JP2019006864A - Heat storable composition, heat storable molded product and method for manufacturing heat storable molded product - Google Patents

Abstract

To provide a heat storable molded product including a heat storage material utilizing solid-solid phase transition and having good warming function.SOLUTION: The heat storable composition (the composition of the present invention) is a heat storable composition comprising a heat storage material and a binder. The heat storage material is a substance absorbing and releasing a heat quantity equal to a transition enthalpy accompanying solid-solid phase transition. The binder is one or more kinds of substances selected from a resin, an elastomer, a rubber and a precursor substance thereof. The heat storage material may be an inorganic oxide-based compound or may be a specific vanadium dioxide-based compound and/or LiVO. The composition of the present invention may further include a reinforcement filler or may further include a thermally conductive filler having a specific shape. In this case, the heat storable molded product comprising the composition of the present invention may have a layer structure formed by alternately laminating a heat storage material layer which is a layer composed of the heat storage material and the binder and a thermally conductive material layer which is a layer composed of the thermally conductive filler and the binder.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a heat storage composition, a heat storage molded body, and a method for producing the heat storage molded body.

  In this technical field, a latent heat storage material that is a substance that absorbs and releases heat corresponding to latent heat in accordance with phase transition is known. For example, temperature control function by kneading a microcapsule containing a latent heat storage material (such as paraffin) that absorbs and dissipates heat with a phase transition between a solid and a liquid (solid-liquid phase transition). It has been proposed to obtain a heat storage rubber material having a constant temperature holding function (see, for example, Patent Document 1).

  However, when the heat storage rubber material is kneaded and used as described above, the microcapsule is broken and the latent heat storage material flows out, which may lead to problems such as deterioration and deformation of the rubber material and a decrease in the heat storage function. is there. Furthermore, since the microcapsule itself does not have a heat storage function, the degree of expression of the heat storage function per added amount is lower than that of the latent heat storage material itself.

On the other hand, there is a latent heat storage material that absorbs and dissipates heat in accordance with a phase transition (solid-solid phase transition) in a solid state instead of the solid-liquid phase transition as described above. As a specific example of such a latent heat storage material, for example, a latent heat storage material that absorbs and dissipates heat with an electronic phase transition, such as V _(1-X) Cr _X O ₂ (0 <X ≦ 0.23). (See Patent Documents 2 to 5). The electronic phase transition is one or more phase transitions among charge, spin, and orbital degrees of freedom that are internal degrees of freedom of electrons.

The heat storage material using the solid-solid phase transition as described above has the following characteristics.
-Since the phase transition occurs in the solid state, it is not necessary to enclose the heat storage material in a microcapsule or the like to prevent the heat storage material from being mixed into the main material (for example, rubber material).
-Unlike solid-liquid phase transitions such as inorganic salt hydrates, there is no risk of phase separation and / or decomposition accompanying phase transitions.
-Volume change accompanying phase transition is small compared to solid-liquid phase transition.

  Many of the substances exhibiting the phase transition as described above have high thermal conductivity. Therefore, a heat storage composition obtained by dispersing a heat storage material using solid-solid phase transition and other heat conductive particles in a matrix resin may be interposed between the heat generator and the heat radiator as a heat dissipation sheet. It has been proposed (see, for example, Patent Document 6). According to this, the movement of heat in the in-plane direction of the sheet is promoted, and heat can be effectively radiated from the heating element.

  In addition, it has been proposed to improve the strength of the composite heat storage material by using the inorganic material as the main material and the heat storage material as the dispersion material, and mixing and dispersing them to make the inorganic material play the role of a reinforcing material. (For example, see Patent Document 7). Thus, a composite heat storage material that can store and release heat at a desired temperature and has a desired mechanical strength is obtained, and for example, exhaust heat from an internal combustion engine is used for heating air during heating by an air conditioner. be able to.

JP 2010-235709 A JP 2010-163510 A JP, 2014-210835, A Japanese Patent Laid-Open No. 2006-108570 Japanese Patent Laid-Open No. 2006-160148 Japanese Patent No. 5854363 Japanese Patent Application Laid-Open No. 2006-077951

  As described above, in this technical field, heat generated from a heating element is efficiently generated using a heat storage molded body formed by a heat storage composition including a heat storage material using a solid-solid phase transition. Various techniques for absorbing and releasing have been proposed. However, the heat storage molded body is required to have not only the heat dissipation function as described above but also a heat retention function for reducing cooling of the heating element, for example. That is, in this technical field, there is a demand for a technique that can provide a heat storage molded article that includes a heat storage material that utilizes a solid-solid phase transition and that has a good heat retaining function.

  The present invention has been made to address the above problems. That is, an object of the present invention is to provide a heat storage molded article that includes a heat storage material using a solid-solid phase transition and has a good heat retaining function.

  Therefore, as a result of earnest research, the present inventor has achieved a solid-solid phase transition according to a heat storage composition comprising a heat storage material using a solid-solid phase transition and a binder having a low thermal conductivity. It has been found that a heat storage molded article including a heat storage material to be used and having a good heat retaining function can be provided.

In view of the above, the heat storage composition according to the present invention (hereinafter sometimes referred to as “the composition of the present invention”) is a heat storage composition composed of a heat storage material and a binder. The heat storage material is a substance that absorbs and releases heat corresponding to the transition enthalpy accompanying the solid-solid phase transition. The binder is one or more substances selected from resins, elastomers, rubbers, and precursors thereof. The heat storage material may be an inorganic oxide compound or a specific vanadium dioxide compound and / or LiVO ₂ (details will be described later). The composition of the present invention may further include a reinforcing filler, or may further include a heat conductive filler having a specific shape.

  The heat storage molded body according to the present invention (hereinafter sometimes referred to as “the present invention molded body”) is a heat storage molded body made of the composition of the present invention. In the present invention formed of the composition of the present invention further comprising a heat conductive filler, a heat storage material layer that is a layer made of a heat storage material and a binder, and a heat that is a layer made of a heat conductive filler and a binder. The conductive material layer may have a layered structure in which the conductive material layers are alternately stacked. Moreover, this invention molded object may further contain the heat insulation coating formed in at least one part surface.

The method for producing a heat storage composition according to the present invention (hereinafter sometimes referred to as “the method of the present invention”) comprises a heat storage molded article from a heat storage composition containing a heat conductive filler having a specific shape. It is a manufacturing method of the heat storage molded object which manufactures, Comprising: Each following process is included.
(1) A step of preparing a heat storage composition by mixing a heat storage material, a binder, and a thermally conductive filler.
(2) A step of filling the heat storage composition in a mold and curing the binder under a predetermined pressure to obtain a heat storage molded body.

  When the heat storage composition is prepared by mixing the heat storage material, the binder and the heat conductive filler in the step (1), after the binder and the heat conductive filler are mixed, the binder and the heat conductive filler are mixed. A heat storage material may be added to the mixture and further mixed. Moreover, this invention method may further include the process of forming a heat insulation coating in the surface of at least one part of the said heat storage molded object.

