JP2017062867A - Substrate for suspension, suspension, suspension with head, hard disk drive and manufacturing method of substrate for suspension - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for suspension capable of improving connection reliability with an actuator element while suppressing complication in manufacturing processes.SOLUTION: A substrate 1 for suspension has a connection structure region 3 that can be connected to an actuator element 44 arranged on an opposite side of an insulator layer 10 with regard to a metal support layer 11, via a conductive adhesive. The connection structure region 3 has an insulator layer opening part 33 that penetrates the insulator layer 10. The insulator layer opening part 33 has a conductive connection part 30 made of nickel and connected to a wiring layer 12. The connection structure region 3 has a metal support layer opening part 32 that penetrates the metal support layer 11 and makes a surface of the conductive connection part 30 on a metal support layer 11 side exposed to the outside.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for manufacturing a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a suspension substrate. The present invention relates to a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a method for manufacturing a suspension substrate.

  Generally, a hard disk drive (HDD) includes a suspension substrate (flexure) on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. The suspension substrate is formed to extend from a head region on which the magnetic head slider is mounted to a tail region connected to an FPC substrate (flexible printed circuit board), and a metal support layer and an insulating layer on the metal support layer And a wiring layer having a plurality of wirings stacked via each other, and by writing an electric signal through each wiring, data is written to or read from the disk.

  In such a hard disk drive, in order to move the magnetic head slider to a desired data track on the disk, a VCM actuator (voice coil motor) that rotates an actuator arm that supports the magnetic head slider is provided by a servo control system. I have control.

  In recent years, there has been an increasing demand for an increase in disk capacity. In order to meet this demand, the density of the disk is increased and the width of the track is reduced. For this reason, it may be difficult to accurately align the magnetic head slider to a desired track by the VCM actuator.

In order to cope with this, a dual actuator type suspension is known in which a VCM actuator and a PZT microactuator (Dual Stage Actuator: DSA) cooperate to move a magnetic head slider to a desired track (for example, Patent Documents 1 to 3). This PZT microactuator is composed of a piezo element (piezoelectric element) made of PZT (lead zirconate titanate), and expands and contracts when a voltage is applied to move the magnetic head slider minutely.
In such a dual actuator type suspension, the VCM actuator roughly adjusts the position of the magnetic head slider, and the PZT microactuator finely adjusts the position of the magnetic head slider. In this way, the magnetic head slider is aligned with a desired track quickly and accurately.

  In the suspension substrates shown in Patent Documents 1 to 3, openings are provided in the metal support layer and the insulating layer, and a conductive adhesive (eg, silver) is applied to the wiring layer (DSA pad) exposed through the openings. Piezo elements are connected via a paste).

JP 2010-165406 A JP 2012-022756 A JP 2011-129180 A

  However, in the suspension substrates shown in Patent Documents 1 to 3, the wiring layer is laminated on the insulating layer, and the insulating layer is opened by etching or the like so that the surface on the piezoelectric element side of the DSA pad of the wiring layer is exposed. It has become. That is, the surface of the DSA pad on the piezoelectric element side is formed on the smooth surface of the insulating layer and then exposed by etching or the like. As a result, the surface of the DSA pad on the piezo element side is formed smoothly, and the surface of the gold plating layer subsequently formed on the surface is also smoothed. In this case, sufficient adhesion between the gold plating layer and the conductive adhesive may not be obtained. Further, in the suspension substrate shown in Patent Document 3, a convex portion is formed on the DSA pad in order to maintain high reliability. However, in order to form such a convex portion, an additional processing step is required. It becomes. For this reason, the problem that a manufacturing process becomes complicated and manufacturing cost increases can be considered.

  The present invention has been made in consideration of such points, and the suspension substrate, suspension, and suspension with a head that can improve the connection reliability with the actuator element while suppressing the complexity of the manufacturing process. An object of the present invention is to provide a method of manufacturing a hard disk drive and a suspension substrate.

  According to the present invention, as a first solution, a wiring layer is laminated on a metal support layer through an insulating layer, and the actuator element disposed on the opposite side of the metal support layer from the insulating layer side is electrically conductive. In a suspension substrate having a connection structure region connectable via an adhesive, provided in the connection structure region, an insulating layer opening penetrating the insulating layer, provided in the insulating layer opening, and formed of nickel And a conductive connection portion connected to the wiring layer and a metal provided in the connection structure region and penetrating the metal support layer to expose the surface of the conductive connection portion on the metal support layer side to the outside. A suspension substrate comprising a support layer opening is provided.

  In the suspension substrate according to the first solving means described above, the surface of the conductive connection portion on the metal support layer side may be curved in a concave shape.

  Further, in the suspension substrate according to the first solving means described above, the insulating layer side end of the outer edge of the metal support layer opening is positioned inward from the metal support layer side end of the outer edge of the insulating layer opening. The conductive connection portion may be electrically connected to the metal support layer in the connection structure region.

  Further, in the suspension substrate according to the first solving means described above, in the connection structure region, a gold plating layer is provided on a surface opposite to the insulating layer side of the metal support layer. Also good.

  Further, in the suspension substrate according to the first solving means described above, a wiring layer opening that penetrates the wiring layer is provided in the connection structure region, and the conductive connection portion extends into the wiring layer opening. You may make it the surface on the opposite side to the said metal support layer side of an electroconductive connection part exposed to the outward.

  According to the present invention, as a second solution, a wiring layer is laminated on a metal support layer via an insulating layer, and the actuator element disposed on the opposite side of the metal support layer from the insulating layer side is electrically conductive. A suspension substrate having a connection structure region connectable via an adhesive, provided in the connection structure region, an insulating layer opening penetrating the insulating layer, provided in the insulating layer opening, and the wiring layer And a metal support layer opening provided in the connection structure region and penetrating through the metal support layer, wherein the conductive connection portion is on the metal support layer side of the conductive connection portion. A surface of the gold-plated portion on the metal support layer side is exposed to the outside through the metal support layer opening, and the metal of the insulating layer. Flush with the surface of the support layer To provide a suspension substrate, characterized in that located.

  In the suspension substrate according to the second solution described above, the insulating layer side end of the outer edge of the metal support layer opening is positioned inward from the metal support layer side end of the outer edge of the insulating layer opening. And the said gold plating part may be made to be electrically connected to the said metal support layer in the said connection structure area | region.

  Further, in the suspension substrate according to the second solving means described above, in the connection structure region, a gold plating layer is provided on a surface opposite to the insulating layer side of the metal support layer. Also good.

  Further, in the suspension substrate according to the second solving means described above, a wiring layer opening penetrating the wiring layer is provided in the connection structure region, and the conductive connection portion extends into the wiring layer opening, You may make it the surface on the opposite side to the said metal support layer side of an electroconductive connection part exposed to the outward.

  In the suspension substrate according to the second solving means described above, the conductive connection portion includes a connection main body portion provided on the opposite side of the metal plating layer side of the gold plating portion, and the connection main body portion. May be made of nickel.

  In the suspension substrate according to the second solving means described above, the conductive connection portion includes a connection main body portion provided on the opposite side of the metal plating layer side of the gold plating portion, and the connection main body portion. May be integrally formed of the same material as the wiring layer.

  Further, in the suspension substrate according to the second solving means described above, the entire conductive connection portion may be formed by gold plating.

  Further, in the suspension substrate according to the second solving means described above, rolling streaks are formed on the surface of the metal support layer on the insulating layer side, and the rolling is formed on the surface of the gold plating portion on the metal support layer side. An uneven shape having a shape corresponding to the line may be formed.

  The present invention is a base plate, the above-mentioned suspension substrate attached to the base plate via a load beam, and joined to at least one of the base plate and the load beam, and the connection structure of the suspension substrate. There is provided a suspension comprising the actuator element connected to a region via the conductive adhesive.

  The present invention provides a suspension with a head, comprising the above-described suspension and the head slider mounted on the suspension.

  The present invention provides a hard disk drive comprising the aforementioned suspension with a head.

  According to the present invention, as a third solution, a wiring layer is laminated on a metal support layer via an insulating layer, and conductive adhesion is applied to an actuator element arranged on the opposite side of the metal support layer from the insulating layer side. In the manufacturing method of a suspension substrate having a connection structure region connectable via an agent, the laminate includes the insulating layer, the metal support layer, and the wiring layer, wherein the insulating layer is formed in the connection structure region. A step of preparing the laminate, wherein an insulating layer opening penetrating through the insulating layer opening is provided, and a conductive connection portion formed of nickel and connected to the wiring layer is provided in the insulating layer opening; and After the step of preparing the metal support layer opening, the metal support layer opening that penetrates the metal support layer in the connection structure region and exposes the metal support layer side surface of the conductive connection portion. The providing and forming by etching, a method of manufacturing a substrate for suspension, characterized in that it comprises a.

