JP2018032806A - Electronic apparatus heat dissipation structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus heat dissipation structure that efficiently discharges heat stored inside an electronic apparatus and does not affect a surface temperature of the electronic apparatus.SOLUTION: An electronic apparatus heat dissipation structure 10 is configured to comprise: a circuit board 28 arranged so that a top plate 14 and an exothermic body 26 face each other; an air suction part 30 formed on a wall surface of a back plate 20, the air suction part making it possible to suck air; a cooling fan 32 arranged so as to be adjacent to the suction part 30, the cooling fan making air from the outside circulate into the inside of the electronic apparatus 12; an air discharge part 34 made of an air discharge hole for discharging circulated air to the outside, the air discharge hole being formed on a wall surface of a front plate 18; a mirror surface sheet member 36 welded on an inner wall of the top plate 14 so as to form a predetermined space between the mirror surface sheet member and the inner wall, the mirror surface sheet member having a surface on which mirror surface treatment is performed; and a pair of leading sheet members 40 having an excess length for making it possible to lead air circulation inside the electronic apparatus 12.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat dissipation structure for an electronic device, in particular, a micro wireless transmission device, and efficiently dissipates heat inside the electronic device generated from a heating element on a circuit board provided therein to the outside of the electronic device. The present invention relates to a heat dissipation structure of an electronic device that eliminates malfunction of the device.

  An electronic device such as a small wireless transmission device (FPU) is used as a wireless relay transmission device in the relay of a television broadcast. It can be transmitted directly or indirectly to a broadcasting station using millimeter waves. In particular, recently, an ultra-small and lightweight wireless transmission device has been developed, and it is often used by attaching it to the rear part of a video camera.

  By the way, when such an electronic device is operated, heat is generated from the heating element on the internal circuit board. However, if this heat is not efficiently dissipated to the outside of the electronic device, excessive heat inside the electronic device is generated. As a result, the temperature rises, and as a result, malfunction and failure of the electronic device itself are caused. Therefore, how to dissipate the heat accumulated inside the electronic device to the outside is an important issue, and various studies have been made in the past.

  For example, in a technology that forcibly cools the heat inside an electronic device using a fan or the like known as a prior art, a heat radiator is attached to a heating element on a circuit board to diffuse the heat, and the wind is applied to it. Thus, the heating element is cooled.

  As for the surface temperature of the electronic device, there is a technique in which a heat insulating material is disposed inside the electronic device to delay the heat transfer rate. For example, as disclosed in Patent Document 1, a base plate on which a heat generating component or the like with a heat sink fixed is mounted on a bottom plate, a power supply unit that supplies power, and the like, and a housing that opens downward is mounted on the bottom plate. Heat dissipating structure for electronic equipment, wherein heat of heat-generating component is radiated from the heat radiating plate into the housing, and the heat of the heated air in the housing is radiated from the top plate of the housing The heat radiation of the electronic device is characterized in that a heat insulating material is attached to the upper part of the heat generating component on the inner surface of the top plate so that the radiant heat from the heat generating component does not directly heat the upper part of the heat generating component of the top plate. It is a structure.

Japanese Patent Laid-Open No. 10-117078

  However, with only the conventional technology using the above-mentioned fan or the like, it is necessary to increase the size of the radiator and the fan in accordance with the increase in the amount of heat generation. Otherwise, the heat that cannot be radiated remains inside the electronic device, Since the temperature of the inside and the surface of the electronic device is raised, it is considered that it is not an optimal technique for a small electronic device with a limited size. Further, even if forced air cooling is performed by a fan, the wind does not flow uniformly inside the electronic device, but is biased, so that the intended wind cannot flow depending on the position of the heating element.

  Furthermore, if the position of the heating element is changed due to an electronic device that replaces the circuit board depending on the function, a version upgrade of the circuit board design, or the like, an inappropriate case may occur in the conventional wind flow path. Therefore, in order to avoid this phenomenon, it is necessary to introduce specially designed parts (for example, wind guide plates) and high-power fans to spread the wind to every corner. This increases the weight and increases the manufacturing cost.

