JP2016023994A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device that can prevent dew formation and freezing automatically and, if they occur, can remove dew and ice.SOLUTION: An electronic component conveyance device comprises a member constituting the device, a heating part for heating the member, a humidity detection part for detecting humidity, and a temperature detection part for detecting temperature. When the temperature detected by the temperature detection part is below the double of the dew point temperature, the member is heated. The humidity of the air in contact with the member is preferably lower than that of the air in contact with the humidity detection part. The temperature detection part is preferably arranged at the member.SELECTED DRAWING: Figure 6

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device.

  Such an IC device inspection may be performed by cooling the IC device to a predetermined temperature. In that case, the IC device is cooled by cooling the arrangement member on which the IC device is arranged, and the humidity of the atmosphere around the arrangement member (humidity in the apparatus) is set so as not to cause condensation or icing (icing). ).

  By the way, dew condensation may occur inside the electronic component transport apparatus. In this case, the worker confirms dew condensation and performs heating to remove the dew condensation by the operator's operation. Thereby, the dew condensation can be removed.

  Further, Patent Document 1 includes a chamber having a test stage for cooling and testing a component at a low temperature, and when temperature abnormality occurs in the chamber, the cooling is stopped and the chamber is heated. A component testing device (electronic component transport device) configured to return to room temperature is described. In Patent Document 1, it is possible to suppress the occurrence of condensation in the chamber by heating the inside of the chamber to return to normal temperature.

JP 2000-9793 A

  However, when condensation occurs inside the electronic component transport device, when heating is performed to remove the condensation by the operator's operation, if the worker cannot find condensation or makes a mistake, The IC device is transported in a state where condensation has occurred. As a result, water may adhere to the IC device, causing a short circuit and making the inspection impossible, or the IC device may be broken. Moreover, when it cools in the state where dew condensation has arisen, icing will arise.

  Further, in the component testing apparatus described in Patent Document 1, when a temperature abnormality occurs in the chamber, the cooling is uniformly stopped and the inside of the chamber is heated to return to normal temperature. When it is not necessary to return to room temperature, that is, when condensation does not occur, return to room temperature. For this reason, there is a problem that it takes a long time to resume the operation.

  In addition, in the component testing apparatus described in Patent Document 1, when temperature abnormality occurs in the chamber, the inside of the chamber is returned to room temperature, so that condensation is removed if condensation occurs in the chamber due to other causes. I can't do it.

  An object of the present invention is to provide an electronic component transport apparatus and an electronic component inspection apparatus capable of automatically preventing condensation or icing and removing the condensation or icing when it occurs. It is in.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
The electronic component conveying apparatus of the present invention includes a member constituting the apparatus,
A heating unit for heating the member;
A humidity detector for detecting humidity;
A temperature detection unit for detecting the temperature,
The member is heated when the temperature detected by the temperature detection unit is not more than twice the dew point temperature.

  Thereby, it is possible to automatically prevent condensation or icing from forming on the members constituting the electronic component transport apparatus, and to remove the condensation or icing when they occur.

[Application Example 2]
In the electronic component conveying apparatus of the present invention, it is preferable that the member is heated when the temperature detected by the temperature detection unit is 0.5 times or more and 2 times or less of the dew point temperature.

  Thereby, it is possible to automatically prevent condensation or icing from forming on the members constituting the electronic component transport apparatus, and to remove the condensation or icing when they occur.

[Application Example 3]
In the electronic component transport device of the present invention, it is preferable that the humidity of the air in contact with the member is lower than the humidity of the air in contact with the humidity detection unit.

  As a result, when the temperature detection unit is not attached to the member and the temperature of the member is set lower than the temperature around the temperature detection unit, the probability of condensation or icing increases. By reducing the humidity of the surrounding air, the probability of condensation or icing can be reduced.

[Application Example 4]
In the electronic component transport device of the present invention, it is preferable that the temperature detection unit is disposed on the member.

  Thereby, the temperature of the member can be directly measured, and by placing the temperature detection part in a part that does not like condensation, it is possible to prevent condensation or icing from occurring in a part that does not like condensation. In the case of condensation or icing, it can be removed.

[Application Example 5]
In the electronic component transport device of the present invention, it is preferable that the member is disposed in a room controlled to a predetermined humidity of the electronic component transport device.

  Thereby, it is possible to prevent the formation of condensation or icing on the member which is not particularly desired to cause dew condensation or icing, and to remove the condensation or icing when it occurs.

[Application Example 6]
In the electronic component conveying apparatus of the present invention, it is preferable that the heating unit includes a heating wire.
Thereby, dew condensation or icing can be removed easily and rapidly.

[Application Example 7]
In the electronic component conveying apparatus of the present invention, it is preferable that the heating unit includes a blower source.
Thereby, condensation or icing can be removed more easily and quickly.

[Application Example 8]
In the electronic component transport device of the present invention, it is preferable that the heating is stopped when the humidity in the room of the electronic component transport device becomes a predetermined first threshold value or less.

  Thereby, it is possible to prevent condensation or icing from occurring on the member, and to remove the condensation or icing when it occurs.

[Application Example 9]
In the electronic component conveying apparatus of the present invention, it is preferable that the heating is stopped when a predetermined time has elapsed.

  Thereby, it is possible to prevent condensation or icing from occurring on the member, and to remove the condensation or icing when it occurs.

