JP2019157125A - Composition, resin composition comprising the same and molded body of the same - Google Patents
Composition, resin composition comprising the same and molded body of the same Download PDFInfo
- Publication number
- JP2019157125A JP2019157125A JP2019040025A JP2019040025A JP2019157125A JP 2019157125 A JP2019157125 A JP 2019157125A JP 2019040025 A JP2019040025 A JP 2019040025A JP 2019040025 A JP2019040025 A JP 2019040025A JP 2019157125 A JP2019157125 A JP 2019157125A
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- Prior art keywords
- acid
- composition
- resin composition
- compound
- polyester
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- 239000000203 mixture Substances 0.000 title claims abstract description 151
- 239000011342 resin composition Substances 0.000 title claims abstract description 116
- 150000001875 compounds Chemical class 0.000 claims abstract description 118
- -1 ethyleneoxy groups Chemical group 0.000 claims abstract description 111
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 94
- 239000002253 acid Substances 0.000 claims abstract description 81
- 229920000642 polymer Polymers 0.000 claims abstract description 81
- 229920000728 polyester Polymers 0.000 claims abstract description 72
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 50
- 239000000057 synthetic resin Substances 0.000 claims abstract description 50
- 239000004593 Epoxy Substances 0.000 claims abstract description 37
- 229920000098 polyolefin Polymers 0.000 claims abstract description 36
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 30
- 238000006243 chemical reaction Methods 0.000 claims abstract description 26
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 23
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 43
- 150000002009 diols Chemical class 0.000 claims description 35
- 239000002608 ionic liquid Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 25
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 24
- 229910052783 alkali metal Inorganic materials 0.000 claims description 21
- 229920001577 copolymer Polymers 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 18
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 13
- 150000008065 acid anhydrides Chemical class 0.000 claims description 13
- 229920000570 polyether Polymers 0.000 claims description 12
- 229920005672 polyolefin resin Polymers 0.000 claims description 12
- 239000004793 Polystyrene Substances 0.000 claims description 11
- 229920002223 polystyrene Polymers 0.000 claims description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- 229920005990 polystyrene resin Polymers 0.000 claims description 3
- 230000000704 physical effect Effects 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 13
- 238000012360 testing method Methods 0.000 description 79
- 230000000052 comparative effect Effects 0.000 description 53
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 46
- 238000002156 mixing Methods 0.000 description 41
- 125000003118 aryl group Chemical group 0.000 description 37
- 125000001931 aliphatic group Chemical group 0.000 description 36
- 125000004432 carbon atom Chemical group C* 0.000 description 34
- 238000011156 evaluation Methods 0.000 description 33
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 29
- 229920005992 thermoplastic resin Polymers 0.000 description 29
- 238000013329 compounding Methods 0.000 description 25
- 238000005452 bending Methods 0.000 description 24
- 229920005989 resin Polymers 0.000 description 24
- 238000000034 method Methods 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 239000002216 antistatic agent Substances 0.000 description 20
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 17
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 16
- 239000003063 flame retardant Substances 0.000 description 16
- 230000005611 electricity Effects 0.000 description 14
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 14
- 150000003839 salts Chemical class 0.000 description 14
- 230000003068 static effect Effects 0.000 description 14
- 229910019142 PO4 Inorganic materials 0.000 description 13
- 239000003963 antioxidant agent Substances 0.000 description 13
- 235000021317 phosphate Nutrition 0.000 description 13
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 12
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 12
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 12
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 12
- 150000004985 diamines Chemical group 0.000 description 12
- 239000010452 phosphate Substances 0.000 description 12
- 238000000465 moulding Methods 0.000 description 11
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 11
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 239000000428 dust Substances 0.000 description 10
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 10
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 10
- 238000005259 measurement Methods 0.000 description 10
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 description 10
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 9
- 229920001971 elastomer Polymers 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 239000012785 packaging film Substances 0.000 description 9
- 229920006280 packaging film Polymers 0.000 description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 9
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 8
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 8
- 150000007524 organic acids Chemical class 0.000 description 8
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 8
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 7
- 239000002202 Polyethylene glycol Substances 0.000 description 7
- 125000002723 alicyclic group Chemical group 0.000 description 7
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 235000014113 dietary fatty acids Nutrition 0.000 description 7
- 239000000194 fatty acid Substances 0.000 description 7
- 229930195729 fatty acid Natural products 0.000 description 7
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 7
- 150000007522 mineralic acids Chemical class 0.000 description 7
- 229960003742 phenol Drugs 0.000 description 7
- 229920001223 polyethylene glycol Polymers 0.000 description 7
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 6
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 6
- 239000001361 adipic acid Substances 0.000 description 6
- 235000011037 adipic acid Nutrition 0.000 description 6
- 150000001450 anions Chemical class 0.000 description 6
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 6
- 238000011109 contamination Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- 238000006068 polycondensation reaction Methods 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 239000005060 rubber Substances 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000004711 α-olefin Substances 0.000 description 6
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 5
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- 239000002841 Lewis acid Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 5
- 239000007983 Tris buffer Substances 0.000 description 5
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 5
- 150000001768 cations Chemical class 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
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- 238000004519 manufacturing process Methods 0.000 description 5
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- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 5
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- 238000003786 synthesis reaction Methods 0.000 description 5
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 4
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 4
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- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 4
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 4
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 4
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 4
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- 125000005907 alkyl ester group Chemical group 0.000 description 4
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- 150000001412 amines Chemical class 0.000 description 4
- 239000002280 amphoteric surfactant Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
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- 238000000576 coating method Methods 0.000 description 4
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 4
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- ZHQLTKAVLJKSKR-UHFFFAOYSA-N homophthalic acid Chemical compound OC(=O)CC1=CC=CC=C1C(O)=O ZHQLTKAVLJKSKR-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 4
- 239000011976 maleic acid Substances 0.000 description 4
- 229940098779 methanesulfonic acid Drugs 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 239000002736 nonionic surfactant Substances 0.000 description 4
- 235000006408 oxalic acid Nutrition 0.000 description 4
- 239000005022 packaging material Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229960001755 resorcinol Drugs 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- 150000003460 sulfonic acids Chemical class 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- 238000004448 titration Methods 0.000 description 4
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 3
- WTPYFJNYAMXZJG-UHFFFAOYSA-N 2-[4-(2-hydroxyethoxy)phenoxy]ethanol Chemical compound OCCOC1=CC=C(OCCO)C=C1 WTPYFJNYAMXZJG-UHFFFAOYSA-N 0.000 description 3
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- 239000000344 soap Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- BAZAXWOYCMUHIX-UHFFFAOYSA-M sodium perchlorate Chemical compound [Na+].[O-]Cl(=O)(=O)=O BAZAXWOYCMUHIX-UHFFFAOYSA-M 0.000 description 1
- 229910001488 sodium perchlorate Inorganic materials 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920006027 ternary co-polymer Polymers 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- WUPCFMITFBVJMS-UHFFFAOYSA-N tetrakis(1,2,2,6,6-pentamethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)C(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)CC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 WUPCFMITFBVJMS-UHFFFAOYSA-N 0.000 description 1
- NZNAAUDJKMURFU-UHFFFAOYSA-N tetrakis(2,2,6,6-tetramethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)NC(C)(C)C1)C(C(=O)OC1CC(C)(C)NC(C)(C)C1)CC(=O)OC1CC(C)(C)NC(C)(C)C1 NZNAAUDJKMURFU-UHFFFAOYSA-N 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229950006389 thiodiglycol Drugs 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- TWQULNDIKKJZPH-UHFFFAOYSA-K trilithium;phosphate Chemical compound [Li+].[Li+].[Li+].[O-]P([O-])([O-])=O TWQULNDIKKJZPH-UHFFFAOYSA-K 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- LIPMRGQQBZJCTM-UHFFFAOYSA-N tris(2-propan-2-ylphenyl) phosphate Chemical compound CC(C)C1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C(C)C)OC1=CC=CC=C1C(C)C LIPMRGQQBZJCTM-UHFFFAOYSA-N 0.000 description 1
- SPUXJWDKFVXXBI-UHFFFAOYSA-N tris(2-tert-butylphenyl) phosphate Chemical compound CC(C)(C)C1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C(C)(C)C)OC1=CC=CC=C1C(C)(C)C SPUXJWDKFVXXBI-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- KPGXUAIFQMJJFB-UHFFFAOYSA-H tungsten hexachloride Chemical compound Cl[W](Cl)(Cl)(Cl)(Cl)Cl KPGXUAIFQMJJFB-UHFFFAOYSA-H 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本発明は、組成物、これを含有する樹脂組成物、およびその成形体に関し、詳しくは、合成樹脂の物性を損なうことなく、優れた帯電防止効果を持続的に付与することができる組成物、これを含有する樹脂組成物、およびその成形体に関する。 The present invention relates to a composition, a resin composition containing the composition, and a molded article thereof, and more specifically, a composition capable of continuously imparting an excellent antistatic effect without impairing physical properties of the synthetic resin, The present invention relates to a resin composition containing the same and a molded body thereof.
熱可塑性樹脂等の合成樹脂は、軽量で加工が容易であるのみならず、用途に応じて基材を設計することができる等の優れた特性を有しているため、現代では欠かすことのできない重要な素材である。また、熱可塑性樹脂は電気絶縁性に優れるという特性を有するため、電気製品のコンポーネント等に頻繁に利用されている。しかしながら、熱可塑性樹脂は、あまりにも絶縁性が高いため、摩擦等により帯電しやすいという問題がある。 Synthetic resins such as thermoplastic resins are not only lightweight and easy to process, but also have excellent properties such as the ability to design a substrate according to the application, so they are indispensable in modern times It is an important material. In addition, since thermoplastic resins have the property of being excellent in electrical insulation, they are frequently used for components of electrical products. However, since the thermoplastic resin is too insulating, there is a problem that it is easily charged by friction or the like.
帯電した熱可塑性樹脂は、周囲の埃や塵を引き付けるため、樹脂成形品の外観を損ねるという問題が生ずる。また、電子製品の中でも、例えば、コンピューター等の精密機器は、帯電により回路が正常に作動することができなくなる場合がある。さらに、電撃による問題も存在する。樹脂から人体に対して電撃が発生すると、人に不快感を与えるだけでなく、可燃性気体や粉塵のあるところでは、爆発事故を誘引する可能性もある。さらにまた、電気電子機器や電気電子部品の包装材等に使用される合成樹脂フィルムにおいても、帯電による静電気の発生は、電撃や微細な埃を引き付けることで、部品や機器の故障を引き起こし、大きな問題となる。 Since the charged thermoplastic resin attracts surrounding dust and dust, the appearance of the resin molded product is impaired. In addition, among electronic products, for example, a precision device such as a computer may not be able to operate normally due to charging. In addition, there are problems caused by electric shock. When an electric shock occurs from the resin to the human body, it not only makes the person uncomfortable, but may also cause an explosion accident where there is flammable gas or dust. Furthermore, even in synthetic resin films used for packaging materials for electrical and electronic equipment and electrical and electronic parts, the occurrence of static electricity due to electrification causes damage to parts and equipment by attracting electric shock and fine dust. It becomes a problem.
また、特に近年、自動車内外装部品は、軽量化、低コスト化、成形の容易さ、剛性、耐衝撃性等の各種要求性能からポリオレフィン樹脂等の熱可塑性樹脂や熱可塑性エラストマー、充填剤等からなる樹脂組成物が使用されており、これら自動車内外装材においても、静電気の発生を抑えることが望まれている。 In recent years, automotive interior / exterior parts have been manufactured from thermoplastic resins such as polyolefin resins, thermoplastic elastomers, fillers, etc. due to various performance requirements such as weight reduction, cost reduction, ease of molding, rigidity, and impact resistance. Therefore, it is desired to suppress the generation of static electricity in these automotive interior and exterior materials.
このような問題を解消するために、従来から、合成樹脂に対して帯電を防止する処理がなされている。最も一般的な帯電防止処理方法は、合成樹脂に帯電防止剤を加える方法である。このような帯電防止剤には、樹脂成形体表面に塗布する塗布型のものと、樹脂を加工成形する際に添加する練り込み型のものとがあるが、塗布型のものは持続性に劣ることに加え、表面に大量の有機物が塗布されるために、その表面に触れたものが汚染されるという問題があった。 In order to solve such a problem, conventionally, the synthetic resin has been treated to prevent charging. The most common antistatic treatment method is a method of adding an antistatic agent to the synthetic resin. Such antistatic agents include a coating type that is applied to the surface of the resin molded body and a kneading type that is added when the resin is processed and molded, but the coating type is inferior in sustainability. In addition, since a large amount of organic matter is applied to the surface, there is a problem that the material touching the surface is contaminated.
かかる観点から、従来、主として練り込み型の帯電防止剤が検討されており、例えば、特許文献1、2では、ポリオレフィン系樹脂への帯電防止性付与のために、ポリエーテルエステルアミドが提案されている。また、特許文献3では、ポリオレフィンのブロックと親水性ポリマーのブロックとが、繰り返し交互に結合した構造を有するブロックポリマーが提案されている。さらに、特許文献4では、ポリエステルのブロックを有する高分子型帯電防止剤が提案されている。 From this point of view, conventionally kneaded antistatic agents have been mainly studied. For example, Patent Documents 1 and 2 propose polyether ester amides for imparting antistatic properties to polyolefin resins. Yes. Patent Document 3 proposes a block polymer having a structure in which a polyolefin block and a hydrophilic polymer block are alternately and repeatedly bonded. Further, Patent Document 4 proposes a polymer antistatic agent having a polyester block.
しかしながら、これら従来の帯電防止剤は、帯電防止性能において、必ずしも充分とはいえず、さらなる改良が望まれているのが現状である。特に、合成樹脂製のフィルム用途に使用した場合、充分な帯電防止性を発揮できない問題があり、その持続性においても充分ではなかった。さらに、樹脂に多量に添加しなければ十分な性能を得られないため、フィルムの透明性や、引張破断強度や破断伸び率等のフィルム物性に悪影響を及ぼすという問題があった。 However, these conventional antistatic agents are not necessarily sufficient in antistatic performance, and the current situation is that further improvements are desired. In particular, when it is used for a film made of a synthetic resin, there is a problem that sufficient antistatic properties cannot be exhibited, and the sustainability is not sufficient. Furthermore, since sufficient performance cannot be obtained unless a large amount is added to the resin, there is a problem in that it adversely affects the film properties such as transparency of the film, tensile strength at break and elongation at break.
また、力学特性の向上等のために充填剤を配合された樹脂組成物の場合、充分な帯電防止性を発揮できない問題があり、その持続性においても充分ではなかった。さらに、樹脂に多量に添加しなければ十分な性能を得られないため、曲げ弾性率や衝撃強度、熱変形温度等の成形体の力学特性等の物性に悪影響を及ぼすという問題もあった。 In addition, in the case of a resin composition containing a filler for the purpose of improving mechanical properties, there is a problem that sufficient antistatic properties cannot be exhibited, and the sustainability is not sufficient. Furthermore, since sufficient performance cannot be obtained unless a large amount is added to the resin, there is also a problem in that physical properties such as the flexural modulus, impact strength, thermal deformation temperature and other properties of the molded article are adversely affected.
そこで、本発明の目的は、合成樹脂の物性を損なうことなく、優れた帯電防止効果を持続的に付与することができる組成物、これを含有する樹脂組成物、およびその成形体を提供することにある。 Then, the objective of this invention is providing the composition which can provide the outstanding antistatic effect continuously, without impairing the physical property of a synthetic resin, the resin composition containing this, and its molded object. It is in.
本発明者らは、上記課題を解決すべく鋭意検討した結果、下記構成とすることで、上記課題を解消できることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that the above-described problems can be solved by adopting the following configuration, and have completed the present invention.
すなわち、本発明の組成物は、(X)成分100質量部に対して、(Y)成分を0.5〜40.0質量部含有する組成物であって、
(X)成分が、ジオールとジカルボン酸とが反応して得られるポリエステル(a)と、エチレンオキシ基を一つ以上有する両末端に水酸基を有する化合物(b)と、エポキシ基を2個以上有するエポキシ化合物(D)と、が反応して得られる高分子化合物(E)の1種以上、
(Y)成分が、酸無水物変成ポリオレフィンの1種以上、
であることを特徴とするものである。
That is, the composition of the present invention is a composition containing 0.5 to 40.0 parts by mass of the (Y) component with respect to 100 parts by mass of the (X) component,
(X) Component has polyester (a) obtained by reaction of diol and dicarboxylic acid, compound (b) having hydroxyl groups at both ends having one or more ethyleneoxy groups, and two or more epoxy groups One or more polymer compounds (E) obtained by reacting the epoxy compound (D),
(Y) component is at least one acid anhydride modified polyolefin,
It is characterized by being.
本発明の組成物においては、前記高分子化合物(E)は、前記ポリエステル(a)から構成されるポリエステルのブロック(A)と、前記化合物(b)から構成されるポリエーテルのブロック(B)と、を有し、前記ポリエステル(a)の末端に有する水酸基またはカルボキシル基と、前記化合物(b)の末端に有する水酸基と、前記エポキシ化合物(D)のエポキシ基と、の反応により形成された、エステル結合またはエーテル結合を介して結合してなる構造を有することが好ましく、特に、前記ポリエステルのブロック(A)と、前記ポリエーテルのブロック(B)と、がエステル結合を介して繰り返し交互に結合してなる両末端にカルボキシル基を有するブロックポリマー(C)と、前記エポキシ化合物(D)と、がエステル結合を介して結合してなる構造を有することが好ましい。また、本発明の組成物においては、前記(Y)成分は、無水マレイン酸変性ポリオレフィンであることが好ましく、前記酸無水物変性ポリオレフィンの酸価が、1〜100mgKOH/gであることや、前記酸無水物変性ポリオレフィンの重量平均分子量が、ポリスチレン換算で1,000〜500,000であることが好ましい。さらに、本発明の組成物においては、さらに、アルカリ金属の塩およびイオン性液体からなる群から選択される1種以上が配合されたものであることが好ましい。 In the composition of the present invention, the polymer compound (E) comprises a polyester block (A) composed of the polyester (a) and a polyether block (B) composed of the compound (b). And the hydroxyl group or carboxyl group at the terminal of the polyester (a), the hydroxyl group at the terminal of the compound (b), and the epoxy group of the epoxy compound (D). The polyester block (A) and the polyether block (B) are preferably alternately and repeatedly formed via an ester bond. The block polymer (C) having a carboxyl group at both ends formed by bonding and the epoxy compound (D) are connected via an ester bond. To have formed by bonding structure Te is preferred. In the composition of the present invention, the component (Y) is preferably maleic anhydride-modified polyolefin, and the acid value of the acid anhydride-modified polyolefin is 1 to 100 mgKOH / g, The weight average molecular weight of the acid anhydride-modified polyolefin is preferably 1,000 to 500,000 in terms of polystyrene. Furthermore, in the composition of this invention, it is preferable that 1 or more types selected from the group which consists of an alkali metal salt and an ionic liquid are further mix | blended.
本発明の樹脂組成物は、合成樹脂に対し、本発明の組成物が配合されたことを特徴とするものである。 The resin composition of the present invention is characterized in that the composition of the present invention is blended with a synthetic resin.
本発明の樹脂組成物においては、前記合成樹脂は、ポリオレフィン系樹脂、ポリスチレン系樹脂およびそれらの共重合体からなる群から選択されることが好ましい。また、本発明の樹脂組成物においては、さらに充填剤が配合されてなることが好ましい。さらに、本発明の樹脂組成物は、さらに、熱可塑性エラストマーが含有されてなることも好ましい。 In the resin composition of the present invention, the synthetic resin is preferably selected from the group consisting of polyolefin resins, polystyrene resins, and copolymers thereof. Moreover, in the resin composition of this invention, it is preferable that a filler is further mix | blended. Furthermore, it is preferable that the resin composition of the present invention further contains a thermoplastic elastomer.
本発明の成形体は、本発明の樹脂組成物から得られることを特徴とするものである。 The molded product of the present invention is obtained from the resin composition of the present invention.
本発明の成形体としては、フィルムおよび自動車内外装材に好適である。 The molded article of the present invention is suitable for films and automotive interior / exterior materials.
本発明によれば、合成樹脂の物性を損なうことなく、優れた帯電防止効果を持続的に付与することができる組成物、これを含有する樹脂組成物、およびその成形体を提供することができる。本発明の成形体は、優れた物性を有し、静電気が発生しにくく、静電気による表面の汚染や埃の付着による商品価値の下落を生じにくい。そのため、フィルムや自動車内外装材に特に好適である。 ADVANTAGE OF THE INVENTION According to this invention, the composition which can provide the outstanding antistatic effect continuously without impairing the physical property of a synthetic resin, the resin composition containing this, and its molded object can be provided. . The molded article of the present invention has excellent physical properties, hardly generates static electricity, and does not easily cause a drop in commercial value due to surface contamination or dust adhesion due to static electricity. Therefore, it is particularly suitable for films and automotive interior / exterior materials.
以下、本発明の実施の形態について詳細に説明する。
本発明の組成物は、(X)成分100質量部に対して、(Y)成分を0.5〜40.0質量部含有する組成物である。(X)成分は、ジオールとジカルボン酸とが反応して得られるポリエステル(a)と、エチレンオキシ基を一つ以上有する両末端に水酸基を有する化合物(b)と、エポキシ基を2個以上有するエポキシ化合物(D)と、が反応して得られる高分子化合物(E)の1種以上であり、(Y)成分は、酸無水物変成ポリオレフィンの1種以上である。
Hereinafter, embodiments of the present invention will be described in detail.
The composition of this invention is a composition which contains 0.5-40.0 mass parts of (Y) component with respect to 100 mass parts of (X) component. The component (X) has a polyester (a) obtained by reacting a diol and a dicarboxylic acid, a compound (b) having one or more ethyleneoxy groups and hydroxyl groups at both ends, and two or more epoxy groups. It is 1 or more types of the high molecular compound (E) obtained by a reaction with an epoxy compound (D), and (Y) component is 1 or more types of an acid anhydride modified polyolefin.
まず、本発明の組成物に係る(X)成分について説明する。本発明の組成物に係る(X)成分は、高分子化合物(E)の1種以上である。この高分子化合物(E)は、ジオールとジカルボン酸とが反応して得られるポリエステル(a)と、エチレンオキシ基を一つ以上有する両末端に水酸基を有する化合物(b)と、エポキシ基を2個以上有するエポキシ化合物(D)と、が反応して得られる高分子化合物である。ここでエチレンオキシ基とは、下記一般式(1)で示される基である。
First, the (X) component which concerns on the composition of this invention is demonstrated. The component (X) according to the composition of the present invention is at least one polymer compound (E). This polymer compound (E) comprises a polyester (a) obtained by reacting a diol and a dicarboxylic acid, a compound (b) having one or more ethyleneoxy groups and hydroxyl groups at both ends, and 2 epoxy groups. It is a polymer compound obtained by reacting with at least one epoxy compound (D). Here, the ethyleneoxy group is a group represented by the following general formula (1).
高分子化合物(E)は、ポリエステル(a)から構成されるポリエステルのブロック(A)と、エチレンオキシ基を一つ以上有する両末端に水酸基を有する化合物(b)から構成されるポリエーテルのブロック(B)を有し、ポリエステル(a)の末端に有する水酸基またはカルボキシル基と、化合物(b)の末端に有する水酸基と、エポキシ化合物(D)のエポキシ基の反応により形成された、エステル結合またはエーテル結合を介して結合してなる構造を有することが、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から好ましい。 The polymer compound (E) is a polyether block composed of a polyester block (A) composed of polyester (a) and a compound (b) having hydroxyl groups at both ends having at least one ethyleneoxy group. An ester bond formed by the reaction of a hydroxyl group or carboxyl group at the terminal of the polyester (a), a hydroxyl group at the terminal of the compound (b), and an epoxy group of the epoxy compound (D). Having a structure formed through an ether bond has antistatic properties and durability, film properties such as film transparency, tensile rupture strength and elongation at break, flexural modulus, impact strength, and heat distortion temperature. It is preferable from the viewpoint of the mechanical properties of the molded article.
高分子化合物(E)のポリエステルのブロック(A)は、ジオールとジカルボン酸とが反応して得られるポリエステル(a)から構成される。本発明の組成物において、高分子化合物(E)のポリエステルのブロック(A)は、ジオールと脂肪族カルボン酸および芳香族ジカルボン酸とが反応して得られるポリエステル(a)から構成されるのが、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から好ましい。なお、ポリエステル(a)はジオールとジカルボン酸とをエステル化反応させれば得ることができる。 The polyester block (A) of the polymer compound (E) is composed of a polyester (a) obtained by reacting a diol and a dicarboxylic acid. In the composition of the present invention, the polyester block (A) of the polymer compound (E) is composed of a polyester (a) obtained by reacting a diol with an aliphatic carboxylic acid and an aromatic dicarboxylic acid. From the viewpoints of antistatic properties and durability, film properties such as film transparency, tensile breaking strength and elongation at break, bending properties, impact strength, heat distortion temperature and other mechanical properties of the molded article. The polyester (a) can be obtained by esterifying diol and dicarboxylic acid.
本発明に係る高分子化合物(E)で用いられるジオールとしては、脂肪族ジオールおよび芳香族基含有ジオールが挙げられる。ジオールは、2種以上の混合物でもよい。 Examples of the diol used in the polymer compound (E) according to the present invention include aliphatic diols and aromatic group-containing diols. The diol may be a mixture of two or more.
脂肪族ジオールとしては、例えば、1,2−エタンジオール(エチレングリコール)、1,2−プロパンジオール(プロピレングリコール)、1,3−プロパンジオール、1,2−ブタンジオール、1,3−ブタンジオール、2−メチル−1,3−プロパンジオール、1,4−ブタンジオール、1,5−ペンタンジオール、2,2−ジメチル−1,3−プロパンジオール(ネオペンチルグリコール)、2,2−ジエチル−1,3−プロパンジオール(3,3−ジメチロールペンタン)、2−n−ブチル−2−エチル−1,3プロパンジオール(3,3−ジメチロールヘプタン)、3−メチル−1,5−ペンタンジオール、1,6−ヘキサンジオール、2,2,4−トリメチル−1,3−ペンタンジオール、2−エチル−1,3−ヘキサンジオール、2−メチル−1,8−オクタンジオール、1,9−ノナンジオール、1,10−デカンジオール、1,12−オクタデカンジオール、1,4−シクロヘキサンジメタノール、水素添加ビスフェノールA、1,2−、1,3−または1,4−シクロヘキサンジオール、シクロドデカンジオール、ダイマージオール、水素添加ダイマージオール、ジエチレングリコール、ジプロピレングリコール、トリエチレングリコール等が挙げられる。 Examples of the aliphatic diol include 1,2-ethanediol (ethylene glycol), 1,2-propanediol (propylene glycol), 1,3-propanediol, 1,2-butanediol, and 1,3-butanediol. 2-methyl-1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 2,2-dimethyl-1,3-propanediol (neopentyl glycol), 2,2-diethyl- 1,3-propanediol (3,3-dimethylolpentane), 2-n-butyl-2-ethyl-1,3-propanediol (3,3-dimethylolheptane), 3-methyl-1,5-pentane Diol, 1,6-hexanediol, 2,2,4-trimethyl-1,3-pentanediol, 2-ethyl-1,3-hexanedio 2-methyl-1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,12-octadecanediol, 1,4-cyclohexanedimethanol, hydrogenated bisphenol A, 1,2 -, 1,3- or 1,4-cyclohexanediol, cyclododecanediol, dimer diol, hydrogenated dimer diol, diethylene glycol, dipropylene glycol, triethylene glycol and the like.
これら脂肪族ジオールの中でも、1,4−シクロヘキサンジメタノール、水素添加ビスフェノールAが、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から好ましく、1,4−シクロヘキサンジメタノールがより好ましい。なお、脂肪族ジオールは、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、疎水性を有することが好ましいので、親水性を有するポリエチレングリコールの使用は好ましくない。 Among these aliphatic diols, 1,4-cyclohexanedimethanol and hydrogenated bisphenol A are antistatic properties and their durability, film properties such as film transparency, tensile breaking strength and elongation at break, flexural modulus, From the viewpoint of the mechanical properties of the molded article such as impact strength and heat distortion temperature, 1,4-cyclohexanedimethanol is more preferred. The aliphatic diol has antistatic properties and durability, film properties such as film transparency, tensile breaking strength and elongation at break, bending elastic modulus, impact strength, heat distortion temperature and other mechanical properties of the molded body. From the point of view, it is preferable to use a polyethylene glycol having hydrophilicity because it is preferably hydrophobic.