  The technique disclosed in Patent Document 1 is intended to level the heat transfer temperature distribution by delaying the speed at which heat is transmitted. Even if a factor that increases heat from the outside works. However, it has been pointed out that when it reaches a saturation state that does not increase any more, the effect diminishes. Therefore, new heat exhaust that efficiently discharges heat accumulated inside the electronic device, does not affect the surface temperature of the electronic device, and can flexibly respond to changes in the position of the heating element on the circuit board. Construction of the structure is needed.

  An object of the present invention is to provide a heat dissipation structure for an electronic device that efficiently discharges heat accumulated in the electronic device and does not affect the surface temperature of the electronic device.

In order to cope with the above-described problems, the present invention takes the following technical means.
That is, the invention according to claim 1 is formed by a top plate, a bottom plate, a front plate, a back plate, a left plate, and a right plate, and a circuit board on which a heating element is mounted is formed inside. A heat dissipation structure for an electronic device that dissipates heat from the electronic device to the outside, wherein the heat dissipation structure of the electronic device is arranged such that the circuit board, the top plate, and the heating element face each other. And an air intake portion that allows air to be drawn on the wall surface of the back plate, and cooling that is arranged adjacent to the air intake portion and distributes air from outside toward the inside of the electronic device A fan, an exhaust portion formed on the wall surface of the front plate facing the back plate, and an exhaust hole for exhausting air circulated by the cooling fan to the outside; an inner wall of the top plate; and the inner wall Predetermined to form a predetermined space between A mirror sheet member having a mirror-finished surface that is welded at a place, and a pair of induction sheet members having a surplus length capable of guiding the air flow inside the electronic device. The guide sheet member includes a pair of sheet fixing portions provided near both ends of the inner wall of the left side plate, and the other pair of sheet fixing portions provided near both ends of the inner wall of the right side plate. In addition, the heat radiation structure of the electronic device is characterized in that the sheet surfaces are attached to face each other.

  The invention according to claim 2 is the heat dissipation structure of the electronic device according to claim 1, wherein the induction sheet member has the sheet surfaces facing each other with the heating element interposed therebetween, and in the vicinity of the heating element. The sheet surfaces are attached to the sheet fixing portions in an arch-shaped curve so that the distance between the sheet surfaces becomes narrower than the distance between other positions. Furthermore, the invention according to claim 3 is the heat dissipation structure of the electronic device according to claim 1 or 2, wherein the sheet fixing portion is formed with a screw hole toward the opposing side plate, and Through holes are formed in the vicinity of both ends in the longitudinal direction of the guide sheet member, and the guide sheet member is fixed by screwing the corresponding screw hole to each of the through holes. It is characterized by being attached to the seat fixing part.

  The invention according to claim 4 is the heat dissipation structure for the electronic device according to claim 3, wherein one of the through holes formed in the vicinity of both ends of the induction sheet member is a length of the induction sheet member. It is characterized by an oblong hole in the direction. Furthermore, the invention according to claim 5 is the heat dissipation structure for an electronic device according to any one of claims 1 to 4, wherein a material of the specular sheet member is pure aluminum.

  The invention according to claim 6 is the heat dissipation structure for an electronic device according to any one of claims 1 to 5, wherein the material of the induction sheet member is polyethylene terephthalate. The invention according to claim 7 is the heat dissipation structure for an electronic device according to any one of claims 1 to 6, wherein the mirror sheet member is fiber laser welded to the inner wall of the top plate at a predetermined location. It is characterized by being made.

  Furthermore, the invention according to claim 8 is the heat dissipation structure for an electronic device according to any one of claims 1 to 7, wherein the induction sheet member can be locked to a predetermined portion of the circuit board. Alternatively, a plurality of fixing pins are provided. The invention according to claim 9 is the heat dissipation structure for an electronic device according to any one of claims 1 to 7, wherein the heating element includes a surface on the left side plate side and a surface on the right side plate side. In addition, a double-sided tape capable of fixing the guide sheet is provided.

  According to the present invention, since the mirror sheet member having a high heat transfer coefficient whose surface is mirror-finished is provided inside the electronic apparatus, radiant heat reflection from the heating element on the circuit board occurs, and heat is generated inside the mirror sheet member. Can be packaged to allow air to pass through, improving exhaust heat efficiency. Moreover, since the predetermined space is formed between the mirror surface sheet member and the top plate, a heat insulating layer (air) is formed in this space, and as a result, the temperature rise of the electronic device surface can be suppressed.

