JP2019138658A - Contact probe and socket for semiconductor device including the same - Google Patents

Abstract

To provide a contact probe and a socket for a semiconductor device including the same, capable of facilitating contact probe assembling, and surely adjusting preload in a contact preload energizing member.SOLUTION: A stepped part 16A of a lower plunger 16 is slidably arranged in an inner peripheral surface of a large diameter part of an upper plunger 12, and received in and locked to a prescribed position by a pair of dowels 12Bd of the upper plunger 12 in a state in which the stepped part is pulled on the basis of an energizing force of a coil spring 14.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a contact probe and a semiconductor device socket including the contact probe.

  In a semiconductor device as an electronic device mounted on an electronic device or the like, for example, as disclosed in Patent Document 1, a test for removing a potential defect at a stage before mounting is performed on a socket for a semiconductor device (patent In Document 1, it is referred to as a socket for semiconductor elements). The semiconductor device socket includes a plurality of contact probes that electrically connect the above-described semiconductor device and a printed wiring board on which the semiconductor device socket is disposed (referred to as an inspection substrate in Patent Document 1). It is provided in the probe housing block. Such a contact probe has an upper plunger having an upper contact that is in contact with and electrically connected to the electrode portion of the semiconductor element, and a lower contact that is in contact with and electrically connected to the electrode portion of the printed wiring board. The lower plunger, and a coil spring that urges the upper plunger and the lower plunger in a direction away from each other are configured. The upper plunger has a contact shaft portion extending toward the insertion hole of the lower plunger, and a flange portion formed at the base end portion of the contact shaft portion, which is connected to the above-described upper contact. The lower plunger cooperates with the flange portion of the upper plunger to provide a flange portion that holds the coil spring in its free length state and an insertion hole into which the contact shaft portion is inserted into the lower contact member. Has a series. Accordingly, when the upper plunger, the lower plunger, and the coil spring are assembled to each other, the base portion of the contact shaft portion that is integrally formed with the flange portion of the upper plunger is inserted into one end of the coil spring, A connecting end formed integrally with the flange portion of the lower plunger is inserted into the other end (guide portion).

Japanese Patent No. 6011103

  When mounting a semiconductor device having a plurality of bumps at a fine pitch of 0.5 mm or less in a socket for a semiconductor device as disclosed in Patent Document 1, for example, a contact shaft portion having a diameter of 0.2 mm or less is provided. Forming the upper plunger by cutting may not be easy to manage its dimensions, and production efficiency may be poor. Also, it is difficult to assemble the fine upper plunger, the lower plunger, and the coil spring with a microscope or the like because the fitting accuracy of the contact shaft portion and the insertion hole is high. At that time, since the coil spring arranged between the above-described upper plunger and the lower plunger is held in its free length state, a preload (preload) was applied to the coil spring in order to adjust the spring load. It is also difficult to hold the upper plunger and the lower plunger in combination.

  In view of the above problems, the present invention provides a contact probe and a socket for a semiconductor device including the contact probe. The contact probe can be easily assembled, and the preload adjustment in the biasing member of the contact probe can be performed. An object of the present invention is to provide a contact probe that can be surely provided and a socket for a semiconductor device including the contact probe.

  In order to achieve the above object, a contact probe according to the present invention has a stepped cylindrical shape having a contact terminal portion having a contact portion that contacts one electrode portion and at least one locking portion that can be elastically displaced. The first plunger, the contact terminal portion having a contact portion that contacts the other electrode portion facing one electrode portion, and the locked portion that is pushed into the inner peripheral portion of the first plunger and locked to the locking portion. A second plunger having a portion, and is arranged between the end portion of the cylindrical portion of the first plunger and the contact terminal portion of the second plunger while being held with a predetermined compression amount, And an urging member that urges the plunger and the second plunger in directions away from each other.

  The distance between the pair of locking portions of the stepped cylindrical first plunger is smaller than the outer diameter of the locked portion of the second plunger, and the locked portion of the second plunger Is pushed between the pair of locking portions of the first plunger, the distance between the pair of locking portions of the first plunger is against the elastic force of the locked portion of the second plunger. After becoming larger than an outer diameter, the to-be-latched part of a 2nd plunger may be hold | maintained at a pair of latching part of a 1st plunger.