[Application Example 10]
The electronic component conveying apparatus of the present invention includes a member constituting the apparatus,
A heating unit for heating the member,
The member is heated when a predetermined condition is satisfied.

  Thereby, it is possible to automatically prevent condensation or icing from forming on the members constituting the electronic component transport apparatus, and to remove the condensation or icing when they occur.

[Application Example 11]
In the electronic component transport device of the present invention, it is preferable that the member has a cooling member on which electronic components can be arranged and cooled.

  Thereby, it is possible to prevent condensation or icing from forming on the cooling member, and to remove it when condensation or icing occurs.

[Application Example 12]
In the electronic component conveying apparatus of the present invention, it is preferable that the condition is that the power is turned off in a state where the cooling member is cooled and the power is turned on after that.

  Thereby, it is possible to prevent condensation or icing from forming on the cooling member, and to remove it when condensation or icing occurs.

[Application Example 13]
In the electronic component transport device of the present invention, the condition is that the power is turned off in a state where the cooling member is cooled, and the power is turned on within a preset time from when the power is turned off. Preferably there is.

  Thereby, it is possible to prevent condensation or icing from forming on the cooling member, and to remove it when condensation or icing occurs.

[Application Example 14]
In the electronic component conveying apparatus of the present invention, liquid nitrogen is used for cooling the cooling member,
The condition is preferably a case where the liquid nitrogen is leaking.

  Thereby, an unexpected part is cooled, and it is possible to prevent condensation or icing from occurring in that part, and it is possible to remove it when condensation or icing occurs.

[Application Example 15]
In the electronic component transport apparatus according to the aspect of the invention, it is preferable that the condition is that the humidity in at least one room of the electronic component transport apparatus is equal to or higher than a predetermined second threshold value.

  Thereby, it is possible to prevent condensation or icing from occurring on the member, and to remove the condensation or icing when it occurs.

[Application Example 16]
In the electronic component transport device of the present invention, a dry gas is supplied into at least one chamber of the electronic component transport device,
The condition is preferably when the supply of the gas is stopped or the flow rate of the gas is reduced to a predetermined value or less.

  Thereby, it is possible to prevent condensation or icing from occurring on the member, and to remove the condensation or icing when it occurs.

[Application Example 17]
In the electronic component conveying device of the present invention, the electronic component conveying device has a plurality of control modes for controlling the operation of the electronic component conveying device,
It is preferable to have a display unit that displays an image corresponding to the currently set control mode among the plurality of control modes.

  Thereby, for example, by displaying information on, for example, condensation or icing, a coping method, etc. on the display unit, the operator can grasp it and can easily and quickly respond.

[Application Example 18]
The electronic component inspection apparatus of the present invention includes a member constituting the apparatus,
A heating unit for heating the member;
A humidity detector for detecting humidity;
A temperature detector for detecting the temperature;
An inspection unit for inspecting electronic components,
The member is heated when the temperature detected by the temperature detection unit is not more than twice the dew point temperature.

  Thereby, it is possible to automatically prevent dew condensation or icing on the members constituting the electronic component inspection apparatus, and to remove the dew condensation or icing when it occurs.

It is a schematic plan view which shows 1st Embodiment of the electronic component inspection apparatus of this invention. It is a block diagram of the electronic component inspection apparatus shown in FIG. It is a figure which shows the display screen of the display part of the electronic component inspection apparatus shown in FIG. It is a figure which shows the display screen of the display part of the electronic component inspection apparatus shown in FIG. It is a figure which shows the display screen of the display part of the electronic component inspection apparatus shown in FIG. It is a flowchart which shows the control operation of the electronic component inspection apparatus shown in FIG. It is a flowchart which shows the control operation of the electronic component inspection apparatus shown in FIG. It is a flowchart which shows the control operation of the electronic component inspection apparatus shown in FIG. It is a block diagram which shows 2nd Embodiment of the electronic component inspection apparatus of this invention. It is a schematic plan view which shows 3rd Embodiment of the electronic component inspection apparatus of this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. 3 to 5 are diagrams showing display screens of the display unit of the electronic component inspection apparatus shown in FIG. 6 to 8 are flowcharts showing the control operation of the electronic component inspection apparatus shown in FIG.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. The direction of the arrow of each axis of the X axis, the Y axis, and the Z axis is referred to as a plus side, and the direction opposite to the arrow is referred to as a minus side. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Each of these regions is partitioned from each other by a wall portion, a shutter, or the like (not shown). The supply area A2 is a first chamber R1 defined by walls and shutters, and the inspection area A3 is a second chamber R2 defined by walls and shutters. In addition, the collection area A4 is a third chamber R3 defined by walls and shutters. The first chamber R1 (supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (collection region A4) are each configured to ensure airtightness and heat insulation. ing. Thereby, each of the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible. The interiors of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively.

  The IC device 90 is inspected in the intermediate inspection area A3 through the respective areas in order from the tray supply area A1 to the tray removal area A5. As described above, the inspection apparatus 1 includes the electronic component transport apparatus that transports the IC device 90 in each region and has the control unit 80, the inspection unit 16 that performs inspection in the inspection region A3, and the inspection control unit (not shown). It has become. In the inspection apparatus 1, an electronic component transport apparatus is configured by a configuration excluding the inspection unit 16 and the inspection control unit.