  As a fourth solution of the present invention, a wiring layer is laminated on a metal support layer via an insulating layer, and the actuator element disposed on the opposite side of the metal support layer from the insulating layer side is electrically conductive. In the method for manufacturing a suspension substrate having a connection structure region connectable via an adhesive, the laminate includes the insulating layer, the metal support layer, and the wiring layer, and the insulating structure is formed in the connection structure region. An insulating layer opening penetrating the layer is provided, and the insulating layer opening has a gold-plated portion provided in a portion on the metal support layer side and a conductive connecting portion connected to the wiring layer is formed After the step of preparing the laminate and the step of preparing the laminate, the metal support layer opening that penetrates the metal support layer in the connection structure region, the metal support of the gold plating portion. Forming the metal support layer opening that exposes the layer-side surface by etching, and in the step of preparing the laminate, the gold-plated portion of the conductive connection portion is the metal support layer of the metal support layer Provided is a method for manufacturing a suspension substrate, wherein the suspension substrate is formed in a portion exposed by the opening of the insulating layer in the surface on the insulating layer side.

  According to the present invention, it is possible to improve the connection reliability with the actuator element while suppressing complication of the manufacturing process.

FIG. 1 is a plan view showing an example of a suspension substrate according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view showing a connection structure region of the suspension board of FIG. FIG. 3 is a diagram showing an example of the suspension according to the first embodiment of the present invention. 4 is a rear view showing a part of the suspension of FIG. FIG. 5 is a perspective view showing an example of a piezo element in the suspension of FIG. 6 is a cross-sectional view showing a connection structure region in the suspension of FIG. FIG. 7 is a plan view showing an example of a suspension with a head according to the first embodiment of the present invention. FIG. 8 is a perspective view showing an example of the hard disk drive according to the first embodiment of the present invention. FIGS. 9A to 9F are views showing a method for manufacturing a suspension substrate in the first embodiment of the present invention. FIGS. 10A and 10B are cross-sectional views showing a modified example (modified example 1) of the connection structure region in the first embodiment of the present invention. FIG. 11 is a cross-sectional view showing the connection structure region of the suspension board in the second embodiment of the present invention. 12 (a) to 12 (g) are diagrams showing a method for manufacturing a suspension substrate in the second embodiment of the present invention. FIG. 13 is a partially enlarged view showing the metal support layer and the third gold plating layer in FIG. FIG. 14 is a cross-sectional view showing a modified example (modified example 2) of the connection structure region according to the second embodiment of the present invention. FIGS. 15A and 15B are cross-sectional views showing other modified examples (modified examples 3 and 4) of the connection structure region according to the second embodiment of the present invention. 16A to 16F are views showing a method for manufacturing the suspension substrate shown in FIG. FIGS. 17A and 17B are sectional views showing other modified examples (modified examples 5 and 6) of the connection structure region in the second embodiment of the present invention.

  A method of manufacturing a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a suspension substrate according to an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones.

(First embodiment)
As shown in FIG. 1, the suspension substrate 1 includes a substrate body region 2 and a pair of connection structure regions 3 disposed on both sides of the substrate body region 2, and a conductive adhesive (for example, And a pair of connection structure regions 3 connected via a silver paste). Among these, the board | substrate body area | region 2 contains the head part 2a in which the head slider 52 (refer FIG. 7) is mounted, and the tail part 2b to which the FPC board 71 (refer FIG. 7) is connected. The head part 2a is provided with a plurality of head terminals 5 connected to the head slider 52, and the tail part 2b is provided with a plurality of tail terminals (external connection board terminals) 6 connected to the FPC board 71. The head terminal 5 and the tail terminal 6 are connected to each other via a plurality of signal wires 13 to be described later. Each connection structure region 3 is connected to the substrate body region 2 via a connection region 4.

  As shown in FIGS. 1 and 2, the suspension substrate 1 includes an insulating layer 10 and a metal provided on one surface of the insulating layer 10 (the surface on the side of the piezo element 44 to be connected (see FIG. 6)). A support layer 11 and a wiring layer 12 provided on the other surface of the insulating layer 10 (a surface opposite to the piezoelectric element 44) are provided. That is, in the suspension substrate 1, the wiring layer 12 is laminated on the metal support layer 11 via the insulating layer 10, and the piezo element 44 is disposed on the opposite side of the metal support layer 11 from the insulating layer 10 side. It is arranged. Although not shown, a seed layer made of nickel (Ni), chromium (Cr), or copper (Cu) and having a thickness of about 300 nm is interposed between the insulating layer 10 and the wiring layer 12. Preferably, in this case, the adhesion between the insulating layer 10 and the wiring layer 12 can be improved.

  As shown in FIG. 1, the wiring layer 12 includes a plurality of wirings, that is, a signal wiring 13 including a pair of reading wirings and a pair of writing wirings, a pair of element wirings 14 connected to the piezo element 44, have. Among these, the signal wiring 13 connects the head terminal 5 and the tail terminal 6, and when an electric signal flows through the signal wiring 13, data is written to or read from the disk 63 (see FIG. 8). Is supposed to do. The element wiring 14 applies a desired voltage to the piezo element 44 through a wiring connection portion 16 described later.

  The wiring layer 12 includes a wiring connection portion 16 provided in the connection structure region 3 and electrically connected to the piezo element 44 via a conductive adhesive. Each wiring connection portion 16 is connected to the element wiring 14 of the wiring layer 12. The wiring connection portion 16 is formed of the same material as the wirings 13 and 14 and has substantially the same thickness as the wirings 13 and 14. The head terminal 5, tail terminal 6, and wirings 13 and 14 are formed. In addition, the wiring layer 12 is configured. The wiring connection portion 16 in the present embodiment is formed in a flat ring shape, as shown in FIG.

  As shown in FIG. 2, the metal support layer 11 has a ring-shaped metal frame portion 17 provided in the connection structure region 3. The metal frame portion 17 is separated from the portion constituting the metal support layer 11 in the substrate main body region 2. The insulating layer 10 has a ring-shaped insulating frame 18 provided in the connection structure region 3.

  The metal frame portion 17 of the metal support layer 11 forms a metal support layer opening 32 that penetrates the metal frame portion 17. Further, the insulating frame body portion 18 of the insulating layer 10 forms an insulating layer opening portion 33 that penetrates the insulating frame body portion 18 at a position corresponding to the metal support layer opening portion 32. Further, the wiring connection portion 16 of the wiring layer 12 forms a wiring layer opening 34 that penetrates the wiring connection portion 16 at a position corresponding to the insulating layer opening 33. In the present embodiment, the insulating layer side end (upper end) 32b of the outer edge 32a of the metal support layer opening 32 is more than the metal support layer side end (lower end) 33b of the outer edge 33a of the insulating layer opening 33. Located outside. More specifically, each of the metal support layer opening 32, the insulating layer opening 33, the wiring layer opening 34, and the protective layer opening 35 (described later) is formed in a circular shape in plan view, and each center Are substantially coincident with each other. The upper end portion 32 b of the outer edge 32 a of the metal support layer opening 32 is located on the outer side in the radial direction from the lower end portion 33 b of the outer edge 33 a of the insulating layer opening 33. That is, the diameter at the upper end of the metal support layer opening 32 is larger than the diameter at the lower end of the insulating layer opening 33. In this case, the surface of the insulating frame 18 on the side of the metal frame 17, that is, a part of the surface (the lower surface 18 a) on the side of the piezo element 44 is formed on the piezo element 44 via the metal support layer opening 32. Exposed to the side. As a result, the conductive adhesive is bonded to the exposed portion of the insulating frame 18 and the adhesion between the conductive adhesive and the connection structure region 3 is improved (for example, the conductive adhesive is made of silver paste). Thus, when the insulating layer 10 is formed of polyimide, the adhesion between the epoxy component of the silver paste and the polyimide is good). In FIG. 2, the outer edge 32 a of the metal support layer opening 32 and the outer edge 33 a of the insulating layer opening 33 are both inclined with respect to the stacking direction of the layers, but the outer edge 32 a of the metal support layer opening 32. If the upper end portion 32b of the metal layer is located radially outside the lower end portion 33b of the outer edge 33a of the insulating layer opening 33, the outer edge 32a of the metal support layer opening 32 and the outer edge 33a of the insulating layer opening 33 are Further, it may be formed so as to extend along the stacking direction.

