JP2019167436A - Resin composition, semiconductor device and method for producing semiconductor device - Google Patents

Abstract

A resin composition having a low viscosity, a high thermal conductivity of a cured product, a low elastic modulus of the cured product, and a small amount of warpage of the cured product is provided. Provided are a semiconductor device including a cured product of a resin composition having a high thermal conductivity, a low elastic modulus, and a small amount of warpage, and a method for manufacturing the same. A resin composition containing a resin (A) and an inorganic filler (B), wherein the inorganic filler (B) is at least two selected from the group consisting of metal oxides, metal nitrides, and boron nitride. And a resin composition for compression molding or transfer molding. [Selection diagram] None

Description

  The present invention relates to a resin composition, a semiconductor device, and a method for manufacturing a semiconductor device.

  In recent years, with the miniaturization and high integration of electronic components, a high-quality sealing material for bonding and sealing substrates, circuits, and modules is required. Various problems have been pointed out regarding the improvement of the quality of the sealing material, and one of them is a problem of releasing heat generated from devices such as transistors and wirings. This problem is generally caused by the fact that the thermal conductivity of the resin composition used for stacking and sealing semiconductor device chips is very low compared to metals and ceramics. There is concern about performance degradation due to heat storage.

  One technique for solving this problem is to increase the thermal conductivity of the resin composition. Specifically, as the thermosetting resin constituting the adhesive component of the resin composition, a highly thermally conductive epoxy resin is used, or such a highly thermally conductive resin and a highly thermally conductive inorganic filler are combined. In order to increase the thermal conductivity of the resin composition.

  For example, in Patent Document 1, thermal conductivity in the thickness direction is improved by using spherical boron nitride aggregates, which are excellent in isotropy of heat conduction, collapse resistance, and kneadability with resin, as fillers. A resin composition capable of forming a packed bed is described. Patent Document 2 describes a resin composition that can form a filling layer having a balance between thermal conductivity and heat resistance by using a combination of boron nitride and an inorganic filler other than boron nitride. ing.

JP 2013-241321 A JP 2014-208818 A

  However, in order to improve the thermal conductivity of the resin composition, when a large amount of high thermal conductive inorganic filler is mixed, the elastic modulus of the high thermal conductive filler is higher than the elastic modulus of the resin. It has the subject that an elasticity modulus becomes high. In addition, when the elastic modulus of the cured resin composition is high, the thermal stress due to the elastic modulus of the cured resin composition increases when the resin composition is subjected to compression molding or transfer molding all at once. There exists a subject that the curvature amount of the molded article obtained by a sealing process becomes large.

  For example, since the resin compositions described in Patent Document 1 and Patent Document 2 contain a large amount of boron nitride, the thermal conductivity of the cured product is improved, but the cured product has a high elastic modulus and a large amount of warpage. Has a problem.

  This invention is made | formed in view of such a subject, The objective of this invention is low viscosity, the thermal conductivity of hardened | cured material is high, the elasticity modulus of hardened | cured material is low, and the curvature amount of hardened | cured material is low. The object is to provide a small resin composition. Another object of the present invention is to provide a semiconductor device including a cured product of a resin composition having a high thermal conductivity, a low elastic modulus, and a small amount of warpage, and a method for manufacturing the same.

  As a result of intensive studies to solve the above problems, the present inventors have found that the above problems can be solved by combining at least two selected from the group consisting of metal oxides, metal nitrides and boron nitrides. It came to complete.

That is, the gist of the present invention is as follows.
[1] A resin composition comprising a resin (A) and an inorganic filler (B), wherein the inorganic filler (B) comprises at least two selected from the group consisting of metal oxides, metal nitrides and boron nitride. A resin composition for compression molding or transfer molding.
[2] The resin composition according to [1], wherein the resin (A) includes an epoxy resin.
[3] The resin composition according to [1] or [2], wherein the inorganic filler (B) includes boron nitride and at least one selected from the group consisting of metal oxides and metal nitrides.
[4] The resin composition according to any one of [1] to [3], wherein the boron nitride has a specific surface area of 10 m ² / g or more.
[5] The resin composition according to any one of [1] to [4], wherein the inorganic filler (B) contains a metal oxide and boron nitride.
[6] The resin composition according to any one of [1] to [5], further comprising a silicone compound (C).
[7] The resin composition according to [6], wherein the silicone compound (C) includes at least one selected from the group consisting of silicone oil and silicone powder.
[8] The resin composition according to any one of [1] to [7], wherein the shear viscosity at 25 ° C. and a shear rate of 10 s ⁻¹ is 100000 Pa · s or less.
[9] The resin composition according to any one of [1] to [8], wherein the cured product has a thermal conductivity of 3 W / m · K or more.
[10] The resin composition according to any one of [1] to [9], wherein the cured product has a shear modulus at 30 ° C. of 30 GPa or less.
[11] A semiconductor device comprising a cured product of the resin composition according to any one of [1] to [10].
[12] A method for manufacturing a semiconductor device, comprising a step of performing compression molding or transfer molding for curing and molding the resin composition according to any one of [1] to [10].

  The resin composition of the present invention has a low viscosity, a high thermal conductivity of the cured product, a low elastic modulus of the cured product, and a small amount of warpage of the cured product. Therefore, by molding the resin composition of the present invention by compression molding or transfer molding, it is expected that the warpage of the semiconductor device will be reduced even when sealing an electronic component of a thin package or a large area electronic component, It is expected that electronic parts such as large-area semiconductor packages can be sealed with high productivity and high quality.

  The present invention will be described in detail below, but the present invention is not limited to the following embodiments, and can be implemented with various modifications within the scope of the gist thereof. In the present specification, when the expression “to” is used, it is used as an expression including numerical values or physical property values before and after the expression.

(Resin composition)
The resin composition of the present invention is a resin composition containing a resin (A) and an inorganic filler (B), and the inorganic filler (B) is selected from the group consisting of a metal oxide, a metal nitride and boron nitride. Including at least two types.

(Resin (A))
Examples of the resin (A) include epoxy resins, phenol resins, urea resins, melamine resins, benzoguanamine resins, polyester resins, allyl resins, alkyd resins, urethane resins, silicone resins, acrylic resins, and polyimide resins. These resin (A) may be used individually by 1 type, and may use 2 or more types together. Among these resins (A), thermosetting resins are preferable because they are easily applied to compression molding and transfer molding, and the thermal conductivity of the cured product of the resin composition is high, and the elastic modulus of the cured product of the resin composition. The epoxy resin is preferable because the amount of warpage of the cured product of the resin composition is small.
In this specification, it is assumed that the resin (A) does not contain the silicone compound (C).

