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JP2016207200A - Touch panel and manufacturing method of the same - Google Patents

Touch panel and manufacturing method of the same Download PDF

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Publication number
JP2016207200A
JP2016207200A JP2016039189A JP2016039189A JP2016207200A JP 2016207200 A JP2016207200 A JP 2016207200A JP 2016039189 A JP2016039189 A JP 2016039189A JP 2016039189 A JP2016039189 A JP 2016039189A JP 2016207200 A JP2016207200 A JP 2016207200A
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Prior art keywords
film
multilayer film
touch panel
layer
adhesive
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JP2016039189A
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Japanese (ja)
Inventor
丈司 礒田
Takeshi Isoda
丈司 礒田
仁志 粟生
Hitoshi Ao
仁志 粟生
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Hosiden Corp
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Hosiden Corp
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Priority to KR1020160034736A priority Critical patent/KR20160124665A/en
Priority to TW105110082A priority patent/TW201706800A/en
Priority to EP16163802.8A priority patent/EP3085528A1/en
Priority to US15/090,901 priority patent/US20160306451A1/en
Priority to CN201610241627.5A priority patent/CN106066725A/en
Publication of JP2016207200A publication Critical patent/JP2016207200A/en
Pending legal-status Critical Current

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  • Laminated Bodies (AREA)
  • Push-Button Switches (AREA)
  • Manufacture Of Switches (AREA)
  • Position Input By Displaying (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a touch panel that stably maintains a three-dimensionally molded shape of a laminated film, and a manufacturing method of the same.SOLUTION: A touch panel comprises: a panel material; and a multi-layer film 10 that is joined to a surface of the panel material, and includes conductive films 1, 2 having conductive layers 1a, 2a and a protective film 4. The multi-layer film 10 has the respective films laminated via adhesive layers 5-7 formed of a thermosetting adhesive, and is molded to have a three-dimensional shape extending along the surface.SELECTED DRAWING: Figure 1

Description

本発明は、タッチパネル及びその製造方法に関する。   The present invention relates to a touch panel and a manufacturing method thereof.

従来より、自動車の音響機器、家電製品、電子機器等における入力装置としてタッチパネルが用いられている。タッチパネルは、通常、絶縁性のフィルムの表面に静電容量の変化を検出する導電層と、装飾用の加飾層とをそれぞれ印刷して積層することにより形成されている。タッチパネルを用いることで、操作面を平らにすることができ、入力操作のための各種スイッチ部品を省略できる等のメリットがある。   Conventionally, touch panels have been used as input devices in automobile audio equipment, home appliances, electronic devices, and the like. The touch panel is usually formed by printing and laminating a conductive layer for detecting a change in capacitance and a decorative layer for decoration on the surface of an insulating film. By using the touch panel, there are advantages that the operation surface can be flattened and various switch parts for input operation can be omitted.

タッチパネルに設けられる加飾層は、タッチパネルの用途や嗜好等に応じて多種のものから選択される。しかし、1枚のフィルムに加飾層と導電層とを印刷して積層するものでは、導電層と加飾層との多様な組み合わせを容易に実現することができない。このため、加飾層を備えた加飾フィルムと、導電層を備えた導電フィルムとを接着剤等で接合するタッチパネルが存在する(例えば、特許文献1)。加飾フィルムと導電フィルムとを個別に設けることで、導電層と加飾層との多様な組み合わせを容易に実現することができる。   The decoration layer provided in the touch panel is selected from various types according to the use and preference of the touch panel. However, if a decorative layer and a conductive layer are printed and laminated on a single film, various combinations of the conductive layer and the decorative layer cannot be easily realized. For this reason, the touch panel which joins the decorating film provided with the decorating layer, and the electrically conductive film provided with the electroconductive layer with an adhesive agent etc. exists (for example, patent document 1). By providing the decorative film and the conductive film separately, various combinations of the conductive layer and the decorative layer can be easily realized.

特開2014−2450号公報JP 2014-2450 A

タッチパネルは設置箇所によっては意匠上や視覚上の理由から曲面等の三次元形状とする方が好ましい場合がある。特許文献1のタッチパネルでは、フィルムインサート法やTOM工法(Three Dimension Overlay Method)等を用いて加飾フィルムが接着剤による接着層を介して導電フィルムに接合されている。フィルムインサート法等を用いてタッチパネルを三次元形状に成形する場合には、双方のフィルムは接着層によって接合されてから曲げられて変形する。このため、硬化した接着層が変形時に破断することがある。接着層の破断を防ぐために、接着層に代えて粘着テープを使用すれば簡易に各種フィルム材を貼り合せることは可能である。しかし、粘着テープの接着力は一般的に接着剤よりも小さいため、例えば、起伏の大きい三次元成形部位では各フィルムが粘着テープから剥離する虞がある。このため、タッチパネルにおいて積層されたフィルム形状の自由度は制限されていた。   Depending on the installation location, the touch panel may preferably have a three-dimensional shape such as a curved surface for design or visual reasons. In the touch panel of Patent Document 1, a decorative film is bonded to a conductive film through an adhesive layer using an adhesive using a film insert method, a TOM method (Three Dimension Overlay Method), or the like. When a touch panel is formed into a three-dimensional shape using a film insert method or the like, both films are bent and deformed after being joined by an adhesive layer. For this reason, the cured adhesive layer may break during deformation. In order to prevent breakage of the adhesive layer, various film materials can be easily bonded together by using an adhesive tape instead of the adhesive layer. However, since the adhesive force of the pressure-sensitive adhesive tape is generally smaller than that of the adhesive, for example, there is a possibility that each film may be peeled off from the pressure-sensitive adhesive tape in a three-dimensional molded part having a large undulation. For this reason, the freedom degree of the film shape laminated | stacked in the touch panel was restrict | limited.

