JP2018122413A - Cutting blade and cutting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make working quality of cutting work uniform by stably suppressing burr.SOLUTION: An annular cutting blade 2 having a function of cutting a workpiece while being supplied with a cutting fluid is provided in which a cutting edge 6 is provided at an outer periphery and a through-hole 4 is provided at a center. A plurality of grooves 10 are formed, in the cutting edge 6, from the through-hole 4 toward the outer periphery side in such a manner that a cross angle of an outer peripheral edge to a tangent line falls within a prescribed range even if the cutting edge 6 is worn from the outer periphery thereof and a diameter of the cutting blade 2 is changed. The groove 10 may be formed on each of a first face perpendicular to an extension direction of the through-hole 4 of the cutting blade 2, and a second face which is a back side of the first face.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a cutting blade for cutting a workpiece and a cutting method using the cutting blade.

  2. Description of the Related Art A cutting apparatus that precisely cuts a workpiece such as a semiconductor wafer, a package substrate, a ceramic substrate, or a glass substrate with an annular cutting blade is known. In the cutting apparatus, the cutting blade is rotatably supported by the spindle. Then, the cutting blade is rotated by rotating the spindle, and the rotating cutting blade is cut into the workpiece to cut the workpiece.

  On the surface of the workpiece, for example, devices such as ICs and LSIs are formed in each of a plurality of regions partitioned by division lines set in a lattice shape. When the workpiece is cut along the planned division line and the workpiece is divided, a plurality of chips having devices (hereinafter referred to as device chips) are formed.

  The workpiece before cutting may be formed with, for example, a layer containing a metal constituting the device, wiring, electrode, or TEG (Test Element Group). When such a metal-containing layer is formed on the division line, the cutting blade cuts the metal.

  For example, when a package substrate having a plurality of devices covered with resin is cut and divided into individual device chips, an electrode pad containing a metal is cut to expose the electrodes on the side surfaces of the formed device chips. In some cases, the division schedule line is set. In such a package substrate, for example, the plurality of devices may be formed in a device region surrounded by a metal frame, and a cutting blade removes the metal frame when cutting the package substrate. To cut.

  The cutting blade is formed by mixing abrasive grains such as diamond with a bond material (binder) made of metal, resin, or the like. When a layer containing a ductile material such as metal or resin (a material with high ductility) is cut with such a cutting blade, the ductility is generated by heat generated by the processing in a processing region where the cutting blade and the workpiece are in contact with each other. In some cases, the material stretches and large protrusions called burrs are generated. In addition, the cutting blade may become clogged and the cutting ability of the cutting blade may be reduced.

  For example, when burr of electrodes occurs when cutting a package substrate, the electrodes may come into contact with each other to cause a short circuit. In addition, when the metal wire is bonded to the electrode of the formed device chip, the burr may be sandwiched to cause bonding failure. Therefore, a technique has been proposed in which cutting is performed twice using a thin cutting blade along each division line.

  By performing the cutting process twice along each division line, it is possible to reduce the volume removed by cutting at a time. Since the portion to be cut and removed of the layer containing the ductile material is extended to form burrs, the burrs can be reduced when the volume of the portion to be cut and removed is reduced. Further, when the volume of the portion to be removed is reduced, heat generation due to the processing is suppressed, and this is also a factor that can reduce the formed burr.

JP 2014-90126 A

  However, in this technique, it is necessary to cut twice for each division planned line. For this reason, the time required for cutting is doubled, resulting in a problem that productivity is deteriorated. In addition, when the grooves are formed for the second time in each division line, the accuracy of the alignment of the cutting blade with respect to the groove formed first must be particularly high, which complicates the process.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a cutting blade capable of preventing deterioration of processing quality without reducing productivity, and a cutting method using the cutting blade. It is.