  Furthermore, according to the present invention, since the pair of guide sheet members having a surplus length are attached to the sheet fixing portions of the left and right side plates so that the sheet surfaces face each other, air is supplied to the heating element on the circuit board. It is possible to efficiently create a flow path to be circulated and its width. Further, it is possible to flexibly cope with a change in position of the heating element on the circuit board.

1 is a perspective view showing an embodiment of a heat dissipation structure for an electronic device according to the present invention, with a top plate opened. BRIEF DESCRIPTION OF THE DRAWINGS It is a top view of the state which open | released the top plate which showed embodiment of the thermal radiation structure of the electronic device which concerns on this invention, (a) is the state which fixed the induction sheet member with the fixing pin, (b) is the induction sheet with a double-sided tape. The state which fixed the member is represented. The embodiment of the thermal radiation structure of the electronic device which concerns on this invention is shown, and the inner wall surface of the open top plate is represented. In embodiment of the heat dissipation structure of the electronic device which concerns on this invention, it is the simplified diagram which showed the heat dissipation structure, (a) is sectional drawing from the left board side, (b) is sectional drawing from the top board side, (c ) Is a cross-sectional view from the top plate side, and shows a state corresponding to the movement of the heating element on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS It is an external view in embodiment of the thermal radiation structure of the electronic device concerning this invention, (a) is a perspective view from the left-side board side and front board side, (b) is a perspective view from the left-side board side and back board side, c) is a perspective view from the right side plate side / front plate side, and (d) is a perspective view from the right side plate side / back plate side.

  An embodiment of a heat dissipation structure for an electronic device according to the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of a heat dissipation structure for an electronic device according to the present invention, and is a perspective view in a state where a top plate is opened. FIG. 2 shows an embodiment of a heat dissipation structure for an electronic device according to the present invention. FIGS. 3A and 3B are plan views showing a state in which the top plate is opened, in which FIG. 3A shows a state in which the guide sheet member is fixed by fixing pins, FIG. 3B shows a state in which the guide sheet member is fixed by double-sided tape, and FIG. The embodiment of the thermal radiation structure of the electronic device which concerns on invention is shown, The inner wall surface of the open top plate is represented.

  Further, FIG. 4 is a simplified diagram showing the heat dissipation structure in the embodiment of the heat dissipation structure of the electronic device according to the present invention, where (a) is a cross-sectional view from the left side plate side, and (b) is from the top plate side. (C) is a cross-sectional view from the top plate side, and shows a state corresponding to the movement of the heating element on the circuit board. FIG. 5 is an external view of an embodiment of a heat dissipation structure for an electronic device according to the present invention, in which (a) is a perspective view from the left side plate side / front plate side, and (b) is a left side plate side / back plate side. (C) is a perspective view from the right side plate / front plate side, and (d) is a perspective view from the right side plate / back plate side.

  Regarding the reference numerals, 10 is a heat dissipation structure of an electronic device, 12 is an electronic device, 14 is a top plate, 16 is a bottom plate, 18 is a front plate, 20 is a back plate, 22 is a left plate, 24 is a right plate, and 26 is A heating element, 28 is a circuit board, 30 is an intake section, 32 is a cooling fan, 34 is an exhaust section, 36 is a specular sheet member, 38 is a welding section, 40 is an induction sheet member, 42 is a sheet fixing section, and 44 is a sheet surface. 46 is an antenna mounting portion, 48 is a panel operation portion, 50 is a power supply operation portion, 52 is a connector connection portion, 54 is a screw hole, 56 is a through hole, 58 is a screw, 60 is a fixing pin, and 62 is a double-sided tape. ing.

  First, as shown in FIGS. 1 to 4, the heat dissipation structure 10 for an electronic device according to the present embodiment includes a top plate 14, a bottom plate 16, a front plate 18, a back plate 20, a left side plate 22, and a right side plate 24. In addition, the heat of the electronic device 12 in which the circuit board 28 on which the heating element 26 is mounted is disposed is radiated to the outside.