  The tray supply area A1 is an area to which a tray 200 in which a plurality of IC devices 90 in an uninspected state are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3. A first tray transport mechanism 11A and a second tray transport mechanism 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjustment unit (soak plate) 12, which is an arrangement unit for arranging the IC device 90, a first device transport head (transport member) 13, and a third tray transport mechanism 15 are provided. ing.

  The temperature adjustment unit 12 is an apparatus that heats or cools the plurality of IC devices 90 to adjust (control) the IC devices 90 to a temperature suitable for inspection. That is, the temperature adjustment unit 12 is a cooling member (member) that can dispose the IC device 90 and can be cooled. In the configuration shown in FIG. 1, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the first tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The first device transport head 13 is supported so as to be movable in the supply region A2. Thereby, the first device transport head 13 transports the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, the temperature adjustment unit 12, and a device supply unit 14 to be described later. And the IC device 90 can be transported between them. The first device transport head 13 has a plurality of gripping portions (not shown) that grip the IC device 90. Each gripping portion includes a suction nozzle and sucks the IC device 90. Hold it.

  The third tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state where all the IC devices 90 are removed in the X direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, which is an electronic component transfer unit that transfers the IC device 90, an inspection unit 16, a second device transfer head (contact portion) 17, and a device recovery (Recovery shuttle) 18 is provided.

  The device supply unit 14 is a device that conveys the temperature-adjusted (temperature-controlled) IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. . In the device supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. That is, the device supply unit 14 is a cooling member (member) on which the IC device 90 can be disposed and can be cooled.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, that is, a holding unit that holds the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in a storage unit of an inspection control unit provided in a tester (not shown) connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection. That is, the inspection unit 16 is a cooling member (member) on which the IC device 90 can be disposed and can be cooled.

  The second device transport head 17 is supported so as to be movable in the inspection area A3. Accordingly, the second device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply region A2 onto the inspection unit 16. When inspecting the IC device 90, the second device transport head 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16. Thereby, as described above, the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected. The second device transport head 17 has a plurality of gripping portions (not shown) that grip the IC device 90, and each gripping portion includes a suction nozzle and sucks the IC device 90. Hold it. In the second device transport head 17, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. That is, the second device transport head 17 is a cooling member (member) on which the IC device 90 can be disposed and can be cooled.

  The device collection unit 18 is an apparatus that conveys the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 1, two device collection units 18 are arranged in the Y direction, like the device supply unit 14, and the IC device 90 on the inspection unit 16 is connected to any one of the device collection units 18. Transported and placed. This transport is performed by the second device transport head 17.

  The collection area A4 is an area where the IC device 90 that has been inspected is collected. In the collection area A4, a collection tray 19, a third device transport head (transport member) 20, and a sixth tray transport mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 1, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The third device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the third device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. The third device transport head 20 has a plurality of gripping portions (not shown) that grip the IC device 90, and each gripping portion includes a suction nozzle and sucks the IC device 90. Hold it.

  The sixth tray transport mechanism 21 is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, a fourth tray transport mechanism 22A and a fifth tray transport mechanism 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism for transporting an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The test control unit of the tester, for example, inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a storage unit (not shown).

  Further, the control unit 80 includes, for example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the temperature adjustment unit 12, the first device transport head 13, the device supply unit 14, and the third supply unit. Tray transport mechanism 15, inspection unit 16, second device transport head 17, device collection unit 18, third device transport head 20, sixth tray transport mechanism 21, and fourth tray transport mechanism The drive of each part of 22A and the 5th tray conveyance mechanism 22B is controlled.

  As shown in FIG. 2, the inspection apparatus 1 detects a temperature sensor (temperature detection unit) 41 that detects temperature, a humidity sensor (humidity detection unit) 42 that detects humidity, and a flow rate of dry air described later. A flow sensor 43 for heating, a heating mechanism (heating unit) 51 for heating, a cooling mechanism (cooling unit) 52 for cooling, a dry air supply mechanism (dry air supply unit) 53 for supplying dry air, and the inspection apparatus 1 An operation unit 6 for performing each operation and an alarm 71 are provided. In FIG. 2, for example, only one of the temperature sensor 41, the humidity sensor 42, the flow rate sensor 43, the heating mechanism 51, and the like is illustrated. The control unit 80 includes a storage unit 801 that stores each information, a timer 802 that measures time, and a determination unit 803 that performs each determination (determination). The heating mechanism 51, the cooling mechanism 52, and the dry air The drive of each part, such as the supply mechanism 53, the display part 62, and the alarm 71, is controlled.

The temperature sensor 41 and the humidity sensor 42 are respectively disposed in predetermined portions inside the inspection apparatus 1, that is, in the first embodiment, the first chamber R1 and the second chamber R2. Thus, the temperature and humidity in the first chamber R1 and the second chamber R2 can be detected, respectively. In this case, the temperature sensor 41 may be disposed at any position in the first chamber R1 and the second chamber R2, but the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport It is preferable that it is disposed on the head 17. Thereby, the temperature of the temperature adjustment part 12, the device supply part 14, the test | inspection part 16, and the 2nd device conveyance head 17 can be measured directly.
In the present embodiment, each humidity is a relative humidity.

  The flow rate sensor 43 is disposed in each of the predetermined air flow units 43 in the inspection apparatus 1, in the present embodiment, in each of the dry air flow paths of the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device recovery unit 18. The flow rate sensor 43 can detect the flow rate of the dry air in the flow path.