  The locking portion of the first plunger may be a protrusion protruding into the cylindrical portion of the stepped cylindrical first plunger having a seam, or the locking portion of the first plunger is The lance which protruded in the cylindrical part of the stepped cylindrical 1st plunger which has a seam may be sufficient. The stepped cylindrical first plunger having a seam may be formed in a cylindrical shape so that both end faces of the thin plate blank face each other. Furthermore, the outer diameter of the locked portion of the second plunger is formed larger than the distance between the pair of locking portions of the stepped cylindrical first plunger, and the cylinder of the first plunger The outer diameter of the shaft connected to the locked portion of the second plunger is smaller than the distance between the pair of locking portions of the first plunger. May be. The second plunger may be formed by press working including a coining process.

  Furthermore, the socket for a semiconductor device according to the present invention includes a contact probe, a contact probe housing portion that houses a plurality of contact probes, and an electrode that contacts a contact portion of the first plunger or the second plunger of the contact probe. A semiconductor device mounting portion that detachably accommodates a semiconductor device having a plurality of portions, and a housing disposed on a wiring board that is electrically connected to the contact probe.

  According to the contact probe according to the present invention and the socket for a semiconductor device including the contact probe, a contact terminal portion having a contact portion that comes into contact with either the electrode portion of the object to be inspected or the electrode portion of the wiring board; A stepped cylindrical first plunger having at least one latching portion that can be elastically displaced, and a wiring board facing the electrode part of the object to be inspected or the electrode part of the wiring board in contact with the contact part of the first plunger A contact terminal portion having a contact portion that comes into contact with the electrode portion or the electrode portion of the object to be inspected, and a locked portion that is pushed into the inner peripheral portion of the cylindrical portion of the first plunger and locked to the locking portion. And a second plunger having a first contact point, the contact probe can be assembled easily, and the biasing member is held at a predetermined compression amount with the end of the cylindrical portion of the first plunger. Second Disposed between the contact terminal of the plunger, it can preload adjustment in biasing member of the contact probe reliably since biasing the first plunger and the second plunger in a direction away from each other.

(A) is a perspective view showing the appearance of the first embodiment of the contact probe according to the present invention, (B) is a cross-sectional view of the contact probe along the IB-IB line shown in (A). . (A) is the expanded sectional view of the upper plunger shown by FIG. 1 (B), (B) is the arrow line view seen from the direction which the arrow IIB in (A) shows. (A) is a front view of the lower plunger shown in FIG. 1 (B), and (B), (C), and (D) are respectively a top view of the lower plunger shown in (A), It is a bottom view and a side view. It is a block diagram including the fragmentary sectional view which shows the structure of an example of the socket for semiconductor devices which concerns on this invention. It is a disassembled perspective view of the socket for semiconductor devices shown by FIG. FIG. 5 is a partial cross-sectional view showing a principal part VI of the socket for a semiconductor device shown in FIG. 4 partially enlarged. (A) is the schematic which expand | deployed the blank with which it uses for description of the processing procedure of an upper plunger, (B) and (C) are the front views and side views of a processed upper plunger, respectively. (A) And (B) is a perspective view of an upper plunger and a lower plunger which are provided for explanation of the assembly procedure of the contact probe, respectively, and a partially enlarged view showing a part of the perspective view. (A) And (B) is a perspective view of an upper plunger and a lower plunger which are provided for explanation of the assembly procedure of the contact probe, respectively, and a partially enlarged view showing a part of the perspective view. (A) And (B) is a perspective view of an upper plunger and a lower plunger which are provided for explanation of the assembly procedure of the contact probe, respectively, and a partially enlarged view showing a part of the perspective view. It is sectional drawing which shows the structure of 2nd Example of the contact probe which concerns on this invention. It is sectional drawing which expands and shows the upper plunger shown by FIG. (A), (B), and (C) are respectively a front view, a side view, and a rear view of the upper plunger shown in FIG. 11, and (D) is a direction indicated by an arrow XIIID in (B). It is the arrow view seen from. (A), (B), and (C) are respectively a front view, a rear view, and a cross-sectional view of the lower plunger shown in FIG. 12, and (D) is viewed from the direction indicated by the arrow XIVD in (A). FIG. (A) and (B) are respectively a perspective view of an upper plunger and a lower plunger used for explaining an assembly procedure of a third embodiment of the contact probe according to the present invention, and an enlarged part of the perspective view. FIG. (A) and (B) are respectively a perspective view of an upper plunger and a lower plunger used for explaining an assembly procedure of a third embodiment of the contact probe according to the present invention, and an enlarged part of the perspective view. FIG. (A) and (B) are respectively a perspective view of an upper plunger and a lower plunger used for explaining an assembly procedure of a third embodiment of the contact probe according to the present invention, and an enlarged part of the perspective view. FIG. It is sectional drawing which shows the structure of 4th Example of the contact probe which concerns on this invention. (A) is a front view of the lower plunger shown in FIG. (B) is an arrow view seen from the direction shown by arrow XIXB in (A), and (C) is an arrow view seen from the direction shown by arrow XIXC in (A).