  In addition, the circuit board 28 is arranged so that the top plate 14 and the heating element 26 face each other, and an air intake section 30 that can intake air (cooling air) formed on the wall surface of the back plate 20; A cooling fan 32 is provided adjacent to the air intake unit 30 and distributes air from outside toward the inside of the electronic device 12.

  Further, an exhaust part 34 in which an air hole for exhausting the air circulated by the cooling fan 32 to the outside is formed in the wall surface of the front plate 18 facing the back plate 20, and the inner wall of the top plate 14 The mirror surface sheet member 36 whose surface is welded at a predetermined location (welded portion 38) so that a predetermined space is formed between the two and the air flow in the electronic device 12. And a pair of guide sheet members 40 having a surplus length that can be guided.

  One of the guide sheet members 40 is fixed to a pair of sheet fixing portions 42 provided near both ends of the inner wall of the left side plate 22, and the other is fixed to a pair of seats provided near both ends of the inner wall of the right side plate 24. The sheet surfaces 44 are attached to the part 42 so as to face each other.

  Next, this embodiment will be described in more detail. First, as shown in FIG. 5B and the like, the electronic device 12 in the present embodiment is for attaching an antenna (not shown) for communicating with the outside through the circuit board from the gap of the back plate 20. The antenna mounting portion 46 protrudes. The appearance is shown in FIG. 5 as an example. For example, referring to FIG. 5B, for example, the antenna mounting portion 46 for attaching an antenna (not shown) is directed upward. In this state, the bottom plate 16 side can be used by being attached to a dedicated fixture (not shown) at the rear of the video camera.

  Then, as shown in FIGS. 5A and 5C, the front panel 18 of the electronic device 12 is connected to a power operation unit 50 for turning on / off the power and a cable for connecting to the video camera. A connector connection portion 52 and the like are provided. Further, as shown in FIGS. 5C and 5D, the right side plate 24 of the electronic device 12 is provided with a panel operation unit 48 that mainly sets the electronic device 12.

  Furthermore, the top plate 14 in this example is configured to cover the inner wall surface of the back plate 20 with a predetermined gap except for a part (near the range where the antenna mounting portion 46 protrudes). Further, as shown in FIG. 5B and the like, the wall surface of the back plate 20 is provided with an air intake portion 30 in which a gap with the antenna mounting portion 46 is formed as an air intake hole (hole for sucking air). As shown in FIG. 1, a cooling fan 32 disposed adjacent to the air intake unit 30 distributes the air sucked from the air intake hole into the electronic device 12. In the present embodiment, the intake hole is a gap between the back plate 20 and the antenna mounting portion 46. For example, a part of the back plate 20 has a mesh structure so that air is sucked from the small hole. Also good.

  Further, as shown in FIG. 5A and the like, the wall surface of the front plate 18 is provided with an exhaust portion 34 in which exhaust holes for exhausting the air circulated by the cooling fan 32 to the outside of the electronic device 12 are formed. It has been. In the present embodiment, the exhaust hole is a gap provided in the front plate 18, but for example, a part of the front plate 18 may have a mesh structure and air may be exhausted from the small hole.

  Subsequently, in the present embodiment, as shown in FIG. 3 and FIG. 4A, the specular sheet member 36 is formed on the inner wall of the top plate 14 of the electronic device 12, and a predetermined space is formed between the inner wall and the mirror surface sheet member 36. As is shown, it is welded at a predetermined location. As described above, when a predetermined space is formed between the specular sheet member 36 and the inner wall of the top plate 14, this space serves as a heat insulating layer (air layer) between the exterior of the electronic device 12. Thus, the temperature rise of the surface of the electronic device 12 can be suppressed. For welding the mirror sheet member 36, as shown in FIG. 3, it is preferable to use a fiber laser welding method because a predetermined space is easily formed.

  The surface of the mirror surface sheet member 36 is subjected to a mirror surface treatment. If the mirror surface sheet member 36 subjected to the mirror surface treatment is welded to the top plate 14, the mirror surface sheet member 36 reflects the radiant heat from the heating element 26 on the circuit board 28 as shown in FIG. (Arrows in the figure) cause heat to be packaged in the space between the specular sheet member 36 and the circuit board 28, and air is further circulated through the space by the cooling fan 32 disposed adjacent to the air intake portion 30. By doing so, the exhaust heat efficiency from the exhaust part 34 can be improved. In addition, the dashed-two dotted line in a figure represents the flow of air.