  The operation unit 6 includes an input unit 61 that performs each input and a display unit 62 that displays an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. When the operator operates the operation unit 6, for example, by operating the input unit 61, moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking). In the following, this operation is also referred to as “pressing the operation button”.

  Note that some or all of the operation buttons displayed on the display unit 62 may be provided as mechanical operation buttons such as push buttons.

  Further, the operation unit 6 is not limited to the one having the above-described configuration, and examples thereof include a device such as a touch panel that can input and display an image.

  Moreover, it does not specifically limit as the heating mechanism 51, For example, the heater etc. which have a heating wire are mentioned. Moreover, the heating mechanism 51 may further include an air source such as a fan, and may be configured to blow warm air (hot air) from the air source. In this embodiment, the heating mechanism 51 is arrange | positioned at the temperature adjustment part 12, the device supply part 14, the test | inspection part 16, and the 2nd device conveyance head 17, and these can be heated now. Note that when the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17 are heated, the temperature adjustment unit 12, the device supply unit 14, and the inspection unit 16 according to the heating, respectively. The temperature of the chamber in which the second device transport head 17 is disposed also rises.

  In addition, the cooling mechanism 52 is not particularly limited, and examples thereof include a device that cools by flowing a refrigerant (for example, a low-temperature gas) through a tube disposed in the vicinity of the object to be cooled, a Peltier element, and the like. In the present embodiment, the cooling mechanism 52 uses a device that cools the refrigerant by flowing it into a pipe disposed in the vicinity of the object to be cooled, and uses nitrogen gas obtained by vaporizing liquid nitrogen as the refrigerant. In the present embodiment, the cooling mechanism 52 can cool the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17, respectively. Note that when the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17 are cooled, the temperature adjustment unit 12, the device supply unit 14, and the inspection unit 16 according to the cooling. In addition, the temperature of the chamber in which the second device transport head 17 is disposed also decreases.

  The dry air supply mechanism 53 is configured to be able to supply (flow) low-humidity air or a gas such as nitrogen (hereinafter also referred to as dry air) to each predetermined part inside the inspection apparatus 1. ing. When the IC device 90 is cooled to a predetermined temperature and inspected, each necessary part is cooled accordingly, but by supplying dry air to each necessary part, condensation and icing (freezing) can be prevented. it can. In the present embodiment, the dry air supply mechanism 53 can supply dry air to the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device collection unit 18, that is, the first chamber R1, the second chamber R2, and the first chamber R2. Dry air can be supplied to the three chambers R3.

  Note that the humidity of the air in contact with the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17 is preferably lower than the humidity of the air in contact with the humidity sensor 42. Thereby, when the temperature sensor 41 is not attached to the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17, the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16 and When the temperature of the second device transport head 17 is set to be lower than the temperature around the temperature sensor 41, the probability of condensation or icing increases, but the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the first By reducing the humidity of the air around the second device transport head 17, the probability of condensation or icing can be reduced.

  In the present embodiment, the dry air used in the dry air supply mechanism 53 is a mixed gas of nitrogen gas after use in the cooling mechanism 52 and air having low humidity when cooled by the cooling mechanism 52. When the cooling is stopped, only the low humidity air is used.

  In the inspection device 1, at least one condition for at least one of the members (component members) constituting the inspection device 1 to condense or freeze is stored in advance in the storage unit 801 of the control unit 80. Then, the determination unit 803 determines whether any of the above conditions is satisfied. When any of the above conditions is satisfied, the heating mechanism 51 heats the constituent member.

  Hereinafter, the condition is also referred to as “condensation condition”. In the present embodiment, the constituent members will be described as the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17, but in the following, these are collectively referred to as “cooling member”. "

In the present embodiment, the following dew condensation conditions (1) to (3) are stored in the storage unit 801.
(1) When the humidity in at least one of the first chamber R1 and the second chamber R2 is equal to or higher than a predetermined threshold (second threshold) α set in advance.

  When this dew condensation condition is satisfied, that is, when the humidity of the first chamber R1 is equal to or higher than the threshold value α, the cooling member disposed in the first chamber R1 is heated, and the humidity of the second chamber R2 is the threshold value α. In the above case, the cooling member disposed in the second chamber R2 is heated. In the following, such distinction is not described, but simply referred to as “heating”.

(2) When the power is turned off while the cooling member is cooled, and then the power is turned on.
A condition is further added to this dew condensation condition, “when the power is turned off while the cooling member is cooled, and the power is turned on within a preset time t1 from when the power is turned off. Is preferable. The reason for this is that even if the power is turned off while the cooling member is cooled and then the power is turned on, if the power has been turned off for a long time, the temperature of the cooling member rises during that time, causing condensation. This is because there is a high possibility that no freezing will occur.

  Moreover, when this dew condensation condition is satisfy | filled, each cooling member is heated. Hereinafter, it is simply referred to as “heating”.

  (3) When the supply of dry air stops or the flow rate of dry air drops below a predetermined value.

  It is preferable that a condition is further added to the dew condensation condition, and “the case where the supply of dry air is stopped or the flow rate of the dry air is reduced to a predetermined value or less and cooling is being performed” is preferable. The reason is that there is a high possibility that condensation and icing will not occur unless cooling is in progress.

