JP2017020943A - Holding structure of wire probes - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a holding structure of wire probes that can make the minimum pitch of wire probes smaller even if the top of a wire probe is not formed into a specific shape relative to a prior one, and without limiting the number of wire probes.SOLUTION: A jig 10 for wire probes includes a base part 11 holding a rear end 30b of a wire probe 30. The base part 11 has an insertion hole 12, which is provided with a large-diameter part 12a facing an electrode substrate 40 and a small-diameter part 12b leading to the large-diameter part 12a. Between the parts 12a and 12b, a step part 12c is formed. The wire probe 30 has a ring-shaped engagement part 33 in the large-diameter part 12a having a larger diameter than that of the small-diameter part 12b.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a holding structure for a wire probe used for substrate inspection.

  2. Description of the Related Art Conventionally, inspection using a fine wire probe has been performed in continuity inspection and electrical characteristic inspection of a semiconductor integrated circuit (substrate to be inspected). For example, both ends of a plurality of wire probes are held by a wire probe jig, the wire probe jig is sandwiched between an electrode substrate and a substrate to be inspected, and both ends of the wire probe are respectively inspected with the terminals of the electrode substrate and the substrate to be inspected. A method is known in which inspection is performed by contacting a terminal of a substrate. In such an inspection, when the electrode to be inspected is small, it is necessary to reduce the minimum pitch (arrangement interval) of the wire probes.

  However, in the conventional wire probe, the minimum pitch of the wire probe is inevitably determined by the diameter of the metal pin of the wire probe.

  That is, when inserting the wire probe into the wire probe jig, the wire probe is inserted from the hole facing the electrode substrate (the hole on the rear end side), and the hole facing the substrate to be inspected (the tip) Project from the side hole). In the conventional wire probe, when the tip part is inserted into the hole on the tip side, the insulating coating is locked to the hole on the tip side and functions as a stopper, so that the wire probe falls off from the wire probe jig. (See Patent Document 1 described later). At this time, the hole on the tip side needs to be formed with a large diameter so that the tip portion (metal pin) of the wire probe can slide smoothly. The insulating coating of the wire probe needs to be formed with a diameter larger than that of the hole on the tip side to such an extent that it cannot pass through the hole on the tip side. Furthermore, the hole on the rear end side needs to be formed with a diameter larger than that of the insulating coating so that the insulating coating of the wire probe can pass therethrough. Since the wall thickness between the holes on the rear end side is determined by processing technology restrictions, the minimum pitch of the wire probe determined by the hole diameter on the rear end side and the wall thickness between the holes is also determined. .

  As described above, the minimum value of the hole diameter on the tip side is inevitably determined by the diameter of the metal pin of the wire probe, and the minimum value of the outer diameter of the insulating coating is inevitably determined by the hole diameter on the tip side. The minimum value of the hole diameter on the rear end side is inevitably determined by the diameter, and the minimum pitch of the wire probe is inevitably determined by the hole diameter on the rear end side. In other words, the minimum pitch of the wire probe is inevitably determined by the diameter of the metal pin of the wire probe. For this reason, the only way to reduce the minimum pitch of the wire probe is to reduce the diameter of the metal pin of the wire probe.

  However, when a linear thin wire probe is used, the maintenance cost increases and the replacement work becomes complicated. In other words, if a narrow pitch can be realized without reducing the diameter of the metal pin, it is possible to reduce the cost of the user and improve the workability. Therefore, a technique for realizing a narrow pitch without reducing the diameter of the metal pin has been demanded.

  In Patent Document 1, two probe needles are inserted into one hole of a jig for an inspection apparatus as a pair, and four terminals for simultaneously contacting the tip portions of the pair of probe needles with one electrode of a measured object. A technique for measuring electrical characteristics of the object to be measured by resistance measurement is disclosed. According to such a method, the minimum pitch of the two probe needles can be reduced without reducing the diameter of the metal pin.

  In the technique described in Patent Document 1, the tip of the probe needle inserted into the hole is formed of a metal conductor exposed from the insulating film, and a part or all of the insulating film on the tip side is removed. An insulating film removing portion is formed, and a step portion is provided between the insulating film removing portion and the insulating film. The stepped portion engages with the hole periphery and functions as a stopper, thereby preventing the probe needle from falling off the inspection apparatus jig.

