JP2016111281A - Multi-piece wiring substrate, manufacturing method of multi-piece wiring substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multi-piece wiring substrate capable of suppressing warp from occurring, and a manufacturing method of a multi-piece wiring substrate.SOLUTION: A multi-piece wiring substrate according to the present invention includes: a product region made of ceramic and in which, in a plan view, a plurality of rectangular wiring substrate parts are arranged so as to be horizontally and vertically adjacent to each other; and an ear part similarly made of ceramic, has a shape of rectangular frame in a plan view, and positioned on the periphery of the product region. Further, in the ear part, a bent part is formed by bending the ear part having the rectangular frame shape along each side thereof.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a multi-cavity wiring board and a method for manufacturing a multi-cavity wiring board.

  In recent years, miniaturization and thinning of a wiring board provided with a ceramic insulating layer have progressed. Such a wiring board is usually formed by firing a ceramic slurry obtained by adding glass powder, a binder resin, a plasticizer, a solvent and the like to ceramic particles into a sheet shape (so-called green sheet). .

  Here, the conventional multi-cavity wiring board is made of a sintered first ceramic material, and when divided into individual substrate regions including a portion that becomes an individual substrate, and a peripheral region adjacent to the individual substrate region. A first insulating layer to be partitioned; and a second insulating layer made of a sintered second ceramic material and stacked only in a peripheral region of the first insulating layer. The second insulating layer is formed with a protruding portion that protrudes at least on one side in the stacking direction in which the first and second insulating layers are stacked rather than the first insulating layer in the individual substrate region. There are some (see, for example, Patent Document 1).

JP 2013-143506 A

  With the thinning of the wiring board, there is a problem that the wiring board is warped by firing. In particular, in the case of a multi-cavity wiring board in which a large number of wiring boards are fired at once, the warpage caused by the increase in area is significant.

  Here, in the wiring board disclosed in Patent Document 1, it is possible to prevent the occurrence of breakage such as warping, cracking, and cracking after firing by the above configuration. Moreover, the wiring board disclosed in Patent Document 1 is formed with a thickness reducing portion where the thickness in the stacking direction is reduced in the protruding portion. The thickness reducing portion is characterized in that it overlaps with an extension of a boundary line of a portion that becomes an individual substrate when divided from the stacking direction. When the wiring board is divided into individual boards, it becomes easy to divide.

  However, with the miniaturization of the wiring board, the individual boards are also miniaturized. When the individual substrate is reduced in size, it becomes difficult to form the thickness reduction portion on the protrusion so as to overlap the extended line of the boundary line of the portion that becomes the individual substrate. As a result, when the wiring board is divided into individual boards, there is a risk that breakage or cracks may occur.

  The present invention has been made in response to the above-described circumstances, and an object thereof is to provide a multi-cavity wiring board and a manufacturing method of the multi-cavity wiring board that can suppress the occurrence of warpage.

  In order to achieve the above object, the multi-cavity wiring board of the present invention is made of ceramic, and a plurality of wiring board parts having a rectangular plan view are made of product areas adjacent to each other vertically and horizontally, and are made of the same ceramic as described above. A multi-cavity wiring board provided with ears positioned around the product region in the form of a rectangular frame, wherein the ears are bent along each side of the rectangular frame-like ears. A portion is formed.

  According to the multi-cavity wiring board of the present invention, since bent portions are formed along the sides of the rectangular frame-shaped ears, it is possible to suppress warping of the multi-cavity wiring board. can do. Moreover, occurrence of breakage such as cracks and cracks due to warpage can be suppressed.

  The bent portion of the multi-piece wiring board of the present invention is characterized in that it is formed along each side of the ear portion so as to surround the product region. For this reason, it is possible to effectively suppress warping of the multi-piece wiring board. Moreover, generation | occurrence | production of breakage, a crack, etc. by a curvature can be suppressed effectively.

  The bent part of the multi-cavity wiring board of the present invention is characterized in that it has a rib shape. For this reason, it is possible to more effectively suppress the warpage of the multi-piece wiring board. In addition, occurrence of breakage such as cracks and cracks due to warpage can be more effectively suppressed. Further, the height of the multi-piece wiring board can be suppressed.