  When this dew condensation condition is satisfied, the dry air is supplied to the cooling member in which the supply of dry air is stopped or the flow rate of the dry air is reduced to a predetermined value or less, that is, the room in which the cooling member is disposed. In the following, such a distinction is not shown, and it is simply referred to as “supplying dry air”.

Next, the control operation of the inspection apparatus 1 will be described.
The inspection apparatus 1 has a plurality of control modes for controlling its operation. In the present embodiment, the control mode includes a first control mode (power failure recovery mode), a second control mode (overhumidity detection mode), and a third control mode (dry air abnormality mode). ing.

  The first control mode is a control mode in a process (initial process) when the power is turned on after the power is turned off. The second control mode is a control mode in a process performed by monitoring the humidity after the initial process. The third control mode is a control mode in a process performed by monitoring the supply of dry air after the initial process.

  Hereinafter, a process when the power is turned on after being turned off will be described with reference to FIG. 6, and a process performed by monitoring the humidity after the initial process will be described with reference to FIG. A process performed by monitoring the supply of dry air after the initial process will be described.

  First, the control operation of the inspection apparatus 1 in the initial process when the power is turned on after the power is turned off will be described.

  Note that the time has been measured by the timer 802 since the previous power-off, and the time (elapsed time) measured by the timer 802 is “ta”.

  As shown in FIG. 6, first, the power is turned on (step S101), and then the humidity (relative humidity) RH in the first chamber R1 and the second chamber R2 is detected by the humidity sensor 42 (step S102). In each of the first chamber R1 and the second chamber R2, it is determined whether or not the humidity RH is greater than or equal to a threshold value α (step S103).

  When it is determined that the humidity RH is equal to or higher than the threshold value α, condensation or icing has occurred, or there is a possibility that condensation or icing may occur, and notification (B) is performed (step S111).

  The threshold α is not particularly limited and is appropriately set according to various conditions, but is preferably set within a range of 90% or more and 100% or less, and is preferably 95% or more and 100% or less. More preferably, it is set within the range. In this embodiment, for example, it is set to 100%.

  In step S111, the image shown in FIG. 3 is displayed on the screen 620 of the display unit 62, the alarm 71 is activated, and a warning sound is generated. As a result, the operator grasps that an abnormality has occurred, that is, an abnormality that may lead to condensation or icing, and details of the abnormality are displayed on the display unit 62. The coping method can be grasped. Note that the image shown in FIG. 3 is an example, and an example thereof will be described below.

  As shown in FIG. 3, the image is called a first image (main window) 621 displayed on the entire screen 620, a dialog box, or the like, and is displayed on the first image 621 from the first image 621. And a second image (subwindow) 622 displayed smaller.

In the first image 621, “stopped” is displayed at the upper left in FIG. 3 on the screen 620.
In the second image 622, the current state of the inspection apparatus 1 (contents of abnormality) such as “A humidity abnormality has occurred at the index” in the frame 623, “START after selecting RETRY, CLEAN OUT” is displayed. Please display a message such as "Solution". The index is “second chamber R2 (inspection area A3)”.

  Note that the notification method in step S111 and the notification described later is not limited to the above-described method, and other examples include lighting and flashing of a light emitting unit such as a lamp.

Next, the dry air supply mechanism 53 is driven to start supplying dry air (step S112), and the heating mechanism 51 is driven to start heating the cooling member (step S113). Thereby, when condensation or icing has occurred, the condensation or icing is removed. Further, since the humidity is lowered, it is possible to prevent condensation and icing from occurring.
Next, the humidity RH in the first chamber R1 and the second chamber R2 is detected by the humidity sensor 42 (step S114). In the first chamber R1 and the second chamber R2, the humidity RH is set to a predetermined threshold value (first It is determined whether or not (threshold) β or less (step S115).

  If it is determined that the humidity RH is not equal to or less than the threshold value β, the process returns to step S114, and step S114 and subsequent steps are executed again. If the humidity RH is determined to be equal to or less than the threshold value β, the process proceeds to step S116.

  The threshold value β is not particularly limited as long as it does not cause condensation or icing, and is appropriately set according to various conditions, but it should be set within a range of 50% or more and less than 100%. Is preferably set within a range of 80% or more and less than 100%, and more preferably set within a range of 80% or more and 90% or less. The threshold value β is preferably set to a value smaller than the threshold value α.

  If it is determined in step S103 that the humidity RH is not greater than or equal to the threshold value α, it is determined whether or not the previous power-off was performed during cooling (step S104).

  When it is determined that the previous power-off was performed during cooling, it is determined whether or not the time ta measured by the timer 802 is equal to or less than a predetermined time t1 (step S105), and the time ta is equal to or less than the time t1. If it is determined that there is a possibility of condensation or icing, or there is a possibility that condensation or icing may occur, and a notification (A) is made (step S106).

  The reason why the previous power supply was cut off, in particular, the reason why the previous power supply was cut off during cooling is, for example, a power failure, a case where an operator presses an emergency stop button, or the like.

  The time t1 is not particularly limited and is appropriately set according to various conditions, but is preferably set within a range of 5 hours or less, and is set within a range of 4 hours or less. Is more preferable, and it is even more preferable to set within a range of 3 hours or less.

  In step S106, the image shown in FIG. 4 is displayed on the screen 620 of the display unit 62, the alarm 71 is activated, and a warning sound is generated. As a result, the operator grasps that an abnormality has occurred, that is, an abnormality that may lead to condensation or icing, and details of the abnormality are displayed on the display unit 62. The coping method can be grasped. Note that the image shown in FIG. 4 is an example, and an example thereof will be described below.

