JP2018200314A - Board inspection device, inspection tool, and its relative alignment method - Google Patents

Abstract

To provide a board inspection device for reducing registration setting of a new board, and setup time of a model change in a board.SOLUTION: An inspection tool mounted to a board inspection device for inspecting a board having a plurality of inspection terminals and a board position mark includes a guide plate having a plurality of probes, a guide hole for guiding the tip to the inspection terminals, and a plurality of tool position marks, and is moved by an inspection tool movement part. A conveyance table for holding and conveying a board includes an auxiliary camera for recognizing a plurality of table position marks and a plurality of tool position marks. A main camera travels relative to the conveyance table and recognizes a plurality of position marks on the conveyance table. In the board inspection device, a control device determines a position of an original position of control coordinates of rectangular coordinates and directions of coordinates axes on the basis of a plurality of table position marks recognized by the main camera, and recognizes and adjusts the board and the inspection tool from positions on the control coordinates of the respective position marks recognized by the main camera and the auxiliary camera.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a board inspection apparatus and an inspection jig having an automatic alignment function for mainly inspecting a wiring pattern by bringing a contactor into contact with an inspection terminal of the wiring pattern formed on a printed wiring board.

  The present invention is not limited to a printed wiring board, but includes various substrates and semiconductors such as flexible boards, multilayer wiring boards, electrode plates for liquid crystal displays and plasma displays, ceramic and resin substrates for semiconductor packages, and film carriers. It can be applied to inspection of electrical wiring characteristics formed on a wafer or the like. In this specification, these various wiring boards are collectively referred to as “substrates”.

  In recent years, multilayer boards based on a build-up method corresponding to the fine and high density of printed wiring boards have been established. A substrate formed by this manufacturing method has a large number of fine via holes which are wirings between layers. As one of the reliability tests, four-terminal measurement (Kelvin method) is performed in which the internal wiring resistance between the inspection terminals is accurately measured to determine pass / fail. In this case, each of the two contacts is simultaneously brought into conductive contact with a large number of fine inspection terminals. In order to carry out this inspection, it is necessary to accurately align the substrate and the inspection jig. Prior art relating to this alignment includes the following.

  In Patent Document 1, the main camera 44 of the main body reads the table positioning mark 57 of the transfer table for transferring the substrate 2 to determine the origin of the reference coordinate system, and further, the inspection jig positioning mark by the auxiliary camera 55 of the transfer table. The position of the inspection jig 41 is recognized by reading 47A and 47B. Next, the structure which recognizes the position of a board | substrate by reading board | substrate positioning marks 2A and 2B with a main camera is disclosed. According to this, the positional relationship between the main camera and the auxiliary camera via the table positioning mark becomes an eigen constant, and the positional relationship between the board and the inspection jig is calculated and its position is calculated. By calculating the deviation and correcting and matching the position of the inspection jig, the position of the substrate pattern and the contact of the inspection jig are aligned.

  Further, in order to check the alignment state and detect and correct the positional deviation of the substrate in the inspection press or the like, an alignment confirmation camera 45 is provided inside the inspection jig, and inspection inspection is performed in the state of the press at the time of inspection. The state in which the tool alignment confirmation through-hole 46 and the substrate positioning mark 2A are coaxially overlapped is imaged, and if the substrate misalignment exceeds an allowable range, the press is released and re-alignment is performed.

However, a dedicated inspection jig with a large number of contacts that match the manufactured substrate is minute, but there are manufacturing errors in processing and assembly, so the center of multiple inspection patterns and the needle tips of the contacts are completely Therefore, when the inspection pattern is small or the manufacturing error of the needle tip is large, the contact may be detached from the inspection pattern and the continuity inspection may not be PASSed.
Furthermore, in order to confirm alignment during inspection, it is necessary to install an alignment confirmation camera (including the illumination unit) inside a dedicated inspection jig. Due to this increase, physical restrictions on the space for installing the camera configuration in the inspection jig have increased, making installation difficult.

Further, in the general-purpose inspection jig 104 that sequentially inspects all circuit patterns with the pair of movable contacts 142A and 142B of the second embodiment, the tip of the pair of contacts is the light of the auxiliary camera 55. The coordinate system of the general-purpose inspection jig is aligned with the reference coordinate system by recognizing the position of the contact by aligning with the axis.
Furthermore, an alignment confirmation camera 45 is provided for the positional deviation of the substrate due to the contact of the pair of movable contacts many times, and table positioning marks 47A and 47B (reference numeral is assumed to be 57) after inspection. The substrate positioning marks 2A and 2B are imaged to detect the positional deviation of the substrate, and re-alignment is performed in the same manner as in the first embodiment.
However, since the contact is sequentially moved and inspected on all circuit patterns on one substrate, the accumulated time for all the movements is too long, which is a disadvantageous problem for mass-produced products.

Japanese Patent Application Laid-Open No. H10-228707 shows a variation in the error of the pin group (contact group) at the time of manufacturing the inspection jig. And the means of the improvement is described. Measure the deviation of the pin position in the XY direction from the design position of some or all of the inspection pins from the design position, average the measured deviations to obtain the average pin deviation, and provide the inspection jig Measure the deviation of the position of the jig position mark in the XY direction from the design position to obtain the jig position mark deviation, and combine the pin deviation average and jig position mark deviation (average) individually or in combination. Then, based on the data, optical alignment is performed from the position of the substrate position mark acquired by the substrate camera 24 and the position of the jig position mark acquired by the jig camera 21.
Specifically, the pin position group and the jig position mark position are acquired through the through holes of the pin group and the jig position mark when the processing of the first pin holding member 134 that holds the tip end side of the pin is completed. Is substituted with the actual measured length (actual measurement).
However, as the jig position data to be registered in the board inspection apparatus, the deviation of the pin group is the average value of the XY components and does not matter the deviation amount of each pin. Contact with large inspection terminals may be lost.

In Patent Document 3, the lower imaging unit 4 is moved to image the pair of reference points of the upper probe jig, and the upper imaging unit 3 similarly images the pair of lower reference points of the lower probe jig. At the time of inspection, the upper and lower image pickup units are returned to the reference position T, and the front and back surfaces of the IC package substrate are individually imaged by image analysis of a pair of reference points on the upper and lower surfaces of the substrate. The amount of misalignment correction is calculated and the upper probe jig and the lower probe jig are individually corrected in the X axis, Y axis, and θ directions. In this configuration, the upper and lower imaging units 3 and 4 (cameras) can recognize the front and back of the IC package substrate and the positions of the upper and lower probe jigs.
However, the condition is that the upper and lower camera positions and the optical axes coincide with the reference position T, and that the three coordinate systems of the respective feeding mechanisms of the upper and lower cameras and the workpiece feeding mechanism 5 are matched. There is a possibility that the optical axis may be deviated from each other before and after the operation over time and during the operation. If any one of them deviates, readjustment is necessary. Further, the reference marks (marks) of these three coordinate systems are not disclosed, and there is a problem that readjustment at the site is not easy.

In Patent Document 4, a dent sheet of pressure-sensitive paper (a white sheet that changes color when pressure is applied) is attached to a substrate, and a test head is pressed to obtain a dent of the probe P. Since the position of a specific dent is recognized by the camera of the apparatus and statistical processing is performed, the “position deviation amount” and “position deviation direction”, which are the positions of all the probes P, are specified. This solves the difficulty of identifying an unclear dent of the probe P directly from the substrate by sticking the dent sheet.
However, this operation is necessary every time the test head is mounted on the apparatus, and is a burden on the operator. Further, when the probe needs to be replaced due to a malfunction of the probe, the test head is removed from the apparatus, so that it is necessary to perform this operation again.

In order to solve this problem, in Patent Document 5, the periphery of the optical position that has been optically aligned is searched by electrical inspection to obtain a central position that conforms to electrical inspection, and the difference from the electrical inspection position is determined. Is written to and read from the main storage device of the apparatus or the storage means of the inspection jig on a one-to-one basis with the inspection jig, and alignment is performed based on the data representing the difference.
In addition, with respect to the substrate inspection apparatus, calibration is performed by using a master scale to standardize the measurement of the substrate inspection apparatus and remove errors inherent in the plurality of substrate inspection apparatuses.

However, in the case of electrical exploration, there is a problem that the same substrate of the sample is moved a little from the optical position and pressed many times, and the sample substrate becomes defective.
In addition, as a calibration for removing errors inherent to each of the plurality of board inspection apparatuses, the characteristic of each apparatus may still remain only by setting the origin of the XY coordinate system depending on the main camera and the master scale.
Further, although the substrate is manufactured as designed, the substrate also has a variation in position error in the target mark position in the manufacturing process.
As described above, various measures have been made for the means for recognizing the positions of the inspection jig and the substrate before the inspection and aligning the inspection jig with the substrate, but there is room for improvement.

JP 2000-055971 A JP 2013-164381 A Japanese Patent Laid-Open No. 10-332863 JP 2014-159978 A JP 2010-169651 A

  In the alignment methods disclosed in Patent Documents 1 to 4, an inspection terminal of a substrate that easily produces a PASS suitable for electrical inspection at a position slightly shifted from the position of optical alignment with the position of the substrate, and a contact of an inspection jig There may be electrical locations that are suitable for alignment. For this purpose, in Patent Document 5, data on the difference between the optical position and the electrical position is stored as a manufacturing error of the inspection jig on a one-to-one basis and added to the optical position. However, if the board inspection device to be mounted changes, the electrical position may also change, and the electrical position that matches the electrical inspection is recognized again by electrical exploration around the optical position, and the compatible position is different from the existing position. In such a case, it is necessary to correct the alignment data so that the matching position becomes the alignment target position.

Also, when using a plurality of board inspection devices and a plurality of inspection jigs, the data of the inspection board product name may be corrected again if the combination is changed. Setup time may be longer when making changes.
From the above situation, it can be seen that each of the plurality of substrate inspection apparatuses, inspection jigs, and substrates still has an error factor due to variations in manufacturing errors. Appropriate measures are required for the factors of each part.

  From the above viewpoint, the present invention minimizes the difference between the optical position and the electrical position, and the registration of the difference can be applied to a plurality of devices at one time with more appropriate optical alignment. Realize. It is another object of the present invention to provide a substrate inspection apparatus, an inspection jig to be mounted on the substrate inspection apparatus, and an alignment method thereof for shortening the setup time when setting a new substrate for a new product and changing the model of the substrate.

  According to a first aspect of the present invention, there is provided a substrate inspection apparatus for inspecting electrical characteristics of a substrate having a plurality of inspection terminals wired with an electric circuit and a plurality of substrate position marks. A replaceable inspection jig for contacting the probe, an inspection jig moving section for holding and moving the inspection jig on the inspection jig holding section, and a plurality of table position marks for holding and transporting the substrate on the substrate holding section An inspection jig comprising: a certain conveyance table; and a main camera that moves relative to the conveyance table and recognizes a plurality of position marks on the conveyance table including the plurality of substrate position marks and the plurality of table position marks. Has a guide plate with a guide hole for guiding the tip of the probe to the inspection terminal and a plurality of jig position marks, and the transfer table moves relative to the inspection jig to place a plurality of jig position marks. Recognition There is a camera, and the board inspection device uses the position of the origin of the control coordinates that are orthogonal coordinates and the direction of the coordinate axis based on the plurality of table position marks recognized by the main camera in optical alignment for aligning the board and the inspection jig. And further comprising a control device for controlling the relative movement of the inspection jig and the transfer table, the control device recognizes the position of the substrate on the control coordinates from a plurality of substrate position marks recognized by the main camera, A substrate inspection apparatus for aligning a substrate and an inspection jig by recognizing a position of the inspection jig on a control coordinate from a plurality of jig position marks recognized by an auxiliary camera.