JP 2006-98066 A

  However, in the structure described in Patent Document 1 described above, the shape of the tip of the probe needle inserted into the hole is not a circular cross-section like a normal wire probe, so the probe needle cannot slide smoothly in the hole. There was a fear. Further, when the number of probe needles is two, the minimum pitch can be reduced, but the minimum pitch cannot be reduced for three or more probe needles.

  Therefore, the present invention can reduce the minimum pitch of the wire probes as compared with the prior art without using a special shape at the tip of the wire probe, and the minimum number of wire probes without limiting the number of wire probes. It is an object of the present invention to provide a wire probe holding structure capable of reducing the pitch.

  The present invention has been made to solve the above-described problems, and is characterized by the following.

  The invention according to claim 1 includes a wire probe, and a wire probe jig that holds both ends of the wire probe and is arranged between the electrode substrate and the substrate to be inspected. The tool includes a base portion that is disposed so as to be in contact with the electrode substrate while holding a rear end portion of the wire probe, and the base portion is provided with a plurality of insertion holes through which the wire probe is inserted. The hole includes a large-diameter portion facing the electrode substrate and a small-diameter portion continuous to the large-diameter portion, and a step is formed between the large-diameter portion and the small-diameter portion, and the wire probe Is provided with a ring-shaped latching portion that is built in the large-diameter portion and has a larger diameter than the small-diameter portion.

  The invention described in claim 2 is characterized in that, in addition to the feature of the invention described in claim 1, the large-diameter portion of the insertion hole is connected to another large-diameter portion. .

  The invention described in claim 3 is characterized in that, in addition to the feature of the invention described in claim 1 or 2, the step portion is formed by using the insertion hole as a step hole. .

  The invention according to claim 1 is as described above, and the insertion hole through which the wire probe is inserted includes a large diameter portion facing the electrode substrate and a small diameter portion continuous to the large diameter portion, and the large diameter portion And a step portion is formed between the small-diameter portion, and the wire probe includes a ring-shaped locking portion that is built in the large-diameter portion and has a larger diameter than the small-diameter portion. For this reason, a ring-shaped latching | locking part becomes a stopper and it can prevent that a wire probe falls off from the jig | tool for wire probes. Since the locking portion serves as a stopper, it is not necessary to lock the insulating film of the wire probe in the hole on the tip side. In other words, the insulating film of the wire probe can be thinned. Since the hole diameter on the rear end side can be reduced by thinning the insulating film of the wire probe, the minimum pitch of the wire probe can be reduced. And since such an effect is realizable without making the front-end | tip part of a wire probe into a special shape, the problem that the front-end | tip part of a wire probe cannot slide smoothly does not generate | occur | produce. Further, the minimum pitch of the wire probes can be reduced without limiting the number of wire probes.

  Moreover, since the latching | locking part is hold | maintained by a large diameter part, the rear-end part of the wire probe which faces a board | substrate does not move, but can improve the position accuracy of a wire probe.

  Moreover, invention of Claim 2 is as above-mentioned, The large diameter part of the said insertion hole is connected and formed with another large diameter part. According to such a configuration, the minimum pitch of the wire probes can be further reduced by bringing the insertion hole closer. In addition, since the wire probe inserted in the large diameter part is insulated by the ring-shaped latching | locking part, even if an adjacent wire probe contacts, it can maintain the state electrically insulated mutually.

  Moreover, invention of Claim 3 is as above-mentioned, The said step part is formed by making the said insertion hole into a step hole. According to such a configuration, the step portion can be formed regardless of the shape of the insertion hole. For example, if the plate that penetrates the insertion hole is thick, even if it is necessary to counter-sink the back side of the insertion hole due to limitations in processing technology, the step is formed using the straight hole on the front side. can do.

It is a sectional side view of the holding structure of a wire probe. It is a side view of a wire probe. It is side sectional drawing of the holding structure of a wire probe, Comprising: (a) The partial enlarged view vicinity of the rear-end part of a wire probe, (b) The figure which expanded further the rear-end part vicinity of the wire probe further. (A) The partial enlarged view which looked at the penetration hole from the opening side, (b) The partial enlarged view which looked at the penetration hole which concerns on the modification 1 from the opening side. (A) Partially enlarged view of the insertion hole according to Modification 2 seen from the opening side, (b) Partially enlarged view of the insertion hole according to Modification 3 from the opening side, (c) According to Modification 4 It is the partially expanded view which looked at the insertion hole from the opening side, (d) It is the partially expanded view which looked at the insertion hole which concerns on the modification 5 from the opening side. It is a sectional side view of the holding structure of the wire probe which concerns on the modification 6, Comprising: It is a partially expanded view near the rear-end part of a wire probe.