  Epoxy resin refers to a compound having an epoxy group in one molecule. 1-8 are preferable and, as for the number of the epoxy groups in 1 molecule, since the glass transition temperature of the hardened | cured material of a resin composition is improved, 2-3 are more preferable.

  Epoxy resins include non-polyfunctional epoxy resins (compounds having 1 or 2 epoxy groups in one molecule) and polyfunctional epoxy resins (compounds having 3 or more epoxy groups in one molecule). Although it is classified, it is preferable to use a polyfunctional epoxy resin in combination with an epoxy resin other than the polyfunctional type because the resin composition is excellent in moldability and has a high thermal conductivity of the cured product of the resin composition. .

  The epoxy resin other than the polyfunctional type preferably has an aromatic skeleton because of the high thermal conductivity of the cured product of the resin composition, and more preferably has a bisphenol A skeleton, a bisphenol F skeleton, and a biphenyl skeleton. Preferably, it has a bisphenol A skeleton.

  Examples of the epoxy resin other than the polyfunctional type having an aromatic skeleton include, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, naphthalene ring-containing epoxy resin, and dicyclopentadiene skeleton. And epoxy resin having phenol, phenol novolac type epoxy resin, cresol novolac type epoxy resin, triphenylmethane type epoxy resin, copolymer epoxy resin of aliphatic epoxy resin and aromatic epoxy resin, and the like. These epoxy resins other than the polyfunctional type having an aromatic skeleton may be used alone or in combination of two or more. Among these epoxy resins other than the polyfunctional type having an aromatic skeleton, the resin composition is excellent in molding processability. Therefore, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy Resin, naphthalene ring-containing epoxy resin is preferred, bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, naphthalene ring containing epoxy resin are more preferred, and bisphenol A type epoxy resin, bisphenol F, which is liquid at 23 ° C. More preferred is a type epoxy resin.

  The content of the epoxy resin other than the polyfunctional type is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 80% by mass, and more preferably 30% by mass to 70% by mass in 100% by mass of the resin (A). Further preferred. When the content of the epoxy resin other than the polyfunctional type is 10% by mass or more, the resin composition is excellent in moldability and can be produced at low cost, and the heat of the cured product of the resin composition High conductivity. Moreover, the glass transition temperature of the hardened | cured material of a resin composition is high in the content rate of epoxy resins other than a polyfunctional type being 90 mass% or less.

  Examples of the polyfunctional epoxy resin include phenol novolac epoxy resin, cresol novolac epoxy resin, bisphenol A novolac epoxy resin, dicyclopentadiene phenol epoxy resin, phenol aralkyl epoxy resin, naphthol novolac epoxy resin, biphenyl Examples include novolac type epoxy resins, terpene phenol type epoxy resins, glycidyl ether type polyfunctional epoxy resins, and glycidyl amine type polyfunctional epoxy resins. These polyfunctional epoxy resins may be used alone or in combination of two or more. Among these polyfunctional epoxy resins, the cured product of the resin composition has a high glass transition temperature and is excellent in molding processability of the resin composition. Therefore, a glycidyl ether polyfunctional epoxy resin and a glycidylamine polyfunctional epoxy resin are used. Is preferable, and a glycidylamine type polyfunctional epoxy resin is more preferable.

  The content of the polyfunctional epoxy resin is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 80% by mass, and still more preferably 30% by mass to 70% by mass in 100% by mass of the resin (A). . When the content of the polyfunctional epoxy resin is 10% by mass or more, the glass transition temperature of the cured product of the resin composition is high. Further, when the content of the polyfunctional epoxy resin is 90% by mass or less, the resin composition is excellent in moldability and can be produced at a low cost, and the heat of the cured product of the resin composition High conductivity.

  Examples of commercially available epoxy resins include “YL6810” (trade name, manufactured by Mitsubishi Chemical Corporation, bisphenol A type epoxy resin), “1750” (trade name, bisphenol F type epoxy resin manufactured by Mitsubishi Chemical Corporation), “ YX4000 (H) "(trade name, manufactured by Mitsubishi Chemical Corporation, biphenyl type epoxy resin)," YL6121H "(trade name, manufactured by Mitsubishi Chemical Corporation, biphenyl type epoxy resin)," YX8800 "(trade name, Mitsubishi Chemical Corporation) Company-made, anthracene type epoxy resin), “YSLV-80XY” (trade name, NS , "YDC-1312" (trade name, Nippon Steel & Sumikin Chemical Formula company, hydroquinone type epoxy resin), "HP4032D" (trade name, manufactured by DIC Corporation, naphthalene type epoxy resin), "LX-01" (trade name, manufactured by Daiso Chemical Co., Ltd., bisphenol A type glycidyl ether epoxy resin) Etc.

The epoxy equivalent of the epoxy resin is preferably 80 g / equivalent to 800 g / equivalent, and more preferably 90 g / equivalent to 500 g / equivalent. When the epoxy equivalent of the epoxy resin is 80 g / equivalent or more, the heat resistance of the cured product of the resin composition is excellent. Moreover, it is excellent in the moldability of a resin composition as the epoxy equivalent of an epoxy resin is 800 g / equivalent or less.
In this specification, the epoxy equivalent of the epoxy resin is a value determined in accordance with ISO 3001.

The shear viscosity at 25 ° C. of the resin (A) is preferably 0.01 Pa · s to 10 Pa · s, and preferably 0.1 Pa · s to 8 Pa · s. When the shear viscosity at 25 ° C. of the resin (A) is 0.01 Pa · s or more, there are few burrs in the molded product of the resin composition, and the quality of the molded product is excellent. Further, when the shear viscosity at 25 ° C. of the resin (A) is 10 Pa · s or less, the resin composition has excellent fluidity and the resin composition has excellent moldability.
In this specification, the shear viscosity at 25 ° C. of the resin (A), the silicone oil, and the resin composition is based on ISO 3104, using a cone-plate rotary viscometer under the condition of a shear rate of 10 s ^−1. The measured value. The cone-plate rotational viscometer is an E-type viscometer defined by ISO 3219.