According to a second means of the present invention, in the first means, there are three or more table position marks, two or more near one axis of the control coordinates, and one or more apart.
According to a third means of the present invention, in the first or second means, an alignment camera for recognizing a plurality of position marks on the transfer table is attached to the inspection jig holding portion, and the control device includes the main camera and the alignment camera. Based on a plurality of table position marks recognized by the camera, the X-axis of the movement coordinate in the X or Y direction of the transfer table and the control coordinate of the movement in the X or Y direction of the inspection jig holding unit by the inspection jig moving unit And the movement of the conveyance table in the X direction or the Y direction and the movement of the inspection jig holding part in the X direction or the Y direction by the inspection jig moving part based on the recognized deviation. Correct.
According to a fourth means of the present invention, in the third means, an XY standard scale having calibration data is held in the substrate holder, and the main camera or the alignment camera recognizes a plurality of predetermined positions on the XY standard scale. The control coordinates are calibrated.

According to a fifth means of the present invention, in the third or fourth means, the auxiliary camera has an auxiliary camera position mark indicating the optical axis position fixed to the transfer table. The position of the auxiliary camera is recognized on the control coordinates by the auxiliary camera position mark recognized by the camera.
According to a sixth means of the present invention, in any one of the third to fifth means, the control device determines the X of the transfer table based on a plurality of table position marks recognized by the main camera or the alignment camera for each predetermined condition. Recognize the displacement of the control coordinate of the movement in the direction or Y direction and the movement of the inspection jig holding unit in the X direction or Y direction by the inspection jig moving unit from the X axis and the Y axis, and based on the recognized deviation, Based on a plurality of jig position marks recognized by the auxiliary camera by correcting the movement of the conveyance table in the X or Y direction and the movement of the inspection jig holding unit in the X or Y direction by the inspection jig moving unit. The position of the inspection jig is recognized on the control coordinates.

According to a seventh means of the present invention, in any one of the first to sixth means, the control device recognizes the plurality of resist position marks selected from the plurality of openings of the resist mask on the substrate surface, which is recognized by the main camera, A positional deviation from the inspection terminal of the resist mask is recognized from a plurality of substrate position marks, and the positional deviation is reflected in the recognition of the position of the substrate.
According to an eighth means of the present invention, in any one of the first to seventh means, the control device includes a storage unit, and the control device optically aligns the inspection jig with an electrical inspection. The data representing the recognized difference is stored in the storage unit in a one-to-one relationship with each inspection jig and stored in the inspection jig holding unit. Data representing a difference associated with the tool is read from the storage unit, and alignment is performed based on the read data representing the difference.
According to a ninth means of the present invention, in any one of the first to seventh means, the inspection jig has a storage unit, and the control device includes an optical position optically aligned with respect to the inspection jig, and an electrical Recognizing the difference from the electrical position suitable for inspection, storing the data representing the recognized difference in the storage unit of the inspection jig that recognized the difference, and storing the inspection jig held in the inspection jig holding unit The data representing the difference is read from the section, and alignment is performed based on the read data representing the difference.

  According to a tenth means of the present invention, there is provided a preparing step for preparing a substrate inspection apparatus according to any one of the first to ninth means, and the main camera is moved relative to the transfer table so that a plurality of substrate position marks and a plurality of substrate position marks are provided. A step of recognizing a plurality of position marks on the transfer table including the table position mark, and a position of the origin of the control coordinates which are orthogonal coordinates based on the plurality of table position marks recognized by the main camera and the coordinate axis Determining the orientation of the substrate, the step of moving the auxiliary camera relative to the inspection jig mounted on the inspection jig holding portion to recognize a plurality of jig position marks, and mounting the substrate on the substrate holding portion. And a step of recognizing a plurality of substrate position marks on the substrate mounted by moving the main camera relative to the transfer table, and a plurality of substrate position marks recognized by the main camera by the control device. Control board position from An alignment process for aligning the substrate and the inspection jig by recognizing the position of the inspection jig on the control coordinates from a plurality of jig position marks recognized by the auxiliary camera and recognized by the auxiliary camera. And a step of performing electrical inspection by bringing the substrate and an inspection jig into contact with each other later.

According to an eleventh means of the present invention, in the tenth means, the preparing step prepares a substrate inspection apparatus in which an alignment camera for recognizing a plurality of position marks on the transfer table is attached to the inspection jig holder as the substrate inspection apparatus. The substrate inspection method includes a mark recognition process in which the main camera and the alignment camera move relative to the transfer table to recognize a plurality of table position marks, and a plurality of control devices that have been recognized in the mark recognition process. Based on the table position mark, the control coordinate of the movement of the transfer table in the X direction or Y direction and the movement of the inspection jig holding unit in the X direction or Y direction by the inspection jig moving unit from the X axis and the Y axis is shifted. And the movement of the conveyance table in the X direction or the Y direction based on the deviation recognized in the deviation recognition process and the holding of the inspection jig by the inspection jig moving unit A correction step of correcting the control of the X or Y direction of the movement of the further comprising a.
According to a twelfth means of the present invention, in the eleventh means, the substrate holding portion holds the XY standard scale having calibration data, and the main camera or the alignment camera moves relative to the transport table. Recognizing a plurality of predetermined positions on the XY standard scale, and a step in which the control device calibrates the control coordinates based on the plurality of recognized predetermined positions.

According to a thirteenth means of the present invention, in the eleventh or twelfth means, the preparation step includes an auxiliary camera position mark fixed to the transfer table as a substrate inspection device and indicating an optical axis position of the auxiliary camera. A substrate inspection apparatus is prepared, and the substrate inspection method includes a step in which the main camera or alignment camera moves relative to the transfer table to recognize the auxiliary camera position mark, and the control apparatus includes the main camera or alignment camera. And a step of recognizing the position of the auxiliary camera on the control coordinates by the recognized auxiliary camera position mark.
According to a fourteenth means of the present invention, in any one of the eleventh to thirteenth means, the main camera or the alignment camera moves relative to the transport table for each predetermined condition to recognize a plurality of table position marks. Mark recognition step and the control device based on a plurality of table position marks recognized in another mark recognition step, the movement of the transfer table in the X or Y direction, and the holding of the inspection jig by the inspection jig moving unit Another shift recognition process for recognizing a shift from the X-axis and the Y-axis of the control coordinates of the movement in the X direction or the Y direction of the unit, and the transfer table based on the shift recognized by the control apparatus in another shift recognition process Correcting the movement in the X direction or the Y direction and the control of the movement in the X direction or the Y direction of the inspection jig holding unit by the inspection jig moving unit, and the auxiliary camera for each predetermined condition, Move relatively The jig position mark recognition process for recognizing a number of jig position marks, and the control device controls the position of the inspection jig based on the plurality of jig position marks recognized in the jig position mark recognition process. And recognizing above.

According to a fifteenth means of the present invention, in any one of the tenth to fourteenth means, the main camera moves relative to the transfer table, and a plurality of resists among a plurality of openings of the resist mask on the substrate surface are provided. Recognizing a position mark together with a plurality of substrate position marks;
A step of recognizing a positional deviation from the inspection terminal of the resist mask from the recognized plurality of resist position marks and a plurality of substrate position marks, and reflecting the positional deviation in the recognition of the position of the substrate; In addition.
According to a sixteenth means of the present invention, in any one of the tenth to fifteenth means, the preparing step prepares a substrate inspection apparatus having a storage unit as a substrate inspection apparatus, and the substrate inspection method includes a control The apparatus recognizes the difference between the optical position optically aligned for the inspection jig and the electrical position suitable for the electrical inspection, and the control apparatus uses the data representing the recognized difference as individual inspection treatments. A step of storing the data in the storage unit in a one-to-one relationship with the tool, and a step of reading data representing a difference associated with the inspection jig held in the inspection jig holding unit from the storage unit. The alignment step includes a step in which the control device aligns the substrate and the inspection jig based on the data representing the read difference.

According to a seventeenth means of the present invention, in any one of the tenth to fifteenth means, the preparing step prepares a substrate inspection apparatus having a storage unit as an inspection jig as a substrate inspection apparatus, and the substrate inspection method is controlled The device recognizes the difference between the optical position of the inspection jig optically aligned and the electrical position suitable for the electrical inspection, and the controller recognizes the difference between the data representing the recognized difference. A step of storing in the storage unit of the inspection jig, and a step in which the control device reads data representing the difference from the storage unit of the inspection jig held in the inspection jig holding unit. Includes a step in which the control device aligns the substrate and the inspection jig based on the data representing the read difference.
According to an eighteenth means of the present invention, in any one of the tenth to seventeenth means, the main camera moves relative to the conveyance table for each predetermined condition during continuous automatic inspection to recognize a plurality of table position marks. The table position mark recognition process and the control unit check the difference from the start of continuous automatic inspection of multiple table position marks recognized in the table position mark recognition process, and reset the origin of the control coordinates and the direction of the coordinate axes And a step of the auxiliary camera recognizing a plurality of jig position marks for each predetermined condition during the continuous automatic inspection.

  A nineteenth means of the present invention is the optical position recognition verification method of the substrate inspection apparatus according to the first or second means, wherein the auxiliary camera moves relative to the inspection jig, and the control coordinates The process of recognizing the position of multiple jig position marks on the top, and fixing a pressure-sensitive acquisition plate with a pressure-sensitive sheet affixed to the part that faces the multiple jig position marks on the substrate holder, and moving it relative to the inspection position And press-contacting process that moves relative to the board recognition position after pressing on the inspection jig, and the main camera moves relative to the transfer table, and multiple pressure-sensitive positions of the press-contact traces of multiple jig position marks on the control coordinates The process of recognizing the position of the mark and the position of a plurality of pairs of position marks corresponding to the pressure-sensitive recognition of the auxiliary camera and the main camera have the same relative movement from the inspection position on the control coordinate to the board recognition position. And a process of verifying.

A twentieth means of the present invention is an inspection jig mounted on a substrate inspection apparatus for inspecting the electrical characteristics of a substrate having a plurality of inspection terminals wired with an electric circuit, the inspection jig main body, and data An inspection jig body that holds a plurality of probes that are in contact with an inspection terminal and a plurality of probes that are in contact with an inspection terminal. And a guide plate having a plurality of guide holes for guiding the tips of the plurality of probes to the inspection terminals, and the guide plate has a plurality of jig position marks capable of optically recognizing the position. The data of the recording medium includes design position data of a plurality of jig position marks and position data after correction of the plurality of jig position marks. Multiple inspection terminal design inspection points and multiple inspection terminals It is corrected from the measurement positions of the multiple jig position marks so that the position of the contact point group of the multiple probes set from the measurement position of the inner hole or the measurement position of the tip group of the multiple probes is properly aligned. It is the position data of a plurality of jig position marks.
According to the twenty-first means of the present invention, in the twentieth means, the condition for proper alignment is that the position of the contact point group of the plurality of probes is shifted from the design inspection point of the plurality of inspection terminals, or a plurality of conditions. This is determined from a margin that deviates from the design area of the inspection terminal.

According to a twenty-second means of the present invention, in the twentieth or twenty-first means, the inspection jig comprises a storage means for writing and reading data by a substrate inspection apparatus, and the storage means includes a recording medium.
A twenty-third means of the present invention is a method for manufacturing an inspection jig according to any one of the twentieth to twenty-second means, and includes a step of creating position data after correcting a plurality of jig position marks. Is a step of creating design data of a plurality of inspection terminals of the substrate, a position of the plurality of jig position marks of the manufactured inspection jig main body, a position of a plurality of guide holes, or a position of a tip group of a plurality of probes Measuring the position of the probe, setting the position of the contact point group of the plurality of probes from the measured position, and rotating the contact point group of the plurality of probes to properly match the plurality of inspection terminal groups of the substrate Exploring and determining the amount and amount of movement, and creating corrected position data corrected from the measurement positions of the plurality of jig position marks so as to correspond to the determined amount of rotation and amount of movement; A method for manufacturing an inspection jig.

