JP2017004911A - Joining object and ultrasonic joining method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a joining object capable of being joined to a conductor of a covered electric wire with sufficient strength and also to provide an ultrasonic joining method capable of joining the conductor of the covered electric wire and the joining object with sufficient strength.SOLUTION: A terminal metal fitting 3 includes a chip 12 vibrated by a driving source and an anvil 13 and is ultrasonic bonded to a conductor 2a of FFC2 using an ultrasonic joining device of which a plurality of projections 12c are formed in a chip 12. In this terminal metal fitting 3, a groove 3d is formed in which a coating part 2b of FFC2a melted during ultrasonic bonding is housed. A width W4 of the groove 3d is provided narrower than a distance L3 between the projection 12c and the projection 12c.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an object to be joined and an ultrasonic joining method, and more particularly to an object to be joined ultrasonically to a covered electric wire and an ultrasonic joining method for joining the covered electric wire and an object to be joined such as a terminal fitting. is there.

  As the above-described ultrasonic bonding apparatus, for example, a conductor to be bonded and a bonding object such as a lead wire are sandwiched between a chip and an anvil, and the chip is vibrated to bond the conductor of the covered electric wire and the bonding object (metal). (Patent Document 1).

  In ultrasonic bonding, the conductor of the covered electric wire to be bonded and the object to be bonded are slid to perform metal bonding. However, when the joint surface is covered with the covering portion as in the case of the covered electric wire, the covering portion is interposed between the conductor of the covered electric wire and the object to be bonded, and the metal between the conductor of the covered electric wire and the object to be bonded is Prevents sliding. For this reason, metal joining becomes inadequate or it becomes a cause of variation in joining strength.

  Therefore, it is also possible to provide a plurality of protrusions on the anvil so that the melted covering portion does not flow into the recesses between the protrusions so that the covering portion does not remain between the conductor of the covered wire and the object to be joined. (Patent Document 2). However, there is a problem that the covered portion melted from between the conductor of the covered electric wire and the object to be joined cannot be completely removed only by the concave portion provided in the anvil.

JP 2012-4289 A JP 2009-87831 A

  Then, this invention makes it a subject to provide the ultrasonic joining method which can join the conductor of a covered electric wire, and a joining target object with sufficient intensity | strength which can be joined with the conductor of a covered electric wire with sufficient intensity | strength.

  The invention according to claim 1, which has been made in order to solve the above-described problem, is a bonding object to be ultrasonically bonded to a conductor of a covered electric wire, and accommodates the covered portion of the covered electric wire that has melted during ultrasonic bonding. It exists in the joining target object characterized by the recessed part or the through-hole being formed.

  According to a second aspect of the present invention, there is provided a chip that is vibrated by a driving source and an anvil, and the covered electric wire using an ultrasonic bonding apparatus in which a plurality of protrusions are formed on one of the chip or the anvil. 2. The object to be bonded ultrasonically to the conductor, wherein a width of the recess or the through hole is narrower than a distance between the protrusion and the protrusion. It exists in the described joining object.

  According to a third aspect of the present invention, a plurality of protrusions provided on one of the tip or the anvil extend along a direction perpendicular to the vibration direction of the tip, and are arranged along the vibration direction. 3. The bonding object according to claim 2, wherein a plurality of recesses or through-holes extend along the orthogonal direction and are arranged side by side along the vibration direction.

  According to a fourth aspect of the present invention, a plurality of protrusions provided on one of the tip or the anvil are formed in a plurality of protrusions arranged in a lattice pattern in the vibration direction of the chip and in a direction orthogonal to the vibration direction. The said recessed part or through-hole exists in the joining target object of Claim 2 extended and provided along the said vibration direction.

  Invention of Claim 5 is an ultrasonic joining method which ultrasonically joins the to-be-joined object and the said covered electric wire of any one of Claims 2-4, Comprising: On either the said chip | tip or the said anvil. The chip is vibrated in a state where the object to be joined and the covered electric wire are sandwiched between the chip and the anvil so that the concave portion or the through hole is disposed between the provided protrusions. The present invention resides in an ultrasonic bonding method.