  The content of the resin (A) is preferably 1% by mass to 50% by mass, more preferably 2% by mass to 25% by mass, and still more preferably 3% by mass to 15% by mass in 100% by mass of the resin composition. When the content of the resin (A) is 1% by mass or more, the resin composition is excellent in moldability and can be produced at low cost. Moreover, the heat conductivity of the hardened | cured material of a resin composition is high in the content rate of resin (A) being 15 mass% or less.

(Inorganic filler (B))
The inorganic filler (B) contributes to the achievement of high thermal conductivity of the cured product of the resin composition, and when the resin composition is molded and the semiconductor chip is encapsulated, both high thermal conductivity and low linear expansion coefficient are achieved. Contribute to.

  The inorganic filler (B) contains at least two kinds selected from the group consisting of metal oxides, metal nitrides, and boron nitrides. However, since the thermal conductivity of the cured product of the resin composition is high, boron nitride and metal It preferably includes at least one selected from the group consisting of oxides and metal nitrides, and more preferably includes metal oxides and boron nitride.

  The boron nitride is not particularly limited, and may be boron nitride particles having a specific crystal structure (hereinafter may be abbreviated as “specific crystal BN particles”), and the boron nitride is aggregated by granulation. Aggregated particles of boron nitride (hereinafter sometimes abbreviated as “aggregated BN particles”) or boron nitride other than the specific crystal BN particles and the aggregated BN particles may be used, but the inorganic filler (B) The specific crystal BN particles and the agglomerated BN particles are preferable because of excellent packing properties, and the agglomerated BN particles are more preferable because of the excellent fluidity of the resin composition. These boron nitrides may be used alone or in combination of two or more.

  Aggregated BN particles are usually aggregates of boron nitride primary particles having a volume average particle diameter of 0.05 μm to 5 μm.

Total pore volume of the agglomerated BN particles is preferably at most 2.15 cm ³ / ^g, more preferably ^{0.30cm 3 /g~2.00cm 3 / g, 0.50cm} 3 /g~1.95cm 3 / g Is more preferable. When the total pore volume of the aggregated BN particles is 0.30 cm ³ / g or more, the aggregated BN particles can be easily produced. Moreover, since the inside of the aggregated BN particles is dense when the total pore volume of the aggregated BN particles is 2.15 cm ³ / g or less, the boundary surface that inhibits heat conduction can be reduced. The thermal conductivity of the particles is high, and the thermal conductivity of the cured product of the resin composition is high.
The total pore volume of the aggregated BN particles is measured by a mercury intrusion method.

Aggregated BN particles are preferably spherical.
In this specification, the spherical shape means that the aspect ratio (ratio of major axis to minor axis) is 1 to 2, and preferably 1 to 1.5.
In this specification, the aspect ratio of the aggregated BN particles is an average calculated by arbitrarily selecting 200 or more aggregated BN particles from an image taken with a scanning electron microscope and obtaining the ratio of the major axis and the minor axis of each. Value.

  The method for producing the aggregated BN particles is not particularly limited, but a production method including a pulverizing step for pulverizing the raw material boron nitride, a granulating step for agglomerating and granulating, and a heating step for crystallizing by heating is preferable. Specifically, the raw material boron nitride powder is dispersed in a medium to form a slurry, which is then pulverized, granulated into spherical particles using the resulting slurry, and the granulated particles are crystallized. It is a manufacturing method which heat-processes in order to perform.

  The slurry preferably contains a binder in order to effectively granulate the boron nitride powder into agglomerated particles. The binder acts to firmly bind the non-adhesive boron nitride powder and stabilize the shape of the granulated particles.

  Detailed production conditions for the aggregated BN particles and the specific crystal BN particles are disclosed in JP2013-241321A.

The specific surface area of the boron nitride is preferably at least ^{10 m} 2 / ^g, more preferably 20m ² / g~50m 2 / ^g, more preferably 25m ² / g~30m 2 / g. When the specific surface area of boron nitride is 10 m ² / g or more, the surface smoothness of the cured product or molded product is excellent. Moreover, the viscosity of a resin composition is low in the specific surface area of a boron nitride being 50 m < ² > / g or less.
In the present specification, the specific surface area of boron nitride is measured by the BET one-point method using nitrogen as the adsorption gas.

The volume average particle diameter of boron nitride is preferably 1 μm to 200 μm, and more preferably 5 μm to 100 μm. When the volume average particle diameter of boron nitride is 1 μm or more, the fluidity of the resin composition is excellent. Moreover, it is excellent in the surface smoothness of hardened | cured material and a molded article as the volume average particle diameter of boron nitride is 200 micrometers or less.
In this specification, the volume average particle diameter of the inorganic filler (B) shall be measured according to ISO 13320.

  Boron nitride may be used after being pulverized in order to make the volume average particle diameter within the above range. Examples of the pulverization method include a method of stirring and mixing with a pulverizing medium such as zirconia beads, a method of pulverizing by jet injection, and the like.

  Boron nitride may be used alone or in combination of two or more boron nitrides having different volume average particle diameters.

  Examples of the metal oxide include magnesium oxide, aluminum oxide, silicon oxide, calcium oxide, zinc oxide, yttrium oxide, zirconium oxide, cerium oxide, ytterbium oxide, and the like. These metal oxides may be used individually by 1 type, and may use 2 or more types together. Among these metal oxides, magnesium oxide, aluminum oxide, silicon oxide, calcium oxide, and zinc oxide are preferred because of the excellent electrical insulation of the cured product of the resin composition, and the water resistance of the cured product of the resin composition is preferred. Aluminum oxide, silicon oxide, and zinc oxide are more preferable because of superiority, and aluminum oxide is still more preferable because the cured product of the resin composition has high thermal conductivity.

  Examples of the metal nitride include aluminum nitride, silicon nitride, sialon (ceramics made of silicon, aluminum, oxygen, and nitrogen). These metal nitrides may be used alone or in combination of two or more. Among these metal nitrides, aluminum nitride is preferable since the thermal conductivity of the cured product of the resin composition is high and the electrical insulation of the cured product of the resin composition is excellent.

