JP2019049731A - Pattern drawing apparatus - Google Patents

Abstract

To decrease a joint error of patterns joined to each other in a width direction of a substrate even when a multi-beam drawing system connecting a plurality of drawing lines is employed.SOLUTION: An exposure apparatus EX for drawing a pattern on a substrate P includes: a rotating drum DR for transporting the substrate P in a transportation direction of the substrate; a drawing device 11 having a plurality of drawing modules UW1 to UW5 for drawing patterns on the substrate P with drawing beams projected onto the substrate P, in which drawing lines neighboring each other in a width direction are arranged at a predetermined space therebetween in the transportation direction in such a manner that the patterns drawn on the substrate P by each of the plurality of drawing modules UW1 to UW5 are joined in the width direction; a rotating mechanism 24 for adjusting a relative inclination of the drawing lines with respect to the width direction of the substrate P; a rotating position detection mechanism for detecting a transportation speed of the substrate P; and a control device for controlling drawing timing of the drawing modules UW1 to UW5 depending on the transportation speed and the relative inclination detected by the rotation position detection mechanism.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a pattern drawing apparatus.

  Conventionally, as a substrate processing apparatus, a scanning drawing apparatus that performs drawing at a predetermined position on a sheet-like medium (substrate) is known (see, for example, Patent Document 1). The scanning drawing apparatus includes a drawing table, a laser light source, a light modulator, and a scanning optical system. The drawing table is conveyed in the conveyance direction (sub-scanning direction) with the medium mounted. The laser light source irradiates laser light toward the light modulator. As the light modulator, for example, an acousto-optic modulator (AOM: Acousto Optic Modulator) is used to modulate laser light emitted from a laser light source. When switched to ON, the light modulator deflects the laser light by diffraction to project the laser light onto the medium. On the other hand, when the light modulator is switched OFF, the laser light is not projected onto the medium without deflecting the laser light. The scanning optical system causes the laser light emitted from the light modulator to scan in the scanning direction along a predetermined scanning line from the scanning start end to the scanning end end on the medium. Then, the scanning drawing apparatus modulates the laser light by the light modulator while transporting the medium in the sub scanning direction by the drawing table, and causes the spot light of the laser light modulated by the scanning optical system to scan in the scanning direction. Draw on the medium.

JP, 2000-227661, A

  By the way, a substrate to be drawn becomes larger as the device becomes larger. As the substrate becomes larger, the pattern drawn on the substrate becomes larger. Here, in the scanning drawing apparatus of Patent Document 1, since drawing is performed by one scanning line, when the pattern drawn on the substrate becomes large, the scanning line by the spot light of the laser light becomes long. However, in the scanning drawing apparatus of Patent Document 1, since the length of the scanning line is limited, the size of the pattern drawn on the substrate is limited by the length of the scanning line.

  Therefore, a so-called multi-beam type drawing method may be considered in which a pattern is drawn on a substrate by a plurality of scanning lines (drawing lines). In such a multi-beam type drawing method, a plurality of drawing lines are arranged side by side in the direction of scanning lines, and each pattern formed by each scanning line is seamed in the width direction orthogonal to the transport direction of the substrate Then, it becomes possible to draw a large pattern on the substrate.

  Even in the multi-beam type drawing method, a pattern is drawn on the substrate by a plurality of drawing lines while transporting the substrate in the transport direction, so the pattern drawn from the drawing start position to the drawing end position of each drawing line is the substrate If uneven speed or the like occurs in the conveyance speed, the drawing start position and the drawing end position will be different positions in the conveyance direction in the micron order. For this reason, there is a possibility that the joint accuracy of the patterns adjacent to each other in the width direction of the substrate may be deteriorated, that is, a joint error may occur.

  In the embodiment of the present invention, in view of the above problems, even in the multi-beam type drawing method in which a plurality of drawing lines are connected, the joint error between the patterns joined in the width direction of the substrate is favorably reduced. To be an issue.

  According to a first aspect of the present invention, there is provided a pattern drawing apparatus for drawing a pattern on a substrate having a predetermined width, wherein the substrate is supported and at a predetermined speed in the transport direction intersecting the width direction of the substrate. A predetermined pattern is drawn on the substrate along a drawing line obtained by scanning the drawing beam projected onto the substrate in the width direction within a range narrower than the width of the substrate, and a substrate transport mechanism to be conveyed. A plurality of drawing modules are provided, and the drawing lines adjacent to each other in the width direction are formed so that the patterns drawn on the substrate by each of the plurality of drawing modules are joined in the width direction of the substrate, The relative inclination of the drawing line with respect to the width direction of the substrate, the drawing apparatus arranged with a predetermined interval in the conveyance direction, the substrate speed detection apparatus for detecting the conveyance speed of the substrate, and The tilt adjustment mechanism to be adjusted, the pattern drawn at the end of the drawing line by one of the drawing modules adjacent to each other in the width direction of the substrate among the plurality of drawing modules, and the pattern by the other drawing module The transport speed detected by the substrate speed detection device and the tilt adjustment mechanism are adjusted so that the pattern drawn at the end of the drawing line is joined in the transport direction or the width direction. And a control device configured to control the drawing timing of each of the drawing modules in accordance with the relative inclination amount.

FIG. 1 is a view showing the overall arrangement of an exposure apparatus (pattern drawing apparatus) according to the first embodiment. FIG. 2 is a perspective view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 3 is a view showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 is a view showing the configuration of the rotary drum and the drawing apparatus of the exposure apparatus of FIG. FIG. 5 is a plan view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 6 is a perspective view showing the configuration of the branching optical system of the exposure apparatus of FIG. FIG. 7 is a diagram showing the arrangement of the scanners in the plurality of drawing modules provided in the exposure apparatus of FIG. FIG. 8 is a perspective view showing the arrangement of the alignment microscope, the drawing line and the encoder head on the substrate. FIG. 9 is a perspective view showing the surface structure of the rotary drum of the exposure apparatus of FIG. FIG. 10 is a view showing an example of an arrangement relationship between a pattern drawn on a substrate by the exposure apparatus of the first embodiment and drawing lines. FIG. 11 is a view showing an example of an arrangement relationship between a pattern drawn on a substrate by the exposure apparatus of the first embodiment and drawing lines. FIG. 12 is a view showing an image of CAD information used in the exposure apparatus of the first embodiment. FIG. 13 is a view showing the configuration of part of the f-θ lens system of the exposure apparatus of the second embodiment. FIG. 14 is a diagram showing the configuration of a cylindrical lens of the f-θ lens system of FIG. FIG. 15 is a view showing an example of an arrangement relationship between a pattern drawn on a substrate by the exposure apparatus of the second embodiment and drawing lines. FIG. 16 is a view showing an example of the arrangement relationship between a pattern drawn on a substrate by the exposure apparatus of the second embodiment and drawing lines. FIG. 17 is a view showing an example of an arrangement relationship between a pattern drawn on a substrate by the exposure apparatus of the third embodiment and drawing lines. FIG. 18 is a view showing an example of an arrangement relationship between a pattern drawn on the substrate and the drawing line when the inclination of the drawing line is not corrected by the exposure apparatus of the fourth embodiment. FIG. 19 is a view showing an example of an arrangement relationship between a pattern drawn on a substrate and drawing lines after correcting the inclination of the drawing lines by the exposure apparatus of the fourth embodiment. FIG. 20 shows an example of the arrangement relationship between the pattern drawn on the substrate and the drawing line when the inclination correction of the drawing line is corrected according to the unevenness of the transport speed of the substrate by the exposure apparatus of the fourth embodiment. FIG. FIG. 21 is a flowchart showing a device manufacturing method using the exposure apparatus of the first to fourth embodiments.

  A mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. Further, the components described below include those which can be easily conceived by those skilled in the art and those which are substantially the same. Furthermore, the components described below can be combined as appropriate. In addition, various omissions, replacements or modifications of the components can be made without departing from the scope of the present invention.

First Embodiment
FIG. 1 is a view showing the overall arrangement of an exposure apparatus (pattern drawing apparatus) according to the first embodiment. The substrate processing apparatus of the first embodiment is an exposure apparatus EX that performs exposure processing on a substrate P, and the exposure apparatus EX is incorporated into a device manufacturing system 1 that performs various processing on the substrate P after exposure to manufacture devices. ing. First, the device manufacturing system 1 will be described.

<Device manufacturing system>
The device manufacturing system 1 is a line (flexible / electronic device manufacturing line) for manufacturing an electronic device such as a flexible display as a device, multilayer flexible wiring, a flexible sensor or the like. In the following embodiments, a flexible display will be described as an example of an electronic device. As a flexible display, there is an organic EL display, for example. In this device manufacturing system 1, various processes are performed on the substrate P which has been fed and sent out from a supply roll (not shown) in which a flexible (flexible) long substrate P is wound in a roll shape. Is continuously applied, and then the processed substrate P is wound as a flexible device on a recovery roll (not shown), which is a so-called roll-to-roll system. In the device manufacturing system 1 of the first embodiment, the substrate P which is a film-like sheet is fed from the supply roll, and the substrate P fed from the supply roll is sequentially processed by the process apparatus U1, the exposure apparatus EX, and the process apparatus. An example is shown after U2 and being wound up on a recovery roll. Here, the substrate P to be processed by the device manufacturing system 1 will be described.

  As the substrate P, for example, a resin film, a foil made of metal or alloy such as stainless steel, or the like is used. Examples of the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Includes one or more.

  For example, it is desirable to select a substrate P whose thermal expansion coefficient is not significantly large so that the amount of deformation due to heat received in various processes applied to the substrate P can be substantially ignored. The thermal expansion coefficient may be set smaller than the threshold according to the process temperature or the like, for example, by mixing an inorganic filler into the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate P may be a single layer of ultrathin glass with a thickness of about 100 μm manufactured by the float method or the like, or a laminate obtained by bonding the above-mentioned resin film, foil or the like to this ultrathin glass. It may be

  The substrate P configured in this way is wound into a roll and becomes a supply roll, and the supply roll is mounted on the device manufacturing system 1. The device manufacturing system 1 mounted with the supply roll repeatedly executes various processes for manufacturing the device on the substrate P delivered from the supply roll. For this reason, on the substrate P after processing, a plurality of devices (for example, display panels for a television and a personal computer) are formed in a row in a longitudinal direction at a predetermined interval. That is, the substrate P delivered from the supply roll is a substrate for multiple chamfering. The substrate P may be one obtained by modifying and activating the surface in advance by predetermined pretreatment, or a substrate having a fine partition structure (concave and convex structure) for precise patterning on the surface.

  The processed substrate P is wound into a roll and is recovered as a recovery roll. The recovery roll is mounted on a dicing apparatus (not shown). The dicing apparatus on which the recovery roll is mounted divides the processed substrate P into devices by dividing it into devices (dicing). The dimensions of the substrate P are, for example, about 10 cm to 2 m in the width direction (direction in which the length is short), and the dimensions in the length direction (direction in which the length is long). Depending on the maximum diameter of the recovery roll, it may be several hundred meters to several thousand meters. In addition, the dimension (each dimension of short / long) of the board | substrate P is not limited to an above-described dimension. In addition, the transport form of the substrate supplied from the supply roll and recovered by the recovery roll is not necessarily required.

  Subsequently, the device manufacturing system 1 will be described with reference to FIG. The device manufacturing system 1 includes a process device U1, an exposure device EX, and a process device U2. In FIG. 1, an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other is shown. The X direction is a direction from the process apparatus U1 to the process apparatus U2 via the exposure apparatus EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction.

  The process apparatus U1 performs a process (preprocess) of the previous process on the substrate P to be exposed by the exposure apparatus EX. The process apparatus U1 sends the pre-processed substrate P toward the exposure apparatus EX. At this time, the substrate P sent to the exposure apparatus EX is a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer) formed on its surface.

  Here, the photosensitive functional layer is uniformly or selectively applied as a solution on the substrate P and becomes a layer (film) by drying. A typical photosensitive functional layer is a photoresist, but a photosensitive silane coupling material (SAM), in which the lyophilic property of the portion irradiated with ultraviolet light is modified, as a material not requiring development processing, Alternatively, there is a photosensitive reducing material or the like in which the plating reducing group is exposed to the portion irradiated with the ultraviolet light. When a photosensitive silane coupling material is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet light on the substrate P is modified from lyophobic to lyophilic, so the lyophilic portion A conductive ink (ink containing conductive nanoparticles such as silver and copper) is selectively applied on top to form a pattern layer. When a photosensitive reducing material is used as the photosensitive functional layer, the plating reduction group is exposed on the pattern portion exposed to ultraviolet light on the substrate P, so that the substrate P is subjected to electroless plating immediately after the exposure, including palladium ion A pattern layer of palladium is formed (deposited) by immersion in a liquid for a fixed time.

  The exposure apparatus EX draws a pattern such as a circuit or wiring for a display panel on the substrate P supplied from the process apparatus U1. Although the details will be described later, the exposure apparatus EX exposes a predetermined pattern on the substrate P by a plurality of drawing lines LL1 to LL5 obtained by scanning each of the plurality of drawing beams LB in a predetermined scanning direction. . The substrate P subjected to the exposure processing by the exposure apparatus EX is sent to the processing apparatus U2, and the processing apparatus U2 performs post-processing processing (post processing) on the substrate P. Thereby, a specific pattern layer of the electronic device is formed on the surface of the substrate P.

<Exposing device (pattern drawing device)>
Subsequently, the exposure apparatus EX will be described with reference to FIGS. 1 to 9. FIG. 2 is a perspective view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 3 is a view showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. FIG. 4 is a view showing the configuration of the rotary drum and the drawing apparatus of the exposure apparatus of FIG. FIG. 5 is a plan view showing the arrangement of the main part of the exposure apparatus of FIG. FIG. 6 is a perspective view showing the configuration of the branching optical system of the exposure apparatus of FIG. FIG. 7 is a diagram showing the arrangement of the scanners in the plurality of drawing modules provided in the exposure apparatus of FIG. FIG. 8 is a perspective view showing the arrangement of the alignment microscope, the drawing line and the encoder head on the substrate. FIG. 9 is a perspective view showing the surface structure of the rotary drum of the exposure apparatus of FIG.

  As shown in FIG. 1, the exposure apparatus EX is an exposure apparatus that does not use a mask, that is, a so-called raster scan type drawing exposure apparatus (direct drawing exposure apparatus), and conveys the substrate P in the transport direction. The spot light is scanned in a predetermined scanning direction to draw on the surface of the substrate P to form a predetermined pattern.

  As shown in FIG. 1, the exposure apparatus EX includes a drawing apparatus 11, a substrate transport mechanism 12, alignment microscopes AM1 and AM2, and a control device 16. The drawing device 11 draws a predetermined pattern on a part of the substrate P transported by the substrate transport mechanism 12 by the plurality of drawing modules UW1 to UW5. The substrate transfer mechanism 12 transfers the substrate P transferred from the process apparatus U1 of the previous process to the process apparatus U2 of the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 detect alignment marks and the like formed in advance on the substrate P in order to relatively align the drawing pattern drawn on the substrate P with the substrate P. The control device 16 controls each part of the exposure apparatus EX to cause each part to execute processing. The controller 16 may be part or all of a higher-level controller that controls the device manufacturing system 1. Further, the control device 16 may be a device different from the upper control device controlled by the upper control device. The controller 16 includes, for example, a computer.

  Furthermore, as shown in FIG. 2, the exposure apparatus EX includes an apparatus frame 13 for supporting the drawing apparatus 11 and the substrate transfer mechanism 12, and a rotary drum DR supported by the apparatus frame 13 and also a part of the substrate A rotational position detection mechanism (see FIG. 4 and FIG. 8 for details) 14 for measuring the rotational position (angular position) is provided. Furthermore, in the exposure apparatus EX, a light source device CNT that emits a laser beam (pulsed beam) as the drawing beam LB is provided. The drawing beam LB in the ultraviolet wavelength range emitted from the light source device CNT is adjusted to a predetermined optical state in the drawing device 11, and is scanned one-dimensionally by the optical scanning mechanism, The spot light having a predetermined diameter is projected onto the substrate P held and transported by the outer peripheral surface of the DR.

