JP2016158060A - Piezoelectric device with thermostatic tank - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric device with a thermostatic tank capable of adjusting influences of a temperature adjustment component to a detection temperature of a temperature sensor with ease.SOLUTION: An OCXO 1 has a TCXO 3, a tank 19, a heater 21, a heater temperature sensor 49, a temperature control circuit 51, and a conductive piece 67. The tank 19 houses the TCXO 3. The heater 21 can perform heat radiation in the tank 19. The heater temperature sensor 49 is arranged in the tank 19. The temperature control circuit 51 controls the heater 21 so that a temperature detected by the heater temperature sensor 49 becomes a predetermined target temperature. The conductive piece 67 abuts on the heater 21 and the heater temperature sensor 49.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a thermostatic chamber-equipped piezoelectric device.

  A piezoelectric device having a thermostatic chamber is known. For example, Patent Document 1 discloses an oven controlled crystal oscillator (OCXO) in which a temperature compensated oscillator (TCXO: Temperature Compensated Crystal Oscillator) is housed in a thermostat.

  The TCXO detects the temperature of the surrounding atmosphere, and based on the detected temperature, compensates for the characteristic change of the piezoelectric body caused by the temperature change. As a result, the possibility that the frequency of the oscillation signal output from the TCXO deviates from the target frequency due to a temperature change in the surrounding atmosphere is reduced. The thermostatic bath is a bath that houses the TCXO, a heater that heats the atmosphere in the bath, a temperature sensor that detects the temperature in the bath, and a heater so that the temperature detected by the temperature sensor becomes a predetermined target temperature. And a control circuit for controlling. Thereby, the atmosphere around the TCXO is kept at a constant temperature, and the influence of the temperature change of the atmosphere around the OCXO on the frequency of the oscillation signal of the TCXO is alleviated.

JP2013-211752A

  If the heater and the temperature sensor are close to each other in the thermostatic bath, the temperature detected by the temperature sensor is easily affected by the heater. As a result, for example, the temperature detected by the temperature sensor deviates from the temperature detected by the TCXO (temperature around the TCXO), and there is a possibility that the temperature around the TCXO cannot be set to the intended temperature by the heater. Conversely, if the heater and the temperature sensor are separated from each other, for example, the temperature detected by the temperature sensor is easily affected by the temperature environment outside the tank. As a result, for example, the heater control may become unstable, and the frequency of the oscillation signal may become unstable.

  It is difficult to predict in advance a relatively subtle difference in detected temperature caused by the position of the temperature sensor as described above. Therefore, for example, it is difficult to appropriately determine the position of the temperature sensor (the position of the pad on which the temperature sensor is mounted) at the stage of designing the wiring board on which the temperature sensor is mounted. Thus, for example, it is conceivable to prepare a plurality of types of OCXOs having different temperature sensor positions and find a suitable position of the temperature sensor. However, this requires preparation of a plurality of types of wiring boards having different temperature sensor mounting positions, which increases design cost. In addition, the change of the position of the temperature sensor cannot be easily performed because it affects the arrangement of wiring and other electronic components on the wiring board on which the temperature sensor is mounted.

  Therefore, it is desired to provide a thermostatic chamber-equipped piezoelectric device that can easily adjust the influence of a temperature adjustment component (for example, a heater) on the detection temperature of the temperature sensor.

  A thermostatic chamber-equipped piezoelectric device according to an aspect of the present invention includes a temperature-compensated piezoelectric device, a chamber that houses the temperature-compensated piezoelectric device, and a temperature adjustment component that can perform at least one of heat dissipation and heat absorption in the chamber. A temperature sensor disposed in the tank; a control circuit that controls the temperature adjustment component such that a temperature detected by the temperature sensor reaches a predetermined target temperature; and the temperature adjustment component and the temperature sensor. And a conductive piece.

  Preferably, the thermostat-equipped piezoelectric device further includes an insulating adhesive that fixes the conductive piece to the temperature adjusting component and the temperature sensor.

  Preferably, the adhesive covers the entire conductive piece.

  Preferably, the temperature adjustment component and the temperature sensor further include a mounting board mounted on the same main surface, and the conductive piece is on the opposite side of the temperature adjustment component and the temperature sensor from the mounting board. It is in contact with the surface and floats from the mounting substrate.

