JP2016134378A - Module holding member, substrate and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress increase in cost for preventing wrong insertion, by blocking short circuit in a slot occurring when an IC module is mis-inserted, in an electronic apparatus where a first slot for IC module and a second slot are arranged side by side.SOLUTION: A module holding member 30 for holding an IC module inserted into the first slot of an electronic apparatus where a first slot for IC module and a second slot 12 are arranged closely each other is provided with an over intrusion prevention part 32 which limits the intrusion length of the module holding member 30 for the second slot 12 to a predetermined length or less.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a module holding member that holds an IC (Integrated Circuit) module that is inserted into one slot of an electronic device in which a plurality of slots into which various modules are inserted are arranged close to each other. The present invention relates to a substrate disposed and an electronic device on which the substrate is mounted.

  Conventionally, in a mobile terminal such as a smartphone, a SIM card (Subscriber Identity Module Card) for recording a unique ID (identification) number for specifying a telephone number is used. This SIM card is normally accommodated in a SIM tray, and this SIM tray is inserted into a slot for a SIM card provided in a portable terminal.

  On the other hand, today, mobile terminals such as smartphones are becoming thinner, and SIM card slots and SD (Secure Digital) card slots are often arranged in close proximity. For this reason, there is a problem that the number of cases where the SIM tray is erroneously inserted into the slot for the SD card is increasing.

  Japanese Patent Application Laid-Open No. 2004-228561 discloses a technique for performing the mounting state of an IC card by monitoring a voltage applied to a voltage check terminal.

JP 11-306295 A (published November 5, 1999)

  When the SIM tray is mistakenly inserted into the slot for the SD card in the portable terminal in which the slot for the SIM card and the slot for the SD card are arranged close to each other, the following problems occur. Arise.

  For example, an SD card insertion detection switch is provided at the back of the SD card slot, and if this insertion detection switch is activated due to erroneous insertion of the SIM card, the power of the portable terminal is turned off. It will be in a state where it can be input. Further, when the power is turned on with the SIM card inserted into the SD card slot, there is a possibility that a short circuit may occur between a plurality of terminals provided in the SD card slot due to the electrode of the SIM card. Yes (see FIG. 6).

  In addition, the technique disclosed in Patent Document 1 has a problem in that a CPU (Central Processing Unit) or the like for determining whether or not there is an erroneous insertion is separately required, and the cost for preventing the erroneous insertion is increased. Furthermore, in the technique disclosed in the same document, if the insertion detection switch is activated, the power supply from the power source is started, so as a solution to the problem that occurs when a foreign object is erroneously inserted. Is insufficient.

  The present invention has been made in view of the above problems, and an object of the present invention is to prevent a short circuit between terminals in a slot that occurs when an IC module is erroneously inserted, and to prevent erroneous insertion. It is in providing the module holding member etc. which can suppress the increase in this.

  In order to solve the above-described problem, a module holding member according to an aspect of the present invention is the electronic device in which the first slot for the IC module and the second slot are arranged in close proximity to each other. A module holding member for holding an IC module to be inserted into the slot, wherein an over-intrusion preventing portion is provided to suppress an intrusion length of the module holding member with respect to the second slot to a predetermined length or less. Yes.

  According to one aspect of the present invention, it is possible to prevent a short circuit between terminals in a slot that occurs when an IC module is erroneously inserted, and to suppress an increase in cost for preventing erroneous insertion.

It is a figure which shows the structure of the SIM tray and SD slot concerning Embodiment 1 of this invention, (a) is a figure which shows the structure of the said SIM tray, (b) is a figure which shows the structure of the said SD slot (C) is a diagram showing a state when the SIM tray is inserted into the SD slot. It is a figure which shows the structure of the smart phone which concerns on Embodiment 1 of this invention, (a) is a figure which shows a state when the module corresponding to each of an SD slot, a SIM slot, and an IMEI slot is not inserted. (B) is a figure which shows the state in which the SIM tray and the SD card are inserted in each of the SIM slot and the SD slot, and (c) is a figure which shows the state in which the IMEI tray is inserted in the IMEI slot. It is. It is a figure which shows the structure of the said smart phone, (a) is a figure which shows the state in which the SIM tray is inserted in the SIM slot, (b) is the state in which the SIM tray is erroneously inserted in the SD slot. FIG. (A) is a figure which shows the prior art example of a nanoSIM tray, (b) is a figure which shows the prior art example of a nanoSIM card, (c) is a figure which shows the prior art example of a microSD card, (d (A) is a figure which shows the prior art example of a SIM card, (e) is a figure which shows the prior art example of a SIM card and a SIM tray, (f) is a figure which shows the prior art example of an SD card. (A) is a figure which shows a state when an SD card is inserted into the SD slot, (b) is a figure which shows a state when a SIM tray is inserted into the SIM slot, and (c) is an SD card. It is a figure which shows a state when the conventional SIM tray is inserted in a slot, (d) is a figure which shows a state when the SIM tray which concerns on Embodiment 2 of this invention is inserted in SD slot. It is a figure which shows the structure of the conventional SIM tray and SD slot, (a) is a figure which shows the structure of the conventional SD slot, (b) is a figure which shows the structure of the conventional SIM tray, c) is a diagram showing a state when the SIM tray is erroneously inserted into the SD slot.

