JP2017183616A - Bonding tool cooling device and bonding device comprising the same, and bonding tool cooling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding tool cooling device that can efficiently cool down a bonding tool in a short time, and to provide a bonding device comprising the same, and a bonding tool cooling method.SOLUTION: Provided is a bonding tool cooling device for cooling down a bonding tool that comprises an attachment tool that sucks and holds a semiconductor chip component, a heater that heats the attachment tool, and a suction mechanism that sucks and holds the attachment tool onto the heater. The bonding tool cooling device comprises a cooling member that is contacted with and cools down the attachment tool surface. The cooling member is provided on transportation means for transporting the semiconductor chip component in a horizontal direction. Also provided are a bonding device comprising the same, and a bonding tool cooling method.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a bonding tool cooling apparatus and a bonding tool cooling method for a bonding apparatus that heats and presses a semiconductor chip component on a circuit board for mounting.

  As a method for mounting a semiconductor chip component on a circuit board, a thermocompression bonding method, a soldering method, or the like is used. In the thermocompression bonding method, a ceramic heater provided in the bonding tool is heated at a high speed, and the thermosetting resin film or thermosetting resin paste filled between the semiconductor chip component and the circuit board is heated and cured to perform thermocompression bonding. doing. In the soldering method, the temperature of the bonding tool is raised to the solder melting temperature, the semiconductor chip component is mounted on the circuit board, and then cooled to below the solid phase temperature to mount the next semiconductor chip component.

  A bonding apparatus for mounting a semiconductor chip component on a circuit board has a structure as shown in FIG. The bonding apparatus 100 includes a bonding tool 10 that sucks and holds the semiconductor chip component 4 to press and heat the circuit board 2 and a substrate stage 20 that sucks and holds the circuit board 2. Between the bonding apparatus 1 and the supply part of the semiconductor chip component 4, a chip slider 26 is provided in a transport means 25 that horizontally transports the semiconductor chip component 4. The semiconductor chip component 4 conveyed by the chip slider 26 is delivered to the bonding tool 10.

  The bonding tool 10 has a structure as shown in FIG. A holder portion 11 is provided at the tip of the bonding tool 10, and a heater base 12 is fixed to the lower surface of the holder portion 11 with mounting bolts. A heater 14 is disposed on the lower surface of the heater base 12 via a heat insulating block 13, and the heater 14 and the heat insulating block 13 are fixed by bolts (not shown). An attachment tool 15 for attracting and holding the semiconductor chip component 4 is provided on the lower surface of the heater 14. An attachment adsorption flow path 17 is formed in the heat insulating block 13 and the heater 14, and the attachment tool 15 is sucked by vacuum through the flow path. A cooling air flow path 18 is formed in the heat insulation block 13, and is configured such that compressed air is supplied from a pressure air source (not shown) and air is blown onto the upper surface of the heater 14 to cool it.

  When the attachment tool 15 receives the semiconductor chip component 4 when the attachment tool 15 receives the cooling, the bonding tool 10 is deformed by melting or softening the solder at the tip of the bump 5 of the semiconductor chip component 4 when the heater 14 receives it at a high temperature. It has been done to prevent that. When the resin film is laminated on the circuit surface of the semiconductor chip component 4, the bonding tool 10 needs to be cooled in order to prevent the resin film from reacting due to high temperature and proceeding curing.

  When the solder is deformed by melting or softening, there is a problem in that the bumps 5 are not evenly contacted when the semiconductor chip component 4 is joined to the circuit board 2 and connection failure occurs. Further, when the curing of the resin film is promoted, there is a problem that the resin between the bumps 5 of the semiconductor chip component 4 and the electrodes 3 of the circuit board 2 is not excluded, resulting in poor connection. Therefore, it is necessary to sufficiently cool the heater 14 to a temperature that does not affect the bondability. However, just cooling the back surface of the heater 14 as shown in FIG. 5 poses a problem that the heat capacity of the attachment tool 15 is large and the cooling takes time and the tact time becomes long.

International Publication Number WO2014 / 087740

  In order to deal with such a problem of tact time, Patent Document 1 discloses a method in which an attachment tool is brought into direct contact with a heat radiating member and cooled by heat propagation as a method of shortening the cooling time of the heater. However, the cooling method described in Patent Document 1 requires a step in which the bonding tool is raised after the bonding is finished, the substrate stage is moved to a position where the bonding tool is brought into contact with the heat radiating member unit, and the bonding tool is lowered and cooled. There is a problem that these extra tact times are required and the production efficiency is lowered.