  As described above, according to the first aspect of the present invention, since the covered portion of the covered electric wire melted during ultrasonic welding is accommodated in the recess or the through hole, the conductor of the covered electric wire and the joint portion of the object to be joined The covering portion remaining between them can be reduced, and the conductor of the covered electric wire can be joined with sufficient strength.

  According to invention of Claim 2, the width | variety of a recessed part or a through-hole is provided narrower than the distance between a processus | protrusion. Thereby, a recessed part or a through-hole can be arrange | positioned and joined between a processus | protrusion, and the covering part which remains between the conductor of a covered electric wire and the junction part of a joining target object is ensured, ensuring a joining area. It can be discharged into the recess or through hole.

  According to invention of Claim 3, the recessed part or the through-hole extends along the orthogonal direction, and is provided with two or more along with the vibration direction. Thereby, even if a large number of protrusions extending in the orthogonal direction and arranged along the vibration direction are provided, the recesses or the through holes can be arranged and bonded between the protrusions.

  According to invention of Claim 4, the recessed part or the through-hole is extended and provided along the vibration direction. Thereby, even if a plurality of protrusions are formed in a lattice shape in the vibration direction and in a direction orthogonal to each other, a recess or a through hole can be disposed and bonded between the protrusion and the protrusion.

  According to the fifth aspect of the present invention, the covering portion remaining between the conductor of the covered electric wire and the bonding portion of the object to be bonded can be discharged into the recess or the through hole while securing the bonding area.

(A) is the fragmentary perspective view of the terminal metal fitting as a joining target object of this invention in 1st Embodiment, (b) is the II sectional view taken on the line of (a). It is a perspective view in the state where the terminal metal fitting shown in FIG. 1 and FFC were positioned between the chip | tip and the anvil of an ultrasonic bonding apparatus. (A) And (b) is the perspective view and front view in the state which pinched | interposed the terminal metal fitting and FFC between the chip | tip and the anvil of the ultrasonic bonding apparatus shown in FIG. (A) is the II-II cross-sectional perspective view of Fig.3 (a), (b) is the X section enlarged view of (a). (A) And (b) is the perspective view and front view of a terminal metal fitting as a joining target object of this invention in 2nd Embodiment. It is a perspective view in the state which pinched | interposed the terminal metal fitting and FFC shown in FIG. 5 between the chip | tip and the anvil of the ultrasonic bonding apparatus. It is a perspective view of the chip | tip which comprises the ultrasonic bonding apparatus shown in FIG. It is the elements on larger scale of the chip | tip shown in FIG. (A) And (b) is the front view and side view for demonstrating the relationship between the chip | tip which comprises the ultrasonic bonding apparatus shown in FIG. 6, and a terminal metal fitting.

(First embodiment)
Hereinafter, the terminal metal fitting as a joining target object of the present invention in the first embodiment will be described with reference to FIGS. An ultrasonic bonding apparatus 1 shown in FIG. 2 and the like electrically connects a conductor 2a (described later) of a flexible flat cable (hereinafter referred to as FFC) 2 as a covered electric wire and a terminal fitting 3 as a bonding target. Used for mechanical connection.

  As shown in FIG. 2 and the like, the FFC 2 includes a plurality of conductors 2a and a covering portion 2b that covers (ie covers) the plurality of conductors 2a. Each of the plurality of conductors 2a is formed in a strip shape extending linearly, and has a rectangular cross-sectional shape. The plurality of conductors 2a are arranged in parallel (that is, in parallel) with a space therebetween. Of course, each of the conductors 2a has conductivity. In the illustrated example, four conductors 2a are provided.