  As shown in FIG. 4, “stopped” is displayed in the upper left frame 624 in FIG. 4 in the image. In addition, in the frame 624, messages such as “Power supply cut at low temperature. Dry purge in progress” are displayed.

  Next, the dry air supply mechanism 53 is driven to start supplying dry air (step S107), the heating mechanism 51 is driven to start heating the cooling member (step S108), and time (elapsed time) is set by the timer 802. Measurement of tb is started (step S109). Thereby, when condensation or icing has occurred, the condensation or icing is removed. Further, since the humidity is lowered, it is possible to prevent condensation and icing from occurring.

  Next, it is determined whether or not the time tb measured by the timer 802 is equal to or longer than the predetermined time t2 (step S110). If it is determined that the time tb is equal to or longer than the predetermined time t2, the process proceeds to step S116. .

  The time t2 is not particularly limited and is appropriately set according to various conditions, but is preferably set within a range of 5 minutes or more and 1 hour or less, and is preferably 10 minutes or more and 40 minutes or less. More preferably, it is set within the range.

  Next, driving of the heating mechanism 51 is stopped, heating of the cooling member is stopped (step S116), driving of the dry air supply mechanism 53 is stopped, supply of dry air is stopped (step S117), and a standby state is set. (Step S118).

  If it is determined in step S105 that the time ta is not less than or equal to the time t1, it is estimated that sufficient time has passed since the last power-off and no condensation or icing occurs, and a special process is performed. Is not performed, and a standby state is set (step S118).

  If it is determined in step S104 that the previous power-off has not been performed during cooling, it is estimated that no condensation or icing will occur, and no special processing is performed and a standby state is entered (step S118). ). The description of the subsequent operation is omitted.

  Next, the control operation of the inspection apparatus 1 performed by monitoring the humidity after the initial process will be described. This process is performed in each of the operating state and the standby state.

  First, the humidity (relative humidity) RH in the first chamber R1 and the second chamber R2 is detected by the humidity sensor 42, and the humidity RH is respectively detected in the first chamber R1 and the second chamber R2, as shown in FIG. Is greater than or equal to the threshold value α (step S201). The detection and judgment of the humidity are made periodically. This threshold value α is the same as the threshold value α in step S103.

  If it is determined that the humidity RH is not equal to or higher than the threshold value α, it is estimated that condensation or icing does not occur, and the process proceeds to the next step without performing any special processing. The description of the subsequent operation is omitted.

  Further, when it is determined in step S201 that the humidity RH is equal to or higher than the threshold value α, condensation or icing may occur, or condensation or icing may occur, and notification is given (step S202).

  In step S202, the image shown in FIG. 3 is displayed on the screen 620 of the display unit 62, the alarm 71 is activated, and a warning sound is generated. This step S202 is the same as step S111.

  Next, it is determined whether or not cooling is being performed by the cooling mechanism 52 (step S203). If it is determined that cooling is not being performed, the dry air supply mechanism 53 is driven to start supplying dry air (step S204). ), The process proceeds to step S206. If it is determined in step S203 that the cooling is being performed, the driving of the cooling mechanism 52 is stopped, the cooling is stopped (step S205), and the process proceeds to step S206. Note that, during the cooling, since the dry air is supplied by the dry air supply mechanism 53, the supply of the dry air is continued.

  Next, the heating mechanism 51 is driven to start heating the cooling member (step S206). Thereby, when condensation or icing has occurred, the condensation or icing is removed. Further, since the humidity is lowered, it is possible to prevent condensation and icing from occurring.

  Next, the humidity RH in the first chamber R1 and the second chamber R2 is detected by the humidity sensor 42 (step S207). Whether the humidity RH is less than or equal to the threshold value β in the first chamber R1 and the second chamber R2, respectively. It is determined whether or not (step S208). This threshold value β is the same as the threshold value β in step S115.

  If it is determined that the humidity RH is not less than or equal to the threshold value β, the process returns to step S207, and step S207 and subsequent steps are executed again.

  If it is determined in step S208 that the humidity RH is equal to or less than the threshold value β, the driving of the heating mechanism 51 is stopped, the heating of the cooling member is stopped (step S209), and the driving of the dry air supply mechanism 53 is stopped. Then, the supply of dry air is stopped (step S210), and the process proceeds to the next step. The description of the subsequent operation is omitted.

  Next, the control operation of the inspection apparatus 1 performed by monitoring the supply of dry air after the initial process will be described.

  First, as shown in FIG. 8, it is determined whether or not there is an abnormality in the supply of dry air by the dry air supply mechanism 53 (step S301).

  In step S301, when the supply of dry air is stopped or the flow rate of the dry air is reduced to a predetermined value a or less, it is determined that there is an abnormality, and when the flow rate of the dry air is not less than the predetermined value a, it is not abnormal (normal ). Note that the flow rate of the dry air is detected by the flow rate sensor 43, and the detection of the flow rate of the dry air and the determination are made periodically.

  The predetermined value a is not particularly limited, and is set as appropriate according to various conditions, but is preferably set within a range of 100 mL / second or less, and is set within a range of 10 mL / second or less. More preferably.

  If it is determined that there is an abnormality in the supply of dry air, condensation or icing has occurred, or there is a possibility that condensation or icing has occurred, and a notification is given (step S302).