  Preferably, the conductive piece is in an electrically floating state.

  According to said structure, the influence which a heater exerts on the detection temperature of a temperature sensor can be adjusted easily.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a schematic configuration of a crystal oscillator with a thermostatic bath according to an embodiment of the present invention, partially broken away. Sectional drawing in the II-II line of FIG. 3A is a cross-sectional view showing a heater and a temperature sensor of the crystal oscillator with a thermostatic bath of FIG. 1, and FIGS. 3B and 3C are diagrams showing a modification of the configuration of FIG. The block diagram which shows schematic structure of the signal processing system of OCXO of FIG.

  Hereinafter, OCXO according to an embodiment of the present invention will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones.

  FIG. 1 is a perspective view showing a schematic configuration of an OCXO 1 according to an embodiment of the present invention, with a part thereof broken. 2 is a cross-sectional view taken along the line II-II in FIG.

  The OCXO 1 may be either upward or downward, but in the description of FIG. 1 and FIG. 2, for the sake of convenience, the upper surface is defined with the upper side of the paper (the z-axis direction positive side) as the upper side. Terminology such as bottom is sometimes used.

  The OCXO 1 is, for example, an electronic component that is generally a rectangular parallelepiped as a whole, and the dimensions thereof may be set as appropriate. For example, the length of the long side or the short side (x direction and y direction) is 1 mm to 3 mm, and the thickness (z direction) is 0.5 mm to 1 mm.

  The OCXO 1 includes, for example, a TCXO 3 and a thermostatic chamber 5 for maintaining an atmosphere around the TCXO 3 at a predetermined temperature and mediating electrical connection between the TCXO 3 and an external device.

  The TCXO 3 includes, for example, an element mounting member 7, a vibration element 9 (FIG. 2) and an IC 11 (FIG. 2) mounted on the element mounting member 7, and a lid body 13 for sealing the vibration element 9. Have.

  The element mounting member 7 includes, for example, an insulating member 15 and various conductors provided on the surface or inside of the insulating member 15.

  As shown in FIG. 2, the insulating member 15 has a first recess 15 a that opens upward and accommodates the vibration element 9, and a second recess 15 b that opens downward and accommodates the IC 11. In another aspect, the insulating member 15 includes a substrate portion 15c, a first frame portion 15d positioned on one main surface of the substrate portion 15c, and a second frame portion positioned on the other main surface of the substrate portion 15c. 15e. The insulating member 15 is formed by stacking a plurality of layered members made of ceramic such as alumina, for example.

  Various conductors of the element mounting member 7 are provided on the bottom surface of the first recess 15a, for example, and a pair of element mounting pads (not shown) for mounting the vibration element 9 on the bottom surface of the second recess 15b. A plurality of IC mounting pads (not shown) for mounting the IC 11 and a plurality of TCXO terminals 25 (see FIG. 4) provided on the lower surface of the second frame portion 15e for inputting / outputting signals to / from the TCXO 3 A wiring (not shown) for connecting a pair of element mounting pads and two of the plurality of IC mounting pads (not shown), a wiring for connecting the rest of the plurality of IC mounting pads and the plurality of TCXO terminals 25 (not shown) (Illustrated). The wiring is composed of, for example, a layered wiring provided on the main surface of the substrate portion 15 c and a via conductor that penetrates the insulating member 15.

  The vibration element 9 includes, for example, a flat plate-shaped piezoelectric element plate 10 (FIG. 2) and a pair of excitation electrodes 32 (see FIG. 4) provided on both main surfaces of the piezoelectric element plate 10. The piezoelectric element plate 10 is made of, for example, a quartz material such as quartz, cut at a predetermined angle with respect to a crystal axis, and has a rectangular shape in plan view. The vibration element 9 generates a thickness shear vibration at a predetermined frequency when a voltage is applied to the pair of excitation electrodes 32. The vibration element 9 is fixed and electrically connected to the element mounting member 7 by, for example, a pair of bumps (reference numerals omitted).

  The IC 11 is configured in, for example, a substantially rectangular parallelepiped shape, and includes an oscillation circuit that generates an oscillation signal by applying a voltage to the vibration element 9 as described later. The IC 11 may be packaged or a bare chip. The IC 11 is fixed to and electrically connected to the element mounting member 7 by, for example, a plurality of bumps (not shown).

