JP2016023971A - Electronic component transfer device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component transfer device and an electronic component inspection device which contribute to power saving by being capable of suppressing temperature fluctuation in an electronic component holding part.SOLUTION: An electronic component inspection device 1 includes: a device supply part 14 in which a recess 141 having a bottom surface 142 in contact with an IC device 90 is provided and which serves as an electronic component holding part for heating or cooling the IC device 90; and an inspection part which inspects the IC device 90. The electronic component inspection device 1 includes a heat insulation part 24 at a portion different from the bottom surface 142 in the device supply part 14.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device.

  Such an inspection of the IC device may be performed after the IC device is heated or cooled to adjust the temperature of the IC device to a predetermined temperature. In this case, the temperature of the IC device on the device holding unit is adjusted by heating or cooling the device holding unit that holds the IC device.

  Patent Document 1 discloses that a hot plate change kit as a device holding unit is placed on a heater base with a built-in heater to heat the device holding unit. In the invention described in Patent Document 1, a heat insulating base is provided to prevent the heat of the heater base from being transmitted to the handler (device) side.

JP 2001-228206 A

  However, in the invention described in Patent Document 1, since the device holding part is in direct contact with the outside air, heat is dissipated even if it is heated at a corner by the heater base. As a result, a temperature drop (temperature fluctuation) occurs in the device holding unit, and thus there is a problem that the temperature of the IC device is not adjusted to a predetermined temperature. Further, when the device holding unit is further heated in order to compensate for the temperature decrease in the device holding unit, there is a problem that power is consumed greatly.

  An object of the present invention is to provide an electronic component transport device and an electronic component inspection device that can suppress temperature fluctuations in the electronic component holding unit and contribute to power saving.

Such an object is achieved by the present invention described below.
[Application Example 1]
The electronic component transport device of the present invention includes an electronic component holding unit that has a contact portion that comes into contact with the electronic component and can heat or cool the electronic component.
In the electronic component holding part, at least a part of the part different from the contact part is provided with a heat insulating part.

  Thereby, the area which an electronic component holding part touches external air can be suppressed as much as possible, and therefore heat dissipation in the electronic component holding part and heat absorption to the electronic component holding part can be suppressed, that is, the electronic component holding part. The temperature fluctuation at can be suppressed. Further, since heat dissipation and heat absorption are suppressed, it is possible to suppress excessive heating and cooling of the electronic component holding portion in an attempt to supplement the heat dissipation and heat absorption. This contributes to power saving.

[Application Example 2]
In the electronic component conveying apparatus according to the present invention, it is preferable that the heat insulating portion has a film shape.

  Thereby, the base material used as the heat insulation part can be easily cut into a predetermined shape so as to fit the electronic component holding part. Moreover, a heat insulation part can be affixed on an electronic component holding part after cutting.

[Application Example 3]
In the electronic component conveying apparatus of the present invention, it is preferable that the heat insulating portion is formed of a plate-like member and is attached or screwed to the electronic component holding portion.

  Thereby, for example, even if the electronic component holding part is accidentally dropped together with the heat insulating part and the heat insulating part is damaged, it can be easily replaced with a new heat insulating part.

[Application Example 4]
In the electronic component transport device of the present invention, it is preferable that a gap is provided between the heat insulating portion and the electronic component holding portion.

  Thereby, the heat insulation function with respect to an electronic component holding part improves by the synergistic effect of a space | gap and a heat insulation part.

[Application Example 5]
In the electronic component conveying apparatus of the present invention, it is preferable that the heat insulating portion has conductivity.
As a result, charging is suppressed in the electronic component holding unit, that is, measures against static electricity are taken.

[Application Example 6]
In the electronic component transport device of the present invention, the electronic component holding unit heats the electronic component,
A heating unit that heats the electronic component holding unit and transfers heat to the electronic component through the electronic component holding unit, and a portion of the electronic component holding unit that comes into contact with the heating unit is separated from the heat insulating unit. Is preferably omitted.

  Thereby, the heat from the heating unit is sufficiently transmitted to the electronic component holding unit, and thus the electronic component can be sufficiently heated.

