JP2017039155A - Reflow soldering apparatus and heating member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reflow soldering apparatus capable of heightening sufficiently soldering reliability; and to provide a heating member used for the reflow soldering apparatus.SOLUTION: A heating member 10 is used for a reflow soldering apparatus, and heats solder. The heating member 10 includes an iron tip part 12 having a pressing surface 14 to be pressed onto a workpiece. A plurality of slits 16 each having a groove shape recessed from the pressing surface 14 are formed on the iron tip part 12. The iron tip part 12 is constituted of a member not to be wet with solder.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a reflow soldering apparatus and a heating member used in the reflow soldering apparatus.

  Regarding a conventional soldering apparatus, for example, Japanese Patent Laid-Open No. 11-129066 discloses a soldering iron (trowel) for the purpose of improving the high reliability and durability so as to extend the life. (Patent Document 1). The soldering iron disclosed in Patent Document 1 includes a flange having a tip portion that melts the solder and attaches the solder to an object to be soldered, and a heating unit that heats the flange. The collar portion is formed from insulating ceramics. A recess surrounding the melted solder is formed at the tip of the collar portion.

  Japanese Patent Laid-Open No. 2001-1138 discloses that even if a metal placed on the tip of the ceramic is bitten, it can be easily replaced, and the metal portion cannot be easily removed after the metal portion is attached. A soldering iron has been disclosed which has an extremely good propagation of heat to the surface and is not restricted by the structure of the heater and the iron tip (Patent Document 2). In the soldering iron disclosed in Patent Document 2, ceramics having excellent thermal conductivity are used for the tip body, and a metal chip is attached to the tip of the body.

  Japanese Patent Laid-Open No. 2010-272605 discloses a soldering iron for the purpose of enabling high-quality manufacturing in a small electronic device that requires fine soldering (Patent Document). 3). In the soldering iron disclosed in Patent Document 3, a cylindrical through hole is formed at the tip of the soldering iron in order to prevent the flux from scattering. The tip of the soldering iron and the inner surface of the through hole are formed of a material of ceramic, tungsten, stainless steel, or titanium.

  Japanese Patent Laid-Open No. 11-320088 discloses that the frequency of soldering failure due to flux and carbide adhering to the terminal pressing surface of the head is reduced, and the polishing frequency of the terminal pressing surface is decreased to improve productivity. A head of a pulse heater for the purpose of making it disclosed is disclosed (Patent Document 4). In the pulse heater head disclosed in Patent Document 4, a number of grooves are formed on the terminal pressing surface of the head.

  Japanese Patent Application Laid-Open No. 2011-249471 discloses an apparatus for manufacturing a connection board for the purpose of reducing the occurrence of solder bridges (Patent Document 5). In the connection board manufacturing apparatus disclosed in Patent Document 5, the connection terminal part of the first wiring board is pressure-bonded to the backup plate and the connection terminal part of the second wiring board placed on the backup plate via solder. And a heater tool. The heater tool is formed with a slit capable of removing excess solder by capillary action during crimping.

  Japanese Patent Laid-Open No. 7-283523 has an object of cleaning and removing flux carbide efficiently during the movement of a workpiece (substrate) to a soldering operation position and without generating a loss time. Moreover, the local soldering apparatus is disclosed (patent document 6). The local soldering device disclosed in Patent Document 6 includes a moving table for reciprocating a substrate and a soldered object between a starting position and a soldering work position, and a position between the starting position and the soldering work position. A heating tool to be held and fixed and a cleaning unit provided on the moving table are provided. When the moving table moves back and forth between the starting position and the soldering work position, the soldering portion of the tip tip of the heating tool is brushed twice by the brass brush of the cleaning unit.

Japanese Patent Laid-Open No. 11-129066 JP 2001-1138 A JP 2010-272605 A Japanese Patent Laid-Open No. 11-320088 JP2011-249471A JP-A-7-283523

  As disclosed in the above-mentioned patent documents, various types of heating members for heating solder are used in a reflow soldering apparatus.

  However, depending on the shape and material of the tip (鏝) of the heating member, the molten solder may adhere to the heating member and the amount of solder related to the reflow solder may not be stable. There is a problem that the flow is obstructed and the solder does not spread sufficiently on the workpiece. In these cases, the reliability of soldering cannot be sufficiently increased.

  In addition, supply of flux is indispensable for performing soldering. One of the roles of the flux is to reduce the surface tension of the solder to improve the wetting and spreading of the solder, and one is to dissolve and remove the oxide film on the metal surface joined by the solder. One is to cover the solder surface during heating to prevent solder oxidation.

  However, during repeated soldering, flux carbides adhere to and accumulate on the tip of the heating member. If soldering is continued in such a state, heat transfer from the heating member to the solder is hindered, and the flatness of the tip portion is lowered, resulting in a problem that solderability is deteriorated. In these cases, the reliability of soldering cannot be sufficiently increased.

  Accordingly, an object of the present invention is to solve the above-described problems, and to provide a reflow soldering apparatus capable of sufficiently increasing the reliability of soldering and a heating member used in the reflow soldering apparatus. It is.

  The heating member according to the present invention is used in a reflow soldering apparatus and heats the solder. The heating member includes a tip portion having a pressure surface pressed against the workpiece. A plurality of slits that are recessed from the pressure surface and have a groove shape are formed in the tip portion. The tip portion is made of a member that does not wet the solder.

  According to the heating member configured as described above, since the tip portion is formed of a member that does not get wet with the solder, it is possible to suppress adhesion of molten solder to the tip portion. In addition, since a plurality of slits are formed in the tip portion, the molten solder flows through the slits, so that the solder can be widely spread on the workpiece. Therefore, according to the present invention, the reliability of soldering can be sufficiently enhanced.

  Preferably, ceramic, tungsten, molybdenum, titanium, or stainless steel is used as a member that does not wet with solder.

  According to the heating member configured as described above, it is possible to suppress the molten solder from adhering to the tip portion using these materials.

  Preferably, the heating member further includes a base portion made of a member that gets wet with the solder. The tip portion is configured by covering the surface of the base portion with a member using ceramic, tungsten, molybdenum, or titanium.

  According to the heating member configured as described above, the heating member can be manufactured at low cost without requiring an advanced processing technique.

  Preferably, the tip portion further includes a first side surface and a second side surface that are bent from the pressing surface and are arranged on the front and back sides. The slit extends from the first side surface to the second side surface.

  According to the heating member configured in this way, the molten solder can be spread over a wider range on the workpiece.

  Further preferably, the sectional area of the slit decreases from the first side surface toward the second side surface.

  According to the heating member configured as described above, since the solder easily flows through the slit, the soldering can be completed in a shorter time.

