JP2016218407A - Exposure apparatus, exposure method and producing method of product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure apparatus advantageous in compatibility of improvement in throughput and improvement in focus accuracy.SOLUTION: An exposure apparatus for scan exposure of shot region of a substrate while scanning of the substrate relatively to slit light comprises a first measuring part measuring height of the substrate in incident region capable of being radiated with the slit light, a second measuring part measuring height of the substrate at front of the incident region, and a controlling part controlling the height of the substrate during the scan exposure in the shot region. Within first section of the shot region at a side of end part of the shot region from which the scan exposure is started, the controlling part controls the height of the substrate during scan exposure in the first section based on measurement result by the first measuring part in outside region of the shot region, and, within second section of the shot region where the scan exposure is executed after the first section, the controlling part controls the height of the substrate during scan exposure in the second section based on measurement result by the second measuring part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an exposure apparatus, an exposure method, and a method for manufacturing an article.

  As an apparatus used in a manufacturing process (lithography process) of a semiconductor device or the like, there is an exposure apparatus that performs scanning exposure of a shot region of a substrate while scanning the substrate with respect to slit light. Such an exposure apparatus measures the surface height of the substrate (focus measurement) before the incident area where the slit light can enter, and based on the measurement result, the surface of the substrate is imaged on the image plane of the projection optical system ( The shot area is scanned and exposed while being placed on the focus plane.

  The exposure apparatus is required to improve the throughput. In order to improve the throughput, it is preferable to shorten the time required for the step movement of the substrate stage between scanning exposures of the shot area. In Patent Document 1, the time required for step movement of the substrate stage is shortened by determining the position of the shot region where focus measurement is started so that focus measurement at or near the end of the shot region is omitted. A method has been proposed.

JP 2009-94256 A

  In the method described in Patent Document 1, when the position of the shot area where focus measurement is started is determined so as to improve the throughput, a section where focus measurement is not performed may occur in the shot area. In this section, since the control for arranging the surface of the substrate on the focus surface is not performed based on the result of focus measurement, the focus accuracy may not be within the allowable range. In other words, the method described in Patent Document 1 may be insufficient in achieving both improvement in throughput and improvement in focus accuracy.

  SUMMARY An advantage of some aspects of the invention is that it provides an exposure apparatus that is advantageous for improving both throughput and focus accuracy.

  In order to achieve the above object, an exposure apparatus according to one aspect of the present invention is an exposure apparatus that performs scanning exposure of a shot area of the substrate while scanning the substrate with respect to the slit light, and the slit light is incident on the exposure apparatus. A first measurement unit that measures the height of the substrate in a possible incident region; and a second measurement unit that measures the height of the substrate before the incident region prior to measurement by the first measurement unit; A control unit that controls the height of the substrate during scanning exposure of the shot region, and the control unit includes a first section of the shot region on the end side of the shot region where scanning exposure is started, The height of the substrate during the scanning exposure in the first section is controlled based on the measurement result by the first measuring unit in the outer area of the shot area, and before the scanning exposure is performed after the first section. In the second section of the shot area, the height of the substrate during the scanning exposure of the second section is controlled based on the measurement result of the second measurement unit, it is characterized.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide an exposure apparatus that is advantageous for achieving both improvement in throughput and improvement in focus accuracy.

It is the schematic which shows the structure of the exposure apparatus 100 of 1st Embodiment. It is a figure which shows arrangement | positioning of several measurement points in a measurement part. It is a figure which shows the positional relationship of the measurement point in which a measurement part performs a measurement, and the incident area | region which can inject slit light. It is a figure for demonstrating the conventional scanning exposure with respect to several shot area | regions on a board | substrate. It is a figure for demonstrating the conventional scanning exposure with respect to several shot area | regions on a board | substrate. It is a figure for demonstrating the scanning exposure of 1st Embodiment with respect to the several shot area | region on a board | substrate. It is a figure for demonstrating the scanning exposure of 2nd Embodiment with respect to the several shot area | region on a board | substrate.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member thru | or element, and the overlapping description is abbreviate | omitted.