  FIG. 4 schematically shows an example of a socket for a semiconductor device provided with a first embodiment of a contact probe according to the present invention or another embodiment to be described later.

  In FIG. 4, a plurality of semiconductor device sockets (hereinafter also referred to as IC sockets) are arranged on a printed circuit board PCB as a test board, for example. FIG. 4 typically shows one IC socket on the printed wiring board PCB.

  The printed wiring board PCB is made of, for example, glass epoxy resin, and is formed with a plurality of electrodes formed in a lattice shape corresponding to the arrangement of a plurality of contact probes 10ai (i = 1 to n, n are positive integers) described later. An electrode group (not shown) composed of pads is provided at the substantially central portion of one surface portion. Around it, there are formed four through holes into which machine screws (not shown) for fixing the IC socket are inserted.

  The IC socket includes, for example, a pressing mechanism unit, an upper housing 22 and a lower housing 20, and a contact probe group (see FIG. 6) arranged in a contact probe accommodating portion 22C formed in the upper housing 22 and the lower housing 20. It shall be equipped with.

  The pressing mechanism unit includes a pressing body 26 that presses the electrode surface of the mounted semiconductor device DV1 against the contact probe group, a base member 24 placed on the upper end surface of the upper housing 22, and both end portions of the base member 24. Each of them includes a latch member 28R and a latch member 28L that are rotatably supported and hold the pressing body 26 in a detachable manner in cooperation with each other.

  The semiconductor device DV1 includes, for example, an integrated circuit in a BGA type package. A plurality of hemispherical electrode portions DVa (see FIG. 6) are formed vertically and horizontally on the bottom of the semiconductor device DV1. The plurality of electrode portions DVa are formed vertically and horizontally at an interval of about 0.3 mm, for example. When the semiconductor device DV1 is positioned on the semiconductor device mounting portion 22A as the inspection object mounting portion of the upper housing 22 to be described later, each electrode portion DVa of the semiconductor device DV1 is expanded as shown in FIG. The contact probe 10ai that protrudes from the semiconductor device mounting portion 22A comes into contact with the contact portion 12Ap of the upper plunger 12 of the contact probe 10ai.

  In the pressing body 26, a pressing protrusion 26 </ b> P that protrudes toward the opening 24 a is formed at a portion facing the opening 24 a of the base member 24. As shown in FIG. 4, when the pressing body 26 is held by the upper housing 22 via the base member 24 with the semiconductor device DV1 mounted on the semiconductor device mounting portion 22A, the end surface of the pressing projection 26P Is in contact with the upper surface of the package of the semiconductor device DV1, and presses the semiconductor device DV1 toward the contact probe group.

  The outer dimensions of the base member 24 are set to be substantially the same as the outer dimensions of the upper housing 22 and the lower housing 20. An opening 24a through which the pressing portion 26P of the pressing body 26 passes is formed at the center of the base member 24 when the semiconductor device DV1 is attached or detached. Around the opening 24a, there are formed four through holes 24b into which small screws BS1 for fixing the base member 24 to the upper housing 22 are inserted. 4 and 5, one through hole 24b is representatively shown. Thereby, the machine screw BS1 is screwed into the female screw hole 22FS1 of the upper housing 22 described later through the through hole 24b. A positioning pin 24P1 for positioning the pressing body 26 with respect to the opening 24a is integrally formed on the upper surface portion of the base member 24. The positioning pin 24P1 is fitted into a positioning hole (not shown) of the pressing body 26. A positioning pin 24P2 for positioning the opening 24a of the base member 24 and the pressing portion 26P of the pressing body 26 with respect to the semiconductor device mounting portion 22A of the upper housing 22 is integrally formed on the lower surface portion of the base member 24. Yes.

  Since the latch members 28R and 28L have the same structure, the structure of the latch member 28R will be described, and the description of the structure of the latch member 28L will be omitted. The latch member 28R having a predetermined lateral width in the direction perpendicular to the paper surface is rotatably supported at one end of the latch member 28R via the support shaft 30 in the bearing portion 24B of the base member 24. Both ends of the support shaft 30 are locked to the bearing portion 24B by E-rings 32, respectively. As shown in FIG. 4, the pressing member 26 is held in the upper housing 22 via the base member 24, or as shown in FIG. 5, at the intermediate portion separated from one end of the latch member 32. The claw portion 28Rn (the claw portion 28Ln in the latch member 28L) that releases the pressing body 26 is integrally formed. The claw portion 28 </ b> Rn protrudes toward the recessed portion 26 </ b> R of the held pressing body 26 substantially perpendicularly to the longitudinal axis of the latch member 32. Thereby, the claw portion 28Rn is locked to the groove 26Ra in the recess 26R formed at the uppermost end portion of the pressing body 26. Therefore, as shown in FIG. 4, the latch member 28 </ b> R is formed in a state where a predetermined gap is formed between the periphery of the base of the pressing protrusion 26 </ b> P of the pressing body 26 and the periphery of the opening 24 a of the base member 24. Thus, the pressing body 26 is held by the base member 24 by 28L.