  The covering portion 2b includes a pair of insulating sheets 2b1 and 2b2. The insulating sheets 2b1 and 2b2 are made of an insulating synthetic resin and are formed in a strip shape. For this reason, the coating | coated part 2b has insulation of course. The insulating sheets 2b1 and 2b2 cover the conductor 2a with a plurality of conductors 2a interposed therebetween. The conductor 2a and the covering portion 2b have flexibility.

  In the present embodiment, the FFC 2 is provided with a notch 2c formed by notching the covering portion 2b between the conductor 2a and the conductor 2a at the end thereof. The notch 2c is provided along the longitudinal direction of the conductor 2a, and one end extends to the end of the FFC 2. The end of the FFC 2 is separated for each conductor 2a by the notch 2c.

  As shown in FIG. 1, the terminal fitting 3 is formed by pressing a metal plate such as copper or a copper alloy. The terminal fitting 3 is connected to an unillustrated counterpart terminal (not shown in FIGS. 1 to 4; equivalent to the electrical contact portion 3a of the second embodiment shown in FIG. 5) and the FFC 2. A conductor connecting portion 3b to which the conductor 2a is connected.

  The electrical contact portion 3a may be formed in a female cylindrical shape or may be formed in a male tab shape. The electric wire connecting portion 3b is formed in a strip shape extending linearly, and the electric contact portion 3a is connected to one end in the longitudinal direction. In addition, the electric wire connection portion 3b is provided with a pair of standing walls 3c erected from the edge in the width direction, and a plurality of grooves 3d as recesses or through holes. As shown in FIG. 3B, the interval W1 between the pair of standing walls 3c is wider than the width W2 of the tip separated for each conductor 2a by the notch 2c of the FFC2.

  The ultrasonic bonding apparatus 1 will be described before describing details of the groove 3d. As shown in FIG. 3, the ultrasonic bonding apparatus 1 includes a horn 11 (not shown in FIGS. 1 to 4) to which a piezoelectric vibrator (not shown) as a drive source is attached. The second embodiment shown in FIG. Equivalent to the horn 11), a tip 12 attached to the horn 11, and an anvil 13 facing the tip 12. The piezoelectric vibrator vibrates ultrasonically when AC power is supplied. A tip 12 is attached to the tip of the horn 11 to which the piezoelectric vibrator is attached. For this reason, the piezoelectric vibrator vibrates the chip 12 via the horn 11 or the like. At this time, the vibration direction Y1 of the chip 12 is orthogonal to the contact / separation direction Y2 in which the chip 12 and the anvil 13 contact (separate) each other.

  The ultrasonic bonding apparatus 1 sandwiches the FFC 2 and the terminal fitting 3 that are bonded to each other between the chip 12 and the anvil 13 and pressurizes the chip 12 and the anvil 13 in a direction in which the chip 12 and the anvil 13 approach each other. Is transmitted to the chip 12 via the horn 11. As a result, ultrasonic vibration energy is applied to the FFC 2 and the terminal fitting 3 sandwiched between the chip 12 and the anvil 13 to join each other.

  The chip 12 described above includes an attachment portion 12a, a wall portion 12b protruding from the attachment portion 12a, and a plurality of protrusion portions 12c (protrusions) protruding from the wall portion 12b.

  The attachment portion 12a is provided in a cylindrical shape, and an insertion hole 12d into which the tip end portion of the horn 11 is inserted is provided in the center along the vibration direction Y1 of the horn 11. The tip of the horn 11 is inserted into the insertion hole 12 d and the tip 12 is attached to the horn 11.

  The wall portion 12b is provided so as to protrude in the contact / separation direction Y2 from the outer surface of the mounting portion 12a. The wall portion 12b is provided to extend linearly along the vibration direction Y1. The width W3 of the wall portion 12b is narrower than the width W2 of the tip separated for each conductor 2a by the notch 2c of the FFC2.