[Application Example 7]
In the electronic component transport device of the present invention, the electronic component holding unit cools the electronic component,
A cooling unit that cools the electronic component holding unit and removes heat from the electronic component through the electronic component holding unit, and a portion of the electronic component holding unit that is in contact with the cooling unit includes the heat insulating unit; Is preferably omitted.

  Thereby, heat can be sufficiently taken from the electronic component via the electronic component holding part, and thus the electronic component can be sufficiently cooled.

[Application Example 8]
The electronic component inspection apparatus of the present invention has a contact portion that comes into contact with an electronic component, and an electronic component holding unit capable of heating or cooling the electronic component;
An inspection unit for inspecting the electronic component,
In the electronic component holding part, at least a part of the part different from the contact part is provided with a heat insulating part.

  Thereby, the area which an electronic component holding part touches external air can be suppressed as much as possible, and therefore heat dissipation in the electronic component holding part and heat absorption to the electronic component holding part can be suppressed, that is, the electronic component holding part. The temperature fluctuation at can be suppressed. Further, since heat dissipation and heat absorption are suppressed, it is possible to suppress excessive heating and cooling of the electronic component holding portion in an attempt to supplement the heat dissipation and heat absorption. This contributes to power saving.

FIG. 1 is a schematic plan view showing an embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a plan view showing an example of the vicinity of the electronic component holding unit provided in the electronic component inspection apparatus shown in FIG. FIG. 3 is a cross-sectional view of the electronic component holding portion shown in FIG. FIG. 4 is a cross-sectional view showing an example of the vicinity of the electronic component holding unit provided in the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 5 is a cross-sectional view showing an example of the vicinity of the electronic component holding unit provided in the electronic component inspection apparatus (third embodiment) of the present invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic plan view showing an embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a plan view showing an example of the vicinity of the electronic component holding unit provided in the electronic component inspection apparatus shown in FIG. FIG. 3 is a cross-sectional view of the electronic component holding portion shown in FIG. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component transport apparatus that transports the IC device 90 in each region, the inspection unit 16 that performs the inspection in the inspection region A3, and the control unit 80.

  The tray supply area A1 is a material supply unit to which a tray (arrangement member) 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  In the supply area A2, a temperature adjusting unit (soak plate) 12, a device transport head 13, and a tray transport mechanism (first transport device) 15 are provided.

  The temperature adjustment unit 12 is an apparatus that heats or cools the plurality of IC devices 90 to adjust the IC devices 90 to a temperature suitable for inspection. In the configuration shown in FIG. 1, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply region A1 by the tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The device transport head 13 is supported so as to be movable in the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports an empty tray 200 in a state where all IC devices 90 have been removed in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transport head 17, and a device recovery unit (recovery shuttle) 18 are provided.

  The device supply unit 14 is a device that transports the temperature-adjusted IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. .

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.

  The device transport head 17 is supported so as to be movable in the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16.

  The device collection unit 18 is an apparatus that conveys the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 1, two device collection units 18 are arranged in the Y direction, like the device supply unit 14, and the IC device 90 on the inspection unit 16 is connected to any one of the device collection units 18. Transported and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism (second conveyance device) 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 1, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200. Thus, in the inspection apparatus 1, the tray transport mechanism 21 is provided in the collection area A4, and the tray transport mechanism 15 is provided in the supply area A2. Thereby, for example, the throughput (the number of IC devices 90 to be transported per unit time) can be improved as compared to transporting an empty tray 200 in the X direction with a single transport mechanism.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The control unit 80 has, for example, a drive control unit. The drive control unit includes, for example, tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, and tray conveyance mechanism 22A, 22B is controlled.

  The test control unit of the tester inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a memory (not shown), for example.

  In the inspection apparatus 1 as described above, in addition to the temperature adjustment unit 12 and the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 are also configured to be able to heat or cool the IC device 90. Thereby, the temperature of the IC device 90 is kept constant while being transported. In the present embodiment, a case will be described in which the IC device 90 is heated and inspected in a high temperature environment within a range of 50 ° C. to 155 ° C., for example.

