, a plurality of intersecting scheduled processing lines 3 are set. A device 5 such as an IC (Integrated Circuit) is formed in each region partitioned by a plurality of processing lines 3. Finally, when the wafer 1 is divided along the planned processing line 3, individual device chips can be formed.

  For example, the wafer 1 is carried into a processing apparatus in a state of a frame unit 11 integrated with an adhesive tape 7 and an annular frame 9. In this case, since the wafer 1 is handled via the annular frame 9 and the adhesive tape 7, the wafer 1 is not easily damaged during transportation. When forming the frame unit 11, for example, the adhesive tape 7 is attached to the frame 9 so as to close the opening of the frame 9, and the adhesive tape 7 is attached to the back surface 1 b side of the wafer 1 in a region surrounded by the frame 9.

  When the frame unit 11 is formed and the wafer 1 is divided, the device chips to be formed are held on the adhesive tape 7, so that the device chips are difficult to disperse. Furthermore, when the adhesive tape 7 is expanded in the outer peripheral direction after the device chip is formed, the space between the device chips becomes wide and the device chip can be easily picked up. However, this embodiment is not limited to this, and the wafer 1 may be carried into the processing apparatus as it is.

  Next, the processing apparatus according to the present embodiment will be described. The processing apparatus includes a processing unit that processes a workpiece such as the wafer 1 along a planned processing line 3. The processing apparatus according to the present embodiment is a cutting apparatus that cuts a workpiece such as the wafer 1 along a planned processing line 3. The cutting apparatus includes an annular cutting blade having a through hole formed in the center. When the cutting blade is rotated and the grindstone portion disposed on the outer peripheral portion of the cutting blade is brought into contact with the wafer 1, the wafer 1 is cut.

  In addition, the processing apparatus according to the present embodiment, for example, irradiates the wafer 1 with a laser beam having a wavelength that is transmissive to the wafer 1 along the processing line 3 so as to be condensed inside the wafer 1, thereby performing a multiphoton absorption process. This is a laser processing apparatus that forms a modified layer inside the wafer 1. When a modified layer is formed inside the wafer 1 and cracks extend from the modified layer in the thickness direction of the wafer 1, the wafer 1 can be divided along the planned processing line 3. Hereinafter, in this embodiment, a case where the processing apparatus is a laser processing apparatus will be described as an example.

  FIG. 2 is a perspective view schematically showing the processing apparatus 2. The processing apparatus 2 includes a base 4 that supports each component, a holding table 6 provided above the base 4, and a processing unit 10 provided above the holding table 6.

  The holding table 6 includes a porous member exposed on the upper surface side, and a suction source (not shown) connected to the porous member. The upper surface of the porous member serves as a holding surface 6a on which the wafer 1 as a workpiece is placed. The holding table 6 includes a plurality of clamps 6b on the outer peripheral side of the holding surface 6a.

  When the wafer 1 in the state of the frame unit 11 is placed on the holding surface 6a, the frame 9 is gripped by the clamp 6b, and the negative pressure generated by the suction source is applied to the wafer 1 through the hole of the porous member, the wafer 1 is held in the holding table 6. Further, the processing apparatus 2 includes a rotation mechanism (not shown) that rotates the holding table 6 around an axis perpendicular to the holding surface 6a.

  The processing apparatus 2 includes an X-axis direction moving mechanism 14 and a Y-axis direction moving mechanism 16 that move the holding table 6 on the upper surface of the base 4. In the processing apparatus 2, when processing the wafer 1 held on the holding table 6, the X-axis direction moving mechanism 14 and the Y-axis direction moving mechanism 16 are actuated at the same time to make the XY different from the Y-axis direction and the X-axis direction. The wafer 1 placed on the holding table 6 is processed and fed in a processing feed direction 26 on a plane.