Preferably, the slit has a substantially semicircular cross-sectional shape.
According to the heating member configured as described above, the solder can easily flow through the slit by making the sectional shape of the slit correspond to the shape of the molten solder.

  Preferably, the pitch at which the plurality of slits are formed is equal to or less than L when the connection terminals are soldered to the plurality of terminal portions arranged on the substrate at a pitch L and provided with solder.

  According to the heating member configured in this way, any slit can be present in the vicinity of the molten solder with a higher probability.

  Further, preferably, when soldering a plurality of terminal portions that are arranged on the substrate at intervals and solder is provided, and the connection terminals are soldered, the slit volume of each slit is the volume of solder provided in each terminal portion. That's it.

  According to the heating member configured in this way, the molten solder can be more reliably held in the slit.

  Preferably, the tip portion further includes a first side surface and a second side surface which are bent from the pressure surface and are arranged on the front and back sides. The tip portion includes a first cutout portion in which the pressurization surface and the corner portion of the first side surface are cut out, and a second cutout portion in which the pressurization surface and the corner portion of the second side surface are cut out. Is formed. The slit extends from the first cutout portion to the second cutout portion.

  According to the heating member configured as described above, when there is an interference object that protrudes toward the pressure surface on the workpiece side, the interference object can be avoided by the first notch part and the second notch part. .

  A reflow soldering apparatus according to one aspect of the present invention includes a heating member according to any one of the above, a heating member detachably provided, a supporting member that supports the heating member, and heating the supporting member. A positioning member for positioning the member. The heating member has a flange that extends in a hook shape from the tip. The support member is fitted with a heating member, and a groove for regulating the position of the heating member in the longitudinal direction of the slit is formed. The positioning member locks the flange so that the heating member is held in a state of being fitted in the groove.

  According to the reflow soldering apparatus configured as described above, when replacing the heating member, it is possible to ensure the reproducibility of the position of the heating member in the longitudinal direction of the slit and to prevent the heating member from falling off the support member. it can.

  A reflow soldering apparatus according to another aspect of the present invention includes the heating member according to any one of the above and a pressure applying mechanism that applies pressure to the heating member in a direction approaching the workpiece. The pressure applying mechanism is configured to be able to apply a first pressure and a second pressure greater than the first pressure.

  According to the reflow soldering apparatus configured as described above, the pressure applied from the pressure applying mechanism to the heating member is changed between the first pressure and the second pressure in accordance with the progress of the soldering process. Can do.

  Preferably, the reflow soldering apparatus includes a sensor unit that detects a change in position of the heating member before and after melting of the solder, and a change in the position of the heating member detected by the sensor unit from the pressure applying mechanism unit to the heating member. And a controller that switches the applied pressure from the first pressure to the second pressure.

  According to the reflow soldering apparatus configured as described above, the pressure applied from the pressure applying mechanism to the heating member can be switched from the first pressure to the second pressure at the timing when the solder melts.

  A reflow soldering apparatus according to still another aspect of the present invention includes a heating member that heats solder. The heating member includes a pressing surface that is pressed against the workpiece, and has a tip portion that is formed with a plurality of slits that are recessed from the pressing surface to form a groove shape. The reflow soldering apparatus has a brush portion, and a cleaning portion that cleans the heating member by bringing the brush portion into contact with the pressing surface, and the brush portion contacts the pressing surface while moving along the longitudinal direction of the slit. And a moving mechanism unit that relatively moves the heating member and the cleaning unit.

  According to the reflow soldering apparatus configured as described above, the carbide of the flux adhering to the pressing surface and the slit is effectively obtained by bringing the brush portion into contact with the pressing surface while moving along the longitudinal direction of the slit. Can be removed. Thereby, the reliability of soldering can fully be improved.

Preferably, the tip portion is made of a member that does not get wet with solder.
According to the reflow soldering device configured as described above, it is possible to prevent the molten solder from adhering to the tip portion.

  Preferably, the reflow soldering apparatus further includes a control unit that controls the operation of the moving mechanism unit. The control unit relatively moves the heating member and the cleaning unit so that the brush unit comes into contact with the pressing surface in a state where the pressing surface and the slit are at a high temperature.

  According to the reflow soldering apparatus configured as described above, it is possible to more effectively remove the carbides of the flux adhering to the processed surface or the slit.

  Preferably, the moving mechanism unit moves the heating member along at least a first direction that intersects the pressure surface and a second direction parallel to the longitudinal direction of the slit.

  According to the reflow soldering apparatus configured as described above, the heating member is moved along the first direction to perform soldering, and the heating member is moved along the second direction to thereby heat the heating member. Can be cleaned.

  Preferably, the brush part includes a rotatable rotating shaft and a fibrous body provided radially on the outer peripheral surface of the rotating shaft.

  According to the reflow soldering device configured as described above, the heating member can be cleaned as the rotating shaft rotates.

Preferably, the brush part includes a fibrous body having a diameter smaller than the width of the slit.
According to the reflow soldering apparatus configured as described above, the carbides of the flux adhering to the slit can be more effectively removed.

  Preferably, the brush portion includes a fibrous body made of a member that does not wet with solder. Stainless steel, carbon, titanium, tungsten, or molybdenum is used as a member that does not wet with solder.

  According to the reflow soldering device configured as described above, even if a part of the fiber body adheres to the tip portion along with the cleaning of the heating member, it is caused by the fiber body during soldering. It can suppress that a solder adheres to a tip part.

  Preferably, the reflow soldering apparatus further includes a control unit that controls the operation of the moving mechanism unit. The control unit relatively moves the heating member and the cleaning unit so that the brush unit comes into contact with the pressing surface each time soldering is performed by heating by the heating member.

  According to the reflow soldering apparatus configured as described above, the reliability of soldering can be further improved by performing soldering using a sufficiently cleaned heating member.

  As described above, according to the present invention, it is possible to provide a reflow soldering apparatus capable of sufficiently increasing the reliability of soldering and a heating member used in the reflow soldering apparatus.

It is a figure which shows the heating member in Embodiment 1 of this invention. It is a figure which shows the connecting terminal soldered by the heating member in FIG. It is a figure which shows the 1st process of the soldering method using the heating member in FIG. It is a figure which shows the 2nd process of the soldering method using the heating member in FIG. It is a figure which shows the 3rd process of the soldering method using the heating member in FIG. It is a photograph which shows the soldering part provided according to the soldering method in FIGS. It is a figure which shows the 1st modification of the heating member in FIG. It is a figure which shows the 2nd modification of the heating member in FIG. It is a figure which shows the 1st process of the soldering method using the heating member in FIG. It is a figure which shows the 2nd process of the soldering method using the heating member in FIG. It is a figure which shows the 3rd process of the soldering method using the heating member in FIG. It is an external view which shows the reflow soldering apparatus in Embodiment 2 of this invention. It is a figure which shows the solder heating tool in FIG. It is an exploded view of the heating unit part of the solder heating tool in FIG. It is an external view which shows the reflow soldering apparatus in Embodiment 3 of this invention. It is a figure which shows the cleaning part in FIG. It is a figure which shows the cleaning process of a heating member in the reflow soldering apparatus in FIG. It is a figure which shows the cleaning process of a heating member in the reflow soldering apparatus in FIG. It is a figure which shows the modification of the cleaning part in FIG. It is a figure which shows the cleaning process of the heating member at the time of using the cleaning part in FIG. It is an external view which shows the 1st modification of the reflow soldering apparatus in FIG. It is a top view which shows the 2nd modification of the reflow soldering apparatus in FIG.