  The exposure apparatus EX shown in FIG. 1 is stored in the temperature control chamber EVC. The temperature control chamber EVC is installed on the installation surface E of the manufacturing plant via the passive or active vibration isolation units SU1 and SU2. The vibration isolation units SU1 and SU2 are provided on the installation surface E, and reduce vibration from the installation surface E. By keeping the temperature control chamber EVC at a predetermined temperature, a shape change due to the temperature of the substrate P transported inside is suppressed.

  Next, with reference to FIG. 1, the substrate transfer mechanism 12 of the exposure apparatus EX will be described. The substrate transport mechanism 12 has an edge position controller EPC, a drive roller DR4, a tension adjustment roller RT1, a rotating drum DR, a tension adjustment roller RT2, a drive roller DR6, and a drive roller DR7 in this order from the upstream side of the substrate P transport direction. doing.

  The edge position controller EPC adjusts the position in the width direction of the substrate P transported from the process device U1. The edge position controller EPC is configured such that the position at an end (edge) in the width direction of the substrate P sent from the process device U1 falls within a range of about ± 10s of μm to several tens of μm with respect to the target position. Is moved in the width direction to correct the position of the substrate P in the width direction. The positioning accuracy of the substrate P in the width direction (Y direction) by the edge position controller EPC is within the adjustable range of the exposure position (drawing position), that is, the range where the drawing device 11 can adjust the scanning position by the spot light. Is desirable.

  The driving roller DR4 rotates while sandwiching the front and back sides of the substrate P transported from the edge position controller EPC, and transports the substrate P toward the rotating drum DR by delivering the substrate P to the downstream side in the transport direction. The rotary drum DR rotates the substrate P around the rotation center line AX2 around the rotation center line AX2 extending in the Y direction while supporting the portion to be pattern-exposed on the substrate P in a cylindrical surface shape. Transport In order to rotate such a rotating drum DR around the rotation center line AX2, shaft portions Sf2 coaxial with the rotation center line AX2 are provided on both sides of the rotating drum DR. A rotational torque from a drive source (a motor, a reduction gear mechanism, etc.) (not shown) is applied to the shaft portion Sf2. A plane passing through the rotation center line AX2 and extending in the Z direction is a center plane p3. The two sets of tension adjustment rollers RT1 and RT2 apply a predetermined tension to the substrate P supported by being wound around the rotary drum DR. The two sets of drive rollers DR6 and DR7 are disposed at a predetermined interval in the transport direction of the substrate P, and give the substrate P after exposure a predetermined slack (play) DL. The driving roller DR6 holds and rotates the upstream side of the substrate P to be conveyed, and the driving roller DR7 turns and holds the downstream side of the substrate P to be conveyed, thereby directing the substrate P to the process device U2. Transport. At this time, since the substrate P is given a slack DL, it can absorb fluctuations in the transport speed of the substrate P that occur on the downstream side of the drive roller DR6 in the transport direction, and expose the substrate P by the transport speed Influence the influence of

  Accordingly, the substrate transport mechanism 12 adjusts the position of the substrate P transported from the process device U1 in the width direction by the edge position controller EPC. The substrate transport mechanism 12 transports the substrate P whose position in the width direction has been adjusted to the tension adjustment roller RT1 by the drive roller DR4, and transports the substrate P which has passed the tension adjustment roller RT1 to the rotating drum DR. Thus, the substrate P is closely supported on the outer peripheral surface of the rotary drum DR in a state in which the substrate P is given a predetermined tension in the longitudinal direction. The substrate transport mechanism 12 transports the substrate P supported by the rotary drum DR toward the tension adjustment roller RT2 by rotating the rotary drum DR. The substrate transport mechanism 12 transports the substrate P transported to the tension adjustment roller RT2 to the drive roller DR6, and transports the substrate P transported to the drive roller DR6 to the drive roller DR7. Then, the substrate transport mechanism 12 transports the substrate P toward the process device U2 while applying the slack DL to the substrate P by the drive roller DR6 and the drive roller DR7.

  Next, the apparatus frame 13 of the exposure apparatus EX will be described with reference to FIG. FIG. 2 is a perspective view showing the arrangement of the main part of the exposure apparatus of FIG. In FIG. 2, an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other is used, and the orthogonal coordinate system similar to FIG. 1 is used. The exposure apparatus EX includes an apparatus frame 13 for supporting the drawing apparatus 11 shown in FIG. 1 and the rotary drum DR of the substrate transfer mechanism 12.

  The apparatus frame 13 shown in FIG. 2 includes, in order from the lower side in the Z direction, the main body frame 21, the three-point seat support 22, the first optical surface plate 23, the rotation mechanism 24, and the second optical surface plate 25. have. As shown in FIG. 1, the main body frame 21 is installed on the installation surface E via the vibration isolation units SU1 and SU2. The main body frame 21 rotatably supports the rotary drum DR and the tension adjustment roller RT1 (not shown) and RT2. The first optical surface plate 23 is provided on the upper side in the vertical direction of the rotary drum DR, and is installed on the main body frame 21 via the three-point seat support 22. The three-point seat support 22 supports the first optical surface plate 23 in kinematics at three support points (with steel balls and V-grooves), and can adjust the Z direction at each support point. For this reason, the three-point support 22 can adjust the height of the surface of the first optical surface plate 23 in the Z direction and the inclination with respect to the horizontal surface. When assembling the device frame 13, the position in the X direction and the Y direction can be adjusted in the XY plane between the main body frame 21 and the three-point seat support 22. On the other hand, after the assembly of the device frame 13, the space between the main body frame 21 and the three-point seat support 22 is fixed (a rigid state). However, at the time of calibration and the like at the time of maintenance, it is preferable that the three-point seat support 22 be finely moved in the X and Y directions on the main body frame 21 as necessary.

  The second optical surface plate 25 is provided on the upper side in the vertical direction (Z direction) of the first optical surface plate 23, and is installed on the first optical surface plate 23 via the rotation mechanism 24. The second optical surface plate 25 has its surface parallel to the surface of the first optical surface plate 23. A plurality of (five in this embodiment) drawing modules UW1 to UW5 of the drawing apparatus 11 are installed on the second optical surface plate 25. The rotation mechanism 24 holds the surface of each of the first optical surface plate 23 and the second optical surface plate 25 in parallel, and centers on a predetermined rotation axis I (also referred to as a rotation center line) extending in the Z direction. It has a structure in which the second optical surface plate 25 is minutely rotated precisely with respect to the first optical surface plate 23. The rotation axis I extends in the Z direction in the central plane p3 in FIG. 1 and is a predetermined point on the surface of the substrate P (a drawing surface curved according to a circumferential surface) wound around the rotating drum DR. Through (see Figure 3). Then, the rotation mechanism 24 rotates the second optical surface plate 25 with respect to the first optical surface plate 23 to make the plurality of drawing modules UW1 to UW5 with respect to the rotary drum DR or the substrate P wound around the rotary drum DR. The angular position in the entire XY plane can be precisely adjusted.

  The rotation mechanism 24 is disposed so as to face each of the upper surface side of the first optical surface plate 23 and the lower surface side of the second optical surface plate 25 with an inner diameter that surrounds the portion closest to the rotating drum DR of the drawing modules UW1 to UW5. And a bearing ball (roll) provided so as to be rollable between the ring-shaped pedestals.

  Subsequently, the light source device CNT shown in FIGS. 1, 4 and 5 will be described. The light source device CNT is installed on the main body frame 21 of the device frame 13. The laser beam for the drawing beam LB emitted from the light source device CNT is light of a predetermined wavelength range suitable for exposure of the photosensitive functional layer on the substrate P, and is set to an ultraviolet region having a strong photoactive action. . As a light source, for example, a laser light source such as a laser light which continuously oscillates or pulsates at a frequency of about 50 to 100 MHz with the third harmonic laser light of YAG (wavelength 355 nm) can be used.

  As a high power laser light source in the ultraviolet region, typically, an excimer laser using a gas such as KrF, ArF, XeCL or the like as a laser medium is known. In addition, it is also possible to use a solid light source such as a laser diode or a light emitting diode (LED) having an oscillation peak in an ultraviolet region of wavelength 450 nm or less. In this embodiment, as an example, as disclosed in International Publication No. WO 1999/046835 or International Publication No. WO 2001/020733, light from a solid-state light source that emits long wavelength light using a fiber amplifier and a nonlinear optical element It is assumed that a laser light source is used which converts (pulsed light in the infrared region) into ultraviolet pulsed light with a wavelength of 355 nm (emission time is about several picoseconds).

  The drawing beam LB emitted from such a light source device CNT is divided into five drawing modules UW1 to UW5 via a beam distribution system including a large number of polarization beam splitters, mirrors, etc., as shown in FIGS. Led to each of the It is preferable that the drawing beam LB be in a polarization state such that it is almost all reflected or almost all transmitted in the polarization beam splitter in order to suppress energy loss caused by transmission and reflection of the drawing beam LB in the polarization beam splitter.

  Next, the drawing apparatus 11 of the exposure apparatus EX will be described. The drawing apparatus 11 is a so-called multi-beam type (also called multi-head type) drawing apparatus 11 using a plurality of drawing modules (also called drawing heads) UW1 to UW5. The drawing device 11 branches the drawing beam LB emitted from the light source device CNT into a plurality of beams, and a plurality of spot lights by the plurality of drawn beams LB branched on the substrate P (5 in the first embodiment, for example) Are scanned along the drawing lines LL1 to LL5 of FIG. Then, the drawing device 11 seams the patterns drawn on the substrate P by the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, with reference to FIG. 3, the plurality of drawing lines LL1 to LL5 formed on the substrate P by scanning the plurality of drawing beams LB by the drawing apparatus 11 will be described.

  As shown in FIG. 3, the plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotary drum DR across the center plane p3. The odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged on the substrate P on the upstream side in the rotational direction of the rotary drum DR. On the substrate P on the downstream side in the rotational direction of the rotary drum DR, the second drawing line LL2 and the fourth drawing line LL4 of the even-numbered ones are arranged.

  The drawing lines LL1 to LL5 are formed in the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotary drum DR, and are shorter than the length of the substrate P in the width direction. More strictly speaking, when each substrate P is transported at a reference speed by the substrate transport mechanism 12, each of the rendering lines LL1 to LL5 minimizes the splice error of the pattern obtained by the plurality of rendering lines LL1 to LL5. It is inclined by a predetermined angle with respect to the rotation center line AX2 of the rotary drum DR.

  The odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged at predetermined intervals in the axial direction of the rotary drum DR. Further, the second drawing line LL2 and the fourth drawing line LL4 of even-numbered ones are arranged at predetermined intervals in the axial direction of the rotary drum DR. At this time, the second drawing line LL2 is disposed between the first drawing line LL1 and the third drawing line LL3 in the axial direction. Similarly, the third drawing line LL3 is disposed between the second drawing line LL2 and the fourth drawing line LL4 in the axial direction. The fourth drawing line LL4 is disposed between the third drawing line LL3 and the fifth drawing line LL5 in the axial direction. The first to fifth drawing lines LL1 to LL5 are arranged to cover the entire width in the Y direction of the exposure area A7 drawn on the substrate P.

  The scanning direction (main scanning direction) of the drawing beam LB scanned along the odd first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 is a one-dimensional direction, and the same direction It has become. The scanning direction of the drawing beam LB scanned along the even-numbered second drawing line LL2 and the fourth drawing line LL4 is a one-dimensional direction, and is the same direction. At this time, the scanning direction of the drawing beam LB scanned along the odd drawing lines LL1, LL3 and LL5 and the scanning direction of the drawing beam LB scanned along the even drawing lines LL2 and LL4 are as follows: It is in the same direction. Therefore, when viewed from the transport direction of the substrate P, the drawing start position (spot light scanning start point) of the odd-numbered drawing lines LL3, LL5 and the drawing end position (spot light of the even-numbered drawing lines LL2, LL4 The scanning end point) is adjacent (matches or partially overlaps in the Y direction), and similarly, drawing end positions of odd-numbered drawing lines LL1 and LL3 and drawing start positions of even-numbered drawing lines LL2 and LL4 Are adjacent (match or partially overlap in the Y direction).

  Next, the drawing apparatus 11 will be described with reference to FIGS. 4 to 7. The drawing apparatus 11 includes a plurality of drawing modules UW1 to UW5 described above, a branch optical system (also called a beam distribution system) SL that branches the drawing beam LB from the light source device CNT, and calibration detection for performing calibration. And a system 31.

  The branching optical system SL branches the drawing beam LB emitted from the light source device CNT into a plurality of branches, and guides the branched plurality of drawing beams LB toward the plurality of drawing modules UW1 to UW5. The branching optical system SL includes a first optical system 41 for branching the drawing beam LB emitted from the light source device CNT into two, and a second optical system to which one drawing beam LB branched by the first optical system 41 is irradiated. A system 42 and a third optical system 43 to which the other drawing beam LB branched by the first optical system 41 is irradiated. In addition, in the third optical system 43, the branching optical system SL shifts the beam LB before branching in the first optical system 41 two-dimensionally in a plane perpendicular to the beam axis, and in the third optical system 43. And the two-sided moving adjustment mechanism 45 for two-dimensionally shifting the light beam LB in a plane perpendicular to the beam axis. A part of the branch optical system SL on the light source device CNT side is installed on the main body frame 21, and another part on the drawing modules UW1 to UW5 side is installed on the second optical surface plate 25.

  The first optical system 41 includes a half wave plate 51, a polarization beam splitter 52, a beam diffuser 53, a first reflection mirror 54, a first relay lens 55, a second relay lens 56, and a second reflection. It has a mirror 57, a third reflecting mirror 58, a fourth reflecting mirror 59, and a first beam splitter 60.

  The drawing beam LB emitted from the light source device CNT in the + X direction is irradiated to the half wave plate 51. The half-wave plate 51 is rotatable in the irradiation plane of the drawing beam LB. The polarization direction of the drawing beam LB irradiated to the half-wave plate 51 is a predetermined polarization direction according to the amount of rotation of the half-wave plate 51. The drawing beam LB that has passed through the half-wave plate 51 is irradiated to the polarization beam splitter 52. The polarization beam splitter 52 transmits the drawing beam LB in a predetermined polarization direction, and reflects the drawing beam LB in a direction other than the predetermined polarization direction in the + Y direction. For this reason, the drawing beam LB reflected by the polarization beam splitter 52 passes through the half wave plate 51. The beam intensity is adjusted. That is, by rotating the half-wave plate 51 to change the polarization direction of the drawing beam LB, the beam intensity of the drawing beam LB reflected by the polarization beam splitter 52 can be adjusted.

  The drawing beam LB transmitted through the polarization beam splitter 52 is absorbed by the beam diffuser 53 and suppresses the leakage of the drawing beam LB irradiated to the beam diffuser 53 to the outside. The drawing beam LB reflected in the + Y direction by the polarization beam splitter 52 is irradiated to the first reflection mirror 54. The drawing beam LB irradiated to the first reflection mirror 54 is reflected by the first reflection mirror 54 in the + X direction, and irradiated to the second reflection mirror 57 via the first relay lens 55 and the second relay lens 56. . The drawing beam LB irradiated to the second reflection mirror 57 is reflected by the second reflection mirror 57 in the −Y direction and irradiated to the third reflection mirror 58. The drawing beam LB irradiated to the third reflection mirror 58 is reflected by the third reflection mirror 58 in the −Z direction, and is irradiated to the fourth reflection mirror 59. The drawing beam LB irradiated to the fourth reflection mirror 59 is reflected by the fourth reflection mirror 59 in the + Y direction, and is irradiated to the first beam splitter 60. While a part of the drawing beam LB irradiated to the first beam splitter 60 is reflected in the −X direction and irradiated to the second optical system 42, the other part is transmitted to the third optical system 43. Irradiated.

