JP2017092063A - Cleaning device, peeling system, cleaning method, peeling method, program, and information storage medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning device which restraints generation of defects due to a clearing solvent.SOLUTION: A cleaning device comprises: a substrate holding part that holds a substrate attached to a tape fixed to a frame through the tape; a rotation driving part that allows the substrate holding part to be rotated; a liquid supply part that supplies the clearing solvent toward the substrate rotating with the substrate holding part; a frame cover that protects the frame from the clearing solvent; and a frame cover fixing part that fixes the frame cover to the substrate holding part with the frame. The frame cover includes one or more annular lip parts that regulates the spreading of wetting of the clearing solvent in the tape by contacting to the tape in the side outer than the substrate and the side inner than the frame. The substrate holding part holds the tape from the side opposite to the frame cover in the side outer than an inner periphery of the frame cover and the side inner than the frame when peeling the frame cover and the tape.SELECTED DRAWING: Figure 11

Description

  The present invention relates to a cleaning apparatus, a peeling system, a cleaning method, a peeling method, a program, and an information storage medium.

  In recent years, for example, in the manufacturing process of a semiconductor device, the diameter of a substrate such as a silicon wafer or a compound semiconductor wafer has been increased and the thickness thereof has been reduced. A thin substrate with a large diameter may be warped or cracked during transport or polishing. For this reason, after a different substrate is bonded to the substrate and reinforced, the substrate is transported or polished, and then the substrates are separated from each other.

  Further, after the substrates are separated from each other, a cleaning process is performed to remove the bonding agent and the like attached to the bonding surfaces of these substrates. Such a cleaning process is performed by supplying a cleaning liquid to the bonding surface of the substrate while rotating the substrate (see, for example, Patent Document 1).

JP2012-69914A

  The substrate is attached to a tape fixed to the frame and is subjected to a cleaning process.

  Conventionally, the frame may be deteriorated by the cleaning liquid.

  This invention is made | formed in view of the said subject, and provides the washing | cleaning apparatus which suppressed the malfunction by a washing | cleaning liquid.

In order to solve the above problems, according to one aspect of the present invention,
A substrate holding part for holding the substrate attached to the tape fixed to the frame via the tape;
A rotation drive unit for rotating the substrate holding unit;
A liquid supply unit for supplying a cleaning liquid toward the substrate rotating together with the substrate holding unit;
A frame cover for protecting the frame from the cleaning liquid;
A frame cover fixing part for fixing the frame cover together with the frame to the substrate holding part;
The frame cover has one or more annular lip portions that regulate the wetting and spreading of the cleaning liquid in the tape by contacting the tape outside the substrate and inside the frame,
The substrate holding unit holds the tape from the opposite side of the frame cover outside the inner periphery of the frame cover and inside the frame when the frame cover and the tape are peeled off. Is provided.

  According to one aspect of the present invention, a cleaning device is provided that suppresses problems caused by the cleaning liquid.

It is a top view which shows the outline of the peeling system by one Embodiment. It is a top view of the superposition | polymerization board | substrate before peeling by one Embodiment. It is sectional drawing of the superposition | polymerization board | substrate before peeling by one Embodiment. FIG. 4 is a partially enlarged view of FIG. 3. It is sectional drawing of the to-be-processed substrate after peeling by one Embodiment. It is a flowchart of the peeling method by one Embodiment. It is a side view before the fall start of the to-be-processed substrate of the 1st cleaning device by one embodiment. It is a side view at the time of completion of the descent of the substrate to be processed of the first cleaning device according to the embodiment. It is a side view at the time of cleaning liquid supply of the 1st cleaning device by one embodiment. FIG. 10 is a cross-sectional view of the spin chuck and the like along the line XX in FIG. 9. FIG. 11 is a partially enlarged view of FIG. 10, which is a cross-sectional view of a mechanical chuck or the like. FIG. 12 is a cross-sectional view of a mechanical chuck or the like along the line XII-XII in FIG. 11. FIG. 10 is a cross-sectional view of a magnet unit and the like taken along line XIII-XIII in FIG. 9. It is sectional drawing, such as a delivery mechanism along the XIV-XIV line of FIG. It is a flowchart of the washing | cleaning method by one Embodiment.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof is omitted. In the following description, the X direction, the Y direction, and the Z direction are directions perpendicular to each other, the X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction.

  FIG. 1 is a plan view schematically showing a peeling system according to an embodiment. FIG. 2 is a plan view of the superposed substrate before peeling according to an embodiment. FIG. 3 is a cross-sectional view of the superposed substrate before peeling according to an embodiment. FIG. 4 is a partially enlarged view of FIG. FIG. 5 is a cross-sectional view of the substrate to be processed after peeling according to an embodiment.

  The peeling system 1 peels the superposed substrate T obtained by bonding the target substrate W and the support substrate S via the bonding layer G into the target substrate W and the support substrate S. Moreover, the peeling system 1 cleans the bonding surface of the substrate to be processed W after peeling, and removes the bonding agent attached to the bonding surface.

  The substrate W to be processed is formed with elements, circuits, terminals, and the like. A surface on which elements, circuits, terminals, and the like are formed is a bonding surface. A surface opposite to the bonding surface of the substrate to be processed W (hereinafter also referred to as a non-bonding surface) is polished after bonding, and the substrate to be processed W is thinned. After polishing, a surface electrode, a through electrode, or the like may be formed on the non-joint surface of the substrate W to be processed. The substrate to be processed W may be a laminate of a plurality of substrates.

  The support substrate S is bonded to the substrate W to be processed and temporarily reinforces the substrate W to be processed. The support substrate S is peeled from the target substrate W after the target substrate W is polished. The peeled support substrate S may be bonded to another substrate to be processed W after being cleaned.

  The bonding layer G bonds the target substrate W and the support substrate S together. The bonding layer G has, for example, a protective agent layer G1, a release agent layer G2, and an adhesive layer G3 in this order from the target substrate W to the support substrate S.

  The protective agent layer G1 protects elements formed on the bonding surface of the substrate W to be processed. The protective agent layer G1 is formed, for example, by applying a coating liquid made of an organic solvent that dissolves the protective agent and the protective agent to the bonding surface of the substrate W to be processed and then performing a heat treatment.