  According to one aspect of the present invention, an annular cutting blade having a function of cutting a workpiece while being supplied with a cutting fluid, the outer peripheral cutting blade, and a central through hole, The cutting blade has a plurality of grooves extending from the through hole to the outer peripheral side so that the crossing angle with respect to the tangent to the outer peripheral edge is within a predetermined range even if the cutting blade wears from the outer periphery and the diameter of the cutting blade changes. A cutting blade is provided that is formed toward the front.

  In one aspect of the present invention, the groove may be formed on a first surface perpendicular to the extending direction of the through hole of the cutting blade and a second surface on the back side of the first surface. .

  According to another aspect of the present invention, there is provided a cutting method for cutting a workpiece with the cutting blade, the holding step for holding the workpiece with a holding means, and the holding step, A cutting step in which the cutting fluid is supplied to the rotating cutting blade to cut the workpiece with the cutting blade while supplying the cutting fluid through the groove to a processing area where the cutting blade and the workpiece are in contact with each other. And a cutting method characterized by comprising:

  The cutting blade of the cutting blade according to one aspect of the present invention has a plurality of grooves. At the time of cutting the workpiece, cutting fluid is supplied to the cutting blade that rotates at high speed around the through hole, and the cutting fluid is supplied to a processing portion of the workpiece through the groove. Then, when a workpiece having a ductile material such as a metal or a resin is cut, the processed portion is cooled, so that generation of burrs is suppressed.

  However, when cutting by the cutting blade proceeds, the cutting blade of the cutting blade is worn from the outer peripheral side, and the diameter of the cutting blade gradually decreases. While performing the cutting process, the edges of the plurality of grooves contact the work piece one after another, but depending on the shape of the groove, the work piece at the edge of the groove as the diameter of the cutting blade decreases. The intersection angle with respect to changes. Then, the generation state of burrs changes, and the size and angle of the generated burrs change, so that the processing quality of the cutting process is not constant.

  Therefore, in the cutting blade according to one aspect of the present invention, even if the cutting blade wears from the outer periphery and the diameter of the cutting blade changes, the angle of intersection with the tangent of the outer peripheral edge is predetermined. The shape is in the range. Then, even if the cutting blade is worn by cutting, the crossing angle of the edge of the groove of the cutting blade with respect to the workpiece is constant, and the occurrence of burrs is also constant. Therefore, according to the cutting method according to an aspect of the present invention using the cutting blade, burrs can be stably suppressed, and the processing quality of the cutting process becomes substantially constant.

  Therefore, according to the present invention, a cutting blade capable of preventing deterioration of processing quality without reducing productivity and a cutting method using the cutting blade are provided.

FIG. 1A is a plan view schematically illustrating the surface side of the workpiece, and FIG. 1B is a plan view schematically illustrating the back side of the workpiece. It is a perspective view which shows a cutting device typically. FIG. 3A is a plan view schematically showing the holding table, and FIG. 3B is a cross-sectional view schematically showing the holding table. It is a side view which shows a cutting blade typically. FIG. 5A is a cross-sectional view schematically showing a part of the cutting blade according to the first embodiment, and FIG. 5B schematically shows a part of the cutting blade according to the second embodiment. It is sectional drawing shown. It is a fragmentary sectional view explaining a holding step typically. It is a side view which illustrates a cutting step typically.

  First, a workpiece to be cut using the cutting blade according to the present embodiment will be described. The workpiece is, for example, a semiconductor wafer such as silicon or sapphire, or a substrate such as glass or quartz. On the surface of the workpiece, for example, devices such as ICs and LSIs are formed in each of a plurality of regions partitioned by division lines set in a lattice shape. When the workpiece is cut along the planned division line and the workpiece is divided, a plurality of chips having devices (hereinafter referred to as device chips) are formed.

  For example, a layer including a metal such as the device, wiring, or electrode may be formed on the workpiece before being cut. When such a metal-containing layer is formed on the division line, the cutting blade cuts the metal.