  The upper housing 22 has a semiconductor device mounting portion 22A at a central position at a position directly below the opening 24a of the base member 24 described above. The semiconductor device mounting portion 22A that opens upward is formed so as to be surrounded on all sides by a slope portion 22D that guides the semiconductor device DV1 when the semiconductor device DV1 is mounted. At the skirt of each inclined surface portion 22D, a positioning wall portion is formed to which the peripheral edge of the electrode group in the package of the semiconductor device DV1 abuts. Both ends of each positioning wall portion along the direction perpendicular to the paper surface are connected to the ends of the positioning wall portions of the adjacent inclined surface portions 22D. Further, reliefs corresponding to the corners of the package of the semiconductor device DV1 to be mounted are formed at each corner located at the end of the positioning wall. Each contact portion of a contact probe group, which will be described later, protrudes in the semiconductor device mounting portion 22A.

  At the upper end portion of the upper housing 22, female screw portions 22FS1 into which the machine screws BS1 described above are screwed are formed at four locations. A contact portion 12Ap of the upper plunger 12 of each contact probe 10ai penetrates through a portion forming the bottom portion of the semiconductor device mounting portion 22A to which the semiconductor device DV1 is attached and detached, as partially enlarged in FIG. A small-diameter hole 22d that protrudes is opened. Each small-diameter hole 22d of the upper housing 22 communicates with each large-diameter hole 22b formed concentrically. The large-diameter hole 22b accommodates the upper plunger 12 of the contact probe 10ai and a part of the coil spring 14. Further, in the portion forming the bottom of the semiconductor device mounting portion 22A, the small housing for fixing the lower housing 20 to the upper housing 22 is located at a position separated from the small diameter hole 22d and the large diameter hole 22b formed at both ends thereof. Female screw holes 22FS2 into which the screw BS2 is screwed are formed at the four corners.

  The plate-like lower housing 20 has a stepped hole into which the machine screw BS2 is inserted at a position corresponding to each female screw hole 22FS2 of the upper housing 22. Further, the lower housing 20 is a large-diameter hole that accommodates the lower plunger 16 and the remainder of the coil spring 14 at a position corresponding to the large-diameter hole 22b of the upper housing 22, as shown in FIG. 20b and a small diameter hole 20d through which the contact end portion 16D (contact point portion 16P) of the lower plunger 16 penetrates and protrudes. The small diameter hole 20d and the large diameter hole 20b communicate with each other and are concentrically formed.

Thereby, the base member 24, the upper housing 22 and the lower housing 20 have fixing screws (not shown) through the through holes (not shown) of the upper housing 22 and the lower housing 20 and the above-described printed wiring board PCB. By being fastened by a nut and a washer through a hole (not shown), it is fixed to the printed circuit board PCB.
Therefore, the contact probe accommodating portion 22C described above is formed by a plurality of small diameter holes 22d and large diameter holes 22b of the upper housing 22, and a plurality of small diameter holes 20d and large diameter holes 20b of the lower housing 20. Become.

  The contact probe 10ai as the first embodiment of the contact probe according to the present invention selectively contacts the electrode portion DVa of the semiconductor device DV1, as shown in enlarged views in FIGS. An upper plunger 12 having a contact portion 12Ap, a lower plunger 16 having a contact portion 16P that comes into contact with a contact pad of the printed wiring board PCB, and a biasing member that biases the upper plunger 12 and the lower plunger 16 in a direction away from each other. A coil spring 14 as an (elastic member) is included.

  The upper plunger 12 as the first plunger is formed into a stepped cylindrical shape by bending, for example, with a beryllium copper alloy, and is connected to the contact end portion 12A having a contact portion 12Ap formed at one end and the contact end portion 12A. And a large-diameter portion 12B that accommodates a stepped portion 16A of a lower plunger 16 as a locked portion described later. The contact end portion 12 </ b> A and the large diameter portion 12 </ b> B have a seam 12 </ b> S formed by bending, which will be described later, along the central axis of the upper plunger 12 as shown in an enlarged view in FIG. . The contact portion 12Ap of the contact end portion 12A opens the pointed contact portions 12Ap1, 12Ap2, and 12Ap3 at intervals of 120 ° along the circumferential direction, as shown in an enlarged view in FIG. It has at the end periphery. The contact portions 12Ap1 and 12Ap3 are formed on both sides of the joint 12S. The contact portion of the contact portion 12Ap of the contact end portion 12A of the upper plunger 12 is not limited to such an example. For example, a flat surface or a substantially hemispherical contact according to the shape of the electrode portion of the semiconductor device is used. Part.