本発明は上記実情に鑑みてなされたものであって、積層されたフィルムを三次元形状に成形してもその形状が安定的に保持されるタッチパネル及びその製造方法を提供することを目的とする。   The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a touch panel in which the shape is stably maintained even when the laminated film is formed into a three-dimensional shape, and a method for manufacturing the touch panel. .

本発明に係るタッチパネルの特徴構成は、パネル材と、前記パネル材の表面に接合され、導電層を有する導電フィルム及び保護フィルムを含む複層フィルムと、を備え、前記複層フィルムは、各フィルムが熱硬化性接着剤によって形成された接着層を介して積層されるとともに、前記表面に沿う三次元形状に成形されている点にある。   A characteristic configuration of a touch panel according to the present invention includes a panel material, and a multilayer film including a conductive film and a protective film which are bonded to the surface of the panel material and have a conductive layer, and the multilayer film includes each film. Are laminated via an adhesive layer formed of a thermosetting adhesive and are formed into a three-dimensional shape along the surface.

本構成では、複層フィルムは、導電フィルム及び保護フィルムを含み、各フィルムが熱硬化性接着剤による接着層を介して積層されているので、加熱前の常温時では接着層は硬化していない。よって、接着層を破断させることなく複層フィルムは変形可能であり、複層フィルムを加熱しつつ三次元形状に成形中又は成形後に接着層を硬化させることができる。このため、導電フィルム及び保護フィルムを含む複層フィルムを、各フィルムが接着層を介して密着した状態で三次元形状に成形することができる。これにより、複層フィルムは三次元形状に成形される際に成形歪が発生し難く、各フィルムと接着層との剥離を誘引する内部応力が低下する。その結果、タッチパネルにおいて複層フィルムの三次元形状が安定的に保持される。   In this configuration, the multilayer film includes a conductive film and a protective film, and since each film is laminated via an adhesive layer made of a thermosetting adhesive, the adhesive layer is not cured at room temperature before heating. . Therefore, the multilayer film can be deformed without breaking the adhesive layer, and the adhesive layer can be cured during or after molding into a three-dimensional shape while heating the multilayer film. For this reason, the multilayer film containing a conductive film and a protective film can be shape | molded in a three-dimensional shape in the state which each film contact | adhered through the contact bonding layer. Thereby, when a multilayer film is shape | molded by a three-dimensional shape, a shaping | molding distortion does not generate | occur | produce easily and the internal stress which induces peeling with each film and an adhesive layer falls. As a result, the three-dimensional shape of the multilayer film is stably maintained on the touch panel.

本発明に係るタッチパネルの他の特徴構成は、前記保護フィルムが加飾層を有する加飾フィルムである点にある。   Another characteristic configuration of the touch panel according to the present invention is that the protective film is a decorative film having a decorative layer.

本構成の如く、複層フィルムにおいて保護フィルムが加飾層を有する加飾フィルムであると、加飾フィルムを選択することでタッチパネルにおいて導電層と加飾層との多様な組み合わせを容易に実現することができる。   As in this configuration, when the protective film is a decorative film having a decorative layer in the multilayer film, various combinations of the conductive layer and the decorative layer can be easily realized on the touch panel by selecting the decorative film. be able to.

本発明に係るタッチパネルの製造方法の特徴手段は、導電層を有する導電フィルム及び保護フィルムを熱硬化性接着剤によって形成された接着層を介して積層して複層フィルムを作成するフィルム作成工程と、前記複層フィルムを加熱しつつ三次元形状に変形させるフィルム成形工程と、成形後の前記複層フィルムを射出成形用の金型に配置し、前記金型内に溶融樹脂を射出してパネル材を成形すると共に、前記複層フィルムと前記パネル材とを一体化するパネル一体化工程と、を有する点にある。   The characteristic means of the manufacturing method of the touch panel according to the present invention includes a film creation step of creating a multilayer film by laminating a conductive film having a conductive layer and a protective film via an adhesive layer formed of a thermosetting adhesive. A film forming step of deforming the multilayer film into a three-dimensional shape while heating, placing the multilayer film after molding in a mold for injection molding, and injecting molten resin into the mold to form a panel And a panel integration step of forming the material and integrating the multilayer film and the panel material.