  The embodiment of the present invention will be described below with reference to FIGS. Hereinafter, for convenience of explanation, components having the same functions as those described in the specific embodiment may be denoted by the same reference numerals and description thereof may be omitted. In addition, the shape of the configuration described in each drawing and the dimensions such as length, size, and width do not reflect the actual shape and dimensions, and are appropriately set for clarity and simplification of the drawings. It has changed.

  Furthermore, a smartphone will be described below as an example of the electronic device according to one embodiment of the present invention. However, the form which embodies this invention is not limited to a smart phone. For example, any electronic device may be used as long as a plurality of slots into which various modules are inserted are arranged close to each other.

Embodiment 1
Hereinafter, the structure of the SIM tray (module holding member) 30 and the SD slot (second slot) 12 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1A shows the structure of the SIM tray 30. FIG. The SIM tray 30 is a smartphone in which a SIM slot (first slot) 11 for a SIM card, which will be described later, and an SD slot 12 for an SD card having an insertion width different from the SIM slot 11 are arranged close to each other ( This is a member for holding a SIM card (IC module) 31 inserted into the SIM slot 11 of the electronic device 10 (see FIG. 2). An electrode 33 is exposed on the front side of the SIM card 31.

  On the upper part (end part on the non-insertion side) of the SIM tray 30, a handle part to be gripped by the user's hand is formed, and between the right end of this handle part and the right side surface of the SIM tray 30, An excessive entry preventing portion 32 having a protruding structure is formed. The excessive intrusion prevention unit 32 is provided in order to keep the intrusion length of the SIM tray 30 into an SD slot 12 (described later) below a predetermined length. As described later, since a short-circuit between terminals in the SD slot 12 can be prevented by a simple method of providing a protruding structure on the side surface of the SIM tray 30 as described later, the cost for preventing erroneous insertion is reduced. Can be suppressed.

  As shown in FIG. 1A, the penetration length of the SIM tray 30 with respect to the SD slot 12 when the excessive entry prevention portion 32 is not provided is substantially equal to the width d1. On the other hand, the penetration length of the SIM tray 30 with respect to the SD slot 12 when the excessive entry prevention portion 32 is provided is substantially equal to the width d2. When the width d2 <the width d1 and the over-intrusion prevention unit 32 is provided, the invasion length with respect to the SD slot 12 is the invasion when the over-invasion prevention unit 32 is not provided. Shorter than the length.

  Next, FIG. 1B shows the structure of the SD slot 12. As shown in the figure, an insertion detection switch (insertion detection unit) 13 is disposed on the inner side of the SD slot 12. When the insertion detection switch 13 is pressed (ON), power is supplied from the power source to the plurality of electrodes 14 for reading the SD card. Further, a plurality of electrodes 14 are further arranged on the inner side of the SD slot 12. The width d3 is the (module) insertion width of the SD slot 12, and the width d4 is the distance between the surface including the insertion side wall surface SUF and the insertion detection switch 13.

  As described above, the SIM tray 30 is provided with the excessive intrusion prevention unit 32. Therefore, by setting the above-described predetermined length (for example, the width d2 shown in FIG. 1A) to an appropriate length (for example, less than the width d4 shown in FIG. 1B), it will be described later. As described above, when the SIM tray 30 is erroneously inserted into the SD slot 12, the tip a of the SIM tray 30 can be prevented from coming into contact with the insertion detection switch 13 provided at the back of the SD slot 12. . For this reason, it can prevent that it will be in the state in which the power supply of the smart phone 10 mentioned later can be turned on. Further, by setting the above-mentioned predetermined length to an appropriate length, as will be described later, the electrode 33 of the SIM card 31 erroneously inserted and the electrode 14 provided in the back of the SD slot 12 are in contact with each other. Can be prevented. For this reason, even if the power is turned on, no current flows between the electrode 33 of the SIM card 31 and the electrode 14 of the SD slot 12. As described above, it is possible to prevent a short circuit between the terminals in the SD slot 12 that occurs when the SIM tray 30 is erroneously inserted.