<First Embodiment>
An exposure apparatus 100 according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus 100 according to the first embodiment. The exposure apparatus 100 according to the first embodiment is a step-and-scan type scanning exposure apparatus that scans and exposes a substrate 15 using slit light. The exposure apparatus 100 includes an illumination optical system 11, a mask stage 13, a projection optical system 14, a substrate stage 16, a measurement unit 17, a first detection unit 18, a second detection unit 19, and a control unit. 20 may be included. The control unit 20 includes, for example, a CPU and a memory, and controls each unit of the exposure apparatus 100. That is, the control unit 20 controls a process of transferring the pattern formed on the mask 12 to the substrate 15 (a process of scanning and exposing the substrate 15).

  The illumination optical system 11 shapes light emitted from a light source (not shown) such as an excimer laser into, for example, a strip-shaped or arc-shaped slit light that is long in the X direction by using a light shielding member such as a masking blade included therein. A part of the mask 12 is illuminated with slit light. The mask 12 and the substrate 15 are respectively held by the mask stage 13 and the substrate stage 16 and are arranged at optically conjugate positions (object plane and image plane of the projection optical system 14) via the projection optical system 14, respectively. Is done. The projection optical system 14 has a predetermined projection magnification (for example, 1/2 times or 1/4 times), and projects the pattern formed on the mask 12 onto the substrate with slit light. Hereinafter, an area where the slit light can be incident is referred to as an incident area 21.

  The mask stage 13 and the substrate stage 16 are configured to be movable in a direction (for example, the Y direction) perpendicular to the optical axis of the projection optical system 14 (the optical axis of the slit light). The scanning is relatively performed at a speed ratio corresponding to the projection magnification. Thereby, the pattern of the mask 12 can be transferred to the shot region 15a on the substrate while scanning the substrate with respect to the slit light (incident region 21). Such scanning exposure is sequentially repeated for each of the plurality of shot regions 15a on the substrate 15 while the substrate stage 16 is moved stepwise, whereby the exposure processing on one substrate 15 can be completed.

  The first detector 18 includes a laser interferometer, for example, and detects the position of the mask stage 13. The laser interferometer included in the first detection unit 18 irradiates, for example, a laser beam to the reflection plate 13a provided on the mask stage 13, and the laser beam reflected by the reflection plate 13a from the reference position on the mask stage 13 Detect displacement. Thereby, the 1st detection part 18 can acquire the present position of the mask stage 13 based on the detected displacement.

  The second detector 19 includes a laser interferometer, for example, and detects the position of the substrate stage 16. The laser interferometer included in the second detection unit 19 irradiates, for example, a laser beam onto the reflection plate 16a provided on the substrate stage 16, and the laser beam reflected by the reflection plate 16a from the reference position on the substrate stage 16 Detect displacement. Thereby, the second detection unit 19 can acquire the current position of the substrate stage 16 based on the detected displacement. Based on the current positions of the mask stage 13 and the substrate stage 16 acquired by the first detection unit 18 and the second detection unit 19, respectively, the driving of the mask stage 13 and the substrate stage 16 in the XY directions is controlled by the control unit. 20. Here, the first detection unit 18 and the second detection unit 19 detect the position of the mask stage 13 and the position of the substrate stage 16 using a laser interferometer, respectively. An encoder may be used.

  The measurement unit 17 aligns the surface of the substrate 15 (hereinafter simply referred to as the substrate 15) with the imaging surface (focus surface) of the projection optical system 14, so that the height of the substrate is maintained while the substrate stage 16 is moving. Measure. The measurement unit 17 of the first embodiment is an oblique incidence type that irradiates light to the substrate 15 from an oblique direction, and an irradiation system 17 a that irradiates the substrate 15 with light, and a light receiving system 17 b that receives the light reflected by the substrate 15. Can be included.

  The irradiation system 17a can include, for example, a light source 70, a collimator lens 71, a slit member 72, an optical system 73, and a mirror 74. The light source 70 is constituted by, for example, a lamp or a light emitting diode, and emits light having a wavelength that the resist on the substrate does not sensitize. The collimator lens 71 turns the light emitted from the light source 70 into parallel light having a substantially uniform light intensity distribution in the cross section. The slit member 72 is composed of a pair of prisms bonded so that their slopes face each other, and chromium or the like in which a plurality of openings (for example, nine pinholes) are formed on the bonding surface 72a. The light shielding film is provided. The optical system 73 is a double-sided telecentric optical system, and causes nine light beams that have passed through a plurality of openings in the slit member 72 to be incident on the substrate via the mirror 74. At this time, the optical system 73 is configured such that the surface 72a where the opening is formed and the surface including the substrate surface satisfy the Scheimpflug condition.