  The multi-piece wiring board of the present invention is made of ceramic and has a rectangular product in a plan view, and a product region in which a plurality of wiring board parts are vertically and horizontally adjacent to each other, and the product region that is made of the same ceramic and has a rectangular frame shape in plan view. And a plurality of wiring circuit boards each having an ear portion positioned around the edge portion, wherein a metal layer is formed on each of the ear portions along each side of the rectangular frame-shaped ear portion. .

  According to the multi-cavity wiring board of the present invention, since the metal layer is formed along each side of the rectangular frame-shaped ear portion, it is possible to suppress the warp of the multi-cavity wiring board. . Moreover, occurrence of breakage such as cracks and cracks due to warpage can be suppressed.

  The metal layer of the multi-piece wiring board according to the present invention is characterized in that it is formed along each side of the ear portion so as to surround the product region. For this reason, it is possible to effectively suppress warping of the multi-piece wiring board. Moreover, generation | occurrence | production of breakage, a crack, etc. by a curvature can be suppressed effectively.

  The metal layer of the multi-piece wiring board according to the present invention is characterized in that it is formed from an end portion of the ear portion on the product region side to an end portion on the opposite side to the product region side. For this reason, it is possible to more effectively suppress the warpage of the multi-piece wiring board. In addition, occurrence of breakage such as cracks and cracks due to warpage can be more effectively suppressed.

  The method of manufacturing a multi-piece wiring board according to the present invention is made of ceramic, and a plurality of wiring board parts having a rectangular plan view are vertically and horizontally adjacent to a product region, and the same ceramic as described above, and the plan view has a rectangular frame shape. A multi-cavity wiring board manufacturing method comprising ears positioned around the product area, each of the green sheets in an area corresponding to the ears of the green sheet to be the multi-cavity wiring board It has the process of forming the bending part bent along the edge | side.

  According to the method for manufacturing a multi-cavity wiring board of the present invention, a bent portion that is bent along each side of the green sheet is formed in a region corresponding to the ear portion of the green sheet that becomes the multi-cavity wiring board. Since the process is provided, it is possible to suppress warping of the multi-piece wiring board. Moreover, occurrence of breakage such as cracks and cracks due to warpage can be suppressed.

  The method for manufacturing a multi-piece wiring board according to the present invention is characterized in that the green sheet is bent along each side so that the bent portion surrounds the product region. For this reason, it is possible to effectively suppress warping of the multi-piece wiring board. Moreover, generation | occurrence | production of breakage, a crack, etc. by a curvature can be suppressed effectively.

  The method for manufacturing a multi-cavity wiring board according to the present invention is characterized in that the green sheet is bent so that the bent portion has a rib shape. For this reason, it is possible to more effectively suppress the warpage of the multi-piece wiring board. In addition, occurrence of breakage such as cracks and cracks due to warpage can be more effectively suppressed.

  The method of manufacturing a multi-piece wiring board according to the present invention is made of ceramic, and a plurality of wiring board parts having a rectangular plan view are vertically and horizontally adjacent to a product region, and the same ceramic as described above, and the plan view has a rectangular frame shape. A multi-cavity wiring board manufacturing method comprising ears positioned around the product area, each of the green sheets in an area corresponding to the ears of the green sheet to be the multi-cavity wiring board It has the process of forming a metal layer along a side.

  According to the method for manufacturing a multi-cavity wiring board of the present invention, the method includes a step of forming a metal layer along each side of the green sheet in a region corresponding to the ear portion of the green sheet to be the multi-cavity wiring board. Therefore, it is possible to suppress the occurrence of warping in the multi-piece wiring board. Moreover, occurrence of breakage such as cracks and cracks due to warpage can be suppressed.

  The method for manufacturing a multi-cavity wiring board according to the present invention is characterized in that a metal layer is formed on each side of a green sheet so as to surround a product region. For this reason, it is possible to effectively suppress warping of the multi-piece wiring board. Moreover, generation | occurrence | production of breakage, a crack, etc. by a curvature can be suppressed effectively.