  The thermal conductivity of the metal oxide or metal nitride is preferably 2 W / m · K to 200 W / m · K, and more preferably 3 W / m · K to 40 W / m · K. When the thermal conductivity of the metal oxide or metal nitride is 2 W / m · K or more, the thermal conductivity of the cured product of the resin composition is high, and the heat dissipation of the molded product is excellent. Moreover, manufacture of a metal oxide and a metal nitride can be easily performed as the thermal conductivity of a metal oxide and a metal nitride is 200 W / mK or less.

The volume resistivity of the metal oxide and the metal nitride is preferably 10 ¹³ Ω · cm to 10 ¹⁶ Ω · cm, and more preferably 10 ¹⁴ Ω · cm to 10 ¹⁵ Ω · cm. When the volume resistivity of the metal oxide and the metal nitride is 10 ¹³ Ω · cm or more, the electric insulation of the cured product of the resin composition is excellent. Further, when the volume resistivity of the metal oxide or metal nitride is 10 ¹⁶ Ω · cm or less, the metal oxide and the metal nitride can be easily produced.
In this specification, the volume resistivity of the metal oxide and the metal nitride is measured according to ISO 2951.

  The volume average particle diameter of the metal oxide and the metal nitride is preferably 0.01 μm to 100 μm, and more preferably 0.1 μm to 50 μm. When the volume average particle diameter of the metal oxide and the metal nitride is 0.01 μm or more, the resin composition is excellent in fluidity, the resin composition is easily kneaded, and the resin composition is excellent in productivity. Moreover, it is excellent in the surface smoothness of hardened | cured material and a molded article as the volume average particle diameter of a metal oxide and a metal nitride is 100 micrometers or less.

The shape of the inorganic filler (B) is not particularly limited, and examples thereof include particles, whiskers, fibers, plates, and aggregates thereof.
The inorganic filler (B) may be one that has been surface-treated with a coupling agent in advance in order to enhance the adhesiveness with the resin (A).

  50 mass%-96 mass% are preferable in 100 mass% of resin compositions, and, as for the content rate of an inorganic filler (B), 60 mass%-93 mass% are more preferable, and 70 mass%-90 mass% are still more preferable. The heat conductivity of the hardened | cured material of a resin composition is high in the content rate of an inorganic filler (B) being 50 mass% or more. When the content of the inorganic filler (B) is 96% by mass or less, the viscosity of the resin composition is low.

  The content of boron nitride is preferably 1% by mass to 30% by mass, more preferably 2% by mass to 20% by mass, and still more preferably 3% by mass to 15% by mass in 100% by mass of the inorganic filler (B). When the boron nitride content is 3% by mass or more, the cured product of the resin composition has high thermal conductivity. Moreover, the linear expansion coefficient of the hardened | cured material of a resin composition is small in the content rate of boron nitride being 30 mass% or less.

  70 mass%-99 mass% are preferable in 100 mass% of inorganic fillers (B), and, as for the content rate of a metal oxide and / or a metal nitride, 80 mass%-98 mass% are more preferable, 85 mass%-97 mass%. More preferred is mass%. When the content of the metal oxide and / or metal nitride is 70% by mass or more, the linear expansion coefficient of the cured product of the resin composition is small. Moreover, the heat conductivity of the hardened | cured material of a resin composition is high in the content rate of a metal oxide and / or a metal nitride being 99 mass% or less.

(Silicone compound (C))
Since the resin composition of this invention can make the elasticity modulus of the hardened | cured material of a resin composition low, it is preferable that a silicone compound (C) is included other than resin (A) and an inorganic filler (B).
The silicone compound (C) refers to a compound having a silicone structure or a siloxane structure in the molecule. Among the silicone compounds (C), silicone oils and silicone powders are preferable because the elastic modulus of the cured product of the resin composition is low.

Silicone oil is defined as a silicone compound having a shear viscosity of 1000 Pa · s or less at 25 ° C. and a shear rate of 10 s ⁻¹ , for example, an alkyl silicone such as dimethyl silicone or diethyl silicone; a phenyl silicone having a phenyl group; an epoxy Epoxy silicone having a group; amino silicone having an amino group; alkyl-modified siloxane or alkyl-modified polysiloxane such as dimethylsiloxane and diethylsiloxane; phenyl-modified siloxane or phenyl-modified polysiloxane having a phenyl group; epoxy-modified siloxane having an epoxy group; Epoxy-modified polysiloxane; amino-modified siloxane having an amino group or amino-modified polysiloxane. These silicone oils may be used alone or in combination of two or more. Among these silicone oils, an epoxy silicone having an epoxy group is preferable because the resin composition is excellent in molding processability and can be produced at low cost.

  The silicone powder is defined as a powdery silicone compound, and examples thereof include silicone composite powder, silicone rubber powder, and organopolysiloxane. These silicone powders may be used alone or in combination of two or more. Among these silicone powders, organopolysiloxane is preferable because the elastic modulus of the cured product of the resin composition is low.

  The content of the silicone compound (C) is preferably 0.1% by mass to 5% by mass, more preferably 0.3% by mass to 4% by mass in 100% by mass of the resin composition, and 0.5% by mass to 3%. More preferred is mass%. When the content of the silicone compound (C) is 0.1% by mass or more, the elastic modulus of the cured product of the resin composition is low. Moreover, it is excellent in the moldability of a resin composition as the content rate of a silicone compound (C) is 15 mass% or less.

(Curing agent (D))
Since the resin composition of this invention is excellent in the moldability of a resin composition, it is preferable to contain a hardening | curing agent (D) other than resin (A), an inorganic filler (B), and a silicone compound (C).
When resin (A) contains an epoxy resin, the curing agent (D) is preferably a compound that contributes to a crosslinking reaction between epoxy groups of the epoxy resin.

  Examples of the curing agent (D) include phenol-based curing agents; amine-based curing agents such as aliphatic amines, polyether amines, alicyclic amines, and aromatic amines; acid anhydride-based curing agents; amide-based curing agents; Tertiary amines; Imidazole and its derivatives; Organic phosphines; Phosphonium salts; Tetraphenylboron salts; Organic acid dihydrazides; Boron halide amine complexes; Polymercaptan curing agents; Isocyanate curing agents; Can be mentioned. These hardening | curing agents (D) may be used individually by 1 type, and may use 2 or more types together. Among these curing agents (D), acid anhydride curing agents are preferred because they are liquid at 23 ° C., have excellent fluidity of the resin composition, and are easy to knead the resin composition.