  A conductive connection 30 is provided in the insulating layer opening 33 and the wiring layer opening 34. That is, the conductive connection part 30 extends from the insulating layer opening 33 to the wiring layer opening 34 and is connected to the wiring connection part 16. Further, the surface on the metal frame body 17 side of the conductive connection portion 30, that is, the surface on the piezoelectric element 44 side (lower surface 30 a) is outward (the piezoelectric element 44 side) through the metal support layer opening 32. Exposed. In this way, when the conductive adhesive is injected into the metal support layer opening 32, the lower surface 30a of the conductive connection portion 30 is in contact with the conductive adhesive, and the conductive connection portion 30 applies the conductive adhesive. Via the piezoelectric element 44. In the present embodiment, the conductive connection portion 30 is made of nickel.

  As shown in FIG. 2, the lower surface 30a of the conductive connection portion 30 is curved in a concave shape. Such a curved shape of the conductive connection part 30 is obtained by etching a part of the conductive connection part 30 with an etching solution of the metal support layer 11 for forming the metal frame part 17 as described later. It is done.

  Incidentally, a protective layer 20 is provided on the insulating layer 10 to cover the wiring connection portion 16 of the wiring layer 12. The protective layer 20 is formed so as to cover the wirings 13 and 14 of the wiring layer 12 in the substrate body region 2 and the connection region 4. In FIG. 1, the protective layer 20 is omitted for the sake of clarity.

  As shown in FIG. 2, the protective layer 20 has a surface on the side opposite to the metal frame body portion 17 of the conductive connection portion 30, that is, a surface opposite to the piezo element 44 side (upper surface 30 b). A protective layer opening 35 is provided to be exposed to the surface. In the present embodiment, the conductive connection portion 30 is formed so as to extend above the protective layer 20 through the protective layer opening 35. A gold plating layer (not shown) may be formed on the upper surface 30b of the conductive connection part 30 exposed in the protective layer opening 35. In this case, when conducting a continuity test between the conductive connection part 30 and the piezo element 44 using a continuity tester 80 such as a probe (see FIG. 6), the contact resistance between the probe and the conductive connection part 30 is reduced. Inspection accuracy can be improved.

  In addition, as shown in FIG. 1, the substrate main body region 2 has two treatments for alignment with the load beam 43 when the suspension substrate 1 is attached to the load beam 43 (see FIG. 3). A tool hole 25 is provided. Each jig hole 25 is disposed on the longitudinal axis (X). That is, the longitudinal axis (X) passes through each jig hole 25.

  Next, materials constituting each layer of the suspension substrate 1 will be described in detail.

  The material of the insulating layer 10 is not particularly limited as long as it is a material having a desired insulating property. For example, it is preferable to use polyimide (PI). Note that the material of the insulating layer 10 can be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer 10 is preferably 5 μm to 30 μm, particularly 8 μm to 10 μm. As a result, the insulation performance between the metal support layer 11 and the wirings 13 and 14 can be ensured, and the loss of the rigidity of the suspension substrate 1 as a whole can be prevented.

  Each wiring 13 and 14 is configured as a conductor for transmitting an electrical signal, and the material of each wiring 13 and 14 is not particularly limited as long as it is a material having a desired conductivity. It is preferable to use copper (Cu). In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, it is preferable that the thickness of each wiring 13 and 14 is 1 micrometer-18 micrometers, especially 9 micrometers-12 micrometers, for example. As a result, it is possible to ensure the transmission characteristics of the wirings 13 and 14 and to prevent the flexibility of the suspension substrate 1 as a whole from being lost. The head terminal 5, tail terminal 6 and wiring connection portion 16 are made of the same material and the same thickness as the wirings 13 and 14.

  The material of the metal support layer 11 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel. The thickness of the metal support layer 11 is preferably 10 μm to 30 μm, more preferably 15 μm to 20 μm. As a result, the conductivity, rigidity, and elasticity of the metal support layer 11 can be ensured.

  As a material of the protective layer 20, it is preferable to use a resin material such as polyimide. The material of the protective layer 20 can be a photosensitive material or a non-photosensitive material. The thickness of the protective layer 20 is preferably 2 μm to 30 μm, particularly 2 to 6 μm.

  Next, the suspension 41 according to the present embodiment will be described with reference to FIGS. A suspension 41 shown in FIG. 3 is attached to the base plate 42, the base plate 42, the load beam 43 that holds the metal support layer 11 of the suspension substrate 1, the suspension substrate 1, the base plate 42, and the load beam 43 described above. And a piezo element 44 connected to the connection structure region 3 of the suspension substrate 1.

  Among these, as shown in FIG. 4, the base plate 42 includes a head side plate portion 42 a disposed on the head portion 2 a side of the suspension substrate 1, a tail side plate portion 42 b disposed on the tail portion 2 b side, A flexible portion 42c connecting the head side plate portion 42a and the tail side plate portion 42b. The base plate 42 has an accommodation opening 42 d for accommodating the piezo element 44. The accommodation opening 42d is formed by a head side plate portion 42a, a tail side plate portion 42b, and a flexible portion 42c. The base plate 42 is preferably made of stainless steel and can have a thickness of, for example, 145 μm.

  As shown in FIGS. 3 and 4, the load beam 43 includes a head side beam portion 43a disposed on the head portion 2a side of the suspension substrate 1 and a tail side beam portion 43b disposed on the tail portion 2b side. And a flexible portion 43c connecting the head side beam portion 43a and the tail side beam portion 43b. In addition, the load beam 43 has an exposed opening 43 d that exposes the surface of the piezo element 44 on the connection structure region 3 side. The exposed opening 43d is formed by a head side beam portion 43a, a tail side beam portion 43b, and a flexible portion 43c. The load beam 43 is preferably made of stainless steel, and the thickness thereof can be set to 25 μm, for example.

In the present embodiment, the piezo element 44 is joined to the base plate 42 and the load beam 43 thus formed. That is, as shown in FIG. 6, the piezo element 44 is accommodated in the accommodation opening 42 d of the base plate 42, joined to the base plate 42, and joined to the surface of the load beam 43 on the base plate 42 side.
As a result, the piezo element 44 can be disposed in the vicinity of the center of the base plate 42 and the load beam 43 in the thickness direction, and loss of the expansion / contraction force of the piezo element 44 is suppressed. It can be efficiently transmitted to the load beam 43. As shown in FIG. 6, the connection structure region 3 of the suspension substrate 1 is joined to the piezo element 44 through the exposed opening 43 d of the load beam 43.

  The load beam 43 is provided with a beam jig hole (not shown) corresponding to each jig hole 25 of the suspension substrate 1. When the load beam 43 is attached to the suspension substrate 1, the suspension beam 1 is suspended. The substrate 1 and the load beam 43 can be aligned. The jig hole of the load beam 43 is disposed on the longitudinal axis (X). The load beam 43 and the suspension substrate 1 are fixed by welding.

  The piezo element 44 is configured as a piezoelectric element that expands and contracts in the direction of the arrow P in FIGS. 3 and 7 when a voltage is applied, and moves the head slider 52 in the sway direction (the turning direction, the arrow in FIGS. 3 and 7). Q direction). As shown in FIG. 5, each piezo element 44 is interposed between a pair of electrodes 44a facing each other and a pair of electrodes 44a, and a piezoelectric material portion 44b made of piezoelectric ceramics such as PZT (lead zirconate titanate), for example. And have. The piezoelectric material portions 44b of the pair of piezo elements 44 are formed to have polarization directions different from each other by 180 °. When a predetermined voltage is applied, one piezo element 44 contracts and the other piezo element 44 44 extends. As shown in FIG. 3, such a piezo element 44 is disposed along the longitudinal axis (X) of the load beam 43, and its expansion / contraction direction is parallel to the longitudinal axis (X). Yes. The piezo elements 44 are arranged symmetrically with respect to the longitudinal axis (X) so that the expansion and contraction of each piezo element 44 is evenly transmitted to the head slider 52. The thickness of the piezo element 44 can be set to 125 μm, for example, and is accommodated in the accommodation opening 42d of the base plate 42 as shown in FIG.

  As shown in FIG. 6, each piezo element 44 is joined to the base plate 42 and the load beam 43 via a nonconductive adhesive portion 46 made of a nonconductive adhesive. As shown in FIGS. 4 and 6, one electrode 44a of the piezo element 44 (on the opposite side to the suspension substrate 1) is connected to the head of the base plate 42 through a first conductive adhesive portion 47 made of a conductive adhesive. The first conductive adhesive portion 47 may be electrically connected to the tail side plate portion 42b, or from one piezo element 44 to the base plate 42. It may be integrally formed so as to extend to the other piezo element 44 through the flexible portion 42c). Further, the other electrode 44a (the suspension substrate 1 side) of the piezo element 44 is bonded to the connection structure region 3 via a second conductive adhesive portion 48 made of a conductive adhesive, as shown in FIG. And electrically connected. That is, a conductive adhesive is injected into the metal support layer opening 32 in the connection structure region 3 to form the second conductive adhesion portion 48, and the piezo element 44 is connected to the connection structure region via the second conductive adhesion portion 48. 3, and the other electrode 44 a of the piezo element 44 is electrically connected to the wiring connection portion 16 of the wiring layer 12 through the second conductive adhesive portion 48 and the conductive connection portion 30.