  The X-axis direction moving mechanism 14 includes a pair of guide rails 14a provided on the upper surface of the base 4 and extending along the X-axis direction, and a linear movement extending along the Y-axis direction orthogonal to the X-axis direction. A shaft 14b. The moving shaft 14b has a length corresponding to the distance between the pair of guide rails 14a, one end is slidably connected to one of the pair of guide rails 14a, and the other end is connected to the other of the pair of guide rails 14a. Are slidably connected. Both ends of the moving shaft 14b are connected to a pair of guide rails 14a via connecting members 14c, for example.

  The Y-axis direction moving mechanism 16 includes a pair of guide rails 16a provided on the upper surface of the base 4 and extending along the Y-axis direction, and a linear movement extending along the X-axis direction orthogonal to the Y-axis direction. A shaft 16b. The moving shaft 16b has a length corresponding to the distance between the pair of guide rails 16a, and one end of the pair of guide rails 16a is slidably connected to the other end of the pair of guide rails 16a. Are slidably connected. Both ends of the moving shaft 16b are connected to a pair of guide rails 16a via connecting members 16c, for example.

  A holding table support base 6c that supports the holding table 6 is provided at the intersection of the moving shaft 14b and the moving shaft 16b. The holding table support 6c is mounted so as to be slidable along the Y-axis direction with respect to the moving shaft 14b, and is mounted so as to be slidable along the X-axis direction with respect to the moving shaft 16b.

  The X-axis direction moving mechanism 14 further includes an X-axis direction driving source (not shown), and the Y-axis direction moving mechanism 16 further includes a Y-axis direction driving source (not shown). The X-axis direction drive source and the Y-axis direction drive source are, for example, linear motors.

  A plurality of coils arranged in the X-axis direction are provided inside the pair of guide rails 14a. The plurality of coils are arranged so that magnetic fields directed alternately in different directions can be formed along the Z-axis direction. On the other hand, in a region facing the guide rail 14a inside the connection member 14c, a plurality of magnets are arranged along the X-axis direction so that different poles are directed toward the guide rail 14a. When the reversal of the direction of the current of the plurality of coils is repeated and the reversal of the direction of the magnetic field is repeated, the moving shaft 14b can be moved along the X-axis direction by the magnetic interaction between the coil and the magnet.

  A plurality of coils arranged in the Y-axis direction are similarly provided inside the pair of guide rails 16a. On the other hand, in the region facing the guide rail 16a inside the connection member 16c, a plurality of magnets are similarly arranged along the Y-axis direction. By controlling the current direction of the plurality of coils, the moving shaft 16b can be moved along the Y-axis direction by the magnetic interaction between the coils and the magnet.

  In the processing apparatus according to this embodiment, the holding table support base 6c may be moved by another method. For example, the X-axis direction drive source includes a ball screw along the moving shaft 16b and a pulse motor provided at one end of the ball screw. The ball screw is screwed into a nut portion provided on the holding table support base 6c. When the pulse motor is operated to rotate the ball screw, the holding table support base 6c is moved along the moving shaft 16b in the X-axis direction. Move to.

  The Y-axis direction drive source is composed of, for example, a ball screw along the moving shaft 14b and a pulse motor provided at one end of the ball screw. The ball screw is screwed into a nut portion provided on the holding table support base 6c, and when the pulse motor is operated to rotate the ball screw, the holding table support base 6c is moved along the movement axis 14b in the Y-axis direction. Move to.

  The X-axis direction moving mechanism 14 and the Y-axis direction moving mechanism 16 function as a processing feed unit that processes and feeds a workpiece such as the wafer 1 held on the holding table 6. When both the moving mechanisms 14 and 16 are operated simultaneously, the holding table 6 is moved along the machining feed direction 26 different from the X-axis direction and the Y-axis direction.

  For example, if the moving speeds output by the X-axis direction moving mechanism 14 and the Y-axis direction moving mechanism 16 are adjusted and the Y-axis direction component and the X-axis direction component of the moving speed of the holding table 6 are the same, the machining feed direction 26 Is a direction in which the angle formed with the X-axis direction is 45 degrees and the angle formed with the Y-axis direction is 45 degrees.