  ADVANTAGE OF THE INVENTION According to this invention, the thermal storage molded object which contains the thermal storage material using a solid-solid phase transition, and has a favorable heat retention function can be provided. Other objects, other features, and attendant advantages of the present invention will be readily understood from the description of each embodiment of the present invention described with reference to the following drawings.

It is a typical perspective view which shows the shape of the cup-shaped molded object used for evaluation of a heat retention function in (A) of an Example. It is a typical graph which shows an example of the DSC chart obtained by the differential scanning calorimetry of the sample piece extract | collected from the molded object shown in FIG. It is a typical perspective view which shows the state which put hot water in the molded object shown in FIG. 1, closed a lid | cover, and has arrange | positioned the thermocouple. It is a typical graph which shows the temperature change of the hot water in the shaping | molding pair shown in FIG. (A) Scanning electron microscope (SEM) photograph and (b) Schematic diagram showing the dispersion state of the heat storage material in the cross section of the heat storage molded body according to the present invention used for the evaluation of the heat retention function in Example (A). is there. It is typical sectional drawing which shows the structure of the assembly of the plate-shaped heat storage molded object used for evaluation of the thermal radiation function in Example (B), a ceramic heater, and a thermocouple. It is a typical graph which shows the temperature change of the ceramic heater measured by the thermocouple contained in the assembly shown in FIG. (A) Scanning electron microscope (SEM) photograph showing the dispersion state of the heat storage material and the heat conductive filler in the cross section of the heat storage molded article according to the present invention used for the evaluation of the cooling function in (B) of the examples and (B) It is the scanning electron microscope (SEM) photograph to which the description for explaining a layered structure was added. It is a schematic diagram which shows the dispersion | distribution state of the heat storage material and the heat conductive filler in the cross section of the heat storage molded object which concerns on this invention shown in FIG.

<< First Embodiment >>
Hereinafter, the heat storage composition according to the first embodiment of the present invention (hereinafter, may be referred to as “first composition”) will be described.

<Constitution>
The first composition is a heat storage composition composed of a heat storage material and a binder. The heat storage material is a substance having a function of storing heat (stores heat). By the heat storage, for example, the temperature of the heat storage material itself and / or the environment where the heat storage material is disposed can be kept constant. Or, heat energy such as solar energy and exhaust heat is stored in a heat storage material and used for heating, or ice produced at night with low power consumption (ie, low power charges) is used for cooling. Is also part of the form of heat storage.

  The heat storage mechanism is roughly divided into sensible heat storage and latent heat storage. Sensible heat storage is a mechanism that utilizes the large specific heat of a substance. For example, a hot water bottle or the like uses a large specific heat of water to warm a human body and / or bedding. On the other hand, latent heat storage is a mechanism that utilizes the transition enthalpy at the time of phase transition. For example, cooling a drink with ice corresponds to latent heat storage using the melting heat (melting enthalpy) of ice. According to the latent heat storage, the temperature of the object can be kept constant or heat can be taken in and out while maintaining the constant temperature by using the transition enthalpy accompanying the phase transition.

  Examples of materials that can be stored by latent heat storage that have been developed in the past (latent heat storage materials) include, for example, inorganic salt hydrates (for example, sodium nitrate (Glauber salt) and sodium acetate), organic substances (for example, paraffin and fatty acids) Etc.), and molten salt (molten salt). These are all heat storage materials that utilize a large transition enthalpy associated with a solid-liquid phase transition.

  The large enthalpy change accompanying the solid-liquid phase transition as described above is an important characteristic as a heat storage material, but there are other characteristics required for the heat storage material. For example, when the thermal conductivity of the heat storage material is low, a temperature distribution (temperature difference) occurs in the surface of the heat storage material itself or the surface of the heat storage molded body containing the heat storage material and / or between the surface and the inside. Therefore, the heat storage function of the heat storage molded body as a whole may not be sufficiently exhibited (for example, the thermal conductivity of organic materials such as paraffin is low).

  Further, when phase separation and / or decomposition occurs along with the phase transition, the heat storage effect is reduced, or products from the phase separation and / or decomposition are mixed into the main material and / or the binder, and the main material and / or There is a possibility that it may lead to problems such as deterioration and / or deformation of the binding material (in the worst case, it cannot be used as a heat storage material). Therefore, it is also required for the heat storage material that phase separation and decomposition accompanying phase transition do not occur.

  Therefore, the heat storage material constituting the first composition is a substance that absorbs and releases heat corresponding to the transition enthalpy accompanying the solid-solid phase transition. As a specific example of such a heat storage material, for example, a latent heat storage material that absorbs and dissipates heat along with an electronic phase transition can be given. As described above, the electronic phase transition is one or more phase transitions among the degrees of freedom of charge, spin, and orbit, which are internal degrees of freedom of electrons. As a more specific example of such a heat storage material, a material that stores heat as the crystal structure changes can be cited.

  In the heat storage material as described above, the phase transition occurs while maintaining the solid state. Therefore, it does not melt and liquefy with heat accumulation, such as paraffin, and does not cause phase separation and / or decomposition during phase transition, such as inorganic salt hydrate. That is, since a solid-solid phase transition occurs instead of a solid-liquid phase transition, it is not necessary to enclose a heat storage material in a container such as a microcapsule, and a product obtained by separation and / or decomposition becomes a main material and / or a binder. There is also no concern that it will lead to problems such as deterioration and / or deformation of the main material and / or binder.

  Furthermore, in the heat storage material as described above, even if the temperature rises, for example, during kneading with the binder in the preparation process of the first composition, there is no risk of melting like paraffin and the solid state is maintained. Therefore, kneading with the binder is easy. The particle size of the heat storage material is not particularly limited, but a particle size of about 0.1 μm to 100 μm is desirable from the viewpoint of processability, dispersibility, stability, and the like.

  By the way, although the said thermal storage material can be used as it is in the 1st composition (namely, without giving any additional process), for example, depending on the combination of a thermal storage material and a binding material, etc., a thermal storage material and a binding material are used. There is a case where it is difficult to obtain a dense heat-retaining molded body due to insufficient affinity. Alternatively, for example, in the case where a thermosetting polymer is applied as a binder, if the heat storage material is used as it is, curing of the thermosetting polymer may be inhibited.

  Therefore, in the first composition, the above problem may be reduced by subjecting the heat storage material to a surface treatment. Specific examples of such surface treatment include surface treatment with an organosilane compound or titanate ester compound. Specifically, an organosilane compound or a titanate ester compound is brought into contact with the surface of the heat storage material and brought into an adsorbed or chemically bonded state, thereby obtaining a chemically stable state.

Specific examples of the organosilane compound include alkoxysilane represented by R (CH ₃ ) _a Si (OR ′) _3-a or a partial hydrolyzate thereof. Wherein R is an unsubstituted alkyl group or substituted alkyl group containing 1 to 20 carbon atoms, R ′ is an alkyl group containing 1 to 4 carbon atoms, and a is 0 or 1 It is a numerical value. Specific examples of the titanate ester compound include alkyl titanates including tetrabutyl titanate.