  The lid 13 is bonded to the upper surface of the first frame portion 15d and seals the first recess 15a. The lid 13 may be made of a conductive material such as metal, may be made of an insulating material, or may be made of a composite material in which an insulating layer and a conductive layer are stacked. For example, the lid 13 is made of a metal plate, and this metal plate is joined to the first frame portion 15d by seam welding or the like.

  For example, the thermostatic chamber 5 mounts the mounting substrate 17 on which the TCXO 3 is mounted, the bath 19 that houses the TCXO 3, the heater 21 (FIG. 2) for heating the atmosphere in the bath 19, and the OCXO 1 on an external device. And a plurality of (6 in the present embodiment) external terminals 23 and various electronic components (not shown in FIGS. 1 and 2) mounted on the mounting substrate 17.

  The mounting substrate 17 is configured by, for example, a printed wiring board, and includes an insulating substrate 24 and various conductors provided on the insulating substrate 24. The insulating substrate 24 is made of, for example, a glass epoxy material. The various conductors of the mounting substrate 17 include, for example, a TCXO pad 27 (FIG. 4) on which the TCXO 3 is mounted, a pad (not shown) on which the heater 21 and other electronic components are mounted, and these pads or pads And a wiring (not shown) that connects the external terminal 23 to the external terminal 23.

  The tank 19 is made of, for example, a metal material and houses the TCXO 3, the mounting substrate 17, and the heater 21. Although not particularly illustrated, the tank 19 is configured, for example, by fixing a member constituting the lower surface of the tank 19 and members constituting the upper surface and the outer peripheral surface of the tank 19. It is preferable that the two members are hermetically bonded by a sealing material or the like, and the inside of the tank 19 is sealed.

  For example, the heater 21 is configured by sealing a conductor (resistor) extending in a predetermined pattern with an insulating material, and generates an amount of heat corresponding to the applied voltage. The outer shape of the heater 21 is, for example, a substantially thin rectangular parallelepiped shape. For example, the heater 21 is mounted on the lower surface of the mounting substrate 17 and overlaps the TCXO 3 via the mounting substrate 17. For example, the heater 21 has an area larger than that of the TCXO 3, and the TCXO 3 is accommodated in the heater 21 in a plan view.

  The plurality of external terminals 23 are, for example, pin-shaped terminals, and one end side is inserted into a hole formed in the mounting substrate 17, and is fixed to the mounting substrate 17 with solder or the like and electrically connected thereto. The other end side of the plurality of external terminals 23 extends from the lower surface of the tank 19, for example. The plurality of external terminals 23 may be fixed to the tank 19 and may contribute to fixing the mounting board 17 and the tank 19 while securing a space between the mounting substrate 17 and the lower surface of the tank 19. .

  FIG. 3A is a cross-sectional view of a part of the mounting substrate 17. As can be understood from the direction of the z-axis, the vertical direction of the paper surface of FIG. 3A is opposite to the vertical direction of the paper surface of FIG.

  As described above, the heater 21 is mounted on one main surface 17 a of the mounting substrate 17. For example, the heater 21 is fixed to the mounting substrate 17 by the bumps 61 and is electrically connected. An underfill 63 may be disposed between and around the heater 21 and the mounting substrate 17. In addition, the surface (top surface 21a) on the opposite side to the mounting substrate 17 of the heater 21 is not covered with the underfill 63, for example, and is exposed.

  A heater temperature sensor 49 for detecting the temperature in the tank 19 is mounted on the main surface 17a of the mounting substrate 17 on which the heater 21 is mounted. The heater 21 and the heater temperature sensor 49 are thermally connected to each other by a conductive piece 67 in contact with them. The conductive piece 67 is fixed to the heater 21 and the heater temperature sensor 49 by an adhesive 69 made of an insulating material.

  The heater temperature sensor 49 is configured, for example, by sealing a resistor (thermistor) whose resistance value changes according to temperature with an insulating material. The heater temperature sensor 49 may be a temperature-sensitive element in which the thermistor is simply sealed with an insulating material, or may include another element such as an amplifier. Further, the heater temperature sensor 49 may be of another type such as a thermocouple.