芳香族基含有ジオールとしては、例えば、ビスフェノールA、1,2−ヒドロキシベンゼン、1,3−ヒドロキシベンゼン、1,4−ヒドロキシベンゼン、1,4−ベンゼンジメタノール、ビスフェノールAのエチレンオキサイド付加物、ビスフェノールAのプロピレンオキサイド付加物、1,4−ビス(2−ヒドロキシエトキシ)ベンゼン、レゾルシン、ピロカテコール等の単核2価フェノール化合物のポリヒドロキシエチル付加物等が挙げられる。 Examples of the aromatic group-containing diol include bisphenol A, 1,2-hydroxybenzene, 1,3-hydroxybenzene, 1,4-hydroxybenzene, 1,4-benzenedimethanol, ethylene oxide adduct of bisphenol A, Examples include propylene oxide adducts of bisphenol A, polyhydroxyethyl adducts of mononuclear dihydric phenol compounds such as 1,4-bis (2-hydroxyethoxy) benzene, resorcin, and pyrocatechol.
これら芳香族基を有するジオールの中でも、ビスフェノールAのエチレンオキサイド付加物、1,4−ビス(β−ヒドロキシエトキシ)ベンゼンが好ましい。なお、芳香族ジオールは、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、疎水性を有することが好ましい。 Among these diols having an aromatic group, ethylene oxide adduct of bisphenol A and 1,4-bis (β-hydroxyethoxy) benzene are preferable. The aromatic diol has antistatic properties and durability, film properties such as film transparency, tensile breaking strength and elongation at break, bending elastic modulus, impact strength, heat distortion temperature and other mechanical properties of the molded body. From the viewpoint, it is preferable to have hydrophobicity.
本発明に係る高分子化合物(E)においては、ポリエステル(a)の構成成分であるジカルボン酸として、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、脂肪族ジカルボン酸および芳香族ジカルボン酸の両者を併用することが好ましい。 In the polymer compound (E) according to the present invention, as the dicarboxylic acid which is a constituent component of the polyester (a), film properties such as antistatic property and durability, transparency of the film, tensile strength at break and elongation at break. From the viewpoint of the mechanical properties of the molded article such as bending elastic modulus, impact strength, and heat distortion temperature, it is preferable to use both aliphatic dicarboxylic acid and aromatic dicarboxylic acid.
本発明に係る高分子化合物(E)で用いられる脂肪族ジカルボン酸は、脂肪族ジカルボン酸の誘導体(例えば、酸無水物、アルキルエステル、アルカリ金属塩、酸ハライド等)であってもよい。脂肪族ジカルボン酸およびその誘導体は、2種以上の混合物でもよい。 The aliphatic dicarboxylic acid used in the polymer compound (E) according to the present invention may be a derivative of an aliphatic dicarboxylic acid (for example, an acid anhydride, an alkyl ester, an alkali metal salt, an acid halide, etc.). The aliphatic dicarboxylic acid and its derivative may be a mixture of two or more.
脂肪族ジカルボン酸としては、好ましくは炭素原子数2〜20の脂肪族ジカルボン酸が挙げられ、例えば、シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、1,10−デカンジカルボン酸、1,4−シクロヘキサンジカルボン酸、ダイマー酸、マレイン酸、フマル酸等が挙げられる。これら脂肪族ジカルボン酸の中でも、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、炭素原子数4〜16のジカルボン酸が好ましく、炭素原子数6〜12のジカルボン酸がより好ましい。 The aliphatic dicarboxylic acid is preferably an aliphatic dicarboxylic acid having 2 to 20 carbon atoms, such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, Examples include sebacic acid, 1,10-decanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, dimer acid, maleic acid, and fumaric acid. Among these aliphatic dicarboxylic acids, mechanical properties of the molded article such as antistatic properties and durability, film properties such as film transparency, tensile breaking strength and elongation at break, bending elastic modulus, impact strength, and heat distortion temperature. From the above point, a dicarboxylic acid having 4 to 16 carbon atoms is preferable, and a dicarboxylic acid having 6 to 12 carbon atoms is more preferable.
本発明に係る高分子化合物(E)で用いられる芳香族ジカルボン酸は、芳香族ジカルボン酸の誘導体(例えば、酸無水物、アルキルエステル、アルカリ金属塩、酸ハライド等)であってもよい。また、芳香族ジカルボン酸およびその誘導体は、2種以上の混合物でもよい。 The aromatic dicarboxylic acid used in the polymer compound (E) according to the present invention may be an aromatic dicarboxylic acid derivative (for example, acid anhydride, alkyl ester, alkali metal salt, acid halide, etc.). Moreover, 2 or more types of mixtures may be sufficient as aromatic dicarboxylic acid and its derivative (s).
芳香族ジカルボン酸としては、好ましくは炭素原子数8〜20の芳香族ジカルボン酸が挙げられ、例えば、テレフタル酸、イソフタル酸、フタル酸、フェニルマロン酸、ホモフタル酸、フェニルコハク酸、β−フェニルグルタル酸、α−フェニルアジピン酸、β−フェニルアジピン酸、ビフェニル−2,2’−ジカルボン酸、ビフェニル−4,4’−ジカルボン酸、ナフタレンジカルボン酸、3−スルホイソフタル酸ナトリウムおよび3−スルホイソフタル酸カリウム等が挙げられる。これら芳香族ジカルボン酸の中でも、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、テレフタル酸、イソフタル酸、フタル酸(無水フタル酸を含む)が好ましく、フタル酸(無水フタル酸を含む)がより好ましい。 The aromatic dicarboxylic acid is preferably an aromatic dicarboxylic acid having 8 to 20 carbon atoms. For example, terephthalic acid, isophthalic acid, phthalic acid, phenylmalonic acid, homophthalic acid, phenylsuccinic acid, β-phenylglutar Acid, α-phenyladipic acid, β-phenyladipic acid, biphenyl-2,2′-dicarboxylic acid, biphenyl-4,4′-dicarboxylic acid, naphthalenedicarboxylic acid, sodium 3-sulfoisophthalate and 3-sulfoisophthalic acid Potassium etc. are mentioned. Among these aromatic dicarboxylic acids, antistatic properties and durability, film properties such as film transparency, tensile rupture strength and elongation at break, flexural modulus, impact strength, heat distortion temperature, etc. From this point, terephthalic acid, isophthalic acid, and phthalic acid (including phthalic anhydride) are preferable, and phthalic acid (including phthalic anhydride) is more preferable.
次に化合物(b)と、高分子化合物(E)のポリエーテル(B)のブロックについて説明する。ポリエーテル(B)のブロックは、下記一般式(1)で示されるエチレンオキシ基を一つ以上有する両末端に水酸基を有する化合物(b)から構成される。 Next, the block of the compound (b) and the polyether (B) of the polymer compound (E) will be described. The block of polyether (B) is comprised from the compound (b) which has a hydroxyl group in the both terminal which has one or more ethyleneoxy groups shown by following General formula (1).
一般式(1)で示されるエチレンオキシ基を一つ以上有し両末端に水酸基を有する化合物(b)としては、親水性を有する化合物が好ましく、一般式(1)で示されるエチレンオキシ基を有するポリエーテルがより好ましく、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率度等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、ポリエチレングリコールがさらにより好ましく、下記一般式(2)で表されるポリエチレングリコールが特に好ましい。 As the compound (b) having at least one ethyleneoxy group represented by the general formula (1) and having hydroxyl groups at both ends, a hydrophilic compound is preferable, and the ethyleneoxy group represented by the general formula (1) The polyether has more preferable, antistatic property and its sustainability, film transparency such as film transparency, tensile breaking strength and breaking elongation rate, bending elastic modulus, impact strength, thermal deformation temperature, etc. From this point, polyethylene glycol is even more preferable, and polyethylene glycol represented by the following general formula (2) is particularly preferable.
一般式(2)中、mは5〜250の数を表す。mは、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、20〜200が好ましく、40〜180がより好ましい。 In general formula (2), m represents the number of 5-250. m is 20 in terms of antistatic properties and durability thereof, film properties such as film transparency, tensile breaking strength and elongation at break, bending elastic modulus, impact strength, thermal deformation temperature and other mechanical properties of the molded article. -200 are preferable and 40-180 are more preferable.
化合物(b)としては、エチレンオキサイドを付加反応させて得られるポリエチレングリコール以外に、エチレンオキサイドと、他のアルキレンオキサイド(例えば、プロピレンオキサイド、1,2−、1,4−、2,3−または1,3−ブチレンオキサイド等)の1種以上とを付加反応させたポリエーテルが挙げられ、このポリエーテルはランダムでもブロックでもいずれでもよい。 As the compound (b), in addition to polyethylene glycol obtained by addition reaction of ethylene oxide, ethylene oxide and other alkylene oxides (for example, propylene oxide, 1,2-, 1,4-, 2,3- or And a polyether obtained by addition reaction of one or more of 1,3-butylene oxide and the like. The polyether may be random or block.
化合物(b)の例をさらに挙げると、活性水素原子含有化合物にエチレンオキサイドが付加した構造の化合物や、エチレンオキサイドおよび他のアルキレンオキサイド(例えば、プロピレンオキサイド、1,2−、1,4−、2,3−または1,3−ブチレンオキサイド等)の1種以上が付加した構造の化合物が挙げられる。これらはランダム付加およびブロック付加のいずれでもよい。 Further examples of compound (b) include compounds having a structure in which ethylene oxide is added to an active hydrogen atom-containing compound, ethylene oxide and other alkylene oxides (for example, propylene oxide, 1,2-, 1,4-, 2,3- or 1,3-butylene oxide and the like). These may be either random addition or block addition.
活性水素原子含有化合物としては、グリコール、2価フェノール、1級モノアミン、2級ジアミンおよびジカルボン酸等が挙げられる。 Examples of the active hydrogen atom-containing compound include glycol, dihydric phenol, primary monoamine, secondary diamine, and dicarboxylic acid.
グリコールとしては、炭素原子数2〜20の脂肪族グリコール、炭素原子数5〜12の脂環式グリコールおよび炭素原子数8〜26の芳香族グリコール等が使用できる。 As glycol, C2-C20 aliphatic glycol, C5-C12 alicyclic glycol, C8-C26 aromatic glycol, etc. can be used.
脂肪族グリコールとしては、例えば、エチレングリコール、1,2−プロピレングリコール、1,3−プロパンジオール、1,2−ブタンジオール、1,3−ブタンジオール、1,4−ブタンジオール、1,3−ヘキサンジオール、1,4−ヘキサンジオール、1,6−ヘキサンジオール、2,5−ヘキサンジオール、1,2−オクタンジオール、1,8−オクタンジオール、1,10−デカンジオール、1,18−オクタデカンジオール、1,20−エイコサンジオール、ジエチレングリコール、トリエチレングリコールおよびチオジエチレングリコール等が挙げられる。 Examples of the aliphatic glycol include ethylene glycol, 1,2-propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,3-butanediol, Hexanediol, 1,4-hexanediol, 1,6-hexanediol, 2,5-hexanediol, 1,2-octanediol, 1,8-octanediol, 1,10-decanediol, 1,18-octadecane Examples include diol, 1,20-eicosanediol, diethylene glycol, triethylene glycol, and thiodiethylene glycol.
脂環式グリコールとしては、例えば、1−ヒドロキシメチル−1−シクロブタノール、1,2−シクロヘキサンジオール、1,3−シクロヘキサンジオール、1,4−シクロヘキサンジオール、1−メチル−3,4−シクロヘキサンジオール、2−ヒドロキシメチルシクロヘキサノール、4−ヒドロキシメチルシクロヘキサノール、1,4−シクロヘキサンジメタノールおよび1,1’−ジヒドロキシ−1,1’−ジシクロヘキシル等が挙げられる。 Examples of the alicyclic glycol include 1-hydroxymethyl-1-cyclobutanol, 1,2-cyclohexanediol, 1,3-cyclohexanediol, 1,4-cyclohexanediol, and 1-methyl-3,4-cyclohexanediol. 2-hydroxymethylcyclohexanol, 4-hydroxymethylcyclohexanol, 1,4-cyclohexanedimethanol, 1,1′-dihydroxy-1,1′-dicyclohexyl, and the like.
芳香族グリコールとしては、例えば、ジヒドロキシメチルベンゼン、1,4−ビス(β−ヒドロキシエトキシ)ベンゼン、2−フェニル−1,3−プロパンジオール、2−フェニル−1,4−ブタンジオール、2−ベンジル−1,3−プロパンジオール、トリフェニルエチレングリコール、テトラフェニルエチレングリコールおよびベンゾピナコール等が挙げられる。 Examples of the aromatic glycol include dihydroxymethylbenzene, 1,4-bis (β-hydroxyethoxy) benzene, 2-phenyl-1,3-propanediol, 2-phenyl-1,4-butanediol, and 2-benzyl. Examples include -1,3-propanediol, triphenylethylene glycol, tetraphenylethylene glycol, and benzopinacol.
2価フェノールとしては、炭素原子数6〜30のフェノールが使用でき、例えば、カテコール、レゾルシノール、1,4−ジヒドロキシベンゼン、ハイドロキノン、ビスフェノールA、ビスフェノールF、ビスフェノールS、ジヒドロキシジフェニルエーテル、ジヒドロキシジフェニルチオエーテル、ビナフトールおよびこれらのアルキル(炭素原子数1〜10)またはハロゲン置換体等が挙げられる。 As the dihydric phenol, phenol having 6 to 30 carbon atoms can be used, for example, catechol, resorcinol, 1,4-dihydroxybenzene, hydroquinone, bisphenol A, bisphenol F, bisphenol S, dihydroxydiphenyl ether, dihydroxydiphenylthioether, binaphthol. And these alkyls (having 1 to 10 carbon atoms) or halogen substituents.
1級モノアミンとしては、炭素原子数1〜20の脂肪族1級モノアミンが挙げられ、例えば、メチルアミン、エチルアミン、n−プロピルアミン、イソプロピルアミン、n−ブチルアミン、s−ブチルアミン、イソブチルアミン、n−アミルアミン、イソアミルアミン、n−ヘキシルアミン、n−ヘプチルアミン、n−オクチルアミン、n−デシルアミン、n−オクタデシルアミンおよびn−イコシルアミン等が挙げられる。 Examples of the primary monoamine include aliphatic primary monoamines having 1 to 20 carbon atoms, such as methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, s-butylamine, isobutylamine, n- Examples include amylamine, isoamylamine, n-hexylamine, n-heptylamine, n-octylamine, n-decylamine, n-octadecylamine, and n-icosylamine.
2級ジアミンとしては、炭素原子数4〜18の脂肪族2級ジアミン、炭素原子数4〜13の複素環式2級ジアミン、炭素原子数6〜14の脂環式2級ジアミン、炭素原子数8〜14の芳香族2級ジアミンおよび炭素原子数3〜22の2級アルカノールジアミン等が使用できる。 Examples of secondary diamines include aliphatic secondary diamines having 4 to 18 carbon atoms, heterocyclic secondary diamines having 4 to 13 carbon atoms, alicyclic secondary diamines having 6 to 14 carbon atoms, and the number of carbon atoms. 8-14 aromatic secondary diamines and secondary alkanol diamines having 3 to 22 carbon atoms can be used.
脂肪族2級ジアミンとしては、例えば、N,N’−ジメチルエチレンジアミン、N,N’−ジエチルエチレンジアミン、N,N’−ジブチルエチレンジアミン、N,N’−ジメチルプロピレンジアミン、N,N’−ジエチルプロピレンジアミン、N,N’−ジブチルプロピレンジアミン、N,N’−ジメチルテトラメチレンジアミン、N,N’−ジエチルテトラメチレンジアミン、N,N’−ジブチルテトラメチレンジアミン、N,N’−ジメチルヘキサメチレンジアミン、N,N’−ジエチルヘキサメチレンジアミン、N,N’−ジブチルヘキサメチレンジアミン、N,N’−ジメチルデカメチレンジアミン、N,N’−ジエチルデカメチレンジアミンおよびN,N’−ジブチルデカメチレンジアミン等が挙げられる。 Examples of the aliphatic secondary diamine include N, N′-dimethylethylenediamine, N, N′-diethylethylenediamine, N, N′-dibutylethylenediamine, N, N′-dimethylpropylenediamine, and N, N′-diethylpropylene. Diamine, N, N'-dibutylpropylenediamine, N, N'-dimethyltetramethylenediamine, N, N'-diethyltetramethylenediamine, N, N'-dibutyltetramethylenediamine, N, N'-dimethylhexamethylenediamine N, N'-diethylhexamethylenediamine, N, N'-dibutylhexamethylenediamine, N, N'-dimethyldecamethylenediamine, N, N'-diethyldecamethylenediamine and N, N'-dibutyldecamethylenediamine Etc.
複素環式2級ジアミンとしては、例えば、ピペラジン、1−アミノピペリジン等が挙げられる。 Examples of the heterocyclic secondary diamine include piperazine and 1-aminopiperidine.
脂環式2級ジアミンとしては、例えば、N,N’−ジメチル−1,2−シクロブタンジアミン、N,N’−ジエチル−1,2−シクロブタンジアミン、N,N’−ジブチル−1,2−シクロブタンジアミン、N,N’−ジメチル−1,4−シクロヘキサンジアミン、N,N’−ジエチル−1,4−シクロヘキサンジアミン、N,N’−ジブチル−1,4−シクロヘキサンジアミン、N,N’−ジメチル−1,3−シクロヘキサンジアミン、N,N’−ジエチル−1,3−シクロヘキサンジアミン、N,N’−ジブチル−1,3−シクロヘキサンジアミン等が挙げられる。 Examples of the alicyclic secondary diamine include N, N′-dimethyl-1,2-cyclobutanediamine, N, N′-diethyl-1,2-cyclobutanediamine, N, N′-dibutyl-1,2- Cyclobutanediamine, N, N'-dimethyl-1,4-cyclohexanediamine, N, N'-diethyl-1,4-cyclohexanediamine, N, N'-dibutyl-1,4-cyclohexanediamine, N, N'- Examples include dimethyl-1,3-cyclohexanediamine, N, N′-diethyl-1,3-cyclohexanediamine, and N, N′-dibutyl-1,3-cyclohexanediamine.
芳香族2級ジアミンとしては、例えば、N,N’−ジメチル−フェニレンジアミン、N,N’−ジメチル−キシリレンジアミン、N,N’−ジメチル−ジフェニルメタンジアミン、N,N’−ジメチル−ジフェニルエーテルジアミン、N,N’−ジメチル−ベンジジンおよびN,N’−ジメチル−1,4−ナフタレンジアミン等が挙げられる。 Examples of the aromatic secondary diamine include N, N′-dimethyl-phenylenediamine, N, N′-dimethyl-xylylenediamine, N, N′-dimethyl-diphenylmethanediamine, and N, N′-dimethyl-diphenyletherdiamine. , N, N′-dimethyl-benzidine and N, N′-dimethyl-1,4-naphthalenediamine.
2級アルカノールジアミンとしては、例えば、N−メチルジエタノールアミン、N−オクチルジエタノールアミン、N−ステアリルジエタノールアミンおよびN−メチルジプロパノールアミン等が挙げられる。 Examples of the secondary alkanoldiamine include N-methyldiethanolamine, N-octyldiethanolamine, N-stearyldiethanolamine, and N-methyldipropanolamine.
ジカルボン酸としては、炭素原子数2〜20のジカルボン酸が使用でき、例えば、脂肪族ジカルボン酸、芳香族ジカルボン酸および脂環式ジカルボン酸等が用いられる。 As the dicarboxylic acid, a dicarboxylic acid having 2 to 20 carbon atoms can be used. For example, aliphatic dicarboxylic acid, aromatic dicarboxylic acid, and alicyclic dicarboxylic acid are used.
脂肪族ジカルボン酸としては、例えば、シュウ酸、マロン酸、コハク酸、グルタル酸、メチルコハク酸、ジメチルマロン酸、β−メチルグルタル酸、エチルコハク酸、イソプロピルマロン酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、ウンデカンジ酸、ドデカンジ酸、トリデカンジ酸、テトラデカンジ酸、ヘキサデカンジ酸、オクタデカンジ酸およびイコサンジ酸が挙げられる。 Examples of the aliphatic dicarboxylic acid include oxalic acid, malonic acid, succinic acid, glutaric acid, methyl succinic acid, dimethyl malonic acid, β-methyl glutaric acid, ethyl succinic acid, isopropyl malonic acid, adipic acid, pimelic acid, suberic acid, Azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, tridecanediic acid, tetradecanediic acid, hexadecanediic acid, octadecanediic acid and icosandiic acid.
芳香族ジカルボン酸としては、例えば、テレフタル酸、イソフタル酸、フタル酸、フェニルマロン酸、ホモフタル酸、フェニルコハク酸、β−フェニルグルタル酸、α−フェニルアジピン酸、β−フェニルアジピン酸、ビフェニル−2,2’−ジカルボン酸、ビフェニル−4,4’−ジカルボン酸、ナフタレンジカルボン酸、3−スルホイソフタル酸ナトリウムおよび3−スルホイソフタル酸カリウム等が挙げられる。 Examples of the aromatic dicarboxylic acid include terephthalic acid, isophthalic acid, phthalic acid, phenylmalonic acid, homophthalic acid, phenylsuccinic acid, β-phenylglutaric acid, α-phenyladipic acid, β-phenyladipic acid, and biphenyl-2. 2,2'-dicarboxylic acid, biphenyl-4,4'-dicarboxylic acid, naphthalenedicarboxylic acid, sodium 3-sulfoisophthalate and potassium 3-sulfoisophthalate.
脂環式ジカルボン酸としては、例えば、1,3−シクロペンタンジカルボン酸、1,2−シクロペンタンジカルボン酸、1,4−シクロヘキサンジカルボン酸、1,2−シクロヘキサンジカルボン酸、1,3−シクロヘキサンジカルボン酸、1,4−シクロヘキサンジ酢酸、1,3−シクロヘキサンジ酢酸、1,2−シクロヘキサンジ酢酸およびジシクロヘキシル−4,4’−ジカルボン酸等が挙げられる。 Examples of the alicyclic dicarboxylic acid include 1,3-cyclopentanedicarboxylic acid, 1,2-cyclopentanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, and 1,3-cyclohexanedicarboxylic acid. Examples include acid, 1,4-cyclohexanediacetic acid, 1,3-cyclohexanediacetic acid, 1,2-cyclohexanediacetic acid, and dicyclohexyl-4,4′-dicarboxylic acid.
これらの活性水素原子含有化合物は、1種でも2種以上の混合物でも使用することができる。 These active hydrogen atom-containing compounds can be used singly or in a mixture of two or more.
次に、高分子化合物(E)を構成するエポキシ基を2個以上有するエポキシ化合物(D)について説明する。本発明に用いるエポキシ化合物(D)としては、エポキシ基を2個以上有するものであれば特に制限されず、例えば、ハイドロキノン、レゾルシン、ピロカテコール、フロログルクシノール等の単核多価フェノール化合物のポリグリシジルエーテル化合物;ジヒドロキシナフタレン、ビフェノール、メチレンビスフェノール(ビスフェノールF)、メチレンビス(オルトクレゾール)、エチリデンビスフェノール、イソプロピリデンビスフェノール(ビスフェノールA)、イソプロピリデンビス(オルトクレゾール)、テトラブロモビスフェノールA、1,3−ビス(4−ヒドロキシクミルベンゼン)、1,4−ビス(4−ヒドロキシクミルベンゼン)、1,1,3−トリス(4−ヒドロキシフェニル)ブタン、1,1,2,2−テトラ(4−ヒドロキシフェニル)エタン、チオビスフェノール、スルホビスフェノール、オキシビスフェノール、フェノールノボラック、オルソクレゾールノボラック、エチルフェノールノボラック、ブチルフェノールノボラック、オクチルフェノールノボラック、レゾルシンノボラック、テルペンフェノール等の多核多価フェノール化合物のポリグリジルエーテル化合物;エチレングリコール、プロピレングリコール、ブチレングリコール、ヘキサンジオール、ジエチレングリコール、ポリエチレングリコール、ジプロピレングリコール、ポリプロピレングリコール、ポリグリコール、チオジグリコール、グリセリン、トリメチロールプロパン、ペンタエリスリトール、ソルビトール、ビスフェノールA−エチレンオキシド付加物、ジシクロペンタジエンジメタノール等の多価アルコール類のポリグリシジルエーテル;マレイン酸、フマル酸、イタコン酸、コハク酸、グルタル酸、スベリン酸、アジピン酸、アゼライン酸、セバシン酸、ダイマー酸、トリマー酸、フタル酸、イソフタル酸、テレフタル酸、トリメリット酸、トリメシン酸、ピロメリット酸、テトラヒドロフタル酸、ヘキサヒドロフタル酸、エンドメチレンテトラヒドロフタル酸等の脂肪族、芳香族または脂環族多塩基酸のグリシジルエステル類およびグリシジルメタクリレートの単独重合体または共重合体;N,N−ジグリシジルアニリン、ビス(4−(N−メチル−N−グリシジルアミノ)フェニル)メタン、ジグリシジルオルトトルイジン等のグリシジルアミノ基を有するエポキシ化合物;ビニルシクロヘキセンジエポキシド、ジシクロペンタジエンジエポキサイド、3,4−エポキシシクロヘキシルメチル−3,4−エポキシシクロヘキサンカルボキシレート、3,4−エポキシ−6−メチルシクロヘキシルメチル−6−メチルシクロヘキサンカルボキシレート、ビス(3,4−エポキシ−6−メチルシクロヘキシルメチル)アジペート等の環状オレフィン化合物のエポキシ化物;エポキシ化ポリブタジエン、エポキシ化スチレン−ブタジエン共重合物等のエポキシ化共役ジエン重合体、トリグリシジルイソシアヌレート等の複素環化合物、エポキシ化大豆油等が挙げられる。また、これらのエポキシ化合物は、末端イソシアネートのプレポリマーによって内部架橋されたもの、あるいは多価の活性水素化合物(多価フェノール、ポリアミン、カルボニル基含有化合物、ポリリン酸エステル等)を用いて高分子量化したものであってもよい。かかるエポキシ化合物(D)は、2種以上を使用してもよい。 Next, the epoxy compound (D) having two or more epoxy groups constituting the polymer compound (E) will be described. The epoxy compound (D) used in the present invention is not particularly limited as long as it has two or more epoxy groups, and examples thereof include mononuclear polyhydric phenol compounds such as hydroquinone, resorcin, pyrocatechol, and phloroglucinol. Polyglycidyl ether compounds; dihydroxynaphthalene, biphenol, methylene bisphenol (bisphenol F), methylene bis (orthocresol), ethylidene bisphenol, isopropylidene bisphenol (bisphenol A), isopropylidene bis (orthocresol), tetrabromobisphenol A, 1,3 -Bis (4-hydroxycumylbenzene), 1,4-bis (4-hydroxycumylbenzene), 1,1,3-tris (4-hydroxyphenyl) butane, 1,1,2,2-tetra ( 4 Polyglycidyl ether compounds of polynuclear polyhydric phenol compounds such as hydroxyphenyl) ethane, thiobisphenol, sulfobisphenol, oxybisphenol, phenol novolak, orthocresol novolak, ethylphenol novolak, butylphenol novolak, octylphenol novolak, resorcin novolak, terpene phenol; Ethylene glycol, propylene glycol, butylene glycol, hexanediol, diethylene glycol, polyethylene glycol, dipropylene glycol, polypropylene glycol, polyglycol, thiodiglycol, glycerin, trimethylolpropane, pentaerythritol, sorbitol, bisphenol A-ethylene oxide adduct, dicyclopenta Polyglycidyl ethers of polyhydric alcohols such as enedimethanol; maleic acid, fumaric acid, itaconic acid, succinic acid, glutaric acid, suberic acid, adipic acid, azelaic acid, sebacic acid, dimer acid, trimer acid, phthalic acid, isophthalic acid Glycidyl esters of aliphatic, aromatic or alicyclic polybasic acids such as acid, terephthalic acid, trimellitic acid, trimesic acid, pyromellitic acid, tetrahydrophthalic acid, hexahydrophthalic acid, endomethylenetetrahydrophthalic acid, and glycidyl A homopolymer or copolymer of methacrylate; an epoxy compound having a glycidylamino group such as N, N-diglycidylaniline, bis (4- (N-methyl-N-glycidylamino) phenyl) methane, diglycidylorthotoluidine; Vinylcyclohexene diepoxy Xoxide, dicyclopentadiene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-6-methylcyclohexanecarboxylate, bis (3,4- Epoxy products of cyclic olefin compounds such as epoxy-6-methylcyclohexylmethyl) adipate; epoxidized conjugated diene polymers such as epoxidized polybutadiene and epoxidized styrene-butadiene copolymer, heterocyclic compounds such as triglycidyl isocyanurate, epoxy And soy bean oil. In addition, these epoxy compounds are made high molecular weight by using those internally crosslinked by terminal isocyanate prepolymers or polyvalent active hydrogen compounds (polyhydric phenols, polyamines, carbonyl group-containing compounds, polyphosphate esters, etc.). It may be what you did. Two or more of such epoxy compounds (D) may be used.