  The third reflection mirror 58 and the fourth reflection mirror 59 are provided at predetermined intervals on the rotation axis I of the rotation mechanism 24. Further, the configuration up to the light source device CNT including the third reflection mirror 58 (a part surrounded by a two-dot chain line on the upper side in the Z direction in FIG. 4) is installed on the main body frame 21 side and includes the fourth reflection mirror 59 The configuration of the plurality of drawing modules UW1 to UW5 (a part surrounded by a two-dot chain line on the lower side in the Z direction in FIG. 4) is installed on the second optical surface plate 25 side. For this reason, even if the second optical surface plate 25 is rotated relative to the first optical surface plate 23 by the rotation mechanism 24, the third reflection mirror 58 and the fourth reflection mirror 59 are provided on the rotation axis I. Therefore, the optical path of the drawing beam LB is not changed. Therefore, even if the second optical surface plate 25 is rotated relative to the first optical surface plate 23 by the rotation mechanism 24, the drawing beam LB emitted from the light source device CNT disposed on the main body frame 21 side is the second optical It is suitably guided to each of a plurality of drawing modules UW1-UW5 installed on the surface plate 25 side.

  The second optical system 42 guides one drawing beam LB branched by the first optical system 41 toward odd-numbered drawing modules UW1, UW3 and UW5 described later. The second optical system 42 includes a fifth reflection mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth reflection mirror 64.

  The drawing beam LB reflected in the −X direction by the first beam splitter 60 of the first optical system 41 is irradiated to the fifth reflection mirror 61. The drawing beam LB irradiated to the fifth reflection mirror 61 is reflected by the fifth reflection mirror 61 in the −Y direction, and is irradiated to the second beam splitter 62. A part of the drawing beam LB irradiated to the second beam splitter 62 is reflected, and the odd drawing module UW5 is irradiated (see FIGS. 5 and 6). The other part of the drawing beam LB irradiated to the second beam splitter 62 is transmitted, and the drawing beam LB is irradiated to the third beam splitter 63. A part of the drawing beam LB irradiated to the third beam splitter 63 is reflected, and the odd-numbered drawing module UW3 is irradiated (see FIGS. 5 and 6). The other part of the drawing beam LB irradiated to the third beam splitter 63 is transmitted, and the drawing beam LB is irradiated to the sixth reflection mirror 64. The drawing beam LB irradiated to the sixth reflection mirror 64 is reflected by the sixth reflection mirror 64 and irradiated to one drawing module UW1 of odd number (see FIGS. 5 and 6). In the second optical system 42, the drawing beam LB irradiated to the odd-numbered drawing modules UW1, UW3 and UW5 is slightly oblique to the -Z direction.

  The third optical system 43 branches and guides the other drawing beam LB branched by the first optical system 41 toward even-numbered drawing modules UW 2 and UW 4 described later. The third optical system 43 includes a seventh reflection mirror 71, an eighth reflection mirror 72, a fourth beam splitter 73, and a ninth reflection mirror 74.

  The drawing beam LB transmitted in the Y direction by the first beam splitter 60 of the first optical system 41 is irradiated to the seventh reflection mirror 71. The drawing beam LB irradiated to the seventh reflection mirror 71 is reflected by the seventh reflection mirror 71 in the X direction, and is irradiated to the eighth reflection mirror 72. The drawing beam LB irradiated to the eighth reflection mirror 72 is reflected by the eighth reflection mirror 72 in the −Y direction, and is irradiated to the fourth beam splitter 73. A part of the drawing beam LB irradiated to the fourth beam splitter 73 is reflected, and the drawing beam LB is irradiated to an even-numbered drawing module UW 4 (see FIGS. 5 and 6). The other part of the drawing beam LB irradiated to the fourth beam splitter 73 is transmitted, and the drawing beam LB is irradiated to the ninth reflection mirror 74. The drawing beam LB irradiated to the ninth reflection mirror 74 is reflected by the ninth reflection mirror 74, and irradiated to one drawing module UW2 of even number. Also in the third optical system 43, the drawing beam LB irradiated to the even-numbered drawing modules UW2 and UW4 is slightly oblique to the -Z direction.

  As described above, in the branch optical system SL, the drawing beam LB from the light source device CNT is branched into a plurality of directions toward the plurality of drawing modules UW1 to UW5. At this time, in the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73, the beam intensities of the drawing beams LB irradiated to the plurality of drawing modules UW1 to UW5 become the same. As such, the reflectance (transmittance) is set to an appropriate reflectance according to the number of branches of the drawing beam LB.

  The XY overall moving adjustment mechanism 44 is disposed between the second relay lens 56 and the second reflecting mirror 57 as shown in FIG. The XY overall moving adjustment mechanism 44 minutely shifts the beam LB incident on the first beam splitter 60 in a two-dimensional manner in a plane perpendicular to the beam axis, and particularly adjusts the position of the beam passing through the second optical system 42. The XY overall having adjusting mechanism 44 is composed of transparent parallel flat glass which can be tilted in the XZ plane of FIG. 6 and transparent parallel flat glass which can be tilted in the YZ plane of FIG. By adjusting the tilt amounts of the two parallel flat glass plates, the beam LB incident on the first beam splitter 60 can be slightly shifted in the X direction and the Z direction in FIG.

  The XY one-side moving adjustment mechanism 45 is disposed between the seventh reflecting mirror 71 and the eighth reflecting mirror 72. The XY one-side moving adjustment mechanism 45 two-dimensionally finely shifts the beam LB transmitted through the first beam splitter 60 in a plane perpendicular to the beam axis, and particularly adjusts the position of the beam passing through the third optical system 43 . Similar to the whole XY moving adjustment mechanism 44, the XY one-side moving adjustment mechanism 45 is a transparent parallel flat glass which can be inclined within the XZ plane of FIG. 6 and a transparent parallel flat glass which can be inclined within the YZ plane of FIG. And consists of By adjusting the tilt amounts of the two parallel flat glass plates, the positions of the drawing beams LB incident on the even-numbered drawing modules UW2 and UW4 can be slightly shifted. As apparent from the configuration of FIG. 6, the positional shift of the beam LB by the XY overall halving adjustment mechanism 44 also shifts the position of the beam transmitted through the first beam splitter 60 and incident on the third optical system 43. The position adjustment of the beams incident on the even-numbered drawing modules UW 2 and UW 4 is performed by both the XY overall weaving adjustment mechanism 44 and the XY one-side weaving adjustment mechanism 45.

  Subsequently, the plurality of drawing modules UW1 to UW5 will be described with reference to FIG. 4, FIG. 5 and FIG. The plurality of drawing modules UW1 to UW5 are provided in accordance with the plurality of drawing lines LL1 to LL5. The plurality of drawing beams LB branched by the branching optical system SL are respectively incident on the plurality of drawing modules UW1 to UW5. Each of the drawing modules UW1 to UW5 condenses a plurality of drawing beams LB onto spot light on each of the drawing lines LL1 to LL5, and scans the spot lights. That is, the first drawing module UW1 guides the drawing beam LB to the first drawing line LL1, and similarly, the second to fifth drawing modules UW2 to UW5 draw the drawing beam LB to the second to fifth drawing lines LL2 to LL5. Lead to

  As shown in FIG. 4 (and FIG. 1), the plurality of drawing modules UW1 to UW5 are arranged in two rows in the circumferential direction of the rotary drum DR across the center plane p3. The plurality of drawing modules UW1 to UW5 are the first drawing on the side where the first, third, and fifth drawing lines LL1, LL3, and LL5 are arranged (the -X direction side in FIG. 5) across the central plane p3. A module UW1, a third drawing module UW3 and a fifth drawing module UW5 are arranged. The first drawing module UW1, the third drawing module UW3, and the fifth drawing module UW5 are arranged at predetermined intervals in the Y direction. The plurality of drawing modules UW1 to UW5 are arranged on the side where the second and fourth drawing lines LL2 and LL4 are arranged (the + X direction side in FIG. 5) with respect to the center plane p3. 4 Drawing module UW4 is arranged. The second drawing module UW2 and the fourth drawing module UW4 are arranged at predetermined intervals in the Y direction. At this time, the second drawing module UW2 is located between the first drawing module UW1 and the third drawing module UW3 in the Y direction. Similarly, the third drawing module UW3 is located between the second drawing module UW2 and the fourth drawing module UW4 in the Y direction. The fourth drawing module UW4 is located between the third drawing module UW3 and the fifth drawing module UW5 in the Y direction. Further, as shown in FIG. 4, the first drawing module UW1, the third drawing module UW3 and the fifth drawing module UW5, and the second drawing module UW2 and the fourth drawing module UW4 view the central plane p3 as viewed from the Y direction. It is arranged symmetrically at the center.

  Next, each drawing module UW1 to UW5 will be described with reference to FIG. Since each of the drawing modules UW1 to UW5 has the same configuration, the first drawing module UW1 (hereinafter, simply referred to as the drawing module UW1) will be described as an example.

  In order to scan the drawing beam LB along the drawing line LL1 (first drawing line LL1), the drawing module UW1 shown in FIG. A scanner 83, a bending mirror 84, an f-θ lens system 85, and an optical member 86 for Y magnification correction are provided. Further, a calibration detection system 31 is provided adjacent to the deflection beam splitter PBS.

  The light deflector 81 is formed of, for example, an acousto-optic modulator (AOM), and switches the generation / non-generation of diffracted light of the incident beam at high speed to project / non-project the drawing beam LB onto the substrate P. Switch fast. By this, the intensity of the spot light irradiated to the substrate P is modulated based on the pattern drawing information (serial bit string signal) applied to the modulator (AOM) 81. Specifically, the drawing beam LB from the branch optical system SL is slightly inclined with respect to the −Z direction via the relay lens 91 and is incident on the light deflector 81. When the light deflector 81 is in the OFF state, the drawing beam LB goes straight in the inclined state and is shielded by the light shielding plate 92 provided at the end of passing the light deflector 81. When the light deflector 81 is in the ON state, the diffracted drawing beam LB is deflected in the -Z direction, passes through the light deflector 81, and is incident on the polarization beam splitter PBS provided on the Z direction of the light deflector 81. Do. Therefore, while the light deflector 81 is on, the spot light of the drawing beam LB continues to be projected onto the substrate P, and while the light deflector 81 is off, the projection of the spot light of the drawing beam LB onto the substrate P is It is interrupted.

  The deflection beam splitter PBS reflects the drawing beam LB emitted from the light deflector 81 through the relay lens 93. On the other hand, the deflection beam splitter PBS cooperates with the quarter-wave plate 82 provided between the deflection beam splitter PBS and the scanner 83 to draw the drawing beam LB reflected by the surface of the substrate P or the rotating drum DR. Is transparent. That is, the drawing beam LB directed from the light deflector 81 to the polarization beam splitter PBS is a laser beam which becomes a linear polarization of S polarization, and is reflected by the polarization beam splitter PBS. The drawing beam LB reflected by the polarization beam splitter PBS passes through the 1⁄4 wavelength plate 82 and becomes circularly polarized light and reaches the substrate P. A part of the reflected light of the drawing beam LB reflected by the surface of the substrate P or the rotary drum DR and returned via the f-θ lens system 85 and the scanner 83 passes through the quarter wavelength plate 82 again. It becomes linear polarization of P polarization. Therefore, the reflected light of the drawing beam LB irradiated from the substrate P to the polarization beam splitter PBS passes through the polarization beam splitter PBS. The reflected light of the drawing beam LB transmitted through the polarization beam splitter PBS is irradiated to the calibration detection system 31 via the relay lens 94. The drawing beam LB reflected by the deflection beam splitter PBS via the relay lens system 93 passes through the 1⁄4 wavelength plate 82 and enters the scanner 83.

  As shown in FIGS. 4 and 7, the scanner 83 has a reflecting mirror 96, a rotating polygon mirror (rotating polygon mirror) 97, and an origin detector 98. The drawing beam LB that has passed through the 1⁄4 wavelength plate 82 is irradiated to the reflection mirror 96 via the relay lens 95. The drawing beam LB reflected by the reflection mirror 96 is irradiated to the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of polygon surfaces (reflection planes) 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 rotates in a predetermined rotation direction about the rotation axis 97a to continuously change the reflection angle of the drawing beam LB irradiated to the polygon surface 97b, thereby reflecting the drawing beam LB reflected. Are scanned along the drawing line LL1 on the substrate P. The drawing beam LB reflected by the rotating polygon mirror 97 is irradiated to the bending mirror 84. The origin detector 98 detects the origin (predetermined scanning start point) of the drawing beam LB scanned along the drawing line LL1 of the substrate P. The origin detector 98 is disposed on the opposite side of the reflection mirror 96 with the drawing beam LB reflected by each polygon surface 97 b interposed therebetween. Therefore, the origin detector 98 detects the drawing beam LB before being irradiated to the f-θ lens system 85. That is, the origin detector 98 detects the angular position of the polygon surface 97b immediately before the spot light is irradiated to the drawing start position of the drawing line LL1 on the substrate P.

  The drawing beam LB irradiated from the scanner 83 to the bending mirror 84 is reflected by the bending mirror 84 and irradiated to the f-θ lens system 85. The f-θ lens system 85 includes a telecentric f-θ lens, and projects the drawing beam LB reflected from the rotating polygon mirror 97 via the bending mirror 84 perpendicularly to the drawing surface of the substrate P.

  As shown in FIG. 7, the plurality of scanners 83 in the plurality of drawing modules UW1 to UW5 have a left-right symmetric configuration with respect to the center plane p3. In the plurality of scanners 83, three scanners 83 corresponding to the drawing modules UW1, UW3 and UW5 are disposed on the upstream side (the -X direction side in FIG. 7) of the rotation direction of the rotary drum DR Two scanners 83 corresponding to UW 4 are disposed on the downstream side (the + X direction side in FIG. 7) of the rotation direction of the rotary drum DR. The three upstream scanners 83 and the two downstream scanners 83 are disposed to face each other across the center plane p3. At this time, the respective scanners 83 disposed on the upstream side and the respective scanners 83 disposed on the downstream side are symmetrical with respect to the center plane p3. Furthermore, the three rotating polygon mirrors 97 on the upstream side scan the drawing beam LB while rotating counterclockwise (counterclockwise) in the XY plane, and are thereby projected onto odd-numbered drawing lines LL1, LL3, and LL5. Each spot light is scanned in a predetermined scanning direction (for example, the + Y direction in FIG. 7) from the drawing start position toward the drawing end position. On the other hand, the two rotating polygon mirrors 97 on the downstream side scan the drawing beam LB while rotating clockwise (clockwise) in the XY plane, whereby the spots projected onto the even-numbered drawing lines LL2 and LL4 The light is scanned from the drawing start position to the drawing end position in the same scanning direction (+ Y direction) as the three upstream drawing lines LL1, LL3, and LL5.

  Here, when viewed in the XZ plane of FIG. 4, the axis line of the drawing beam LB reaching the substrate P from the odd-numbered drawing modules UW1, UW3, UW5 is in a direction coincident with the installation azimuth line Le1. That is, the installation azimuth line Le1 is a line connecting the odd-numbered drawing lines LL1, LL3, and LL5 and the rotation center line AX2 in the XZ plane. Similarly, when viewed in the XZ plane of FIG. 4, the axis line of the drawing beam LB reaching the substrate P from the even-numbered drawing modules UW2 and UW4 is in a direction coincident with the installation azimuth line Le2. That is, the installation azimuth line Le2 is a line connecting the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane.

  The Y magnification correcting optical member 86 is a combination of a cylindrical lens having positive refractive power in the Y direction and a cylindrical lens having negative refractive power in the Y direction, and includes the f-θ lens system 85 and the substrate P. Is placed between. By finely moving at least one of the plurality of cylindrical lenses constituting the Y magnification correction optical member 86 in the direction of the optical axis of the f-θ lens system 85 (the axis of the drawing beam LB) The drawn lines LL1 to LL5 can be isotropically enlarged or reduced by a very small amount in the Y direction.

  In the drawing device 11 configured in this manner, a predetermined pattern is drawn on the substrate P by controlling each part by the control device 16. That is, while the drawing beam LB projected onto the substrate P is scanning in the scanning direction, the control device 16 generates light based on CAD (Computer Aided Design) information which is information of a pattern to be drawn on the substrate P. The drawing beam LB is deflected by On / Off modulation of the deflector 81 to draw a pattern on the photosensitive layer of the substrate P. Further, the control device 16 synchronizes the scanning direction (scanning start timing) of the spot light of the drawing beam LB scanning along the drawing line LL1 with the movement of the substrate P in the transport direction by the rotation of the rotary drum DR. A predetermined pattern is drawn in a portion corresponding to the drawing line LL1 in the exposure area A7.