  The outer shape of the heater temperature sensor 49 is, for example, a substantially rectangular parallelepiped shape. For example, the heater temperature sensor 49 is fixed to the mounting substrate 17 by a bump 65 and is electrically connected thereto. Although not shown, an underfill may be disposed between and around the heater temperature sensor 49 and the mounting substrate 17, similarly to the heater 21. The heater temperature sensor 49 is mounted at a position away from the heater 21.

  The conductive piece 67 is made of a metal piece, for example. The metal is, for example, aluminum, iron, copper, or stainless steel. Since a conductive material conducts heat by conduction electrons, it has a higher thermal conductivity than an insulating material in which heat conduction by phonons is dominant. Therefore, the conductive piece 67 has a higher thermal conductivity than the adhesive 69 and the insulating substrate 24 of the mounting substrate 17. The conductive piece 67 conducts heat more efficiently than air (or a gas such as nitrogen) in the tank 19 even when convection is taken into consideration.

  The shape and size of the conductive piece 67 may be set as appropriate. For example, the conductive piece 67 has a rectangular parallelepiped shape (for example, a plate shape). By adjusting the size of the conductive piece 67, the influence of the heater 21 on the temperature detected by the heater temperature sensor 49 can be adjusted. For example, the thickness (z direction) and the length (x direction) of the conductive piece 67 are constant, and the cross-sectional area contributing to the heat conduction of the conductive piece 67 by appropriately adjusting the size of the width (y direction). Thus, the influence of the heater 21 on the temperature detected by the heater temperature sensor 49 can be adjusted.

  For example, the conductive piece 67 is in contact with the surface (the top surfaces 21a, 49a) of the heater 21 and the heater temperature sensor 49 opposite to the mounting substrate 17. That is, the conductive piece 67 is provided so as to span the heater 21 and the heater temperature sensor 49, and is floating from the mounting board 17. In the region of the main surface 17a of the mounting substrate 17 facing the conductive piece 67, wirings or electronic components may be arranged or may not be arranged. The wiring is usually covered with a solder resist. The electronic component is, for example, a resistor, a capacitor, or an inductor.

  For example, the conductive piece 67 is in surface contact with the heater 21 and the heater temperature sensor 49. Specifically, for example, the top surface 21a of the heater 21 and the top surface 49a of the heater temperature sensor 49 have the same height from the mounting substrate 17, and the conductive piece 67 has a flat plate shape. The conductive piece 67 is in surface contact with the top surface 21a and the top surface 49a. Even when the heights of the top surface 21a and the top surface 49a from the mounting substrate 17 are different from each other, the conductive piece 67 is appropriately bent or bent so that the conductive piece 67 is made to the top surface 21a and the top surface 49a. It is possible to make surface contact with at least one of the above. In addition, the conductive piece 67 is in point contact with the heater 21 and the heater temperature sensor 49 by mounting the flat conductive piece 67 on the top surface 21a and the top surface 49a having different heights. Also good.

  The adhesive 69 is made of an insulating material as described above. The insulating material is, for example, a resin such as a silicone resin or an epoxy resin. The adhesive 69 has a lower thermal conductivity than the conductive piece 67. Therefore, the change in the amount of the adhesive 69 does not cause a change in the influence of the heater 21 on the detection temperature of the heater temperature sensor 49 as compared with the change in the dimension of the conductive piece 67. The adhesive 69 is disposed, for example, at two positions: a contact position between the one end of the conductive piece 67 and the heater 21, and a contact position between the other end of the conductive piece 67 and the heater temperature sensor 49. It is adhered to.

  The conductive piece 67 is only in contact with the insulating outer surface (the surface of the insulating package) of the heater 21 and the heater temperature sensor 49 and the insulating adhesive 69, and is electrically connected to other components. It is not connected to and is in an electrically floating state.

  FIG. 3B is a diagram showing the arrangement of the adhesive 69 according to the modification. In this modification, the adhesive 69 is disposed so as to cover the entire conductive piece 67. The heater temperature sensor 49 is also entirely covered with an adhesive 69. The heater 21 is only partially covered with the adhesive 69.

  FIG.3 (c) is a figure which shows arrangement | positioning of the adhesive agent 69 which concerns on a modification. In this modification, the adhesive 69 covers not only the entire conductive piece 67 and the heater temperature sensor 49 but also the heater 21. In FIG. 3C, the underfill 63 is omitted, but the underfill 63 may be disposed as in FIGS. 3A and 3C.

