JP2018147857A - Connection device, electronic component, and method of manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate the connection of a plurality of circuit boards.SOLUTION: A connection device includes: a first penetrating member 1 which is provided to penetrate through one object to be connected in a thickness direction and at least a surface of which is formed of a conductive material so as to be elastically deformable in a direction crossing this penetration direction; a second penetration member 2 which penetrates through other object to be connected provided at a distance with the one object to be connected in a thickness direction and at least a surface of which is formed of a conductive material so as to be elastically deformable in a direction crossing this penetration direction; and a connecting member 3 which electrically connects the first penetrating member 1 and the second penetration member 2 to each other and which is formed so as to be elastically deformable in the penetration direction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a connection device, an electronic component, and a method for manufacturing the electronic component.

In recent years, high performance, miniaturization, and price reduction of mobile communication devices are rapidly progressing, and there are cases where a plurality of boards are not directly connected with a cable but directly connected with a connector. As a connector used for this purpose, there is one described in Patent Document 1, for example.
The connector described in Patent Document 1 uses pins penetrating through holes of two printed boards. This connector has a configuration in which a pin is elastically deformed using a slot formed in a head portion of the pin to penetrate the through hole, and the pin is connected to two substrate through holes by biasing of a coil spring. It has become.
Further, the connector described in Patent Document 2 has a configuration in which a spring-deformable conductor is inserted and connected to a substrate.

JP-A-4-342194 JP 2006-172986 A

  However, when the connector described in Patent Document 1 is made to correspond to various intervals between substrates to be connected, the degree of freedom of the fitting distance is insufficient, or the positions of both the boards to be fitted are restricted. There is a problem that mounting suitable for miniaturization cannot be performed. In addition, a pin that has been deformed by a minute amount corresponding to the width of the head slit is made to penetrate the substrate, and the umbrella-shaped part prevents the pin from being removed. In order to achieve this, high-precision processing is required. In particular, when the through hole has a small diameter, there is a problem that manufacture becomes difficult.

  Moreover, although the connector described in patent document 2 can be attached to the through-hole of a board | substrate with a simple structure, when trying to connect a some board | substrate mutually, it cannot apply as it is.

  The present invention has been proposed to solve the above-described problems, and an object thereof is to provide a technique for easily connecting a plurality of circuit boards having various arrangements.

In order to solve the above problems, the present invention proposes the following means.
The connection device according to the first aspect of the present invention is provided by penetrating one connected object in the thickness direction, elastically deformable in a direction crossing the penetration direction, and at least the surface thereof being made of a conductive material. Another penetrating member formed between the one penetrating member formed and the one concatenated object in the thickness direction is provided so as to penetrate in the thickness direction. The other penetrating member having at least the surface formed of a conductive material and the one member and the other member are electrically connected to each other so as to be elastically deformable in the intersecting direction, and elastically deformable in the penetrating direction. And a connecting member formed. Further, the electronic device is configured by connecting one substrate and another substrate to each other by the connecting device according to the first aspect.

  The manufacturing method according to the second aspect of the present invention includes a step of arranging one connected object having a through-hole and another connected object at a predetermined relative position, and elasticity to the through-hole of the one connected object. One penetrating member configured to be insertable in a deformed state, another penetrating member configured to be insertable in an elastically deformed state into the through hole of the other connected object, and the one penetrating member and the other penetrating member Passing through the through hole of the one connected object and the other connected object while elastically deforming the connecting member that is elastically deformable between the one connecting member and the other connected member, and the connecting member Passing the through-hole of the one connected object and the other connected object while elastically deforming the member, aligning the one penetrating member with the one connected object, and connecting the other penetrating member to the other Aligning the object to be connected and elastically deforming the connecting member. Characterized in that the production of electronic components comprising the steps of: aligning the reluctant the one of connected object and another object to be conjugate.

  According to the present invention, it is possible to easily connect a plurality of electronic substrates arranged in various ways.

It is a side view which shows the outline | summary of 1st Embodiment of this invention. It is a longitudinal cross-sectional view at the time of connecting between circuit boards with a large mutual space | interval using the connection apparatus which concerns on 2nd Embodiment of this invention. It is a longitudinal cross-sectional view at the time of connecting between circuit boards with a small mutual space | interval using the connection apparatus which concerns on 2nd Embodiment of this invention. It is a longitudinal cross-sectional view at the time of connecting between the circuit boards which shifted | deviated to the surface direction using the connection apparatus which concerns on 2nd Embodiment of this invention. It is an expanded sectional view of the contact of the connecting device concerning a 2nd embodiment of the present invention. It is a longitudinal cross-sectional view at the time of connecting between circuit boards with a large mutual space | interval using the connection apparatus which concerns on 3rd Embodiment of this invention. It is a longitudinal cross-sectional view at the time of connecting between circuit boards with a large mutual space | interval using the connection apparatus which concerns on 3rd Embodiment of this invention.