エポキシ化合物(D)のエポキシ当量は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、70〜2000が好ましい。 The epoxy equivalent of the epoxy compound (D) is the antistatic property and its durability, the transparency of the film, film properties such as tensile breaking strength and breaking elongation, bending elastic modulus, impact strength, thermal deformation temperature, etc. 70-2000 are preferable from the point of mechanical characteristics.
高分子化合物(E)は、ポリエステル(a)の末端に有する水酸基またはカルボキシル基と、化合物(b)の末端に有する水酸基と、エポキシ化合物(D)のエポキシ基とにより形成されたエステル結合またはエーテル結合により、ポリエステルのブロック(A)、ポリエーテルのブロック(B)、エポキシ基が反応したエポキシ化合物(D)が、エステル結合またはエーテル結合を介して結合してなる構造を有することが好ましい。 The polymer compound (E) is an ester bond or ether formed by a hydroxyl group or carboxyl group at the terminal of the polyester (a), a hydroxyl group at the terminal of the compound (b), and an epoxy group of the epoxy compound (D). It is preferable that the polyester block (A), the polyether block (B), and the epoxy compound (D) reacted with an epoxy group are bonded to each other through an ester bond or an ether bond.
さらに、高分子化合物(E)は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、ポリエステル(a)から構成されるポリエステルのブロック(A)および化合物(b)から構成されるポリエーテルのブロック(B)がエステル結合を介して繰り返し交互に結合してなる両末端にカルボキシル基を有するブロックポリマー(C)と、エポキシ化合物(D)とが、ブロックポリマー(C)のカルボキシル基とエポキシ化合物(D)のエポキシ基により形成されたエステル結合を介して結合してなる構造を有することがより好ましい。 Furthermore, the polymer compound (E) is an antistatic property and its durability, film properties such as film transparency, tensile rupture strength and elongation at break, bending elastic modulus, impact strength, heat distortion temperature, etc. From the standpoint of mechanical properties, both a polyester block (A) composed of polyester (a) and a polyether block (B) composed of compound (b) are alternately and repeatedly bonded via ester bonds. The block polymer (C) having a carboxyl group at the terminal and the epoxy compound (D) are bonded via an ester bond formed by the carboxyl group of the block polymer (C) and the epoxy group of the epoxy compound (D). It is more preferable to have the following structure.
本発明に係るポリエステルのブロック(A)を構成するポリエステル(a)は、ジオールとジカルボン酸とからなるものであればよく、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、好ましくは、ジオールの水酸基を除いた残基と、ジカルボン酸のカルボキシル基を除いた残基とが、エステル結合を介して結合する構造を有する。さらに好ましい本発明に係るポリエステルのブロック(A)を構成するポリエステル(a)は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、ジオールと、脂肪族ジカルボン酸および芳香族ジカルボン酸からなるものであり、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、好ましくは、ジオールの水酸基を除いた残基と、脂肪族ジカルボン酸のカルボキシル基を除いた残基とが、エステル結合を介して結合する構造を有し、かつ、ジオールの水酸基を除いた残基と、芳香族ジカルボン酸のカルボキシル基を除いた残基とが、エステル結合を介して結合する構造を有する。 The polyester (a) constituting the polyester block (A) according to the present invention is only required to be composed of a diol and a dicarboxylic acid, and has antistatic properties and durability, transparency of the film, tensile breaking strength and breaking. From the viewpoint of film properties such as elongation, flexural modulus, impact strength, thermal deformation temperature and other mechanical properties of the molded article, it is preferable that the residue obtained by removing the hydroxyl group of the diol and the residue obtained by removing the carboxyl group of the dicarboxylic acid. The group has a structure in which the group is bonded via an ester bond. Further, the polyester (a) constituting the polyester block (A) according to the present invention preferably has antistatic properties and durability, film properties such as film transparency, tensile breaking strength and elongation at break, bending elastic modulus, It consists of diol, aliphatic dicarboxylic acid and aromatic dicarboxylic acid in terms of mechanical properties of the molded product such as impact strength and heat distortion temperature, and has antistatic properties and durability, transparency of the film, and tensile breakage. From the viewpoint of film properties such as strength and elongation at break, flexural modulus, impact strength, and mechanical properties of the molded product such as heat distortion temperature, it is preferable that a residue excluding the hydroxyl group of the diol and a carboxyl of the aliphatic dicarboxylic acid A residue having a structure in which a residue is removed via an ester bond, and a residue in which a hydroxyl group of a diol is removed and a carboxyl of an aromatic dicarboxylic acid A residue obtained by removing has a structure which is attached via an ester bond.
また、ポリエステル(a)は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、両末端にカルボキシル基を有する構造のものが好ましい。さらに、ポリエステル(a)の重合度は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から好適には2〜50の範囲である。 Polyester (a) has antistatic properties and durability, transparency of the film, film physical properties such as tensile breaking strength and elongation at break, bending elastic modulus, impact strength, heat distortion temperature and other mechanical properties of the molded body. From this point, a structure having a carboxyl group at both ends is preferred. Further, the degree of polymerization of the polyester (a) is such as antistatic properties and durability, film properties such as film transparency, tensile rupture strength and elongation at break, bending elastic modulus, impact strength, heat distortion temperature and other molded articles. The range of 2 to 50 is preferred from the standpoint of the mechanical properties.
両末端にカルボキシル基を有するポリエステル(a)は、例えば、上記ジカルボン酸(好ましくは脂肪族ジカルボン酸および芳香族ジカルボン酸)と、上記ジオールとを重縮合反応させることにより得ることができる。 The polyester (a) having carboxyl groups at both ends can be obtained, for example, by subjecting the dicarboxylic acid (preferably an aliphatic dicarboxylic acid and an aromatic dicarboxylic acid) and the diol to a polycondensation reaction.
脂肪族ジカルボン酸は、脂肪族ジカルボン酸の誘導体(例えば、酸無水物、アルキルエステル、アルカリ金属塩、酸ハライド等)であってもよく、誘導体を使用してポリエステル(a)を得た場合は、最終的に両末端を処理してカルボキシル基にすればよく、そのままの状態で、次の、両末端にカルボキシル基を有する構造を有するブロックポリマー(C)を得るための反応に進んでもよい。また、脂肪族ジカルボン酸およびその誘導体は、2種以上の混合物であってもよい。 The aliphatic dicarboxylic acid may be a derivative of an aliphatic dicarboxylic acid (for example, an acid anhydride, an alkyl ester, an alkali metal salt, an acid halide, etc.). When the polyester (a) is obtained using the derivative, It is sufficient that the both ends are finally processed into carboxyl groups, and the reaction for proceeding to the next block polymer (C) having a structure having carboxyl groups at both ends may be carried out as it is. The aliphatic dicarboxylic acid and its derivative may be a mixture of two or more.
芳香族ジカルボン酸は、芳香族ジカルボン酸の誘導体(例えば、酸無水物、アルキルエステル、アルカリ金属塩、酸ハライド等)であってもよく、誘導体を使用してポリエステルを得た場合は、最終的に両末端を処理してカルボキシル基にすればよく、そのままの状態で、次の、両末端にカルボキシル基を有する構造を有するブロックポリマー(C)を得るための反応に進んでもよい。また、芳香族ジカルボン酸およびその誘導体は、2種以上の混合物であってもよい。 The aromatic dicarboxylic acid may be a derivative of an aromatic dicarboxylic acid (for example, an acid anhydride, an alkyl ester, an alkali metal salt, an acid halide, etc.). It is sufficient that the both ends are treated to form carboxyl groups, and the reaction for proceeding to the next block polymer (C) having a structure having carboxyl groups at both ends may be proceeded as it is. Moreover, 2 or more types of mixtures may be sufficient as aromatic dicarboxylic acid and its derivative (s).
脂肪族ジカルボン酸および芳香族ジカルボン酸を使用する場合の、ポリエステル(a)中の、脂肪族ジカルボンのカルボキシル基を除いた残基と、芳香族ジカルボン酸のカルボキシル基を除いた残基との比は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点からモル比で90:10〜99.9:0.1が好ましく、93:7〜99.9:0.1がより好ましい。 Ratio of the residue excluding the carboxyl group of the aliphatic dicarboxylic acid and the residue excluding the carboxyl group of the aromatic dicarboxylic acid in the polyester (a) when using the aliphatic dicarboxylic acid and the aromatic dicarboxylic acid Is a molar ratio in terms of antistatic properties and durability, film transparency, film physical properties such as tensile breaking strength and elongation at break, bending elastic modulus, impact strength, and mechanical properties of the molded product such as heat distortion temperature. 90: 10-99.9: 0.1 is preferable, and 93: 7-99.9: 0.1 is more preferable.
両末端にカルボキシル基を有するポリエステル(a)は、例えば、上記ジカルボン酸またはその誘導体(好ましくは、上記脂肪族ジカルボン酸またはその誘導体、および上記芳香族ジカルボン酸またはその誘導体)と、上記ジオールとを重縮合反応させることにより得ることができる。 Polyester (a) having a carboxyl group at both ends includes, for example, the dicarboxylic acid or a derivative thereof (preferably the aliphatic dicarboxylic acid or a derivative thereof, and the aromatic dicarboxylic acid or a derivative thereof) and the diol. It can be obtained by polycondensation reaction.
ジカルボン酸またはその誘導体(好ましくは、脂肪族ジカルボン酸またはその誘導体、および芳香族ジカルボン酸またはその誘導体)と、ジオールとの反応比は、両末端がカルボキシル基となるように、ジカルボン酸またはその誘導体(好ましくは、脂肪族ジカルボン酸またはその誘導体、および芳香族ジカルボン酸またはその誘導体)を過剰に使用することが好ましく、モル比で、ジオールに対して1モル過剰に使用することが好ましい。 The reaction ratio of dicarboxylic acid or its derivative (preferably aliphatic dicarboxylic acid or its derivative, and aromatic dicarboxylic acid or its derivative) to diol is such that dicarboxylic acid or its derivative is a carboxyl group at both ends. (Preferably, an aliphatic dicarboxylic acid or a derivative thereof, and an aromatic dicarboxylic acid or a derivative thereof) are preferably used in excess, and are preferably used in a molar ratio of 1 mole excess with respect to the diol.
重縮合反応時の脂肪族ジカルボン酸またはその誘導体と芳香族ジカルボン酸またはその誘導体との配合比は、モル比で90:10〜99.9:0.1が好ましく、93:7〜99.9:0.1がより好ましい。 The molar ratio of the aliphatic dicarboxylic acid or derivative thereof and the aromatic dicarboxylic acid or derivative thereof during the polycondensation reaction is preferably 90:10 to 99.9: 0.1, and 93: 7 to 99.9. : 0.1 is more preferable.
また、配合比や反応条件によっては、ジオールおよび脂肪族ジカルボン酸のみから構成されるポリエステルや、ジオールおよび芳香族ジカルボン酸からのみ構成されるポリエステルが生成する場合もあるが、本発明では、ポリエステル(a)に、それらが混入していてもよく、そのままそれらを化合物(b)と反応させて、ブロックポリマー(C)を得てもよい。 Further, depending on the mixing ratio and reaction conditions, there are cases where a polyester composed only of a diol and an aliphatic dicarboxylic acid or a polyester composed only of a diol and an aromatic dicarboxylic acid may be produced. They may be mixed in a), or they may be directly reacted with the compound (b) to obtain the block polymer (C).
重縮合反応には、エステル化反応を促進する触媒を使用してもよく、触媒としては、ジブチル錫オキサイド、テトラアルキルチタネート、酢酸ジルコニウム、酢酸亜鉛等、従来公知のものが使用できる。 For the polycondensation reaction, a catalyst that promotes the esterification reaction may be used. As the catalyst, conventionally known ones such as dibutyltin oxide, tetraalkyl titanate, zirconium acetate, and zinc acetate can be used.
また、ジカルボン酸(好ましくは、脂肪族ジカルボン酸および芳香族ジカルボン酸)は、ジカルボン酸の代わりに、カルボン酸エステル、カルボン酸金属塩、カルボン酸ハライド等の誘導体を使用した場合には、それらとジオールとの反応後に、両末端を処理してジカルボン酸としてもよく、そのままの状態で、次の、両末端にカルボキシル基を有する構造を有するブロックポリマー(C)を得るための反応に進んでもよい。 In addition, dicarboxylic acids (preferably aliphatic dicarboxylic acids and aromatic dicarboxylic acids) can be used together with derivatives of carboxylic acid esters, carboxylic acid metal salts, carboxylic acid halides, etc. instead of dicarboxylic acids. After the reaction with the diol, both ends may be treated to form a dicarboxylic acid, and the reaction may proceed to the next reaction for obtaining a block polymer (C) having a structure having a carboxyl group at both ends as it is. .
ジオールと、ジカルボン酸(好ましくは、脂肪族ジカルボン酸および芳香族ジカルボン酸)からなり両末端にカルボキシル基を有する好適なポリエステル(a)は、化合物(b)と反応することでエステル結合を形成し、ブロックポリマー(C)の構造を形成するものであればよく、両末端のカルボキシル基は、保護されていてもよく、修飾されていてもよく、また、前駆体の形であってもよい。また、反応時に生成物の酸化を抑えるために、反応系にフェノール系酸化防止剤等の酸化防止剤を添加してもよい。 A suitable polyester (a) comprising a diol and a dicarboxylic acid (preferably an aliphatic dicarboxylic acid and an aromatic dicarboxylic acid) and having carboxyl groups at both ends forms an ester bond by reacting with the compound (b). As long as it forms the structure of the block polymer (C), the carboxyl groups at both ends may be protected, modified, or in the form of a precursor. Moreover, in order to suppress the oxidation of a product at the time of reaction, you may add antioxidants, such as a phenolic antioxidant, to a reaction system.
エチレンオキシ基を一つ以上有し両末端に水酸基を有する化合物(b)は、ポリエステル(a)と反応することでエステル結合を形成し、ブロックポリマー(C)の構造を形成するものであればよく、両末端の水酸基は、保護されていてもよく、修飾されていてもよく、また、前駆体の形であってもよい。 As long as the compound (b) having one or more ethyleneoxy groups and having hydroxyl groups at both ends thereof reacts with the polyester (a) to form an ester bond and form the structure of the block polymer (C). The hydroxyl groups at both ends may be protected, modified, or in the form of a precursor.
本発明に係る両末端にカルボキシル基を有する構造を有するブロックポリマー(C)は、上記ポリエステル(a)から構成されたブロック(A)と、上記化合物(b)から構成されたブロック(B)とを有し、これらのブロックが、カルボキシル基と水酸基とにより形成されたエステル結合を介して繰り返し交互に結合してなる構造を有する。かかるブロックポリマー(C)の一例を挙げると、例えば、下記一般式(3)で表される構造を有するものが挙げられる。 The block polymer (C) having a structure having carboxyl groups at both ends according to the present invention includes a block (A) composed of the polyester (a) and a block (B) composed of the compound (b). These blocks have a structure in which they are alternately and repeatedly bonded through ester bonds formed by carboxyl groups and hydroxyl groups. An example of such a block polymer (C) is, for example, one having a structure represented by the following general formula (3).
一般式(3)中、(A)は、上記両末端にカルボキシル基を有するポリエステル(a)から構成されたブロックを表し、(B)は、上記両末端に水酸基を有する化合物(b)から構成されたブロックを表し、tは繰り返し単位の繰り返しの数であり、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から好ましくは1〜10の数を表す。tは、より好ましくは1〜7の数であり、最も好ましくは1〜5の数である。 In the general formula (3), (A) represents a block composed of the polyester (a) having carboxyl groups at both ends, and (B) is composed of the compound (b) having hydroxyl groups at both ends. Wherein t is the number of repeating units, antistatic properties and their durability, film properties such as film transparency, tensile breaking strength and elongation at break, bending elastic modulus, impact strength, heat The number of 1-10 is preferably represented from the point of the mechanical characteristics of a molded object, such as deformation temperature. t is more preferably a number of 1 to 7, and most preferably a number of 1 to 5.
ポリエステル(a)に脂肪族ジカルボン酸および芳香族ジカルボン酸を使用する場合、ブロックポリマー(C)中の、ポリエステル(a)から構成されたブロックの一部は、ジオールおよび脂肪族ジカルボン酸のみから構成されたポリエステルからなるブロック、または、ジオールおよび芳香族ジカルボン酸のみから構成されたポリエステルからなるブロックに置き換えられていてもよい。 When an aliphatic dicarboxylic acid and an aromatic dicarboxylic acid are used for the polyester (a), a part of the block composed of the polyester (a) in the block polymer (C) is composed only of the diol and the aliphatic dicarboxylic acid. It may be replaced with a block made of polyester or a block made of polyester composed only of diol and aromatic dicarboxylic acid.
両末端にカルボキシル基を有する構造を有するブロックポリマー(C)は、上記両末端にカルボキシル基を有するポリエステル(a)と、上記両末端に水酸基を有する化合物(b)とを、重縮合反応させることによって得ることができるが、上記ポリエステル(a)と上記化合物(b)とが、カルボキシル基と水酸基とにより形成されたエステル結合を介して繰り返し交互に結合してなる構造を有するものと同等の構造を有するものであれば、必ずしも上記ポリエステル(a)と上記化合物(b)とから合成する必要はない。 The block polymer (C) having a structure having carboxyl groups at both ends is a polycondensation reaction between the polyester (a) having carboxyl groups at both ends and the compound (b) having hydroxyl groups at both ends. A structure equivalent to that having a structure in which the polyester (a) and the compound (b) are alternately and repeatedly bonded via an ester bond formed by a carboxyl group and a hydroxyl group. It is not always necessary to synthesize from the polyester (a) and the compound (b).
上記ポリエステル(a)と上記化合物(b)との反応比は、上記化合物(b)がXモルに対して、上記ポリエステル(a)がX+1モルとなるように調整すれば、両末端にカルボキシル基を有するブロックポリマー(C)を好ましく得ることができる。 If the reaction ratio of the polyester (a) to the compound (b) is adjusted so that the polyester (a) is X + 1 mol with respect to X mol of the compound (b), carboxyl groups are present at both ends. A block polymer (C) having the following can be preferably obtained.
反応に際しては、上記ポリエステル(a)の合成反応の完結後に、上記ポリエステル(a)を単離せずに、上記化合物(b)を反応系に加えて、そのまま反応させてもよい。 In the reaction, after completion of the synthesis reaction of the polyester (a), the compound (b) may be added to the reaction system and reacted as it is without isolating the polyester (a).
重縮合反応には、エステル化反応を促進する触媒を使用してもよく、触媒としては、ジブチル錫オキサイド、テトラアルキルチタネート、酢酸ジルコニウム、酢酸亜鉛等、従来公知のものが使用できる。また、反応時に生成物の酸化を抑えるために、反応系にフェノール系酸化防止剤等の酸化防止剤を添加してもよい。 For the polycondensation reaction, a catalyst that promotes the esterification reaction may be used. As the catalyst, conventionally known ones such as dibutyltin oxide, tetraalkyl titanate, zirconium acetate, and zinc acetate can be used. Moreover, in order to suppress the oxidation of a product at the time of reaction, you may add antioxidants, such as a phenolic antioxidant, to a reaction system.
また、ポリエステル(a)に脂肪族ジカルボン酸および芳香族ジカルボン酸を使用する場合、ポリエステル(a)には、ジオールおよび脂肪族ジカルボン酸のみから構成されるポリエステルや、ジオールおよび芳香族ジカルボン酸からのみ構成されるポリエステルが混入していてもよく、それらをそのまま化合物(b)と反応させ、ブロックポリマー(C)を得てもよい。 ブロックポリマー(C)は、ポリエステル(a)から構成されるブロック(A)と化合物(b)から構成されるブロック(B)以外に、ジオールと脂肪族ジカルボン酸のみから構成されるポリエステルから構成されるブロックや、ジオールと芳香族ジカルボン酸からのみ構成されるポリエステルから構成されるブロックが構造中に含まれていてもよい。 Further, when an aliphatic dicarboxylic acid and an aromatic dicarboxylic acid are used for the polyester (a), the polyester (a) includes only a polyester composed only of a diol and an aliphatic dicarboxylic acid, or only a diol and an aromatic dicarboxylic acid. The polyester which comprises may be mixed, and they may be made to react with a compound (b) as it is, and a block polymer (C) may be obtained. The block polymer (C) is composed of a polyester composed only of a diol and an aliphatic dicarboxylic acid in addition to the block (A) composed of the polyester (a) and the block (B) composed of the compound (b). And a block composed of polyester composed only of diol and aromatic dicarboxylic acid may be included in the structure.
本発明に係る高分子化合物(E)は、好ましくは、両末端にカルボキシル基を有する構造を有するブロックポリマー(C)と、2個以上のエポキシ基を有するエポキシ化合物(D)とが、ブロックポリマー(C)の末端のカルボキシル基とエポキシ化合物(D)のエポキシ基とにより形成されたエステル結合を介して結合してなる構造を有する。また、かかる高分子化合物(E)は、さらに、上記ポリエステル(a)のカルボキシル基と上記エポキシ化合物(D)のエポキシ基とにより形成されたエステル結合を含んでいてもよい。また、かかる高分子化合物(E)は、さらに、上記ポリエステル(a)の水酸基または上記化合物(b)の水酸基と、上記エポキシ化合物(D)のエポキシ基とにより形成されたエーテル結合を含んでいてもよい。 In the polymer compound (E) according to the present invention, the block polymer (C) having a structure having a carboxyl group at both ends and the epoxy compound (D) having two or more epoxy groups are preferably a block polymer. It has a structure formed by bonding via an ester bond formed by the terminal carboxyl group of (C) and the epoxy group of epoxy compound (D). The polymer compound (E) may further contain an ester bond formed by the carboxyl group of the polyester (a) and the epoxy group of the epoxy compound (D). The polymer compound (E) further includes an ether bond formed by the hydroxyl group of the polyester (a) or the hydroxyl group of the compound (b) and the epoxy group of the epoxy compound (D). Also good.
高分子化合物(E)を得るためには、上記ブロックポリマー(C)のカルボキシル基と、上記エポキシ化合物(D)のエポキシ基とを反応させればよい。エポキシ化合物(D)のエポキシ基の数は、反応させるブロックポリマー(C)のカルボキシル基の数の、0.5〜5当量が好ましく、0.5〜1.5当量がより好ましい。また、上記反応は、各種溶媒中で行ってもよく、溶融状態で行ってもよい。 In order to obtain the polymer compound (E), the carboxyl group of the block polymer (C) may be reacted with the epoxy group of the epoxy compound (D). The number of epoxy groups in the epoxy compound (D) is preferably 0.5 to 5 equivalents and more preferably 0.5 to 1.5 equivalents of the number of carboxyl groups in the block polymer (C) to be reacted. Moreover, the said reaction may be performed in various solvents and may be performed in a molten state.
反応させるエポキシ基を2個以上有するエポキシ化合物(D)は、反応させるブロックポリマー(C)のカルボキシル基の数の0.1〜2.0当量が好ましく、0.2〜1.5当量がより好ましい。 The epoxy compound (D) having two or more epoxy groups to be reacted is preferably 0.1 to 2.0 equivalents, more preferably 0.2 to 1.5 equivalents of the number of carboxyl groups of the block polymer (C) to be reacted. preferable.
反応に際しては、上記ブロックポリマー(C)の合成反応の完結後に、ブロックポリマー(C)を単離せずに、反応系にエポキシ化合物(D)を加えて、そのまま反応させてもよい。その場合、ブロックポリマー(C)を合成するときに過剰に使用した未反応のポリエステル(a)のカルボキシル基と、エポキシ化合物(D)の一部のエポキシ基とが反応して、エステル結合を形成してもよい。 In the reaction, after completion of the synthesis reaction of the block polymer (C), the epoxy compound (D) may be added to the reaction system without isolation of the block polymer (C) and reacted as it is. In that case, the carboxyl group of the unreacted polyester (a) used excessively when synthesizing the block polymer (C) reacts with some epoxy groups of the epoxy compound (D) to form an ester bond. May be.
本発明に係る、好ましい高分子化合物(E)は、両末端にカルボキシル基を有する構造を有するブロックポリマー(C)とエポキシ基を2個以上有するエポキシ化合物(D)とが、それぞれのカルボキシル基とエポキシ基とにより形成されたエステル結合を介して結合した構造を有するものと同等の構造を有するものであれば、必ずしも上記ブロックポリマー(C)と上記エポキシ化合物(D)とから合成する必要はない。 A preferred polymer compound (E) according to the present invention includes a block polymer (C) having a structure having carboxyl groups at both ends and an epoxy compound (D) having two or more epoxy groups, It is not always necessary to synthesize from the block polymer (C) and the epoxy compound (D) as long as it has a structure equivalent to that having a structure bonded through an ester bond formed with an epoxy group. .
本発明に係る高分子化合物(E)における、両末端に水酸基を有する化合物(b)から構成されるブロックの数平均分子量は、水酸基価の測定値から算出し、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から好ましくは400〜10,000であり、より好ましくは1,000〜8,000であり、さらに好ましくは2,000〜8,000である。 In the polymer compound (E) according to the present invention, the number average molecular weight of the block composed of the compound (b) having a hydroxyl group at both ends is calculated from the measured value of the hydroxyl value, and antistatic property and its sustainability, From the viewpoint of film properties such as film transparency such as transparency, tensile breaking strength and elongation at break, bending elastic modulus, impact strength, heat distortion temperature, etc., it is preferably 400 to 10,000, more preferably It is 1,000-8,000, More preferably, it is 2,000-8,000.
また、本発明に係る高分子化合物(E)における、ポリエステル(a)から構成されるブロックの数平均分子量は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から好ましくはポリスチレン換算で800〜8,000であり、より好ましくは1,000〜6,000であり、さらに好ましくは2,000〜4,000である。 The number average molecular weight of the block composed of the polyester (a) in the polymer compound (E) according to the present invention is the antistatic property and its sustainability, the transparency of the film, the tensile strength at break, the elongation at break, etc. From the viewpoint of the mechanical properties of the molded product such as film physical properties, flexural modulus, impact strength, heat distortion temperature, etc., it is preferably 800 to 8,000 in terms of polystyrene, more preferably 1,000 to 6,000, More preferably, it is 2,000-4,000.
さらに、高分子化合物(E)における、両末端にカルボキシル基を有する構造を有するブロックポリマー(C)から構成されるブロックの数平均分子量は、好ましくはポリスチレン換算で5,000〜30,000であり、より好ましくは7,000〜20,000であり、より好ましくは9,000〜17,000である。 Furthermore, the number average molecular weight of the block composed of the block polymer (C) having a structure having a carboxyl group at both ends in the polymer compound (E) is preferably 5,000 to 30,000 in terms of polystyrene. More preferably, it is 7,000-20,000, More preferably, it is 9,000-17,000.