  By the way, as mentioned above, in the said technical field, the heat generated from a heat generating body is efficiently utilized using the heat storage molded object formed with the heat storage composition containing the heat storage material using a solid-solid phase transition. Various techniques have been proposed for absorbing and releasing. Also in the heat storage composition disclosed in the above-mentioned prior art documents, thermally conductive particles are added to enhance the “heat dissipation function” for cooling the heating element. Moreover, also when an inorganic material is employ | adopted as a main material of a heat storage composition, the heat conductivity as the whole heat storage composition increases, a heat dissipation function increases, but a heat retention function falls. However, as described above, the heat storage molded body is required to have not only a heat radiating function but also a heat retaining function for reducing cooling of the heating element, for example.

  Therefore, the binder constituting the first composition is one or more substances selected from resins, elastomers, rubbers, and precursors thereof.

  The binder exhibits a function as a binder of the heat storage material and improves the moldability of the composition. The resin as the binder may be a thermosetting resin or a thermoplastic resin. The “resin” used herein includes elastomers and rubbers. Specific examples of the thermosetting resin include, but are not limited to, an epoxy resin, a phenol resin, an unsaturated polyester resin, and a melamine resin. Specific examples of the thermoplastic resin include, for example, polyolefins such as polyethylene and polypropylene, polyamides such as polyester and nylon, ABS resin, methacrylic resin, polyphenylene sulfide, fluorine resin, polysulfone, polyetherimide, polyethersulfone, and polyetherketone. , Polyether ether ketone, liquid crystal polyester, and polyimide, and copolymers, polymer alloys, and blends (mixtures) of these, but are not limited thereto.

  Specific examples of the thermoplastic elastomer (TPE) include, for example, styrene TPE, olefin TPE, vinyl chloride TPE, urethane TPE, ester TPE, amide TPE, chlorinated polyethylene TPE, syndiotactic-1 , 2-polybutadiene-based TPE, trans-1,4-polyisoprene-based TPE, fluorine-based TPE, and the like. Specific examples of rubber include, for example, natural rubber (ASTM abbreviation NR), isoprene rubber (IR), butadiene rubber (BR), 1,2-polybutadiene (1,2-BR), styrene-butadiene (SBR), chloroprene. Rubber (CR), nitrile rubber (NBR), butyl rubber (IIR), ethylene-propylene rubber (EPM, EPDM), chlorosulfonated preethylene (CSM), acrylic rubber (ACM, ANM), epichlorohydrin rubber (CO, ECO) , Polysulfide rubber (T), silicone rubber, fluorine rubber (FKM), urethane rubber (U), and the like, but are not limited thereto.

  The blending ratio of the binder in the first composition is not particularly limited, but is typically about 30% to 99% by weight with respect to the entire first composition. On the other hand, the mixing ratio of the heat storage material in the first composition is not particularly limited, but is typically about 1% by weight to 70% by weight with respect to the entire first composition. The blending ratio of the heat storage material in the first composition can be appropriately set according to, for example, the amount of heat to be stored in the application of the first composition.

<effect>
In the first composition, a substance that absorbs and releases heat corresponding to the transition enthalpy associated with the solid-solid phase transition is used as the heat storage material. Without requiring a container such as a capsule, a molded body (part) having a high degree of design freedom can be provided by various methods such as injection molding and press molding.

  Further, from the viewpoint of increasing the amount of heat stored by the heat storage composition as much as possible, it is desirable to reduce the content of constituent components other than the heat storage material as much as possible, as long as the integrity of the composition can be ensured. A 1st composition consists only of a heat storage material and a binder as mentioned above, for example, does not contain other materials, such as a heat conductive particle. Therefore, the heat storage amount as the whole heat storage composition can be increased.

  Furthermore, unlike the heat storage composition according to the prior art described above, since the first composition does not contain heat conductive particles, the first composition as a whole can exhibit a high heat retaining function.

  In addition, since heat absorption and heat dissipation occur in a temperature range according to the characteristics of the heat storage material, for example, when keeping an object such as engine oil, the temperature of the object is prevented from excessively deviating from the above temperature range. Can do. As a result, it is possible to extend the useful life of the object and / or other articles in the vicinity of the object (for example, automobile parts, etc.), and promote energy saving by using exhaust heat.

<< Second Embodiment >>
Hereinafter, the heat storage composition according to the second embodiment of the present invention (hereinafter, may be referred to as “second composition”) will be described.

<Constitution>
As described above, when the thermal conductivity of the heat storage material is low, the temperature distribution (temperature difference) between the surface of the heat storage material itself or the surface of the heat storage molded body containing the heat storage material and / or between the surface and the inside. ) May occur, and the heat storage function of the heat storage molded body as a whole may not be sufficiently exhibited. In order to avoid such a problem, it is desirable to use a heat storage material having a high thermal conductivity.

  On the other hand, generally, organic materials such as paraffin have lower thermal conductivity than inorganic materials. From such a viewpoint, a heat storage material made of an inorganic material is more preferable than a heat storage material made of an organic material, and a heat storage material made of an inorganic oxide compound is more preferable.

  Therefore, the second composition is the above-described first composition, and is a heat storage composition in which the heat storage material is an inorganic oxide compound.

<effect>
In the second composition, a heat storage material made of an inorganic oxide compound having higher thermal conductivity than that of an organic material is used. Therefore, the temperature distribution (temperature difference) in the surface of the heat storage material itself or the surface of the heat storage molded body and / or between the surface and the inside can be reduced. As a result, the heat storage function as the whole heat storage molded body can be sufficiently exhibited.

<< Third Embodiment >>
Hereinafter, the heat storage composition according to the third embodiment of the present invention (hereinafter sometimes referred to as “third composition”) will be described.

<Constitution>
As described above, in the second composition, an inorganic oxide compound that absorbs and releases heat corresponding to the transition enthalpy accompanying the solid-solid phase transition is employed as the heat storage material. Specific examples of such a heat storage material are disclosed in, for example, Patent Document 2 to Patent Document 5 described above.

Therefore, the third composition is the above-described second composition, and is a heat storage composition in which the heat storage material is a vanadium dioxide compound and / or LiVO ₂ represented by the following general formula (X).

  In the above general formula (X), M is an element having a tetravalent, pentavalent or hexavalent valence, and X is a numerical value which is 0 or more and less than 1.

<effect>
In the vanadium dioxide compound represented by the general formula (X), by adjusting the combination of the type of the element represented by M and the introduction ratio of the element M represented by X, as a heat storage material The heat storage characteristics (for example, the endothermic temperature, the heat radiation temperature, the amount of heat storage, etc.) can be adjusted.