  Embodiments of the present invention will be described with reference to the drawings. In the drawings referred to below, the same or corresponding members are denoted by the same reference numerals.

(Embodiment 1)
FIG. 1 is a diagram showing a heating member in Embodiment 1 of the present invention. 1 (a) shows a front view, FIG. 1 (b) shows a side view, and FIG. 1 (c) shows a perspective view seen from the pressure surface 14 side described later. ing.

  Referring to FIG. 1, heating member 10 in the present embodiment heats solder in a reflow soldering apparatus.

  The heating member 10 has a tip portion 12 as a constituent part thereof. The tip portion 12 is provided at the tip of the heating member 10. The tip portion 12 has a pressing surface 14. The pressing surface 14 has a planar shape. The pressing surface 14 has a substantially rectangular plan view. The pressing surface 14 is pressed against the work during the soldering process using the heating member 10.

  The tip portion 12 further has a first side surface 17 and a second side surface 18. The first side surface 17 and the second side surface 18 are bent from the pressure surface 14 and extend. The first side surface 17 and the second side surface 18 are disposed on the front and back sides. The first side surface 17 and the second side surface 18 are arranged at a distance in the direction indicated by the arrow 101. The first side surface 17 and the second side surface 18 and the pressure surface 14 intersect at a right angle.

  A plurality of slits 16 are formed in the tip portion 12. The slit 16 is recessed from the pressure surface 14 and has a groove shape. The slit 16 has a substantially rectangular cross-sectional shape. The groove depth of the slit 16 is constant. The slit 16 extends from the first side surface 17 to the second side surface 18. The slit 16 extends linearly in one direction indicated by the arrow 101 (hereinafter, the direction indicated by the arrow 101 is also referred to as the longitudinal direction of the slit 16).

  The plurality of slits 16 extend in parallel to each other. The plurality of slits 16 are provided at intervals in the direction indicated by the arrow 102 orthogonal to the direction indicated by the arrow 101 (hereinafter, the direction indicated by the arrow 102 is also referred to as the arrangement direction of the slits 16). The plurality of slits 16 are provided at an equal pitch. The groove depth of the plurality of slits 16 is constant.

  The tip portion 12 is made of a member that does not get wet with solder. For example, ceramic, a high melting point material (such as tungsten or molybdenum), titanium, or stainless steel can be used as the member that does not wet the solder.

  Then, the process of the soldering method using the heating member 10 in FIG. 1 is demonstrated. FIG. 2 is a diagram showing the connection terminals soldered by the heating member in FIG. FIG. 2A shows a plan view, and FIG. 2B shows a side view.

  3 to 5 are diagrams showing the steps of the soldering method using the heating member in FIG. 3 (a), 4 (a) and 5 (a) show front views, and FIG. 3 (b), FIG. 4 (b) and FIG. 5 (b) show FIG. A cross section taken along line IIIb-IIIb in (a), a cross section taken along line IVb-IVb in FIG. 4 (a), and a cross section taken along line Vb-Vb in FIG. 5 (a) are shown. .

  With reference to FIGS. 1 to 5, in the present embodiment, it is assumed that a plurality of terminal portions 32 provided on substrate 31 and connection terminals 21 are soldered using heating member 10. Yes.

  The plurality of terminal portions 32 are provided at intervals. Each of the plurality of terminal portions 32 is provided with a solid solder 41. The solder 41 may be a lead-containing solder or a lead-free solder.

  The connection terminal 21 includes a base material 23, a plurality of terminal portions 24, a contact portion 25, and a cover lay 22. The base material 23 is comprised from films, such as a polyimide.

  The plurality of terminal portions 24 are provided on both surfaces of the base material 23. The terminal portion 24 extends in a strip shape in one direction on the surface of the base material 23. The plurality of terminal portions 24 are arranged at intervals. The plurality of terminal portions 24 are arranged at the same pitch as the plurality of terminal portions 32 on the substrate 31.

  The plurality of terminal portions 24 are formed, for example, by rolling a copper foil on both surfaces of the base material 23, patterning the copper foil, and then depositing Ni and Au. As an example, the pitch between the plurality of terminal portions 24 is 1 mm, and the width of each terminal portion 24 is about 0.55 mm.

  The contact portion 25 is provided so as to connect the terminal portions 24 provided on both surfaces of the base material 23 to each other. FIG. 2 shows the case where the contact portion 25 is provided at the peripheral edge portion of the base material 23. However, the present invention is not limited to such a configuration. For example, a through hole is provided in the terminal portion 24 to It is good also as a structure which mutually connects between the terminal parts 24 of both surfaces, and the structure which mixed both may be sufficient.

  The coverlay 22 is provided on both surfaces of the base material 23. The coverlay 22 is provided at the base part of the plurality of terminal parts 24. The cover lay 22 has a thickness larger than that of the terminal portion 24.

  Referring to FIG. 3, the flux is applied to the soldering portion of connection terminal 21 before the soldering process. As a method of applying the flux, various methods such as a dispenser, transfer, and brush coating can be employed.

  The substrate 31 is set on the stage 30. The connection terminal 21 is disposed on the substrate 31. At this time, the plurality of terminal portions 32 and the plurality of terminal portions 24 are opposed to each other through the solder 41. The heating member 10 is disposed on the connection terminal 21. At this time, the heating member 10 is arranged so that the slit 16 in the heating member 10 does not straddle the plurality of terminal portions 24 in the connection terminal 21. Preferably, the direction in which the terminal portion 24 extends in a strip shape in the connection terminal 21 and the direction in which the slit 16 extends in a linear shape in the heating member 10 are matched.

  Referring to FIGS. 4 and 5, soldering is performed by moving heating member 10 toward connection terminal 21 and pressing pressure surface 14 against connection terminal 21. As an example of the soldering conditions, the temperature of the heating member 10 is 300 to 350 ° C., the applied pressure is about 10 N, and the soldering time is about 3 s.