At this time, the effective size (spot diameter) of the spot light on the substrate P of the drawing beam LB projected from each drawing module UW1 to UW5 is D (μm), and the spot light scan along the drawing lines LL1 to LL5 Assuming that the velocity is Vp (μm / sec), the light source device CNT sets the light emission repetition period T (seconds) of the laser light source emitting pulsed light to the relationship of T <D / Vp. The effective size (diameter) of the spot light is the width (full width at half maximum) which is half the peak value on the intensity distribution in the main scanning direction of the spot light, or 1 / e ² for the peak value And the width of the

  Next, alignment microscopes AM1 and AM2 as a pattern detection unit will be described with reference to FIGS. 3 and 8. The alignment microscopes AM1 and AM2 detect an alignment mark formed in advance on the substrate P, or a reference mark, a reference pattern, or the like formed on the rotating drum DR in a predetermined observation area. Hereinafter, the alignment mark of the substrate P, the reference mark and the reference pattern of the rotary drum DR may be simply referred to as a mark. The alignment microscopes AM1 and AM2 are used to align the substrate P with a predetermined pattern drawn on the substrate P, or to calibrate the rotary drum DR and the drawing apparatus 11.

  The alignment microscopes AM1 and AM2 are provided upstream of the drawing lines LL1 to LL5 formed by the drawing apparatus 11 in the rotation direction of the rotary drum DR. Further, the alignment microscope AM1 is disposed on the upstream side in the rotation direction of the rotary drum DR as compared with the alignment microscope AM2.

  The alignment microscopes AM1 and AM2 project illumination light onto the substrate P or the rotary drum DR, and an image of a mark received through the objective lens system GA and the objective lens system GA as a detection probe for incidence of the light generated at the mark. It comprises an imaging system GD or the like for imaging (bright field image, dark field image, fluorescent image, etc.) with a two-dimensional CCD, CMOS etc. Note that the illumination light for alignment is light in a wavelength range that has little sensitivity to the photosensitive layer on the substrate P, for example, light with a wavelength of about 500 to 800 nm.

  A plurality of (for example, three) alignment microscopes AM1 are provided in line in the Y direction (the width direction of the substrate P). Similarly, a plurality of (for example, three) alignment microscopes AM2 are provided in line in the Y direction (the width direction of the substrate P). That is, a total of six alignment microscopes AM1 and AM2 are provided.

  In FIG. 3, in order to make it easy to understand, the arrangement of the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 among the objective lens systems GA of the six alignment microscopes AM1 and AM2 is shown. The observation areas (detection positions) Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotating drum DR) by the respective objective lens systems GA1 to GA3 of the three alignment microscopes AM1 are, as shown in FIG. The parallel Y-directions are arranged at predetermined intervals. As shown in FIG. 8, the optical axes La1 to La3 of the objective lens systems GA1 to GA3 passing through the centers of the observation regions Vw1 to Vw3 are all parallel to the XZ plane. Similarly, as shown in FIG. 3, the observation areas Vw4 to Vw6 on the substrate P (or the outer peripheral surface of the rotating drum DR) by the respective objective lens systems GA of the three alignment microscopes AM2 are Y parallel to the rotation center line AX2. The directions are arranged at predetermined intervals. As shown in FIG. 8, the optical axes La4 to La6 of the objective lens systems GA passing through the centers of the observation regions Vw4 to Vw6 are all parallel to the XZ plane. The observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotary drum DR.

  The observation areas Vw1 to Vw6 of the marks by the alignment microscopes AM1 and AM2 are set, for example, in a range of about 200 μm square on the substrate P and the rotary drum DR. Here, the optical axes La1 to La3 of the alignment microscope AM1, that is, the optical axes La1 to La3 of the objective lens system GA are set in the same direction as the installation azimuth Le3 extending in the radial direction of the rotating drum DR from the rotation center line AX2. Ru. That is, the installation azimuth line Le3 is a line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 when viewed in the XZ plane of FIG. Similarly, the optical axes La4 to La6 of the alignment microscope AM2, that is, the optical axes La4 to La6 of the objective lens system GA, are set in the same direction as the installation azimuth Le4 extending in the radial direction of the rotary drum DR from the rotation center line AX2. Ru. That is, the installation azimuth line Le4 is a line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 when viewed in the XZ plane of FIG. At this time, since the alignment microscope AM1 is disposed upstream of the alignment microscope AM2 in the rotational direction of the rotary drum DR, the angle between the central plane p3 and the installation azimuth Le3 is the same as that of the central plane p3. The angle is larger than the angle formed by the installation direction line Le4.

  On the substrate P, as shown in FIG. 3, exposure areas A7 drawn by each of the five drawing lines LL1 to LL5 are arranged at predetermined intervals in the X direction. Around the exposure area A7 on the substrate P, a plurality of alignment marks Ks1 to Ks3 (hereinafter abbreviated as marks) for alignment are formed in, for example, a cross shape. Each drawing module specifies (corrects) the main scanning position of the spot light by specifying the position on the substrate P on which the pattern is to be drawn based on the detection result of the alignment marks Ks1 to Ks2 by the alignment microscopes AM1 and AM2. Alignment is not limited to this. For example, alignment may be performed by detecting a partial shape of a circuit pattern or the like formed on the substrate P by the alignment microscopes AM1 and AM2.

  In FIG. 3, the mark Ks1 is provided in the peripheral region on the −Y side of the exposure region A7 at a constant interval in the X direction, and the mark Ks3 is constant in the peripheral region on the + Y side of the exposure region A7 in the X direction. It is provided at intervals. Further, the mark Ks2 is provided at the center in the Y direction in the margin area between two exposure areas A7 adjacent in the X direction.

  The mark Ks1 is sequentially captured while the substrate P is being sent in the observation area Vw1 of the objective lens system GA1 of the alignment microscope AM1 and the observation area Vw4 of the objective lens system GA of the alignment microscope AM2. Is formed. Also, the mark Ks3 is to be sequentially captured while the substrate P is being sent in the observation area Vw3 of the objective lens system GA3 of the alignment microscope AM1 and in the observation area Vw6 of the objective lens system GA of the alignment microscope AM2. Is formed. Furthermore, while the substrate P is being sent, the mark Ks2 is sequentially captured in the observation area Vw2 of the objective lens system GA2 of the alignment microscope AM1 and the observation area Vw5 of the objective lens system GA of the alignment microscope AM2, respectively. Formed to

  Therefore, among the three alignment microscopes AM1 and AM2, the alignment microscopes AM1 and AM2 on both sides in the Y direction of the rotary drum DR constantly observe or detect the marks Ks1 and Ks3 formed on both sides in the width direction of the substrate P. be able to. Further, among the three alignment microscopes AM1 and AM2, the alignment microscopes AM1 and AM2 at the center of the rotary drum DR in the Y direction are in the margin in the longitudinal direction between the exposure regions A7 drawn on the substrate P. The formed mark Ks2 can be constantly observed or detected.

  Here, since the exposure apparatus EX applies a so-called multi-beam type drawing apparatus 11, a plurality of patterns drawn on the substrate P by the drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 In order to preferably join together in the Y direction, calibration is required to keep the joint accuracy by the plurality of drawing modules UW1 to UW5 within the allowable range. Further, the relative positional relationship between the observation areas Vw1 to Vw6 of the alignment microscopes AM1 and AM2 with respect to the respective drawing lines LL1 to LL5 of the plurality of drawing modules UW1 to UW5 needs to be accurately determined by baseline management. Calibration is also required for baseline management.

  In calibration for confirming the joint accuracy by the plurality of drawing modules UW1 to UW5 and calibration for baseline management of the alignment microscopes AM1 and AM2, at least a part of the outer peripheral surface of the rotating drum DR supporting the substrate P It is necessary to provide a reference mark and a reference pattern. Therefore, as shown in FIG. 9, in the exposure apparatus EX, a rotary drum DR provided with a reference mark and a reference pattern on the outer peripheral surface is used.

  The rotary drum DR has scale portions GPa and GPb which form a part of a rotational position detection mechanism 14 described later on both end sides of the outer peripheral surface thereof. In the rotary drum DR, inside the scale portions GPa and GPb, restriction bands CLa and CLb having a narrow width by concave grooves or convex rims are engraved along the entire circumference. The width of the substrate P in the Y direction is set smaller than the distance between the two restriction bands CLa and CLb in the Y direction, and the substrate P is sandwiched by the restriction bands CLa and CLb on the outer peripheral surface of the rotary drum DR. It is closely supported to the inner area.

  The rotary drum DR has a plurality of line patterns RL1 inclined at +45 degrees with respect to the rotation center line AX2 and -45 degrees with respect to the rotation center line AX2 on the outer peripheral surface sandwiched by the regulation bands CLa and CLb A mesh-like reference pattern (also usable as a reference mark) RMP in which a plurality of line patterns RL2 are repeatedly cut at a constant pitch (period) Pf1 and Pf2 is provided. As an example, the line width LW of the line pattern RL1 and the line pattern RL2 is set to about several μm to 20 μm, and the pitch (period) Pf1 and Pf2 are set to about several tens μm to several hundreds μm.

  The reference pattern RMP is a uniform oblique pattern (diagonal grid pattern) over the entire surface so that no change in the frictional force or the tension of the substrate P occurs in the portion where the substrate P contacts the outer peripheral surface of the rotary drum DR There is. The line patterns RL1 and RL2 do not necessarily have to be 45 degrees diagonally, and may be a mesh pattern in which the line pattern RL1 is parallel to the Y axis and the line pattern RL2 is parallel to the X axis. Furthermore, it is not necessary to cross the line patterns RL1 and RL2 at 90 degrees, and the rectangular area surrounded by the two adjacent line patterns RL1 and the two adjacent line patterns RL2 is other than a square (or a rectangle). The line patterns RL1 and RL2 may be intersected at an angle that forms a rhombus.

  Next, the rotational position detection mechanism 14 will be described with reference to FIGS. 3, 4 and 8. As shown in FIG. 8, the rotational position detection mechanism 14 optically detects the rotational position of the rotary drum DR, and for example, an encoder system using a rotary encoder or the like is applied. The rotational position detection mechanism 14 has scale parts GPa and GPb provided at both ends of the rotary drum DR, and a plurality of encoder heads EN1, EN2, EN3 and EN4 facing the respective scale parts GPa and GPb. Although only four encoder heads EN1, EN2, EN3, and EN4 opposed to the scale part GPa are shown in FIGS. 4 and 8, similar encoder heads EN1, EN2, EN3, and EN4 also oppose the scale part GPb. Will be placed.

  The scale portions GPa and GPb are respectively formed annularly over the entire circumferential direction of the outer peripheral surface of the rotary drum DR. The scale portions GPa and GPb are diffraction gratings in which concave or convex grid lines are formed at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotary drum DR, and are configured as incremental scales. In the case of this embodiment, the grid lines (scales) of the scale parts GPa and GPb and the reference pattern RMP shown in FIG. 9 are simultaneously formed by an apparatus (pattern engraving machine etc.) for processing the surface of the rotary drum DR. It is possible to have an unambiguous positional relationship on the order of microns. In addition, an origin mark is juxtaposed at one place in the circumferential direction of the scale parts GPa and GPb, and each of the encoder heads EN1, EN2, EN3, and EN4 detects the origin mark and outputs an origin signal. Equipped with Therefore, also with respect to the origin mark, the reference pattern RMP has an unambiguous positional relation (known angular positional relation) in the circumferential direction.

  The substrate P is configured to be wound inside the scale parts GPa and GPb at both ends of the rotary drum DR, that is, inside the restriction bands CLa and CLb. When a strict positional relationship is required, the outer peripheral surfaces of the scale parts GPa and GPb and the outer peripheral surface of the portion of the substrate P wound around the rotary drum DR are on the same plane (the same radius from the rotation center line AX2) Set For this purpose, the outer peripheral surfaces of the scale portions GPa and GPb may be increased in the radial direction by the thickness of the substrate P with respect to the outer peripheral surface of the rotary drum DR for winding the substrate. For this reason, the outer peripheral surfaces of the scale parts GPa and GPb formed on the rotary drum DR can be set to the same radius as the outer peripheral surface of the substrate P. Therefore, the encoder heads EN1, EN2, EN3, EN4 can detect the scale parts GPa, GPb at the same radial position as the drawing surface on the substrate P wound around the rotary drum DR, and the measurement position and the processing position are Abbe error caused by the difference in the radial direction of the rotating system can be reduced. When the scale portions GPa and GPb can not be formed directly on both ends of the rotary drum DR, scale disks in which the scale portions GPa (GPb) are engraved on the outer peripheral surface of a disk shaped member having a diameter substantially the same as that of the rotary drum DR May be coaxially attached to the shaft portion Sf2 of the rotary drum DR.

  The encoder heads EN1, EN2, EN3, EN4 are respectively disposed around the scale parts GPa, GPb when viewed from the rotation center line AX2, and are at different positions in the circumferential direction of the rotary drum DR. The encoder heads EN 1, EN 2, EN 3, EN 4 are connected to the controller 16. The encoder heads EN1, EN2, EN3, and EN4 project measurement light beams toward the scale portions GPa and GPb, and photoelectrically detect the reflected light beams (diffracted lights), thereby circumferentially extending the scale portions GPa and GPb. A detection signal (for example, a two-phase signal having a phase difference of 90 degrees) corresponding to the position change of the above is output to the control device 16. The control device 16 interpolates and digitally processes the detection signal with a counter circuit (not shown) to change the angle of the rotary drum DR, that is, the positional change in the circumferential direction of the outer peripheral surface with a resolution of submicron. It can be measured. At this time, the control device 16 can also measure the transport speed of the substrate P on the rotating drum DR from the change in angle of the rotating drum DR.

  Further, as shown in FIGS. 4 and 8, the encoder head EN1 is disposed on the installation azimuth line Le1. The installation azimuth line Le1 is a line connecting the projection area (reading position) of the measurement light beam onto the scale part GPa (GPb) by the encoder head EN1 and the rotation center line AX2 in the XZ plane. Further, as described above, the installation azimuth line Le1 is a line connecting the drawing lines LL1, LL3, and LL5 with the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of encoder head EN1 and rotation center line AX2, and the line connecting drawing lines LL1, LL3, and LL5 and rotation center line AX2 are the same azimuthal line (the same Direction).

  Similarly, as shown in FIGS. 4 and 8, the encoder head EN2 is disposed on the installation azimuth line Le2. The installation azimuth line Le2 is a line connecting a projection area (reading position) of the measurement light beam onto the scale part GPa (GPb) by the encoder head EN2 and the rotation center line AX2 in the XZ plane. Further, as described above, the installation azimuth line Le2 is a line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN2 and the rotation center line AX2 and the line connecting the drawing lines LL2, LL4 and the rotation center line AX2 have the same azimuth (the same direction as viewed from the center axis AX2) It has become.

  Also, as shown in FIGS. 4 and 8, the encoder head EN3 is disposed on the installation azimuth line Le3. The installation azimuth line Le3 is a line connecting the projection area (reading position) of the measurement light beam onto the scale part GPa (GPb) by the encoder head EN3 and the rotation center line AX2 in the XZ plane. Further, as described above, the installation azimuth line Le3 is a line connecting the observation areas Vw1 to Vw3 of the substrate P with the alignment microscope AM1 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN3 and the rotation center line AX2 and the line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 are the same azimuthal line (from the central axis AX2 Same direction). With such a configuration, when viewed from the direction in which the rotation center axis AX2 extends, the measurement area of the encoder head EN3 on the scale parts GPa and GPb and the detection areas Vw1 to Vw3 of the alignment microscope AM1 are in the circumferential direction of the rotating drum DR. In the same position.