また、本発明に係る高分子化合物(E)は、ジオール、ジカルボン酸(好ましくは脂肪族ジカルボン酸および芳香族ジカルボン酸)からポリエステル(a)を得たのち、ポリエステル(a)を単離せずに、化合物(b)および/またはエポキシ化合物(D)と反応させてもよい。 In addition, the polymer compound (E) according to the present invention can be obtained without obtaining the polyester (a) after obtaining the polyester (a) from the diol and dicarboxylic acid (preferably aliphatic dicarboxylic acid and aromatic dicarboxylic acid). You may make it react with a compound (b) and / or an epoxy compound (D).
次に、本発明の組成物に係る(Y)成分について説明する。本発明の組成物に係る(Y)成分は酸無水物変性ポリオレフィンの1種以上であり、本発明に係る酸無水物変性ポリオレフィンは、ポリオレフィンに無水マレイン酸等の酸無水物を共重合またはグラフト化させた重合体である。 Next, the (Y) component which concerns on the composition of this invention is demonstrated. (Y) component which concerns on the composition of this invention is 1 or more types of acid anhydride modified polyolefin, and the acid anhydride modified polyolefin which concerns on this invention copolymerizes or grafts acid anhydrides, such as maleic anhydride, to polyolefin. Polymer.
酸無水物変性ポリオレフィンのポリオレフィン部分は、エチレン、プロピレン、α−オレフィンまたはジエンが、重合または共重合したものが挙げられ、α−オレフィンとしては、例えば、1−ブテン、4−メチル−1−ペンテン、1−ペンテン、1−オクテン、1−デセン、1−ドデセン等が挙げられ、ジエンとしては、例えば、ブタジエン、イソプレン、シクロペンタジエン、1,11−ドデカジエン等が挙げられる。また、これら以外に他の共重合成分が含まれていてもよい。さらに具体的には、ポリエチレン、ポリプロピレン、エチレン/プロピレン共重合体、エチレン/プロピレン/ジエン三元共重合体、エチレン/1−ブテン共重合体、エチレン/酢酸ビニル共重合体、およびそれらの混合物等が挙げられる。これらのうち、帯電防止性とその持続性、力学特性の点から、エチレン、プロピレン、炭素原子数4〜12のα−オレフィン、ブタジエン、イソプレンが重合または共重合したものが好ましく、エチレン、プロピレン、炭素原子数4〜8のα−オレフィン、ブタジエンが重合または共重合したものがより好ましく、エチレン、プロピレン、ブタジエンが重合または共重合したものがさらに好ましい。 Examples of the polyolefin portion of the acid anhydride-modified polyolefin include those obtained by polymerization or copolymerization of ethylene, propylene, α-olefin or diene. Examples of the α-olefin include 1-butene and 4-methyl-1-pentene. , 1-pentene, 1-octene, 1-decene, 1-dodecene and the like, and examples of the diene include butadiene, isoprene, cyclopentadiene, 1,11-dodecadiene, and the like. In addition to these, other copolymer components may be contained. More specifically, polyethylene, polypropylene, ethylene / propylene copolymer, ethylene / propylene / diene terpolymer, ethylene / 1-butene copolymer, ethylene / vinyl acetate copolymer, and mixtures thereof, etc. Is mentioned. Among these, from the viewpoint of antistatic properties and their sustainability, and mechanical properties, ethylene, propylene, α-olefin having 4 to 12 carbon atoms, butadiene, and isoprene are preferably polymerized or copolymerized, and ethylene, propylene, More preferable is a polymerized or copolymerized α-olefin having 4 to 8 carbon atoms and butadiene, and more preferable is a polymerized or copolymerized ethylene, propylene, or butadiene.
酸無水物としては、無水マレイン酸、無水イタコン酸等が挙げられ、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、無水マレイン酸が好ましい。 Examples of the acid anhydride include maleic anhydride, itaconic anhydride, etc., and antistatic properties and durability thereof, film properties such as film transparency, tensile rupture strength and elongation at break, bending elastic modulus, impact strength, Maleic anhydride is preferred from the viewpoint of the mechanical properties of the molded article such as the heat distortion temperature.
酸無水物変性ポリオレフィンの酸価は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、好ましくは1〜100mgKOH/g、さらに好ましくは2〜80mgKOH/g、最も好ましいのは5〜70mgKOH/gの範囲である。この酸価は、JISK0070規格に準じて、以下の(i)〜(iii)の手順で測定して得られる値である。 The acid value of the acid anhydride-modified polyolefin is the antistatic property and its durability, film transparency such as film transparency, tensile rupture strength and elongation at break, bending elastic modulus, impact strength, thermal deformation temperature, etc. From the viewpoint of mechanical properties, the range is preferably 1 to 100 mgKOH / g, more preferably 2 to 80 mgKOH / g, and most preferably 5 to 70 mgKOH / g. This acid value is a value obtained by measurement according to the following procedures (i) to (iii) according to the JISK0070 standard.
<酸無水物変性ポリオレフィンの酸価の測定方法>
(i)140℃に加熱したキシレン70mLに酸無水物変性ポリオレフィン1gを溶解させる。
(ii)同温度でフェノールフタレインを指示薬として、0.1mol/L水酸化カリウムエタノール溶液[商品名「0.1mol/Lエタノール性水酸化カリウム溶液」、和光純薬(株)製]で滴定を行う。
(iii)滴定に要した水酸化カリウム量をmgに換算して酸価(単位:mgKOH/g)を算出する。
<Method of measuring acid value of acid anhydride-modified polyolefin>
(I) 1 g of acid anhydride-modified polyolefin is dissolved in 70 mL of xylene heated to 140 ° C.
(Ii) Titration with 0.1 mol / L potassium hydroxide ethanol solution [trade name “0.1 mol / L ethanolic potassium hydroxide solution”, manufactured by Wako Pure Chemical Industries, Ltd.] using phenolphthalein as an indicator at the same temperature. I do.
(Iii) The amount of potassium hydroxide required for titration is converted to mg, and the acid value (unit: mgKOH / g) is calculated.
また、酸無水物変性ポリオレフィンの重量平均分子量(Mw)は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、ポリスチレン換算で、1,000〜500,000が好ましく、5,000〜300,000がより好ましく、20,000〜200,000がさらにより好ましい。 In addition, the weight average molecular weight (Mw) of the acid anhydride-modified polyolefin is the antistatic property and its durability, film transparency, film physical properties such as tensile breaking strength and breaking elongation, bending elastic modulus, impact strength, thermal deformation. From the viewpoint of the mechanical properties of the molded article such as temperature, it is preferably 1,000 to 500,000, more preferably 5,000 to 300,000, and still more preferably 20,000 to 200,000 in terms of polystyrene.
本発明の組成物に係る(Y)成分の酸無水物ポリオレフィンは、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、無水マレイン酸変性ポリオレフィンが好ましく、無水マレイン酸変性ポリプロピレンがより好ましい。 The (Y) component acid anhydride polyolefin according to the composition of the present invention has antistatic properties and durability, film properties such as film transparency, tensile breaking strength and elongation at break, bending elastic modulus, impact strength, From the viewpoint of the mechanical properties of the molded article such as heat distortion temperature, maleic anhydride-modified polyolefin is preferable, and maleic anhydride-modified polypropylene is more preferable.
酸無水物変性ポリオレフィンは、従来公知の方法で、ポリオレフィンに無水マレイン酸等の酸無水物をグラフト化反応させれば得られ、種々の市販品を使用してもよい。 The acid anhydride-modified polyolefin can be obtained by grafting reaction of an acid anhydride such as maleic anhydride to the polyolefin by a conventionally known method, and various commercially available products may be used.
本発明の組成物は、(X)成分100質量部に対して、(Y)成分を0.5〜40.0質量部含有する。帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、(X)成分100質量部に対して、(Y)成分を1.0〜30.0質量部含有することが好ましく、2.0〜25.0質量部含有することがより好ましく、3.0〜20.0質量部含有することがさらに好ましく、5.0〜15.0質量部含有することが特に好ましい。 The composition of this invention contains 0.5-40.0 mass parts of (Y) component with respect to 100 mass parts of (X) component. From the viewpoint of antistatic properties and durability, film physical properties such as film transparency, tensile breaking strength and elongation at break, flexural modulus, impact strength, thermal deformation temperature and other mechanical properties of the molded product (X) It is preferable to contain 1.0 to 30.0 parts by mass of component (Y) with respect to 100 parts by mass, more preferably 2.0 to 25.0 parts by mass, and 3.0 to 20.0. More preferably, it is contained in an amount of 5.0-15.0 parts by mass.
本発明の組成物は(X)成分および(Y)成分以外に、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、アルカリ金属の塩およびイオン性液体の群から選択される1種以上を含有することも好ましい。 In addition to the component (X) and the component (Y), the composition of the present invention has antistatic properties and durability, film properties such as film transparency, tensile rupture strength and elongation at break, bending elastic modulus, impact strength, From the viewpoint of the mechanical properties of the molded article such as the heat distortion temperature, it is also preferable to contain one or more selected from the group of alkali metal salts and ionic liquids.
アルカリ金属の塩としては有機酸または無機酸の塩が挙げられ、アルカリ金属の例としては、リチウム、ナトリウム、カリウム、セシウム、ルビジウム等が挙げられる。有機酸の例としては、ギ酸、酢酸、プロピオン酸、酪酸、乳酸等の炭素原子数1〜18の脂肪族モノカルボン酸;シュウ酸、マロン酸、コハク酸、フマル酸、マレイン酸、アジピン酸等の炭素原子数1〜12の脂肪族ジカルボン酸;安息香酸、フタル酸、イソフタル酸、テレフタル酸、サリチル酸等の芳香族カルボン酸;メタンスルホン酸、p−トルエンスルホン酸、ドデシルベンゼンスルホン酸、トリフルオロメタンスルホン酸等の炭素原子数1〜20のスルホン酸等が挙げられる。無機酸の例としては、塩酸、臭化水素酸、硫酸、亜硫酸、リン酸、亜リン酸、ポリリン酸、硝酸、過塩素酸等が挙げられる。中でも、摩擦帯電圧と表面抵抗率、生体や環境に対する安全性の点から、リチウム、ナトリウム、カリウムの塩が好ましく、ナトリウムがより好ましい。また、帯電防止性とその持続性、力学特性の点から、酢酸の塩、過塩素酸の塩、p−トルエンスルホン酸の塩、ドデシルベンゼンスルホン酸の塩が好ましく、ドデシルベンゼンスルホン酸の塩がより好ましい。アルカリ金属の塩は2種以上併用してもよい。 Examples of the alkali metal salt include a salt of an organic acid or an inorganic acid, and examples of the alkali metal include lithium, sodium, potassium, cesium, rubidium and the like. Examples of organic acids include aliphatic monocarboxylic acids having 1 to 18 carbon atoms such as formic acid, acetic acid, propionic acid, butyric acid, lactic acid; oxalic acid, malonic acid, succinic acid, fumaric acid, maleic acid, adipic acid, etc. Aliphatic dicarboxylic acid having 1 to 12 carbon atoms; aromatic carboxylic acid such as benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, salicylic acid; methanesulfonic acid, p-toluenesulfonic acid, dodecylbenzenesulfonic acid, trifluoromethane Examples thereof include sulfonic acids having 1 to 20 carbon atoms such as sulfonic acids. Examples of inorganic acids include hydrochloric acid, hydrobromic acid, sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, polyphosphoric acid, nitric acid, perchloric acid and the like. Among these, lithium, sodium and potassium salts are preferable, and sodium is more preferable from the viewpoint of frictional voltage and surface resistivity, and safety to living bodies and the environment. In addition, from the viewpoint of antistatic properties, durability, and mechanical properties, acetic acid salt, perchloric acid salt, p-toluenesulfonic acid salt, dodecylbenzenesulfonic acid salt are preferable, and dodecylbenzenesulfonic acid salt is preferable. More preferred. Two or more alkali metal salts may be used in combination.
アルカリ金属の塩の具体例としては、例えば、酢酸リチウム、酢酸ナトリウム、酢酸カリウム、塩化リチウム、塩化ナトリウム、塩化カリウム、リン酸リチウム、リン酸ナトリウム、リン酸カリウム、硫酸リチウム、硫酸ナトリウム、過塩素酸リチウム、過塩素酸ナトリウム、過塩素酸カリウム、p−トルエンスルホン酸リチウム、p−トルエンスルホン酸ナトリウム、p−トルエンスルホン酸カリウム、ドデシルベンゼンスルホン酸リチウム、ドデシルベンゼンスルホン酸ナトリウム、ドデシルベンゼンスルホン酸カリウム等が挙げられる。これらの中で、帯電防止性とその持続性、力学特性、生体や環境に対する安全性の点から、好ましいのは、p−トルエンスルホン酸リチウム、p−トルエンスルホン酸ナトリウム、ドデシルベンゼンスルホン酸リチウム、ドデシルベンゼンスルホン酸ナトリウム等であり、最も好ましいのはドデシルベンゼンスルホン酸ナトリウムである。 Specific examples of the alkali metal salt include, for example, lithium acetate, sodium acetate, potassium acetate, lithium chloride, sodium chloride, potassium chloride, lithium phosphate, sodium phosphate, potassium phosphate, lithium sulfate, sodium sulfate, perchlorine. Lithium acid, sodium perchlorate, potassium perchlorate, lithium p-toluenesulfonate, sodium p-toluenesulfonate, potassium p-toluenesulfonate, lithium dodecylbenzenesulfonate, sodium dodecylbenzenesulfonate, dodecylbenzenesulfonic acid Potassium etc. are mentioned. Among these, from the viewpoint of antistatic properties and their durability, mechanical properties, and safety to living bodies and the environment, lithium p-toluenesulfonate, sodium p-toluenesulfonate, lithium dodecylbenzenesulfonate, Sodium dodecylbenzenesulfonate and the like, most preferably sodium dodecylbenzenesulfonate.
アルカリ金属の塩は、本発明の組成物に配合してもよいし、本発明の組成物とともに合成樹脂に配合して使用してもよい。アルカリ金属の塩の配合量は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、本発明の組成物の(X)成分100質量部に対して、0.01〜20質量部が好ましく、0.1〜15質量部がより好ましく、3.0〜12質量部が最も好ましい。 The alkali metal salt may be blended in the composition of the present invention, or may be blended in a synthetic resin together with the composition of the present invention. Alkali metal salt content is the antistatic property and durability, film transparency, film physical properties such as tensile breaking strength and elongation at break, flexural modulus, impact strength, heat distortion temperature, etc. From the point of a characteristic, 0.01-20 mass parts is preferable with respect to 100 mass parts of (X) component of the composition of this invention, 0.1-15 mass parts is more preferable, 3.0-12 mass parts Is most preferred.
イオン性液体の例としては、室温以下の融点を有し、イオン性液体を構成するカチオンまたはアニオンのうち少なくとも一つが有機物イオンであり、初期電導度が1〜200ms/cm、好ましくは10〜200ms/cmである常温溶融塩であって、例えば、国際公開第95/15572号に記載の常温溶融塩が挙げられる。 Examples of the ionic liquid are those having a melting point of room temperature or lower, at least one of cations or anions constituting the ionic liquid is an organic ion, and an initial conductivity of 1 to 200 ms / cm, preferably 10 to 200 ms. A room temperature molten salt that is / cm, for example, a room temperature molten salt described in International Publication No. 95/15572.
イオン性液体を構成するカチオンとしては、アミジニウム、ピリジニウム、ピラゾリウムおよびグアニジニウムカチオンからなる群から選ばれるカチオンが挙げられる。このうち、アミジニウムカチオンとしては、下記のものが挙げられる。 Examples of the cation constituting the ionic liquid include a cation selected from the group consisting of amidinium, pyridinium, pyrazolium and guanidinium cations. Among these, the following are mentioned as an amidinium cation.
(1)イミダゾリニウムカチオン
炭素原子数5〜15のものが挙げられ、例えば、1,2,3,4−テトラメチルイミダゾリニウム、1,3−ジメチルイミダゾリニウム;
(1) Imidazolinium cation Examples include those having 5 to 15 carbon atoms, such as 1,2,3,4-tetramethylimidazolinium and 1,3-dimethylimidazolinium;
(2)イミダゾリウムカチオン
炭素原子数5〜15のものが挙げられ、例えば、1,3−ジメチルイミダゾリウム、1−エチル−3−メチルイミダゾリウム;
(2) Imidazolium cation Examples include those having 5 to 15 carbon atoms, such as 1,3-dimethylimidazolium, 1-ethyl-3-methylimidazolium;
(3)テトラヒドロピリミジニウムカチオン
炭素原子数6〜15のものが挙げられ、例えば、1,3−ジメチル−1,4,5,6−テトラヒドロピリミジニウム、1,2,3,4−テトラメチル−1,4,5,6−テトラヒドロピリミジニウム;
(3) Tetrahydropyrimidinium cation One having 6 to 15 carbon atoms is exemplified, for example, 1,3-dimethyl-1,4,5,6-tetrahydropyrimidinium, 1,2,3,4-tetra Methyl-1,4,5,6-tetrahydropyrimidinium;
(4)ジヒドロピリミジニウムカチオン
炭素原子数6〜20のものが挙げられ、例えば、1,3−ジメチル−1,4−ジヒドロピリミジニウム、1,3−ジメチル−1,6−ジヒドロピリミジニウム、8−メチル−1,8−ジアザビシクロ[5,4,0]−7,9−ウンデカジエニウム、8−メチル−1,8−ジアザビシクロ[5,4,0]−7,10−ウンデカジエニウム。
(4) Dihydropyrimidinium cation A thing with 6-20 carbon atoms is mentioned, for example, 1,3-dimethyl-1,4-dihydropyrimidinium, 1,3-dimethyl-1,6-dihydropyrimidi Ni, 8-methyl-1,8-diazabicyclo [5,4,0] -7,9-undecadienium, 8-methyl-1,8-diazabicyclo [5,4,0] -7,10-un Decadienium.
ピリジニウムカチオンとしては、炭素原子数6〜20のものが挙げられ、例えば、3−メチル−1−プロピルピリジニウム、1−ブチル−3,4−ジメチルピリジニウムが挙げられる。 Examples of the pyridinium cation include those having 6 to 20 carbon atoms, such as 3-methyl-1-propylpyridinium and 1-butyl-3,4-dimethylpyridinium.
ピラゾリウムカチオンとしては、炭素原子数5〜15のものが挙げられ、例えば、1、2−ジメチルピラゾリウム、1−n−ブチル−2−メチルピラゾリウムが挙げられる。 Examples of the pyrazolium cation include those having 5 to 15 carbon atoms, such as 1,2-dimethylpyrazolium and 1-n-butyl-2-methylpyrazolium.
グアニジニウムカチオンとしては、下記のものが挙げられる。
(1)イミダゾリニウム骨格を有するグアニジニウムカチオン
炭素原子数8〜15のものが挙げられ、例えば、2−ジメチルアミノ−1,3,4−トリメチルイミダゾリニウム、2−ジエチルアミノ−1,3,4−トリメチルイミダゾリニウム;
The following are mentioned as a guanidinium cation.
(1) Guanidinium cation having an imidazolinium skeleton One having 8 to 15 carbon atoms is exemplified, for example, 2-dimethylamino-1,3,4-trimethylimidazolinium, 2-diethylamino-1,3 , 4-trimethylimidazolinium;
(2)イミダゾリウム骨格を有するグアニジニウムカチオン
炭素原子数8〜15のものが挙げられ、例えば、2−ジメチルアミノ−1,3,4−トリメチルイミダゾリウム、2−ジエチルアミノ−1,3,4−トリメチルイミダゾリウム;
(2) Guanidinium cation having an imidazolium skeleton, those having 8 to 15 carbon atoms, such as 2-dimethylamino-1,3,4-trimethylimidazolium, 2-diethylamino-1,3,4 -Trimethylimidazolium;
(3)テトラヒドロピリミジニウム骨格を有するグアニジニウムカチオン
炭素原子数10〜20のものが挙げられ、例えば、2−ジメチルアミノ−1,3,4−トリメチル−1,4,5,6−テトラヒドロピリミジニウム、2−ジエチルアミノ−1,3−ジメチル−4−エチル−1,4,5,6−テトラヒドロピリミジニウム;
(3) A guanidinium cation having a tetrahydropyrimidinium skeleton having 10 to 20 carbon atoms, for example, 2-dimethylamino-1,3,4-trimethyl-1,4,5,6-tetrahydro Pyrimidinium, 2-diethylamino-1,3-dimethyl-4-ethyl-1,4,5,6-tetrahydropyrimidinium;
(4)ジヒドロピリミジニウム骨格を有するグアニジニウムカチオン
炭素原子数10〜20のものが挙げられ、例えば、2−ジメチルアミノ−1,3,4−トリメチル−1,4−ジヒドロピリミジニウム、2−ジメチルアミノ−1,3,4−トリメチル−1,6−ジヒドロピリミジニウム、2−ジエチルアミノ−1,3−ジメチル−4−エチル−1,4−ジヒドロピリミジニウム、2−ジエチルアミノ−1,3−ジメチル−4−エチル−1,6−ジヒドロピリミジニウム。
(4) A guanidinium cation having a dihydropyrimidinium skeleton having 10 to 20 carbon atoms, such as 2-dimethylamino-1,3,4-trimethyl-1,4-dihydropyrimidinium, 2-dimethylamino-1,3,4-trimethyl-1,6-dihydropyrimidinium, 2-diethylamino-1,3-dimethyl-4-ethyl-1,4-dihydropyrimidinium, 2-diethylamino-1 , 3-Dimethyl-4-ethyl-1,6-dihydropyrimidinium.
上記カチオンは1種を単独で用いても、また、2種以上を併用しても、いずれでもよい。これらのうち、摩擦帯電圧と表面抵抗率の点から、好ましくはアミジニウムカチオン、より好ましくはイミダゾリウムカチオン、特に好ましくは1−エチル−3−メチルイミダゾリウムカチオンである。 The cation may be used alone or in combination of two or more. Of these, from the viewpoint of frictional voltage and surface resistivity, amidinium cations are preferred, imidazolium cations are more preferred, and 1-ethyl-3-methylimidazolium cations are particularly preferred.
イオン性液体において、アニオンを構成する有機酸または無機酸としては、下記のものが挙げられる。有機酸としては、例えば、カルボン酸、硫酸エステル、スルホン酸およびリン酸エステル;無機酸としては、例えば、超強酸(例えば、ホウフッ素酸、四フッ化ホウ素酸、過塩素酸、六フッ化リン酸、六フッ化アンチモン酸および六フッ化ヒ素酸)、リン酸およびホウ酸が挙げられる。上記有機酸および無機酸は、1種を単独で用いても、また、2種以上を併用しても、いずれでもよい。 In the ionic liquid, examples of the organic acid or inorganic acid constituting the anion include the following. Examples of the organic acid include carboxylic acid, sulfuric acid ester, sulfonic acid and phosphoric acid ester; examples of the inorganic acid include super strong acid (for example, borofluoric acid, tetrafluoroboric acid, perchloric acid, phosphorus hexafluoride). Acid, hexafluoroantimonic acid and hexafluoroarsenic acid), phosphoric acid and boric acid. The organic acid and inorganic acid may be used singly or in combination of two or more.
上記有機酸および無機酸のうち、イオン性液体の、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から好ましいのは、イオン性液体を構成するアニオンのHamett酸度関数(−H0)が12〜100である、超強酸の共役塩基、超強酸の共役塩基以外のアニオンを形成する酸およびこれらの混合物である。 Of the above organic acids and inorganic acids, the ionic liquid has antistatic properties and durability, film transparency, film properties such as tensile breaking strength and breaking elongation, flexural modulus, impact strength, heat distortion temperature, etc. From the viewpoint of the mechanical properties of the molded article, an anion other than the conjugate base of the super strong acid or the super strong acid having a Hammett acidity function (-H0) of 12 to 100 of the anion constituting the ionic liquid is preferable. The acids that form and mixtures thereof.
超強酸の共役塩基以外のアニオンとしては、例えば、ハロゲン(例えば、フッ素、塩素および臭素)イオン、アルキル(炭素原子数1〜12)ベンゼンスルホン酸(例えば、p−トルエンスルホン酸およびドデシルベンゼンスルホン酸)イオンおよびポリ(n=1〜25)フルオロアルカンスルホン酸(例えば、ウンデカフルオロペンタンスルホン酸)イオンが挙げられる。 Examples of the anion other than the conjugate base of the super strong acid include halogen (for example, fluorine, chlorine and bromine) ions, alkyl (1 to 12 carbon atoms) benzenesulfonic acid (for example, p-toluenesulfonic acid and dodecylbenzenesulfonic acid). ) Ions and poly (n = 1-25) fluoroalkanesulfonic acid (eg, undecafluoropentanesulfonic acid) ions.
また、超強酸としては、プロトン酸およびプロトン酸とルイス酸との組み合わせから誘導されるもの、およびこれらの混合物が挙げられる。超強酸としてのプロトン酸としては、例えば、ビス(トリフルオロメチルスルホニル)イミド酸、ビス(ペンタフルオロエチルスルホニル)イミド酸、トリス(トリフルオロメチルスルホニル)メタン、過塩素酸、フルオロスルホン酸、アルカン(炭素原子数1〜30)スルホン酸(例えば、メタンスルホン酸、ドデカンスルホン酸等)、ポリ(n=1〜30)フルオロアルカン(炭素原子数1〜30)スルホン酸(例えば、トリフルオロメタンスルホン酸、ペンタフルオロエタンスルホン酸、ヘプタフルオロプロパンスルホン酸、ノナフルオロブタンスルホン酸、ウンデカフルオロペンタンスルホン酸およびトリデカフルオロヘキサンスルホン酸)、ホウフッ素酸および四フッ化ホウ素酸が挙げられる。これらのうち、合成の容易さの観点から好ましいのはホウフッ素酸、トリフルオロメタンスルホン酸、ビス(トリフルオロメタンスルホニル)イミド酸およびビス(ペンタフルオロエチルスルホニル)イミド酸である。 Examples of super strong acids include those derived from proton acids, combinations of proton acids and Lewis acids, and mixtures thereof. Examples of the protonic acid as the super strong acid include bis (trifluoromethylsulfonyl) imidic acid, bis (pentafluoroethylsulfonyl) imidic acid, tris (trifluoromethylsulfonyl) methane, perchloric acid, fluorosulfonic acid, alkane ( 1 to 30 carbon atoms) sulfonic acid (for example, methanesulfonic acid, dodecanesulfonic acid, etc.), poly (n = 1 to 30) fluoroalkane (1 to 30 carbon atoms) sulfonic acid (for example, trifluoromethanesulfonic acid, Pentafluoroethanesulfonic acid, heptafluoropropanesulfonic acid, nonafluorobutanesulfonic acid, undecafluoropentanesulfonic acid and tridecafluorohexanesulfonic acid), borofluoric acid and tetrafluoroboric acid. Of these, borofluoric acid, trifluoromethanesulfonic acid, bis (trifluoromethanesulfonyl) imidic acid and bis (pentafluoroethylsulfonyl) imidic acid are preferable from the viewpoint of ease of synthesis.
ルイス酸と組合せて用いられるプロトン酸としては、例えば、ハロゲン化水素(例えば、フッ化水素、塩化水素、臭化水素およびヨウ化水素)、過塩素酸、フルオロスルホン酸、メタンスルホン酸、トリフルオロメタンスルホン酸、ペンタフルオロエタンスルホン酸、ノナフルオロブタンスルホン酸、ウンデカフルオロペンタンスルホン酸、トリデカフルオロヘキサンスルホン酸およびこれらの混合物が挙げられる。これらのうち、イオン性液体の初期電導度の観点から好ましいのはフッ化水素である。 Examples of the protonic acid used in combination with the Lewis acid include hydrogen halide (for example, hydrogen fluoride, hydrogen chloride, hydrogen bromide and hydrogen iodide), perchloric acid, fluorosulfonic acid, methanesulfonic acid, and trifluoromethane. Examples include sulfonic acid, pentafluoroethanesulfonic acid, nonafluorobutanesulfonic acid, undecafluoropentanesulfonic acid, tridecafluorohexanesulfonic acid, and mixtures thereof. Of these, hydrogen fluoride is preferred from the viewpoint of the initial conductivity of the ionic liquid.