  Accordingly, an object of the present invention is to provide a bonding tool cooling device capable of efficiently cooling a bonding tool in a short time, a bonding device including the same, and a bonding tool cooling method.

In order to solve the above-mentioned problem, the invention described in claim 1
A bonding tool cooling device for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater,
A cooling member that cools by contacting the attachment tool surface,
The cooling member is a bonding tool cooling device provided in a transfer means for transferring a semiconductor chip component in a horizontal direction.

The invention according to claim 2 is the bonding tool cooling device according to claim 1,
It is a bonding tool cooling device having a function of sucking and holding the attachment tool by providing a suction hole in the cooling member and depressurizing the inside of the suction hole.

Invention of Claim 3 is the bonding tool cooling device of Claim 1 or Claim 2, Comprising:
The transporting means is a bonding tool cooling device for transporting the semiconductor chip component to a height between the recognition means for recognizing the image of the semiconductor chip component and the bonding tool.

Invention of Claim 4 is provided with the bonding tool cooling device in any one of Claims 1-3,
A bonding apparatus that heats and presses a semiconductor chip component and mounts it on a circuit board using the bonding tool.

Invention of Claim 5 is the bonding apparatus of Claim 4, Comprising:
The bonding apparatus includes a plurality of bonding tools, and the bonding tool cooling apparatus has a function of cooling another bonding tool when one bonding tool mounts the semiconductor chip component on the circuit board.

The invention described in claim 6
A bonding tool cooling method for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater,
After the attachment tool has bonded the semiconductor chip component to the circuit board and then lifted and is waiting to supply the semiconductor chip component,
Move the conveying means to convey the semiconductor chip parts below the attachment tool,
Contact the cooling member provided on the transport means with the attachment tool,
This is a bonding tool cooling method for cooling the attachment tool surface.

  According to the first aspect of the present invention, since the cooling member that contacts and cools the attachment tool surface is provided, the bonding tool can be efficiently cooled in a short time. In addition, since the cooling member is provided in the conveying means for conveying the semiconductor chip component, the semiconductor chip component can be supplied to the attachment tool immediately after the bonding tool is cooled, and the delivery time is shortened.

  According to the second aspect of the present invention, the attachment tool is released from the adsorption by the bonding tool and the cooling member side is adsorbed, so that the delivery to the chip slider can be performed. Thereby, the attachment tool is separated from the bonding tool, and the cooling speed can be increased by reducing the heat capacity on the bonding tool side and increasing the air cooling area on the attachment tool side.

  According to the third aspect of the present invention, since the transport means transports the semiconductor chip component to a height between the recognition means for recognizing the image of the semiconductor chip component and the bonding tool, the semiconductor chip component is transferred to the bonding tool. It can be performed at the shortest distance and the delivery time can be shortened. Further, during the semiconductor chip transfer operation, the amount of positional deviation of the semiconductor chip mounted on the substrate can be measured by the lower visual field recognition means for recognizing the substrate side of the two visual field recognition means.

  According to the invention of claim 4, since the semiconductor chip component is picked up by the bonding tool cooled efficiently, the mounting without connection failure can be performed with a short tact time.

  According to the fifth aspect of the present invention, since one bonding tool mounts the semiconductor chip component on the substrate and simultaneously cools the other bonding tool, continuous mounting without cooling waiting time becomes possible.

  According to the invention described in claim 6, when the attachment tool is bonded to the circuit board and then rises and waits for supply of the semiconductor chip component, the transport means for transporting the semiconductor chip component is attached to the attachment tool. Since the attachment tool surface is cooled by moving it below the tool and bringing the cooling member provided in the conveying means into contact with the attachment tool, the bonding tool can be efficiently cooled in a short time without contact.