  Similarly, as shown in FIGS. 4 and 8, the encoder head EN4 is disposed on the installation azimuth line Le4. The installation azimuth line Le4 is a line connecting the projection area (reading position) of the measurement light beam onto the scale part GPa (GPb) by the encoder head EN4 and the rotation center line AX2 in the XZ plane. Further, as described above, the installation azimuth line Le4 is a line connecting the rotation center line AX2 with the observation areas Vw4 to Vw6 of the substrate P with the alignment microscope AM2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN4 and the rotation center line AX2 and the line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 are the same azimuthal line (from the central axis AX2 Same direction). With such a configuration, when viewed from the direction in which the rotation center axis AX2 extends, the measurement area of the encoder head EN4 on the scale parts GPa and GPb and the detection areas Vw4 to Vw6 of the alignment microscope AM2 are in the circumferential direction of the rotating drum DR. In the same position.

  When the installation azimuths (angular directions in the XZ plane about the rotation center line AX2) of the encoder heads EN1, EN2, EN3, EN4 are represented by installation azimuths Le1, Le2, Le3, Le4, as shown in FIG. The plurality of drawing modules UW1 to UW5 and the encoder heads EN1 and EN2 are arranged such that the installation azimuth lines Le1 and Le2 form an angle of ± θ ° with respect to the central plane p3.

  Here, the control device 16 is a rotational angle position of the scale parts (rotary drums DR) GPa and GPb detected by the encoder heads EN1 and EN2 and the counter circuit, that is, a movement position and movement of the outer peripheral surface of the rotary drum DR in the circumferential direction. Based on the amount, the drawing start positions of the odd-numbered and even-numbered drawing modules UW1 to UW5 are controlled. That is, the controller 16 turns on / off the light deflector 81 based on the CAD information of the pattern to be drawn on the substrate P while the drawing beam LB projected onto the substrate P is scanning in the scanning direction. However, the pattern is accurately drawn on the photosensitive layer of the substrate P by performing the start timing of ON / OFF modulation of CAD information for one scan by the light deflector 81 based on the detected rotational angle position. be able to.

  Further, the control device 16 rotates the scale parts (rotary drums DR) GPa and GPb detected by the encoder heads EN3 and EN4 when the alignment marks Ks1 to Ks3 on the substrate P are detected by the alignment microscopes AM1 and AM2. By storing the angular position, the correspondence between the positions of the alignment marks Ks1 to Ks3 on the substrate P and the rotational angular position of the rotary drum DR can be determined. Similarly, the control device 16 rotates the scale parts (rotating drums DR) GPa and GPb detected by the encoder heads EN3 and EN4 when the alignment microscopes AM1 and AM2 detect the reference pattern RMP on the rotating drum DR. By storing the angular position, the correspondence between the position of the reference pattern RMP on the rotary drum DR and the rotational angular position of the rotary drum DR can be determined. As described above, the alignment microscopes AM1 and AM2 can accurately measure the rotational angular position (or circumferential position) of the rotary drum DR at the moment when the reference pattern or the mark is sampled in the observation areas Vw1 to Vw6. Then, in the exposure apparatus EX, based on the measurement result, the substrate P and the predetermined pattern drawn on the substrate P are aligned (aligned), or each of the drawing modules UW1 to Uw1 of the rotary drum DR and the drawing apparatus 11 is aligned. The positional relationship with the drawing lines LL1 to LL5 by UW5 is calibrated or the like.

  By the way, in the multi-beam type exposure apparatus EX, the spot light of the drawing beam LB is scanned along the plurality of drawing lines LL1 to LL5 on the substrate P while the substrate P is transported in the transport direction. Here, the scanning direction of the drawing beam LB scanned along the drawing lines LL1 to LL5 is the same direction, and each of the drawing lines LL1 to LL5 is precisely parallel to the central plane p3 (central axis AX2). When it is set to, the patterns PT1 to PT5 respectively formed on the substrate P by the plurality of drawing lines LL1 to LL5 become patterns as shown in FIG.

  FIG. 10 is a diagram exaggerating an example of the arrangement relationship between the pattern drawn on the substrate by the exposure apparatus of the first embodiment and the drawing lines. In FIG. 10, since it is a drawing developed in the transport direction (Xs direction) of the substrate P, it is an orthogonal coordinate system in which the Xs direction, the Y direction, and the Z direction are orthogonal. Further, in FIG. 10, the drawing lines LL1 to LL5 and the patterns PT1 to PT5 are made thicker in the transport direction of the substrate P so that the relationship between the drawing lines LL1 to LL5 and the patterns PT1 to PT5 can be easily understood.

  As shown in FIG. 10, spot light of the drawing beam LB projected onto the substrate P from each of the plurality of drawing modules UW1 to UW5 is directed from the drawing start position PO1 to the drawing end position PO2 along the drawing lines LL1 to LL5. Scan in the + Y direction. At this time, the spot light of the drawing beam LB has the same scanning direction in which it is scanned along the drawing lines LL1 to LL5. Therefore, when viewed in the transport direction Xs of the substrate P, the pattern PT1 is formed at the end PTa of the pattern PT1 to PT5 formed at the drawing start position PO1 of the drawing lines LL1 to LL5 and at the drawing end position PO2 of the drawing lines LL1 to LL5. The end portions PTb of the formed patterns PT1 to PT5 are adjacent to each other in the patterns PT1 to PT5 adjacent in the width direction of the substrate P.

Here, in the patterns PT1 to PT5 formed on the substrate P when the spot light of the drawing beam LB is scanned once with respect to the substrate P, since the substrate P is transported at a constant velocity in the transport direction, It is slightly inclined. The amount of tilt is shown exaggeratingly in FIG. 10, and is expressed by the ratio Vxs / Vp of the transport velocity Vxs of the substrate P and the scanning velocity Vp of the spot light of the drawing beam LB. The scanning speed Vp is proportional to the rotational speed Rv (rps) of the rotating polygon mirror 97 as the scanner 83. For example, eight reflecting surfaces of the rotating polygon mirror 97 have a substantial scanning period of 40% per reflecting surface. Assuming that the length of the drawing lines (LL1 to LL5) is YL (mm), the scanning speed Vp (mm / S) of the spot light can be obtained by the following equation.
Vp = (8.Rv.YL) /0.4=20.Rv.YL [mm / S]

  Assuming that the rotating polygon mirror 97 rotates 6,000 revolutions per minute (rotational speed Rv = 100 rps) and the length YL is 50 mm, the scanning speed Vp is 100,000 mm / s. Assuming that the transport speed Vxs of the substrate P is 50 mm / S, the inclination amount Vxs / Vp of the drawing line on the substrate P is 1/2000. This amount of inclination means that both ends (drawing start point PO1 and drawing end point PO2) of the drawing line in the Y direction are shifted by 25 μm in the Xs direction on the substrate P. Of course, if the rotational speed Rv of the rotating polygon mirror 97 is increased and the transport speed Vxs of the substrate P is decreased, the inclination amount Vxs / Vp of the drawing line can be reduced, but both ends of the drawing line in the Y direction (drawing start point In order to make the amount of deviation in the Xs direction of PO1 and drawing end point PO2) into a fraction of the minimum line width of the pattern to be drawn, the rotational speed Rv of the rotating polygon mirror 97 is increased several times or more The conveyance speed Vxs of P will be reduced significantly. That is, the end PTa of the pattern PT1 to PT5 formed at the drawing start position PO1 of the drawing lines LL1 to LL5 is compared with the end PTb of the pattern PT1 to PT5 formed at the drawing end position PO2 of the drawing line LL1 to LL5. It is formed on the downstream side in the transport direction. Thus, the end PTa and the end PTb of the patterns PT1 to PT5 are at different positions in the transport direction. In this case, in the patterns PT1 to PT5 spliced in the width direction of the substrate P, a splice error occurs in the transport direction between the adjacent patterns PT1 to PT5.

  As described above, when the scanning speed Vp of the drawing beam LB in the main scanning direction of the spot light of the drawing beam LB is constant, the connection error of the patterns PT1 to PT5 has the inclination of the drawing lines LL1 to LL5 in the width direction of the substrate P This occurs because the inclination does not correspond to the conveyance speed of Here, the inclinations of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P are adjusted before drawing by the exposure apparatus EX and at the time of drawing by the exposure apparatus EX.

  Specifically, before drawing (for example, at the time of alignment) of the exposure apparatus EX, the exposure apparatus EX transports the substrate P at a reference speed (Vxs) which is a preset reference. At this time, the reference speed may be appropriately changed in accordance with the substrate P to be used. For example, when the sensitivity of the photosensitive layer applied to the substrate P is low, the reference speed may be lowered to overlap the main scan with the spot light a plurality of times to increase the exposure amount. Therefore, the drawing line LL1 is set according to the reference speed set for the substrate P so that the patterns PT1 to PT5 are suitably spliced in the width direction of the substrate P with respect to the substrate P transported at the reference speed. .About.LL5 are adjusted so as to be appropriately inclined with respect to the central plane p3 (central axis AX2).

  Further, during the drawing operation by the exposure apparatus EX, the rotational drive of the rotary drum DR is controlled such that the transport speed of the substrate P becomes the reference speed. At this time, the structure of the rotary bearing portion of the rotary drum DR (bearing characteristics The conveyance speed of the substrate P to be conveyed may slightly fluctuate from the reference speed in accordance with the rotation cycle of the rotary drum DR due to the rotation drive mechanism (torque characteristics of the motor, characteristics of the reduction gear, etc.). That is, speed unevenness may occur periodically in the conveyance speed of the substrate P conveyed by the rotating drum DR. Therefore, the drawing lines LL1 to LL5 follow the fluctuation of the transport speed of the substrate P so that the patterns PT1 to PT5 are suitably spliced in the width direction of the substrate P with respect to the substrate P whose speed slightly changes from the reference speed. It is preferable to incorporate a configuration (control system) that dynamically (actively) tilts each of the

  Next, adjustment of the inclination of the drawing lines LL1 to LL5 in the width direction of the substrate P will be described with reference to FIG. FIG. 11 is a view showing an example of an arrangement relationship between a pattern drawn on a substrate by the exposure apparatus of the first embodiment and drawing lines. In the exposure apparatus EX of the first embodiment, by rotating the second optical surface plate 25 with respect to the first optical surface plate 23 by the rotation mechanism 24, the drawing lines LL1 to LL5 are generally made in the width direction of the substrate P. I am inclined to That is, the rotation mechanism 24 functions as an inclination adjustment mechanism that adjusts the inclination of the drawing lines LL1 to LL5.

  The rotation mechanism 24 rotates the drawing device 11 with respect to the substrate P about the rotation axis I by rotating the second optical surface plate 25 with respect to the first optical surface plate 23. When the drawing device 11 rotates around the rotation axis I, the drawing lines LL1 to LL5 do not change the positional relationship between the substrate P and the width direction of the substrate P (that is, the rotation center line AX2 of the rotating drum DR or the central plane Tilt to p3).

  Here, adjustment of the inclination of the drawing lines LL1 to LL5 in the case where the patterns PT1 to PT5 are joined in the width direction of the substrate P with respect to the substrate P transported at the reference speed will be described with respect to alignment of the exposure apparatus EX. . As shown in FIG. 11, the control device 16 rotates the rotation mechanism 24 based on the reference speed of the substrate P detected by the rotation position detection mechanism 14. Here, the reference speed of the substrate P is associated with the amount of rotation of the rotation mechanism 24. The amount of rotation is such that the end PTa and the end PTb of the patterns PT1 to PT5 are at the same position in the transport direction, that is, the patterns PT1 to PT5 are formed along the width direction of the substrate P Amount of rotation (inclination amount). That is, the control device 16 rotates the rotation mechanism 24 based on the amount of rotation associated with the reference speed of the substrate P to be detected. Specifically, when the patterns PT1 to PT5 shown in FIG. 10 are formed, the control device 16 rotates the rotation mechanism 24 based on the reference speed of the substrate P to draw the drawing start positions of the drawing lines LL1 to LL5. The drawing apparatus 11 is rotated with respect to the substrate P such that PO1 is located on the upstream side in the transport direction and the drawing end position PO2 of the drawing lines LL1 to LL5 is located on the downstream side in the transport direction.

  As shown in FIG. 11, when the rotation mechanism 24 entirely tilts the drawing lines LL1 to LL5 without changing the positional relationship between the drawing lines LL1 to LL5, the drawing line LL1 on the side far from the rotation axis I and the drawing line LL1 and While the movement amount of the drawing line LL5 in the transport direction increases, the movement amount of the drawing line LL3 closer to the rotation axis I in the transport direction decreases. That is, the drawing line LL1 largely moves to the upstream side in the transport direction, and the drawing line LL2 slightly moves to the upstream side in the transport direction. The drawing line LL3 has almost no movement in the transport direction. The drawing line LL4 slightly moves to the downstream side in the transport direction, and the drawing line LL5 largely moves to the downstream side in the transport direction. Therefore, each of the patterns PT1 to PT5 drawn on the substrate P by the drawing lines LL1 to LL5 after rotation (after inclination correction) by the rotation mechanism 24 is in the width direction of the substrate P as shown by the dotted line in FIG. It is formed without inclination in substantially the same direction.

  On the other hand, the respective patterns PT1 to PT5 exposed after rotation (after inclination correction) are formed at slightly different positions in the transport direction of the substrate P in accordance with the inclination of the drawing lines LL1 to LL5. That is, pattern PT5 is formed on the downstream side in the transport direction with respect to pattern PT4, pattern PT4 is formed on the downstream side in the transport direction with respect to pattern PT3, and pattern PT3 is formed in the transport direction with respect to pattern PT2. The pattern PT2 is formed on the downstream side, and the pattern PT2 is formed on the downstream side in the transport direction with respect to the pattern PT1. As described above, when the drawing apparatus 11 is rotated by the rotation mechanism 24 around the rotation axis I, the positions of the patterns PT1 to PT5 after rotation differ in the conveyance direction, and the conveyance direction of the patterns PT1 to PT5 after rotation In the above, a predetermined deviation amount occurs. Therefore, the control device 16 controls the drawing timing of each of the drawing modules UW1 to UW5 based on the reference speed of the substrate P detected by the rotational position detection mechanism 14 to convey the rotated patterns PT1 to PT5. Correct the position in the direction. That is, the reference speed of the substrate P is also associated with the correction amount of the drawing timing. Here, in order to correct the drawing timing, the control device 16 corrects CAD information used for drawing on the substrate P in the transport direction.

  FIG. 12 is a view showing an image of CAD information used in the exposure apparatus of the first embodiment. In FIG. 12, CAD patterns CAD1 to CAD5 corresponding to the patterns PT1 to PT5 shown in FIG. 11 are illustrated as CAD information of patterns to be drawn on the substrate P. Further, CAD patterns CAD1 to CAD5 indicated by dotted lines in FIG. 12 are CAD patterns (original data in design) CAD1 to CAD5 before correction of drawing timing, and CAD patterns CAD1 to CAD5 indicated by solid lines in FIG. CAD patterns CAD1 to CAD5 after correction of drawing timing.

  As shown by the dotted lines in FIG. 12, each of the CAD patterns CAD1 to CAD5 before correction is for drawing data (bit pattern) so as to be drawn in the same arrangement as the patterns PT1 to PT5 to be drawn on the substrate P. And the same position in the transport direction of the substrate P. Therefore, the CAD patterns CAD1 to CAD5 before correction are arranged in a line along the width direction of the substrate P.

  The control device 16 sets the CAD patterns CAD1 to CAD5 before this correction so that the rotated patterns PT1 to PT5 shown in FIG. 11 are at the same position in the transport direction, that is, the ends PTa and PTb of the patterns PT1 to PT5. The CAD patterns CAD1 to CAD4 are corrected in the transport direction based on the CAD pattern CAD5 so that they are joined together. That is, as indicated by the solid line in FIG. 12, the control device 16 selects each of the CAD patterns CAD1 to CAD5 before correction according to the positional shift amount in the transport direction of the patterns PT1 to PT5 after rotation shown in FIG. , Correction in the transport direction. The correction is performed, for example, by shifting the start timing of reading out each drawing data (bit pattern) of the CAD patterns CAD1 to CAD5 before correction from the memory circuit.

