JP2018127256A - Cover tape and electronic component packaging body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cover tape which is good in transparency in which electronic component deposition is suppressed.SOLUTION: Provided is a cover tape for a carrier tape which comprises a base material layer and a seal layer that is provided at one side surface of the base material layer. The seal layer includes plural convex parts which are arranged regularly.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a cover tape and an electronic component package. More specifically, a cover tape capable of heat-sealing a carrier tape having a storage pocket for transporting an electronic component such as a semiconductor IC chip, and heat-sealing the cover tape to the carrier tape storing the electronic component. It is related with the electronic component package obtained by this.

  Electronic parts such as semiconductor IC chips are stored in a state where they are packed in a packaging material and wound on a paper or plastic reel until they are provided to the mounting process after their manufacture. And transported. For packaging electronic components, a tape-shaped packaging material is used so as to correspond to a mounting process on a substrate by an automatic mounting apparatus, and the packaging material is placed on a long sheet at a predetermined interval. The carrier tape includes a plurality of concave storage pockets and a cover tape heat-sealed to the carrier tape. The electronic component packed with such a packaging material is automatically taken out of the package after the cover tape is peeled off from the carrier tape, and mounted on the electronic circuit board.

  Carrier tape includes static electricity generated by friction between the cover tape and electronic components during the process of transporting the packaged package, static electricity generated when the cover tape is peeled off from the carrier tape, or dust and contents attached. It is required to have necessary antistatic properties to such an extent that it is possible to suppress the failure (electrostatic breakdown) of the electronic components housed in the package due to static electricity generated from the object.

  Also, in the process of peeling the cover tape from the carrier tape, if the peel strength that is necessary for peeling the cover tape from the carrier tape is too high, the carrier tape vibrates when the cover tape is peeled off, A phenomenon occurs in which electronic components jump out of the storage pocket. On the other hand, if the adhesive strength between the carrier tape and the cover tape is low, the cover tape may be peeled off during the transportation of the package, and the packed electronic component may fall. For this reason, the cover tape is required to have sufficient adhesive strength to the carrier tape, and at the same time, to be peelable from the carrier tape in the mounting process. Furthermore, when the cover tape is peeled from the carrier tape, it is also required that the electronic components adhere to the cover tape and do not jump out.

  In addition, the state of the packed electronic component needs to be confirmed through a cover tape. Therefore, the cover tape needs to have sufficient transparency to visually check the stored electronic component by visual or image processing.

  In order to solve the above-mentioned problems, various studies have been made. For example, Patent Document 1 proposes an antistatic cover tape having unevenness on a surface portion that comes into contact with an object conveyed by a carrier tape. Yes. In Patent Document 1, fine protrusions are provided by introducing fine particles into the antistatic layer. In this document, when an object transported by the carrier tape comes into contact with the uneven surface of the cover tape, the contact area is reduced, so that the object sticks to the surface of the cover tape.

Special table 2014-532602 gazette

  However, when the uneven portion is provided, the problem of adhesion to the electronic component is solved, but the transparency may be lowered. If the transparency is lowered, visual inspection of stored electronic components may become inefficient, or problems may occur in inspection by image processing.

  The present invention provides a cover tape with good transparency and excellent visibility of the electronic component of the contents, and an electronic component package using the cover tape, in which sticking of the electronic component is suppressed.

  As a result of intensive research, the present inventors have provided a plurality of regularly arranged convex portions on the sealing layer of the cover tape, thereby suppressing the sticking of electronic components without impairing transparency. The present invention has been completed by finding that a cover tape can be obtained.

  According to this invention, it is a cover tape for carrier tapes provided with a base material layer and the sealing layer provided in one surface of the said base material layer, Comprising: The said sealing layer is arrange | positioned regularly A cover tape having a plurality of protrusions is provided.

  According to the present invention, there is also provided an electronic component package comprising: a carrier tape storing electronic components; and the cover tape having a seal layer bonded to the carrier tape so as to seal the electronic components. The

  ADVANTAGE OF THE INVENTION According to this invention, transparency is good and the cover tape in which sticking of the electronic component was suppressed is provided.

It is sectional drawing which shows the structure of the cover tape which concerns on this embodiment. It is a figure which shows an example of the state which sealed the cover tape for electronic component packaging which concerns on this embodiment to the carrier tape.