  The method for manufacturing a multi-cavity wiring board according to the present invention is characterized in that a metal layer is formed from an end portion on the product region side of the ear portion to an end portion on the opposite side to the product region side. For this reason, it is possible to more effectively suppress the warpage of the multi-piece wiring board. In addition, occurrence of breakage such as cracks and cracks due to warpage can be more effectively suppressed.

  As described above, according to the present invention, it is possible to provide a multi-cavity wiring board that can suppress the occurrence of warpage and a method for manufacturing the multi-cavity wiring board.

FIG. 2 is a plan view of a multi-cavity wiring board according to the first embodiment. Sectional drawing in the XX line of the multi-cavity wiring board which concerns on 1st Embodiment. The figure which shows the manufacturing method of the multi-cavity wiring board which concerns on 1st Embodiment. The figure which shows the effect of the multi-cavity wiring board which concerns on 1st Embodiment. The top view of the multi-cavity wiring board which concerns on the modification of 1st Embodiment. Sectional drawing in the YY line of the multi-cavity wiring board which concerns on the modification of 1st Embodiment. The block diagram of the jig | tool used when manufacturing the multi-cavity wiring board which concerns on the modification of 1st Embodiment. The other block diagram of the jig | tool used when manufacturing the multi-cavity wiring board which concerns on the modification of 1st Embodiment. The top view of the multi-cavity wiring board which concerns on 2nd Embodiment. Sectional drawing in the ZZ line of the multi-cavity wiring board which concerns on 2nd Embodiment. Explanatory drawing of the measuring method of the curvature in an Example.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, a wiring board having a single ceramic insulating layer (single layer), which is particularly prone to warping because of its thin thickness, will be described. However, the wiring board according to the embodiment described below is merely an example, and is not particularly limited as long as it is a multi-piece wiring board provided with a ceramic insulating layer. For example, it may be a multilayer wiring board in which a plurality of ceramic insulating layers are laminated.

(First embodiment)
FIG. 1 is a cross-sectional view of a multi-piece wiring board 100 (hereinafter simply referred to as a wiring board 100) according to the first embodiment. 2 is a cross-sectional view taken along line XX of the wiring board 100 shown in FIG. A wiring board 100 according to the first embodiment is made of ceramic, and a plurality of wiring board portions 103 having a rectangular shape in plan view are made of a product region 101 adjacent vertically and horizontally, and made of the same ceramic as the product region 101, and the shape in plan view is rectangular. This is a multi-piece wiring board including an ear portion 102 located around a frame-shaped product region 101. The thickness of the wiring board 100 is about 0.1 mm.

  The wiring substrate 100 has division grooves 104 formed in a lattice shape along the boundary between adjacent wiring substrate portions 103 and the boundary between the product region 101 and the ear portion 102. By dividing the wiring substrate 100 along the dividing groove 104, the product region 101 and the ear portion 102 can be separated and the wiring substrate portion 103 of the product region 101 can be separated into pieces.

  In addition, bent portions 109 to 112 that are bent along the sides 105 to 108 of the rectangular frame-shaped ear portion 102 are formed on the ear portion 102 of the wiring substrate 100. The bent portions 109 to 112 are formed along the sides 105 to 108 of the ear portion 102 so as to surround the product region 101. That is, the bent portions 109 to 112 are formed along the sides 105 to 108 of the ear portion 102 so that adjacent end portions are connected to each other.

  As shown in FIG. 2, in the present embodiment, in the bent portions 109 to 112, the peripheral portion of the ear portion 102 is bent upward in the drawing, but the bending direction is either the upward direction or the downward direction. It doesn't matter.

Next, a method for manufacturing the wiring substrate 100 will be described with reference to FIGS.
First, a so-called green sheet is prepared by forming a ceramic slurry obtained by adding glass powder, a binder resin, a plasticizer, a solvent, and the like to ceramic particles. Next, the green sheet is punched as necessary to form via holes and divided grooves 104, and then a metal paste is applied by a printing method or the like to form a wiring pattern or a via conductor. Through this process, a plurality of precursors 203 to be the wiring board portion 103 are formed in the region 201 corresponding to the product region 101 of the green sheet (see FIG. 3A).