  The workpiece is a package substrate having a plurality of devices covered with resin. FIG. 1A shows a top view of a package substrate 1 which is an example of a workpiece. FIG. 1B is a bottom view of the package substrate 1. As shown in FIGS. 1A and 1B, the package substrate 1 includes a metal frame 3 formed in a substantially rectangular shape in plan view.

  The metal frame 3 is made of, for example, a metal such as 42 alloy (an alloy of iron and nickel) or copper, and includes a plurality of device regions 5 and an outer peripheral surplus region 7 surrounding each device region 5. ing. As illustrated in FIG. 1B, a plurality of stages 9 are arranged on the back surface 3 b side of the metal frame 3. On the front side of the stage 9 (on the surface 3a side of the metal frame 3), devices (not shown) such as ICs and LEDs are provided so as to overlap each stage 9.

  A sealing resin 13 for sealing the device is formed on the surface 3a side of the metal frame 3. The sealing resin 13 is formed with a predetermined thickness and protrudes from the surface 3 a of the metal frame 3. On each stage 9, each device is covered with this sealing resin 13.

  As shown in FIG. 1B, a plurality of electrode pads 11 are formed around each stage 9, and the plurality of electrode pads 11 are arranged in a matrix in each device region 5. Each electrode pad 11 is covered with a sealing resin 13 on the front side, and the back side is exposed to the outside. In the package substrate 1, before the sealing resin 13 is formed, each electrode of each device is connected to a corresponding electrode pad 11 by a metal wire (not shown) or the like.

  At this time, the electrode pads 11 located between the two adjacent devices are connected to the respective electrodes of the two adjacent devices, and individual device chips are formed later by cutting with a cutting blade. At this time, the electrode pads 11 are divided to form electrode terminals of the respective device chips.

  A marker 15 is formed on the back surface 3b side of the metal frame 3. The marker 15 is formed so as to sandwich each row or column between the top side and the end side of each row and column of the plurality of electrode pads 11 arranged in a matrix. The marker 15 is used as a mark for adjusting the position of the cutting blade at the time of cutting to a predetermined position.

  That is, by cutting the sealing resin 13 together with the electrode pads 11 around each stage 9 by cutting a cutting blade so as to divide the plurality of electrode pads 11 one after another in each row or column, each device chip Is formed. That is, each row and column in which the plurality of electrode pads 11 are arranged becomes a planned division line. Therefore, when the package substrate 1 or the like is cut by the cutting blade along the planned division line, the cutting blade cuts the metal contained in the electrode pad 11 or the like and the sealing resin 13.

  When a layer containing a ductile material such as metal or resin (a material with high ductility) is cut with a cutting blade, the ductile material expands due to heat generated by processing in the processing region where the cutting blade and the workpiece are in contact with each other. As a result, protrusions called burrs may occur. When this burr | flash generate | occur | produces, electrodes may contact and may short-circuit. In addition, when the metal wire is bonded to the electrode of the formed chip, the burr may be sandwiched to cause a bonding failure. In addition, the cutting blade may become clogged and the cutting ability of the cutting blade may be reduced.

  Next, a description will be given of a cutting device 22 that is equipped with the cutting blade according to the present embodiment and performs a cutting process on a workpiece. As shown in FIG. 2, a gate-type support structure 42 that supports a cutting unit (cutting means) 40 for cutting a workpiece is disposed on the upper surface of the base 24 so as to straddle the opening 24a. A cutting unit moving mechanism (index feed means) 44 for moving the cutting unit 40 in the Y-axis direction (index feed direction) and the Z-axis direction (vertical direction) is provided on the upper front surface of the support structure 42.

  The cutting unit 40 includes an annular cutting blade 2 attached to one end of a spindle (not shown) that forms a rotation axis parallel to the Y-axis direction. A rotational drive source (not shown) such as a motor is connected to the other end side of the spindle, and the cutting blade 2 is rotated by a rotational force transmitted from the rotational drive source via the spindle.