  In the present embodiment, the mirror 74 has an angle φ (an angle between the light beam and the optical axis of the projection optical system 14) at which each light beam emitted from the irradiation system 17a enters the substrate is, for example, 70 degrees or more. It is configured. In addition, as shown in FIG. 2, the irradiation system 17a forms an angle θ (for example, 22.5 degrees) with respect to the scanning direction (Y direction) of the slit light in the direction parallel to the substrate surface (XY direction). To 9 high speeds are made incident on the substrate. By making nine light beams incident on the substrate 15 in this way, the height of the substrate surface can be individually measured at the nine measurement points 30.

  The light receiving system 17b can include, for example, a mirror 75, a light receiving optical system 76, a correction optical system 77, a photoelectric conversion unit 78, and a processing unit 79. The mirror 75 guides the nine light beams reflected by the substrate 15 to the light receiving optical system 76. The light receiving optical system 76 is a both-side telecentric optical system, and includes a stopper diaphragm provided in common for nine light beams. Then, high-order diffracted light (noise light) generated due to the circuit pattern formed on the substrate is blocked by the stopper diaphragm included in the light receiving optical system 76. The correction optical system 77 has a plurality of (nine) lenses so as to correspond to the nine light beams. The nine light beams are imaged on the light receiving surface of the photoelectric conversion unit 78 and pinned on the light receiving surface. Each hole image is formed. The photoelectric conversion unit 78 includes, for example, a plurality (nine) of photoelectric conversion elements so as to correspond to nine light beams. As the photoelectric conversion element, a CCD line sensor or the like can be used. Further, the processing unit 79 calculates the height of the substrate surface at each measurement point 30 based on the change in the position of each pinhole image on the light receiving surface of the photoelectric conversion unit 78.

  By configuring the irradiation system 17a and the light receiving system 17b as described above, the measurement unit 17 can increase the height of the substrate 15 at each measurement point 30 based on the change in the position of each pinhole image on the light receiving surface of the photoelectric conversion unit 78. Can be measured. And the control part 20 can control the substrate stage 16 based on the measurement result by the measurement part 17 so that the height of the board | substrate 15 may become target height (focus surface (target value)) (board | substrate 15). Can control the height). Here, in the light receiving system 17b, the tilt correction is performed so that each measurement point 30 on the substrate and the light receiving surface of the photoelectric conversion unit 78 are conjugate with each other. Therefore, the position of each pinhole image on the light receiving surface of the photoelectric conversion unit 78 does not change depending on the local inclination of each measurement point 30.

Next, measurement of the height of the substrate 15 during scanning exposure of the shot area 15a on the substrate will be described with reference to FIG. FIG. 3 is a diagram showing a positional relationship between nine measurement points 30 at which the height of the substrate 15 is measured by the measurement unit 17 and incident regions 21 where slit light can be incident. In FIG. 3, the incident area 21 is an area on a rectangle surrounded by a broken line. The measurement points 30 a _{1 to} 30 a ₃ (measurement points 30 a) are measurement points 30 at which the height of the substrate 15 is measured inside the incident region 21 by the first measurement unit of the measurement unit 17. That is, at the measurement point 30a, the height of the measurement point 40 arranged inside the incident region 21 among the plurality of measurement points 40 set on the substrate is measured by the first measurement unit. The measurement location 40 is a location on the substrate that is set so that height measurement by the measurement unit 17 is performed.

Further, the measurement points 30b _{1 to} 30b ₃ (measurement point 30b) and the measurement points 30c _{1 to} 30c ₃ (measurement point 30c) are measured by the second measurement unit of the measurement unit 17 at the height of the substrate 15 before the incident region 21. It is the measurement point 30 which measures this. That is, at the measurement point 30b and the measurement point 30c, the height of the measurement point 40 is the second before the measurement of the height of the measurement point 40 at the measurement point 30a by the first measurement unit performed inside the incident region 21. It is measured by the measuring unit. For example, the measurement point 30b and the measurement point 30c are arranged at positions separated by a distance Lp in the scanning direction (± Y direction) of the slit light from the measurement point 30a at which the measurement by the first measurement unit is performed. The measurement at the measurement point 30b and the measurement at the measurement point 30c are switched according to the scanning direction of the slit light, that is, the movement direction of the substrate 15.