  FIG. 4 is a block diagram showing a schematic configuration of the signal processing system of OCXO1.

  OCXO1 has TCXO3 and the thermostat 5 as mentioned above. Both are electrically connected by connecting a plurality of TCXO terminals 25 provided on the element mounting member 7 and a plurality of TCXO pads 27 provided on the mounting substrate 17. Then, various signals are input to the plurality of TCXO terminals 25 of the TCXO 3 through the plurality of external terminals 23 of the thermostatic bath 5 or various signals are output.

  The signals given to the plurality of external terminals 23 are, for example, the power supply voltage Vcc for driving the TCXO 3 and the thermostat 5, the reference potential GND, and the control voltage Vcon for controlling the frequency of the oscillation signal generated by the TCXO 3. . The signal output from the plurality of external terminals 23 is, for example, the oscillation signal Vout generated by the TCXO 3. Note that which signal is allocated to the external terminal 23 at which position may be appropriately set. The same applies to the TCXO terminal 25 and the TCXO pad 27.

  As described above, the TCXO 3 includes the vibration element 9 and the IC 11 connected to the vibration element 9. The IC 11 includes, for example, an oscillation circuit 33 that generates an oscillation signal by applying a voltage to the vibration element 9 and a temperature compensation circuit 35 that compensates for a characteristic change of the vibration element 9 caused by a temperature change. . The configurations of the oscillation circuit 33 and the temperature compensation circuit 35 may be the same as known configurations.

  For example, the oscillation circuit 33 is not particularly shown, but an inverter whose input side and output side are connected to the vibration element 9, a feedback resistor connected to the input side and output side of the inverter, and between the input side of the inverter and the ground portion And a variable capacitance element arranged between the output side of the inverter and the ground portion.

  For example, the temperature compensation circuit 35 includes a variable capacitance element 39 disposed between the vibration element 9 and the ground portion, a compensation signal generation circuit 41 connected to the variable capacitance element 39, and a compensation signal generation circuit 41. A ROM 43, a RAM 45, and a compensation temperature sensor 47 are connected.

  Note that the variable capacitance element 39 of the temperature compensation circuit 35 may also be used as a variable capacitance element included in the oscillation circuit 33 in order to change the frequency of the oscillation signal in accordance with the control voltage Vcon. Further, the ROM 43 and the RAM 45 may be used also as a ROM and a RAM that hold information used by the oscillation circuit 33. The compensation temperature sensor 47 may be provided separately from the IC 11.

  The compensation signal generation circuit 41 applies a voltage corresponding to the temperature detected by the compensation temperature sensor 47 to the variable capacitance element 39 based on information stored in the ROM 43 or the RAM 45. Thereby, the load capacity of the vibration element 9 changes according to the temperature, and the frequency of the oscillation signal is temperature-compensated.

  The constant temperature bath 5 includes, for example, a temperature control circuit 51 that controls the heater 21 based on the temperature detected by the heater temperature sensor 49 in addition to the heater 21 and the heater temperature sensor 49 described above. The temperature control circuit 51 is configured by, for example, an IC (not shown) mounted on the mounting substrate 17 and is housed in the tank 19 together with the heater 21 and the heater temperature sensor 49. For example, the temperature control circuit 51 feedback-controls the amount of electric power (specifically, for example, voltage) supplied to the heater 21 so that the temperature detected by the heater temperature sensor 49 is maintained at a preset target temperature. Note that the target temperature may be set as appropriate based on the use environment assumed for the OCXO1, the temperature characteristics of the TCXO3, and the like, similarly to the known OCXO1.

  The plurality of external terminals 23 exposed from the thermostat 5 and the plurality of TCXO terminals 25 of the TCXO 3 are directly connected via, for example, wiring of the mounting substrate 17. However, an appropriate circuit or electronic element may be interposed between the plurality of external terminals 23 and the plurality of TCXO terminals 25. For example, an amplifier or an element for impedance matching may be interposed.

  As described above, in the present embodiment, the OCXO 1 includes the TCXO 3, the tank 19, the heater 21, the heater temperature sensor 49, the temperature control circuit 51, and the conductive piece 67. The tank 19 accommodates TCXO3. The heater 21 can dissipate heat (heat) in the tank 19. The heater temperature sensor 49 is disposed in the tank 19. The temperature control circuit 51 controls the heater 21 so that the temperature detected by the heater temperature sensor 49 becomes a predetermined target temperature. The conductive piece 67 contacts the heater 21 and the heater temperature sensor 49.