  A rectangular opening 24 a that is long in the X-axis direction (front-rear direction, cutting feed direction) is formed on the upper surface of the base 24. Within this opening 24a, an X-axis moving table 26, an X-axis moving mechanism (cutting means) (not shown) for moving the X-axis moving table 26 in the X-axis direction, and a dustproof and splash-proof cover that covers the X-axis moving mechanism 28 is provided.

  A holding table (holding means) 30 for sucking and holding the package substrate 1 is disposed on the X-axis moving table 26. The holding table 30 includes a base 32 having two types of suction ports. A holding jig 34 corresponding to the package substrate 1 is mounted on the upper surface 32 a of the base 32.

  FIG. 3A is a plan view schematically showing the holding jig 34, and FIG. 3B is a diagram schematically showing the holding jig 34 placed on the upper surface 32 a of the base 32. It is. As shown in FIGS. 3A and 3B, the holding jig 34 is formed in a substantially rectangular flat plate shape, and its upper surface is a holding surface 34a for sucking and holding the package substrate 1. .

  A relief groove 34c corresponding to a street (division planned line) of the package substrate 1 is formed on the holding surface 34a. By the escape groove 34 c, the holding surface 34 a of the holding jig 34 is partitioned into a plurality of regions corresponding to the chips divided from the package substrate 1.

  The width of the escape groove 34 c is wider than the width of the cutting blade 2 described later, and the depth of the escape groove 34 c is deeper than the cutting depth of the cutting blade 2. Therefore, even when the cutting blade 2 is deeply cut when the package substrate 1 is cut along the street (division planned line), the cutting blade 2 does not contact the holding jig 34. The holding jig 34 is formed thicker than the depth of the escape groove 34c.

  In each region defined by the escape groove 34c, a small hole 34d that penetrates the holding jig 34 vertically and opens to the holding surface 34a is formed. As shown in FIG. 3B, when the holding jig 34 is placed on the upper surface 32a of the base 32, each pore 34d is connected to the suction port 32b formed in the central portion on the upper surface 32a side of the base 32. The

  The suction port 32b is connected to a suction source 38 through a solenoid valve 36a. For this reason, the package substrate 1 is overlaid on the holding surface 34a of the holding jig 34 placed on the upper surface 32a of the base 32, and the region corresponding to each chip of the package substrate 1 is aligned with each of the pores 34d. If 36 a is opened, the package substrate 1 can be sucked and held by the holding table 30.

  A suction port 32 c for attaching the holding jig 34 to the base 32 is formed on the outer peripheral portion of the base 32 on the upper surface 32 a side. The suction port 32c is connected to a suction source 38 through a solenoid valve 36b. Therefore, the holding jig 34 can be mounted on the upper surface 32a of the base 32 by bringing the lower surface 34b of the holding jig 34 into contact with the upper surface 32a of the base 32 and opening the solenoid valve 36b.

  A cutting blade according to an embodiment of the present invention attached to the cutting unit 40 will be described. FIG. 4 is a side view schematically showing an example of the cutting blade 2. As shown in FIG. 4, the cutting blade 2 is, for example, a washer type blade, and has a through hole 4 at the center and a cutting blade 6 at the outer periphery. A groove 10 is formed in the first surface 8 perpendicular to the extending direction of the through hole 4 and the second surface 14 (see FIG. 5) on the back side of the first surface 8. The cutting blade 2 is formed by mixing abrasives such as diamond with a bond material (binder) such as metal or resin.

  The annular cutting blade 2 is attached to the cutting device 22 by passing the spindle of the cutting device 22 through the through hole 4. When the spindle rotates, the cutting blade 2 rotates. When the cutting blade 6 of the rotating cutting blade 2 hits the workpiece, the workpiece is cut. When cutting is continued, the abrasive grains of the cutting blade 6 are consumed, but the bond material is also consumed and new abrasive grains are exposed one after another, so that a certain level of cutting ability is maintained.