  Next, referring to FIG. 7, the suspension with head 51 in the present embodiment will be described. A suspension 51 with a head shown in FIG. 7 has the above-described suspension 41 and a head slider 52 connected to the head terminal 5 of the suspension substrate 1.

  Next, the hard disk drive 61 in the present embodiment will be described with reference to FIG. A hard disk drive 61 shown in FIG. 8 is provided with a case 62, a disk 63 that is rotatably attached to the case 62, stores data, a spindle motor 64 that rotates the disk 63, and a desired flying height on the disk 63. And a suspension 51 with a head including a head slider 52 that writes and reads data to and from the disk 63. Among them, the suspension with head 51 is attached to the case 62 so as to be movable, and the voice coil motor 65 for moving the head slider 52 of the suspension with head 51 along the disk 63 is attached to the case 62. Yes. The suspension 51 with the head is attached to the voice coil motor 65 via the arm 66 and connected to an FPC board 71 (see FIG. 7) connected to a control unit (not shown) that controls the hard disk drive 61. ing. In this way, an electrical signal is transmitted between the control unit and the head slider 52 via the suspension board 1 and the FPC board 71.

  Next, the case where the suspension substrate 1 according to the present embodiment is manufactured by the subtractive method will be described. Here, as an example, a method of manufacturing the suspension substrate 1 by the subtractive method will be described with reference to FIG. 9 showing a cross section of the connection structure region 3. The suspension substrate 1 can also be manufactured by an additive method (see FIG. 16).

  First, the insulating layer 10, the metal support layer 11 provided on one surface of the insulating layer 10 (the surface on the side of the piezo element 44 to be connected), the wiring layer 12 provided on the other surface of the insulating layer 10, and Are prepared (see FIG. 9A). In this case, first, the metal support layer 11 is prepared, and the insulating layer 10 is formed on the metal support layer 11 by a coating method using non-photosensitive polyimide. Subsequently, nickel, chromium and copper are sequentially coated on the insulating layer 10 by a sputtering method to form a seed layer (not shown). Thereafter, the wiring layer 12 is formed by copper plating using the seed layer as a conductive medium. Thus, the 1st laminated body 28 which has the insulating layer 10, the metal support layer 11, and the wiring layer 12 is obtained.

  Subsequently, a plurality of wirings 13 and 14 and a wiring connection portion 16 are formed in the wiring layer 12 (see FIG. 9B). In this case, a patterned resist (not shown) is formed on the wiring layer 12 by a photofabrication technique, and the exposed portion of the wiring layer 12 is etched. In this way, a plurality of wirings 13 and 14 are obtained. At this time, the wiring connection portion 16 and the wiring layer opening 34 are formed in the connection structure region 3, and the head terminal 5 and the tail terminal 6 as shown in FIG. 1 are formed in the substrate body region 2. For example, a ferric chloride aqueous solution is preferably used as the etching solution. Thereafter, the resist is removed.

  Next, a protective layer 20 having a desired shape is formed on the insulating layer 10 to cover the wirings 13 and 14 and the wiring connection portion 16 of the wiring layer 12 (see FIG. 9C). In this case, non-photosensitive polyimide is coated on the insulating layer 10 using a die coater, and dried to form the protective layer 20. Subsequently, a patterned resist (not shown) is formed on the formed protective layer 20, and the exposed portion of the protective layer 20 is etched to cure the protective layer 20. In this way, the protective layer 20 is trimmed into a desired shape. At this time, a protective layer opening 35 is formed in the protective layer 20. The method for etching the protective layer 20 is not particularly limited, but it is preferable to perform wet etching. In particular, the etching solution is preferably selected as appropriate according to the type of material of the protective layer 20. For example, when the protective layer 20 is formed of a polyimide resin, an alkaline etching solution such as an organic alkaline etching solution is used. Can be used. Thereafter, the resist is removed.

  After the protective layer 20 is obtained, the insulating layer opening 33 is formed in the insulating layer 10, and the outer shape of the insulating layer 10 is processed into a desired shape (see FIG. 9D). In this case, first, a patterned resist (not shown) is formed, and the exposed portion of the insulating layer 10 is etched, so that the insulating layer 10 is processed into a desired shape. At this time, in the connection structure region 3, the insulating frame 18 and the insulating layer opening 33 are formed. Here, the method of etching the insulating layer 10 is not particularly limited as in the method of etching the protective layer 20, but wet etching is preferably performed. In particular, the etching solution is preferably selected as appropriate according to the type of material of the insulating layer 10. For example, when the insulating layer 10 is formed of a polyimide resin, an alkaline etching solution such as an organic alkaline etching solution is used. Can be used. After the etching is performed, the resist is removed.

  Subsequently, the conductive connection portion 30 is formed in the insulating layer opening 33, the wiring layer opening 34, and the protective layer opening 35 (see FIG. 9E). In this case, first, a patterned resist (not shown) is formed on the protective layer 20 by using a dry film so as to expose the openings 33, 34, and 35. Subsequently, nickel plating is applied to the openings 33, 34, and 35 by an electrolytic plating method. At this time, a standard nickel sulfamate plating bath is used as the plating bath, and electrolytic immersion plating (0.2 A, 14 minutes) is performed. Thereby, the conductive connection portion 30 is formed in the openings 33, 34, and 35. At this time, the lower surface 30 a of the conductive connection portion 30 is formed in a flat shape in contact with the upper surface of the metal support layer 11. In this way, the second laminated body 29 having the insulating layer 10, the metal support layer 11, the wiring layer 12, and the protective layer 20, and a conductive connection portion in the insulating layer opening 33 provided in the connection structure region 3. A second laminated body 29 provided with 30 is obtained.

  After the conductive connection portion 30 is formed, nickel plating and gold plating are applied to the head terminal 5 and the tail terminal 6 in this order by electrolytic plating.

  Thereafter, the metal support layer opening 32 is formed in the metal support layer 11, and the metal support layer 11 is processed into a desired shape (see FIG. 9F). In this case, first, a patterned resist (not shown) is formed on the lower surface of the metal support layer 11 using a dry film, and the exposed portion of the metal support layer 11 is etched to form a metal support layer. 11 is externally processed into a desired shape. At this time, the metal frame portion 17 and the metal support layer opening 32 are formed in the connection structure region 3. The metal frame portion 17 is separated from the portion of the metal support layer 11 in the substrate main body region 2. For example, a ferric chloride aqueous solution is preferably used as the etching solution. Thereafter, the resist is removed.

  When the metal support layer 11 is etched to form the metal support layer opening 32, the lower surface 30a of the conductive connection portion 30 is exposed. As a result, the lower surface 30a of the conductive connection portion 30 comes into contact with the etching solution. However, the etching of the metal support layer 11 can be prevented from being greatly etched by ending the etching quickly after a predetermined etching time, that is, after the metal support layer opening 32 is formed. . As a result, the lower surface 30a of the conductive connection portion 30 can be curved in a concave shape as shown in FIG.

  Thus, the suspension substrate 1 in the present embodiment is obtained.

  Next, a method for manufacturing the suspension 41 will be described.

  First, the suspension substrate 1 obtained as described above is attached to the base plate 42 via the load beam 43 by welding. In this case, first, the load beam 43 is fixed to the base plate 42 by welding, then, a beam jig hole (not shown) provided in the load beam 43 and a jig hole 25 provided in the suspension substrate 1. As a result, the alignment of the load beam 43 and the suspension substrate 1 is performed. Thereafter, the metal support layer 11 of the suspension substrate 1 is welded, and the load beam 43 and the suspension substrate 1 are joined and fixed to each other.

  Next, the piezo element 44 is bonded to the base plate 42 and the load beam 43 using an adhesive, and is connected to the connection structure region 3 of the suspension substrate 1. In this case, first, the piezo element 44 is bonded to the base plate 42 and the load beam 43 via the non-conductive adhesive portion 46. Next, a conductive adhesive is applied to form a first conductive adhesive portion 47, and an electrode 44 a on one side (opposite side of the suspension substrate 1) of the piezo element 44 is formed via the first conductive adhesive portion 47. The base plate 42 is electrically connected via a conductive adhesive.

