JP2018167540A - Method for manufacturing head chip and method for manufacturing inkjet head - Google Patents

Abstract

To provide a method for manufacturing a head chip that makes highly accurate machining possible by reducing influence from cutting swarf when cutting or cutting off a ceramic substrate with a dicing blade, and to provide a method for manufacturing an inkjet head.SOLUTION: A dicing blade A for cutting or cutting off a ceramic substrate 10 is formed with an annular blade part 91 constituted of an abrasive grain layer over the whole circumference on a double side on a peripheral edge side of a disk-like metal base 9, and has a thickness of an inner peripheral side part 9a that is thinner than that of a peripheral edge side part. The annular blade part 91 has a radial width (a) that is narrower than a cutting depth b of the ceramic substrate 10 to be cut or cut off.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a head chip and a method for manufacturing an inkjet head. More specifically, when cutting or cutting a ceramic substrate with a dicing blade, the influence of cutting waste between the ceramic substrate and the dicing blade is reduced. The present invention relates to a method for manufacturing a head chip and a method for manufacturing an inkjet head that enable high-precision processing.

  2. Description of the Related Art Conventionally, a shear mode type ink jet head having a head chip in which channels and drive walls are alternately arranged is known. In this ink jet head, a voltage is applied to an electrode formed on the drive wall to deform the drive wall into a dogleg shape, and the ink in the channel is ejected from the nozzle.

  As such an ink jet head, there is a head provided with a head chip having a structure in which an inlet to a channel and an outlet from the channel are opened on a back surface and a front surface of the head chip, respectively. Such a head chip fully cuts (cuts) a long ceramic substrate (piezoelectric substrate) in which channels are arranged side by side in a direction perpendicular to the channel length direction at a pitch corresponding to the desired number of channels. By doing so, a large number can be produced at a time, and the productivity is extremely good. As shown in FIG. 20, a full cut of the ceramic substrate is performed by a dicing blade 101 that is mounted on a dicing saw 100 and rotated. The dicing blade 101 is configured by forming blade portions made of an abrasive grain layer on both surfaces of a disk-shaped base metal.

  In addition, as an example of the manufacturing process of such a head chip, there is a process of cutting a ceramic substrate constituting the head chip using a dicing blade to form a plurality of elongated discharge grooves (Patent Document 1). Further, the step of forming a plurality of openings for communicating the common ink chambers with the plurality of channels by channel-shaped grooves penetrating the bottom surface of the groove is also performed using a dicing blade (Patent Document 2).

  A plurality of openings can be formed at a minute pitch that cannot be formed by sandblasting or laser processing by performing dicing processing in which a plate member is cut using a dicing blade. Therefore, easy and efficient processing can be performed.

Japanese Patent Laying-Open No. 2015-024516 JP 2008-201022 A JP 58-165965 A

  In recent years, ink jet heads are required to perform higher-definition image recording, and accordingly, higher density of nozzles is required. For this reason, the channels provided in the head chip have been multi-rowed, and the head chip is obtained by full-cutting (cutting) a thick laminate in which a plurality of ceramic substrates are laminated so that the channel row has a desired number of rows. Need to be produced.

  As shown in FIG. 20, in the case of manufacturing a head chip in which a plurality of channel rows are arranged in parallel by full cutting using the dicing blade 101, a cutting surface 201a on one side of the dicing blade 101 and a cutting surface 201b on the other surface side. And the head chip thickness (thickness in the channel length direction) was found to be non-uniform. This non-uniformity was about 10 μm in thickness difference between one end and the other end of the head chip. If the head chip thickness (thickness in the channel length direction) is not uniform, the channel length differs for each channel row, and the ink ejection performance varies for each channel row. In addition, poor adhesion of the nozzle plate adhered to the head chip, poor adhesion of the wiring substrate adhered to the head chip, and poor conduction occur.

  The present inventor has intensively studied this problem, and has found that the cause is the chip 202 generated when the ceramic substrate 201 is fully cut. That is, when the ceramic substrate 201 is fully cut using the dicing blade 101, a large amount of cutting waste 202 is generated, and the cutting waste 202 stays between the cut surfaces 201 a and 201 b of the ceramic substrate 201 and the dicing blade 101. . The cutting waste 202 is discharged along with the rotation of the dicing blade 101. When the cutting waste 202 is discharged, it is rubbed against the cut surfaces 201a and 201b of the ceramic substrate, and further cuts the cut surfaces 201a and 201b. As described above, the cut surfaces 201a and 201b after cutting are further scraped, resulting in non-uniformity of the cut surfaces 201a and 201b.

  Such a problem becomes more prominent because the number of stacked ceramic substrates 201 increases and the cutting thickness increases, so that the amount of generated cutting waste 202 increases.

  In addition, a dicing blade in which a blade portion made of an abrasive grain layer is formed only in an annular region on a peripheral side surface and a peripheral side of a disk-shaped base metal is proposed (Patent Document 3). Assuming cutting of a semiconductor wafer thinner than the width of the blade part in the annular region, and the purpose of which is to suppress the extension of the disk-shaped base metal by the blade part, cutting of a ceramic substrate with a large number of stacks and a thick cutting thickness However, this does not mean solving the problem of the cutting waste as described above.

  Therefore, the present invention provides a head chip manufacturing method that reduces the influence of cutting waste between the ceramic substrate and the dicing blade when cutting or cutting the ceramic substrate with a dicing blade, and enables higher precision processing, and It is an object to provide a method for manufacturing an inkjet head.

  Other problems of the present invention will become apparent from the following description.

  The above problems are solved by the following inventions.