  The release agent layer G2 is for smoothly peeling the target substrate W and the support substrate S. The release agent layer G2 is formed, for example, by applying a coating solution made of an organic solvent that dissolves the release agent and the release agent to, for example, the protective agent layer G1 or the adhesive layer G3, followed by heat treatment. The release agent has a lower adhesive force than the protective agent or the adhesive.

  The adhesive layer G3 is formed, for example, by applying a coating liquid made of an adhesive and an organic solvent that dissolves the adhesive to the bonding surface of the support substrate S and then performing a heat treatment. The adhesive may be either a thermosetting resin or a thermoplastic resin.

  As shown in FIGS. 2 to 4, the superposed substrate T is affixed to a tape P fixed to the inner peripheral portion of the frame F and is held by the frame F. The tape P covers the opening of the frame F. As the frame F, for example, a dicing frame is used, and as the tape P, for example, a dicing tape is used.

  The superposed substrate T is peeled off from the target substrate W and the support substrate S while being held by the frame F. The target substrate W after being peeled is subjected to a cleaning process while being held by the frame F. In this cleaning process, the protective agent layer G1 and the release agent layer G2 adhering to the bonding surface of the substrate to be processed W are removed.

  In this embodiment, the substrate W to be processed corresponds to the first substrate described in the claims, and the support substrate S corresponds to the second substrate described in the claims, but the first substrate and the second substrate The reverse is also possible. The first substrate may be the support substrate S, and the second substrate may be the substrate W to be processed.

  As shown in FIG. 1, the peeling system 1 includes a first processing block 10, a second processing block 20, and a control device 30.

  The first processing block 10 performs processing on the superposed substrate T or the target substrate W after peeling. The first processing block 10 includes a carry-in / out station 11, a first transfer device 12, a standby device 13, a peeling device 15, and a first cleaning device 16.

  The loading / unloading station 11 loads and unloads the cassettes Ct and Cw with the outside. The carry-in / out station 11 includes a cassette mounting table, and the cassette mounting table includes a plurality of mounting units 11a and 11b. Cassettes Ct and Cw are placed on these placement portions 11a and 11b. The cassette Ct contains a plurality of superposed substrates T, and the cassette Cw contains a plurality of substrates to be processed W after peeling. The superposed substrate T and the substrate to be processed W after peeling are accommodated in the cassettes Ct and Cw while being held by the frame F.

  The 1st conveyance apparatus 12 conveys the superposition | polymerization board | substrate T or the to-be-processed substrate W after peeling. The first transfer device 12 includes a transfer arm unit and a substrate holding unit. The transfer arm unit is movable in the horizontal direction, can be moved up and down in the vertical direction, and can be turned around the vertical axis. The substrate holding unit holds the frame F, thereby holding the superposed substrate T or the substrate to be processed W after peeling substantially horizontally. The first transport device 12 transports the substrate held by the substrate holding unit to a desired place by the transport arm unit.

  The standby device 13 temporarily waits for the superposed substrate T waiting for processing. The standby device 13 includes a mounting table. The superposed substrate T is placed on the mounting table. An ID reading device is provided on the mounting table, and the ID reading device reads the ID (Identification) of the frame F and identifies the superposed substrate T.

  The peeling apparatus 15 peels the superposed substrate T into the target substrate W and the support substrate S. The superposed substrate T is peeled into the substrate W to be processed and the support substrate S while being held by the frame F. The substrate to be processed W after being peeled is kept in a state of being held by the frame F as shown in FIG.

  The 1st washing | cleaning apparatus 16 wash | cleans the to-be-processed substrate W after peeling. The substrate to be processed W after being peeled is cleaned with the non-bonded surface attached to the tape P. By this cleaning, the protective agent layer G1 and the release agent layer G2 attached to the bonding surface of the substrate to be processed W are removed. Details of the first cleaning device 16 will be described later.

  On the other hand, the 2nd processing block 20 performs processing to support substrate S after exfoliation. The second processing block 20 includes a delivery device 21, a second cleaning device 22, a second transport device 23, and a carry-out station 24.

  The delivery device 21 receives the support substrate S after peeling from the peeling device 15 and passes it to the second cleaning device 22.

  The second cleaning device 22 cleans the support substrate S after peeling. As the 2nd washing | cleaning apparatus 22, the washing | cleaning apparatus of Unexamined-Japanese-Patent No. 2013-033925 is used, for example.

  The second transport device 23 transports the cleaned support substrate S to the carry-out station 24. Similar to the first transfer device 12, the second transfer device 23 includes a transfer arm unit and a substrate holding unit. The substrate holding unit provided in the second transfer device 23 holds the support substrate S substantially horizontally by supporting the support substrate S from below, for example.

  The carry-out station 24 carries the cassette Cs into and out of the outside. The carry-out station 24 has a cassette mounting table, and this cassette mounting table has a plurality of mounting portions 24a and 24b. The cassette Cs is placed on the placement portions 24a and 24b. The cassette Cs accommodates a plurality of support substrates S after peeling.

  The control device 30 is configured by a computer including a recording medium 31 such as a memory and a CPU (Central Processing Unit) 32, and performs various processes by causing the CPU 32 to execute a program (also referred to as a recipe) stored in the recording medium 31. Is realized. The control device 30 is provided separately from the first cleaning device 16 in the present embodiment, but may be a part of the first cleaning device 16.

  The program of the control device 30 is stored in the information storage medium and installed from the information storage medium. Examples of the information storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical desk (MO), and a memory card. The program may be downloaded from a server via the Internet and installed.

  Next, with reference to FIG. 6, the peeling method using the said peeling system 1 is demonstrated. FIG. 6 is a flowchart of a peeling method according to an embodiment. Here, the peeling method will be described focusing on the substrate W to be processed.

  The peeling method includes a carry-in process S11, a peel process S12, a cleaning process S13, a carry-out process S14, and the like. These steps are performed under the control of the control device 30.

  In the carry-in step S11, the first transport device 12 transports the superposed substrate T from the cassette Ct on the placement portion 11a to the standby device 13, and then transports the standby substrate 13 from the standby device 13 to the peeling device 15.