  Further, the other electrode 44a (the suspension substrate 1 side) of the piezo element 44 is joined and electrically connected to the connection structure region 3 of the suspension substrate 1 through the second conductive adhesive portion 48. (See FIG. 6). A conductive adhesive is previously injected into the metal support layer opening 32 in the connection structure region 3, and when the piezoelectric element 44 is joined to the base plate 42 and the load beam 43, the connection structure region 3 and the piezoelectric element 44 are connected to each other. Connected.

  In this way, the suspension 41 according to the present embodiment is obtained.

  A head slider 52 is connected to the head terminal 5 of the obtained suspension 41 to obtain a suspension 51 with a head shown in FIG. Further, the suspension 51 with the head is attached to the case 62 of the hard disk drive 61 to obtain the hard disk drive 61 shown in FIG.

  When writing and reading data in the hard disk drive 61 shown in FIG. 8, the head slider 52 of the suspension with head 51 is moved along the disk 63 by the voice coil motor 65 and is rotated by the spindle motor 64. Keep close to the desired flying height. As a result, data is exchanged between the head slider 52 and the disk 63. During this time, an electrical signal is transmitted between the control unit (not shown) connected to the FPC board 71 and the head slider 52 via the suspension board 1 and the FPC board 71. Such an electric signal is transmitted between the head terminal 5 and the tail terminal 6 through the signal wirings 13 in the suspension board 1.

  When moving the head slider 52, the voice coil motor 65 roughly adjusts the position of the head slider 52, and the piezo element 44 finely adjusts the position of the head slider 52. That is, by applying a predetermined voltage to the electrode 44a of the piezo element 44 on the connection structure region 3 side of the suspension substrate 1 through the element wiring 14 and the wiring connection portion 16, the longitudinal axis (X) is applied. One piezo element 44 contracts and the other piezo element 44 expands in the same direction (the direction of arrow P in FIGS. 3 and 7). In this case, the flexible portion 42c of the base plate 42 and the flexible portion 43c of the load beam 43 are elastically deformed, and the head slider 52 located on the tip side of the load beam 43 moves in the sway direction (turning direction Q). it can. In this way, the head slider 52 can be quickly and accurately aligned with a desired track of the disk 63.

  As described above, according to the present embodiment, in the connection structure region 3, the conductive connection portion 30 connected to the wiring connection portion 16 of the wiring layer 12 is provided in the insulating layer opening 33 penetrating the insulating layer 10. A lower surface 30 a of the conductive connection portion 30 is exposed to the outside through a metal support layer opening 32 that penetrates the metal support layer 11. Thus, by injecting a conductive adhesive into the metal support layer opening 32, the conductive connection portion 30 can be electrically connected to the piezo element 44 via the conductive adhesive. In addition, since the conductive connection portion 30 is formed of nickel, the oxide film formed on the exposed lower surface 30a of the conductive connection portion 30 is formed by the OH group and hydrogen of the epoxy component of the conductive adhesive such as silver paste. Can be combined. For this reason, the adhesiveness of a conductive adhesive and the conductive connection part 30 can be improved. As a result, the connection reliability with the piezo element 44 can be improved.

  Further, according to the present embodiment, in the manufacturing process of the suspension substrate 1, the conductive connection is achieved by adding the step of performing nickel plating to the insulating layer opening 33, the wiring layer opening 34 and the protective layer opening 35. The portion 30 can be formed. For this reason, the conductive connection part 30 can be formed while suppressing the manufacturing process of the suspension substrate 1 from becoming complicated. In particular, when a ground via (not shown) for grounding the head terminal 5 for grounding is provided in the head region 2a, a through hole is formed in the ground wiring (not shown) of the insulating layer 10 and the wiring layer 12. The ground via is formed by applying nickel plating to the through hole. In this case, the conductive connection portion 30 can be formed during the step of forming the ground via, and an additional step for forming the conductive connection portion 30 can be prevented. In addition, wiring is formed by forming a through hole in the insulating layer between the first wiring layer and the second wiring layer of the laminated wiring structure (stacked wiring structure) and the second wiring layer and plating the through hole with nickel. Similarly, when forming a via (not shown), the conductive connection portion 30 can be formed in the process of forming the wiring via.

Further, according to the present embodiment, the lower surface 30a of the conductive connection portion 30 is curved in a concave shape.
As a result, the contact area with the conductive adhesive can be increased. For this reason, the adhesiveness between the conductive adhesive and the conductive connection portion 30 can be further improved, and the connection reliability with the piezo element 44 can be further improved.

  Further, according to the present embodiment, the upper surface 30b of the conductive connection portion 30 is exposed to the outside. Thus, the continuity test between the conductive connecting portion 30 and the piezo element 44 can be performed using a continuity tester 80 such as a probe (see FIG. 6). For this reason, the connection reliability with the piezo element 44 can be improved. Further, since the conductive connection portion 30 is formed of nickel, the conductive connection portion 30 is deformed even when the conductive connection portion 30 is pressed to join the connection structure region 3 to the piezoelectric element 44. Can be prevented.

(Modification 1)
In the above-described embodiment, an example in which the upper end portion 32b of the outer edge 32a of the metal support layer opening 32 is located outward from the lower end portion 33b of the outer edge 33a of the insulating layer opening 33 has been described. . However, the present invention is not limited to this, and as shown in FIGS. 10A and 10B, the upper end portion 32 b of the outer edge 32 a of the metal support layer opening portion 32 is the lower end of the outer edge 33 a of the insulating layer opening portion 33. The diameter at the upper end portion of the metal support layer opening 32 may be smaller than the diameter at the lower end portion of the insulating layer opening 33, located inward (radially inward) from the portion 33b. In this case, a part of the lower surface 30 a of the conductive connection part 30 is in contact with the surface (upper surface 17 b) of the metal frame part 17 on the insulating frame part 18 side, and the conductive connection part 30 is in contact with the metal frame part 17. Electrically connected.

  10 (a) and 10 (b), the conductive connection part 30 is not only electrically connected to the conductive adhesive without the metal frame part 17, but also the metal frame part 17 It can also be electrically connected to the conductive adhesive via As a result, the area of electrical connection with the conductive adhesive can be increased as the connection structure region 3. For this reason, the electrical continuity between the conductive adhesive and the conductive connection portion 30 can be improved, and the connection reliability with the piezo element 44 can be improved.

  The first gold formed by applying gold plating to the surface of the metal frame 17 opposite to the insulating frame 18, that is, the surface (lower surface 17 a) of the piezo element 44. A plating layer (gold plating layer) 36 is preferably provided. As a result, the contact resistance between the conductive adhesive and the metal frame portion 17 can be reduced. In addition, although the 1st gold plating layer 36 has shown the example formed in ring shape by planar view in FIG. 10A, it is not restricted to this but can be made into arbitrary shapes. Further, the first gold plating layer 36 may be formed on the metal frame portion 17 via a nickel plating layer (not shown).

  In FIG. 10A, the second gold plating layer 37 (see FIG. 10B) is not formed between the conductive connection portion 30 and the wiring connection portion 16. Here, FIG. 10A shows a cross-sectional structure of the connection structure region 3 when the element wiring 14 of the wiring layer 12 is an independent wiring. That is, in the case of independent wiring, the metal support layer 11 and the element wiring 14 are not electrically connected before the conductive connection portion 30 is formed. Thus, the metal support layer 11 can function as a power supply electrode for gold plating, but the wiring connection portion 16 cannot function as a power supply electrode for gold plating. For this reason, in the case of independent wiring, first, the conductive connection portion 30 is formed to electrically connect the metal support layer 11 and the wiring connection portion 16 (element wiring 14), and then the head terminal 5 and Gold plating is applied to the tail terminal 6. Therefore, in FIG. 10A showing the case of independent wiring, the second gold plating layer 37 is not formed between the conductive connection portion 30 and the wiring connection portion 16.

  On the other hand, in the form shown in FIG. 10B, the second gold plating layer 37 is formed between the conductive connection portion 30 and the wiring connection portion 16. Here, FIG. 10B shows a cross section of the connection structure region 3 when the element wiring 14 of the wiring layer 12 is a non-independent wiring. That is, in the case of non-independent wiring, even before the conductive connection portion 30 is formed, the metal support layer 11 and the element wiring 14 are electrically connected, and not only the metal support layer 11 but also the wiring connection portion. 16 can also function as a power supply electrode for gold plating. Thereby, before the conductive connection portion 30 is formed, the wiring connection portion 16 can be plated with gold. For this reason, in FIG. 10B, the second gold plating layer 37 is formed between the conductive connection portion 30 and the wiring connection portion 16. The second gold plating layer 37 may be formed on the wiring connection portion 16 via a nickel plating layer (not shown).