ルイス酸としては、例えば、三フッ化ホウ素、五フッ化リン、五フッ化アンチモン、五フッ化ヒ素、五フッ化タンタルおよびこれらの混合物が挙げられる。これらのうちでも、イオン性液体の初期電導度の観点から好ましいのは三フッ化ホウ素および五フッ化リンである。 Examples of the Lewis acid include boron trifluoride, phosphorus pentafluoride, antimony pentafluoride, arsenic pentafluoride, tantalum pentafluoride, and mixtures thereof. Among these, boron trifluoride and phosphorus pentafluoride are preferable from the viewpoint of the initial conductivity of the ionic liquid.
プロトン酸とルイス酸との組み合わせは任意であるが、これらの組み合わせからなる超強酸としては、例えば、テトラフルオロホウ酸、ヘキサフルオロリン酸、六フッ化タンタル酸、六フッ化アンチモン酸、六フッ化タンタルスルホン酸、四フッ化ホウ素酸、六フッ化リン酸、塩化三フッ化ホウ素酸、六フッ化ヒ素酸およびこれらの混合物が挙げられる。 The combination of the protonic acid and the Lewis acid is arbitrary, but examples of the super strong acid composed of these combinations include tetrafluoroboric acid, hexafluorophosphoric acid, hexafluorotantalic acid, hexafluoroantimonic acid, hexafluoride. Tantalum sulfonate, tetrafluoroboronic acid, hexafluorophosphoric acid, chloroboron trifluoride, arsenic hexafluoride and mixtures thereof.
上記のアニオンのうち、イオン性液体の帯電防止性の観点から好ましいのは超強酸の共役塩基(プロトン酸からなる超強酸およびプロトン酸とルイス酸との組合せからなる超強酸)であり、さらに好ましいのはプロトン酸からなる超強酸およびプロトン酸と、三フッ化ホウ素および/または五フッ化リンとからなる超強酸の共役塩基である。 Of the above anions, preferred from the viewpoint of antistatic properties of the ionic liquid is a conjugate base of a super strong acid (a super strong acid comprising a proton acid and a super strong acid comprising a combination of a proton acid and a Lewis acid), and more preferred. Is a conjugate base of a super strong acid composed of a proton acid and a super strong acid composed of a proton acid and boron trifluoride and / or phosphorus pentafluoride.
イオン性液体のうち、帯電防止性の観点から好ましいのは、アミジニウムカチオンを有するイオン性液体、より好ましいのは1−エチル−3−メチルイミダゾリウムカチオンを有するイオン性液体、特に好ましいのは1−エチル−3−メチルイミダゾリウムビス(トリフルオロメタンスルホニル)イミドである。 Among the ionic liquids, the ionic liquid having an amidinium cation is preferable from the viewpoint of antistatic properties, the ionic liquid having a 1-ethyl-3-methylimidazolium cation is more preferable, and particularly preferable. 1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide.
イオン性液体は、本発明の組成物に配合してもよいし、本発明の組成物とともに合成樹脂に配合して使用してもよい。イオン性液体の配合量は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、本発明の組成物の(X)成分100質量部に対して、0.01〜20質量部が好ましく、0.1〜15質量部がより好ましく、1〜12質量部が最も好ましい。 An ionic liquid may be mix | blended with the composition of this invention, and may be mix | blended and used for a synthetic resin with the composition of this invention. Compounding amount of ionic liquid is antistatic property and durability, film properties such as film transparency, tensile breaking strength and breaking elongation, bending elastic modulus, impact strength, heat distortion temperature, etc. From this point, 0.01 to 20 parts by mass is preferable, 0.1 to 15 parts by mass is more preferable, and 1 to 12 parts by mass is most preferable with respect to 100 parts by mass of the component (X) of the composition of the present invention. .
本発明の組成物においては、(X)成分および(Y)成分、必要に応じて、アルカリ金属の塩および/またはイオン性液体を、さらに必要に応じて他の任意成分を混合すればよく、混合には各種混合機を用いることができる。混合時には加熱してもよい。使用できる混合機の例を挙げると、タンブラーミキサー、ヘンシェルミキサー、リボンブレンダー、V型混合機、W型混合機、スーパーミキサー、ナウターミキサー等が挙げられる。また、(X)成分である高分子化合物(E)や(Y)成分である酸無水物変性ポリオレフィンの合成反応中に、反応系にアルカリ金属の塩および/またはイオン性液体を添加してもよい。 In the composition of the present invention, the component (X) and the component (Y), if necessary, an alkali metal salt and / or an ionic liquid may be further mixed with other optional components as necessary. Various mixers can be used for mixing. You may heat at the time of mixing. Examples of the mixer that can be used include a tumbler mixer, a Henschel mixer, a ribbon blender, a V-type mixer, a W-type mixer, a super mixer, and a Nauta mixer. Further, during the synthesis reaction of the polymer compound (E) as the component (X) and the acid anhydride-modified polyolefin as the component (Y), an alkali metal salt and / or ionic liquid may be added to the reaction system. Good.
本発明の組成物には、本発明の効果を損なわない範囲で、(X)成分および(Y)成分、必要に応じてアルカリ金属の塩および/またはイオン性液体以外に、任意成分として、他の成分を配合してもよい。他の成分は、本発明の組成物に直接配合してもよいし、本発明の組成物を熱可塑性樹脂等の合成樹脂に配合して、樹脂組成物として使用する場合に、合成樹脂に配合してもよい。 In the composition of the present invention, as long as the effects of the present invention are not impaired, the component (X) and the component (Y), if necessary, other than the alkali metal salt and / or ionic liquid, other optional components may be used. These ingredients may be blended. Other components may be blended directly with the composition of the present invention, or when blended with a synthetic resin such as a thermoplastic resin and used as a resin composition, blended with the synthetic resin. May be.
本発明の組成物には、本発明の効果を損なわない範囲で、さらに第2族元素の塩を配合してもよい。第2族元素の塩としては、有機酸または無機酸の塩が挙げられ、第2族元素の例としては、ベリリウム、マグネシウム、カルシウム、ストロンチウム、バリウム等が挙げられる。有機酸の例としては、ギ酸、酢酸、プロピオン酸、酪酸、乳酸等の炭素原子数1〜18の脂肪族モノカルボン酸;シュウ酸、マロン酸、コハク酸、フマル酸、マレイン酸、アジピン酸等の炭素原子数1〜12の脂肪族ジカルボン酸;安息香酸、フタル酸、イソフタル酸、テレフタル酸、サリチル酸等の芳香族カルボン酸;メタンスルホン酸、p−トルエンスルホン酸、ドデシルベンゼンスルホン酸、トリフルオロメタンスルホン酸等の炭素原子数1〜20のスルホン酸等が挙げられる。無機酸の例としては、塩酸、臭化水素酸、硫酸、亜硫酸、リン酸、亜リン酸、ポリリン酸、硝酸、過塩素酸等が挙げられる。 The composition of the present invention may further contain a group 2 element salt within a range not impairing the effects of the present invention. Examples of Group 2 element salts include organic acid or inorganic acid salts. Examples of Group 2 elements include beryllium, magnesium, calcium, strontium, barium, and the like. Examples of organic acids include aliphatic monocarboxylic acids having 1 to 18 carbon atoms such as formic acid, acetic acid, propionic acid, butyric acid, lactic acid; oxalic acid, malonic acid, succinic acid, fumaric acid, maleic acid, adipic acid, etc. Aliphatic dicarboxylic acid having 1 to 12 carbon atoms; aromatic carboxylic acid such as benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, salicylic acid; methanesulfonic acid, p-toluenesulfonic acid, dodecylbenzenesulfonic acid, trifluoromethane Examples thereof include sulfonic acids having 1 to 20 carbon atoms such as sulfonic acids. Examples of inorganic acids include hydrochloric acid, hydrobromic acid, sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, polyphosphoric acid, nitric acid, perchloric acid and the like.
第2族元素の塩は、本発明の組成物に配合してもよく、組成物とともに、熱可塑性樹脂等の合成樹脂に配合して使用してもよい。第2族元素の塩の配合量は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、本発明の組成物の(X)成分100質量部に対して、0.01〜20質量部が好ましく、0.1〜15質量部がより好ましく、3.0〜12質量部が最も好ましい。 The group 2 element salt may be blended in the composition of the present invention, or may be blended with a synthetic resin such as a thermoplastic resin together with the composition. The amount of the salt of the Group 2 element is such that the antistatic property and its sustainability, the transparency of the film, the film physical properties such as the tensile breaking strength and the elongation at break, the bending elastic modulus, the impact strength, the thermal deformation temperature, etc. From the viewpoint of the mechanical characteristics of the present invention, 0.01 to 20 parts by mass is preferable, 0.1 to 15 parts by mass is more preferable, and 3.0 to 12 is preferable with respect to 100 parts by mass of component (X) of the composition of the present invention. Part by mass is most preferred.
また、本発明の組成物には、本発明の効果を損なわない範囲で、界面活性剤を配合してもよい。界面活性剤としては、非イオン性、アニオン性、カチオン性または両性の界面活性剤を使用することができる。非イオン性界面活性剤としては、高級アルコールエチレンオキシド付加物、脂肪酸エチレンオキシド付加物、高級アルキルアミンエチレンオキシド付加物、ポリプロピレングリコールエチレンオキシド付加物等のポリエチレングリコール型非イオン界面活性剤;ポリエチレンオキシド、グリセリンの脂肪酸エステル、ペンタエリスリットの脂肪酸エステル、ソルビット若しくはソルビタンの脂肪酸エステル、多価アルコールのアルキルエーテル、アルカノールアミンの脂肪族アミド等の多価アルコール型非イオン界面活性剤等が挙げられ、アニオン性界面活性剤としては、例えば、高級脂肪酸のアルカリ金属塩等のカルボン酸塩;高級アルコール硫酸エステル塩、高級アルキルエーテル硫酸エステル塩等の硫酸エステル塩、アルキルベンゼンスルホン酸塩、アルキルスルホン酸塩、パラフィンスルホン酸塩等のスルホン酸塩;高級アルコールリン酸エステル塩等のリン酸エステル塩等が挙げられ、カチオン性界面活性剤としては、アルキルトリメチルアンモニウム塩等の第4級アンモニウム塩等が挙げられる。両性界面活性剤としては、高級アルキルアミノプロピオン酸塩等のアミノ酸型両性界面活性剤、高級アルキルジメチルベタイン、高級アルキルジヒドロキシエチルベタイン等のベタイン型両性界面活性剤等が挙げられ、これらは単独でまたは2種以上組み合わせて使用することができる。本発明の組成物においては、上記界面活性剤の中でも、アニオン性界面活性剤が好ましく、特に、アルキルベンゼンスルホン酸塩、アルキルスルホン酸塩、パラフィンスルホン酸塩等のスルホン酸塩が好ましい。 Moreover, you may mix | blend surfactant with the composition of this invention in the range which does not impair the effect of this invention. As the surfactant, nonionic, anionic, cationic or amphoteric surfactants can be used. Nonionic surfactants include polyethylene glycol type nonionic surfactants such as higher alcohol ethylene oxide adducts, fatty acid ethylene oxide adducts, higher alkylamine ethylene oxide adducts, and polypropylene glycol ethylene oxide adducts; polyethylene oxide, fatty acid esters of glycerin Polyanhydric alcohol type nonionic surfactants such as fatty acid ester of pentaerythritol, fatty acid ester of sorbit or sorbitan, alkyl ether of polyhydric alcohol, aliphatic amide of alkanolamine, etc. For example, carboxylates such as alkali metal salts of higher fatty acids; sulfates such as higher alcohol sulfates, higher alkyl ether sulfates, alkylbenzenes Sulfonates such as sulfonates, alkyl sulfonates, and paraffin sulfonates; and phosphate ester salts such as higher alcohol phosphates. Examples of cationic surfactants include alkyltrimethylammonium salts. Quaternary ammonium salt etc. are mentioned. Examples of amphoteric surfactants include amino acid-type amphoteric surfactants such as higher alkylaminopropionates, betaine-type amphoteric surfactants such as higher alkyldimethylbetaines and higher alkyldihydroxyethylbetaines, and these are used alone or Two or more types can be used in combination. In the composition of the present invention, among the above surfactants, anionic surfactants are preferable, and sulfonates such as alkylbenzene sulfonate, alkyl sulfonate, and paraffin sulfonate are particularly preferable.
界面活性剤は、本発明の組成物に配合してもよく、組成物とともに、熱可塑性樹脂等の合成樹脂に配合して使用してもよい。界面活性剤の配合量は、本発明の組成物の(X)成分100質量部に対して、0.01〜20質量部が好ましく、0.1〜15質量部がより好ましく、1〜10質量部が最も好ましい。 The surfactant may be blended in the composition of the present invention or may be blended with a synthetic resin such as a thermoplastic resin together with the composition. 0.01-20 mass parts is preferable with respect to 100 mass parts of (X) component of the composition of this invention, and, as for the compounding quantity of surfactant, 0.1-15 mass parts is more preferable, and 1-10 masses. Part is most preferred.
さらに、本発明の組成物には、本発明の効果を損なわない範囲で、高分子型帯電防止剤を配合してもよい。高分子帯電防止剤としては、例えば、公知のポリエーテルエステルアミド等の高分子型帯電防止剤を使用することができ、公知のポリエーテルエステルアミドとしては、例えば、特開平7−10989号公報に記載のビスフェノールAのポリオキシアルキレン付加物からなるポリエーテルエステルアミドが挙げられる。また、ポリオレフィンブロックと親水性ポリマーブロックとの結合単位が2〜50の繰り返し構造を有するブロックポリマーを使用することができ、例えば、米国特許第6552131号明細書記載のブロックポリマーを挙げることができる。 Furthermore, you may mix | blend a polymer type antistatic agent with the composition of this invention in the range which does not impair the effect of this invention. As the polymer antistatic agent, for example, a polymer type antistatic agent such as a known polyether ester amide can be used, and examples of the known polyether ester amide include those described in JP-A-7-10989. And polyether ester amides comprising the polyoxyalkylene adducts of bisphenol A described. Moreover, the block polymer which has a repeating structure whose coupling unit of a polyolefin block and a hydrophilic polymer block is 2-50 can be used, For example, the block polymer of US Patent 6552131 can be mentioned.
高分子型帯電防止剤は、本発明の組成物に配合してもよく、組成物とともに、熱可塑性樹脂等の合成樹脂に配合して使用してもよい。高分子型帯電防止剤の配合量は、本発明の組成物の(X)成分100質量部に対して、0〜50質量部が好ましく、5〜20質量部がより好ましい。 The polymer antistatic agent may be blended in the composition of the present invention, or may be blended with a synthetic resin such as a thermoplastic resin together with the composition. 0-50 mass parts is preferable with respect to 100 mass parts of (X) component of the composition of this invention, and, as for the compounding quantity of a polymer type antistatic agent, 5-20 mass parts is more preferable.
次に、本発明の樹脂組成物について説明する。本発明の樹脂組成物は、合成樹脂に対し、本発明の組成物が配合されたものであり、合成樹脂、特に好ましくは、熱可塑性樹脂に配合して、樹脂組成物として使用できる。 Next, the resin composition of the present invention will be described. The resin composition of the present invention is obtained by blending the composition of the present invention with a synthetic resin and can be used as a resin composition by blending with a synthetic resin, particularly preferably a thermoplastic resin.
熱可塑性樹脂の例としては、ポリプロピレン、高密度ポリエチレン、低密度ポリエチレン、直鎖低密度ポリエチレン、架橋ポリエチレン、超高分子量ポリエチレン、ポリブテン−1、ポリ−3−メチルペンテン、ポリ−4−メチルペンテン等のα−オレフィン重合体またはエチレン−酢酸ビニル共重合体、エチレン−エチルアクリレート共重合体、エチレン−プロピレン共重合体等のポリオレフィン系樹脂およびこれらの共重合体;ポリ塩化ビニル、ポリ塩化ビニリデン、塩素化ポリエチレン、塩素化ポリプロピレン、ポリフッ化ビニリデン、塩化ゴム、塩化ビニル−酢酸ビニル共重合体、塩化ビニル−エチレン共重合体、塩化ビニル−塩化ビニリデン共重合体、塩化ビニル−塩化ビニリデン−酢酸ビニル三元共重合体、塩化ビニル−アクリル酸エステル共重合体、塩化ビニル−マレイン酸エステル共重合体、塩化ビニル−シクロヘキシルマレイミド共重合体等の含ハロゲン樹脂;石油樹脂、クマロン樹脂、ポリスチレン、ポリ酢酸ビニル、アクリル樹脂、スチレンおよび/またはα−メチルスチレンと他の単量体(例えば、無水マレイン酸、フェニルマレイミド、メタクリル酸メチル、ブタジエン、アクリロニトリル等)との共重合体(例えば、AS樹脂、ABS(アクリロニトリルブタジエンスチレン共重合体)樹脂、ACS樹脂、SBS樹脂、MBS樹脂、耐熱ABS樹脂等);ポリメチルメタクリレート、ポリビニルアルコール、ポリビニルホルマール、ポリビニルブチラール;ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリシクロヘキサンジメチレンテレフタレート等のポリアルキレンテレフタレート、ポリエチレンナフタレート、ポリブチレンナフタレート等のポリアルキレンナフタレート等の芳香族ポリエステルおよびポリテトラメチレンテレフタレート等の直鎖ポリエステル;ポリヒドロキシブチレート、ポリカプロラクトン、ポリブチレンサクシネート、ポリエチレンサクシネート、ポリ乳酸、ポリリンゴ酸、ポリグリコール酸、ポリジオキサン、ポリ(2−オキセタノン)等の分解性脂肪族ポリエステル;ポリフェニレンオキサイド、ポリカプロラクタムおよびポリヘキサメチレンアジパミド等のポリアミド、ポリカーボネート、ポリカーボネート/ABS樹脂、分岐ポリカーボネート、ポリアセタール、ポリフェニレンサルファイド、ポリウレタン、繊維素系樹脂、ポリイミド樹脂、ポリサルフォン、ポリフェニレンエーテル、ポリエーテルケトン、ポリエーテルエーテルケトン、液晶ポリマー等の熱可塑性樹脂およびこれらのブレンド物を挙げることができる。また、熱可塑性樹脂は、イソプレンゴム、ブタジエンゴム、アクリロニトリル−ブタジエン共重合ゴム、スチレン−ブタジエン共重合ゴム、フッ素ゴム、シリコーンゴム等が挙げられる。本発明の樹脂組成物においては、これらの熱可塑性樹脂は、単独で使用してもよく、2種以上を併せて使用してもよい。また、熱可塑性樹脂はアロイ化されていてもよい。 Examples of thermoplastic resins include polypropylene, high density polyethylene, low density polyethylene, linear low density polyethylene, crosslinked polyethylene, ultrahigh molecular weight polyethylene, polybutene-1, poly-3-methylpentene, poly-4-methylpentene, and the like. Α-olefin polymers or polyolefin-based resins such as ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, ethylene-propylene copolymers, and copolymers thereof; polyvinyl chloride, polyvinylidene chloride, chlorine Polyethylene, chlorinated polypropylene, polyvinylidene fluoride, rubber chloride, vinyl chloride-vinyl acetate copolymer, vinyl chloride-ethylene copolymer, vinyl chloride-vinylidene chloride copolymer, vinyl chloride-vinylidene chloride-vinyl acetate ternary Copolymer, vinyl chloride-acrylic Halogen-containing resins such as acid ester copolymer, vinyl chloride-maleic acid ester copolymer, vinyl chloride-cyclohexyl maleimide copolymer; petroleum resin, coumarone resin, polystyrene, polyvinyl acetate, acrylic resin, styrene and / or α -Copolymer (for example, AS resin, ABS (acrylonitrile butadiene styrene copolymer) resin of methylstyrene and other monomers (for example, maleic anhydride, phenylmaleimide, methyl methacrylate, butadiene, acrylonitrile, etc.), ACS resin, SBS resin, MBS resin, heat-resistant ABS resin, etc.); polymethyl methacrylate, polyvinyl alcohol, polyvinyl formal, polyvinyl butyral; polyethylene terephthalate, polybutylene terephthalate, polycyclohexanedimethylene Aromatic polyesters such as polyalkylene terephthalates such as phthalates, polyethylene naphthalates, polybutylene naphthalates and the like, and linear polyesters such as polytetramethylene terephthalates; polyhydroxybutyrate, polycaprolactone, polybutylene succinate, Degradable aliphatic polyesters such as polyethylene succinate, polylactic acid, polymalic acid, polyglycolic acid, polydioxane, poly (2-oxetanone); polyamides such as polyphenylene oxide, polycaprolactam and polyhexamethylene adipamide, polycarbonate, polycarbonate / ABS resin, branched polycarbonate, polyacetal, polyphenylene sulfide, polyurethane, fiber base resin, polyimide resin Can polysulfone, polyphenylene ether, polyether ketone, polyether ether ketone, include thermoplastic resins and blends thereof such as a liquid crystal polymer. Examples of the thermoplastic resin include isoprene rubber, butadiene rubber, acrylonitrile-butadiene copolymer rubber, styrene-butadiene copolymer rubber, fluorine rubber, and silicone rubber. In the resin composition of this invention, these thermoplastic resins may be used independently and may use 2 or more types together. Further, the thermoplastic resin may be alloyed.
本発明の樹脂組成物においては、これらの熱可塑性樹脂は、分子量、重合度、密度、軟化点、溶媒への不溶分の割合、立体規則性の程度、触媒残渣の有無、原料となるモノマーの種類や配合比率、重合触媒の種類(例えば、チーグラー触媒、メタロセン触媒等)等に関わらず使用することができる。これらの熱可塑性樹脂の中でも、帯電防止性とその持続性、力学特性の点から、ポリオレフィン系樹脂、ポリスチレン系樹脂およびそれらの共重合体からなる群から選ばれる1種以上が好ましく、それらと熱可塑性エラストマーを併用しても好ましい。 In the resin composition of the present invention, these thermoplastic resins are composed of molecular weight, degree of polymerization, density, softening point, proportion of insoluble matter in solvent, degree of stereoregularity, presence of catalyst residue, and amount of monomer as a raw material. It can be used regardless of the type, mixing ratio, type of polymerization catalyst (eg, Ziegler catalyst, metallocene catalyst, etc.). Among these thermoplastic resins, one or more selected from the group consisting of polyolefin resins, polystyrene resins, and copolymers thereof are preferable from the viewpoint of antistatic properties, their sustainability, and mechanical properties. It is also preferable to use a plastic elastomer in combination.
また、ポリオレフィン系樹脂に本発明の組成物を使用し、フィルムとした場合、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性に優れるため好ましい。ポリオレフィン系樹脂としては、例えば、ポリプロピレン、高密度ポリエチレン、低密度ポリエチレン、直鎖低密度ポリエチレン、架橋ポリエチレン、超高分子量ポリエチレン、ポリブテン−1、ポリ−3−メチルペンテン、ポリ−4−メチルペンテン等のα−オレフィン重合体またはエチレン−酢酸ビニル共重合体、エチレン−エチルアクリレート共重合体、エチレン−プロピレン共重合体等のポリオレフィン系樹脂およびこれらの共重合体が挙げられる。これらフィルムは、電気・電子部品、電気・電子製品、精密部品、精密機械、精密製品等の包装材等に好適である。 In addition, when the composition of the present invention is used as a polyolefin-based resin to form a film, it is preferable because it has excellent film properties such as antistatic properties and durability, transparency of the film, tensile breaking strength, and elongation at break. Examples of the polyolefin-based resin include polypropylene, high density polyethylene, low density polyethylene, linear low density polyethylene, cross-linked polyethylene, ultrahigh molecular weight polyethylene, polybutene-1, poly-3-methylpentene, poly-4-methylpentene, and the like. Α-olefin polymer or ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-propylene copolymer, and other polyolefin resins and copolymers thereof. These films are suitable for packaging materials for electrical / electronic parts, electrical / electronic products, precision parts, precision machines, precision products, and the like.
合成樹脂に対する本発明の組成物の配合量は、帯電防止性とその持続性、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性、曲げ弾性率、衝撃強度、熱変形温度等の成形体の力学特性の点から、合成樹脂100質量部に対して、1.0〜100質量部が好ましく、2.0〜60質量部がより好ましく、5.0〜50質量部がさらに好ましく、10.0〜45質量部が特に好ましく、15.0〜45質量部が最も好ましい。 The blending amount of the composition of the present invention with respect to the synthetic resin includes antistatic properties and durability, film properties such as film transparency, tensile rupture strength and elongation at break, bending elastic modulus, impact strength, and heat distortion temperature. From the point of mechanical properties of the molded body, 1.0 to 100 parts by mass is preferable, 100 to 60 parts by mass is more preferable, and 5.0 to 50 parts by mass is more preferable, with respect to 100 parts by mass of the synthetic resin. 10.0-45 mass parts is especially preferable, and 15.0-45 mass parts is the most preferable.
また、本発明の組成物は、充填剤が配合された熱可塑性樹脂にも、好適に使用することができる。充填剤は、曲げ弾性率、衝撃強度、熱変形温度等、樹脂成形体の力学特性を向上するために、ポリオレフィン樹脂等の熱可塑性樹脂に好ましく配合される。また、充填剤を配合した場合に、成形体の耐衝撃性を改善するためや、加工時の流動性改善のために熱可塑性エラストマー等が好ましく配合される。本発明の組成物は、充填剤が配合された熱可塑性樹脂、または熱可塑性エラストマーが配合された熱可塑性樹脂、さらには充填剤および熱可塑性エラストマーが配合された熱可塑性樹脂に対しても、持続性の有る、優れた帯電防止性を付与することができる。 Moreover, the composition of this invention can be used conveniently also for the thermoplastic resin with which the filler was mix | blended. The filler is preferably blended with a thermoplastic resin such as a polyolefin resin in order to improve the mechanical properties of the resin molded body such as a flexural modulus, impact strength, and heat distortion temperature. In addition, when a filler is blended, a thermoplastic elastomer or the like is preferably blended for improving the impact resistance of the molded body or for improving fluidity during processing. The composition of the present invention can be applied to a thermoplastic resin containing a filler, a thermoplastic resin containing a thermoplastic elastomer, and a thermoplastic resin containing a filler and a thermoplastic elastomer. And excellent antistatic properties can be imparted.
充填剤の例としては、ポリオレフィン系樹脂等の熱可塑性樹脂に、従来使用されている公知の充填剤が挙げられ、例えば、タルク、炭酸カルシウム、硫酸マグネシウム繊維、シリカ、クレー、カオリン、アルミナ、カーボンブラック、ガラス繊維等が挙げられ、成形体の力学特性の点から、特にタルクが好ましい。また、タルクは、微粉化や微粒子化等の処理や表面処理をされていてもよい。 Examples of the filler include known fillers conventionally used for thermoplastic resins such as polyolefin resins, such as talc, calcium carbonate, magnesium sulfate fiber, silica, clay, kaolin, alumina, carbon. Examples thereof include black and glass fiber, and talc is particularly preferable from the viewpoint of mechanical properties of the molded body. Moreover, the talc may be subjected to a treatment such as pulverization or fine particle treatment or a surface treatment.
充填剤の配合量は、力学特性の点から、合成樹脂成分の合計100質量部に対して、1〜30質量部が好ましく、3〜25質量部がより好ましく、5〜20質量部がさらに好ましい。 The blending amount of the filler is preferably 1 to 30 parts by mass, more preferably 3 to 25 parts by mass, and further preferably 5 to 20 parts by mass with respect to 100 parts by mass in total of the synthetic resin components from the viewpoint of mechanical properties. .
充填剤の合成樹脂への配合方法は従来公知の方法を用いればよく、特に限定されない。あらかじめ合成樹脂に配合していてもよく、本発明の組成物と同時に合成樹脂に配合してもよい。 A method for blending the filler into the synthetic resin may be a conventionally known method, and is not particularly limited. You may mix | blend with a synthetic resin previously, and you may mix | blend with a synthetic resin simultaneously with the composition of this invention.