  Next, bent portions 109 to 112 that are bent along the sides 105 to 108 of the green sheet are formed in the region 202 corresponding to the ear portion 102 of the green sheet to be the wiring substrate 100 (FIG. 3B). reference). In this step, each side 105-105 of the ear part 102 is formed so that the bent parts 109 to 112 surround the area 201 corresponding to the product area 101, that is, adjacent ends are connected to each other. The bent portions 109 to 112 are formed by bending along 108.

  Next, the green sheet on which the bent portions 109 to 112 are formed is fired at a predetermined temperature and time to obtain the wiring substrate 100 shown in FIG. If necessary, the wiring pattern may be plated or a metallized layer may be formed.

  Next, the effect of the wiring board 100 will be described with reference to FIGS. First, a wiring board in which the bent portions 109 to 112 are not formed will be described. In the wiring board in which the bent portions 109 to 112 are not formed, as shown in FIG. 4A, when the green sheet is baked to form the wiring board, the entire wiring board is warped to be rounded. . On the other hand, in the wiring board 100 according to the present embodiment, since the bent portions 109 to 112 are formed along the sides 105 to 108, it is possible to prevent the wiring board from being warped.

  Specifically, in the direction of the arrow α in FIG. 1, the warpage is suppressed by the bent portions 110 and 112 formed along the sides 106 and 108 parallel to the arrow α. In addition, in the direction of arrow β in FIG. 1, warpage is suppressed by bent portions 109 and 111 formed along sides 105 and 107 parallel to arrow β.

  As described above, according to the wiring substrate 100 according to the present embodiment, the bent portions 109 to 112 that are bent along the sides 105 to 108 of the rectangular frame-shaped ear portion 102 are formed. It is possible to prevent the substrate 100 from warping. Moreover, occurrence of breakage such as cracks and cracks due to warpage can be suppressed.

  Furthermore, the bent portions 109 to 112 of the wiring board 100 according to the present embodiment are formed along the sides 105 to 108 of the ear portion 102 so as to surround the product region 101. For this reason, it can suppress effectively that the wiring board 100 generate | occur | produces curvature. Moreover, generation | occurrence | production of breakage, a crack, etc. by a curvature can be suppressed effectively.

(Modification of the first embodiment)
FIG. 5 is a plan view of a multi-piece wiring board 300 (hereinafter simply referred to as a wiring board 300) according to a modification of the first embodiment. FIG. 6 is a cross-sectional view taken along line YY of the wiring board 300 shown in FIG. Hereinafter, the wiring substrate 300 will be described with reference to FIGS. 5 and 6. The same components as those described with reference to FIGS.

  The wiring board 300 is formed such that bent portions 309 to 312 that are bent along the sides 105 to 108 of the rectangular frame-shaped ear portion 102 surround the product region 101. Although the same, the bent portions 309 to 312 are different from the wiring substrate 100 in that they are rib-shaped.

  As shown in FIG. 6, in the present embodiment, in the bent portions 309 to 312, the protruding direction of the rib is the upward direction on the paper surface, but the protruding direction may be either the upward direction or the downward direction. Absent.

  FIG. 7 is a configuration diagram of a jig 400 used when the wiring board 300 is manufactured. The jig 400 is divided into a lower mold 410 and an upper mold 420. The lower mold 410 has a V-shaped groove 411 formed linearly. In addition, the upper mold 420 is formed with a linear protrusion 421 having a V-shaped cross section that fits into the V-shaped groove 411 of the lower mold 410. By pressing the ear portion 102 of the wiring board 300 between the lower die 410 and the upper die 420 constituting the jig 400, the rib-shaped bent portions 309 to 312 can be easily formed.

  Note that a protrusion having a V-shaped cross section may be formed on the lower mold 410 and a V-shaped groove may be formed on the upper mold 420. The angle of the V-shaped groove 411 is preferably an acute angle. This is because when the angle of the V-shaped groove 411 is wide, it is difficult to form the bent portions 309 to 312 in a rib shape. Further, the cross-sectional shape of the V-shaped groove 411 and the protruding portion 421 may be a shape other than the V-shape, for example, a U-shape.