  A first embodiment showing the minimum configuration of the present invention will be described with reference to FIG. Reference numeral 1 denotes a first penetrating member that is provided so as to penetrate one connected object in the thickness direction, and expands and contracts in the direction intersecting with the penetrating direction, that is, in the left-right direction in FIG. Thus, it is configured to be elastically deformable. The first penetrating member 1 has at least a surface formed of a conductive material. Reference numeral 2 denotes a second penetrating member, which is provided so as to penetrate another connected object provided at an interval in the thickness direction of the one connected object, that is, a direction intersecting with the penetrating direction, that is, , And are configured to be elastically deformable so as to expand and contract in the left-right direction of FIG. The second penetrating member 2 has at least a surface formed of a conductive material.

  Reference numeral 3 denotes a connecting member that electrically and mechanically connects the first penetrating member 1 and the second penetrating member 2. The connecting member 3 is configured to be elastically deformable so as to expand and contract in the penetrating direction, that is, the vertical direction indicated by arrows C and D in FIG.

  In the coupling device of the first embodiment, the first penetrating member 1 and the second penetrating member 2 are elastically deformed so as to contract in the directions of the arrows A and B, so that the connected object such as a circuit board is connected. It can pass through the through hole. Further, after passing through the through hole, it is restored larger than the inner diameter of the through hole and is prevented from coming off from the through hole. The connecting member 3 is elastically deformed in the directions indicated by the arrows C and D, so that the distance between the first penetrating member 1 and the second penetrating member 2 is the distance between the circuit boards as the connected objects (up and down in FIG. 1). Can be adjusted according to the distance in the direction).

Next, a second embodiment will be described with reference to FIGS.
In the second embodiment, the contact 11 corresponding to the first penetrating member 1 and the contact 21 corresponding to the second penetrating member 2 having springiness at both ends as shown in FIG. The first circuit board 4 and the second circuit board 5 are connected using a metal terminal having a contact 31 corresponding to the connecting member 3.

  A through hole penetrating in the thickness direction is formed in the first circuit board 4 and the second circuit board 5, and a metal grommet 6 is fitted in the through hole. In the case of the second embodiment, the inner diameter portion of the grommet 6 is a through hole 41 or 51 that penetrates the first circuit board 4 and the second circuit board 5 (in the case of illustration, a through hole having the same inner diameter and the same length). ).

  The contact 11 and the contact 31 and the contact 21 and the contact 31 are connected to each other by a straight line portion 7. For example, the connecting device according to the second embodiment is formed by forming a conductor plate narrower than the inner diameter of the grommet 6 into a side shape as shown in FIG. The portion 7 is integrally formed and is configured to be elastically deformable in the left-right direction or the vertical direction in FIG.

  In the connecting device having the above-described configuration, the contact 11 is elastically deformed as a spring so that the width (dimension in the left-right direction in FIG. 2) is variable. By being pushed into the hole 41, it is pushed into the through hole 41 along the inclination of the contact 11, and can pass while being elastically deformed in the reduction direction in a vertically long shape. And after inserting in the through hole 41, as shown in FIG. 3, it protrudes upward from the through hole 41, elastically restores the diameter larger than the diameter of the through hole 41, and expands the diameter. It plays a role as a stopper to prevent it from coming out of 5 easily.

  That is, as shown in FIG. 2, when the distance l between the circuit boards 4 and 5 is large, the contact 11 comes into contact with the inner surface of the grommet 6 in an elastically deformed state, and as shown in FIG. When the distance 1 is small, the contact 11 is elastically restored larger than the diameter of the through hole 41 at a position above the grommet 6.

  The contact 31 can also be expanded and contracted in the same manner as the contacts 11 and 21, but the contact 11 and 21 are different from each other in the direction in which elastic deformation is easy, and as shown in FIG. The spring is easily elastically deformed. By combining the contacts 11 and 21 that are easily elastically deformed in the left and right direction (the radial direction of the through hole 41) and the contact 31 that is easily elastically deformed in the up and down direction (through direction of the through hole 41), Even if the distance and the horizontal positional relationship change, the electrical coupling between the substrates can be maintained. Also, when the positions of the through holes 41 and 51 are shifted in the horizontal direction in FIG. 4 along the surfaces of the circuit boards 4 and 5 due to elastic deformation of the contacts 11 and 21, for example, as shown in FIG. Even if it exists, a part or all of contact 11, 21, 31 and the linear part 7 can contact the grommet 6, and can be electrically connected by elastically deforming a connection apparatus.

