JP2016125933A - Probe unit and inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cause two probe pins to surely probe with respect to a probing object.SOLUTION: A probe unit comprises: holding units 12a and 12b which hold each of probe pins 13a and 13b by means of respective tip ends 21a and 21b, respectively in a state where each contact side end of the probe pins 13a and 13b gets close to each other, and in which respective base ends 22a and 22b are anchored to an anchoring part 10. Each of the holding units 12a and 12b is configured to allow each of the probe pins 13a and 13b to be held so that each of the probe pins 13a and 13b are lined along a first direction B corresponding to a synthesis direction of each of running directions A1 and A2 of each of the holding parts 12a and 12b toward the respective tip ends 21a and 21b from the respective base ends 22a and 22b, and when observing each of the probe pins 13a and 13b in a first orientation toward an upstream side from a downstream side in the first direction B, each of the probe pins 13a and 13b are overlapped.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a probe unit including a pair of holding portions that respectively hold a pair of probe pins, and an inspection apparatus including the probe unit.

  As this type of probe unit, a probe unit disclosed by the applicant in Patent Document 1 below is known. The probe unit includes a pair of contact probes and a probe holding portion to which each contact probe is fixed. Each contact probe includes a probe pin and a holder that is configured by a link mechanism and holds the probe pin at the tip. In this probe unit, since each contact probe is fixed, a pair of probe pins can be moved together to probe each probe pin at one time with respect to one probing target. In this case, in this probe unit, when the two probe pins are viewed from the front side of the front end portion of each holder, each holder holds each probe pin so that each probe pin forms a V shape. (Refer to FIG. 15). With this configuration, the tip portions of the probe pins can be held close to each other.

JP 2006-330006 A (page 5-6, FIG. 1)

  However, the above probe unit has the following problems to be improved. That is, in this probe unit, since each probe pin is held so as to form a V shape when viewed from the front, a component is disposed near the pad or land on the substrate, or a cavity in which a recess is formed. When pads or lands are provided in the vicinity of the wall surface of the bottom surface of the concave portion of the substrate, inconvenience may occur when probing is performed using these pads or lands as probing targets. Specifically, as shown in FIG. 15, when a pad 103 is provided in the vicinity of a wall 104 in a cavity substrate 100 having a recess (cavity) 101, two probes 201 are probed to the pad 103. When trying to do so, one of the two probes 201 (the probe 201 on the right side in the figure) may come into contact with the wall portion 104, and at this time, it is difficult to probe each probe 201 with respect to the pad 103. There is a risk.

  The present invention has been made in view of such a problem to be improved, and a main object of the present invention is to provide a probe unit and an inspection apparatus that can reliably probe two probe pins to a probing target.

  In order to achieve the above object, the probe unit according to claim 1 is configured such that each of the contact-side ends of the pair of probe pins holds each of the probe pins at each of the distal ends in a state of being close to each other, and each of the proximal ends. The probe unit includes a pair of holding parts fixed to the fixing part, and is configured to be capable of probing the probe pins together with a probing target, and the holding parts are respectively provided from the base end parts. The probe pins are arranged along a first direction corresponding to the combined direction of the extending directions of the holding portions toward the tip of the first portion, and the first direction from the downstream side to the upstream side in the first direction. The probe pins can be held so that the probe pins overlap each other when the probe pins are viewed in the direction.

  Further, the probe unit according to claim 2 is the probe unit according to claim 1, wherein each of the holding portions is in contact with and separated from the probing object when the probe pins are viewed in the first direction. Each probe pin is configured to be held so that each probe pin extends along the direction in which the probe pin extends.

  Further, the probe unit according to claim 3 is the probe unit according to claim 1 or 2, wherein the holding portions are viewed from the probe pins along a second direction orthogonal to the first direction. The probe pins can be held so that the probe pins are inclined at an acute angle with respect to the first direction.

  A probe unit according to a fourth aspect is the probe unit according to any one of the first to third aspects, wherein the holding portions are configured to hold the probe pins having the same length.

  The probe unit according to claim 5 is the probe unit according to any one of claims 1 to 4, wherein each of the holding portions is joined to each other by a joining portion in which the tip portions are elastic. .

  An inspection apparatus according to a sixth aspect includes a probe unit according to any one of the first to fifth aspects, and an inspection unit that inspects an inspection object based on an electric signal input and output via the probe pin of the probe unit. It has.