  For example, when scanning exposure is performed by moving the substrate 15 in the direction of the arrow F, the measurement point 30b is arranged at the measurement point 40 on the substrate before the measurement point 30a inside the incident region 21. Therefore, based on the measurement result at the measurement point 30b by the second measurement unit, the control unit 20 measures the measurement point 40 when the incident region 21 is arranged in the measurement point 40 where the measurement by the second measurement unit is performed. The height of the substrate 15 is controlled so that the height becomes the target height. On the other hand, when scanning exposure is performed by moving the substrate 15 in the direction of the arrow R, the measurement point 30c is arranged at the measurement point 40 on the substrate before the measurement point 30a inside the incident region 21. Therefore, based on the measurement result at the measurement point 30c by the second measurement unit, the control unit 20 measures the measurement point 40 when the incident region 21 is arranged in the measurement point 40 where the measurement by the second measurement unit is performed. The height of the substrate 15 is controlled so that the height becomes the target height.

  Here, the measurement of the height of the measurement point 40 at the measurement point 30 b or 30 c by the second measurement unit is performed outside the incident region 21. Therefore, based on the measurement result of the height of the measurement location 40 by the second measurement unit, the height of the substrate 15 is controlled so that the height of the measurement location 40 where the incident region 21 is arranged becomes the target height. However, a control error may occur. Therefore, the exposure apparatus 100 measures the height of the measurement location 40 where the incident region 21 is arranged by the first measurement unit, and based on the difference between the measurement result by the first measurement unit and the measurement result by the second measurement unit. The control error is corrected. In this way, by using the first measurement unit and the second measurement unit in combination, the height of the substrate 15 can be accurately controlled.

[Conventional scanning exposure for a plurality of shot areas 15a]
Next, conventional scanning exposure for a plurality of shot regions 15a on the substrate will be described with reference to FIG. FIG. 4A is a diagram showing the positions of a plurality of measurement points 30 and a scanning path 21a on the substrate of slit light (incident region 21) when scanning exposure is performed on a plurality of shot regions 15a on the substrate. It is. In FIG. 4 (a), shot and shot region 15a ₁ of the scanning exposure is completed, the shot area 15a ₂ which follows the scanning exposure for the shot area 15a ₁ is performed, the next scanning exposure for the shot area 15a ₂ is performed Region 15a ₃ is shown. Here, a case where scanning exposure of the shot area 15a ₂ is performed will be described. FIG. 4B is a diagram showing the relationship between the moving speed of the substrate stage 16 in the Y direction and time when scanning exposure of the shot area 15a ₂ is performed. The black circle (●) in FIG. 4B indicates the measurement timing at the measurement point 40 by the second measurement unit (measurement point 30b).

First, after the scanning exposure of the shot area 15a ₁ is completed, that is, after the shot area 15a ₁ is removed from the incident area 21, the control unit 20 moves the substrate stage 16 to start the scanning exposure of the shot area 15a _2. Move step. For the Y direction, as shown in FIG. 4B, the substrate stage 16 is decelerated during the period from time t1 to time t2, and the substrate stage 16 is accelerated during the period from time t2 to time t3. At time t3, the substrate stage 16 starts moving at a constant speed, and the second measurement unit (measurement point 30b) starts measurement at the measurement point 40 in the shot region 15a2.

At time t4 in FIG. 4B, the shot area 15a ₂ reaches the incident area 21, and scanning exposure of the shot area 15a ₂ by the slit light is started. Then, during the period from time t4 to time t5, the scanning exposure of the shot area 15a ₂ is performed. At this time, the control unit 20 determines the height of each measurement point 40 arranged in the incident region 21 based on the height of each measurement point 40 in the shot region 15a ₂ measured by the second measurement unit (measurement point 30b). The height of the substrate 15 is controlled so that the height becomes the target height.