  In peeling process S12, the peeling apparatus 15 peels the superposition | polymerization board | substrate T into the to-be-processed substrate W and the support substrate S. FIG. The superposed substrate T is peeled into the substrate W to be processed and the support substrate S while being held by the frame F. The target substrate W after being peeled is kept in the state of being held by the frame F. After peeling, the first transfer device 12 transfers the substrate W to be processed from the release device 15 to the first cleaning device 16.

  In the cleaning step S13, the first cleaning device 16 cleans the substrate to be processed W after being peeled. The substrate to be processed W after being peeled is cleaned with the non-bonded surface attached to the tape P. By this cleaning, the protective agent layer G1 and the release agent layer G2 attached to the bonding surface of the substrate to be processed W are removed.

  In the unloading step S14, the first transfer device 12 transfers the substrate to be processed W after separation to the cassette Cw on the placement unit 11b.

  Thus, the to-be-processed substrate W after peeling is wash | cleaned in the 1st washing | cleaning apparatus 16, and is accommodated in cassette Cw after that. During this time, the peeled support substrate S is cleaned by the second cleaning device 22 and then accommodated in the cassette Cs.

  In addition, the peeling system 1 is not limited to the said structure. For example, the peeling system 1 may have a mounting device. The mounting device attaches the superposed substrate T to the tape P fixed to the inner peripheral portion of the frame F. The polymerization substrate T is mounted not inside the peeling system 1 but inside the peeling system 1. Moreover, the peeling system 1 may have various inspection apparatuses. Examples of the inspection apparatus include an inspection apparatus that inspects the presence or absence of residues of the substrate to be processed W after cleaning and the support substrate S after cleaning, and an inspection apparatus that inspects electrical characteristics of elements of the substrate to be processed after cleaning. It is done.

  Next, details of the first cleaning device 16 will be described. FIG. 7 is a side view of the first cleaning apparatus according to the embodiment before starting to lower the substrate to be processed. FIG. 8 is a side view of the first cleaning apparatus according to the embodiment when the substrate to be processed is lowered. FIG. 9 is a side view of the first cleaning device according to the embodiment when the cleaning liquid is supplied.

  As shown in FIG. 7 and the like, the first cleaning device 16 includes a spin chuck 40, a liquid supply mechanism 50, a cup 60, an outer cover 65, a frame cover 70, a frame cover fixing mechanism 80, and A delivery mechanism 90 is provided. A loading / unloading port for the substrate W to be processed is formed on the side surface of the processing container, and an opening / closing shutter is provided at the loading / unloading port. A fan filter unit is provided on the ceiling of the processing container, and the fan filter unit forms a downflow in the processing container.

  FIG. 10 is a cross-sectional view of the spin chuck and the like along the line XX in FIG. FIG. 11 is a partially enlarged view of FIG. 10, and is a cross-sectional view of a mechanical chuck or the like. 12 is a cross-sectional view of the mechanical chuck and the like along the line XII-XII in FIG. 13 is a cross-sectional view of the magnet unit and the like along the line XIII-XIII in FIG. In FIG. 11 and FIG. 13, a dotted line shows the state at the time of elastic restoration of the inner lip part 71a.

  The spin chuck 40 is provided in the approximate center of the processing container. As shown in FIG. 10, the spin chuck 40 includes, for example, a substrate holding unit 41, a seal unit 42, a support unit 45, and a rotation driving unit 46.

  The substrate holding unit 41 holds the substrate W to be processed via the tape P. As shown in FIG. 11, the substrate holding part 41 includes, for example, an inner holding part 41a, an outer holding part 41b, and an elastic ring part 41c.

  The inner holding portion 41a is larger than the substrate to be processed W, and holds the entire substrate to be processed W flat via the tape P. The holding is, for example, vacuum suction. The substrate W to be processed is held horizontally, for example, with its bonding surface facing up.

  The material of the inner holding part 41a is, for example, carbon. In addition, the material of the inner holding part 41a should just be a material of the hardness which can hold | maintain the to-be-processed substrate W flat, and may be a metal, a ceramic, or resin.

  The outer holding part 41b is detachably attached to the inner holding part 41a. The outer holding portion 41b may be formed integrally with the inner holding portion 41a so as not to be separated.

  The outer holding portion 41b surrounds the inner holding portion 41a, holds the tape P outside the inner holding portion 41a, and holds the frame F via the tape P. The holding is, for example, vacuum suction.

  The suction hole for vacuum suction in the outer holding part 41b communicates with the suction hole for vacuum suction in the inner holding part 41a. Therefore, the holding by the outer holding portion 41b and the holding by the inner holding portion 41a are started at the same time and are ended at the same time.

  The suction hole for vacuum suction in the outer holding portion 41b and the suction hole for vacuum suction in the inner holding portion 41a do not need to communicate with each other. The holding by the outer holding portion 41b and the holding by the inner holding portion 41a may be started in order, and whichever may be the order. Similarly, the holding by the outer holding portion 41b and the holding by the inner holding portion 41a may be finished in order, and the order may be first.

  The holding surface of the tape P in the outer holding portion 41b is continuously provided on the same plane as the holding surface of the tape P in the inner holding portion 41a. An annular groove is formed in the holding surface of the tape P in the outer holding portion 41b, and an elastic ring portion 41c is attached to the annular groove.

  The material of the outer holding part 41b is, for example, metal. In addition, the material of the outer holding part 41b should just be a material of the hardness which can hold | maintain the elastic ring part 41c so that elastic deformation is possible, and ceramic, carbon, resin, etc. may be sufficient as it.

  The elastic ring portion 41c is made of an elastic material such as rubber. When the frame cover 70 is fixed to the substrate holding part 41, the frame cover 70 pushes the tape P into the elastic ring part 41c, whereby the elastic ring part 41c is elastically deformed. The elastic ring portion 41 c brings the tape P into close contact with the frame cover 70 by its elastic restoring force.

  The seal portion 42 surrounds the suction hole for vacuum suction in the substrate holding portion 41 and closes the space between the substrate holding portion 41 and the frame F. Inflow of outside air to the suction holes can be suppressed, and a decrease in suction power can be suppressed. The seal portion 42 is formed of, for example, a lip seal, and is in close contact with the frame F by its elastic restoring force.

  The rotation drive unit 46 (see FIG. 10) is configured by a motor or the like, and rotates the substrate holding unit 41 by rotating the support column unit 45.