  Examples of the phenol-based curing agent include bisphenol A, bisphenol F, 4,4′-dihydroxydiphenylmethane, 4,4′-dihydroxydiphenyl ether, 1,4-bis (4-hydroxyphenoxy) benzene, 1,3-bis ( 4-hydroxyphenoxy) benzene, 4,4′-dihydroxydiphenyl sulfide, 4,4′-dihydroxydiphenyl ketone, 4,4′-dihydroxydiphenyl sulfone, 4,4′-dihydroxybiphenyl, 2,2′-dihydroxybiphenyl, 10- (2,5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenanthrene-10-oxide, phenol novolak, bisphenol A novolak, o-cresol novolak, m-cresol novolak, p-cle All novolak, xylenol novolak, poly-p-hydroxystyrene, hydroquinone, resorcin, catechol, t-butylcatechol, t-butylhydroquinone, fluoroglycinol, pyrogallol, t-butyl pyrogallol, allylated pyrogallol, polyallylated pyrogallol, 1,2, 4-benzenetriol, 2,3,4-trihydroxybenzophenone, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6 Examples include dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8-dihydroxynaphthalene, allylated products of dihydroxynaphthalene, polyallylated products of dihydroxynaphthalene, allylated bisphenol A, allylated bisphenol F, allylated phenol novolak, allylated pyrogallol, etc. It is done. These phenolic curing agents may be used alone or in combination of two or more.

  Examples of amine-based curing agents include ethylenediamine, 1, -diaminopropane, 1,4-diaminopropane, hexamethylenediamine, 2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine, diethylenetriamine, iminobispropylamine, bis Aliphatic amines such as (hexamethylene) triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-hydroxyethylethylenediamine, tetra (hydroxyethyl) ethylenediamine; triethylene glycol diamine, tetraethylene glycol diamine, diethylene glycol bis Polyetheramines such as (propylamine), polyoxypropylenediamine, and polyoxypropylenetriamines; Min, metacenediamine, N-aminoethylpiperazine, bis (4-amino-3-methyldicyclohexyl) methane, bis (aminomethyl) cyclohexane, 3,9-bis (3-aminopropyl) -2,4,8, Cycloaliphatic amines such as 10-tetraoxaspiro (5,5) undecane, norbornenediamine; tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4-diaminoanisole, 2,4-toluenediamine, 2,4-diaminodiphenylmethane, 4,4′diaminodiphenylmethane, 4,4′-diamino-1,2-diphenylethane, 2,4 Diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone , M-aminophenol, m-aminobenzylamine, benzyldimethylamine, 2-dimethylaminomethyl) phenol, triethanolamine, methylbenzylamine, α- (m-aminophenyl) ethylamine, α- (p-aminophenyl) Aromatic amines such as ethylamine, diaminodiethyldimethyldiphenylmethane, α, α′-bis (4-aminophenyl) -p-diisopropylbenzene, and the like can be mentioned. These amine-based curing agents may be used alone or in combination of two or more.

  Examples of acid anhydride curing agents include dodecenyl succinic anhydride, polyadipic acid anhydride, polyazelinic acid anhydride, polysebacic acid anhydride, poly (ethyloctadecanedioic acid) anhydride, poly (phenylhexadecanedioic acid) anhydride. , Methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhymic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexene dicarboxylic anhydride, methylcyclohexene tetracarboxylic acid Anhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitic dianhydride, anhydrous het acid, anhydrous nadic acid, anhydrous methyl nadic acid, 5- (2 , -Dioxotetrahydro-3-furanyl) -3-methyl-3-cyclohexane-1,2-dicarboxylic anhydride, 3,4-dicarboxy-1,2,34-tetrahydro-1-naphthalene succinic dianhydride 1-methyl-dicarboxy 1,2,4-tetrahydro-1-naphthalene succinic dianhydride and the like. These acid anhydride curing agents may be used alone or in combination of two or more. Among these acid anhydride curing agents, the combined use of 4-methylhexahydrophthalic anhydride and hexahydrophthalic anhydride is preferred because the resin composition is excellent in fluidity and easy to knead the resin composition. .

  Examples of the amide type curing agent include dicyandiamide and polyamide resin. These amide type curing agents may be used alone or in combination of two or more.

  Examples of the tertiary amine include 1,8-diazabicyclo (5,4,0) undecene-7, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol. It is done. These tertiary amines may be used alone or in combination of two or more.

  Examples of imidazole and derivatives thereof include 1-cyanoethyl-2-phenylimidazole, 2-phenylimidazole, 2-ethyl-4 (5) -methylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methyl. Imidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyano-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenyl Imidazolium trimellitate, 2,4 diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methyl Imidazolyl- (1 ′)]-ethyl-s-triazine, 2,4 Diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl -4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, adducts of epoxy resin and the imidazoles, and the like. It is done. These imidazoles and derivatives thereof may be used alone or in combination of two or more.

  Examples of the organic phosphines include tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, phenylphosphine, and the like. These organic phosphines may be used individually by 1 type, and may use 2 or more types together.

  Examples of the phosphonium salt include tetraphenylphosphonium / tetraphenylborate, tetraphenylphosphonium / ethyltriphenylborate, and tetrabutylphosphonium / tetrabutylborate. These phosphonium salts may be used alone or in combination of two or more.

  Examples of the tetraphenylboron salt include 2-ethyl-4-methylimidazole / tetraphenylborate, N-methylmorpholine / tetraphenylborate, and the like. These tetraphenylboron salts may be used individually by 1 type, and may use 2 or more types together.

  The content of the curing agent (D) is preferably 1% by mass to 8% by mass, more preferably 2% by mass to 7% by mass, and still more preferably 4% by mass to 6% by mass in 100% by mass of the resin composition. The glass transition temperature of the hardened | cured material of a resin composition is high in the content rate of a hardening | curing agent (D) being 3 mass% or more. Moreover, the heat conductivity of the hardened | cured material of a resin composition is high in the content rate of a hardening | curing agent (D) being 8 mass% or less.

When the curing agent (D) is a phenol curing agent, an amine curing agent, or an acid anhydride curing agent, the equivalent ratio of the epoxy group in the epoxy resin to the functional group in the curing agent (D) is unreacted. Since an epoxy group and a functional group can be suppressed, 0.8-1.5 are preferable.
In this specification, the equivalent ratio of the epoxy group in the epoxy resin and the functional group in the curing agent (D) is obtained by dividing the mass% of the epoxy resin by the epoxy equivalent, and half the mass% of the curing agent. It is calculated by dividing by the value divided by the curing agent equivalent.