  Therefore, according to the third composition, by adjusting the type of the element represented by M and the introduction ratio of the element M represented by X in the general formula (X), the heat storage characteristics according to the application can be obtained. It can be achieved and the heat retaining function can be exhibited in a desired temperature range.

<< 4th Embodiment >>
Hereinafter, the heat storage composition according to the fourth embodiment of the present invention (hereinafter sometimes referred to as “fourth composition”) will be described.

<Constitution>
As described above, the third composition is the second composition described above, wherein the heat storage material is a vanadium dioxide compound and / or LiVO ₂ represented by the general formula (X). It is. In addition, the element represented by M in the general formula (X) can be selected from various elements having a tetravalent, pentavalent, or hexavalent valence. Moreover, X representing the introduction ratio of the element M in the general formula (X) can achieve, for example, a heat storage function in a desired temperature range by achieving heat storage characteristics according to the application of the third composition. Set to

  In the fourth composition, M in the general formula (X) is one or more elements selected from the group consisting of Cr, W, Mo, Nb, Ta, Os, Ir, Ru, and Re. X is a numerical value that is 0 or more and 0.5 or less.

<effect>
According to the fourth composition, by adjusting the combination of the type of the element represented by M and the introduction ratio of the element M represented by X, the heat storage characteristics (for example, endothermic temperature, By adjusting the heat radiation temperature, the amount of heat storage, etc., the heat storage characteristics corresponding to the application can be achieved more reliably, and the heat retaining function can be more reliably exhibited in a desired temperature range.

<< 5th Embodiment >>
Hereinafter, the heat storage composition according to the fifth embodiment of the present invention (hereinafter, may be referred to as “fifth composition”) will be described.

<Constitution>
By the way, the heat storage composition (1st composition thru | or 4th composition) which concerns on 1st Embodiment thru | or 4th Embodiment of this invention demonstrated so far is accompanied by solid-solid phase transition as mentioned above. A heat storage composition comprising only a heat storage material and a binder that is one or more substances selected from resins, elastomers, rubbers, and precursors thereof.

  Therefore, depending on the application, it may be assumed that the mechanical strength of the heat storage molded body produced from these heat storage compositions is insufficient. In such a case, you may add the component for increasing the mechanical strength of a molded object.

  Therefore, the fifth composition is any one of the first to fourth compositions described above, and is a heat storage composition further including a reinforcing filler.

  The reinforcing filler is not particularly limited as long as it is a component capable of increasing the mechanical strength of the heat storage molded article produced from the fifth composition, depending on the mechanical strength required in its use, It can select suitably from the various reinforcement fillers currently used in the said technical field. Specific examples of such reinforcing fillers include, for example, reinforcing fillers having a fibrous, needle-like, columnar, scale-like, plate-like, or flat-like shape made of various resins including polyamide, polyimide, and cellulose. Can be mentioned.

  In addition, in the category which does not impair the heat retention function which the heat storage molded object manufactured from the 5th composition should exhibit, it has high heat conductivity compared with resin, such as carbon (carbon), glass, ceramics, and metals, for example. Reinforcing fillers formed by the material may be used.

<effect>
As described above, the fifth composition is a heat storage composition according to the present invention, and further includes a reinforcing filler. Therefore, according to the fifth composition, it is possible to easily and surely achieve the necessary mechanical strength by selecting an official reinforcing filler for the use of the heat storage molded article produced from the composition. it can.

<< 6th Embodiment >>
Hereinafter, the heat storage composition according to the sixth embodiment of the present invention (hereinafter may be referred to as “sixth composition”) will be described.

<Constitution>
By the way, as described at the beginning of the present specification, not only the heat retention function as described above but also a heat dissipation function that efficiently absorbs and releases heat from a high-temperature object such as a heating element has a heat storage composition. This is one of the functions to be exhibited by a heat storage molded article made of a product. Thus, the heat storage molded object which exhibits a heat dissipation function can also be manufactured from the heat storage composition as mentioned above.

  However, in any of the heat storage compositions according to the first to fifth embodiments of the present invention described above, the heat retaining function is emphasized. In other words, the first composition to the fifth composition described above are configured so as to ensure a sufficient heat-retaining function so that the thermal conductivity is not so high. Therefore, in order for the heat storage molded body made of the composition of the present invention to exhibit a sufficient heat dissipation function, the composition of the present invention needs to further contain a heat conductive filler.

  Therefore, the sixth composition is any one of the first to fourth compositions described above, and has a fibrous shape, a needle shape, a column shape, a scale shape, a plate shape, or a flat shape. Is a heat storage composition.

  A heat conductive filler plays the role which accelerates | stimulates transmission of the heat | fever to the heat storage material in the heat storage molded object which consists of a 6th composition. The blending ratio of the heat conductive filler is not particularly limited, but is preferably about 1% by weight to 50% by weight with respect to the entire heat storage composition from the viewpoint of processability, dispersibility, stability, and the like.

  The material constituting the thermally conductive filler is not particularly limited as long as it exhibits good thermal conductivity, has high affinity with the heat storage material and the binding material, and can be easily kneaded with the heat storage material and the binding material. Specific examples of the material constituting the thermally conductive filler include carbon (carbon), glass, ceramics and metal. Specific examples of carbon include graphite, graphite, and graphene. Specific examples of ceramics include alumina, silica, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, and aluminum hydroxide.

  As described above, the heat conductive filler has a fiber-like, needle-like or columnar elongated shape, or a scale-like, plate-like or flat-like flat shape. In the case of the former (elongated shape), the diameter of the heat conductive filler is not particularly limited, but is preferably about 0.5 μm to 40 μm from the viewpoint of processability, dispersibility, stability, and the like. The length of the heat conductive filler is also not particularly limited, but if it is about 1 μm to 6000 μm, it is easy to form a layered structure with a heat storage material as described later. On the other hand, in the latter case (flat shape), the aspect ratio of the thermally conductive filler is not particularly limited, but if it is about 1 to 400, it is easy to form a layered structure with a heat storage material as described later.

  When carbon fiber is used as the thermally conductive filler, the type of carbon fiber is not particularly limited, but mesophase pitch-based carbon fiber can produce high-density long fibers with developed graphite crystals. From the viewpoint of the above. Further, carbon materials such as carbon nanotubes, vapor grown carbon fibers (for example, VGCF (registered trademark)), graphite, and graphene may be used.

<effect>
As described above, the thermally conductive filler contained in the sixth composition has a fibrous shape, a needle shape, a columnar shape, a scale shape, a plate shape, or a flat shape. Therefore, when the filler has a fiber-like, needle-like or columnar shape, heat is easily conducted in the longitudinal direction, and when the filler has a scale-like, plate-like or flat-like shape, heat is conducted in the in-plane direction. easy. If the individual fillers are not completely spaced apart and at least partially overlap, the heat conduction path is further expanded.