  As shown in FIG. 4, a plurality of grooves 10 are formed on the first surface 8 of the cutting blade 6 of the cutting blade 2. When cutting a workpiece such as the package substrate 1, a cutting fluid is supplied toward the cutting blade 2 that rotates at high speed around the through-hole 4, and the cutting fluid passes through the groove 10 to process the workpiece. To be supplied. Then, when the workpiece is cut, the processing portion is cooled, so that generation of burrs is suppressed.

  As cutting with the cutting blade 2 proceeds, the cutting blade 6 of the cutting blade 2 is worn from the outer peripheral side, and the diameter of the cutting blade 2 is reduced. Then, depending on the shape of the groove 10, the crossing angle of the edge of the groove 10 with respect to the workpiece changes, and the state of occurrence of burrs also changes. If the burr generation condition changes and the burr size and angle change, the machining quality of the cutting process will not be constant.

  Therefore, in the cutting blade 2 according to one aspect of the present invention, the groove 10 formed in the cutting blade 6 is tangent to the outer peripheral edge even when the cutting blade 6 wears from the outer periphery and the diameter of the cutting blade 2 changes. The crossing angle with respect to is a shape that falls within a predetermined range.

  For example, as shown in FIG. 1, the shape of the groove 10 is a Bernoulli spiral line (spiral). The Bernoulli spiral line has a self-similar shape, and an enlarged or reduced element at an arbitrary magnification coincides with the original line by appropriate rotation. The angle formed by the half line drawn from the center of the Bernoulli spiral line and the tangent line of the spiral line is always constant.

  When the groove 10 is formed in such a shape, even if the cutting blade 2 is worn by cutting and changes in diameter, the crossing angle of the edge of the groove 10 with respect to the workpiece is constant, so the occurrence of burrs is constant. It becomes. Therefore, burrs can be stably suppressed and the machining quality of the cutting process becomes constant.

  The crossing angle does not have to be completely constant, as long as the crossing angle does not change greatly while the diameter changes due to wear of the cutting blade. For example, it is preferable that the intersecting angle extends over the entire area of the groove 10 and falls within a range of plus or minus 10 degrees from the average value of the intersecting angles at each point constituting the groove 10. Further, it is more preferable that the average value of the crossing angle falls within a range of plus or minus 5 degrees.

  When the shape of the groove 10 is a Bernoulli spiral, for example, as shown in FIG. 4, the groove 10 is bent in the same direction as the rotational direction 12 of the cutting blade 2 from the through hole 4 toward the outer peripheral direction. Then, the cutting fluid is easily supplied to the workpiece along the groove 10. Further, the groove 10 may also be formed on the second surface 14 on the back side of the first surface 8 of the cutting blade 2. FIGS. 5A and 5B are partial cross-sectional views of the cutting blade 2 in which a plurality of grooves 10 are formed on both the first surface 8 and the second surface 14.

  In the first form shown in FIG. 5A, the groove 10 formed on the first surface 8 and the groove 10 formed on the second surface 14 are formed so as to overlap each other. If the groove | channel 10 is formed in this way, cutting water will be supplied similarly from the 1st surface 8 side and the 2nd surface 14 side with respect to a process location.

  Alternatively, for example, in the second embodiment shown in FIG. 5B, the groove 10 formed on the first surface 8 and the groove 10 formed on the second surface 14 are formed so as not to overlap each other. . When the grooves 10 on both sides overlap each other, the thickness of the cutting blade 2 is reduced at the portion where the grooves 10 are formed, and the rigidity is easily lost. If the grooves 10 on both sides are formed so as not to overlap with each other, there is no portion where the thickness of the cutting blade 2 becomes extremely thin, so that the rigidity of the cutting blade 2 is easily maintained.

  If the width of the groove 10 is too large, the rigidity required for the cutting blade 2 cannot be maintained. Therefore, for example, the width of the groove 10 is set to 1 mm or less. If the groove 10 is too deep, the necessary rigidity cannot be maintained. Therefore, for example, the depth of the groove 10 is set to 1/3 or less of the thickness of the cutting blade 2.