  Further, according to the above configuration, the short circuit between the terminals in the SD slot 12 can be prevented by a simple method of providing the over-intrusion prevention unit 32 in the SIM tray 30, so that the cost for preventing erroneous insertion can be reduced. Increase can be suppressed. As described above, it is possible to prevent a short circuit between terminals in the slot that occurs when the SIM tray 30 is erroneously inserted, and to suppress an increase in cost for preventing erroneous insertion.

  Next, FIG. 1C is a diagram showing a state when the SIM tray 30 is inserted into the SD slot 12. Note that the SD slot 12 is provided on the substrate 20 as shown in FIG.

  Further, as shown in the figure, the tip a of the SIM tray 30 and the insertion detection switch in a state where the over-intrusion preventing portion 32 and the insertion side wall surface SUF of the SD slot 12 are in contact with each other on the right side surface of the SIM tray 30. A gap is formed between the two. For this reason, when the SIM tray 30 is erroneously inserted into the SD slot 12, the tip of the SIM tray 30 is prevented from coming into contact with the insertion detection switch 13 so that the smartphone 10 can be turned on. can do.

  Further, as shown in the figure, in the state where the over-intrusion prevention part 32 and the insertion side wall surface SUF of the SD slot 12 are in contact with each other on the side surface of the SIM tray 30, the electrode 33 of the SIM card 31 and the SD slot 12 The electrode 14 provided in the back is separated. For this reason, even if the power is turned on, no current flows between the electrode 33 of the SIM card 31 and the electrode 14 of the SD slot 12.

  Next, FIG. 2 is a diagram illustrating a structure of the smartphone 10 according to the first embodiment of the present invention. As shown in FIG. 2A, the smartphone 10 includes a SIM slot (first slot) 11, an SD slot 12, and an IMEI slot 15. In the example shown in the figure, the module corresponding to each slot is not inserted. Further, as shown in the figure, each of the SIM slot 11, the SD slot 12, and the IMEI slot 15 is arranged along a direction perpendicular to a board (not shown) to be mounted. Thereby, the thickness with respect to the direction perpendicular | vertical with respect to a board | substrate of the smart phone 10 with which a board | substrate is mounted can be made small.

  Next, FIG. 2B shows a state where the SIM tray 30 and the SD card 40 are inserted into the SIM slot 11 and the SD slot 12, respectively. On the other hand, FIG. 2C shows a state in which the IMEI tray 50 is inserted into the IMEI (International Mobile Equipment Identity) slot 15. If the SIM tray 30 is inserted into the SIM slot 11 along the IMEI tray 50 inserted into the IMEI slot 15 shown in FIG. can do.

  Next, FIG. 3 is a diagram illustrating the structure of the smartphone 10. FIG. 3A shows a state where the SIM tray 30 is inserted into the SIM slot 11. On the other hand, FIG. 3B shows a state where the SIM tray 30 is erroneously inserted into the SD slot 12. According to the SIM tray 30 described above, even if the SIM tray 30 is erroneously inserted into the SD slot 12 as shown in FIG. 3B, there is no short circuit between the terminals (electrodes 14) in the SD slot 12. .

  Next, as a reference matter, conventional examples of SIM tray, SIM card, and SD card are shown. 4A shows a conventional example of a nanoSIM tray, FIG. 4B shows a conventional example of a nanoSIM card, and FIG. 4C shows a conventional example of a microSD card.

  The nanoSIM card is a size-reduced version that is compatible with the USIM card (SIM card, UIM card) that records contractor information and authentication information, and the small version of the microSIM card. Also called 4FF SIM (4th-Form-Factor SIM).

  FIG. 4D shows a conventional SIM card. The sizes (width x length x thickness) of various SIM cards are as follows. The size of the standard SIM card is width × length × thickness = 15 × 25 × 0.76 mm. The size of the microSIM card is width × length × thickness = 12 × 15 × 0.76 mm. The size of the nanoSIM card is width × length × thickness = 8.8 × 12.3 × 0.67 mm. As shown in FIG. 4E, the SIM card is often inserted into a SIM slot with a SIM tray attached.