  The liquid supply mechanism 50 supplies the cleaning liquid toward the substrate to be processed W that rotates together with the substrate holding unit 41. As the cleaning liquid, for example, a solvent that dissolves a bonding agent (for example, a release agent and a protective agent) is used. The solvent is an organic solvent such as thinner.

  As shown in FIG. 10, the liquid supply mechanism 50 includes, for example, a cleaning liquid nozzle 51, a nozzle arm 52, and a moving lift unit 53. The liquid supply mechanism 50 corresponds to the liquid supply unit described in the claims.

  The cleaning liquid nozzle 51 is, for example, a two-fluid nozzle, and is connected to the solvent supply source 56 via the solvent flow rate adjustment valve 55 and to the gas supply source 58 via the gas flow rate adjustment valve 57. The cleaning liquid nozzle 51 supplies a cleaning liquid obtained by mixing the solvent supplied from the solvent supply source 56 and the gas supplied from the gas supply source 58 to the substrate W to be processed.

  The nozzle arm 52 is horizontal and holds the cleaning liquid nozzle 51 with its discharge port facing downward. The number of cleaning liquid nozzles 51 is one in FIG. 10, but may be plural. The nozzle arm 52 may hold a plurality of cleaning liquid nozzles 51 at intervals in the radial direction of the substrate W to be processed.

  The moving elevating unit 53 horizontally moves the nozzle arm 52 to horizontally move the cleaning liquid nozzle 51 between the standby position (position shown in FIG. 8) and the liquid supply position (position shown in FIG. 9). Further, the moving lift 53 adjusts the height of the cleaning liquid nozzle 51 by moving the nozzle arm 52 up and down.

  The liquid supply mechanism 50 may further include a rinse liquid nozzle (not shown). The rinsing liquid nozzle is connected to a rinsing liquid supply source via a rinsing liquid flow rate adjustment valve, and supplies the rinsing liquid supplied from the rinsing liquid supply source to the substrate W to be processed. The rinse liquid nozzle is held by the nozzle arm 52 with its discharge port facing downward. For example, pure water or IPA (isopropyl alcohol) is used as the rinse liquid.

  The liquid supply mechanism 50 may further include a suction nozzle (not shown). The suction nozzle sucks the liquid on the substrate W to be processed. The suction nozzle is held by the nozzle arm 52 with its suction port facing downward.

  The cup 60 (see FIG. 10) collects the cleaning liquid supplied by the liquid supply mechanism 50. The cup 60 has a cup cylinder part 61 as an outer peripheral part and a bottom part 62 that closes the bottom of the cup cylinder part 61. A drainage pipe 63 that discharges the liquid in the cup 60 and an exhaust pipe 64 that discharges the gas in the cup 60 are connected to the bottom 62.

  The outer cover 65 is moved up and down along the outer periphery of the cup 60 between a standby position (position shown in FIG. 8) and a liquid splash prevention position (position shown in FIG. 9). The outer peripheral cover 65 is lifted from the standby position to the liquid scattering prevention position, surrounds the substrate holding part 41, and blocks the scattering of liquid droplets from the substrate W to be rotated together with the substrate holding part 41. A plurality of outer peripheral covers 65 may be provided.

  The frame cover 70 is overlaid on the frame F and fixed to the substrate holding portion 41 together with the frame F. The frame cover 70 surrounds the target substrate W held by the substrate holder 41 and protects the frame F from the cleaning liquid supplied to the target substrate W. As shown in FIG. 11 and the like, the frame cover 70 includes, for example, a liquid intrusion restricting portion 71, a fixing ring portion 72, and a fixing ring cover portion 73.

  The liquid intrusion restricting portion 71 surrounds the substrate to be processed W held by the substrate holding portion 41 and restricts the wetting and spreading of the cleaning liquid on the tape P outside the substrate to be processed W and inside the frame F. The liquid intrusion restricting portion 71 has annular lip portions 71a and 71b.

  The lip portions 71a and 71b regulate the wetting and spreading of the cleaning liquid on the tape P by contacting the tape P on the outside of the substrate W to be processed held on the substrate holding portion 41 and on the inside of the frame F. The lip portions 71a and 71b are arranged, for example, concentrically at intervals.

  Hereinafter, of the lip portions 71a and 71b, the innermost lip portion 71a is referred to as an inner lip portion 71a, and the lip portion 71b outside the inner lip portion 71a is referred to as an outer lip portion 71b.

  The inner lip portion 71a is pressed against the substrate holding portion 41 via the tape P and is elastically deformed. The inner lip portion 71a is in close contact with the tape P by its elastic restoring force. The close contact force can suppress the leakage of the cleaning liquid.

  The inner lip portion 71a overlaps the inner holding portion 41a in plan view. The wetting and spreading of the cleaning liquid on the tape P can be stopped in the vicinity of the substrate to be processed W held on the inner holding portion 41a via the tape P.

  When the inner lip portion 71a is peeled off from the tape P, the inner lip portion 71a is elastically restored. As shown by the dotted line in FIG. 11, the elastically restored inner lip portion 71a is inclined obliquely with respect to the holding surface of the tape P in the substrate holding portion 41, and is inclined inward in the radial direction from the upper side to the lower side. ing. Further, the elastically restored inner lip portion 71a protrudes below the outer lip portion 71b as indicated by a dotted line in FIG.

  The outer lip portion 71b pushes the tape P into the elastic ring portion 41c and elastically deforms the elastic ring portion 41c. The elastic ring portion 41c brings the tape P into close contact with the outer lip portion 71b by its elastic restoring force. The close contact force can suppress the leakage of the cleaning liquid.

  The outer lip portion 71b is formed in a sharp shape toward the elastic ring portion 41c, for example. Since the adhesive force of the tape P concentrates on the tip of the outer lip portion 71b, the leakage of the cleaning liquid can be further suppressed.

  When the outer lip portion 71b is peeled off from the tape P, the elastic ring portion 41c is elastically restored. The holding surface of the tape P in the elastic ring portion 41c that has been elastically restored may be continuously arranged on the same plane with respect to the holding surface of the tape P in the outer holding portion 41b.

  The number of lip portions is not particularly limited. The number of lip portions may be one, for example, only the inner lip portion 71a may be provided. The inner lip portion 71a may push the tape P into the elastic ring portion 41c. Further, the number of lip portions may be three or more, and the lip portions may be provided between the inner lip portion 71a and the outer lip portion 71b and / or outside the outer lip portion 71b.