  As shown in FIG. 1, the electronic component packaging cover tape 10 according to this embodiment includes a base material layer 3 and a seal layer 2 provided on one surface of the base material layer 3. Here, the cover tape 10 may have a two-layer structure of base material layer 3 / sealing layer 2, for example, an intermediate layer 1 which is another layer between the base material layer 3 and the sealing layer 2. A multilayer structure such as a base material layer 3 / intermediate layer 2 / sealing layer 1 may be interposed. The seal layer 2 is provided with a plurality of regularly arranged convex portions. Thereby, at the time of use of the cover tape 10, sticking of the electronic component to the seal layer 2 is suppressed.

  Here, a method of using the cover tape will be described with reference to FIG. As shown in FIG. 2, the cover tape 10 is used as a cover material for the carrier tape 20 in which concave pockets 21 are continuously provided in accordance with the shape of the electronic component. Specifically, the cover tape 10 is used by adhering (for example, heat sealing) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. In the following description, a structure obtained by bonding the cover tape 10 and the carrier tape 20 is referred to as an electronic component package 100.

  At an electronic device manufacturing site, electronic components are accommodated in the pocket 21 of the carrier tape 20, and then the cover tape 10 is bonded to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. By doing so, the package 100 in which the electronic component is accommodated is produced. As described above, the package 100 is transported to a work area where surface packaging is performed on an electronic circuit board or the like in a state where the package 100 is wound around a paper or plastic reel. In the surface mounting process of the electronic component, the cover tape 10 is peeled off from the carrier tape 20, and the electronic component is automatically taken out from the package and mounted on the electronic circuit board.

  The cover tape 10 of this embodiment is bonded to the cover tape 10 so that the seal layer 2 is on the electronic component side. The cover tape 10 of the present embodiment has a plurality of convex portions in which the seal layer 2 is regularly arranged, so that when the cover tape 10 is peeled from the carrier tape 20 in the surface mounting process of the electronic component, the cover tape 10 is prevented from sticking to the electronic component. Moreover, since the cover tape 10 of this embodiment is provided with convex portions within a range where the transparency is not impaired, the electronic component accommodated in the package 100 can be visually recognized.

  The base material layer 3 is made of a thermoplastic resin. For example, a thermoplastic resin such as a polyester resin, a polyamide resin, a polyolefin resin, a polyacrylate resin, a polymethacrylate resin, a polyimide resin, a polycarbonate resin, or an ABS resin. A more formed film, particularly a biaxially stretched film can be suitably used. A biaxially stretched polyethylene terephthalate film is preferred, and any commercially available film can be used. The thickness of the base material layer 3 is generally 5 to 50 μm.

  The sealing layer 2 has a heat sealing property with respect to the carrier tape 20 and is made of a thermoplastic resin exhibiting easy peelability that can be easily peeled off during use. For example, a polyethylene resin, an ethylene-vinyl acetate copolymer, an ethylene- One or more resins selected from ethylene-based polymers such as ethyl acrylate copolymer and ethylene-butene-1 random copolymer, and styrene-butadiene copolymer, polystyrene, high-impact polystyrene, etc. A mixture of one or more resins selected from styrenic polymers can be used. Among them, a blend of ethylene-butene-1 random copolymer, styrene-butadiene copolymer and high-impact polystyrene in that the peel strength when peeled by heat sealing to the carrier tape 20 is continuously stable. Is preferred.

  An intermediate layer 1 may be provided between the base material layer 3 and the seal layer 2. The intermediate layer 1 is made of a thermoplastic resin and may be a single layer or multiple layers. By providing the intermediate layer 1, the flexibility of the film can be adjusted, and the adhesive strength between the base material layer 3 and the seal layer 2 can be strengthened. The thermoplastic resin used for the intermediate layer 1 is not particularly limited, and known resins such as polyolefin resins can be used alone or in a mixture of two or more. In one embodiment, the thickness of the cover tape 10 is 25 μm or more and 200 μm or less, preferably 30 μm or more and 150 μm or less. The width of the cover tape 10 is, for example, 2 mm or more and 100 mm or less, preferably 2 mm or more and 80 mm or less, and more preferably 2 mm or more and 50 mm or less.