(Curing accelerator (E))
Since the resin composition of the present invention can lower the curing temperature and shorten the curing time, in addition to the resin (A), the inorganic filler (B), and the silicone compound (C), the curing is accelerated together with the curing agent (D). It is preferable that an agent (E) is included.

  As the curing accelerator (E), for example, a compound containing a tertiary amino group, imidazole and its derivatives, organic phosphines, dimethylurea, a coating agent made of an organic polymer, an inorganic compound, or the like is used to microencapsulate the compound. And the like. These hardening accelerators (E) may be used individually by 1 type, and may use 2 or more types together. Among these curing accelerators (E), imidazole and its derivatives are preferable since the pot life is long, the curability in the intermediate temperature range is excellent, and the heat resistance of the cured product of the resin composition is preferable. 4 (5) -methylimidazole is more preferred.

  Examples of the compound containing a tertiary amino group include 1,8-diazabicyclo (5,4,0) undecene-7, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol. Etc. These compounds containing a tertiary amino group may be used alone or in combination of two or more.

  Examples of imidazole and its derivatives include 1-cyanoethyl-2-phenylimidazole, 2-phenylimidazole, 2-ethyl-4 (5) -methylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2- Methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyano-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2- Phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4' -Methylimidazolyl- (1 ')]-ethyl-s-triazine, 2, -Diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2 -Phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, adducts of epoxy resins and imidazoles, etc. Is mentioned. These imidazoles and derivatives thereof may be used alone or in combination of two or more.

  Examples of the organic phosphines include tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, phenylphosphine, and the like. These organic phosphines may be used individually by 1 type, and may use 2 or more types together.

  0.01 mass%-3 mass% are preferable in 100 mass% of resin compositions, and, as for the content rate of a hardening accelerator (E), 0.02 mass%-1 mass% are more preferable. It is excellent in the heat resistance of the hardened | cured material of a resin composition as the content rate of a hardening accelerator (E) is 0.01 mass% or more. Moreover, the hardening acceleration | stimulation during kneading | mixing of a resin composition can be suppressed as the content rate of a hardening accelerator (E) is 3 mass% or less.

(Other ingredients)
The resin composition of the present invention is a resin (A), an inorganic filler (B), a silicone compound (C), a cured resin within the range not impairing the effects of the present invention for the purpose of further improving the functionality of the resin composition. In addition to the agent (D) and the curing accelerator (E), other components may be included.

  Examples of other components include fine particles for controlling the orientation of the inorganic filler (B), reactive or non-reactive diluents for reducing the viscosity of the resin composition, and elasticity of the cured product of the resin composition. Rubber particles for improving the rate and fracture toughness, mold release agents for facilitating removal of molded products from the mold, coupling agents for suppressing cracks occurring in the cured product of the resin composition, antioxidants , UV inhibitors, plasticizers, flame retardants, colorants, dispersants and the like. These other components may be used individually by 1 type, and may use 2 or more types together.

  Since the content rate of another component maintains the effect of this invention, 5 mass% or less is preferable in 100 mass% of resin compositions, and 1 mass% or less is more preferable.

(Production method of resin composition)
The resin composition of the present invention comprises a resin (A), an inorganic filler (B), and, if necessary, a silicone compound (C), a curing agent (D), a curing accelerator (E) and other components using a mixer or the like. It is obtained by kneading.
The blending order of these components is not particularly limited.

A medium can be added to the resin composition obtained by kneading to form a slurry, and the slurry can be applied and dried to form a film.
Additives are added to the resin composition obtained by kneading to obtain a massive kneaded product, which is then pulverized and granulated, or tableted by granulating the tablet. You can also

(Physical properties of resin composition)
The shear viscosity at 25 ° C. and a shear rate of 10 s ⁻¹ of the resin composition is preferably 100000 Pa · s or less, more preferably 100 Pa · s to 75000 Pa · s, and still more preferably 1000 Pa · s to 50000 Pa · s. When the shear viscosity at 25 ° C. of the resin composition is 100 Pa · s or more, there are few burrs in the molded product of the resin composition, and the quality of the molded product is excellent. Further, when the shear viscosity at 25 ° C. of the resin composition is 100000 Pa · s or less, the resin composition has excellent fluidity and the resin composition has excellent moldability.

The thermal conductivity of the cured product of the resin composition is preferably 3 W / m · K or more, more preferably 3.5 W / m · K to 20 W / m · K, and more preferably 4 W / m · K to 15 W / m · K. Further preferred. When the thermal conductivity of the cured product of the resin composition is 3 W / m · K or more, the heat dissipation of the molded product is excellent. Moreover, when the thermal conductivity of the cured product of the resin composition is 20 W / m · K or less, the resin composition can be easily designed.
In this specification, the thermal conductivity of the cured product of the resin composition is the thermal diffusivity measured according to ISO 22007-3 (temperature wave thermal analysis method), the specific gravity measured according to ISO 2781, The value calculated by the product with the specific heat measured in accordance with ISO 19628.

The shear modulus at 30 ° C. of the cured product of the resin composition is preferably 30 GPa or less, more preferably 10 GPa to 28 GPa, and even more preferably 15 GPa to 26 GPa. When the shear modulus at 30 ° C. of the cured product of the resin composition is 10 GPa or more, the heat resistance of the cured product of the resin composition is excellent. Moreover, the curvature amount of the hardened | cured material of a resin composition can be made small that the shear elastic modulus in 30 degreeC of the hardened | cured material of a resin composition is 30 GPa or less, and a molding defect can be suppressed.
In this specification, the shear modulus at 30 ° C. of the cured product of the resin composition is determined by cutting out a sample having a width of 3 mm × length of 35 mm from a cured film of the resin composition having a thickness of 500 μm. It is set as the value obtained by performing dynamic viscoelasticity measurement as follows using a measuring apparatus.
The sample was set in a dynamic viscoelasticity measuring device, and a torsional vibration having a sinusoidal distortion γ = 0.1% and a distortion frequency f = 1 Hz was applied between 30 ° C. and 270 ° C. at a rate of 3 ° C. per minute. The temperature is raised and the storage modulus G (GPa) at each temperature is measured. A value obtained by multiplying the storage elastic modulus G at 30 ° C. by 2.6 is defined as a shear elastic modulus at 30 ° C.

