JP2017050573A5 - Work dividing apparatus and work dividing method - Google Patents
Work dividing apparatus and work dividing method Download PDFInfo
- Publication number
- JP2017050573A5 JP2017050573A5 JP2016242455A JP2016242455A JP2017050573A5 JP 2017050573 A5 JP2017050573 A5 JP 2017050573A5 JP 2016242455 A JP2016242455 A JP 2016242455A JP 2016242455 A JP2016242455 A JP 2016242455A JP 2017050573 A5 JP2017050573 A5 JP 2017050573A5
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- JP
- Japan
- Prior art keywords
- dicing tape
- heating
- workpiece
- expanding
- work dividing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims 9
- 230000002093 peripheral Effects 0.000 claims 2
Claims (4)
前記ダイシングテープをエキスパンドするエキスパンド手段と、
前記エキスパンドにより発生した前記ダイシングテープの外周部の弛み部分を局所的に加熱する加熱手段と、
前記加熱手段を前記ダイシングテープの外周部に沿って回転させる回転手段と、
を備える、ワーク分割装置。 In a workpiece dividing device that divides a workpiece mounted on a dicing tape in a ring-shaped frame into individual chips,
Expanding means for expanding the dicing tape;
Heating means for locally heating the slack portion of the outer peripheral portion of the dicing tape generated by the expand;
Rotating means for rotating the heating means along the outer periphery of the dicing tape;
A workpiece dividing device.
請求項1に記載のワーク分割装置。 The heating means performs heating using radiant heat or convection heat.
The work dividing apparatus according to claim 1.
請求項1又は2に記載のワーク分割装置。 A plurality of the heating means are provided at positions where the center of the workpiece is symmetric.
The work dividing apparatus according to claim 1 or 2.
前記ダイシングテープをエキスパンドするエキスパンドステップと、 An expanding step for expanding the dicing tape;
前記エキスパンドにより発生した前記ダイシングテープの外周部の弛み部分を局所的に加熱する加熱ステップと、 A heating step for locally heating a slack portion of an outer peripheral portion of the dicing tape generated by the expanding;
前記加熱する位置を前記ダイシングテープの外周部に沿って回転させる回転ステップと、 A rotation step of rotating the heating position along the outer periphery of the dicing tape;
を備える、ワーク分割方法。 A work dividing method comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016242455A JP6414995B2 (en) | 2016-12-14 | 2016-12-14 | Work dividing apparatus and work dividing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016242455A JP6414995B2 (en) | 2016-12-14 | 2016-12-14 | Work dividing apparatus and work dividing method |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016097858A Division JP6060475B2 (en) | 2016-05-16 | 2016-05-16 | Work dividing apparatus and work dividing method |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018130134A Division JP2018170525A (en) | 2018-07-09 | 2018-07-09 | Workpiece division device and workpiece division method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017050573A JP2017050573A (en) | 2017-03-09 |
JP2017050573A5 true JP2017050573A5 (en) | 2017-06-29 |
JP6414995B2 JP6414995B2 (en) | 2018-10-31 |
Family
ID=58280323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016242455A Active JP6414995B2 (en) | 2016-12-14 | 2016-12-14 | Work dividing apparatus and work dividing method |
Country Status (1)
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JP (1) | JP6414995B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102472950B1 (en) * | 2017-07-14 | 2022-12-05 | 에스케이하이닉스 주식회사 | Cooling/heating combination device, adhesive film cutting assembly and adhesive film cutting equipment having the same |
JP7045635B2 (en) * | 2017-08-30 | 2022-04-01 | パナソニックIpマネジメント株式会社 | Plasma processing equipment and method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5207455B2 (en) * | 2008-05-09 | 2013-06-12 | 株式会社ディスコ | Film adhesive breaking apparatus and breaking method |
JP5243101B2 (en) * | 2008-05-14 | 2013-07-24 | 株式会社ディスコ | Breaking device |
JP5013148B1 (en) * | 2011-02-16 | 2012-08-29 | 株式会社東京精密 | Work dividing apparatus and work dividing method |
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2016
- 2016-12-14 JP JP2016242455A patent/JP6414995B2/en active Active
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