  The temperature adjustment unit 12, the inspection unit 16, the device transport head 13, the device supply unit 14, and the device transport head 17 can be referred to as an electronic component holding unit that heats or cools the IC device 90 while holding it. Hereinafter, the electronic component holding unit will be described with the device supply unit 14 as a representative.

  As shown in FIGS. 2 and 3, the device supply unit 14 has a plate shape and has at least one recess (pocket) 141 opened on the upper surface. The IC device 90 can be disposed and stored in the recess 141. In addition, when the recessed part 141 is formed in multiple numbers, the arrangement | positioning shown, for example in FIG. The device supply unit 14 shown in FIG. 2 has four concave portions 141 arranged in a matrix of two rows along the X direction and two columns along the Y direction. In addition, about the arrangement | positioning aspect of the recessed part 141, it is not limited.

  As shown in FIG. 3, the concave portion 141 is a portion defined by a flat bottom surface 142 and a side surface (bank) 143 inclined with respect to the bottom surface 142. In a state where the IC device 90 is housed in the recess 141, the bottom surface 142 becomes a contact portion that contacts the lower surface (back surface) 901 of the IC device 90.

  In addition, it does not specifically limit as a constituent material of the device supply part 14, For example, metal materials, such as aluminum, can be used. When the device supply unit 14 is made of aluminum, the device supply unit 14 has a relatively high thermal conductivity. Thereby, the IC device 90 on the device supply unit 14 can be easily heated.

  Further, as shown in FIG. 3, the device supply unit 14 is detachably mounted on a heating unit 23 having a plate shape. In this mounted state, the device supply unit 14 is heated by the heating unit 23. Thereby, the heat from the heating unit 23 is transmitted to the IC device 90 via the device supply unit 14, and thus the temperature of the IC device 90 can be adjusted to a predetermined temperature.

  The device supply unit 14 can reciprocate in the X direction together with the heating unit 23. Thereby, the device supply unit 14 can be heated even during movement, and thus the temperature adjustment for the IC device 90 can be performed quickly.

  In the configuration shown in FIG. 3, the heating unit 23 includes a coil 231 that generates heat when energized. The coil 231 is made of a nichrome wire having a relatively high electrical resistance. The heating unit 23 is not limited to the one shown in FIG. 3, and may have, for example, a flow path through which the thermal fluid passes.

  As shown in FIG. 3, the device supply unit 14 includes a heat insulating unit 24. The heat insulating portion 24 covers a bottom surface 142 that is a contact portion that contacts the IC device 90 and a peripheral portion thereof, that is, a portion different from the side surface 143. In other words, the heat insulating unit 24 includes a first portion 241 that covers the upper surface 144 of the device supply unit 14 and a second portion 242 that covers the side surface 145 of the device supply unit 14. Note that the heat insulating portion 24 may be provided on the side surface 143 of the concave portion 141.

  The constituent material of the heat insulating part 24 is not particularly limited, and for example, various thermoplastic resins and various thermosetting resins can be used. Among these, polyether ether ketone (PEEK), polytetrafluoroethylene, etc. These various thermoplastic elastomers are preferred.

  By the way, in the inspection area A3, for example, the device transport head 17 and the device supply unit 14 move, so that convection easily occurs. For this reason, even if the device supply unit 14 is heated at the corner by the heating unit 23, there is a concern that the heat transmitted to the device supply unit 14 may be easily taken away, that is, radiated.

  However, since the heat supply part 24 is provided in the device supply part 14, the area which the device supply part 14 touches the air in test | inspection area | region A3 can be suppressed as much as possible. Thereby, heat dissipation in the device supply unit 14 can be suppressed, that is, temperature fluctuations in the device supply unit 14 can be suppressed.

  Further, since the heat insulating portion 24 is omitted from the bottom surface 142 which is a contact portion that contacts the IC device 90, the heat from the heating portion 23 is transmitted to the IC device 90 via the bottom surface 142.