  As a result of the above, the heat conducted from the outside to the heat storage molded body made of the sixth composition is efficiently diffused into the molded body through the conduction path expanded as described above, and the molding is performed. It efficiently reaches the heat storage material dispersed in the body and is quickly absorbed by the heat storage material. That is, the molded body can absorb and accumulate heat conducted from the outside efficiently and quickly. Conversely, when the heat stored in the heat storage material in the heat storage molded body made of the sixth composition is released to the outside, it can be radiated efficiently and quickly through the heat conduction path described above.

  Furthermore, in the situation where the amount of heat that can be absorbed by the heat storage material is absorbed, and the heat storage material cannot absorb more heat, the amount of heat that is not absorbed by the heat storage material (surplus), It can be passed efficiently and quickly through the heat conduction path described above.

  As described above, according to the heat storage molded body made of the sixth composition, the heat transferred from the outside can be efficiently and quickly absorbed into the heat storage material or released from the heat storage material, or the inside thereof. It can be passed efficiently and quickly. That is, the heat storage molded object which consists of a 6th composition can exhibit the outstanding heat dissipation function.

<< 7th Embodiment >>
Hereinafter, the heat storage molded object (henceforth a 7th molded object) which concerns on 7th Embodiment of this invention is demonstrated.

<Constitution>
By the way, as stated at the beginning of the present specification, the present invention relates not only to the heat storage composition but also to a heat storage molded body made of the heat storage composition according to the present invention. That is, a 7th molded object is a heat storage molded object which consists of a heat storage composition in any one of the 1st composition thru | or the 6th composition mentioned above.

  A specific method for producing the seventh molded body from the heat storage composition is, for example, a heat storage material and a binder constituting the heat storage composition (and a filler when the heat storage composition further includes a filler). Depending on the properties, blending ratio, etc., various molding methods widely known in the art can be appropriately selected.

  For example, when a thermoplastic resin is used as a binder, the components of the seventh molded body are uniformly mixed and pelletized by a twin-screw extrusion kneader, and the pellets thus obtained are desired by a twin-screw extruder. The seventh molded body can be obtained by injection molding into a cavity of a mold having a size and shape of. Alternatively, when a thermosetting resin is employed as the binder, the precursor of the thermosetting resin and the heat storage material (and the filler when the heat storage composition further includes a filler) have a desired size and shape. The seventh molded body can be obtained by filling the cavity of the mold and holding the thermosetting resin at a predetermined temperature and pressure for a predetermined period to cure the thermosetting resin.

<effect>
In the case where the seventh molded body is a heat storage molded body composed of any one of the first composition to the fifth composition, as already described in the description regarding the first composition to the fifth composition, the seventh molded body is Excellent thermal insulation function can be demonstrated.

  Specifically, for example, the seventh molded body may be molded as an oil pan of an engine such as an automobile. In this case, the oil pan is warmed through the oil circulating through the engine, the cylinder, etc., and heat is accumulated in the heat storage material. For example, even when parking and stopping and / or idling stop is activated, even if heat generation from the engine stops and the oil starts to cool, if the oil temperature reaches a predetermined temperature (heat dissipation temperature of the heat storage material), it is stored in the heat storage material. The heat that has been done is released. As a result, the decrease in oil temperature is delayed. That is, the possibility that the engine oil falls below a predetermined temperature (heat radiation temperature of the heat storage material) is reduced.

  Or you may shape | mold a 7th molded object as a hot water storage tank with which a domestic fuel cell cogeneration system called "ENE FARM" is equipped, for example. In this case, the hot water storage tank is warmed by hot water (water) warmed by exhaust heat during power generation by the system, and heat is accumulated in the heat storage material. The hot water storage tank is cooled by, for example, outside air, but when the temperature of the hot water storage tank reaches a predetermined temperature (heat radiation temperature of the heat storage material), the heat stored in the heat storage material is released. As a result, the temperature drop of the hot water stored in the hot water storage tank is delayed. That is, the possibility that the temperature of the hot water in the hot water storage tank falls below a predetermined temperature (heat radiation temperature of the heat storage material) is reduced.

  As described above, according to the seventh molded body made of any one of the first composition to the fifth composition, the heat transferred from the outside is once absorbed in the heat storage material, and the temperature of the seventh molded body is When the temperature drops below a predetermined temperature (heat release temperature of the heat storage material), the heat stored in the heat storage material is released from the heat storage material, and the temperature of the seventh molded body becomes the predetermined temperature (heat release temperature of the heat storage material). ) Is less likely to drop below. That is, the seventh molded body made of any one of the first composition to the fifth composition can exhibit an excellent heat retaining function.

  On the other hand, when the seventh molded body is a heat storage molded body made of the sixth composition, as already described in the description of the sixth composition, the sixth composition further includes a thermally conductive filler. The seventh molded body can exhibit an excellent heat dissipation function.

  Specifically, the seventh molded body can be molded as a heat sink that is disposed for the purpose of cooling and radiating heat of a heat generating portion that is an element and / or a part that generates heat, for example. In this case, as already described in the description of the sixth composition, the heat conducted from the outside to the seventh molded body passes through the conduction path expanded by the thermally conductive filler, and the inside of the seventh molded body. And efficiently reaches the heat storage material dispersed inside the seventh molded body, and is quickly absorbed by the heat storage material. That is, the seventh molded body can efficiently and quickly absorb and accumulate heat conducted from the outside.

  And on the surface which is not in contact with the heat generating part of the seventh molded body as a heat sink, the heat stored in the heat storage material is released from the seventh molded body to the outside, contrary to the above. Also at this time, heat can be radiated efficiently and quickly through the heat conduction path described above.

  Furthermore, in the situation where the amount of heat that can be absorbed by the heat storage material is absorbed, and the heat storage material cannot absorb more heat, the amount of heat that is not absorbed by the heat storage material (surplus), The heat can be radiated to the outside through the heat conduction path described above efficiently and quickly.

  As described above, according to the seventh molded body made of the sixth composition, the heat transferred from the outside is efficiently and quickly absorbed into or released from the heat storage material, or the inside It can be passed efficiently and quickly. That is, the heat storage molded object which consists of a 6th composition can exhibit the outstanding heat dissipation function.

<< Eighth Embodiment >>
Hereinafter, the heat storage molded object (henceforth an 8th molded object) which concerns on 8th Embodiment of this invention is demonstrated.

<Constitution>
The 8th molded object is a heat storage molded object which consists of a 6th composition mentioned above. In addition, the eighth molded body is formed by alternately stacking a heat storage material layer that is a layer mainly composed of a heat storage material and a binder, and a heat conductive material layer that is a layer mainly composed of a thermally conductive filler and a binder. Having a layered structure. Such a layered structure can be formed, for example, by filling the sixth composition into a mold and curing the binder under a predetermined pressure.

<effect>
In the eighth molded body, a layered structure in which the heat storage material layers and the heat conductive material layers are alternately stacked as described above is formed. As a result, the heat conducted from the outside to the eighth molded body diffuses in the in-plane direction (two-dimensional) of the layer in the heat conductive material layer and is absorbed by the heat storage material included in the adjacent heat storage material layer. The Inside the heat storage material layer, heat is transmitted through the heat storage material in the stacking direction (thickness direction) of the layered structure. The heat conducted to the next heat conductive material layer in this way is diffused in the in-plane direction (two-dimensional) in the next heat conductive material layer, and the heat is absorbed by the heat storage material included in the next heat storage material layer. Is done.