  The plurality of protrusions 12c are provided so as to protrude in the contact / separation direction Y2 from the end face of the wall 12b facing the anvil 13. The plurality of protrusions 12c extend along the orthogonal direction Y3 perpendicular to both the vibration direction Y1 and the contact / separation direction Y2, and are arranged side by side along the vibration direction Y1.

  The anvil 13 includes a rectangular parallelepiped base portion 13a, a wall portion 13b protruding from the base portion 13a, and a plurality of knurl projections 13c (FIG. 4) protruding from the wall portion 13b. The wall portion 13b is provided to protrude from the base portion 13a along the contact / separation direction Y2. The wall portion 13b is provided to extend linearly along the vibration direction Y1. The plurality of knurled protrusions 13c are provided in a truncated quadrangular pyramid shape, and are arranged in a lattice shape along the vibration direction Y1 and the orthogonal direction Y3.

  Returning to the description, the details of the groove 3d provided in the wire connecting portion 3b of the terminal fitting 3 will be described. As shown in FIG. 1, the grooves 3d extend along the orthogonal direction Y3, and a plurality of the grooves 3d are provided along the vibration direction Y1. Further, the width W4 of the groove 3d is provided to be narrower than the distance L3 between the protrusion 12c and the protrusion 12c (specifically, the distance between the flat top and the top of the protrusion 12c). In the present embodiment, as shown in FIG. 1, the groove 3d is provided in the recess without penetrating the wire connecting portion 3b, but may be provided in a through hole penetrating the wire connecting portion 3b.

  Next, an ultrasonic bonding method using the ultrasonic bonding apparatus 1 having the above-described configuration will be described. First, as shown in FIG. 2, the wire connection portion 3 b of the terminal fitting 3 is disposed on the wall portion 13 b of the anvil 13. At this time, it arrange | positions so that the longitudinal direction of the electric wire connection part 3b may follow the vibration direction Y1, and the groove | channel 3d of the electric wire connection part 3b may open toward the chip | tip 12 side.

  Next, one end of the FFC 2 branched into a plurality of portions is overlapped between the pair of standing walls 3 c provided in the wire connection portion 3 b, and the FFC 2 and the terminal fitting 3 are positioned between the chip 12 and the anvil 13. At this time, as shown in FIG. 4B, the chip 12 and the anvil 13 are arranged such that the groove 3d of the terminal fitting 3 is disposed between the protrusion 12c provided on the chip 12 and the protrusion 12c. The terminal fitting 3 is positioned between them. Thereby, the flat top part of the projection part 12c does not oppose the groove | channel 3d.

  Thereafter, as shown in FIG. 4, the chip 12 and the anvil 13 are brought close to each other, and the FFC 2 and the terminal fitting 3 are pressurized. In this state, the piezoelectric vibrator is vibrated. This vibration is transmitted to the chip 12 via the horn 11. When the chip 12 vibrates, the vibration is transmitted to the FFC 2 and the covering portion 2b of the FFC 2 is melted.

  Since the tip 12 and the anvil 13 are pressurized in a direction approaching each other, the melted covering portion 2b of the FFC 2 is removed from between the conductor 2a and the terminal fitting 3 sandwiched between the tip 12 and the anvil 13. Further, the insulating sheet 2b1 on the chip 12 side of the removed covering portion 2b enters (accommodates) into the groove between the protruding portion 12c and the protruding portion 12c. On the other hand, the insulating sheet 2b2 on the terminal fitting 3 side in the removed covering portion 2b enters (is accommodated) into the groove 3d.

  The conductor 2a and the terminal fitting 3 are brought into contact with each other. When vibration is applied in a state where the conductor 2a and the terminal fitting 3 are in contact with each other, the conductor 2a and the terminal fitting 3 are joined.

  According to the embodiment described above, by providing the groove 3d in the terminal fitting 3, the covering portion 2b of the FFC 2 melted at the time of ultrasonic welding is accommodated in the groove 3d, so that the joint portion of the conductor 2a of the FFC 2 and the terminal fitting 3 is joined. The covering portion 2b remaining between them can be reduced, and the conductor 2a of the FFC 2 can be joined with sufficient strength.