本発明で使用される熱可塑性エラストマーは、特に限定されず、公知のものをいずれも用いることができる。好ましい熱可塑性エラストマーとしては、常温(5〜35℃)でゴム弾性を有し、加熱により流動性を発揮し、成形加工が可能なエラストマーである。熱可塑性エラストマーとしては、例えば、ポリオレフィン系熱可塑性エラストマー、ポリスチレン系熱可塑性エラストマー、ポリ塩化ビニル系熱可塑性エラストマー、ポリエステル系熱可塑性エラストマー、ポリアミド系熱可塑性エラストマー、ポリウレタン系熱可塑性エラストマー、ニトリル系熱可塑性エラストマー、ナイロン系熱可塑性エラストマー等が挙げられ、成形体の力学的特性の点から、ポリオレフィン系熱可塑性エラストマー、および、ポリスチレン系熱可塑性エラストマーが好ましく、ポリオレフィン系熱可塑性エラストマーがより好ましい。 The thermoplastic elastomer used in the present invention is not particularly limited, and any known one can be used. A preferred thermoplastic elastomer is an elastomer that has rubber elasticity at normal temperature (5 to 35 ° C.), exhibits fluidity when heated, and can be molded. Examples of the thermoplastic elastomer include a polyolefin-based thermoplastic elastomer, a polystyrene-based thermoplastic elastomer, a polyvinyl chloride-based thermoplastic elastomer, a polyester-based thermoplastic elastomer, a polyamide-based thermoplastic elastomer, a polyurethane-based thermoplastic elastomer, and a nitrile-based thermoplastic. Examples thereof include elastomers and nylon thermoplastic elastomers. From the viewpoint of the mechanical properties of the molded product, polyolefin thermoplastic elastomers and polystyrene thermoplastic elastomers are preferable, and polyolefin thermoplastic elastomers are more preferable.
熱可塑性エラストマーの配合量は、力学特性の点から、合成樹脂成分の合計100質量部に対して、1〜30質量部が好ましく、3〜25質量部がより好ましく、5〜20質量部がさらにより好ましい。 The blending amount of the thermoplastic elastomer is preferably 1 to 30 parts by mass, more preferably 3 to 25 parts by mass, and further 5 to 20 parts by mass with respect to a total of 100 parts by mass of the synthetic resin component from the viewpoint of mechanical properties. More preferred.
熱可塑性エラストマーの合成樹脂への配合方法は従来公知の方法を用いればよく、特に限定されない。あらかじめ合成樹脂に配合していてもよく、本発明の組成物と同時に合成樹脂に配合してもよい。 A method for blending the thermoplastic elastomer into the synthetic resin may be a conventionally known method, and is not particularly limited. You may mix | blend with a synthetic resin previously, and you may mix | blend with a synthetic resin simultaneously with the composition of this invention.
本発明の組成物の合成樹脂への配合方法は特に限定されず、熱可塑性樹脂の場合、通常使用されている任意の方法を用いることができ、例えば、ロール混練り、バンバリー混練り、押し出し機、ニーダー等により混合、練り込みして配合すればよい。また、本発明の組成物は、そのまま熱可塑性樹脂に添加してもよいが、必要に応じて、担体に含浸させてから添加してもよい。担体に含浸させるには、そのまま加熱混合してもよいし、必要に応じて、有機溶媒で希釈してから担体に含浸させ、その後に溶媒を除去する方法でもよい。こうした担体としては、合成樹脂のフィラーや充填剤として知られているもの、または、常温で固体の難燃剤や光安定剤が使用でき、例えば、ケイ酸カルシウム粉末、シリカ粉末、タルク粉末、アルミナ粉末、酸化チタン粉末、または、これら担体の表面を化学修飾したもの、下記に挙げる難燃剤や酸化防止剤の中で固体のもの等が挙げられる。これらの担体の中でも担体の表面を化学修飾したものが好ましく、シリカ粉末の表面を化学修飾したものがより好ましい。これらの担体は、平均粒径が0.1〜100μmのものが好ましく、0.5〜50μmのものがより好ましい。 The method of blending the composition of the present invention into the synthetic resin is not particularly limited, and in the case of a thermoplastic resin, any commonly used method can be used. For example, roll kneading, Banbury kneading, extruder The mixture may be mixed and kneaded with a kneader or the like. In addition, the composition of the present invention may be added to the thermoplastic resin as it is, but may be added after impregnating the support, if necessary. In order to impregnate the carrier, it may be heated and mixed as it is, or if necessary, it may be diluted with an organic solvent, impregnated into the carrier, and then the solvent is removed. As such a carrier, those known as fillers and fillers of synthetic resins, or flame retardants and light stabilizers that are solid at room temperature can be used. For example, calcium silicate powder, silica powder, talc powder, alumina powder In addition, titanium oxide powder, those obtained by chemically modifying the surface of these carriers, solid ones among the flame retardants and antioxidants listed below, and the like can be mentioned. Among these carriers, those obtained by chemically modifying the surface of the carrier are preferred, and those obtained by chemically modifying the surface of the silica powder are more preferred. These carriers preferably have an average particle size of 0.1 to 100 μm, and more preferably 0.5 to 50 μm.
さらに、本発明の組成物の樹脂成分への配合方法としては、(X)成分および(Y)成分を樹脂成分に練り込みながら配合してもよく、そのときにアルカリ金属の塩およびイオン性液体の1種以上を同時に練り込んでもよく、また、(X)成分である高分子化合物(E)の原料または中間体を樹脂成分と同時に練り込みながら合成して配合してもよく、(Y)成分の原料または中間体を樹脂成分と同時に練り込みながら合成して配合してもよく、射出成型等の成型時に、(X)成分および(Y)成分、合成樹脂、必要に応じてアルカリ金属の塩およびイオン性液体の1種以上、を混合して成形品を得る方法で配合してもよく、さらに、あらかじめ、(X)成分および(Y)成分、合成樹脂、必要に応じてアルカリ金属の塩およびイオン性液体の1種以上、とのマスターバッチを製造しておき、このマスターバッチを配合してもよい。 Further, as a method of blending the composition of the present invention into the resin component, the component (X) and the component (Y) may be blended while being kneaded into the resin component. At that time, an alkali metal salt and an ionic liquid are used. One or more of the above may be kneaded at the same time, or the raw material or intermediate of the polymer compound (E) as the component (X) may be synthesized and kneaded simultaneously with the resin component, and (Y) The raw material or intermediate of the component may be synthesized and blended while kneading simultaneously with the resin component, and at the time of molding such as injection molding, the (X) component and (Y) component, synthetic resin, and if necessary, an alkali metal One or more of a salt and an ionic liquid may be mixed to obtain a molded product. Further, the (X) component and the (Y) component, a synthetic resin, and if necessary, an alkali metal Salt and ionic liquid 1 or more in advance to produce the master batch with, may be blended with this masterbatch.
さらにまた、(X)成分および(Y)成分と、アルカリ金属の塩およびイオン性液体の1種以上は、あらかじめ混合しておいてから合成樹脂に配合してもよく、合成反応中にアルカリ金属の塩およびイオン性液体の1種以上を添加して合成した、(X)成分の高分子化合物(E)または(Y)成分を合成樹脂に配合してもよい。 Furthermore, the (X) component and the (Y) component, and one or more of an alkali metal salt and an ionic liquid may be mixed in advance and then blended into a synthetic resin. The polymer compound (E) or (Y) component (X) synthesized by adding one or more of the above salts and ionic liquid may be added to the synthetic resin.
本発明の樹脂組成物には、必要に応じて、フェノール系酸化防止剤、リン系酸化防止剤、チオエーテル系酸化防止剤、紫外線吸収剤、ヒンダードアミン系光安定剤等の各種添加剤をさらに添加することができ、これにより、本発明の樹脂組成物を安定化させることができる。 Various additives such as phenolic antioxidants, phosphorus antioxidants, thioether antioxidants, ultraviolet absorbers, hindered amine light stabilizers and the like are further added to the resin composition of the present invention as necessary. Thus, the resin composition of the present invention can be stabilized.
これら酸化防止剤等の各種添加剤は、合成樹脂に配合するまえに、本発明の組成物中に配合しておいてもよい。さらには(X)成分である高分子化合物(E)および/または(Y)成分の製造時に配合しておいてもよい。特に酸化防止剤は、高分子化合物(E)の製造時に配合することで、製造中の高分子化合物(E)の酸化劣化も防ぐことができるので好ましい。 These additives such as antioxidants may be blended in the composition of the present invention before blending into the synthetic resin. Furthermore, you may mix | blend at the time of manufacture of the high molecular compound (E) and / or (Y) component which are (X) components. In particular, an antioxidant is preferable because it can be prevented from oxidative deterioration of the polymer compound (E) being produced by blending it during the production of the polymer compound (E).
上記フェノール系酸化防止剤としては、例えば、2,6−ジ第三ブチル−p−クレゾール、2,6−ジフェニル−4−オクタデシロキシフェノール、ジステアリル(3,5−ジ第三ブチル−4−ヒドロキシベンジル)ホスホネート、1,6−ヘキサメチレンビス〔(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオン酸アミド〕、4,4’−チオビス(6−第三ブチル−m−クレゾール)、2,2’−メチレンビス(4−メチル−6−第三ブチルフェノール)、2,2’−メチレンビス(4−エチル−6−第三ブチルフェノール)、4,4’−ブチリデンビス(6−第三ブチル−m−クレゾール)、2,2’−エチリデンビス(4,6―ジ第三ブチルフェノール)、2,2’−エチリデンビス(4−第二ブチル−6−第三ブチルフェノール)、1,1,3−トリス(2−メチル−4−ヒドロキシ−5−第三ブチルフェニル)ブタン、1,3,5−トリス(2,6−ジメチル−3−ヒドロキシ−4−第三ブチルベンジル)イソシアヌレート、1,3,5−トリス(3,5−ジ第三ブチル−4−ヒドロキシベンジル)イソシアヌレート、1,3,5−トリス(3,5−ジ第三ブチル−4−ヒドロキシベンジル)−2,4,6−トリメチルベンゼン、2−第三ブチル−4−メチル−6−(2−アクリロイルオキシ−3−第三ブチル−5−メチルベンジル)フェノール、ステアリル(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオネート、テトラキス〔3−(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオン酸メチル〕メタン、チオジエチレングリコールビス〔(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオネート〕、1,6−ヘキサメチレンビス〔(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオネート〕、ビス〔3,3−ビス(4−ヒドロキシ−3−第三ブチルフェニル)ブチリックアシッド〕グリコールエステル、ビス〔2−第三ブチル−4−メチル−6−(2−ヒドロキシ−3−第三ブチル−5−メチルベンジル)フェニル〕テレフタレート、1,3,5−トリス〔(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオニルオキシエチル〕イソシアヌレート、3,9−ビス〔1,1−ジメチル−2−{(3−第三ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニルオキシ}エチル〕−2,4,8,10−テトラオキサスピロ〔5,5〕ウンデカン、トリエチレングリコールビス〔(3−第三ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオネート〕等が挙げられる。これらのフェノール系酸化防止剤の添加量は、合成樹脂100質量部に対して、0.001〜10質量部であることが好ましく、0.05〜5質量部であることがより好ましい。 Examples of the phenolic antioxidant include 2,6-ditert-butyl-p-cresol, 2,6-diphenyl-4-octadecyloxyphenol, distearyl (3,5-ditert-butyl-4). -Hydroxybenzyl) phosphonate, 1,6-hexamethylenebis [(3,5-ditert-butyl-4-hydroxyphenyl) propionic acid amide], 4,4'-thiobis (6-tert-butyl-m-cresol ), 2,2′-methylenebis (4-methyl-6-tert-butylphenol), 2,2′-methylenebis (4-ethyl-6-tert-butylphenol), 4,4′-butylidenebis (6-tert-butyl) -M-cresol), 2,2'-ethylidenebis (4,6-ditert-butylphenol), 2,2'-ethylidenebis (4-secondarybutyl-6-tert-butylphenol) Nol), 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5-tris (2,6-dimethyl-3-hydroxy-4-tertiary) Butylbenzyl) isocyanurate, 1,3,5-tris (3,5-ditert-butyl-4-hydroxybenzyl) isocyanurate, 1,3,5-tris (3,5-ditert-butyl-4- Hydroxybenzyl) -2,4,6-trimethylbenzene, 2-tert-butyl-4-methyl-6- (2-acryloyloxy-3-tert-butyl-5-methylbenzyl) phenol, stearyl (3,5- Ditertiarybutyl-4-hydroxyphenyl) propionate, tetrakis [methyl 3- (3,5-ditertiarybutyl-4-hydroxyphenyl) propionate] methane, thiodiethyleneglycol Bis [(3,5-ditert-butyl-4-hydroxyphenyl) propionate], 1,6-hexamethylenebis [(3,5-ditert-butyl-4-hydroxyphenyl) propionate], bis [3 3-bis (4-hydroxy-3-tert-butylphenyl) butyric acid] glycol ester, bis [2-tert-butyl-4-methyl-6- (2-hydroxy-3-tert-butyl-5-methyl) Benzyl) phenyl] terephthalate, 1,3,5-tris [(3,5-ditert-butyl-4-hydroxyphenyl) propionyloxyethyl] isocyanurate, 3,9-bis [1,1-dimethyl-2- {(3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy} ethyl] -2,4,8,10-tetraoxaspiro [5,5] And ndecane and triethylene glycol bis [(3-tert-butyl-4-hydroxy-5-methylphenyl) propionate]. The amount of these phenolic antioxidants added is preferably 0.001 to 10 parts by mass and more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the synthetic resin.
上記リン系酸化防止剤としては、例えば、トリスノニルフェニルホスファイト、トリス〔2−第三ブチル−4−(3−第三ブチル−4−ヒドロキシ−5−メチルフェニルチオ)−5−メチルフェニル〕ホスファイト、トリデシルホスファイト、オクチルジフェニルホスファイト、ジ(デシル)モノフェニルホスファイト、ジ(トリデシル)ペンタエリスリトールジホスファイト、ジ(ノニルフェニル)ペンタエリスリトールジホスファイト、ビス(2,4−ジ第三ブチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,6−ジ第三ブチル−4−メチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,4,6−トリ第三ブチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,4−ジクミルフェニル)ペンタエリスリトールジホスファイト、テトラ(トリデシル)イソプロピリデンジフェノールジホスファイト、テトラ(トリデシル)−4,4’−n−ブチリデンビス(2−第三ブチル−5−メチルフェノール)ジホスファイト、ヘキサ(トリデシル)−1,1,3−トリス(2−メチル−4−ヒドロキシ−5−第三ブチルフェニル)ブタントリホスファイト、テトラキス(2,4−ジ第三ブチルフェニル)ビフェニレンジホスホナイト、9,10−ジハイドロ−9−オキサ−10−ホスファフェナンスレン−10−オキサイド、2,2’−メチレンビス(4,6−第三ブチルフェニル)−2−エチルヘキシルホスファイト、2,2’−メチレンビス(4,6−第三ブチルフェニル)−オクタデシルホスファイト、2,2’−エチリデンビス(4,6−ジ第三ブチルフェニル)フルオロホスファイト、トリス(2−〔(2,4,8,10−テトラキス第三ブチルジベンゾ〔d,f〕〔1,3,2〕ジオキサホスフェピン−6−イル)オキシ〕エチル)アミン、2−エチル−2−ブチルプロピレングリコールと2,4,6−トリ第三ブチルフェノールのホスファイト等が挙げられる。これらのリン系酸化防止剤の添加量は、合成樹脂100質量部に対して0.001〜10質量部であることが好ましく、0.05〜5質量部であることがより好ましい。 Examples of the phosphorus antioxidant include trisnonylphenyl phosphite, tris [2-tert-butyl-4- (3-tert-butyl-4-hydroxy-5-methylphenylthio) -5-methylphenyl]. Phosphite, tridecyl phosphite, octyl diphenyl phosphite, di (decyl) monophenyl phosphite, di (tridecyl) pentaerythritol diphosphite, di (nonylphenyl) pentaerythritol diphosphite, bis (2,4-di Tert-butylphenyl) pentaerythritol diphosphite, bis (2,6-ditert-butyl-4-methylphenyl) pentaerythritol diphosphite, bis (2,4,6-tritert-butylphenyl) pentaerythritol diphosphite Phosphite, bis (2,4-dicumylphenyl) pen Erythritol diphosphite, tetra (tridecyl) isopropylidene diphenol diphosphite, tetra (tridecyl) -4,4′-n-butylidenebis (2-tert-butyl-5-methylphenol) diphosphite, hexa (tridecyl) -1 , 1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane triphosphite, tetrakis (2,4-ditert-butylphenyl) biphenylene diphosphonite, 9,10-dihydro-9 -Oxa-10-phosphaphenanthrene-10-oxide, 2,2'-methylenebis (4,6-tert-butylphenyl) -2-ethylhexyl phosphite, 2,2'-methylenebis (4,6- Tributylphenyl) -octadecyl phosphite, 2,2′-ethylidenebis (4 6-ditert-butylphenyl) fluorophosphite, tris (2-[(2,4,8,10-tetrakis tert-butyldibenzo [d, f] [1,3,2] dioxaphosphine-6 -Yl) oxy] ethyl) amine, phosphite of 2-ethyl-2-butylpropylene glycol and 2,4,6-tritert-butylphenol, and the like. The addition amount of these phosphorus antioxidants is preferably 0.001 to 10 parts by mass, more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the synthetic resin.
上記チオエーテル系酸化防止剤としては、例えば、チオジプロピオン酸ジラウリル、チオジプロピオン酸ジミリスチル、チオジプロピオン酸ジステアリル等のジアルキルチオジプロピオネート類、および、ペンタエリスリトールテトラ(β−アルキルチオプロピオン酸)エステル類が挙げられる。これらのチオエーテル系酸化防止剤の添加量は、合成樹脂100質量部に対して、0.001〜10質量部であることが好ましく、0.05〜5質量部であることがより好ましい。 Examples of the thioether antioxidant include dialkylthiodipropionates such as dilauryl thiodipropionate, dimyristyl thiodipropionate, distearyl thiodipropionate, and pentaerythritol tetra (β-alkylthiopropionic acid). Examples include esters. The addition amount of these thioether-based antioxidants is preferably 0.001 to 10 parts by mass and more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the synthetic resin.
上記紫外線吸収剤としては、例えば、2,4−ジヒドロキシベンゾフェノン、2−ヒドロキシ−4−メトキシベンゾフェノン、2−ヒドロキシ−4−オクトキシベンゾフェノン、5,5’−メチレンビス(2−ヒドロキシ−4−メトキシベンゾフェノン)等の2−ヒドロキシベンゾフェノン類;2−(2’−ヒドロキシ−5’−メチルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−3’,5’−ジ第三ブチルフェニル)−5−クロロベンゾトリアゾ−ル、2−(2’−ヒドロキシ−3’−第三ブチル−5’−メチルフェニル)−5−クロロベンゾトリアゾ−ル、2−(2’−ヒドロキシ−5’−第三オクチルフェニル)ベンゾトリアゾ−ル、2−(2’−ヒドロキシ−3’,5’−ジクミルフェニル)ベンゾトリアゾ−ル、2,2’−メチレンビス(4−第三オクチル−6−(ベンゾトリアゾリル)フェノール)、2−(2’−ヒドロキシ−3’−第三ブチル−5’−カルボキシフェニル)ベンゾトリアゾール等の2−(2’−ヒドロキシフェニル)ベンゾトリアゾール類;フェニルサリシレート、レゾルシノールモノベンゾエート、2,4−ジ第三ブチルフェニル−3,5−ジ第三ブチル−4−ヒドロキシベンゾエート、2,4−ジ第三アミルフェニル−3,5−ジ第三ブチル−4−ヒドロキシベンゾエート、ヘキサデシル−3,5−ジ第三ブチル−4−ヒドロキシベンゾエート等のベンゾエート類;2−エチル−2’−エトキシオキザニリド、2−エトキシ−4’−ドデシルオキザニリド等の置換オキザニリド類;エチル−α−シアノ−β、β−ジフェニルアクリレート、メチル−2−シアノ−3−メチル−3−(p−メトキシフェニル)アクリレート等のシアノアクリレート類;2−(2−ヒドロキシ−4−オクトキシフェニル)−4,6−ビス(2,4−ジ第三ブチルフェニル)−s−トリアジン、2−(2−ヒドロキシ−4−メトキシフェニル)−4,6−ジフェニル−s−トリアジン、2−(2−ヒドロキシ−4−プロポキシ−5−メチルフェニル)−4,6−ビス(2,4−ジ第三ブチルフェニル)−s−トリアジン等のトリアリールトリアジン類が挙げられる。これらの紫外線吸収剤の添加量は、合成樹脂100質量部に対して、0.001〜30質量部であることが好ましく、0.05〜10質量部であることがより好ましい。 Examples of the ultraviolet absorber include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, and 5,5′-methylenebis (2-hydroxy-4-methoxybenzophenone). 2-hydroxybenzophenones; 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-ditert-butylphenyl) -5-chloro Benzotriazole, 2- (2′-hydroxy-3′-tert-butyl-5′-methylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-5′-tert. Octylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-dicumylphenyl) benzotriazole, 2, 2- (2 such as' -methylenebis (4-tert-octyl-6- (benzotriazolyl) phenol), 2- (2'-hydroxy-3'-tert-butyl-5'-carboxyphenyl) benzotriazole '-Hydroxyphenyl) benzotriazoles; phenyl salicylate, resorcinol monobenzoate, 2,4-ditert-butylphenyl-3,5-ditert-butyl-4-hydroxybenzoate, 2,4-ditert-amylphenyl- Benzoates such as 3,5-ditert-butyl-4-hydroxybenzoate and hexadecyl-3,5-ditert-butyl-4-hydroxybenzoate; 2-ethyl-2′-ethoxyoxanilide, 2-ethoxy- Substituted oxanilides such as 4′-dodecyl oxanilide; ethyl-α-cyano-β, β-diphenylacrylate And cyanoacrylates such as methyl-2-cyano-3-methyl-3- (p-methoxyphenyl) acrylate; 2- (2-hydroxy-4-octoxyphenyl) -4,6-bis (2,4 -Di-tert-butylphenyl) -s-triazine, 2- (2-hydroxy-4-methoxyphenyl) -4,6-diphenyl-s-triazine, 2- (2-hydroxy-4-propoxy-5-methylphenyl) And triaryltriazines such as -4,6-bis (2,4-ditert-butylphenyl) -s-triazine. The addition amount of these ultraviolet absorbers is preferably 0.001 to 30 parts by mass, and more preferably 0.05 to 10 parts by mass with respect to 100 parts by mass of the synthetic resin.
上記ヒンダードアミン系光安定剤としては、例えば、2,2,6,6−テトラメチル−4−ピペリジルステアレート、1,2,2,6,6−ペンタメチル−4−ピペリジルステアレート、2,2,6,6−テトラメチル−4−ピペリジルベンゾエート、ビス(2,2,6,6−テトラメチル−4−ピペリジル)セバケート、ビス(1,2,2,6,6−ペンタメチル−4−ピペリジル)セバケート、ビス(1−オクトキシ−2,2,6,6−テトラメチル−4−ピペリジル)セバケート、テトラキス(2,2,6,6−テトラメチル−4−ピペリジル)−1,2,3,4−ブタンテトラカルボキシレート、テトラキス(1,2,2,6,6−ペンタメチル−4−ピペリジル)−1,2,3,4−ブタンテトラカルボキシレート、ビス(2,2,6,6−テトラメチル−4−ピペリジル)・ジ(トリデシル)−1,2,3,4−ブタンテトラカルボキシレート、ビス(1,2,2,6,6−ペンタメチル−4−ピペリジル)・ジ(トリデシル)−1,2,3,4−ブタンテトラカルボキシレート、ビス(1,2,2,4,4−ペンタメチル−4−ピペリジル)−2−ブチル−2−(3,5−ジ第三ブチル−4−ヒドロキシベンジル)マロネート、1−(2−ヒドロキシエチル)−2,2,6,6−テトラメチル−4−ピペリジノ−ル/コハク酸ジエチル重縮合物、1,6−ビス(2,2,6,6−テトラメチル−4−ピペリジルアミノ)ヘキサン/2,4−ジクロロ−6−モルホリノ−s−トリアジン重縮合物、1,6−ビス(2,2,6,6−テトラメチル−4−ピペリジルアミノ)ヘキサン/2,4−ジクロロ−6−第三オクチルアミノ−s−トリアジン重縮合物、1,5,8,12−テトラキス〔2,4−ビス(N−ブチル−N−(2,2,6,6−テトラメチル−4−ピペリジル)アミノ)−s−トリアジン−6−イル〕−1,5,8,12−テトラアザドデカン、1,5,8,12−テトラキス〔2,4−ビス(N−ブチル−N−(1,2,2,6,6−ペンタメチル−4−ピペリジル)アミノ)−s−トリアジン−6−イル〕−1,5,8−12−テトラアザドデカン、1,6,11−トリス〔2,4−ビス(N−ブチル−N−(2,2,6,6−テトラメチル−4−ピペリジル)アミノ)−s−トリアジン−6−イル〕アミノウンデカン、1,6,11−トリス〔2,4−ビス(N−ブチル−N−(1,2,2,6,6−ペンタメチル−4−ピペリジル)アミノ)−s−トリアジン−6−イル〕アミノウンデカン等のヒンダードアミン化合物が挙げられる。これらのヒンダードアミン系光安定剤の添加量は、合成樹脂100質量部に対して0.001〜30質量部であることが好ましく、0.05〜10質量部であることがより好ましい。 Examples of the hindered amine light stabilizer include 2,2,6,6-tetramethyl-4-piperidyl stearate, 1,2,2,6,6-pentamethyl-4-piperidyl stearate, 2,2, 6,6-tetramethyl-4-piperidylbenzoate, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate Bis (1-octoxy-2,2,6,6-tetramethyl-4-piperidyl) sebacate, tetrakis (2,2,6,6-tetramethyl-4-piperidyl) -1,2,3,4 Butanetetracarboxylate, tetrakis (1,2,2,6,6-pentamethyl-4-piperidyl) -1,2,3,4-butanetetracarboxylate, bis (2,2 6,6-tetramethyl-4-piperidyl) di (tridecyl) -1,2,3,4-butanetetracarboxylate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) di (Tridecyl) -1,2,3,4-butanetetracarboxylate, bis (1,2,2,4,4-pentamethyl-4-piperidyl) -2-butyl-2- (3,5-ditertiary Butyl-4-hydroxybenzyl) malonate, 1- (2-hydroxyethyl) -2,2,6,6-tetramethyl-4-piperidinol / diethyl succinate polycondensate, 1,6-bis (2, 2,6,6-tetramethyl-4-piperidylamino) hexane / 2,4-dichloro-6-morpholino-s-triazine polycondensate, 1,6-bis (2,2,6,6-tetramethyl- 4-piperidylamino Hexane / 2,4-dichloro-6-tert-octylamino-s-triazine polycondensate, 1,5,8,12-tetrakis [2,4-bis (N-butyl-N- (2,2,6 , 6-tetramethyl-4-piperidyl) amino) -s-triazin-6-yl] -1,5,8,12-tetraazadodecane, 1,5,8,12-tetrakis [2,4-bis ( N-butyl-N- (1,2,2,6,6-pentamethyl-4-piperidyl) amino) -s-triazin-6-yl] -1,5,8-12-tetraazadodecane, 1,6 , 11-tris [2,4-bis (N-butyl-N- (2,2,6,6-tetramethyl-4-piperidyl) amino) -s-triazin-6-yl] aminoundecane, 1,6 , 11-tris [2,4-bis (N-butyl-N- (1,2,2 , 6,6-pentamethyl-4-piperidyl) amino) -s-triazin-6-yl] aminoundecane. The amount of these hindered amine light stabilizers added is preferably 0.001 to 30 parts by mass, more preferably 0.05 to 10 parts by mass with respect to 100 parts by mass of the synthetic resin.