  Here, the conductive piece 67 has a higher thermal conductivity than the insulating substrate 24 of the mounting substrate 17 and the air in the tank 19. Accordingly, the conductive piece 67 forms a heat path from the heater 21 to the heater temperature sensor 49. As a result, the influence of the heater 21 on the detected temperature of the heater temperature sensor 49 can be adjusted by adjusting the size of the conductive piece 67. The adjustment of the dimension of the conductive piece 67 is, for example, cutting the appropriate conductive plate to produce the conductive piece 67, adjusting the cutting amount, and / or shaving the cut conductive piece 67. Is possible. The adjustment of the dimensions is, for example, less expensive than preparing a plurality of types of mounting boards 17 in which the positions of the heater temperature sensors 49 are different from each other, and also has an influence on the arrangement of other electronic components and the like. small. That is, the adjustment with the conductive piece 67 is inexpensive and simple.

  In this embodiment, the OCXO 1 further includes an insulating adhesive 69 that fixes the conductive piece 67 to the heater 21 and the heater temperature sensor 49.

  Therefore, for example, it is simpler than an embodiment in which the conductive piece 67 is fixed using screws or claws (this embodiment is also included in the present invention). Further, for example, the amount of the adhesive or the error in the arrangement of the adhesive from the heater 21 to the heater temperature sensor 49 is smaller than that in an embodiment using a conductive adhesive (for example, solder) (this embodiment is also included in the present invention). The effect on heat transfer is small. In other words, the conductive piece 67 is dominant in heat transfer among the conductive piece 67 and the adhesive 69, and the heater 21 detects the heater temperature sensor 49 with high accuracy by adjusting the size of the conductive piece 67. The effect on temperature can be adjusted. For example, even if the insulating adhesive 69 flows to an unintended position, no short circuit occurs in the mounting substrate 17.

  As shown in FIGS. 3B and 3C, the adhesive 69 may cover the entire conductive piece 67.

  In this case, for example, the conductive piece 67 is insulated from the gas in the tank 19 by the adhesive 69. Therefore, the amount of heat transferred from the heater 21 to the heater temperature sensor 49 is stabilized, and the control of the heater is stabilized. Moreover, for example, since the conductive piece 67 is insulated from the surroundings, the risk of an unintended short circuit in the tank 19 is also reduced.

  In the present embodiment, the OCXO 1 further includes a mounting substrate 17 on which the heater 21 and the heater temperature sensor 49 are mounted on the same main surface (main surface 17a). The conductive piece 67 is in contact with the surface (the top surface 21 a and the top surface 49 a) of the heater 21 and the heater temperature sensor 49 opposite to the mounting substrate 17, and is floating from the mounting substrate 17.

  Therefore, for example, a relatively small electronic component can be mounted on a region of the mounting substrate 17 facing the conductive piece 67. From another viewpoint, the influence of the conductive piece 67 on the wiring and mounting on the mounting substrate 17 is relatively small. Further, for example, the conductive piece 67 can function as a shield for the heater 21, the heater temperature sensor 49, and / or other electronic components between them, and the conductive piece 67 can be actively used.

  In the present embodiment, the conductive piece 67 is in an electrically floating state.

  Therefore, for example, compared to an aspect in which the conductive piece 67 and the reference potential wiring of the mounting substrate 17 are electrically connected (this aspect is also included in the present invention), a configuration for the connection is unnecessary, and the OCXO1 The configuration is simple. For example, since there is a low risk of heat escaping from the conductive piece 67 to the reference potential wiring, the amount of heat transmitted from the heater 21 to the heater temperature sensor 49 via the conductive piece 67 is stabilized. Unlike this embodiment, in order to connect the conductive piece 67 to the reference potential wiring, for example, a bonding wire is used, or a part of the conductive piece 67 is bent and brought into contact with the reference potential wiring. That's fine.