  The IC device 90 can be efficiently heated and adjusted to a predetermined temperature by a synergistic effect of temperature fluctuation suppression in the device supply unit 14 and heat transfer via the device supply unit 14.

  Moreover, since heat dissipation in the device supply unit 14 is suppressed, excessive heating of the device supply unit 14 is suppressed in an attempt to compensate for the heat dissipation. This contributes to power saving.

  As shown in FIG. 3, the device supply unit 14 has a bottom surface 146 in contact with the heating unit 23. Accordingly, the heat insulating portion 24 is omitted from the bottom surface 146. Thereby, the heat from the heating unit 23 is sufficiently transmitted to the device supply unit 14.

  In this embodiment, the heat insulation part 24 is comprised with the member which makes | forms a film | membrane form (film form). Thereby, the base material used as the heat insulation part 24 can be easily cut into a predetermined shape so as to be the first portion 241 and the second portion 242. Moreover, the heat insulation part 24 can be affixed on the device supply part 14 after cutting. The attaching method is not particularly limited, and examples thereof include a method using an adhesive.

  The thickness t of the heat insulating portion 24 is not particularly limited, and is preferably 0.1 mm or more and 1 mm or less, and more preferably 0.2 mm or more and 0.6 mm or less.

  In addition, the thickness t may be constant along the surface direction of the heat insulating portion 24, or there may be a changed portion, that is, a reduced or increased portion.

  The heat insulating part 24 preferably contains a conductive filler. As a result, charging in the device supply unit 14 is suppressed, that is, measures against static electricity are taken.

Second Embodiment
FIG. 4 is a cross-sectional view showing an example of the vicinity of the electronic component holding unit provided in the electronic component inspection apparatus (second embodiment) of the present invention.

  Hereinafter, the second embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to this drawing. However, the description will focus on differences from the above-described embodiment, and the same matters will be described. Is omitted.

  In this embodiment, the IC device is cooled, and for example, the inspection is performed in a low temperature environment within a range of −60 ° C. to −40 ° C.

  As shown in FIG. 4, in the present embodiment, the device supply unit 14 is detachably mounted on a cooling unit 25 having a plate shape. In this mounted state, the device supply unit 14 is cooled by the cooling unit 25. Thereby, the device supply unit 14 can be cooled and heat can be taken from the IC device 90 via the device supply unit 14. Therefore, the temperature of the IC device 90 is adjusted to a predetermined temperature.

  The device supply unit 14 can reciprocate in the X direction together with the cooling unit 25. Thereby, the device supply unit 14 can be cooled even during movement, and thus the temperature adjustment for the IC device 90 can be performed quickly.

  In the configuration shown in FIG. 4, the cooling unit 25 has a flow path 251 through which the refrigerant (cooling fluid) C passes. As the refrigerant C, for example, a vaporized liquid nitrogen is used.

  And the heat insulation part 24 is omitted from the bottom face 146 which contacts the cooling part 25 of the device supply part 14 similarly to the said 1st Embodiment. Thereby, heat can be sufficiently removed from the IC device 90 through the device supply unit 14.

<Third Embodiment>
FIG. 5 is a cross-sectional view showing an example of the vicinity of the electronic component holding unit provided in the electronic component inspection apparatus (third embodiment) of the present invention.

  Hereinafter, the third embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to this drawing. However, the difference from the above-described embodiment will be mainly described, and the same matters will be described. Is omitted.

  The present embodiment is the same as the first embodiment except that the arrangement of the heat insulating unit with respect to the device supply unit is different.

  As shown in FIG. 5, in this embodiment, the heat insulation part 24 is comprised with hard plate-shaped members, such as an epoxy resin, for example, and is being fixed to the side surface 145 of the device supply part 14 using the screw 26, ie, It is screwed. Thereby, for example, even if the device supply unit 14 is mistakenly dropped together with the heat insulating part 24 and the heat insulating part 24 is damaged, if the screw 26 is loosened, it can be easily replaced with a new heat insulating part 24.

  In addition, as a fixing method of the heat insulation part 24, it is not limited to screwing, For example, the sticking using an adhesive agent etc. may be sufficient.