  Embodiments of the present invention will be described with reference to the drawings.

  The holding structure of the wire probe 30 according to the present embodiment is for a wire probe that is disposed between the electrode substrate 40 and a substrate to be inspected (not shown) while holding both ends of the wire probe 30 and the wire probe 30. And a jig 10.

  As shown in FIG. 2 and the like, the wire probe 30 includes an insulating film 32 and a locking portion 33 on the outer peripheral portion of a conductive metal pin 31. The insulating film 32 is an insulating coating that covers the outer periphery of the metal pin 31 at the intermediate portion of the wire probe 30. By providing this insulating film 32, insulation from other wire probes 30 is ensured even when the wire probe 30 is bent. The locking portion 33 is a ring-shaped insulator attached to the outer periphery of the metal pin 31 in the vicinity of the rear end portion 30b of the wire probe 30. The locking portion 33 ensures insulation of the wire probe 30 and prevents the wire probe 30 from falling off the wire probe jig 10.

  The wire probe 30 is held by the wire probe jig 10 so that the front end 30a and the rear end 30b are exposed. At the time of inspection, the exposed front end portion 30 a contacts the terminal of the substrate to be inspected, and the exposed rear end portion 30 b contacts the terminal of the electrode substrate 40.

  The electrode substrate 40 is provided with the end portion of the wiring 41 exposed at a position in contact with the rear end portion 30 b of the wire probe 30. The wiring 41 is electrically connected to an inspection scanner (not shown), so that a predetermined portion of the substrate to be inspected can be inspected using the wire probe 30. Yes.

  As shown in FIG. 1, the wire probe jig 10 holds a plurality of wire probes 30 so as not to contact each other. The wire probe jig 10 has one surface fixed to the surface of the electrode substrate 40, the other surface is pressed against a substrate to be inspected such as a semiconductor integrated circuit, and both ends of the held wire probe 30 are respectively connected to the electrode substrate. It is used for contacting the 40 terminals and the terminals of the substrate to be inspected.

  As shown in FIG. 1, the wire probe jig 10 according to the present embodiment includes a base portion 11 disposed on the electrode substrate 40 side, a head portion 17 disposed on the substrate to be inspected, and a base portion 11. And a spacer 22 provided between the head portion 17 and the head portion 17.

  The base portion 11 is a plate-like portion that is disposed so as to be able to contact the electrode substrate 40 while holding the rear end portion 30b of the wire probe 30, and in this embodiment, two pieces of the first base plate 13 and the second base plate 15 are provided. It is configured by overlapping the plates. The two plates are connected by a base fixing screw 23. A base fixing screw 23 for connecting the two plates is screwed to the spacer 22, whereby the base portion 11 and the spacer 22 are integrally fixed.

  The base part 11 is provided with a plurality of insertion holes 12 through which the wire probe 30 is inserted. The insertion hole 12 is formed by communication between a first rear end hole 14 of the first base plate 13 described later and a second rear end hole 16 of the second base plate 15. As shown in FIG. 3, the insertion hole 12 includes a large-diameter portion 12a facing the electrode substrate 40 and a small-diameter portion 12b continuous with the large-diameter portion 12a. Since the small diameter portion 12b is formed to have a smaller diameter than the large diameter portion 12a, a stepped portion 12c is formed between the large diameter portion 12a and the small diameter portion 12b. The large-diameter portion 12a is used to house the locking portion 33 of the wire probe 30, but the small-diameter portion 12b has a smaller diameter than the locking portion 33, so that the edge of the locking portion 33 becomes the step portion 12c. It is designed to be locked.

  The first base plate 13 is a plate disposed so as to face the electrode substrate 40. At the time of inspection, the surface of the first base plate 13 is fixed in a state of being in contact with the electrode substrate 40. The first base plate 13 is provided with a first rear end hole 14 through which the wire probe 30 is inserted. The first rear end holes 14 are provided as many as the number of wire probes 30 to be held.