  Next, FIG. 4F shows a conventional example of an SD card. microSD is a standard for memory cards, which is a reduction in the size of standard SD cards and is a miniaturization of miniSD cards. The sizes (width x length x thickness) of various SD cards are as follows. The size of a normal SD card is width × length × thickness = 24 × 32 × 2.1 mm. The size of the miniSD card is width × length × thickness = 20 × 21.5 × 1.4 mm. The size of the microSD card is width × length × thickness = 11 × 15 × 1.0 mm.

[Embodiment 2]
Next, based on FIG. 5, the structure of the SIM tray (module holding member) 30a which concerns on Embodiment 2 of this invention is demonstrated. 5 (a) shows a state when a conventional SD card is inserted into the SD slot 12. FIG. FIG. 5B shows a state when a conventional SIM tray is inserted into the SIM slot 11.

  As shown in FIG. 5C, when the conventional SIM tray is erroneously inserted into the SD slot 12, the tip end side of the SIM tray comes into contact with the insertion detection switch, and the insertion detection switch is turned on. Also, a plurality of electrodes arranged in the back of the SD slot 12 come into contact with the SIM card electrode, causing a short circuit between the terminals.

  Therefore, as shown in FIG. 5D, in this embodiment, the width of the knob portion 32a protruding to one end side of the handle portion on the upper side of the SIM tray 30a is compared with the width of the knob portion of the conventional SIM tray. Is getting bigger. For this reason, the tip of the SIM tray 30a is provided in the back of the SD slot 12 when the SIM tray 30a is erroneously inserted into the SD slot 12 by setting the width of the knob portion 32a to an appropriate length. It is possible to prevent contact with the inserted detection switch. For this reason, it can prevent that it will be in the state in which the power supply of the smart phone 10 can be turned on. In addition, by setting the width of the knob portion 32a to an appropriate length, it is possible to prevent the erroneously inserted SIM card electrode from coming into contact with the electrode provided in the back of the SD slot 12. it can. Therefore, even if the power is turned on, no current flows between the SIM card electrode and the SD slot 12 electrode. As described above, it is possible to prevent a short-circuit between the terminals in the SD slot 12 that occurs when the SIM tray 30a is erroneously inserted.

[Summary]
The module holding member according to the first aspect of the present invention holds the IC module inserted into the first slot of the electronic device in which the first slot for the IC module and the second slot are arranged close to each other. The module holding member is configured to be provided with an over-intrusion prevention unit that suppresses an intrusion length of the module holding member with respect to the second slot to a predetermined length or less.

  According to the above configuration, the module holding member is provided with the excessive intrusion prevention unit that suppresses the penetration length of the module holding member into the second slot to a predetermined length or less. Therefore, by setting the predetermined length to an appropriate length, when the IC module is erroneously inserted into the second slot, the insertion detection that the tip of the module holding member is provided in the back of the second slot is detected. It is possible to prevent contact with the part. For this reason, it can be prevented that the electronic device can be turned on. In addition, according to the above configuration, by setting the predetermined length to an appropriate length, it is possible to prevent the erroneously inserted IC module electrode from coming into contact with the electrode provided in the back of the second slot. can do. For this reason, even if the power is turned on, no current flows between the electrode of the IC module and the electrode provided in the back of the second slot. As described above, it is possible to prevent a short circuit between the terminals in the second slot that occurs when the IC module is erroneously inserted.

  In addition, according to the above configuration, since a short circuit between terminals in the slot can be prevented by a simple method of providing an over-intrusion preventing portion on the module holding member, an increase in cost for preventing erroneous insertion is suppressed. can do. As described above, it is possible to prevent a short circuit between terminals in a slot that occurs when an IC module is erroneously inserted, and to suppress an increase in cost for preventing erroneous insertion.

  The module holding member according to the second aspect of the present invention is the module holding member according to the first aspect, wherein the over-intrusion preventing portion and the insertion side wall surface of the second slot are in contact with each other on the side surface of the module holding member. It is preferable that a gap is formed between the tip of the member and the insertion detection unit provided in the back of the second slot. According to the above configuration, between the tip of the module holding member and the insertion detection unit provided in the back of the second slot in a state where the excessive entry prevention unit and the insertion side wall surface of the second slot are in contact with each other. A gap is formed. For this reason, when the IC module is erroneously inserted into the second slot, it is prevented that the tip of the module holding member comes into contact with the insertion detection unit and the electronic device can be turned on. Can do.