1 is a schematic side view of a bonding apparatus according to an embodiment of the present invention. It is a perspective view of the conveyance means which concerns on embodiment of this invention. It is a schematic plan view of the conveyance means which concerns on embodiment of this invention. It is a temperature rise prevention measure for the cooling member according to the embodiment of the present invention, (a) a method for cooling the cooling member with gas, (b) a method for connecting the cooling member to a heat sink, and (c) a heat capacity of the cooling member. It is a figure explaining the method to increase, and the method of providing the (d) radiation fin. It is an operation | movement flowchart of the bonding apparatus which concerns on embodiment of this invention. When picking up a semiconductor chip component from the chip slider, (a) a state in which the semiconductor chip component is disposed immediately below the bonding tool, (b) a state in which the bonding tool is lowered, and (c) an attachment tool of the bonding tool is the semiconductor chip component It is a figure which shows the state which picked up. When cooling the bonding tool using the cooling member according to the embodiment of the present invention, (a) a state in which the chip slider is moved so that the cooling member is disposed immediately below the bonding tool, and (b) cooling immediately below the bonding tool. It is a figure which shows the state in which the member is arrange | positioned, (c) the state which lowered | hangs the bonding tool and is cooling the attachment tool surface with the cooling member. When the cooling member according to the embodiment of the present invention has an adsorption hole, (a) the cooling member is disposed immediately below the bonding tool, (b) the bonding tool is lowered and cooled to the surface of the attachment tool. (C) It is a figure which shows the state which canceled the adsorption | suction of an attachment tool when raising a bonding tool, and delivered the attachment tool to the chip slider, when raising a bonding tool. It is a modification of the approach method of the cooling member and the bonding tool according to the embodiment of the present invention, and (a) the cooling member is lowered, and (b) the cooling member is raised by the protruding pins provided on the chip slider. It is a figure which shows a state. It is a modification of the approach method of the cooling member and bonding tool which concerns on embodiment of this invention, (a) The state which lowered the cooling member by the bellows provided in the chip slider, (b) The cooling member was raised It is a figure which shows a state. It is a schematic side view of the bonding apparatus which concerns on another embodiment of this invention. It is an operation | movement flowchart of the bonding apparatus which concerns on another embodiment of this invention. It is a schematic side view of a bonding apparatus. It is a schematic side view explaining the structure of a bonding tool.

  Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, the direction toward the bonding apparatus 1 is the X axis as the left-right direction, the Y axis as the front direction, the Z axis as the axis perpendicular to the XY plane composed of the X axis and the Y axis, and the direction rotating around the Z axis. Is the θ direction. Further, in the bonding apparatus 1, the same symbols are used for components common to the bonding apparatus 100 in FIG.

  The bonding apparatus 1 includes a bonding tool 10 that presses and heats a semiconductor chip component 4 (hereinafter referred to as a chip component 4) to a circuit board 2, a substrate stage 20 that holds the circuit board 2 by suction, and a chip component 4 that is bonded to the circuit board 2. 10 is provided with a conveying means 25 for horizontally conveying to 10, an upper visual field recognizing means for recognizing an alignment mark attached to the chip component 4, and a lower visual field recognizing means for recognizing the alignment mark attached to the circuit board 2. The recognizing unit 30 has two fields of view and a control unit 50 that controls the entire bonding apparatus 1.

  The bonding tool 10 has the structure shown in FIG. 14 and is composed of the members described in the background art.

  As shown in the example shown in FIG. 2, the transport unit 25 includes a chip slider 26 and a transport rail 27 that horizontally transport the chip component 4 from the chip supply unit to below the attachment tool 15. The chip slider 26 conveys semiconductor chip components to a height between the bonding tool 10 and the recognition means 30. FIG. 3 shows a state in which the chip slider 26 is referenced from the upper side in the Z direction. The chip slider 26 is provided with a chip adsorbing portion 28 that adsorbs and holds the chip component 4 and a cooling member 29 that cools the bonding tool 10 by surface contact with the attachment tool 15.

  The cooling member 29 preferably has a high thermal conductivity (50 W / m · K or more) and is not thermally deformed. Specific examples of the material having heat conductivity and heat resistance include aluminum nitride and silicon carbide. However, the present invention is not limited to this. Moreover, as a bonding head cooling device using the cooling member 29, it is not preferable that the temperature of the cooling member 29 rises due to heat received from the attachment tool 15. For this reason, it is desirable to provide a temperature rise prevention means for the cooling member 29. Some examples are shown in FIG. FIG. 4A shows the case where the cooling member 29 is cooled by jetting gas from the nozzle 29N, and FIG. 4B shows the case where the low-temperature heat sink 29S and the cooling member 29 are connected by the heat transfer member for cooling. 4 (c) is for increasing the heat capacity of the cooling member 29 to mitigate the temperature rise, and FIG. 4 (d) is for dissipating heat by providing the cooling member 29 with a radiating fan 29F. You may combine, and you may make another temperature rise prevention means.