  As shown in FIG. 4, when the tip 12 contacts the connection terminal 21, the heat is transferred from the heating member 10 to the connection terminal 21, so that the solder 41 is remelted. The molten solder 41 flows out toward the first side surface 17 of the heating member 10 due to the load from the heating member 10. As shown in FIG. 5, the solder 41 that has flowed out toward the first side surface 17 of the heating member 10 flows into the slit 16 formed in the heating member 10, and thus wraps around the upper surface side of the connection terminal 21. Thereby, the connection intensity | strength and connection reliability in the soldering part of the some terminal part 32 on the board | substrate 31 and the connection terminal 21 can be improved.

  In the present embodiment, since the slit 16 extends from the first side surface 17 to the second side surface 18, the molten solder 41 can be smoothly wetted and spread on the upper surface side of the connection terminal 21. Moreover, since the molten solder 41 spreads in the longitudinal direction of the slit 16, it is possible to prevent a phenomenon (bridge phenomenon) in which the soldered portions are integrated between the adjacent terminal portions 32.

  Since the tip portion 12 of the heating member 10 is made of a member that does not get wet with the solder, the tip portion 12 does not bring back the solder, and the amount of solder in the soldering portion can be stabilized. Moreover, the phenomenon (solder erosion) that the material of the tip part 12 melts into the soldering part can be prevented. Such a phenomenon of solder erosion becomes more prominent as the temperature of the heating member 10 becomes higher using lead-free solder.

  In the soldering method in the present embodiment, solder 41 is provided in each terminal portion 32 in advance, and soldering is performed by remelting the solder 41, so that the amount of solder in the soldering portion is stabilized. Further, in the soldering method according to the present embodiment, the flux is applied to the soldering portion of the connection terminal 21 without using the thread solder containing the flux, so that the bump of the flux is prevented and the scattering of the flux is suppressed. be able to. Even if the application amount of the flux is small, the gasified flux diffuses through the slit 16 at the moment when the tip portion 12 contacts the connection terminal 21, so that the solderability can be improved.

  FIG. 6 is a photograph showing a soldering portion provided in accordance with the soldering method in FIGS. As can be seen with reference to FIG. 6, according to the present embodiment, the solder 41 can be spread over the entire upper surface of the terminal portion 24 of the connection terminal 21.

  With reference to FIGS. 1 to 5, the heating member 10 may have a configuration in which the cross-sectional area of the slit 16 decreases from the first side surface 17 toward the second side surface 18. According to such a configuration, since the inflow speed of the solder 41 from the first side surface 17 to the slit 16 is increased, the soldering process can be completed in a shorter time.

  The slit 16 may have a substantially semicircular cross-sectional shape. According to such a configuration, the solder 41 can easily flow through the slit 16 by making the cross-sectional shape of the slit 16 correspond to the shape of the molten solder 41.

  When the plurality of terminal portions 32 are arranged on the substrate 31 at the pitch L, the pitch at which the plurality of slits 16 are formed is preferably L or less. According to such a configuration, in the front view shown in FIG. 3A, even if the position of the heating member 10 is slightly shifted in the left-right direction, any one of the slits 16 near the solder 41 has a higher probability. The solder 41 can be made to wrap around the upper surface side of the connection terminal 21 through the slit 16. More preferably, the pitch at which the plurality of slits 16 are formed is L / 2 or less.

  The cut volume of the slit 16 is preferably equal to or greater than the volume of the solder 41 provided in the terminal portion 32. According to such a configuration, even when all of the molten solder 41 flows into the slit 16, the solder 41 can be held in the slit 16. If the solder 41 cannot be held in the slit 16, the excess solder ejected from the slit 16 becomes a solder ball, and this phenomenon can be prevented.

  If the structure of the heating member 10 in Embodiment 1 of this invention demonstrated above is demonstrated collectively, the heating member 10 in this Embodiment is used for a reflow soldering apparatus, and heats a solder. The heating member 10 includes a tip portion 12 having a pressing surface 14 that is pressed against a workpiece. A plurality of slits 16 that are recessed from the pressing surface 14 and have a groove shape are formed in the tip portion 12. The tip portion 12 is made of a member that does not get wet with solder.

  According to the heating member 10 according to the first embodiment of the present invention configured as described above, since the tip portion 12 is configured by a member that does not wet the solder, the molten solder 41 is applied to the tip portion 12. It can suppress adhering. In addition, since the plurality of slits 16 are formed in the tip portion 12, the molten solder 41 flows through the slits 16, so that the solder 41 can be widely spread on the workpiece. Therefore, the reliability of soldering between the substrate 31 and the connection terminal 21 can be improved.

  FIG. 7 is a view showing a first modification of the heating member in FIG. FIG. 7A shows a front view, and FIG. 7B shows a side view.

  Referring to FIG. 7, the heating member 10 </ b> A in the present modification has a tip portion 12 and a base portion 46 as its constituent parts. The base 46 is made of a member that gets wet with solder. The tip portion 12 is configured by covering the surface of the base portion 46 with a member using ceramic, tungsten, molybdenum, or titanium.

  For example, stainless steel is used as the material for the base 46. A shape corresponding to the slit 16 is formed by performing electric discharge machining by wire cutting on the base 46. When the heating member 10 in FIG. 1 is manufactured, a high processing technique such as processing a ceramic with a diamond tool is required. In this modification, a high accuracy is achieved without using such a high processing technique. The slit shape can be processed in a short time and at a low cost.

  Next, the oxide film adhering to the surface of the base 46 is removed by acid. Next, using a PVD method or a plasma CVD method, a ceramic, a high melting point material, titanium, DLC (Diamond-like Carbon) or the like is formed on the surface of the base 46 with a thickness of several μm or less, and the tip portion 12 is formed. The heating member 10A has, for example, a length of about 5 mm in the arrangement direction of the slits 16, a length of about 3.5 mm in the longitudinal direction of the slits 16, and a length of about 7 mm or less in the depth direction of the slits 16. Has a length. In this modification, a plurality of base portions 46 can be arranged in the film forming chamber and the surface of the base portion 46 can be coated by batch processing, so that the tip portion 12 can be formed at low cost.

  FIG. 8 is a view showing a second modification of the heating member in FIG. FIG. 8A shows a front view, and FIG. 8B shows a side view. 9 to 11 are diagrams showing the steps of the soldering method using the heating member in FIG. FIGS. 9 (a), 10 (a) and 11 (a) show front views, and FIGS. 9 (b), 10 (b) and 11 (b) show FIG. A cross section taken along line IXb-IXb in (a), a cross section taken along line Xb-Xb in FIG. 10 (a), and a cross section taken along line XIb-XIb in FIG. 11 (a) are shown. .

  With reference to FIGS. 8 to 11, in the heating member 10 </ b> B in the present modification, a first notch portion 47 and a second notch portion 48 are formed in the tip portion 12.