According to the first or tenth means of the present invention, the substrate and the inspection jig are automatically optically aligned over time from a plurality of position marks automatically recognized by the main camera and the auxiliary camera. And reduce the burden on the operator. Since there are a plurality of permanent fixed table position marks, the position (X, Y, Θ) is recognized with the transport table as at least a surface on the control coordinates of the orthogonal coordinates that the main camera recognizes by relative movement. The change with time can be understood from the difference between the position recognition and the origin of the orthogonal coordinates and the direction of the coordinate axes, and appropriate measures such as resetting, correcting, and warning various mechanism bodies can be performed when setting the control coordinates. For example, in the case of parallel movement of the surface, it is reset as the optical axis movement of the main camera. Relative movement can be maintained over time on the control coordinates within the range of XY plane distortion of the transport table, and surface recognition and control alignment can be reproduced over time.
Since there are a plurality of jig position marks on the guide plate having a guide hole for slidably guiding the tips of the probes that are in contact with the plurality of inspection terminals of the substrate, the position variations of the plurality of probe tips are limited and stabilized.
In addition, since the two cameras can recognize a plurality of position marks facing each other at any time, the change with time can be recognized, and the reproducibility of alignment can be ensured.

According to the second means of the present invention, since the transfer table has a plurality of fixed table position marks of three or more in a two-dimensional position, it functions as a permanent XY scale and functions as an XY moving unit of the main camera. The change over time, such as the degree of orthogonality, can also be clearly seen. It is possible to distinguish between the rotation of the moving part and the orthogonality. Further, correction can be made based on a plurality of table position marks at any time.
Since the camera recognizes the position by relative movement, timely recognition of the XY scale and correction of the moving part may be necessary with time.
According to the third or eleventh means of the present invention, the relative movement control is corrected based on the positional deviations of the plurality of table position marks recognized by the main camera and the alignment camera, and the movement on the control coordinates. Reproducibility of camera recognition is stable and stable. The transfer table can correspond to the configurations of various mechanism bodies such as a rotary table. The relative movement between the substrate recognition position and the inspection position becomes clear on the control coordinates.

According to the fourth or twelfth means of the present invention, correction of length (straightness), angle (rotation, parallelism, straightness), and orthogonality (intersection angle) based on the XY standard scale with calibration data is possible. Can be calibrated. If there is an XY standard scale calibration certificate, the compatibility will increase. This ensures the accuracy of the mechanism body after delivery of the moving parts of each axis on the control coordinates. In addition, when a plurality of units are installed and operated, it can be improved by calibrating and correcting variations in errors between devices. The moving unit can be corrected over time based on the recognized position data of the plurality of table position marks after calibration.
According to the fifth or thirteenth means of the present invention, since the auxiliary camera position mark is recognized on the control coordinates by the main camera or the alignment camera, assembly errors of a plurality of board inspection apparatuses can be eliminated.
According to the sixth, fourteenth, and eighteenth aspects of the present invention, the state of the mechanism body such as a predetermined position mark and a device operating room temperature is automatically recognized under predetermined conditions even during continuous automatic inspection. It can also be modified. As a result, the state at the start of the inspection can be maintained and recovered. Also, it is ensured that the substrate surface and the surface of the inspection jig are relatively equivalent on the control coordinates over time.

According to the seventh or fifteenth means of the present invention, a plurality of resist position marks are also optically recognized, and it corresponds to an electrical inspection in which a plurality of probes reflecting a resist displacement amount in a substrate manufacturing process are brought into contact with an inspection terminal. Correction recognition can be performed at the position of the substrate to be performed.
According to the eighth, ninth, sixteenth, seventeenth and twenty-second means of the present invention, if there is a difference between an appropriate optical position for optical alignment and an electrical position suitable for an actual electrical inspection, one inspection treatment is possible. It can be stored as a characteristic value of the tool and reused as data representing the difference.
According to the nineteenth means of the present invention, the position recognition of the inspection jig of the auxiliary camera and the main camera is performed from the inspection position to the board recognition position by using the pressure-sensitive acquisition plate on which the pressure-sensitive sheet is pasted. It is verified that the relative movement is a parallel movement of the surface, and the position of the auxiliary camera inspection jig is guaranteed.

According to the twentieth to twenty-second means of the present invention, the position data of a plurality of jig position marks indicating the position of the inspection jig is calculated appropriately by the contact point group of the probe in consideration of the manufacturing error in the inspection terminal group. Since there is corrected position data that is the measurement positions of the plurality of jig position marks when they are aligned, the inspection jig can be optically aligned more appropriately. The difference from the design position data is the correction of the manufacturing error.
According to the twenty-first means of the present invention, the contact point group of the substrate and the inspection jig can be properly aligned according to the state characteristics such as the shape and arrangement of the plurality of inspection terminals of the substrate.
It is easy to set up and deliver time for inspection jigs manufactured in the new period. The difference between the optical position of the alignment and the electrical position can be minimized. Verification of calculation consistency before delivery is a useful tool for evaluating the feasibility and margin of inspection.
Although the effects of the invention have been described according to the means of the present invention, the common specific items have the same effects in other means. They may also interact with each other.

FIG. 1 is an overall explanatory view showing a substrate inspection apparatus according to the present invention. FIG. 2 is a perspective view for explaining the relative movement of the transfer table and the inspection jig in FIG. 1 on the control coordinates. FIG. 3 is a cross-sectional view illustrating the auxiliary camera. FIG. 4 is an explanatory diagram of the design data of the substrate and the inspection jig and the guide plate. FIG. 5 is an explanatory view of a side view, a bottom view, and a partially enlarged view of the inspection jig. Fig.6 (a) is explanatory drawing of the alignment jig | tool used for recognition of a mechanism main body. FIG. 6B is an exemplary diagram of an XY standard scale. FIG. 7 is a conventional example of an error distribution diagram of the probe position of the inspection jig. FIG. 8A is an explanatory diagram in which the auxiliary camera images the jig position mark. FIG. 8B is an explanatory diagram in which the auxiliary camera images the jig position mark hole. FIG. 9A is an explanatory diagram in which the main camera images a pressure-sensitive position mark (convex portion). FIG. 9B is an explanatory diagram in which the main camera images the pressure-sensitive position mark (hole). FIG. 10 is an explanatory view of a form of a rotary table for transporting the substrate of the mechanism main body.

Hereinafter, a substrate inspection apparatus, an inspection jig, a substrate, and an alignment method according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.
[Embodiment 1]

FIG. 1 is an explanatory view on the right side showing a substrate inspection apparatus 1 according to the present invention. An orthogonal coordinate system based on the XYΘZ axes is shown from the viewpoint of clarifying the moving direction of the transfer table 21 for transferring the substrate 2 and the upper and lower inspection jig moving units 30 and 30B. As for each axis, the direction of the arrow in FIG. 1 is the positive direction. When a direction is indicated, it is based on an orthogonal coordinate system based on the XYΘZ axes.
The substrate inspection apparatus 1 has inspection jigs 3 and 3B arranged vertically to electrically inspect both surfaces of the substrate 2. And it has the function of alignment which optically recognizes the position of inspection jig | tool 3, 3B, and the board | substrate 2 from both surfaces, and aligns both surfaces, before making it contact | abut. Regarding the explanation of the optical alignment, since the inspection jig 3 and the like are arranged symmetrically in the vertical direction, the explanation on the upper side will be given and the lower side can be interpreted similarly. For example, the inspection jig 3 is described, and when necessary, the lower inspection jig 3B is described.

The substrate inspection apparatus 1 includes a table moving unit 20 for a transfer table 21 that holds a substrate 2 on a substrate holding unit 211 and moves the substrate 2 along the Y axis. An inspection jig moving unit 30 for moving the inspection jig 3 including a plurality of probes 31 in the XYΘZ plane is provided. The upper and lower inspection jig moving parts 30 and 30B are arranged symmetrically with respect to the XY plane.
The transfer table 21 shown in FIGS. 1 and 2 includes a plurality of table position marks 22 that indicate the position of the transfer table 21, a substrate holder 211 on which the substrate 2 is placed and held, and an inspection treatment as will be described later. Auxiliary cameras 25 and 25B for recognizing the positions of the tools 3 and 3B are provided.

  The inspection jig moving units 30 and 30B include inspection jig holding units 301 and 301B. The inspection jigs 3 and 3B are mounted and held, and the inspection jigs 3 and 3B are moved to move the substrate 2 It functions so that the plurality of probes 31 are brought into contact with the inspection terminal 201 of the wiring pattern to be inspected. A plurality of probes 31 are electrically connected to the tester 13 via a circuit switching part for electrical inspection of the substrate 2 via connectors of the inspection jig holding parts 301 and 301B.

  Control such as movement of the inspection jig moving units 30 and 30B and the table moving unit 20 is performed by the control device 11. An operator of the substrate inspection apparatus 1 gives an instruction to the apparatus from the operation panel 12 and operates according to the display on the panel screen. The configuration of the moving shaft of the inspection jig moving unit 30 is the X, Y. They are stacked in a Θ and Z axis configuration. The center of the Y-axis moving unit is coaxial with the center of Θ and Z-axis. Further, the combination may be changed as long as the control calculation is suitable.

Further, main cameras 15 and 15B for specifying the XY axis positions of the position marks on the substrate 2 and the transfer table 21 are attached to the X axis moving parts of the upper and lower inspection jig moving parts 30 and 30B, respectively. An XY coordinate system of the main camera 15 is formed.
Images captured by the main camera 15 and the auxiliary camera 25 are processed into predetermined position data by the image processing unit 14 and stored in the main storage unit 111 of the control device 11.

FIG. 2 is a diagram for explaining the inspection jig 3, the transfer table 21, the control coordinates 112, and the like held by the inspection jig holding unit 301 of the upper inspection jig moving unit 30 of the substrate inspection apparatus 1 in FIG. FIG.
The transfer table 21 is provided with a plurality of table position marks 22, one of which is used as the position of the reference mark 22 </ b> S of the XY control coordinates of the substrate inspection apparatus 1. With this as the origin, the control coordinate 112 is set in the control device 11. Then, the positions of the substrate 2 and the inspection jig 3 are recognized on the control coordinates 112.

The position of the substrate 2 is specified by moving the main camera 15 relative to the transfer table 21 to image the pair of substrate position marks 2a and 2b and converting them to the XY position to determine the substrate position (XYΘ, center position and rotation angle). Recognize as a face. Similarly, the inspection jig 3 recognizes the surface of the inspection jig position (XYΘ) by imaging the pair of jig position marks 3a and 3b by the relative movement of the auxiliary camera 25.
Since the distance between the table position mark 22 and the position of the auxiliary camera optical axis 25L of the auxiliary camera 25 described later is mechanically fixed, the positions of the substrate 2 and the inspection jig 3 are specified with reference to the reference mark 22S. Can do.

  The jig position marks 3 a and 3 b are read by the auxiliary camera 25 attached to the transfer table 21, and the table position mark 22 and the substrate position marks 2 a and 2 b of the substrate 2 are read by the main camera 15. Data such as the position of the inspection jig 3 on the XY control coordinates obtained from the data read by the main camera 15 and the auxiliary camera 25 is stored in the main storage unit 111 of the control device 11.

  The outline of the electrical control system in the substrate inspection apparatus 1 is provided with a control device 11, a drive system of a moving part of the mechanism body 10 such as X, Y, Z, Θ, an operation panel 12, a tester 13, and an image processing unit 14. The main storage unit 111, external storage means, and the like are connected to control the substrate inspection apparatus 1.

  As shown in FIG. 2, the substrate holding portion 211 mounted on the transfer table 21 is provided with three engagement pins 211 a according to the outer shape of the substrate 2, and the side surfaces of the substrate 2 are engaged with them. At the same time, the substrate 2 is held at an appropriate position of the substrate holding portion 211 by urging the substrate 2 toward the engagement pin by a biasing means (not shown) from the direction facing the engagement pin 211a. Thus, the distance from the position of the reference mark 22S to the substrate position marks 2a and 2b is predetermined in design.