  Further, according to the above-described embodiment, the width W4 of the groove 3d is provided narrower than the distance L3 between the protrusion 12c and the protrusion 12c. As a result, the groove 3d can be disposed and joined between the projection 12c and the projection 12c, and the covering remaining between the conductor 2a of the FFC 2 and the junction of the terminal fitting 3 while ensuring a junction area. The part 2b can be discharged into the groove 3d.

  Further, according to the embodiment described above, the plurality of grooves 3d extend along the orthogonal direction Y3 and are arranged side by side along the vibration direction Y1. As a result, even if a large number of protrusions 12c extending along the orthogonal direction Y3 and arranged along the vibration direction Y1 are provided, the grooves 3d are arranged between the protrusions 12c and 12c. Can be joined together.

  In addition, according to 1st Embodiment mentioned above, the chip | tip 12 is made into one of the chip | tip 12 or the anvil 13, and the anvil 13 is made into the other of the chip | tip 12 or the anvil 13, and the ultrasonic bonding which provided the protrusion part 12c in the chip | tip 12 was carried out. Although the apparatus 1 was used, it is not restricted to this. You may use the ultrasonic bonding apparatus 1 which provided the projection part 12c in the anvil 13. FIG.

(Second Embodiment)
Next, the terminal metal fitting 3 as a joining target object of the present invention in the second embodiment will be described with reference to FIGS. In this figure, parts that are the same as those of the ultrasonic bonding apparatus 1 shown in FIGS. 2 to 4 already described in the first embodiment are given the same reference numerals, and detailed descriptions thereof are omitted.

  The ultrasonic bonding apparatus 1 shown in the figure is used to electrically and mechanically connect the conductor 2a of the FFC 2 and the terminal fitting 3 as in the first embodiment.

  As in the first embodiment, the FFC 2 includes a plurality of conductors 2a and a covering portion 2b that covers the plurality of conductors 2a. Unlike the first embodiment, the FFC 2 used in the second embodiment is not provided with a notch 2c at the tip. Of course, the FFC 2 provided with the notch 2c may be used as in the first embodiment.

  As shown in FIG. 5, the terminal fitting 3 includes an electrical contact portion 3a connected to a mating terminal (not shown) and an electric wire connection portion 3b to which the conductor 2a of the FFC 2 is connected, as in the first embodiment. Have. Since the electrical contact part 3a is the same as that of the first embodiment, a detailed description thereof is omitted.

  Unlike the first embodiment, the electric wire connecting portion 3b is not provided with the standing wall 3c. However, if the FFC 2 provided with the notch 2c is used as in the first embodiment, the standing wall 3c may be provided. The wire connection portion 3b is provided with one groove 3e.

  Before describing the details of the groove 3e, the ultrasonic bonding apparatus 1 will be described. As shown in FIG. 6, the ultrasonic bonding apparatus 1 includes a horn 11, a tip 12, and an anvil 13 as in the first embodiment. Since the horn 11 is the same as that of the first embodiment described above, a detailed description thereof is omitted here.

  The chip 12 includes an attachment portion 12a, a plurality of wall portions 12b protruding from the attachment portion 12a, and a plurality of knurled protrusion portions 12e (projections) protruding from the wall portion 12b. Since the attachment part 12a is the same as that of 1st Embodiment mentioned above, detailed description is abbreviate | omitted here.

  The plurality of wall portions 12b are provided so as to protrude along the contact / separation direction Y2 from the outer surface of the attachment portion 12a. The plurality of wall portions 12b are provided to extend linearly along the vibration direction Y1. The plurality of wall portions 12b are arranged at intervals from each other along the orthogonal direction Y3.