  The first cutout portion 47 is formed by cutting out the corner portions of the pressure surface 14 and the first side surface 17. The second notch 48 is formed by notching the corners of the pressing surface 14 and the second side surface 18. The first notch 47 and the second notch 48 are provided continuously in the direction in which the slits 16 are arranged. The slit 16 extends from the first notch 47 to the second notch 48.

  As shown in FIG. 10, when the tip 12 contacts the connection terminal 21, the heat is transferred from the heating member 10 to the connection terminal 21, so that the solder 41 is remelted. The molten solder 41 flows out toward the first notch 47 of the heating member 10 due to the load from the heating member 10. At this time, since the heating member 10B exists above the molten solder 41, the temperature drop of the solder 41 can be suppressed. As shown in FIG. 11, the solder 41 that has flowed out toward the first notch 47 of the heating member 10 </ b> B flows into the slit 16 formed in the heating member 10 </ b> B, and thus wraps around the upper surface side of the connection terminal 21.

  When the tip 12 contacts the connection terminal 21, if the cover member 22 shown in FIG. In some cases, soldering may not be completed within the specified time. On the other hand, when the heating member 10 is disposed so as to avoid interference with the cover lay 22, the connection terminal 21 may not be partially heated. In this modification, the connection terminal 21 is appropriately heated without causing the heating member 10B to interfere with the cover lay 22 by forming the first notch 47 and the second notch 48 in the heating member 10B. Can do.

(Embodiment 2)
In this embodiment, a reflow soldering apparatus using the heating member 10 in FIG. 1 will be described.

  FIG. 12 is an external view showing a reflow soldering apparatus according to Embodiment 2 of the present invention. Referring to FIG. 12, reflow soldering apparatus 50 in the present embodiment includes solder heating tool 60, base 51, support column 52, jig 53, Z-axis stage 54, guide rail 55, and sensor. A switch 56, a bracket 57, and an air cylinder 58 are provided.

  On the base 51, a workpiece (substrate 31 and connection terminal 21) to be soldered is installed by a jig 53. The support column 52 is erected on the base 51. A Z-axis stage 54 is fixed to the support column 52. The Z-axis stage 54 is a feed mechanism unit in the vertical direction (Z-axis direction). The solder heating tool 60 is attached to the Z-axis stage 54 via a guide rail 55 and a bracket 57.

  The guide rail 55 is a guide mechanism that guides the solder heating tool 60 so as to be movable in the vertical direction (Z-axis direction). The solder heating tool 60 has the heating member 10 described in the first embodiment. The solder heating tool 60 is provided so that the heating member 10 faces the workpiece on the base 51.

  The air cylinder 58 is attached to the Z-axis stage 54. The air cylinder 58 has a rod that can be expanded and contracted in the vertical direction (Z-axis direction), and the tip of the rod is connected to the guide rail 55 (carriage side). The air cylinder 58 is a pressure application mechanism that applies pressure to the solder heating tool 60 (heating member 10) in a direction approaching the workpiece as the rod extends.

  The air cylinder 58 is configured to be able to apply two systems of pressure, a first pressure and a second pressure larger than the first pressure, to the solder heating tool 60 by switching control of the electromagnetic valve. In the present embodiment, the first pressure is a low pressure of 1 N or less, and the second pressure is a medium pressure of 10 N or less.

  The sensor switch 56 is attached to the support column 52 via a bracket. The sensor switch 56 is provided on the opposite side of the air cylinder 58 across the guide rail 55 (carriage thereof) in the vertical direction (Z-axis direction).

  The sensor switch 56 is a sensor unit that detects a change in the position of the solder heating tool 60 (heating member 10) before and after melting of the solder (solder 41 in the first embodiment). The position of the sensor switch 56 is adjusted so that it does not operate when the heating member 10 comes into contact with the connection terminal 21 but operates when it falls below the position. That is, when the connection terminal 21 is heated by the heating member 10 and the solder 41 on the substrate 31 is remelted, the solder heating tool 60 (heating member 10) receiving the pressure from the air cylinder 58 is lowered, and the sensor switch 56 is turned on. Operate.

  The reflow soldering apparatus 50 further includes a control unit (not shown) that controls the operation of the air cylinder 58. When the position of the solder heating tool 60 (heating member 10) before and after the melting of the solder 41 is detected by the sensor switch 56, the control unit is given from the air cylinder 58 to the solder heating tool 60 (heating member 10). The pressure is switched from the first pressure to the second pressure.

  In the soldering process, the heat transfer state, the contact state of the connection terminal 21, the state of occurrence of scratches on the connection terminal 21, and the soldering time vary depending on the pressure acting on the connection terminal 21 from the heating member 10. For this reason, it is important to appropriately control the pressure acting on the connection terminal 21 from the heating member 10.

  Further, due to variations in the thickness of the substrate 31 and the connection terminal 21 to be soldered, the pressure acting on the connection terminal 21 from the heating member 10 may vary only by controlling the height of the Z-axis stage 54. Therefore, in the present embodiment, an air cylinder 58 is installed above the guide rail 55. At the time of soldering, first, the solder heating tool 60 is lowered by the Z-axis stage 54 so that the heating member 10 comes close to a position of about 1 mm on the connection terminal 21.

  Next, the heating member 10 is brought into contact with the connection terminal 21 with a low pressure of 1 N or less by switching control of the electromagnetic valve in the air cylinder 58. At this time, since the pressure acting on the connection terminal 21 from the heating member 10 is a low pressure, the connection terminal 21 can be prevented from being damaged. In addition, since the pressure acting on the connection terminal 21 from the heating member 10 is constant, the variation in time until the solder 41 is remelted can be reduced.

  When the sensor switch 56 is activated due to remelting of the solder 41, a medium pressure of 10 N or less is applied to the connection terminal 21 by switching control of the solenoid valve in the air cylinder 58, and the connection terminal 21 is brought into close contact with the terminal portion 32 on the substrate 31. Let

  According to such a configuration, the pressure acting on the connection terminal 21 from the heating member 10 can be switched from the low pressure to the medium pressure by the air cylinder 58 configured to be able to apply two systems of pressure.

  Further, by installing the sensor switch 56, remelting of the solder 41 can be confirmed. Before the solder 41 is melted, pressurization is performed at a low pressure, and after the solder 41 is melted, the connection terminal 21 is pressurized at medium pressure. It is possible. Accordingly, it is possible to solve the problem that the heat transfer state, the contact state of the connection terminal 21, the generation state of scratches on the connection terminal 21, and the soldering time are changed by the pressure acting on the connection terminal 21 from the heating member 10. In addition, it is possible to detect the presence or absence of remelting of the solder 41 through the presence or absence of the operation of the sensor switch 56.

  The reflow soldering apparatus 50 further includes a cleaning unit 121. The cleaning unit 121 includes a brush unit 122. In the present embodiment, the heating member 10 is cleaned (cleaned) by the cleaning unit 121 after the soldering process. The cleaning unit 121 will be described in detail in a third embodiment described later.