本特徴手段によれば、フィルム成形工程により複層フィルムを成形してから金型に配置し射出成形することで、タッチパネルが製造される。ここで、複層フィルムは導電層を有する導電フィルム及び保護フィルムを熱硬化性接着剤によって形成された接着層を介して積層したフィルム作成工程により作成される。フィルム作成工程の完了時点では、複層フィルムの接着層は硬化していないものの、その粘性により導電フィルム及び保護フィルムが接合されている。そして、フィルム成形工程において加熱することで三次元形状の成形中または成形後に複層フィルムの温度が熱硬化性接着剤の硬化温度を上回ると、接着層が硬化する。このように、複層フィルムはフィルム成形工程において接着層が硬化されるため、成形の際に各々のフィルムに発生する歪が抑制される。これにより、安定した三次元形状の複層フィルムとパネル材とが一体化されたタッチパネルを製造することができる。また、仮にフィルム成形工程の加熱によって接着層の硬化が完了していない場合であっても、パネル一体化工程において複層フィルムが加熱されることで接着層の硬化を完了させることができる。   According to this characteristic means, a touch panel is manufactured by forming a multilayer film by a film forming process, placing the film in a mold, and performing injection molding. Here, a multilayer film is created by the film creation process which laminated | stacked the conductive film and protective film which have a conductive layer through the contact bonding layer formed with the thermosetting adhesive. Although the adhesive layer of the multilayer film is not cured at the completion of the film production process, the conductive film and the protective film are bonded together due to the viscosity. When the temperature of the multilayer film exceeds the curing temperature of the thermosetting adhesive during or after the molding of the three-dimensional shape by heating in the film molding process, the adhesive layer is cured. In this way, since the adhesive layer of the multilayer film is cured in the film forming process, distortion generated in each film during the forming is suppressed. Thereby, the touch panel with which the stable three-dimensional multilayer film and panel material were integrated can be manufactured. Moreover, even if it is a case where hardening of an adhesive layer is not completed by the heating of a film formation process, hardening of an adhesive layer can be completed by heating a multilayer film in a panel integration process.

複層フィルムの構成を示す図である。It is a figure which shows the structure of a multilayer film. 第1実施形態に係るタッチパネルの斜視図である。1 is a perspective view of a touch panel according to a first embodiment. 図2のIII−III線矢視断面図である。FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. 予備成形後の複層フィルムを示す図である。It is a figure which shows the multilayer film after preforming. タッチパネルの成形工程を示す図である。It is a figure which shows the shaping | molding process of a touchscreen. タッチパネルの成形工程を示す図である。It is a figure which shows the shaping | molding process of a touchscreen. タッチパネルの成形工程を示す図である。It is a figure which shows the shaping | molding process of a touchscreen. タッチパネルの成形工程の別形態を示す図である。It is a figure which shows another form of the shaping | molding process of a touchscreen. タッチパネルの成形工程の別形態を示す図である。It is a figure which shows another form of the shaping | molding process of a touchscreen. 第2実施形態に係るタッチパネルの斜視図である。It is a perspective view of the touch panel which concerns on 2nd Embodiment. 図10のXI−XI線矢視断面図である。It is XI-XI sectional view taken on the line of FIG. 他の実施形態に係るタッチパネルの斜視図である。It is a perspective view of the touch panel concerning other embodiments.

以下に、本発明の実施形態を図面に基づいて説明する。   Embodiments of the present invention will be described below with reference to the drawings.

〔第1実施形態〕
タッチパネル20は、図1〜図3に示すように、パネル材11の表面に複層フィルム10が積層されて構成されている。パネル材11及び複層フィルム10は共に三次元形状に形成されている。本実施形態では、タッチパネル20の表面が三次元曲面形状に形成されている。パネル材11の中央にはタッチパネル20の操作画面となる開口12が形成されている。
[First Embodiment]
As shown in FIGS. 1 to 3, the touch panel 20 is configured by laminating a multilayer film 10 on the surface of the panel material 11. Both the panel material 11 and the multilayer film 10 are formed in a three-dimensional shape. In the present embodiment, the surface of the touch panel 20 is formed in a three-dimensional curved surface shape. An opening 12 serving as an operation screen of the touch panel 20 is formed in the center of the panel material 11.

図1に示すように、複層フィルム10は、導電層1a,2aを有する導電フィルム1,2と、接着層6と、加飾層3aを有する加飾フィルム3とが順に積層されている。加飾フィルム3の表面側(図1の上方側)には、接着層7を介してさらに保護層4aを有する保護フィルム4が積層されている。   As shown in FIG. 1, as for the multilayer film 10, the conductive films 1 and 2 which have the conductive layers 1a and 2a, the contact bonding layer 6, and the decorating film 3 which has the decorating layer 3a are laminated | stacked in order. A protective film 4 having a protective layer 4 a is further laminated on the surface side of the decorative film 3 (upper side in FIG. 1) via an adhesive layer 7.

第1導電フィルム1及び第2導電フィルム2はベースフィルムの表面側に第1導電層1a及び第2導電層2aを夫々備える。第1導電フィルム1と第2導電フィルム2とは接着層5を介して積層されている。第1導電層1aは例えば所定の一方向の座標位置を検出し、第2導電層2aは前記一方向に交差する方向の座標位置を検出するので、第1導電フィルム1と第2導電フィルム2との組み合わせは、タッチセンサとしての機能を有する。本実施形態では、タッチセンサが2枚の導電フィルム1,2によって構成されているが、タッチセンサは1枚の導電フィルムで構成してもよい。   The first conductive film 1 and the second conductive film 2 include a first conductive layer 1a and a second conductive layer 2a on the surface side of the base film, respectively. The first conductive film 1 and the second conductive film 2 are laminated via an adhesive layer 5. For example, the first conductive layer 1a detects a coordinate position in one predetermined direction, and the second conductive layer 2a detects a coordinate position in a direction crossing the one direction. Therefore, the first conductive film 1 and the second conductive film 2 are detected. In combination with a touch sensor. In the present embodiment, the touch sensor is constituted by two conductive films 1 and 2, but the touch sensor may be constituted by one conductive film.