  The fixing ring portion 72 comes into contact with the frame F from the side opposite to the substrate holding portion 41. The fixing ring portion 72 is made of a material harder than the liquid intrusion restricting portion 71 and is made of a metal such as stainless steel like the frame F, for example. The frame cover 70 can be stably fixed to the frame F.

  The fixing ring cover portion 73 protects the fixing ring portion 72 from the cleaning liquid and fixes the liquid intrusion restricting portion 71 between the fixing ring portion 72 and the fixing ring portion 72. The fixing ring cover portion 73 includes a base material harder than the liquid intrusion restricting portion 71 and a protective film that protects the base material from the cleaning liquid. The protective film is made of a material having corrosion resistance to the cleaning liquid, and is made of, for example, a fluorine-based resin such as Teflon (registered trademark). The base material is selected according to the type of the protective film, and is formed of a metal such as aluminum, for example.

  In addition to the fixing ring portion 72, the fixing ring cover portion 73 protects the frame cover fixing mechanism 80 from the cleaning liquid.

  The frame cover fixing mechanism 80 (see FIG. 7) fixes the frame cover 70 to the substrate holding portion 41 together with the frame F. The frame cover fixing mechanism 80 corresponds to the frame cover fixing portion described in the claims. The frame cover fixing mechanism 80 includes, for example, both a mechanical chuck 81 (see FIGS. 11 to 12) and a magnet unit 82 (see FIG. 13).

  As shown in FIG. 11, the mechanical chuck 81 has, for example, a claw portion 81a and an arm portion 81b. The arm portion 81 b is attached to the lower surface of the substrate holding portion 41 and protrudes outward in the radial direction of the substrate holding portion 41. A plurality of (for example, four) arm portions 81 b are provided at intervals in the circumferential direction of the substrate holding portion 41. A claw 81a is swingably attached to the tip of each arm 81b. As shown in FIG. 12, each claw portion 81 a presses the fixing ring portion 72 of the frame cover 70 from above to fix the frame cover 70 to the substrate holding portion 41. The frame cover 70 is fixed to the substrate holding part 41 with the frame F interposed therebetween.

  The mechanical chuck 81 further includes an attitude detection sensor (not shown). The posture detection sensor detects the posture of each claw portion 81 a and transmits the detection result to the control device 30. The control device 30 detects whether or not the frame F and the frame cover 70 are normally fixed to the substrate holding portion 41 based on the posture of each claw portion 81a.

  As shown in FIG. 13, the magnet unit 82 includes, for example, a magnet 82a and an adsorbent 82b that is adsorbed by the magnet 82a. The magnet unit 82 attracts the frame cover 70 to the substrate holding part 41 by magnetic force. The frame cover 70 is fixed to the substrate holding part 41 with the frame F interposed therebetween.

  The magnet 82a is attached to the substrate holding part 41, for example. A plurality of (for example, eight) magnets 82 a are provided at intervals in the circumferential direction of the substrate holding portion 41. One magnet 82a is provided on each side of each claw portion 81a. The number of the magnets 82a may be one, and the shape of the magnets 82a may be annular.

  The magnet 82a is rotated together with the substrate holder 41. Therefore, a permanent magnet is used as the magnet 82a. The magnet 82a may be an electromagnet. By stopping energization of the electromagnet, the attractive force can be made substantially zero.

  The adsorbent 82b is attached to the frame cover 70, for example. A plurality of (e.g., eight) adsorbers 82b are provided at intervals in the circumferential direction of the frame cover 70. A plurality of attractors 82b are provided corresponding to the plurality of magnets 82a.

  The number of the adsorbents 82b may be one, and the shape of the adsorbents 82b may be annular. For example, the fixing ring portion 72 may be used as the adsorbent 82b. In this case, the magnet 82 a may be disposed directly below the fixing ring portion 72.

  The adsorbent 82b is rotated together with the frame cover 70. The adsorbent 82b is made of, for example, a soft magnetic material. Regardless of the direction of the magnetic pole of the magnet 82a, the magnet 82a can attract the attracting body 82b. Therefore, when attaching the magnet 82a to the board | substrate holding | maintenance part 41, the effort which manages the direction of the magnetic pole of the magnet 82a can be saved.

  The arrangement of the magnet 82a and the adsorbing body 82b may be reversed. The magnet 82a may be attached to the frame cover 70 and the adsorbing body 82b may be attached to the substrate holding portion 41. Further, the attracting body 82b only needs to be attracted by the magnet 82a, and may be formed of a hard magnetic material. That is, the adsorbent 82b may also be a magnet, and the magnet may be attached to both the substrate holding part 41 and the frame cover 70.

  The frame cover fixing mechanism 80 of the present embodiment includes both the mechanical chuck 81 and the magnet unit 82, but may include only one of them. When the frame cover fixing mechanism 80 has only the magnet unit 82, a sensor for detecting whether or not the frame F and the frame cover 70 are normally fixed to the substrate holding portion 41 is provided separately from the posture detection sensor.

  14 is a cross-sectional view of the delivery mechanism and the like along the line XIV-XIV in FIG. The delivery mechanism 90 receives the substrate W to be processed from the first transport device 12 and delivers it to the spin chuck 40 as shown in FIG. In addition, the delivery mechanism 90 receives the substrate W to be processed from the spin chuck 40 as shown in FIG.

  The delivery mechanism 90 delivers the substrate W to be processed and the frame cover 70 to the spin chuck 40. Since the frame cover 70 is attached to and detached from the frame F inside the first cleaning device 16, the frame cover 70 can be put on the frame F only during cleaning. One frame cover 70 can be used repeatedly.

  As shown in FIGS. 7 to 9, the delivery mechanism 90 includes, for example, a frame holding part 91, a frame cover holding part 94, and an elevating part 97.

  The frame holding unit 91 holds the target substrate W by holding the frame F. The frame holding portion 91 includes, for example, a plurality of frame holding claws 92a and 92b and a frame holding claw opening / closing mechanism 93.

  The plurality of frame holding claws 92 a and 92 b are arranged radially around the center line of the frame F. The plurality of frame holding claws 92 a and 92 b are hooked and held by the frame F by closing inward in the radial direction. Further, the plurality of frame holding claws 92a, 92b are released radially outward to release the holding of the frame F.