  The amount of displacement in the transport direction of the patterns PT1 to PT5 indicated by the dotted line in FIG. 11 is associated with the transport speed of the substrate P as described above, so the control device 16 is based on the transport speed of the substrate P. Then, correction in the transfer direction of the CAD patterns CAD1 to CAD5 (such as shifting of the timing to start reading of drawing data) is performed. As for the CAD information after correction, the CAD pattern CAD5 is located upstream of the CAD pattern CAD4 in the transport direction, the CAD pattern CAD4 is located upstream of the CAD pattern CAD3 in the transport direction, and the CAD pattern CAD3 is CAD The CAD pattern CAD2 is located on the upstream side in the transport direction with respect to the pattern CAD2, and the CAD pattern CAD2 is located on the upstream side in the transport direction with respect to the CAD pattern CAD1. Although the controller 16 corrects the other CAD patterns CAD1 to CAD4 with the CAD pattern CAD5 as a reference, the controller 16 may correct the other CAD patterns CAD1 to CAD4 as a reference.

  As described above, the controller 16 controls the transfer direction of the CAD patterns CAD1 to CAD5 indicated by the solid line in FIG. 12 according to the transfer speed of the substrate P detected by the rotational position detection mechanism 14 at the time of alignment of the exposure apparatus EX. By correcting the position, it is possible to draw on the substrate P as patterns PT1 to PT5 indicated by solid lines in FIG.

  The adjustment of the inclinations of the drawing lines LL1 to LL5 at the time of alignment of the exposure apparatus EX may be performed by manually rotating the rotation mechanism 24 or by driving the rotation mechanism 24 by the control device 16 and rotating it. Good.

  Next, with respect to the drawing of the exposure apparatus EX, the drawing line LL1 in the case of joining the patterns PT1 to PT5 in the width direction of the substrate P with respect to the substrate P conveyed while changing the speed slightly from the reference speed. The adjustment of the inclination of ~ LL5 will be described. As shown in FIG. 11, the rotation mechanism 24 sets the patterns PT1 to PT5 by setting the drawing lines LL1 to LL5 at a predetermined inclination with respect to the substrate P transported at the reference speed with respect to the substrate P. It is preferably spliced in the width direction of the substrate P.

  When the substrate P is transported at a transport speed faster than the reference speed from the state shown in FIG. 11, the patterns PT1 to PT5 formed on the substrate P are formed obliquely as shown in FIG. That is, the end PTa of the patterns PT1 to PT5 is formed on the downstream side in the transport direction as compared with the end PTb of the patterns PT1 to PT5. On the other hand, when the substrate P is transported at a transport speed slower than the reference speed, the patterns PT1 to PT5 formed on the substrate P are inclined in the opposite direction to the patterns PT1 to PT5 shown in FIG. Is inclined downward and to the right). That is, the end PTa of the patterns PT1 to PT5 is formed on the upstream side in the transport direction as compared with the end PTb of the patterns PT1 to PT5.

  When the transport speed of the substrate P detected by the rotational position detection mechanism 14 becomes faster than the reference speed, the controller 16 causes the drawing start position PO1 of the drawing lines LL1 to LL5 to draw the drawing lines LL1 to LL5 at the reference speed. The drawing end position PO2 of the drawing lines LL1 to LL5 is positioned downstream of the drawing end positions PO2 of the drawing lines LL1 to LL5 at the reference speed, located upstream of the start position PO1 in the conveyance direction. Then, the rotation mechanism 24 is rotated, and the whole of the drawing lines LL1 to LL5 are further rotated clockwise from the state of FIG. In addition, when the rotation mechanism 24 is rotated, the patterns PT1 to PT5 after rotation are displaced in the transport direction so that the patterns PT1 to PT4 are on the upstream side in the transport direction compared to the patterns PT2 to PT5. . For this reason, the controller 16 draws the CAD information for drawing on the substrate P at the drawing timing in the conveyance direction (CAD pattern CAD1 to CAD4 is on the downstream side in the conveyance direction as compared to CAD patterns CAD2 to CAD5) The timing at which the reading of drawing data from the memory circuit is started is corrected.

  On the other hand, when the transport speed of the substrate P detected by the rotational position detection mechanism 14 becomes slower than the reference speed, the control device 16 sets the drawing start position PO1 of the drawing lines LL1 to LL5 to the drawing lines LL1 to LL1 at the reference speed. The drawing end position PO2 of the drawing lines LL1 to LL5 is located upstream of the drawing end position PO2 of the drawing lines LL1 to LL5 at the reference speed, which is located downstream of the drawing start position PO1 of LL5 in the conveyance direction. The rotation mechanism 24 is rotated so as to be positioned. In addition, when the rotation mechanism 24 is rotated, the patterns PT1 to PT5 after rotation are displaced in the transport direction so that the patterns PT1 to PT4 are on the downstream side in the transport direction compared to the patterns PT2 to PT5. . For this reason, the controller 16 draws the CAD information for drawing on the substrate P at the drawing timing (conveying direction) so that the CAD patterns CAD1 to CAD4 are on the upstream side in the conveying direction as compared to the CAD patterns CAD2 to CAD5. The timing at which the reading of drawing data from the memory circuit is started is corrected.

  As described above, even when the substrate P is transported while the substrate P is slightly changed from the reference velocity due to the velocity unevenness, the control device 16 detects the transport velocity detected by the rotational position detection mechanism 14 at the time of drawing of the exposure device EX. The overall inclination of the drawing lines LL1 to LL5 can be adjusted based on the difference from the reference speed. Further, the control device 16 corrects the position in the conveyance direction of the CAD patterns CAD1 to CAD5 (corrects the drawing start timing) by using the deviation amount of the rotated patterns PT1 to PT5 in the conveyance direction as a correction amount. The patterns PT1 to PT5 can be drawn on the substrate P in a state of being linearly connected in the width direction of P.

  The amount of rotation by the rotation mechanism 24 is preferably determined in advance according to the reference speed of the substrate P and the transport speed. Similarly, the correction amount of the CAD information is preferably obtained in advance according to the reference speed of the substrate P and the transport speed. Furthermore, the reference speed of the substrate P, the displacement from the reference speed, the rotation amount of the rotation mechanism 24, and the correction amount of the CAD information may be obtained as a correlated correlation map. In addition, when correcting the positions in the conveyance direction of CAD patterns CAD1 to CAD5 (correcting the drawing start timing), each of the high resolution encoder heads EN1 and EN2 (rotational position detection mechanism 14) shown in FIG. The drawing by the drawing lines LL1 to LL5 is started (the access of the drawing data from the memory circuit is started) based on the angular position of the rotary drum DR (the transfer position of the substrate P) detected by the above. Specifically, when the controller 16 calculates the amount of deviation in the transport direction between the drawing start position PO1 and the drawing end position PO2 of each of the patterns PT1 to PT5 that can occur after rotation correction by the rotation mechanism 24, the encoder head Correction position information is generated by adding ± ΔXs correction according to the amount of deviation to the angular position of the rotary drum DR detected by each of EN1 and EN2. Then, based on the correction position information, drawing by the drawing lines LL1 to LL5 is started (access of drawing data from the memory circuit is started).

  As described above, in the first embodiment, the second optical surface plate 25 is rotated by the rotation mechanism 24 on the basis of the transport speed of the substrate P detected by the rotation position detection mechanism 14 to thereby tilt the drawing lines LL1 to LL5. It can be adjusted. Therefore, the patterns PT1 to PT5 drawn on the substrate P can be formed linearly along the width direction of the substrate P by the drawing beam LB scanned along the drawing lines LL1 to LL5. Further, after the rotation of the second optical surface plate 25 by the rotation mechanism 24, the drawing timings of the CAD patterns CAD1 to CAD5 are corrected, and the patterns PT1 to PT5 drawn on the substrate P have the same positions in the transport direction of the substrate P. It can be done. Therefore, since the patterns PT1 to PT5 drawn on the substrate P can be corrected to be suitably spliced in the width direction and the transport direction (long direction) of the substrate P, the splice error due to the speed unevenness is suppressed be able to.

  Further, in the first embodiment, the rotation mechanism 24 can be rotated in real time by the control device 16 in accordance with the transport speed of the substrate P detected by the rotation position detection mechanism 14. Therefore, even during drawing by the exposure apparatus EX, it is possible to adjust the inclination of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P, and to suppress the splice error caused by the periodic speed unevenness of the rotating drum DR. it can.

  In the first embodiment, when the transport speed of the substrate P is higher than the reference speed, the drawing lines LL1 to LL5 in the width direction of the substrate P are upstream of the drawing start position PO1 of the drawing lines LL1 to LL5 at the reference speed. The patterns PT <b> 1 to PT <b> 5 can be suitably corrected by inclining so as to be on the downstream side of the drawing end position PO <b> 2 on the side. When the transport speed of the substrate P is lower than the reference speed, the drawing lines LL1 to LL5 in the width direction of the substrate P are located downstream of the drawing start position PO1 of the drawing lines LL1 to LL5 at the reference speed and the drawing end position The patterns PT <b> 1 to PT <b> 5 can be suitably corrected by inclining so as to be on the upstream side of PO <b> 2.

  In the first embodiment, since each of the drawing modules UW1 to UW5 can be configured to include the light deflector 81 and the scanner 83, the drawing beams are drawn in a one-dimensional direction along the drawing lines LL1 to LL5. LB can be scanned.

  Further, in the first embodiment, the drawing device 11 installed on the second optical surface plate 25 is rotated by the rotation mechanism 24 to maintain the relative positional relationship between the drawing lines LL1 to LL5, and the drawing line LL1. It is possible to adjust all the slopes of ~ LL5. For this reason, since the control device 16 only needs to control the rotation of the rotation mechanism 24, the configuration relating to the control can be simplified.

  In the first embodiment, the size (spot diameter) on the substrate P of the drawing beam LB projected from each of the drawing modules UW1 to UW5 is D (μm), and the scanning along the drawing lines LL1 to LL5 of the drawing beam LB When the velocity is Vp (μm / sec), the light source device CNT can make the light emission repetition cycle T (seconds) of the laser light source emitting pulsed light satisfy the relationship of T <D / Vp. Therefore, the drawing beam LB can be scanned in the scanning direction while overlapping spot light by the drawing beam LB on the substrate P, so that the drawing line by the drawing beam LB is on while the light deflector 81 is ON. It is drawn as a continuous line without interruption in the scanning direction.

  In the first embodiment, the second optical surface plate 25 is rotated by the rotation mechanism 24 and the drawing device 11 is rotated with respect to the substrate P, whereby the inclinations of the drawing lines LL1 to LL5 in the width direction of the substrate P are obtained. It was adjusted. However, the present invention is not limited to this configuration, and the inclinations of the drawing lines LL1 to LL5 may be relatively adjusted in the width direction of the substrate P. That is, in the XY plane, the exposure apparatus EX may be configured to rotate the rotation center line AX2 of the rotary drum DR about the rotation axis I in the XY plane. In this case, at least the rollers RT1 and RT2 (FIG. 1) disposed at the front and back of the rotary drum DR in the transport path of the substrate P are integrally rotated about the rotation axis I in the XY plane It is good to do.

Second Embodiment
Next, an exposure apparatus EX of the second embodiment will be described with reference to FIGS. 13 to 16. In the second embodiment, only the parts different from the first embodiment will be described to avoid overlapping descriptions with the first embodiment, and the same constituent elements as the first embodiment are the same as the first embodiment. The code may be attached and the description may be omitted. FIG. 13 is a view showing the configuration of part of the f-θ lens system of the exposure apparatus of the second embodiment. FIG. 14 is a diagram showing the configuration of a cylindrical lens of the f-θ lens system of FIG. FIG. 15 is a view showing an example of an arrangement relationship between a pattern drawn on a substrate by the exposure apparatus of the second embodiment and drawing lines. FIG. 16 is a view showing an example of the arrangement relationship between a pattern drawn on a substrate by the exposure apparatus of the second embodiment and drawing lines. The exposure apparatus EX according to the first embodiment rotates the second optical surface plate 25 by the rotation mechanism 24 to adjust the inclination of the drawing lines LL1 to LL5 as a whole. On the other hand, the exposure apparatus EX of the second embodiment individually adjusts the inclination of each of the drawing lines LL1 to LL5.

  In the exposure apparatus EX of the second embodiment, as shown in FIG. 13, the f-θ lens system 85 is configured to include a telecentric f-θ lens 85a and a cylindrical lens 85b. In FIG. 13, in the f-θ lens system 85, illustration of lenses other than the telecentric f-θ lens 85a and the cylindrical lens 85b is omitted.

  The telecentric f-θ lens 85 a collimates the drawing beam LB to be irradiated in the XZ plane and in the Y direction (scanning direction). The drawing beam LB of parallel light in the XZ plane is irradiated toward the cylindrical lens 85b. The cylindrical lens 85 b is provided between the telecentric f-θ lens 85 a and the substrate P. The cylindrical lens 85b has a generatrix substantially parallel to the scanning direction in which the drawing lines LL1 (LL2 to LL5 extend), and has a predetermined power (refractive power) in the direction orthogonal to the generatrix, and the drawing beam LB Is focused on the spot light. Further, as shown in FIG. 14, the cylindrical lens 85b is rotatable around the rotation axes I1 to I5 in order to finely adjust the inclination of each of the drawing lines LL1 to LL5 with respect to the width direction of the substrate P. . The rotation axes I1 to I5 are rotation axes centering on a predetermined point in the drawing surface including the drawing lines LL1 to LL5 formed on the substrate P. The rotation axes I1 to I5 are rotation axes centering on the center of the direction in which the drawing lines LL1 to LL5 extend, for example, and are in the same direction as the axis of the drawing beam LB. That is, rotation axes I1, I3 and I5 of odd-numbered drawing lines LL1, LL3 and LL5 are in the same direction as installation azimuth line Le1, and rotation axes I2 and I4 of even drawing lines LL2 and LL4 are set The direction is the same as the azimuth line Le2. The cylindrical lens 85 b is rotated about the rotation axes I 1 to I 5 by the drive unit 100, and the rotation of the cylindrical lens 85 b is controlled by the control device 16 connected to the drive unit 100. In rotation of the cylindrical lens 85b about the rotation axes I1 to I5, the generatrix direction of the cylindrical lens 85b (Y direction with respect to the chief ray of the drawing beam projected onto the substrate P through the vicinity of the rotation axes I1 to I5) Because the principal ray of the drawing beam projected onto the substrate P through both end sides of) is slightly inclined with respect to the direction orthogonal to either of the generatrix of the cylindrical lens 85b and the rotation axes I1 to I5, the drawing line on the substrate P LL1 to LL5 can be slightly inclined.

  Next, adjustment of the inclination of the drawing lines LL1 to LL5 in the width direction of the substrate P will be described with reference to FIG. In the exposure apparatus EX of the second embodiment, the drawing lines LL1 to LL5 are inclined with respect to the width direction of the substrate P by rotating the cylindrical lens 85b by the drive unit 100. That is, the cylindrical lens 85b functions as a drawing line rotation mechanism that adjusts the inclination of each of the drawing lines LL1 to LL5.

  The driving unit 100 tilts the drawing lines LL1 to LL5 of the drawing modules UW1 to UW5 with respect to the width direction of the substrate P by rotating the cylindrical lenses 85b around the rotation axes I1 to I5, respectively.

  Here, the drawing lines LL1 to LL5 in the case where the patterns PT1 to PT5 are joined in the width direction of the substrate P with respect to the substrate P transported at the reference speed before drawing (for example, at the time of alignment) of the exposure apparatus EX. The adjustment of the inclination will be described. The adjustment of the inclinations of the drawing lines LL1 to LL5 in the second embodiment in the above case is substantially the same as the adjustment of the inclinations of the drawing lines LL1 to LL5 in the first embodiment. Some explanations are omitted. As shown in FIG. 15, the control device 16 controls the drive unit 100 to rotate the cylindrical lens 85 b based on the reference speed of the substrate P detected by the rotational position detection mechanism 14. Also in this case, the reference speed of the substrate P is associated with the amount of rotation of the cylindrical lens 85 b. Specifically, the control device 16 rotates the cylindrical lens 85b based on the reference speed of the substrate P to position the drawing start position PO1 of the drawing lines LL1 to LL5 on the upstream side in the transport direction, and the drawing line LL1. The cylindrical lens 85b is rotated with respect to the substrate P such that the drawing end position PO2 of the first to the fourth LL5 is positioned on the downstream side in the transport direction.