  As described above, the heat conducted from the outside to the eighth molded body is diffused not only in the in-plane direction of the layered structure but also in the stacking direction inside the eighth molded body. As a result, the heat generating portion can be effectively cooled and radiated. As a result, the heat dissipation of the article and / or part to which the eighth molded body is attached can be improved, and the reliability of the article and / or part can be improved.

<< Ninth Embodiment >>
Hereinafter, the heat storage molded object (henceforth a "9th molded object" may be called) which concerns on 9th Embodiment of this invention is demonstrated.

<Constitution>
The ninth molded body is the above-described seventh molded body or eighth molded body, and is a heat storage molded body that further includes a heat insulating coating formed on at least a part of the surface. The heat insulating coating is a film made of a material that effectively prevents heat conduction (ie, has a low thermal conductivity) such as a heat insulating paint and a heat shielding paint. Therefore, on the surface on which the heat insulating coating is formed, the transfer of heat from the inside of the ninth molded body to the outside (heat radiation) is effectively reduced.

  In addition, the area | region which forms a heat insulating coating can be defined as an area | region which does not need to give and receive heat in the use of a 9th molded object, for example. Specifically, for example, an object (heat-absorbing body) that provides heat by a contact area between the ninth molded body and a contact area between the ninth molded body (heat generating element) and the ninth molded body. ) And the ninth molded body may be formed on all surfaces except the contact area. In addition, the method for forming the heat insulating coating is not particularly limited, and can be appropriately selected from various coating methods well known to those skilled in the art.

<effect>
In the ninth molded body, from the region other than the contact area between the ninth molded product and these objects during the period from the absorption of heat from the heating element to the release (returning) of heat to the heat absorbing body. The heat release is reduced by the insulating coating. Therefore, according to the 9th molded object, the heat retention effect can be improved significantly. For example, the ninth molded body is molded into a cup shape, and a heat insulating coating is formed on the outer surface thereof, thereby improving the heat retaining function of the cup and reducing the temperature of its contents (for example, hot water). It can be effectively reduced.

<< 10th Embodiment >>
Hereinafter, the manufacturing method of the heat storage molded object which concerns on 10th Embodiment of this invention (henceforth a "10th method" may be called.) Is demonstrated.

<Constitution>
As described at the beginning of the present specification, the present invention relates not only to the heat storage composition and the heat storage molded body but also to the method for producing the heat storage molded body according to the present invention. In particular, the tenth method is a method for producing an eighth molded body having excellent heat dissipation characteristics from a sixth composition containing a thermally conductive filler.

That is, the tenth method is a method for manufacturing a heat storage molded body for manufacturing the eighth molded body from the sixth composition, and includes the following steps.
(1) A step of preparing a heat storage composition by mixing a heat storage material, a binder, and a thermally conductive filler.
(2) A step of filling the heat storage composition in a mold and curing the binder under a predetermined pressure to obtain a heat storage molded body.

  The specific method for mixing the heat storage material, the binder, and the heat conductive filler in the step (1) is, for example, according to the properties of the heat storage material, the binder, and the heat conductive filler. Can be appropriately selected from known mixing methods. In addition, a specific method for curing the binder in the step (2) can be appropriately selected from curing methods well known in the technical field according to, for example, the properties of the binder.

  For example, when a thermoplastic resin is used as a binder, the components of the sixth composition are uniformly mixed while being heated by a twin-screw extrusion kneader, and injected into a mold cavity having a desired size and shape. By cooling after molding, an eighth molded body can be obtained. Alternatively, when a thermosetting resin is employed as a binder, the precursor of the thermosetting resin, a heat storage material, and a heat conductive filler are filled into a cavity of a mold having a desired size and shape, The thermoset resin can be cured by holding it at a temperature and pressure for a predetermined period of time to obtain an eighth molded body.

<effect>
As described above, in the eighth molded body, a layered structure in which the heat storage material layers and the heat conductive material layers are alternately stacked is formed, and the heat conducted from the outside to the eighth molded body is the eighth. In the molded body, it is diffused not only in the in-plane direction of the layered structure but also in the stacking direction. As a result, the heat generating portion can be effectively cooled and radiated. As a result, the heat dissipation of the article and / or part to which the eighth molded body is attached can be improved, and the reliability of the article and / or part can be improved.

<< 11th Embodiment >>
Hereinafter, the manufacturing method of the heat storage molded object which concerns on 11th Embodiment of this invention (henceforth a "11th method" may be called.) Is demonstrated.

<Constitution>
As described above, specific methods for mixing the heat storage material, the binder, and the heat conductive filler in the step (1) included in the tenth method include, for example, the heat storage material, the binder, and the heat conductive filler. Depending on the nature of the material, etc., it can be appropriately selected from mixing methods well known in the art. However, depending on the properties of the heat storage material, the binder, and the thermally conductive filler, the mixing order of the binder, the heat storage material, and the heat conductive filler is set to a specific order, so that the heat storage material layer and the heat conductive material layer It is possible to more reliably form a layered structure in which are alternately stacked.

  Therefore, in the eleventh method, when the heat storage material is prepared by mixing the heat storage material, the binder, and the heat conductive filler in the step (1), after the binder and the heat conductive filler are mixed. The heat storage material is added to the mixture of the binder and the heat conductive filler and further mixed.

<effect>
According to the eleventh method, by setting the mixing order of the binder, the heat storage material, and the heat conductive filler to the order described above, the layered structure in which the heat storage material layers and the heat conductive material layers are alternately stacked is more reliably obtained. Can be formed. Therefore, the heat conducted to the eighth molded body from the outside is more favorably diffused not only in the in-plane direction of the layered structure but also in the stacking direction inside the eighth molded body. As a result, the heat generating portion can be further effectively cooled and radiated. As a result, the heat dissipation of the article and / or part to which the eighth molded body is attached can be improved, and the reliability of the article and / or part can be improved.

<< Twelfth Embodiment >>
Hereinafter, the manufacturing method of the heat storage molded object which concerns on 12th Embodiment of this invention (henceforth a "12th method" may be called.) Is demonstrated.

<Constitution>
The twelfth method is a method for manufacturing the ninth molded body described above, and in particular, a method for manufacturing the ninth molded body including a thermally conductive filler. That is, the twelfth method is the above-described tenth method or eleventh method, and further includes forming a heat insulating coating on at least a part of the surface of the heat storage molded body. is there.

  Since the structure of the heat insulating coating, the region where the heat insulating coating is formed, and the method for forming the heat insulating coating have already been described in the description of the ninth molded body, the description will not be repeated here.