  The probe unit according to claim 1 and the inspection apparatus according to claim 6, wherein the probe pins are arranged along a first direction corresponding to a combined direction of the extending directions of the holding portions and are downstream in the first direction. Each holding portion is configured to be able to hold each probe pin so that the probe pins overlap each other when viewed in the first direction from the side toward the upstream side. Therefore, according to the probe unit and the inspection apparatus, for example, the probing target is provided in the vicinity of the wall portion forming the concave portion in the cavity substrate having the concave portion (that is, an obstacle exists in the vicinity of the probing target). ) Even in the case, the probe pin can be surely probed to the probing object without bringing the probe pin into contact with the wall (obstacle).

  Further, in the probe unit according to claim 2 and the inspection apparatus according to claim 6, each probe pin is arranged along a direction in which the probe pin comes in contact with and separates from the probing target when the probe pin is viewed in the first direction. Each holding portion is configured to be able to hold each probe pin so as to extend. Therefore, according to the probe unit and the inspection apparatus, even if an obstacle exists in the vicinity of either the right side or the left side of the probing object from the downstream side in the first direction toward the upstream side, The probe pin can be reliably probed to the probing object without bringing the probe pin into contact with an object.

  Further, in the probe unit according to claim 3 and the inspection apparatus according to claim 6, when the probe pins are viewed along the second direction orthogonal to the first direction, each probe pin is in the first direction. Each holding portion is configured to hold each probe pin so as to be inclined at an acute angle. For this reason, according to this probe unit and inspection apparatus, the contact side end of each probe pin in one probe unit and the contact side end of each probe pin in another one probe unit are in contact with each other. As a result, the contact side end portions of the probe pins in the two probe units can be reliably probing to the two probing objects in proximity without contacting each other.

  In the probe unit according to claim 4 and the inspection apparatus according to claim 6, each holding portion is configured to hold each probe pin having the same length. Therefore, according to the probe unit and the inspection apparatus, unlike the configuration using two probe pins having different lengths, the mechanical characteristics of each probe pin can be equalized. As a result, the amount of elastic deformation and the vibration state can be made equal (or substantially equal), so that each probe pin can be stably probed.

  Further, in the probe unit according to claim 5 and the inspection apparatus according to claim 6, the tip portions of the holding portions are joined to each other by a joint portion having elasticity. For this reason, according to the probe unit and the inspection apparatus, it is possible to equalize (or substantially equal) the amount of movement and the vibration state of each tip portion of each holding portion, thereby probing each probe pin more stably. be able to. In addition, according to the probe unit and the inspection apparatus, since the joint portion has elasticity, the respective distal end portions of the respective holding portions are allowed to be somewhat separated from each other, and the respective probes that are respectively held at the respective distal end portions. As a result of the pins being able to be spaced apart somewhat, for example, both probe pins can be reliably probed with respect to a probing target having a curved surface (the surface is not flat).

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. 2 is a perspective view of a probe unit 3. FIG. FIG. 3 is a perspective view of a fixing unit 10. It is the perspective view which looked at the front of the probe unit 3 from the slightly upper direction. 3 is a side view of the probe unit 3. FIG. 2 is a plan view of the probe unit 3. FIG. It is a side view of the holding | maintenance part 12a. It is a side view of the holding | maintenance part 12b. FIG. 3 is a first explanatory view explaining how to use the probe unit 3. It is the 2nd explanatory view explaining how to use probe unit. It is a perspective view explaining the structure of 3 A of probe units. It is explanatory drawing explaining operation | movement of the probe unit 3A at the time of use. 4 is a side view illustrating the configuration of a probe unit 203. FIG. 4 is a side view illustrating the configuration of a probe unit 303. FIG. It is explanatory drawing explaining the structure of the conventional probe unit.

  Hereinafter, embodiments of a probe unit and an inspection apparatus will be described with reference to the accompanying drawings.

  First, the configuration of the substrate inspection apparatus 1 as an example of the inspection apparatus will be described. A substrate inspection apparatus 1 shown in FIG. 1 is an inspection apparatus for inspecting an inspection target (for example, the cavity substrate 100 shown in FIG. 1 and FIG. 9), and includes a substrate fixing base 2, a pair of probe units 3, and a pair of probing mechanisms. 4, the measurement part 5, the operation part 6, the memory | storage part 7, and the control part 8 are comprised.

  The substrate fixing base 2 is configured to be able to place the cavity substrate 100 to be inspected, and is configured to be able to fix the cavity substrate 100 by a clamp not shown.