  The frame holding claw opening / closing mechanism 93 opens and closes the plurality of frame holding claws 92a and 92b in the radial direction. The frame holding claw opening / closing mechanism 93 has a plurality of cylinders 93a, 93b corresponding to the plurality of frame holding claws 92a, 92b.

  Note that the frame holding unit 91 of this embodiment hooks and holds the frame F, but the frame F may be sucked and held.

  The frame cover holding part 94 holds the frame cover 70. As shown in FIG. 14, the frame cover holding unit 94 includes, for example, a plurality of frame cover holding claws 95 a and 95 b and a frame cover holding claw opening / closing mechanism 96.

  The plurality of frame cover holding claws 95 a and 95 b are arranged radially around the center line of the frame cover 70. The plurality of frame cover holding claws 95a and 95b hook and hold the frame cover 70 by closing inward in the radial direction. Further, the plurality of frame cover holding claws 95a and 95b are released radially outward to release the holding of the frame cover 70.

  Each of the plurality of frame cover holding claws 95a and 95b is bifurcated from the base end portion, and has a guide pin GP (see FIG. 14, FIG. 7, etc.) at each branched tip end portion. Each guide pin GP is inserted into a guide groove GG (see FIG. 14) formed on the outer periphery of the frame cover 70. Thereby, position shift can be prevented.

  Each of the plurality of frame cover holding claws 95a and 95b of the present embodiment is bifurcated from the base end portion. However, the frame cover holding claws 95a and 95b may not be branched, and have a guide pin GP at the distal end portion. Also good. The arrangement of the guide pin GP and the guide groove GG may be reversed, the guide pin GP may be arranged in the frame cover 70, and the guide groove GG may be arranged in the frame cover holding claws 95a and 95b.

  The frame cover holding claw opening / closing mechanism 96 opens and closes the plurality of frame cover holding claws 95a and 95b in the radial direction. The frame cover holding claw opening / closing mechanism 96 has a plurality of cylinders 96a, 96b corresponding to the plurality of frame cover holding claws 95a, 95b.

  The frame cover holding portion 94 of the present embodiment hooks and holds the frame cover 70, but the frame cover 70 may be sucked and held.

  The elevating part 97 has a first elevating part 97a (see FIGS. 7 to 9) and a second elevating part 97b (see FIG. 14). The first elevating part 97a raises and lowers the frame holding part 91 and the frame cover holding part 94 with respect to the substrate holding part 41 at the same time. The second elevating unit 97b moves the other frame cover holding claw 95b up and down relatively with respect to the one frame cover holding claw 95a.

  The number of frame cover holding claws may be three or more. The number of second elevating parts 97b may be one less than the number of frame cover holding claws, but may be more than that number.

  When the tape P held by the substrate holding part 41 and the frame cover 70 are peeled off, the control device 30 first operates the second elevating part 97b and then operates the first elevating part 97a. Peeling is performed sequentially from one circumferential end to the other circumferential end.

  Next, a cleaning method using the first cleaning device 16 will be described with reference to FIG. FIG. 15 is a flowchart of a cleaning method according to an embodiment.

  As shown in FIG. 15, the cleaning method includes, for example, a preparation step S21, a cleaning liquid supply step S22, a rinse liquid supply step S23, a drying step S24, and a recovery step S25. These steps are performed under the control of the control device 30.

  The preparation step S <b> 21 starts when the delivery mechanism 90 receives the substrate to be processed W after peeling from the first transport device 12. The delivery mechanism 90 holds the substrate W to be processed via the frame F and holds the frame cover 70 above the frame F.

  In the preparation step S21, the delivery mechanism 90 delivers the substrate to be processed W and the frame cover 70 to the spin chuck 40, and the liquid supply mechanism 50 and the like prepare for supply of the cleaning liquid.

  Specifically, the elevating unit 97 first lowers the frame holding unit 91 and the frame cover holding unit 94 from the standby position to the delivery position. As a result, the substrate to be processed W and the frame cover 70 are transferred to the substrate holder 41. Further, the frame cover 70 is attracted to the substrate holder 41 by the magnetic force of the magnet unit 82.

  Next, the substrate holding unit 41 holds the substrate W to be processed via the tape P, and the mechanical chuck 81 fixes the frame cover 70 to the substrate holding unit 41. The frame cover 70 is fixed to the substrate holder 41 with the frame F interposed therebetween.

  The inner lip portion 71a is pressed against the substrate holding portion 41 via the tape P and is elastically deformed. Further, the outer lip portion 71b pushes the tape P into the elastic ring portion 41c, and elastically deforms the elastic ring portion 41c. The elastic ring portion 41c causes the tape P to adhere to the outer lip portion 71b by its elastic restoring force.

  Next, the elevating unit 97 raises the frame holding unit 91 and the frame cover holding unit 94 to the original standby position.

  Thereafter, the moving elevating unit 53 horizontally moves the cleaning liquid nozzle 51 from the standby position to the liquid supply position. This operation may be started before the delivery mechanism 90 is completely lifted.

  Thereafter, the outer peripheral cover 65 is pulled up from the standby position to the liquid scattering prevention position. This operation may be started before the movement of the cleaning liquid nozzle 51 is completed.

  In the cleaning liquid supply step S <b> 22, the cleaning liquid nozzle 51 supplies the cleaning liquid toward the target substrate W. At this time, the rotation driving unit 46 rotates the substrate holding unit 41. The cleaning liquid supplied to the substrate to be processed W wets and spreads due to the centrifugal force accompanying the rotation of the substrate to be processed W. The entire bonding surface of the substrate to be processed W is covered with the cleaning liquid film, and the bonding agent adhering to the bonding surface of the substrate to be processed W is immersed in the cleaning liquid. The bonding agent gradually dissolves in the cleaning solution.

  At this time, the frame cover 70 is fixed to the substrate holding portion 41 together with the frame F. The inner lip portion 71a and the outer lip portion 71b come into contact with the tape P on the outside of the substrate to be processed W held on the substrate holding portion 41 and on the inside of the frame F, respectively. To regulate. Therefore, the frame F can be protected from the cleaning liquid.