  FIG. 8 is a configuration diagram of a jig 500 used when manufacturing the wiring board 300. In the jig 400 shown in FIG. 7, it is necessary to form the rib-shaped bent portions 309 to 312 by pressing each side 105 to 108 of the rectangular frame-shaped ear portion 102. On the other hand, the jig 500 shown in FIG. 8 has a V-shaped groove 511 formed for each side of the rectangular lower mold 510 in a plan view. A protrusion 521 having a V-shaped cross section to be fitted with the V-shaped groove 511 is formed. Therefore, rib-shaped bent portions 309 to 312 are collectively formed by pressing the ear portion 102 of the wiring board 300 between the lower die 510 and the upper die 520 constituting the jig 500. be able to.

  Note that a protrusion 521 having a V-shaped cross section may be formed on the lower mold 510 and a V-shaped groove may be formed on the upper mold 520. The angle of the V-shaped groove 511 is preferably an acute angle. This is because if the angle of the V-shaped groove 511 is wide, it is difficult to form the bent portions 309 to 312 in a rib shape. Further, the cross-sectional shapes of the V-shaped groove 511 and the protruding portion 521 may be a shape other than the V-shape, for example, a U-shape.

  By making each bending part 309-312 into a rib shape, it can suppress more effectively that the wiring board 300 generate | occur | produces curvature. In addition, occurrence of breakage such as cracks and cracks due to warpage can be more effectively suppressed. Furthermore, the height of the wiring board 300 can be suppressed.

(Second Embodiment)
FIG. 9 is a plan view of a multi-piece wiring board 600 (hereinafter simply referred to as a wiring board 600) according to the second embodiment. 10 is a cross-sectional view taken along line ZZ of wiring substrate 600 shown in FIG. Hereinafter, the wiring board 600 will be described with reference to FIGS. 9 and 10. The same components as those described with reference to FIGS. 1 to 4 are denoted by the same reference numerals, and redundant description will be omitted.

  In the wiring board 600, metal layers 609 to 612 are formed along the sides 105 to 108 of the rectangular frame-shaped ear portion 102. Here, the metal layers 609 to 612 are formed along the sides 105 to 108 of the ear portion 102 so as to surround the product region 101. That is, the metal layers 609 to 612 are formed along the sides 105 to 108 of the ear portion 102 so that adjacent end portions are connected to each other. Furthermore, the metal layers 609 to 612 are formed from the end T1 on the product region 101 side of the ear portion 102 to the end T2 on the opposite side to the product region 101 side.

Next, a method for manufacturing the wiring substrate 600 will be described with reference to FIGS.
First, a so-called green sheet is prepared by forming a ceramic slurry obtained by adding glass powder, a binder resin, a plasticizer, a solvent, and the like to ceramic particles. Next, the green sheet is punched as necessary to form via holes and divided grooves 104, and then a metal paste is applied by a printing method or the like to form a wiring pattern or a via conductor. By this step, a plurality of precursors that will become the wiring board portion 103 are formed in a region corresponding to the product region 101 of the green sheet.

  Next, metal layers 609 to 612 are formed along the sides 105 to 108 of the green sheet in a region corresponding to the ear portion of the green sheet to be the wiring substrate 600. The metal layers 609 to 612 surround the region corresponding to the product region 101 and extend from the end T1 on the product region 101 side of the ear portion 102 to the end T2 on the opposite side to the product region 101 side. Form.

  Next, the green sheet on which the metal layers 609 to 612 are formed is fired at a predetermined temperature and time to obtain a wiring substrate 600 shown in FIG. If necessary, the wiring pattern may be plated or a metallized layer may be formed.

  As described above, according to the wiring substrate 600 according to the present embodiment, the metal layers 609 to 612 are formed along the sides 105 to 108 of the rectangular frame-shaped ear portion 102, so that the wiring substrate 600 is warped. Can be suppressed. Moreover, occurrence of breakage such as cracks and cracks due to warpage can be suppressed.

  Further, the metal layers 609 to 612 of the wiring board 600 according to the present embodiment are formed along the sides 105 to 108 of the ear portion 102 so as to surround the product region 101. For this reason, it is possible to effectively suppress the occurrence of warping of the wiring board 600. Moreover, generation | occurrence | production of breakage, a crack, etc. by a curvature can be suppressed effectively.