  As shown in FIG. 2, each probe unit 3 includes a fixed portion 10, a substrate 11, a pair of holding portions 12a and 12b (hereinafter also referred to as “holding portion 12” when not distinguished), and a pair of probe pins 13a and 13b. (Hereinafter also referred to as “probe pins 13” when not distinguished), and each probe pin 13 can be probed together (at a time) to a probing target (for example, the pad 103 of the cavity substrate 100 shown in FIG. 9). It is configured.

  As shown in FIG. 4, the fixing portion 10 is configured to be able to fix base end portions 22 a and 22 b (hereinafter, also referred to as “base end portion 22” when not distinguished) of the holding portions 12 a and 12 b. Further, as shown in FIG. 3, the fixing portion 10 is formed so that the width becomes narrower from the one end portion side (the back side in the drawing) to the other end portion (the front side in the drawing). As shown in FIG. 4, the holding portions 12 a and 12 b in which the base end portions 22 a and 22 b are fixed to the fixing portion 10 are respectively tip portions 21 a and 21 b (hereinafter, also referred to as “tip portion 21” when not distinguished). The postures that are close to each other are maintained as heading toward.

  As shown in FIG. 2, the substrate 11 is formed in a plate shape, and one end portion (the lower end portion in the figure) is fixed to the fixing portion 10. In addition, the other end portion (upper end portion in the figure) of the substrate 11 is fixed to a mounting portion (not shown) in the probing mechanism 4. Moreover, the board | substrate 11 is comprised so that it can electrically connect with the probe pin 13 via the conducting wire outside a figure. In addition, illustration of the board | substrate 11 is abbreviate | omitted in FIGS.

  As shown in FIGS. 4 to 6, the holding portion 12 a is configured to be able to hold the probe pin 13 a by the distal end portion 21 a and is configured to be able to fix the base end portion 22 a to the fixing portion 10 (FIG. 5). Then, illustration of the fixing | fixed part 10 is abbreviate | omitted). Specifically, as shown in FIG. 7, the holding portion 12 a includes a base portion 121 a that is fixed to the fixing portion 10, and a pair of arm portions 122 a and 123 a that have base ends connected to the base portion 121 a. The arm portions 122a and 123a are connected to each other and connected to the connecting portion 124a for holding the probe pin 13a. In this case, each base end part (each connection part with base part 121a) of arm parts 122a and 123a and each tip part (each connection part with connection part 124a) of arm parts 122a and 123a are from other parts. Is also thinly formed and is easily elastically deformed. For this reason, the holding portion 12a has a four-bar linkage mechanism in which the arm portions 122a and 123a correspond to links (nodes), and the base end portions and the distal end portions of the arm portions 122a and 123a correspond to joints (joints or fulcrums). Function as.

  As shown in FIGS. 4 to 6, the holding portion 12 b is configured so that the probe pin 13 b can be held by the distal end portion 21 b and the base end portion 22 b can be fixed to the fixing portion 10. Specifically, as shown in FIG. 8, the holding part 12b includes a base part 121b fixed to the fixing part 10, and a pair of arm parts 122b and 123b each having a base end connected to the base part 121b. The arm portions 122b and 123b are connected to each other and connected to the connecting portion 124b for holding the probe pin 13b. In this case, each base end part (each connection part with the base part 121b) of the arm parts 122b and 123b and each front end part (each connection part with the connection part 124b) of the arm parts 122b and 123b are more than other parts. Is also thinly formed and is easily elastically deformed. For this reason, the holding | maintenance part 12b functions as a four-bar linkage mechanism similarly to the holding | maintenance part 12a.

  As shown in FIGS. 4, 5, 7, and 8, the probe pins 13 a and 13 b have a cylindrical shape in which tip portions 31 a and 31 b (hereinafter, also referred to as “tip portion 31” when not distinguished) form a conical shape (taper shape). The base end portions 32a and 32b are respectively held by the connecting portions 124a and 124b of the holding portions 12a and 12b. In this case, in this probe unit 3, probe pins 13a and 13b having the same length are used.