  In the rinsing liquid supply step S <b> 23, the rinsing liquid nozzle supplies a rinsing liquid (for example, IPA) toward the substrate W to be processed. At this time, the rotation driving unit 46 rotates the substrate holding unit 41. The rinse liquid supplied to the substrate to be processed W wets and spreads due to the centrifugal force accompanying the rotation of the substrate to be processed W. The liquid on the substrate to be processed W can be replaced or diluted with the rinse liquid.

  In the drying step S24, the rotation driving unit 46 rotates the substrate holding unit 41 and shakes off the remaining liquid on the substrate W to be processed by centrifugal force. The shaken liquid leaves the tape P along the frame cover 70, gets over the frame cover 70, and is collected in the cup 60. Incidentally, after the rinsing liquid supply step S23 and before the drying step S24, the moving elevating unit 53 may move the cleaning liquid nozzle 51 and the like from the liquid supply position to the standby position.

  In the collection step S25, the substrate W after drying is received by the delivery mechanism 90 from the spin chuck 40 and delivered to the first transport device 12. The delivery mechanism 90 receives the frame cover 70 from the spin chuck 40 in addition to the substrate W to be processed.

  Specifically, the elevating unit 97 first lowers the frame holding unit 91 and the frame cover holding unit 94 from the standby position to the delivery position. This operation may be performed after the outer peripheral cover 65 is lowered from the liquid splash prevention position to the standby position.

  Next, the mechanical chuck 81 releases the fixation of the frame cover 70 to the substrate holding portion 41. At this time, the frame cover 70 is attracted to the substrate holder 41 by the magnet unit 82. At this time, the frame cover 70 is attached to the tape P.

  Next, the delivery mechanism 90 holds the frame cover 70, raises the frame cover 70 slightly with respect to the substrate holding portion 41, releases the adsorption by the magnet unit 82, and separates the frame cover 70 and the tape P. At this time, the substrate holding unit 41 holds the tape P from the side opposite to the frame cover 70.

  As described above, the substrate holding part 41 includes the outer holding part 41b in addition to the inner holding part 41a. Both the inner holding part 41 a and the outer holding part 41 b hold the tape P from the side opposite to the frame cover 70.

  The outer holding portion 41 b holds the tape P from the side opposite to the frame cover 70 on the outer side of the inner periphery of the frame cover 70 and the inner side of the frame F. When the frame cover 70 and the tape P are peeled off, the tape P can be fixed in the vicinity of the lip portions 71a and 71b attached to the tape P.

  The outer holding portion 41 b has suction holes for vacuum-sucking the tape P outside the inner periphery of the frame cover 70 and inside the frame F. The suction hole may be provided at a position that does not overlap with the lip portions 71a and 71b in a plan view, and may be provided between the inner lip portion 71a and the outer lip portion 71b, for example.

  In addition, although the outer holding | maintenance part 41b of this embodiment utilizes a vacuum suction force for the holding | maintenance of the tape P, you may utilize an adhesive force, an electrostatic force, etc., for example. The holding of the tape P by the outer holding portion 41b may be various.

  The delivery mechanism 90 sequentially peels the frame cover 70 and the tape P from one circumferential end of the frame cover 70 toward the other circumferential end. Since the peeling of the frame cover 70 from the tape P and the release of the adsorption by the magnet unit 82 are performed gradually, the fluttering of the frame cover 70 can be suppressed as compared with the case where it is performed all at once.

  Next, the substrate holding part 41 releases the holding of the tape P, and the elevating part 97 raises the frame holding part 91 and the frame cover holding part 94 to the original standby position. On the way, the frame holding unit 91 hooks and holds the frame F.

  Thereafter, the delivery mechanism 90 delivers the substrate W to be processed to the first transport device 12, and the recovery step S25 is completed. At this time, the frame cover 70 is held by the delivery mechanism 90 and used for protection of the next frame F.

  As described above, the first cleaning device 16 of the present embodiment has the frame cover 70. The frame cover 70 has one or more lip portions (two lip portions 71a and 71b in the present embodiment). The lip portions 71 a and 71 b contact the tape P outside the substrate to be processed W held by the substrate holding portion 41 and inside the frame F, thereby restricting the wetting and spreading of the cleaning liquid on the tape P. Therefore, deterioration of the frame F due to the cleaning liquid can be suppressed.

  The substrate holding portion 41 of the present embodiment holds the tape P from the opposite side of the frame cover 70 on the outer side of the inner periphery of the frame cover 70 and the inner side of the frame F when the frame cover 70 and the tape P are peeled off. To do. When the frame cover 70 and the tape P are peeled off, the tape P can be fixed in the vicinity of the lip portions 71a and 71b attached to the tape P. This effect becomes more prominent as the adhesion between the frame cover 70 and the tape P is stronger.

  A seal portion 42 is attached to the substrate holding portion 41 of the present embodiment. The seal portion 42 surrounds the suction hole for vacuum suction in the substrate holding portion 41 and closes the space between the substrate holding portion 41 and the frame F. Therefore, the inflow of outside air to the suction hole can be suppressed, and the decrease in the suction force can be suppressed.

  The substrate holding part 41 of this embodiment has an annular elastic ring part 41 c outside the substrate to be processed W held by the substrate holding part 41 and inside the frame F. The outer lip portion 71b pushes the tape P into the elastic ring portion 41c and elastically deforms the elastic ring portion 41c. The tape P can be brought into close contact with the frame cover 70 by the elastic restoring force of the elastic ring portion 41c, and the leakage of the cleaning liquid can be further suppressed.

  In this embodiment, the outer lip portion 71b pushes the tape P into the elastic ring portion 41c, but the inner lip portion 71a may push the tape P into the elastic ring portion 41c, or the inner lip portion 71a and the outer lip portion 71b. Both of them may push the tape P into the elastic ring portion 41c. In either case, the tape P can be brought into close contact with the frame cover 70 by the elastic restoring force of the elastic ring portion 41c.

  A part of the magnet unit 82 is attached to the substrate holding part 41 of the present embodiment. The magnet unit 82 attracts the frame cover 70 together with the frame F to the substrate holding portion 41. The lip portions 71a and 71b can be brought into close contact with the tape P by magnetic force, and leakage of the cleaning liquid can be suppressed.