1.
Using a dicing blade, cutting or cutting the ceramic substrate constituting the head chip of the inkjet head,
The dicing blade is formed with an annular blade portion formed of an abrasive layer over the entire circumference on both sides of the periphery of the disc-shaped base metal,
The inner peripheral side portion where the annular blade portion of the disc-shaped base metal is not formed is thinner than the peripheral side portion including the annular blade portion,
A method of manufacturing a head chip, characterized in that a radial width of the annular blade portion is narrower than a cutting depth of the ceramic substrate to be cut or cut.
2.
In the step of cutting the ceramic substrate,
The ceramic substrate is adhered and fixed on a resin dicing sheet, and the dicing blade enters the ceramic substrate from the opposite side of the dicing sheet to cut the ceramic substrate and cut a part of the dicing sheet. And
2. The method of manufacturing a head chip according to claim 1, wherein a cutting depth with respect to the dicing sheet is smaller than a radial width of the annular blade portion.
3.
3. The method of manufacturing a head chip according to claim 1 or 2, wherein the dicing blade is formed with a peripheral blade portion made of an abrasive grain layer on a peripheral side surface of the disk-shaped base metal.
4).
4. The method of manufacturing a head chip according to claim 3, wherein the peripheral blade portion is formed flat along a peripheral side surface of the disk-shaped base metal.
5.
The dicing blade is used by sandwiching and fixing the disk-shaped base metal by a pair of flanges,
5. The arithmetic average roughness of the surface of the sandwiched portion of the disk-shaped base metal by the flange is equal to or greater than the arithmetic average roughness of the surface of the annular blade portion. A manufacturing method of a head chip.
6).
The dicing blade is used by sandwiching and fixing the disk-shaped base metal by a pair of flanges,
The maximum static frictional force moment between the surface of the sandwiched portion of the disk-shaped base metal by the flange and the flange is equal to or greater than the dynamic frictional force moment between the surface of the annular blade and the ceramic substrate. 6. The method of manufacturing a head chip as described in any one of 1 to 5 above.
7).
The annular blade portion is thinner toward the inner peripheral side of the disk-shaped base metal and is thicker toward the outer peripheral side of the disk-shaped base metal, and the surface thereof becomes an inclined surface from the inner peripheral side toward the outer peripheral side. The method of manufacturing a head chip as described in any one of 1 to 6 above.
8).
The annular blade portion is thinner toward the inner peripheral side of the disk-shaped base metal, and is thicker toward the outer peripheral side of the disk-shaped base metal, and its surface is stepped from the inner peripheral side toward the outer peripheral side. The method of manufacturing a head chip as described in any one of 1 to 6 above.
9.
The step of cutting the ceramic substrate includes:
9. The ceramic substrate according to any one of 1 to 8, wherein a plurality of grooves forming a plurality of channels are formed in the ceramic substrate, and a plurality of parallel channels and a partition wall for driving the channels are formed. A manufacturing method of a head chip.
10.
The step of cutting the ceramic substrate includes:
The ceramic substrate is cut to join a nozzle plate joining surface to which a nozzle plate on which a plurality of nozzles are formed is joined, and a wiring substrate on which a wiring pattern for supplying power to partition walls separating a plurality of channels is formed. 10. The method of manufacturing a head chip as described in any one of 1 to 9 above, wherein at least one of the wiring board bonding surfaces is formed.
11.
In the step of cutting the ceramic substrate,
The ceramic substrate before cutting is formed with grooves constituting a plurality of channels, and an electrode for supplying power to a piezoelectric element that causes volume change of the channels is formed on the inner surface of the grooves. 11. The method of manufacturing a head chip as described in 10 above.
12
In the step of cutting the ceramic substrate,
The method of manufacturing a head chip according to 10 or 11, wherein a plurality of cutting waste discharge grooves are formed in the ceramic substrate before cutting.
13
A step of bonding a nozzle plate having a plurality of nozzles to the head chip driven in parallel by a plurality of channels formed in parallel and separating the channels, the nozzles corresponding to the channels; and
Bonding a wiring board on which a wiring pattern for supplying power to the partition wall is formed on the head chip,
The dicing according to any one of 1 to 8, wherein at least one of a nozzle plate bonding surface to which the nozzle plate of the ceramic substrate constituting the head chip is bonded and a wiring substrate bonding surface to which the wiring substrate is bonded are used. A method of manufacturing an ink jet head, comprising forming by cutting using a blade.

  According to the present invention, when cutting or cutting a ceramic substrate with a dicing blade, a head chip manufacturing method that reduces the influence of cutting waste between the ceramic substrate and the dicing blade and enables higher precision processing, and An ink jet head manufacturing method can be provided.

Sectional drawing which shows the structure of the dicing blade used in the manufacturing method of the head chip of this invention Sectional drawing which shows the cutting process using the said dicing blade Side view showing the structure of the ceramic substrate (A) is a perspective view of a ceramic substrate for explaining how a channel is formed, and (b) is a cross-sectional view in a direction orthogonal to the channel of the ceramic substrate on which the channel is formed. Enlarged view of the channel part of the ceramic substrate with electrodes Cross-sectional view of laminated substrate with 6 ceramic substrates (A) (b) is sectional drawing which shows other embodiment of the laminated substrate which laminated | stacked six ceramic substrates. Cross-sectional view of a laminated board with cutting waste discharge grooves Plan view of laminated substrate with cutting waste discharge grooves formed Front view of a ceramic substrate with channels composed of ink channels and air channels Sectional drawing explaining a mode that a laminated substrate is cut | disconnected Partially enlarged plan view for explaining how cutting waste flows when cutting a laminated substrate Sectional drawing which shows an example of the inkjet head manufactured by this invention Rear view of head chip in inkjet head Front view of wiring board in inkjet head The perspective view of the ceramic substrate explaining a mode that the channel which concerns on other embodiment is formed (A) is a top view of the laminated substrate in which the groove | channel concerning other embodiment was formed, (b) is sectional drawing which follows the bb line in (a). Sectional drawing which shows the other example of a structure of the dicing blade used in this invention. Sectional drawing which shows the further another example of a structure of the dicing blade used in this invention. The front view which shows the structure of the dicing blade used in the manufacturing method of the conventional head chip.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
An ink jet head has a head chip in which a plurality of channels serving as ink flow paths are formed in parallel and a partition that drives between the channels is driven, and a plurality of nozzles are formed and each nozzle is associated with each channel. It has a bonded nozzle plate, and a wiring substrate on which a wiring pattern for supplying power to the partition is formed and bonded to the head chip. In the head chip manufacturing method of the present invention, a ceramic substrate constituting the head chip is cut or cut using a dicing blade.

[Configuration of dicing blade]
FIG. 1 is a cross-sectional view showing the configuration of a dicing blade used in the head chip manufacturing method of the present invention.

  As shown in FIG. 1, the dicing blade A has a disk-shaped base metal 9 and is configured in a disk shape. In the dicing blade A, the central portion of the disk-shaped base metal 9 is attached to the tip end side of the rotating shaft (spindle shaft) 8 of the dicing saw, and is rotated through the rotating shaft 8. One flange 81 of a pair of disk-shaped flanges 81 and 82 is attached to the distal end side of the rotary shaft 8, and then inserted into the center hole 9 b of the disk-shaped base metal 9. It is attached by a nut 83. The disc-shaped base metal 9 of the dicing blade A is fixed to the distal end side of the rotary shaft 8 with both sides on the center side sandwiched between a pair of flanges 81 and 82.

  The dicing blade A is configured by forming an annular blade portion 91 made of an abrasive layer over the entire circumference on both sides of the periphery of the disc-shaped base metal 9. The annular blade portion 91 is configured by brazing abrasive grains on a disk-shaped base metal 9. As the abrasive grains, ultrahard abrasive grains such as diamond and hexagonal boron nitride are used. A resin or a metal film formed by a vapor phase method is sometimes used for brazing, but an electroformed film is often used for brazing abrasive grains.

  The electroformed abrasive grain type annular blade portion 91 is formed by providing an electroformed layer on the surface of the disk-shaped base metal 9 and embedding abrasive grains in the electroformed layer. The annular blade portion 91 can be formed by electroforming in a known electroforming bath, for example, a nickel plating bath such as a watt bath, a sulfamic acid bath, or an electroless bath. For the electroformed layer, a hard metal or an alloy, for example, a Ni metal or a known nickel-based metal such as a Ni—Co alloy, a Ni—W alloy, or a Ni—P alloy can be suitably used. The hardness of these nickel-based metals is generally about 150 to 600 Hv. The optimum embedding rate of the abrasive grains itself varies depending on the use of the annular blade 91, but is a relatively high embedding rate such as 60 to 70%, 70 to 80%, 80 to 90%, 90 to 100%. The embedding rate is the average thickness of the electroformed layer with respect to the average grain size of the abrasive grains.