  Through-openings are formed in the substrate holding part 211 and the transport table 21, and the circuit pattern on the lower surface of the held substrate 2 is abutted and inspected by the lower inspection jig 3 </ b> D. The auxiliary camera 25B arranged in parallel with the auxiliary camera 25 is used for imaging the jig position marks 3Ba and 3Bb of the lower inspection jig 3B in the −Z direction. Since the auxiliary cameras 25 and 25B have the same configuration, the configuration of the auxiliary camera 25 will be described here.

  As shown in FIG. 3, the auxiliary camera 25 includes an illumination unit 251 on the upper surface of the transfer table 21. The illumination unit 251 includes an outer metal tube 252 whose inner surface reflects light and a light divergence portion 253 made of a transparent material such as acrylic resin or glass. The light generated from the light source passes through the light guide portion 254 made of a material such as glass fiber, reaches the light divergence portion 253, diverges at the light divergence portion 253, becomes diverging light, and the jig position mark 3a. 3b. The auxiliary camera opening 251A of the external metal cylinder 252 has a circular shape with a diameter of 2 mm, and the center is the focal point of the auxiliary camera 25 and the auxiliary camera optical axis 25L. The image is changed in the Y-axis direction by the prism 255 and imaged on the CCD 257 via the lens 256. The field of view of the camera 25 is about 2.5 mm square. When the jig position marks 3a and 3b approach from just above the Z axis and enter the depth of focus, an image is formed simultaneously with the auxiliary camera opening 251A and the position from the auxiliary camera optical axis 25L can be recognized. The image is shown in FIG.

  When the auxiliary camera opening 251A is viewed from directly above the Z axis, the center of the inscribed circle of the cylinder is the auxiliary camera optical axis 25L. It is fixed to the transport table 21 and is preferable as the auxiliary camera position mark 25P. However, the height differs from the table position mark 22 by a difference of 25 Ph in order to image the jig position marks 3a and 3b. The main camera 15 moves relative to the transport table 21 and the XY plane and images the table position mark 22 and the substrate position marks 2a and 2b to recognize the position, so that the position mark surface is an object within the depth of focus of the main camera 15. It is a plane of distance.

The transport table 21 in FIG. 2 has a plurality of table position marks 22. Based on one of the centers of the X axes, there are four each, one for + X and -X and one for + Y. The position where the center reference mark 22S and the optical axis of the main camera 15 coincide with each other is set as the origin (0, 0) 112S of the control coordinate 112 of the control device 11. The four points are arranged at (0,0), (+ tm1,0), (-tm2,0), (0, + tm3) by design.
Similarly to the table position mark 22, the substrate position marks 2 a and 2 b of the substrate 2 held by the substrate holding unit 211 are imaged by the main camera 15 and the XY positions are recorded in the main storage unit 111. The centers of the through openings of the substrate holder 211 and the transfer table 21 are designed to be (0, −ts). The XY positions of the substrate position marks 2a and 2b are also designed (set) from the substrate design data in advance with the center of the outer shape of the substrate 2 being (0, 0). When (0, −ts) * (− 1) is added to the origin 112S (0, 0) of the control coordinates 112, the control coordinates 112 and the board recognition position S6 of the main camera 15 of the mechanism body 10 are obtained.

The probe holder 35 shown in FIG. 5 of the inspection jig 3 is also designed with the center of the outer shape of the substrate 2 as a reference (0, 0). Further, the center of the inspection jig moving unit 30 and the center of the Θ and Z axes are coaxially configured. When the inspection jig holder 301 is rotated at the inspection position S7, the probe holder 35 of the inspection jig 3 is rotated around the center of the substrate 2.
Since the reference mark 22S (0, 0) of the table position mark 22 and the auxiliary camera optical axis 25L of the auxiliary camera 25 are at a fixed distance Df, the transfer table 21 is moved relative to the inspection jig 3 by a design distance to perform inspection. At the tool recognition position S4, the auxiliary camera 25 images the pair of jig position marks 3a and 3b and stores the positions in the main storage unit 111. The position of the surface XYΘ of the inspection jig 3 on the control coordinates 112 is known. Since the XYΘ position of the inspection jig 3 and the XYΘ position of the substrate 2 are known on the control coordinates 112, the substrate 2 and the inspection jig 3 are aligned by performing relative processing and XYΘ movement.

The outline of the operation and operation steps of the substrate inspection apparatus 1 is as follows.
S0: Recognizes the state of the mechanism main body 10 of the substrate inspection apparatus 1.
S1 Data for inspection of the substrate 2 to be inspected is set.
S2: The corresponding substrate holding part 211 is mounted.
S3. The corresponding inspection jig 3 is mounted.
S4: The optical position of the inspection jig 3 is recognized.
S5: The substrate 2 is placed and the inspection is started.
S6: Recognizes the optical position of the substrate 2 and performs relative movement including alignment.
S7: Press and inspect the inspection jig 3.
S8: The press is released and the substrate 2 is removed by relative movement.
It becomes. The model change setup in which the type of the substrate 2 to be inspected changes is performed from S1 to S8, and if the electrical inspection is PASS, the continuous automatic inspection is started. In the continuous automatic inspection cycle, S5 to S8 are repeated.

The recognition of the state of the mechanism body 10 in step S0 will be described. Each mechanism body 10 has characteristics (variation) including manufacturing errors. In addition, the characteristics change depending on the external environment such as the room temperature of the installed factory. In many cases, multiple units are installed in the same factory. Therefore, a means for recognizing the state of each mechanism body 10 and matching the specifications of the product (device) accuracy will be described.
Step S0A: The XY standard scale 61 is placed on the substrate holder 211, and the XY coordinate system recognized by the main camera 15 is calibrated based on the XY standard scale 61.
Step S0B: The alignment jig 40 is mounted on the inspection jig holder 301, and the XY coordinate system recognized by the alignment camera 41 is calibrated based on the XY standard scale 61.

  Various XY standard scales 61 placed on the substrate holding part 211 in step S0A are commercially available depending on the size and accuracy specifications. For example, in the case of XY100 mm shown in FIG. 6B, the material is soda glass, the outer shape is 127 (x) * 127 (y) * 5 (t), and the X axis and the Y axis are 50 mm (center) orthogonal to each other. Yes. The scale accuracy is ± 0.002. A calibration certificate can be attached and obtained.

  First, the main camera 15 moves relative to recognize a plurality of table position marks 22. Then, the origin 112S of the control coordinate 112 is set based on the reference mark 22S. Next, a plurality of predetermined positions on the XY standard scale 61 are recognized. Since the captured image at the predetermined position has a cross line + shape, the position of the center of the intersection is recognized. Here, the movement of the XY axis of the main camera 15 and the axis of the XY standard scale 61 are not parallel because of the inclination at the time of placement or the like and do not coincide. A dedicated substrate holder 211 with rotation adjustment is preferable. Although it is difficult to completely match, this can be corrected (including tilted according to the scale of the XY standard scale and converted into a measurement value without rotation) by performing arithmetic processing including rotation. Differences in straightness (linearity, linearity) and orthogonality are recognized and recorded in the main storage unit 111. If this difference is within a predetermined range, the position recognition and moving unit of the main camera is normal.

  If there is a calibration certificate for the XY standard scale 61, calibration data can be created, and calibration processing can be performed to control and correct the control device 11 more appropriately for position recognition of the main camera 15 (XY coordinate system). In accordance with the accuracy specification of the mechanism main body 10 of the apparatus, it is preferable to perform a predetermined treatment (calibration treatment) for straightness and orthogonality. When the apparatus main body 10 is calibrated, the scale of the XY standard scale 61 (calibration data value thereof) and the position recognition of the main camera 15 (XY coordinate system) coincide. Since the XY standard scale 61 (glass) and the mechanism main body 10 (iron-based) have different coefficients of thermal expansion, the recognition length of the main camera changes at room temperature, so it is preferable to define the room temperature for operation of the apparatus.

The alignment jig 40 in step S0B has a configuration in which an alignment camera 41 is fixed to the jig base 33 shown in FIG. The alignment camera 41 has an XY position at the center of the guide plate 36. The focal point is at an objective distance 41 d that is flush with the surface of the guide plate 36. The camera field of view is approximately 2.5 mm square. This is equivalent to the transfer of the main camera 15 to the inspection jig 3.
The positions of the reference mark 22S and the auxiliary camera optical axis 25L of the auxiliary camera 25 are fixed values. Here, the fixed distance Df is also measured.

First, the alignment camera 41 captures a plurality of table position marks 22 and recognizes their positions. Next, the inspection jig moving unit 30 moves the XY axis of the fixed distance Df after moving the difference of the height 25Ph from the opening 251A of the auxiliary camera by + Z axis. Thus, the auxiliary camera optical axis 25L is directly above. The auxiliary camera optical axis 25L which is the center position is recognized by imaging the opening 251A of the circular auxiliary camera having a diameter of 2 mm. This is written into the main storage unit 111. The mechanical fixed distance Df is actually measured.
In this case, the manufacturing error of the mechanical fixed distance Df between the plurality of devices is eliminated. Here, the auxiliary camera opening 251A of the illumination unit 251 of the auxiliary camera 25 is fixed to the transport table 21, and functions as the auxiliary camera position mark 25P. Even if the main body of the auxiliary camera 25 is moved or replaced, the position of the auxiliary camera position mark 25P does not move. When the illumination unit 251 is replaced, the fixed distance Df can be measured again.

  The alignment camera 41 moves relative to recognize a plurality of predetermined positions on the XY standard scale 61. Calculation processing is performed in the same manner as the main camera 15 described above, and the result is recorded in the main storage unit 111. If this difference is within a predetermined range, the position recognition and movement of the alignment camera 41 are normal.

It is also verified whether the difference in position recognition (XY coordinate system) between the previous two cameras is relatively equal. Two XY coordinate systems (main camera 15 recognition system and alignment camera 41) in the mechanism body 10 such as a difference in straightness of the Y axis of the transport table 21 (parallelism (rotation) and orthogonality of the two XY coordinate systems) can be known. The relative difference state of the recognition system) can be recognized. As necessary, the straightness, orthogonality, parallelism (rotation) of the nonconforming part, the design constant value of the mechanism body 10 and the like are corrected so as to match the control coordinates 112. When the correction treatment is performed, it is preferable to perform the steps S0A and S0B again to confirm the conformity of the mechanism body 10 after calibration.
As a result, the mechanism body 10 becomes an XY coordinate system of orthogonal coordinates in which the position recognition of the relative movement of the transport table 21 with respect to the main camera 15 and the alignment camera 41 is equivalent. When viewed from the transfer table 21, the relative movement of the main camera 15 and the alignment camera 41 is equivalent to XY movement. This means that the XY coordinate system of the alignment camera is moved in parallel by two camera intervals (XY) on the control coordinates 112 of the main camera 15.

The transport table 21 has a plurality of position marks, and the reference mark 22S is aligned with the main camera 15 to be the origin 112S of the control coordinates 112. The position recognition of the auxiliary camera 25 viewing the inspection jig 3 from the auxiliary camera optical axis 25L at a fixed distance Df from the reference mark 22S is relatively equivalent to the position recognition of the main camera 15. In other words, recognizing the position of the inspection jig 3 with the auxiliary camera 25 is relatively equivalent to recognizing the position of the inspection jig 3 with the main camera 15. When the relative difference is controlled and corrected by recognizing the position of the main camera 15 on the substrate 2 and the auxiliary camera 25 on the inspection jig 3, the substrate 2 and the inspection jig 3 are aligned.
The state recognition of the mechanism body 10 is preferably performed as a periodic inspection. Accordingly, the change with time of the mechanism body 10 can be improved. In addition, error variation among a plurality of apparatuses is also improved.
In the above steps S0A and S0B, the XY standard scale 61 was used for calibration and correction. Thereafter, a plurality of table position marks 22 fixedly arranged in a two-dimensional manner on the transport table 21 can be automatically performed as time as a step S0A1 or S0B1 body check automatically and appropriately as an XY auxiliary scale. Items for which resetting and correction are appropriate can be corrected.