  In order to strengthen and stabilize the adhesive strength with the sealing layer 2 or the intermediate layer 1, the base material layer 3 has a surface that is in contact with the sealing layer 2 or the intermediate layer 1, such as a sandplast treatment, a corona discharge treatment, or a plasma treatment. Can be processed. The base material layer 3 may be an antistatic product in which an antistatic agent is kneaded or surface-coated.

  The seal layer 2 of the present embodiment has a plurality of convex portions formed on the surface thereof. These convex portions are regularly arranged. Preferably, the convex portions are arranged in a planar lattice shape. By providing the convex portions in a planar lattice shape, it is possible to prevent the electronic components from sticking without impairing the transparency of the obtained cover film.

  The convex portions provided on the seal layer 2 are preferably provided in a number of 1000 or more and 10,000 or less per square inch of the seal layer. Preferably, this number is 1100 or more and 6000 or less. By providing the sealing layer 2 with the number of convex portions in the above range, it is possible to prevent the electronic component from sticking without impairing the adhesion and peelability of the sealing layer 2 to the carrier tape 20.

  It is preferable that the convex part provided in the sealing layer 2 is adjusted so that the convex part area ratio is 0.77 or more and 0.95 or less. Here, the area ratio of the protrusions is a ratio of the area of the protrusions per unit area of the seal layer 2. The convex area ratio refers to the ratio of the area occupied by the convex portion per unit area when the sealing layer 2 is looked down on with the portion higher than the reference surface of the seal layer 2 as the convex portion.

  The roughness (Rz) of the sealing layer 2 provided with the convex portions is preferably 6 μm or more and 25 μm or less, and more preferably 6 μm or more and 10 μm or less. If the roughness (Rz) exceeds 25 μm, the haze of the seal layer 2 becomes high, that is, the transparency of the seal layer is impaired, and the transparency of the obtained cover tape 10 is deteriorated. It becomes difficult. If the roughness (Rz) is less than 6 μm, the effect of suppressing sticking of electronic components may not be obtained. Here, in the present invention, the roughness (Rz) is measured using a surface roughness meter (“Handy Surf” manufactured by Tokyo Seimitsu Co., Ltd.) defined in JIS B0651-2001, and a measurement method defined in JIS B0633-2001. The roughness (Rz) defined in JISB0601-20001, measured according to the above.

  The shape of the convex portion provided in the sealing layer 2 is preferably a cone, a truncated cone, a cylinder, a pyramid, a truncated pyramid, or a prism. Among these, a cylinder, a truncated cone, a quadrangular column, a quadrangular frustum, a hexagonal column, and a hexagonal frustum are preferably used because they are easy to manufacture. The plurality of convex portions need not all have the same shape and may be different from each other, but preferably all have the same shape. Moreover, the convex part may have a fine uneven | corrugated structure in the side surface or upper surface.

  The maximum width of the convex portion provided on the seal layer 2 is preferably 370 μm or more and 1080 μm or less, and more preferably 570 μm or more and 1080 μm or less. By adjusting to the said range, the transparency fall of the sealing layer 2 resulting from the embossing for providing a convex part can be suppressed.

The sealing layer 2 provided with the convex portions as described above preferably has a tack force at 25 ° C. measured by a tack test method of 2.4 gf / cm ² or less. Even if the electronic component is lightweight, the sticking of the sealing layer 2 having such tack force is reduced. Here, in the present invention, the tack force is obtained by pressing a silicon resin having a contact area of 180 mm ² and a hardness of A24 against the seal layer 2 of the cover tape 10 at a contact speed of 50 mm / min and holding the contact load at 150 ± 70 g for 10 seconds. , The load per unit area when peeling at a rate of 100 mm / min.

  The sealing layer 2 provided with the convex portions as described above preferably has a haze of 65% or less measured based on JIS K 7136. With such haze, the transparency of the base material layer 3 and / or the intermediate layer 1 on which the seal layer 2 is laminated is hardly affected. Therefore, the transparency of the obtained cover tape 10 is maintained.