加飾フィルム3は、ベースフィルムの裏面側に加飾層3aを有する。加飾層3aはスクリーン印刷や転写等により形成されている。加飾層3aは、非透光性であって例えばタッチパネル20に応じたデザインや色調が施されている。   The decorative film 3 has a decorative layer 3a on the back side of the base film. The decorative layer 3a is formed by screen printing or transfer. The decorative layer 3a is non-translucent and has a design and color tone according to the touch panel 20, for example.

保護フィルム4は、ベースフィルムの表面側に保護層4aを有する。保護層4aとして例えばハードコート材が塗布されており、これにより、耐スクラッチ、低反射、アンチグレア、防指紋、傷付き修復、屈折率調整、リタデーション調整等の機能を有する。
保護フィルム4は、保護層4aを有しない、以下のベースフィルムのみから構成されていてもよい。
The protective film 4 has a protective layer 4a on the surface side of the base film. For example, a hard coat material is applied as the protective layer 4a, thereby having functions such as scratch resistance, low reflection, anti-glare, anti-fingerprint, scratch repair, refractive index adjustment, and retardation adjustment.
The protective film 4 may be comprised only of the following base films which do not have the protective layer 4a.

各フィルム1〜4のベースフィルムは、特に限定されないが、例えばポリエチレンテレフタレート(PET),ポリカーボネート(PC),アクリル(PMMA),シクロオレフィントリマー(COP),ポリプロピレン(PP),ポリエチレンナフタレート(PEN),トリアセチルセルロース(TAC),ポリイミド(PI)等が使用される。各フィルム1〜4のベースフィルムは、全て同種の材料であってもよいし、異なる材料であってもよい。   Although the base film of each film 1-4 is not specifically limited, For example, polyethylene terephthalate (PET), polycarbonate (PC), acrylic (PMMA), cycloolefin trimer (COP), polypropylene (PP), polyethylene naphthalate (PEN) , Triacetyl cellulose (TAC), polyimide (PI) and the like are used. The base films of the films 1 to 4 may all be the same type of material or different materials.

接着層5〜7はいずれも熱硬化性接着剤によって形成されている。熱硬化性接着剤は常温で粘着性を有するものが好ましい。熱硬化性接着剤の種類は特に限定されないが、例えば熱硬化型光学透明接着剤(Optical Clear Adhesive;OCA)が用いられると好ましい。   The adhesive layers 5 to 7 are all formed of a thermosetting adhesive. The thermosetting adhesive preferably has tackiness at room temperature. Although the kind of thermosetting adhesive is not specifically limited, For example, when a thermosetting optical transparent adhesive (Optical Clear Adhesive; OCA) is used, it is preferable.

熱硬化性接着剤は硬化後に多少の粘弾性を有するものでもよい。各フィルム1〜4の隣接するフィルムの間には微妙な成形性の差異や、熱収縮性、線膨張係数等の物性の差異が存在する場合がある。こうした場合に、熱硬化性接着剤が粘弾性を有するものであると、接着層5〜7が緩衝体となり各フィルム1〜4の成形性の差異や物性の差異を吸収することができる。これにより、各フィルム1〜4の剥離を防止することができる。   The thermosetting adhesive may have some viscoelasticity after curing. There may be subtle differences in formability and physical properties such as thermal shrinkage and linear expansion coefficient between adjacent films 1 to 4. In such a case, if the thermosetting adhesive has viscoelasticity, the adhesive layers 5 to 7 serve as a buffer and can absorb differences in formability and physical properties of the films 1 to 4. Thereby, peeling of each film 1-4 can be prevented.

熱硬化性接着剤は硬化後に剛性を有するものであってもよい。この場合は、各フィルム1〜4に発生する歪の相互作用が接着層5〜7の剛性によって断絶されることで、各フィルム1〜4の剥離を防止することができる。   The thermosetting adhesive may have rigidity after curing. In this case, peeling of each film 1-4 can be prevented because the interaction of the distortion which generate | occur | produces in each film 1-4 is interrupted | blocked by the rigidity of the adhesive layers 5-7.

複層フィルム10は、第1導電フィルム1、第2導電フィルム2、加飾フィルム3の表面側に接着層5〜7を夫々塗布し各フィルム1〜4を積層することで形成される。なお、導電フィルム1の裏面側には、パネル材11との接着に適したバインダ1bが塗布されている。   The multilayer film 10 is formed by applying the adhesive layers 5 to 7 on the surface side of the first conductive film 1, the second conductive film 2, and the decorative film 3, respectively, and laminating the films 1 to 4. Note that a binder 1 b suitable for bonding to the panel material 11 is applied to the back side of the conductive film 1.