  Furthermore, the range in which the specular sheet member 36 is attached by welding is preferably the entire top plate 14 because the heat packaging effect in the space is increased, but the range is not intended to limit the present invention. . In addition, it is preferable to use pure aluminum having a high heat transfer coefficient as the material of the mirror sheet member 36 because the exhaust heat efficiency is further increased.

  Subsequently, in the present embodiment, as shown in FIGS. 1, 2, and 4, an induction sheet member 40 that can guide the flow of air circulated by the cooling fan 32 inside the electronic device 12. Are attached to both sides of the left side plate 22 and the right side plate 24, respectively.

  Specifically, first, one guide sheet member 40 is attached to both ends of the sheet fixing portion 42 provided near both ends of the inner wall of the left side plate 22, and further provided near both ends of the inner wall of the right side plate 24. The other induction sheet member 40 is attached to the sheet fixing portion 42 at both ends thereof, and the sheet surfaces 44 are opposed to each other with the heating element 26 interposed therebetween.

  Thus, since the pair of induction sheet members 40 are configured to face each other, air flows through the space (line) sandwiched between the induction sheet members 40 (FIG. 4 ( b)), and since the guide sheet member 40 has an extra length, it can be deformed into an arbitrary shape such as forming an arch-shaped curve inside the electronic device 12. Therefore, it is possible to adjust the wind speed, which is an important point of air cooling that is the purpose of air circulation.

  Further, as shown in FIGS. 4B and 4C, even when the position of the heating element 26 on the circuit board 28 is changed when the circuit board 28 is replaced, for example, from (b) to ( c)), the guide sheet member 40 having a surplus length is deformed to create an arch-shaped curve that follows the heating element 26, thereby providing a flow path for efficiently flowing air to the heating element 26. It has become. Here, if the guide sheet member 40 is formed to be curved in an arch shape so that the interval between the sheet surfaces 44 in the vicinity of the heating element 26 is narrower than the interval at other positions, the heating element is more efficiently performed. The air can be circulated with respect to H.26. The guide sheet member 40 is preferably made of a flexible material, particularly polyethylene terephthalate. In addition, the dashed-two dotted line in a figure represents the flow of air.

  Further, in the present embodiment, as shown in FIGS. 1 and 2, each sheet fixing portion 42 is formed with a screw hole 54 toward the opposing side plate direction, and each guide sheet member 40 includes Through holes 56 are formed in the vicinity of both ends in the longitudinal direction. The guide sheet member 40 is attached to the seat fixing portion 42 by aligning the through holes 56 and the corresponding screw holes 54 of the seat fixing portion 42 and screwing them with screws 58.

  Furthermore, in the present embodiment, as shown in FIGS. 1 and 2, one of the through holes 56 formed in the vicinity of both ends of the guide sheet member 40 is an ellipse toward the longitudinal direction of the guide sheet member 40. It is a hole. When such an oval hole is used, the screwing position can be adjusted when screwing with the screw 58, and as a result, the length of the guide sheet member 40 can be adjusted.

  Subsequently, in this embodiment, as shown in FIGS. 2A and 4, two fixing pins 60 capable of locking the guide sheet member 40 are provided at predetermined positions of the circuit board 28. . By locking the guide sheet member 40 to the fixing pin 60, an arched curve following the heating element 26 can be created. In addition, it is preferable that the number of the fixing pins 60 and the installation position are suitable for the guide sheet member 40 to efficiently distribute the air to the heating element 26.

  Also, as shown in FIG. 2 (b), double-sided tape 62 is provided on the left side plate 22 side surface and the right side plate 24 side surface of the heating element 26, and the induction sheet member 40 is fixed thereto. Thus, the guide sheet member 40 may be configured to efficiently distribute the air to the heating element 26. Further, the fixing pin 60 and the double-sided tape 62 may be combined.

  Next, the result of conducting a heat dissipation experiment of the electronic device by the heat dissipation structure of the electronic device according to the present invention is shown (Table 1).