  In the dicing blade A, the inner peripheral side portion 9 a where the circular blade portion 91 of the disk-shaped base metal 9 is not formed is thinner than the peripheral edge portion including the circular blade portion 91. This difference in thickness is a thickness corresponding to the total thickness of the annular blade portions 91 on both sides. The thickness of the annular blade portion 91 is, for example, about 5 μm to 20 μm. The thickness of the disk-shaped base metal 9 is, for example, about 200 μm to 400 μm.

  The cutting or cutting of the ceramic substrate 10 using the dicing blade A is preferably performed by adhering and fixing the ceramic substrate 10 on the resin dicing sheet 7. In this case, the ceramic substrate 10 is cut or cut by making the dicing blade A enter the fixed ceramic substrate 10 while rotating the dicing blade A from the opposite side of the dicing sheet 7.

  In the dicing blade A, the radial width a of the annular blade portion 91 is narrower than the cutting depth b of the ceramic substrate 10 to be cut. The width a in the radial direction is preferably about (1/2) times or less the cutting depth b of the ceramic substrate 10. The radial width a is, for example, about 300 μm (when the cutting depth b of the ceramic substrate 10 is 600 μm or more).

  As described above, the inner peripheral side portion 9a of the disk-shaped base metal 9 is thinner than the peripheral side portion, and the radial width a of the annular blade portion 91 is narrower than the cutting depth b of the ceramic substrate 10. A gap is generated between the two cutting surfaces 10 b and 10 b by the annular blade portion 91 and the inner peripheral side portion 9 a of the disk-shaped base metal 9. The cutting waste 10a stays in the gap and is discharged as the dicing blade A rotates. Since the cutting waste 10a stays in the gap, the cutting surfaces 10b and 10b are not further cut. Therefore, according to the dicing blade A, the thick ceramic substrate 10 can be cut with high accuracy. That is, both the cutting surfaces 10b and 10b formed by the double-sided annular blade portions 91 are planes that are accurately parallel to each other. Regarding the parallelism of both the cutting surfaces 10b and 10b, the difference in thickness between one end and the other end of the head chip to be manufactured is, for example, less than 10 μm.

  Therefore, in this head chip manufacturing method, variation in the shape of the channel 13 is suppressed, variation in ejection performance between nozzles of the inkjet head, adhesion failure of the nozzle plate adhered to the head chip, adhesion to the head chip. Bonding failure and conduction failure of the wiring board to be performed can be suppressed.

  The dicing blade described in Patent Document 3 described above is intended to suppress the extension of the disk-shaped base metal by the blade portion, so that the radial width of the annular blade portion becomes narrower than the cutting depth. Is not assumed, and the effect of increasing the machining accuracy by avoiding the influence of cutting chips cannot be obtained.

  In the dicing blade A, it is preferable that a peripheral blade portion 91 a made of an abrasive grain layer is also formed on the peripheral side surface of the disk-shaped base metal 9. The peripheral blade portion 91a is formed by the same material and forming method as the annular blade portion 91. By forming the peripheral blade portion 91a, the disc-shaped base metal 9 is not moved and the cutting position is not shifted, and the ceramic substrate 10 is not cut obliquely.

  Further, the peripheral blade portion 91 a is formed flat along the peripheral side surface of the disk-shaped base metal 9. Since the peripheral edge 91a is formed flat, no burrs remain on the cutting surface.

  FIG. 2 is a cross-sectional view showing a cutting process using the dicing blade A. FIG.

  As shown in FIG. 2, in the dicing blade A, the radial width a of the annular blade portion 91 is narrower than the cutting depth of the ceramic substrate 10 (that is, the thickness of the ceramic substrate 10) b (a <b ) And that the peripheral edge 91a is formed flat is also effective in the step of cutting the ceramic substrate 10. In order to cut the ceramic substrate 10, the ceramic substrate 10 is adhered and fixed on the resin dicing sheet 7, and the dicing blade A enters the ceramic substrate 10 from the opposite side of the dicing sheet 7. At this time, the ceramic substrate 10 is cut and a part of the dicing sheet 7 is cut.

  The cutting depth c with respect to the dicing sheet 7 at this time is preferably smaller than the radial width a of the annular blade portion 91. The thickness of the dicing sheet 7 is generally about 100 μm to 200 μm. The cutting depth c with respect to the dicing sheet 7 is, for example, a thickness obtained by subtracting about 30 μm to 100 μm from the thickness of the dicing sheet 7.

  When the cutting depth c with respect to the dicing sheet 7 is larger than the radial width a of the annular blade portion 91, that is, when the entire width of the annular blade portion 91 falls out to the opposite side of the ceramic substrate 10, dicing is performed. Since the sheet 7 is softer than the ceramic substrate 10, the peripheral portion of the dicing blade A is not stable, and there is a possibility that the resin material forming the dicing sheet 7 may vibrate. There is a possibility that the interval between the two cut surfaces 10b, 10b formed by the annular blade portion 91 becomes wider. By making the cutting depth c with respect to the dicing sheet 7 smaller than the radial width a of the annular blade portion 91, the peripheral portion of the dicing blade A is stabilized and the thick ceramic substrate 10 is cut with high accuracy. The two cut surfaces 10b, 10b formed by the annular blade portions 91 on both sides are formed into planes that are accurately parallel to each other.

  Also in this cutting step, the cutting waste 10a stays in the gap between the two cutting surfaces 10b, 10b by the double-sided annular blade portion 91 and the inner peripheral side portion 9a of the disk-shaped base metal 9, and the cutting surface 10b. , 10b is not further cut. Therefore, according to the dicing blade A, the thick ceramic substrate 10 can be cut with high accuracy. That is, both the cut surfaces 10b and 10b formed by the double-sided circular blade portions 91 are planes that are exactly parallel to each other.

In this dicing blade A, the arithmetic average roughness Ra of the surface of the disc-shaped base metal 9 sandwiched by the flanges 81 and 82 is equal to or greater than the arithmetic average roughness of the surface of the annular blade portion 91 (0.2-0. 3 μm or more) is preferable. The arithmetic average roughness Ra is a parameter representing the surface roughness obtained based on JIS (Japanese Industrial Standards) B0601: 1994, and is specifically expressed by the following equation.

  When the arithmetic average roughness Ra of the surface of the sandwiched portion by the flanges 81 and 82 is equal to or greater than the arithmetic average roughness of the surface of the annular blade portion 91, the dicing blade A is in a process of cutting or cutting the ceramic substrate 10, The idling of the flanges 81 and 82 is prevented from starting.