  In step S302, the image shown in FIG. 5 is displayed on the screen 620 of the display unit 62, the alarm 71 is activated, and a warning sound is generated. As a result, the operator grasps that an abnormality has occurred, that is, an abnormality that may lead to condensation or icing, and details of the abnormality are displayed on the display unit 62. The coping method can be grasped. Note that the image shown in FIG. 5 is an example, and an example thereof will be described below.

  As shown in FIG. 5, the image includes a first image 621 displayed on the entire screen 620, and a second image 622 displayed on the first image 621 smaller than the first image 621. have.

In the first image 621, “Stopped” is displayed on the upper left in FIG. 5 of the screen 620.
In the second image 622, the current state of the inspection apparatus 1 (contents of abnormality) such as “Shuttle part purge flow rate is abnormal” in the frame 623, “START after selecting RETRY, CLEAN OUT” Each message such as a coping method is displayed. Also, the abnormal part is indicated by a circle 625. The shuttle unit is the “device supply unit 14”.

  Next, the cooling mechanism 52 is stopped, cooling is stopped (step S304), the heating mechanism 51 is driven, heating of the cooling member is started (step S305), and the process proceeds to the next step. Thereby, when condensation or icing has occurred, the condensation or icing is removed. Further, since the humidity decreases as the temperature rises, it is possible to prevent condensation and icing from occurring.

  If it is determined in step S303 that cooling is not in progress, it is estimated that condensation or icing will not occur, and the process proceeds to the next step without performing any special processing.

  If it is determined in step S301 that there is no abnormality in the supply of dry air, it is estimated that no condensation or icing will occur, and the process proceeds to the next step without performing any special processing. The description of the subsequent operation is omitted.

  As described above, according to this inspection apparatus 1, when any of the plurality of dew condensation conditions is satisfied, it is estimated that dew condensation or icing has occurred, or that dew condensation or icing will occur. Then, the heating mechanism 51 is driven to heat the cooling member.

  Thereby, when dew condensation or icing has occurred, it is possible to remove the dew condensation or icing and to prevent dew condensation or icing from occurring.

  Further, there is no need for the operator to check condensation or icing or to perform an operation for heating, and the inspection apparatus 1 automatically estimates that condensation or icing has occurred, or that condensation or icing has occurred. In particular, since the cooling mechanism is heated by driving the heating mechanism 51, it is possible to prevent trouble and dew condensation or icing from being removed due to an operator's confirmation error or the like.

  The inspection apparatus 1 may further include a sensor that detects condensation or icing. When condensation or icing has occurred, it is possible to detect the occurrence of condensation or icing with this sensor, thereby removing the condensation or icing.

  The sensor is not particularly limited as long as it can detect condensation or icing, and examples thereof include a leak sensor.

Second Embodiment
FIG. 9 is a block diagram showing a second embodiment of the electronic component inspection apparatus of the present invention.

  Hereinafter, although the second embodiment will be described, the description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

As shown in FIG. 9, the inspection apparatus 1 according to the second embodiment includes a leakage sensor 44 as a sensor that detects leakage of liquid nitrogen used for the refrigerant of the cooling mechanism 52.
In addition to the condensation conditions (1) to (3) described in the first embodiment, the condensation condition “when the liquid nitrogen is leaking” is added as the condensation condition.

  The inspection apparatus 1 periodically detects the leakage of liquid nitrogen by the leakage sensor 44. When the leakage of liquid nitrogen is detected, the inspection apparatus 1 drives a heating mechanism (not shown) and uses the leakage of liquid nitrogen from the inspection apparatus 1. Heat the part to be cooled. As a result, an unexpected portion is cooled by the leaked liquid nitrogen, so that condensation or icing can be prevented from occurring in that portion, and when condensation or icing occurs, it can be removed.

  According to the second embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

<Third Embodiment>
FIG. 10 is a schematic plan view showing a third embodiment of the electronic component inspection apparatus of the present invention.

  In the following, the third embodiment will be described. The description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As shown in FIG. 10, in the inspection apparatus 1 of the third embodiment, a humidity sensor 45 is provided outside the inspection apparatus 1, and the humidity outside the inspection apparatus 1 is detected by the humidity sensor 45.

  Further, as the condensation condition, in addition to the condensation conditions (1) to (3) described in the first embodiment, the condensation “when the humidity outside the inspection apparatus 1 is equal to or higher than a predetermined threshold value”. A condition has been added.

  The inspection device 1 periodically detects the humidity outside the inspection device 1 by the humidity sensor 45, and when the humidity is equal to or higher than a predetermined threshold value, drives a heating mechanism (not shown) The outer wall of the apparatus 1 is heated. Thereby, it is possible to prevent condensation or icing from occurring on the outer wall or the like of the inspection apparatus 1 and to remove it when condensation or icing occurs.

  According to the third embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
Hereinafter, although the fourth embodiment will be described, the description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  The inspection apparatus 1 according to the fourth embodiment is obtained by changing the condensation condition (1) described in the first embodiment to the following condensation condition (1A).

(1A) When the temperature detected by the temperature sensor 41 is not more than twice the dew point temperature.
If the temperature detected by the temperature sensor 41 is less than or equal to twice the dew point temperature, there is a possibility that dew point temperature will be formed, and condensation or icing may occur. When icing or icing has occurred, it is possible to remove the icing or icing, and to prevent icing or icing from occurring.