  FIG. 13 is a view showing the solder heating tool in FIG. In FIG. 13, the heating unit portion of the solder heating tool is shown in cross section. FIG. 14 is an exploded view of a heating unit portion of the solder heating tool in FIG. FIG. 14A shows a front view, and FIG. 14B shows a side view.

  With reference to FIG. 13 and FIG. 14, the solder heating tool 60 includes a controller 61 and a heating unit 69.

  The heating unit 69 is a part having the heating member 10, and further includes a flange 62, a cap nut 63, a sleeve 64, a heater 65, a heat transfer base 66 and a positioning member 67. The controller 61 controls energization to the heater 65.

  The heater 65 is composed of a nichrome heater or a ceramic heater. From the viewpoint of short heating time, a ceramic heater is more preferable. The heater 65 has a bar shape extending in one direction.

  A flange 62 and a heat transfer base 66 are fitted on the outer periphery of the heater 65. The heat transfer base 66 is a support member on which the heating member 10 is detachably provided and supports the heating member 10. The heat generated by the heater 65 is transmitted to the heating member 10 through the heat transfer base 66. A groove 72 is formed in the heat transfer base 66. The groove portion 72 is formed on the end surface of the heat transfer base 66 disposed on the extension of the heater 65. By fitting the heating member 10 into the groove 72, the position of the heating member 10 in the longitudinal direction of the slit 16 is regulated.

  The heating member 10 has a flange 71. The flange portion 71 is provided so as to expand in a hook shape from the end portion of the tip portion 12 on the side opposite to the pressing surface 14. The flange portion 71 is disposed in the groove portion 72.

  The positioning member 67 positions the heating member 10 with respect to the heat transfer base 66. More specifically, the positioning member 67 is fitted on the outer periphery of the heating member 10. The positioning member 67 locks the flange portion 71 so that the heating member 10 is held in a state of being fitted in the groove portion 72. The flange 71 is sandwiched between the heat transfer base 66 and the positioning member 67.

  The sleeve 64 is fitted on the outer periphery of the heat transfer base 66, the heating member 10, and the positioning member 67. The sleeve 64 is provided at an end in the axial direction, and has a reduced diameter portion 79 having a reduced diameter, and an opening 77 that opens at the tip of the reduced diameter portion 79. The heating member 10 is provided such that the tip portion 12 including the pressing surface 14 protrudes from the opening 77. By positioning the positioning member 67 inside the reduced diameter portion 79, the relative positions of the positioning member 67, the heating member 10, and the heat transfer base 66 in the axial direction of the sleeve 64 are restricted. Further, the cap nut 63 is fitted on the outer periphery of the sleeve 64 and screwed into the flange 62, whereby the sleeve 64, the positioning member 67, the heat transfer base 66, and the heating member 10 are held together, and the heating member 10 is also held. Is regulated with high accuracy.

  In the present embodiment, the heating member 10 can be easily replaced by detaching the cap nut 63 from the flange 62.

  As described in the first embodiment, when the tip 12 is in contact with the connection terminal 21, the heating member 10 pressurizes the cover lay 22 shown in FIG. There is a case where heat is not efficiently transferred from 10 to the connection terminal 21 and soldering is not completed within a specified time. In this Embodiment, the position reproducibility of the heating member 10 at the time of replacement | exchange can be ensured by the structure by which the position of the heating member 10 in the longitudinal direction of the slit 16 is controlled. Thereby, soldering can be performed without pressurizing the cover lay 22.

  Further, the configuration in which the positioning member 67 locks the flange portion 71 can prevent the heating member 10 from falling out of the groove portion 72. The position of the heating member 10 is regulated by the inner peripheral surface 76 of the positioning member 67. For this reason, by processing the dimension of the inner peripheral surface 76 with high accuracy in the direction in which the slits 16 are arranged, the position of the heating member 10 in the direction in which the slits 16 are arranged can be managed with high accuracy.

  According to the reflow soldering apparatus 50 according to the second embodiment of the present invention configured as described above, the effects described in the first embodiment can be similarly obtained.

(Embodiment 3)
FIG. 15 is an external view showing a reflow soldering apparatus according to Embodiment 3 of the present invention. The reflow soldering apparatus in the present embodiment has basically the same structure as that of the reflow soldering apparatus 50 in the second embodiment. Hereinafter, the description of the overlapping structure will not be repeated.

  Referring to FIG. 15, reflow soldering apparatus 110 in the present embodiment includes solder heating tool 60, base 51, bracket 57, SCARA robot 131, control unit (not shown), and cleaning unit 121. Have

  On the base 51, a workpiece (substrate 31 and connection terminal 21) to be soldered is installed by a jig 53. The solder heating tool 60 is supported by the SCARA robot 131 via the bracket 57. The SCARA robot 131 moves the solder heating tool 60 (heating member 10) to the three orthogonal axes of the X, Y, and Z axes and the θ axis centered on any of these three axes. Part. A control unit (not shown) controls the operation of the SCARA robot 131.

  The cleaning unit 121 cleans (cleans) the heating member 10. The cleaning unit 121 is provided on the base 51. The cleaning unit 121 is provided at a position where it is desired to leave the workpiece installed on the base 51.

  FIG. 16 is a diagram illustrating the cleaning unit in FIG. 15. 17 and 18 are diagrams showing a heating member cleaning step in the reflow soldering apparatus in FIG. FIGS. 16 (a), 17 (a) and 18 (a) show a front view, and FIGS. 16 (b), 17 (b) and 18 (b) show a side view. Has been.

  Referring to FIGS. 15 and 16, cleaning unit 121 includes pedestal portion 124 and brush portion 122. The pedestal portion 124 is fixed on the base 51. The brush part 122 is attached to the pedestal part 124. When the heating member 10 is cleaned by the cleaning unit 121, the brush unit 122 contacts the pressure surface 14. The brush part 122 includes a fixed block 123 and a fiber body 126. The fibrous body 126 is implanted in the fixed block 123. The fiber body 126 extends vertically upward from the fixed block 123.

  With reference to FIGS. 15 to 18, in the present embodiment, after performing the soldering process described in the first embodiment, a cleaning process of heating member 10 described below is performed.

  By operating the SCARA robot 131, the solder heating tool 60 is moved from directly above the workpiece toward the cleaning unit 121. Next, the solder heating tool 60 (heating member 10) is moved so that the brush part 122 contacts the pressing surface 14 while moving along the longitudinal direction of the slit 16. In the present embodiment, the solder heating tool 60 (heating member 10) is reciprocated along the longitudinal direction of the slit 16.