<effect>
In the ninth molded body produced by the twelfth method, the ninth molded article, these objects, and the like in a period from the time when heat is absorbed from the heating element to the time when heat is radiated (returned) to the heat absorbing body. The heat release from areas other than the contact area is reduced by the insulating coating. Therefore, according to the twelfth method, it is possible to obtain a heat storage molded body that exhibits a greatly improved heat retaining effect.

(A) Thermal storage molded article exhibiting high heat retention function 1) Preparation of compositions according to examples and comparative examples In this example, vanadium dioxide (VO ₂ ) as a thermal storage material that stores heat at 68 ° C. and a binder A polypropylene resin (PP) was selected and these two types of components were blended in the blending ratios listed in Table 1 below to prepare heat storage compositions according to Examples A1 to A4. On the other hand, as a comparative example, vanadium dioxide (VO ₂ ) as a heat storage material, polypropylene resin (PP) as a binder, and bulk alumina (Al ₂ O ₃ ) as a heat conductive filler are selected. Components were blended at the blending ratios listed in Table 1 below to prepare compositions according to Comparative Examples A1 to A5.

  A molded body as a sample for evaluation was prepared from each composition, and the amount of heat storage was evaluated by differential scanning calorimetry (DSC). Furthermore, the heat retaining function was evaluated by putting hot water into the formed body and measuring the heat retaining time. The creation of each evaluation sample and each evaluation result will be described in detail below.

2) Preparation of evaluation sample Each molded body as an evaluation sample was prepared according to the following procedure.
(1) The material used as the component of each composition was uniformly mixed using the twin-screw extrusion kneader, and the pellet was produced.
(2) The pellets were injection molded with a mold to produce a cup-shaped molded body with a lid as shown in FIG.
(3) Each molded body was machined into a shape of approximately 4 mm in diameter and 2 mm in thickness to produce a sample piece for DSC.

3) Differential scanning calorimetry (DSC)
Using a high-sensitivity differential scanning calorimeter DSC8230 manufactured by Rigaku Corporation, differential scanning calorimetry was performed in an air atmosphere in a temperature rising process and a temperature falling process in a temperature range from 30 ° C to 400 ° C. An example of the obtained DSC chart is shown in FIG. The results of calculating the total heat absorption amount (J / g) in the above temperature range as the heat storage amount for each sample according to Examples A1 to A4 and Comparative Examples A1 to A5 are also listed in Table 1.

As apparent from Table 1, the magnitude of the heat storage amount was almost proportional to the compounding ratio of vanadium dioxide (VO ₂ ) as the heat storage material. A heat storage composition having a larger amount of heat storage can exhibit a higher heat storage function and can keep hot water for a longer period of time.

4) Evaluation of heat retention function As shown in FIG. 3, hot water boiled to 100 ° C. was poured into a molded body as an evaluation sample, and the lid was closed. And the result of having monitored the temperature change of hot water using the thermocouple is shown in the graph of FIG. However, in the graph of FIG. 4, the measurement results for Examples A3 and A4 and Comparative Examples A4 and A5 were omitted. Table 1 also lists the results of calculating the time required for the hot water temperature to reach room temperature (heat retention function) based on the molded body according to Comparative Example A1 made of only polypropylene.

  From the results shown in FIG. 4 and Table 1, it can be seen that the sample having a higher blending ratio of the heat storage material can keep hot water for a longer time. Furthermore, from the comparison between Examples A1 to A4 in which no thermally conductive filler is blended and Comparative Examples A2 to A5 in which a thermally conductive filler is blended, the heat storage material is not blended with the thermally conductive filler. A period during which the temperature of the hot water was kept constant was recognized near the heat storage temperature (68 ° C. in this example), and as a result, it was confirmed that the hot water could be kept warm for a longer period. .

5) Observation of dispersion state of heat storage material An example of the result of observing the cross section of each molded body according to Examples A1 to A4 with a scanning electron microscope (SEM) and observing the dispersion state of the heat storage material in each molded body As shown in FIG. As shown by the SEM photograph shown in (a) and the schematic diagram shown in (b), in each molded body according to Examples A1 to A4, the heat storage material is uniformly dispersed in the binder (polypropylene resin). It was confirmed that Thereby, in each molded object which concerns on Example A1 thru | or A4, it is judged that the favorable heat retention function was achieved.

6) Summary of evaluation results From the above evaluation results, according to the heat storage molded body produced from the heat storage composition according to the present invention, a higher heat storage function is achieved compared to the molded body according to the prior art, As a result, it was confirmed that a higher heat retention function was achieved.

(B) Thermal storage molded product exhibiting high heat dissipation function 1) Preparation of compositions according to examples and comparative examples Also in this example, heat is stored at 68 ° C. as in the evaluation of the heat retention function in (A) described above. Vanadium dioxide (VO ₂ ) as a heat storage material was selected. However, instead of polypropylene resin (PP), phenol resin (PF) was selected as the binder, and carbon fiber (CF) was selected as the heat conductive filler. These three types of components were blended at the blending ratios listed in Table 2 below to prepare heat storage compositions according to Examples B1 to B3. On the other hand, as a comparative example, vanadium dioxide (VO ₂ ) as a heat storage material, phenol resin (PF) as a binder, and bulk alumina (Al ₂ O ₃ ) as a heat conductive filler are selected. The constituents were blended at the blending ratios listed in Table 2 below to prepare compositions according to Comparative Examples B1 to B3.

  A molded body as a sample for evaluation was prepared from each composition, and the amount of heat storage was evaluated by differential scanning calorimetry (DSC). Furthermore, the heat dissipation function was evaluated using the formed body. The creation of each evaluation sample and each evaluation result will be described in detail below.

2) Preparation of evaluation sample Each molded body as an evaluation sample was prepared according to the following procedure.
(1) After mixing a liquid phenolic resin (PF) and a thermally conductive filler (carbon fiber (CF) in the example, massive alumina in the comparative example), vanadium dioxide (VO ₂ ) as a heat storage material is mixed. A ternary composite material was prepared by addition. However, Comparative Example B1 was prepared as a one-component composition consisting only of phenolic resin (PF).
(2) The above composite material (Comparative Example B1 is phenol resin (PF) only) filled in a mold having a cavity of 50 mm square and 5 mm thickness subjected to mold release treatment, and a pressure of 300 to 400 kgf / cm ² and 150 A molded body having a thickness of 5 mm was prepared by curing the phenol resin (PF) by holding at a temperature of 10 ° C. for 10 minutes.
(3) Each molded body was machined into a shape of approximately 4 mm in diameter and 2 mm in thickness to produce a DSC sample.

3) Differential scanning calorimetry (DSC)
Using a high-sensitivity differential scanning calorimeter DSC8230 manufactured by Rigaku Corporation, differential scanning calorimetry was performed in an air atmosphere in a temperature rising process and a temperature falling process in a temperature range from 30 ° C to 400 ° C. Table 2 also lists the results of calculating the total heat absorption amount (J / g) in the above temperature range as the heat storage amount for each sample according to Examples B1 to B3 and Comparative Examples B1 to B3.