  As mentioned above, although embodiment of washing | cleaning apparatus etc. was described, this invention is not limited to the said embodiment etc., In the range of the summary of this invention described in the claim, various deformation | transformation and improvement are possible. is there.

  For example, the type of substrate W to be processed may be various, and may be, for example, a substrate for an FPD (flat panel display), a mask reticle for a photomask, or the like in addition to a semiconductor substrate.

  The bonding layer G of the polymerization substrate T shown in FIG. 3 has a three-layer structure including a protective agent layer G1, a release agent layer G2, and an adhesive layer G3, but the structure is not particularly limited. For example, the bonding layer G may have a one-layer structure including only the adhesive layer G3 or a two-layer structure including the release agent layer G2 and the adhesive layer G3. In the case of a two-layer structure, the disposition of the release agent layer G2 and the adhesive layer G3 may be opposite to that in FIG. 3, the release agent layer G2 is disposed on the substrate to be processed W, and the adhesive layer G3 It may be arranged on the side. Therefore, the type of the bonding agent that adheres to the bonding surface of the substrate to be processed W after peeling is not particularly limited.

  The first cleaning device 16 of the above embodiment is used for cleaning the target substrate W after peeling, but may be used for cleaning the supporting substrate S after peeling. The application of the first cleaning device 16 is not particularly limited.

  The liquid supply mechanism 50 of the above embodiment linearly moves the cleaning liquid nozzle 51 in the horizontal direction, but the cleaning liquid nozzle 51 may be rotated in the horizontal direction.

DESCRIPTION OF SYMBOLS 1 Peeling system 15 Peeling device 16 1st washing | cleaning apparatus 30 Control apparatus 40 Spin chuck 41 Substrate holding part 41a Inner holding part 41b Outer holding part 41c Elastic ring part 42 Seal part 46 Rotation drive part 50 Liquid supply mechanism 51 Cleaning liquid nozzle 70 Frame cover 71 Liquid intrusion restricting portion 71a Inner lip portion 71b Outer lip portion 80 Frame cover fixing mechanism 81 Mechanical chuck 82 Magnet unit 90 Delivery mechanism 91 Frame holding portion 94 Frame cover holding portion 97 Lifting portion

Claims (16)

A substrate holding part for holding the substrate attached to the tape fixed to the frame via the tape;
A rotation drive unit for rotating the substrate holding unit;
A liquid supply unit for supplying a cleaning liquid toward the substrate rotating together with the substrate holding unit;
A frame cover for protecting the frame from the cleaning liquid;
A frame cover fixing part for fixing the frame cover together with the frame to the substrate holding part;
The frame cover has one or more annular lip portions that regulate the wetting and spreading of the cleaning liquid in the tape by contacting the tape outside the substrate and inside the frame,
The substrate holding unit holds the tape from the opposite side of the frame cover outside the inner periphery of the frame cover and inside the frame when the frame cover and the tape are peeled off. .   The substrate holding portion vacuum-sucks the tape from the side opposite to the frame cover on the outer side of the inner periphery of the frame cover and on the inner side of the frame when the frame cover and the tape are peeled off. Item 2. The cleaning device according to Item 1.   The cleaning apparatus according to claim 2, further comprising a seal portion that surrounds a suction hole for vacuum suction in the substrate holding portion and closes a gap between the substrate holding portion and the frame. The substrate holding portion has an annular elastic ring portion outside the substrate held by the substrate holding portion and inside the frame,
The cleaning device according to claim 1, wherein at least one of the lip portions pushes the tape into the elastic ring portion to elastically deform the elastic ring portion.   The said frame cover fixing | fixed part is a washing | cleaning apparatus of any one of Claims 1-4 which has a magnet unit which adsorb | sucks the said frame cover with respect to the said board | substrate holding part with the said frame.   The cleaning apparatus according to claim 1, wherein the liquid supply unit supplies a solvent that dissolves a bonding agent attached to the substrate as the cleaning liquid. A peeling device that peels the superposed substrate bonded with the first substrate and the second substrate into the first substrate and the second substrate, and a cleaning device that cleans the bonded surface of the first substrate after peeling. A peeling system,
A peeling system comprising the cleaning device according to any one of claims 1 to 6 as the cleaning device. A preparatory step for holding the substrate attached to the tape fixed to the frame on the substrate holding part via the tape and fixing the frame cover to the substrate holding part together with the frame;
After the preparation step, a cleaning liquid supply step of supplying a cleaning liquid to the substrate rotating together with the substrate holding unit and protecting the frame from the cleaning liquid by the frame cover;
After the cleaning liquid supply step, the tape held by the substrate holding unit and the frame cover are peeled off, and a recovery step of releasing the holding of the tape by the substrate holding unit,
The frame cover has one or more annular lip portions that regulate the wetting and spreading of the cleaning liquid in the tape by contacting the tape outside the substrate and inside the frame,
The substrate holding unit holds the tape from the opposite side of the frame cover outside the inner periphery of the frame cover and inside the frame when the frame cover and the tape are peeled off. .   The substrate holding portion vacuum-sucks the tape from the side opposite to the frame cover on the outer side of the inner periphery of the frame cover and on the inner side of the frame when the frame cover and the tape are peeled off. Item 9. The cleaning method according to Item 8.   The cleaning method according to claim 9, wherein in the preparation step, a space between the substrate holding unit and the frame is closed by a seal portion that surrounds a vacuum suction hole in the substrate holding unit. The substrate holding portion has an annular elastic ring portion outside the substrate held by the substrate holding portion and inside the frame,
The cleaning method according to claim 8, wherein at least one of the lip portions pushes the tape into the elastic ring portion to elastically deform the elastic ring portion.   The cleaning method according to any one of claims 8 to 11, wherein, in the preparation step, the frame cover is attracted to the substrate holding portion together with the frame by a magnetic force.   The cleaning method according to claim 8, wherein a solvent that dissolves the bonding agent attached to the substrate is supplied as the cleaning liquid. A peeling step of peeling the superposed substrate bonded with the first substrate and the second substrate into the first substrate and the second substrate;
And a cleaning step of cleaning the bonding surface of the first substrate after peeling,
In the said washing | cleaning process, the peeling method using the washing | cleaning method of any one of Claims 8-13.   The program for making a computer perform the washing | cleaning method of any one of Claims 8-13.   An information storage medium storing the program according to claim 15.

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