  As shown in Table 1, the surface temperature of the electronic device could be lowered by 2.4 ° C. by applying the heat dissipation structure of the electronic device according to the present invention inside the electronic device in an environment of 45 ° C. outside air. In addition, normally, since the reflection of radiant heat has the effect of trapping heat escaping outside, the temperature inside the electronic device also rises, but the heat dissipation structure of the electronic device according to the present invention It became clear that even if applied, there was no temperature difference.

  The present invention is a heat dissipation structure that can efficiently dissipate the heat inside the electronic device and does not affect the surface temperature. Therefore, particularly in a small electronic device, the internal circuit board can be further changed. Also, it can be suitably used.

DESCRIPTION OF SYMBOLS 10 Electronic device heat dissipation structure 12 Electronic device 14 Top plate 16 Bottom plate 18 Front plate 20 Back plate 22 Left side plate 24 Right side plate 26 Heating element 28 Circuit board 30 Intake part 32 Cooling fan 34 Exhaust part 36 Specular sheet member 38 Welding part 40 Induction Sheet member 42 Sheet fixing portion 44 Sheet surface 46 Antenna mounting portion 48 Panel operation portion 50 Power supply operation portion 52 Connector connection portion 54 Screw hole 56 Through hole 58 Screw 60 Fixing pin 62 Double-sided tape

Claims (9)

It is formed by a top plate, bottom plate, front plate, back plate, left side plate, and right side plate, and the heat of an electronic device in which a circuit board on which a heating element is mounted is arranged outside A heat dissipation structure for an electronic device that dissipates heat to
The electronic device heat dissipation structure is
The circuit board is disposed so that the top plate and the heating element face each other,
An air intake section that can inhale air formed on the wall of the back plate;
A cooling fan that is arranged adjacent to the air intake and circulates air from outside toward the inside of the electronic device;
An exhaust part in which an exhaust hole for exhausting the air circulated by the cooling fan to the outside is formed in the wall surface of the front plate facing the back plate;
A mirror surface sheet member having a mirror surface treatment applied to a surface formed by welding at a predetermined location so that a predetermined space is formed between the inner wall of the top plate and the inner wall;
A pair of induction sheet members having a surplus length capable of guiding the air flow inside the electronic device, and
One of the guide sheet members is a pair of sheet fixing portions provided near both ends of the inner wall of the left side plate, and the other is a pair of sheet fixing portions provided near both ends of the inner wall of the right side plate. A heat dissipation structure for an electronic device, wherein the sheet surfaces are attached so as to face each other.   The guide sheet member has an arcuate shape such that the sheet surfaces are opposed to each other with the heating element interposed therebetween, and an interval between the sheet surfaces in the vicinity of the heating element is narrower than an interval at other positions. The heat dissipation structure for an electronic device according to claim 1, wherein the heat dissipation structure is attached to the sheet fixing portion in a state where a curve is formed.   Each of the sheet fixing portions is formed with a screw hole toward the opposite side plate direction, and each of the guide sheet member is formed with a through hole in the vicinity of both ends in the longitudinal direction. The heat dissipation structure for an electronic device according to claim 1, wherein the guide sheet member is attached to the sheet fixing portion by aligning and screwing the corresponding screw hole to each of the two.   4. The electronic device according to claim 3, wherein one of the through holes formed in the vicinity of both ends of the guide sheet member is an oval hole in a longitudinal direction of the guide sheet member. Heat dissipation structure.   The heat dissipation structure for an electronic device according to any one of claims 1 to 4, wherein a material of the specular sheet member is pure aluminum.   The heat dissipation structure for an electronic device according to any one of claims 1 to 5, wherein a material of the induction sheet member is polyethylene terephthalate.   The heat dissipation structure for an electronic device according to any one of claims 1 to 6, wherein the mirror sheet member is formed by fiber laser welding at a predetermined location on an inner wall of the top plate.   8. The heat dissipation structure for an electronic device according to claim 1, wherein one or a plurality of fixing pins capable of locking the induction sheet member is provided at a predetermined portion of the circuit board. .   The said heat generating body is provided with the hook_and_loop | surface fastener which can fix the said guidance sheet | seat so that attachment or detachment is possible respectively on the surface by the side of the left side plate, and the surface by the side of the right side plate. 7. A heat dissipation structure for an electronic device according to any one of 7 above.

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