As apparent from Table 2, the magnitude of the heat storage amount was almost proportional to the blending ratio of vanadium dioxide (VO ₂ ) as the heat storage material. The heat storage composition having a larger amount of heat storage exhibits a higher heat storage function and can absorb a larger amount of heat from the heat source.

4) Evaluation of heat dissipation function As shown in FIG. 6, the above-mentioned various molded bodies are cut into a 15 mm square size and bonded to one surface of a 15 mm square × thickness 1.27 mm plate-shaped ceramic heater. A thermocouple was attached to the opposite side of the heater. The graph of FIG. 7 shows the result of monitoring the temperature change of the ceramic heater by applying 5 W power to the ceramic heater in this state. The time required for the temperature of the ceramic heater to reach from 80 ° C. to room temperature (heat radiation function) is also listed in Table 2.

  From the results shown in FIG. 6 and Table 2, the heat storage molded bodies according to Examples B1 to B3 that employ fibrous carbon (carbon fiber) as the heat conductive filler do not contain a heat storage material or a heat conductive filler. It can be seen that not only the molded body according to Comparative Example B1, but also the heat storage molded body according to Comparative Examples B2 and B3, in which massive alumina is used as the heat conductive filler, suppresses the temperature rise of the ceramic heater. This indicates that the heat storage molded bodies according to Examples B1 to B3 exhibit a better heat dissipation function than the molded bodies according to Comparative Examples B1 to B3.

5) Observation of dispersion state of heat storage material and thermal conductive filler The cross section of each molded body according to Examples B1 to B3 was observed with a scanning electron microscope (SEM), and the heat storage material and the thermal conductive filler in each molded body were observed. An example of the result of observing the dispersion state is shown in FIG. In (b) of FIG. 8, the heat storage material layer, which is a layer mainly composed of the heat storage material and the binder, observed in the SEM photograph shown in (a) is an ellipse, mainly from the thermally conductive filler and the binder. Each of the heat conductive material layers, which is a layer to be formed, is indicated by a square. As is apparent from FIG. 8, the heat storage molded body has a layered structure in which heat storage material layers and heat conductive material layers are alternately stacked.

Therefore, as represented by the arrows described in the schematic diagram shown in FIG. 9, the heat conducted from the external heat source (in this embodiment, the ceramic heater) to the heat storage molded body is the molded body. In the inside, the layer structure is diffused better not only in the in-plane direction but also in the stacking direction. More specifically, in the heat conductive material layer composed of carbon fiber (CF) as the heat conductive filler and phenol resin (PF) as the binder, the heat conductive material layer is sandwiched between the heat conductive material layers mainly in the in-plane direction. In the heat storage material layer composed of vanadium dioxide (VO ₂ ) as the heat storage material and phenol resin (PF) as the binder, heat is diffused satisfactorily mainly in the stacking direction (thickness direction). As a result, heat dissipation from the ceramic heater, which is a heat source, was performed extremely effectively, and as a result, the temperature rise of the ceramic heater to which the heat storage molded bodies according to Examples B1 to B3 were joined was suppressed. It is done.

6) Summary of evaluation results From the above evaluation results, according to the heat storage molded body produced from the heat storage composition according to the present invention, a higher heat dissipation function is achieved compared to the molded body according to the prior art, As a result, it was confirmed that a higher cooling function was achieved.

  Further, among Examples B1 to B3, Example B1 is more than Example B1 of Example B2 that contains the most heat conductive filler and Example B3 that contains the most heat storage material. The heat storage molded product according to the above exhibited a higher heat dissipation function. From this, in order to exhibit a high heat dissipation function in the heat storage molded body according to the present invention, it is possible to take an appropriate balance between the amount of heat stored by the heat storage material and the heat conduction speed by the heat conductive filler. It seems to suggest that it is important.

  In the foregoing, for the purpose of illustrating the present invention, several embodiments and examples having specific configurations have been described with reference to the accompanying drawings. However, the scope of the present invention is illustrative only. It should be understood that the present invention should not be construed as being limited to the embodiments and examples, and that modifications can be made as appropriate within the scope of the matters described in the claims and the specification.

Claims (12)

A heat storage composition comprising a heat storage material and a binder,
The heat storage material is a substance that absorbs and releases heat corresponding to a transition enthalpy associated with a solid-solid phase transition,
The binder is one or more substances selected from resins, elastomers and rubbers and their precursors.
Thermal storage composition. A heat storage composition according to claim 1,
The heat storage material is an inorganic oxide compound.
Thermal storage composition. A heat storage composition according to claim 2,
The heat storage material is a vanadium dioxide compound and / or LiVO ₂ represented by the following general formula (X),
In the general formula (X), M is an element having a tetravalent, pentavalent, or hexavalent valence, and X is a numerical value that is 0 or more and less than 1.
Thermal storage composition. A heat storage composition according to claim 3,
In the general formula (X), M is one or more elements selected from the group consisting of Cr, W, Mo, Nb, Ta, Os, Ir, Ru, and Re, and X is 0 or more and A numerical value that is 0.5 or less,
Thermal storage composition. It is a heat storage composition described in any one of Claims 1 thru / or 4, Comprising:
Further comprising a reinforcing filler,
Thermal storage composition. It is a heat storage composition described in any one of Claims 1 thru / or 4, Comprising:
It further includes a thermally conductive filler having a fibrous shape, a needle shape, a columnar shape, a scale shape, a plate shape, or a flat shape,
Thermal storage composition.   The heat storage molded object which consists of a heat storage composition described in any one of Claims 1 thru | or 6. A heat storage molded article comprising the heat storage composition according to claim 6,
A heat storage material layer which is a layer composed of the heat storage material and the binder;
A heat conductive material layer which is a layer made of the heat conductive filler and the binder;
Has a layered structure in which the layers are alternately stacked,
Thermal storage molded product. A heat storage molded product according to claim 7 or claim 8,
Further comprising a thermal barrier coating formed on at least a portion of the surface;
Thermal storage molded product. It is a manufacturing method of the heat storage molded object which manufactures the heat storage molded object described in Claim 8 from the heat storage composition described in Claim 6,
Mixing the heat storage material, the binder and the heat conductive filler to prepare the heat storage composition;
Filling the heat storage composition in a mold and curing the binder under a predetermined pressure to obtain a heat storage molded body;
The manufacturing method of the heat storage molded object containing this. A method for producing a heat storage molded article according to claim 10,
When the heat storage composition is prepared by mixing the heat storage material, the binder, and the heat conductive filler, the binder and the heat conduction are mixed after the binder and the heat conductive filler are mixed. Adding the heat storage material to the mixture with the conductive filler and further mixing,
Manufacturing method of heat storage molded object. A method for producing a heat storage molded body according to claim 10 or claim 11,
Forming a heat insulating coating on at least a part of the surface of the heat storage molded article,
The manufacturing method of the heat storage molded object which contains further.