  For example, when the Y-axis direction component of the moving speed of the holding table 6 is made larger than the X-axis direction component, the machining feed direction 26 approaches the Y-axis direction. On the other hand, when the X-axis direction component of the moving speed of the holding table 6 is made larger than the Y-axis direction component, the machining feed direction 26 approaches the X-axis direction. Thus, in the processing apparatus 2 according to the present embodiment, the workpiece can be processed and fed in an arbitrary direction by adjusting the outputs of the both moving mechanisms 14 and 16.

  When both the moving mechanisms 14 and 16 are operated simultaneously to function as a machining feed unit, the machining feed speed is calculated from the moving speeds output by the both moving mechanisms 14 and 16 using the Pythagorean theorem. That is, the calculated machining feed rate is the speed at which the X-axis direction moving mechanism 14 tries to move the holding table 6 in the X-axis direction, and the Y-axis direction moving mechanism 16 moves the holding table 6 in the Y-axis direction. It is calculated from the speed to be tried.

  When the X-axis direction moving mechanism 14 is operated to move the moving shaft 14b in the X-axis direction, the holding table support 6c can be moved along the X-axis direction. Further, when the Y-axis direction moving mechanism 16 is operated to move the moving shaft 16b in the Y-axis direction, the holding table support base 6c can be moved along the Y-axis direction. Here, the moving shaft 14b and the moving shaft 16b are disposed at different height positions so as not to interfere with each other's movement.

  On the rear side on the base 4 of the processing apparatus 2, a standing portion 4 a that supports the processing unit 10 is arranged. A processing unit support portion 8 whose tip is near the upper center of the base 4 is attached to the front surface (the surface facing the holding table 6) of the standing portion 4a. A processing unit 10 for processing the workpiece held on the holding table 6 and a camera unit 12 are disposed at the tip of the processing unit support 8.

  When the processing apparatus 2 is a laser processing apparatus, the processing unit 10 is a laser processing unit. The processing unit 10 can oscillate a laser beam having a wavelength that passes through the wafer 1, and can irradiate the workpiece such as the wafer 1 held on the holding surface 6 a of the holding table 6 with the laser beam. Then, by condensing the laser beam inside the wafer 1 along the planned processing line 3, a modified layer can be formed inside the wafer 1 by a multiphoton absorption process.

  The camera unit 12 captures the planned processing line 3 by photographing the surface 1 a of the workpiece such as the wafer 1 held on the holding table 6. The processing apparatus 2 changes the orientation of the wafer 1 by rotating the holding table 6 around an axis perpendicular to the holding surface 6a so that the processing scheduled line 3 is along the processing feed direction 26. That is, alignment can be performed by using the camera unit 12.

  The processing apparatus 2 according to the present embodiment further includes a control unit (not shown). The control unit has a function of controlling each component of the processing apparatus 2 such as the X-axis direction moving mechanism 14, the Y-axis direction moving mechanism 16, the holding table 6, the processing unit 10, and the camera unit 12. The control unit controls each component to perform processing with a predetermined content on the workpiece such as the wafer 1.

  For example, when laser processing is performed on the wafer 1, the control unit first captures the processing planned line 3 by imaging the wafer 1 held on the holding table 6 by the camera unit 12. Next, the holding table 6 is rotated so that the extending direction of the processing line 3 of the wafer 1 is along the processing feeding direction 26, and the holding surface table is positioned so that the processing unit 10 is positioned above the extended line of the processing line 3. 6 is moved.

  Then, the control unit operates the X-axis direction moving mechanism 14 and the Y-axis direction moving mechanism 16 simultaneously while causing the machining unit 10 to oscillate the laser beam to move the holding table 6 along the machining feed direction 26. Then, the wafer 1 is processed along the planned processing line 3 and a modified layer is formed inside the wafer 1.

  After carrying out the machining along one scheduled machining line 3, the control unit moves the holding table 6 in the indexing feed direction parallel to the holding surface 6a and perpendicular to the machining feed direction 26, and the other scheduled machining line 3 is moved. In the same way, the processing is performed. After processing along the planned processing line 3 along one direction, the holding table 6 is rotated at a predetermined angle, and processing is performed similarly along the planned processing line 3 along the other direction. Then, the modified layer is formed along all the planned processing lines 3.