  Further, the dicing blade A has a maximum static frictional force moment (maximum static frictional force × distance from the center of rotation) between the surface of the sandwiched portion of the disc-shaped base metal 9 by the flanges 81 and 82 and the flanges 81 and 82. It is preferable that the dynamic friction force moment between the surface of the annular blade portion 91 and the ceramic substrate 10 (dynamic friction force × distance from the center of rotation) is greater than or equal to.

  Since the maximum static frictional force moment between the surface of the sandwiched portion by the flanges 81 and 82 and the flanges 81 and 82 is greater than or equal to the dynamic frictional moment between the surface of the annular blade portion 91 and the ceramic substrate 10, the dicing blade A does not start idling with respect to the flanges 81 and 82 in the process of cutting or cutting the ceramic substrate 10.

[Head chip manufacturing process]
An example of the head chip manufacturing method of the present invention will be described with reference to FIGS.
FIG. 3 is a side view showing the configuration of the ceramic substrate.

  First, as shown in FIG. 3, a ceramic substrate that constitutes a head chip having two piezoelectric element substrates 12a and 12b that are respectively polarized and bonded to a substrate 11 made of ceramics and having a piezoelectric element layer on the surface. 10 is created.

  As the piezoelectric material used for each of the piezoelectric element substrates 12a and 12b, a known piezoelectric material that deforms when a voltage is applied, for example, lead zirconate titanate (PZT) can be used. The two piezoelectric element substrates 12a and 12b are laminated with their polarization directions (indicated by arrows) opposite to each other, and are bonded to the substrate 11 using an adhesive.

[Channel formation process (cutting process)]
FIG. 4A is a perspective view of a ceramic substrate for explaining how a channel is formed, and FIG. 4B is a cross-sectional view in a direction perpendicular to the channel of the ceramic substrate on which the channel is formed.

  As shown in FIG. 4, this head chip manufacturing method includes a step of forming a plurality of grooves constituting a plurality of channels 13 in the ceramic substrate 10. This step can be performed by cutting using a dicing blade A which is a rotary blade, but may be performed by other methods. In the case where the dicing blade A is used, in this step, a plurality of parallel channels 13 are formed in a groove shape using the dicing blade A from the surface of the ceramic substrate 10 to the two piezoelectric element substrates 12a and 12b. Cutting.

  As a result, drive walls 14 made of piezoelectric elements whose polarization directions are opposite to each other in the height direction are arranged in parallel between adjacent channels 13.

  When this process is performed using the dicing blade A described above, the width of the groove constituting the channel 13 can be cut with high accuracy. That is, both side walls of the width are formed as planes that are exactly parallel to each other.

  Here, since the channel 13 extending from the front of one end of the ceramic substrate 10 to the front of the other end is formed, both ends in the length direction of the channel 13 do not reach the end of the ceramic substrate 10, and the ceramic It is not open to the side of the substrate 10.

  Although not shown, the piezoelectric element substrate 12b is made thick instead of using the substrate 11, and the channel 13 is cut from the thin piezoelectric element substrate 12a side to the middle portion of the thick piezoelectric element substrate 12b. A portion of the substrate 11 may be integrally formed by the piezoelectric element substrate 12b simultaneously with the formation of the drive wall 14 whose polarization direction is opposite in the height direction.

[Electrode formation process]
FIG. 5 is an enlarged view of a channel portion in a ceramic substrate on which electrodes are formed.
In this head chip manufacturing method, in the step of cutting the ceramic substrate 10, the ceramic substrate 10 before cutting is formed with grooves constituting the plurality of channels 13 as described above. The electrode 15 for supplying electric power to the piezoelectric element that causes the volume change of the channel 13 is formed.

  That is, as shown in FIG. 5, the electrode 15 is formed on the inner surface of each channel 13.

  Ni, Co, Cu, Al, or the like can be used as the metal forming the electrode 15, and Al or Cu is preferably used from the viewpoint of electrical resistance, but Ni is preferably used from the viewpoint of corrosion, strength, and cost. Alternatively, a laminated structure in which Au is further laminated on Al may be employed. Examples of the method of forming the electrode 15 include a method of forming a metal film by a method using a vacuum apparatus such as a vapor deposition method, a sputtering method, and a CVD (chemical vapor reaction method) in addition to a plating method.

  Since the electrode 15 needs to be independent for each channel 13, a metal film is not formed on the upper end surface of the drive wall 14. For this reason, for example, a dry film is attached in advance to the upper end surface of each drive wall 14 or a resist film is formed, and after the metal film is formed, these are removed to form the inside of the channel 13. Electrodes 15 are selectively formed on the side surfaces of the respective drive walls 14 facing and the bottom surfaces of the respective channels 13.

  In the following description of the head chip manufacturing process, the electrode 15 is not shown.

[Laminated substrate manufacturing process]
FIG. 6 is a cross-sectional view of a laminated substrate in which six ceramic substrates are laminated.

  Next, a multilayer substrate 20 that is a laminate of the ceramic substrates 10 is produced by laminating a plurality of ceramic substrates 10 thus produced (six in this case).

  The laminated structure of the plurality of ceramic substrates 10 is not particularly limited. For example, as shown in FIG. 6, the open surfaces on the upper surface of the channel 13 are aligned in the same direction and the length direction of the channel 13 is aligned three by three. A laminated substrate 20 having six rows of channels 13 is formed by forming a set, with the upper surface of the channel 13 of the uppermost layer of each set facing each other, and sandwiching a cover substrate 16 made of ceramics therebetween, and integrally bonding them. Can be produced.

  7A and 7B are cross-sectional views showing another embodiment of a laminated substrate in which six ceramic substrates are laminated.

  In addition, as shown in FIG. 7A, the open surfaces of the channels 13 of the ceramic substrates 10 are all aligned in the same direction, and the open surfaces of the channel 13 of the outermost layer are covered with the cover substrate 16. By doing so, the laminated substrate 20 having six channel rows may be formed. Further, as shown in FIG. 7B, three sets of laminated bodies having two channel rows with the open surfaces of the channels 13 of the two ceramic substrates 10 facing each other and the cover substrate 16 sandwiched therebetween are used. Alternatively, the laminated substrate 20 having six channel rows may be formed.

[Cutting waste discharge groove forming process]
FIG. 8 is a cross-sectional view of the laminated substrate in which the cutting waste discharging groove is formed, and FIG. 9 is a plan view of the laminated substrate in which the cutting waste discharging groove is formed.

  In this head chip manufacturing method, in the step of cutting the ceramic substrate, it is preferable to form a plurality of cutting waste discharge grooves 21 in the ceramic substrate before cutting. That is, as shown in FIGS. 8 and 9, the cutting waste discharge groove 21 having a predetermined depth is formed in the multilayer substrate 20.

  Here, the cutting waste discharging groove 21 was formed in the laminated substrate 20 shown in FIG. The cutting waste discharging groove 21 is in a direction intersecting with the channel 13 from one surface (upper surface in FIG. 8) of the laminated substrate 20 to the other surface (lower surface in FIG. 8), preferably the length of the channel 13. It is formed along a direction orthogonal to the direction (left and right direction in FIGS. 8 and 9).