  As shown in FIG. 3, the first rear end hole 14 includes a stepped hole portion 14b on the electrode substrate 40 side and a counterbore portion 14a on the inspected substrate side. The step hole portion 14b is a step hole that forms the above-described large diameter portion 12a, small diameter portion 12b, and step portion 12c. On the other hand, the spot facing portion 14a is a tapered hole formed by spot facing. In the present embodiment, since the thickness of the first base plate 13 is thick, in order to facilitate processing, a hole is formed by counterboring from the back side of the straight hole. In the present embodiment, one counterbore portion 14a communicates with the plurality of step hole portions 14b.

  In addition, the large diameter part 12a which concerns on this embodiment is connected and formed with the other large diameter part 12a, as shown in FIG. On the other hand, the small diameter portion 12b is not connected to other small diameter portions 12b. Therefore, as shown in FIG. 3, when viewed in a cross section passing through the center line of the two connected large diameter portions 12a, there is no wall between the large diameter portions 12a, and there is no gap between the small diameter portions 12b. Has a partition wall 14c.

  The second base plate 15 is a plate disposed inside the first base plate 13, that is, closer to the substrate to be inspected than the first base plate 13. The second base plate 15 is provided with a second rear end hole 16 through which the wire probe 30 is inserted. The second rear end holes 16 are provided as many as the number of wire probes 30 to be held, and communicate with the first rear end holes 14.

  As shown in FIG. 3, the second rear end hole 16 includes a counterbore 16a on the electrode substrate 40 side and a straight portion 16b on the substrate to be inspected. The counterbore part 16a is a tapered hole formed by counterbore processing. In the present embodiment, since the thickness of the second base plate 15 is thick, in order to facilitate processing, a hole is formed by counterboring from the back side of the straight hole. In the present embodiment, one counterbore portion 16a communicates with the plurality of straight portions 16b. A partition wall portion 16c is provided between the adjacent straight portions 16b.

  The head portion 17 is a plate-like portion that is disposed so as to be in contact with the substrate to be inspected while holding the tip portion 30 a of the wire probe 30, and in the present embodiment, two of the first head plate 18 and the second head plate 20. It consists of a stack of plates. The two plates are connected to each other by a head fixing screw 24. The head fixing screw 24 for connecting the two plates is screwed to the spacer 22, whereby the head portion 17 and the spacer 22 are integrally fixed.

  The first head plate 18 is a plate disposed inside the second head plate 20, that is, closer to the electrode substrate 40 than the second head plate 20. The first head plate 18 is provided with a first tip hole 19 through which the wire probe 30 is inserted. The first tip holes 19 are provided as many as the number of wire probes 30 to be held.

  The second head plate 20 is a plate disposed so as to face the substrate to be inspected. At the time of inspection, the surface of the second head plate 20 is pressed against the substrate to be inspected. The second head plate 20 is provided with a second tip hole 21 through which the wire probe 30 is inserted. The second tip holes 21 are provided as many as the number of wire probes 30 to be held, and communicate with the first tip hole 19 described above.

  The spacer 22 is a member that connects the base portion 11 and the head portion 17 with a predetermined interval. In the present embodiment, a plurality of columnar members are used as the spacers 22. However, the present invention is not limited to this, and the spacers 22 may be configured using, for example, plate-like members.

  When the wire probe jig 10 configured as described above is pressed against the substrate to be inspected, the tip portion 30a of the wire probe 30 protruding from the head portion 17 is pressed against the terminal of the substrate to be inspected. The wire probe 30 pressed against the substrate to be inspected bends at the intermediate portion and is pressed against the substrate to be inspected by its elastic force. By acting in this way, both ends of the wire probe 30 are reliably pressed against the electrode substrate 40 and the substrate to be inspected.

  In this embodiment, the base portion 11 and the head portion 17 are described as being fixed. However, the base portion 11 (or a part of the base portion 11) and the head are pressed when pressed against the substrate to be inspected. The part 17 (or part of the head part 17) may move relative to each other.