  In the above embodiment, OCXO1 is an example of a thermostatic chamber-equipped piezoelectric device, TCXO3 is an example of a temperature-compensated piezoelectric device, and the heater 21 is an example of a temperature adjustment component.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  For example, the piezoelectric device is not limited to an oscillator. For example, a filter such as a SAW filter may be used. In the case of a filter, for example, temperature compensation is performed so that the waveform of an output signal when an input signal having a predetermined waveform is filtered approaches a predetermined shape.

  The oscillator may input and output signals other than those exemplified in the embodiment. For example, the oscillator may be one that does not receive a control voltage (outputs an oscillation signal having a predetermined constant frequency), or one that receives an enable / disable signal. Alternatively, two oscillation signals having different frequencies or the same frequency may be output.

  The vibration element is not limited to one in which a pair of electrodes is provided on both main surfaces of the piezoelectric body, and a pair of electrodes is provided on one main surface of the piezoelectric body like a SAW type vibration element. Also good. The cut angle of the piezoelectric body may be set as appropriate. The piezoelectric body is not limited to quartz but may be ceramic, for example.

  The element mounting member on which the piezoelectric body (vibration element) and the integrated circuit element are mounted is not limited to a so-called H-type having two concave portions on opposite sides. For example, the piezoelectric body and the integrated circuit element may be accommodated in one recess.

  The temperature-compensated piezoelectric device (TCXO or the like) is not limited to those mounted on the mounting substrate by bumps, and may be mounted on the mounting substrate by bonding wires or pin-shaped TCXO terminals, for example.

  The tank only needs to accommodate the temperature-compensated piezoelectric device, and does not need to accommodate the mounting substrate or the like. For example, the tank has a box shape in which one surface of a rectangular parallelepiped is opened, and is arranged so as to cover the main surface of the mounting substrate on which the temperature compensating piezoelectric device is mounted, and accommodates the temperature compensating piezoelectric device. May be. In this case, it may be considered that a six-sided tank is constituted by the five-sided tank and the mounting substrate. Further, for example, at least a part of the heater may be exposed in the tank.

  The temperature adjustment component is not limited to the one that performs heat dissipation (heating) (heater), and may be one that performs heat absorption (cooling). For example, a Peltier element exposed inside and outside the tank may be provided and function as a heating element, a cooling element, or a heating / cooling element capable of both heating and cooling.

  The conductive piece may abut against the mutually opposing surfaces or side surfaces of the heater and the temperature sensor, or may be supported on the main surface of the mounting substrate. The shape may also be set appropriately.

  The adhesive for fixing the conductive piece may be in an arrangement mode other than that shown in FIG. For example, the adhesive may cover the entire conductive piece only, or cover the entire temperature sensor only. When no underfill is provided around the heater and / or temperature sensor, the adhesive for fixing the conductive piece is located between the heater and / or temperature sensor and the mounting board and functions like an underfill. May be.

  DESCRIPTION OF SYMBOLS 1 ... Crystal oscillator with a thermostat (OCXO, piezoelectric device with a thermostat), 3 ... Temperature compensated crystal oscillator (TCXO, temperature compensated piezoelectric device), 19 ... Tank, 21 ... Heater (temperature adjustment component), 49 ... Heater Temperature sensor (temperature sensor), 51 ... temperature control circuit (control circuit), 67 ... conductive piece.

Claims (5)

A temperature-compensated piezoelectric device;
A tank containing the temperature-compensated piezoelectric device;
A temperature adjustment component capable of at least one of heat dissipation and heat absorption in the tank;
A temperature sensor disposed in the vessel;
A control circuit for controlling the temperature adjustment component such that the temperature detected by the temperature sensor becomes a predetermined target temperature;
A conductive piece in contact with the temperature adjustment component and the temperature sensor;
A piezoelectric device with a thermostatic chamber. The piezoelectric device with a thermostat according to claim 1, further comprising an insulating adhesive for fixing the conductive piece to the temperature adjusting component and the temperature sensor. The piezoelectric device with a thermostat according to claim 2, wherein the adhesive covers the entire conductive piece. The temperature adjustment component and the temperature sensor further have a mounting board mounted on the same main surface,
The said electrically conductive piece is contact | abutting on the surface on the opposite side to the said mounting board of the said temperature control component and the said temperature sensor, and has floated from the said mounting board. Piezoelectric device with thermostatic chamber. The piezoelectric device with a thermostat according to any one of claims 1 to 4, wherein the conductive piece is in an electrically floating state.

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