(Hardening / molding of resin composition)
A cured product or a molded product can be obtained by curing and molding the resin composition of the present invention. The methods of curing and molding are compression molding and transfer molding because of excellent productivity of cured products and molded products.

  Compression molding is a molding method in which a resin composition is placed in a heated mold cavity and pressed and cured and molded in the mold. For example, a resin composition is applied on a large-area wafer, a wafer coated with the resin composition is put into a mold cavity, and a molded product is obtained by heating and pressing in the mold. Can do.

  Transfer molding is a molding method in which a heat-softened resin composition is pressed into a heated mold cavity and cured and molded. For example, a molded product can be obtained by press-fitting a resin composition plasticized in a heating chamber into a cavity of a heated mold and heating in the mold.

(Use of resin composition)
The resin composition of the present invention has a high thermal conductivity of a cured product, a low elastic modulus of the cured product, and a small amount of warpage of the cured product. It can be suitably used for a body, etc., can be radiated with high efficiency from a semiconductor device having a high heat generation density, and is excellent in a protective function of a semiconductor element to be included, and thus is particularly suitably used for a high thermal conductive semiconductor sealing material. be able to.

(Semiconductor device)
The semiconductor device of the present invention includes a cured product of the resin composition of the present invention.
The manufacturing method of the semiconductor device of this invention includes the process of hardening | curing and shape | molding the resin composition of this invention. The methods of curing and molding are compression molding and transfer molding because of excellent productivity of cured products and molded products.

  As a specific example of a method for manufacturing a semiconductor device, a resin composition is applied on a silicon wafer or a substrate on which a rewiring layer is drawn on which a semiconductor chip previously separated is mounted, and compression molding is performed. And a method of dividing the molded product into individual pieces.

  EXAMPLES Hereinafter, although this invention is demonstrated more concretely using an Example, this invention is not limited to description of a following example, unless it deviates from the summary.

(Compounding ingredients)
Resin (A-1): “630LSD” (trade name, manufactured by Mitsubishi Chemical Corporation, glycidylamine type epoxy resin, epoxy equivalent 96 g / equivalent)
Resin (A-2): “LX-01” (trade name, manufactured by Daiso Chemical Co., Ltd., bisphenol A type epoxy resin, epoxy equivalent 171 g / equivalent)
Inorganic filler (B-1-1): Boron nitride produced by Production Example 1 described later (aggregated BN particles, specific surface area 26.7 m ² / g, volume average particle diameter 6.8 μm)
Inorganic filler (B-1-2): “RBN” (trade name, manufactured by Nissin Reflatec Co., Ltd., boron nitride, specific surface area 9.7 m ² / g, volume average particle diameter 2.7 μm, thickness direction thermal conductivity 3W / m · K, in-plane thermal conductivity 275W / m · K)
Inorganic filler (B-2-1): “A13-SI-C1” (trade name, manufactured by Admatex, aluminum oxide, volume average particle diameter: 5.2 μm)
Inorganic filler (B-2-2): “AC5250-SI” (trade name, manufactured by Admatechs Co., Ltd., aluminum oxide, volume average particle size: 3.3 μm)
Silicone compound (C-1): “KF-105” (trade name, manufactured by Shin-Etsu Chemical Co., Ltd., silicone oil)
Silicone compound (C-2): “KMP-600” (trade name, manufactured by Shin-Etsu Chemical Co., Ltd., silicone composite powder)
Curing agent (D-1): “Licacid MH-700G” (trade name, manufactured by Nippon Nippon Chemical Co., Ltd., mixture of 4-methylhexahydrophthalic anhydride and hexahydrophthalic anhydride, acid anhydride equivalent 166 g / equivalent)
Curing accelerator (E-1): “jER cure EMI24” (trade name, manufactured by Mitsubishi Chemical Corporation, 2-ethyl-4 (5) -methylimidazole)

(Shear viscosity of resin composition at 25 ° C.)
The resin compositions obtained in the examples and comparative examples were weighed exactly 0.143 cm ^{3 and} using a cone-plate rotational viscometer (model name “MCR102”, manufactured by Anton Paar) under the following conditions: The shear viscosity at 25 ° C. was measured.
Cone plate: 25 mm diameter, made of aluminum with an elevation angle of 2 ° Gap: 0.104 mm
Shear rate: 10 s ^-1

(Thermal conductivity)
The resin compositions obtained in Examples and Comparative Examples were applied onto a release film placed on a glass substrate, and the release film and the glass substrate were further sandwiched through a mold, at 130 ° C. and a pressure of 1 MPa. It was pressed for 2 hours to be cured and molded to obtain a cured film of a resin composition having a film thickness of 500 μm.
About the obtained cured film, the following apparatuses were used to measure thermal diffusivity, specific gravity and specific heat, and the thermal conductivity was calculated by multiplying these three measured values.
Thermal diffusivity: Thermal conductivity measurement device (model name “Eye Phase Mobile 1u”, manufactured by Eiphase Co., Ltd.)
Specific gravity: Balance (Model name “Balance XS-204”, manufactured by METTLER TOLEDO Co., Ltd., using solid specific gravity measurement kit)
Specific heat: Thermal analyzer (model name “DSC320 / 6200”, manufactured by Seiko Instruments Inc.)

(Shear modulus at 30 ° C)
The resin compositions obtained in the examples and comparative examples were applied onto a release film placed on a glass substrate, and the release film and the glass substrate were further sandwiched through a mold, at 150 ° C. and a pressure of 1 MPa. It was pressed for 2 hours to be cured and molded to obtain a cured film of a resin composition having a film thickness of 500 μm. A sample having a width of 3 mm and a length of 35 mm was cut out from the cured film, and this sample was dynamically used as follows using a dynamic viscoelasticity measuring apparatus (model name “Rheometer MCR102”, manufactured by Anton Paar Japan). Viscoelasticity measurement was performed.
The sample was set in a dynamic viscoelasticity measuring device, and a torsional vibration having a sinusoidal distortion γ = 0.1% and a distortion frequency f = 1 Hz was applied between 30 ° C. and 270 ° C. at a rate of 3 ° C. per minute. The temperature was raised and the storage elastic modulus G (GPa) at each temperature was measured. A value obtained by multiplying the storage elastic modulus G at 30 ° C. by 2.6 was defined as a shear elastic modulus at 30 ° C.