  The cover tape 10 of the present embodiment can be manufactured by providing a convex portion on the cover tape 10 that is normally used in the field using an embossing machine. The material of the mold used for the embossing machine is not particularly limited. For example, glass, quartz, polycarbonate resin, polyethylene terephthalate resin, polydimethylsiloxane, nickel, gold, silver, copper, platinum, iron, stainless steel, aluminum, A semiconductor substrate or the like can be used. Among these, by processing a semiconductor substrate such as Si by a microfabrication technique to form a mold, it is possible to accurately form a fine convex portion. Further, the surface of the mold may be subjected to a surface treatment such as a fluorine monomolecular film coating so that the step of removing the seal layer from the mold can be stably performed.

  As mentioned above, although embodiment of this invention was described, these are illustrations of this invention and can employ | adopt various structures other than the above.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these.

(Manufacture of cover tape)
CSL-Z8300 (manufactured by Sumitomo Bakelite Co., Ltd.) was provided with convex portions having the properties shown in Tables 1 and 2 to obtain cover tapes of Examples 1 to 13 and Reference Examples 1 to 3. As the cover tape of Comparative Example 1, CSL-Z8300 (manufactured by Sumitomo Bakelite Co., Ltd.) having high transparency and high tack force was used. As the cover tape of Comparative Example 2, CSL-Z8400 (manufactured by Sumitomo Bakelite Co., Ltd.) having low transparency and low tack force was used.
In order to provide convex portions on the cover tape, an etching mold (manufactured by Nomura Metals Co., Ltd.) in which a plurality of cup-shaped concave portions that follow the convex portions having the shapes and arrangements shown in Table 1 are provided in a grid pattern on the entire molding surface. The raw tape was placed so that the sealing layer of the raw tape was in contact with the molding surface of the etching mold, and press treatment was performed under conditions of a molding temperature of 90 ° C., a molding pressure of 20 MPa, and a molding time of 1 minute. Thereafter, the tape was peeled off from the etching mold under the condition of a mold release temperature of 35 ° C. to obtain cover tapes of Examples and Reference Examples.
(Evaluation of cover tape)
About the obtained cover tape, haze and tack force were measured. The results are shown in Table 2.

  All the cover tapes in which the convex portions having the specific shapes and dimensions described in the examples were provided in a planar lattice shape were excellent in transparency and had a low tack force.

DESCRIPTION OF SYMBOLS 1 Intermediate | middle layer 2 Sealing layer 3 Base material layer 10 Cover tape for electronic component packaging (cover tape)
20 Carrier tape 21 Pocket 100 Electronic component packaging

Claims (11)

A base material layer;
A cover tape for a carrier tape comprising a sealing layer provided on one surface of the base material layer,
The seal layer is a cover tape having a plurality of regularly arranged convex portions.   The cover tape according to claim 1, wherein the convex portions are arranged in a planar grid pattern.   The cover tape according to claim 1, wherein there are 1000 or more and 10,000 or less convex portions per square inch of the sealing layer.   The cover tape according to claim 1 whose ratio of the area which said convex part accounts to the unit area of said seal layer is 0.77 or more and 0.95 or less.   The cover tape according to claim 1, wherein the seal layer has a roughness (Rz) of 6 μm or more and 25 μm or less.   The cover tape according to claim 1, wherein the convex portion has a shape of a cone, a truncated cone, a cylinder, a pyramid, a truncated pyramid, or a prism.   The cover tape according to claim 1 whose maximum width of said convex part is 370 micrometers or more and 1080 micrometers or less. When a silicone resin having a contact area of 180 mm ² and a hardness of A24 is pressed against the sealing layer of the cover tape at a contact speed of 50 mm / min, held at a contact load of 150 ± 70 g for 10 seconds, and then peeled off at a speed of 100 mm / min. When the load per unit area is the tack force,
The cover tape according to claim 1, wherein a tack force of the seal layer at 25 ° C is 2.4 gf / cm ² or less.   The cover tape according to claim 1 whose haze measured based on JIS K 7136 is 65% or less.   The cover tape according to any one of claims 1 to 9, wherein the convex portion of the seal layer is in contact with an electronic component conveyed by the carrier tape.   An electronic device comprising: a carrier tape storing electronic components; and a cover tape according to any one of claims 1 to 9, wherein the sealing layer is bonded to the carrier tape so as to seal the electronic components. Parts packaging.

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