  As shown in an enlarged view in FIG. 2A, the small diameter hole 12a of the penetrating contact end 12A communicates with the large diameter hole 12b of the penetrating large diameter section 12B. The large-diameter portion 12B has dowels (projections) 12Bd as locking portions facing each other at a position that is substantially 90 ° along the circumferential direction with respect to the joint 12S. Further, the inner diameter of the large diameter portion 12B is set to be slightly larger than the outer diameter of the stepped portion 16A of the lower plunger 16. One end of the coil spring 14 is in contact with the opening end surface below the large diameter portion 12B. As a result, the stepped portion 16A of the lower plunger 16 is slidably disposed on the inner peripheral surface of the large diameter portion 12B and is stretched based on the urging force of the coil spring 14 in a pair of dowels 12Bd. Thus, it is received and locked at a predetermined position. Accordingly, the coil spring 14 disposed between the opening end peripheral edge of the large-diameter portion 12B of the upper plunger 12 and a spring receiving portion 16F of the lower plunger 16 described below can adjust a predetermined preload (preload). It becomes possible.

The lower plunger 16 as the second plunger is made of, for example, a beryllium copper alloy by press working (including face punching and coining), and is shown in FIGS. 3 (A), (B), (C), and (D). As shown in an enlarged manner, a contact end portion 16D having a contact portion 16P formed at one end, a spring receiving portion (hereinafter also referred to as a flange portion) 16F that receives the other end of the coil spring 14, a contact end portion 16D, and It is composed of a small diameter shaft portion 16B and a large diameter shaft portion 16C that connect the flange portion 16F and the stepped portion 16A.
The stepped portion 16A has a pointed portion 16Ap at one end. In this embodiment, the diameter of the stepped portion 16A, the contact end portion 16D, and the large diameter shaft portion 16C is set larger than the diameter of the small diameter shaft portion 16B. The diameters of the large-diameter shaft portion 16C, the small-diameter shaft portion 16B, and the stepped portion 16A are set slightly smaller than the inner diameter of the coil spring 14. The contact portion 16P of the contact end portion 16D has a pointed portion at one end. Further, by providing a slight clearance between the outer diameter of the large-diameter shaft portion 16C and the inner diameter of the coil spring 14, the large-diameter shaft portion 16C functions as a core rod of the coil spring 14, so that the coil spring 14 The concentricity with the lower plunger 16 can be increased.

  The dimension of the long side of the flange portion 16F having a substantially rectangular cross section is set to be substantially the same as the outer diameter of the coil spring 14 and larger than the dimension of the large diameter shaft portion 16C. In addition, the dimension of the short side of the flange part 16F may be set smaller than the dimension of the large diameter shaft part 16C.

  In forming the above-described upper plunger 12 by bending, for example, as shown in FIG. 7A, first, a thin plate-like blank 32 corresponding to the overall shape of the upper plunger 12 is prepared. The blank 32 includes a portion 32A corresponding to the contact end portion 12A and a portion 32B corresponding to the large diameter portion 12B. The tip of the portion 32A has an uneven portion 32P corresponding to the contact portions 12Ap1, 12Ap2, and 12Ap3 of the contact portion 12Ap. A pair of end surfaces (side surfaces) 32Ae orthogonal to the concavo-convex portion 32P of the portion 32A form a part of the joint 12S. Further, the pair of end surfaces 32Be connected to the pair of end surfaces 32Ae in the portion 32B also form the remaining portion of the joint 12S. The portion 32B has a dowel 32Bd at a position corresponding to the pair of dowels 12Bd in the upper plunger 12 with a predetermined mutual interval. Next, as shown in FIGS. 7B and 7C, the blank 32 is rounded by, for example, pressing (including face punching and coining), a roll bender, etc. can get.

  Further, in assembling the upper plunger 12, the coil spring 14, and the lower plunger 16, first, after the small diameter shaft portion 16B and the large diameter shaft portion 16C of the lower plunger 16 are inserted into the coil spring 14, FIG. The stepped portion 16A of the lower plunger 16 is inserted into the large-diameter hole 12b of the large-diameter portion 12B of the upper plunger 12 in the direction indicated by the arrows shown in (A) and (B). In addition, the coil spring 14 is abbreviate | omitted in FIG. 8 (A), (B), FIG. 9 (A), (B), FIG. 10 (A), (B).