  The cutting waste discharging groove 21 is preferably formed using a dicing blade (not shown) so as to extend over all the channels 13 of the laminated substrate 20, and from the surface of the uppermost ceramic substrate 10 in FIG. The depth is reached to reach the channel 13 of the lower ceramic substrate 10, and preferably the depth is equal to or greater than the depth of the channel 13 of the lowermost ceramic substrate 10.

  Here, the depth equal to or greater than the depth of the channel 13 is a depth equal to or greater than the depth from one surface of the laminated substrate 20 to the bottom surface of the channel 13 of the lowermost ceramic substrate 10. The bottom surface of the channel 13 is a lower surface in the channel 13 of the laminated substrate 20 at a portion where the cutting waste discharging groove 21 is formed. The laminated substrate 20 shown in FIG. 8 has a tapered portion 13a in which both ends of the channel 13 gradually become shallow grooves. When the cutting waste discharging groove 21 is formed at the position of the tapered portion 13a, the lowermost layer is formed. The surface of the tapered portion 13 a in the channel 13 of the ceramic substrate 10 becomes the bottom surface of the channel 13.

  7A, the cover substrate 16 is disposed in the lowermost layer. In this case, the bottom surface of the channel 13 of the lowermost ceramic substrate 10 is the upper surface 16a of the cover substrate 16. (Surface facing the channel 13).

  FIG. 10 is a front view of a ceramic substrate in which the channel is composed of an ink channel and an air channel.

  Furthermore, some head chips have ink channels that eject ink and air channels that do not eject ink alternately arranged in parallel. In this case, the channels of the ceramic substrate 10 may be formed such that the depth of the air channel 132 is deeper than the depth of the ink channel 131, as shown in FIG. When the ceramic substrate 10 having the ink channels 131 and the air channels 132 having different depths is laminated as shown in FIGS. 6 and 7B, the bottom surface of the channel 13 is the ceramic substrate in the lowermost layer. 10 is the bottom surface of the air channel 132 having a deeper depth.

  This cutting waste discharging groove 21 is for preventing the cutting waste generated at the time of full cutting of the laminated substrate 20 described later from being clogged in the channel 13. By setting the cutting waste discharge groove 21 to a depth equal to or greater than the depth from one surface of the multilayer substrate 20 to the bottom surface of the channel 13 of the lowermost ceramic substrate 10, the cutting waste discharge groove 21 allows all the channels 13 in each row to be formed. Since it cut | disconnects completely over the thickness direction of the laminated substrate 20, the discharge | emission of the cutting waste generated in the cutting process mentioned later can be made the most favorable. Further, since the cutting waste discharge groove 21 can be formed only from one surface (upper surface of the uppermost layer) of the laminated substrate 20, there is an advantage that the operation of forming the cutting waste discharge groove 21 can be simplified.

  The cutting waste discharge grooves 21 are formed at a predetermined interval along the length direction of the channel 13. The number of cutting waste discharge grooves 21 is appropriately set according to the length of the channel 13 of the head chip to be manufactured (interval of the cutting site). The number of cutting waste discharge grooves 21 is preferably two or more. However, since the portion of the cutting waste discharge groove 21 in the laminated substrate 20 becomes an unnecessary portion after the head chip 1 is cut out, if the number is too large. The number of head chips 1 is reduced. Therefore, it is preferable that the number of the cutting waste discharge grooves 21 is about 4 to 5. The width of the cutting waste discharge groove 21 is defined by the width cut by the dicing blade.

  In this head chip manufacturing method, cutting waste generated at the time of cutting by the dicing blade A in a cutting step described later is discharged through the cutting waste discharge groove 21. By using the dicing blade A described above, the cutting waste is reduced as compared with the prior art, so that the cutting waste discharge groove 21 is hard to be blocked, and the discharge of the cutting waste is stable and can be stably cut.

  It is preferable to use a dicing blade A that is used when the laminated substrate 20 is fully cut in a cutting process, which will be described later, as the processing blade for processing the cutting waste discharging groove 21. Thereby, it can transfer to a cutting process immediately after formation of the cutting waste discharge groove 21.

  When each cutting waste discharging groove 21 is recessed in the depth direction from the upper surface of the multilayer substrate 20, at least one end in the length direction (vertical direction in FIG. 9) is set to the side of the multilayer substrate 20 (FIG. 9 is preferably formed so as to open upward or downward in FIG. Thereby, the cutting waste generated at the time of full cutting can be discharged to the outside from the side of the multilayer substrate 20 (the ceramic substrates 10) through the cutting waste discharge groove 21.

  Further, each cutting waste discharge groove 21 is formed so as to completely traverse from one end of the laminated substrate 20 to the other end as shown in FIG. It is more preferable to form both ends open to the side of the laminated substrate 20 because the chips can be discharged more smoothly to the outside.

[Cutting process (head chip cutting)]
FIG. 11 is a cross-sectional view for explaining a state of cutting the laminated substrate.

  Next, as shown in FIG. 11, the laminated substrate 20 is fully cut at a plurality of cutting sites C arranged at predetermined intervals along a direction orthogonal to the length direction of the channel 13 using a dicing blade A. By cutting (cutting), a plurality of head chips 1 whose channel 13 has a predetermined length are cut out.

  Here, a plurality of cut portions C are provided at the same pitch P with respect to the laminated substrate 20 shown in FIG. 8, so that the lengths of the channels 13 of the head chip 1 to be cut out are the same at the pitch P. I have to. However, in the present invention, a plurality of types of head chips 1 having different lengths of the channels 13 may be cut out from one laminated substrate 20 by making the intervals of the plurality of cutting portions C different.

  One of the cut surfaces of the dicing blade A is a nozzle plate bonding surface (front surface 1a) to which the nozzle plate is bonded. The nozzle plate is a flat plate on which a plurality of nozzles are formed, and is bonded to the head chip 1 with each nozzle corresponding to each channel 13. The other of the cut surfaces by the dicing blade A is a wiring board bonding surface (rear surface 1b) to which the wiring board is bonded. In the present invention, at least one of the nozzle plate bonding surface (front surface 1a) and the wiring board bonding surface (rear surface 1b) may be cut out using the dicing blade A described above, but it is particularly preferable to cut out both surfaces.

  In this head chip manufacturing method, by using the dicing blade A described above, variation in the L length (the length of the channel 13) in the head chip 1 can be reduced, and variation in head performance between the channels 13 can be suppressed. Can do. In addition, poor adhesion of the nozzle plate, poor adhesion of the wiring board, and poor conduction can be suppressed. Further, by using the dicing blade A described above, the amount of wall cutting is reduced, so that the damage to the electrode 15 is reduced. That is, in the past, there was a risk that the electrode 15 would peel off if the conditions were bad, but such a situation can be reduced.