  As shown in FIG. 15, when the drawing lines LL1 to LL5 are inclined about the rotation axes I1 to I5, the positions of the drawing lines LL1 to LL5 in the transport direction hardly change. Therefore, the respective patterns PT1 to PT5 drawn on the substrate P by the drawing lines LL1 to LL5 after rotation are formed linearly in substantially the same direction as the width direction of the substrate P, as shown by the solid line in FIG. Also in the transport direction of the substrate P, the same position is obtained. Thus, the patterns PT1 to PT5 are formed in a line along the width direction of the substrate P.

  Next, with respect to the drawing of the exposure apparatus EX, the drawing line LL1 in the case of joining the patterns PT1 to PT5 in the width direction of the substrate P with respect to the substrate P conveyed while changing the speed slightly from the reference speed. The adjustment of the inclination of ~ LL5 will be described. The adjustment of the inclinations of the drawing lines LL1 to LL5 in the second embodiment in the above case is substantially the same as the adjustment of the inclinations of the drawing lines LL1 to LL5 in the first embodiment. Some explanations are omitted. As shown in FIG. 15, the driving unit 100 sets the patterns PT1 to PT5 by setting the drawing lines LL1 to LL5 at a predetermined inclination in the width direction of the substrate P with respect to the substrate P transported at the reference speed. It is preferably spliced in the width direction of the substrate P.

  When the substrate P is transported at a transport speed higher than the reference speed from the state shown in FIG. 15, in the patterns PT1 to PT5 formed on the substrate P, the end PTa is downstream in the transport direction compared to the end PTb. It is formed obliquely to be on the side. On the other hand, when the substrate P is transported at a transport speed slower than the reference speed, in the patterns PT1 to PT5 formed on the substrate P, the end PTa is on the upstream side in the transport direction compared to the end PTb. , Formed obliquely.

  When the transfer speed of the substrate P detected by the rotational position detection mechanism 14 becomes faster than the reference speed, the control device 16 sets the drawing start position PO1 of the drawing lines LL1 to LL5 to the reference speed as in the first embodiment. The drawing end position PO2 of the drawing lines LL1 to LL5 in the transport direction is located upstream of the drawing start position PO1 of the drawing lines, and the drawing end position PO2 of the drawing lines LL1 to LL5 is conveyed than the drawing end position PO2 of the drawing lines LL1 to LL5 at the reference speed The drive unit 100 of each cylindrical lens 85b is controlled so as to be positioned on the downstream side of the direction, and the drawing lines LL1 to LL5 are inclined. On the other hand, when the transport speed of the substrate P detected by the rotational position detection mechanism 14 becomes slower than the reference speed, the control device 16 sets the drawing start position PO1 of the drawing lines LL1 to LL5 to the drawing lines LL1 to LL1 at the reference speed. The drawing end position PO2 of the drawing lines LL1 to LL5 is located upstream of the drawing end position PO2 of the drawing lines LL1 to LL5 at the reference speed, which is located downstream of the drawing start position PO1 of LL5 in the conveyance direction. The drive unit 100 of each cylindrical lens 85 b is controlled to be positioned, and the drawing line is inclined.

  Here, the exposure apparatus EX of the second embodiment adjusts the inclination of the drawing lines LL1 to LL5 individually. Therefore, drawing lines LL1, LL3 and LL5 of the (odd-numbered) drawing modules UW1, UW3 and UW5 on the upstream side and drawing modules UW2 and UW4 of the (even-numbered) downstream side, sandwiching the central plane p3. It is possible to adjust the inclination separately for the lines LL2 and LL4.

  The speed unevenness generated at the time of drawing of the exposure apparatus EX may differ at the rotational position in the circumferential direction of the rotary drum DR. Specifically, the transfer speed of the substrate P at the installation direction Le1 may be different from the transfer speed of the substrate P at the installation direction Le2. In this case, the odd-numbered drawing lines LL1, LL3, and LL5 and the even-numbered drawing lines LL2 and LL4 have the same inclination with respect to the substrate P. Then, for example, as shown in FIG. 16, the patterns PT1, PT3, and PT5 formed by the odd-numbered drawing lines LL1, LL3, and LL5 are formed along the width direction of the substrate P, while the even-numbered patterns are formed. The patterns PT2 and PT4 formed by the drawing lines LL2 and LL4 may be formed obliquely with respect to the width direction of the substrate P, as indicated by dotted lines in FIG. This is because the odd-numbered drawing lines LL1, LL3, and LL5 and the even-numbered drawing lines LL2 and LL4 are set apart in the Xs direction, so a pattern to be drawn on the same region in the Xs direction on the substrate P There is a time difference in accordance with the transport speed of the substrate P in the drawing of.

  The control device 16 detects the transport speed of the substrate P on the installation azimuth line Le1 detected by the encoder head EN1 of the rotational position detection mechanism 14, and the installation azimuth line detected by the encoder head EN2 of the rotational position detection mechanism 14. The transport speed of the substrate P in Le2 is detected. Then, the control device 16 detects a speed difference between the transfer speed of the substrate P on the detected installation direction line Le1 and the transfer speed of the substrate P on the detected installation direction line Le2. As described above, the control device 16 is configured to include a function as a speed difference detection mechanism that detects a speed difference between the transport speed of the substrate P at the installation azimuth Le1 and the transportation speed of the substrate P at the installation azimuth Le2. ing. Then, based on the detected speed difference, the control device 16 controls the inclination of the even-numbered drawing lines LL2 and LL4 by controlling the driving unit 100 of the cylindrical lens 85b provided in each of the even-numbered drawing modules UW2 and UW4. To adjust. The patterns PT2 and PT4 exposed on the substrate P after the rotational adjustment of the cylindrical lens 85b are formed linearly along the width direction of the substrate P, similarly to the patterns PT1, PT3 and PT5.

  As described above, in the second embodiment, the inclination of the drawing lines LL1 to LL5 is adjusted by rotating the cylindrical lens 85b by the drive unit 100 based on the transport speed of the substrate P detected by the rotational position detection mechanism 14 be able to. Therefore, the patterns PT1 to PT5 drawn on the substrate P can be formed linearly along the width direction of the substrate P by the drawing beam LB scanned along the drawing lines LL1 to LL5. Also in the transport direction of the substrate P, the same position can be obtained. Therefore, the patterns PT1 to PT5 drawn on the substrate P can be corrected so as to be suitably spliced in the width direction and the conveyance direction (long direction) of the substrate P, and the unevenness of the conveyance speed of the substrate P The splice error can be further suppressed.

  Further, in the second embodiment, the mechanism (drawing line rotation mechanism) for adjusting the inclination of the drawing lines LL1 to LL5 can be configured simply by the drive unit 100 and the cylindrical lens 85b.

  In the second embodiment, the transport speed of the drawing lines LL1, LL3, and LL5 of the upstream (odd-numbered) drawing modules UW1, UW3, and UW5 and the downstream (even-numbered) drawing modules UW2 and UW4 are used. The speed difference between the drawing lines LL2 and LL4 and the transport speed can be detected, and the inclination of the drawing lines LL1 to LL5 can be adjusted according to the detected speed difference. Therefore, the transport speed of the substrate P at the time of drawing by the drawing lines LL1, LL3 and LL5 of the odd drawing modules UW1, UW3 and UW5, and the drawing by the drawing lines LL2 and LL4 of the even drawing modules UW2 and UW4. Even when the transport speed of the substrate P is different, the patterns PT1 to PT5 drawn on the substrate P can be corrected and exposed so as to be suitably spliced in the width direction and transport direction of the substrate P. Therefore, it is possible to suppress a splice error due to speed unevenness.

  In the second embodiment, the drawing lines LL1 to LL5 are rotated about the rotation axes I1 to I5, but the rotation center is not particularly limited. For example, the rotation axes I1 to I5 may be the drawing start position PO1 or the drawing end position PO2 of the drawing lines LL1 to LL5.

Third Embodiment
Next, an exposure apparatus EX of the third embodiment will be described with reference to FIG. Also in the third embodiment, in order to avoid overlapping descriptions with the first and second embodiments, only the portions different from the first and second embodiments will be described, and the same components as the first and second embodiments The same reference numerals as in the first and second embodiments may be assigned to the component and the description thereof may be omitted. FIG. 17 is a view showing an example of an arrangement relationship between a pattern drawn on a substrate by the exposure apparatus of the third embodiment and drawing lines. The exposure apparatus EX according to the first embodiment rotates the second optical surface plate 25 by the rotation mechanism 24 to adjust the inclination of the drawing lines LL1 to LL5 as a whole. On the other hand, the exposure apparatus EX of the third embodiment adjusts the drawing timing without changing the inclination of the drawing lines LL1 to LL5.

  In the exposure apparatus EX of the third embodiment, as shown in FIG. 17, the control device 16 corrects the drawing timing in accordance with the transport speed or transport position of the substrate P detected by the rotational position detection mechanism 14. The correction of the drawing timing is the same as in the first embodiment, and as shown in FIG. 12, CAD information used for drawing on the substrate P is corrected in the transport direction. That is, the control device 16 sets the CAD patterns CAD1 to CAD5 corresponding to the patterns PT1 to PT5 formed on the substrate P such that the end portions PTa and PTb of the patterns PT1 to PT5 are joined together. Correct CAD5 in the transport direction.

  As described above, the controller 16 controls the CAD pattern shown by the solid line in FIG. 12 according to the transport speed of the substrate P detected by the rotational position detection mechanism 14 or the transport position during alignment or drawing of the exposure apparatus EX. By correcting the positions in the conveyance direction of CAD1 to CAD5, it is possible to draw on the substrate P as patterns PT1 to PT5 shown in FIG.

  As described above, in the third embodiment, the drawing timing by the drawing modules UW1 to UW5 can be corrected based on the conveyance speed of the substrate P detected by the rotational position detection mechanism 14 or the conveyance position. For this reason, although the patterns PT1 to PT5 drawn on the substrate P can be corrected so as to be spliced in the width direction of the substrate P although they are oblique to the width direction of the substrate P, An error can be suppressed.

Fourth Embodiment
Next, with reference to FIG. 18, an exposure apparatus EX of the fourth embodiment will be described. Also in the fourth embodiment, in order to avoid overlapping descriptions with the first to third embodiments, only the portions different from the first to third embodiments will be described, and the same components as the first to third embodiments The same reference numerals as in the first to third embodiments may be added to the description and the description may be omitted. FIG. 18 is a view showing an example of an arrangement relationship between a pattern drawn on a substrate by the exposure apparatus of the fourth embodiment and drawing lines. In the exposure apparatuses EX of the first to third embodiments, the scanning directions of the drawing beam LB scanned along the drawing lines LL1 to LL5 are all the same. On the other hand, in the exposure apparatus EX of the fourth embodiment, of the drawing lines LL1 to LL5, the drawing beam LB scanned along the drawing lines LL1, LL3, and LL5 of the odd-numbered drawing modules UW1, UW3, and UW5. The scanning direction is opposite to the scanning direction of the drawing beam LB scanned along the drawing lines LL2, LL4 of the even-numbered drawing modules UW2, UW4.

  In the exposure apparatus EX of the fourth embodiment, as shown in FIG. 18, the spot light of the drawing beam LB projected onto the substrate P from each of the plurality of drawing modules UW1 to UW5 is in linear drawing lines LL1 to LL5. Along the line, scanning is performed in the Y direction from the drawing start position PO1 to the drawing end position PO2. At this time, the scanning direction of the spot light of the drawing beam LB scanned along the drawing lines LL1, LL3 and LL5 is opposite to the scanning direction of the spot light of the drawing beam LB scanned along the drawing lines LL2 and LL4. It is in the direction. This is realized by rotating all the rotating polygon mirrors 97 of the respective drawing modules shown in FIG. 7 in the same direction (for example, all in the counterclockwise direction).

  Therefore, the patterns PT1, PT3 and PT5 formed on the substrate P by the drawing beam LB scanned along the drawing lines LL1, LL3 and LL5 set on a straight line parallel to the central plane p3 correspond to those of the substrate P. Under the influence of the transport speed, for example, the sheet is formed to be inclined upward to the right in the plane of FIG. That is, the right end PTa of the patterns PT1, PT3 and PT5 is formed on the downstream side in the transport direction as compared with the left end PTb of the patterns PT1, PT3 and PT5. On the other hand, the patterns PT2 and PT4 formed on the substrate P by the drawing beam LB scanned along the drawing lines LL2 and LL4 set on straight lines parallel to the center plane p3 are affected by the transport speed of the substrate P. In the reverse direction to the patterns PT1, PT3 and PT5, that is, they are formed to be inclined upward to the left in the plane of FIG. That is, the right end PTb of the patterns PT2 and PT4 is formed on the upstream side in the transport direction as compared with the left end PTa of the patterns PT2 and PT4.

  Furthermore, the distance between the odd-numbered drawing lines LL1, LL3, and LL5 and the even-numbered drawing lines LL2 and LL4 in the Xs direction is constant, and the transport speed of the substrate P is uniform, and the rotating polygon mirror 97 of each drawing module Assuming that the rotational speeds match, the width PT of the left side PTb of the pattern PT1 drawn by the drawing line LL1 and the right end PTb of the pattern PT2 drawn by the drawing line LL2 are the width of the substrate P It is seamed about a direction (Y direction) and a conveyance direction (Xs direction). Similarly, the end PTa on the left side of the pattern PT2 drawn by the drawing line LL2 and the end PTa on the right side of the pattern PT3 drawn by the drawing line LL3 are spliced in the Y direction and the Xs direction, and drawn by the drawing line LL3. The left end PTb of the pattern PT3 to be printed and the right end PTb of the pattern PT4 drawn by the drawing line LL4 are also joined in the Y direction and the Xs direction, and the left end of the pattern PT4 drawn by the drawing line LL4 The portion PTa and the right end PTa of the pattern PT5 drawn by the drawing line LL5 are also spliced in the Y direction and the Xs direction.

  As in the fourth embodiment, the scanning direction of the spot light of the drawing beam LB scanned along the drawing lines LL1, LL3, and LL5 and the spot light of the drawing beam LB scanned along the drawing lines LL2 and LL4. If there is no unevenness in the transport speed of the substrate P if the scanning direction of the substrate P is opposite to the above, the patterns PT1 to PT5 drawn on the substrate P are slightly oblique to the width direction (Y axis) of the substrate P However, it can be seamed in the width direction of the substrate P.

  FIG. 19 shows that each of the patterns PT1 to PT5 drawn on the substrate P is corrected to be slightly inclined as in FIG. 18, and here, as in the second embodiment (FIG. 14), The inclinations of the drawing lines LL1 to LL5 are individually adjusted by slightly rotating the cylindrical lens 85b of the f-θ lens system 85 about the rotation axes I1 to I5 by the driving unit 100.

  As shown in FIG. 19, the drawing start position PO1 of the drawing lines LL1, LL3 and LL5 is located on the upstream side (-Xs direction) in the transport direction, and the drawing end position PO2 of the drawing lines LL1, LL3 and LL5 is in the transport direction. The cylindrical lens 85 b in each of the drawing modules UW 1, UW 3 and UW 5 is rotated by the drive unit 100 with respect to the substrate P so as to be positioned downstream (in the + Xs direction). On the other hand, the drawing start position PO1 of the drawing lines LL2 and LL4 is located on the upstream side (-Xs direction) in the transport direction, and the drawing end position PO2 of the drawing lines LL2 and LL4 is located on the downstream side (+ Xs direction) in the transport direction Thus, the cylindrical lens 85 b is rotated by the drive unit 100 with respect to the substrate P.

  As shown in FIG. 19, when the drawing lines LL1 to LL5 are respectively inclined about the rotation axes I1 to I5, the patterns PT1 to PT5 drawn on the substrate P by the drawing lines LL1 to LL5 after rotation are shown in FIG. As indicated by the solid line 19, they are formed linearly in the direction substantially the same as the width direction of the substrate P, and are at the same position in the transport direction (Xs direction) of the substrate P. As described above, if the transport speed of the substrate P is precisely constant and there is no speed nonuniformity, the drawn patterns PT1 to PT5 are formed linearly in a line along the width direction of the substrate P. The same applies to the second embodiment, but the points at which the rotation axes I1, I3 and I5 of the cylindrical lenses 85b of the f-θ lens system 85 of the odd number intersect the Y-Xs plane are parallel to the Y axis. It shall be located on the line.