  Next, a method for forming the cutting blade 2 will be described. First, for example, a resin or a metal is prepared as a raw material for the bond material constituting the cutting blade 2. A grindstone such as diamond is mixed with the raw material of the bond material. Next, a mold in which convex portions along the grooves 10 are formed is prepared and sintered. Then, the cutting blade 2 in which the groove 10 is formed is formed.

  Here, the groove 10 may be formed by other methods. For example, it may be formed by photolithography. In this case, after forming the annular cutting blade, the region other than the portion where the groove 10 is formed is covered with a resist mask, and the groove 10 is formed by etching. Furthermore, the groove 10 may be formed by irradiating a laser beam only to a region to be the groove 10 of the annular cutting blade.

  If the groove 10 is formed in the cutting blade 2 in such a shape that the crossing angle with respect to the tangent of the outer peripheral edge is within a predetermined range even if the diameter of the cutting blade 2 is changed, the work piece in the groove 10 will be worn even if worn by cutting. The crossing angle with respect to is constant. Therefore, the burr generation state does not change, the burr can be stably suppressed, and the machining quality of the cutting can be made constant.

  Next, a method for cutting a workpiece such as the package substrate 1 using the cutting blade 2 according to this embodiment will be described. The cutting method is performed by the cutting device 22 including the cutting unit 40 to which the cutting blade 2 is attached.

  The cutting method includes a holding step of holding the workpiece with a holding unit, and a cutting step of cutting the workpiece such as the package substrate 1 with the cutting blade after the holding step is performed. In the cutting step, by supplying a cutting fluid to the rotating cutting blade, the workpiece is cut while supplying the cutting fluid through the groove to a processing region where the cutting blade and the workpiece are in contact with each other.

  The holding step according to the cutting method will be described with reference to FIG. FIG. 6 is a partial cross-sectional view for schematically explaining the holding step. First, the holding jig 34 is attached to the base 32. The lower surface 34b of the holding jig 34 is brought into contact with the upper surface 32a of the base 32, the solenoid valve 36b is opened, and a negative pressure is applied from the suction source 38 through the suction port 32c, whereby the holding jig 34 is moved to the upper surface 32a of the base 32. Attach to.

  Next, the package substrate 1 is placed on the holding jig 34 with the back surface 3b of the metal frame 3 facing upward. At this time, the street (scheduled division line) of the package substrate 1 is overlaid on the escape groove 34 c formed in the holding jig 34. Then, the solenoid valve 36a is opened, and a negative pressure is applied from the suction source 38 through the suction port 32b, so that the holding substrate 34 sucks and holds the package substrate 1.

  After performing the holding step, a cutting step is performed. The cutting step will be described with reference to FIG. FIG. 7 is a side view schematically illustrating the cutting step. First, the cutting blade 2 is positioned on an extension line of the street outside the metal frame 3 so that the cutting unit 40 is moved so that the cutting blade 2 can cut the package substrate 1 along the street of the package substrate 1. Next, rotation of the cutting blade 2 is started and cutting fluid is supplied to the cutting blade 2.

  Here, the cutting fluid is supplied to the cutting blade 2 from a cutting fluid ejection port 46a shown in FIG. The cutting fluid is supplied to the cutting fluid jet port 46a facing the cutting blade of the cutting blade 2 through the cutting fluid feed pipe 46, and the cutting fluid is sprayed to the cutting blade 2 from the cutting fluid jet port 46a.

  Further, the cutting fluid is supplied from the cutting fluid supply pipe 48 to the side surfaces (first surface 8 and second surface 14) of the cutting blade 2. A plurality of holes facing the side surface of the cutting blade are formed on the side of the cutting fluid supply pipe 48, and the cutting fluid supplied to the cutting fluid supply pipe 48 through the holes is ejected to the side surface of the cutting blade 2. To do.