  Next, the stepped portion 16 </ b> A of the lower plunger 16 is pushed against the elastic force of the upper plunger 12 and the biasing force of the coil spring 14 between the pair of dowels 12 </ b> Bd of the upper plunger 12. Accordingly, as shown in FIGS. 9A and 9B, the pair of end surfaces forming the joint 12S are separated from each other, so that a predetermined gap CL is formed in the joint 12S of the upper plunger 12. Then, when the stepped portion 16A of the lower plunger 16 passes between the pair of dowels 12Bd and is further pushed into the large-diameter hole 12b, as shown in FIGS. 10A and 10B, the upper plunger Since the pair of end faces approach each other due to the restoring force of 12, the joint 12S of the upper plunger 12 is returned to the initial state. Thereby, as shown in FIG. 1B, the stepped portion 16 </ b> A of the lower plunger 16 is locked to the pair of dowels 12 </ b> Bd of the upper plunger 12. Therefore, the assembly of the contact probe 10ai is completed when the upper plunger 12, the coil spring 14, and the lower plunger 16 are easily assembled together.

  FIG. 11 shows the configuration of a second embodiment of the contact probe according to the present invention.

  Whereas the upper plunger 12 of the contact probe 10ai shown in FIGS. 1 (A) and 1 (B) has a dowel 12Bd and the lower plunger 16 is made by pressing (coining), The upper plunger 42 of the contact probe 40ai shown in FIG. 11 has a cut (hereinafter also referred to as a lance) 42Bd, and the lower plunger 46 is formed into a rod shape by rounding a plate material by bending. In FIG. 11, the same components as those in the example shown in FIGS. 1A and 1B are denoted by the same reference numerals, and redundant description thereof is omitted.

  The contact probe 40ai includes an upper plunger 42 having a contact portion 42Ap that selectively contacts the electrode portion DVa of the semiconductor device DV1, a lower plunger 46 having a contact portion 46P that contacts a contact pad of the printed circuit board PCB, and an upper The coil spring 14 is configured as an elastic member that biases the plunger 42 and the lower plunger 46 in a direction in which they are separated from each other.

  The upper plunger 42 as the first plunger is formed into a stepped cylindrical shape by bending, for example, with a beryllium copper alloy as shown in FIG. 12, and a contact portion 42Ap is formed at one end. It comprises an end portion 42A and a large-diameter portion 42B that is connected to the contact end portion 42A and accommodates a stepped portion 46A of a lower plunger 46 as a locked portion described later. As shown in FIG. 13C, the contact end portion 42A and the large diameter portion 42B have a seam 42S formed by bending along the central axis of the upper plunger 42. As shown in FIG. 13 (D), the contact portion 42Ap of the contact end portion 42A has a pointed contact portion 42Ap1, 42Ap2, and 42Ap3 on the periphery of the opening end at intervals of 120 ° along the circumferential direction. Have. The contact portions 42Ap1 and 42Ap3 are formed on both sides of the joint 42S. The small diameter hole 42a of the contact end portion 42A that penetrates communicates with the large diameter hole 42b of the large diameter portion 42B that penetrates.

  As shown in FIGS. 12 and 13B, the large-diameter portion 42B has a lance 42Bd as a locking portion that faces each other at a position that is approximately 90 ° along the circumferential direction with respect to the joint 42S. ing. Further, the inner diameter of the large diameter portion 42B is set to be slightly larger than the outer diameter of the stepped portion 46A of the lower plunger 46. One end of the coil spring 14 is in contact with the opening end surface below the large diameter portion 42B. As a result, the stepped portion 46A of the lower plunger 46 is slidably disposed on the inner peripheral surface of the large diameter portion 42B, and in a state of being pulled based on the urging force of the coil spring 14, the pair of lances 42Bd The locking end 42Be is received and locked at a predetermined position. Accordingly, the coil spring 14 disposed between the opening end surface of the large-diameter portion 42B of the upper plunger 42 and a spring receiving portion 46F of the lower plunger 46 described later can adjust a predetermined preload (preload). Become.

  The lower plunger 46 as the second plunger is made of, for example, a beryllium copper alloy that is rounded into a cylindrical shape by pressing (including face punching and coining), and FIGS. 14A, 14B, 14C. ) And (D), as shown in an enlarged view, a contact end portion 46D where the contact portion 46P is formed at one end, and a spring receiving portion (hereinafter also referred to as a flange portion) 46F that receives the other end of the coil spring 14. The contact end portion 46D, the flange portion 46F, and the shaft portion 46B that connects the stepped portion 46A.