For example, when the measurement point _40a shot areas 15a ₂ (40a 1 ~40a ₃₎ is arranged in the measuring point 30b, the control unit 20 causes the measured height of the measurement point 40a in the second measurement unit. Further, when the measurement point _{40b (40b} 1 _{~40b 3)} is arranged in the measuring point 30b, the control unit 20 causes the measured height of the measurement point 40b in the second measurement unit. And the control part 20 is a board | substrate based on the measurement result of the measurement location 40a by a 2nd measurement part so that the height of the measurement location 40a becomes target height by the time the measurement location 40a is arrange | positioned in the incident area | region 21. Control the height of 15. Next, the control unit 20 sets the substrate based on the measurement result of the measurement point 40b by the second measurement unit so that the height of the measurement point 40b becomes the target height before the measurement point 40b is arranged in the incident region 21. Control the height of 15.

In exposure apparatus 100, in order to improve the throughput, for example, it is preferable that the scanning exposure for the shot area 15a ₁ is to shorten the time required from exit to the start of the scanning exposure for the shot area 15a _2. That is, it is preferable to shorten the time required for the step movement of the substrate stage 16. As a method for shortening the time required for the step movement of the substrate stage 16, for example, as shown in FIG. 5, first in some measurement points 40 disposed on the end side of the shot region 15a ₂ to start the scanning exposure There is a method of omitting the measurement by the two measurement unit (measurement point 30b). FIG. 5A is a diagram showing a scanning path 21b of the slit light on the substrate when measurement by the second measurement unit at the measurement point 40a arranged on the end side of the shot region 15a ₂ is omitted. FIG. 5B is a diagram showing the relationship between the moving speed of the substrate stage 16 in the Y direction and time when scanning exposure of the shot area 15a ₂ is performed. By omitting such measurements in some measurement points 40 by the second measurement unit, the period from the start of the measurement by the second measurement unit to start the scanning exposure for the shot area 15a ₂ (time (period from t3 to time t4) can be shortened. That is, the slit light scanning path 21b (movement distance of the substrate stage 16) related to the step movement of the substrate stage 16 can be shortened, and the time required for the step movement of the substrate stage 16 can be shortened.

[Scanning exposure in this embodiment]
In a method in which measurement by the second measurement unit is omitted at some measurement locations 40 arranged on the end side of the shot area 15a ₂ where scanning exposure is started, a section in which measurement by the second measurement unit is not performed (first section) is to occur shot region 15a _2. In FIG. 5A, the measurement by the second measurement unit is omitted at the measurement point 40a, and the section Ls between the end where scanning exposure starts and the measurement point 40b is measured by the second measurement unit. It corresponds to the first section that is not broken. Therefore, in the first section, the height of the substrate 15 is not controlled based on the measurement result by the second measurement unit, so that it is difficult to set the height of the substrate 15 to the target height in the incident region 21. Can be. Therefore, the exposure apparatus 100 of the present embodiment, the height of the substrate 15 during the scanning exposure of the first section, the first measurement unit in the outer region of the shot region 15a ₂ is controlled based on the measurement results measured. Further, in the exposure apparatus 100 of the present embodiment, in the second section of the shot region 15a ₂ where the scanning exposure is performed after the first section, the height of the substrate 15 during the scanning exposure in the second section is measured at each measurement location 40. The control is performed based on the measurement result measured by the second measurement unit.

Next, a method for controlling the height of the substrate 15 during the scanning exposure in the first section based on the measurement result by the first measurement unit in the outer region of the shot region 15a ₂ will be described with reference to FIG. . FIG. 6A is a diagram for explaining measurement at the measurement point 40 by the measurement unit 17 when scanning exposure is performed on a plurality of shot regions 15a on the substrate. FIG. 6B is a diagram showing the relationship between the moving speed of the substrate stage 16 in the Y direction and time when scanning exposure of the shot area 15a ₂ is performed.