また、熱可塑性樹脂としてポリオレフィン系樹脂を使用する場合は、本発明の効果を損なわない範囲で、必要に応じてさらに、ポリオレフィン系樹脂中の残渣触媒を中和するために、公知の中和剤を添加することが好ましい。中和剤としては、例えば、ステアリン酸カルシウム、ステアリン酸リチウム、ステアリン酸ナトリウム等の脂肪酸金属塩、または、エチレンビス(ステアロアミド)、エチレンビス(12−ヒドロキシステアロアミド)、ステアリン酸アミド等の脂肪酸アミド化合物が挙げられ、これら中和剤は混合して用いてもよい。 Moreover, when using polyolefin-type resin as a thermoplastic resin, in order to neutralize the residual catalyst in polyolefin-type resin as needed, in the range which does not impair the effect of this invention, well-known neutralizing agent Is preferably added. Examples of the neutralizing agent include fatty acid metal salts such as calcium stearate, lithium stearate, and sodium stearate, or fatty acid amides such as ethylene bis (stearamide), ethylene bis (12-hydroxystearamide), and stearic acid amide. Compounds, and these neutralizing agents may be used in combination.
本発明の樹脂組成物には、その他の添加剤として、必要に応じてさらに、本発明の効果を損なわない範囲で、芳香族カルボン酸金属塩、脂環式アルキルカルボン酸金属塩、p−第三ブチル安息香酸アルミニウム、芳香族リン酸エステル金属塩、ジベンジリデンソルビトール類等の造核剤、金属石鹸、ハイドロタルサイト、トリアジン環含有化合物、金属水酸化物、リン酸エステル系難燃剤、縮合リン酸エステル系難燃剤、ホスフェート系難燃剤、無機リン系難燃剤、(ポリ)リン酸塩系難燃剤、ハロゲン系難燃剤、シリコン系難燃剤、三酸化アンチモン等の酸化アンチモン、その他の無機系難燃助剤、その他の有機系難燃助剤、顔料、滑剤、発泡剤等を添加してもよい。 In the resin composition of the present invention, as other additives, an aromatic carboxylic acid metal salt, an alicyclic alkyl carboxylic acid metal salt, p-second compound, as necessary, as long as the effects of the present invention are not impaired. Nucleating agents such as aluminum tributylbenzoate, aromatic phosphate ester metal salts, dibenzylidene sorbitols, metal soap, hydrotalcite, triazine ring-containing compounds, metal hydroxides, phosphate ester flame retardants, condensed phosphorus Acid ester flame retardant, phosphate flame retardant, inorganic phosphorus flame retardant, (poly) phosphate flame retardant, halogen flame retardant, silicon flame retardant, antimony oxide such as antimony trioxide, and other inorganic flame retardants A flame retardant, other organic flame retardant aids, pigments, lubricants, foaming agents and the like may be added.
上記トリアジン環含有化合物としては、例えば、メラミン、アンメリン、ベンズグアナミン、アセトグアナミン、フタロジグアナミン、メラミンシアヌレート、ピロリン酸メラミン、ブチレンジグアナミン、ノルボルネンジグアナミン、メチレンジグアナミン、エチレンジメラミン、トリメチレンジメラミン、テトラメチレンジメラミン、ヘキサメチレンジメラミン、1,3−ヘキシレンジメラミン等が挙げられる。 Examples of the triazine ring-containing compound include melamine, ammelin, benzguanamine, acetoguanamine, phthalodiguanamine, melamine cyanurate, melamine pyrophosphate, butylenediguanamine, norbornene diguanamine, methylene diguanamine, ethylene dimelamine, trimethylene Dimelamine, tetramethylene dimelamine, hexamethylene dimelamine, 1,3-hexylene dimelamine and the like can be mentioned.
上記金属水酸化物としては、例えば、水酸化マグネシウム、水酸化アルミニウム、水酸化カルシウム、水酸化バリウム、水酸化亜鉛、キスマー5A(水酸化マグネシウム:協和化学工業(株)製)等が挙げられる。 Examples of the metal hydroxide include magnesium hydroxide, aluminum hydroxide, calcium hydroxide, barium hydroxide, zinc hydroxide, Kismer 5A (magnesium hydroxide: manufactured by Kyowa Chemical Industry Co., Ltd.) and the like.
上記リン酸エステル系難燃剤としては、例えば、トリメチルホスフェート、トリエチルホスフェート、トリブチルホスフェート、トリブトキシエチルホスフェート、トリスクロロエチルホスフェート、トリスジクロロプロピルホスフェート、トリフェニルホスフェート、トリクレジルホスフェート、クレジルジフェニルホスフェート、トリキシレニルホスフェート、オクチルジフェニルホスフェート、キシレニルジフェニルホスフェート、トリスイソプロピルフェニルホスフェート、2−エチルヘキシルジフェニルホスフェート、t−ブチルフェニルジフェニルホスフェート、ビス−(t−ブチルフェニル)フェニルホスフェート、トリス−(t−ブチルフェニル)ホスフェート、イソプロピルフェニルジフェニルホスフェート、ビス−(イソプロピルフェニル)ジフェニルホスフェート、トリス−(イソプロピルフェニル)ホスフェート等が挙げられる。 Examples of the phosphate ester flame retardant include, for example, trimethyl phosphate, triethyl phosphate, tributyl phosphate, tributoxyethyl phosphate, trischloroethyl phosphate, trisdichloropropyl phosphate, triphenyl phosphate, tricresyl phosphate, cresyl diphenyl phosphate, Trixylenyl phosphate, octyl diphenyl phosphate, xylenyl diphenyl phosphate, trisisopropylphenyl phosphate, 2-ethylhexyl diphenyl phosphate, t-butylphenyl diphenyl phosphate, bis- (t-butylphenyl) phenyl phosphate, tris- (t-butyl Phenyl) phosphate, isopropylphenyldiphenylphosphate, bis- (i Propyl phenyl) diphenyl phosphate, tris - (isopropylphenyl) phosphate, and the like.
上記縮合リン酸エステル系難燃剤の例としては、1,3−フェニレンビス(ジフェニルホスフェート)、1,3−フェニレンビス(ジキシレニルホスフェート)、ビスフェノールAビス(ジフェニルホスフェート)等が挙げられる。 Examples of the condensed phosphate ester flame retardant include 1,3-phenylene bis (diphenyl phosphate), 1,3-phenylene bis (dixylenyl phosphate), bisphenol A bis (diphenyl phosphate), and the like.
上記(ポリ)リン酸塩系難燃剤の例としては、ポリリン酸アンモニウム、ポリリン酸メラミン、ポリリン酸ピペラジン、ピロリン酸メラミン、ピロリン酸ピペラジン等の(ポリ)リン酸のアンモニウム塩やアミン塩が挙げられる。 Examples of the (poly) phosphate flame retardant include ammonium salts and amine salts of (poly) phosphoric acid such as ammonium polyphosphate, melamine polyphosphate, piperazine polyphosphate, melamine pyrophosphate, and piperazine pyrophosphate. .
その他の無機系難燃助剤としては、例えば、酸化チタン、酸化アルミニウム、酸化マグネシウム、ハイドロタルサイト、モンモリロナイト等の無機化合物、およびその表面処理品が挙げられ、例えば、TIPAQUE R−680(酸化チタン:石原産業(株)製)、キョーワマグ150(酸化マグネシウム:協和化学工業(株)製)、DHT−4A(ハイドロタルサイト:協和化学工業(株)製)、アルカマイザー4(亜鉛変性ハイドロタルサイト:協和化学工業(株)製)等の種々の市販品を用いることができる。また、その他の有機系難燃助剤としては、例えば、ペンタエリスリトールが挙げられる。 Examples of other inorganic flame retardant aids include inorganic compounds such as titanium oxide, aluminum oxide, magnesium oxide, hydrotalcite, montmorillonite, and surface-treated products thereof. For example, TIPAQUE R-680 (titanium oxide) : Ishihara Sangyo Co., Ltd.), Kyowa Mag 150 (magnesium oxide: Kyowa Chemical Industry Co., Ltd.), DHT-4A (Hydrotalcite: Kyowa Chemical Industry Co., Ltd.), Alkamizer 4 (Zinc-modified hydrotalcite) : Kyowa Chemical Industry Co., Ltd.) and other commercially available products can be used. Examples of other organic flame retardant aids include pentaerythritol.
その他、本発明の樹脂組成物には、必要に応じて、通常合成樹脂に使用される添加剤、例えば、架橋剤、防曇剤、プレートアウト防止剤、表面処理剤、可塑剤、滑剤、難燃剤、蛍光剤、防黴剤、殺菌剤、発泡剤、金属不活性剤、離型剤、顔料、加工助剤、酸化防止剤、光安定剤等を、本発明の効果を損なわない範囲で配合することができる。 In addition, in the resin composition of the present invention, additives that are usually used in synthetic resins, for example, crosslinking agents, antifogging agents, plate-out preventing agents, surface treatment agents, plasticizers, lubricants, difficulty, etc. Blends flame retardants, fluorescent agents, fungicides, bactericides, foaming agents, metal deactivators, mold release agents, pigments, processing aids, antioxidants, light stabilizers, etc., within the range that does not impair the effects of the present invention. can do.
本発明の樹脂組成物に配合される添加剤は、熱可塑性樹脂等の合成樹脂に直接添加してもよく、本発明の組成物に配合してから、熱可塑性樹脂等の合成樹脂に添加してもよい。 The additive blended in the resin composition of the present invention may be added directly to a synthetic resin such as a thermoplastic resin, or may be blended into the composition of the present invention and then added to a synthetic resin such as a thermoplastic resin. May be.
本発明の樹脂組成物、好ましくは熱可塑性樹脂を使用した樹脂組成物を成形することにより、成形体を得ることができる。成形方法としては、特に限定されるものではなく、押出加工、カレンダー加工、射出成形、ロール、圧縮成形、ブロー成形、回転成形等が挙げられ、樹脂板、シート、フィルム、ボトル、繊維、異形品等の種々の形状の成形品が製造できる。 A molded body can be obtained by molding the resin composition of the present invention, preferably a resin composition using a thermoplastic resin. The molding method is not particularly limited, and examples thereof include extrusion processing, calendar processing, injection molding, roll, compression molding, blow molding, rotational molding, and the like. Resin plate, sheet, film, bottle, fiber, irregular shape product Various shaped products such as these can be manufactured.
本発明の樹脂組成物により得られる成形体は、静電気が発生しにくく、静電気による表面の汚染や埃の付着による商品価値の下落を生じにくい成形体である。また、本発明の樹脂組成物により得られる成形体は、帯電防止性とその持続性に優れ、優れた物性を有する。 The molded product obtained from the resin composition of the present invention is a molded product that is less prone to static electricity and is less likely to cause a decline in commercial value due to surface contamination and dust adhesion due to static electricity. Moreover, the molded object obtained by the resin composition of this invention is excellent in antistatic property and its sustainability, and has the outstanding physical property.
本発明の樹脂組成物により得られる成形体の中でも、特にフィルムは、帯電防止性とその持続性に優れ、フィルムの透明性、引張破断強度および破断伸び率等のフィルム物性に優れるため好ましい。これらフィルムは、静電気が発生しにくく、静電気による表面の汚染や埃の付着による商品価値の下落を生じにくく、さらに強度等の物性に優れたフィルムである。そのため、電気・電子部品、電気・電子製品、精密部品、精密機器等の包装材等に好適である。 Among the molded articles obtained by the resin composition of the present invention, a film is particularly preferable because it is excellent in antistatic properties and durability, and excellent in film physical properties such as film transparency, tensile breaking strength, and elongation at break. These films are less likely to generate static electricity, are less likely to cause a drop in commercial value due to surface contamination or dust adhesion due to static electricity, and are excellent in physical properties such as strength. Therefore, it is suitable for packaging materials for electrical / electronic parts, electrical / electronic products, precision parts, precision equipment, and the like.
また、本発明の樹脂組成物により得られる成形体は、充填剤が配合された力学特性が向上した成形体や、熱可塑性エラストマーが配合され耐衝撃性を改善させた成形体においても、静電気が発生しにくく、静電気による表面の汚染や埃の付着による商品価値の下落を生じにくい成形体である。そのため、力学特性や耐衝撃性を必要とする自動車内外装材に好ましく用いられる。 In addition, the molded product obtained from the resin composition of the present invention has static electricity even in a molded product with improved mechanical properties blended with a filler and a molded product with improved impact resistance blended with a thermoplastic elastomer. It is a molded body that is less likely to occur and is less likely to cause a decline in commercial value due to surface contamination and dust adhesion due to static electricity. Therefore, it is preferably used for automobile interior / exterior materials that require mechanical properties and impact resistance.
本発明の樹脂組成物およびこれを用いた成形体は、電気・電子・通信、農林水産、鉱業、建設、食品、繊維、衣類、医療、石炭、石油、ゴム、皮革、自動車、精密機器、木材、建材、土木、家具、印刷、楽器等の幅広い産業分野に使用できる。 The resin composition of the present invention and a molded article using the resin composition are electrical / electronic / communication, agriculture, forestry and fisheries, mining, construction, food, textile, clothing, medical treatment, coal, petroleum, rubber, leather, automobile, precision equipment, wood It can be used in a wide range of industrial fields such as building materials, civil engineering, furniture, printing and musical instruments.
より具体的には、本発明の樹脂組成物およびその成形体は、プリンター、パソコン、ワープロ、キーボード、PDA(小型情報端末機)、電話機、複写機、ファクシミリ、ECR(電子式金銭登録機)、電卓、電子手帳、カード、ホルダー、文具等の事務、OA機器、洗濯機、冷蔵庫、掃除機、電子レンジ、照明器具、ゲーム機、アイロン、コタツ等の家電機器、TV、VTR、ビデオカメラ、ラジカセ、テープレコーダー、ミニディスク、CDプレーヤー、スピーカー、液晶ディスプレー等のAV機器、コネクター、リレー、コンデンサー、スイッチ、プリント基板、コイルボビン、半導体封止材料、LED封止材料、電線、ケーブル、トランス、偏向ヨーク、分電盤、時計等の電気・電子部品および通信機器、自動車用内外装材、電気部品容器、電子部品容器、製版用フィルム、粘着フィルム、ボトル、食品用容器、食品包装用フィルム、製薬・医薬用ラップフィルム、製品包装フィルム、農業用フィルム、農業用シート、温室用フィルム、電子部品包装用フィルム、電気部品包装用フィルム、電子機器包装用フィルム、電気製品包装用フィルム、精密部品包装用フィルム、精密機器包装用フィルム等の用途に用いられる。 More specifically, the resin composition of the present invention and the molded product thereof are a printer, a personal computer, a word processor, a keyboard, a PDA (small information terminal), a telephone, a copying machine, a facsimile, an ECR (electronic cash register), Calculator, electronic notebook, card, holder, office supplies such as stationery, OA equipment, washing machine, refrigerator, vacuum cleaner, microwave oven, lighting equipment, game machine, iron, kotatsu and other household appliances, TV, VTR, video camera, radio cassette , AV equipment such as tape recorders, mini-discs, CD players, speakers, liquid crystal displays, connectors, relays, capacitors, switches, printed circuit boards, coil bobbins, semiconductor sealing materials, LED sealing materials, electric wires, cables, transformers, deflection yokes , Electrical and electronic parts such as distribution boards and watches, communication equipment, automotive interior and exterior materials, electrical parts Container, electronic component container, plate-making film, adhesive film, bottle, food container, food packaging film, pharmaceutical / pharmaceutical wrap film, product packaging film, agricultural film, agricultural sheet, greenhouse film, electronic component packaging Film, electrical component packaging film, electronic device packaging film, electrical product packaging film, precision component packaging film, precision device packaging film, and the like.
さらに、本発明の樹脂組成物およびその成形体は、座席(詰物、表地等)、ベルト、天井張り、コンパーチブルトップ、アームレスト、ドアトリム、リアパッケージトレイ、カーペット、マット、サンバイザー、ホイルカバー、マットレスカバー、エアバック、絶縁材、吊り手、吊り手帯、電線被覆材、電気絶縁材、塗料、コーティング材、上張り材、床材、隅壁、カーペット、壁紙、壁装材、外装材、内装材、屋根材、デッキ材、壁材、柱材、敷板、塀の材料、骨組および繰形、窓およびドア形材、こけら板、羽目、テラス、バルコニー、防音板、断熱板、窓材等の自動車、車両、船舶、航空機、建物、住宅および建築用材料や土木材料、衣料、カーテン、シーツ、不織布、合板、合繊板、絨毯、玄関マット、シート、バケツ、ホース、容器、眼鏡、鞄、ケース、ゴーグル、スキー板、ラケット、テント、楽器等の生活用品、スポーツ用品等の各種用途に使用することができる。 Further, the resin composition of the present invention and the molded product thereof are a seat (filling, outer material, etc.), belt, ceiling, compatible top, armrest, door trim, rear package tray, carpet, mat, sun visor, foil cover, mattress cover. , Airbags, insulation materials, suspension hands, suspension straps, wire coating materials, electrical insulation materials, paints, coating materials, upholstery materials, flooring materials, corner walls, carpets, wallpaper, wall covering materials, exterior materials, interior materials , Roofing materials, deck materials, wall materials, pillar materials, floorboards, fence materials, frames and repetitive shapes, window and door shapes, slabs, plaids, terraces, balconies, soundproofing plates, heat insulating plates, window materials, etc. Automobiles, vehicles, ships, aircraft, buildings, housing and construction materials and civil engineering materials, clothing, curtains, sheets, non-woven fabrics, plywood, synthetic fiber boards, carpets, doormats, sheets, buckets, hoses, containers , It is possible to use glasses, bags, cases, goggles, skis, rackets, tents, household goods of musical instruments, etc., in various applications such as sporting goods.
これらの中でも、本発明の樹脂組成物およびこれを用いたフィルムは、電子部品包装用フィルム、電気部品包装用フィルム、電子機器包装用フィルム、電気製品包装用フィルム、精密部品包装用フィルム、精密機器包装用フィルム等に好ましく用いられる。 Among these, the resin composition of the present invention and a film using the resin composition are a film for packaging electronic parts, a film for packaging electrical parts, a film for packaging electronic equipment, a film for packaging electrical products, a film for packaging precision parts, and a precision instrument. It is preferably used for packaging films and the like.
また、本発明の樹脂組成物およびこれを用いた成形体は、特に、自動車内外装材、自動車内外装部品に好ましく用いられる。 In addition, the resin composition of the present invention and a molded body using the resin composition are particularly preferably used for automotive interior / exterior materials and automotive interior / exterior parts.
自動車内装部品の例を挙げると、インストルメントパネル、ドアトリムパネル、ピラートリム、ドアトリム、ピラーガーニッシュ、パッケージトレイ、リアトレイ、コンソールボックス等が挙げられ、自動車外装部品の例を挙げると、バンパー、ラジエーターグリル、フロントグリル、フロントパネル、フェンダー、ピラー、ピラーカバー、ドアミラーステーカバー、グラスランチャンネル、ドアミラーハウジング、ランプハウジング、ホイールカバー、スポイラー、エアスポイラー、ウェザーストリップ、ウインドウモール、ベルトモール、サンルーフ、フロントエンドモジュール、ドアモジュール、バックドアモジュール、外板等が挙げられる。 Examples of automotive interior parts include instrument panels, door trim panels, pillar trims, door trims, pillar garnishes, package trays, rear trays, console boxes, etc. Examples of automotive exterior parts include bumpers, radiator grills, front Grill, front panel, fender, pillar, pillar cover, door mirror stay cover, glass run channel, door mirror housing, lamp housing, wheel cover, spoiler, air spoiler, weather strip, window molding, belt molding, sunroof, front end module, door module , Back door modules, outer plates and the like.
以下、本発明を、実施例を用いてさらに詳細に説明するが、本発明はこれらに限定されるものではない。なお、以下の実施例等において、「%」、「ppm」および「部」は、特に記載がない限り、質量基準である。 EXAMPLES Hereinafter, although this invention is demonstrated further in detail using an Example, this invention is not limited to these. In the following examples and the like, “%”, “ppm” and “parts” are based on mass unless otherwise specified.
下記の製造例に従い、本発明の組成物の(X)成分である高分子化合物(E)を製造した。(Y)成分である無水マレイン酸変性ポリオレフィンは、下記市販品を使用した。なお、下記の製造例において、無水マレイン酸変性ポリオレフィンの重量平均分子量は、下記<分子量測定方法1>で測定し、それ以外の数平均分子量は、下記<分子量測定方法2>で測定した。また、無水マレイン酸変性ポリオレフィンの酸価は、下記<酸価測定方法>で測定した。 In accordance with the following production example, a polymer compound (E) which is the component (X) of the composition of the present invention was produced. As the maleic anhydride-modified polyolefin as the component (Y), the following commercially available products were used. In the following production examples, the weight average molecular weight of the maleic anhydride-modified polyolefin was measured by the following <Molecular weight measuring method 1>, and the other number average molecular weights were measured by the following <Molecular weight measuring method 2>. Moreover, the acid value of the maleic anhydride-modified polyolefin was measured by the following <Acid Value Measuring Method>.
<分子量測定方法1>
本発明における重量平均分子量(以下、「Mw」とも称する)の測定条件は以下の通りである。
装置 :高温ゲルパーミエイションクロマトグラフ
[「Viscotek HT−GPC スペクトリス(株)製」]
溶媒 :オルトジクロロベンゼン
基準物質 :ポリスチレン
検出器 :屈折率検出器,
カラム固定相 :TSKgel GMHHR−HHT 2本直列「東ソー株式会社製」
カラム温度 :140℃
サンプル濃度 :3mg/1mL
流量 :1.0mL/min.
注入量 :100μL
<Molecular weight measuring method 1>
The measurement conditions of the weight average molecular weight (hereinafter also referred to as “Mw”) in the present invention are as follows.
Apparatus: High-temperature gel permeation chromatograph
["Viscotek HT-GPC Spectris Co., Ltd."]
Solvent: Orthodichlorobenzene reference material: Polystyrene detector: Refractive index detector,
Column stationary phase: TSKgel GMHHR-HHT 2 series "Tosoh Corporation"
Column temperature: 140 ° C
Sample concentration: 3mg / 1mL
Flow rate: 1.0 mL / min.
Injection volume: 100 μL
<分子量測定方法2>
数平均分子量(以下、「Mn」とも称する)は、ゲルパーミエーションクロマトグラフィー(GPC)法によって測定した。Mnの測定条件は以下の通りである。
装置 :日本分光(株)製GPC装置,
溶媒 :テトラヒドロフラン
基準物質 :ポリスチレン
検出器 :示差屈折計(RI検出器),
カラム固定相 :昭和電工(株)製Shodex KF−804L
カラム温度 :40℃
サンプル濃度 :1mg/1mL
流量 :0.8mL/min.
注入量 :100μL
<Molecular weight measuring method 2>
The number average molecular weight (hereinafter also referred to as “Mn”) was measured by a gel permeation chromatography (GPC) method. The measurement conditions for Mn are as follows.
Apparatus: GPC apparatus manufactured by JASCO Corporation,
Solvent: Tetrahydrofuran reference material: Polystyrene detector: Differential refractometer (RI detector),
Column stationary phase: Shodex KF-804L manufactured by Showa Denko K.K.
Column temperature: 40 ° C
Sample concentration: 1 mg / 1 mL
Flow rate: 0.8 mL / min.
Injection volume: 100 μL
<酸価測定方法>
(i)140℃に加熱したキシレン70mLに酸無水物変性ポリオレフィン1gを溶解させる。
(ii)同温度でフェノールフタレインを指示薬として、0.1mol/L水酸化カリウムエタノール溶液[商品名「0.1mol/Lエタノール性水酸化カリウム溶液」、和光純薬(株)製]で滴定を行う。
(iii)滴定に要した水酸化カリウム量をmgに換算して酸価(単位:mgKOH/g)を算出する。
<Method for measuring acid value>
(I) 1 g of acid anhydride-modified polyolefin is dissolved in 70 mL of xylene heated to 140 ° C.
(Ii) Titration with 0.1 mol / L potassium hydroxide ethanol solution [trade name “0.1 mol / L ethanolic potassium hydroxide solution”, manufactured by Wako Pure Chemical Industries, Ltd.] using phenolphthalein as an indicator at the same temperature. I do.
(Iii) The amount of potassium hydroxide required for titration is converted to mg, and the acid value (unit: mgKOH / g) is calculated.
〔製造例1〕(X)成分である高分子化合物(E)の合成
セパラブルフラスコに、1,4−シクロヘキサンジメタノールを656g、アジピン酸を708g、無水フタル酸を0.7g、酸化防止剤(テトラキス[3−(3,5−ジ第三ブチル−4−ヒドロキシフェニル)プロピオニルオキシメチル]メタン、アデカスタブAO−60(株)ADEKA製)を0.7g仕込み、160℃から210℃まで徐々に昇温しながら常圧で4時間、その後210℃、減圧下で3時間重合して、ポリエステル(a)−1を得た。
[Production Example 1] Synthesis of polymer compound (E) as component (X) In a separable flask, 656 g of 1,4-cyclohexanedimethanol, 708 g of adipic acid, 0.7 g of phthalic anhydride, antioxidant (Tetrakis [3- (3,5-ditert-butyl-4-hydroxyphenyl) propionyloxymethyl] methane, Adeka Stub AO-60 manufactured by ADEKA) was charged in an amount of 0.7 g and gradually from 160 ° C. to 210 ° C. While raising the temperature, polymerization was carried out at normal pressure for 4 hours, and then at 210 ° C. under reduced pressure for 3 hours to obtain polyester (a) -1.
次に、得られたポリエステル(a)−1を600g、両末端に水酸基を有する化合物(b)−1として数平均分子量4000、エチレンオキシ基の繰り返し単位の数=80のポリエチレングリコールを300g、酸化防止剤(アデカスタブAO−60)を0.5g、オクチル酸ジルコニウムを0.8g仕込み、210℃で7時間、減圧下で重合して、両末端にカルボキシル基を有する構造を有するブロックポリマー(C)−1を得た。この両末端にカルボキシル基を有する構造を有するブロックポリマー(C)−1の酸価は9、数平均分子量Mnはポリスチレン換算で12,000であった。 Next, 600 g of the obtained polyester (a) -1 and 300 g of polyethylene glycol having a number average molecular weight of 4000 and a number of repeating units of ethyleneoxy group = 80 as a compound (b) -1 having hydroxyl groups at both ends, oxidized. Block polymer (C) having 0.5 g of inhibitor (Adeka Stab AO-60) and 0.8 g of zirconium octylate, polymerized under reduced pressure at 210 ° C. for 7 hours, and having carboxyl groups at both ends -1 was obtained. The acid value of the block polymer (C) -1 having a structure having a carboxyl group at both ends was 9, and the number average molecular weight Mn was 12,000 in terms of polystyrene.
得られた両末端にカルボキシル基を有する構造を有するブロックポリマー(C)−1 360gに、エポキシ化合物(D)−1としてビスフェノールFジグリシジルエーテル(エポキシ当量170g/eq)6gを仕込み、240℃で3時間、減圧下で重合して、本発明の組成物に係る(X)成分である高分子化合物(E)−1を得た。 360 g of the obtained block polymer (C) -1 having a structure having a carboxyl group at both ends was charged with 6 g of bisphenol F diglycidyl ether (epoxy equivalent 170 g / eq) as epoxy compound (D) -1, at 240 ° C. Polymerization was performed under reduced pressure for 3 hours to obtain a polymer compound (E) -1 which is the component (X) according to the composition of the present invention.