The set of data relating to the inspection of the substrate 2 to be inspected in step S1 sets data relating to all inspections such as the name of the substrate 2, the electrical inspection standard, the manufacturing number of the inspection jig 3, and data relating to alignment.
The mounting of the corresponding substrate holding part 211 in step S2 uses the substrate holding part 211 corresponding to the board to be inspected 2 in order to place and hold the board 2 to be inspected having a different physical shape at the design position.
The mounting of the corresponding inspection jig 3 in step S3 occurs even after the repair of the inspection jig 3 being lowered at the site, such as a malfunction of the probe 31. Although the inspection jig 3 is mechanically positioned on the inspection jig holding portion 301, there is an error in the reproducibility of the position, and it is necessary to recognize the position of the inspection jig 3 in the next step S4.

The optical position recognition of the inspection jig 3 in step S4 will be described. The present invention is characterized by optically automatically recognizing the position of the inspection jig 3. In step S 0, the manufacturing error of the mechanism body 10 has been improved, and if the position of the inspection jig 3 is known on the control coordinates 112, arithmetic processing for moving the inspection jig 3 to the position of the substrate 2 becomes possible.
First, the main camera 15 recognizes the plurality of table position marks 22 and sets the origin 112S of the control coordinates 112. The point where the center of the optical axis of the main camera 15 is aligned with the position of the reference mark 22S is the origin (0, 0) 112S. When recognizing a plurality of table position marks 22 fixedly arranged in two dimensions (fixed XY positions and values), reproducibility such as orthogonality of the XY coordinate system recognized by the main camera 15 can be confirmed. When stored in the main storage unit 111, changes with time are known. A reasonable correction is also possible.

Next, the pair of jig position marks 3a and 3b are recognized by the auxiliary camera 25 having the auxiliary camera optical axis 25L at a fixed distance Df from the control coordinate origin 112S. Since the positional relationship between the main camera 15 and the auxiliary camera 25 is clear from the origin, it is equivalent to recognizing the jig position marks 3a and 3b by the main camera 15. The position (Xj, Yj, Θj) of the surface of the inspection jig 3 is determined on the control coordinates 112.
However, it is assumed that the pair of jig position marks 3 a and 3 b are at appropriate positions of the inspection jig 3. In other words, the position of the inspection jig 3 is required to be the position of the pair of jig position marks 3a and 3b.

In step S5, the substrate 2 is placed on the substrate holder 211 and an inspection start is instructed.
In step S6, first, the main camera 15 recognizes the position by relatively moving the pair of substrate position marks 2a and 2b directly below the main camera 15 on the transport table 21 or the like. Since the position (Xb, Yb, Θb) of the surface of the substrate 2 is determined on the control coordinate 112, the relative movement amounts (ΔXjb, ΔYjb, ΔΘjb) to be matched are calculated, and the substrate 2 and the inspection jig 3 are moved. Let
However, it is assumed that the pair of substrate position marks 2 a and 2 b are at appropriate positions on the substrate 2. In other words, the position of the substrate 2 is required to be the position of the pair of substrate position marks 2a and 2b.
In step 7, since the substrate 2 is positioned at the alignment position directly below the inspection jig 3, the inspection jig 3 is pressed and brought into contact with the substrate 2. The probe 31 contacts the inspection terminal 201 to perform an electrical inspection.
In step S8, the press is released at the end of the inspection, the transfer table 21 and the like are returned to the mounting position S8 of the substrate 2, and the substrate 2 is taken out.

The apparatus 1 can perform continuous automatic inspection by providing an automatic substrate placement device and a substrate take-out device. (Not shown) Steps 5 to 8 are repeated. Here, it is preferable to automatically recognize the optical position of the inspection jig 3 in step 4 when a predetermined condition such as the number of inspections is satisfied. The state of continuous automatic inspection can take days until there are no uninspected substrates. In order to avoid a continuity inspection failure due to a misalignment, the state of the mechanism main body 10 and the like can be maintained at the start of the continuous automatic inspection.
Thereby, the mutual positional relationship of the mechanism body 10 with time can be recognized. If necessary, the position on the control coordinate 112 can be corrected. Since the main camera 15 recognizes the position of the plurality of table position marks 22, the abnormality of the main camera XY moving system can be known from the difference from the previous position data, and an appropriate apparatus can be operated.
[Embodiment 2]

  A dedicated inspection jig 3 mounted on the apparatus 1 and inspecting the electrical characteristics of the substrate 2 will be described. The inspection jig 3 shown in FIG. 5 is exchangeable by setting the jig base 33 placed on the inspection jig holding portion 301 and held at a mechanical position to a common standard. The jig base 33 has a connector 341 and is connected to the tester 13 via the connector of the inspection jig holding unit 301. The connector 341 of the jig base 33 is connected to the electrode 344 of the electrode plate 343 by wiring 342 or the like. This portion is used as an electrode body 34.

The probe 31 that is in electrical contact with the electrode 344 and the inspection terminal 201 of the substrate 2 has a structure in which one end or both ends expand and contract with an urging force. The plurality of probes 31 stand up against the electrode 344 and the inspection terminal 201. Since a plurality of the substrates 2 face each other, a probe holding plate A351 for holding the probe 31, a probe holding portion 35A of the probe holding plate B352, and a guide hole 361 for slidably guiding the tip 31A of the probe 31 to the inspection terminal 201 are provided. A certain guide plate 36 constitutes the probe holder 35.
In the inspection jig 3, the guide plate 36 is in direct contact with the substrate 2. If the positions of the guide plate 36 and the substrate 2 are known, optical alignment can be performed.

  The guide plate 36 will be described in detail with reference to FIG. The inspection jig 3 is designed by extracting the inspection terminal 201 of the conductor pattern 202 of the substrate surface layer of FIG. 4 from the design data of the substrate 2 and creating hole processing data 364 such as the guide plate 36. Add parts mounting holes and other parts necessary for assembly. In the present application, since the positions of the jig position marks 3 a and 3 b of the inspection jig 3 are the positions of the inspection jig 3, a pair of jig position marks 3 a and 3 b are added to the guide plate 36. Specifically, a pair of jig position mark holes 362 and a later-described length measurement hole 363 are added to the guide plate to form hole processing data 364 of the guide plate 36. Although drilling is performed with an NC drill or the like based on this design data, a manufacturing error (positional variation) similar to that in FIG.

  Therefore, it is confirmed that the hole measurement data JHM1 of the guide plate 36 obtained by measuring the hole group related to the alignment with the digital length measuring device 60 after the hole processing is within a predetermined error. This measurement preferably has a pair of measurement holes 363. The pair of measurement holes 363 are designed and arranged equally on both sides of the X axis from the center of the substrate 2. The middle of the measured value is the center. It becomes easy to place the guide plate 36 on the length measuring machine (XY coordinate system) 60 and set the center (rotation origin 0, 0) and angle (radian). In this case, the length measurement value (XY coordinate) can be calculated to an angle (radian) = 0. Further, the jig position marks 3a and 3b on the guide jig 36 of the inspection jig 3 or the probe holder 35 on which the probe 31 is mounted later can be measured based on the length measurement hole 363 by reflected illumination. . The control device 11 performs an alignment calculation process on the surface of the rotation angle (X, Y, Θ) with the position of the guide plate 36 of the substrate 2 and the inspection jig 3 as the center, and the inspection jig moving unit 30 also supports. The structure of the center of rotation.

Next, the manufacturing error is corrected by performing a simulation (computation matching) of the alignment state of the contact point group 32G including the manufacturing error of the inspection terminal group 201G of the substrate 2 and the probe 31. The method is, for example,
S110: Correction of position data of jig position mark A. A method of minimizing an error (deviation amount) from the design value is the following procedure from S111 to S114.
S111: The inspection point data TCL1 for the design of the inspection terminal group 201G of the substrate 2 is created.
S112: The data PCM1 of the probe contact point group 32G is created. The contact point 32 is set to a position PCM1 having a high probability of occurrence from the measured center JHM1 of the guide hole 361. For example, the center of the guide hole 361 is used.
In S113 • CAD, etc., PCM1 is added to the rotation and movement of TCL1, and the operation is matched. Corresponding point group difference value (ΔnX, ΔnY, or ΔnD diagonal) shift amount is minimized.
The minimum state of S114 and S113 is an appropriate position of the manufactured inspection jig 3. In this state, the position JMDA of the jig position mark hole 362 of the PCM 1 is acquired.

In S113, the matching is described by CAD or the like, but for example, calculation processing can be easily performed on spreadsheet software. The surface of PCM1 is rotated and moved in the X and Y directions so that the difference between each point (nXt, nYt) of TCL1 and each point (nXp, nYp) of PCM1 is minimized.
Specifically, the rotation converts the XY coordinate display (X, Y) of each point into a polar coordinate display (radius and radians from the center), and adds the rotation (radians) of the movement instruction value. Then, the original XY coordinates are restored. In the X and Y directions, the movement instruction value is added to each point. The maximum difference value is stored for each movement instruction value. The state in which all stored maximum values are minimum is the proper PCM1 surface position in S113. If similar dedicated software is prepared, the work is easy.

The inspection terminal 201 has a large and small area. Small terminals are difficult to contact, and large terminals are easy to contact.
S120: Correction of position data of jig position mark B. The following steps S121 to S124 are performed to maximize the margin until the contact point 32 is removed from the inspection terminal 201. The operation is verified in advance by a method similar to the electric exploration described later.
S121: Design range data TPL1 of the inspection terminal group 201G of the substrate 2 is created. When the inspection terminal is rectangular, nTPL1 = nTCL1 (+ nPX, −nPX, + nPY, −nPY)
S122 = S112. The data PCM1 of the contact point group 32G of the probe 31 is created.
In S123 / CAD or the like, the PCM1 is added to the TPL1 by adding rotation and movement to match the calculation. The minimum value of the margin values (+ nPCX, −nCPCX, + nCPCY, −nCPCY) of the corresponding point group is maximized. (+ NPCX = + nPX + ΔnX, and so on)
In the case where the inspection terminal is circular, the margin amount = the radius of the n terminal (nR / 2) −ΔnD deviation amounts S124 and S123 has the maximum margin, which is the appropriate position of the manufactured inspection jig 3. The position JMDB of the jig position mark hole 362 of the PCM 1 in this state is acquired.

  From the above, as the position data of the jig position marks 3a and 3b, three kinds of design jig position data JMD at the time of designing the inspection jig and correction jig position data JMDA and JMDB of the manufactured inspection jig are created. The The difference between the design jig position data JMD and the correction jig position data JMDA indicates the manufacturing accuracy of the inspection jig 3, and the difference with the correction jig position data JMDB indicates the margin of alignment during use. Thus, the performance when the inspection jig 3 is used can be evaluated before shipment. It is also useful for verifying the feasibility of electrical inspection by feeding back to the design process of the substrate 2 and the inspection jig 3.

The jig position marks 3a and 3b will be described. The positions of the pair of jig position marks 3a and 3b may be located on any of the guide plates 36 by design, but are arranged symmetrically on the central X axis as shown in FIG. The position recognition of the inspection jig 3 is convenient in terms of the mechanism of relative movement of the auxiliary camera 25 by uniaxial movement of the X axis, and the position recognition error is also improved. It would be preferable to be close to one axis. The measurement hole 363 is the same.
The cylindrical jig position marks 3 a and 3 b such as a metal that reflects light are press-fitted into the jig position mark hole 362 and fixed. The position of the contact point group 32G of the probe 31 is fixed to the guide hole group 361G and the expansion / contraction movement (XYZ) of the probe 31 can be limited to the clearance range of the difference in diameter between the guide hole 361 and the probe tip 31A.