  The module holding member according to Aspect 3 of the present invention is the module holding member according to Aspect 1 or 2, wherein the over-intrusion preventing portion and the insertion side wall surface of the second slot are in contact with each other on the side surface of the module holding member. It is preferable that the electrode of the IC module is separated from the electrode provided in the back of the second slot. According to the above configuration, the electrode of the IC module and the electrode provided in the back of the second slot are separated from each other in a state where the over-intrusion preventing portion and the insertion side wall surface of the second slot are in contact with each other. For this reason, even if the power is turned on, no current flows between the electrode of the IC module and the electrode provided in the back of the second slot.

  The module holding member according to aspect 4 of the present invention is the module holding member according to any one of the above aspects 1 to 3, wherein the over-intrusion prevention unit is a member having a protruding structure provided on a side surface of the module holding member. good. According to the above configuration, since a short circuit between terminals in the slot can be prevented by a simple method of providing a protruding structure on the side surface of the module holding member, an increase in cost for preventing erroneous insertion is suppressed. can do.

  It is preferable that the board | substrate which concerns on aspect 5 of this invention is equipped with the said 2nd slot which can insert the module holding member in any one of the said aspects 1-4. According to the above configuration, it is possible to realize a substrate that can prevent a short circuit between terminals in a slot that occurs when an IC module is erroneously inserted, and suppress an increase in cost for preventing erroneous insertion.

  The substrate according to aspect 6 of the present invention is the substrate according to aspect 5, in which each of the first slot and the second slot into which the module holding member can be inserted is perpendicular to the substrate to be mounted. It may be arranged along. According to the said structure, the thickness with respect to the direction perpendicular | vertical with respect to a board | substrate of the electronic device in which a board | substrate is mounted can be made small.

  The electronic device according to aspect 7 of the present invention preferably includes the second slot into which the module holding member according to any one of aspects 1 to 4 can be inserted. According to the above configuration, it is possible to realize an electronic device that can prevent a short circuit between terminals in a slot that occurs when an IC module is erroneously inserted, and suppress an increase in cost for preventing erroneous insertion. .

  The electronic device according to aspect 8 of the present invention is preferably mounted with the substrate of aspect 5 or 6 above. According to the above configuration, it is possible to realize an electronic device that can prevent a short circuit between terminals in a slot that occurs when an IC module is erroneously inserted, and suppress an increase in cost for preventing erroneous insertion. .

[Additional Notes]
The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention. Furthermore, a new technical feature can be formed by combining the technical means disclosed in each embodiment.

  The present invention relates to a module holding member that holds an IC module inserted into one slot of an electronic device in which a plurality of slots into which various modules are inserted are arranged close to each other, and a substrate on which the plurality of slots are arranged , And can be used for electronic devices on which the substrate is mounted.

10 Smartphone (electronic equipment)
11 SIM slot (first slot)
12 SD slot (second slot)
13 Insertion detection switch (insertion detection unit)
14 Electrode 20 Substrate 30 SIM tray (module holding member)
30a SIM tray (module holding member)
31 SIM card (IC module)
32 Over-intrusion prevention part (protruding structure)
32a Knob part (over-intrusion prevention part)
33 Electrode a Tip SUF Insertion side wall

Claims (8)

A module holding member for holding an IC module inserted into the first slot of an electronic device in which a first slot for an IC module and a second slot are arranged close to each other,
The module holding member, wherein an over-intrusion preventing portion that suppresses an intrusion length of the module holding member with respect to the second slot to a predetermined length or less is provided.   Insertion detection provided at the tip of the module holding member and at the back of the second slot in a state where the over-intrusion prevention portion and the insertion side wall surface of the second slot are in contact with each other on the side surface of the module holding member The module holding member according to claim 1, wherein a gap is formed between the first and second portions.   The electrode of the IC module and the electrode provided in the back of the second slot are in a state where the over-intrusion preventing portion and the insertion side wall surface of the second slot are in contact with each other on the side surface of the module holding member. The module holding member according to claim 1, wherein the module holding member is separated.   The module holding member according to any one of claims 1 to 3, wherein the over-intrusion preventing portion is a member having a projecting structure provided on a side surface of the module holding member.   A board comprising the second slot into which the module holding member according to any one of claims 1 to 4 can be inserted.   6. The first slot and the second slot into which the module holding member can be inserted are arranged along a direction perpendicular to the board to be mounted. The substrate described in 1.   An electronic apparatus comprising the second slot into which the module holding member according to any one of claims 1 to 4 can be inserted.   An electronic device, wherein the substrate according to claim 5 is mounted.

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