(Warpage amount)
The resin compositions obtained in the examples and comparative examples were strictly weighed 40.1 cm ³ and allowed to stand in the center on a silicon wafer having a diameter of 300 mm, and the compression molding temperature was 120 ° C. using a heat compression molding apparatus. Then, compression molding (compression molding) was performed at a compression molding time of 10 minutes to obtain a laminate in which a cured product of a resin composition having a thickness of 0.6 mm and a diameter of 292 mm was laminated on a silicon wafer.
The obtained laminate was air-cooled to 25 ° C. and placed on a surface plate, and the vertical distance from the bottom surface of the silicon wafer end to the surface plate of the laminate curved in a cylindrical shape was measured, and this value was taken as the amount of warpage. When the silicon wafer warps greatly due to the internal stress of the cured product and breaks without being able to withstand, it is described as “cracked” in Table 2.

[Production Example 1]
Boron nitride (trade name “ABN”, manufactured by Nissin Reflatec Co., Ltd.) 100 parts by mass, binder (trade name “Taxelum M160L”, manufactured by Taki Chemical Co., Ltd., solid content concentration 21% by mass) 115 parts by mass and surfactant A zirconia ceramic ball was placed in 2.5 parts by mass (ammonium lauryl sulfate, manufactured by Kao Corporation), and stirred for 1 hour on a pot mill rotary table to obtain a slurry.
The obtained slurry was granulated using a spray dryer (model name “FOC-20”, manufactured by Ogawara Koki Co., Ltd.) under the conditions of a disk rotational speed of 20,000 rpm to 23000 rpm and a drying temperature of 80 ° C.
The granulated boron nitride is evacuated at 23 ° C., then nitrogen gas is introduced and the pressure is restored, and the temperature is raised to 2000 ° C. at 83 ° C./hour while introducing nitrogen gas as it is. It was held for 5 hours while introducing nitrogen gas. Then, it cooled to 23 degreeC and obtained boron nitride (B-1-1).

[Example 1]
Resin (A-1) 2.8% by mass, Resin (A-2) 2.8% by mass and Curing agent (D-1) 5.4% by mass were added to a planetary mixer (model name “Hibismix 2P-03”). ", Manufactured by Primix Co., Ltd.) and stirred at a temperature of 50 ° C and 30 rpm for 5 minutes. Subsequently, 2.0 mass% of silicone compound (C-1) was further added, and the mixture was stirred for 5 minutes under the conditions of a temperature of 50 ° C. and 30 rpm. Subsequently, 45.7 mass% of inorganic fillers (B-2-1) and 30.5 mass% of inorganic fillers (B-2-2) were further added, and the mixture was stirred for 5 minutes at a temperature of 50 ° C. and 30 rpm. Next, 10.7% by mass of boron nitride (B-1-1) was further added, and the mixture was stirred for 5 minutes under the conditions of a temperature of 50 ° C. and 30 rpm, and the pressure inside the chamber was reduced with a diaphragm pump while the temperature was 50 ° C. and 30 rpm. The mixture was further stirred for 30 minutes under the above conditions. Next, 0.06% by mass of a curing accelerator (E-1) was added, and the mixture was stirred for 10 minutes under the conditions of a temperature of 50 ° C. and 30 rpm while decompressing the inside of the chamber with a diaphragm pump to obtain a resin composition.
The evaluation results of the obtained resin composition are shown in Table 2.

[Examples 2 to 7, Comparative Example 1]
A resin composition was obtained in the same manner as in Example 1 except that the blending components and blending amounts were changed as shown in Table 1.
The evaluation results of the obtained resin composition are shown in Table 2.

  As can be seen from Table 2, the resin compositions obtained in Examples 1 to 7 had a low viscosity, a high thermal conductivity of the cured product, a low elastic modulus of the cured product, and a small amount of warpage of the cured product. . In particular, since the resin compositions obtained in Examples 1 to 5 used boron nitride and aluminum oxide as the inorganic filler (B), the thermal conductivity of the cured product was remarkably high. On the other hand, since only aluminum oxide was used as the inorganic filler (B), the resin composition obtained in Comparative Example 1 had a high elastic modulus of the cured product, a large amount of warpage of the cured product, and was cracked.

  The resin composition of the present invention has a high thermal conductivity of a cured product, a low elastic modulus of the cured product, and a small amount of warpage of the cured product. It can be suitably used for a body, etc., can be radiated with high efficiency from a semiconductor device having a high heat generation density, and is excellent in a protective function of a semiconductor element to be included, and thus is particularly suitably used for a high thermal conductive semiconductor sealing material be able to.

Claims (12)

A resin composition comprising a resin (A) and an inorganic filler (B),
The inorganic filler (B) contains at least two selected from the group consisting of metal oxides, metal nitrides and boron nitrides,
Resin composition for compression mold or transfer mold.   The resin composition of Claim 1 in which resin (A) contains an epoxy resin.   The resin composition according to claim 1 or 2, wherein the inorganic filler (B) contains boron nitride and at least one selected from the group consisting of metal oxides and metal nitrides. The resin composition according to claim 1, wherein the boron nitride has a specific surface area of 10 m ² / g or more.   The resin composition according to any one of claims 1 to 4, wherein the inorganic filler (B) contains a metal oxide and boron nitride.   Furthermore, the resin composition of any one of Claims 1-5 containing a silicone compound (C).   The resin composition according to claim 6, wherein the silicone compound (C) includes at least one selected from the group consisting of silicone oil and silicone powder. The resin composition according to any one of claims 1 to 7, wherein the shear viscosity at 25 ° C and a shear rate of 10 s ^-1 is 100000 Pa · s or less.   The resin composition of any one of Claims 1-8 whose heat conductivity of hardened | cured material is 3 W / m * K or more.   The resin composition according to any one of claims 1 to 9, wherein the cured product has a shear elastic modulus at 30 ° C of 30 GPa or less.   The semiconductor device containing the hardened | cured material of the resin composition of any one of Claims 1-10.   The manufacturing method of a semiconductor device including the process of performing compression molding or transfer molding which hardens and shape | molds the resin composition of any one of Claims 1-10.