  When both the cutting process for forming the grooves constituting the channel 13 and the cutting process for cutting in the direction orthogonal to the length direction of the channel 13 are performed using the dicing blade A described above, the channel 13 is The width of the groove to be formed can be cut with high precision, the length of the channel 13 (L length) can be cut with high precision, and these processes can be performed using the same dicing blade A. Can be processed quickly and easily.

  In this cutting step, cutting is performed while injecting liquid near the dicing blade A. Liquid ejecting nozzles N and N are arranged in the vicinity of the dicing blade A, respectively, and liquid is directed from the liquid ejecting nozzles N and N toward the surface of the dicing blade A or the cutting portion of the laminated substrate 20 cut by the dicing blade A. Spray. It is preferable to use water as the liquid.

  FIG. 12 is a partially enlarged plan view illustrating a state in which cutting waste flows when cutting the laminated substrate.

  By jetting the liquid during the full cut in this way, most of the cutting waste cut by the dicing blade A is blown away by the liquid, but some of the cutting waste together with the liquid enters each channel 13 from the cut surface. Break into. However, since each channel 13 faces the cutting waste discharge groove 21, the liquid containing the cutting waste enters the cutting waste discharge groove 21 from the channel 13 as shown by the arrow in FIG. Since it is discharged to the outside through the groove 21, it is prevented from staying in the channel 13. Therefore, it is possible to prevent the cut surface from becoming non-uniform due to clogging of the chips with the channel 13.

  In particular, as shown in the present embodiment, when the cutting waste discharge groove 21 is also open to the side of the laminated substrate 20, the liquid containing cutting waste entering the cutting waste discharge groove 21 is the cutting waste discharge groove 21. Therefore, it is possible to more reliably prevent the channel 13 from being clogged.

  As shown in FIG. 11, the cutting process by the dicing blade A is preferably performed on the same surface as the surface on which the formation of the cutting waste discharge groove 21 is started with respect to the laminated substrate 20. When the same dicing blade A is used in the cutting waste discharge groove forming step and the cutting step, it is not necessary to move the laminated substrate 20 after forming the cutting waste discharge groove 21 on the laminated substrate 20, and the cutting step is performed as it is. The work process can be simplified.

  There are at least two cutting portions C to be cut by the dicing blade A between the adjacent cutting waste discharge grooves 21 in the laminated substrate 20. Thereby, in any cutting part C, cutting waste can be discharged by at least one of the two adjacent cutting waste discharge grooves 21.

  As shown in FIG. 11, the cutting part C is arranged at a part different from the cutting waste discharging groove 21 in the laminated substrate 20. That is, in the cutting waste discharge groove forming step, the cutting waste discharge groove 21 is formed only at a position excluding the cutting portion C assumed in the subsequent cutting step. Thereby, when the head chip 1 is cut out, a flat cut surface in which the cutting waste discharging groove 21 is not formed is obtained.

  Further, as shown in FIG. 11, the distance d between one cutting waste discharge groove 21 and the cutting portion C closest to the cutting waste discharge groove 21 is a predetermined length of the channel 13 of the head chip 1 (here, P Shorter than). That is, in the cutting waste discharge groove forming step, the cutting waste discharge groove 21 formed at a position adjacent to the cutting portion C assumed in the subsequent cutting step is the same as the cutting portion C closest to the cutting waste discharge groove 21. The distance d is arranged at a position where the distance d is shorter than a predetermined length of the channel 13 of the head chip 1. Thereby, the discharge property of cutting waste is improved. In addition, it is possible to reduce waste due to discarding the portion of the laminated substrate 20 in which the cutting waste discharging groove 21 is formed.

  In the cutting step, when the multilayer substrate 20 is fully cut at a plurality of cutting sites C, the cutting site C at one end in the direction in which the cutting sites C are arranged (for example, the cutting site C at the left end in FIG. 11) is the first. It is preferable to cut into two in terms of improving the subsequent workability. In this case, it is preferable that the cutting waste discharging groove 21 is arranged outside the first cutting site C. That is, in the cutting waste discharge groove forming step, at least one cutting waste is discharged outside the cutting portion C at one end of the plurality of cutting portions C assumed in the subsequent cutting step. A groove 21 is formed.

  As a result, the distance d between the cutting portion C to be cut first, preferably the distance d from the cutting portion C at the end, becomes shorter than the predetermined length of the channel 13 of the head chip 1. With the cutting waste discharging groove 21 disposed, the cutting waste can be effectively discharged and a flatter cut surface can be obtained.

  Moreover, since the cutting waste discharging groove 21 can be formed in an unnecessary portion of the end portion of the multilayer substrate 20, the head chip 1 can be cut out efficiently without waste.

  Moreover, the cutting waste discharge groove | channel 21 formed in this way outside the cutting | disconnection site | part C is each formed in the outer side of the cutting | disconnection site | parts C and C of the both ends of the arrangement direction of the some cutting | disconnection site | part C, as shown in FIG. It is also preferable. As a result, the cut surfaces of the cut portions C and C at both ends can be made flatter cut surfaces where the cutting waste discharging grooves 21 are not formed, and the head chip 1 can be cut out more efficiently and efficiently.

  According to the present invention, when the ceramic substrate 10 is cut or cut by the dicing blade A, the head chip that reduces the influence of cutting waste between the ceramic substrate 10 and the dicing blade A and enables high-precision processing. The manufacturing method of can be provided.

  In the present invention, by using the above-described dicing blade A, it is possible to perform processing with higher accuracy in the head chip groove processing and chip cutting processing.

  Further, since the influence of the cutting waste is reduced by using the dicing blade A of the present invention, damage to the electrode 15 is caused in chip cutting processing of the ceramic substrate 10 provided with the electrode 15 such as a shear mode harmonica head. Can be reduced.

[Configuration example of inkjet head]
An example of an ink jet head using the head chip 1 manufactured as described above will be described with reference to FIGS.

  FIG. 13 is a cross-sectional view showing an example of an inkjet head manufactured according to the present invention.

  As shown in FIG. 13, the inkjet head H has a nozzle plate 2 bonded to the front surface (nozzle plate bonding surface) 1a of the head chip 1, and a wiring substrate 3 connected to the rear surface (wiring substrate bonding surface) 1b of the head chip 1. It is joined. In the nozzle plate 2, nozzles 2 a are formed at positions corresponding to the respective channels 13 of the head chip 1.

  The head chip 1 manufactured using the dicing blade A by the head chip manufacturing method according to the present invention has a uniform cut surface (front surface 1a, rear surface 1b), so that the nozzle plate 2 and the wiring substrate 3 can be made highly accurate. Can be joined. Thereby, the workability in the next process of the manufacturing process of the head chip 1 can be improved, and the yield failure can be improved by suppressing the adhesion failure of the nozzle plate, the adhesion failure and the conduction failure of the wiring board.

  On the rear surface 1b of the head chip 1, lead electrodes 17 are formed so as to correspond to the respective channels 13 on a one-to-one basis. One end of each extraction electrode 17 is electrically connected to the electrode 15 in each channel 13.

  In addition, this inkjet head H has shown the aspect using the head chip 1 cut out from the laminated substrate 20 of FIG.7 (b).