(Second Embodiment)
Next, a suspension substrate in the second embodiment of the present invention will be described with reference to FIGS.

  The second embodiment shown in FIGS. 11 and 12 is mainly different in that a gold-plated portion is provided in a portion on the metal support layer side of the conductive connection portion, and other configurations are the same as those in FIGS. 9 is substantially the same as the first embodiment shown in FIG. 11 and 12, the same parts as those of the first embodiment shown in FIGS. 1 to 9 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 11, the conductive connection portion 30 includes a third gold plating layer (gold plating portion) 38 provided on a portion of the conductive connection portion 30 on the metal frame portion 17 side. Specifically, the conductive connection portion 30 includes a connection main body portion 31 and a third gold plating layer provided on the surface of the connection main body portion 31 on the metal frame portion 17 side, that is, on the surface on the piezoelectric element 44 side. 38. Among these, the connection main body portion 31 is formed by nickel plating as in the first embodiment. The surface of the third gold plating layer 38 on the metal frame portion 17 side, that is, the surface of the piezoelectric element 44 (the lower surface 38a) is outward (the piezoelectric element 44 side) through the metal support layer opening 32. Exposed to the conductive adhesive injected into the metal support layer opening 32. In this way, the third gold plating layer 38 is electrically connected to the piezo element 44 via the conductive adhesive. The lower surface 38a of the third gold plating layer 38 is located on the same plane as the surface of the insulating frame 18 on the side of the metal frame 17, that is, the surface of the piezo element 44 (lower surface 18 a). ing. Here, the term “same” is not limited to the meaning of exactly the same, but is used as a meaning including a manufacturing error that can be regarded as the same.

  In the form shown in FIG. 11, as in the form shown in FIG. 2, the upper end portion 32 b of the outer edge 32 a of the metal support layer opening portion 32 is outward from the lower end portion 33 b of the outer edge 33 a of the insulating layer opening portion 33. positioned.

  Next, the case where the suspension substrate 1 according to the present embodiment is manufactured by the subtractive method will be described. Here, as an example, a method for manufacturing the suspension substrate 1 according to the present embodiment by the subtractive method will be described with reference to FIG. 12 showing a cross section of the connection structure region 3. In addition, the same content as the manufacturing method of the suspension substrate 1 in the first embodiment is omitted.

  First, a laminated body 28 having an insulating layer 10, a metal support layer 11 provided on one surface of the insulating layer 10, and a wiring layer 12 provided on the other surface of the insulating layer 10 is prepared (FIG. 12 (a)). For the metal support layer 11 here, it is preferable to use a stainless material formed of a rolled material. In this case, uneven rolling bars 11c are formed on both surfaces (the lower surface 11a and the upper surface 11b) of the metal support layer 11 (see FIG. 13). The uneven depth of the rolling rebar 11c is generally 0.05 μm to 0.2 μm.

  Next, a plurality of wirings 13 and 14 and a wiring connection portion 16 are formed in the wiring layer 12 (see FIG. 12B). Subsequently, a protective layer 20 having a desired shape is formed on the insulating layer 10 to cover the wirings 13 and 14 and the wiring connection portion 16 of the wiring layer 12 (see FIG. 12C). After the protective layer 20 is obtained, the insulating layer opening 33 is formed in the insulating layer 10, and the outer shape of the insulating layer 10 is processed into a desired shape (see FIG. 12D).

  Next, nickel plating is applied to the head terminal 5 and the tail terminal 6 by electrolytic plating. At this time, the nickel plating is not performed on the portion of the upper surface 11 b of the metal support layer 11 exposed by the insulating layer opening 33.

  Thereafter, a third gold plating layer 38 is formed on a portion of the upper surface 11b of the metal support layer 11 exposed by the insulating layer opening 33 (see FIG. 12E). In this case, gold plating is performed by electrolytic plating. As shown in FIG. 13, the rolling streaks 11c formed on the upper surface 11b (surface on the insulating layer 10 side) of the metal support layer 11 are transferred to the lower surface 38a of the formed third gold plating layer 38, An uneven shape 38b having a shape corresponding to the rolling bar 11c is formed. Here, FIG. 13 shows an example of a cross-sectional shape of the rolling rebar 11c and the uneven shape 38b. In FIG. 13, the concavo-convex shape 38b is constituted by a convex portion 38c corresponding to the concave portion 11d of the rolling bar 11c and a concave portion 38d corresponding to the convex portion 11e of the rolling bar 11c. In the case of the above-described non-independent wiring, the gold plating is also applied to the head terminal 5 and the tail terminal 6 when the third gold plating layer 38 is formed. On the other hand, in the case of independent wiring, after the conductive connection portion 30 is formed as shown in FIG. 12 (f) described later, the head terminal 5 and the tail terminal 6 are plated with gold.

  After the third gold plating layer 38 is formed, the connection main body portion 31 is formed in the insulating layer opening 33, the wiring layer opening 34, and the protective layer opening 35. Thereby, the electroconductive connection part 30 which has the connection main-body part 31 and the 3rd gold plating layer 38 is obtained (refer FIG.12 (f)). In this way, in the second laminated body 29 having the insulating layer 10, the metal support layer 11, the wiring layer 12, and the protective layer 20, a piezoelectric element is formed in the insulating layer opening 33 provided in the connection structure region 3. Thus, the second laminated body 29 in which the conductive connection portion 30 having the third gold plating layer 38 provided in the portion on the side of 44 is formed.

  Thereafter, the metal support layer opening 32 is formed in the metal support layer 11, and the metal support layer 11 is processed into a desired shape (see FIG. 12G). When the metal support layer 11 is etched to form the metal support layer opening 32, the lower surface 38a of the third gold plating layer 38 is exposed. However, gold, which is the material of the third gold plating layer 38, has difficulty in etching. That is, the third gold plating layer 38 functions as an etching barrier layer. As a result, the lower surface 38a of the third gold plating layer 38 is maintained on the same plane as the lower surface 18a of the insulating frame 18. Further, an uneven shape 38b (see FIG. 13) having a shape corresponding to the rolling bar 11c of the metal support layer 11 is maintained on the lower surface 38a of the third gold plating layer 38.

  Thus, the suspension substrate 1 in the present embodiment is obtained.

As described above, according to the present embodiment, in the connection structure region 3, the conductive connection portion 30 connected to the wiring connection portion 16 of the wiring layer 12 is provided in the insulating layer opening 33 penetrating the insulating layer 10. A third gold plating layer 38 is provided on the portion of the conductive connection portion 30 on the piezoelectric element 44 side. The lower surface 38a of the third gold plating layer 38 is exposed to the outside through the metal support layer opening 32 and is located on the same plane as the lower surface 18a of the insulating frame 18.
Thus, by injecting a conductive adhesive into the metal support layer opening 32, the conductive connection portion 30 can be electrically connected to the piezo element 44 via the conductive adhesive. In this case, since the connection main body portion 31 of the conductive connection portion 30 is electrically connected to the conductive adhesive via the third gold plating layer 38, the contact resistance between the conductive adhesive and the conductive connection portion 30 is reduced. Can be reduced. Further, as described above, the concave and convex shape 38 b having a shape corresponding to the rolling bar 11 c of the metal support layer 11 is formed on the lower surface 38 a of the third gold plating layer 38. For this reason, a contact area with a conductive adhesive can be increased, and the adhesiveness of a conductive adhesive and the conductive connection part 30 can be improved. As a result, the connection reliability with the piezo element 44 can be improved.

  Further, according to the present embodiment, in the manufacturing process of the suspension substrate 1, the conductive connection is achieved by adding the step of performing nickel plating to the insulating layer opening 33, the wiring layer opening 34 and the protective layer opening 35. The connection main body portion 31 of the portion 30 can be formed. For this reason, the connection main-body part 31 of the conductive connection part 30 can be formed, suppressing that the manufacturing process of the suspension board | substrate 1 becomes complicated. In particular, in the case of non-independent wiring, the third gold plating layer 38 formed on the surface of the connection main body portion 31 on the piezoelectric element 44 side is formed when the head terminal 5 and the tail terminal 6 are plated with gold. This can further suppress the complication of the manufacturing process. When a ground via (not shown) for grounding the head terminal 5 for grounding is provided in the head region 2a, a through hole is formed in the ground wiring (not shown) of the insulating layer 10 and the wiring layer 12. The ground via is formed by applying nickel plating to the through hole. In this case, it is possible to form the connection main body portion 31 of the conductive connection portion 30 during the step of forming the ground via, and it is possible to prevent a process from being added to form the connection main body portion 31. . In addition, wiring is formed by forming a through hole in the insulating layer between the first wiring layer and the second wiring layer of the laminated wiring structure (stacked wiring structure) and the second wiring layer and plating the through hole with nickel. In the case where vias (not shown) are formed, the connection main body portion 31 can be formed in the same manner in the process of forming wiring vias.