  Here, in this probe unit 3, as shown in FIG. 5, each holding portion 12 is configured to hold each probe pin 13 in a state where the tip portions 31 of each probe pin 13 are close to each other. Yes. Further, in this probe unit 3, as shown in FIG. 6, the extending direction A1 of the holding portion 12a (arm portions 122a, 123a) from the base end portion 22a toward the tip end portion 21a, and the base end portion 22b to the tip end portion 21b. The probe pins 13 are arranged along the first direction B corresponding to the combined direction of the extending direction A2 of the holding portion 12b (arm portions 122b, 123b) toward the downstream side, and the downstream B1 side in the first direction B (see FIG. 5). 4), each probe pin 13 can be held so that the probe pins 13 overlap each other as shown in FIG. 4 when viewed in the first direction toward the upstream B2 side (see the same figure). Each holding part 12 is configured respectively.

  Further, in this probe unit 3, as shown in FIG. 4, when each probe pin 13 is viewed in the first direction described above, the direction in which each probe pin 13 is brought into contact with or separated from the probing target during probing ( Z-direction: a state in which each probe pin 13 extends along the direction perpendicular to the surface of the cavity substrate 100 fixed to the substrate fixing base 2 (that is, each probe pin 13 is relative to the surface of the cavity substrate 100) Each holding portion 12 is configured to hold each probe pin 13 in a vertical state.

  Moreover, in this probe unit 3, when each probe pin 13 is viewed along the second direction C (see FIG. 6) orthogonal to the first direction B, as shown in FIG. Each holding portion 12 is configured to hold each probe pin 13 so that 13 is inclined at an acute angle (an angle smaller than a right angle) with respect to the first direction B. More specifically, each holding portion 12 is located on the downstream B1 side in the first direction B of the probe pins 13 when the probe pins 13 are viewed along the second direction C described above. The inclination angle θ2 (see FIG. 5) of one probe pin 13 (in this example, probe pin 13b) with respect to the first direction B is the inclination of the other probe pin 13 (in this example, probe pin 13a) with respect to the first direction B. Each probe pin 13 can be held in a state larger than the angle θ1 (see the same figure).

  Further, in the probe unit 3, the probe pins 13a and 13b having the same length are used as described above, and the probe pins 13a and 13b having the same length are used as described above (in the first direction, each probe pin 13 The holding portions 12a and 12b are configured to be able to hold the probe pins 13 so that the probe pins 13 overlap each other when viewing 13.

  Each probing mechanism 4 executes a probing process under the control of the control unit 8. In this case, in the probing process, the probing mechanism 4 is moved in the direction along the surface of the cavity substrate 100 fixed to the substrate fixing base 2 (XY direction) and in the direction of contacting and separating from the cavity substrate 100 (Z direction). The probe unit 3 is moved, and each tip 31 of each probe pin 13 in the probe unit 3 is probed to the pad 103 (see FIG. 9) of the cavity substrate 100 as a probing target.

  The measurement unit 5 is connected to the pad 103 based on an electrical signal input / output via each probe pin 13 of the probe unit 3 probed to the pad 103 of the cavity substrate 100 under the control of the control unit 8. A measurement process for measuring a resistance value (amount to be measured) of a conductor pattern (not shown) is executed.

  The operation unit 6 includes various switches and keys, and outputs an operation signal when these are operated. The storage unit 7 stores position data indicating the position of the pad 103 to be probed (the probe pin 13 of the probe unit 3 should be probed). Further, the storage unit 7 stores a reference value of a resistance value used for inspection of the cavity substrate 100 (a conductor pattern (not shown) formed on the cavity substrate 100).

  The control unit 8 controls the probing mechanism 4 and the measurement unit 5. The control unit 8 functions as an inspection unit together with the measurement unit 5 and inspects the cavity substrate 100 based on the resistance value measured by the measurement unit 5.

  Next, a method for inspecting the cavity substrate 100 as an inspection object using the substrate inspection apparatus 1 and the operation of each part of the substrate inspection apparatus 1 at that time will be described with reference to the drawings. As shown in FIG. 9, the cavity substrate 100 is formed with a recess 101 (cavity) for housing (mounting) electrical components, and the bottom surface 102 of the recess 101 is connected to a conductor pattern. It is assumed that a target pad 103 is provided.

  First, as shown in FIG. 1, the cavity substrate 100 is mounted on the substrate fixing base 2, and then the cavity substrate 100 is fixed by a clamp outside the drawing. Subsequently, the operation unit 6 is operated to instruct the start of inspection. At this time, the operation unit 6 outputs an operation signal, and the control unit 8 executes an inspection process according to the operation signal. In this inspection process, the control unit 8 reads position data from the storage unit 7, and the storage unit 7 specifies the position of the pad 103 to be probed based on the position data.