  At this time, the height of the solder heating tool 60 (heating member 10) is adjusted so that the fiber body 126 reaches the bottom of the slit 16. It is preferable that the pressing amount of the heating member 10 from the position where the fibrous body 126 contacts the pressing surface 14 is larger than the depth of the slit 16.

  Through the above-described cleaning process, slack carbide adhering to the pressure surface 14 and the slit 16 can be removed from the heating member 10. Thereby, the heat transfer from the heating member 10 to the solder 41 is hindered during the soldering process, the flatness of the tip portion 12 is lowered, the solderability is deteriorated, and the deposits are attached to the connection terminals 21. It is possible to solve the problem of falling on the terminal portion 24 and hindering the wetting and spreading of the solder 41.

  In this embodiment, since the SCARA robot 131 moves the solder heating tool 60 (heating member 10) to the cleaning unit 121 to perform the cleaning process, the carbide of the flux removed from the heating member 10 adheres to the workpiece. Can be prevented.

  The cleaning process is preferably performed in a state where the pressure surface 14 and the slit 16 are at a high temperature. The cleaning process is preferably performed every time the soldering process is performed.

  The diameter of the fibrous body 126 is preferably smaller than the width of the slit 16 in order to efficiently scrape slack carbide adhering in the slit 16. The diameter of the fibrous body 126 is more preferably 1/2 or less of the width of the slit 16.

  In order to evenly clean the entire pressing surface 14 and slit 16, the width in which the fibrous body 126 is provided is preferably equal to or greater than the width of the first side surface 17 and the second side surface 18.

  When the fibrous body 126 is configured by a member that is wetted by solder such as brass, fragments of the fibrous body 126 may adhere to the tip portion 12 as the heating member 10 is cleaned. When soldering is performed with such a heating member 10, the solder is wetted on the tip portion 12, and the flow of the solder 41 in the slit 16 is blocked, or when the temperature of the heating member 10 rises, the tip portion 12 is connected. There arises a problem that the terminal portion 24 of the terminal 21 is bonded to the connection terminal 21 on the substrate 31 and floats. In order to solve such a problem, it is preferable that the fibrous body 126 is formed of a member that does not wet with solder such as stainless steel, carbon, titanium, tungsten, or molybdenum.

  The structure of the reflow soldering apparatus 50 according to the third embodiment of the present invention described above will be described together. The reflow soldering apparatus 50 according to the present embodiment includes the heating member 10 that heats the solder 41. The heating member 10 includes a pressing surface 14 that is pressed against a workpiece, and includes a tip portion 12 in which a plurality of slits 16 that are recessed from the pressing surface 14 and have a groove shape are formed. The reflow soldering apparatus 50 includes a brush portion 122, and a cleaning portion 121 that cleans the heating member 10 by bringing the brush portion 122 into contact with the pressure surface 14, and the brush portion 122 moves along the longitudinal direction of the slit 16. A SCARA robot 131 is provided as a moving mechanism unit that relatively moves the heating member 10 and the cleaning unit 121 so as to come into contact with the pressing surface 14.

  According to the reflow soldering apparatus 50 according to the third embodiment of the present invention configured as described above, the carbides of the flux adhering to the pressing surface 14 and the slit 16 can be effectively removed. Thereby, the reliability of soldering can fully be improved.

  FIG. 19 is a diagram showing a modification of the cleaning unit in FIG. FIG. 19A shows a front view, and FIG. 19B shows a side view. FIG. 20 is a diagram illustrating a heating member cleaning process when the cleaning unit in FIG. 19 is used. FIG. 20A shows a front view, and FIG. 20B shows a side view.

  Referring to FIGS. 19 and 20, in cleaning unit 121 </ b> A in this modification, brush unit 122 includes a rotation shaft 132, a fiber body 126, and a rotation drive unit (not shown). The rotation shaft 132 is supported by the pedestal portion 124 so as to be rotatable about the central axis 106. The fibrous body 126 is provided radially on the outer peripheral surface of the rotating shaft 132. The rotation driving unit (not shown) rotates the rotation shaft 132 in the direction indicated by the arrow in FIGS. 19B and 20B.

  During the cleaning process, the fiber body 126 can easily enter the slit 16 by rotationally driving the rotating shaft 132 so that the fiber body 126 moves along the longitudinal direction of the slit 16.

  An example of the cleaning conditions in the cleaning unit 121 when the heating member 10 having a slit width of 0.2 mm and a slit depth of 0.2 mm is used is as follows.

The material of the fiber body 126: SUS, the diameter of the fiber body 126: 0.07 mm, the pushing amount of the heating member 10 from the position where the fiber body 126 contacts the pressing surface 14: 0.5 mm
Free length of fibrous body 126: 9 mm, rotational speed of brush portion 122: 2 rpm, moving speed of heating member 10: 30 mm / s
FIG. 21 is an external view showing a first modification of the reflow soldering apparatus in FIG. Referring to FIG. 21, in this modification, instead of the SCARA robot 131 in FIG. 15, the Z-axis stage 141 and the Y-axis stage 143 serve as a moving mechanism unit that moves the solder heating tool 60 (heating member 10). Is provided.

  The Z axis stage 141 is attached to the carriage 144 of the Y axis stage 143. The solder heating tool 60 is attached to the Z-axis stage 141 via the floating part 142 and the bracket 57. The Z-axis stage 141 is a feed mechanism section in the vertical direction (Z-axis direction), and moves the solder heating tool 60 (heating member 10) in a direction that intersects (orthogonally intersects) the pressing surface 14. The Y-axis stage 143 is a feed mechanism unit in the horizontal direction (Y-axis direction), and moves the solder heating tool 60 (heating member 10) in a direction parallel to the longitudinal direction of the slit 16.

  In this modification, the solder heating tool 60 is configured to be movable in the Z-axis direction and the Y-axis direction, but may be configured to be movable in different axial directions.

  Further, in this modification, a cleaning unit 121B having a brush unit 122 in FIG. 19 is provided instead of the cleaning unit 121 in FIG. The cleaning unit 121B further includes a cover body 146, an air blow unit 147, and an air suction unit 148.

  The air blow part 147 blows air toward the heating member 10 (tip part 12) at the time of cleaning. Thereby, it is prevented that the fragments of the fibrous body 126 or fine flux carbides adhere to the tip portion 12. The cover body 146 is provided so as to surround the brush portion 122 from the horizontal direction. The cover body 146 prevents the fine flux carbide from scattering. The air suction unit 148 sucks air from the space surrounded by the cover body 146. This prevents the fragments of the fibrous body 126 and the flux carbides from flying up.

  FIG. 22 is a plan view showing a second modification of the reflow soldering apparatus in FIG. Referring to FIG. 22, in this modification, the reflow soldering apparatus further includes a turntable 151. The rotary table 151 is provided with a jig 53P and a jig 53Q. As the rotary table 151 rotates, the jig 53P and the jig 53Q are alternately positioned in the soldering / cleaning area 161 and the LD / ULD (load / unload) area 162 and positioned.