  Note that the X-axis direction moving mechanism and the Y-axis direction moving mechanism of the processing apparatus 2 according to the present embodiment are not limited to this. FIG. 3 is a perspective view schematically showing another example of the Y-axis direction moving mechanism and the X-axis direction moving mechanism. FIG. 3 schematically shows an X-axis direction moving mechanism 18, a Y-axis direction moving mechanism 20, and a holding table support table 22 that supports the holding table arranged on the base 4 b. . In FIG. 3, other components are omitted for convenience of explanation.

  The X-axis direction moving mechanism 18 shown in FIG. 3 includes a pair of guide rails 18a extending along the X-axis direction and a moving frame 18b extending along the Y-axis direction. The moving frame 18b has a long side along the Y-axis direction corresponding to the distance between the pair of guide rails 18a, and one end of the pair of guide rails 18a is slidably connected to the pair of guide rails 18a. The other end of the guide rail 18a is slidably connected to the other guide rail 18a. The moving frame 18b is formed with a through hole 18c that penetrates the moving frame 18b in the vertical direction.

  The Y-axis direction moving mechanism 20 shown in FIG. 3 includes a pair of guide rails 20a that extend along the Y-axis direction, and a moving frame 20b that extends along the X-axis direction. The moving frame 20b has a long side along the X-axis direction having a length corresponding to the distance between the pair of guide rails 20a, and one end of the pair of guide rails 20a is slidably connected to the pair of guide rails 20a. The other end of the guide rail 20a is slidably connected to the other guide rail 20a. The moving frame 20b is formed with a through hole 20c that penetrates the moving frame 20b in the vertical direction.

  The moving frame 18b and the moving frame 20b are formed at different height positions so that the main parts do not collide with each other. And the holding table support stand 22 is arranged in the position where the through-hole 18c of the movement frame 18b and the through-hole 20c of the movement frame 20b overlap. A fixing portion 24 is connected to the lower surface of the holding table support 22 along the Z-axis direction perpendicular to the X-axis direction and the Y-axis direction. The fixed part 24 is pierced through the through hole 18c of the moving frame 18b and the through hole 20c of the moving frame 20b.

  The X-axis direction moving mechanism 18 includes an X-axis direction drive source (not shown), and the Y-axis direction moving mechanism 20 includes a Y-axis direction drive source (not shown). The X-axis direction drive source and the Y-axis direction drive source are constituted by, for example, a ball screw and a pulse motor. Or it comprises a linear motor.

  The X-axis direction drive source has a function of moving the holding table support 22 in the X-axis direction by moving the moving frame 18b in the X-axis direction and pushing and moving the fixing portion 24 of the holding table support 22 with the moving frame 18b. Is provided. The Y-axis direction drive source moves the holding table support 22 in the Y-axis direction by moving the moving frame 20b in the Y-axis direction and pushing and moving the fixing portion 24 of the holding table support 22 with the moving frame 20b. It has a function to make it.

  When the X-axis direction moving mechanism 18 and the Y-axis direction moving mechanism 20 are simultaneously operated, the holding table placed on the holding table support base 22 is moved in the machining feed direction 26 different from the X-axis direction and the Y-axis direction. it can.

  FIG. 4 schematically shows another example of the X-axis direction moving mechanism and the Y-axis direction moving mechanism. FIG. 4 is a perspective view schematically showing a processing apparatus equipped with an X-axis direction moving mechanism and a Y-axis direction moving mechanism according to another example. The processing device 28 shown in FIG. 4 is similar to the processing device 2 shown in FIG. 2 in that the base 30, the standing portion 30a, the holding table 32, the processing unit support portion 34, the processing unit 36, and the camera unit. 38.

  The Y-axis direction moving mechanism 40 includes a pair of guide rails 40a provided on the upper surface of the base 30 and extending along the X-axis direction, and a linear movement extending along the Y-axis direction orthogonal to the X-axis direction. A shaft 40b. The moving shaft 40b has a length corresponding to the distance between the pair of guide rails 40a, and one end of the pair of guide rails 40a is slidably connected to the other end of the pair of guide rails 40a. Are slidably connected.