  Next, the control unit 8 controls each probing mechanism 4 to execute a probing process. In this probing process, the probing mechanism 4 moves the probe unit 3 in the direction along the surface of the cavity substrate 100 fixed to the substrate fixing base 2, and sets each probe pin 13 above the pad 103 to be probed. Each tip 31 is positioned. Subsequently, as shown in FIG. 9, the probing mechanism 4 moves the probe unit 3 in the Z direction close to the cavity substrate 100 to cause each probe pin 13 to be probed to the pad 103 of the cavity substrate 100 as a probing target. .

  Here, in the probe unit 3, as described above, the probe pins 13 are arranged along the first direction B, and the probe pins 13 overlap when the probe pins 13 are viewed in the first direction. Thus, each probe pin 13 is held. For this reason, as shown in FIG. 9, even when the pad 103 is provided in the vicinity of the wall 104 constituting the recess 101 of the cavity substrate 100, the probe pin 13 is not brought into contact with the wall 104 (wall). The probe pin 13 can be probed to the pad 103 by bringing the probe pin 13 sufficiently close to the portion 104.

  In the probe unit 3, as described above, each probe pin 13 is held so as to extend along the Z direction (direction perpendicular to the surface of the cavity substrate 100). Therefore, there is a wall 104 that becomes an obstacle in the vicinity of either the right or left side of the pad 103 from the downstream B1 side (see FIG. 5) in the first direction B toward the upstream B2 side (see FIG. 5). Even if it does (refer FIG. 9), it is possible to make each probe pin 13 probe to the pad 103, without contacting each probe pin 13 to each wall part 104. FIG.

  Further, in the probe unit 3, as described above, each probe pin 13 is held so as to be inclined at an acute angle with respect to the first direction B. For this reason, as shown in FIG. 10, each probe pin 13 of one probe unit 3 and each probe pin 13 of another probe unit 3 can be brought close to each other without being brought into contact with each other. It is possible to probe each probe pin 13 to one pad 103.

  In the probe unit 3, as described above, two probe pins 13 having the same length are used. In this case, for example, in the configuration in which the lengths of the two probe pins 13 are different, the mechanical characteristics of each probe pin 13 are different, so that the amount of elastic deformation of each probe pin 13 during probing is different from each other, The probe pins 13 may have different vibration states (frequency characteristics), which may make stable probing difficult. On the other hand, in this configuration in which the lengths of the probe pins 13 are equal, the mechanical characteristics of the probe pins 13 can be made equal, so that each probe pin 13 can be stably probed. Yes.

  On the other hand, the control unit 8 controls the signal supply unit (not shown) to output an electrical signal for inspection in a state where each probe pin 13 is probed to the pad 103 of the cavity substrate 100. Next, the control unit 8 controls the measurement unit 5 to execute measurement processing. In this measurement process, the measurement unit 5 measures the resistance value of a conductor pattern (not shown) connected to the pad 103 based on an electric signal input / output via each probe pin 13.

  Subsequently, the control unit 8 reads the reference value of the resistance value from the storage unit 7, compares the resistance value measured by the measuring unit 5 with the reference value, and inspects the quality of the conductor pattern (disconnection or short circuit). . Next, the control unit 8 causes the display unit (not shown) to display the inspection result and causes the storage unit 7 to store the inspection result.

  In this case, in this board inspection apparatus 1, as described above, each probe pin 13 can be reliably probed to the pad 103 to be probed. Therefore, the substrate inspection apparatus 1 can accurately inspect the cavity substrate 100.

  As described above, in the probe unit 3 and the board inspection apparatus 1, the probe pins 13 are arranged along the first direction B corresponding to the combined direction of the extending directions of the holding portions 12, and in the first direction B. Each holding portion 12 is configured to hold each probe pin 13 so that the probe pins 13 overlap each other when the probe pins 13 are viewed in the first direction from the downstream B1 side to the upstream B2 side. . Therefore, according to the probe unit 3 and the substrate inspection apparatus 1, for example, the pad 103 is provided in the vicinity of the wall portion 104 that forms the concave portion 101 of the cavity substrate 100 (that is, an obstacle in the vicinity of the probing target). Even when the probe pin 13 is not in contact with the wall portion 104 (obstacle), the probe pin 13 can be reliably probed to the pad 103.