  Further, the same number of wall portions 12b as the conductors 2a of the FFC 2 described above are provided, and four wall portions 12b are provided in the illustrated example. The width W3 (FIG. 7) of the wall portion 12b is provided to be narrower than the width of the conductor 2a constituting the FFC2. Further, the interval L1 (FIG. 7) between the wall portion 12b and the wall portion 12b is provided substantially the same as the interval L2 (see FIG. 1) between the conductor 2a and the conductor 2a constituting the FFC2. Thus, when the FFC 2 and the terminal fitting 3 are sandwiched and joined between the chip 12 and the anvil 13, one conductor 2 a is sandwiched between the one wall portion 12 b and the anvil 13.

  The plurality of knurled protrusions 12e are provided so as to protrude in the contact / separation direction Y2 from the end surface of the wall 12b facing the anvil 13. The knurl protrusion 12e is provided in a truncated quadrangular pyramid shape. The plurality of knurled protrusions 12e are arranged in a lattice pattern along the vibration direction Y1 and the orthogonal direction Y3. The plurality of knurl protrusions 12e are all provided in the same size and shape. In the present embodiment, the two knurled protrusions 12e are arranged side by side in the orthogonal direction Y3. The anvil 13 is formed in a rectangular parallelepiped shape.

  Returning to the description, the details of the groove 3e provided in the wire connecting portion 3b of the terminal fitting 3 will be described. As shown in FIG. 9, the groove 3e is provided to extend along the vibration direction Y1. Further, the width W4 of the groove 3d is set to be narrower than the distance L3 between the flat top of the knurl projection 12e and the flat top of the nar projection 12e. Note that FFC 2 is omitted from FIG. 9 for the sake of simplicity. Moreover, in this embodiment, as shown in FIG. 5, although the groove | channel 3e is provided in the recessed part without penetrating the electric wire connection part 3b, you may provide in the through-hole which penetrates the electric wire connection part 3b.

  Next, an ultrasonic bonding method using the ultrasonic bonding apparatus 1 having the above-described configuration will be described. First, similarly to the first embodiment, the wire connection portion 3b of the terminal fitting 3 is disposed on the anvil 13. At this time, it arrange | positions so that the groove 3e of the electric wire connection part 3b may open toward the chip | tip 12 side while arrange | positioning so that the longitudinal direction of the electric wire connection part 3b may follow the vibration direction Y1.

  Next, the FFC 2 is overlapped on the electric wire connection portion 3 b, and the FFC 2 and the terminal fitting 3 are positioned between the chip 12 and the anvil 13. At this time, the plurality of conductors 2a constituting the FFC 2 are arranged side by side along the orthogonal direction Y3 so that the longitudinal direction of the conductor 2a is along the vibration direction Y1. Thereby, the some conductor 2a and the electric wire connection part 3b of the some terminal metal fitting 3 oppose on one to one. Also, as shown in FIG. 9, the groove 3e of the terminal fitting 3 is disposed between the tip 12 and the anvil 13 so that the groove 3e of the terminal fitting 3 is disposed between the knurl projection 12e and the knurl projection 12e provided on the chip 12. Position the terminal fitting 3. Thereby, the flat top part of the knurl | projection part 12e does not oppose the groove | channel 3e.

  Thereafter, the chip 12 and the anvil 13 are brought close to each other, and the FFC 2 and the terminal fitting 3 are pressurized. In this state, the piezoelectric vibrator is vibrated. This vibration is transmitted to the chip 12 via the horn 11. When the chip 12 vibrates, the vibration is transmitted to the FFC 2 and the covering portion 2b of the FFC 2 is melted.

  Since the tip 12 and the anvil 13 are pressurized in a direction approaching each other, the melted covering portion 2b of the FFC 2 is removed from between the conductor 2a and the terminal fitting 3 sandwiched between the tip 12 and the anvil 13. Further, the insulating sheet 2b1 on the chip 12 side in the removed covering portion 2b enters (is accommodated) into the groove between the knurled protrusions 12e. On the other hand, the insulating sheet 2b2 on the terminal fitting 3 side in the removed covering portion 2b enters (is accommodated) into the groove 3e.