  The X-axis direction moving mechanism 42 includes a pair of guide rails 42a provided on the upper surface of the base 4 and extending along the Y-axis direction, and a linear movement extending along the X-axis direction orthogonal to the Y-axis direction. A shaft 42b. The moving shaft 42b has a length corresponding to the distance between the pair of guide rails 42a, one end is slidably connected to one of the pair of guide rails 42a, and the other end is connected to the other of the pair of guide rails 42a. Are slidably connected.

  A holding table support base 32c that supports the holding table 32 is provided at the intersection of the moving shaft 40b and the moving shaft 42b. The holding table support base 32c is mounted so as to be slidable along the Y-axis direction with respect to the moving shaft 40b, and is mounted so as to be slidable along the X-axis direction with respect to the moving shaft 42b.

  A plurality of coils arranged in the Y-axis direction are provided inside the moving shaft 40b. The plurality of coils are arranged so that magnetic fields directed alternately in different directions can be formed along the Z-axis direction. In a region facing the moving shaft 40b inside the holding table support 32c, a plurality of magnets are arranged along the Y-axis direction so that different poles are directed toward the moving shaft 40b. When the reversal of the direction of the current of the plurality of coils is repeated and the reversal of the direction of the magnetic field is repeated, the holding table support base 32c can be moved along the Y-axis direction by the magnetic interaction between the coil and the magnet. .

  In addition, a plurality of coils arranged in the X-axis direction are similarly provided inside the moving shaft 42b. On the other hand, a plurality of magnets are similarly arranged along the X-axis direction in a region facing the moving shaft 42b inside the holding table support base 32c. By controlling the current direction of the plurality of coils, the holding table support base 32c can be moved along the X-axis direction by the magnetic interaction between the coils and the magnet. Also in the example shown in FIG. 4, the holding table 32 is processed and fed along the processing feed direction 26 by the Y-axis direction moving mechanism 40 and the X-axis direction moving mechanism 42.

  As described above, in the machining apparatus according to the present embodiment, the holding table is moved along the machining feed direction 26 different from the X axis direction and the Y axis direction by simultaneously operating the X axis direction moving mechanism and the Y axis direction moving mechanism. Can be moved.

  For example, when the holding table is moved using only one of the two moving mechanisms, the holding table cannot be moved faster than the maximum value of the output speed of the moving mechanism to be used. On the other hand, in the processing apparatus 2 according to the present embodiment, the processing speed can be reduced by maximizing the output speed of the both moving mechanisms, so that the time required for processing can be shortened and highly efficient processing can be performed. It becomes possible.

  Further, when the holding table is moved at a predetermined processing feed rate, when both moving mechanisms are used, the output speed of each moving mechanism can be made lower than when only one of the both moving mechanisms is used. Therefore, since the load applied to each moving mechanism is reduced, the wear of the moving mechanism is suppressed, and the frequency of inspection and replacement can be reduced. That is, since the stop time of the processing apparatus 2 for maintenance can be reduced, highly efficient processing of the workpiece can be realized.

  In particular, as shown in FIGS. 2 to 4, the X-axis direction moving mechanism and the Y-axis direction moving mechanism are formed of similar members, and the angle between the machining feed direction 26 and the X-axis direction and the Y-axis direction is 45. When the direction is set to the same direction, the same load is applied to the X-axis direction drive source and the Y-axis direction drive source. That is, since the X-axis direction moving mechanism and the Y-axis direction moving mechanism are similarly worn out, the maintenance timing of both moving mechanisms can be unified, and the convenience of maintenance is improved.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above-described embodiment, a case has been described in which the holding table 6 that holds the workpiece is linearly fed along the machining feed direction 26 different from the X-axis direction and the Y-axis direction. One embodiment is not limited to this.