  Moreover, in this probe unit 3 and the board | substrate inspection apparatus 1, when each probe pin 13 is viewed in a 1st direction, each probe pin 13 is extended along the Z direction which contacts / separates with respect to the pad 103. The holding portion 12 is configured to hold each probe pin 13. Therefore, according to the probe unit 3 and the substrate inspection apparatus 1, the wall portion that becomes an obstacle in the vicinity of either the right side or the left side of the pad 103 from the downstream B1 side in the first direction B toward the upstream B2 side. Even if 104 exists, the probe pin 13 can be reliably probed to the pad 103 without bringing the probe pin 13 into contact with each wall portion 104.

  In the probe unit 3 and the substrate inspection apparatus 1, each probe pin 13 has an acute angle with respect to the first direction B when the probe pin 13 is viewed along the second direction C orthogonal to the first direction B. Each holding portion 12 is configured to be able to hold each probe pin 13 so as to be inclined to each other. For this reason, according to the probe unit 3 and the substrate inspection apparatus 1, each tip 31 of each probe pin 13 in one probe unit 3 and each tip 31 of each probe pin 13 in another one probe unit 3 As a result, the tips 31 of the probe pins 13 in the two probe units 3 can be reliably brought into contact with the two adjacent pads 103 without contacting each other. Can be probing.

  Moreover, in this probe unit 3 and the board | substrate inspection apparatus 1, each holding part 12 is comprised so that each probe pin 13 of the same length can be hold | maintained. For this reason, according to the probe unit 3 and the substrate inspection apparatus 1, unlike the configuration using two probe pins 13 having different lengths, the mechanical characteristics of the probe pins 13 can be equalized. As a result, the amount of elastic deformation and vibration state of each probe pin 13 can be made equal (or substantially equal), so that each probe pin 13 can be stably probed.

  The probe unit and the circuit board inspection apparatus are not limited to the above configuration. For example, the probe unit 3A shown in FIG. 11 and a substrate inspection apparatus provided with the probe unit 3A can be employed. In the following description, the same components as those of the probe unit 3 described above are denoted by the same reference numerals, and redundant description is omitted.

  In the probe unit 3A, as shown in FIG. 11, the distal end portion 21a of the holding portion 12a and the distal end portion 21b of the holding portion 12b are joined to each other by an elastic joining portion 14. For example, the bonding portion 14 is cured by applying a moisture-curing type silicone adhesive, an addition-curing type (heat-curing type) silicone adhesive, an ultraviolet-curing type silicone adhesive, or the like to the tip portions 21a and 21b. It is formed by making it (rubbery). In addition, the junction part 14 of the shape which can be fitted in each front-end | tip part 21a, 21b is formed with elastic materials, such as rubber | gum, This joint part 14 is fitted in each front-end | tip part 21a, 21b, and front-end | tip part 21a, 21b mutually mutually It can also be joined.

  According to the probe unit 3A, the tip portions 21a and 21b of the holding portions 12a and 12b are joined to each other by the joint portion 14, so that the movement amount and vibration state of the tip portions 21a and 21b are equal (or As a result, each probe pin 13 can be probed more stably.

  In this case, in the configuration in which the tip portions 21a and 21b are joined to each other by the joint portion 14 which is not easily elastically deformed, the tip portions 21a and 21b are difficult to be separated from each other, and thus each probe pin held by the tip portions 21a and 21b. 13 is also difficult to be separated. For this reason, in such a configuration, for example, as shown in FIG. 12, when probing each probe pin 13 to a probing target 105 whose surface is curved (the surface is not flat), only one probe pin 13b is the probing target. The probe pin 13a (shown by a broken line in the figure) may be difficult to probe. On the other hand, according to the probe unit 3A, since the joint portion 14 has elasticity, the distal end portions 21a and 21b are allowed to be somewhat separated from each other and are held by the distal end portions 21a and 21b, respectively. As a result of the fact that the probe pins 13 can be somewhat separated from each other, both the probe pins 13 can be reliably probed with respect to the probing target 105 whose surface is curved as shown by the solid line in FIG.

  Also, the probe unit 203 shown in FIG. 13 and a substrate inspection apparatus provided with the probe unit 203 can be employed. The probe unit 203 includes holding portions 212a and 212b (hereinafter, also referred to as “holding portion 212” when not distinguished) in place of the holding portions 12a and 12b of the probe unit 3 described above. It replaces with the fixing | fixed part 10 of the probe unit 3, and is provided with the fixing | fixed part outside a figure which can fix the base end part 222a, 222b of holding | maintenance part 212a, 212b. The probe unit 203 includes probe pins 213a and 213b having different lengths (hereinafter also referred to as “probe pins 213” when not distinguished from each other).