  The conductor 2a and the terminal fitting 3 are brought into contact with each other. When vibration is applied in a state where the conductor 2a and the terminal fitting 3 are in contact with each other, the conductor 2a and the terminal fitting 3 are joined.

  According to the embodiment described above, the groove 3e is provided so as to extend along the vibration direction Y1. As a result, even if the plurality of the knurl projections 12e are formed in a lattice pattern in the vibration direction Y1 and the orthogonal direction Y3, the groove 3e is disposed and joined between the knurl projections 12e and the knurl projections 12e. Can do.

  In addition, according to 2nd Embodiment mentioned above, the chip | tip 12 is made into one of the chip | tip 12 or the anvil 13, and the anvil 13 was made into the other of the chip | tip 12 or the anvil 13, and the chip | tip 12 was provided with the knurled protrusion part 12e. Although the joining apparatus 1 was used, it is not restricted to this. The ultrasonic bonding apparatus 1 in which the anvil 13 is provided with the knurl protrusions 12e may be used.

  Further, according to the second embodiment described above, the knurled protrusions 12e are arranged in two rows in the orthogonal direction Y3 and are provided with the single groove 3e. However, the present invention is not limited to this. When the knurled protrusions 12e are provided in three rows in the orthogonal direction Y3, two grooves 3e can be provided.

  Moreover, according to 1st and 2nd embodiment mentioned above, although the terminal metal fitting 3 was mentioned as an example as a joining target object, it does not restrict to this. The joining object may be a conductor of another electric wire, a metal plate, or a conductive sheet.

  Moreover, in 1st and 2nd embodiment mentioned above, although FFC2 was used as an electric wire, it is not restricted to this. An electric wire having a round cross section may be used as the electric wire.

  Further, the above-described embodiments are merely representative forms of the present invention, and the present invention is not limited to the embodiments. That is, various modifications can be made without departing from the scope of the present invention.

2 FFC (Coated wire)
2a Conductor 2b Cover 3 Terminal fitting (object to be joined)
3d groove 3e groove 12 chip 12c protrusion (protrusion)
12e Knurl protrusion (protrusion)
13 Anvil Y1 Vibration direction Y3 Orthogonal direction (orthogonal direction)

Claims (5)

An object to be ultrasonically bonded to a conductor of a covered electric wire,
A concave object or a through hole is formed in which a covering portion of the covered electric wire melted during ultrasonic bonding is accommodated. Bonding that is ultrasonically bonded to the conductor of the covered electric wire using an ultrasonic bonding apparatus having a chip vibrated by a drive source and an anvil, and a plurality of protrusions formed on one of the chip or the anvil. An object,
The width of the said recessed part or a through-hole is provided narrower than the distance between the said protrusion and the said protrusion. The joining target object of Claim 1 characterized by the above-mentioned. A plurality of protrusions provided on one of the tip or the anvil extend along a direction orthogonal to the vibration direction of the chip, and are arranged along the vibration direction.
The joining object according to claim 2, wherein a plurality of the recesses or through holes extend along the orthogonal direction and are arranged side by side along the vibration direction. A plurality of protrusions provided on one of the chip or the anvil is formed with a plurality of protrusions arranged in a lattice shape in the vibration direction of the chip and in a direction perpendicular to the vibration direction,
The bonding object according to claim 2, wherein the concave portion or the through hole is provided so as to extend along the vibration direction. An ultrasonic bonding method for ultrasonically bonding the bonding target object according to any one of claims 2 to 4 and the covered electric wire,
The object to be joined and the covered electric wire are sandwiched between the tip and the anvil so that the recess or the through hole is disposed between the protrusion provided on one of the tip or the anvil. The ultrasonic bonding method, wherein the chip is vibrated in a state.

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