  For example, in the processing apparatus 2 according to one aspect of the present invention, the control unit may be able to change the processing feed direction while the processing unit 10 performs processing on the workpiece held on the holding table 6. . When the machining feed direction can be changed while the workpiece is being machined, the machining apparatus 2 also follows the machining scheduled line even for the workpiece on which the machining scheduled line having a non-linear shape is set. To process the workpiece.

  Further, in the above-described embodiment, the holding table 6 is rotatable around an axis perpendicular to the holding surface 6 a, and the holding table 6 is rotated so that the processing line 3 of the workpiece is aligned with the processing feed direction 26. Although cases have been described, one embodiment of the present invention is not limited thereto. For example, in the processing apparatus according to an aspect of the present invention, the control unit detects the processing planned line 3 of the workpiece held on the holding table 6 with the camera unit 12, and processes the direction along the processing planned line 3 The feeding direction 26 may be set.

  The processing apparatus 2 according to one aspect of the present invention can move the holding table 6 in any direction by adjusting the outputs of the X-axis direction moving mechanism 14 and the Y-axis direction moving mechanism 16. Therefore, the holding table 6 can be processed and fed along any direction on the XY plane along the planned processing line 3 of the workpiece held by the holding table 6. In this case, since it is not necessary to rotate the holding table 6 around an axis perpendicular to the holding surface 6a, the processing of the workpiece can be started earlier.

  Further, in this case, after performing processing along all the planned processing lines 3 along one direction, when performing processing along the planned processing lines 3 along the other direction, the holding table 6 is There is also no need to rotate around an axis perpendicular to the holding surface 6a. That is, the control unit resets the machining feed direction 26 of the holding table 6 to the extension direction of the planned machining line 3 along the other direction.

  In this case, the X-axis direction moving mechanism 14 and the Y-axis direction moving mechanism 16 can be controlled to move the holding table 6 along the newly set processing feed direction 26 to perform processing. Therefore, the processing apparatus can complete the processing along all the planned processing lines 3 without rotating the holding table 6. Therefore, not only the time required for processing can be shortened, but also a rotating mechanism for rotating the holding table 6 can be omitted.

  The structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

DESCRIPTION OF SYMBOLS 1 Wafer 1a Front surface 1b Back surface 3 Process scheduled line 5 Device 7 Adhesive tape 9 Frame 11 Frame unit 2,28 Processing apparatus 4,4b, 30 Base 4a, 30a Standing part 6,32 Holding table 6a, 32a Holding surface 6b, 32b Clamp 6c, 22, 32c Holding table support base 8, 34 Processing unit support 10, 36 Processing unit 12, 38 Camera unit 14, 16, 18, 20, 40, 42 Moving mechanism 14a, 16a, 18a, 20a, 40a , 42a Guide rails 14b, 16b, 40b, 42b Moving shafts 14c, 16c Connecting members 18b, 20b Moving frames 18c, 20c Through holes 24 Fixed portions 26 Processing feed direction

Claims (4)

A processing device for processing a plate-shaped workpiece,
A holding table having a holding surface on which the workpiece is placed and having a function of holding the workpiece on the holding surface;
An X-axis direction moving mechanism for moving the holding table along the X-axis direction;
A Y-axis direction moving mechanism for moving the holding table along the Y-axis direction orthogonal to the X-axis direction;
By simultaneously operating the X-axis direction moving mechanism and the Y-axis direction moving mechanism, the workpiece held on the holding table is on an XY plane different from the X-axis direction and the Y-axis direction. A control unit capable of machining feed in the machining feed direction of
And a processing unit for processing the workpiece held on the holding table. An angle formed by the machining feed direction and the X-axis direction is 45 degrees,
The processing apparatus according to claim 1, wherein an angle formed by the processing feed direction and the Y-axis direction is 45 degrees.   2. The processing apparatus according to claim 1, wherein the control unit is capable of changing the processing feed direction while processing by the processing unit is performed on the workpiece held on the holding table.   The processing apparatus according to any one of claims 1 to 3, wherein the processing unit is a laser processing unit capable of laser processing the workpiece by irradiating the workpiece with a laser beam.