(Modification 2)
In the above-described embodiment, an example in which the upper end portion 32b of the outer edge 32a of the metal support layer opening 32 is located outward from the lower end portion 33b of the outer edge 33a of the insulating layer opening 33 has been described. . However, the present invention is not limited to this, and as shown in FIG. 14, the upper end portion 32 b of the outer edge 32 a of the metal support layer opening 32 is more inward (radius) than the lower end portion 33 b of the outer edge 33 a of the insulating layer opening 33. The diameter at the upper end of the metal support layer opening 32 may be smaller than the diameter at the lower end of the insulating layer opening 33. In this case, a part of the lower surface 38 a of the third gold plating layer 38 is in contact with the upper surface 17 b of the metal frame portion 17 of the metal support layer 11, and the third gold plating layer 38 is electrically connected to the metal frame portion 17. Connected to.

  According to the embodiment shown in FIG. 14, the conductive connection part 30 is not only electrically connected to the conductive adhesive without the metal frame part 17, but also the conductive adhesive via the metal frame part 17. Can also be electrically connected. As a result, the area of electrical connection with the conductive adhesive can be increased as the connection structure region 3. For this reason, the electrical continuity between the conductive adhesive and the conductive connection portion 30 can be improved, and the connection reliability with the piezo element 44 can be improved. In this case, the third gold plating layer 38 is interposed between the connection main body portion 31 of the conductive connection portion 30 and the metal frame portion 17. Thereby, the contact resistance between the conductive connection portion 30 and the metal frame portion 17 can be reduced, and the connection reliability with the piezo element 44 can be further improved.

  In addition, it is preferable that the 1st gold plating layer 36 formed by performing gold plating is provided in the lower surface 17a of the metal frame part 17 similarly to the form shown in FIG. As a result, the contact resistance between the conductive adhesive and the metal frame portion 17 can be reduced. Such a first gold plating layer 36 can be formed when the third gold plating layer 38 is formed or when the head terminal 5 and the tail terminal 6 are plated with gold. The first gold plating layer 36 may be formed on the metal frame 17 through a nickel plating layer (not shown). Since the nickel plating layer as a base is not formed on the third gold plating layer 38, when forming the nickel plating layer, the metal frame portion is used when nickel plating and gold plating are applied to the head terminal 5 and the tail terminal 6. 17 is preferably subjected to nickel plating and gold plating to form the first gold plating layer 36.

Further, in the form shown in FIG. 14, the second gold plating layer 37 (see FIG. 10B) is formed between the conductive connection part 30 and the wiring connection part 16 as in the form shown in FIG. In addition, the cross-sectional structure of the connection structure region 3 when the element wiring 14 of the wiring layer 12 is an independent wiring is shown.
However, the present invention is not limited to such a configuration, and the second metal is formed between the connection body portion 31 of the conductive connection portion 30 and the wiring connection portion 16 so that the element wiring 14 is formed as a non-independent wiring. A plating layer 37 may be formed.

(Modification 3)
Moreover, in this Embodiment mentioned above, the example in which the connection main-body part 31 of the electroconductive connection part 30 was formed with nickel was demonstrated. However, the present invention is not limited to this, and as shown in FIG. 15A, the connection main body portion 31 of the conductive connection portion 30 is integrally formed of the same material as the wiring connection portion 16 of the wiring layer 12. May be. More specifically, a connection main body portion 31 formed of the same material as the wiring connection portion 16 is provided in the insulating layer opening 33, and the connection main body portion 31 is formed integrally with the wiring connection portion 16. . In other words, a part of the wiring connection portion 16 is embedded in the insulating layer opening 33, and the portion embedded in the insulating layer opening 33 constitutes the connection main body portion 31. In this case, the wiring layer opening 34 is not formed in the wiring connection portion 16. 15A, the upper end 32b of the outer edge 32a of the metal support layer opening 32 is located outward (radially outward) from the lower end 33b of the outer edge 33a of the insulating layer opening 33. ing.

  The suspension substrate 1 having the form shown in FIG. 15A is preferably manufactured by an additive method. Here, as an example, a method for manufacturing the suspension substrate 1 having the form shown in FIG. 15A by the additive method will be described with reference to FIG. 16 showing a cross section of the connection structure region 3.

  First, the metal support layer 11 is prepared (see FIG. 16A). In this case, it is preferable to use a stainless steel material formed of a rolled material for the metal support layer 11, and in this case, uneven rolling bars 11 c (see FIG. 13) on both surfaces 11 a and 11 b of the metal support layer 11. Is formed.

  Subsequently, the insulating layer 10 having a desired shape is formed on the metal support layer 11 (see FIG. 16B). At this time, the insulating frame 18 including the insulating layer opening 33 is formed on the metal support layer 11 in the connection structure region 3.

  Next, a third gold plating layer 38 is formed on a portion of the upper surface 11b of the metal support layer 11 exposed by the insulating layer opening 33 (see FIG. 16C). At this time, as shown in FIG. 13, the rolling rebar 11c formed on the upper surface 11b of the metal support layer 11 is transferred to the lower surface 38a of the formed third gold plating layer 38, and corresponds to the rolling rebar 11c. An uneven shape 38b having a shape to be formed is formed.

  Subsequently, the wiring layer 12 is formed on the insulating layer 10 (see FIG. 16D). At this time, the wiring connection portion 16 is formed on the insulating frame body portion 18, and a part of the wiring connection portion 16 is embedded in the insulating layer opening 33. In this way, the connection main body portion 31 integral with the wiring connection portion 16 is formed in the insulating layer opening 33.

  After the wiring layer 12 is formed, the protective layer 20 is formed (see FIG. 16E). In this way, in the second laminated body 29 having the insulating layer 10, the metal support layer 11, the wiring layer 12, and the protective layer 20, a piezoelectric element is formed in the insulating layer opening 33 provided in the connection structure region 3. Thus, the second laminated body 29 in which the conductive connection portion 30 having the third gold plating layer 38 provided in the portion on the side of 44 is formed.

  Thereafter, the metal support layer opening 32 is formed, and the metal support layer 11 is trimmed into a desired shape (see FIG. 16F). At this time, the lower surface 38a of the third gold plating layer 38 is maintained on the same plane as the lower surface 18a of the insulating frame 18 and the lower surface 38a of the third gold plating layer 38 has a rolling bar 11c of the metal support layer 11. The concavo-convex shape 38b (see FIG. 13) having a shape corresponding to is maintained. In this way, the suspension substrate 1 having the form shown in FIG. 15A is obtained.

  According to the embodiment shown in FIG. 15A, the connection main body portion 31 of the conductive connection portion 30 is formed integrally with the wiring connection portion 16. As a result, when the suspension substrate 1 is manufactured by the additive method, the connection main body portion 31 can be formed integrally with the wiring connection portion 16 in the step of forming the wiring connection portion 16. For this reason, it can prevent that a process is added in order to form the connection main-body part 31, and can form the conductive connection part 30, suppressing the manufacturing process of the board | substrate 1 for suspensions becoming complicated.

(Modification 4)
15A, an example in which the upper end portion 32b of the outer edge 32a of the metal support layer opening portion 32 is located outward from the lower end portion 33b of the outer edge 33a of the insulating layer opening portion 33 will be described. did. However, the present invention is not limited to this. As shown in FIG. 15B, the upper end portion 32b of the outer edge 32a of the metal support layer opening portion 32 is located inside the lower end portion 33b of the outer edge 33a of the insulating layer opening portion 33. The diameter at the upper end of the metal support layer opening 32 may be made smaller than the diameter at the lower end of the insulating layer opening 33. In this case, a part of the lower surface 38 a of the third gold plating layer 38 is in contact with the upper surface 17 b of the metal frame portion 17 of the metal support layer 11, and the third gold plating layer 38 is electrically connected to the metal frame portion 17. Connected to. In the form shown in FIG. 15B, it is preferable that the first gold plating layer 36 similar to the form shown in FIGS. 10 and 14 is provided on the lower surface 17a of the metal frame portion 17.