  Moreover, it does not specifically limit as thickness t of the heat insulation part 24 in this embodiment, For example, it is 0.5 mm or more and 5 mm or less, and it is more preferable that it is 1 mm or more and 2 mm or less.

  In particular, it is preferable that a gap 27 is provided between the first portion 241 of the heat insulating portion 24 and the upper surface 144 of the device supply portion 14. The air gap 27 is an air layer and functions as a heat insulating layer between the heat insulating unit 24 and the device supply unit 14. Thereby, the heat insulation function with respect to the device supply part 14 improves by the synergistic effect with the heat insulation part 24. FIG.

  The gap length (gap distance) g in the gap 27 is set to be smaller than the thickness t, and is preferably 0.2 mm or more and 3 mm or less, and more preferably 0.5 mm or more and 1 mm or less. .

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Moreover, although the heating part and the cooling part are provided separately from the electronic component holding part, the invention is not limited to this, and the electronic part holding part may include the heating part and the cooling part.

  Moreover, the heat insulation part may be comprised with the coating film. In this case, it is preferable that a hollow bead material is mixed in the coating film.

  Moreover, the heat insulation part may be comprised with the laminated body (composite formation body) of a solid member (a plate-shaped member or a film member) and a sealing member.

1 ... Inspection equipment (electronic parts inspection equipment)
11A, 11B ...... Tray transport mechanism 12 ... Temperature adjuster (soak plate)
13 …… Device transport head 14 …… Device supply unit (supply shuttle)
141 …… Recess (Pocket)
142 …… Bottom 143 …… Side (bank)
144 …… Top surface 145 …… Side surface 146 …… Bottom surface 15 …… Tray transport mechanism (first transport device)
16 …… Inspection unit 17 …… Device transport head 18 …… Device recovery unit (recovery shuttle)
19 ... Recovery tray 20 ... Device transport head 21 ... Tray transport mechanism 22A, 22B ... Tray transport mechanism 23 ... Heating unit 231 ... Coil 24 ... Heat insulation unit 241 ... First part 242 ... First 2 parts 25 ... Cooling part 251 ... Flow path 26 ... Screw 27 ... Air gap 80 ... Control part 90 ... IC device 901 ... Bottom (back)
200 …… Tray (arrangement member)
A1 …… Tray supply area A2 …… Device supply area (supply area)
A3: Inspection area A4: Device collection area (collection area)
A5 ... Tray removal area C ... Refrigerant (cooling fluid)
g …… Gap length (gap distance)
t …… Thickness

Claims (8)

An electronic component holding portion having a contact portion that contacts the electronic component, and capable of heating or cooling the electronic component;
In the electronic component holding portion, at least a part of the portion different from the contact portion is provided with a heat insulating portion.   The electronic component conveying apparatus according to claim 1, wherein the heat insulating portion has a film shape.   The electronic component conveying apparatus according to claim 1, wherein the heat insulating portion is configured by a plate-like member, and is attached or screwed to the electronic component holding portion.   The electronic component conveying apparatus according to claim 1, wherein a gap is provided between the heat insulating portion and the electronic component holding portion.   The electronic component conveying apparatus according to claim 1, wherein the heat insulating portion has conductivity. The electronic component holding unit heats the electronic component,
A heating unit that heats the electronic component holding unit and transfers heat to the electronic component through the electronic component holding unit, and a portion of the electronic component holding unit that comes into contact with the heating unit is separated from the heat insulating unit. The electronic component conveying apparatus according to claim 1, wherein is omitted. The electronic component holding unit cools the electronic component,
A cooling unit that cools the electronic component holding unit and removes heat from the electronic component through the electronic component holding unit, and a portion of the electronic component holding unit that is in contact with the cooling unit includes the heat insulating unit; The electronic component conveying apparatus according to claim 1, wherein is omitted. An electronic component holding unit that has a contact portion that contacts the electronic component and can heat or cool the electronic component;
An inspection unit for inspecting the electronic component,
In the electronic component holding part, at least a part of the part different from the contact part is provided with a heat insulating part.

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