  It has been described above that the position of the jig position mark hole 362 is measured after drilling the guide plate 36. There is no guarantee that there is no difference in the optical recognition position between the jig position mark hole 362 (transmission illumination imaging) and the jig position marks 3a and 3b (reflection illumination imaging) to which a cylindrical metal or the like is fixed. Therefore, it is preferable to measure the jig position marks 3a and 3b from the surface with reference to the pair of measurement holes 363. In that case, if there is a difference from the previously measured hole measurement data JHM1, JMDA1 and JMDB1 to which the difference is added are created. Thus, the recognition positions of the jig position marks 3a and 3b of the auxiliary camera 25 become more appropriate optical positions of the inspection jig 3 (= contact point group 32G). In this way, the pair of jig position marks 3 a and 3 b is improved to meet the requirement that the inspection jig 3 is at an appropriate position.

  FIG. 8A shows an image in which the auxiliary camera 25 images the jig position marks 3a and 3b. Circular jig position marks 3a, 3b are inside. The outer circle is an auxiliary camera position mark 25P of the auxiliary camera opening 251A. The center is the auxiliary camera optical axis 25L. The outer quadrilateral is the auxiliary camera field of view 25S. Depending on the magnitude of the reflected light (reflectance, whiteness), the positions of the jig position marks 3a, 3b can be recognized from the auxiliary camera optical axis 25L. FIG. 8B is an image obtained by imaging the circular jig position mark hole 362. Regarding the whiteness of the reflected light, the jig position mark hole 362 has low whiteness, the surface of the guide plate 36 has medium whiteness, and the outside of the auxiliary camera position mark 25P has high whiteness. The image processing unit 14 has, for example, a multi-value conversion function and recognizes the position of the jig position mark hole 362.

If the jig position marks 3a and 3b are the jig position mark holes 362 of the holes, they can be used as a pair of length measurement holes 363 (length measurement marks).
In the above description, the binarization (black and white) determination level of the image is matched to one as usual,
For example, a cylindrical metal is coaxially press-fitted into the jig position mark hole 362 to increase the reflectivity, and the jig position marks 3a and 3b in which the image becomes highly white are created, but this is not necessary. Also, the correction jig position marks JMDA1 and JMDB1 can be eliminated. The inspection jig 3 can be easily designed and manufactured.

Further, since all the holes of the guide plate 36 are fixed positions, the guide holes 361 may be adopted. However, the probe tip is also imaged inside the guide hole 361 and the image of the probe tip shape is uncertain. However, it is possible to use dedicated software (algorithm) for recognizing the center position of the guide hole 361. Position recognition.
Accordingly, the position marks of the jig, length measurement, substrate, auxiliary camera, resist, etc., need only have a shape that is fixed to the subject including the concave portion of the surface such as the hole of the guide plate 36 and the position can be recognized from the shade of the camera image. It will be. Color identification may be used. When there is no need for automatic camera position recognition, the operator may specify the position on the monitor of the operation panel 12.
[Embodiment 3]

  As shown in FIG. 4, the surface pattern 202 of the substrate 2 is provided with a resist mask 203 of a surface protective film. In some cases, the resist mask 203 is displaced from the surface pattern 202 in the substrate manufacturing process. If the resist opening 201r having the same shape is shifted and overlapped with the inspection terminal 201, the center position of the inspection terminal 201 is moved from the contact point 32 of the probe 31.

  In step 6 described above, the main camera 15 recognizes the substrate position marks 2 a and 2 b of the substrate 2. In general, the substrate position marks 2a and 2b are often formed with a single-island conductor pattern (fiducial mark) having no resist mask 203 in the periphery, so that a resist opening portion of the inspection terminal 201 of the resist mask 203 is formed. A registration error at 201r is not detected. In the present application, a pair of resist mask openings 201r are registered as resist position marks 2ar and 2br, position recognition is performed for each predetermined number of substrates, and substrate positions from the substrate position marks 2a and 2b and the resist position marks 2ar and 2br are detected. It is confirmed that the difference is within a predetermined error.

For example, when the error amount of the resist deviation exceeds a predetermined value, the resist mask opening 201r is adopted as the substrate position. If it exceeds half of the predetermined value, the average of the substrate position PM (Xm, Ym, Θm) of the substrate position marks 2a, 2b and the resist position PR (Xr, Yr, Θr) of the resist position marks 2ar, 2br is adopted. . If it exceeds twice the predetermined value, it is determined that the substrate has a resist displacement defect.
The resist displacement moves the actual proper position of the contact point 32 of the probe 31 at the time of electrical inspection. Alternatively, there is a problem of reducing the contact area, and the resist displacement amount is reflected in the position recognition of the substrate 2. This improves the requirement that the pair of substrate position marks 2a, 2b of the substrate 2 before the electrical inspection is in an appropriate position for contact with the probe 31. Further, when the error of the registration error exceeds a predetermined value, it can be determined that the registration error of the substrate is defective.
In addition, in the optical position recognition of the resist opening 201r and the like, it is preferable for the automatic recognition of the position mark that the image processing unit 14 has the above-mentioned software such as the multi-value conversion function and the color identification function.
[Embodiment 4]

The position confirmation when mounting the inspection jig 3 manufactured in the new period will be described. As the position data of the jig position marks 3a and 3b, it is preferable to employ the position data in the order of JMDB1 or JMDB from the above margin, JMDA1 or JMDA from the difference from the design, and JMD from the design.
An electrical inspection is performed after the optical alignment of the substrate 2 to confirm the PASS. Then, from the optical position Jp (Xp, Yp, Θp), the periphery (electricity energization) is searched to confirm that it is at the center of the PASS range. Specifically, the inspection jig 3 is inspected by rotating the Θ axis in the positive and negative directions to be the center of the PASS range. The X axis is then moved in the positive and negative directions and inspected to center the PASS range. The Y axis is moved in the positive and negative directions and inspected to center the PASS range. Thus, the electrical position Je (Xe, Ye, Θe) appropriate for the electrical inspection is obtained.

The difference data ΔJpe (Xe−Xp, Ye−Yp, Θe−Θp) between the optical position Jp and the electrical position Je of the inspection jig 3 is registered as the characteristic value of the inspection jig 3 in the main storage unit 111 or other storage means. To do. Since the optical position Jp varies depending on each substrate 2, addition of difference data ΔJpe can cope with the variation of the substrate 2.
The inspection jig 3 is preferably equipped with a storage means 39 that can read and write data by the control device 11 as one of the other storage means. Even when the inspection jig 3 is mounted on another apparatus, the electrical position Jp can be reproduced by adding the original written difference data ΔJpe to the optical position Jp. It is preferable that the position data of the jig position mark is also written in the storage means 39 in the same manner.
However, the position of the electrical contact point group 32GE is inevitably caused by a slight movement variation for each press due to the clear lath between the probe tip 31A and the guide hole 36. Although the statistical center can be obtained from a plurality of difference data samples, one difference data is adopted here.
The actual substrate inspection apparatus 1, inspection jig 3, and substrate 2 have small manufacturing errors from design values. And since each is improved, when the combination changes, it can respond to the change of the position of the alignment suitable for an electric test | inspection.
[Other embodiments]

The transfer direction of one transfer table 21 according to the first embodiment may be changed from the Y axis to the X axis direction according to the type of the transfer table 21. Although X and Y change, there is no problem in the alignment control calculation.
Two transport tables 21 may be provided. The recognition of the position of the substrate 2 of the main camera 15 and the electrical inspection are performed in parallel, and the time for continuous automatic inspection is reduced to about half. In this case, for example, when the transport directions are two independent XY axes, when the main camera 15 is fixed to the mechanism body 10, the movement trajectories (characteristics) of the two independent transport tables 21a and 21b are minute. Will be different. The two control coordinates 112a and 112b are preferably set according to the accuracy of the alignment error. Correction and calibration can be performed in the same manner as in step S0 in accordance with each movement characteristic.

  The substrate 2 shown in FIG. 10 may be transported as one rotary table 21R. For example, there is a substrate holding part 211 at four stop positions every 90 degrees, and the parallel operation of placing S5, position recognition S6, electrical inspection S7, and taking out S8 of the substrate 2 is performed, thereby reducing the time for continuous automatic inspection. Is also preferable.

In the first embodiment (FIG. 1), the XY relative movement of the main camera 15 is constituted by the X axis of the inspection jig moving unit 30 and the Y axis of the table moving unit 20 of the transfer table 21, but in the rotary table 21R, The main camera 15 is fixedly installed on an independent XY moving unit 15XY. Since the control coordinates 112 of the control device 11 are established, the alignment control calculation can be performed.
For example, in the one rotary table 21R such as 90 degrees described above, an XY moving system having the tangential direction as the X axis can be provided if the division angle is controlled to be equal or even. The distance of the Y axis of the table moving unit 20 of the first embodiment is the rotation angle of the rotary table (radian * radius = circumference distance).

Since the reference camera 22S fixed to the turntable 21R and the auxiliary camera 25 at a fixed angle are stopped at the inspection position S4, the inspection jig 3 is relatively moved independently by the inspection jig moving portion 30XY, and thus assists in the same manner. The camera 25 is an XY moving system having the tangential direction as the X axis.
XY movement for independent position recognition between the main camera 15 and the alignment camera 41 on the alignment jig 40 can be corrected and calibrated in step S0. In addition, the same relative movement can be ensured. This is because the XY moving unit 15XY of the independent main camera 15 and the XY moving unit (inspection jig moving unit 30XY) of the auxiliary camera 25 (stopped at the inspection position S7) are at a fixed angle of 90 degrees, and the control coordinates 112 The substrate 2 and the inspection jig 3 can be optically aligned.
However, it is a requirement that the accuracy (reproducibility) of the angle and stop position of the rotary table 21R is ensured. In this case as well, proper arrangement of the plurality of table position marks 22 is preferable for recognizing the reproducibility of the table stop position and the relative movement of the inspection jig 3. If there is reproducibility, it can be corrected on the control coordinates. In addition, the control coordinates 112a, 112b, 112c, and 112d can be set for each of the four substrate holders 211. A correction constant may be added to each. You may add table position mark 22a, 22b, 22c, 22d etc. for every board | substrate holding | maintenance part 211. FIG.

The main camera 15 can be configured to control and move also the Z axis. The auxiliary camera position mark 25P can be recognized by both the main camera 15 and the alignment camera 41. In the present application, the configuration using the Z axis of the inspection jig moving unit 30 does not increase the moving unit, and employs the Z axis of the same movement locus as the recognition of the jig position marks 3a and 3b.
Recognizing the auxiliary camera position mark 25P with the main camera 15 or the alignment camera 41 means recognizing the coaxial position with the auxiliary camera optical axis 25L.
Similarly, the configuration of the plurality of moving units of the mechanism body 10 can be changed to various machine configurations if the control coordinates 112 are established in the control device 11.

  The moving unit of the device 10 is driven by rotating a ball screw mainly by a motor, but may be a linear system or the like. In any case, the amount of movement varies slightly depending on the temperature with respect to the instruction value for movement. This is the same with a solid scale length measuring device even if a linear scale (length measuring device) or the like is mounted on the moving unit. If equipped with a laser length measuring device, it is improved, but this device 10 does not employ it.

  In the present apparatus 10, the mutual difference depending on the temperature is distributed from the center based on the center of the substrate 2 and the guide plate 36 of the inspection jig 3. In addition, the mechanism body 10 makes the XY coordinate system of the main camera and the XY coordinate systems of the alignment camera and auxiliary camera relatively equivalent (parallel movement), so that the temperature of the board recognition position S6 and the electrical inspection position S7 of the mechanism body 10 can be adjusted. This mutual movement is improved by optically automatically recognizing the transfer table 21 and the inspection jig 3 and reflecting them on the control coordinates 112. Further, each moving part is corrected based on a plurality of table position marks 22 at fixed positions (thermally expanded at the temperature at that time).