For example, in the period in which the substrate 15 is moved without scanning exposure (period in which the substrate stage 16 is moved stepwise) before the scanning exposure of the shot area 15a ₂ is started, the control unit 20 performs the first measurement unit. (Measurement point 30a) is measured in the outer region. At this time, as shown in FIG. 6B, the control unit 20 preferably causes the first measurement unit to perform measurement after the substrate starts moving at a constant speed (after time t3). Thus, in the state where the substrate is moved at a constant speed, the end of the shot region 15a ₂ where the scanning exposure is started is caused when the first measurement unit performs measurement rather than the second measurement unit performs measurement. A measurement result at a location close to the part can be obtained. In FIG. 6A, at the time t3 when the substrate 15 starts moving at a constant speed, measurement is performed by the first measurement unit at the measurement points 50a (50a _{1 to} 50a ₃ ) in the outer region. Measurement point 50a of the thus outer region is measured by the first measuring unit is performed, to reflect the control of the height of the substrate 15 in the first section, as possible to the end of the shot area 15a ₂ to start the scanning exposure The closer one is preferable. And the control part 20 controls the height of the board | substrate in the scanning exposure of a 1st area based on the measurement result by the 1st measurement part in the measurement location 50a of an outer side area | region. Thereby, the height of the substrate 15 can be accurately controlled even during the scanning exposure of the first section in which the control of the height of the substrate based on the measurement result by the second measurement unit is not performed.

As described above, the exposure apparatus 100 of the first embodiment performs the first in the outer region of the shot region 15a ₂ during the scanning exposure of the first section in which the substrate height is not measured by the second measuring unit. The height of the substrate 15 is controlled based on the measurement result by the measurement unit. Thereby, even during the scanning exposure of the first section, the height of the substrate 15 can be accurately controlled to improve the focus accuracy. That is, the exposure apparatus 100 of the first embodiment can improve throughput by omitting the measurement location of the shot area 15a ₂ and can also improve the focus accuracy in the first section.

Second Embodiment
An exposure apparatus according to a second embodiment of the present invention will be described. The exposure apparatus 100 according to the first embodiment causes the first measurement unit to measure the height of the substrate in the outer region of the shot region 15a ₂ during the step movement of the substrate stage 16, and first based on the measurement result. The height of the substrate 15 during the scanning exposure of the section was controlled. In contrast, the exposure apparatus of the second embodiment, based on the measurement result by the first measurement unit in the outer region obtained during scanning exposure in the outer region of the shot regions 15a _2, during the scanning exposure of the first section The height of the substrate 15 is controlled. Since the exposure apparatus of the second embodiment has the same apparatus configuration as the exposure apparatus 100 of the first embodiment, description of the apparatus configuration is omitted here.

Figure 7 is a diagram showing a scanning path 21b on the substrate position and the slit light of a plurality of measurement points 30 (incident area 21) in the case of performing scanning exposure of the shot area 15a _2. FIG. 7 shows shot areas 15a _{1 to} 15a ₉ . The shot area 15a ₂ is a shot area 15a to be subjected to scanning exposure. The shot areas 15a ₁ , 15a ₄ , 15a ₅ , and 15a ₇ are shot areas 15a that have already undergone scanning exposure before the shot area 15a ₂ . The shot areas 15a ₃ , 15a ₆ , 15a ₈ , and 15a ₉ are shot areas 15a in which scanning exposure is performed after the shot area 15a ₂ . In FIG. 7, for clarity of the figure, the control unit 20 which is not shown of the measuring point 30c, prior to starting the scanning exposure for the shot area 15a _2, the outer region of the shot area 15a ₂ (e.g. The measurement result by the first measurement unit in the outer region obtained during the scanning exposure of the shot region 15a ₅ ) is acquired. For example, it is assumed that the outer region (shot region 15a ₅ ) has a plurality of measurement points 60 that are measured by the first measurement unit (measurement point 30a). In this case, the control unit 20, among the plurality of measurement points 60, may acquire the measurement result of the first measuring unit for the nearest measurement point 60a to an end portion of the shot area 15a ₂ to start the scanning exposure. This is because an error with respect to the height of the substrate 15 in the first section is smaller at the measurement point closer to the end. And the control part 20 controls the height of the board | substrate 15 in the scanning exposure of a 1st area based on the measurement result by the 1st measurement part in the acquired outer area | region. Thereby, the height of the substrate 15 can be accurately controlled even during the scanning exposure of the first section in which the height of the substrate 15 is not controlled based on the measurement result by the second measurement unit.

Here, the control unit 20, depending on whether the scanning exposure of the shot area adjacent to the shot area 15a ₂ (outer region) is performed in the end of the shot area 15a ₂ to start the scanning exposure, You may switch the control method of the height of the board | substrate 15 in a 1st area. For example, when scanning exposure of the outer region is not performed, the control unit 20 performs measurement by the first measurement unit in the outer region obtained during the step movement of the substrate stage as in the first embodiment. Based on the result, the height of the substrate 15 during the scanning exposure in the first section may be controlled. On the other hand, when the scanning exposure of the outer region has already been performed, the control unit 20 acquires the measurement result by the first measuring unit in the outer region obtained during the scanning exposure of the outer region, Based on the measurement result, the height of the substrate 15 during the scanning exposure in the first section may be controlled.