  Further, as shown in FIG. 5, the contact 31 is deformed into a vertically long shape like the contacts 11 and 21 and does not enter the through hole 41 (51) when pushed into the through hole 41 (51). Projection 32 is provided. As a result, the expansion and contraction directions of the two types of contacts 11 and 21 and the contact 31 can be controlled. The contacts 11 and 21 serve as springs that extend in the horizontal direction so as to pass through the through holes and serve as stoppers after the penetration, and the contact 31 is a distance between the two printed boards 4 and 5. It plays a role as a spring that expands and contracts in the vertical direction according to l. The contacts 11, 21, 31 can be manufactured by a simple manufacturing process by molding a metal plate, and function as metal terminals that electrically connect the circuit board 4 and the circuit board 5 to each other. it can.

Next, a process of manufacturing an electronic component by connecting a plurality of circuit boards using the connecting device of the second embodiment will be described.
As shown in FIG. 2, the metal terminal contacts 11 having contacts 11 and 21 are passed through the through holes 41 and 51 of the respective circuit boards 4 and 5 with respect to the upper and lower circuit boards 4 and 5. . As a result, the upper and lower circuit boards 41 and 51 are electrically coupled via the contacts 11, 21, 31, and the metal terminals (connection device constituted by a conductor) integrally formed by the linear portion 7. .

  In the second embodiment, the following effects can be obtained when the distance between the circuit boards changes. That is, when the distance 1 between the circuit boards 4 and 5 is long, the through hole 41 and the contact 11 come into contact at the contact 8 as shown in FIG. Further, even when the distance l between the circuit boards 4 and 5 is longer than that in FIG. 2, the contact 8 can contact the through hole 41 by extending the intermediate contact 31 in the vertical direction, and the distance l Can accommodate a long arrangement.

  When it is desired to separate the upper and lower circuit boards 4 and 5, the contact 7 is reduced in the horizontal direction by passing through the direction in which the distance l between these circuit boards is increased, and the through holes 41 and 51 are passed through. Thus, the contact between the contacts 11, 21 or 31 and the circuit boards 4 and 5 may be eliminated. Note that the distance between the circuit boards 4 and 5 is increased until the contacts 11 and 21 pass through the through holes 41 and 51 and the connection with the circuit boards 4 and 5 is separated. be able to.

  On the other hand, when the distance l between the substrates is short, the through hole 41 and the contact 31 are in contact with each other at the contact point 9 as shown in FIG. Since the inter-substrate distance l is shortened, the portion of the contact 9 is pushed by the through holes 41, 51. The elastic deformation of the contact 31 and the presence of the protrusion 32 as shown in FIG. By being crushed, the contact of the contact 8 in FIG. 2 cannot be maintained, but the contact can be maintained by the contact 9. That is, the contact 31 cannot enter the grommet 6 when the protrusion 32 hits the edge of the grommet 6 as shown in FIG. The protrusion 32 can be elastically deformed in the vertical direction (through direction) by sliding along the surface of the grommet 6. The contacts 11 and 21 may be formed in a vertically long rhombus shape to facilitate the deformation in the width direction, and the contact 31 may be formed in a horizontally long rhombus shape to facilitate the vertical deformation.

  Further, since the contacts 11 and 21 are provided as shown in FIG. 4, even if the position of the circuit boards 4 and 5 in the lateral direction (direction along the surface) is changed, these contacts 11 and 21 are provided. The upper and lower circuit boards 4 and 5 can continue to be electrically coupled. As a result, even if the circuit boards 4 and 5 have a structure that is not fixed to the case or the like that accommodates the circuit boards by screwing or the like, the contacts 11 and 21 do not pass through the through holes 41 and 51. If there is, contact can be maintained. Furthermore, when the horizontal positional relationship between the substrates is not fixed, such as when the substrate is mounted in a floating structure, the electrical connection between the substrates can be maintained even in a structure in which the inter-substrate distance l varies depending on the location.

Further, in FIGS. 2 to 4, the contacts 11 to 31 and the contacts 21 to 31 are simply connected by the straight line portion 7, but even if changed as in the third embodiment shown in FIGS. 6 and 7. good.
Specifically, instead of the straight line portion 7 of the second embodiment, a spring structure portion 7A that has a shape that is elastically deformable and can be deformed in a direction intersecting the wiring board may be used. It is valid.