  Next, the cutting unit 40 is lowered to position the cutting blade 2 at a predetermined height position. Then, the X-axis movement table of the cutting device 22 is moved in the X-axis direction, and the package substrate 1 is processed and fed. Then, when the rotating cutting blade 2 hits the package substrate 1, cutting is started. At the time of cutting, the cutting fluid is supplied to the processing region where the cutting blade 2 and the package substrate 1 are in contact with each other through the groove 10 of the cutting blade 2.

  As the cutting by the cutting blade 2 proceeds, the grindstone contained in the cutting blade 2 is gradually consumed, but the bonding material of the cutting blade 2 is also gradually consumed, so that new grindstones appear one after another. The cutting ability is maintained. Even when the cutting blade 2 is worn by cutting, the crossing angle of the groove 10 with respect to the workpiece is constant in the cutting blade 2 according to this embodiment. Therefore, the occurrence state of burrs caused by the grooves 10 does not change, and the burrs can be stably suppressed, and the machining quality of the cutting can be made constant.

  Even when the cutting blade 2 is positioned at a height where the lowest point of the cutting blade 2 completely cuts the package substrate 1 in the thickness direction, the cutting blade 2 enters the escape groove 34 c of the holding jig 34. Therefore, the cutting blade 2 does not cut the holding jig 34 or the like. Then, unnecessary wear of the cutting blade 2 can be avoided.

  When the cutting process by the cutting blade 2 proceeds and the package substrate 1 is divided along all the streets, individual chips are formed. Here, the holding jig 34 is provided with pores 34d corresponding to the positions of the respective chips, and negative pressure caused by the suction source 38 can be applied to the individual chips through the pores 34d. Therefore, the formed individual chips are held by the holding jig 34 as they are.

  In addition, this invention is not limited to description of said embodiment, A various change can be implemented. For example, although the washer type blade has been described in the above embodiment, the present invention is not limited to this. For example, a hub type blade or a kimberley type blade in which a cutting edge is formed on the outer periphery of a metal base may be used. Similarly, the bond material included in the cutting blade is not limited to resin or metal, and may be formed by vitrified bond or electroformed bond, for example.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

DESCRIPTION OF SYMBOLS 1 Package board | substrate 3 Metal frame 3a Surface 5 Device area | region 7 Peripheral surplus area | region 9 Stage 11 Electrode pad 13 Sealing resin 15 Marker 2 Cutting blade 4 Through-hole 6 Cutting edge 8 1st surface 10 Groove 12 Rotating direction of cutting blade 14 Second surface 22 Cutting device 24 Base 24a Opening 26 X-axis moving table 28 Dustproof and drip-proof cover 30 Holding table (holding means)
32 Base 32a Upper surface 32b, 32c Suction port 34 Holding jig 34a Holding surface 34b Lower surface 34c Relief groove 34d Small hole 36a, 36b Solenoid valve 38 Suction source 40 Cutting unit (cutting means)
42 Support structure 44 Cutting unit moving mechanism (index feed means)
46 Cutting fluid feed pipe 46a Cutting fluid outlet 48 Cutting fluid supply pipe

Claims (3)

An annular cutting blade having a function of cutting a workpiece while being supplied with a cutting fluid,
A peripheral cutting edge and a central through hole,
The cutting blade has a plurality of grooves extending from the through hole to the outer peripheral side so that the crossing angle with respect to the tangent to the outer peripheral edge is within a predetermined range even if the cutting blade wears from the outer periphery and the diameter of the cutting blade changes. A cutting blade characterized by being formed toward the surface.   2. The cutting blade according to claim 1, wherein the groove is formed on a first surface perpendicular to an extending direction of the through-hole of the cutting blade and a second surface on the back side of the first surface. A cutting method for cutting a workpiece with the cutting blade according to claim 1 or 2,
A holding step for holding the workpiece by holding means;
After the holding step, the cutting fluid is supplied to the rotating cutting blade, so that the cutting fluid is supplied through the groove to the processing area where the cutting blade and the workpiece are in contact with each other. A cutting method comprising: a cutting step for cutting a workpiece.