  Incidentally, as shown in FIG. 4A, the wire probe 30 according to the present embodiment covers a part of the outer periphery of the metal pin 31 with an insulating film 32, so that the insulating film is larger than the outer diameter of the metal pin 31. The outer diameter of 32 is large. Further, the outer diameter of the locking portion 33 is set larger than the outer diameter of the insulating film 32.

  The inner diameter of the small diameter portion 12 b is set to be larger than the outer diameter of the insulating film 32 and smaller than the outer diameter of the locking portion 33. Further, the inner diameter of the large diameter portion 12 a is set larger than the outer diameter of the insulating coating 32 and the outer diameter of the locking portion 33.

  That is, the relationship of “the outer diameter of the metal pin 31” <“the outer diameter of the insulating film 32” <“the inner diameter of the small diameter portion 12b” <“the outer diameter of the locking portion 33” <“the inner diameter of the large diameter portion 12a” is established. Each dimension is set as follows. With such a dimension setting, the wire probe 30 can be inserted until the locking portion 33 is locked to the small diameter portion 12 b, and the locking portion 33 is prevented from coming off.

  When the wire probe 30 is inserted into the wire probe jig 10, the distal end portion 30a of the wire probe 30 is inserted from the base portion 11 side. At this time, since the insulating film 32 of the wire probe 30 passes through the small diameter portion 12 b, the wire probe 30 penetrates the insertion hole 12 of the base portion 11. Then, the distal end portion 30 a (metal pin 31) of the wire probe 30 penetrating the insertion hole 12 is inserted into the first distal end hole 19 and the second distal end hole 21 of the head portion 17. On the other hand, since the locking portion 33 cannot pass through the small diameter portion 12b, the locking portion 33 is locked to the step portion 12c and serves as a stopper.

  Thus, in this embodiment, the insulating film 32 is not locked to the head portion 17 to prevent it from coming off as in the prior art, but the locking portion 33 is locked to the small-diameter portion 12b of the base portion 11 to be removed. It is stopped. According to such a configuration, the outer diameter of the insulating film 32 is not restricted, and the outer diameter of the insulating film 32 can be reduced, so that the minimum pitch of the wire probes 30 can be reduced.

Moreover, in the present embodiment, as shown in FIG. 4A, the large diameter portion 12a is connected to the other large diameter portion 12a. For this reason, the large-diameter portion 12a can be brought as close as possible (for example, with a minimum dimension allowed in drilling the small-diameter portion 12b). Thus, the minimum pitch of the wire probe 30 can be further reduced by bringing the large diameter portion 12a close to each other. The shape of the large diameter portion 12a is not limited to the circular cross section as shown in FIG. 4A, and can be changed as appropriate in consideration of workability in processing. For example, a long hole shape as shown in FIG.
Moreover, as shown to Fig.5 (a)-(d), you may connect the three or more large diameter parts 12a.
That is, as shown in FIG. 5A, the large-diameter portion 12a having a circular cross section may be connected vertically and horizontally.

Further, as shown in FIG. 5 (b), by forming one substantially rectangular concave portion, a plurality of large diameter portions 12a corresponding to the plurality of small diameter portions 12b are formed by this one concave portion. Also good.
Moreover, as shown in FIG.5 (c), after arranging the large diameter part 12a of a circular cross section in a hexagonal lattice form, you may connect with the adjacent large diameter part 12a.

  Further, as shown in FIG. 5 (d), by forming one large concave portion having a substantially parallelogram shape, a plurality of large diameter portions 12a corresponding to the plurality of small diameter portions 12b are formed by this one concave portion. It may be.

