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JP2017050573A5 - Work dividing apparatus and work dividing method - Google Patents

Work dividing apparatus and work dividing method Download PDF

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Publication number
JP2017050573A5
JP2017050573A5 JP2016242455A JP2016242455A JP2017050573A5 JP 2017050573 A5 JP2017050573 A5 JP 2017050573A5 JP 2016242455 A JP2016242455 A JP 2016242455A JP 2016242455 A JP2016242455 A JP 2016242455A JP 2017050573 A5 JP2017050573 A5 JP 2017050573A5
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JP
Japan
Prior art keywords
dicing tape
heating
workpiece
expanding
work dividing
Prior art date
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Granted
Application number
JP2016242455A
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Japanese (ja)
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JP2017050573A (en
JP6414995B2 (en
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Publication date
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Priority to JP2016242455A priority Critical patent/JP6414995B2/en
Priority claimed from JP2016242455A external-priority patent/JP6414995B2/en
Publication of JP2017050573A publication Critical patent/JP2017050573A/en
Publication of JP2017050573A5 publication Critical patent/JP2017050573A5/en
Application granted granted Critical
Publication of JP6414995B2 publication Critical patent/JP6414995B2/en
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Claims (4)

リング状フレーム内のダイシングテープ上にマウントされたワークを個々のチップに分割するワーク分割装置において、
前記ダイシングテープをエキスパンドするエキスパンド手段と、
前記エキスパンドにより発生した前記ダイシングテープの外周部の弛み部分を局所的に加熱する加熱手段と、
前記加熱手段を前記ダイシングテープの外周部に沿って回転させる回転手段と、
を備える、ワーク分割装置。
In a workpiece dividing device that divides a workpiece mounted on a dicing tape in a ring-shaped frame into individual chips,
Expanding means for expanding the dicing tape;
Heating means for locally heating the slack portion of the outer peripheral portion of the dicing tape generated by the expand;
Rotating means for rotating the heating means along the outer periphery of the dicing tape;
A workpiece dividing device.
前記加熱手段は輻射熱又は対流熱を用いて加熱を行う、
請求項1に記載のワーク分割装置。
The heating means performs heating using radiant heat or convection heat.
The work dividing apparatus according to claim 1.
前記加熱手段は前記ワークの中心を対称にした位置に複数設けられる、
請求項1又は2に記載のワーク分割装置。
A plurality of the heating means are provided at positions where the center of the workpiece is symmetric.
The work dividing apparatus according to claim 1 or 2.
リング状フレーム内のダイシングテープ上にマウントされたワークを個々のチップに分割するワーク分割装置において、In a workpiece dividing device that divides a workpiece mounted on a dicing tape in a ring-shaped frame into individual chips,
前記ダイシングテープをエキスパンドするエキスパンドステップと、  An expanding step for expanding the dicing tape;
前記エキスパンドにより発生した前記ダイシングテープの外周部の弛み部分を局所的に加熱する加熱ステップと、  A heating step for locally heating a slack portion of an outer peripheral portion of the dicing tape generated by the expanding;
前記加熱する位置を前記ダイシングテープの外周部に沿って回転させる回転ステップと、  A rotation step of rotating the heating position along the outer periphery of the dicing tape;
を備える、ワーク分割方法。  A work dividing method comprising:
JP2016242455A 2016-12-14 2016-12-14 Work dividing apparatus and work dividing method Active JP6414995B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016242455A JP6414995B2 (en) 2016-12-14 2016-12-14 Work dividing apparatus and work dividing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016242455A JP6414995B2 (en) 2016-12-14 2016-12-14 Work dividing apparatus and work dividing method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2016097858A Division JP6060475B2 (en) 2016-05-16 2016-05-16 Work dividing apparatus and work dividing method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018130134A Division JP2018170525A (en) 2018-07-09 2018-07-09 Workpiece division device and workpiece division method

Publications (3)

Publication Number Publication Date
JP2017050573A JP2017050573A (en) 2017-03-09
JP2017050573A5 true JP2017050573A5 (en) 2017-06-29
JP6414995B2 JP6414995B2 (en) 2018-10-31

Family

ID=58280323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016242455A Active JP6414995B2 (en) 2016-12-14 2016-12-14 Work dividing apparatus and work dividing method

Country Status (1)

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JP (1) JP6414995B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102472950B1 (en) * 2017-07-14 2022-12-05 에스케이하이닉스 주식회사 Cooling/heating combination device, adhesive film cutting assembly and adhesive film cutting equipment having the same
JP7045635B2 (en) * 2017-08-30 2022-04-01 パナソニックIpマネジメント株式会社 Plasma processing equipment and method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5207455B2 (en) * 2008-05-09 2013-06-12 株式会社ディスコ Film adhesive breaking apparatus and breaking method
JP5243101B2 (en) * 2008-05-14 2013-07-24 株式会社ディスコ Breaking device
JP5013148B1 (en) * 2011-02-16 2012-08-29 株式会社東京精密 Work dividing apparatus and work dividing method

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