  The operation of mounting the chip component 4 on the circuit board 2 using the bonding apparatus 1 having such a configuration will be described with reference to the flowchart shown in FIG.

  First, the chip part 4 is transported so that the chip slider 26 of the transport means 25 is arranged below the bonding tool 10 (FIG. 6A), and the bonding tool 10 is lowered (FIG. 6B). Then, the chip component 4 is picked up from the chip slider 26 (FIG. 6C) (step ST01). The chip slider 26 moves to the chip component supply unit, and the bonding tool 10 moves up to the standby position.

  At the same time, the two-view recognition means 30 is inserted between the circuit board 2 and the bonding tool 10. Next, the recognition means recognizes an image of the alignment marks attached to the chip component 4 and the circuit board 2 (step ST02).

  Next, the two-view recognition means 30 is moved to the standby position, and the bonding tool 10 is aligned in the θ direction and the substrate stage 20 is aligned in the XY direction based on the data recognized in the above (step ST03).

  Next, the bonding tool 10 is lowered (step ST04).

  Next, the heater 14 of the bonding tool 10 is heated to bond the chip component 4 to the circuit board 2 (step ST05).

  Next, the bonding tool 10 is raised to the standby position (step ST06).

  Next, cooling air is supplied to the cooling air flow path 18 provided in the bonding tool 10 to start the internal cooling of the heater 14 (step ST07).

  Next, as shown in FIGS. 7A to 7B, the cooling member 29 of the chip slider 26 is moved to the lower side of the bonding tool 10, and then the bonding tool is lowered to attach the attachment tool 15 to the cooling member. 29 is contacted (FIG. 7C), and surface cooling of the attachment tool 15 is started (step ST09). The chip slider 26 moves in a state where the chip component 4 to be bonded next is adsorbed by the chip adsorbing portion 28.

  At the same time, the two-view recognition means 30 is inserted between the circuit board 2 and the bonding tool 10.

  8A is provided in the cooling member 29 and communicates with a decompression mechanism (not shown), so that the attachment tool 15 can be delivered to the chip slider 26. That is, after the attachment tool 15 is brought into contact with the cooling member 29 (FIG. 8B), the inside of the suction hole 29V is depressurized and is passed through the attachment suction flow path 17 (see FIG. 14) (by the bonding tool 10). If the suction holding of the attachment tool 15 is released, the attachment tool 15 is separated from the heater 14, and the delivery is completed by suction holding on the chip slider 26 side (FIG. 8C). By doing so, the heat capacity of the heater 14 is reduced and high-speed cooling is possible. In addition, since the area where the attachment tool 15 comes into contact with air is increased, the cooling efficiency is increased, and the cooling speed can be increased.

  Next, it is confirmed whether or not the heater 14 has reached an appropriate temperature (step ST10). In the case of the soldering method, the temperature at which the heater 14 does not melt the solder, for example, 150 ° C. or less is an appropriate temperature, and in the case of the thermocompression bonding method using resin, the temperature at which the resin curing reaction does not start, for example, 80 ° C. or less.

  Next, when the proper temperature is reached, the cooling air for cooling the inside of the heater 14 is stopped, the bonding tool 10 is raised (the same arrangement as in FIG. 7B, the contact between the cooling member 29 of the chip slider 26 and the attachment tool 15). The cooling of the bonding tool 10 is finished (step ST11).

  Next, the chip slider 26 is moved so that the chip component 4 is positioned below the attachment tool 15 (arrangement similar to FIG. 6A) (step ST12).

  Next, the bonding tool 10 is lowered, and the chip component 4 is picked up from the chip slider 26 (step ST13).

  Next, returning to step ST02, the bonding of the chip component 4 and the cooling of the bonding tool 10 are sequentially repeated.

  As described above, by providing the cooling member 29 that cools the chip slider 26 that contacts the attachment tool 15 on the chip slider 26 that horizontally transports the chip component 4, the bonding tool 10 can be efficiently cooled, and the bonding tool 10 can be cooled. Immediately, semiconductor chip components can be supplied to the attachment tool, and the delivery time can be shortened.

  Further, by using the time between step ST07 and step ST13, the amount of displacement of the chip component 4 mounted on the circuit board 2 can be measured by the lower visual field recognition unit 30 of the two visual field recognition unit 30. I can do it.