  Furthermore, the metal layer of the wiring board 600 according to the present embodiment is formed from the end portion T1 on the product region 101 side of the ear portion 102 to the end portion T2 on the side opposite to the product region 101 side. For this reason, it can suppress more effectively that the wiring board 600 generate | occur | produces curvature. In addition, occurrence of breakage such as cracks and cracks due to warpage can be more effectively suppressed.

Next, examples will be described.
(Overview)
The inventors prepared the following three types of multi-piece wiring boards (hereinafter simply referred to as wiring boards), and then, as shown by L1 to L3 in FIG. 11, the lower left to the upper right (L1), the upper left to the right Height measurement was performed from the bottom (L2) and the center bottom to the center top (L3), and the warpage of each wiring board was evaluated.

For measuring the warpage, a laser warpage measuring device V4.17 (manufactured by Anritsu) was used. The measurement conditions are as follows.
Starting point: X = 1.5mm, Y = 1.5mm
Range: X = 49.63mm, Y = 45.58mm
Pitch: 0.3mm
Soft filter: 3 times Cut-off: 0um
Gain: 10

Example 1
In Example 1, similarly to the wiring substrate 300 according to the modification of the first embodiment described with reference to FIGS. 5 and 6, bending is performed along the sides 105 to 108 of the rectangular frame-shaped ear portion 102. A wiring board in which the bent portions 109 to 112 were formed in a rib shape was manufactured.

(Example 2)
In Example 2, similarly to the wiring substrate 600 according to the second embodiment described with reference to FIG. 9 and FIG. 10, the metal layers 609 to 609 are formed along the sides 105 to 108 of the rectangular frame-shaped ear part 102. A wiring board on which 612 was formed was produced.

(Comparative Example 1)
In Comparative Example 1, a wiring board in which a bent portion and a metal layer were not formed on the rectangular frame-shaped ear portion 102 was produced.

Next, the measurement result will be described.
(Measurement result of Example 1)
Warpage in a straight line (corresponding to L1 in FIG. 11) drawn from the lower left to the upper right of the wiring board of Example 1 was measured (R1). Warpage in a straight line (corresponding to L2 in FIG. 11) drawn from the upper left to the lower right of the wiring board of Example 1 was measured (R2). Moreover, the curvature in the straight line (corresponding to L3 in FIG. 11) drawn from the lower center to the upper center of the wiring board of Example 1 was measured (R3).

  Here, R1 to R3 are measurement results including the product region and the ear part, respectively, and the measurement results (S1 to S3) of only the product region were also confirmed. From the measurement results of R1 to R3 and S1 to S3, in the wiring board of Example 1, the warpage in the product region (S1 to S3) is greatly suppressed as compared with the amount of warpage of the ear portion. I understood.

(Measurement result of Example 2)
Warpage in a straight line (corresponding to L1 in FIG. 11) drawn from the lower left to the upper right of the wiring board of Example 2 was measured (R4). Warpage in a straight line (corresponding to L2 in FIG. 11) drawn from the upper left to the lower right of the wiring board of Example 2 was measured (R5). Moreover, the curvature in the straight line (corresponding to L3 in FIG. 11) drawn from the lower center to the upper center of the wiring board of Example 2 was measured (R6).

  Here, R4 to R6 are measurement results including the product region and the ear, respectively, and the measurement results (S4 to S6) of only the product region were also confirmed. From the measurement results of R4 to R6 and S4 to S6, it is found that even in the wiring board of Example 2, the warpage in the product region (S4 to S6) is suppressed as compared with the amount of warpage of the ear portion. It was.

(Measurement results of Comparative Example 1)
Warpage in a straight line (corresponding to L1 in FIG. 11) drawn from the lower left to the upper right of the wiring board of Comparative Example 1 was measured (R7). Warpage in a straight line (corresponding to L2 in FIG. 11) drawn from the upper left to the lower right of the wiring board of Comparative Example 1 was measured (R8). Moreover, the curvature in the straight line (corresponding to L3 in FIG. 11) drawn from the lower center toward the upper center of the wiring board of Comparative Example 1 was measured (R9).