〔タッチパネルの製造方法〕
次に、フィルムインサート法による、タッチパネル20の製造方法について説明する。
タッチパネル20の製造方法は、図4〜図7に示すように、複層フィルム10を作成するフィルム作成工程と、複層フィルム10を加熱しつつ三次元形状に変形させるフィルム成形工程と、成形後の複層フィルム10を射出成形用の金型30に配置し、金型30内に溶融樹脂を射出してパネル材11を成形すると共に、成形後の複層フィルム10とパネル材11とを一体化するパネル一体化工程と、を有する。
[Manufacturing method of touch panel]
Next, the manufacturing method of the touch panel 20 by the film insert method will be described.
As shown in FIGS. 4 to 7, the manufacturing method of the touch panel 20 includes a film creation process for creating the multilayer film 10, a film molding process for transforming the multilayer film 10 into a three-dimensional shape while heating, and after molding The multilayer film 10 is placed in a mold 30 for injection molding, a molten resin is injected into the mold 30 to mold the panel material 11, and the molded multilayer film 10 and the panel material 11 are integrated. A panel integration step.

不図示のフィルム作成工程では、導電層1a,2aを有する導電フィルム1,2と、加飾層3aを有する加飾フィルム3と、保護層4aを有する保護フィルム4とが熱硬化性接着剤によって形成された接着層5〜7を介して積層される。フィルム作成工程の完了時点では、接着層5〜7は硬化していないものの、その粘性により各フィルム1〜4が接合されている。図2に示される複層フィルム10では、少なくともパネル材11の開口12に重なる透光性領域15には加飾層3aが形成されていない。図2の形態に代えて、複層フィルム10において透光性領域15の一部に加飾層3aが形成されていてもよい。   In the film creation process (not shown), the conductive films 1 and 2 having the conductive layers 1a and 2a, the decorative film 3 having the decorative layer 3a, and the protective film 4 having the protective layer 4a are formed by a thermosetting adhesive. It laminates | stacks through the formed adhesive layers 5-7. Although the adhesive layers 5-7 are not hardened | cured at the time of completion of a film preparation process, each film 1-4 is joined by the viscosity. In the multilayer film 10 shown in FIG. 2, the decorative layer 3 a is not formed at least in the translucent region 15 that overlaps the opening 12 of the panel material 11. Instead of the form of FIG. 2, the decorative layer 3 a may be formed in a part of the light-transmitting region 15 in the multilayer film 10.

フィルム成形工程では、図4に示すように、複層フィルム10が加熱されつつ三次元形状に予備成形される。複層フィルム10の予備成形は熱プレス、真空成形、圧空成形等により行われる。フィルム成形工程での加熱により複層フィルム10の温度が接着層5〜7の熱硬化性接着剤の硬化温度を上回ると、接着層5〜7が硬化する。   In the film forming step, as shown in FIG. 4, the multilayer film 10 is preformed into a three-dimensional shape while being heated. The preforming of the multilayer film 10 is performed by hot pressing, vacuum forming, pressure forming, or the like. When the temperature of the multilayer film 10 exceeds the curing temperature of the thermosetting adhesive of the adhesive layers 5 to 7 by heating in the film forming step, the adhesive layers 5 to 7 are cured.

次に、図5に示すように、予備成形後の複層フィルム10を射出成型用の金型30の一方の成形型31の内面に沿うように配置する。図6に示すように、金型30を閉じると、複層フィルム10に他方の成形型32の凸部33が当接し、凸部33の周囲にキャビティ34が形成される。   Next, as shown in FIG. 5, the multilayer film 10 after the pre-molding is arranged along the inner surface of one molding die 31 of the mold 30 for injection molding. As shown in FIG. 6, when the mold 30 is closed, the convex portion 33 of the other mold 32 abuts on the multilayer film 10, and a cavity 34 is formed around the convex portion 33.

その後、図7に示すように、キャビティ34にゲート35から溶融樹脂を射出することでパネル材11が成形されると共に、三次元形状の複層フィルム10とパネル材11とが一体化される。このパネル一体化工程により、タッチパネル20が製造される。   Thereafter, as shown in FIG. 7, the panel material 11 is molded by injecting molten resin into the cavity 34 from the gate 35, and the three-dimensional multilayer film 10 and the panel material 11 are integrated. The touch panel 20 is manufactured by this panel integration process.

このように、フィルム成形工程における複層フィルム10が加熱により、接着層5〜7が硬化する。このため、各フィルム1〜4が接着層5〜7を介して密着した状態で、複層フィルム10を三次元形状に成形することができる。これにより、複層フィルム10は三次元形状に成形される際に成形歪が発生し難く、各フィルム1〜4と接着層5〜7との剥離を誘引する内部応力が低下する。その結果、安定した三次元形状の複層フィルム10とパネル材11とが一体化されたタッチパネル20を製造することができる。また、仮にフィルム成形工程の加熱によって接着層5〜7の硬化が完了していない場合であっても、パネル一体化工程において複層フィルム10が加熱されることで接着層5〜7の硬化を完了させることができる。   Thus, the adhesive layers 5 to 7 are cured by heating the multilayer film 10 in the film forming step. For this reason, the multilayer film 10 can be shape | molded in the three-dimensional shape in the state which each film 1-4 contact | adhered through the adhesive layers 5-7. Thereby, when the multilayer film 10 is shape | molded by a three-dimensional shape, a shaping | molding distortion does not generate | occur | produce easily and the internal stress which induces peeling with each film 1-4 and the adhesive layers 5-7 falls. As a result, the touch panel 20 in which the stable three-dimensional multilayer film 10 and the panel material 11 are integrated can be manufactured. Moreover, even if it is a case where hardening of the adhesive layers 5-7 is not completed by the heating of a film formation process, the hardening of the adhesive layers 5-7 is performed by heating the multilayer film 10 in a panel integration process. Can be completed.