  FIG. 14 is a rear view of the head chip in the inkjet head.

  As shown in FIG. 14, the lead-out electrodes 17 corresponding to the respective channels 13 of the channel rows of the A row and the F row located on the outermost side of the channel rows formed on the head chip 1 are arranged on the rear surface of the head chip 1. 1b extends toward the upper end or the lower end, respectively, but the lead electrode 17 led out from each channel 13 of the B-row channel row located inside, and each channel 13 of the adjacent C-row channel row The lead-out electrodes 17 led out from are extended in opposite directions, and are arranged so as not to be short-circuited between the B-row channel row and the C-row channel row. Furthermore, the extraction electrode 17 drawn out from each channel 13 of the D-row channel row and the extraction electrode 17 drawn from each channel 13 of the adjacent E-row channel row extend in directions facing each other. , The D-row channel row and the E-row channel row are arranged so as not to short-circuit each other.

  As shown in FIGS. 13 and 14, the wiring substrate 3 is bonded to the rear surface 1b of the head chip 1 with a predetermined width along the outer peripheral edge of the rear surface 1b. The wiring board 3 is made of an insulating material such as glass or ceramics, has a size that protrudes from the periphery of the rear surface 1b of the head chip 1 to the side, and corresponds to each channel 13 facing the rear surface 1b of the head chip 1. A rectangular opening 31 is formed. Therefore, the inlets of all the channels 13 of the head chip 1 are communicated rearward through any of the openings 31.

  FIG. 15 is a front view of the wiring board in the inkjet head.

  As shown in FIGS. 13 and 15, the surface of the wiring substrate 3 (bonding surface with the rear surface 1 b of the head chip 1) corresponds to the extraction electrode 17 extracted from each channel 13 of each channel row of the head chip 1. The wiring electrodes 32 are patterned from the peripheral edge of the opening 31 to the outer peripheral edge of the wiring substrate 3 at a pitch of the same. The wiring board 3 is aligned so that these wiring electrodes 32 are electrically connected to the extraction electrodes 17 of each channel row, and is adhered to the rear surface 1b using, for example, an anisotropic conductive film or the like. .

  As a result, the electrodes 15 in each channel 13 of each channel row are respectively drawn out to the side of the head chip 1 by the lead electrodes 17 and the wiring electrodes 32 of the wiring board 3. One end of the FPC 6 for applying a drive signal from a drive circuit (not shown) to the electrode 15 in each channel 13 of each channel row is connected to the wiring electrode 32 of the wiring board 3, for example, anisotropic conductive It is electrically connected by bonding using a film or the like.

  Thereby, a drive signal from the drive circuit can be applied to the electrode 15 of each channel 13 of the head chip 1 via the FPC 6, and the inkjet head H having the high-density head chip 1 can be simply configured. Can do.

  As shown in FIG. 13, the common flow path member 5 has a box shape having an opening on the surface facing the rear surface 1 b of the head chip 1 and having a size equivalent to the outer shape of the wiring board 3. The common flow path member 5 is bonded to the rear surface of the wiring board 3, thereby providing a common flow path 51 for supplying ink in common to all the channels 13 communicating through the openings 31 of the wiring board 3. Forming a space.

[Other Embodiments]
FIG. 16 is a perspective view of a ceramic substrate for explaining the formation of a channel according to another embodiment.

  In the above description, the channel 13 in the head chip 1 is formed so as to extend from the front of one end of the ceramic substrate 10 to the front of the other end. However, in the present invention, as shown in FIG. By forming the substrate 10 so as to completely traverse from one end to the other end, both ends of the channel 13 in the length direction may be opened to the sides of the ceramic substrate 10, respectively. In this case, since the liquid containing the cutting waste generated in a cutting process can be discharged outside using the end of each channel 13, it is preferred.

  FIG. 17A is a plan view of a laminated substrate in which grooves according to another embodiment are formed, and FIG. 17B is a cross-sectional view taken along line bb in FIG.

  In the above description, the cutting waste discharging grooves 21 are formed so as to completely traverse from one side end to the other side end of the multilayer substrate 20, so that both ends in the length direction are respectively lateral to the multilayer substrate 20. Although formed so as to be opened, as shown in FIG. 17, both ends in the length direction are formed by forming the cutting waste discharging groove 21 from the front of one end of the laminated substrate 20 to the front of the other end. May be formed so as not to open to the side of the laminated substrate 20.

  In this case, the cutting waste discharge groove 21 is opened only to the upper surface side where the formation of the cutting waste discharge groove 21 in the laminated substrate 20 is started, but the cutting waste generated in the cutting process is discharged together with the liquid. Since it is received in the groove 21 and can be discharged further to the upper surface side, clogging of cutting waste in each channel 13 is prevented.

  In the above description, the cutting waste discharging groove 21 is formed from one surface to the other surface. However, the groove may be formed along the direction intersecting the channel 13 from the surface of the laminated substrate 20, For example, in FIG. 11, grooves reaching the surface of the cover substrate 16 from the upper surface and the lower surface of the multilayer substrate 20 along the direction intersecting the channel 13 may be formed.

  As described above, the cutting waste discharging groove 21 is preferably formed so that each channel 13 of the laminated substrate 20 communicates with the outside of the laminated substrate 20 via one or a plurality of grooves. It is possible to cut the cutting waste entering the inside 13 while discharging it together with the liquid to the outside of the laminated substrate 20 through the cutting waste discharge groove 21.

  Further, the cutting waste discharging groove 21 may be formed in a direction (a direction from the front side to the back side in FIG. 11) intersecting with the stacking direction of the multilayer substrate 20 (vertical direction in FIG. 11).

  Furthermore, in the above description, the head chip 1 having six channel rows is produced by laminating six ceramic substrates 10, but the number of laminated ceramic substrates 10 is one or (other than six). A) A plurality of sheets may be used. In particular, when the laminated substrate 20 having three or more channel rows is fully cut by laminating three or more ceramic substrates 10, the non-uniformity of the cut surface due to the generated cutting waste appears remarkably. Therefore, the present invention can be preferably applied when the head chip 1 is manufactured from the laminated substrate 20 in which three or more ceramic substrates 10 are laminated.

  Furthermore, in the above description, after the channels 13 are formed on the ceramic substrate 10 and before the ceramic substrates 10 are laminated, the electrodes 15 are formed in the channels 13. It may be formed by plating or the like in each channel 13 of the head chip 1 cut out from the head chip 1.

  Furthermore, the head chip or the ink jet head manufactured by the head chip manufacturing method or the ink jet head manufacturing method of the present invention is not limited to the one in which the channels 13 are formed in parallel as described above. 13 may be two-dimensionally arranged.

[Other aspects of the dicing blade]
FIG. 18 is a cross-sectional view showing another example of the configuration of the dicing blade used in the present invention.