(Y)成分
無水マレイン酸変性ポリプロピレン−1:酸価46.6、重量平均分子量80,000
無水マレイン酸変性ポリプロピレン−2:酸価9.5、重量平均分子量75,000
Component (Y) Maleic anhydride-modified polypropylene-1: Acid value 46.6, weight average molecular weight 80,000
Maleic anhydride-modified polypropylene-2: acid value 9.5, weight average molecular weight 75,000
<実施例1−1〜1−10および比較例1−1〜1−8>
〔実施例1−1〕
下記の表1に記載した配合量(質量部)に基づいて調整し、本発明の組成物1−1を得た。得られた組成物1−1を用いて、表2に記載した配合量(質量部)で調整して、実施例1−1の樹脂組成物を得た。得られたの樹脂組成物を用いて、下記に示す試験片−1の作成条件に従い、試験片を得た。得られた試験片を用いて、下記測定方法で表面抵抗率(SR値)を評価した。さらに、得られた試験片を用いて、下記条件で、Haze値、引張破断強度および破断伸び率を測定した。結果を表2に示す。
<Examples 1-1 to 1-10 and Comparative Examples 1-1 to 1-8>
[Example 1-1]
It adjusted based on the compounding quantity (mass part) described in following Table 1, and obtained the composition 1-1 of this invention. Using the obtained composition 1-1, it adjusted with the compounding quantity (mass part) described in Table 2, and obtained the resin composition of Example 1-1. Using the obtained resin composition, a test piece was obtained according to the conditions for preparing Test piece-1 shown below. Using the obtained test piece, the surface resistivity (SR value) was evaluated by the following measurement method. Furthermore, using the obtained test piece, the Haze value, tensile breaking strength, and breaking elongation were measured under the following conditions. The results are shown in Table 2.
〔実施例1−2〕
実施例1−1で得られた組成物1−1を用いて、表2に記載した配合量(質量部)で調整して、実施例1−2の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表2に併記する。
[Example 1-2]
Using the composition 1-1 obtained in Example 1-1, the resin composition of Example 1-2 was obtained by adjusting the blending amount (parts by mass) described in Table 2. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 2.
〔実施例1−3〕
実施例1−1で得られた組成物1−1を用いて、表2に記載した配合量(質量部)で調整して、実施例1−3の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表2に併記する。
[Example 1-3]
Using the composition 1-1 obtained in Example 1-1, the resin composition of Example 1-3 was obtained by adjusting the blending amount (parts by mass) described in Table 2. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 2.
〔実施例1−4〕
下記の表1に記載した配合量(質量部)に基づいて調整し、本発明の組成物1−2を得た。得られた組成物1−2を用いて、表2に記載した配合量(質量部)で調整して、実施例1−4の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表2に併記する。
[Example 1-4]
It adjusted based on the compounding quantity (mass part) described in following Table 1, and obtained the composition 1-2 of this invention. Using the obtained composition 1-2, it adjusted with the compounding quantity (mass part) described in Table 2, and obtained the resin composition of Example 1-4. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 2.
〔実施例1−5〕
下記の表1に記載した配合量(質量部)に基づいて調整し、本発明の組成物1−3を得た。得られた組成物1−3を用いて、表2に記載した配合量(質量部)で調整して、実施例1−5の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表2に併記する。
[Example 1-5]
It adjusted based on the compounding quantity (mass part) described in following Table 1, and obtained the composition 1-3 of this invention. Using the obtained composition 1-3, it adjusted with the compounding quantity (mass part) described in Table 2, and obtained the resin composition of Example 1-5. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 2.
〔実施例1−6〕
下記の表1に記載した配合量(質量部)に基づいて調整し、本発明の組成物1−4を得た。得られた組成物1−4を用いて、表3に記載した配合量(質量部)で調整して、実施例1−6の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表3に併記する。
[Example 1-6]
It adjusted based on the compounding quantity (mass part) described in following Table 1, and obtained the composition 1-4 of this invention. Using the obtained composition 1-4, it adjusted with the compounding quantity (mass part) described in Table 3, and obtained the resin composition of Example 1-6. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 3.
〔実施例1−7〕
下記の表1に記載した配合量(質量部)に基づいて調整し、本発明の組成物1−5を得た。得られた組成物1−5を用いて、表3に記載した配合量(質量部)で調整して、実施例1−7の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表3に併記する。
[Example 1-7]
It adjusted based on the compounding quantity (mass part) described in following Table 1, and obtained the composition 1-5 of this invention. Using the obtained composition 1-5, it adjusted with the compounding quantity (mass part) described in Table 3, and obtained the resin composition of Example 1-7. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 3.
〔実施例1−8〕
実施例1−1で得られた組成物1−1を用いて、表3に記載した配合量(質量部)で調整して、実施例1−8の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表3に併記する。
[Example 1-8]
Using the composition 1-1 obtained in Example 1-1, the resin composition of Example 1-8 was obtained by adjusting the blending amount (parts by mass) described in Table 3. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 3.
〔実施例1−9〕
実施例1−1で得られた組成物1−1を用いて、表3に記載した配合量(質量部)で調整して、実施例1−9の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表3に併記する。
[Example 1-9]
Using the composition 1-1 obtained in Example 1-1, the resin composition of Example 1-9 was obtained by adjusting the blending amount (parts by mass) described in Table 3. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 3.
〔実施例1−10〕
実施例1−1で得られた組成物1−1を用いて、表3に記載した配合量(質量部)で調整して、実施例1−10の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表3に併記する。
[Example 1-10]
Using the composition 1-1 obtained in Example 1-1, the resin composition of Example 1-10 was obtained by adjusting the blending amount (parts by mass) described in Table 3. Using the obtained resin composition, a test piece was obtained in the same manner as in Example 1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 3.
〔比較例1−1〕
下記の表1に記載した配合量(質量部)に基づいて調整し、比較組成物1−1を得た。得られた比較組成物1−1を用いて、表4に記載した配合量(質量部)で調整して、比較例1−1の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表4に併記する。
[Comparative Example 1-1]
It adjusted based on the compounding quantity (mass part) described in following Table 1, and obtained the comparative composition 1-1. Using the obtained Comparative Composition 1-1, the resin composition of Comparative Example 1-1 was obtained by adjusting the blending amount (parts by mass) described in Table 4. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 4.
〔比較例1−2〕
比較例1−1で得られた比較組成物1−1を用いて、表4に記載した配合量(質量部)で調整して、比較例1−2の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表4に併記する。
[Comparative Example 1-2]
Using the comparative composition 1-1 obtained in Comparative Example 1-1, the resin composition of Comparative Example 1-2 was obtained by adjusting the blending amount (parts by mass) described in Table 4. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 4.
〔比較例1−3〕
比較帯電防止剤として、ポリエーテルエステルアミド系帯電防止剤(BASF社製、商品名イルガスタットP−18)を、表4に記載した配合量(質量部)で調整して、比較例1−3の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表4に併記する。
[Comparative Example 1-3]
As a comparative antistatic agent, a polyether ester amide type antistatic agent (manufactured by BASF, trade name: Irgastat P-18) was adjusted with the blending amount (parts by mass) shown in Table 4, and Comparative Example 1-3 was used. A resin composition was obtained. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 4.
〔比較例1−4〕
比較帯電防止剤として、ポリエーテルエステルアミド系帯電防止剤(BASF社製、商品名イルガスタットP−18)を、表4に記載した配合量(質量部)で調整して、比較例1−4の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表4に併記する。
[Comparative Example 1-4]
As a comparative antistatic agent, a polyether ester amide type antistatic agent (manufactured by BASF, trade name: Irgastat P-18) was adjusted with the blending amount (parts by mass) shown in Table 4, and Comparative Example 1-4 was used. A resin composition was obtained. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 4.
〔比較例1−5〕
比較例1−1で得られた比較組成物1−1を用いて、表4に記載した配合量(質量部)で調整して、比較例1−5の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表4に併記する。
[Comparative Example 1-5]
Using the comparative composition 1-1 obtained in Comparative Example 1-1, the resin composition of Comparative Example 1-5 was obtained by adjusting the blending amount (parts by mass) described in Table 4. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 4.
〔比較例1−6〕
比較例1−1で得られた比較組成物1−1を用いて、表5に記載した配合量(質量部)で調整して、比較例1−6の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表5に併記する。
[Comparative Example 1-6]
Using the comparative composition 1-1 obtained in Comparative Example 1-1, the resin composition of Comparative Example 1-6 was obtained by adjusting the blending amount (parts by mass) described in Table 5. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 5.
〔比較例1−7〕
下記の表1に記載した配合量(質量部)に基づいて調整し、比較組成物1−2を得た。得られた比較組成物1−2を用いて、表5に記載した配合量(質量部)で調整して、比較例1−7の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表5に併記する。
[Comparative Example 1-7]
It adjusted based on the compounding quantity (mass part) described in following Table 1, and obtained the comparison composition 1-2. Using the obtained Comparative Composition 1-2, the resin composition of Comparative Example 1-7 was obtained by adjusting the blending amount (parts by mass) described in Table 5. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 5.
〔比較例1−8〕
比較例1−7で得られた比較組成物1−2を用いて、表5に記載した配合量(質量部)で調整して、比較例1−8の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例1−1と同様にして試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表5に併記する。
[Comparative Example 1-8]
Using Comparative Composition 1-2 obtained in Comparative Example 1-7, the resin composition of Comparative Example 1-8 was obtained by adjusting the blending amount (parts by mass) described in Table 5. A test piece was obtained using the obtained resin composition in the same manner as in Example 1-1. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 5.
<樹脂組成物の試験片−1の作成条件>
各樹脂組成物を、(株)池貝製の2軸押出機(PCM30,60mesh入り)を用いて、200℃、7kg/時間の条件で造粒し、ペレットを得た。得られたペレットを用いて、(株)東洋精機製作所製Tダイキャストフィルム成形機(押出機:単軸D2020 ; Tダイ:T150C)にて、厚さ100μmのキャストフィルムを作成した。作成したフィルムを用いて、下記測定方法で、表面抵抗率(SR値)、Haze値、引張破断強度および破断伸び率を測定した。
<Conditions for preparing test piece-1 of resin composition>
Each resin composition was granulated under the conditions of 200 ° C. and 7 kg / hour using a twin screw extruder (PCM30, 60 mesh contained) manufactured by Ikegai Co., Ltd. to obtain pellets. Using the obtained pellets, a cast film having a thickness of 100 μm was prepared with a T-die cast film molding machine (extruder: single-axis D2020; T-die: T150C) manufactured by Toyo Seiki Seisakusho. Using the prepared film, surface resistivity (SR value), Haze value, tensile breaking strength and breaking elongation were measured by the following measuring methods.
<表面抵抗率(SR値)の測定>
得られた試験片を、成形加工後直ちに、温度25℃、湿度50%RHの条件下に保存し、成形加工の1日および30日保存後に、同雰囲気下で、アドバンテスト社製のR8340抵抗計を用いて、印加電圧500V、印加時間1分の条件で、表面抵抗率(Ω/□)を測定した。測定は5枚の試験片で1枚あたり5点について行い、その平均値を求めた。
<Measurement of surface resistivity (SR value)>
Immediately after molding, the obtained test piece was stored under conditions of a temperature of 25 ° C. and a humidity of 50% RH. After storage for 1 day and 30 days of molding, the R8340 resistance meter manufactured by Advantest was used in the same atmosphere. Was used to measure the surface resistivity (Ω / □) under the conditions of an applied voltage of 500 V and an applied time of 1 minute. The measurement was performed on five test pieces at five points per sheet, and the average value was obtained.
<Haze値の測定>
ISO14782に準拠して測定した。
<Measurement of Haze value>
Measurement was performed in accordance with ISO14782.
<引張破断強度および破断伸び率の測定>
ISO527−3に準拠して測定し、測定する際の速度は200mm/minとした。
<Measurement of tensile strength at break and elongation at break>
It measured based on ISO527-3 and the speed | rate at the time of measuring was 200 mm / min.
※2:無水マレイン酸変性ポリプロピレン−1(酸価46.6、重量平均分子量80,000)
※3:ドデシルベンゼンスルホン酸ナトリウム
* 2: Maleic anhydride modified polypropylene-1 (acid value 46.6, weight average molecular weight 80,000)
* 3: Sodium dodecylbenzenesulfonate
※5:日本ポリプロ株式会社製 ノバテックFB3B(メルトフローレート=7.5g/10min)
※6:日本ポリエチレン株式会社製 ノバテックUF942(メルトフローレート=2.1g/10min)
* 5: Novatec FB3B manufactured by Nippon Polypro Co., Ltd. (melt flow rate = 7.5 g / 10 min)
* 6: Novatec UF942 manufactured by Nippon Polyethylene Co., Ltd. (melt flow rate = 2.1 g / 10 min)
<実施例2−1〜2−10および比較例2−1〜2−6>
〔実施例2−1〕
下記の表6に記載した配合量(質量部)に基づいて調整し、本発明の組成物2−1を得た。得られた組成物2−1を用いて、表7に記載した配合量(質量部)で調整して、実施例2−1の樹脂組成物を得た。得られた樹脂組成物を用いて、下記に示す試験片作成条件−2に従い、試験片を得た。得られた試験片を用いて、実施例1−1と同様に評価を行った。結果を表7に併記する。
<Examples 2-1 to 2-10 and Comparative Examples 2-1 to 2-6>
[Example 2-1]
It adjusted based on the compounding quantity (mass part) described in following Table 6, and obtained the composition 2-1 of this invention. Using the obtained composition 2-1, it adjusted with the compounding quantity (mass part) described in Table 7, and obtained the resin composition of Example 2-1. Using the obtained resin composition, a test piece was obtained according to the test piece preparation condition-2 shown below. Evaluation was performed in the same manner as in Example 1-1 using the obtained test piece. The results are also shown in Table 7.
〔実施例2−2〕
実施例2−1で得られた組成物2−1を用いて、表7に記載した配合量(質量部)で調整して、実施例2−2の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表7に併記する。
[Example 2-2]
Using the composition 2-1 obtained in Example 2-1, the resin composition of Example 2-2 was obtained by adjusting the blending amount (parts by mass) described in Table 7. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 7.
〔実施例2−3〕
実施例2−1で得られた組成物2−1を用いて、表7に記載した配合量(質量部)で調整して、実施例2−3の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表7に併記する。
[Example 2-3]
Using the composition 2-1 obtained in Example 2-1, the resin composition of Example 2-3 was obtained by adjusting the blending amount (parts by mass) described in Table 7. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 7.
〔実施例2−4〕
下記の表6に記載した配合量(質量部)に基づいて調整し、本発明の組成物2−2を得た。得られた組成物2−2を用いて、表7に記載した配合量(質量部)で調整して、実施例2−4の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表6に併記する。
[Example 2-4]
It adjusted based on the compounding quantity (mass part) described in following Table 6, and obtained the composition 2-2 of this invention. Using the obtained composition 2-2, the resin composition of Example 2-4 was obtained by adjusting the blending amount (parts by mass) described in Table 7. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 6.
〔実施例2−5〕
下記の表6に記載した配合量(質量部)に基づいて調整し、本発明の組成物2−3を得た。得られた組成物2−3を用いて、表7に記載した配合量(質量部)で調整して、実施例2−5の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表7に併記する。
[Example 2-5]
It adjusted based on the compounding quantity (mass part) described in the following Table 6, and obtained the composition 2-3 of this invention. Using the obtained composition 2-3, the resin composition of Example 2-5 was obtained by adjusting the blending amount (parts by mass) described in Table 7. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 7.
〔実施例2−6〕
下記の表6に記載した配合量(質量部)に基づいて調整し、本発明の組成物2−4を得た。得られた組成物2−4を用いて、表8に記載した配合量(質量部)で調整して、実施例2−6の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表8に併記する。
[Example 2-6]
It adjusted based on the compounding quantity (mass part) described in following Table 6, and obtained the composition 2-4 of this invention. Using the obtained composition 2-4, it adjusted with the compounding quantity (mass part) described in Table 8, and obtained the resin composition of Example 2-6. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 8.
〔実施例2−7〕
下記の表6に記載した配合量(質量部)に基づいて調整し、本発明の組成物2−5を得た。得られた組成物2−5を用いて、表8に記載した配合量(質量部)で調整して、実施例2−7の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表8に併記する。
[Example 2-7]
It adjusted based on the compounding quantity (mass part) described in following Table 6, and obtained the composition 2-5 of this invention. Using the obtained composition 2-5, it adjusted with the compounding quantity (mass part) described in Table 8, and obtained the resin composition of Example 2-7. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 8.
〔実施例2−8〕
実施例2−1で得られた組成物2−1を用いて、表8に記載した配合量(質量部)で調整して、実施例2−8の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表8に併記する。
[Example 2-8]
The composition 2-1 obtained in Example 2-1 was used to adjust the blending amount (parts by mass) described in Table 8 to obtain a resin composition of Example 2-8. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 8.
〔実施例2−9〕
実施例2−1で得られた組成物2−1を用いて、表8に記載した配合量(質量部)で調整して、実施例2−9の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表8に併記する。
[Example 2-9]
Using the composition 2-1 obtained in Example 2-1, the resin composition of Example 2-9 was obtained by adjusting the blending amount (parts by mass) described in Table 8. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 8.
〔実施例2−10〕
実施例2−1で得られた組成物2−1を用いて、表8に記載した配合量(質量部)で調整して、実施例2−10の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表8に併記する。
[Example 2-10]
Using the composition 2-1 obtained in Example 2-1, the resin composition of Example 2-10 was obtained by adjusting the blending amount (parts by mass) described in Table 8. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 8.
〔比較例2−1〕
下記の表6に記載した配合量(質量部)に基づいて調整し、比較組成物2−1を得た。得られた比較組成物2−1を用いて、表9に記載した配合量(質量部)で調整して、比較例2−1の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表9に併記する。
[Comparative Example 2-1]
It adjusted based on the compounding quantity (mass part) described in the following Table 6, and obtained the comparative composition 2-1. Using the obtained comparative composition 2-1, the resin composition of Comparative Example 2-1 was obtained by adjusting the blending amount (parts by mass) described in Table 9. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 9.
〔比較例2−2〕
比較例2−1で得られた比較組成物2−1を用いて、表9に記載した配合量(質量部)で調整して、比較例2−2の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表9に併記する。
[Comparative Example 2-2]
Using the comparative composition 2-1 obtained in Comparative Example 2-1, the resin composition of Comparative Example 2-2 was obtained by adjusting the blending amount (parts by mass) described in Table 9. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 9.
〔比較例2−3〕
比較帯電防止剤として、ポリエーテルエステルアミド系帯電防止剤(BASF社製、商品名イルガスタットP−18)を、表9に記載した配合量(質量部)で調整して、比較例2−2の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表9に併記する。
[Comparative Example 2-3]
As a comparative antistatic agent, a polyether ester amide type antistatic agent (manufactured by BASF, trade name: Irgastat P-18) was adjusted with the blending amount (part by mass) shown in Table 9, and Comparative Example 2-2 was prepared. A resin composition was obtained. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 9.
〔比較例2−4〕
比較帯電防止剤として、ポリエーテルエステルアミド系帯電防止剤(BASF社製、商品名イルガスタットP−18)を、表9に記載した配合量(質量部)で調整して、比較例2−4の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表9に併記する。
[Comparative Example 2-4]
As a comparative antistatic agent, a polyether ester amide type antistatic agent (manufactured by BASF, trade name: Irgastat P-18) was adjusted with a blending amount (part by mass) shown in Table 9, and Comparative Example 2-4 A resin composition was obtained. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 9.
〔比較例2−5〕
下記の表6に記載した配合量(質量部)に基づいて調整し、比較組成物2−2を得た。得られた比較組成物2−2を用いて、表9に記載した配合量(質量部)で調整して、比較例2−5の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表9に併記する。
[Comparative Example 2-5]
It adjusted based on the compounding quantity (mass part) described in following Table 6, and comparative composition 2-2 was obtained. Using the obtained Comparative Composition 2-2, the resin composition of Comparative Example 2-5 was obtained by adjusting the blending amount (parts by mass) described in Table 9. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 9.
〔比較例2−6〕
比較例2−1で得られた比較組成物2−1を用いて、表9に記載した配合量(質量部)で調整して、比較例2−6の樹脂組成物を得た。得られた樹脂組成物を用いて、実施例2−1と同様にして試験片を得た。得られた試験片を用いて、実施例2−1と同様に評価を行った。結果を表9に併記する。
[Comparative Example 2-6]
Using the comparative composition 2-1 obtained in Comparative Example 2-1, the resin composition of Comparative Example 2-6 was obtained by adjusting the blending amount (parts by mass) described in Table 9. A test piece was obtained using the obtained resin composition in the same manner as in Example 2-1. Evaluation was performed in the same manner as in Example 2-1, using the obtained test piece. The results are also shown in Table 9.
<樹脂組成物試験片作成条件−2>
樹脂組成物を、(株)池貝製の2軸押出機(PCM30,60mesh入り)を用いて、200℃、7kg/時間の条件で造粒し、ペレットを得た。得られたペレットを、横型射出成形機(NEX80:日精樹脂工業(株)製)を用い、樹脂温度200℃、金型温度40℃の加工条件で成形し、表面抵抗率の試験片(100mm×100mm×3mm)と、曲げ弾性率、シャルピー衝撃強度および熱変形温度の試験片(80mm×10mm×4mm)を得た。
<Resin composition test piece preparation condition-2>
The resin composition was granulated under the conditions of 200 ° C. and 7 kg / hour using a twin screw extruder (PCM30, 60 mesh included) manufactured by Ikegai Co., Ltd. to obtain pellets. The obtained pellets were molded using a horizontal injection molding machine (NEX80: manufactured by Nissei Resin Co., Ltd.) under processing conditions of a resin temperature of 200 ° C. and a mold temperature of 40 ° C., and a surface resistivity test piece (100 mm × 100 mm × 3 mm) and test pieces (80 mm × 10 mm × 4 mm) of flexural modulus, Charpy impact strength and heat distortion temperature were obtained.
<表面抵抗率(SR値)測定方法>
得られた試験片を、成形加工後直ちに、温度25℃、湿度50%RHの条件下に保存し、成形加工の1日および30日保存後に、同雰囲気下で、アドバンテスト社製のR8340抵抗計を用いて、印加電圧500V、印加時間1分の条件で、表面抵抗率(Ω/□)を測定した。測定は5枚の試験片で1枚あたり5点について行い、その平均値を求めた。
<Method for measuring surface resistivity (SR value)>
Immediately after molding, the obtained test piece was stored under conditions of a temperature of 25 ° C. and a humidity of 50% RH. After storage for 1 day and 30 days of molding, the R8340 resistance meter manufactured by Advantest was used in the same atmosphere. Was used to measure the surface resistivity (Ω / □) under the conditions of an applied voltage of 500 V and an applied time of 1 minute. The measurement was performed on five test pieces at five points per sheet, and the average value was obtained.
<曲げ弾性率>
ISO178に準拠して測定した。
<Bending elastic modulus>
Measurement was performed in accordance with ISO178.
<シャルピー衝撃強度>
ISO179−1(ノッチ付)に準拠して測定した。
<Charpy impact strength>
It measured based on ISO179-1 (with notch).
<熱変形温度>
ISO75−2に準拠して測定した。
<Heat deformation temperature>
It measured based on ISO75-2.
※8:無水マレイン酸変性ポリプロピレン−2、酸価9.5、重量平均分子量75,000
※9:ドデシルベンゼンスルホン酸ナトリウム
* 8: Maleic anhydride modified polypropylene-2, acid value 9.5, weight average molecular weight 75,000
* 9: Sodium dodecylbenzenesulfonate
*11:日本ポリプロ株式会社製 ノバテックBC03B(メルトフローレート=30g/10min)
*12:タルク、松本産業株式会社製 商品名 ハイフィラーMY4000
*13:ポリオレフィン系熱可塑性エラストマー、Dow社製 商品名 ENGAGE 8842(エチレン−オクテン共重合体)
* 11: Novatec BC03B manufactured by Nippon Polypro Co., Ltd. (melt flow rate = 30 g / 10 min)
* 12: Talc, manufactured by Matsumoto Sangyo Co., Ltd. Trade name High Filler MY4000
* 13: Polyolefin thermoplastic elastomer, product name ENGAGE 8842 (ethylene-octene copolymer) manufactured by Dow
表2〜5より、本発明の組成物は、合成樹脂、特にポリオレフィン系樹脂に、優れた帯電防止効果とその持続性を付与することができ、透明性に優れ、引張破断強度および破断伸び率等の物性に優れるフィルムを得ることができることがわかる。これらフィルムは、静電気が発生しにくく、静電気による表面の汚染や埃の付着による商品価値の下落を生じにくく、さらに強度等の物性に優れたフィルムである。そのため、電気・電子部品、電気・電子製品、精密部品、精密機器等の包装材等に好適である。 From Tables 2 to 5, the composition of the present invention can impart an excellent antistatic effect and its durability to a synthetic resin, particularly a polyolefin resin, and has excellent transparency, tensile breaking strength and breaking elongation. It can be seen that a film having excellent physical properties can be obtained. These films are less likely to generate static electricity, are less likely to cause a drop in commercial value due to surface contamination or dust adhesion due to static electricity, and are excellent in physical properties such as strength. Therefore, it is suitable for packaging materials for electrical / electronic parts, electrical / electronic products, precision parts, precision equipment, and the like.
また、表7〜9より、本発明の組成物は、合成樹脂、特に充填剤、さらに熱可塑性エラストマーが配合された合成樹脂に、帯電防止効果とその持続性を付与することができ、曲げ弾性率、衝撃強度、熱変形温度等の力学特性に優れた成形体を得ることができることがわかる。これら成形体は、静電気が発生しにくく、静電気による表面の汚染や埃の付着による商品価値の下落を生じにくく、力学特性や耐衝撃性を必要とする自動車内外装材等に好適である。
Further, from Tables 7 to 9, the composition of the present invention can impart an antistatic effect and its durability to a synthetic resin, particularly a synthetic resin in which a filler and a thermoplastic elastomer are blended. It can be seen that a molded article excellent in mechanical properties such as rate, impact strength, and heat distortion temperature can be obtained. These molded articles are less likely to generate static electricity, are less likely to cause a decline in commercial value due to surface contamination due to static electricity and adhesion of dust, and are suitable for automobile interior and exterior materials that require mechanical properties and impact resistance.
Claims (14)
(X)成分が、ジオールとジカルボン酸とが反応して得られるポリエステル(a)と、エチレンオキシ基を一つ以上有する両末端に水酸基を有する化合物(b)と、エポキシ基を2個以上有するエポキシ化合物(D)と、が反応して得られる高分子化合物(E)の1種以上、
(Y)成分が、酸無水物変成ポリオレフィンの1種以上、
であることを特徴とする組成物。 (X) A composition containing 0.5 to 40.0 parts by mass of component (Y) with respect to 100 parts by mass of component,
(X) Component has polyester (a) obtained by reaction of diol and dicarboxylic acid, compound (b) having hydroxyl groups at both ends having one or more ethyleneoxy groups, and two or more epoxy groups One or more polymer compounds (E) obtained by reacting the epoxy compound (D),
(Y) component is at least one acid anhydride modified polyolefin,
The composition characterized by these.
An automotive interior / exterior material obtained from the resin composition according to any one of claims 8 to 11.
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JP2010270309A (en) * | 2009-04-24 | 2010-12-02 | Sumitomo Chemical Co Ltd | Method for producing resin composition, and molding |
JP2011046758A (en) * | 2009-08-25 | 2011-03-10 | Japan Polypropylene Corp | Thermoplastic resin composition and molded body thereof |
JP2015124272A (en) * | 2013-12-26 | 2015-07-06 | 株式会社プライムポリマー | Polypropylene resin composition |
JP2016023254A (en) * | 2014-07-22 | 2016-02-08 | 株式会社Adeka | Antistatic agent, antistatic agent composition, antistatic resin composition, and molded article |
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JP2010270309A (en) * | 2009-04-24 | 2010-12-02 | Sumitomo Chemical Co Ltd | Method for producing resin composition, and molding |
JP2011046758A (en) * | 2009-08-25 | 2011-03-10 | Japan Polypropylene Corp | Thermoplastic resin composition and molded body thereof |
JP2015124272A (en) * | 2013-12-26 | 2015-07-06 | 株式会社プライムポリマー | Polypropylene resin composition |
JP2016023254A (en) * | 2014-07-22 | 2016-02-08 | 株式会社Adeka | Antistatic agent, antistatic agent composition, antistatic resin composition, and molded article |
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CN117209899A (en) * | 2023-11-09 | 2023-12-12 | 河南华佳新材料技术有限公司 | Metallized film for reactive compensation capacitor and preparation method thereof |
CN117209899B (en) * | 2023-11-09 | 2024-01-26 | 河南华佳新材料技术有限公司 | Metallized film for reactive compensation capacitor and preparation method thereof |
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