  Heretofore, the example in which the bonding tool 10 is lowered to bring the cooling member 29 into contact with the attachment tool 15 has been described. However, the cooling member 29 is raised on the chip slider 26 to bring the cooling member 29 into the attachment tool. 15 may be contacted. Such a modification is shown in FIGS. FIG. 9 shows a state in which the cooling member 29 is lowered (FIG. 9A) and a state in which it is raised (FIG. 9B) by pins 29E that move up and down along the cylinder 29S. FIG. 10 shows a state in which the cooling member 29 is lowered (FIG. 10A) and a state in which it is raised (FIG. 10B) by the bellows 29B. Even when the cooling member 29 is moved up and down as described above, it is preferable to provide means for preventing the temperature of the cooling member from rising. In the example of FIG. 9, the nozzle 26N for ejecting the cooling gas is provided.

  By the way, the conveying means 25 of the bonding apparatus 1 shown in FIG. 1 may be used for a bonding apparatus having a plurality of bonding tools, thereby enabling efficient operation. An example thereof is shown in FIG. 11 as another embodiment. A bonding apparatus 200 in FIG. 11 includes two bonding tools, a bonding tool 10A and a bonding tool 10B. In the conveying means 25, one chip slider 26 supplies the chip component 4 to both bonding tools. The bonding tool 10A and the bonding tool 10B have the same structure as the bonding tool 10 shown in FIGS.

  In the bonding apparatus 200 having the conveying means 25 having the structure as shown in FIG. 2, when the chip slider 26 exists directly under one bonding tool, the space immediately below the other bonding tool is an empty space. Therefore, for example, the bonding tool 10B can bond the chip component 4 to the circuit board 2 at the same time that the attachment tool 15A of the bonding tool 10A is cooled by the cooling member 29 of the chip slider 26.

  FIG. 12 shows the operations of the bonding tool 10A and the bonding tool 10B and the position of the chip slider 26 during each operation in the bonding apparatus 200 of FIG. 12, STA01 to STA12 representing the operation steps of the bonding tool 10A and STB01 to STB12 representing the operation steps of the bonding tool 10B are the same operation steps as ST01 to ST12 of (bonding tool 10) shown in FIG. As shown in FIG. 12, in the bonding apparatus 200, while one bonding tool 10A (10B) is cooling, the other bonding tool 10B (10A) performs a bonding operation starting from the pickup of the chip component 4. Yes. That is, one of the bonding tools always performs bonding, and continuous bonding without a cooling waiting time can be realized.

1, 100, 200 Bonding device 2 Circuit board 3 Electrode 4 Semiconductor chip component (chip component)
5 Bump 10, 10A, 10B Bonding tool 11 Holder part 12 Heater base 13 Heat insulation block 14 Heater 15 Attachment tool 16 Chip adsorption flow path 17 Attachment adsorption flow path 18 Cooling air flow path 20 Substrate stage 25 Transport means 26 Chip slider 27 Transport rail 28 Chip adsorption unit 29 Cooling member 30 Recognizing means 50 Control unit

Claims (6)

A bonding tool cooling device for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater,
A cooling member that cools by contacting the attachment tool surface,
A bonding tool cooling device in which the cooling member is provided in a transfer means for transferring a semiconductor chip component in a horizontal direction. The bonding tool cooling device according to claim 1,
An adsorption hole is provided in the cooling member,
A bonding tool cooling device having a function of sucking and holding the attachment tool by depressurizing the inside of the suction hole. The bonding tool cooling device according to claim 1 or 2,
A bonding tool cooling apparatus, wherein the conveying means conveys the semiconductor chip component to a height between the recognition means for recognizing the image of the semiconductor chip component and the bonding tool. A bonding tool cooling device according to any one of claims 1 to 3,
A bonding apparatus in which a semiconductor chip component is heated and pressed using the bonding tool and mounted on a circuit board. The bonding apparatus according to claim 4,
A bonding apparatus comprising a plurality of bonding tools, wherein the bonding tool cooling device has a function of cooling another bonding tool when one bonding tool mounts the semiconductor chip component on the circuit board. A bonding tool cooling method for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater,
After the attachment tool has bonded the semiconductor chip component to the circuit board and then lifted and is waiting to supply the semiconductor chip component,
Move the conveying means to convey the semiconductor chip parts below the attachment tool,
Contact the cooling member provided on the transport means with the attachment tool,
Bonding tool cooling method to cool the attachment tool surface.

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