  First, a workpiece is set on the jig 53 in the LD / ULD region 162. Next, the rotary table 151 is rotated to supply the work to the soldering / cleaning area 161. Next, the workpiece is soldered in the soldering / cleaning area 161. Next, the rotary table 151 is rotated and the work is carried out to the LD / ULD area 162. During this time, the solder heating tool 60 is moved toward the cleaning portion 121B, and the heating member 10 is cleaned.

  By performing the cleaning process of the heating member 10 every time after the soldering process, stable soldering without adhesion of flux carbides can be performed. In addition, the mass production machine can be operated with a tact time of 10 s or less.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention is mainly used for manufacturing using reflow soldering.

  10, 10A, 10B Heating member, 12 tip portion, 14 pressure surface, 16 slit, 17 first side surface, 18 second side surface, 21 connection terminal, 22 cover lay, 23 base material, 24, 32 terminal portion, 25 Contact part, 30 stage, 31 substrate, 41 solder, 46 base part, 47 first notch part, 48 second notch part, 50, 110 reflow soldering device, 51 base, 52 strut, 53, 53P, 53Q jig , 54, 141 Z-axis stage, 55 guide rail, 56 sensor switch, 57 bracket, 58 air cylinder, 60 solder heating tool, 61 control unit, 62 flange, 63 cap nut, 64 sleeve, 65 heater, 66 heat transfer base, 67 Positioning member, 69 Heating unit part, 71 collar part, 72 groove part, 76 inner peripheral surface , 77 opening, 79 reduced diameter part, 106 central axis, 121, 121A, 121B cleaning part, 122 brush part, 123 fixed block, 124 pedestal part, 126 fiber body, 131 SCARA robot, 132 rotating shaft, 142 floating part, 143 Y-axis stage, 144 carriage, 146 cover body, 147 air blow section, 148 air suction section, 151 rotary table, 161 cleaning area, 162 LD / ULD area.

Claims (20)

A heating member used in a reflow soldering apparatus for heating solder,
Provided with a tip having a pressure surface pressed against the workpiece,
The tip portion is formed with a plurality of slits that are recessed from the pressure surface to form a groove shape,
The said tip part is a heating member comprised with the member which does not get wet with solder.   The heating member according to claim 1, wherein ceramic, tungsten, molybdenum, titanium, or stainless steel is used as the member that does not wet the solder. It further includes a base composed of a member that gets wet with solder,
The heating member according to claim 1, wherein the tip portion is configured by covering a surface of the base portion with a member using ceramic, tungsten, molybdenum, or titanium. The tip portion further includes a first side surface and a second side surface that are bent from the pressing surface and are arranged on the front and back sides.
The heating member according to any one of claims 1 to 3, wherein the slit extends from the first side surface to the second side surface.   The heating member according to claim 4, wherein a cross-sectional area of the slit decreases from the first side surface toward the second side surface.   The heating member according to any one of claims 1 to 5, wherein the slit has a substantially semicircular cross-sectional shape.   The pitch at which the plurality of slits are formed when soldering a plurality of terminal portions arranged at a pitch L on a substrate and provided with solder and connection terminals is L or less. The heating member according to any one of 6.   When soldering a plurality of terminal portions, which are arranged on the substrate at intervals and are provided with solder, and connection terminals, the slit volume of each slit is equal to or greater than the volume of solder provided in each terminal portion. The heating member according to any one of claims 1 to 7, wherein: The tip portion further includes a first side surface and a second side surface which are bent and extended from the pressure surface and are arranged on the front and back sides.
The tip portion includes a first notch portion in which corners of the pressure surface and the first side surface are cut out, and a first notch portion in which corners of the pressure surface and the second side surface are notched. Two notches are formed,
The heating member according to any one of claims 1 to 8, wherein the slit extends from the first cutout portion to the second cutout portion. The heating member according to any one of claims 1 to 9,
The heating member is detachably provided, and a support member that supports the heating member;
A positioning member that positions the heating member with respect to the support member;
The heating member has a collar portion that spreads in a bowl shape from the tip portion,
The heating member is fitted into the support member, and a groove portion that regulates the position of the heating member in the longitudinal direction of the slit is formed.
The reflow soldering apparatus, wherein the positioning member locks the flange so that the heating member is held in a state of being fitted in the groove. The heating member according to any one of claims 1 to 9,
A pressure applying mechanism that applies pressure to the heating member in a direction approaching the workpiece;
The reflow soldering apparatus, wherein the pressure applying mechanism is configured to be able to apply a first pressure and a second pressure larger than the first pressure. A sensor unit for detecting a change in position of the heating member before and after melting of the solder;
A control unit that switches the pressure applied to the heating member from the pressure application mechanism unit from the first pressure to the second pressure when a change in the position of the heating member is detected by the sensor unit; The reflow soldering apparatus according to claim 11. A heating member for heating the solder;
The heating member includes a pressing surface that is pressed against a workpiece, and has a tip portion formed with a plurality of slits that are recessed from the pressing surface to form a groove shape,
A cleaning unit that has a brush part and cleans the heating member by bringing the brush part into contact with the pressure surface;
A reflow soldering apparatus comprising: a moving mechanism unit that relatively moves the heating member and the cleaning unit so that the brush unit contacts the pressure surface while moving along the longitudinal direction of the slit.   The reflow soldering apparatus according to claim 13, wherein the tip portion is formed of a member that does not wet with solder. A control unit for controlling the operation of the moving mechanism unit;
The said control part moves the said heating member and the said cleaning part relatively so that the said brush part may contact the said pressurization surface in the state where the said pressurization surface and the said slit are high temperature. Reflow soldering equipment.   The moving mechanism unit moves the heating member along at least a first direction that intersects the pressure surface and a second direction parallel to the longitudinal direction of the slit. The reflow soldering apparatus described.   The reflow soldering apparatus according to any one of claims 13 to 16, wherein the brush portion includes a rotatable rotating shaft and a fibrous body provided radially on an outer peripheral surface of the rotating shaft.   The reflow soldering apparatus according to claim 13, wherein the brush portion includes a fibrous body having a diameter smaller than a width of the slit. The brush part includes a fibrous body composed of a member that does not wet solder,
The reflow soldering apparatus according to any one of claims 13 to 18, wherein stainless steel, carbon, titanium, tungsten, or molybdenum is used as the member that does not wet the solder. A control unit for controlling the operation of the moving mechanism unit;
20. The control unit according to claim 13, wherein the control unit relatively moves the heating member and the cleaning unit so that the brush unit is in contact with the pressure surface each time soldering is performed by heating by the heating member. The reflow soldering apparatus of any one of Claims.

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