フィルム成形工程において複層フィルム10を予備成形する際には、通常60℃〜100℃に複層フィルム10が加熱される。このため、熱硬化性接着剤の硬化開始温度が異なれば、それに応じて異なる作用が生じる。
接着層5〜7の熱硬化性接着剤は例えば60℃以上で硬化が開始するものを用いることができる。この場合、フィルム作成工程では接着層5〜7は硬化しないが、フィルム成形工程で予備成形する際の加熱により接着層5〜7の硬化が開始することになる。
When preforming the multilayer film 10 in the film forming step, the multilayer film 10 is usually heated to 60 ° C to 100 ° C. For this reason, if the curing start temperature of the thermosetting adhesive is different, different actions are generated accordingly.
As the thermosetting adhesive for the adhesive layers 5 to 7, for example, an adhesive whose curing starts at 60 ° C. or higher can be used. In this case, the adhesive layers 5 to 7 are not cured in the film making process, but the curing of the adhesive layers 5 to 7 is started by heating when preforming in the film forming process.

熱硬化性接着剤は100℃以上で硬化が開始するものでもよい。この場合は、フィルム成形工程における複層フィルム10の加熱温度を高めの領域に設定することで接着層5〜7が硬化する。このため、フィルム成形工程の前に、例えば複層フィルム10に対して、オートクレーブ(滅菌)処理やアニール(焼鈍し)処理を行う際には接着層5〜7を硬化させることなく、フィルム成形工程時に初めて接着層5〜7の硬化を開始させることができる。また、フィルム成形工程における加熱温度を低く設定することで、フィルム成形工程では複層フィルム10の接着層5〜7の硬化の開始を抑制し、パネル一体化工程において接着層5〜7を硬化させることができる。   The thermosetting adhesive may start curing at 100 ° C. or higher. In this case, the adhesive layers 5-7 harden | cure by setting the heating temperature of the multilayer film 10 in a film formation process to a high area | region. For this reason, before performing a film forming process, for example, when performing an autoclave (sterilization) process or an annealing (annealing) process on the multilayer film 10, the film forming process is performed without curing the adhesive layers 5-7. Only occasionally the curing of the adhesive layers 5-7 can be started. Moreover, the start of hardening of the adhesive layers 5-7 of the multilayer film 10 is suppressed in the film forming step by setting the heating temperature in the film forming step low, and the adhesive layers 5-7 are cured in the panel integration step. be able to.

熱硬化性接着剤は250℃以上で硬化が開始するものでもよい。この場合は、熱硬化性接着剤の硬化開始温度が、フィルム成形工程における予備成形の際の加熱温度よりも高温になる。したがって、複層フィルム10が金型30に配置される際には、接着層5〜7はまだ硬化していない。このため、パネル一体化工程において、金型30に対して予備成形された複層フィルム10が隙間のある状態で配置されたとしても、溶融樹脂の射出圧力によって複層フィルム10が金型30の形状に矯正され、この状態で複層フィルム10が溶融樹脂に加熱されることで接着層5〜7を硬化させることができる。   The thermosetting adhesive may start curing at 250 ° C. or higher. In this case, the curing start temperature of the thermosetting adhesive is higher than the heating temperature in the preliminary molding in the film molding process. Therefore, when the multilayer film 10 is disposed in the mold 30, the adhesive layers 5 to 7 are not yet cured. For this reason, even if the multilayer film 10 preformed with respect to the mold 30 is arranged with a gap in the panel integration step, the multilayer film 10 is formed on the mold 30 by the injection pressure of the molten resin. The adhesive layers 5 to 7 can be cured by correcting the shape and heating the multilayer film 10 to the molten resin in this state.

〔タッチパネルの他の製造方法〕
図8〜図9に示すように、平板の複層フィルム10を金型30に挿入し、金型30の内部で複層フィルム10の成形を行っても良い。複層フィルム10は、例えば図示しない熱源によって加熱しつつ成形型31に沿って変形する。その後、金型30を閉じ、キャビティ34にゲート35から溶融樹脂を射出してパネル材11を成形する。これにより、三次元形状の複層フィルム10にパネル材11が一体化されたタッチパネル20が製造される。
[Other touch panel manufacturing methods]
As shown in FIGS. 8 to 9, a flat multilayer film 10 may be inserted into a mold 30 and the multilayer film 10 may be molded inside the mold 30. The multilayer film 10 is deformed along the mold 31 while being heated by, for example, a heat source (not shown). Thereafter, the mold 30 is closed, and molten resin is injected from the gate 35 into the cavity 34 to mold the panel material 11. Thereby, the touch panel 20 in which the panel material 11 is integrated with the three-dimensional multilayer film 10 is manufactured.