  That is, by providing the elastically deformable spring structure portion 7A, the restriction due to the positional relationship (displacement in the surface direction or distance in the direction intersecting the surface) of the circuit boards 4 and 5 to be fitted is reduced as much as possible. Regardless of the displacement, stable contact can be ensured at both the contact 8 and the contact 9, and impedance changes due to fluctuations in contact resistance between the upper and lower wiring boards 4, 5 are reduced. High-speed signals can be passed.

  As shown in FIG. 6, when the inter-substrate distance l is relatively large, the contact 8 and the contact 9 can be brought into contact with each other by contracting the spring structure 7 </ b> A. When the inter-substrate distance l is small, the contact 31 is crushed and is in contact with the contact 9, and the contact of the contact 9 can be maintained by the spring structure portion 7 </ b> A pulling the contact 31.

  In the third embodiment, the spring structure 7A provided on the terminal is deformed in the thickness direction of the circuit board (contact penetration direction), so that it can be easily expanded and contracted according to the mating distance of the circuit board. Further, since the spring structure portion 7A can be deformed also in the surface direction of the circuit board, the horizontal positional relationship of the circuit boards 4 and 5 can have a certain degree of freedom. For example, the circuit board 4 Even if a floating structure 5 is movable (or relatively movable) with respect to the housing, it can be connected.

  In each of the above embodiments, the case where two circuit boards are connected using a connection device has been described. However, the number of contacts that can be elastically deformed in the width direction is provided according to the number of circuit boards. A structure may be adopted in which the contacts are connected by a contact that can be elastically deformed in the direction of penetration into the through hole.

The specific structure of the contact is not limited to a structure that uses elastic deformation of a member formed by bending a plate-like metal as in the above embodiment. For example, a rigid conductor that contacts the grommet is used. A structure that is connected by a spring and can be displaced in a predetermined direction by elastic deformation of the spring may be used.
The material constituting the contact is not limited to a conductor such as a metal. For example, a conductor coating is applied to the surface of a plastic material that can be elastically deformed (for example, a contact surface with a circuit board such as a grommet) by metal plating or the like. It may be provided.

  As mentioned above, although embodiment of this invention was explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The design change etc. of the range which does not deviate from the summary of this invention are included.

  The present invention relates to a connection device used for electrical connection of electronic components, an electronic component connected by the connection device, and a method for manufacturing the same.

DESCRIPTION OF SYMBOLS 1 1st penetration member 2 2nd penetration member 3 Connecting member 4 1st circuit board 5 2nd circuit board 6 Grommet 7 Linear part 7A Spring structure part 8 Contact 9 Contact 11 Contact 21 Contact 31 Contact 32 Projection 41 Through Hole 51 Through hole

Claims (8)

One penetrating member that is provided so as to penetrate one connected object in the thickness direction, and that is elastically deformable in a direction crossing the penetrating direction, at least a surface formed of a conductive material;
The other connected object provided with a gap in the thickness direction between the one connected object is provided to penetrate in the thickness direction, and can be elastically deformed in a direction intersecting the penetrating direction. Another penetrating member having at least a surface formed of a conductive material;
These one penetrating member and another penetrating member are electrically connected to each other, and a connecting member formed to be elastically deformable in the penetrating direction,
A connecting device having: The one penetrating member has a first contact composed of a plurality of metal members which are arranged to face each other and are connected to each other so as to be elastically deformable in the facing direction.
The other penetrating member has a second contact composed of a plurality of metal members which are arranged to face each other and are connected to each other so as to be elastically deformable in the facing direction.
The connecting member has a third contact made of a metal member that connects the first contact and the second contact to each other.
The connection device according to claim 1.   The connection device according to claim 2, wherein the first contact and the second contact have a plate shape.   The connection device according to claim 2, wherein the third contact has a plate shape.   The connection according to any one of claims 2 to 4, wherein the first contact, the second contact, and the third contact are formed by forming a part of an integrated belt-like metal plate into a predetermined shape. apparatus.   6. The device according to claim 2, wherein at least one of the first contact, the second contact, and the third contact has a rhombus whose diagonal direction is the penetrating direction. Connected device.   An electronic component comprising the connection device according to claim 1, one circuit board through which one penetration member of the connection device penetrates, and another circuit board through which another penetration member penetrates. . Arranging one connected object having another through-hole and another connected object at a predetermined relative position;
One penetrating member configured to be insertable in an elastically deformed state into the through hole of the one connected object, another penetrating member configured to be insertable into the through hole of the other connected object in an elastically deformed state, And passing through the through hole of the one connected object and the other connected object while elastically deforming the connecting member that connects the one penetrating member and the other penetrating member in an elastically deformable manner;
Aligning the one penetrating member with one connected object and aligning the other penetrating member with another connected object;
Aligning the one connected object and the other connected object while elastically deforming the connecting member;
Manufacturing method of electronic component having

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