<Embodiment of Method for Manufacturing Article>
The method for manufacturing an article according to an embodiment of the present invention is suitable, for example, for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. In the method for manufacturing an article according to the present embodiment, a latent image pattern is formed on the photosensitive agent applied to the substrate using the above-described exposure apparatus (a step of exposing the substrate), and the latent image pattern is formed in this step. Developing the substrate. Further, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferred embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

11: illumination optical system, 12: mask, 13: mask stage, 14: projection optical system, 15: substrate, 16: substrate stage, 17: measuring unit, 20: control unit, 100: exposure apparatus

Claims (9)

An exposure apparatus that performs scanning exposure of a shot region of the substrate while scanning the substrate with respect to slit light,
A first measurement unit that measures the height of the substrate in an incident region where the slit light can be incident;
Prior to the measurement by the first measurement unit, a second measurement unit that measures the height of the substrate before the incident region;
A control unit for controlling the height of the substrate during scanning exposure of the shot area;
Including
The controller is
In the first section of the shot area on the edge side of the shot area where scanning exposure is started, the height of the substrate during the scanning exposure of the first section is measured in the first area in the outer area of the shot area. Control based on the measurement results by the
In the second section of the shot area where scanning exposure is performed after the first section, the height of the substrate during the scanning exposure of the second section is controlled based on the measurement result by the second measurement unit, An exposure apparatus characterized by that.   The control unit is based on a measurement result measured by the first measurement unit in the outer region during a period in which the substrate is moved without scanning exposure before starting scanning exposure of the shot region, The exposure apparatus according to claim 1, wherein the height of the substrate during the scanning exposure of the first section is controlled.   The controller controls the substrate during the scanning exposure of the first section based on a measurement result measured by the first measurement unit in the outer region after the substrate starts moving at a constant speed during the period. The exposure apparatus according to claim 2, wherein the height is controlled.   The control unit controls the height of the substrate during the scanning exposure of the first section based on a measurement result measured by the first measuring unit in the outer region during the scanning exposure of the outer region. The exposure apparatus according to claim 1. The outer region has a plurality of measurement points where measurement by the first measurement unit is performed during scanning exposure of the outer region,
The control unit is performing scanning exposure of the first section based on a measurement result by the first measurement unit for a measurement point closest to an end of the shot area where scanning exposure is started among the plurality of measurement points. The exposure apparatus according to claim 4, wherein the height of the substrate is controlled. The controller is
When the scanning exposure of the outer region is not performed, the outer region obtained during the period in which the substrate is moved without scanning exposure before the scanning exposure of the shot region is started. Based on the measurement result by the first measurement unit, controlling the height of the substrate during the scanning exposure of the first section,
When the scanning exposure of the outer region has already been performed, the scanning of the first section is performed based on the measurement result of the first measuring unit in the outer region obtained during the scanning exposure of the outer region. The exposure apparatus according to claim 1, wherein the height of the substrate during exposure is controlled.   The exposure apparatus according to claim 1, wherein the outer region is a shot region adjacent to the shot region on an end side of the shot region where scanning exposure is started. . A step of exposing the substrate using the exposure apparatus according to claim 1;
Developing the substrate exposed in the step;
A method for producing an article comprising: A first measurement unit that measures the height of the substrate in an incident region where slit light can be incident, and a second that measures the height of the substrate before the incident region prior to measurement by the first measurement unit. In an exposure apparatus having a measurement unit, an exposure method for performing scanning exposure of a shot region of the substrate while scanning the substrate with respect to slit light,
In the first section of the shot area on the edge side of the shot area where scanning exposure is started, the height of the substrate during the scanning exposure in the first section is measured in the first area in the outer area of the shot area. A step of controlling based on the measurement result by the unit,
The step of controlling the height of the substrate during the scanning exposure of the second section based on the measurement result by the second measuring unit in the second section of the shot area where the scanning exposure is performed after the first section. When,
An exposure method comprising:

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