  The measured values measured with different materials are used for the mechanism main body 10, the inspection jig 3, and the substrate 2 related to the alignment of the substrate inspection apparatus 1. The mechanism body 10 is preferably equipped with a digital temperature / humidity meter and can be connected to or communicated with the control device 11. If there is regularity in the mutual difference depending on temperature, it can be improved. This apparatus records date and position recognition data under predetermined conditions such as operation steps S0 and S4. By adding the date and time, temperature, and humidity to the state of the mechanism body 10 and analyzing these recorded data groups, the regularity of the mutual difference depending on the temperature can be reflected in the control of the mechanism body 10.

As the position mark recognized by the camera, an independent circular island or hole is generally used, but any shape that can be image-processed for position recognition such as a polygon such as a quadrangle or a cross + shape may be used. As for illumination, an appropriate one of reflection or transmission can be adopted.
Although the auxiliary camera position mark 25P is a circular auxiliary camera opening 251A having a diameter of 2 mm, it may be a transparent glass crosshair. In this case, restrictions on the field of view and magnification of the auxiliary camera 25 are improved.
The position marks are not limited to a pair, and may be two or more such as two pairs.

In the second embodiment, the contact point group 32G and the like of the inspection jig 3 are set from the measured values of the holes of the guide plate 36, but this is related to the alignment of the tip group and the like of the probe 31 mounted on the inspection jig 3. The position may be set by directly measuring with the digital length measuring device 60. The positional relationship between the contact point group 32G and the jig position marks 3a and 3b is known.
A pair of length measurement holes 363 for determining the origin for measuring the hole group of the manufactured guide plate 36 is added on the X axis, but the guide holes 363 may be substituted. However, it is not easy to determine the substitute guide hole 363 from the guide hole group 363G in which a large number are dense, and it is preferable to add the substitute guide hole 363 to a position useful for length measurement.

The tip group may be a dent group in which a dent acquisition plate having a pressure-sensitive paper dent sheet attached to the inspection jig 3 is pressed.
Further, by using the unevenness on the surface of the guide plate 36, if the partial dent sheet is only the peripheral part of each of the jig position marks 3a and 3b in the hole, the dent sheet has a thickness and has a pressure contact force. It can be concentrated and acquired simultaneously with the mark of the pressure contact mark of the hole and the peripheral dent group. The position data of the contact point group 32G and the jig position marks 3a and 3b may be created from these two measured values. The dent corresponds to the pressure contact mark of the pressure sensitive sheet. The pressure sensitive sheet has pressure sensitivity, and the area to be applied varies depending on the pressure sensitivity and the press pressure. Those for low pressure that are highly sensitive to pressure are preferred. There are various types such as a transfer type.

  When the inspection jig 3 is mounted on the substrate inspection apparatus 1, a pressure-sensitive acquisition plate partially bonded with a pressure-sensitive sheet is fixed to the substrate holder 211 and pressed, and then the pressure contact traces of the hole jig position marks 3a and 3b The position of the pressure sensitive position marks 3at and 3bt (described later and shown in FIG. 9) can be recognized by the main camera 15. The surface position (XYΘ) of the inspection jig 3 is also known. The use of the pressure sensitive position marks 3at and 3bt in the pressure contact sheet of the pressure sensitive sheet is preferable as a means for confirming (demonstrating) the relative recognition of the positions of the auxiliary camera 25 and the main camera 15. In the case of inequality, steps S0A1, 0B1 or S0A, S0B are executed, and the cause can be corrected or calibrated from the difference analysis with the previous recording, and the equivalent can be recovered. Further, when there is no matching camera 41, non-identical data (XYΘ) is converted into mechanism main body constant Δp (XYΘR) of difference data between two optical positions, center X, Y position, rotation, orthogonality (of auxiliary camera 25) Relative movement coefficient). If the plurality of jig position marks are two-dimensional with three or more points, the orthogonality difference is also known. Δp1, Δp2,... Δpn may be similarly set in the plurality of substrate holding portions 211 as necessary. In any case, the equivalent (relative movement) can be maintained and recovered.

Further, even if the same alignment confirmation jig 45 for confirmation is used in which the inspection jig 3 is fixed to the guide plate 36 and the convex jig position marks 3a, 3b,. good. The position can be recognized by the main camera 15 using the pressure-sensitive acquisition plate. Equivalent (XYΘR) or difference from the auxiliary camera 25 can be recognized.
Images obtained by the main camera 15 picking up the pressure-sensitive position marks 3at and 3bt on the pressure-sensitive acquisition plate are intensely dark as shown in FIG. 9A at the convex jig position marks 3a and 3b, and guide the non-pressure-contact portion. The plate 36 has a low dark color (no color development). In the concave jig position marks 3a and 3b, the pressure contact of the surface of the guide plate 36 shown in FIG. 9B is a moderate color (medium density color). Accordingly, even if the alignment camera 41 is not provided, the mechanism body constant Δp (XYΘR) of the difference data between the two optical positions may be set for each of the plurality of substrate holding portions 211n.
However, the pressure-sensitive acquisition plate may be fixed to the substrate holding unit 211 in the case of a plurality of substrate holding units 211 and a multi-sided substrate (inspection press for each surface of the inspection jig). It is preferable to avoid as much as possible because it can be a considerable work in properties.
In this application, the origin setting of the main camera 15 (step S0A1) and the auxiliary camera 25 automatically recognize the jig position marks 3a and 3b (step S4) directly at a predetermined timing of operation of the apparatus including every time the inspection jig 3 is mounted. doing. The position of the inspection jig 3 on at least the control coordinates can be known.

  The plurality of table position marks 22 may be a pair of fixed table position marks 22, for example. Since it can be recognized as a surface from the XY coordinates recognized by the main camera 15, it can be recognized if there is a change over time. However, in the present application, the reference mark 22S is set as the origin, and the position mark is also arranged in the X-axis and Y-axis directions, so that the arrangement is preferable for the arithmetic processing for analyzing the state of the surface change (XYΘR).

  For example, tm4≈2 * ts of (0, −tm4) may be added to the arrangement of (0, + tm3) in FIG. The position of the entire surface of the transfer table 21 can be recognized. (+ Tm1, -tm4), (-tm2, -tm4) may be added to this. This arrangement functions as an XY auxiliary scale fixed to the transport table 21 with respect to the XY coordinate system recognized by the main camera 15, and is preferable for recognizing the reproducibility of the relative movement.

Regarding the reproducibility of the relative movement system of the inspection jig 3, it is understood that the alignment jig 40 with the alignment camera 41 described above is mounted in time and position marks such as a plurality of table position marks 22 are recognized. The relative relationship between the main camera 15 and the XY coordinate system recognized by the alignment camera 41 or the auxiliary camera 25 can be understood and corrected. Thus, the position recognition of the main camera 15 and the auxiliary camera 25 can be made equal over time.
In addition, the alignment camera 41 may be fixed to the inspection jig holder 301. There is no work for mounting and removing the alignment jig 40, and position recognition can be performed even if the inspection jig 3 is present. This is possible even during continuous automatic inspection. The arrangement of the alignment camera 41 can be selected according to the configuration and characteristics of the mechanism body 10. There is also an arrangement in both.

  The Z-axis height 25Ph of the auxiliary camera position mark 25P may be the same as the table position mark 22 and the substrate position marks 2a and 2b. It can be recognized by both the main camera 15 and the matching camera 41. However, in the present application, as shown in FIGS. 1, 2, and 3, due to the problem of physical interference between a projection (not shown) on the conveyance table 21 and the guide plate 36 of the inspection jig 3 when the jig position marks 3 a and 3 b are imaged. Protruding.

In the main body configuration shown in FIG. 1, the inspection jig 3 and the alignment camera 25 are indirectly connected to the main camera 15 to perform an approximate relative movement, and there are few errors compared to other main body configurations. Are different from each other, the mechanical characteristics of the mechanism body 10 and the room temperature may be present, but errors and changes over time may become a problem.
In the optical alignment of various substrate inspection apparatuses having different transfer tables, inspection jigs, moving axis configurations, arrangements of each arrangement, etc., as shown in other embodiments, the main camera 15, The configuration of the alignment camera 41, the auxiliary camera 25, and the plurality of position marks on the table 21 can appropriately cope with changes with time.
If the position recognition of the plurality of table position marks 22 of the main camera 15 is within the range of automatic resetting and correction, the main camera 15 and the inspection jig 3 or the alignment camera 41 are arranged on the table 21. The same relative movement between the position mark and the auxiliary camera 25 is realized by automatic correction. And even if the board | substrate test | inspection apparatus 1 mounted in one test | inspection jig | tool 3 changes, the difference with the electrical position from an appropriate optical position will not change.

  The foregoing descriptions of specific embodiments of the present invention have been presented for purposes of illustration. Although described before and after, they are not intended to be exhaustive or to limit the invention to the precise form described. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above description.

  The board inspection apparatus and the inspection jig of the present invention can be used for an energization jig and an energization apparatus for bringing a probe into conductive contact simultaneously with a plurality of inspection terminals provided in electronic components such as a printed wiring board, an IC package, and an IC. it can.

  1. Board inspection device 10. Mechanism body, device 11. Control device 112. Control coordinate 112S. Control coordinate origin 15. Main camera 21. Transfer table, table 22. Table position mark 22S. Reference mark 25. Auxiliary camera 25L. Auxiliary camera optical axis 251A, 25P, auxiliary camera opening, auxiliary camera position mark 2, substrate 2a, 2b, substrate position mark 201, inspection terminal, pattern, inspection point 201r, resist mask opening 2ar, 2br, resist position mark 30・ Inspection jig moving part 3 ・ Inspection jig 3a, 3b ・ Jig position mark 3at, 3bt ・ Pressure sensitive position mark 31 ・ Probe, contact 32 ・ Contact point 36 ・ Guide plate 361 ・ Guide hole 362 ・ Jig position Mark hole, jig position mark, length measurement mark 363 ・ Length measuring hole, length measuring mark 39 ・ Storage means 40 ・ Alignment jig 41 ・ Alignment camera 60 ・ Length measuring device, digital length measuring device 61 ・ XY standard scale

Claims (23)