(Modification 5)
Moreover, as shown to Fig.17 (a), the whole conductive connection part 30 may be formed of gold plating. Such a conductive connection portion 30 omits, for example, the step of forming the third gold plating layer 38 shown in FIG. 12E (that is, the head terminal 5 and the tail terminal 6 are plated with gold, but the third In the step of forming the conductive connection portion 30 shown in FIG. 12F, gold plating is applied to the insulating layer opening portion 33, the wiring layer opening portion 34, and the protective layer opening portion 35. Can be formed. In the form shown in FIG. 17A, the upper end portion 32b of the outer edge 32a of the metal support layer opening 32 is located outward (radially outward) from the lower end portion 33b of the outer edge 33a of the insulating layer opening 33. ing.

  In the form shown in FIG. 17A, since the conductive connection portion 30 is formed by gold plating, the conduction resistance of the conductive connection portion 30 can be reduced. Thereby, the connection reliability with the piezo element 44 can be further improved.

  The conductive connection portion 30 includes a connection main body portion 31 formed by gold plating and a third gold plating layer 38, and the connection main body portion 31 and the third gold plating layer 38 are formed in separate steps. You may make it. For example, in the step of forming the third gold plating layer 38 as shown in FIG. 12E and then forming the conductive connection portion 30 shown in FIG. The insulating layer opening 33, the wiring layer opening 34, and the protective layer opening 35 can be formed by performing gold plating.

(Modification 6)
In the form shown in FIG. 17A, an example in which the upper end portion 32b of the outer edge 32a of the metal support layer opening 32 is located outward from the lower end portion 33b of the outer edge 33a of the insulating layer opening 33 is described. did. However, the present invention is not limited to this, and as shown in FIG. 17B, the upper end portion 32b of the outer edge 32a of the metal support layer opening 32 is located inside the lower end portion 33b of the outer edge 33a of the insulating layer opening 33. The diameter at the upper end of the metal support layer opening 32 may be made smaller than the diameter at the lower end of the insulating layer opening 33. In this case, a part of the lower surface 30 a of the conductive connection part 30 is in contact with the upper surface 17 b of the metal frame part 17 of the metal support layer 11, and the conductive connection part 30 is electrically connected to the metal frame part 17. . In the form shown in FIG. 17 (b), the first gold plating layer 36 similar to the form shown in FIGS. 10, 14, and 15 (b) is provided on the lower surface 17a of the metal frame portion 17. It is preferable.

  As described above, the embodiments of the present invention have been described in detail. However, the suspension substrate, the suspension, the suspension with a head, and the hard disk drive according to the present invention are not limited to the above-described embodiments, and the gist of the present invention. Various modifications can be made without departing from the scope.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 3 Connection structure area | region 10 Insulating layer 11 Metal support layer 11a Lower surface 11b Upper surface 11c Rolling bar 12 Wiring layer 16 Wiring connection part 17 Metal frame part 17a Lower surface 17b Upper surface 18 Insulating frame part 18a Lower surface 20 Protective layer 28 1 laminated body 29 2nd laminated body 30 conductive connection part 30a lower surface 30b upper surface 31 connection main body part 32 metal support layer opening part 32a outer edge 32b upper end part 33 insulating layer opening part 33a outer edge 33b lower end part 34 wiring layer opening part 35 protective layer opening Portion 36 First gold plating layer 37 Second gold plating layer 38 Third gold plating layer 38a Lower surface 38b Uneven shape 41 Suspension 42 Base plate 43 Load beam 44 Piezo element 51 Suspension with head 52 Head slider 61 Hard disk drive

Claims (18)

A connection structure region in which a wiring layer is laminated on a metal support layer via an insulating layer and can be connected to an actuator element disposed on the opposite side of the metal support layer from the insulating layer side via a conductive adhesive In a suspension substrate having
An insulating layer opening provided in the connection structure region and penetrating the insulating layer;
A conductive connecting portion provided in the insulating layer opening, formed of nickel and connected to the wiring layer;
A suspension provided in the connection structure region, the metal support layer opening that penetrates the metal support layer and exposes the surface of the conductive connection portion on the metal support layer side to the outside. Substrate.   The suspension substrate according to claim 1, wherein a surface of the conductive connection portion on the metal support layer side is curved in a concave shape. The insulating layer side end of the outer edge of the metal support layer opening is located inward from the metal support layer side end of the outer edge of the insulating layer opening,
The suspension substrate according to claim 1, wherein the conductive connection portion is electrically connected to the metal support layer in the connection structure region.   4. The suspension substrate according to claim 3, wherein a gold plating layer is provided on a surface opposite to the insulating layer side of the metal support layer in the connection structure region. In the connection structure region, a wiring layer opening penetrating the wiring layer is provided,
The conductive connection portion extends into the wiring layer opening,
The suspension substrate according to any one of claims 1 to 4, wherein a surface of the conductive connection portion opposite to the metal support layer side is exposed to the outside. A connection structure region in which a wiring layer is laminated on a metal support layer via an insulating layer and can be connected to an actuator element disposed on the opposite side of the metal support layer from the insulating layer side via a conductive adhesive In a suspension substrate having
An insulating layer opening provided in the connection structure region and penetrating the insulating layer;
A conductive connection provided in the insulating layer opening and connected to the wiring layer;
A metal support layer opening provided in the connection structure region and penetrating the metal support layer,
The conductive connection portion has a gold-plated portion provided on the metal support layer side portion of the conductive connection portion,
The surface on the metal support layer side of the gold plating portion is exposed to the outside through the metal support layer opening, and is located on the same plane as the surface on the metal support layer side of the insulating layer. Suspension substrate characterized by the above. The insulating layer side end of the outer edge of the metal support layer opening is located inward from the metal support layer side end of the outer edge of the insulating layer opening,
The suspension substrate according to claim 6, wherein the gold plating portion is electrically connected to the metal support layer in the connection structure region.   The suspension substrate according to claim 7, wherein a gold plating layer is provided on a surface of the metal support layer opposite to the insulating layer side in the connection structure region. In the connection structure region, a wiring layer opening penetrating the wiring layer is provided,
The conductive connection portion extends into the wiring layer opening,
9. The suspension substrate according to claim 6, wherein a surface of the conductive connection portion opposite to the metal support layer side is exposed to the outside. The conductive connection part has a connection main body part provided on the side opposite to the metal support layer side of the gold plating part,
The suspension substrate according to claim 6, wherein the connection main body portion is made of nickel. The conductive connection part has a connection main body part provided on the side opposite to the metal support layer side of the gold plating part,
9. The suspension substrate according to claim 6, wherein the connection main body portion is integrally formed of the same material as the wiring layer.   The suspension substrate according to claim 6, wherein the entire conductive connection portion is formed by gold plating. Rolling lines are formed on the surface of the metal support layer on the insulating layer side,
The suspension substrate according to any one of claims 6 to 12, wherein a concavo-convex shape having a shape corresponding to the rolling bar is formed on a surface of the gold-plated portion on the metal support layer side. A base plate;
The suspension substrate according to any one of claims 1 to 13, which is attached to the base plate via a load beam;
The suspension comprising: the actuator element joined to at least one of the base plate and the load beam, and connected to the connection structure region of the suspension substrate via the conductive adhesive. . The suspension of claim 14;
A suspension with a head, comprising: a head slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 15. A connection structure region in which a wiring layer is laminated on a metal support layer via an insulating layer and can be connected to an actuator element disposed on the opposite side of the metal support layer from the insulating layer side via a conductive adhesive In the manufacturing method of the suspension substrate having
A laminated body including the insulating layer, the metal support layer, and the wiring layer, wherein an insulating layer opening that penetrates the insulating layer is provided in the connection structure region, and the insulating layer opening is made of nickel. A step of preparing the laminated body provided with a conductive connection portion formed and connected to the wiring layer;
After the step of preparing the laminate, in the connection structure region, the metal support layer opening that penetrates the metal support layer and exposes the metal support layer side surface of the conductive connection portion. And a step of forming a layer opening by etching. A connection structure region in which a wiring layer is laminated on a metal support layer via an insulating layer and can be connected to an actuator element disposed on the opposite side of the metal support layer from the insulating layer side via a conductive adhesive In the manufacturing method of the suspension substrate having
A laminated body having the insulating layer, the metal support layer, and the wiring layer, wherein an insulating layer opening that penetrates the insulating layer is provided in the connection structure region, and the metal is formed in the insulating layer opening. A step of preparing the laminated body having a gold-plated portion provided in a portion on the support layer side and formed with a conductive connection portion connected to the wiring layer;
After the step of preparing the laminate, in the connection structure region, the metal support layer opening that penetrates the metal support layer and exposes the metal support layer side surface of the gold plating portion. Forming a layer opening by etching, and
In the step of preparing the laminated body, the gold-plated portion of the conductive connection portion is formed in a portion exposed by the insulating layer opening portion of the surface on the insulating layer side of the metal support layer. A method for manufacturing a suspension substrate.

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