金型30に挿入される複層フィルム10は、金型30を閉じる際の押圧力によって金型30に少なくとも一部が沿う形状に変形させてから、溶融樹脂による射出成形を行ってもよい。こうすると、複層フィルム10が溶融樹脂の圧力を受けて変形すると共に、接着層5〜7が溶融樹脂により加熱されて硬化する。   The multilayer film 10 inserted into the mold 30 may be subjected to injection molding with a molten resin after being deformed into a shape along which at least a part is aligned with the mold 30 by a pressing force when the mold 30 is closed. If it carries out like this, while the multilayer film 10 receives the pressure of molten resin and deform | transforms, the adhesive layers 5-7 will be heated with molten resin, and will be hardened | cured.

〔第2実施形態〕
第2実施形態では、タッチパネル21は、図10〜図11に示すように、開口を有しないパネル材11の表面全体に複層フィルム10が積層されて構成されている。パネル材11及び複層フィルム10は共に三次元形状に形成されている。パネル材11は、ポリカーボネート等の透明の樹脂からなり、複層フィルム10と略同形状に構成されている。図10に示される複層フィルム10では、操作画面となる透光性領域15には加飾層3aが形成されていない。図10の形態に代えて、複層フィルム10において透光性領域15の一部に加飾層3aが形成されていてもよい。タッチパネル21は、第1実施形態と同様の製造方法によって製造することができる。
[Second Embodiment]
In 2nd Embodiment, as shown in FIGS. 10-11, the touchscreen 21 is comprised by laminating | stacking the multilayer film 10 on the whole surface of the panel material 11 which does not have opening. Both the panel material 11 and the multilayer film 10 are formed in a three-dimensional shape. The panel material 11 is made of a transparent resin such as polycarbonate and is configured in substantially the same shape as the multilayer film 10. In the multilayer film 10 shown in FIG. 10, the decorative layer 3a is not formed in the translucent area | region 15 used as an operation screen. Instead of the form of FIG. 10, the decorative layer 3 a may be formed on a part of the translucent region 15 in the multilayer film 10. The touch panel 21 can be manufactured by the same manufacturing method as in the first embodiment.

このように、複層フィルム10とパネル材11とを同形状にして積層することで、タッチパネル21は全面に亘って仕様を充足する安定した強度を確保することができる。これにより、タッチパネル21の耐久性が向上する。また、図示はしないが、タッチパネル21には加飾層3aを有しない複層フィルム10を用いてもよい。その場合には、複層フィルム10の面全体をタッチパネル21の操作画面として使用することができる。   Thus, by laminating the multilayer film 10 and the panel material 11 in the same shape, the touch panel 21 can ensure a stable strength that satisfies the specifications over the entire surface. Thereby, the durability of the touch panel 21 is improved. Moreover, although not shown in figure, you may use the multilayer film 10 which does not have the decorating layer 3a for the touchscreen 21. FIG. In that case, the entire surface of the multilayer film 10 can be used as the operation screen of the touch panel 21.

[他の実施形態]
(1)図12に他の実施形態のタッチパネル22を示す。このタッチパネル22では、表面が三次元曲面形状に形成されており、左右の端部13が略直角に折り返されている。また、タッチパネル22の表面側に押圧操作可能な区画部14が備えられている。区画部14は、第1実施形態のタッチパネル20又は第2実施形態のタッチパネル21に設けてもよい。
[Other Embodiments]
(1) FIG. 12 shows a touch panel 22 of another embodiment. In the touch panel 22, the surface is formed in a three-dimensional curved surface shape, and the left and right end portions 13 are folded back at a substantially right angle. In addition, a partition section 14 that can be pressed is provided on the front surface side of the touch panel 22. You may provide the partition part 14 in the touchscreen 20 of 1st Embodiment, or the touchscreen 21 of 2nd Embodiment.

(2)上記の各実施形態では、複層フィルム10が導電フィルム1,2、加飾フィルム3、及び保護フィルム4を備える例を示したが、保護フィルム4を備えない複層フィルム10であってもよい。この場合は、複層フィルム10の最外層が加飾フィルム3であるため、加飾フィルム3が保護フィルムとして兼用される。すなわち、複層フィルム10の保護フィルムが加飾フィルム3によって構成される。また、複層フィルム10は、加飾フィルム3を備えずに、導電フィルム1,2及び保護フィルム4によって構成してもよい。 (2) In each of the above-described embodiments, the multilayer film 10 includes the conductive films 1 and 2, the decorative film 3, and the protective film 4. However, the multilayer film 10 does not include the protective film 4. May be. In this case, since the outermost layer of the multilayer film 10 is the decorative film 3, the decorative film 3 is also used as a protective film. That is, the protective film of the multilayer film 10 is constituted by the decorative film 3. Further, the multilayer film 10 may be constituted by the conductive films 1 and 2 and the protective film 4 without including the decorative film 3.