  The diameter of the contact end portion 46D is set smaller than the diameter of the flange portion 46F. The diameters of the stepped portion 46 </ b> A and the shaft portion 46 </ b> B are set slightly smaller than the inner diameter of the coil spring 14. The contact portion 46P of the contact end portion 46D has a substantially hemispherical shape. The stepped portion 46A has a substantially hemispherical shape at the tip. The diameter of the flange portion 46F is set to be approximately the same as the outer diameter of the coil spring 14. A cavity 46CA communicating with the shaft hole 46b of the shaft portion 46B is formed inside the flange portion 46F and the contact end portion 46D. Further, by setting the outer diameter of a part of the shaft portion 46B to be substantially the same as the inner diameter of the coil spring 14, a part of the shaft part 46B functions as a core rod of the coil spring 14, so that the coil spring 14 and the lower plunger 46 Can increase the degree of concentricity.

  The shape of the contact portion of the contact end portion 46D is not limited to such an example. For example, the contact end portion 46D has three pointed contact portions on the periphery of the opening end at intervals of 120 ° along the circumferential direction. It may be a thing.

  Furthermore, as shown in FIGS. 15A and 15B, as a third embodiment of the contact probe according to the present invention, the contact probe 50ai selectively contacts the electrode portion DVa of the semiconductor device DV1. An upper plunger 42 having a portion 42Ap (see FIG. 12), a lower plunger 16 having a contact portion 16P that contacts the contact pad of the printed circuit board PCB (see FIGS. 3A to 3D), and an upper plunger 42. A coil spring 14 as an elastic member that urges the lower plunger 16 in a direction away from each other may be included.

  In such a configuration, in assembling the upper plunger 42, the coil spring 14, and the lower plunger 16 with each other, as shown in FIGS. 15A and 15B, first, the small-diameter shaft portion 16B of the lower plunger 16 and After the large-diameter shaft portion 16C is inserted into the coil spring 14, the stepped portion 16A of the lower plunger 16 is connected to the large-diameter portion of the upper plunger 42 in the direction indicated by the arrows shown in FIGS. 42B is inserted into the large-diameter hole 42b. In addition, the coil spring 14 is abbreviate | omitted in FIG. 15 (A), (B), FIG. 16 (A), (B), FIG. 17 (A), (B).

  Next, the stepped portion 16 </ b> A of the lower plunger 16 is further pushed between the pair of lances 42 </ b> Bd of the upper plunger 42 against the elastic force of the lance 42 </ b> Bd and the biasing force of the coil spring 14. As a result, as shown in FIGS. 16A and 16B, the pair of lances 42Bd are pushed apart in a direction away from each other. Then, when the stepped portion 16A of the lower plunger 16 passes between the pair of lances 42Bd and is further pushed into the large-diameter hole 42b, as shown in FIGS. 17 (A) and 17 (B), the lance 42Bd Since the pair of lances 42Bd approach each other due to the restoring force, the pair of lances 42Bd is returned to the initial state. Thus, as shown in FIG. 17B, the stepped portion 16A of the lower plunger 16 is locked to the locking ends 42Be of the pair of lances 42Bd of the upper plunger 42. Therefore, the assembly of the contact probe 50ai is completed when the upper plunger 42, the coil spring 14, and the lower plunger 16 are easily assembled together.

  FIG. 18 shows the configuration of a fourth embodiment of the contact probe according to the present invention.

  As shown in an enlarged view in FIG. 18, the contact probe 60ai contacts the upper plunger 12 having the contact portion 12Ap that selectively contacts the electrode portion DVa of the semiconductor device DV1 and the contact pad of the printed wiring board PCB. The lower plunger 56 having the contact end portion 56P, and the coil spring 14 as an urging member (elastic member) that urges the upper plunger 12 and the lower plunger 56 in a direction away from each other are configured. In FIG. 18, the same components as those in the example shown in FIG. 1B are denoted by the same reference numerals. The duplicate description is omitted.

  The lower plunger 56 as the second plunger is made of a beryllium copper alloy by cutting (machining), for example. The lower plunger 56 includes a contact end portion 56P having a contact portion 56Pc formed at one end thereof, a spring receiving portion (hereinafter also referred to as a flange portion) 56F that receives the other end of the coil spring 14, and a contact end portion 56P and a flange portion 56F. And a shaft portion 56B that connects the stepped portion 56A.