In a substrate inspection apparatus for inspecting electrical characteristics of a substrate having a plurality of inspection terminals wired with an electric circuit and a plurality of substrate position marks,
A replaceable inspection jig that is mounted on the substrate inspection apparatus and abuts a probe on the inspection terminal;
An inspection jig moving unit for holding and moving the inspection jig on the inspection jig holding unit;
A transport table having a plurality of table position marks for holding and transporting the substrate to a substrate holder;
A main camera that moves relative to the transfer table and recognizes a plurality of position marks on the transfer table including the plurality of substrate position marks and the plurality of table position marks;
The inspection jig includes a guide plate having a guide hole for guiding the tip of the probe to the inspection terminal and a plurality of jig position marks,
The transfer table has an auxiliary camera that moves relative to the inspection jig and recognizes the plurality of jig position marks,
The substrate inspection apparatus includes:
In the optical alignment for aligning the substrate and the inspection jig, the position of the origin of the control coordinates that are orthogonal coordinates and the direction of the coordinate axes are determined based on the plurality of table position marks recognized by the main camera, A control device for controlling the relative movement of the inspection jig and the transfer table;
The control device recognizes the position of the substrate on the control coordinates from the plurality of substrate position marks recognized by the main camera, and determines the inspection jig from the plurality of jig position marks recognized by the auxiliary camera. A substrate inspection apparatus for aligning the substrate and the inspection jig by recognizing a position on the control coordinates.   The substrate inspection apparatus according to claim 1, wherein there are three or more table position marks, two or more near one axis of the control coordinates, and one or more apart. Compensate (calibrate or correct) the movement axis on the control coordinates
An alignment camera for recognizing the plurality of position marks on the transfer table is attached to the inspection jig holding unit,
The control device includes:
Based on the plurality of table position marks recognized by the main camera and the alignment camera, movement of the transfer table in the X direction or Y direction, and X direction of the inspection jig holding unit by the inspection jig moving unit or Recognizing the deviation of the control coordinate in the Y direction from the X axis and the Y axis, based on the recognized deviation, the movement of the transfer table in the X direction or the Y direction, and the inspection jig moving unit The substrate inspection apparatus according to claim 1, wherein the control of the movement in the X direction or the Y direction of the inspection jig holding unit is corrected.   An XY standard scale having calibration data is held on the substrate holding unit, and the control coordinates are calibrated by the main camera or the alignment camera recognizing a plurality of predetermined positions on the XY standard scale. The board inspection apparatus according to claim 3. In the auxiliary camera, there is an auxiliary camera position mark that indicates the optical axis position fixed to the transfer table,
The substrate inspection apparatus according to claim 3, wherein the control device recognizes the position of the auxiliary camera on the control coordinates based on the auxiliary camera position mark recognized by the main camera or the alignment camera. The control device, for each predetermined condition,
Based on the plurality of table position marks recognized by the main camera or the alignment camera, the movement of the transfer table in the X direction or Y direction and the X direction of the inspection jig holding unit by the inspection jig moving unit or Recognizing the deviation of the control coordinate in the Y direction from the X axis and the Y axis, based on the recognized deviation, the movement of the transfer table in the X direction or the Y direction, and the inspection jig moving unit Correct the control of the movement of the inspection jig holder in the X or Y direction,
The substrate inspection apparatus according to claim 3, wherein the position of the inspection jig is recognized on the control coordinates based on the plurality of jig position marks recognized by the auxiliary camera.   The control device recognizes the main camera from a plurality of resist position marks selected from a plurality of openings on the resist mask on the substrate surface, and from the plurality of substrate position marks, the position of the resist mask from the inspection terminal The substrate inspection apparatus according to claim 1, wherein a displacement is recognized and the displacement is reflected in the recognition of the position of the substrate. The control device has a storage unit;
The control device recognizes a difference between an optical position optically aligned with respect to the inspection jig and an electric position suitable for an electric inspection, and stores data representing the recognized difference with each inspection jig. One-to-one correspondence is stored in the storage unit, and data representing the difference associated with the inspection jig held in the inspection jig holding unit is read from the storage unit, and the read difference is represented. The substrate inspection apparatus according to claim 1, wherein alignment is performed based on data. The inspection jig has a storage unit,
The control device recognizes a difference between an optical position optically aligned and an electrical position suitable for electrical inspection for the inspection jig, and displays data representing the recognized difference as an inspection treatment that recognizes the difference. The data representing the difference is read from the storage unit stored in the storage unit of the tool and held by the inspection jig held by the inspection jig holding unit, and alignment is performed based on the read data representing the difference. The substrate inspection apparatus according to claim 1, wherein: A preparation step of preparing the substrate inspection apparatus according to claim 1;
The main camera moving relative to the transport table to recognize a plurality of position marks on the transport table including the plurality of substrate position marks and the plurality of table position marks;
The control device determines the position of the origin of the control coordinate and the direction of the coordinate axis that are orthogonal coordinates based on the plurality of table position marks recognized by the main camera;
The auxiliary camera moves relative to the inspection jig mounted on the inspection jig holding part and recognizes the plurality of jig position marks;
Placing the substrate on the substrate holder;
The main camera moving relative to the transfer table and recognizing the plurality of substrate position marks of the mounted substrate;
The control device recognizes the position of the substrate on the control coordinates from the plurality of substrate position marks recognized by the main camera, and determines the inspection jig from the plurality of jig position marks recognized by the auxiliary camera. An alignment step of aligning the substrate and the inspection jig by recognizing a position on the control coordinates;
And a step of performing electrical inspection by bringing the substrate and the inspection jig into contact with each other after the alignment step. It is a board | substrate inspection method of Claim 10, Comprising:
In the preparation step, as the substrate inspection device, a substrate inspection device in which an alignment camera for recognizing the plurality of position marks on the transfer table is attached to the inspection jig holding unit,
The substrate inspection method includes:
A mark recognition step in which the main camera and the alignment camera move relative to the transfer table to recognize the plurality of table position marks;
Based on the plurality of table position marks recognized in the mark recognition step, the control device moves the transfer table in the X direction or the Y direction, and the inspection jig holding unit by the inspection jig moving unit. A displacement recognition step of recognizing a displacement of the control coordinate in the X direction or the Y direction from the X axis and the Y axis;
Based on the deviation recognized in the deviation recognition step by the control device, the movement of the transfer table in the X direction or the Y direction, and the inspection jig holding part by the inspection jig moving part in the X direction or the Y direction And a correction step of correcting control of movement of the substrate. Holding the XY standard scale with calibration data in the substrate holder;
The main camera or the alignment camera is moved relative to the transfer table to recognize a plurality of predetermined positions on the XY standard scale;
The substrate inspection method according to claim 11, further comprising a step of calibrating the control coordinates based on the plurality of recognized predetermined positions. The substrate inspection method according to claim 11 or 12,
In the preparation step, as the substrate inspection device, a substrate inspection device having an auxiliary camera position mark indicating the optical axis position fixed to the transfer table is prepared in the auxiliary camera,
The substrate inspection method includes:
The main camera or the alignment camera moving relative to the transfer table to recognize the auxiliary camera position mark;
And a step of recognizing the position of the auxiliary camera on the control coordinates by the auxiliary camera position mark recognized by the main camera or the alignment camera. A substrate inspection method according to any one of claims 11 to 13,
Another mark recognition step in which the main camera or the alignment camera moves relative to the transfer table for each predetermined condition to recognize the plurality of table position marks;
Based on the plurality of table position marks recognized in the separate mark recognition step, the control device moves the transport table in the X direction or the Y direction, and holds the inspection jig by the inspection jig moving unit. Another shift recognition step for recognizing a shift from the X-axis and the Y-axis of the control coordinates of the movement of the portion in the X direction or the Y direction;
Based on the deviation recognized by the another deviation recognition step, the control device moves the transfer table in the X direction or the Y direction, and the inspection jig holding part by the inspection jig moving part in the X direction or Correcting the movement control in the Y direction;
A jig position mark recognition step for recognizing the plurality of jig position marks by moving the auxiliary camera relative to the inspection jig for each predetermined condition;
And a step of recognizing the position of the inspection jig on the control coordinates based on the plurality of jig position marks recognized in the jig position mark recognition step. . The main camera moves relative to the transfer table and recognizes a plurality of resist position marks in the plurality of openings of the resist mask on the substrate surface together with the plurality of substrate position marks;
The control device recognizes a positional deviation from the inspection terminal of the resist mask from the recognized plurality of resist position marks and the plurality of substrate position marks, and uses the positional deviation to recognize the position of the substrate. The substrate inspection method according to claim 10, further comprising a step of reflecting. A substrate inspection method according to any one of claims 10 to 15,
In the preparation step, as the substrate inspection device, the control device prepares a substrate inspection device having a storage unit,
The substrate inspection method includes:
Recognizing the difference between the optical position optically aligned for the inspection jig and the electrical position suitable for electrical inspection;
Storing the data representing the recognized difference in the storage unit in a one-to-one relationship with each of the inspection jigs;
The control device further includes reading from the storage unit data representing the difference associated with the inspection jig held in the inspection jig holding unit;
The alignment step includes
The board | substrate inspection method including the process in which the said control apparatus aligns the said board | substrate and the said inspection jig based on the data showing the read said difference. A substrate inspection method according to any one of claims 10 to 15,
In the preparation step, as the substrate inspection device, the inspection jig prepares a substrate inspection device having a storage unit,
The substrate inspection method includes:
Recognizing the difference between the optical position optically aligned for the inspection jig and the electrical position suitable for electrical inspection;
Storing the data representing the recognized difference in the storage unit of the inspection jig that has recognized the difference;
The control device further includes a step of reading data representing the difference from the storage unit included in the inspection jig held by the inspection jig holding unit,
The alignment step includes
The board | substrate inspection method including the process in which the said control apparatus aligns the said board | substrate and the said inspection jig based on the data showing the read said difference. A substrate inspection method according to any one of claims 10 to 17,
A table position mark recognition step for recognizing the plurality of table position marks by moving relative to the transport table for each predetermined condition during the continuous automatic inspection of the main camera,
The control device checks the difference from the start of the continuous automatic inspection of the plurality of table position marks recognized in the table position mark recognition step, and resets the origin of the control coordinates and the direction of the coordinate axes When,
The auxiliary camera further includes a step of recognizing the plurality of jig position marks for each predetermined condition during the continuous automatic inspection. A method for verifying optical position recognition of a substrate inspection apparatus according to claim 1 or 2,
The auxiliary camera moves relative to the inspection jig and recognizes the plurality of jig position marks on the control coordinates;
A pressure-sensitive acquisition plate having a pressure-sensitive sheet attached to a portion facing the plurality of jig position marks is fixed to the substrate holding portion, moved relative to the inspection position, and after pressing on the inspection jig, the substrate recognition position A relative displacement process, and
The main camera moves relative to the transfer table, and recognizes a plurality of pressure-sensitive position marks of the pressure contact marks of the plurality of jig position marks on the control coordinates;
Verifying that the positions of a plurality of pairs of position marks corresponding to the recognition of the auxiliary camera and the main camera are the same relative movement from the inspection position to the substrate recognition position on the control coordinates. And a method for verifying optical position recognition of a substrate inspection apparatus. An inspection jig mounted on a substrate inspection apparatus that inspects the electrical characteristics of a substrate having a plurality of inspection terminals wired with an electric circuit,
An inspection jig body and a recording medium on which data is recorded,
The inspection jig body is
A jig base held in the inspection jig holding part of the substrate inspection apparatus;
A plurality of probes in contact with the inspection terminals;
A probe holding unit for holding the plurality of probes;
A guide plate having a plurality of guide holes for guiding the tips of the plurality of probes to the inspection terminals,
The guide plate has a plurality of jig position marks that can be optically recognized,
The data of the recording medium is
Position data on design of the plurality of jig position marks;
And position data after correction of the plurality of jig position marks,
The corrected position data is a plurality of the inspection points set on the substrate and the plurality of inspection terminals set from the measurement positions of the plurality of guide holes or the tip groups of the plurality of probes. An inspection jig that is position data of the plurality of jig position marks corrected from the measurement positions of the plurality of jig position marks so that the position of the contact point group of the probe is appropriately matched.   The properly matched condition deviates from the design amount of the plurality of inspection terminals or the amount of deviation of the position of the contact point group of the plurality of probes from the design inspection point of the plurality of inspection terminals. The inspection jig according to claim 20, wherein the inspection jig is determined from a margin. The storage means in the inspection jig The inspection jig includes storage means for writing and reading data by the substrate inspection apparatus, and the storage means includes the recording medium. Inspection jig. A method for manufacturing an inspection jig according to any one of claims 20 to 22,
Creating position data after correction of the plurality of jig position marks,
The process is
Creating design data of the plurality of inspection terminals of the substrate;
Measuring the positions of the plurality of jig position marks of the manufactured inspection jig body, and the positions of the plurality of guide holes or the tip groups of the plurality of probes;
Setting the position of the contact point group of the plurality of probes from the measured position;
Exploring and determining the amount of rotation and the amount of movement of the contact point group of the plurality of probes in order to properly match the plurality of inspection terminal groups of the substrate;
Creating the corrected position data corrected from the measurement positions of the plurality of jig position marks so as to correspond to the determined rotation amount and movement amount. .

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