  In the probe unit 203, as shown in FIG. 13, a holding part 212b is disposed above the holding part 212a. In the probe unit 203, the holding portion 212a holds the probe pin 213a having a short length, and the holding portion 212b holds the probe pin 213b having a long length. Also in the probe unit 203, the probe pins 213 are arranged along the first direction B (see the same figure) corresponding to the combined direction of the extending directions of the holding portions 212, and downstream in the first direction B. Each probe pin 213 is held so that the probe pins 213 overlap each other when viewed in the first direction from the B1 side (right side in the figure) toward the upstream B2 side (left side in the figure). Each holding part 212 is configured as possible. For this reason, in this probe unit 203 as well as the probe unit 3, even when an obstacle exists in the vicinity of the probing target, each probe pin 213 is not contacted with the obstacle without contacting each probe pin 213. Probing target can be surely probed.

  In the probe unit 3 described above, the holding portion 12 holds the probe pins 13a and 13b so that the inclination angles θ1 and θ2 of the probe pins 13a and 13b with respect to the first direction B are different from each other. As described above, the probe unit 303 having the holding portions 312a and 312b that hold the probe pins 13a and 13b (hereinafter also referred to as “holding portion 312” when not distinguished) is employed so that the inclination angles θ1 and θ2 are equal. You can also. Also in this configuration, the probe pins 13 are arranged along the first direction B (see the same figure) corresponding to the combined direction of the extending directions of the holding portions 312, and the downstream B1 side in the first direction B (same as the same). When holding each probe pin 13 in a first direction from the right side in the drawing toward the upstream B2 side (left side in the drawing), each holding the probe pins 13 so that the probe pins 13 overlap each other. By configuring each unit 312, as in the case of the probe unit 3, even when an obstacle exists in the vicinity of the probing target, each probe pin 13 is probed without contacting each probe pin 13 with the obstacle. The target can be reliably probed.

  Moreover, although the example which made the inspection object the cavity board | substrate 100 which has the recessed part 101 (cavity) was mentioned above, the board | substrate which does not have the recessed part 101 can also be made into a test object. In addition, the example in which the resistance value as the measured amount is measured from the electrical signal input / output via the probe pin 13 (probe pin 213) has been described above, but other measured amounts (for example, current value and voltage value) It can also be measured.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 3,203,303 Probe unit 8 Control part 5 Measuring part 13a, 13b, 213a, 213b Probe pin 31a, 31b Tip part 21a, 21b Tip part 22a, 22b Base end part 10 Fixing part 12a, 12b Holding part 212a, 212b holding part 312a, 312b holding part 100 cavity substrate 103 pad A1, A2 extending direction B first direction C second direction θ1, θ2 inclination angle

Claims (6)

A pair of holding portions in which each of the contact side ends of the pair of probe pins is held close to each other and each of the probe pins is held at the tip portion and each base end portion is fixed to the fixing portion; A probe unit configured to be capable of probing the probe pins together with a probing target,
The holding pins are arranged with the probe pins arranged along a first direction corresponding to a combined direction of the extending directions of the holding portions from the base end portions to the tip portions, and A probe unit configured to be able to hold the probe pins so that the probe pins overlap when viewed from the first direction from the downstream side to the upstream side in the first direction.   Each of the holding portions holds the probe pins so that the probe pins extend along a direction in which the probe pins are in contact with or separated from the probing target when the probe pins are viewed in the first direction. The probe unit according to claim 1, wherein the probe unit is configured to be held.   Each of the holding portions is configured so that the probe pins are inclined at an acute angle with respect to the first direction when the probe pins are viewed along a second direction orthogonal to the first direction. The probe unit according to claim 1, wherein the probe unit is configured to be able to hold a pin.   The probe unit according to any one of claims 1 to 3, wherein each holding portion is configured to be able to hold each probe pin having the same length.   5. The probe unit according to claim 1, wherein each of the holding portions is joined to each other by a joining portion in which the tip portions have elasticity.   An inspection apparatus comprising: the probe unit according to claim 1; and an inspection unit that inspects an inspection object based on an electric signal input and output via the probe pin of the probe unit.

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