  The diameter of the contact end portion 56P is set smaller than the diameter of the flange portion 56F. The diameters of the stepped portion 56 </ b> A and the shaft portion 56 </ b> B are set slightly smaller than the inner diameter of the coil spring 14. The contact portion 56Pc of the contact end portion 56P has a conical shape. As shown in FIGS. 19A and 19B, the stepped portion 56A has a conical tip portion 56Ap. The diameter of the flange portion 56F is set to be approximately the same as the outer diameter of the coil spring 14. Further, by setting the outer diameter of a part of the shaft portion 56B to be substantially the same as the inner diameter of the coil spring 14, a part of the shaft part 56B functions as a core rod of the coil spring 14, so that the coil spring 14 and the lower plunger 56 Can increase the degree of concentricity.

  The contact portion of the contact end portion 56P is not limited to such an example. For example, the contact end portion 56P may have a flat contact portion or a substantially hemispherical contact portion according to the shape of the electrode portion of the semiconductor device. Alternatively, it may have three pointed contact portions at 120 ° intervals along the circumferential direction.

  In each of the above-described embodiments, the contact end portion of the upper plunger as the first plunger and the contact portion of the contact end portion of the lower plunger as the second plunger are the electrode portions of the semiconductor device DV1, respectively. Although it is configured to abut against the contact pads of the DVa and the printed wiring board PCB, it is not always necessary to do so. For example, the contact portion of the contact end portion of the upper plunger as the first plunger is printed. The contact portion of the lower plunger as the second plunger may be in contact with the contact pad of the wiring board PCB, and may be configured to contact the electrode portion DVa of the semiconductor device DV1. Further, in the contact probe, the above-described upper plunger 12 and the lower plunger 46 can be combined, and the upper plunger 42 and the lower plunger 56 can be combined. Furthermore, in the above-described example, each embodiment of the contact probe according to the present invention is applied to a socket for a semiconductor device. However, the present invention is not limited to such an example. For example, each embodiment of the contact probe according to the present invention is described. It goes without saying that the example may be applied to other electronic devices such as an electrical connection connector.

10ai, 40ai, 50ai, 60ai Contact probe 12, 42 Upper plunger 12S Joint 12Bd Dowel 14 Coil spring 16, 46, 56 Lower plunger 32 Blank 42Bd Lance

Claims (8)

A contact terminal portion having a contact portion that comes into contact with one of the electrode portions; a stepped cylindrical first plunger having at least one locking portion that can be elastically displaced;
A contact terminal portion having a contact portion that contacts the other electrode portion facing the one electrode portion; and a locked portion that is pushed into the inner peripheral portion of the first plunger and locked to the locking portion. A second plunger having;
The first plunger and the second plunger are arranged between an end portion of the cylindrical portion of the first plunger and a contact terminal portion of the second plunger in a state where the first plunger and the second plunger are held with a predetermined compression amount. A contact probe configured to be biased in a direction away from each other.   The distance between the pair of locking portions of the stepped cylindrical first plunger is smaller than the outer diameter of the locked portion of the second plunger, and the locked position of the second plunger When the portion is pushed between the pair of locking portions of the first plunger, the distance between the pair of locking portions of the first plunger resists the elastic force and the second plunger is locked. 2. The contact probe according to claim 1, wherein after the outer diameter of the first portion becomes larger, the locked portion of the second plunger is held by the pair of locking portions of the first plunger. .   The contact probe according to claim 1, wherein the locking portion of the first plunger is a protrusion protruding into the cylindrical portion of the stepped cylindrical first plunger having a seam.   The contact probe according to claim 1, wherein the locking portion of the first plunger is a lance protruding into the cylindrical portion of the stepped cylindrical first plunger having a seam.   The outer diameter of the locked portion of the second plunger is formed larger than the distance between the pair of locking portions of the stepped cylindrical first plunger, and the first plunger The outer diameter of the shaft portion connected to the locked portion of the second plunger is smaller than the distance between the pair of locking portions of the first plunger. The contact probe according to claim 2, wherein the contact probe is formed small.   The contact probe according to claim 5, wherein the second plunger is formed by press working including a coining process.   5. The stepped cylindrical first plunger having the seam is formed in a cylindrical shape so that both end faces of a thin plate-like blank face each other. Contact probe as described. A plurality of contact probes according to claim 1;
A semiconductor device that detachably accommodates a semiconductor device having a plurality of contact probe accommodating portions that accommodate the plurality of contact probes and a plurality of electrode portions that contact the contact portions of the first plunger or the second plunger of the contact probes. A housing that is disposed on a wiring board that is electrically connected to the contact probe;
A socket for a semiconductor device comprising:

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