(3)複層フィルム10において、導電フィルム1,2の間には、タッチパネル20の感度を調整するためにダミーフィルムを積層してもよい。ダミーフィルムは、各フィルム1〜4のベースフィルム単体によって構成される。すなわち、ダミーフィルムは、導電層1a,2a、加飾層3a、保護層4a等を有しないフィルムである。また、導電フィルム1,2と保護フィルム4との間には、ダミーフィルムのみを積層してもよいし、ダミーフィルムと加飾フィルム3の両方を積層してもよい。ダミーフィルムを用いることで、複層フィルム10の厚み調整を容易に行うこともできる。各フィルム(導電フィルム1,2、加飾フィルム3、保護フィルム4、ダミーフィルム)はいずれも熱硬化性接着剤によって形成された接着層を介して積層される。 (3) In the multilayer film 10, a dummy film may be laminated between the conductive films 1 and 2 in order to adjust the sensitivity of the touch panel 20. The dummy film is composed of a single base film of each of the films 1 to 4. That is, the dummy film is a film that does not include the conductive layers 1a and 2a, the decorative layer 3a, the protective layer 4a, and the like. Further, only the dummy film may be laminated between the conductive films 1 and 2 and the protective film 4, or both the dummy film and the decorative film 3 may be laminated. By using a dummy film, the thickness of the multilayer film 10 can be easily adjusted. Each film (the conductive films 1 and 2, the decorative film 3, the protective film 4, and the dummy film) is laminated via an adhesive layer formed of a thermosetting adhesive.

(4)複層フィルム10に備えられる、保護フィルム4、加飾フィルム3、及びダミーフィルムは、夫々複数であってもよい。複数設けられた同種のフィルムについても、熱硬化性接着剤によって形成された接着層を介して積層される。 (4) There may be a plurality of protective films 4, decorative films 3, and dummy films provided in the multilayer film 10. A plurality of the same type of films are also laminated through an adhesive layer formed of a thermosetting adhesive.

(5)上記の各実施形態では、タッチパネル20〜22の表面を三次元の曲面形状にする例を示したが、タッチパネルの表面は三次元形状であればよく、曲面以外の形状であってもよい。 (5) In each of the above embodiments, an example in which the surfaces of the touch panels 20 to 22 have a three-dimensional curved surface shape has been described. However, the surface of the touch panel may have a three-dimensional shape, and may have a shape other than a curved surface. Good.

(6)上記の各実施形態では、導電層1a,2aを導電フィルム1,2の表面側に形成し、加飾層3aを加飾フィルム3の裏面側に形成した例を示した。しかし、導電層1a,2aは導電フィルム1,2の裏面側に形成してもよい。また、加飾層3aは加飾フィルム3の表面側に形成してもよい。 (6) In each of the above embodiments, the conductive layers 1 a and 2 a are formed on the front surface side of the conductive films 1 and 2, and the decorative layer 3 a is formed on the back surface side of the decorative film 3. However, the conductive layers 1 a and 2 a may be formed on the back side of the conductive films 1 and 2. Further, the decorative layer 3 a may be formed on the surface side of the decorative film 3.

(7)上記の各実施形態では、フィルムインサート法を用いて複層フィルム10とパネル材11とを一体化する例を示したが、フィルムインサート法に代えてTOM工法を用いてもよい。 (7) In each of the above embodiments, the example in which the multilayer film 10 and the panel material 11 are integrated using the film insert method has been shown, but the TOM method may be used instead of the film insert method.

本発明は、自動車、家電製品、電子機器等に設置されるタッチパネルに広く利用することができる。   The present invention can be widely used for touch panels installed in automobiles, home appliances, electronic devices, and the like.

1,2 導電フィルム
1a,2a 導電層
3 加飾フィルム
3a 加飾層
4 保護フィルム
4a 保護層
5,6,7 接着層
10 複層フィルム
11 パネル材
20〜22 タッチパネル
DESCRIPTION OF SYMBOLS 1, 2 Conductive film 1a, 2a Conductive layer 3 Decorative film 3a Decorative layer 4 Protective film 4a Protective layer 5, 6, 7 Adhesive layer 10 Multi-layer film 11 Panel material 20-22 Touch panel

Claims (3)

パネル材と、
前記パネル材の表面に接合され、導電層を有する導電フィルム及び保護フィルムを含む複層フィルムと、を備え、
前記複層フィルムは、各フィルムが熱硬化性接着剤によって形成された接着層を介して積層されるとともに、前記表面に沿う三次元形状に成形されているタッチパネル。
Panel material,
A multilayer film including a conductive film and a protective film bonded to the surface of the panel material and having a conductive layer;
The multilayer film is a touch panel in which each film is laminated through an adhesive layer formed of a thermosetting adhesive and is formed into a three-dimensional shape along the surface.
前記保護フィルムが加飾層を有する加飾フィルムである請求項1に記載のタッチパネル。   The touch panel according to claim 1, wherein the protective film is a decorative film having a decorative layer. 導電層を有する導電フィルム及び保護フィルムを熱硬化性接着剤によって形成された接着層を介して積層して複層フィルムを作成するフィルム作成工程と、
前記複層フィルムを加熱しつつ三次元形状に変形させるフィルム成形工程と、
成形後の前記複層フィルムを射出成形用の金型に配置し、前記金型内に溶融樹脂を射出してパネル材を成形すると共に、前記複層フィルムと前記パネル材とを一体化するパネル一体化工程と、を有するタッチパネルの製造方法。
A film forming step of forming a multilayer film by laminating a conductive film having a conductive layer and a protective film via an adhesive layer formed of a thermosetting adhesive;
A film forming step of deforming into a three-dimensional shape while heating the multilayer film;
A panel in which the multilayer film after molding is placed in a mold for injection molding, a molten resin is injected into the mold to mold a panel material, and the multilayer film and the panel material are integrated. A touch panel manufacturing method comprising: an integration step.
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