  The dew point temperature can be obtained based on the temperature detected by the temperature sensor 41 and the humidity detected by the humidity sensor 42. That is, the storage unit 801 of the control unit 80 stores in advance a calibration curve such as a table for calculating the dew point temperature and an arithmetic expression based on the temperature and humidity, and the control unit 80 uses the calibration curve. Determine the dew point temperature.

  In the present embodiment, heating is performed when the temperature detected by the temperature sensor 41 is not more than twice the dew point temperature, but heating is performed when the temperature is not less than 0.5 times and not more than 2 times the dew point temperature. It is more preferable to heat when it becomes 1.05 times or more and 2 times or less, and it is more preferable to heat when it becomes 1.05 times or more and 1.5 times or less. It is particularly preferable to heat when it becomes 1 to 1.4 times.

  According to the fourth embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part has the same function. Any configuration can be substituted. Moreover, other arbitrary components may be added.

  Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.

1 ... Inspection equipment (electronic parts inspection equipment)
11A... First tray transport mechanism 11B... Second tray transport mechanism 12... Temperature adjustment unit (soak plate)
13 …… First device transfer head 14 …… Device supply unit (supply shuttle)
15 …… Third tray transport mechanism 16 …… Inspection unit 17 …… Second device transport head 18 …… Device recovery unit (recovery shuttle)
DESCRIPTION OF SYMBOLS 19 ... Collecting tray 20 ... 3rd device conveyance head 21 ... 6th tray conveyance mechanism 22A ... 4th tray conveyance mechanism 22B ... 5th tray conveyance mechanism 41 ... Temperature sensors 42, 45 …… Humidity sensor 43 …… Flow sensor 44 …… Leak sensor 51 …… Heating mechanism 52 …… Cooling mechanism 53 …… Dry air supply mechanism 6 …… Operation section 61 …… Input section 62 …… Display section 620 …… Screen 621... First image 622... Second image 623, 624... Frame 625... Circle 71 .. Alarm 80... Control unit 801... Storage unit 802. ... IC device 200 ... Tray A1 ... Tray supply area A2 ... Device supply area (supply area)
A3: Inspection area A4: Device collection area (collection area)
A5 …… Tray removal area R1 …… First chamber R2 …… Second chamber R3 …… Third chamber S101 to S118 …… Step S201 to S210 …… Step S301 to S305 …… Step

Claims (18)

Members constituting the device;
A heating unit for heating the member;
A humidity detector for detecting humidity;
A temperature detection unit for detecting the temperature,
The electronic component conveying apparatus, wherein the member is heated when the temperature detected by the temperature detecting unit is not more than twice the dew point temperature.   The electronic component transport apparatus according to claim 1, wherein the member is heated when a temperature detected by the temperature detection unit is 0.5 times or more and 2 times or less of a dew point temperature.   The electronic component transport apparatus according to claim 1, wherein a humidity of air in contact with the member is lower than a humidity of air in contact with the humidity detection unit.   The electronic component conveying apparatus according to claim 1, wherein the temperature detection unit is disposed on the member.   5. The electronic component transport apparatus according to claim 1, wherein the member is disposed in a room controlled to a predetermined humidity of the electronic component transport apparatus.   The electronic component conveying apparatus according to claim 1, wherein the heating unit includes a heating wire.   The electronic component transport apparatus according to claim 6, wherein the heating unit includes a blower source.   The electronic component conveying apparatus according to any one of claims 1 to 7, wherein the heating is stopped when a humidity in the room of the electronic component conveying apparatus becomes a predetermined first threshold value or less.   The electronic component conveying apparatus according to claim 1, wherein the heating is stopped when a predetermined time has elapsed. Members constituting the device;
A heating unit for heating the member,
An electronic component conveying apparatus, wherein the member is heated when a predetermined condition is met.   The electronic component conveying apparatus according to claim 10, wherein the member includes a cooling member on which an electronic component can be arranged and can be cooled.   The electronic component conveying apparatus according to claim 11, wherein the condition is a case where the power is turned off while the cooling member is cooled, and the power is turned on after that.   The electronic component according to claim 11, wherein the condition is a case where the power is turned off in a state where the cooling member is cooled, and the power is turned on within a preset time from when the power is turned off. Conveying device. Liquid nitrogen is used for cooling the cooling member,
The electronic component conveying apparatus according to claim 11, wherein the condition is a case where the liquid nitrogen is leaking.   15. The electronic component transport apparatus according to claim 10, wherein the condition is a case where the humidity in at least one room of the electronic component transport apparatus is equal to or higher than a predetermined second threshold value. A dry gas is supplied into at least one chamber of the electronic component transport device;
The electronic component conveying apparatus according to any one of claims 10 to 15, wherein the condition is a case where supply of the gas is stopped or a flow rate of the gas is decreased to a predetermined value or less. A plurality of control modes for controlling the operation of the electronic component conveying device;
The electronic component conveying apparatus according to any one of claims 1 to 16, further comprising a display unit that displays an image corresponding to a currently set control mode among the plurality of control modes. Members constituting the device;
A heating unit for heating the member;
A humidity detector for detecting humidity;
A temperature detector for detecting the temperature;
An inspection unit for inspecting electronic components,
The electronic component inspection apparatus, wherein the member is heated when the temperature detected by the temperature detection unit is not more than twice the dew point temperature.

Images