  In the dicing blade A used in the head chip manufacturing method of the present invention, as shown in FIG. 18, the annular blade portion 91 is made thinner toward the inner peripheral side of the disk-shaped base metal 9, and the outer periphery of the disk-shaped base metal 9 is The surface may be thicker and its surface may be inclined from the inner peripheral side toward the outer peripheral side.

  By thinning the inner peripheral side of the disk-shaped base metal 9 in this way, a gap is generated between the two cutting surfaces 10b, 10b by the double-sided annular blade portion 91 and the annular blade portion 91, and this gap The cutting waste 10a stays. Since the cutting waste 10a stays in the gap, the cutting surfaces 10b and 10b are not further cut and are discharged well. Therefore, both the cutting surfaces 10b, 10b formed by the double-sided annular blade portions 91 are planes that are accurately parallel to each other. In the circular blade portion 91, it is preferable to cut the ceramic substrate 10 with an arc portion when grooving or cutting is performed, and it is preferable not to cut the side surface portion.

  FIG. 19 is a cross-sectional view showing still another example of the configuration of the dicing blade used in the present invention.

  Furthermore, as shown in FIG. 19, the dicing blade A used in the head chip manufacturing method of the present invention is such that the annular blade portion 91 is thinner toward the inner peripheral side of the disk-shaped base metal 9 so that the disk-shaped base metal 9 The outer peripheral side may be thicker and its surface may be stepped from the inner peripheral side to the outer peripheral side.

  Also in this case, a gap is generated between the two cutting surfaces 10b, 10b by the ring blade portions 91 on both sides and the ring blade portion 91, and the cutting waste 10a stays in the space. Since the cutting waste 10a stays in the gap, the cutting surfaces 10b and 10b are not further cut and are discharged well. Therefore, both the cutting surfaces 10b, 10b formed by the double-sided annular blade portions 91 are planes that are accurately parallel to each other.

1: Head chip 1a: Front surface (nozzle plate joint surface)
1b: Rear surface (wiring board bonding surface)
2: Nozzle plate 2a: Nozzle 3: Wiring substrate 31: Opening 32: Wiring electrode 4: Electrode extraction member 4a: Front end surface 4b, 4c: Side surface 41: Second extraction electrode 5: Common flow channel member 51: Common flow channel 52: Rear wall 53: Through hole 6: FPC
7: Dicing sheet 8: Rotating shaft 81: Flange 82: Flange 83: Nut 9: Disc base metal 9a: Inner peripheral portion 9b: Center hole 91: Ring blade portion 91a: Peripheral blade portion 10: Ceramic substrate 11 : Substrate 12a, 12b: Piezoelectric element substrate 13: Channel 13a: Taber surface 14: Drive wall 15: Electrode 16: Cover substrate 16a: Upper surface 17: First extraction electrode 20: Multilayer substrate 21: Cutting waste discharging groove A: Dicing Blade C: Cutting site N: Liquid injection nozzle P: Pitch d: Distance between the groove and the cutting site closest to the groove

Claims (13)

Using a dicing blade, cutting or cutting the ceramic substrate constituting the head chip of the inkjet head,
The dicing blade is formed with an annular blade portion formed of an abrasive layer over the entire circumference on both sides of the periphery of the disc-shaped base metal,
The inner peripheral side portion where the annular blade portion of the disc-shaped base metal is not formed is thinner than the peripheral side portion including the annular blade portion,
A method of manufacturing a head chip, characterized in that a radial width of the annular blade portion is narrower than a cutting depth of the ceramic substrate to be cut or cut. In the step of cutting the ceramic substrate,
The ceramic substrate is adhered and fixed on a resin dicing sheet, and the dicing blade enters the ceramic substrate from the opposite side of the dicing sheet to cut the ceramic substrate and cut a part of the dicing sheet. And
2. The method of manufacturing a head chip according to claim 1, wherein a cutting depth with respect to the dicing sheet is smaller than a radial width of the annular blade portion.   3. The method of manufacturing a head chip according to claim 1, wherein the dicing blade has a peripheral blade portion formed of an abrasive grain layer formed on a peripheral side surface of the disc-shaped base metal.   The method of manufacturing a head chip according to claim 3, wherein the peripheral surface blade portion is formed flat along a peripheral side surface of the disk-shaped base metal. The dicing blade is used by sandwiching and fixing the disk-shaped base metal by a pair of flanges,
5. The arithmetic average roughness of the surface of the sandwiched portion of the disk-shaped base metal by the flange is equal to or greater than the arithmetic average roughness of the surface of the annular blade portion. Manufacturing method of the head chip. The dicing blade is used by sandwiching and fixing the disk-shaped base metal by a pair of flanges,
The maximum static frictional force moment between the surface of the sandwiched portion of the disk-shaped base metal by the flange and the flange is equal to or greater than the dynamic frictional force moment between the surface of the annular blade and the ceramic substrate. 6. A method of manufacturing a head chip according to claim 1, wherein   The annular blade portion is thinner toward the inner peripheral side of the disk-shaped base metal and is thicker toward the outer peripheral side of the disk-shaped base metal, and the surface thereof becomes an inclined surface from the inner peripheral side toward the outer peripheral side. The method for manufacturing a head chip according to claim 1, wherein:   The annular blade portion is thinner toward the inner peripheral side of the disk-shaped base metal, and is thicker toward the outer peripheral side of the disk-shaped base metal, and its surface is stepped from the inner peripheral side toward the outer peripheral side. The method for manufacturing a head chip according to claim 1, wherein: The step of cutting the ceramic substrate includes:
9. A plurality of grooves constituting a plurality of channels are formed in the ceramic substrate, and a plurality of parallel channels and partition walls for driving the channels are formed. Manufacturing method of the head chip. The step of cutting the ceramic substrate includes:
The ceramic substrate is cut to join a nozzle plate joining surface to which a nozzle plate on which a plurality of nozzles are formed is joined, and a wiring substrate on which a wiring pattern for supplying power to partition walls separating a plurality of channels is formed. The method for manufacturing a head chip according to claim 1, wherein at least one of the wiring board bonding surfaces is formed. In the step of cutting the ceramic substrate,
The ceramic substrate before cutting is formed with grooves constituting a plurality of channels, and an electrode for supplying power to a piezoelectric element that causes volume change of the channels is formed on the inner surface of the grooves. The method of manufacturing a head chip according to claim 10. In the step of cutting the ceramic substrate,
The method for manufacturing a head chip according to claim 10 or 11, wherein a plurality of cutting waste discharge grooves are formed in the ceramic substrate before cutting. A step of bonding a nozzle plate having a plurality of nozzles to the head chip driven in parallel by a plurality of channels formed in parallel and separating the channels, the nozzles corresponding to the channels; and
Bonding a wiring board on which a wiring pattern for supplying power to the partition wall is formed on the head chip,
9. At least one of a nozzle plate bonding surface to which the nozzle plate of the ceramic substrate constituting the head chip is bonded and a wiring substrate bonding surface to which the wiring substrate is bonded are defined in any one of claims 1 to 8. A method of manufacturing an ink-jet head, wherein the ink-jet head is formed by cutting using a dicing blade.

Images