  Here, the regions R7 to R9 are measurement results including the product region and the ear portion, respectively, and the measurement results (S7 to S9) of only the product region were also confirmed. From the measurement results of R7 to R9 and S7 to S9, the wiring board of Comparative Example 1 has a larger warp in the product region than the ear part, and the warp in the product region (S7 to S9) is not suppressed. all right.

  From the measurement results of the product areas of Examples 1 and 2 and Comparative Example 1, it is effective to provide a bent part or a metal layer that is bent along each side of the ear part to cause warping of the wiring board. It was found that it can be suppressed. For this reason, it turned out that generation | occurrence | production of breakage, a crack, etc. by a curvature can be suppressed effectively.

  The multi-cavity wiring board and the manufacturing method of the multi-cavity wiring board according to the present invention can suppress the occurrence of warpage, and thus can be suitably used for a thin wiring board having a particularly large area.

DESCRIPTION OF SYMBOLS 100,600 Wiring board 101 Product area 102 Ear part 103 Wiring board part 104 Dividing groove 105-108 Side 109-112 Bending part 200,300 Wiring board 309-312 Rib-like bending part 400,500 Jig 609-612 Metal layer

Claims (12)

A plurality of wiring board portions made of ceramic and having a rectangular shape in plan view are adjacent to each other vertically and horizontally, and an ear portion made of the same ceramic as described above and positioned around the product region having a rectangular frame shape in plan view. A multi-circuit board,
The multi-piece wiring board according to claim 1, wherein the ear part is formed with a bent part that is bent along each side of the rectangular frame-like ear part.   The multi-piece wiring board according to claim 1, wherein the bent portion is formed along each side of the ear portion so as to surround the product region.   The multi-piece wiring board according to claim 1, wherein the bent portion has a rib shape. A plurality of wiring board portions made of ceramic and having a rectangular shape in plan view are adjacent to each other vertically and horizontally, and an ear portion made of the same ceramic as described above and positioned around the product region having a rectangular frame shape in plan view. A multi-circuit board,
The multi-piece wiring board according to claim 1, wherein a metal layer is formed on each of the ear portions along each side of the rectangular frame-shaped ear portion.   5. The multi-cavity wiring board according to claim 4, wherein the metal layer is formed along each side of the ear portion so as to surround the product region.   The said metal layer is formed from the edge part of the said product area side of the said ear | edge part to the edge part on the opposite side to the said product area side, The Claim 4 or Claim 5 characterized by the above-mentioned. Multi-piece wiring board. A plurality of wiring board portions made of ceramic and having a rectangular shape in plan view are adjacent to each other vertically and horizontally, and an ear portion made of the same ceramic as described above and positioned around the product region having a rectangular frame shape in plan view. A method for manufacturing a multi-piece wiring board,
A multi-cavity wiring board comprising a step of forming a bent portion along each side of the green sheet in a region corresponding to the ear portion of the green sheet to be the multi-cavity wiring board Manufacturing method.   The method for manufacturing a multi-piece wiring board according to claim 7, wherein the green sheet is bent along each side so that the bent portion surrounds the product region.   The method for manufacturing a multi-cavity wiring board according to claim 7 or 8, wherein the green sheet is bent so that the bent portion has a rib shape. A plurality of wiring board portions made of ceramic and having a rectangular shape in plan view are adjacent to each other vertically and horizontally, and an ear portion made of the same ceramic as described above and positioned around the product region having a rectangular frame shape in plan view. A method for manufacturing a multi-piece wiring board,
A method of manufacturing a multi-cavity wiring board, comprising a step of forming a metal layer along each side of the green sheet in a region corresponding to the ear portion of the green sheet to be the multi-cavity wiring board .   The method of manufacturing a multi-cavity wiring board according to claim 10, wherein the metal layer is formed on each side of the green sheet so as to surround the product region.   The multi-piece picking according to claim 10 or 11, wherein the metal layer is formed from an end of the ear portion on the product region side to an end opposite to the product region side. Wiring board.

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