  When the transfer speed of the substrate P at the installation azimuth line Le1 and the transfer speed of the substrate P at the installation azimuth line Le2 are different at the time of drawing of the exposure apparatus EX, as shown in the solid line in FIG. Thus, while the patterns PT1, PT3, and PT5 formed by the odd-numbered drawing lines LL1, LL3, and LL5 are formed along the width direction of the substrate P, as shown by the dotted line in FIG. The patterns PT2 and PT4 formed by the drawing lines LL2 and LL4 are formed obliquely to the width direction of the substrate P.

  For this reason, the control device 16 controls the transport speed of the substrate P on the installation azimuth Le1 detected by the encoder head EN1 of the rotation position detection mechanism 14 and the installation azimuth Le2 detected by the encoder head EN2 of the rotation position detection mechanism 14. Speed difference with the transfer speed of the substrate P in Then, the control device 16 adjusts the inclination of the even-numbered drawing lines LL2, LL4 based on the detected speed difference. The rotated patterns PT2 and PT4 are formed along the width direction of the substrate P, similarly to the patterns PT1, PT3 and PT5.

  As described above, in the fourth embodiment, the inclination of the drawing lines LL1 to LL5 is adjusted by rotating the cylindrical lens 85b by the drive unit 100 based on the transport speed of the substrate P detected by the rotational position detection mechanism 14 be able to. For this reason, the patterns PT1 to PT5 drawn on the substrate P are precisely formed without being inclined along the width direction of the substrate P by the drawing beam LB scanned along the drawing lines LL1 to LL5. In the transport direction of the substrate P, the same position can be taken. Therefore, since the patterns PT1 to PT5 drawn on the substrate P can be corrected so as to be suitably spliced in the width direction of the substrate P, even if the drawing timing is not corrected as in the first embodiment, It is possible to suppress a splice error due to speed unevenness.

  In the fourth embodiment, as in the second embodiment, the drawing lines LL1 to LL5 are rotated about the rotation axes I1 to I5, but the rotation center is not particularly limited. For example, the rotation axes I1 to I5 may be the drawing start position PO1 or the drawing end position PO2 of the drawing lines LL1 to LL5.

  In the first to fourth embodiments, the rotational position (moving position of the substrate P) and the transport speed of the rotating drum DR are detected using the scale parts GPa and GPb formed on the outer peripheral surface of the rotating drum DR. Not limited to this configuration. For example, a scale disc of high roundness may be attached to the rotary drum DR. In this scale disk, scale portions GPa and GPb are engraved on the outer peripheral surface, and fixed to the end of the rotary drum DR so as to be orthogonal to the rotation center line AX2. For this reason, the scale disk integrally rotates with the rotary drum DR around the rotation center line AX2. The scale disk is made of metal, glass, ceramic or the like with low thermal expansion as a base material, and made to have a diameter as large as possible (for example, a diameter of 20 cm or more) in order to enhance measurement resolution. In the scale disc, the so-called measurement Abbe error is further reduced by making the diameter of the outer peripheral surface of the substrate P wound around the rotary drum DR equal to the diameter of the scale parts GPa and GPb of the scale disc. Can.

  Furthermore, the configurations of the first to fourth embodiments may be combined as appropriate. For example, as in the first embodiment, each of the plurality of drawing modules UW1 to UW5 can be slightly rotated by the rotation mechanism 24, while each of the drawing modules UW1 to UW1 can be as in the second embodiment (or the fourth embodiment). The cylindrical lenses 85 b of the f-θ lens system 85 of UW 5 may be individually finely rotatable. Furthermore, as shown in FIG. 3, the position of each of the plurality of alignment marks Ks1, Ks2, and Ks formed on the substrate P is detected by the corresponding alignment microscope AM1, and the exposure area A7 on the substrate P is obtained. It is possible to continuously measure the tendency of two-dimensional stretch deformation, non-linear strain deformation and the like.

  Therefore, each or all of the drawing lines LL1 to LL5 are real-time on the surface of the substrate P so as to match two-dimensional extension deformation or non-linear distortion deformation of the exposure area A7 measured by the alignment microscope AM1. The superimposing accuracy of the pattern layer already formed in the exposure area A7 on the substrate P and the drawing pattern to be superimposed and exposed on the substrate P is corrected in the exposure area A7. It becomes possible to keep within the tolerance at each place.

  In the first to fourth embodiments, the substrate P is supported by the outer peripheral surface of the rotary drum DR, and the rotary drum DR is rotated to convey the substrate P in the long direction while rotating the substrate P. Although the pattern is drawn on the portion supported by the drum DR, it is not limited thereto. For example, in a state where the substrate P is supported by suction on the surface of a stage that supports the substrate P in a planar manner, a pattern is drawn while transporting the stage and the substrate P in the long direction together, or An air bearing layer is formed between the front surface of the support and the back surface of the substrate P in a state in which the substrate P is placed on the substrate P, and the substrate P is supported flatly and transported in a noncontact or low friction state. The pattern may be drawn.

  Furthermore, in each of the first to fourth embodiments, when adjusting the inclination of the whole of the drawing lines LL1 to LL5 in the XY plane, the rotation mechanism 24 and the second optical surface plate 25 shown in FIG. Is slightly rotated, but the entire position of the rotary drum DR can be inclined in the XY plane by slightly shifting the positions of the bearings etc. supporting the both ends of the shaft portion Sf2 of the rotary drum DR in the X direction. good. Further, when the transport speed in the longitudinal direction of the substrate P supported on the rotary drum DR is changed from the reference speed, or when the transport speed is uneven, depending on the changed speed or the speed irregularity. The rotational speed of the rotating polygon mirror 97 of each of the drawing units UW1 to UW5 may be dynamically changed. That is, the ratio of the scanning speed (main scanning speed) Vp of the spot light scanned along each of the drawing lines LL1 to LL5 to the transport speed (sub scanning speed) Vxs in the longitudinal direction of the substrate P The rotational speed of the rotating polygon mirror 97 may be controlled so as to be substantially constant even when the transport speed of the above changes.

<Device manufacturing method>
Next, a device manufacturing method will be described with reference to FIG. FIG. 21 is a flowchart showing the device manufacturing method of each embodiment.

  In the device manufacturing method shown in FIG. 21, first, function / performance design of a display panel by self-light emitting elements such as organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD (step S201). In addition, a supply roll on which a flexible substrate P (a resin film, a metal foil film, a plastic or the like) to be a base material of the display panel is wound is prepared (step S202). The roll-like substrate P prepared in this step S202 has its surface modified as necessary, a base layer (for example, minute unevenness by imprint method) formed in advance, photosensitivity What laminated the functional film and transparent film | membrane (insulation material) of previously is also good.

  Next, on the substrate P, a backplane layer composed of electrodes and wirings constituting the display panel device, an insulating film, a TFT (thin film semiconductor) and the like is formed, and organic EL etc. A light emitting layer (display pixel portion) is formed by the self light emitting element of (step S203). Although this step S203 includes the conventional photolithography process of exposing the photoresist layer using the exposure apparatus EX described in each of the previous embodiments, a photosensitive silane coupling material is applied instead of the photoresist. Exposing the patterned substrate P to form a pattern of hydrophilicity and water repellency on the surface, exposing the photosensitive catalyst layer to a pattern and forming a pattern (wiring, electrode, etc.) of a metal film by electroless plating Processing by a process or a printing process of drawing a pattern with a conductive ink containing silver nanoparticles is also included.

  Then, the substrate P is diced for each display panel device continuously manufactured on a long substrate P by a roll method, or a protective film (environmental barrier layer) or a color filter is formed on the surface of each display panel device. A sheet or the like is attached to assemble a device (step S204). Then, an inspection process is performed to determine whether the display panel device functions properly or satisfies the desired performance and characteristics (step S205). As described above, a display panel (flexible display) can be manufactured.

DESCRIPTION OF SYMBOLS 1 device manufacturing system 11 drawing apparatus 12 board | substrate conveyance mechanism 13 apparatus frame 14 rotation position detection mechanism 16 control apparatus 21 main body frame 22 three-point seat support part 23 1st optical surface plate 24 rotation mechanism 25 2nd optical surface plate 31 calibration detection System 44 XY whole halving adjustment mechanism 45 XY one side halving adjustment mechanism 51 1⁄2 wavelength plate 52 polarization beam splitter 53 beam diffuser 60 first beam splitter 62 second beam splitter 63 third beam splitter 73 fourth beam splitter 81 light deflector 82 quarter wave plate 83 scanner 84 bending mirror 85 f-θ lens system 86 optical member for Y magnification correction 92 light shielding plate 96 reflection mirror 97 rotating polygon mirror 98 home position detector 100 driving unit P substrate U1, U2 process device EX Exposure apparatus AM1, AM2 Alignment microscope EVC Temperature control chamber SU1, SU2 Vibration isolation unit E Installation surface EPC Edge position controller RT1, RT2 Tension adjustment roller DR Rotating drum AX2 Rotation center line Sf2 Shaft part p3 Central surface DL Sagging UW1 to UW5 Drawing module CNT light source device LB drawing beam I rotation axis LL1 to LL5 drawing line PBS polarization beam splitter A7 exposure area SL branch optical system (beam distribution system)
Le1 to Le4 Orientation line Vw1 to Vw6 Observation area Ks1 to Ks3 Alignment mark GPa, GPb Scale part EN1 to EN4 Encoder head PT1 to PT5 pattern

Claims (13)

A pattern drawing apparatus for drawing a pattern on a substrate having a predetermined width, comprising:
A substrate transport mechanism for supporting the substrate and transporting the substrate at a predetermined speed in a transport direction intersecting the width direction of the substrate;
A plurality of drawing modules for drawing a predetermined pattern on the substrate along a drawing line obtained by scanning the drawing beam projected on the substrate in the width direction within a range narrower than the width of the substrate, The drawing lines adjacent to each other in the width direction are separated by a predetermined distance in the transport direction so that the patterns drawn on the substrate by each of the plurality of drawing modules are joined together in the width direction of the substrate A drawing device placed with an empty space,
A substrate velocity detection device that detects the transport velocity of the substrate;
An inclination adjustment mechanism that adjusts the relative inclination of the drawing line with respect to the width direction of the substrate;
Among the plurality of drawing modules, a pattern drawn at an end of the drawing line by the one drawing module adjacent to each other in the width direction of the substrate and a drawing by the other end of the drawing line by the other drawing module Of the transport speed detected by the substrate speed detection device and the amount of the relative inclination adjusted by the inclination adjustment mechanism so that the pattern to be formed is joined in the transport direction or the width direction And a control device that controls the drawing timing of each of the drawing modules according to
A pattern drawing apparatus comprising: The pattern drawing apparatus according to claim 1, wherein
The controller is
The inclination adjustment mechanism is controlled so that the relative inclination of the drawing line is adjusted according to the transport speed detected by the substrate speed detection device, and the adjustment is caused by the adjustment of the relative inclination. Correct the drawing timing of each of the drawing modules so that the positional deviation of the seaming of patterns is corrected,
Pattern drawing device. The pattern drawing apparatus according to claim 2, wherein
The controller is
When the transfer speed detected by the substrate speed detection device is higher than a predetermined reference speed, the drawing start side of the drawing line is upstream of the drawing start side of the drawing line at the reference speed. Control the tilt adjustment mechanism so that the drawing end side of the drawing line is positioned downstream of the drawing end side of the drawing line at the reference speed, the drawing end side of the drawing line being positioned on the side;
Pattern drawing device. The pattern drawing apparatus according to claim 2, wherein
The controller is
When the transfer speed of the substrate detected by the substrate speed detection device is lower than a predetermined reference speed, the drawing start side of the drawing line is the transfer direction rather than the drawing start side of the drawing line at the reference speed. Control the inclination adjustment mechanism so that the drawing end side of the drawing line is positioned upstream of the drawing end side of the drawing line at the reference speed with respect to the downstream side of
Pattern drawing device. It is a pattern drawing apparatus of any one of Claims 1-4, Comprising:
Each of the plurality of drawing modules has its intensity modulated based on the drawing data of the pattern in order to perform the drawing operation of the pattern while the drawing beam scans in one direction along the drawing line. A modulator for generating a beam as the drawing beam; and a scanner for scanning the drawing beam along the drawing line in one dimension.
Pattern drawing device. The pattern drawing apparatus according to claim 5, wherein
The drawing apparatus includes a platen which holds each of the plurality of drawing modules in a predetermined positional relationship;
The tilt adjustment mechanism includes a rotation mechanism that rotates the platen in the drawing surface around a predetermined point in the drawing surface including the drawing line formed by each of the plurality of drawing modules;
The control device drives and controls the rotation mechanism in accordance with the transport speed detected by the substrate speed detection device.
Pattern drawing device. The pattern drawing apparatus according to claim 6, wherein
The controller is
The pattern drawn at the end of the first drawing line and the pattern drawn at the end of the second drawing line, which are adjacent to each other in the width direction of the substrate, rotate the surface plate by the rotation mechanism. After that, the drawing timing of each of the drawing modules is corrected so as to be at the same position on the substrate in the transport direction or the width direction.
Pattern drawing device. The pattern drawing apparatus according to claim 5, wherein
The tilt adjustment mechanism
A drawing line rotating mechanism, provided in each of the plurality of drawing modules, for rotating the drawing line in the drawing plane around a predetermined point in the drawing plane including the drawing line formed on the substrate Equipped
The control device drives and controls each of the drawing line rotation mechanisms provided for each of the plurality of drawing modules in accordance with the transport speed detected by the substrate speed detection device.
Pattern drawing device. The pattern drawing apparatus according to claim 5, wherein
The drawing device is
The plurality of drawing modules are held such that the scanning direction at the time of drawing of the drawing beam projected from each of the plurality of drawing modules is reverse for each of the drawing lines adjacent to each other in the width direction of the substrate Have a plate to
The tilt adjustment mechanism
Drawing line rotation which is provided in each of the plurality of drawing modules and rotates each of the drawing lines in the drawing plane around a predetermined point in the drawing plane including the drawing lines formed on the substrate Equipped with a mechanism,
Pattern drawing device. The pattern drawing apparatus according to claim 9, wherein
The controller is
The drawing line rotation mechanism provided for each of the plurality of drawing modules is controlled so that the relative inclination of each of the drawing lines is adjusted according to the transport speed detected by the substrate speed detection device. And correct the drawing timing of each of the drawing modules,
Pattern drawing device. The pattern drawing apparatus according to claim 9 or 10, wherein
Each of the plurality of drawing modules is
A rotating polygon mirror that deflects and scans the drawing beam toward the substrate in one direction;
An f-θ lens for guiding the drawing beam deflected and scanned by the rotary polygon mirror to the drawing line on the substrate;
And a cylindrical lens provided between the f-θ lens and the substrate and having a generatrix substantially parallel to the direction in which the drawing line extends, and condensing the drawing beam in the direction orthogonal to the generatrix And
The drawing line rotation mechanism relatively tilts the drawing line by rotating the cylindrical lens.
Pattern drawing device. The pattern drawing apparatus according to claim 9 or 10, wherein
The plurality of drawing modules are
An upstream drawing module provided on the upstream side of the transport direction of the substrate, and a downstream drawing module provided on the downstream side of the transport direction of the substrate;
The controller is
A speed difference detection mechanism that detects a difference between the upstream transport speed of the substrate in the drawing line by the upstream drawing module and the downstream transport speed of the substrate in the drawing line by the downstream drawing module;
The inclination adjustment mechanism adjusts the inclination of the drawing line by the downstream drawing module according to the detected speed difference.
Pattern drawing device. The pattern drawing apparatus according to any one of claims 1 to 12, wherein
The drawing apparatus includes a pulse light source which generates pulse light as the drawing beam,
When the size of the drawing beam projected from the drawing module on the substrate is D (μm), and the scanning speed of the drawing beam along the drawing line is Vp (μm / sec), the light emission of the pulse light source The repetition cycle T (seconds) is set to the relationship of T <D / Vp,
Pattern drawing device.

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