  As described above, according to the present embodiment, the wire probe 30 and the wire probe jig 10 that is disposed between the electrode substrate 40 and the substrate to be inspected while holding both ends of the wire probe 30 are provided. The wire probe jig 10 includes a base portion 11 that holds the rear end portion 30b of the wire probe 30 and is disposed so as to come into contact with the electrode substrate 40. The base portion 11 includes the base portion 11 A plurality of insertion holes 12 through which the wire probe 30 is inserted are provided, and the insertion hole 12 includes a large-diameter portion 12a facing the electrode substrate 40, and a small-diameter portion 12b continuing to the large-diameter portion 12a. A step portion 12c is formed between the large diameter portion 12a and the small diameter portion 12b, and the wire probe 30 is housed in the large diameter portion 12a and has a larger diameter than the small diameter portion 12b. Comprising a ring-shaped engaging portion 33 has been made. For this reason, the ring-shaped latching | locking part 33 becomes a stopper, and it can prevent that the wire probe 30 falls off from the jig | tool 10 for wire probes. Since the locking portion 33 serves as a stopper, there is no need to lock the insulating film 32 of the wire probe 30 in the first tip hole 19 on the tip side. In other words, the insulating film 32 of the wire probe 30 can be thinned. Since the outer diameter of the small diameter portion 12b can be reduced by thinning the insulating film 32 of the wire probe 30, the minimum pitch of the wire probe 30 can be reduced. And since such an effect is realizable, without making the front-end | tip part 30a of the wire probe 30 into a special shape, the problem that the front-end | tip part 30a of the wire probe 30 cannot slide smoothly does not generate | occur | produce. Further, since the pitch of the wire probes 30 is reduced by reducing the outer diameter of the small diameter portion 12b, the minimum pitch of the wire probes 30 can be reduced without limiting the number of wire probes 30.

  Moreover, since the latching | locking part 33 is hold | maintained by the large diameter part 12a, the rear-end part 30b of the wire probe 30 which faces the electrode substrate 40 does not move, but the positional accuracy with respect to the electrode substrate 40 of the wire probe 30 can be improved. it can.

  Moreover, since the large diameter part 12a of the said insertion hole 12 is connected and formed with the other large diameter part 12a, the insertion hole 12 can be approached and the minimum pitch of the wire probe 30 can be made further smaller. In addition, since the wire probe 30 inserted through the large diameter portion 12a is insulated by the ring-shaped locking portion 33, even if the adjacent wire probes 30 come into contact with each other, they are kept electrically insulated from each other. Can do.

  The step 12c is formed by using the insertion hole 12 (first rear end hole 14) as a step hole. According to such a configuration, the stepped portion 12 c can be formed regardless of the shape of the insertion hole 12. For example, when the plate (first base plate 13) that penetrates and forms the insertion hole 12 is thick, even if the back side of the insertion hole 12 needs to be countersunk due to processing technology restrictions, the straight hole on the front side The step portion 12c can be formed using the above.

  In the above-described embodiment, the step 12c is formed by using the insertion hole 12 as a step hole. However, the embodiment of the present invention is not limited to this. For example, as shown in FIG. 6, the first rear end hole 14 and the second rear end hole 16 are formed as straight holes, and the step portion 12 c is formed at the boundary between the first base plate 13 and the second base plate 15. It may be. That is, the large diameter portion 12 a may be formed by the first rear end hole 14, and the small diameter portion 12 b may be formed by the second rear end hole 16.

DESCRIPTION OF SYMBOLS 10 Wire probe jig | tool 11 Base part 12 Insertion hole 12a Large diameter part 12b Small diameter part 12c Step part 13 1st base plate 14 1st rear end hole 14a Counterbore part 14b Step hole part 14c Partition part 15 2nd base plate 16 2nd Rear end hole 16a Counterbore part 16b Straight part 16c Bulkhead part 17 Head part 18 First head plate 19 First tip hole 20 Second head plate 21 Second tip hole 22 Spacer 23 Base fixing screw 24 Head fixing screw 30 Wire probe 30a Front end 30b Rear end 31 Metal pin 32 Insulating film 33 Locking portion 40 Electrode substrate 41 Wiring

Claims (3)

A wire probe, and a wire probe jig disposed between the electrode substrate and the substrate to be inspected while holding both ends of the wire probe,
The wire probe jig includes a base portion that is disposed so as to be in contact with the electrode substrate while holding a rear end portion of the wire probe.
The base portion is provided with a plurality of insertion holes through which the wire probe is inserted,
The insertion hole includes a large diameter portion facing the electrode substrate, and a small diameter portion continuous to the large diameter portion, and a step portion is formed between the large diameter portion and the small diameter portion,
The wire probe is provided with a ring-shaped locking portion that is housed in the large-diameter portion and has a larger diameter than the small-diameter portion.   The wire probe holding structure according to claim 1, wherein the large-diameter portion of the insertion hole is formed to be connected to another large-diameter portion.   The said step part is formed by making the said insertion hole into a step hole, The holding structure of the wire probe characterized by the above-mentioned.

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